TWI296211B - Substrate processing apparatus - Google Patents

Description

1296211 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a technique for cleaning a slit nozzle without stopping the processing of a substrate, whereby the intermittent time can be shortened. [Prior Art] As a device used in the substrate manufacturing step, a slit coater (substrate processing device) is known to discharge a processing liquid such as a photoresist liquid from a slit nozzle to a substrate surface, thereby forming a substrate. Apply a photoresist solution. In the past, in view of the desire of the manufacturer to improve the productivity in the manufacturing steps of the substrate, it has been desired to shorten the intermittent time of the substrate processing. For example, Patent Document 1 discloses such a slit coating. In the apparatus disclosed in the patent document (10), there has been proposed a technique for shortening the intermittent time by simultaneously processing a plurality of substrates by a plurality of slit nozzles. [Patent Document 1] Japanese Patent Laid-Open No. Hei 10-216599 (Problems to be Solved by the Invention) On the other hand, in the slit coating, in order to improve the coating processing precision, it is preferred to perform coating for each substrate. Cloth treatment, the implementation - the use of washing, the front end of the spout mouth and so on. However, for example, when the slit coater is in operation, during the maintenance of the slit nozzle, since the slit nozzle cannot be used, the slit coater cannot perform the substrate processing. Therefore, there is a problem that the intermittent time of the substrate processing is prolonged when the substrate is unloaded during the processing period of the substrate. The process of removing the air remaining in the inside of the slit nozzle by the long gate requires a long time between the temples, so that it is difficult to complete the air removal treatment in the processing time of the substrate unloading person. In the apparatus disclosed in Patent Document 1, when any one of the plurality of slit nozzles takes a long time due to the quasi-w蒦, the substrate processed by the other slit nozzles is also in a standby state, and thus The problem of intermittent time extension due to maintenance cannot be solved. Further, in the slit coater disclosed in Patent Document 1, for example, one of the slit nozzles is abnormal, and it is necessary to perform a large maintenance on the slit nozzle: there is a problem that it is necessary to stop all the slit coaters. . That is, if the number of slit nozzles is increased, the maintenance opportunity is also increased. Therefore, in the slit nozzle disclosed in Patent Document 1, there is a problem that the intermittent time due to maintenance is prolonged. This is done by the above-mentioned problem in order to prevent an increase in the intermittent time due to the compliance. SUMMARY OF THE INVENTION In order to solve the above problems, the invention of claim 1 is a substrate processing apparatus, and the special treatment is to apply a specific processing liquid to a substrate coating region, and to provide a holding mechanism for holding one substrate; a slit nozzle that discharges the specific processing liquid from a linear discharge port in a substantially all area of the substrate application region of the holding mechanism, and a supply mechanism that supplies the specific processing liquid to the plurality of slit nozzles a lifting mechanism that independently lifts and lowers the plurality of slit nozzles, and a moving mechanism that independently moves the substrate held by the holding mechanism and the plurality of slit nozzles independently in a direction of the substrate surface; And a maintenance mechanism that performs specific maintenance on the plurality of slit nozzles. The invention of claim 2, wherein the maintenance mechanism cleans the slit nozzle that is not discharged to the substrate by the specific cleaning liquid. According to a third aspect of the invention, in the substrate processing apparatus of the invention of claim 2, the cleaning means includes a separate cleaning liquid supply path for the plurality of slit nozzles. Further, the invention of claim 4 is the substrate processing apparatus according to the invention of the present invention, characterized in that the upper material maintenance mechanism further includes a deaeration mechanism, and the deaerator 2 performs degassing from a slit nozzle that is not discharged to the substrate. . According to a fifth aspect of the invention, in the substrate processing apparatus of the invention of claim 1, the supply unit has a separate processing liquid supply path for the plurality of slit nozzles. The invention of claim 6 is the substrate processing apparatus of the invention of claim 1, 2; further comprising an acquisition mechanism for acquiring maintenance conditions; and a storage mechanism, wherein the maintenance condition is taken by the upper mechanism (four); The invention of claim 7 is the substrate processing apparatus of the invention of claim 1, wherein the slit nozzle further includes a measuring mechanism for the plurality of narrow lifting mechanisms. The gap between the substrates held by the holding mechanism is the same; the measurement result of the measurement mechanism of the upper 2 is a slit nozzle. After the 〒丄I, the second is the item: the substrate processing device of the invention of claim 1 The moving mechanism is a linear motor. 98703-970131.doc 1296211 [Effects of the Invention] In the invention of claim 1 to claim 9, 'the processing of the substrate can be continued by having a plurality of slit spray wiping mechanisms Fully splicing 5 vines and other slit nozzles, ^, and the above-mentioned plurality of slit nozzles are oriented to maintain the entire area of the soil and the product area, and the special treatment liquid is discharged from the straight discharge port. The maintenance mechanism performs specific maintenance on a plurality of slit nozzles. In the invention of the second month, the maintenance mechanism can be processed only by the substrate and can sufficiently wash other slits by providing a cleaning mechanism. In the nozzle, the above-mentioned β-structure is washed by a special cleaning liquid, and is not a slit nozzle that is in a state in which the discharge processing is performed on the substrate. In the invention of claim 3, the cleaning mechanism is provided with a plurality of slits. In the invention according to the fourth aspect of the invention, the maintenance mechanism can continue to be provided with a degassing mechanism, in addition to the separate cleaning liquid supply path. The 4c is blackened to the substrate and can be sufficiently degassed by the other slit nozzles. The above-described deaeration mechanism performs a degassing process from a slit nozzle that is not in a state in which the discharge processing is performed on the substrate. In the invention, the supply means can supply the processing liquid suitable for each slit nozzle by providing a separate processing liquid supply path for the plurality of slit nozzles. 98703-970131.doc In the invention of 6, the maintenance of the price and the maintenance of the secrets are controlled according to the conditions stored in the storage mechanism to control the maintenance of the thief to implement the necessary maintenance. The control mechanism can be efficient. In the invention of 7, the above-mentioned plurality of slit nozzles 测定! measuring means respectively measure each partition; the lifting mechanism;: - the dance between the substrates held by the holding mechanism is determined by the measuring mechanism丨#夕纟士 I slit nozzle-L疋 mechanism measured results 'lifting a plurality of substrates. ##Multiple slits (4) can correspond to any thickness

Preventing sound; in the land of Zhancheng, the hunter is a linear motor driven by a moving mechanism, so that it can increase the occupied area. J. In the invention of claim 9, the upward widths are different from each other. [Embodiment] A plurality of slit nozzles are included in the length to correspond to substrates having different widths. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the accompanying drawings. <1. Younger Embodiments> Fig. 1 is a schematic perspective view showing a substrate processing apparatus 1 of the present invention. Fig. 2 is a side cross-sectional view showing the main body 2 of the substrate processing apparatus i, and showing a main component of the coating operation of the photoresist. In addition, in FIG. 1, for convenience of illustration and description, it is defined that the two-axis direction indicates the vertical direction 'ΧΥ plane indicates the horizontal plane', and the material is simply defined to facilitate grasping the positional relationship, and is not limited to the following directions (four). The same applies to the following figures. ~ <Overall Configuration> 98703-970131.doc -10- 1296211 The substrate processing apparatus 1 is roughly divided into a main body 2 and a control unit 6, which will be used to manufacture liquid crystals. (4) The glass substrate of the display device is a substrate to be processed (hereinafter referred to as "苴&, 冉 von von substrate") 9 〇, and is selectively formed on the surface of the substrate 90. In this case, a coating treatment apparatus in which a photoresist liquid is applied as a treatment liquid on the surface of the substrate 9 is formed. Therefore, in the embodiment, the slit nozzles 41a and 41b are for discharging the photoresist. Further, the substrate processing apparatus 41 is not only a glass plate for a liquid crystal display device, but may be generally used as a device for applying a processing liquid (chemical liquid) to various substrates for a flat panel display. The main body 2 is provided with a platform 3, which can be used as a support for placing the holding substrate 90, and can function as a base of each of the attached mechanisms, and has a square shape of 3:3 and is, for example, a body-shaped stone. The product has a flat surface on the upper surface (holding surface 30) and the side surface. The top of the flat $3 is set to the horizontal plane, so that it becomes the holding surface of the substrate 9〇. A plurality of vacuum suction ports (not shown) are formed on the holding surface 30, and the substrate 9 is held at a specific horizontal position by the substrate 9 while the substrate processing apparatus 1 processes the substrate 90. Further, on the holding surface 30, a plurality of ejection rams LPs which are vertically movable up and down can be placed at appropriate intervals by a mechanism (not shown). The ejector pin LP is used to press and lift the substrate 90 and the like when the substrate 9 is taken out. The both end portions of the holding surface 30 in which the substrate 90 holding region (the region holding the substrate 9A) is held are fixed in a substantially horizontal direction in parallel with one side, [31]. The tunnel 31 constitutes a support block fixed at the lowermost end of the bridge structures 4a, 4b and not shown, and the movement of the guide bridge structure 4a, 4b 98703.97013ld〇c • 11 - 1296211 (will move The direction is defined as a specific direction) and the bridge structure is supported, and the servant supports the linear guide above the holding surface 30. Above the platform 3 are provided bridge structures 4a, 4b which are substantially horizontal from the sides of the platform 3. The bridging structure 4a mainly includes a nozzle supporting portion which uses, for example, a carbon fiber-reinforced resin as an aggregate, and lifting mechanisms 43a, 44a for supporting both ends of the bridge structure 4a. In addition, since the bridging structure is the same as the structure of the bridging structure, the related description is omitted as appropriate. A slit nozzle 4U and a gap sensor 42a are attached to the nozzle support portion 40a. The slit nozzle 4 having a longitudinal direction in the γ-axis direction in Fig. 1 is connected to a supply mechanism 7 (resist agent pump 72a) for supplying a photoresist liquid to the slit nozzle 41a. The slit nozzle 41a scans the surface of the substrate 90, and discharges the photoresist liquid supplied from the supply mechanism 7 to a specific region (hereinafter referred to as "resist agent application region") on the surface of the substrate 9. Thereby, the slit nozzle 4U applies the photoresist liquid onto the substrate 90. Here, the photoresist coating region refers to a region in the surface of the substrate 90 where the photoresist liquid is to be applied, and generally refers to subtracting a region having a specific width along the edge from the total area of the substrate 90. Area. Further, a detailed description of the supply mechanism 7 will be described later. The gap sensors 42a, 42b are respectively located near the slit nozzles 41a, 4bb, and are applied to the nozzle support portions 4a, 40b to measure the difference between the underlying objects (for example, the surface of the substrate 9 or the surface of the photoresist film). (Gap), the measurement result is transmitted to the control unit 6. That is, the gap sensor 42a measures the gap between the slit nozzle 4 and the lower object, and the gap sensor 42b measures the gap between the slit nozzle 41b and the lower portion of 98703-970131.doc -12-1296211. In this manner, the substrate processing apparatus 1 separately measures the interval between the substrate 90 held on the stage 3 and the plurality of slit nozzles 41a and 41b. The lifting mechanisms 43a and 44a are disposed on both sides of the nozzle supporting portion 40a. The nozzle support portion 40a is coupled to the slit nozzles 41&. The elevating mechanisms 43a and 44a mainly include AC servo motors 430a and 440a and a ball screw (not shown), and generate and lower the driving force of the bridging structure 4a in accordance with the control signal from the control unit 6. Thereby, the elevating mechanisms 43a and 44a can advance and lower the slit nozzle 41a. Further, the elevating mechanisms 43a, 44a are used to adjust the potential of the slit nozzle 41a in the plane of the ¥2. Further, by the elevating mechanisms 43b and 44b2 AC servo motors 43〇b and 440b, the slit nozzle 41b and the slit nozzle 4u can be separately operated to perform the same operation. In the earth sheet processing apparatus 1, fixed members 500, 510 are respectively fixed along both side edges of the platform 3. Further, moving members 5〇la 511a are provided at both end portions of the bridge structure 4a, and moving members Mu and 511b are provided at both end portions of the bridge structure 4b. The fixing member 5A and the moving members 5〇la and 5〇ib constitute an ac coreless linear motor (hereinafter simply referred to as a “linear motor”. The fixing member 51〇 and the moving members 511 & 51113 constitute a linear motor 51. Each of the linear motors 5A and 51 is provided with a pair of moving members 501a, 5〇1b, 5Ua, and 5m, and the moving members are individually moved in the X-axis direction. In this manner, the substrate processing apparatus 1 of the present embodiment borrows The wire 11 motors 50 and 51 are used as a mechanism for moving the bridge structures 4a and 4b in the X-axis direction, so that the fixing member 51G can be used. Therefore, for example, a general moving mechanism using a rotary motor and a ball screw can be used. Compared with the case where the bridging structure 98703-970131.doc -13-1296211 4a, 4b is separately moved, the occupied area can be reduced. Further, the linearity of the scale portion and the detecting member is fixed at both ends of the bridging structure 4a. An encoder 52a (not shown), 53a, a linear encoder 52a for detecting the position of the moving member 5A of the linear motor 50, and a linear encoder 53a for detecting the position of the moving member 51a of the linear motor 51. In the same way, in the shelf Linear encoders 52b, 53b are fixed at both ends of the bridge structure 4b, the linear encoder 52b is used to detect the position of the moving member 50lb of the linear motor 50, and the linear encoder 53b is used to detect the moving member 5 1 lb of the linear motor 51. The linear encoders 52a, 52b, 53a, 53b output the detected position information to the control unit 6. In this manner, each of the linear encoders 52a, 52b, 53a, 53b is used to detect each of the moving members 501a, Based on the detection results, the control unit 6 controls the linear motors 50 and 5 1 respectively, whereby the substrate processing apparatus 1 can individually move the bridging structures 4a and 4b, respectively. The state of the slit nozzle (for example, the slit nozzle 41a) is affected, so that the other slit nozzle (for example, the slit nozzle 41b) can be moved. On the holding surface 30 of the body 2, the X-axis direction of the holding area is provided. The openings 32a and 32b have slits 41a and 4b having a longitudinal direction in the Y-axis direction, and the lengths in the longitudinal direction are substantially the same as the lengths of the slit nozzles 41a and 41b in the longitudinal direction. Again, in Figure 1 The following illustration is omitted: a cleaning liquid discharge mechanism 83a, a standby box 85a, and a pre-coating mechanism 86a are provided inside the main body 2 below the opening 32a, and a cleaning liquid discharge mechanism is provided inside the main body 2 below the opening 32b. 83b, the standby box 85b, and the pre-coating mechanism 86b. Fig. 3 is a view showing the supply mechanism 7 and the cleaning mechanism 8. The slit nozzle 98703-97013 l.doc -14-1296211

As shown in FIG. 3, the pipes 71a and 71b which are mainly used for the photoresist liquid flow path, and the light from the photoresist container 70 via the photoresist pump 72a are connected to the slit 7a, and the photoresist liquid is supplied to the light in the pipe 7ia. For the photoresist liquid supply path of the slit nozzle 41a, the photoresist container 7 is connected to the f71b of the slit nozzle 41b via the photoresist pump 31, and the photoresist liquid is transported to the pipe. The photoresist pump 72b constitutes a photoresist liquid supply path 73b for the slit nozzle 41b. That is, the supply mechanism 7 is provided with separate photoresist liquid supply paths 73a and 73b for the respective slit nozzles 41b. Moreover, the cleaning mechanism 8 for cleaning the slit nozzles 41a and 41b mainly includes the cleaning liquid container 80, the pipes 81a and 81b as the cleaning liquid flow paths, the pumps 82a and 82b, and the cleaning liquid discharge mechanisms 83a and 83b. . The cleaning liquid container 8 is connected to the pipe 81a of the cleaning liquid discharge mechanism 83a via the pump 82a, and the cleaning liquid is sent to the pump 82a in the pipe 81 and the cleaning liquid which discharges the cleaning liquid to the slit nozzle 41a. The mechanism 83a constitutes a cleaning liquid supply path 84a for the slit nozzles 4^. In the same manner, the cleaning liquid container 80 is connected to the pipe 81b of the cleaning liquid discharge mechanism 83b via the pump 82b, and the pump 82b for conveying the cleaning liquid to the pipe 81b and the washing liquid for discharging the cleaning liquid to the slit nozzle 41b. The cleaning liquid discharge mechanism 83b constitutes a cleaning liquid supply path 84b for the slit nozzle 41b. In other words, the cleaning mechanism 8 includes separate cleaning liquid supply paths 84a and 84b for the plurality of slit nozzles 41a and 4lb, and the cleaning liquid discharge mechanisms 83a and 83b are respectively applied to the slit nozzles 41a and 41b. The front end portion discharges the cleaning liquid supplied from the cleaning liquid container 80. Further, 98703-970131.doc -15-1296211, although not shown, can be ejected from the gas discharge mechanisms 83a and 4b in the supply of the inert gas a, 83b to the cleaning liquid discharge supply unit. The cleaning nozzle 41a, 41b is under the movement mechanism not shown, and the slit 啧 can be made.

: The bottom (4) is moved in the axial direction, and the slit nozzle 4U can be washed by spitting and washing, and the squirting liquid can be washed by the squirting liquid, and the washing liquid can be dried by the sputum preparation &gt; . The shovel is used to make the nozzles 仏, 仙中, not in the counter substrate 90::, the processing of the state of the slit nozzle, so that the cleaning process (dimensional), and The processing of the substrate 9G is continued. Therefore, the extension of the intermittent time can be suppressed and the maintenance time can be sufficiently ensured. Further, in the substrate processing apparatus according to the present embodiment, the same cleaning liquid is used for the slit nozzles 41a and 41b. In this case, the path from the cleaning liquid supply passages 84a and 84b to the pumps 82a and 82b may be used. In this case, the piping may be configured as follows. By opening and closing the valve, the pipings of the discharge mechanisms 83a and 83b are opened, and only The cleaning liquid is supplied to the cleaning liquid discharge mechanisms 83a and 83b for performing the processing. Fig. 4 is a view for explaining in detail the photoresist liquid supply path of the slit nozzle 41a. The piping 71a is attached to the piping 71a. The two-way valve 71A and the valve 711. Further, the same structure is provided on the slit nozzle 41b side. Further, in Fig. 4, a solenoid valve is omitted, wherein the three-way valve 71, the valve 711, and the valve 74 are omitted. 1 connected to The opening and closing operation is performed by the control unit 6. The three-way valve 710 is provided at a position where the pipe 81a is connected to the pipe 71a, and the upstream side of the pipe 71a or the pipe 81a can be selectively connected to the slit nozzle. 98703-97013i.d〇( -16-1296211 41a (downstream side of piping 71 &). Specifically, when the photoresist liquid is supplied to the slit nozzle 41a, the upstream side of the opening pipe 71a is opened, and the piping 81 &amp; Thereby, the photoresist liquid that has been transferred from the photoresist pump 72a is supplied to the slit nozzle 41a. On the other hand, when the cleaning liquid is supplied to the slit nozzle 41a, the upstream side of the pipe 71a is closed and opened. In this way, the cleaning liquid sent from the pump 82a is supplied to the slit nozzle 41a. Further, the degassing mechanism 74a is attached to the slit nozzle 41a. The deaeration mechanism 74&amp; is provided with the deaerating pipe 740 and the valve. 741. The degassing pipe 740 is connected to a recovery mechanism (not shown), and is opened and closed by the valve 741. Further, in the substrate processing apparatus according to the embodiment, the photoresist liquid and the cleaning liquid are from the slit nozzle. Supply on the left and right sides of 41a, or from the central part The standby boxes 85a and 85b are designed such that the front ends of the slit nozzles 41a and 41b in standby are not dried, and the slit nozzles 41a and 41b are mainly used during the application process for a long period of time. The pre-coating mechanisms 86a and 86b are placed on the standby box 85a and 85b. The pre-coating mechanisms 86a and 86b are mechanisms for performing preliminary coating shortly before the slit nozzles 4ia and 4bb apply the coating process to the substrate 90. The pre-coating mechanism 86a, Each of the 86b includes a distribution roller, and the slit nozzles 41a and 41b discharge the photoresist liquid to the distribution roller, and then perform preliminary coating. Thereby, the precision of the coating process of the substrate processing apparatus 1 can be improved. Returning to Fig. 1, the control unit 6 includes therein a secondary calculation unit 60 for processing various materials in accordance with a program, and a storage unit 6 for storing programs or various materials. Further, the front surface of the control unit 6 is provided with an operation unit 62 for inputting a necessary instruction to the substrate processing apparatus i, and a display for displaying various materials 98703-970131.d〇 ( -17-1296211 63. The control unit 6 is electrically connected to each mechanism attached to the main body 2 by means of a non-illustrated g, a heart depth, and a control unit 6. The control unit 6 is based on the data stored in the storage unit ο or from the operation. The input signal of the part 62, or the scorpion 荨 盗 来自 间隙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙 仙In the storage correction, the maintenance condition is set by the controller operating the operation unit 62. Further, the maintenance bar stored in the storage unit 61 is appropriately read, and the motor (4), the motor supply mechanism 5, and the washing mechanism 7 are controlled. The net mechanism 8 and the like can perform the maintenance of the corresponding situation at the time. In addition, the storage unit 61 can be a temporary storage data, a read-only ROM, a magnetic disk device, etc. Mobility Light Disk or Memory The memory unit, the reading device, etc. The operation unit 62 can be a button, a switch (including a keyboard or a mouse, etc.), etc. The M n ^ _ panel display has the function of the display unit 63. The portion 63 can be a liquid crystal display or a variety of indicator lamps, etc. As described above, the configuration and function of the substrate processing apparatus 1 of the present embodiment will be described. <Operation Explanation> FIGS. 5 and 6 show the present embodiment. Flowchart of the operation of the substrate processing apparatus. The operation of the substrate processing apparatus will be described below with reference to FIGS. 5 and 6. Further, unless otherwise specified, the operation of the substrate processing apparatus described below is performed by the control unit 6. Control is carried out. =& First, the substrate processing device is finished with a specific initial setting (step Μ) 98703-970131.doc -18-1296211, until it is loaded into the substrate 9〇—straight Resentment (step S11). The re-explanation setting refers to the step of performing the necessary preparation for the substrate (four). For example, not only the steps required to read the data (reading data, etc.), but also including the controller = 0 Fixed work (4) (Additional new method or setting (4) protection conditions, etc. ^ Initializing maintenance of the quilting nozzles 4la, 41b is also performed in the initial setting. Fig. 1 2 3 4 shows a flowchart for detailed description of the initial maintenance performed in the initial setting. In the substrate processing apparatus according to the present embodiment, the internal cleaning process and the external cleaning process are performed on the slit nozzles 41a and 41# during the initializing maintenance. Further, the maintenance is not limited to the processes. Since the slit nozzle 41a and the slit nozzle 41b are initialized and maintained, the processing of the slit nozzle 4ia will be described as an example. First, the control unit 6 narrows the control by controlling the linear motors 50 and 51. The slit nozzle 987〇3-97〇13 i.doc •19- 1 la moves above the precoating mechanism 86a (step si〇i). 2 When the slit nozzle 41a is moved, the control unit 6 controls the three-way valve 710 to open the pipe 8 1 a and to close the upstream side of the pipe 71 a. Further, the control valve 711 opens the downstream side of the pipe 71a. Thereby, the flow of the cleaning liquid from the cleaning liquid container 80 to the slit nozzle 41a can be connected in four ways. Further, the control unit 6 opens the valve 741 of the deaeration mechanism 74a and opens the deaerating pipe 740. Then, the control unit 6 drives the pump 82a, supplies the cleaning liquid from the cleaning liquid container 80 to the slit nozzle 41a (step S102), and performs deaeration of the slit nozzle 41a (step S103). When the cleaning liquid is supplied to the slit nozzle 41a, the supplied cleaning liquid is sent to the downstream side of the pipe 71a and discharged from the slit 4196211 nozzle 41a. Thereby, the inside of the slit nozzle 4U can be cleaned. Further, the cleaning liquid supplied and supplied by the I 82a overflows from the deaeration mechanism 74a. By the cleaning liquid, the air in the slit nozzle 41a is pressed toward the deaeration mechanism 74a, and can be discharged to the recovery mechanism. Therefore, in the figure $, for convenience of illustration, the steps S102 and S1〇3 are disclosed as two different steps, but in reality, the two steps are performed in parallel with each other. Further, it is also possible to provide a degassing pump in the deaeration mechanism 74a, and to perform degassing in a mandatory manner. When a certain period of time has elapsed after the pump 82a is started to be driven, the control unit 6 stops the operation of the pump 82a to stop the supply of the cleaning liquid. Next, the three-way valve door 7U) is controlled to close the pipe 81a and open the upstream side of the pipe 7u. Thereby, the flow path of the photoresist liquid from the photoresist container 7G to the slit nozzle 可 can be connected. Furthermore, the time during which the step S1〇2 (S1〇3) is performed (the actual washing time in the internal washing process) can be set as a maintenance condition in advance, and stored in the storage unit in such a manner as to be in the substrate processing apparatus. ! The maintenance conditions set in advance by the controller are stored in the storage unit 61, and the control core implements the maintenance condition as a method (maintenance method), whereby necessary maintenance can be performed at an appropriate timing. As for the specific example, the maintenance method can be carried out by adding the necessary maintenance method to the substrate processing method (the usual method) to be carried out as follows, and the automation can be promoted even if the controller is not released one by one. Therefore, it is possible to reduce the situation in which the second control must be involved. In the following, the conditions required by the control unit 6 in the process of the maintenance process are previously set and stored as maintenance strips 98703-970131.doc -20-1296211. Next, the control unit 6 drives the photoresist pump 72a to supply the photoresist liquid from the photoresist container 7 to the slit nozzle 41a (step sl4). Thereby, the cleaning liquid in the slit nozzles μ &amp;, the valve 71 a and the deaeration mechanism 74 a is displaced and replaced with the photoresist liquid. When a certain time elapses after the right start of driving of the photoresist pump 72a, the control unit 6 stops the operation of the photoresist pump 72a to stop the supply of the photoresist liquid. Next, the valve 711 is closed, the downstream side of the pipe 71a is closed, and the valve 741 is closed, and the degassing pipe 740 is closed. Thereby, the inside of the slit nozzle 41a and the piping 71 &amp; is filled with the photoresist liquid, and the internal washing process is completed. When the internal washing process is completed, the control unit 6 controls the linear motors 5〇, 51 to move the slit squirt 41a above the standby box 85a (step s1〇5). At this time, the control unit 6 controls the state in which the cleaning liquid discharge mechanism 83a reaches the height position near the discharge port of the scanable slit nozzle (the slit position where the slit nozzle 41a and the cleaning liquid discharge mechanism 83a do not interfere with each other). Lifting mechanism c&amp;, 44&amp;. When the slit nozzles 41a are moved, the control unit 6 determines whether or not the washing liquid is to be discharged based on the number of scans of the cleaning liquid discharge mechanism 83a (step si%), and it is necessary to discharge the washing liquid. The cleaning liquid discharge mechanism 83a supplies the cleaning liquid. Thereby, the cleaning liquid discharge mechanism 83a discharges the cleaning liquid to the slit nozzle 41a (step S107), and scans the slit nozzle 4ia (step S108). Therefore, the front end portion of the slit nozzle 4U is washed from the outside. Further, the "washing liquid discharge mechanism" - the speed at the time of scanning or the like can also be set as a maintenance condition. On the other hand, when there is no need to spit out the cleaning solution (determined in step 8106 as 98703-970131.doc • 21· 1296211)

No), the step S107 is skipped, and the slit nozzles 41a are scanned (step S108). In the step S10, the "cleaning liquid discharge means 8.3 a discharges the rat gas, so that the cleaning liquid is not discharged, and the slit nozzle 41a can be dried and processed by performing the step S108. Further, in the substrate processing apparatus 1 of the present embodiment, when the step sl7 is performed, the nitrogen gas can be blown out because the step S108 is also performed. The purpose is to suppress the unnecessary discharge of the washing liquid to be discharged, and to stop blowing nitrogen gas during the washing process if it is not necessary. Since the control unit 6 controls the maintenance conditions so determined in advance, the control unit 6 controls the respective configurations, so that the substrate processing apparatus can perform the processing as needed. Each time the step S108 is executed, the control unit 6 counts the number of scans of the cleaning liquid discharge mechanism 83a until the predetermined number of times has been completed, and repeats the processing of steps S109 (step S109). When the scanning by the cleaning liquid discharge mechanism 83a is completed a certain number of times, the external washing process is completed, and the processing shown in Fig. 6 is returned. At this time, the control unit 6 controls the elevating mechanisms 43a and 44a to lower the slit nozzle 41a and to intrude the tip end portion into the standby casing 85a. Thereby, drying of the front end portion of the slit nozzle 4U can be suppressed. Hereinafter, the state of the slit nozzles 41a and 41b at this time is referred to as a "standby state". The above is the process of initializing maintenance. Referring back to FIG. 6, in the substrate processing apparatus μ, the substrate 90 is transported to a specific position by a controller or a transport mechanism (not shown), and the ejector pin (4) of the stage 3 receives the substrate 9 〇Q and 'by The lowering of the ejector pin allows the substrate 90 to be placed at a specific position on the holding surface 3G of the platform 3, so that the platform 3 adsorbs and holds the substrate 90. By the operation #1, the loading of the substrate 90 is performed (Yes in step S11). 98703-970131.doc -22- 1296211 When the loading of the substrate 90 is completed, the substrate processing apparatus 1 ends the maintenance of the slit nozzle 4 ia, and starts the coating process by the slit nozzle 41a (step S12) until the coating is performed. Processing continues until the cloth processing is completed (step s丨3). Further, the maintenance in the step S12 is not limited to the initial maintenance, and may also include maintenance as will be described later. That is, it is preferable that the maintenance of the slit nozzle 41a is completed until the step S12 can be performed, and more specifically, the slit nozzle 41a is in the standby state at the time when the step S12 can be performed. When the coating process by the slit nozzle 41a is described, the slit nozzle 41a is first moved to the precoating mechanism 86a based on the control signals from the control unit 6, the elevating mechanisms 43a, 44a, and the linear motors 50, 51. Above. Next, a specific amount of the photoresist liquid is supplied to the slit nozzle 41 &amp; by the supply mechanism 7, and the slit nozzle 41a discharges the photoresist liquid to the distribution roller of the precoating mechanism 86a. Thereby, the preliminary coating process can be performed in the substrate processing apparatus 1, and the preparation of the slit nozzles 41a is completed, and the coating process can be performed. When the preliminary coating process is completed, the lift sensor 43a, 44a moves the gap sensor 42a attached to the nozzle support portion 4a to a specific height higher than the thickness of the substrate 90 in accordance with the control signal from the control unit 6. Hereinafter, it is called "measuring south degree".). If the gap sensor 42a is set at the measured height, the linear motors 5〇, 5丨 move the bridging structure 4a to the (+X) direction (ie, only the moving members 5〇la, 5Ua), thereby making the gap feel The detector 42a moves up above the photoresist coating area. At this time, the control unit 6 controls the position of the gap sensor 42a in the X-axis direction by supplying a control signal to each of the linear motors 50 and 51 based on the detection results of the linear encoders 52a and 53a. 98703-970131.doc -23- 1296211 Next, the gap sensor 42a starts measuring the gap between the surface of the substrate 90 and the slit nozzle 41a in the photoresist application region on the surface of the substrate 90, and transmits the measurement result to the control unit 6. At this time, the control unit 6 stores the measurement result of the gap sensor 42a in the storage unit 61. When the measurement by the gap sensor 42a is completed, the control unit 6 calculates the position of the nozzle support portion 40a based on the detection result from the gap sensor 42a by the calculation unit 60. The nozzle support portion 4a The position of the slit nozzle 41a in the YZ plane is an appropriate posture (the interval between the slit nozzle 4U and the photoresist-applied coating region is suitable for the interval at which the photoresist liquid is applied). "Appropriate posture".) The position of the time. Further, based on the calculation result of the calculation unit 60, control signals are supplied to the respective elevating mechanisms 43 &amp; 44a. Each of the elevating mechanisms 43a and 44a moves the nozzle supporting portion 40a in the Z-axis direction in accordance with the control signal from the control unit 6, and adjusts the slit nozzle 4ia to an appropriate posture. In this manner, in order to achieve uniform application of the photoresist liquid, it is necessary to closely adjust the distance between the slit nozzles 41a and the surface of the substrate 90. In the substrate processing apparatus 1, the control unit 6 controls the elevation mechanisms 43a, 44a based on the detection results of the gap sensor 42a, whereby the distance can be adjusted. Further, as described above, in the substrate processing apparatus 1 of the present embodiment, the elevating mechanisms 43a, 43b, 44a, and 44b and the gap sensors 42a and 42b are separately provided for the slit nozzles 41a and 41b, and thus the respective slits are provided. The above-described posture adjustment can be separately performed by the slit nozzles 4la, 4lb. Therefore, even when the substrate processing apparatus 1 processes the substrate 90 of any thickness, it can be processed by the slit nozzles 41a, 4 lb. That is, depending on the thickness of the substrate 9 to be processed, 98703-970131.doc -24-1296211 need not limit the slit nozzles 41a, 41b which can perform processing. Further, the linear motors 50 and 51 move the bridge structure 4a in the X-axis direction, and move the slit nozzle 41a to the discharge start position. Here, the "discharge start position" means that the slit nozzle 41a is located substantially along the side of the photoresist application region. When the slit nozzle 41a moves to the discharge start position, the control unit 6 supplies a control signal to the linear motors 50 and 51. According to the control signal, the linear motors 50, 51 move the bridging structure 4a to the (+χ) direction, whereby the slit nozzles 41&amp; scan the surface of the substrate 90. Further, the control unit 6 monitors whether or not the slit nozzle 41a has moved to the discharge end position based on the detection results of the linear encoders 52&amp;, 53a. Further, the control unit 6 supplies a control signal to the supply mechanism 7 in parallel with the scanning of the slit nozzle 41a, and the supply mechanism 7 drives the photoresist pump 72a based on the control signal. Thereby, the photoresist liquid supply path 73a is provided independently from the slit nozzle 4U from the photoresist container 7 to supply the photoresist liquid to the slit nozzle 41a. Further, the control unit 6 controls the supply mechanism 7 to set the flow rate of the photoresist liquid discharged from the slit nozzle 41a to a flow rate required to form a film having a desired film thickness. Specifically, the driving speed of the photoresist pump 72a is controlled. By the operation as described above, the slit nozzle 41a discharges the photoresist liquid in the photoresist application region, and a photoresist liquid layer (film) can be formed on the surface of the substrate 9. That is, the coating process performed by the slit nozzle 41a can be performed. When the slit nozzle 41a is moved to the discharge end position, the control unit 6 supplies the production signal to the supply mechanism 7. Based on the control signal, the supply mechanism 7 stops the operation of the photoresist pump 72a. Thereby, the photoresist liquid of 98703-970131.doc -25-1296211 is discharged from the slit nozzle 41a, and the coating process by the slit nozzle 4ia is completed (it is judged as Yes in step S13). Further, the coating treatment by the slit nozzles 41b described below can be carried out in substantially the same manner. When the coating process by the slit nozzle 41a is completed, the substrate processing apparatus 1 starts the maintenance of the slit nozzle 41a (step s4). In the substrate processing apparatus according to the present embodiment, the maintenance performed on the slit nozzles 41a will be described. First, the control unit 6 supplies control signals to the elevating mechanisms 43a and 44a and the linear motors 50 and 51, and the elevating mechanisms 43a and 44a. And the linear motors 50, 51 move the slit nozzle 41a above the standby box 85 &amp; Next, the supply mechanism 7 supplies a specific amount of the photoresist liquid to the slit nozzle 41a, whereby the slit nozzle 4U discharges the photoresist liquid to the standby cassette 85a. Thereby, the air mixed into the inside of the slit nozzle 4la can be removed, for example, by sucking at the end of coating or the like. Therefore, the next time the coating process is performed by the slit nozzles 41 &amp; the discharge responsiveness and the discharge uniformity can be improved, so that the discharge accuracy of the slit nozzle 4U can be improved. In this manner, in the substrate processing apparatus 1 of the present embodiment, the degassing process can be performed by the control unit 6, the supply mechanism 7, and the standby box 85a (precoat mechanism 86a). In other words, not only the deaeration mechanism 74a but also such a configuration can function as a deaeration mechanism of the invention of the present invention. When the degassing process is completed, the cleaning mechanism 8 drives the pump 82a, and supplies the cleaning liquid from the cleaning liquid container 80 to the cleaning liquid discharge mechanism, and moves the cleaning liquid discharge mechanism in the Y-axis direction. Thereby, the cleaning process of the front end portion of the slit nozzle 4丨a (the same treatment as the external washing process shown in FIG. 7) can be performed, and the 98703-97013 l.doi -26 - 1296211 can be cleared. Photoresist fluid or other contaminants. Therefore, when the coating process is performed by the slit nozzle 41a next time, it is possible to suppress the adhesion of the particles to the substrate 9 or the film thickness of the substrate is not uniform, so that it can be improved by the slit nozzle 4丨&amp; Coating accuracy. The above is mainly the content of the wafer squeezing 41a in the substrate processing apparatus in the substrate processing. Further, the following description of the slit nozzle 4ib is also substantially the same. In the step S14, the maintenance of the slit nozzle 4a is started. At the same time, the substrate processing apparatus 1 performs the unloading process of the substrate 9 that has finished the coating process, and the control unit 6 monitors the completion of the unloading process of the substrate 90. (Step S1 5). In the unloading process of the substrate 90, first, the stage 3 stops adsorbing the substrate 90 and raises the die ejector lp' to thereby raise the substrate 9A to a specific height position. The controller or the transport mechanism receives the substrate 9 in this state, and transports it to the next processing step, thereby completing the carry-out processing of the substrate 9 (YES in step § 15). When the substrate processing apparatus 1 is finished, the substrate processing apparatus 1 determines whether or not the substrate 9 that needs further processing (hereinafter, the substrate 90 to be processed next is referred to as "substrate 91"), and determines whether or not the operation is completed (step S16). When the substrate 91 is not present (it is determined to be Yes in step S16), the processing is terminated. On the other hand, when the substrate 91 is present (the determination is No in the step S16), the substrate 91 is loaded and the completion of the loading operation is monitored (step S21). When the loading of the substrate 91 is completed, the maintenance of the slit nozzle 41b is completed, and the coating process by the slit nozzle 41b is started (step S22). The coating process carried out by the slit nozzle 41b is carried out in substantially the same manner as the coating process carried out by the slit nozzle 41a by means of 98703-970131.doc -27-1296211. In the substrate processing apparatus 1 of the present embodiment, the slit nozzle 41b performs the coating process for the substrate 91, so that it is not necessary to end the maintenance of the slit nozzle 41a at the time of loading the substrate 91. That is, in the previous apparatus, after the step S14 is performed, the substrate carry-in/out time (corresponding to the time when the steps S15, S16, and S21 are performed) serves only as the maintenance time, but in the substrate processing apparatus 1, the step S15 can be performed. S16, the times of steps S21 to S26 and step snn serve as the maintenance time for the slit nozzle 41a. Therefore, if the substrate processing apparatus 1 is stopped, even if maintenance such as degassing is required for a long period of time, the intermittent time for the substrate 9 is not prolonged. When the coating process performed on the substrate 91 by the slit nozzle 41b is completed (Yes in the step S23), the substrate processing apparatus 丨 starts the maintenance of the slit nozzle 41b (step S24), and starts the unloading of the substrate 91. The job monitors the completion of the unloading operation (step S25). When the substrate 91 is completed, it is determined whether or not there is a substrate 90 to be further processed, thereby determining whether or not the operation is completed (step s26), and the processing is terminated when there is no substrate 9 to be processed. Nai chi, there is a need for a knife to sign the pole shape of the magazine, the reverse of the four extremities suddenly continue to implement the treatment. In this manner, the substrate processing apparatus is not until there is no substrate 9 to be processed (until the steps are called or the steps to S26 are processed. 16Ms* and step S21 are provided in the above-described manner, and the present embodiment is maintained as described above. Form substrate 98703-970131.doc -28-1296211 A plurality of slit nozzles 41a, 41b of the photoresist liquid are ejected in almost all areas of the substrate 90 photoresist application area on the platform 3, in a plurality of slits In the nozzles 41a and 41b, the slit nozzles that have not been subjected to the discharge processing to the substrate 9A can be subjected to maintenance, whereby the processing for the substrate 9 can be continued, and the other slit nozzles can be sufficiently washed. The substrate processing apparatus according to the embodiment includes lift mechanisms 43a, 4B, and 43b for individually raising and lowering a plurality of slit nozzles 41a and 41b, and a plurality of slit nozzles 41a and 41b for holding and holding the plurality of slit nozzles 41a and 41b, respectively. The gap sensors 42a and 4沘 spaced apart from each other on the upper substrate 90 lift and lower a plurality of slit nozzles based on the measurement results measured by the gap sensors 42a to 42b

Wa, 4 lb, whereby the plurality of slit nozzles 4u can correspond to the substrate 90 of any thickness. Further, as the mechanism for moving the bridge structure 4a in the axial direction, the linear motors 50, 5i can be used to prevent an increase in the occupied area. Further, in the substrate processing apparatus i of the present embodiment, the photoresist liquid supplied to the slit nozzles 41a and 41b can be supplied from the photoresist container 7 and is a general-purpose photoresist liquid. However, it is also possible to separately provide the photoresist capacitors (4), (4), etc., which are respectively connected to the photoresist liquid supply paths ～, 73b, and the photo-resist liquids which are different from each other. In other words, the present embodiment can also be configured such that the photoresist liquid supply path a J3b can be separately provided, so that the slit nozzles 4u and Sichuan can discharge different treatment liquids. The Sea If-B is 'can be coated with different materials for the substrate 9 〇 and the substrate', but even in this case, the maintenance time can be fully ensured. Only %4la, 41b 98703-970131.doc -29 - !296211 Further, the cleaning liquid supplied from the cleaning mechanism 8 to the cleaning liquid discharge mechanisms 83a and 83b is supplied from the cleaning liquid container 80, and is a general cleaning liquid. However, it is also possible to separately provide separate cleaning. The cleaning liquid container 80 to the cleaning liquid supply paths 84a and 84b stores the washing liquids different from each other in the cleaning liquid container 8A. Since the cleaning liquid supply paths 84a and 84b are separately provided, the respective slit nozzles 41a and 41b can be washed using the most suitable cleaning liquid based on, for example, the processing liquids used for the slit nozzles 41a and 41b. Further, the maintenance in the step S14 (or the step S24) (maintenance in the substrate processing performed by the substrate processing apparatus) may be continued when the processing of one substrate is difficult to end, and the slit nozzles 41a, 41b may continue. Coating the two substrates. That is, each place The slit nozzles 41a and the slit nozzles 41b are alternately used after a plurality of substrates, and may be determined according to the time required for maintenance. <2. Second Embodiment> The first embodiment is characterized by A method in which the slit nozzles 41a and 4 are alternately used to perform the coating process to ensure the maintenance time of the slit nozzles 41a and 41b will be described. However, the maintenance is not limited to those performed during the operation of the substrate processing apparatus, for example, It may be due to the abnormality of the slit nozzle, and the maintenance of the slit nozzle after the slit nozzle is disassembled or replaced (hereinafter (4) "Recovery"). Restoring the maintenance system requires a long period of maintenance, and it is usually necessary to carry out the operation by the controller. Therefore, when the device is previously stopped and the maintenance is terminated, the controller can be instructed to operate again. The substrate processing apparatus of the present invention! In order to implement such a recovery, it can also delay the intermittent time of 98703-970131.doc -30-1296211. Figs. 8 and 9 are flowcharts showing the operation of the substrate processing apparatus 1 according to the first embodiment of the present invention. In the second embodiment, the configuration of the substrate processing apparatus 1 is substantially the same as that of the substrate processing apparatus 1 of the first embodiment. Therefore, the description of the configuration will be omitted. When the initial setting (not shown) is completed, it is determined whether or not an abnormality has occurred in the slit nozzle (step S31), and when an abnormality occurs, the restoration of the slit nozzle 41a is started (step S41). Further, the processing when the abnormality is not found by performing the slit squirting 41 a in step S31 is as will be described later. Further, the abnormality detection may be detected based on the inspection result of the processed substrate 9 or by an operation performed by the controller, or the abnormality detection may be periodically performed by processing the specific number of slices. On the other hand, when the slit nozzle 41a is not abnormal, the loading substrate 90' monitors the completion of the loading operation (step S32). When the substrate processing apparatus of the present embodiment is loaded into the substrate 9A, the maintenance of the slit nozzle 41a is completed, and the coating process performed by the slit nozzle 4U is started (step S33). The coating treatment in this embodiment is the same as the coating treatment in the second embodiment, and the description thereof is omitted. By performing the step S34, if it is possible to detect that the coating process by the slit nozzle 41 is completed, the maintenance of the slit nozzle 41a is started (step S35) and the substrate 9 is carried out. When it is detected that the loading of the substrate 90 is completed, it is determined whether or not the substrate 9 to be further processed is present (step S37). If there is a substrate 90 to be processed, the process returns to step S3 and continues. deal with. - 98703.97013l.doc •31 · 1296211 Aspects - The processing is terminated when there is no substrate 9G to be processed. In other words, the substrate processing apparatus according to the second embodiment is required to be the same as the previous apparatus by the slit nozzle 41a until the slit nozzle 4丨& is required to be abnormal, and the abnormality of the maintenance is continued (until it is determined in step S3i). Processing. Therefore, during the operation, the maintenance performed on the slit nozzle 41a is mainly performed within the time period during which the substrate 90 is carried out (the time when steps S36, S37, S3, and S32 are performed). When it is detected that the slit nozzle 41a is abnormal during the operation of the substrate processing apparatus according to the second embodiment (it is determined in step S31 that the slit nozzle 4a is started as described above). In addition, the substrate 9 to be processed is carried in, and the completion of the loading operation of the substrate 9 is monitored (step S42). When the substrate 9 is loaded, the maintenance of the slit nozzle 41b is completed, and the operation is started. The coating process performed by the slit nozzle 41b (step S43). In other words, when the substrate processing apparatus according to the second embodiment is required to perform recovery maintenance on the slit nozzle 41a, the slit nozzle 41b is used to continue the coating process. In this case, in this case, it is necessary to stop the operation (the production line is stopped) and resume maintenance is performed, and the substrate 9 is completely incapable of being processed in the period. However, the substrate processing apparatus of the present embodiment is even in such a case. It is possible to suppress the extension of the intermittent time due to the recovery and maintenance without stopping the production line. By performing the step S44', the slit nozzle 41 is completed. b. The coating process carried out by the substrate processing apparatus 1 starts the maintenance of the slit nozzle 41b (step S45) and carries out the substrate 90. 98703-970l31.doc -32-1296211, by the step S46, If it is detected that the s47 of the substrate 90 has been removed, it is judged whether or not the restoration of the slit nozzle 41a is completed (step s; when the maintenance of the bundle is completed, the process returns to step s37 of Fig. 8 to continue the process. In the case of recovery maintenance performed by the slit nozzle 41a: whether there is a substrate 90 that needs further processing (step S48), and if there is a substrate 9G to be processed, the process returns to step S42 and continues. On the other hand, when the substrate 90 to be processed is not present, the processing is terminated. As described above, the substrate processing apparatus according to the second embodiment can be suppressed as in the substrate processing apparatus i of the second embodiment. The intermittent time caused by maintenance is extended. In addition, 'recovery maintenance is not limited to the maintenance required in the case of "unusual" unpredictable conditions. For example, 'can also include more like photoresist liquid [3rd Embodiment] In the first embodiment, only the internal cleaning process which requires a long time in the initial setting will be described as an example. The substrate processing apparatus 1 can be configured as follows. The substrate processing apparatus 1 can be configured as follows: After the coating process is started, the coating process is continued and the internal cleaning process can be performed. Fig. 10 and Fig. 11 show the substrate processing apparatus according to the third embodiment. In addition, the configuration of the substrate processing apparatus according to the first embodiment is substantially the same as that of the substrate processing apparatus according to the first embodiment, and the description thereof will be omitted. First, in step S 1 of the first embodiment, In the same manner as in S11, the actual setting of 98703-970131.doc -33 - 1296211 (step S5 1) and the completion of the loading of the substrate 90 are completed (step S52). When the substrate 90 is loaded, the control unit 6 determines whether or not the end is narrow. Maintenance performed by the slit nozzle 41a (step S53), when performing maintenance on the slit nozzle 41a, it is further determined whether or not the maintenance performed for the slit nozzle 41b is ended. Step S54). In other words, in the substrate processing apparatus 1 of the present embodiment, steps S5 3 and S54 are repeated until the slit nozzle 41a and the slit nozzle 41b can be used, and the coating process is in a standby state. When the slit nozzle 41a is used (Yes in step S53), the coating process performed by the slit nozzle 41a is started (step S55), and when the slit nozzle 41b can be used (step In S54, it is determined as Yes), and the coating process performed by the slit nozzle 41b is started (step S56). In the following manner, the slit nozzles 41a and the slit nozzles 41b which are selected as the slit nozzles which can be applied to the substrate 90 are referred to as "target slit nozzles". In addition, the coating process by the target slit nozzle is the same as the coating process described in the first embodiment, and the description thereof is omitted. When the control unit 6 completes the coating process by the target slit nozzle (Yes in the step S61), the number of times the target slit nozzle is used is increased. The number of times of use refers to the number of times the coating process is performed continuously using the target slit nozzle from the previous internal cleaning process. Thereby, in the latter case, the control unit 6 can know how many times the slit nozzles 4a, 4 i b have been continuously used to perform the coating process. Next, the control unit 6 starts the maintenance process (step S62) and monitors the completion of the loading of the board 98703-970131.doc -34-1296211 (step S63). That is, the substrate processing apparatus 1 of the present embodiment starts the maintenance process by the step S62, but the coating process can be continued without waiting for the maintenance process to end. Fig. 12 is a flow chart showing the operation of the maintenance processing in the third embodiment. In the maintenance process, the slit nozzle inspection can be performed first (step s7i). The slit nozzle inspection is a treatment for a slit nozzle for performing a maintenance process. In the present embodiment, a slit nozzle (target slit nozzle) which has been subjected to 35 coating treatment just before can be selected. When the target slit nozzle has been determined, the control unit 6 determines whether or not a specific number of times has been used with reference to the use of the counter slit nozzle that has been counted: (9) (step S72). The specific number of times as the criterion for determination at this time is set in advance by the controller as a maintenance condition. The control unit 6 performs the determination of step S72 by referring to the setting 储存 stored in the storage unit 61 as a specific number of times. When a certain number of times has been used, the control unit 6 controls the linear motors 5, 51 to move the target slit nozzle above the precoating mechanism 86a (or the precoating mechanism 86b) (step S73). When the movement of the target slit nozzle is completed, the internal washing process is performed (step S74). Further, in the step S74, the cleaning process is substantially the same as the steps §1〇2 to sl4 (Fig. 7) of the first embodiment, and the description thereof is omitted. On the other hand, when the specific number of times has not been used, steps S73 and S74 are skipped because the internal washing process is omitted. Next, the control unit 6 controls the linear motors 50 and 51 to move the target slit nozzle above the standby cassette 85a (or the standby cassette 85b) (step S75). Further, 98703-970131.doc -35-1296211, if the movement of the target slit nozzle is completed, an external washing process is performed (step S76). Further, the external washing treatment in the step S76 is substantially the same as the processing in the steps 31〇6 to 8109 (Fig. 7) of the second embodiment, and the description thereof is omitted. In this manner, the control unit 6 continuously performs the internal washing process (step S74) and the external washing process (step s76) on the slit nozzles 41a and 41b that have been subjected to the coating process for a predetermined number of times after the coating process is completed. ). On the other hand, for the slit nozzles 41&amp;, 41b which have not been used for a certain number of times of continuous use, only the external washing process is performed after the coating process (step s76). In the substrate processing apparatus according to the present embodiment, the control unit 6 appropriately performs the necessary maintenance according to the maintenance condition '#, thereby ensuring the normal state of the slit nozzles 41a and 41b. When the external washing process is performed, the control unit 6 controls the elevating mechanisms a and 44a (or the elevating mechanisms 43|3 and 44b), and lowers the target slit nozzle so as to be pushed into the standby box 85a (or the standby box 85b). That is, the target slit is moved to the standby position (step S77). The maintenance process is ended in the above manner. As described above, the maintenance process is started by v step S62 (Fig. 11), but the coating process can be continued without waiting for the maintenance process to end. Therefore, even if the maintenance process is not completed, it is possible to determine whether or not there is a substrate (v step S64) where there is a need for further processing when the substrate 90 is unloaded. Returning to step 852 (Fig. 10), the process is repeated. In the slit nozzles 41a and 41b which are maintenance processing targets, the coating process cannot be performed. Therefore, the target slit nozzle is specified in step S71 until after. During the period from the processing of step S77, the state of the target slit nozzle is 98703-97013i.doc -36 - 1296211 and is in "maintenance". In steps S53 and S54 (Fig. 10B), the control unit 6 determines the slit nozzles 41a and 41b which can be subjected to the coating process in the next step by referring to this state. In this manner, the substrate processing apparatus 1 of the present embodiment includes a plurality of slit nozzles 41a and 41b, and any one of them can be used (any one of steps S53 and s 54 is determined to be Yes), and coating processing can be performed. . Therefore, when maintenance is required for a long period of time in the slit nozzle of one of the nozzles, the coating process can be continued by the other slit nozzle, whereby the processing efficiency of the substrate 90 can be improved. Further, in the substrate processing apparatus 1 of the present embodiment, the state in which the maintenance processing can be performed in parallel on the slit nozzles 41a and 4lb is also present, and in this case, the maintenance processing of any slit nozzle is completed. The processing of steps S53, S54 is repeated and the coating process is in a standby state. In the step S64, the substrate processing apparatus 1 can determine that there is no substrate 90 that needs further processing, and waits for the end of the maintenance process to end the processing. As described above, the substrate processing apparatus 1 of the present embodiment can obtain the same effects as those of the above embodiment. Further, as described in the present embodiment, when the slit nozzles 41a and 41b are alternately used from the start of the coating process, the number of times can be almost simultaneously achieved, and the internal washing process needs to be performed almost simultaneously (step S74). In this case, the two slit nozzles 41a, 41b cannot be used for a long time. Therefore, for example, only the slit nozzle 41a is used to perform the coating process of the first fixed number of sheets, and then the alternate operation is started. &lt;4. Fourth Embodiment&gt; 98703.97013ld (•37-1296211 The substrate processing apparatus 1 is provided with the individual photoresist liquid supply paths 73a and 73b, so that the non-photosensitive agent liquid can be supplied and the different coating processes can be alternately performed. This case has been described in the above-described first embodiment. However, when a plurality of kinds of photoresist liquids are used, the time required to replace the photoresist liquid can be ensured during operation. According to the principle of the form, the photoresist liquid supplied to the slit nozzle 41b is replaced with the photoresist liquid B during the coating process performed by using the photoresist liquid A only by the slit nozzle "a". The maintenance time required to replace the photoresist liquid B can be ensured. If the process of replacing the photoresist liquid B is completed, the coating process is alternately performed by the slit nozzle 41 &amp; and the slit nozzle 41b. The maintenance time required for the external cleaning process of each of the slit nozzles 41a and 41b can be ensured. Further, when the coating process for applying the photoresist liquid A is completed, the slit nozzle 41b is continuously used only. Coating treatment, replacing photoresist liquid A with green agent Liquid c. Thereby, the maintenance time required for the replacement of the photoresist liquid c can be ensured. In this way, if a plurality of substrates 90' are separately processed by the photoresist plan by a manufacturing plan or the like, It is set as a maintenance condition, and can be effectively utilized. <5 · 苐5 embodiment> Maintenance for removing the photoresist liquid adhering to the slit nozzles 41a and 41b' In the above, the external cleaning treatment is mainly described. However, the method for removing the photoresist liquid is not limited thereto. Fig. 13 is a view showing the removal mechanism of the substrate processing apparatus in the embodiment according to the principle. In addition, in Fig. 13, only 98283-970131.doc - 38-1296211 does not have a removal mechanism 75, but the substrate processing apparatus 本 of the present embodiment includes two removal mechanisms 75, which are respectively arranged in standby. Above the cartridges 85a and 85b, the removal mechanism 75 has a wound base 75A, a pair of collecting members 751, a feed nut portion 752, a ball screw 753, and a rotating motor (not shown). The base 750 is a plate-shaped member. ( + Z) side A pair of collecting members 751 are arranged in the Y-axis direction. The collecting member 751 is a plate-shaped resin member, and as shown in Fig. 13, a slit portion is formed in the upper portion thereof. The slit portion 75U is formed to be The shape of the slit nozzle 仏 and the front end portion of the ridge is catered for. The number or shape of the collecting member 751 is not limited to the one shown in the drawing. The feed nut portion W is fixed to the (-z) side surface of the pedestal 75G. A screw hole penetrating in the γ-axis direction is formed in the feed nut portion 752 of the substantially box-shaped member, and a ball screw 753 is screwed into the screw hole. A ball screw 753 is disposed along the shaft, and the length in the γ-axis direction is larger than It is equal to the length of the ¥ axis direction of He 4U, 411 &quot;. Further, the ball screw 753 -= is equipped with a (four) motor. By driving the rotary motor, the ball screw ... rotates around the axis of the large, small, and Y-axis. Furthermore, the pedestal is. The feed member is set so as not to rotate the ball screw 753 by the rotary motor by rotating the ball screw (7), and the feed nut is moved. i: The moving member 751 is moved in the same direction as the γ-axis. The slewing motor is controlled by the control unit 6, from the rotation direction and the rotation speed. p, according to the removal of the above configuration, the photoresist ▲ 丨 y ' on 4U, 41b is used to remove the adhesion to the slit nozzle 曰; ^ + method (hereinafter referred to as "removal process"). As a method of processing the slit nozzles, the method is almost the same, and therefore, the description of the slit nozzle 41a will be described in Japanese Patent Application No. 98703-97013l.doc -39-1296211. In the substrate processing apparatus 1 of the present embodiment, the removal processing is continued after the external cleaning processing (the same processing as the steps S106 to S109 shown in Fig. 7) performed on the slit nozzles 4la. First, the control unit 6 controls the linear motors 50 and 51 and the elevating mechanisms 43a and 44a to move the slit nozzle 41a that has finished the external washing process to the upper side of the removing mechanism 75. Further, the slit nozzles 41a are lowered by a certain height by the elevating mechanisms 43a and 44a, and the end portions of the slit nozzles 41a are pressed to meet the slit portions 751a of the collecting member 751. In this state, the control unit 6 drives the rotation motor to rotate the ball screw 753. Thereby, the collecting member 751 abuts against the front end portion of the slit nozzle 4 la, and in this state, the collecting member 751 moves in the Y-axis direction. Therefore, the adhering matter attached to the slit nozzle 41a is collected by the collecting member 75 and removed. Further, in the substrate processing apparatus 1 of the present embodiment, as the material of the collecting member 751, a resin may be used. However, any material may be used as long as it is softer than the material forming the slit nozzles 4ia and 4 lb. A material. Further, the collecting member 751 may be attached to the base 750 via a member (for example, a spring or a rubber) that can bias the collecting member 751 in the (+z) direction. The control unit 6 repeats the scanning until the number of times set as the maintenance condition is reached, and the end removal processing is completed. As described above, the maintenance mechanism is similar to the above-described embodiment in that it is a mechanism for collecting and removing the photoresist liquid as in the removal mechanism 75. 98703-970131.doc 40- 1296211 Further, instead of the collecting member 753, a cloth wiping member can be used for the removal process. In this case, it is also possible to wipe the adhered photoresist liquid by crimping the rubbing-like rubbing member. The present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. For example, in any one of the slit nozzles 41a and 41b, the coating process is alternately performed by the slit nozzles 41a and 41b in the same manner as the substrate processing apparatus 1 of the first embodiment; In the case where maintenance is necessary, it is also possible to perform processing using a slit nozzle that does not require maintenance, in the same manner as the substrate processing apparatus i of the second embodiment. Further, the cleaning liquid discharge mechanisms 83a and 83b and the precoating mechanisms 86 &amp; 86b may be only one. Fig. 14 is a schematic view showing main components of the cross section of the main body portion 2a of the board processing apparatus 1 constructed in accordance with such a principle and the photoresist liquid application operation. The main body portion 2a shown in Fig. 14 is not configured to correspond to the cleaning liquid discharge mechanism 83b and the precoating mechanism 86b of the substrate processing apparatus 1 of the above embodiment. Even in such a configuration, for example, the same operation as the substrate processing apparatus according to the second embodiment can be performed. In other words, when the slit nozzle 41a is normally subjected to the coating process, when the slit nozzle 41a is required to perform maintenance maintenance such as disassembly maintenance, the slit nozzle 4U is largely retracted, and the coating can be performed by the slit nozzle 41b. Cloth processing. At this time, the maintenance performed during the operation of the slit nozzle 41b is performed in the opening 32a. In other words, in the state in which the slit nozzle 41b is in the state of 98703-970131.doc -41 - 1296211, the cleaning liquid discharge mechanism 83a discharges the cleaning liquid, thereby cleaning the slit nozzle 41b; When the preliminary coating process is performed on the slit nozzles 4lb, the precoating mechanism 86a can be used. With such a configuration, the same effects as those of the substrate processing apparatus 1 of the second embodiment can be obtained. Further, the plurality of slit nozzles 41a and 4 lb may have different length directions (Y-axis directions) from each other. In this case, the substrate processing apparatus i may correspond to substrates of different widths. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the outline of a substrate processing apparatus of the present invention. Fig. 2 is a side cross-sectional view showing the main body of the substrate processing apparatus, and is a schematic view showing main components related to the photoresist liquid application operation. Fig. 3 is a schematic view showing a supply path of a photoresist liquid and a cleaning liquid in a substrate processing apparatus. Portion 4 is an explanatory view for explaining in detail the photoresist liquid supply path of the slit nozzle. Fig. 5 is a flow chart showing the operation of the substrate processing apparatus in the first embodiment. Fig. 6 is a flow chart showing the operation of the substrate processing apparatus in the second embodiment. Fig. 7 is a flow chart showing the operation of initializing maintenance in the second embodiment. Fig. 8 is a view showing the operation of the substrate processing apparatus in the second embodiment. </ RTI> Fig. 9 is a flow chart showing the operation of the substrate processing apparatus in the second embodiment. Fig. 10 is a flow chart showing the operation of the substrate processing apparatus in the third embodiment. Fig. 1 is a flow chart showing the operation of the substrate processing apparatus in the third embodiment. Fig. 12 is a flow chart showing the operation of the maintenance process in the third embodiment. Fig. 13 is a schematic view showing a mechanism for removing a substrate processing apparatus in the fifth embodiment. Fig. 14 is a view showing main components of a side surface of a main body portion of a substrate processing apparatus and a photoresist liquid application operation in a modification. [Description of main component symbols] 1 substrate processing apparatus 2, 2a main body part 3 platform 30 holding surface 41a, 41b slit nozzles 42a, 42b gap sensors 43a, 43b, 44a, 44b lifting mechanism 4a, 4b bridging structure 50, 51 Linear motor 6 Control unit 61 Storage unit 62 Operation unit (acquisition mechanism) 6 Supply mechanism 73a, 73b Photoreceptor supply path 98703-970131.doc 1296211 74a Deaeration mechanism 75 Removal mechanism 8 Cleaning mechanism 80 Cleaning liquid container 84a , 84b cleaning liquid supply path 85a, 85b standby box 90, 91 substrate 98703-970131.doc -44-

Claims (1)

1296211 X. Patent application scope: 1. A substrate processing apparatus characterized in that: a specific processing liquid is applied to a substrate application region, and a holding mechanism is provided, which holds one substrate; a plurality of slit nozzles The specific processing liquid is discharged from the linear discharge port in substantially all areas of the application region of the substrate held by the holding mechanism, and the supply mechanism supplies the specific processing liquid to the plurality of slit nozzles; Separatingly moving the plurality of slit nozzles independently; and moving the mechanism to independently move the substrate held by the holding mechanism and the plurality of slit nozzles independently in a direction along the surface of the substrate; and A mechanism that performs specific maintenance on the plurality of slit nozzles described above. 2. The substrate processing apparatus according to (6), wherein the maintenance mechanism includes a cleaning mechanism that cleans a slit nozzle that is not discharged to the substrate by a specific cleaning liquid. 3. The substrate processing apparatus according to claim 2, wherein the cleaning means includes an independent cleaning liquid supply path for each of the plurality of slit nozzles. 4. The substrate processing apparatus according to claim 1, wherein the maintenance mechanism further includes a deaeration mechanism, wherein the deaeration mechanism performs deaeration from a slit nozzle that is not discharged to the substrate. 5. The substrate processing apparatus according to claim 1, wherein the supply means includes separate processing liquid supply paths for the plurality of slit nozzles. The substrate processing apparatus of claim 1, further comprising: an acquisition mechanism that acquires maintenance conditions; a storage mechanism that stores maintenance conditions acquired by the acquisition mechanism; and a control mechanism The maintenance mechanism is controlled according to maintenance conditions stored in the storage mechanism. The substrate processing apparatus according to claim 1, further comprising: a measuring unit that measures an interval between the plurality of slit nozzles and the substrate held by the holding mechanism; and the lifting mechanism is based on a measurement result of the measuring mechanism Lifting the plurality of slit nozzles. 8. If requested! The substrate processing apparatus, wherein the moving mechanism is a linear motor. 9. The substrate processing apparatus according to claim 1, wherein the plurality of slit nozzles in the straight φ μ, +, and each of the plurality of slit nozzles have different widths in the longitudinal direction. 98703-970131.doc Patent Interrogation Form k-pattern replacement page (January 97) Painting 2 98703.doc 9(523⁄43⁄4縦)Foot page No. Patent application Chinese translation page (January 97) 98703.doc 1296211 VII. Designated representative map: (1) The representative representative of the case is: (1). (2) A brief description of the components of the representative drawing: 1 substrate processing apparatus 2 main body part 3 platform 6 control part 30 holding surface 31 traveling path 32a, 32b opening 4a, 4b bridging structure 40a, 40b nozzle supporting part 41a, 41b narrow Slot nozzles 42a, 42b Gap sensors 43a, 43b, 44a, 44b Elevating mechanisms 52b, 53a, 53b Linear encoders 430a, 430b, 440a, 440b Servo motors 500, 510 Fixings 501a, 501b, 511a, 511b Moving parts 60 Calculation unit 61 Storage unit 62 Operation unit 63 Display unit 90 Substrate LP ejector pin 8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: (none) 98703-970131.doc