TWI263542B - Apparatus for and method of processing substrate - Google Patents

Apparatus for and method of processing substrate Download PDF

Info

Publication number
TWI263542B
TWI263542B TW094129400A TW94129400A TWI263542B TW I263542 B TWI263542 B TW I263542B TW 094129400 A TW094129400 A TW 094129400A TW 94129400 A TW94129400 A TW 94129400A TW I263542 B TWI263542 B TW I263542B
Authority
TW
Taiwan
Prior art keywords
substrate
coating
nozzle
slit
blade
Prior art date
Application number
TW094129400A
Other languages
Chinese (zh)
Other versions
TW200624180A (en
Inventor
Yoshinori Takagi
Hiroshi Okada
Yasuhiro Kawaguchi
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004291306A external-priority patent/JP4324538B2/en
Priority claimed from JP2004302533A external-priority patent/JP4727203B2/en
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200624180A publication Critical patent/TW200624180A/en
Application granted granted Critical
Publication of TWI263542B publication Critical patent/TWI263542B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005Nozzles or other outlets specially adapted for discharging one or more gases
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B05B1/04Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
    • B05B1/044Slits, i.e. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84Inspecting
    • G03F1/86Inspecting by charged particle beam [CPB]

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

To inhibit application unevenness by optimizing the state of a slit nozzle. In a slit nozzle 41, the first lip side 410a of a first lip 410 is arranged in the position where only a level difference D is lower than the second lip side 411a of a second lip 411. Preliminary application processing is performed by applying resist liquid to a roller 71 of a spare applying member while making the slit nozzle 41 scan in the direction ((-X) direction) opposite to the scanning direction ((+X) direction) of the slit nozzle 41 in this application processing. The application processing is performed by applying the resist liquid to a substrate 90 while making the slit nozzle 41 scan in the direction (+X) which is normalized by the preliminary application processing.

Description

1263542 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種於液晶用玻璃角形基板、半導體晶 元、薄膜液晶用可撓性基板、光罩用基板、彩色濾光片用 基板等之基板(以下簡稱為「基板」)之表面,塗佈光阻等之 處理液之技術。更詳述之,-種為了提高塗佈精度,而使 喷嘴狀態正常化之技術。[Technical Field] The present invention relates to a glass-angle substrate for liquid crystal, a semiconductor wafer, a flexible substrate for a thin film liquid crystal, a substrate for a photomask, a substrate for a color filter, and the like. A technique of applying a treatment liquid such as a photoresist to the surface of a substrate (hereinafter simply referred to as "substrate"). More specifically, there is a technique for normalizing the nozzle state in order to improve the coating accuracy.

【先前技術】 以往,眾所皆知於基板表面塗佈光阻等之處理液之基板 處理裝置。作為如此基板處理裝置,一般知道使用包含開 縫狀之吐出部之開縫喷嘴,進行形成塗膜之塗佈處理(開縫 塗佈)之開縫塗佈。塗佈後不進行使塗膜均—化之旋轉處理 之開缝塗佈中,塗佈膜厚之偏差(以下稱為「塗佈不均」) 係直接成為製品配線寬幅等之缺陷(不良原因 句〗避免產生 -佈處理之特定狀態。更具體㈣,如圖u及圖12之侧面 圖所示,最理想為開縫喷嘴341之前端部係涵蓋其長邊方向 之整體,於開縫喷嘴34丨之下端 1M ^ 卜為面未存有處理液B之狀態(圖 ⑴’:於開縫喷嘴341之下端面,形成均一且 之液體積留之狀態(圖12)。總之,開縫嘴嘴341之前端:: 不淪長邊方向及寬幅方向, ’、 取対^b成為均一之狀態。 但疋,反覆進行塗佈處理時 > 乂山 圖13所不,開縫嘴嘴341 ㈣側面有時會附著處理液⑹。如此,„[Prior Art] Conventionally, a substrate processing apparatus which applies a treatment liquid such as a photoresist to a surface of a substrate is known. As such a substrate processing apparatus, it is generally known to use a slit nozzle including a slit-like discharge portion to perform slit coating for forming a coating film (slot coating). In the slit coating in which the coating film is not subjected to the spin treatment after the coating, the variation in the coating film thickness (hereinafter referred to as "coating unevenness") directly becomes a defect in the width of the product wiring (bad The reason sentence 〖avoids the specific state of the cloth processing. More specifically (4), as shown in the side view of Fig. u and Fig. 12, it is most desirable that the front end portion of the slit nozzle 341 covers the entire length direction of the slit nozzle. The lower end 1M of the nozzle 34 is in a state where the processing liquid B is not present (Fig. (1)': a state in which the liquid is left in the lower end surface of the slit nozzle 341 (Fig. 12). In short, slitting Front end of mouth 341:: No long-side direction and wide direction, ', take 対^b to be uniform. But 疋, when applying coating repeatedly> 乂山图13不, slit mouth 341 (4) The treatment liquid (6) is sometimes attached to the side. Thus, „

Ba係與從吐出口 341吐出 液 出之處理液B干涉’而降低塗佈處理 104395.doc U63542 佑:""並成為塗佈不均之原因。為了決解此,於開縫塗 &订使用洗'爭液洗淨開縫噴嘴之前端部之洗淨處 右/旦即使進行此洗淨處理,如圖14所示洗淨液R(或空氣) I:進入吐出口 341a内’故僅洗淨處理係難以將開縫噴嘴 之别端部調整到均一之特定狀態。 因此’從以往即得知插 — 種種恢设開縫喷嘴之狀態之技術, 例如揭示於專利文件1。 :專利文件1中’係、記载於開縫噴嘴之側面等塗佈疏水性 ^ 使八不附著不用之處理液之技術。但由於僅塗佈lm 、J縫噴觜之先端’故有成本增加且開缝喷嘴變高價 題另外’塗佈處理由於伴隨著熱處理,故可能於 開縫噴嘴產生歪曲。 ::、於開縫塗佈中’在將開縫噴嘴靠近旋轉之大致圓 5滾軸外周面之狀態吐出—定之處理液,藉由此,也 可2開縫贺嘴之前端部調整為圖u、圖^所示之均一特定 (、彳士參肊專利文件2、3)。此處理,係由於對本來之基 、、佈處理則進行,故稱為「預備塗佈處理(預先塗佈)」 [專利文件1]日本特開2002-282760號公報 [專利文件2]曰本特開2〇〇1_31〇147號公報 [專利文件3]日本特開2〇〇心167476號公報 (發明所欲解決之問題) ,_僅進行上述預備塗佈處理,係難以將開縫喷嘴之 ,心凡王最適化。因此,例如每進行特定次數之處理,或 、特疋之時間,即有必要進行開縫喷嘴之洗淨處理 104395.doc 1263542 等。然後’進行開縫噴 處理故生產量乃降低。'因卜,處期間’由於中斷塗佈 技術係有待更加改善。4 ’對正常化開縫噴嘴之狀態之 藉由預備塗佈處理附菩於、、奋 與特定之洗淨液混合後,處理液’係 長尺狀刮片,可從滾μ錯由域於㈣之滾軸外周面之 片係由揚氏俜數為::6周面撥洛除去。一般來說,此刮 _、MPa到653GMPa左右之聚乙稀、聚 鈿酪、u旨等之塑膠片所組成。 之基板尺寸之大型化,對開縫塗佈之開縫喷嘴 大尺寸要求也增大’因此,滚軸長邊方向之尺寸也隨著增 =如此^增大乃進展時,^之加工或其安裝中 …:因安装之滾軸本身重量,於滾軸之長邊方 於+邊曲。因此’於嚴謹之位準(帅位準)中,係難 於長邊方向直線配置滾軸之外周面。 除去滾轴之附著物之上述到片,係可沿著滾轴之 ^成為直線配置。因此,滚轴之外周面係於長邊方 =為非直線時’於部分的外周面,則產生藉由刮片對滾 灶罢之知屋力較弱之處,或刮片與滾軸未接觸之處。並 :果’部分產生於滾軸之外周面無法藉由刮片除去之殘留 ,導致此殘留物阻礙對開縫噴嘴恢復到特定狀態之調整。 =發明係鑑於上述課題發明者,且以最適化開縫喷嘴之 狀悲、抑制塗佈不均為第1目的。 並且,本發明係以涵蓋滾軸之整體長邊方向除去滾輛之 104395.doc 1263542 附著物為第2目的。 【發明内容】 j 了解決上述課題’如請求項&發明係 處料之基板處理裝置,且包括:保持基板;之保= 冓’舁於弟1方向掃描保持在前述保持機構之美 、. 從吐出口對於前述基板吐出處 2 ’a同時 、丄、 從 < 開縫賀嘴,盥Μ ώ 乂 述開缝喷嘴塗佈處理液之預備 ' 則The Ba system interferes with the treatment liquid B discharged from the discharge port 341 and reduces the coating treatment. 104395.doc U63542 You: "" and causes uneven coating. In order to resolve this, in the sew coating & use the washing liquid to clean the opening of the nozzle before the end of the cleaning, right / even if this cleaning process, as shown in Figure 14 of the cleaning liquid R (or Air) I: Entering the discharge port 341a. Therefore, it is difficult to adjust the other end portions of the slit nozzles to a uniform specific state. Therefore, it has been known from the past that various techniques for recovering the state of the slit nozzle are known, for example, from Patent Document 1. In Patent Document 1, the technique of applying a hydrophobicity to the side surface of a slit nozzle or the like is such that the treatment liquid is not attached. However, since only the leading ends of the lm and J slit squirts are applied, the cost increases and the slit nozzle becomes expensive. In addition, the coating treatment may be caused by the heat treatment, which may cause distortion in the slit nozzle. :: In the slit coating, the liquid is discharged in a state where the slit nozzle is brought close to the outer circumference of the substantially circular roller 5 of the rotation, whereby the end portion of the slit can be adjusted to the front. u, the uniformity shown in Figure ^ (, Gentleman's patent documents 2, 3). This process is performed on the basis of the original and the cloth, so it is called "pre-coating process (pre-coating)" [Patent Document 1] JP-A-2002-282760 [Patent Document 2] [Patent Document 3] Japanese Patent Laid-Open No. 167476 (problem to be solved by the invention), _ only the above-described preliminary coating treatment is performed, and it is difficult to open the slit nozzle The heart of the king is the most appropriate. Therefore, for example, it is necessary to perform the cleaning process of the slit nozzle 104395.doc 1263542 or the like every time a certain number of times of processing, or special time is performed. Then, the production of the slit spray is reduced. 'Inb, during the period' due to the interruption of the coating technology needs to be further improved. 4 'The state of the normalized slit nozzle is prepared by the pre-coating treatment, and the mixture is mixed with the specific cleaning liquid, and the treatment liquid is a long-length blade, which can be obtained from the roll. The film on the outer peripheral surface of the roller is removed by Young's number of turns: 6 weeks. Generally speaking, the scraping _, MPa to 653 GMPa, the composition of polyethylene, polythene, and the like. As the size of the substrate is increased, the size of the slit nozzle for slit coating is also increased. Therefore, the dimension of the longitudinal direction of the roller is also increased as the diameter of the roller increases. Medium...: Due to the weight of the roller itself, the long side of the roller is on the + side. Therefore, it is difficult to arrange the outer surface of the roller in a straight line in the direction of the rigorous position. The above-mentioned sheet to which the attachment of the roller is removed can be arranged in a straight line along the roller. Therefore, when the outer peripheral surface of the roller is on the long side = when it is non-linear, the outer peripheral surface of the portion is weak, or the blade is not weakened by the blade, or the blade and the roller are not Where to contact. And the portion of the fruit is produced by the residue on the outer surface of the roller which cannot be removed by the blade, so that the residue hinders the adjustment of the slit nozzle to a specific state. In the inventor of the present invention, in order to optimize the shape of the slit nozzle, it is the first object to suppress coating. Further, the present invention is a second object of removing the roller of the roller from the entire longitudinal direction of the roller, 104395.doc 1263542. SUMMARY OF THE INVENTION A substrate processing apparatus for solving the above-mentioned problems, such as the claim item & the invention, includes: holding the substrate; and maintaining the beauty of the holding mechanism in the direction of the first direction scanning. The discharge port is at the same time as the above-mentioned substrate discharge portion 2'a, 丄, from < slitting, and 乂 乂 乂 预备 预备 开 开 开 则 则 则 则 则

乃以於對前述第!方向幾近逆向 ㈣W 佈構件之夺面之方4 4 向掃描前述預備塗 籌件之表面之方式’相對移動前述開縫喷嘴 塗佈構件之表面之移動機構 '、 含位詈於X山 再”中,則述開縫噴嘴,係包 置於刚述吐出口之前述第1方向侧之第1唇部面,及位 置於刖述吐出口之前述第2方 辰邱& , W之第2唇部面,·前述第! ^面,係比前述第2唇部面於處理液之吐出方向突出 又,請求項2之發明係關於請求項!之發明之出。 置;JL中,访、十、猫很1 土板處理裝 、“/ 塗佈構件,係大致圓筒狀之構件^ ;L夕動機構,係以前述開縫喷 m 備塗佈構件表面之方式,於 件。 ;車〜周圍方疋轉前述預備塗佈構 置㈣關於請求項2之發明之基板處理裝 更突出、=: 前述第1唇部面比前述第2唇部面 又大出之調整機構。 ,w 板㈣關於請求項1至3… 出30 ^置上其令’前述第1唇部面係比前述請部面突 1〇4395.d〇c 1263542 又,請求項5之發明係關於請求項2之發明之基板處理裝 置,其係更進一步包括藉由抵接於前述預備塗佈構件之表 I除去該表面之附著物之長尺狀刮片,其中前述刮片係揚 氏係數為1 MPa到20 MPa之範圍内之彈性體所組成。 又,清求項6之發明係關於請求項2之發明之基板處理裝 置,其係更包括藉由抵接於前述預備塗佈構件之表面除去 =面之附著物之長尺狀刮片;其中,前述刮片係以橡膠 、姐成。 又,請求項7之發明係,其特徵為從設置於開縫喷嘴之吐 出口吐出處理液,於基板塗佈處理液之基板處理方法,且 m持基板之保持步驟;與對於在前述保持步驟中所 板塗=述基板’於第1方向掃描前述開縫喷嘴並於前述基 板塗佈處理液之主塗佈步驟,與以前述開縫喷嘴可於盘乂 :弟1方向幾近為逆方向之第2方向掃描之方式,相對移: -佈構件之表面且於前述預備塗佈構件 塗佈步驟;其中,於前述主塗佈步驟及前心= 中,設詈於it、+、1 Ϊ 貝備塗佈步驟 比#置P ϋ之別述第1方向側之第1唇部面,俜 比叹置於刖述吐出口前 你 更低之位置。之“第2方向側之第2卷部面設置於 d貝8之發明係其特徵為關於 板處理方法;且前述預備塗佈步驟係比前^之發明之基 實行;前述主塗佈牛驟… 比别述主塗饰步驟先 又” ”驟係於别述預備塗佈步驟之後實杆 又,“項9之發明係於基板塗佈處理 ^仃。 置,且包含:沿著大 之之基板處理裝 千之弟3方向延伸,於前述第3方 I04395.doc -10- a^W542 向正乂之大致水平之第4 於前述基板吐出二、+、+ 〇,對於前述基板相對移動且可 入工aj刖迷處理、、右 方向延伸,ϋ ^ 液之開縫噴嘴,與沿者前述第3 ^ 1曱错由於外周面你a丄 液,脾a、+、^卸攸則述開縫喷嘴吐出前述處理 、則速開縫噴嘴之前 狀之滾軸,盥^ $调整到特定狀態之大致圓筒 ’衣釉,與沿者前述第3太 之前述外届而^ 、万向延伸且藉由抵接於前述滾軸 其中,义m u I外周面之附著物之長尺狀刮片· “干,削迷刮片係以楊氏 之 彈性體所_。 ”數為—a到2〇MPa之範圍内 板處理置、G之&明係其特徵為於基板塗佈處理液之基 =裝置,且包含:沿著大致水平之第3方向延伸 述第3方向正交之大致 弒^ α 炙第4方向,對於前述基板相對 移動且可於前述基板It is for the aforementioned! The direction is almost reversed (4) The face of the W-belt member 4 4 The direction of scanning the surface of the aforementioned preliminary coating member is 'relatively moving the moving mechanism of the surface of the slit nozzle coating member', the position of the surface is X in X-shan again" In the middle, the slit nozzle is placed on the first lip surface on the first direction side of the discharge port, and the second square Chen & The lip surface, the first surface of the second lip portion protrudes from the discharge direction of the treatment liquid, and the invention of claim 2 relates to the invention of the request item. Ten, the cat is very 1 earth plate processing equipment, "/ coating member, is a substantially cylindrical member ^; L tempo mechanism, the surface of the coating member is prepared by the above-mentioned slitting spray. (2) The substrate processing apparatus of the invention of claim 2 is more prominent, and the adjustment mechanism of the first lip surface is larger than the second lip surface. , w board (four) about request items 1 to 3... out 30 ^ put the order of 'the first lip part is more than the aforementioned part of the face protrusion 1〇4395.d〇c 1263542 Also, the invention of claim 5 is about the request The substrate processing apparatus according to the invention of claim 2, further comprising a long-sized blade which removes the adhering matter of the surface by a surface I of the preliminary coating member, wherein the blade has a Young's modulus of 1 It consists of an elastomer in the range of MPa to 20 MPa. Further, the invention of claim 2 is the substrate processing apparatus of the invention of claim 2, further comprising a long-sized blade which is removed by abutting the surface of the preliminary coating member; The aforementioned blade is made of rubber and sister. Further, the invention of claim 7 is characterized in that the processing liquid is discharged from the discharge port of the slit nozzle, the substrate processing method of the substrate coating processing liquid, and the holding step of the substrate is held; In the main coating step of the substrate coating, the substrate is scanned in the first direction, and the main coating step of the substrate coating treatment liquid is performed, and the slit nozzle can be reversed in the direction of the tray 1 In the second direction scanning mode, the relative movement is: - the surface of the cloth member and the coating step of the preliminary coating member; wherein, in the main coating step and the front center =, it is set to it, +, 1 Ϊ The shell-coating step is lower than the first lip surface on the first direction side of #PP, and it is placed lower than the position before the spout. The invention of the second roll portion on the second direction side is provided in the d-be 8 and is characterized in that the plate processing method is performed; and the preliminary coating step is performed on the basis of the invention of the former; ...Before the description of the main finishing step, the "S" is followed by the actual coating step, and the invention of Item 9 is applied to the substrate coating process. And including: extending along the direction of the substrate of the large substrate, in the third direction, the third party I04395.doc -10- a^W542 to the fourth level of the normal level of the fourth substrate on the substrate spit two, + , + 〇, for the relative movement of the above-mentioned substrate, and can be processed in the right direction, extending in the right direction, the slit nozzle of the ϋ ^ liquid, and the third ^ 1 error along the edge, because of the outer peripheral surface, you a sputum, spleen a, +, ^ 攸 攸 攸 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开 开The long-length blade of the attachment of the outer peripheral surface of the outer mu I, which is extended by the outer and the gimbal, and the "dry", the shaving blade is made of the elastic body of the Young's _. "The number is -a to 2 〇 MPa in the range of the plate treatment, G & Ming is characterized by the base of the substrate coating treatment liquid = device, and includes: extending along the third horizontal direction The third direction is orthogonal to the substantially 弑^α 炙 fourth direction, and the substrate is relatively moved and can be on the substrate

出則述處理液之開縫喷嘴,與沿者 月U迷苐3方向延伸,葬士仏L 卢押> _ ";外周面從前述開縫喷嘴吐出前述 处里液’將前述開縫噴嘴之命 、❺則^部調整到特定狀態之大致 圓靖狀之滾軸,與沿者前诚笙,士人 .., 边弟3方向延伸且藉由抵接於前述 μ . 除去^外周面之附著物之長尺狀刮 片,其中,前述刮片係以橡膠組成。 又,请求項11之發明,作於^ # °載於#求項9或1 〇之基板處 理裝置’前述刮片之厚度係從0 5_到1〇_之範圍内。 又,請求項12之發明,係於記载於請求項9或狀基板處 理裝置,其中更進一步包含& ^ + 3於刖述第3方向,可部分調整對 於前述滾轴之前述刮片之按壓力之調整機構。 又,請求項13之發明係於記載於請求項12之基板處理裳 置;其中,前述調整機構係藉由於前述第3方向,部分變更 104395.doc 11 UW542 對於前述滾輪 [發明之效果]月卜丨片之角度,調整前述按麼力。 於請失 板且:吐:1至8所記載之發明中’於第1方向掃描保持之基 面,係比:2:?基板吐出處理液之開縫喷嘴之第1唇部 向幾近逆向:邛面於處理液之吐出方向突出’以對第1方 對移動開縫噴部材之表面之方式,相 記载於性古 冓件之表面,可抑制塗佈不均。 、明求項2之發明,預備塗係 件,移動機m 1有土佈構件為大致圓筒狀之構 之表面之方/ 、縫噴嘴乃於第2方向掃描預備塗佈構件 求裝置之小:化精由於轴心周圍旋轉預備塗佈構件,可謀 口己载於請求項3之發明,粗 部面比前述第2唇部… 一步包括使前述第1唇 用之處理、夜種 *出之㈣機構,例如可因應於使 里/夜種類做位置調整。 °己载於请求項8之發明,預備 驟先實行,主冷你半跡佈^驟係比前述主塗佈步 行,由於可於芒、“ 於預備塗佈步驟之後立即實 取% 了於最適化開縫噴嘴 塗佈處理㈣立即進行基板之主 一 故可南精度塗佈處理液。 藉由請求項5、6及9至13之發明,^ ρ 之外周面形狀而變形,故於滾魅/片由於可能沿著滾軸 心,涵蓋整體第3 ' 即使產生重量彎曲或偏 此,可、=第3方向刮片係可接觸於滾軸之外周面。因 可涵盘整體第3方向除去滚轴之付著物。 又,特別藉由請求項丨丨之發 變形性態之平衡。 ’、可取得刮片之耐久性與 104395.doc 1263542 又,特別藉由請求項12及13之發明,由於可 分調整對滾轴之刮片之按壓力,故於第3任向部 有刮片之按壓力較弱之部分也可調整此, 處即使 方向除去滾轴之付著物。另外,特別藉由請;^整_ 係可易於變更此按壓力。 “13之發明, 【實施方式】 以下’參照添付圖面詳細說明本發 <第1實施形態> 通且只鼽形態。 < ^1·基板處理裝置之構造> 圖1係例示本發明^實施形態之 =略斜視圖。並且,中為7配合圖二: 義軸方向為錯直方向、χγ平面為水平面,但此等 ^ 明位置關係而定義者,並非限定以下說明各…、次 之圖也相同。 门之者。以下 開縫塗佈1係大致分成塗佈處理部2與控制部 之電極基板」),於選擇性_形成於基板90表面 、,電極層專之製程中’組成於基板90表面塗佈作為處 夜:塗佈處理裳置。因此,於此實施形態中,開 m 土出光阻液。並且,開縫塗佈1係不僅可為液晶顯 不、 <玻璃基板裝置’且也可變形利用作為— 面板顯示器用之各種基板塗佈處理液之裳置而變形利用 塗佈處理部2係作為用來保持載置基板9〇之保持台而作 用’且同時也包括作為附屬各機構之基台而功能之平台3。 W4395.doc 1263542 平口 3係包含正方體形狀之例如一體成形之石製品,其上面 (保持面30)及側面係加工成平坦面。 平台3上面係做成水平面,且為基板90之保持面30。保持 面30係形成分布多數未圖示之真空吸著孔,於開縫塗佈1 中,處理基板之期間藉由吸著基板90,將基板90保持於特定 之X平位置。並且,於保持面3 〇以適當之間隔,設置藉由未 圖示之艇動步驟可上下自由昇降之複數昇降銷Lp。昇降銷 籲LP係於除去基板9〇時為了將基板往上推而使用。 保持面30中挾持基板9G之保持區域(料基㈣之區域) 之兩端部’於大致水平方向較設定平行伸展—對走行軌道 31。走行軌道31係與固定於架橋構造4之兩端部最下方、未 圖示之支持區塊相同,引導架橋構造4之移動(將移動方向規 疋於特定方向),並組成將架橋構造4支持於保持㈣ .線性引導。 於平台3上方,設置從此平台3之兩側部分大致水平h 2橋構造4。架轎構造4係主要由例如以碳纖維補強樹 月幹之喷嘴支持部40,與支持其兩端之昇降機構仏料所组 成。 、 於噴嘴支持部40安裝著開縫喷嘴41。圖,於γ軸方向 包含長邊方向之開縫喷嘴41,係連接著含有對開縫喷嘴二 供給光阻之配管或光鴨浦等之光阻供( Ϊ)°開縫噴嘴41係―之同時,將藉由光阻用 “供給之光阻液’吐出於基板9〇表面之特定 稱為「光阻塗料域」),再對基板㈣佈綠液。並且,’ 104395.doc _ 14· 1263542 所謂光阻塗佈區域係指於基板90表面中要塗佈光阻液之區 域,且通常從基板90之全面積,除去沿著端緣之特定寬幅區 域之區域。 另外,開縫噴嘴4H系不僅掃描基板9〇,也掃描預先塗佈 滾軸71 (圖2)之表面,同時塗佈光阻液。開縫塗佈〗之此等詳 細動作乃於後述之。 昇降機構43、44係分別於開縫噴嘴41之兩側,藉由喷嘴 # 支持部40,與開縫喷嘴41連接。昇降機構43、44係主要由 AC伺服馬達43a、44a及未圖示之滾珠螺桿所組成,根據從 控制部8來之控制信號生成架橋構造4之昇降驅動力。藉由 此,歼降機構43、44係並行跟進昇降開縫喷嘴4丨。並且,昇 降機構43、44係也可使用於調整開縫喷嘴41之¥2平面内之 姿勢。 於架橋構造4之兩端部,沿著平台3兩側之緣侧,各自固 定設置各包含一對固定子50a(狀態)與移動子5〇b及固定子 _ 5丨&與移動子51b之AC無鐵心式線性馬達5〇、51(以下簡稱為 「線性馬達」)。並且,於架橋構造4之兩端部係各自固定設 置各包括比例尺部與檢測子之線性編碼器52、53。線性編碼 器52、53係檢測線性馬達50、51之位置。此等線性馬達5〇、 5 1與線性編碼器52、53係主要組成,將架橋構造4引導到走 行軌道31之同時移動平台3上之走行機構。控制部8係根據從 線性編碼器52、53來之檢測結果,控制線性馬達5〇、5丨之動 作彳工制平台3上之架橋構造4之移動、總之控制藉由開縫噴 嘴41所產生之基板9〇之掃描。 104395.doc -15- 1263542 塗佈處理部2之保持面30中,於保持區域之(_χ)方向側設 置開口 32。開口 32係與開缝喷嘴41相同於¥軸方向包含長邊 方向,且該長邊方向長度係與開縫噴嘴41之長邊方向長度大 致相同。 圖2為主要例示開口 32内之預備塗佈機構7之構造側面 圖。於圖1中係省略圖示,但於開口 32下方之塗佈處理部2 之内部係設置預備塗佈機構7。The slit nozzle of the treatment liquid is extended in the direction of the stalker U, and the funeral 仏L Lu &> _ "; the outer peripheral surface is spouted from the aforementioned slit nozzle The nozzle's life, the ^ ^ ^ 调整 调整 调整 调整 调整 调整 调整 调整 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴 喷嘴A long-sized blade of the attachment, wherein the blade is made of rubber. Further, the invention of claim 11 is made in the substrate processing device of #9 or 1 〇, and the thickness of the blade is in the range of 0 5 _ to 1 〇 _. Further, the invention of claim 12 is described in the request item 9 or the substrate processing apparatus, further comprising & ^ + 3 in the third direction, wherein the blade for the roller is partially adjustable Press the pressure adjustment mechanism. Further, the invention of claim 13 is the substrate processing device described in claim 12; wherein the adjustment mechanism is partially changed by the third direction 104395.doc 11 UW542 for the aforementioned roller [effect of the invention] From the angle of the cymbal, adjust the aforementioned force. In the invention described in 1 to 8, the base surface of the scanning and holding in the first direction is: 2: the first lip of the slit nozzle of the substrate discharge processing liquid is nearly reversed. The kneading surface protrudes in the discharge direction of the treatment liquid. The method of moving the surface of the slitting spray member to the first side is described on the surface of the smear element, and coating unevenness can be suppressed. According to the invention of claim 2, the preliminary coating system is provided, and the moving machine m 1 has a surface in which the soil cloth member has a substantially cylindrical structure, and the slit nozzle scans the preliminary coating member in the second direction. In the invention of claim 3, the rough surface is larger than the second lip portion, and the first lip is processed in one step, and the night is planted in the night. The (4) organization, for example, can make position adjustments according to the type of inside/night. ° has been carried out in the invention of claim 8, the preparation is carried out first, the main cold your half-track cloth is more than the above-mentioned main coating walk, because it can be used in the mang, "after the preparation of the coating step, the actual take-up is optimal The slitting nozzle coating process (4) immediately performs the main coating of the substrate to the south precision coating processing liquid. With the inventions of claims 5, 6 and 9 to 13, the shape of the outer surface of the surface is deformed, so that the charm Since the sheet may be along the roller core, covering the entire 3'th, even if the weight is bent or biased, the =3 direction wiper can contact the outer circumference of the roller. The third direction of the cullet can be removed. In addition, the balance of the deformation state of the hair strand is requested, in particular, the durability of the blade can be obtained and 104395.doc 1263542, in particular, by the invention of claims 12 and 13 Since the pressing force of the blade of the roller can be adjusted, the portion where the pressing force of the blade is weak in the third direction portion can be adjusted, and the object of the roller can be removed even if the direction is removed. In particular, it is easy to change this pressing pressure by means of the ^^ system. "Invention of 13, [ Hereinafter Shi embodiment 'of the present detailed description made with reference to add & lt pay drawings; Embodiment 1 > and only through congested nose shape. <^1·Structure of Substrate Processing Apparatus> Fig. 1 is a perspective view showing an embodiment of the present invention. In addition, the middle is 7 with the figure 2: the direction of the sense axis is the direction of the straight line, and the plane of the χγ plane is the horizontal plane. However, the definition of the positional relationship is not limited to the following descriptions. The door. The following slit coating 1 is roughly divided into an electrode substrate "" of the coating processing portion 2 and the control portion", and is selectively formed on the surface of the substrate 90, and the surface of the substrate 90 is coated on the surface of the substrate 90. Night: Coating treatment. Therefore, in this embodiment, the photoresist is opened. Further, the slit coating 1 system can be modified not only by liquid crystal display, but also by the glass substrate device, and can be deformed by using various coating treatment liquids for the panel display, and the coating processing unit 2 is used. It functions as a holding table for holding the substrate 9A, and also includes a platform 3 that functions as a base for each of the attached mechanisms. W4395.doc 1263542 Flat mouth 3 series of stone products, for example, integrally formed in the shape of a cube, the upper surface (holding surface 30) and the side surface are processed into a flat surface. The upper surface of the platform 3 is formed into a horizontal plane and is a holding surface 30 of the substrate 90. The holding surface 30 is formed with a plurality of vacuum suction holes (not shown). In the slit coating 1, the substrate 90 is held by the substrate 90 while the substrate is being processed, and the substrate 90 is held at a specific X flat position. Further, a plurality of lift pins Lp which are vertically movable up and down by a boat moving step (not shown) are provided at appropriate intervals on the holding surface 3'. The lift pin calls the LP to be used to push the substrate upward when the substrate 9 is removed. The both end portions ' of the holding surface (the region of the material base (4)) of the holding surface 9G in the holding surface 30 are extended in the substantially horizontal direction in parallel to the traveling track 31. The running track 31 is the same as the supporting block which is fixed to the lowermost end portions of the bridge structure 4 and not shown, and guides the movement of the bridge structure 4 (the moving direction is regulated in a specific direction), and constitutes the bridge structure 4 support. To maintain (four). Linear guidance. Above the platform 3, a substantially horizontal h 2 bridge configuration 4 from both sides of the platform 3 is provided. The carriage structure 4 is mainly composed of, for example, a nozzle support portion 40 which is made of a carbon fiber reinforced tree, and a lifting mechanism that supports both ends thereof. A slit nozzle 41 is attached to the nozzle support portion 40. In the drawing, the slit nozzle 41 including the longitudinal direction in the γ-axis direction is connected to a pipe containing a photoresist for the slit nozzle 2 or a light-resistance (s) slit nozzle 41 of a light duck or the like. The "light-resistance liquid supplied from the photoresist" is spit out of the surface of the substrate 9 to be referred to as "photoresist coating field", and the substrate (four) is greened. Also, '104395.doc _ 14· 1263542 The term "resistive coating area" refers to the area of the surface of the substrate 90 where the photoresist is to be applied, and generally the specific width of the substrate 90 is removed from the entire area of the substrate 90. The area of the area. Further, the slit nozzle 4H not only scans the substrate 9 but also scans the surface of the roller 71 (Fig. 2) beforehand and applies the photoresist. The detailed actions of the slit coating are described later. The elevating mechanisms 43, 44 are connected to the slit nozzles 41 by the nozzle #support portion 40 on both sides of the slit nozzle 41, respectively. The elevating mechanisms 43 and 44 are mainly composed of AC servo motors 43a and 44a and a ball screw (not shown), and generate and lower the driving force of the bridging structure 4 based on the control signal from the control unit 8. Thereby, the squatting mechanism 43, 44 is followed by the lifting slit nozzle 4 in parallel. Further, the lifting mechanisms 43 and 44 can also be used to adjust the posture in the plane of the slot 2 of the slot nozzle 41. At both end portions of the bridge structure 4, along the edge sides of the platform 3, each of which is fixedly disposed to include a pair of stators 50a (state) and a moving sub-port 5b and a fixed sub-5丨& and a moving sub-51b The AC coreless linear motor 5〇, 51 (hereinafter referred to as "linear motor"). Further, linear encoders 52 and 53 each including a scale portion and a detector are fixedly disposed at both end portions of the bridge structure 4. The linear encoders 52, 53 detect the position of the linear motors 50, 51. These linear motors 5, 51 and the linear encoders 52, 53 are mainly composed, and the bridging structure 4 is guided to the traveling track 31 while moving the traveling mechanism on the platform 3. The control unit 8 controls the movement of the bridge structure 4 on the work platform 3 based on the detection results from the linear encoders 52 and 53 and the control of the bridge structure 4 on the work platform 3, and the control is always generated by the slit nozzle 41. Scanning of the substrate 9〇. 104395.doc -15- 1263542 In the holding surface 30 of the coating processing unit 2, an opening 32 is provided on the (_χ) direction side of the holding area. The opening 32 is the same as the slit nozzle 41 in the longitudinal direction of the ¥ axis direction, and the length in the longitudinal direction is substantially the same as the length in the longitudinal direction of the slit nozzle 41. Fig. 2 is a side view showing the construction of the preliminary coating mechanism 7 in the opening 32. Although not shown in Fig. 1, a preliminary coating mechanism 7 is provided inside the coating treatment portion 2 below the opening 32.

預備塗佈機構7係比對基板90塗佈光阻液(主塗佈處理)預 先進行,且於預備塗佈處理(後述之)時使用。預備塗佈機構 7係包含筐體70、預先塗佈滾軸71(以下簡稱為「滾軸」)、 旋轉機構72、及附著物除去部74。附著物除去部⑽包含除 液用之刮片73。 筐體70係如圖2所示,以從上面露出一部分滾 :置之大致箱形狀之構件。於筐體7〇之内部係貯留可適合: 潰滾軸71之塗佈面一部分之量之洗淨液。另外,詳細情況: 未圖示’但貯留之洗淨液係從洗淨液供給部供給,藉由溢流 或沒極排出筐體70外。並且,洗涤饬筏异此 冼淨液係最好為含有光阻液溶 以成分之揮發性液體’但當然也不限於此者。 圓筒狀之滾軸71係,於預備塗佈處理時藉由開縫噴嘴41 知描其圓筒面’組成塗佈光阻液之塗佈面。亦#,滾軸π =當於本發明之預備塗佈構件。滾轴71之圓筒中心為轴心 轉驅動力於滾軸7丨之軸心p。 方疋轉機構72係未詳細圖示 仁由生成方疋轉驅動力之旋轉 104395.doc -16- 1263542 傳達該旋轉驅動力之圓環構件等所組成之機構。藉由 :疋馬達所生成之旋轉驅動力係介由圓環構件 :71,滾轴71係於圖2中順時鐘旋轉。藉由此,滚二; 佈面與開縫喷嘴41係相對移動。 之主 另外’藉由使旋轉機構72旋轉滾軸71, 係浸潰於此貯留之洗淨液。並且,塗佈面中浸潰於 部分係藉由滾轴71之旋轉從洗淨洗中拿出。 先淨液之 如此,於預備塗佈機構7中,藉由將滾轴7ι之塗 、、主 於洗淨液,係可於預備塗佈處理中 /又/貝 τ况手除去塗佈於塗佈面之 次。、’且’作為洗淨塗伟面之機構係不限於 =構,例如亦可於筐㈣内設置朝向塗佈面吐出洗淨^ 於筐體7 0内部固定設置包含 本邱7ZL wu 于欣用之刮片73之附著物除 去#74。刮片73係朝向滾轴71之塗佈面稍按壓之狀離,均一 抵接於Y軸方向。於此狀態滾㈣旋轉時,刮片如塗佈面 乃相對移動’刮片73係撥取並除去塗佈面之附著物。 預備塗佈機構7係進行預備塗佈處击 曰收拖猎由走订機構及 幵降機構43、44,於圖2所示之位置(以 下稱為預備塗佈位 」;己開縫喷嘴41。亦即,於預備塗佈處理中,開縫噴 噶4 1係大致呈現靜止之狀態。 圖3係例示配置於預備塗佈位置之開縫噴嘴41之圖。開缝 _係安裝於喷嘴支持部4〇之下方,包括幻唇部41 2唇部411及填隙板412。 戶斤謂第1辱部410與第2唇部411係如圖3所示,大致相同形 104395.doc 1263542 狀之構件,此等幾近對向迎合而組成開縫噴嘴4 1。第1唇部 410之下端為配置於大致水平方向之第1唇部面410a。同樣 地’第2唇部411之下端為配置於大致水平方向之第2唇部面 4 Ua。另外,第1唇部面410a及第2唇部面41 la,兩者開縫噴 嘴41塗佈光阻液之情況,兩者都為對向塗佈對象物(基板% 或滾轴71)表面之面。 於開縫塗佈1中,形成於第1唇部410與第2唇部411間之空 • 間係成為開縫噴嘴4 1内之光阻液之流徑(未圖示),該流徑之 (-z)方向之開口部係形成吐出口 41a(開縫)。藉由如此構造, 第1唇。P面410a係配置於吐出口 41a之(+X)方向側;第2唇部 面41 la係配置於吐出口 41a之〇χ)方向側。 如圖3所示,第丨唇部41〇係介由填隙板412安裝於喷嘴支 持部40。因此,第i唇部面41〇a係僅填隙板412之2軸方向之 厚度分(階差D)比第2唇部面411a,於(-Z)方向突出。如此, 藉由使用厚度不同之填隙板412,填隙板412係可功能作為調 _ 整第1唇部面410a及第2唇部面411a之階差之調整機構。另 外,本實施形態中之開縫塗佈1中,Z軸方向係表示垂直方 向’故第1唇部面41〇a係比第2唇部面411a配置於更低之位 置。 於開縫塗佈1,從未圖示之供給口將光阻液供給開缝喷嘴 4 1,此光阻液係流過開縫噴嘴4丨内之流徑,從吐出口 4 1 &於 (-ζ)方向吐出。亦即,第】唇部面41〇a係比第2唇部面ο。, 於(-Z)方向僅突出階差D,於開縫塗佈j中光阻液之吐出方向 由於為(-Z)方向,故第i唇部面41〇a係變成比第2唇部面 104395.doc -18- 1263542 411a,於口+屮士人^ 、、、出方向突出。此為,換言之,意味著於塗佈處理 (主塗佈處理及預備塗佈處理)中,開缝噴嘴41之第!唇部面 41〇a’係比第2唇部面41 la更接近塗有對象物。 :=圖1,控制部8係内部包括,隨者程序處理各種資料 之演算部8〇、保存程序或各種資料之記憶部81。另外,於前 面匕3知作員對開縫塗佈丨輸入必要之指示之操作部Μ及顯 示各種資料之顯示部83。 籲:工制係於圖1中,藉由未圖示之纜線與附屬於各機構 、'布處理邛2電性連接。控制部8係根據從操作部82來之輸 =仏諕或攸未圖不之各種感知器等來之信號,控制藉由昇降 機構43、44所造成之昇降動作、藉由走行機構所造成之開縫 喷背41^動作、更進―步藉由旋轉機構υ所造成之開縫 喷嘴4 1之掃描動作。 作為°己憶部8 1之具體例,係相當於暫時記憶資料之 η貝取專用之R〇M及磁碟裝置等。但記憶部8 1係可由 可拆ϋ磁碟片或記憶卡等之記憶媒體及此等之讀取裝置取 '另卜操作°卩82則有按扭及開關類等(包含鍵盤及滑鼠) 等仁亦可為如觸控式顯示器可兼具顯示部83功能。液晶顯 示器及各種燈等則相當於顯示部83。 < 1-2.基板處理裝置之構造〉 /、人概略⑨明藉由開縫噴嘴4丨之光阻液塗佈動作。又, 特別於僅要不拒絶,以下之動作係受到從控制部8來之控制 信號控制。 圖4為例示開縫塗佈1之動作流程圖。於開缝塗佈!中,藉 104395.doc 19 1263542 由操作員或未圖不之搬送機構,將基板9〇送到昇降銷Lp。 昇降銷LP係接收基板90後,開始下降藉由埋没於平台3内, 將收到之基板90載置於保持面3〇。藉由此,基板9〇係載置於 平台3之保持面30之特定位置,並且保持吸附著(步驟§1)。 與如此基板90之搬入處理不同地,於開縫塗佈}中於主塗 佈處理前,實施回復開縫噴嘴41前端部之狀態之最適化處 理,亦即實施預備塗佈處理(步驟S2)。 • 於預備塗佈處理中,首先,線性馬達50、51乃於X軸方向 移動開縫噴嘴4 1 ’並配置於預備塗佈機構7之滾軸7}上方。 八-人,昇降機構43、44係調整開縫喷嘴41之¥2平面内中之 姿勢’且同時將開縫噴嘴41接近滾軸”之塗佈面。藉由此, 開縫噴嘴4 1係移動到預備塗佈位置(圖2及圖3)。 :縫喷紫4 1移動到預備塗佈位置乃完了後,因應於從控 制4 8來之控制彳§號’光阻供給機構乃對開縫噴嘴Μ進行光 阻液之供給’藉由此’從開縫噴嘴“之吐出口…吐出光阻 、、、:後同步於光阻液之吐出,藉由使旋轉機構72旋轉滾 貝知對塗佈面塗佈光阻液、總之實行預備塗佈處理。 開縫噴嘴41雖然呈現幾近靜止狀態,但藉由使旋 Μ 72疑轉滾軸71,開縫喷嘴41與塗佈面乃相對移動。亦 汗’縫土佈1中藉由旋轉機構72所造成塗佈面之 可貫現預備涂佑声占 佈處理中之開縫塗佈41之掃描。 預備塗佈處理之、冷 主佈面之旋轉方向為圖2及圖3中之順時 知方向。因此,預锯 員備主佈處理中之開縫喷嘴41與塗佈面之相 對移動方向為A, 、、、、、。但於滾軸71中塗佈光阻液之部分(於塗 104395.doc -20- 1263542 佈瞬間進行掃描之部分)為滚轴7ί之最高到達 座標為最大點)。因此,例如即使塗佈面為旋轉動;方= 況,塗佈之瞬間之開鏠噴嘴41之掃描方向,係 = 方向之接線方向、亦即(_x)方向。 成對叙轉 :後述之,但於開缝塗佈m主塗佈處理中,開縫噴 係於㈣方向掃㈣㈣。因此,預備塗佈處 嘴41之掃描方向,係主㈣處理中之掃描方向q = t :。亦即’本實施形態中之開縫塗佈】之預傷 : 塗佈面中塗佈光阻液之區域,係藉由滾抽 浸潰於貯留於筐體7〇下部之洗 疋又序 光阻液係可立即藉由洗淨液洗淨除去。更進一步藉由滾轴7】 凝轉’將㈣於洗淨液之塗佈面從洗淨液取出,塗佈面之洗 淨處理乃結束。 塗佈面中’洗淨處理結束之區域係藉由滾軸71旋轉,再 y刮片73撥取附著物(主要為洗淨液或光阻液之殘留物 專)。如此,進行藉由刮片73之除去處理。 藉由預備塗佈處理於滾軸71之塗佈面中塗佈光阻液之區 域’係如此除去塗佈之光阻液,並再次回㈣佈光阻液之位 置(最南到達點)。藉由此,藉由滾轴71之塗佈面可避免開缝 賀嘴41受到污染。 進行從開㈣嘴41吐出特定量之光阻液且結束預備塗佈 處理後,線性馬達50、51乃將開縫嘴嘴41移動到塗佈開始位 104395.doc -21 - 1263542 置之同時,昇降機構43、44乃將開縫噴嘴41之高度調節到特 定之高度。所謂塗佈開始位置係指開縫喷嘴41幾近沿著基板 90之光阻塗佈區域之(_x)側端邊之位置。The preliminary coating mechanism 7 is previously applied to the substrate 90 by applying a photoresist (main coating treatment), and is used in a preliminary coating treatment (described later). The preliminary coating mechanism 7 includes a casing 70, a pre-coating roller 71 (hereinafter simply referred to as "roller"), a rotating mechanism 72, and an attachment removing portion 74. The deposit removing portion (10) includes a blade 73 for liquid removal. As shown in Fig. 2, the casing 70 is formed by exposing a part of a member having a substantially box shape from above. The internal storage in the casing 7 can be adapted to: a cleaning liquid in a part of the coated surface of the crushing shaft 71. Further, the details are not shown in the figure. However, the stored cleaning liquid is supplied from the cleaning liquid supply unit, and is discharged from the casing 70 by overflow or incompleteness. Further, it is preferable that the washing liquid is a volatile liquid containing a photoresist liquid-soluble component, but it is of course not limited thereto. The cylindrical roller 71 is formed by the slit nozzle 41 at the time of the preliminary coating process to form a coated surface of the coating photoresist. Also #, roller π = as the preliminary coating member of the present invention. The center of the cylinder of the roller 71 is the pivoting force of the shaft to the shaft center p of the roller 7丨. The rotation mechanism 72 is not shown in detail. The rotation of the driving force is generated by the generator. 104395.doc -16- 1263542 The mechanism that constitutes the circular member such as the rotational driving force. The rotational driving force generated by the 疋 motor is rotated clockwise in FIG. 2 via the ring member: 71. Thereby, the roll 2; the cloth surface and the slit nozzle 41 are relatively moved. In addition, by rotating the roller 71 by the rotating mechanism 72, the stored cleaning liquid is immersed. Further, the portion impregnated in the coated surface is taken out from the washing and washing by the rotation of the roller 71. In the preliminary coating mechanism 7, in the preliminary coating mechanism 7, by applying the roller 7 to the cleaning liquid, it can be removed and applied to the coating in the preliminary coating process. The second time. The 'and' mechanism for washing the coated noodles is not limited to the structure. For example, it can be placed in the basket (four) to be sprayed toward the coated surface. ^In the case of the housing 70, the internal fixed setting includes Benqi 7ZL wu Yu Xin The attachment of the blade 73 is removed #74. The blade 73 is slightly pressed against the coated surface of the roller 71, and is uniformly abutted in the Y-axis direction. When the state is rolled (four), the blade is moved relative to the coated surface. The blade 73 is used to remove and remove the adhering surface. The preliminary coating mechanism 7 performs a preliminary coating operation, and the trailing mechanism and the lowering mechanism 43 and 44 are placed at a position shown in FIG. 2 (hereinafter referred to as a preliminary coating position); the slit nozzle 41 is opened. That is, in the preliminary coating process, the slit squeegee 41 is substantially in a stationary state. Fig. 3 is a view showing a slit nozzle 41 disposed at a preliminary application position. The slit _ is attached to the nozzle support. Below the portion 4, the lip portion 41 2 lip portion 411 and the shim plate 412 are included. The first shame portion 410 and the second lip portion 411 are as shown in Fig. 3, and have substantially the same shape 104395.doc 1263542. The member is formed so as to meet the slit nozzle 41. The lower end of the first lip portion 410 is the first lip surface 410a disposed in the substantially horizontal direction. Similarly, the lower end of the second lip portion 411 is The second lip surface 4 Ua is disposed in a substantially horizontal direction. Further, the first lip surface 410a and the second lip surface 41 la are both coated with a photoresist liquid, and both of them are The surface of the surface of the object to be coated (substrate % or roller 71). In the slit coating 1, the space between the first lip portion 410 and the second lip portion 411 is formed. The flow path (not shown) of the photoresist liquid in the slit nozzle 41 is formed, and the opening of the flow path in the (-z) direction forms a discharge port 41a (slit). The lip surface P is disposed on the (+X) direction side of the discharge port 41a, and the second lip surface 41a is disposed on the side of the discharge port 41a. As shown in Fig. 3, the second lip portion 41 is attached to the nozzle support portion 40 via a shim plate 412. Therefore, in the i-th lip surface 41〇a, only the thickness component (step D) of the shim plate 412 in the two-axis direction is protruded in the (-Z) direction from the second lip surface 411a. Thus, by using the shim plates 412 having different thicknesses, the shim plate 412 can function as an adjustment mechanism for adjusting the step of the first lip surface 410a and the second lip surface 411a. Further, in the slit coating 1 of the present embodiment, the Z-axis direction indicates the vertical direction, so the first lip surface 41〇a is disposed at a lower position than the second lip surface 411a. In the slit coating 1, the photoresist liquid is supplied to the slit nozzle 4 1 from a supply port (not shown), and the photoresist liquid flows through the flow path in the slit nozzle 4, from the discharge port 4 1 & (-ζ) direction spit out. That is, the first lip surface 41〇a is smaller than the second lip surface. Only the step D is protruded in the (-Z) direction, and the discharge direction of the photoresist in the slit coating j is (-Z) direction, so the i-th lip surface 41〇a becomes the second lip Face 104395.doc -18- 1263542 411a, prominent in the mouth + gentleman ^,,, out direction. In other words, in other words, it means that the slitting nozzle 41 is in the coating process (main coating process and preliminary coating process)! The lip surface 41〇a' is closer to the object than the second lip surface 41 la. In the control unit 8, the control unit 8 includes a calculation unit 8 for processing various kinds of data, and a storage unit 81 for storing programs or various materials. Further, in the front panel 3, the operator inputs a necessary instruction to the slit coating, and a display portion 83 for displaying various materials.于: The system is shown in Fig. 1, and is electrically connected to the respective mechanisms and the cloth processing unit 2 by a cable (not shown). The control unit 8 controls the lifting operation by the elevating mechanisms 43 and 44 based on signals from various sensors or the like that are not shown in the operation unit 82, and is caused by the traveling mechanism. The slitting spray 41 is operated, and the scanning operation of the slit nozzle 41 caused by the rotating mechanism is further advanced. As a specific example of the hexadecimal portion 8 1 , it is equivalent to R 〇 M and a disk device which are dedicated to temporarily storing data. However, the memory unit 8 1 can be replaced by a removable media such as a floppy disk or a memory card, and the like, and the reading device can be used as a separate operation. 卩 82 has a button and a switch (including a keyboard and a mouse). Alternatively, the touch display can also function as the display unit 83. The liquid crystal display, various lamps, and the like correspond to the display unit 83. <1-2. Structure of Substrate Processing Apparatus> /, Person's Summary 9 The photoresist coating operation by the slit nozzle 4 is shown. Further, in particular, the following operations are controlled by the control signal from the control unit 8, in particular. FIG. 4 is a flow chart illustrating the operation of the slit coating 1. Apply in the slit! In the case of 104395.doc 19 1263542, the substrate 9 is sent to the lift pin Lp by an operator or a transfer mechanism not shown. After the lift pin LP receives the substrate 90, it starts to descend and is buried in the stage 3, and the received substrate 90 is placed on the holding surface 3〇. Thereby, the substrate 9 is placed at a specific position on the holding surface 30 of the stage 3, and remains adsorbed (step § 1). Unlike the carrying-in process of the substrate 90, in the slit coating}, before the main coating process, the optimum process of returning the front end portion of the slit nozzle 41 is performed, that is, the preliminary coating process is performed (step S2). . • In the preliminary coating process, first, the linear motors 50 and 51 move the slit nozzle 4 1 ' in the X-axis direction and are disposed above the roller 7} of the preliminary coating mechanism 7. The eight-person, lifting mechanism 43, 44 adjusts the posture of the slot nozzle 41 in the plane of the ¥2 plane and simultaneously closes the slot nozzle 41 to the roller. Thus, the slot nozzle 4 1 is Move to the preparatory coating position (Fig. 2 and Fig. 3): After the slit spray purple 4 1 is moved to the preliminary coating position, the control is controlled from the control 4 彳 § 'the photoresist supply mechanism is the slit The nozzle Μ is supplied with the photoresist liquid, and by this, the discharge is sputtered from the discharge nozzle of the slit nozzle, and the discharge is made synchronously with the photoresist, and the rotary mechanism 72 is rotated by the roller. The coating is coated with a photoresist solution, and a preliminary coating treatment is performed. Although the slit nozzle 41 is in a nearly stationary state, the slit nozzle 41 and the coated surface are relatively moved by causing the knob 72 to rotate the roller 71. In the sweat-sand cloth 1 , the coated surface of the coated fabric by the rotating mechanism 72 is ready to be scanned for the slit coating 41 in the processing. The direction of rotation of the cold main fabric prepared by the preliminary coating treatment is the clockwise direction in Figs. 2 and 3. Therefore, the relative movement direction of the slit nozzle 41 in the pre-saw main cloth processing and the coated surface is A, , , , , . However, the portion of the photoresist 71 coated with the photoresist (the portion scanned in the instant of coating 104395.doc -20-1263542) is the highest point of the roller 7ί is the maximum point). Therefore, for example, even if the coated surface is rotated, the scanning direction of the opening nozzle 41 at the instant of application is the direction of the wiring of the direction, that is, the (_x) direction. Paired rotation: As will be described later, in the slit coating m main coating treatment, the slitting is performed in the (four) direction sweep (four) (four). Therefore, the scanning direction of the preliminary coating nozzle 41 is the scanning direction q = t in the main (4) processing. That is, the pre-injury of the "slot coating" in the present embodiment: the region where the photoresist is applied to the coated surface is immersed in the rinsing and ordering light stored in the lower portion of the casing 7 by rolling The liquid blocking system can be immediately removed by washing with a washing solution. Further, the coating surface of the cleaning liquid is taken out from the cleaning liquid by the roller 7 condensing, and the washing treatment of the coated surface is completed. In the coated surface, the area where the cleaning treatment is completed is rotated by the roller 71, and the y-scraping sheet 73 picks up the deposit (mainly the residue of the cleaning liquid or the photoresist). In this way, the removal process by the blade 73 is performed. By applying the coating treatment to the region where the photoresist is applied to the coated surface of the roller 71, the coated photoresist is removed, and the position of the photoresist is again returned (the southernmost reaching point). Thereby, the slitted mouthpiece 41 can be prevented from being contaminated by the coated surface of the roller 71. After discharging a specific amount of photoresist from the opening (four) nozzle 41 and ending the preliminary coating process, the linear motors 50, 51 move the slit nozzle 41 to the coating start position 104395.doc -21 - 1263542, The lifting mechanisms 43, 44 adjust the height of the slit nozzle 41 to a specific height. The coating start position means that the slit nozzle 41 is located almost along the (_x) side end side of the photoresist coating region of the substrate 90.

隨著此等之位置調整完了,光阻供給機構係對開縫噴嘴 41供給光阻液,同時藉由線性馬達5〇、51以特定之速度於 (+X)方向移動架橋構造4,進行對基板%塗佈光阻液、總之 進行主塗佈處理(步驟S3)。如此,於本實施形態中之開縫塗 佈1,於主塗佈處理中,開缝噴嘴41之掃描方向為(+χ)方向, 與預備塗佈方向之掃描方向之(〇〇方向成為逆方向。 並且,於本實施形態中之開縫塗佈1,於將開縫噴嘴41從 預備㈣位置移動到塗佈開始位置之間,從光阻供給機構吐 出少量之光阻液,並於開縫喷嘴41之前端部形成光阻液之液 體積存。藉由此,開縫噴嘴41接近基板9〇時,於¥軸方向形 成均一彎月,並且提高塗佈精度。 7 在此’與其他之方法比較,說明進行本實施形態中之開 縫塗佈1之預備塗佈處理丨牛 々^曰 伸恩理(步驟S2)及主塗佈處理(步驟S3)時 之夕力果。 / 丁 、 主师處理情況之產生塗佈不均之結s " 於預備塗佈處理中,所謂將開縫喷嘴之先端配/ 於預備塗佈構件之、、声4 ^ 、 6 最咼到達點,及該滾軸與開縫噴嘴 距離,係於任一項之悴, 貝㊉之 向中,所謂「順方Γ 條件。並且,滾軸旋轉方 # + 、 n」係指預備塗佈處理之掃描方向盥± # 佈處理之掃描方向幾π万门與主塗 備塗佈處理之掃描方… 月况’所謂「逆方向」係指預 描方向與主塗佈處理之掃描方向幾近為逆 104395.doc -22- 1263542 :向之情況。另外,所謂「唇部階差」係指相當於本實施形 恶中=差D之值,且為例示主塗佈處理中配置於掃描方向前 方之前I部(相#於第1唇部,,對配置於後方之後唇部 (相當於第2唇部411)於吐出方向突出多少之值。更進-步, 所謂圖5中產生塗佈不均狀況,係以記號表示以下之結果。 ^從弟!張基板開始產生條紋不均。△:塗佈數張 m不均。〇:連續處理⑽張中,偶而產生條紋不 均。◎:連續處理100張,未產 硌忐w 又不均。在此,所謂連 α處理100張係指,途中未 疋订同縫噴鳴之洗淨處理而 處理之意,並非指僅連續進行主塗佈處理。 、 唇部階差為之情況(圖 塗佈處理中之掃p * A T 7虎碼I、6)係不依賴預備 均。此Α 而於塗佈數張後開始產生條紋不 故幾近相當於以往裝置中之卢理:都不使之突出之情況’ rm# 置中之處理°從圖5所示之結果,也可As the position adjustment is completed, the photoresist supply mechanism supplies the photoresist liquid to the slit nozzle 41 while moving the bridge structure 4 in the (+X) direction at a specific speed by the linear motors 5, 51, and performs the counter substrate. % of the photoresist is applied, and the main coating treatment is performed (step S3). As described above, in the slit coating 1 of the present embodiment, in the main coating process, the scanning direction of the slit nozzle 41 is (+χ) direction, and the scanning direction of the preliminary coating direction is reversed. Further, in the slit coating 1 of the present embodiment, a small amount of photoresist is discharged from the photoresist supply mechanism when the slit nozzle 41 is moved from the preliminary (four) position to the application start position. A liquid volume of the photoresist liquid is formed at the front end of the slit nozzle 41. Thereby, when the slit nozzle 41 approaches the substrate 9〇, a uniform meniscus is formed in the direction of the ¥ axis, and the coating precision is improved. The method comparison shows the effect of performing the preliminary coating treatment of the slit coating 1 in the present embodiment (step S2) and the main coating treatment (step S3). In the pre-coating process, the front end of the slit nozzle is matched with the pre-coated member, the sound 4 ^ , 6 is finally reached, and The distance between the roller and the slotted nozzle is tied to either one. In the middle, the condition of "shun Γ 。 并且 并且 滚 滚 # # # # # # # # 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备 预备The side of the month [the so-called "reverse direction" means that the direction of the pre-drawing is almost the same as the scanning direction of the main coating process. 104395.doc -22-1263542: In addition, the so-called "lip step" refers to This is equivalent to the value of the difference between the middle and the middle of the present embodiment, and is an example of the first part before the scanning direction is arranged in the main coating process (phase # is in the first lip, and is placed in the rear after the lip (equivalent to the first 2 The value of the lip portion 411) protruding in the discharge direction. Further, the coating unevenness is generated in Fig. 5, and the following results are indicated by the symbols. ^ From the younger brother, the sheet substrate is unevenly distributed. : A few sheets of coating m are uneven. 〇: Continuous processing (10) sheets, occasionally uneven streaks. ◎: 100 sheets are continuously processed, and unproduced w is uneven. Here, the so-called α-processing 100 sheets refers to In the meantime, the intention to deal with the washing treatment of the same squirting sound is not treated, and it does not mean that only the main coating is continuously performed. The case of the lip step (the scan p * AT 7 tiger code I, 6 in the coating process) does not depend on the preparation. This 开始 and after the application of several sheets, the stripes are not nearly It is equivalent to the case of Lu Li in the previous device: the situation that does not make it stand out' rm# The processing in the center is also shown in Figure 5.

付知以在褒置中每處理特定也T 、、盈走丄、1 欠 而進订開縫喷嘴之淡 淨處理。成為如此結 Μ之冼 部之乾燥肤能认μ 田係了考里到,因開縫噴嘴之唇 ,、心,開縫噴嘴前端部側面附著光阻% . ώ 備塗佈構件之爷& β Α 附者先阻液、或與預 後,於開縫喷嘴之前 、L基板之接近如 基板與光阻液之接觸r:t 一液體積留等之理由,使 從 < 接觸形狀柔不穩定。 唇部階差為「負」且為「順時 碼2、”,為塗佈數…g 里方向」之情況(圖5中,號 後唇部側之光阻 句。此係可考量為 乃不均一,結果產 後唇部比較而退出生條、、、文不均。亦即,與 出則唇部之情況(前魯部位乃於較高位置之 W4395.doc *23- 1263542 十月況)’將預備塗佈處理之掃描方向與主塗佈處理之掃描方 向一致後,藉由對每特定張數進行洗淨處理,係可進行與以 在裝置相同程度之處理。 但是’唇部階差為「負」且為「逆時鐘方向」之情況(圖5 中號碼7、8),為從第丨張開始產生條紋不均,且塗佈精度比 以往裝置更低下。此係可考量為,因預備塗佈處理後,唇部 側面光阻液乃不均一由下往上流,更加促進條紋不均之 生。 唇部階差為「正」且為「順時鐘方向」之情況(圖5中,號 ^ 4 5) ’為從第丨張開始產生條紋不均,且塗佈精度比以往 裝置更低下。此係可考量為,因預備塗佈處理後,唇部側之 光阻液乃不均一,結果更加促進條紋不均之產生。 另外,與本實施形態中之開縫塗佈2相同地,將唇部階差 作為「正」,並將預備㈣處理之掃描方向作成「逆時鏡鐘 方向」之情況(圖5中號碼9、1〇),與以往裝置比較乃可大量 :少塗佈不均之產生。具體說明之,將唇部階差作為「3〇_」 ^ ’可將㈣不均抑制在做連續處理⑽張時條纹不均為偶 :…呈度。特別於將唇部階差作為「7〇_」時,即使連續 處理100張也不會產生條紋不均。 度:二:!圖=明’僅將唇部階差作為「正」,塗佈精 "文、二 圖所示之號碼4、5之情況等中可能為不 …。為了抑制塗佈不均,將唇部階差作為 之後, 1=預備塗佈處理中之開縫喷嘴之掃描方向,作成主 土佈處理中之開縫喷嘴之掃描方向之逆方向。 104395.doc -24- 1263542 本實施形態中之開与条、冷# ^ & …… 塗佈1係由於符合此條件,故比以往 破置更可抑制塗佈不均之產生。 w ^ ^ ptb , ^ 且,所謂於開縫喷嘴中設 置。邛1¾差,並非僅使裝置構造福 ^ 、 直稱仏禝雜化之者。另外,即使變It is known that the processing of the slit nozzle is made for each treatment specific T, the profit walking, and the 1 owing. The dry skin of the crotch of the crotch is recognized by the cow. The lip of the slit nozzle, the heart, and the side of the front end of the slit nozzle are attached with a % of light resistance. β Α attached to the first blocking solution, or prognosis, before the slit nozzle, the proximity of the L substrate such as the contact between the substrate and the photoresist liquid r: t a liquid volume retention, etc. . The lip step is "negative" and is "shun-time code 2", which is the case where the number of coatings is ... g in the direction of the direction (in Figure 5, the photoresist on the back lip side. This system can be considered as Inconsistent, the results of postpartum lip comparison and withdrawal of the strip, and the text is uneven. That is, the situation with the lip (the former Lu is the higher position of W4395.doc *23-1263542 October) 'When the scanning direction of the preliminary coating process is matched with the scanning direction of the main coating process, the cleaning process for each specific number of sheets can be performed to the same extent as the device. However, the lip step is In the case of "negative" and "counterclockwise direction" (numbers 7 and 8 in Fig. 5), streaks are uneven from the third sheet, and the coating accuracy is lower than that of the conventional device. This system can be considered as After the preliminary coating treatment, the photoresist on the side of the lip is unevenly flowed from the bottom to the top, which promotes uneven streaks. The lip step is "positive" and is "clockwise" (Figure 5 , No. ^ 4 5) 'In order to produce uneven streaks from the third sheet, the coating accuracy is lower than that of the conventional device. It is considered that the photoresist solution on the lip side is not uniform after the preliminary coating treatment, and as a result, uneven streaking is further promoted. Further, in the same manner as the slit coating 2 in the present embodiment, the lip is used. When the step difference is "positive" and the scanning direction of the preparatory (4) processing is made "inverse clockwise direction" (numbers 9, 1 in Fig. 5), it can be compared with the conventional device: a small amount of uneven coating Specifically, the lip step is taken as "3〇_" ^ ', and the (4) unevenness can be suppressed in the continuous processing (10) when the stripes are not even: ... presentation. Especially in the lip order When the difference is "7〇_", even if 100 sheets are processed continuously, unevenness will not occur. Degree: 2: !图=明' Only the lip step is "positive", coated fine "文,二In the case of the numbers 4 and 5 shown in the figure, it may be... In order to suppress uneven coating, the lip step is taken as follows, 1 = the scanning direction of the slit nozzle in the preliminary coating process, and the main soil is created. The reverse direction of the scanning direction of the slit nozzle in the cloth processing. 104395.doc -24- 1263542 The opening and the strip in this embodiment , cold # ^ & ...... Since the coating 1 system meets this condition, it can suppress the occurrence of uneven coating even more than the previous break. w ^ ^ ptb , ^ , and is set in the slit nozzle. 邛13⁄4 The difference is not only the device structure, but also the one that is called the hybrid.

更預備塗佈處理中之開够哈皆 P …η 贺…描方向,也不會產生因此 所成之成本上昇。亦即,開縫 ^ 卩開縫塗佈1係可實現抑制成本之 增加。It is more suitable for the coating process to open the P ... η ... to describe the direction, and will not produce the resulting cost increase. That is, the slitting ^ 卩 slit coating 1 series can achieve an increase in the suppression cost.

並且,猎由圖5,開縫塗佈1係藉由將階差作成「30 _以 上」,可比以往襄置更能抑制塗佈不均,但最好作成「7 — 以上」。3外’圖5並未圖示出’作為唇部階差之上限值,以 「200 _以下」可有効抑制塗佈不均,但最好為「⑽叫 以下」。 回到圖4,開縫喷嘴41往(+X)方向移動,到達光阻塗佈區 域之(+X)側端邊日夺’步驟S3之主塗佈處理乃結束。另外,主 塗佈處理結束後’藉由線性馬達5G、51移動架橋構造4,開 縫喷嘴41乃歸回待機位置。又’所謂待機位置係指開縫噴嘴 41不進行處理而待機之位置,且於搬進出基板9()之時,基板 90與開縫噴嘴41不產生干涉之位置。 開縫噴嘴41移動到待機位置時,平台3之保持㈣乃停止 吸附基板90,並將基板90搬出裝置外(步驟S4)。更進一步, 開縫塗佈1係判是否有要繼續處理之其他基板9〇(步驟s5), 有其他基板90存在之情況,回到步驟“反覆處理。另外, 未存有應要處理之其他基板90之情況,則處理結束。 如上所述,本實施形態中之開縫塗佈丨,係開縫噴嘴41之 第1唇部面410a比第2唇部面411a突出於光阻液之吐出方向 104395.doc -25- 1263542 ((-z)方向),於主塗佈處理中,於(+χ)方向掃描基板%且從 吐出口 41 a對基板90吐出處理液之同時,於預備塗佈處理 中,以開縫喷嘴41乃對(+X)方向幾近為逆向之(^)方向掃描 滾軸71之塗佈面之方式,旋轉機構72相對移動開縫噴嘴ο 與滾軸71,故不需花費成本且也可抑制塗佈不均。 另外滾軸71為大致圓筒狀之構件,旋轉機構72係以開 縫喷嘴41為於(-X)方向掃描滾軸71之塗佈面之方式,藉由於 軸心周圍旋轉滾軸71,例如與對板狀之預帛塗佈才冓件預備塗 佈之情況相比,可謀求小型化裝置。 另外,作為將第1唇部面410a做得比第2唇部面41 &amp;突出之 調整方法,藉由備有填隙板412,例如因應使用之光阻液之 種類可調整位置(調整高度位置)。 再藉由開始主塗佈處理前進行預備塗佈處理,由於 了以猎由預備塗佈處理最適化開縫噴嘴41之狀態開始主塗 佈處理,故更可高精度進行主塗佈處理。 &lt; 1 ·3變形例&gt; 、二上」說明本發明之第1實施形態’本發明係不限定於上 述第1實施形態,可做種種之變形。 、 ♦J如,預備塗佈構件# y i i、办 千係不限疋為如滾軸71之圓筒形狀之 例如亦可為配置成大致尤伞古 m“ 之板狀構件。將如此之 作為預備塗佈構件使用之情況,於㈣㈣處理 件。线性馬達5G、51相對移_縫噴嘴4ι與預備塗佈構 另外, 圖4所示之處理順序係不限於此。例如 步驟S1之 J〇4395.d -26· 1263542 保持基板90之處理,係可於步驟S2之預備塗佈處理後進 行,亦可同步進行實施此等之處理。亦即,若可獲得同樣之 効果,以任何之順序實施此等處理即可。 另外,將第1唇部面41〇a比第2唇部面411&amp;於吐出方向突出 ^方法,係不限如上述實施形態所示之使用填隙板Ο]之形 態。例如,可預先製造將第i唇部41〇比第2唇部4ιι於卜z)方 向更長之構件’亦可設置如調整螺絲之機構,組成幻唇部 • 410可於(-Z)方向突出。 &lt; 2.第2實施形態&gt; 〈2-1·基板處理裝置之概要&gt; 圖6係例不本發明第2實施形態之基板處理裝置之開縫塗 佈210之概略構造斜視圖。開缝塗佈21〇為,進行於基板29〇 之表面塗佈處理液之光阻液之所謂開縫塗佈之塗佈處理之 k佈處理哀置,利用於選擇性钱刻形成於基板表面之電 極層等之製程等。開縫塗佈210之塗佈對象之基板29〇,係代 •表性為製造液晶顯示裝置之畫面面板之角形玻璃基板,但亦 可為半導體基板、薄膜液晶用可撓性基板、光罩用基板、彩 色遽光片用基板等之其他基板。 如圖6所示,開縫塗佈21 0係大致分為控制裝置整體之控 制部2〇1,與實施塗佈處理之塗佈處理部202。控制部2〇1係 /、1佈處理。卩202之各部電性連接,蓋括控制塗佈處理部2〇2 之各部動作。控制部201係包括由CPU、RAM及ROM等所組 成之微電腦。藉由控制部2〇1所產生之各種控制功能,係藉 由CPU根據特定之程序或資料利用ram且進行演算處理而 104395.doc •27- 1263542 實現。另外,於控制部201設有,接受操作員之輸入操作之 操作部211與顯示各種資料之顯示部212,此等乃作為使用者 介面而功能。 塗佈處理部202係主要由保持基板290之平台2〇3、對保持 於平台203之基板29〇吐出光阻液之吐出機構2〇4及使吐出機 構204移動於特定方向之移動機構2〇5所組成。 並且,於以下說明中,為方便說明將又軸方向作為内面方 • 向(+x側為正面側、-X側為背面側),將Y軸方向作為左右方 向(從正面側觀看時,+γ側為右側、_¥側為左側)。 、平台203係由包含大致長方體形狀之花崗岩等石材所組 成,其上面加工成大致水平且平坦,並作為基板29〇之保持 面230而功能。於保持面23〇形成分散多數真空吸著口。藉由 此等真空吸著口吸附基板29〇,於塗佈處理時基板29〇可^平 狀恶保持於特定之位置。 吐出機構204係主要以吐出光阻液之開縫喷嘴241、支持 ♦縫噴嘴241之噴嘴支持部242、支持噴嘴支持部⑷兩端而 昇降之2個昇降機構243所組成。 開縫喷嘴241,係從開縫狀之吐出口對基板之上面吐 出從圖外之供給機構所供給之光阻液。此開縫噴嘴Μ,其 吐出口乃沿著對保持面230大致平行之γ軸方向延展,且朝 向錯^下方(·Ζ側)並可吐出光阻液,且藉由喷嘴支持部⑷ 支持著。喷嘴支持部242係以將γ軸方向作為長邊方向之碳 纖維補強樹脂等之板狀構件所組成。 2個昇降機構243係連結於噴嘴支持部242之左右兩端 104395.doc -28- 1263542 部。此等昇降機構243係各自包括AC伺服馬達及滾珠螺桿 等,故可於鉛直方向(z軸方向)昇降噴嘴支持部24〇及支持於 此之開縫喷嘴241。藉由此等2個昇降機構243,係、可調整開 缝唷嘴241與基板29〇之間隔(開縫),或對基板29〇之開縫喷 嘴241之姿勢等。 ' 如圖6所示,藉由包含此等開縫噴嘴241、喷嘴支持部 及2個昇降機構243之吐出機構2〇4之整體,係形成沿著γ軸 方向架叹平台203之左右兩端部之架橋構造。移動機構2〇5 係沿著X軸方向移動包含如此架橋構造之吐出機構2〇4之全 體。 如圖所示移動機構205,係左右對稱構造(於+γ側與_¥側 之對稱)’於左右之各部乃包括將吐出機構2〇4之移動引導到 X軸方向之走行執道25;1、產生移動吐出機構2〇4之移動力之 線性馬達252及檢測吐出機構2〇4位置之線性編碼器。 2個走行執道251係各自,於平台2〇3之γ軸方向之端部(左 右兩端)沿著X軸方向延展設置。藉由沿著此等2個走行執道 251各自引導2個昇降機構243之下端部,吐出機構2〇4之移動 方向乃規定於X軸方向。 2個線性馬達252係各自組成,包含固定子乃以與移動子 252b之AC無鐵心式線性馬達。固定子25以係於平台2〇3 γ軸 方向之側面(左右側面)沿著X軸方向設置。另外,移動子乃孔 係固疋§曼置於昇降機構243之外側。線性馬達252,係藉由產 生於此等固定子252a與移動子25几間所產生之磁力動吐 出機構204。 104395.doc -29- 1263542 另外,2個線性編碼器253係各自包含比例尺部253a與檢測 部253b。比例尺部253a,係於固定設置於平台203之線性馬 達252之固定子252a下部,沿著X軸方向設置著。又,檢測 部253b係固定設置於,固定設置於昇降機構243之線性馬達 252之移動子252b之更外侧,且對向配置於比例尺部253a。 線性編媽器253,係根據比例尺部253a與檢測部253b之相對 位置關係,檢測X-軸方向中之吐出機構2〇4之位置(更具體說 _ 明之,開縫喷嘴241之吐出口位置)。 藉由以上之構造,開縫喷嘴24丨係將保持基板29〇之保持 面230之上部空間,對保持面23〇於平行之X軸方向移動,對 保持面230可相對移動。 此開縫喷嘴24 1係於進行塗佈處理前,以可搬入基板29〇 之方式’待機於比應保持基板290之特定位置更背面側(-X) 之特定待機位置23 1 (圖6所示之狀態)。 於塗佈處理時,首先,搬入基板290並保持於平台2〇3之 • 保持面230。然後,開縫噴嘴241乃移動到基板29〇之背面側 (-X側)端部之正上位置,且同時開始從開縫噴嘴24 1之吐出 口吐出光阻液。然後,維持吐出此光阻液之狀態,開縫喷嘴 241係以特定速度朝向正面側(+χ側)移動。藉由此,進行對 基板290之開縫喷嘴241之掃描(吐出掃描)。 然後’開縫Τ嘴24 1係移動到基板290之正面側(+χ側)端部 之正上位置,吐出掃描結束後,停止從開縫喷嘴2 4 1吐出光 阻液。藉由如此處理,涵蓋於基板290之大致全部均一塗佈 光阻液,並於基板290表面上形成特定膜厚之光阻液層。其 104395.doc -30- 1263542 後,開縫噴嘴241係再次待機到待機位置231,並從平台2〇3 搬出處理後之基板29G。藉由此,對—個基板谓之_連塗佈 處理乃結束。關於如此塗佈處理之控制係藉由控制部2〇ι而 成0 &lt; 2-2.噴嘴調整部&gt; 另夕開縫塗佈210係於進行上述一連塗佈處理(主塗佈處 理^之前,包含進行將開缝噴嘴241之前端部調整到均一正常 狀悲處理之調整處理之喷嘴調整部2〇6。噴嘴調整部,係 乂可對於待機位置23〗待機中之開縫喷嘴241做處理之方 式配置於待機位置23 1下方(-Z側)。此喷嘴調整部2〇6也盥 控制部201電性連接,並受到控制部2〇1之控制。 ’、 ^圖7為例示從_γ侧觀看噴嘴調整部2〇6構造之側面圖。喷 實调整處理係,以洗淨液洗淨開缝喷嘴241之洗淨處理,與 使開縫噴嘴241吐出-定光阻液量之預備塗佈處理之2階段 進行。因此’噴嘴調整部施係如圖所示,包括進行洗淨處 理之洗淨處理部261與進行預#塗佈處理之預備塗佈機= 2 6 2/洗淨處理部2 6丨係包含配合開縫喷嘴2 *丨前端部形狀之 洗淨空間261a;於其洗淨空間26;^之對向面,配置噴出洗淨 液之複數噴出口。 / 另外,預備塗佈機構262係主要包括,從開縫噴嘴Μ〗來 光阻液吐出對象之預先塗佈滚軸2 6 3 (以下簡稱「滾轴」), 與包圍其滾軸263周圍之筐體264所組成。 滾軸263係’直徑例如從1〇〇 mm到120 mm,長邊方向 尺寸比開縫噴嘴241之γ轴方向之尺寸稍大之大致圓筒狀^ 104395.doc 1263542 構件,並且其長邊方向(轴心263a所延展之方向)乃以沿著y 轴方向配置著。滾轴263之材質為鐵,且對包含其外周面之 表面施實硬質黑電錄。滾轴263,係可藉由圖外之驅動機構 以轴心263a為中心旋轉,其旋轉方向為圖中箭頭㈣示之方 向(圖7中為順時鐘)。 望體264為箱形狀之構件,並於其上部形成開口部。滾轴 263,係以其上部可從筐體264之開口部露出於外側之方式, 鲁-置於筐體264内。並且,滾軸263外周面之最上部263b係與 配置於平台203之基板290高度大致相同。於進行預備塗佈處 理時,從開縫噴嘴241對此最上部263b吐出光阻液。另外, 於筐體264之内部貯留特定量之洗淨液281,滚轴加之下部 乃浸潰於此洗淨液281。 另外,預備塗佈機構262,係包含除去附著於滚軸263外 周面之附著物之附著物除去部207。附著物除去部2〇7,係包 括著將沿著γ軸方向延展之長尺狀刮片271(刮除刮片),抵接 鲁於滾軸263外周面之狀態。此刮片271,係藉由旋轉滾抽263 掃描滾轴263外周面,撥落滾軸263外周面之附著物。關於此 附著物除去部207乃於後述詳細之。 藉由包含如此構造之噴嘴調整部206所實施之喷嘴調整 處理係也受到控制部201之控制。於噴嘴調整處理時,首先, 為了進行洗淨處理,開缝喷嘴24丨係移動到其前端部進入到 洗淨處理部261之洗淨空間261 a之位置(圖7中以虛線所示之 位置)。然後’從洗淨處理部261之複數噴出口,對開缝喷嘴 241之前端部喷出洗淨液。藉由此,係可除去附著於開縫喷 104395.doc -32- 1263542 嘴241之前端部側面等之光阻液。 洗淨處理完了 、 喷嘴“I係移::、“其次’ 4 了進行預備塗佈處理,開縫 外周面之最上部263b之正上位置 隔而配置。缺後不::置)’與滾軸263外周面隔著特定之間 、、灸,開始紋轉滾軸263,對於此旋轉之滾軸263 外周面,從開縫噴嘴241吐出— 出疋間時一疋ΐ之光阻液。 曰 也預備塗佈處理,並如圖11或圖12所示開縫喷嘴Further, in Fig. 5, the slit coating 1 is made to have a step of "30 _ or more", and the coating unevenness can be suppressed more than the conventional one, but it is preferable to create "7 - or more". 3 is not shown in Fig. 5 as the upper limit of the lip step, and "200 Å or less" can effectively suppress coating unevenness, but it is preferable to "(10) call below". Referring back to Fig. 4, the slit nozzle 41 is moved in the (+X) direction to reach the (+X) side end of the photoresist coating region. The main coating process of the step S3 is completed. Further, after the main coating process is completed, the bridge structure 4 is moved by the linear motors 5G and 51, and the slit nozzle 41 is returned to the standby position. Further, the "standby position" refers to a position at which the slit nozzle 41 waits without being processed, and does not interfere with the slit nozzle 41 when the substrate 9 () is carried in and out. When the slit nozzle 41 is moved to the standby position, the holding of the stage 3 (4) stops the adsorption of the substrate 90 and carries the substrate 90 out of the apparatus (step S4). Further, the slit coating 1 determines whether or not there is another substrate 9 to be processed (step s5), and if another substrate 90 exists, the process returns to the step "repeated processing. In addition, there is no other processing that should be handled. In the case of the substrate 90, the processing is completed. As described above, in the slit coating of the present embodiment, the first lip surface 410a of the slit nozzle 41 protrudes from the discharge of the photoresist liquid than the second lip surface 411a. Direction 104395.doc -25-1263542 ((-z) direction), in the main coating process, the substrate is scanned in the (+χ) direction and the processing liquid is discharged from the discharge port 41a to the substrate 90, and the coating is applied. In the cloth processing, the slitting nozzle 41 scans the coated surface of the roller 71 in the opposite (^) direction in the (+X) direction, and the rotating mechanism 72 relatively moves the slit nozzle ο and the roller 71. Therefore, the coating unevenness can be suppressed and the unevenness of the coating can be suppressed. Further, the roller 71 is a substantially cylindrical member, and the rotating mechanism 72 is configured to scan the coated surface of the roller 71 in the (-X) direction by the slit nozzle 41. In this way, by the rotation of the roller 71 around the axis, for example, with the pre-coating of the plate shape, the coating is pre-coated. In addition, as a method of adjusting the protrusion of the first lip surface 410a to the second lip surface 41 &amp; the gap is formed by the shim plate 412, for example, The type of the photoresist can be adjusted (position height adjustment). Further, the preliminary coating treatment is performed before the main coating treatment is started, and the main coating is started in the state where the slitting nozzle 41 is optimized by the preliminary coating treatment. In the first embodiment of the present invention, the first embodiment of the present invention is not limited to the above-described first embodiment, and can be performed. Various deformations. ♦J, for example, the preliminary coating member # yii, the tens of the system is not limited to a cylindrical shape such as the roller 71. For example, it may be a plate-like member that is disposed substantially in the shape of a Umbrella. In the case where the coating member is used, the processing member is used in (4) (4). The linear motor 5G, 51 is opposite to the slit nozzle 4m and the preliminary coating structure. The processing sequence shown in Fig. 4 is not limited thereto. For example, J〇4395 of step S1. d -26· 1263542 The process of holding the substrate 90 may be performed after the preliminary coating process of step S2, or may be performed simultaneously. That is, if the same effect can be obtained, the process is performed in any order. In addition, the method of projecting the first lip surface 41〇a to the second lip surface 411&amp; in the discharge direction is not limited to the form of using the caulking plate as described in the above embodiment. For example, a member that makes the i-th lip 41〇 longer than the second lip 4 in the direction of the z) may be preliminarily manufactured. A mechanism such as an adjusting screw may be provided to form a magic lip portion 410 in the (-Z) direction. 2. 2. Second embodiment> <2-1·Overview of substrate processing apparatus Fig. 6 is a perspective view showing a schematic configuration of a slit coating 210 of a substrate processing apparatus according to a second embodiment of the present invention. The slit coating 21 is a method of applying a light to a surface of a substrate 29 The k-cloth treatment of the coating treatment of the slit-coating of the liquid-repellent coating is used for the process of selectively forming the electrode layer formed on the surface of the substrate, etc. The substrate 29 to which the slit coating 210 is applied 〇 The expression is a prismatic glass substrate for manufacturing a screen panel of a liquid crystal display device, but may be another substrate such as a semiconductor substrate, a flexible substrate for a thin film liquid crystal, a substrate for a photomask, or a substrate for a color filter. As shown in Fig. 6, the slit coating 207 is roughly divided into a control unit 2〇1 of the entire control device and a coating processing unit 202 that performs a coating process. The control unit 2〇1/1 is treated. Each part of the crucible 202 is electrically connected to cover the operation of each unit of the coating processing unit 2 to 2. The control unit 201 includes a microcomputer composed of a CPU, a RAM, a ROM, etc. The various units generated by the control unit 2〇1 Control function, which uses ram to use ram according to specific programs or materials. In addition, the control unit 201 is provided with an operation unit 211 that accepts an operator's input operation and a display unit 212 that displays various materials, and functions as a user interface. The coating processing unit 202 is mainly composed of a stage 2〇3 for holding the substrate 290, a discharge mechanism 2〇4 for discharging the photoresist liquid to the substrate 29 held by the stage 203, and a moving mechanism 2 for moving the discharge mechanism 204 in a specific direction. In the following description, for convenience of explanation, the axial direction is the inner surface direction (the +x side is the front side, the -X side is the back side), and the Y-axis direction is the left-right direction (from the front side). When viewed from the side, the +γ side is the right side, and the _¥ side is the left side. The platform 203 is composed of a stone such as granite having a substantially rectangular parallelepiped shape, and is processed to be substantially horizontal and flat, and functions as a holding surface 230 of the substrate 29. A plurality of vacuum suction ports are formed on the holding surface 23〇. By adsorbing the substrate 29 by the vacuum suction ports, the substrate 29 can be held at a specific position during the coating process. The discharge mechanism 204 is mainly composed of a slit nozzle 241 that discharges a photoresist, a nozzle support portion 242 that supports the slit nozzle 241, and two lift mechanisms 243 that support both ends of the nozzle support portion (4). The slit nozzle 241 discharges the photoresist liquid supplied from the supply means outside the drawing from the discharge port of the slit shape to the upper surface of the substrate. In the slit nozzle Μ, the discharge port is extended along the γ-axis direction substantially parallel to the holding surface 230, and is directed downward (·Ζ side) and can discharge the photoresist liquid, and is supported by the nozzle support portion (4). . The nozzle support portion 242 is composed of a plate-like member such as a carbon fiber reinforcing resin having a γ-axis direction as a longitudinal direction. The two lifting mechanisms 243 are coupled to the left and right ends of the nozzle support portion 242, 104395.doc -28-1263542. Since these lifting mechanisms 243 each include an AC servo motor, a ball screw, and the like, the nozzle support portion 24A and the slit nozzle 241 supported thereby can be lifted in the vertical direction (z-axis direction). By the two elevating mechanisms 243, the interval between the slit nozzle 241 and the substrate 29 (the slit) can be adjusted, or the posture of the slit nozzle 241 of the substrate 29 can be adjusted. As shown in FIG. 6, the entire left and right ends of the platform 203 are formed along the γ-axis direction by the entire discharge nozzles 241 including the slit nozzles 241, the nozzle support portion, and the two lift mechanisms 243. The bridge structure of the department. The moving mechanism 2〇5 moves the entire body including the ejection mechanism 2〇4 having such a bridge structure in the X-axis direction. As shown in the figure, the moving mechanism 205 is a left-right symmetric structure (symmetry between the +γ side and the _¥ side)', and each of the left and right portions includes a traveling way 25 for guiding the movement of the discharge mechanism 2〇4 to the X-axis direction; 1. A linear motor 252 that generates a moving force for moving the discharge mechanism 2〇4 and a linear encoder that detects the position of the discharge mechanism 2〇4. Each of the two running lanes 251 is extended along the X-axis direction at the end (left and right ends) of the y-axis direction of the platform 2〇3. The lower end portions of the two elevating mechanisms 243 are guided along the two traveling lanes 251, and the moving direction of the ejection mechanism 2〇4 is defined in the X-axis direction. The two linear motors 252 are each composed of an AC coreless linear motor including a stator and a moving sub-252b. The stator 25 is disposed along the X-axis direction on the side (left and right sides) of the y-axis direction of the platform 2〇3. In addition, the moving member is placed on the outer side of the lifting mechanism 243. The linear motor 252 is a magnetic force output mechanism 204 which is generated by the stator 252a and the moving member 25. 104395.doc -29- 1263542 Further, the two linear encoders 253 each include a scale portion 253a and a detecting portion 253b. The scale portion 253a is provided below the stator 252a fixed to the linear motor 252 of the stage 203, and is disposed along the X-axis direction. Further, the detecting portion 253b is fixedly disposed outside the moving member 252b of the linear motor 252 fixed to the elevating mechanism 243, and is disposed opposite to the scale portion 253a. The linear knitting device 253 detects the position of the discharge mechanism 2〇4 in the X-axis direction based on the relative positional relationship between the scale portion 253a and the detecting portion 253b (more specifically, the discharge port position of the slit nozzle 241) . According to the above configuration, the slit nozzle 24 is configured to hold the upper space of the holding surface 230 of the substrate 29, and to move the holding surface 23 in the X-axis direction of the parallel, and to move the holding surface 230 relatively. The slit nozzle 24 1 is configured to stand by the specific standby position 23 1 on the back side (-X) of the specific position of the substrate 290 before being carried into the substrate 29 (FIG. 6). State of indication). At the time of the coating process, first, the substrate 290 is carried and held on the holding surface 230 of the stage 2〇3. Then, the slit nozzle 241 is moved to the upper position on the back side (-X side) end of the substrate 29, and at the same time, the photoresist is discharged from the discharge port of the slit nozzle 24 1 . Then, the state in which the photoresist is discharged is maintained, and the slit nozzle 241 is moved toward the front side (+χ side) at a specific speed. Thereby, scanning (discharging scanning) of the slit nozzle 241 of the substrate 290 is performed. Then, the slit nozzle 24 1 is moved to the upper position on the front side (+χ side) end of the substrate 290, and after the discharge scanning is completed, the discharge of the photoresist from the slit nozzle 24 1 is stopped. By doing so, substantially all of the substrate 290 is coated with a photoresist solution, and a photoresist layer having a specific film thickness is formed on the surface of the substrate 290. After 104395.doc -30-1263542, the slit nozzle 241 stands by again to the standby position 231, and carries out the processed substrate 29G from the stage 2〇3. By this, the processing of the substrate is terminated. The control system for such a coating process is formed by the control unit 2〇0&lt;2-2. Nozzle adjusting unit&gt; The slit coating 210 is applied to perform the above-described continuous coating process (main coating process ^ Previously, the nozzle adjustment unit 2〇6 for adjusting the front end portion of the slit nozzle 241 to the uniform normal shape is processed. The nozzle adjustment unit can be used for the standby position 23 in the standby position 23 The processing method is disposed below the standby position 23 1 (the -Z side). The nozzle adjusting unit 2〇6 is also electrically connected to the control unit 201, and is controlled by the control unit 2〇1. ', ^ Figure 7 is an illustration of the slave _γ side view side view of the structure of the nozzle adjustment unit 2〇6. The spray adjustment processing system washes the slit nozzle 241 with the cleaning liquid, and prepares the slit nozzle 241 to discharge the liquid amount The coating treatment is carried out in two stages. Therefore, the nozzle adjustment unit is provided as shown in the figure, and includes a cleaning treatment unit 261 for performing the cleaning treatment and a preliminary coating machine for performing the pre-coating treatment = 2 6 2 / washing The processing unit 26 includes a cleaning space 26 that matches the shape of the tip end portion of the slit nozzle 2 * 1a; a plurality of discharge ports for discharging the cleaning liquid are disposed on the opposite surface of the cleaning space 26; and the preliminary coating mechanism 262 mainly includes the nozzle for discharging the photoresist from the slit nozzle. The roller 2 6 3 (hereinafter referred to as "roller") is pre-coated, and is composed of a casing 264 surrounding the roller 263. The roller 263 is 'diameter, for example, from 1 mm to 120 mm, and the longitudinal direction is A substantially cylindrical member having a size slightly larger than the dimension of the slit nozzle 241 in the γ-axis direction is disposed in the longitudinal direction (the direction in which the axis 263a extends) along the y-axis direction. The material of the roller 263 is iron, and a hard black record is applied to the surface including the outer peripheral surface thereof. The roller 263 can be rotated around the axis 263a by a driving mechanism outside the drawing, and the rotation direction is in the figure. The arrow (four) indicates the direction (clockwise in Fig. 7). The desired body 264 is a box-shaped member and has an opening formed in the upper portion thereof. The roller 263 is exposed from the opening of the casing 264 to the outside. In the manner, Lu is placed in the casing 264. Also, the uppermost portion 263b of the outer peripheral surface of the roller 263 The height of the substrate 290 disposed on the stage 203 is substantially the same. When the preliminary coating process is performed, the photoresist is discharged from the slit nozzle 241 to the uppermost portion 263b. Further, a certain amount of the cleaning liquid is stored inside the casing 264. 281, the roller-added portion is immersed in the cleaning liquid 281. The pre-application mechanism 262 includes an attachment removing portion 207 that removes the adhering matter adhering to the outer circumferential surface of the roller 263. The adhering substance removing portion 2〇 7, the long-length blade 271 (scraping blade) extending in the γ-axis direction is brought into contact with the outer peripheral surface of the roller shaft 263. In the blade 271, the outer peripheral surface of the roller 263 is scanned by the rotary knuckle 263, and the deposit on the outer peripheral surface of the roller 263 is pulled. The attachment removing unit 207 will be described later in detail. The nozzle adjustment processing system implemented by the nozzle adjustment unit 206 having such a configuration is also controlled by the control unit 201. At the time of the nozzle adjustment processing, first, in order to perform the cleaning process, the slit nozzle 24 is moved to a position where the tip end portion thereof enters the washing space 261a of the washing processing unit 261 (the position indicated by a broken line in Fig. 7) ). Then, from the plurality of discharge ports of the cleaning processing unit 261, the cleaning liquid is discharged to the front end portion of the slit nozzle 241. By this, it is possible to remove the photoresist liquid attached to the side of the front end of the nozzle 241 of the slit spray 104395.doc -32-1263542. After the cleaning process is completed, the nozzle "I-shift::," "second" 4 is subjected to preliminary coating treatment, and the uppermost portion 263b of the outer peripheral surface of the slit is placed upside down. After the absence of ::)), the outer peripheral surface of the roller 263 is separated from the outer peripheral surface by a specific moxibustion, and the roller 263 is started. The outer peripheral surface of the rotating roller 263 is ejected from the slit nozzle 241. When the light is blocked.曰 Also prepare the coating process and open the nozzle as shown in Figure 11 or Figure 12.

241之前端部係可調整成均—之特枝態。藉由此,噴嘴啁 整處理乃結束。 ' ” 於預備塗佈處理中,滾軸263外周面中吐出光阻液之部分 (以下%為「庄目面」),係藉由滾軸263之旋轉依序浸潰貯 邊於筐體264下部之洗淨液28卜藉由此,附著於注目面之光 阻液與洗淨液28 i乃混合,並且從注目自大致除去光阻液。 更進一步,滾軸263旋轉時,浸潰於洗淨液281之注目面, 係從洗淨液281取出後,藉由刮片271掃描。藉由此,藉由刮 片271撥除注目面之附著物(主要為洗淨液或光阻液之殘留 物專),乃可從注目面除去附著物。藉由如此之處理,光阻 液之吐出對象之滾軸263外周面之最上部263b,係常處於未 有附著物之狀態。 如此’藉由刮片271撥除之撥除物,係蓄積於滾軸263與 刮片271所形成之空間265。長久放置此蓄積之撥除物時,由 於對刮片27 1之撥除性能造成不良影響,故於筐體264内部之 最適位置,對蓄積撥除物之空間2 6 5,設置喷出洗淨液且使 撥除物掉落於下方之洗淨噴嘴266。 104395.doc -33- 1263542 此洗淨噴伽係如圖8所示沿Μ轴方向配置,涵蓋於空 間265之Υ轴方向之整體而可噴出洗淨液282。於洗淨喷嘴 266,藉由控制部2〇1再經由可開關控制之控制栓⑽,從洗 淨液供給部283供給洗淨液。藉由此,藉由洗㈣嘴⑽產生 之洗淨液282之噴出,係受到控制部2〇1之控制。 但是重覆進行預備塗佈處理時,貯留於望體…内之洗淨 液叫乃漸漸受到光阻液之污染,且導致洗淨液281之洗淨能 力爹低因此於開縫塗佈2 ! 〇中要定期交換貯留於望體264 内之洗淨液281。 亦即’如圖8所示,於筐體264之γ轴方向之兩侧面設置供 給洗淨液281之供'給口 264a,另外嗜僮體…之下部設置排 出洗淨液281之排出n 264b。供給口⑽係介由控制检加 與洗淨液供給部283連接;排出口 264b係介由控制栓286引導 到開縫塗佈210之外部。控制栓285及控制检⑽兩者係藉由 控制部2〇1而可開關控制,藉由此等控制拴285、286之開關, 交換貯留於筐體264内之洗淨液281。並且,洗淨液281之液 面高度,係藉由形成於筐體264下面之溢流管而常保持 一定。 雖然^無特別限定從洗淨噴嘴266噴出洗淨液282之時 門或乂換射迢於筐體264之洗淨液28 1之時間,但例如於起 動時、#止時、動作中斷時、處理特定張數基板等係於開縫 塗佈210之動作中之每個特定項目進行即可。 &lt; 2-3·附著物除去部&gt; 其次,更進一步詳細說明附著物除去部207。圖9為詳細 104395.doc -34- 1263542 例不附著物除去部207之構造圖。如圖所示,附著物除去部 2〇7係由彈性體之刮片巧丨與保持刮片2?1之金屬製之刮片保 持構件2 7 2所組成。 彈性體之刮片271之具體質材係最好採用石夕橡膠(石夕樹脂)、 EPDM(Ethylene Propylene Diene Methylene Linkage 丙烯三共聚物/乙烯丙烯橡膠)、異丁橡膠、氟橡膠、 Perfl〇ur(登記商標)及Kalrez(登記商標)等之合成橡膠。 • 作為此刮片271質材之揚氏係數其最好之範圍為從i MPa 到20 MPa(亦即!跑以上且2〇 Mpa以下),但更好之範圍為 從6 MPa到20 MPa。另外特别於作為到片271採用石夕橡膠之 情況中,其揚氏係數最好之範圍為從6咖到9 5 Mpa。 由於並非採用塑膠片而採用硬度較小之如此彈性質材作 為刮片271 ’故刮片271乃較容易變形。因此,如圖9所示, 刮片27!係藉由抵接而於χζ平面内變形,且對滾轴加外周 面並非線接觸而為面接觸,故可大幅度提高撥落滚轴加外 • 周面之附著物之性能。 更進一步,刮片27Η系也於其γ軸方向可較易於變形。因 此,偏心或自重為原因,於滾軸263外周面有「起伏」或「彎 曲」,滾軸263外周面即使不沿著γ轴方向之直線上配置,配 合於抵接之滾軸263外周面之丫轴方向之形狀(「起伏」或「彎 曲」)’刮片271乃變形。其結果’於γ軸方向到片π與滾 軸263外周面未接觸之處乃消失’故刮片271乃涵蓋接觸滚軸 263外周面之Υ軸方向之整體。總之,滾轴263外周面之γ轴 方向之整體之附著物係藉由刮片27丨而除去。 104395.doc -35- ^263542 此刮片27 1之厚度(以圖9中符號27 11所示之長度),係最好 從〇·5 mm到10 mm(亦即〇·5 mm以上且1〇 mm以下)之範圍 内縮小刮片271之厚度時到片27 j之耐久性乃變低,故必需 系更換刮片271。另外,增加刮片271之厚度時刮片271之耐 久性雖然提高,但刮片271之丫軸方向之變形性能乃降低。 刮片27 1之厚度係在上述之範圍内,則可取得如此刮片27 ^ 之耐久性與變形性能之平衡。 _ 但疋,對滾軸263外周面之刮片271之按壓力,係藉由變 更對刮片27 1之筐體264之相對角度(以下,稱為「配置角 度」),即可调整。總之,筐體264與滾軸263之相對配置關 係為固定,故刮片271之配置角度係規定對滾軸263之刮片 271之角度,更進一步,規定對滾軸263之刮片271之按壓力。 此刮片271之配置角度,係可藉由保持刮片271之保持構件 272而變更。 如圖9所示,刮片保持構件272係主要由,藉由2個爪27化、 • 273b直接保持刮片271之第1保持部273,與支持第丨保持部 273之第2保持部274,與固設於筐體264之第3保持部275所組 成。 第2保持部274與第3保持部275,係以可調整相互間之角 度之方式’介由角度調整螺絲276固定。因此,藉由調整角 度調整螺絲276,可對第2保持部274、保持於此之第】保持部 273、更進一步,保持於其第}保持部273之刮片27ι,調整對 筐體264之相對角度(亦即「配置角度」)。 另外’此刮片27 1之配置角度係可於γ軸方向部分變更。 104395.doc -36· 1263542 ::圖所*,第!保持部273係藉由上下2個螺栓Μ、·及彈 =278_’支持於第2保持部274。下方螺栓η?係以非結合方式 貫通第1保持部273,其前端部係固定於第2保持部μ。然 ^,下方螺拴277之頭部與第丨保持部273下面之間配置著彈 κ 278 ’错由此於第丨保持部273付與對朝向第2保持部η#接 近之彈力。 另外,上方螺栓279係結合於形成於第2保持部274之螺絲 山’且貫通第2保持部274,其前端部係抵接於^保持部⑺ 之上部。總之,上方螺栓279係以反彈簧278所產生之彈力之 方式’抵接於第1保持部273。 並且此上方螺栓279所抵接之第1保持部273上部側之爪 係例如以2 mm左右之較薄之不锈鋼板所組成,藉由 上方螺栓279所產生之按壓力可彈性變形。因此,鎖住上方 螺栓279時,抵接於此之部分之爪加乃變形,保持於其變 I之爪273a之部分之刮片271也變形且朝向下方。總之,藉 由調整鎖住上方螺栓279情況,於γ軸方向,可調整僅其: 方螺才王279之抵接處之刮片271之配置角度。 如圖1 0之刮片271之背面圖所示,於每特定間隔於γ軸方 向之複數處配置如此上方螺栓279。因此,於各配置此上方 螺栓279之位置’係可局部性調整刮片271之配置角度。總 之,整體Y軸方向之刮片271之配置角度,係可藉由角度調 整螺絲276而變更’ Y軸方向之部分到片271之配置角度,係 可藉由上方螺栓279而改更。 如此,藉由可於Υ軸方向部分變更刮片27〗之配置角度, 104395.doc -37- 1263542 對刮片271之滚軸263之按壓力也於γ軸方向且做局部性調 整。作為刮片271即使採用如上述之彈性質材,因經年吳化 等’對滾軸263外周面之刮片271之按壓力,係有可能於 方向變得不一定且按壓力乃局部變弱。因此,關於如此之 處,若調整使對滾軸263之刮片271之按壓力可上升,即使於 此處也可確實除去附著物。因此,可涵蓋整體γ軸方向更確 實除去滾軸263之附著物。 _ &lt; 3 ·其他之實施形態〉 另外,於第1實施形態中,作為圖2所示之附著物除去部 74,係可採用與圖9所示之第2實施形態之附著物除去部加7 相同之構造。此情況,作為第}實施形態之刮片73係可採用 與第2實施形態之刮片271相同之質材。藉由採用此構造,於 第1貫施形悲之預備塗佈構件之滾軸7丨中即使產生「起伏 或「彎曲」,也可確實除去滾軸71表面之附著物。 【圖式簡單說明】 • 圖1係例示本發明實施形態之基板處理裝置之概略斜視 圖。 圖2係主要例示開口部内之預備塗佈機構構造之側面圖。 圖3係例示配置於預備塗佈位置之開縫噴嘴之圖。 圖4係例示基板處理裝置之動作流程圖。 圖5係例示實施主塗佈處理時塗佈不均之產生結果圖。 圖6係例示開縫塗佈之概略構造之斜視圖。 圖7係例示喷嘴調整部構造之側面圖。 圖8為例示洗淨液之供給系統及排n统之圖。 I04395.doc -38- 1263542 圖9係詳細例示附著物除去部之構造圖。 圖10係例示上方螺絲之配置圖 圖11係例示開缝喷嘴前端部之正常狀態一例圖。 圖12係例示開縫噴嘴前端部之正常狀態一例圖。 圖13係例示開缝喷嘴前端部之不良狀態一例圖。 圖14係例示開缝喷嘴前端部之不良狀態一例圖。 【主要元件符號說明】Before 241, the end system can be adjusted to the uniform state. By this, the nozzle tempering process is finished. In the preliminary coating treatment, a portion of the outer peripheral surface of the roller 263 from which the photoresist is discharged (hereinafter referred to as "the sole surface") is sequentially immersed in the casing 264 by the rotation of the roller 263. By the lower portion of the cleaning liquid 28, the photoresist liquid adhered to the surface of the object is mixed with the cleaning liquid 28i, and the photoresist liquid is substantially removed from the viewpoint. Further, when the roller 263 is rotated, it is immersed in the surface of the cleaning liquid 281, and is taken out from the cleaning liquid 281, and then scanned by the blade 271. Thereby, the attachment of the surface of the object (mainly the residue of the cleaning liquid or the photoresist) is removed by the blade 271, and the deposit can be removed from the surface of the object. By such treatment, the uppermost portion 263b of the outer peripheral surface of the roller 263 of the discharge target of the photoresist is always in a state of no deposit. Thus, the dial removed by the blade 271 is accumulated in the space 265 formed by the roller 263 and the blade 271. When the accumulated dispensing material is placed for a long time, the cleaning effect of the blade 27 1 is adversely affected. Therefore, in the optimum position inside the casing 264, the space for accumulating the removed material is 2 6 5, and the discharge is set to be washed. The liquid is dropped onto the cleaning nozzle 266 below. 104395.doc -33- 1263542 This cleaning spray system is arranged along the x-axis direction as shown in Fig. 8, and covers the entire axial direction of the space 265 to discharge the cleaning liquid 282. The cleaning nozzle 266 is supplied with the cleaning liquid from the cleaning liquid supply unit 283 via the control unit 2〇1 via the controllable control plug (10). Thereby, the discharge of the cleaning liquid 282 generated by the washing (4) nozzle (10) is controlled by the control unit 2〇1. However, when the preliminary coating treatment is repeated, the cleaning liquid stored in the desired body is gradually contaminated by the photoresist, and the cleaning ability of the cleaning liquid 281 is lowered, so that the coating is applied to the slit 2! The cleaning solution 281 stored in the desired body 264 is periodically exchanged. That is, as shown in Fig. 8, in the γ-axis direction of the casing 264, the supply port 264 is supplied with the cleaning liquid 281, and the lower portion of the casing 264 is provided with the discharge of the cleaning liquid 281. . The supply port (10) is connected to the cleaning liquid supply unit 283 via the control check, and the discharge port 264b is guided to the outside of the slit coat 210 via the control plug 286. Both the control plug 285 and the control test (10) are switchable and controlled by the control unit 2〇1, and the switches 285 and 286 are controlled to exchange the cleaning liquid 281 stored in the casing 264. Further, the liquid level of the cleaning liquid 281 is always kept constant by the overflow pipe formed under the casing 264. There is no particular limitation on the time when the door or the sputum is changed to the cleaning liquid 28 1 of the casing 264 when the cleaning liquid 282 is ejected from the cleaning nozzle 266, but for example, at the time of starting, at the time of stopping, when the operation is interrupted, It is sufficient to process a specific number of substrates or the like for each specific item in the operation of the slit coating 210. &lt;2-3. Attachment Removal Unit&gt; Next, the attachment removal unit 207 will be described in further detail. Fig. 9 is a structural view showing a detail removing portion 207 of the example 104395.doc -34-1263542. As shown in the figure, the attachment removing portion 2 is composed of a blade of an elastic body and a blade holding member 272 made of metal which holds the blade 2?. The specific material of the blade 271 of the elastomer is preferably Shishi rubber (Shixi resin), EPDM (Ethylene Propylene Diene Methylene Linkage propylene copolymer/ethylene propylene rubber), butyl rubber, fluororubber, Perfl〇ur. (registered trademark) and synthetic rubber such as Kalrez (registered trademark). • The best range for the Young's modulus of the material of this blade 271 is from i MPa to 20 MPa (ie, above! and below 2 〇 Mpa), but better ranges from 6 MPa to 20 MPa. Further, in particular, in the case where Shishi rubber is used as the sheet 271, the Young's modulus is preferably in the range of from 6 to 95 Mpa. Since the elastic material having a small hardness is not used as the blade 271', the blade 271 is more easily deformed. Therefore, as shown in FIG. 9, the blade 27! is deformed in the plane of the crucible by abutting, and the outer peripheral surface of the roller is not in line contact but is in surface contact, so that the dial roller can be greatly increased. • The performance of the attachments on the circumference. Further, the blade 27 can also be easily deformed in the γ-axis direction. Therefore, due to the eccentricity or the self-weight, the outer peripheral surface of the roller 263 has "undulation" or "bending", and the outer peripheral surface of the roller 263 is disposed on a straight line not along the γ-axis direction, and is fitted to the outer peripheral surface of the abutting roller 263. The shape of the axis direction ("undulation" or "bending")' blade 271 is deformed. As a result, the y-axis direction disappears when the sheet π does not contact the outer peripheral surface of the roller 263. Therefore, the blade 271 covers the entire axial direction of the outer peripheral surface of the contact roller 263. In short, the entire attachment of the outer peripheral surface of the roller 263 in the γ-axis direction is removed by the blade 27丨. 104395.doc -35- ^263542 The thickness of the blade 27 1 (the length shown by the symbol 27 11 in Fig. 9) is preferably from 〇·5 mm to 10 mm (i.e., 〇·5 mm or more and 1 When the thickness of the blade 271 is reduced within the range of 〇mm or less, the durability of the blade 27j is lowered, so that the blade 271 must be replaced. Further, although the durability of the blade 271 is increased when the thickness of the blade 271 is increased, the deformation property of the blade 271 in the z-axis direction is lowered. When the thickness of the blade 27 1 is within the above range, the balance between the durability and the deformation property of the blade 27 can be obtained. Further, the pressing force of the blade 271 on the outer peripheral surface of the roller 263 can be adjusted by changing the relative angle of the casing 264 of the blade 27 1 (hereinafter referred to as "arrangement angle"). In short, the relative arrangement relationship between the housing 264 and the roller 263 is fixed. Therefore, the arrangement angle of the blade 271 defines the angle of the blade 271 of the roller 263, and further, the pressing of the blade 271 of the roller 263 is specified. pressure. The arrangement angle of the blade 271 can be changed by holding the holding member 272 of the blade 271. As shown in FIG. 9, the blade holding member 272 mainly supports the first holding portion 273 of the blade 271 directly by the two claws 27, 273b, and the second holding portion 274 that supports the second holding portion 273. It is composed of a third holding portion 275 fixed to the casing 264. The second holding portion 274 and the third holding portion 275 are fixed by the angle adjusting screw 276 so as to be adjustable in angle with each other. Therefore, by adjusting the angle adjusting screw 276, the second holding portion 274, the holding portion 273 held therein, and the blade 27 of the first holding portion 273 can be further adjusted to the housing 264. Relative angle (also known as "configuration angle"). Further, the arrangement angle of the blade 27 1 can be partially changed in the γ-axis direction. 104395.doc -36· 1263542: The figure: the holding portion 273 is supported by the second holding portion 274 by the upper and lower two bolts ·, and the elastic ball 278_'. The lower bolt η is passed through the first holding portion 273 in a non-bonding manner, and the front end portion thereof is fixed to the second holding portion μ. However, the spring κ 278 ' is disposed between the head of the lower thread 277 and the lower surface of the second holding portion 273, whereby the second holding portion 273 is biased toward the second holding portion η#. Further, the upper bolt 279 is coupled to the screw holder ′ formed in the second holding portion 274 and penetrates the second holding portion 274, and the distal end portion thereof abuts against the upper portion of the holding portion (7). In short, the upper bolt 279 abuts against the first holding portion 273 by the elastic force generated by the anti-spring 278. Further, the claw on the upper side of the first holding portion 273 which the upper bolt 279 abuts is composed of, for example, a thin stainless steel plate of about 2 mm, and is elastically deformable by the pressing force generated by the upper bolt 279. Therefore, when the upper bolt 279 is locked, the claw which is in contact with this portion is deformed, and the blade 271 which is held by the portion of the claw 273a which is changed to I is also deformed and faces downward. In short, by adjusting the upper bolt 279, in the γ-axis direction, it is possible to adjust only the arrangement angle of the blade 271 at the abutment of the square screw 279. As shown in the rear view of the blade 271 of Fig. 10, such an upper bolt 279 is disposed at a plurality of positions in the γ-axis direction at every specific interval. Therefore, the arrangement angle of the blade 271 can be locally adjusted at each position where the upper bolt 279 is disposed. In short, the arrangement angle of the blade 271 in the overall Y-axis direction can be changed by the angle adjusting screw 276 to change the arrangement angle of the portion in the Y-axis direction to the sheet 271, which can be changed by the upper bolt 279. Thus, by pressing the arrangement angle of the blade 27 in the x-axis direction portion, the pressing force of the roller 263 of the blade 271 by 104395.doc -37 - 1263542 is also locally adjusted in the γ-axis direction. Even if the above-mentioned elastic material is used as the doctor blade 271, the pressing force of the blade 271 on the outer peripheral surface of the roller 263 may not be uniform in the direction and the pressure is locally weakened by the pressing force of the blade 271 on the outer peripheral surface of the roller 263. . Therefore, in this case, if the pressing force of the blade 271 of the pair of rollers 263 is adjusted to be raised, the deposit can be surely removed even here. Therefore, it is possible to cover the entire γ-axis direction to more reliably remove the attachment of the roller 263. _ &lt; 3 Other Embodiments In addition, in the first embodiment, as the attachment removing portion 74 shown in Fig. 2, the attachment removing portion of the second embodiment shown in Fig. 9 can be used. 7 The same structure. In this case, the blade 73 of the first embodiment can be made of the same material as the blade 271 of the second embodiment. By adopting this configuration, even if "undulation or "bending" occurs in the roller 7'' of the first application-formed member, the attachment on the surface of the roller 71 can be surely removed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic perspective view showing a substrate processing apparatus according to an embodiment of the present invention. Fig. 2 is a side view mainly showing the structure of a preliminary coating mechanism in the opening. Fig. 3 is a view showing a slit nozzle disposed at a preliminary application position. Fig. 4 is a flow chart showing the operation of the substrate processing apparatus. Fig. 5 is a graph showing the results of uneven coating at the time of performing the main coating treatment. Fig. 6 is a perspective view showing a schematic structure of slit coating. Fig. 7 is a side view showing the structure of the nozzle adjusting portion. Fig. 8 is a view showing a supply system and a row of cleaning liquids. I04395.doc -38 - 1263542 Fig. 9 is a structural diagram illustrating the attachment removing portion in detail. Fig. 10 is a view showing an arrangement of the upper screws. Fig. 11 is a view showing an example of a normal state of the tip end portion of the slit nozzle. Fig. 12 is a view showing an example of a normal state of the tip end portion of the slit nozzle. Fig. 13 is a view showing an example of a failure state of the tip end portion of the slit nozzle. Fig. 14 is a view showing an example of a failure state of the tip end portion of the slit nozzle. [Main component symbol description]

41 開缝喷嘴 410 第1唇部 411 第2唇部 412 填隙板 41a 吐出口 7 預備塗佈機構 71 滾軸 D 階差 271 刮片 272 刮片保持構件 279 上方螺絲 104395.doc -39-41 slot nozzle 410 first lip 411 second lip 412 shim plate 41a spout 7 preparatory coating mechanism 71 roller D step 271 blade 272 blade holding member 279 upper screw 104395.doc -39-

Claims (1)

1263542 十、申請專利範圍: .-種基板處理装置,其特徵為·· 係於基板塗佈處理液者,且包括: 保持機構,其係保持基板; 開縫喷嘴,於第】方向掃描保持在 板,且同時從吐出口對於前述基板吐出處=機構之基 預備塗佈構件,藉由前述:里液; ’__噴嘴乃以於對;:;^汐 向之第2方向掃描前述預備塗佈構件弟1方向幾近逆 移動前述開㈣嘴與前述預備塗佈、之方式,相對 前述開縫噴嘴係包含·· 表面;其中, 位置於前述吐屮义 付罢一、 述苐1方向側之第1唇部面;刀 出之則述第2方向側之第2唇部面; &quot;1唇°卩面,係比前述第2唇部面於處理液之 方向突出。 处王欲之吐出 2. 如請求項1之基板處理裝置,其中 二述預備塗佈構件,係大致圓筒狀之構件; 述移動機構’係以前述開縫喷嘴於前述第2方 前述預備㈣構件表面之方式,於㈣„旋轉前= 備塗佈構件。 ~艰 3·如清求項2之基板處理裝置,其中係更進一步包括使前述 第1 σ邛面比刖述第2唇部面更突出之調整機構。 L 4·如#求項1至3之任一項之基板處理裝置,其中前述第1辰 部面係比前述第2唇部面突出3〇μηι以上。 。 104395.doc 1263542 5.如 明求項2之基板處理 拉μ、, 、置’其中係更進一步包括葬由抵 接於丽述預備塗佈構件/已括措由抵 尺狀刮μ &amp;、+、 表面除去該表面之附著物之長 八狀別片,月丨〗述到片 、氏係數為1 MPa到20 MPa之蘇圍 内之彈性體所組成。 UMPa之耗圍 6. 如請求項2之基板處理拿 述、,其中係更包括藉由抵接於前 迷預備塗佈構件之表面 片,+ 除去絲面之附著物之長尺狀到 片其中則述到片係以橡膠組成。 7. -種基板處理方法,其特徵為: 係從設置於開縫噴嘴之吐 &gt;占m 土出處理液,於基板塗 佈處理液者,且包括: 板土 保持步驟,其係保持基板; 主塗佈步驟,對於前述俘 1保待步驟令所保持之前述美 板,於第1方向掃描前述開縫喷 土 、嘴並於則述基板塗佈處理 瑕,及 預備塗佈步驟,以前述開縫噴嘴乃以於與前述第!方向 幾近逆向之第2方向掃描之方式,相對移動塗佈構件之; 面且於前述預備塗佈構件塗佈處理液; &quot; 於前述主塗佈步驟及前述預備塗佈步驟中, 設置於前述吐出口之前述第丨方向側之第i唇部面,係 比設置於前述吐出口之前述第2方向側之第2唇部面設置 於更低之位置。 X 8·如請求項7之基板處理方法,其中前沭箱他炎从 八T刚述預備塗佈步驟係比 前述主塗佈步驟先實行; 前述主塗佈步驟係於前述預備塗佈步驟之後實行。 104395.doc 1263542 種基板處理裝置,其特徵為: y . 係於基板塗佈處理液者,其包含 開縫噴嘴,沿著大致水平之 士 丄 昂3方向延伸,於前述第3 方向正父之大致水平之第 且可於前、+、方向,對於前述基板相對移動 且丌於則返基板吐出前述處理液; 大致圓筒狀之滾軸,沿者 闲品4弟3方向延伸,藉由於外 周面k刖述開縫噴嘴吐出前述處 4處理液,將前述開縫噴嘴 之刖而邛凋整到特定狀態;及 、 長尺狀刮片,係沿者前 、十、、奋紅1 这第3方向延伸且藉由抵接於前 述滾軸之前述外周面,除 、則 ‘ 牙、去則述外周面之附著物; 刖迷刮片係以揚氏儀數兔 ^ ^ 糸數為1 MPa到20 MPa之範圍内之 弹性體所組成。 礼固門之 1〇· 一種基板處理裝置,其特徵為: 係於基板塗佈處理液者,其包含·· 開縫喷嘴,沿著大致水平之 方内弟方向延伸,於前述第3 向正父之大致水平之第4方向, 且可於俞、十、I 4 對於則述基板相對移動 了於則述基板吐出前述處理液,· 大致圓筒狀之滾轴,沿者前述第3方向延伸 周面從前述開鏠噴嘴吐出 3由於外 鳥吐出則述處理液,將前述開縫噴喈 之刖鳊部調整到特定狀態;及 贺為 m面,除去則述外周面之附著物· 前述刮片係以橡膠組成。 , U·如請求項9或1〇之基板處 败〜里表置,其中前述刮片之厚度係 104395.doc 1263542 從0.5 mm到l〇 mm之範圍内。 12•如請求項9或1〇之基板處理裝置,其中更進一步包含於前 述第3方向,可部分調整對於 力之調整機構。 引迷滚軸之如述刮片之按壓 於前述第3方向,部分變更對於二中前述調整機構係藉 度,調整前述按壓力。 於前述滾軸之前述刮片之1263542 X. Patent application scope: A substrate processing apparatus characterized in that it is attached to a substrate coating treatment liquid, and includes: a holding mechanism that holds the substrate; and a slit nozzle that is scanned in the first direction a plate, and at the same time, from the discharge port to the substrate discharge portion = the base preparation member of the mechanism, by the foregoing: the liquid; the '__ nozzle is for scanning the second direction to the second direction The cloth member 1 slightly reverses the movement of the opening (four) nozzle and the preliminary coating, and the surface of the slit nozzle includes a surface; wherein the position is on the side of the spit The first lip surface is the second lip surface on the second direction side; the first lip surface is protruded in the direction of the treatment liquid than the second lip surface. 2. The substrate processing apparatus according to claim 1, wherein the preliminary coating member is a substantially cylindrical member; and the moving mechanism is formed by the slitting nozzle in the second party. The method of the surface of the member is as follows: (4) „ before the rotation = preparing the coating member. The substrate processing device according to the second aspect of the invention, wherein the method further comprises: arranging the first σ surface to describe the second lip surface The substrate processing apparatus according to any one of claims 1 to 3, wherein the first side surface is protruded by 3〇μηι or more than the second lip surface. 104395.doc 1263542 5. The substrate processing according to the item 2 of claim 2, pull, set, and further include the burial by the contact with the reference preparation coating member / the method of arranging the scraping μ &amp; The long octagonal piece of the attachment of the surface is removed, and the elastic body of the sulcus having a coefficient of 1 MPa to 20 MPa is described. The consumption of UMPa is 6. The substrate of claim 2 Handling the description, and the system further includes preparing the coating structure by abutting on the former The surface sheet, + the long rule of the attachment of the silk surface is removed to the sheet, wherein the sheet is made of rubber. 7. The substrate processing method is characterized in that: the spit is set from the spout nozzle&gt; The m-soil treatment liquid is applied to the substrate to apply the treatment liquid, and includes: a soil-soil retention step for holding the substrate; a main coating step for the aforementioned US-preserved sheet retained by the capture step Scanning the slitted soil and the nozzle in one direction, and performing a substrate coating process, and a preliminary coating step, wherein the slit nozzle is scanned in a second direction opposite to the first direction, And moving the coating member to the preliminary coating member; and applying the processing liquid to the preliminary coating member; &quot; in the main coating step and the preliminary coating step, the first surface of the discharge port on the second side of the discharge port The lip surface is disposed at a lower position than the second lip surface provided on the second direction side of the discharge port. X8. The substrate processing method of claim 7, wherein the front box is from eight T just described the preparation step The first coating step is performed after the preliminary coating step. The main coating step is performed after the preliminary coating step. 104395.doc 1263542 A substrate processing apparatus characterized in that: y. is applied to a substrate coating treatment liquid, The slit nozzle is arranged to extend in a substantially horizontal direction of the sacred 3, and is substantially horizontal in the third direction and can be moved in the front, +, and direction relative to the substrate, and then returned to the substrate. The processing liquid; the substantially cylindrical roller extending in the direction of the casualty 4, and the discharge nozzle is discharged from the outer peripheral surface k, and the slitting nozzle is smashed And a long-sized blade; and a long-sized blade extending in the third direction of the front, ten, and red 1 and abutting against the outer peripheral surface of the roller, except for the tooth, The attachment of the outer peripheral surface; the squeegee blade is composed of an elastomer having a number of numerators in the range of 1 MPa to 20 MPa. In the substrate processing apparatus, the substrate processing apparatus includes: a slit nozzle extending in a substantially horizontal direction, and the third direction positive parent In the fourth direction of the substantially horizontal direction, the substrate is relatively moved to the substrate, and the processing liquid is discharged from the substrate, and the substantially cylindrical roller is extended along the third direction. The surface is ejected from the opening nozzle 3, and the treatment liquid is discharged by the outer bird, and the crotch portion of the slit sneeze is adjusted to a specific state; and the surface is removed to the m surface, and the attachment of the outer peripheral surface is removed. Made of rubber. , U. If the substrate of claim 9 or 1 is defeated, the thickness of the aforementioned blade is 104395.doc 1263542 ranging from 0.5 mm to l〇 mm. 12. The substrate processing apparatus according to claim 9 or 1 further comprising the third direction in the foregoing, wherein the adjustment mechanism for the force is partially adjustable. The pressing of the blade as shown in the third direction is partially changed in the third direction, and the pressing force is adjusted for the adjustment mechanism. The aforementioned blade of the aforementioned roller 104395.doc104395.doc
TW094129400A 2004-10-04 2005-08-26 Apparatus for and method of processing substrate TWI263542B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004291306A JP4324538B2 (en) 2004-10-04 2004-10-04 Substrate processing apparatus and substrate processing method
JP2004302533A JP4727203B2 (en) 2004-10-18 2004-10-18 Substrate processing equipment

Publications (2)

Publication Number Publication Date
TW200624180A TW200624180A (en) 2006-07-16
TWI263542B true TWI263542B (en) 2006-10-11

Family

ID=37150093

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129400A TWI263542B (en) 2004-10-04 2005-08-26 Apparatus for and method of processing substrate

Country Status (2)

Country Link
KR (1) KR100722642B1 (en)
TW (1) TWI263542B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399822B (en) * 2009-04-03 2013-06-21 Dainippon Screen Mfg Substrate processing apparatus

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101282591B1 (en) * 2006-09-18 2013-07-12 주식회사 케이씨텍 Device for coating a substrate
JP4222522B2 (en) * 2006-11-22 2009-02-12 東京エレクトロン株式会社 Optical foreign matter detection device and treatment liquid coating device equipped with the same
KR100828665B1 (en) * 2006-12-28 2008-05-09 주식회사 디엠에스 Nozzle for jetting fluid
KR100840528B1 (en) * 2007-04-13 2008-06-23 주식회사 케이씨텍 Pre discharging apparatus for slit coater
KR101065331B1 (en) * 2008-11-26 2011-09-16 세메스 주식회사 Apparatus and methdo for processing a glass
KR101353661B1 (en) * 2009-06-19 2014-01-20 다즈모 가부시키가이샤 Substrate coating apparatus
CN113522641B (en) * 2020-04-13 2022-09-16 阳程科技股份有限公司 Coating machine capable of controlling coating head coating thickness by unreeling dust-free cloth

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07328514A (en) * 1994-06-08 1995-12-19 Dainippon Screen Mfg Co Ltd Treating-liquid coating apparatus
JPH11244760A (en) 1998-02-26 1999-09-14 Dainippon Screen Mfg Co Ltd Substrate treating device
JP3943935B2 (en) * 2001-02-26 2007-07-11 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP2004216298A (en) 2003-01-16 2004-08-05 Mitsubishi Chemicals Corp Coating method and slit die nozzle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399822B (en) * 2009-04-03 2013-06-21 Dainippon Screen Mfg Substrate processing apparatus

Also Published As

Publication number Publication date
TW200624180A (en) 2006-07-16
KR100722642B1 (en) 2007-05-28
KR20060051708A (en) 2006-05-19

Similar Documents

Publication Publication Date Title
TWI263542B (en) Apparatus for and method of processing substrate
TWI296211B (en) Substrate processing apparatus
TW494451B (en) Substrate processing method and substrate processing apparatus
TWI313024B (en) Coating apparatus and method of fabricating liquid crystal display device using the same
CN101276148B (en) Apparatus for processing substrate
TWI425557B (en) Liquid treatment apparatus and liquid treatment method
CN104136221B (en) Screen printing apparatus
TWI326368B (en) Dispensing apparatus for manufacturing liquid display panel
TWI325339B (en) Substrate processing apparatus
TW502288B (en) Developing method and developing unit
TW201217066A (en) Coating apparatus and method of forming coating layer using the same
JP4091372B2 (en) Substrate processing equipment
TW201347853A (en) Wiping pad and nozzle maintenance apparatus using the wiping pad and coating processing equipment
JP7001400B2 (en) Board processing equipment
TWI294828B (en) Apparatus for ejecting liquid droplet, work to be applied thereto, method of manufacturing electro-optic device, electro-optic device, and electronic equipment
KR101067143B1 (en) Coating film forming apparatus and coating film forming method
TWI313623B (en) Coating treatment apparatus, coating treatment method and computer readable storage medium
KR101053144B1 (en) Apparatus and method of coating treatment solution
TWI313194B (en) Coating film forming method
TWI519425B (en) Roll printing apparatus and roll printing method using the same
JP5208709B2 (en) Photoresist coating equipment and method
JP4523516B2 (en) Coating film unevenness detection method, coating film unevenness detection program, substrate processing method, and substrate processing apparatus
JP4727203B2 (en) Substrate processing equipment
JP2008093662A (en) Coating apparatus and coating method
JP3992530B2 (en) Substrate processing method and apparatus