JP3940054B2 - Nozzle cleaning apparatus and substrate processing apparatus provided with the nozzle cleaning apparatus - Google Patents

Nozzle cleaning apparatus and substrate processing apparatus provided with the nozzle cleaning apparatus Download PDF

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Publication number
JP3940054B2
JP3940054B2 JP2002293302A JP2002293302A JP3940054B2 JP 3940054 B2 JP3940054 B2 JP 3940054B2 JP 2002293302 A JP2002293302 A JP 2002293302A JP 2002293302 A JP2002293302 A JP 2002293302A JP 3940054 B2 JP3940054 B2 JP 3940054B2
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JP
Japan
Prior art keywords
processing liquid
liquid supply
nozzle
cleaning
supply nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002293302A
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Japanese (ja)
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JP2004122067A (en
Inventor
博喜 水野
和昭 清野
善則 高木
Original Assignee
大日本スクリーン製造株式会社
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Priority to JP2002293302A priority Critical patent/JP3940054B2/en
Publication of JP2004122067A publication Critical patent/JP2004122067A/en
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Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a nozzle cleaning device for cleaning a processing liquid supply nozzle for supplying a processing liquid to the surface of a substrate, and a substrate processing apparatus provided with the nozzle cleaning device.
[0002]
[Prior art]
As a substrate processing apparatus for supplying a processing liquid to a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display panel, or a mask substrate for a semiconductor manufacturing apparatus and processing the substrate, while discharging the processing liquid from a slit-like discharge port, When the processing liquid supply nozzle that supplies the processing liquid to the surface of the substrate is used, the processing liquid remains in the vicinity of the slit-like discharge port in the processing liquid supply nozzle as the substrate is processed. This becomes a contaminant and causes contamination of the treatment liquid supply nozzle. Such contamination is particularly likely to occur when a resist, particularly a resist containing a pigment called a color resist or the like, is used as the processing solution. For this reason, it is necessary to periodically clean the processing liquid supply nozzle with a nozzle cleaning device.
[0003]
Conventionally, such a nozzle cleaning device has a configuration in which a cleaning wiping member is brought into contact with the processing liquid supply nozzle and the processing liquid supply nozzle is cleaned by the wiping member. And in such a nozzle cleaning apparatus, the elongate wiping member wound between a feed roll and a winding roll is used (for example, refer patent document 1).
[0004]
[Patent Document 1]
JP 2001-113213 A
[0005]
[Problems to be solved by the invention]
In recent years, since the size of the substrate has increased, the overall length of the slit-like discharge port in the processing liquid supply nozzle tends to be longer. For this reason, in the conventional nozzle cleaning apparatus, the consumption of a wiping member increases and the problem that running cost increases arises.
[0006]
The present invention has been made to solve the above-described problem, and includes a nozzle cleaning device capable of reliably cleaning the processing liquid supply nozzle while reducing the consumption of the wiping member, and the nozzle cleaning device. An object is to provide a substrate processing apparatus.
[0007]
[Means for Solving the Problems]
According to the first aspect of the present invention, the processing liquid supply nozzle that supplies the processing liquid to the surface of the substrate is cleaned by moving relative to the substrate while discharging the processing liquid from the slit-shaped discharge port. Nozzle cleaning device for use in the present invention is a feed roll around which a long wiping member is wound, and a take-up roll that winds up the wiping member fed from the feed roll in the longitudinal direction of the discharge port of the treatment liquid supply nozzle A rotating mechanism that rotates the take-up roll, and a first cleaning mechanism that cleans the processing liquid supply nozzle by bringing the wiping member fed from the feed roll into contact with the processing liquid supply nozzle; Before the processing liquid supply nozzle is cleaned by the first cleaning mechanism, the processing liquid is supplied by the action of the first cleaning mechanism in the wiping member fed from the feed roll. The area after the contact with the nozzle, by contacting the process liquid supply nozzle, characterized in that a second cleaning mechanism to pre-clean the process liquid supply nozzle.
[0008]
The invention described in claim 2 In the invention according to claim 1, a wiping unit including the feed roll, the take-up roll, the rotation mechanism, the first cleaning mechanism, and the second cleaning mechanism, A moving mechanism for reciprocating in the longitudinal direction of the discharge port in the processing liquid supply nozzle; More .
[0009]
The invention according to claim 3 is the invention according to claim 2, wherein the second cleaning mechanism is configured such that the wiping member moves when the wiping portion moves in the same direction as the winding direction of the wiping member by the winding roll. Is brought into contact with the processing liquid supply nozzle, and the wiping member is separated from the processing liquid supply nozzle when the wiping portion moves in a direction opposite to the winding direction of the wiping member by the winding roll.
[0010]
According to a fourth aspect of the present invention, in the third aspect of the present invention, when the wiping portion moves in the same direction as the winding direction of the wiping member by the winding roll, Rotate the roll.
[0011]
According to a fifth aspect of the present invention, in the third aspect of the invention, the rotation of the unwinding roll is restricted when the wiping portion moves in a direction opposite to the winding direction of the wiping member by the winding roll. A rotation restricting mechanism is provided.
[0012]
According to a sixth aspect of the present invention, in the first aspect of the present invention, the first cleaning mechanism is configured to cause the wiping member to abut on a lip surface of the processing liquid supply nozzle. A pressing member; and a second pressing member for bringing the wiping member into contact with a side surface of the processing liquid supply nozzle.
[0013]
The invention according to claim 7 is the invention according to claim 6, wherein the first cleaning mechanism includes a plurality of the first pressing member or the second pressing member.
[0014]
The invention according to claim 8 is the invention according to claim 6, wherein the second pressing member is formed with a recess corresponding to a shape of a side surface of the processing liquid supply nozzle, and the second pressing member. Is further movably supported.
[0015]
The invention according to claim 9 is the invention according to claim 8, wherein the support mechanism is capable of moving the second pressing member in the Y direction and the Z direction when the movement direction of the wiping portion is the X direction. It comprises a plurality of springs supported by
[0016]
According to a tenth aspect of the present invention, in the invention according to the eighth or ninth aspect, the second pressing member has guide portions that guide both ends of the wiping member that is unwound from the unwinding roll.
[0017]
The invention according to claim 11 is the invention according to any one of claims 1 to 10, further comprising a cleaning liquid supply mechanism for supplying a cleaning liquid to the wiping member.
[0018]
The invention according to claim 12 cleans the processing liquid supply nozzle that supplies the processing liquid to the surface of the substrate by moving relative to the substrate while discharging the processing liquid from the slit-shaped discharge port. A nozzle cleaning device for supplying a supply means for supplying a long wiping member, a recovery means for recovering a wiping member sent from the supply means in the longitudinal direction of a discharge port in the treatment liquid supply nozzle, and the supply A first cleaning mechanism for cleaning the processing liquid supply nozzle by bringing the wiping member supplied from the means into contact with the processing liquid supply nozzle; and before the processing liquid supply nozzle is cleaned by the first cleaning mechanism. In addition, a region of the wiping member supplied from the supply unit after coming into contact with the processing liquid supply nozzle by the action of the first cleaning mechanism is brought into contact with the processing liquid supply nozzle. More, characterized in that a second cleaning mechanism to pre-clean the process liquid supply nozzle.
[0019]
The invention according to claim 13 In the invention according to claim 12, a wiping portion comprising the supply means, the recovery means, the first cleaning mechanism, and the second cleaning mechanism, A moving mechanism for reciprocating in the longitudinal direction of the discharge port in the processing liquid supply nozzle; More .
[0020]
According to the fourteenth aspect of the present invention, the substrate holding mechanism that holds the substrate and the substrate holding mechanism that moves relative to the substrate while discharging the processing liquid from the slit-like discharge port, A processing liquid supply nozzle for supplying a processing liquid to the surface of the substrate and a nozzle cleaning device according to any one of claims 1 to 13 are provided.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0022]
First, the structure of the substrate processing apparatus to which the nozzle cleaning apparatus 18 according to the present invention is applied will be described. FIG. 1 is a schematic view of a substrate processing apparatus to which a nozzle cleaning apparatus according to the present invention is applied.
[0023]
This substrate processing apparatus is for applying a resist containing a pigment called a color resist to a rectangular glass substrate (hereinafter referred to as “substrate”) W for a liquid crystal panel. A spin chuck 13 that rotates about a shaft 12 by driving a motor 11 in a state, a processing liquid supply nozzle 14 for applying a resist to a substrate W held by the spin chuck 13, and the processing liquid supply nozzle 14 are moved. A nozzle moving mechanism 15 for resisting, a resist supply mechanism 16 for supplying a resist to the processing liquid supply nozzle 14, and a resist that scatters from an edge of the substrate W when the substrate W after resist application is rotated by the spin chuck 13. A resist-capturing cup 17 and a nozzle cleaning device 18 according to the present invention.
[0024]
The spin chuck 13 and the shaft 12 can be moved up and down between a rotation position indicated by a solid line and a coating position indicated by a two-dot chain line in FIG. Here, the rotation position is a position where the substrate W after the resist application is accommodated in the cup 17 and rotates, and the application position is a position where the resist is applied to the substrate W by the processing liquid supply nozzle 14.
[0025]
The nozzle moving mechanism 15 includes a moving frame 22 that reciprocates along a horizontally extending moving guide 21. The processing liquid supply nozzle 14 is supported by the moving frame 22 via a nozzle support arm 23 so as to be movable in the horizontal direction. The nozzle moving mechanism 15 does not include a mechanism that moves in the vertical direction. For this reason, the distance between the processing liquid supply nozzle 14 and the substrate W is prevented from changing when the processing liquid supply nozzle 14 moves along the movement guide 21. Accordingly, when the resist is applied to the substrate W by horizontally moving the processing liquid supply nozzle 14, it is possible to form a coating film having a uniform thickness.
[0026]
The resist supply mechanism 16 includes a pressure tank 24 having a hermetically sealed configuration and a resist tank 25 accommodated in the pressure tank 24. The pressurized tank 24 is connected to a supply source of nitrogen gas or air (not shown) by a pressurized pipe 27. A three-way valve 28 for switching supply / exhaust of nitrogen gas and a regulator 29 are arranged in the pressurizing pipe 27. Further, one end of a resist supply pipe 31 that connects the resist tank 25 and the processing liquid supply nozzle 14 is inserted into the resist tank 25. An opening / closing valve 33 is disposed in the resist supply pipe 31.
[0027]
In the resist supply mechanism 15 having such a configuration, when the on-off valve 33 is opened, the resist in the resist tank 25 is treated with the processing liquid via the resist supply pipe 31 by the pressure of nitrogen gas in the pressure tank 24. The pressure is fed to the supply nozzle 14 and the pressure of the resist is stopped by closing the on-off valve 33.
[0028]
FIG. 2 is an explanatory diagram schematically showing a resist supply operation by the processing liquid supply nozzle 14. The processing liquid supply nozzle 14 has a slit-like discharge port 34 extending in the longitudinal direction (direction perpendicular to the paper surface in FIG. 2). The length of the discharge port 34 in the longitudinal direction is equal to or longer than the length of the short side of the rectangular element formation portion on the substrate W, but here, the length of the short side of the rectangular element formation portion is long. Is almost equal. The resist 35 supplied by the resist supply pipe 31 is supplied to the surface of the substrate W through the slit-like discharge port 34 as shown in FIG.
[0029]
FIG. 3 is an enlarged view of the lower end portion of the processing liquid supply nozzle 14. As shown in this figure, the processing liquid supply nozzle 14 includes an inclined side surface 39 in order to minimize the amount of resist 35 adhering thereto. In this figure, reference numeral 38 denotes a lip surface that forms the discharge port 34. The lip surface 38 constitutes the lower end portion of the side surface 39.
[0030]
Next, a coating operation for coating a resist on the substrate W by the above-described substrate processing apparatus will be described. FIG. 4 is an explanatory diagram showing a coating operation for coating a resist on the substrate W by the substrate processing apparatus. In the following description, the processing liquid supply nozzle 14 is moved by the nozzle moving mechanism 15 described above.
[0031]
In a state before the resist coating operation is executed, the processing liquid supply nozzle 14 is disposed at a position facing the nozzle cleaning device 18 according to the present invention. The state of the processing liquid supply nozzle 14 and the like at this time will be described in detail later.
[0032]
In this state, when the resist coating operation is started, the processing liquid supply nozzle 14 is moved with respect to the nozzle cleaning apparatus 18 as indicated by the arrow (1) from the state in which the processing liquid supply nozzle 14 is waited above the nozzle cleaning apparatus 18. The substrate W is horizontally moved to the upper end of the far side substrate W. Next, the substrate W is placed at the coating position by the chuck lifting mechanism. At this time, the distance between the surface of the substrate W and the discharge port 34 of the processing liquid supply nozzle 14 is a predetermined value suitable for resist application.
[0033]
In this state, the resist is discharged from the slit-like discharge port 34 in the processing liquid supply nozzle 14, and the processing liquid supply nozzle 14 is horizontally moved along the surface of the substrate W as indicated by the arrow (2). In this state, as shown in FIG. 2, the resist 35 discharged from the slit-shaped discharge port 34 in the processing liquid supply nozzle 14 is applied to the surface of the substrate W in a thin film shape.
[0034]
When the slit-shaped discharge port 34 in the processing liquid supply nozzle 14 moves to a position facing the other end of the substrate W, the discharge of the resist from the slit-shaped discharge port 34 in the processing liquid supply nozzle 14 is stopped, and the nozzle Move to above the cleaning device 18.
[0035]
Next, the configuration of the nozzle cleaning device 18 according to the present invention will be described. FIG. 5 is a side view showing the nozzle cleaning device 18 according to the present invention together with the standby pot 36.
[0036]
The nozzle cleaning device 18 includes a bracket 42 that is movable along a rail 41 that is arranged in parallel with the processing liquid supply nozzle 14 described above, and a synchronous belt 43 that is connected to the bracket 42 so as to reciprocally rotate the bracket 42. A motor 44 that reciprocally moves 42 in parallel with the treatment liquid supply nozzle 14, and a wiping portion 45 disposed above the bracket 42. As will be described later, the wiping unit 45 is for wiping the slit-like discharge port 34 in the processing liquid supply nozzle 14. The wiping unit 45 reciprocates between a position indicated by a solid line and a position indicated by a two-dot chain line in FIG.
[0037]
On the other hand, the standby pot 36 is for preventing the resist in the vicinity of the slit-like discharge port 34 in the processing liquid supply nozzle 14 from being dried and denatured in a state where no resist is applied. For example, a solvent for dissolving the resist is stored in the standby pot 36. The standby pot 36 is driven by the air cylinder 37, and the upper end opening shown by a two-dot chain line in FIG. 5 is opposed to the slit-like discharge port 34 of the processing liquid supply nozzle 14 and the lowering shown by a solid line. It can be moved up and down between positions. For this reason, when the standby pot 36 takes the raised position while the processing liquid supply nozzle 14 is waiting above the nozzle cleaning device 18, the discharge port 34 of the processing liquid supply nozzle 14 is placed in a space closed by the standby pot 36. Will be exposed. At this time, since the space is filled with an atmosphere containing the vapor of the solvent, the resist in the vicinity of the discharge port 34 is prevented from drying.
[0038]
Next, the structure of the wiping part 45 mentioned above is demonstrated. FIG. 6 is a front view of the wiping unit 45, FIG. 7 is a side sectional view of the wiping unit 45, and FIG. 8 is a plan view of the wiping unit 45. 7 and 8, the illustration of the wiping member 52 is partially omitted for convenience of explanation.
[0039]
The wiping unit 45 includes a casing 51, a feed roll 53 around which a long wiping member 52 is wound, a take-up roll 54 that winds up the wiping member 52 sent out from the feed roll 53, and a cleaning liquid on the wiping member 52. Cleaning liquid supply nozzles 55, 56 and first and second cleaning mechanisms 57, 58. The wiping member 52 is made of a sheet-like porous material. As such a porous substance, paper such as filter paper, cloth such as non-woven fabric, or resin can be used.
[0040]
A gear 62 is attached to the shaft 61 of the feed roll 53. The gear 62 is connected to a tension generating member 64 such as a rotary damper via a gear 63. For this reason, the feed roll 53 rotates with a certain resistance.
[0041]
As shown in FIG. 9, a rotation restricting mechanism 67 for restricting the rotation of the feed roll 53 is disposed below the gear 62 attached to the shaft 61 of the feed roll 53. The rotation restricting mechanism 67 includes a rack member 65 connected to the cylinder rod of the air cylinder 66. The rack member 65 moves up and down between a standby position indicated by a solid line in FIG. 9 and a restriction position indicated by an imaginary line in FIG. 9 by driving the air cylinder 66. In a state where the rack member 65 is disposed at the restriction position, the rack member 65 meshes with the gear 62 and the rotation of the feed roll 53 is restricted.
[0042]
Again referring to FIGS. 6 to 8, the shaft 71 of the take-up roll 54 is connected to the shaft 74 of the motor 73 via the coupling 72. For this reason, the winding roll 54 is rotated by driving the motor 73.
[0043]
The wiping member 52 is supplied with the processing liquid at a position below the wiping member 52 from the feeding roll 53 to the winding roll 54, that is, at a position between the feeding roll 53 and the winding roll 54 in the movement path of the wiping member 52. A first cleaning mechanism 57 is provided for pressing the wiping member 52 against the processing liquid supply nozzle 14 by pressing toward the nozzle 14.
[0044]
Hereinafter, the configuration of the first cleaning mechanism 57 will be described. FIG. 10 is an explanatory view showing the configuration of the first cleaning mechanism 57, and FIG. 11 is a perspective view showing the main part thereof. 10A is a plan view of the first cleaning mechanism 57 with the casing 75 removed, FIG. 10B is a longitudinal sectional view of the first cleaning mechanism 57, and FIG. 10C is the first view. 6 is a side view of the cleaning mechanism 57. FIG. Further, in FIG. 11, the casing 75 of the first cleaning mechanism 57 is represented by a virtual line.
[0045]
The first cleaning mechanism 57 is for cleaning the processing liquid supply nozzle 14 by bringing the wiping member 52 fed from the feed roll 53 into contact with the processing liquid supply nozzle 14. The casing 75 and the casing 75 A pair of first pressing members 76 whose lower end portions are housed inside, a second pressing member 77 whose lower end portions are housed inside a casing 75, and a support plate 80 are provided. The cleaning liquid supply nozzle 55 (see FIG. 8) for supplying the cleaning liquid to the wiping member 52 described above is disposed above the first cleaning mechanism 57.
[0046]
The first pressing member 76 is used for bringing the wiping member 52 into contact with the lip surface 38 of the processing liquid supply nozzle 14. The first pressing member 76 has a rounded shape whose head is chamfered in an arc shape in order to reduce an impact at the time of contact with the processing liquid supply nozzle 14 in a cleaning process of the processing liquid supply nozzle 14 described later. ing. In addition, it is good also as a taper shape instead of a round shape.
[0047]
A pair of springs 82 that urge the first pressing member 76 in the direction of the wiping member 52 are disposed between the lower surface of the first pressing member 76 and the support plate 80. A convex portion 81 for preventing the first pressing member 76 from jumping out of the casing 75 is formed at the lower end portion of the first pressing member 76.
[0048]
The second pressing member 77 is used for bringing the wiping member 52 into contact with the side surface 39 of the processing liquid supply nozzle 14. The second pressing member 77 is formed with a recess 78 corresponding to the shape of the side surface 39 of the processing liquid supply nozzle 14. In addition, the second pressing member 77 also has a round shape with a chamfered head in an arc shape in order to reduce an impact at the time of contact with the processing liquid supply nozzle 14 in a cleaning process of the processing liquid supply nozzle 14 described later. It has become.
[0049]
A pair of springs 83 that urge the second pressing member 77 in the direction of the wiping member 52 are disposed between the lower surface of the second pressing member 77 and the support plate 80. A convex portion 84 for preventing the second pressing member 77 from jumping out of the casing 75 is formed at the lower end portion of the second pressing member 77. Further, a pair of moving members 85 slidable with respect to the casing 75 are disposed inside the casing 75, and a pair of springs 86 are interposed between the moving member 85 and the second pressing member 77. It is arranged.
[0050]
The second pressing member 77 is movably supported by the action of the springs 83 and 86 and the moving member 85. That is, the second pressing member 77 has the Y direction when the movement direction of the wiping portion 45 in the cleaning process described later is set to the X direction shown in FIGS. 10 and 11 by the action of the springs 83 and 86 and the moving member 85. And supported so as to be movable in the Z direction. Thereby, even when there is an error in the positional accuracy between the first cleaning mechanism 57 and the processing liquid supply nozzle 14, the concave portion 78 formed in the second pressing member 77 and the side surface 39 of the processing liquid supply nozzle 14 are securely connected. It becomes possible to make it contact | abut.
[0051]
A pair of guide portions 79 is formed at the upper end portion of the second pressing member 77. The pair of guide portions 77 are for guiding both ends of the wiping member 52 unwound from the unwinding roll 53. That is, as shown in FIG. 12A, the pair of guide portions 77 are arranged so as to be separated from each other by a distance substantially the same as the width of the wiping member 52, and are configured to abut against both ends of the wiping member 52. Have. For this reason, it is possible to effectively prevent the wiping member 52 from being detached from the upper position of the second pressing member 77 by the action of these guide portions.
[0052]
In the cleaning process described later, in the state where the processing liquid supply nozzle 14 and the second pressing member 77 are in contact with each other via the wiping member 52, as shown in FIG. It is pressed by the side surface 39 of the supply nozzle 14 and enters the recess 78 in the second pressing member 77.
[0053]
Referring again to FIGS. 6 to 8, the wiping after the contact with the processing liquid supply nozzle 14 is once in the position between the first cleaning mechanism 57 and the take-up roll 54 in the movement path of the wiping member 52. A second cleaning mechanism 58 for abutting the wiping member 52 against the processing liquid supply nozzle 14 by pressing the member 52 toward the processing liquid supply nozzle 14 again is provided.
[0054]
The second cleaning mechanism 58 includes a fixed guide roller 87 and a lift guide roller 88 for guiding the wiping member 52. The fixed guide roller 87 is rotatably supported with respect to the casing 51. On the other hand, the lifting guide roller 88 is rotatably supported at the tip of a substantially L-shaped bracket 89 that moves up and down by driving the air cylinder 90. For this reason, the raising / lowering guide roller 88 raises / lowers between the cleaning position shown by the solid line in FIG. 6 and the retracted position shown by the phantom line by driving the air cylinder 90. Here, the cleaning position is a position where the lifting guide roller 88 brings the wiping member 52 into contact with the lip surface 38 of the processing liquid supply nozzle 14 and cleans it with the wiping member 52. Note that the cleaning liquid supply nozzle 56 for supplying the cleaning liquid to the wiping member 52 described above is disposed on the side of the lift guide roller 88.
[0055]
In the wiping unit 45 described above, a cassette mechanism is employed in which the first and second cleaning mechanisms 57, 58 and the like can be attached and detached together with the feed roll 53, the take-up roll 54, and the like.
[0056]
Next, the cleaning operation of the processing liquid supply nozzle 14 by the nozzle cleaning device 18 according to the present invention will be described.
[0057]
When the cleaning operation of the processing liquid supply nozzle 14 is performed using this nozzle cleaning device, the standby pot 36 has two points in FIG. 5 with the processing liquid supply nozzle 14 positioned above the cleaning mechanism 18. It descends from the ascending position indicated by the chain line to the descending position indicated by the solid line. Moreover, the wiping part 45 has stopped in the position of the travel stroke right end shown with a virtual line in FIG. This position is a position where the wiping member 45 is disposed at the end on the feed roll 53 side.
[0058]
Thereafter, the wiping unit 45 starts moving in the left direction shown in FIG. This direction is a direction parallel to the slit-like discharge port 34 in the processing liquid supply nozzle 14 and is the same as the winding direction of the wiping member 52 by the winding roll 54. Further, when the wiping member 52 moves leftward, the elevation guide roller 88 of the second cleaning mechanism 58 is disposed at the cleaning position indicated by the solid line in FIG.
[0059]
When the wiping unit 45 continues to move in this state, first, the lip surface 38 of the processing liquid supply nozzle 14 and the wiping member 52 come into contact with each other by the action of the lifting guide roller 88 in the second cleaning mechanism 58, so that the processing liquid is supplied. The lip surface 38 of the nozzle 14 is preliminarily cleaned by the wiping member 52. In the preliminary cleaning process, the cleaning liquid is supplied from the cleaning liquid supply nozzle 56 to the wiping member 52 as necessary.
[0060]
At this time, the wiping member 52 used for the preliminary cleaning is already used for cleaning the lip surface 38 and the side surface 39 of the processing liquid supply nozzle 14 by the first cleaning mechanism 57 in the previous cleaning process, as will be described later. It is a part that has been. Therefore, the wiping member 52 used for the preliminary cleaning is contaminated to some extent by the resist. However, since the cleaning by the first cleaning mechanism 57 is executed later, this level of contamination is a problem in the preliminary cleaning process. Don't be.
[0061]
Thereafter, when the wiping unit 45 continues to move further, the processing liquid supply nozzle 14 and the wiping member 52 come into contact with each other by the action of the first cleaning mechanism 57, and the processing liquid supply nozzle 14 is finally cleaned by the wiping member 52. .
[0062]
The cleaning operation by the first cleaning mechanism 57 will be described in detail with reference to FIG. FIG. 13 is a schematic diagram illustrating a cleaning operation of the processing liquid supply nozzle 14 by the first cleaning mechanism 57.
[0063]
If the positional relationship between the treatment liquid supply nozzle 14 and the first cleaning mechanism 57 changes from the state shown in FIG. 13A to the state shown in FIG. Due to the action of the first pressing member 76 on the 54 side, the lip surface 38 of the processing liquid supply nozzle 14 and the wiping member 52 come into contact with each other, and the lip surface 38 of the processing liquid supply nozzle 14 is cleaned by the wiping member 52. In this state, the first pressing member 76 on the winding roll 54 side is pressed by the processing liquid supply nozzle 14 and descends. As described above, since the head of the first pressing member 76 has a rounded shape that is chamfered in an arc shape, the impact at the time of contact between the first pressing member 76 and the treatment liquid supply nozzle 14 is reduced. It becomes possible to do.
[0064]
If the wiping unit 45 further moves from this state and the arrangement relationship between the processing liquid supply nozzle 14 and the first cleaning mechanism 57 is in the state shown in FIG. 13C, the processing liquid is operated by the action of the second pressing member 77. The side surface 39 of the supply nozzle 14 and the wiping member 52 come into contact with each other, and the side surface 39 of the processing liquid supply nozzle 14 is cleaned by the wiping member 52. In this state, the second pressing member 77 is pressed by the processing liquid supply nozzle 14 and descends. As described above, since the head of the second pressing member 77 has a rounded shape that is chamfered in an arc shape, the impact at the time of contact between the second pressing member 77 and the processing liquid supply nozzle 14 is reduced. It becomes possible to do.
[0065]
At this time, as described above, since the second pressing member 77 is supported to be movable in the Y direction and the Z direction, there is an error in the positional accuracy between the first cleaning mechanism 57 and the processing liquid supply nozzle 14. Even in this case, it is possible to reliably bring the concave portion 78 formed in the second pressing member 77 into contact with the side surface 39 of the processing liquid supply nozzle 14. For this reason, the side surface 39 of the processing liquid supply nozzle 14 and the wiping member 52 can be reliably brought into contact with each other, and the side surface 39 of the processing liquid supply nozzle 14 can be reliably cleaned by the wiping member 52.
[0066]
If the wiping unit 45 further moves and the arrangement relationship between the processing liquid supply nozzle 14 and the first cleaning mechanism 57 is in the state shown in FIG. 13D, the first pressing member 76 on the feed roll 53 side causes the action. The lip surface 38 of the processing liquid supply nozzle 14 and the wiping member 52 come into contact again, and the lip surface 38 of the processing liquid supply nozzle 14 is cleaned again by the wiping member 52. In this state, the first pressing member 76 on the winding roll 54 side is pressed by the processing liquid supply nozzle 14 and descends. Since the head of the first pressing member 76 has a rounded shape that is chamfered in an arc shape, it is possible to mitigate an impact at the time of contact between the first pressing member 76 and the processing liquid supply nozzle 14. It becomes.
[0067]
When the processing liquid supply nozzle 14 is cleaned by the first cleaning mechanism 57 described above, the cleaning liquid is supplied from the cleaning liquid supply nozzle 55 to the wiping member 52 as necessary. Further, when the processing liquid supply nozzle 14 is cleaned by the first cleaning mechanism 57, the take-up roll 54 rotates at a low speed by driving the motor 73. For this reason, the lip surface 38 and the side surface 39 of the processing liquid supply nozzle 14 can be cleaned cleanly by the new wiping member 52. The wiping member 52 after being used for cleaning by the first cleaning mechanism 57 is reused for preliminary cleaning by the second cleaning mechanism 58 as described above.
[0068]
When the length of the slit-like discharge port 34 in the processing liquid supply nozzle 14 in the longitudinal direction is relatively short, the lip surface 38 and the side surface 39 of the processing liquid supply nozzle 14 are not rotated without rotating the take-up roll 54. You may make it clean.
[0069]
If the wiping part 45 moves from the position of the right end of the travel stroke indicated by the phantom line in FIG. 5 to the position of the left end of the travel stroke indicated by the solid line in FIG. At the same time, it moves rightward as shown in FIG. This direction is a direction parallel to the slit-like discharge port 34 in the treatment liquid supply nozzle 14 and is opposite to the winding direction of the wiping member 52 by the winding roll 54.
[0070]
When the wiping member 52 moves in the left direction, the lip surface 38 and the side surface 39 of the processing liquid supply nozzle 14 are cleaned again by the wiping member 52 by the action of the first cleaning mechanism 57. However, when the wiping member 52 is moved in the left direction, the lifting guide roller 88 of the second cleaning mechanism 58 is disposed at the retracted position indicated by the phantom line in FIG. For this reason, the lip surface 38 and the side surface 39 of the processing liquid supply nozzle 14 after cleaning do not come into contact with the wiping member 52 used for the preliminary cleaning and are not contaminated.
[0071]
Further, when the wiping member 52 moves in the left direction, the rack member 65 of the rotation restricting mechanism 67 shown in FIG. 9 is arranged at the restricting position, and the rotation of the feed roll 53 is restricted. For this reason, even when the wiping member 52 is pulled by the frictional force between the wiping member 52 and the treatment liquid supply nozzle 14 when the wiping member 52 moves in the left direction, the feed roll 53 does not reverse. .
[0072]
Thereafter, when the wiping portion 45 moves to the right end position of the travel stroke indicated by the phantom line in FIG. 5, the cleaning operation of the processing liquid supply nozzle 14 is completed. However, the treatment liquid supply nozzle 14 may be cleaned by reciprocating the wiping unit 45 a plurality of times.
[0073]
In the above-described embodiment, the nozzle cleaning device 18 according to the present invention is a substrate processing apparatus configured to rotate the substrate W by the spin chuck 13 after applying a resist to the substrate W by the processing liquid supply nozzle 14. Although the case where it is applied has been described, the nozzle cleaning apparatus according to the present invention may be applied to a type of substrate processing apparatus that does not rotate the substrate W after the processing liquid is supplied to the substrate W by the processing liquid supply nozzle 14.
[0074]
In the above-described embodiment, the case where a plurality of first pressing members 76 are disposed in the first cleaning mechanism 57 has been described. However, a plurality of second pressing members 77 are disposed in the first cleaning mechanism 57. It may be.
A plurality of
[0075]
【The invention's effect】
According to the first, second, twelfth, thirteenth and fourteenth aspects of the present invention, the region used for cleaning the treatment liquid supply nozzle by the first cleaning mechanism in the wiping member is second cleaned. Since the mechanism can be used for preliminary cleaning of the processing liquid supply nozzle, the processing liquid supply nozzle can be reliably cleaned while reducing the consumption of the wiping member.
[0076]
According to the invention described in claim 3, the wiping member is brought into contact with the processing liquid supply nozzle only when the second cleaning mechanism moves in the same direction as the winding direction of the wiping member by the winding roll. Therefore, it is possible to prevent the wiping member used for the preliminary cleaning from coming into contact with the processing liquid supply nozzle again and contaminating the processing liquid supply nozzle.
[0077]
According to the invention described in claim 4, the rotating mechanism rotates the winding roll when the wiping portion moves in the same direction as the winding direction of the wiping member by the winding roll. It becomes possible to clean cleanly by a new wiping member.
[0078]
According to the fifth aspect of the present invention, the wiping member includes the rotation regulating mechanism that regulates the rotation of the unwinding roll when the wiping portion moves in the direction opposite to the winding direction of the wiping member by the winding roll. During the movement, it is possible to reliably prevent the feed roll from reversing due to the frictional force between the wiping member and the treatment liquid supply nozzle.
[0079]
According to the sixth aspect of the present invention, the first cleaning mechanism causes the wiping member to contact the lip surface of the processing liquid supply nozzle and the second pressing member causes the wiping member to contact the side surface of the processing liquid supply nozzle. Since the pressing member is provided, the lip surface and the side surface of the processing liquid supply nozzle can be reliably cleaned.
[0080]
According to the seventh aspect of the present invention, since the first cleaning mechanism includes a plurality of first pressing members or second pressing members, it is possible to more reliably clean the lip surface or side surface of the processing liquid supply nozzle. It becomes.
[0081]
According to the eighth aspect of the present invention, the second pressing member is formed with a recess corresponding to the shape of the side surface of the treatment liquid supply nozzle, and further includes a support mechanism for supporting the second pressing member so as to be movable. Therefore, even when there is an error in the positional accuracy between the first cleaning mechanism and the processing liquid supply nozzle, the concave portion formed in the second pressing member and the side surface of the processing liquid supply nozzle are reliably brought into contact with each other. Is possible.
[0082]
According to the ninth aspect of the present invention, the support mechanism is configured by a plurality of springs that support the second pressing member so as to be movable in the Y direction and the Z direction when the wiping portion is moved in the X direction. Therefore, even when there is an error in the positional accuracy between the first cleaning mechanism and the processing liquid supply nozzle, the concave portion formed in the second pressing member and the side surface of the processing liquid supply nozzle are more reliably brought into contact with each other. It becomes possible.
[0083]
According to the tenth aspect of the invention, since the second pressing member has the guide portions that guide both ends of the wiping member that is unwound from the unwinding roll, the wiping member is detached from the position above the second pressing portion. It is possible to effectively prevent this.
[0084]
According to the eleventh aspect of the invention, since the cleaning liquid supply mechanism that supplies the cleaning liquid to the wiping member is provided, the processing liquid supply nozzle can be more reliably cleaned using the cleaning liquid.
[Brief description of the drawings]
FIG. 1 is a schematic view of a substrate processing apparatus to which a nozzle cleaning apparatus according to the present invention is applied.
FIG. 2 is an explanatory view schematically showing a resist supply operation by a processing liquid supply nozzle 14;
FIG. 3 is an enlarged view of a lower end portion of a processing liquid supply nozzle 14;
FIG. 4 is an explanatory diagram showing a coating operation for coating a resist on a substrate W by a substrate processing apparatus.
5 is a side view showing the nozzle cleaning device 18 according to the present invention together with a standby pot 36. FIG.
6 is a front view of a wiping unit 45. FIG.
7 is a side view of the wiping unit 45. FIG.
FIG. 8 is a plan view of the wiping unit 45. FIG.
9 is a front view showing the rotation restricting mechanism 67 together with the gear 62. FIG.
10 is an explanatory view showing a configuration of a first cleaning mechanism 57. FIG.
11 is a perspective view showing a main part of the first cleaning mechanism 57. FIG.
12 is an explanatory view showing a relationship between the second pressing member 77 and the wiping member 52. FIG.
13 is a schematic diagram illustrating a cleaning operation of the processing liquid supply nozzle 14 by the first cleaning mechanism 57. FIG.
[Explanation of symbols]
13 Spin chuck
14 Treatment liquid supply nozzle
18 Nozzle cleaning device
34 Discharge port
36 Waiting pot
38 Lip surface
39 side
41 rails
42 Bracket
43 Synchronous belt
44 motor
45 Wiping part
52 Wiping member
53 Feeding roll
54 Winding roll
55 Cleaning liquid supply nozzle
56 Cleaning liquid supply nozzle
57 First cleaning mechanism
58 Second cleaning mechanism
61 axis
62 Gear
63 Gear
64 Tension generator
65 Rack members
66 Air cylinder
67 Rotation restriction mechanism
71 axes
72 coupling
73 motor
74 axes
75 casing
76 First pressing member
77 Second pressing member
78 recess
79 Guide
80 Support plate
81 Convex
82 Spring
83 Spring
84 Convex
85 Moving member
86 Spring
87 Fixed guide roller
88 Lifting guide roller
89 Bracket
90 Air cylinder
W substrate

Claims (14)

  1. A nozzle cleaning device for cleaning a processing liquid supply nozzle for supplying a processing liquid to the surface of the substrate by moving relative to the substrate while discharging the processing liquid from a slit-like discharge port,
    A feed roll wound with a long wiping member;
    A take-up roll that winds up the wiping member fed from the feed roll in the longitudinal direction of the discharge port in the treatment liquid supply nozzle;
    A rotating mechanism for rotating the winding roll;
    A first cleaning mechanism that cleans the treatment liquid supply nozzle by bringing the wiping member fed from the feed roll into contact with the treatment liquid supply nozzle;
    Before cleaning the processing liquid supply nozzle by the first cleaning mechanism, the region after contacting the processing liquid supply nozzle by the action of the first cleaning mechanism in the wiping member sent out from the feed roll, A second cleaning mechanism for preliminarily cleaning the processing liquid supply nozzle by contacting the processing liquid supply nozzle;
    A nozzle cleaning device comprising:
  2. In the nozzle cleaning apparatus of Claim 1,
    A wiping portion comprising the feed roll, the take-up roll, the rotating mechanism, the first cleaning mechanism, and the second cleaning mechanism,
    A moving mechanism for reciprocating in the longitudinal direction of the discharge port in the processing liquid supply nozzle;
    A nozzle cleaning device further comprising:
  3. The nozzle cleaning device according to claim 2,
    The second cleaning mechanism is configured to bring the wiping member into contact with the processing liquid supply nozzle when the wiping portion moves in the same direction as the winding direction of the wiping member by the winding roll, and to wipe the wiping member by the winding roll. A nozzle cleaning device that separates the wiping member from the processing liquid supply nozzle when the wiping portion moves in a direction opposite to the winding direction of the liquid.
  4. In the nozzle cleaning apparatus of Claim 3,
    The said rotation mechanism is a nozzle cleaning apparatus which rotates the said winding roll, when the said wiping part moves to the same direction as the winding direction of the wiping member by the said winding roll.
  5. In the nozzle cleaning apparatus of Claim 3,
    The nozzle cleaning apparatus provided with the rotation control mechanism which controls rotation of the said unwinding roll, when the said wiping part moves to the reverse direction to the winding direction of the wiping member by the said winding roll.
  6. In the nozzle cleaning apparatus in any one of Claims 1 thru | or 5,
    The first cleaning mechanism includes a first pressing member that brings the wiping member into contact with a lip surface of the processing liquid supply nozzle, and a second pressing member that brings the wiping member into contact with a side surface of the processing liquid supply nozzle. A nozzle cleaning device provided.
  7. The nozzle cleaning device according to claim 6,
    The nozzle cleaning apparatus in which the first cleaning mechanism includes a plurality of the first pressing member or the second pressing member.
  8. The nozzle cleaning device according to claim 6,
    The second pressing member is formed with a recess corresponding to the shape of the side surface of the processing liquid supply nozzle,
    A nozzle cleaning device further comprising a support mechanism for movably supporting the second pressing member.
  9. The nozzle cleaning device according to claim 8,
    The said support mechanism is a nozzle cleaning apparatus comprised from the some spring which supports the said 2nd press member so that a movement in a Y direction and a Z direction is possible, when the moving direction of a wiping part is made into the X direction.
  10. In the nozzle cleaning device according to claim 8 or 9,
    The said 2nd press member is a nozzle cleaning apparatus which has a guide part which guides the both ends of the wiping member unwound from the said unwinding roll.
  11. The nozzle cleaning device according to any one of claims 1 to 10,
    A nozzle cleaning device comprising a cleaning liquid supply mechanism for supplying a cleaning liquid to the wiping member.
  12. A nozzle cleaning device for cleaning a processing liquid supply nozzle for supplying a processing liquid to the surface of the substrate by moving relative to the substrate while discharging the processing liquid from a slit-like discharge port,
    Supply means for supplying a long wiping member;
    Recovery means for recovering the wiping member sent from the supply means in the longitudinal direction of the discharge port in the processing liquid supply nozzle;
    A first cleaning mechanism for cleaning the processing liquid supply nozzle by bringing the wiping member supplied from the supply means into contact with the processing liquid supply nozzle;
    Before cleaning the processing liquid supply nozzle by the first cleaning mechanism, the region after contacting the processing liquid supply nozzle by the action of the first cleaning mechanism in the wiping member supplied from the supply means, A second cleaning mechanism for preliminarily cleaning the processing liquid supply nozzle by contacting the processing liquid supply nozzle;
    A nozzle cleaning device comprising:
  13. The nozzle cleaning device according to claim 12,
    A wiping portion comprising the supply means, the recovery means, the first cleaning mechanism, and the second cleaning mechanism;
    A moving mechanism for reciprocating in the longitudinal direction of the discharge port in the processing liquid supply nozzle;
    A nozzle cleaning device further comprising:
  14. A substrate holding mechanism for holding the substrate;
    A processing liquid supply nozzle for supplying the processing liquid to the surface of the substrate by moving relative to the substrate held by the holding mechanism while discharging the processing liquid from the slit-like discharge port;
    A nozzle cleaning device according to any one of claims 1 to 13,
    A substrate processing apparatus comprising:
JP2002293302A 2002-10-07 2002-10-07 Nozzle cleaning apparatus and substrate processing apparatus provided with the nozzle cleaning apparatus Expired - Fee Related JP3940054B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002293302A JP3940054B2 (en) 2002-10-07 2002-10-07 Nozzle cleaning apparatus and substrate processing apparatus provided with the nozzle cleaning apparatus

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002293302A JP3940054B2 (en) 2002-10-07 2002-10-07 Nozzle cleaning apparatus and substrate processing apparatus provided with the nozzle cleaning apparatus
TW92124338A TWI234797B (en) 2002-10-07 2003-09-03 Nozzle cleaning apparatus and substrate treating apparatus having the same
CN 03132661 CN1252798C (en) 2002-10-07 2003-09-30 Nozzle cleaning device and substrate processing device with the nozzle cleaning device
KR20030068555A KR100578392B1 (en) 2002-10-07 2003-10-02 Nozzle cleaning apparatus and substrate treating apparatus having the same

Publications (2)

Publication Number Publication Date
JP2004122067A JP2004122067A (en) 2004-04-22
JP3940054B2 true JP3940054B2 (en) 2007-07-04

Family

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Country Status (4)

Country Link
JP (1) JP3940054B2 (en)
KR (1) KR100578392B1 (en)
CN (1) CN1252798C (en)
TW (1) TWI234797B (en)

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CN103567160A (en) * 2012-07-27 2014-02-12 北京京东方光电科技有限公司 Device for automatically cleaning printed circuit boards and using method for device

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Publication number Priority date Publication date Assignee Title
JP4324538B2 (en) 2004-10-04 2009-09-02 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
KR100945360B1 (en) 2005-12-29 2010-03-08 엘지디스플레이 주식회사 Roll stocker and method of fabricating liquid crystal display device using the same
KR100787908B1 (en) 2006-07-28 2007-12-27 주식회사 케이씨텍 Coater having pre-spreading unit and method of coating
JP4850680B2 (en) 2006-12-15 2012-01-11 中外炉工業株式会社 Discharge nozzle cleaning device
JP2010240550A (en) * 2009-04-03 2010-10-28 Dainippon Screen Mfg Co Ltd Apparatus for treating substrate
JP5138058B2 (en) * 2011-03-07 2013-02-06 東レ株式会社 Cleaning member and applicator cleaning method, cleaning device, and display member manufacturing method
JP5537581B2 (en) * 2012-03-08 2014-07-02 株式会社東芝 Coating apparatus and coating body manufacturing method
CN105436037B (en) * 2016-01-06 2018-10-30 苏州赛腾精密电子股份有限公司 A kind of syringe needle gel resin mechanism and dispenser

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103567160A (en) * 2012-07-27 2014-02-12 北京京东方光电科技有限公司 Device for automatically cleaning printed circuit boards and using method for device
CN103567160B (en) * 2012-07-27 2015-07-15 北京京东方光电科技有限公司 Device for automatically cleaning printed circuit boards and using method for device

Also Published As

Publication number Publication date
CN1497659A (en) 2004-05-19
KR20040032055A (en) 2004-04-14
TWI234797B (en) 2005-06-21
TW200414277A (en) 2004-08-01
CN1252798C (en) 2006-04-19
KR100578392B1 (en) 2006-05-10
JP2004122067A (en) 2004-04-22

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