CN1644246A - Substrate processing device - Google Patents
Substrate processing device Download PDFInfo
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- CN1644246A CN1644246A CNA2005100046580A CN200510004658A CN1644246A CN 1644246 A CN1644246 A CN 1644246A CN A2005100046580 A CNA2005100046580 A CN A2005100046580A CN 200510004658 A CN200510004658 A CN 200510004658A CN 1644246 A CN1644246 A CN 1644246A
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- Prior art keywords
- jet nozzle
- slit jet
- aforementioned
- substrate
- board treatment
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
- B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
Abstract
The present invention relates to a substrate processing device, which can restrain a tact time from being increased due to maintenance. A plurality of slit nozzles 41a, 41b are arranged in the apparatus body 2 of this substrate treatment apparatus 1. A gap sensor 42a, lifting/lowering mechanisms 43a, 44a and movers 501a, 510a of linear motors 50, 51 are provided in the slit nozzle 41a. A gap sensor 42b, lifting lowering mechanisms 43b, 44b and movers 501b, 510b of the linear motors 50, 51 are provided in the slit nozzle 41b. When this substrate treatment apparatus 1 is operated, the slit nozzle 41b is maintained while the coating is performed by the slit nozzle 41a, and the slit nozzle 41a is maintained while the coating is performed by the slit nozzle 41b.
Description
Technical field
The present invention relates to a kind of by not stopping that slit jet nozzle is cleaned in the processing that substrate carries out, thereby realize the substrate board treatment of the shortening of intermittent time.
Background technology
As the device of the manufacturing process that is used in substrate, be well known that by to treatment fluid such as substrate surface ejection resist liquid resist liquid being coated to finedraw coating machine (substrate board treatment) on the substrate from slit jet nozzle.
All the time,, wish to shorten the intermittent time of processing substrate, for example, in patent documentation 1, put down in writing such finedraw coating machine according to improving productive requirement in the manufacturing process of substrate.In the device of patent documentation 1 record, thereby proposed to handle the technology that a plurality of substrates realize that the intermittent time shortens simultaneously by a plurality of slit jet nozzles.
On the other hand, in the finedraw coating machine,, when carrying out the coating of substrate handled, preferably clean the maintenance of slit jet nozzle front end etc. for the precision that coating is handled improves at every turn.But, even for example the finedraw coating machine is in the action, when carrying out, can not use described slit jet nozzle, so the finedraw coating machine can not carry out the coating of substrate is handled to the safeguarding of slit jet nozzle.Therefore, in being transported into of substrate transports the time of processing, safeguarding under the situation that does not have to finish, existing the intermittent time of processing substrate to increase such problem.Particularly, the processing of removing the air that accumulates in slit jet nozzle inside is the processing of comparison spended time, exists to be difficult to the problem that in being transported into of substrate transports the time of processing this processing finished.
Even in the device of patent documentation 1 record, do not solve such problem: when in a plurality of slit jet nozzles any safeguarded, at other slit jet nozzle place processed substrate also therewith correspondence be in the wait process, thereby increased the intermittent time that causes by maintenance.
And, in the finedraw coating machine of patent documentation 1 record, there is such problem: for example take place unusually, in the time of must carrying out big the maintenance to this slit jet nozzle, finedraw coating machine integral body is stopped at a slit jet nozzle place.That is, when the quantity of slit jet nozzle increased, the chance of maintenance also increased, so in the finedraw coating machine of patent documentation 1 record, also exist the intermittent time that is caused by maintenance to increase such problem.
Summary of the invention
The present invention is exactly in view of the above problems and proposes, and its purpose is to provide a kind of substrate board treatment that prevents the increase of off time of causing because of maintenance.
To achieve these goals, the invention of first aspect is a kind of substrate board treatment, at the area of application coating predetermined process liquid of substrate, comprising: holding device, it keeps a substrate; A plurality of slit jet nozzles, it is to the roughly whole zone of the area of application of the aforesaid base plate that is kept by aforementioned holding device, sprays aforementioned predetermined process liquid from the ejiction opening of linearity; Feed mechanism, it supplies to aforementioned a plurality of slit jet nozzle with aforementioned predetermined process liquid; Lowering or hoisting gear, it makes the lifting independently respectively of aforementioned a plurality of slit jet nozzle; Mobile device, it makes the aforesaid base plate that kept by aforementioned holding device and aforementioned a plurality of slit jet nozzle respectively independently along relatively moving on the direction on aforesaid base plate surface; Attending device, the maintenance that it is stipulated aforementioned a plurality of slit jet nozzles.
In addition, the invention of second aspect is that aforementioned attending device has cleaning device in the substrate board treatment of the invention of first aspect, and its cleaning fluid by regulation cleans the slit jet nozzle that aforesaid base plate is not being sprayed.
In addition, the invention of the third aspect is in the substrate board treatment of the invention of second aspect, and aforementioned cleaning device has respectively independently cleaning solution supplying path with respect to aforementioned a plurality of slit jet nozzles.
In addition, the invention of fourth aspect is that aforementioned attending device also has air-cleaning device in the substrate board treatment of the invention of first aspect, and its slit jet nozzle that never aforesaid base plate is being sprayed is removed air.
In addition, the invention of the 5th aspect is in the substrate board treatment of the invention of first aspect, and aforementioned feed mechanism has respectively independently treatment fluid feed path with respect to aforementioned a plurality of slit jet nozzles.
In addition, the invention of the 6th aspect is in the substrate board treatment of the invention of first aspect, also has: acquisition device, and it obtains the maintenance condition; Storage device, the maintenance condition that its storage is obtained by aforementioned acquisition device; Control device, it controls aforementioned attending device based on the maintenance condition that is stored in the aforementioned storage device.
In addition, the invention of the 7th aspect, be in the substrate board treatment of the invention of first aspect, at each of aforementioned a plurality of slit jet nozzles, also have the determinator of measuring with by the interval between the aforesaid base plate of aforementioned holding device maintenance, aforementioned lowering or hoisting gear makes aforementioned a plurality of slit jet nozzle lifting corresponding to the testing result of aforementioned determinator.
In addition, the invention of eight aspect is that aforementioned mobile device is a linear motor in the substrate board treatment of the invention of first aspect.
In addition, the invention of the 9th aspect is in the substrate board treatment of the invention of first aspect, and aforementioned a plurality of slit jet nozzles comprise longitudinally width different slit jet nozzle mutually.
According to the described invention in first aspect to the nine aspects because have roughly whole zone to the area of application of the substrate that keeps by holding device, from a plurality of slit jet nozzles of the ejiction opening ejection predetermined process liquid of linearity; With the attending device of the maintenance that a plurality of slit jet nozzles are stipulated, so on one side can continue processing to substrate, Yi Bian carry out the maintenance of other slit jet nozzle fully.
According to the described invention of second aspect, because attending device has the cleaning device that cleaning fluid by regulation cleans not the slit jet nozzle that aforesaid base plate is sprayed, so can continue processing on one side, Yi Bian carry out the cleaning of other slit jet nozzle fully to substrate.
According to the described invention of the third aspect, because cleaning device with respect to aforementioned a plurality of slit jet nozzles, has respectively independently cleaning solution supplying path, so the cleaning fluid that is suitable for each slit jet nozzle can be provided.
According to the described invention of fourth aspect, because attending device also has the air-cleaning device that the slit jet nozzle that never aforesaid base plate is sprayed is removed air, so can continue processing on one side, Yi Bian carry out the air purge of other slit jet nozzle fully to substrate.
According to the described invention in the 5th aspect, because feed mechanism with respect to aforementioned a plurality of slit jet nozzles, has respectively independently treatment fluid feed path, so the treatment fluid that is suitable for each slit jet nozzle can be provided.
According to the described invention in the 6th aspect, owing to also have based on the maintenance condition that is stored in the storage device, the control device of control attending device is so can carry out suitably necessary maintenance expeditiously.
According to the described invention in the 7th aspect, because at each of a plurality of slit jet nozzles, also has the determinator of measuring with by the interval between the substrate of holding device maintenance, lowering or hoisting gear makes a plurality of slit jet nozzle liftings corresponding to the testing result of determinator, so any in a plurality of slit jet nozzle can both be corresponding to the substrate of any thickness.
According to the described invention of eight aspect, because mobile device is a linear motor, so can prevent the increase of track trace.
According to the described invention in the 9th aspect, because a plurality of slit jet nozzles comprise the mutual different slit jet nozzle of width longitudinally, so can be corresponding to the different substrate of width.
Description of drawings
Fig. 1 is the stereogram of the general structure of expression substrate board treatment of the present invention.
Fig. 2 is for the side section of the main body of expression substrate board treatment, illustrate the view of main composition element of the coating action of resist liquid simultaneously.
Fig. 3 represents the view of the feed path of the resist liquid of substrate board treatment and cleaning fluid.
Fig. 4 is a view of representing the resist liquid feed path of slit jet nozzle in detail.
Fig. 5 is the flow chart of the action of the substrate board treatment of expression first form of implementation.
Fig. 6 is the flow chart of the action of the substrate board treatment of expression first form of implementation.
Fig. 7 is the flow chart of the action of the initialization maintenance of expression first form of implementation.
Fig. 8 is the flow chart of the action of the substrate board treatment of expression second form of implementation.
Fig. 9 is the flow chart of the action of the substrate board treatment of expression second form of implementation.
Figure 10 is the flow chart of the action of the substrate board treatment of expression the 3rd form of implementation.
Figure 11 is the flow chart of the action of the substrate board treatment of expression the 3rd form of implementation.
Figure 12 is the flow chart of the action of the maintenance processing of expression the 3rd form of implementation.
Figure 13 is the view of the removal mechanism of the substrate board treatment of expression the 5th form of implementation.
Figure 14 represent modified example substrate board treatment main part side section and the view of main composition element of the coating action of resist liquid is shown.
The specific embodiment
Below, the preferred implementing form that present invention will be described in detail with reference to the accompanying.
1, first form of implementation
Fig. 1 is the oblique view of the general structure of expression substrate board treatment 1 of the present invention.Fig. 2 is for the side section of the main body 2 of expression substrate board treatment 1, illustrate the view of main composition element of the coating action of resist liquid simultaneously.
In Fig. 1, so define for the convenience that illustrates and illustrate, that is, Z-direction is represented vertical direction, XY represents on the plane horizontal plane, but these do not limit all directions of following explanation for the ease of holding the position relation and defining.Also be same in remaining figure.
(overall structure)
The upper surface of workbench 3 is a horizontal plane, becomes the maintenance face 30 of substrate 90.On maintenance face 30, distribute and be formed with a plurality of vacuum suction mouth (not shown), during substrate board treatment 1 treatment substrate 90, substrate 90 is remained in the horizontal level of regulation by absorption substrate 90.And, on maintenance face 30, but a plurality of lifter pin LP by the lifting of drive unit (not shown) easy on and off are set with proper spacing.Lifter pin LP is used for making substrate 90 risings etc. when taking off substrate 90.
In maintenance face 30,, be set with a pair of moving guide rail 31 that extends in parallel along general horizontal direction on the both ends in the retaining zone of substrate 90 (zone that keeps substrate 90).Moving guide rail 31 and be fixedly installed on bridge members 4a, 4b both ends the below the rest pad (not shown) together, be configured to guide move (moving direction is defined as specific direction) of bridge members 4a, 4b, and bridge members 4a, 4b be bearing in the linear guide part of the top of maintenance face 30.
Above workbench 3, be provided with from the two side portions approximate horizontal of this workbench 3 the bridge members 4a, the 4b that set up.
In substrate board treatment 1, be set with fixture (stator) 500,510 respectively along the edge side of workbench 3 both sides.And, be provided with moving member 501a, 511a at the both ends of bridge members 4a, be provided with moving member 501b, 511b at the both ends of bridge members 4b.Fixture 500 and moving member 501a, 501b constitute and exchange coreless linear motor (below, singly be called " linear motor ") 50, and fixture 510 and moving member 511a, 511b constitute linear motor 51.That is, linear motor 50,51 has a pair of moving member 501a, 501b and 511a, 511b respectively, and they are moved along X-direction independently.
Like this, the substrate board treatment 1 of this form of implementation because with linear motor 50,51 as making bridge members 4a, 4b, so can make fixture 500,510 generalizations along the mechanism that X-direction moves.Therefore, the situation compared with bridge members 4a, 4b are moved independently can suppress the track trace.
And, fixedly install linear encoder 52a (not shown), the 53a that has scale portion and detect part respectively at the both ends of bridge members 4a.Linear encoder 52a detects the position of the moving member 501a of linear motor 50, and linear encoder 53a detects the position of the moving member 511a of linear motor 51.Equally, fixedly install linear encoder 52b, 53b at the both ends of bridge members 4b.Linear encoder 52b detects the position of the moving member 501b of linear motor 50, and linear encoder 53b detects the position of the moving member 511b of linear motor 51.Each linear encoder 52a, 52b, 53a, 53b output to control part 6 with detected positional information.
Like this, each linear encoder 52a, 52b, 53a, 53b detect the position of each moving member 501a, 501b, 511a, 511b respectively, control part 6 is controlled linear motor 50,51 respectively corresponding to this testing result, thus, substrate board treatment 1 can make bridge members 4a, 4b move independently respectively.Therefore, be not subjected to the state influence of a slit jet nozzle (for example slit jet nozzle 41a) and another slit jet nozzle (for example slit jet nozzle 41b) is moved.
On the maintenance face 30 of main body 2, opening 32a, 32b are set in the X-direction both sides of retaining zone.Opening 32a, 32b are the same with slit jet nozzle 41a, 41b, have length direction along Y direction, and the same length of the length direction of the length of this length direction and slit jet nozzle 41a, 41b.Though in Fig. 1, do not illustrate, but, the inside of the main body 2 below opening 32a is provided with the cleaning fluid ejection 83a of mechanism, standby jar 85a and the 86a of pre-coated mechanism, and the inside of the main body 2 below opening 32b is provided with the cleaning fluid ejection 83b of mechanism, standby jar 85b and the 86b of pre-coated mechanism.
Fig. 3 is the view of expression feed mechanism 7 and wiper mechanism 8.As shown in Figure 3, the feed mechanism 7 that resist liquid is supplied to slit jet nozzle 41a, 41b mainly by resist container 70, as pipe arrangement 71a, the 71b of resist liquid stream, and resist pump 72a, 72b constitute.Be routed to the pipe arrangement 71a of slit jet nozzle 41a from resist container 70 through resist pump 72a, and carry the resist liquid feed path 73a of the resist pump 72a formation of the resist liquid in the pipe arrangement 71a at slit jet nozzle 41a.Equally, be routed to the pipe arrangement 71b of slit jet nozzle 41b through resist pump 72b, and carry the resist liquid feed path 73b of the resist pump 72b formation of the resist liquid in the pipe arrangement 71b at slit jet nozzle 41b from resist container 70.That is, feed mechanism 7 has independent respectively resist liquid feed path 73a, the 73b that is provided with respect to each slit jet nozzle 41a, 41b.
The wiper mechanism 8 that cleans slit jet nozzle 41a, 41b mainly is made of soda liquor container 80, pipe arrangement 81a, 81b, pump 82a, 82b and cleaning fluid the ejection 83a of mechanism, 83b as the cleaning fluid stream.Be routed to pipe arrangement 81a, the pump 82a that carries the cleaning fluid in the pipe arrangement 81a that cleaning fluid sprays the 83a of mechanism from soda liquor container 80 through pump 82a, and the cleaning fluid that cleaning fluid is ejected on the slit jet nozzle 41a sprays the cleaning solution supplying path 84a of the 83a of mechanism formation at slit jet nozzle 41a.Equally, be routed to pipe arrangement 81b, the pump 82b that carries the cleaning fluid in the pipe arrangement 81b that cleaning fluid sprays the 83b of mechanism from soda liquor container 80 through pump 82b, and the cleaning fluid that cleaning fluid is ejected on the slit jet nozzle 41b sprays the cleaning solution supplying path 84b of the 83b of mechanism formation at slit jet nozzle 41b.That is, wiper mechanism 8 has respectively independently cleaning solution supplying path 84a, 84b with respect to a plurality of slit jet nozzle 41a, 41b.
Cleaning fluid the ejection 83a of mechanism, 83b be will be by soda liquor container 80 cleaning liquid supplied respectively to mechanism that slit jet nozzle 41a, 41b spray.And, although do not illustrate in the drawings, can inert gas (nitrogen) be supplied to cleaning fluid the ejection 83a of mechanism, 83b from gas supply part, and spray to slit jet nozzle 41a, 41b.Cleaning fluid the ejection 83a of mechanism, 83b move below slit jet nozzle 41a, 41b along Y direction by not shown travel mechanism, spray cleaning fluid simultaneously, thereby clean the leading section of slit jet nozzle 41a, 41b, and can make the cleaning fluid drying by nitrogen-blow.
Like this, substrate board treatment 1 cleans the nozzle that substrate 90 is not sprayed among a plurality of slit jet nozzle 41a, the 41b with cleaning fluid, thereby this nozzle is carried out cleaning treatment (maintenance) by wiper mechanism 8, is continued substrate 90 is handled by other nozzle simultaneously.Therefore, when suppressing the intermittent time increase, can fully guarantee maintenance time.
In addition,, using with respect to slit jet nozzle 41a, 41b under the situation of identical cleaning fluid, also can make among cleaning solution supplying path 84a, the 84b and change jointly to the path of pump 82a, 82b according to the substrate board treatment 1 of this form of implementation.In this case, also can pass through to spray the pipe arrangement of the 83a of mechanism, 83b from pump to cleaning fluid, thereby the cleaning fluid ejection 83a of mechanism, the 83b that only carry out cleaning treatment relatively supply with cleaning fluid with opening/closings such as open and close valves.
Fig. 4 is the view of the detailed content of the resist liquid feed path 73a of expression slit jet nozzle 41a.Triple valve 710 and valve 711 are installed on pipe arrangement 71a.And, in slit jet nozzle 41b side same structure is set.In Fig. 4, although do not illustrate, triple valve 710, valve 711 and valve 741 are connected with control part 6, and they are for carrying out a kind of magnetic valve of on-off action by the control of control part 6.
Triple valve 710 is arranged on the position that pipe arrangement 81a is connected with pipe arrangement 71a, and upstream side and the pipe arrangement 81a of pipe arrangement 71a selectively is connected to slit jet nozzle 41a (downstream side of pipe arrangement 71a).Specifically, resist liquid is being supplied under the situation of slit jet nozzle 41a the upstream side of open pipe arrangement 71a, sealing pipe arrangement 81a.Like this, the resist liquid of carrying from resist pump 72a is fed into slit jet nozzle 41a.On the other hand, with cleaning solution supplying under the situation of slit jet nozzle 41a, the upstream side of sealing pipe arrangement 71a and open pipe arrangement 81a.Like this, the cleaning fluid of carrying from pump 82a is fed into slit jet nozzle 41a.
And, the 74a of air purge mechanism is installed on slit jet nozzle 41a.The 74a of air purge mechanism has air purge pipe arrangement 740 and valve 741.Air purge pipe arrangement 740 is connected to not shown recovering mechanism, and is opened, closed by valve 741.
In the substrate board treatment 1 of this form of implementation, resist liquid and cleaning fluid are supplied with from about slit jet nozzle 41a, but also can for example supply with from a position of central authorities.
The 86a of pre-coated mechanism, 86b carry out pre-applied mechanism for before slit jet nozzle 41a, 41b apply processing to substrate 90.The 86a of pre-coated mechanism, 86b have distribution rollers respectively, and slit jet nozzle 41a, 41b spray resist liquid to described distribution rollers, thereby carry out pre-coated.Like this, can improve the precision of the coating processing of substrate board treatment 1.
Return Fig. 1, the inside of control part 6 has the storage part 61 according to the various operation of data of routine processes portion 60 and save routine and various data.And, on front surface, being provided with operating portion 62 and the display part 63 that shows various data, wherein said operating portion 62 is the parts of operator to the necessary instruction of substrate board treatment 1 input usefulness.
Particularly, control part 6 makes and operates the maintenance condition that described operating portion 62 sets by the operator and be stored in the storage part 61.And control part 6 can suitably be read the stored maintenance condition of storage part 61, and control linear motor 50,51, feed mechanism 7 and wiper mechanism 8 etc. carry out the maintenance corresponding with various situations.
Specifically, the RAM of temporary storaging data, the ROM that reads special use and disk set etc. are corresponding with storage part 61.Perhaps, also can be storage mediums such as portable light disk, storage card and their reading device etc.And button and Switch etc. (comprising keyboard and mouse etc.) are corresponding with operating portion 62.Perhaps, also can be touch panel display function with display part 63 such the time.LCD and various indicator lamps etc. are corresponding with display part 63.
More than explanation is the 26S Proteasome Structure and Function of the substrate board treatment 1 of this form of implementation.
(action specification)
Fig. 5 and Fig. 6 are the flow chart of the action of the substrate board treatment 1 of this form of implementation of expression.Action below by Fig. 5 and 6 explanation substrate board treatments 1.Only otherwise specify, the action of following substrate board treatment 1 is based on that the control of control part 6 carries out.
At first, the initial setting that substrate board treatment 1 is stipulated (step S10) is in holding state (step S11) afterwards till substrate 90 is transported into.And the initial setting of so-called regulation is meant the operation of the necessary preparation of action of carrying out substrate board treatment 1.For example, not only comprise the operation that substrate board treatment 1 carries out automatically (data read etc.), and comprise the setting operation that the operator manually stipulates (new method append and safeguard setting of condition etc.).And the initialization of slit jet nozzle 41a, 41b is safeguarded and is also carried out during initial setting.
The flow chart of the detailed content that Fig. 7 safeguards for the initialization that expression is carried out in the initial setting.According to the substrate board treatment 1 of this form of implementation, in initialization is safeguarded, slit jet nozzle 41a, 41b are carried out inner cleaning treatment and exterior washings processing.In addition, maintenance is not limited to these.And, because being safeguarded, initialization substantially similarly carries out with respect to slit jet nozzle 41a and slit jet nozzle 41b, so here, describe with the example that is treated to slit jet nozzle 41a.
At first, control part 6 control linear motors 50,51 make slit jet nozzle 41a move to the top (step S101) of the 86a of pre-coated mechanism.
Behind the mobile end of slit jet nozzle 41a, control part 6 control triple valves 7 make pipe arrangement 81a become open state, seal the upstream side of pipe arrangement 71a simultaneously.And, control valve 711, the downstream of open pipe arrangement 71a.Like this, the stream of the cleaning fluid from soda liquor container 80 to slit jet nozzle 41a is connected.In addition, control part 6 makes the valve 741 of the 74a of air purge mechanism become open mode, thereby open air is removed pipe arrangement 740.
Then, control part 6 drives pump 82a, cleaning fluid is supplied to slit jet nozzle 41a (step S102) from soda liquor container 80, and carry out the air purge (step S103) of slit jet nozzle 41a.As execution in step S102, when cleaning solution supplying was arrived slit jet nozzle 41a, institute's cleaning liquid supplied was transported to the downstream of pipe arrangement 71a, and discharges from slit jet nozzle 41a.Like this, the inside of slit jet nozzle 41a is cleaned.
Also overflow by pump 82a conveying, cleaning liquid supplied from the 74a of air purge mechanism.Air in the slit jet nozzle 41a is expressed among the 74a of air purge mechanism by described cleaning fluid, and is discharged towards recovering mechanism.In Fig. 7, though for diagram step S102 and step S103 are represented as the operation of separating, in fact, these two operations are processing of carrying out concurrently simultaneously.And, also can so construct, the pump that air purge uses promptly is set in the 74a of air purge mechanism comes forced exhaust.
When the driving from pump 82a began through official hour, control part 6 stopped pump 82a, thereby stops the supply of cleaning fluid.Then, control triple valve 710, sealing pipe arrangement 81a, the upstream side of open pipe arrangement 71a simultaneously.Like this, the stream of the resist liquid from resist container 70 to slit jet nozzle 41a is connected.
And the time of execution in step S102 (S103) (scavenging period of inner cleaning treatment reality) is preestablished as the maintenance condition, and is stored in the storage part 61.Like this, in substrate board treatment 1, the operator is stored in predefined maintenance condition in the storage part 61, and handles as a kind of method (maintaining method) with control part 6, thereby can carry out necessary maintenance with suitable timing.
As concrete example, be attached to by maintaining method in the method (commonsense method) of the processing substrate of carrying out below necessity, even without operator's instruction, also can safeguard seriatim, thereby can promote automation.Therefore, reduced the situation that the operator must get involved, thereby can alleviate operator's burden.Below, only otherwise specify that in the maintenance, control part 6 necessary various conditions preestablish as the maintenance condition, and are stored.
Then, control part 6 drives resist pump 72a, supplies with resist liquid (step S104) from resist container 70 to slit jet nozzle 41a.Like this, the cleaning fluid in slit jet nozzle 41a, pipe arrangement 71a and the 74a of air purge mechanism is squeezed out, and is replaced by resist liquid.
When the driving from resist pump 72a began through official hour, control part 6 stopped resist pump 72a, thereby the supply of resist liquid is stopped.Then, shut off valve 711 and the downstream of sealing pipe arrangement 71a, shut off valve 741a and occluded air is removed pipe arrangement 740 simultaneously.Like this, become the state that is full of resist liquid in slit jet nozzle 41a and the pipe arrangement 71a, inner cleaning treatment finishes.
When inner cleaning treatment finished, control part 6 control linear motors 50,51 made slit jet nozzle 41a move (step S105) to the top of standby jar 85a.At this moment, control part 6 control elevating mechanism 43a, 44a are so that the cleaning fluid ejection 83a of mechanism reaches the ejiction opening height and position (slit jet nozzle 41a and the hands-off height and position of the cleaning fluid ejection 83a of mechanism) on every side that can scan slit jet nozzle 41a.
When the mobile end of slit jet nozzle 41a, control part 6 is judged ejection cleaning fluid whether (step S106) according to the scanning times of the cleaning fluid ejection 83a of mechanism, under the situation that makes the cleaning fluid ejection, driving pump 82a, the 83a of mechanism supplies with cleaning fluid to the cleaning fluid ejection.Like this, the cleaning fluid ejection 83a of mechanism scans slit jet nozzle 41a (step S108) simultaneously to slit jet nozzle 41a ejection cleaning fluid (step S107).Thus, from the leading section of exterior washings slit jet nozzle 41a.And the speed when making the cleaning fluid ejection 83a of mechanism scanning etc. also can be set as the maintenance condition.
On the other hand, under the situation that does not make the cleaning fluid ejection, (be "No" among the step S106), skips steps S107, scanning slit jet nozzle 41a (step S108).In step S108, because the cleaning fluid ejection 83a of mechanism can blow out nitrogen, so under the situation of execution in step S108, can carry out the drying of slit jet nozzle 41a and handle not spraying cleaning fluid.
And, in the substrate board treatment 1 of this form of implementation, when execution in step S107, owing to step S108 also carries out, so can blow out nitrogen.This can be used to unnecessary the dispersing etc. of the cleaning fluid that suppresses to spray, if but do not need, also can stop to blow out of nitrogen in the cleaning.Owing to control part 6 is controlled each member corresponding to the maintenance condition that preestablishes this judgement, so in substrate board treatment 1, can realize processing as required.
During each execution in step S108, control part 6 is just counted the scanning times of the cleaning fluid ejection 83a of mechanism, before the number of times end of regulation, and the processing of execution in step S106 to S109 (step S109) repeatedly.
When the end of scan of the stipulated number that is undertaken by the cleaning fluid ejection 83a of mechanism, exterior washings finishes, and returns processing shown in Figure 6.At this moment, control part 6 control elevating mechanism 43a, 44a descend slit jet nozzle 41a, and leading section enters in the standby jar 85a.The drying that can suppress like this, the leading section of slit jet nozzle 41a.Below, the state of at this moment slit jet nozzle 41a, 41b is called " holding state ".The more than processing of safeguarding for initialization.
Return Fig. 6, in substrate board treatment 1, when operator or not shown conveyer were transported to the position of regulation with substrate 90, the lifter pin LP of workbench 3 rose, and received substrate 90.And by the decline of lifter pin LP, substrate 90 is positioned in the assigned position on the maintenance face 30 of workbench 3, and workbench 3 absorption are also keeping substrate 90.By described action, (being judged as "Yes" in step S11) finished in being transported into of substrate 90.
When being transported into of substrate 90 finished, substrate board treatment 1 was finished the maintenance of slit jet nozzle 41a, and beginning applies processings (step S12) by slit jet nozzle 41a, and continued processing up to coating finish dealing with (step S13).In addition, the maintenance among the step S12 is not limited to initialization and safeguards, also comprises maintenance described later.That is, being maintained in of slit jet nozzle 41a finished before the execution in step S12 also passable, in more detail, when execution in step S12, slit jet nozzle 41a is in holding state.
The following describes the coating processing that slit jet nozzle 41a carries out, at first, in response to the control signal from control part 6, elevating mechanism 43a, 44a and linear motor 50,51 make slit jet nozzle 41a move to the top of the 86a of pre-coated mechanism.Then, feed mechanism 7 is supplied with slit jet nozzle 41a with the resist liquid of ormal weight, thereby slit jet nozzle 41a is to the distribution rollers ejection resist liquid of the 86a of pre-coated mechanism.Thus, the pre-coated of carrying out in the substrate board treatment 1 is handled, and the preparation of slit jet nozzle 41a finishes, and becomes the state that can apply processing.
When the pre-coated processing finished, according to the control signal from control part 6, elevating mechanism 43a, 44a made the gap sensor 42a that is installed on the nozzle support 40a move to the specified altitude higher than the thickness of substrate 90 (below, be called " measure height ").
When gap sensor 42a being set in when measuring height, linear motor 50,51 make bridge members 4a to (+X) direction moves (that is, moving member 501a, 511a being moved), thus gap sensor 42a is moved to the top of resist liquid the area of application.At this moment, control part 6 sends control signal to corresponding linear motor 50,51, the position of the X-direction of control gap sensor 42a thus according to the result that detects of linear encoder 52a, 53a.
Then, gap sensor 42a begins to detect substrate 90 surfaces of resist the area of application on substrate 90 surfaces and the gap between the slit jet nozzle 41a, and measurement result is passed to control part 6.At this moment, control part 6 is kept at the measurement result of gap sensor 42a in the storage part 61.
When the mensuration of being undertaken by gap sensor 42a finishes, control part 6 is according to the testing result from gap sensor 42a, and calculating slit jet nozzle 41a by operational part 60 becomes suitable posture in the posture on the YZ plane (interval between slit jet nozzle 41a and resist liquid the area of application becomes the posture of the appropriate intervals that coating resist liquid uses.Hereinafter referred to as " suitably posture ") the position of nozzle support 40a.In addition, according to the result that calculates of operational part 60, send control signal to each elevating mechanism 43a, 44a.According to the control signal from control part 6, each elevating mechanism 43a, 44a make nozzle support 40a move along Z-direction, and slit jet nozzle 41a is adjusted to suitable posture.
Like this, in order to realize the even coating of resist liquid, must strictly adjust the distance between the surface of slit jet nozzle 41a and substrate 90.In substrate board treatment 1, control part 6 is corresponding to the result that detects of gap sensor 42a, and control elevating mechanism 43a, 44a carry out the adjustment of this distance thus.
And, as previously mentioned, substrate board treatment 1 according to this form of implementation, because with respect to each slit jet nozzle 41a, 41b, elevating mechanism 43a, 43b, 44a, 44b and gap sensor 42a, 42b are provided with respectively independently, so can carry out this stance adjustment individually with respect to each slit jet nozzle 41a, 41b.Therefore, even when substrate board treatment 1 is handled the substrate 90 of any thickness, can both handle by among slit jet nozzle 41a, the 41b any.That is, accessible slit jet nozzle 41a, 41b can't help the thickness of treatment substrate 90 and limit.
In addition, linear motor 50,51 makes bridge members 4a move along X-direction, and makes slit jet nozzle 41a move to the ejection starting position.Here, the so-called starting position that sprays is meant that slit jet nozzle 41a is roughly along resist the area of application position on one side.
When slit jet nozzle 41a moved to the ejection starting position, control part 6 sent control signal to linear motor 50,51.According to this control signal, linear motor 50,51 make bridge members 4a along (+X) direction moves, thus, the surface of slit jet nozzle 41a scanning substrate 90.In addition, control part 6 monitors according to the result that detects of linear encoder 52a, 53a whether slit jet nozzle 41a moves to the ejection end position.
And and the scanning of slit jet nozzle 41a parallel, control part 6 sends control signal to feed mechanism 7, corresponding to this control signal, feed mechanism 7 drives resist pump 72a.Like this, via the resist liquid feed path 73a that independently is provided with respect to slit jet nozzle 41a, resist liquid is supplied to slit jet nozzle 41a from resist pump 70.In addition, control part 6 control feed mechanisms 7 make to reach from the flow of the resist liquid of slit jet nozzle 41a ejection to form the necessary flow of film of wishing thickness.Specifically, the actuating speed of control resist pump 72a.
By above-mentioned action, slit jet nozzle 41a is ejected into resist liquid on resist the area of application, forms resist liquid layer (film) on the surface of substrate 90.That is, carry out handling by the coating of slit jet nozzle 41a implementation.
When slit jet nozzle 41a moved to the ejection end position, control part 6 sent control signal to feed mechanism 7.Based on this control signal, feed mechanism 7 stops resist pump 72a.Like this, the action from slit jet nozzle 41a ejection resist liquid stops the coating processing (being judged to be "Yes" in step S13) that end is undertaken by slit jet nozzle 41a.In addition, roughly similarly carrying out the coating of being carried out by slit jet nozzle 41b described later handles.
When the coating processing of being carried out by slit jet nozzle 41a finished, substrate board treatment 1 began safeguard (the step S14) to slit jet nozzle 41a.
The following describes in the substrate board treatment 1 of this form of implementation the maintenance that slit jet nozzle 41a is carried out.At first, control part 6 sends control signal to elevating mechanism 43a, 44a and linear motor 50,51, and elevating mechanism 43a, 44a and linear motor 50,51 make slit jet nozzle 41a move to the top of standby jar 85a.
Then, feed mechanism 7 is supplied with slit jet nozzle 41a with the resist liquid of ormal weight, thereby slit jet nozzle 41a is discharged to resist liquid among the standby jar 85a.Like this, can remove by as the air of sneaking into slit jet nozzle 41a inside such as the suck-back of coating when finishing.Therefore, when carrying out the coating processing of slit jet nozzle 41a implementation next time, can improve ejection response and ejection uniformity, thereby can make the ejection precision raising of slit jet nozzle 41a.Like this, in the substrate board treatment 1 of this form of implementation, also can carry out air purge and handle by control part 6, feed mechanism 7 and standby jar 85a (86a of pre-coated mechanism).That is, the 74a of air purge mechanism not only, these parts also can be used as air purge means of the present invention.
When the air purge processing finished, wiper mechanism 8 driving pump 82a supplied to the cleaning fluid ejection 83a of mechanism with cleaning fluid from soda liquor container 80, and the cleaning fluid ejection 83a of mechanism is moved along Y direction.Thus, carry out the cleaning treatment (handling same processing) of the leading section of slit jet nozzle 41a, remove resist liquid and other pollutant of adhering to exterior washings shown in Figure 7.Therefore, when carrying out coating that slit jet nozzle 41a carries out next time and handling, can suppress particulate and be attached on the substrate 90 and make the thickness of the film of the formation uneven situation that becomes, thereby the coating precision of slit jet nozzle 41a is improved.
More than be mainly the content that the slit jet nozzle 41a to the substrate board treatment in the processing substrate 1 safeguards.Maintenance for slit jet nozzle 41b described later is same content substantially.
With execution in step S14, begin the maintenance of slit jet nozzle 41a parallelly, substrate board treatment 1 applies the processing that transports of substrate 90 that processing finished, control part 6 monitors the end that transports processing (step S15) of substrates 90.Transporting in the processing of substrate 90, at first, workbench 3 stops the absorption to substrate 90, substrate 90 is lifted the height and position of regulation by lifter pin LP is risen.The substrate 90 of this state is received by operator or conveyer, and is transported to following treatment process, and the processing that transports of substrate 90 finishes (being judged to be "Yes" among the step S15).
When the transporting processing and finish of substrate 90, substrate board treatment 1 substrate 90 whether existence should be handled according to also (below, the substrate 90 that should handle next time is called " substrate 91 "), judge release whether (step S16), when not existing, substrate 91 (is not "Yes" among the step S16), end process.
On the other hand, substrate board treatment 1 carries out the operation that is transported into of substrate 91, and monitors that this is transported into the end of operation (step S21) under the situation that substrate 91 exists (being "No" among the step S16).
When being transported into of substrate 91 finished, the maintenance of slit jet nozzle 41b finished, and beginning is handled (step S22) by the coating that slit jet nozzle 41b carries out.The coating of being undertaken by slit jet nozzle 41b is handled and is handled by the coating that slit jet nozzle 41a carries out and roughly similarly carries out.
Like this, in the substrate board treatment 1 of this form of implementation, slit jet nozzle 41b carries out the coating of substrate 91 is handled, so in the moment that substrate 91 is transported into, there is no need to finish the maintenance to slit jet nozzle 41a.Promptly, in existing apparatus, behind the execution in step S14, the time of having only substrate to transport to be transported into (be equivalent to execution in step S15, S1 6, S21 during time) can mend to go in the maintenance time, but, in substrate board treatment 1, the time during execution in step S15, S16, step S21 to S26, the step S11 can mend in the maintenance time of going into slit jet nozzle 41a.Therefore, substrate board treatment 1 is stopped, even and carry out the maintenance that air purge is handled needs the long period like this, the intermittent time that also can not increase relative substrate 90.
When finishing, the coating processing of being undertaken by slit jet nozzle 41b to substrate 91 (is "Yes" among the step S23), substrate board treatment 1 begins safeguard (the step S24) of slit jet nozzle 41b, begin the operation that transports of substrate 91 simultaneously, and monitor that this transports the end of operation (step S25).
When transporting of substrate 91 finished, judge whether also to exist the substrate 90 that should handle, whether judge release thus (step S26), under the substrate 90 non-existent situations that should handle, end process.
On the other hand, under the situation that the substrate 90 that should handle exists, return step S11 and continue to handle.Like this, substrate board treatment 1 the substrate 90 that should handle become do not exist before (before being judged to be "No" among step S16 or the step S26), continue the processing of step S11 to S16 and step S21 to S26.
As mentioned above, the substrate board treatment 1 of this form of implementation, have a plurality of slit jet nozzle 41a, 41b towards the roughly whole resist the area of application ejection resist liquid that remains on the substrate 90 on the workbench 3, by slit jet nozzle carrying out maintenance to substrate 90 not being sprayed among a plurality of slit jet nozzle 41a, the 41b, can continue processing on one side, Yi Bian clean other slit jet nozzle fully to substrate 90.
And, described device 1 has makes a plurality of slit jet nozzle 41a, elevating mechanism 43a, the 44a of 41b lifting, 43b, 44b respectively independently, remain on gap sensor 42a, the 42b of the interval usefulness of each nozzle among substrate 90 relative a plurality of slit jet nozzle 41a, the 41b on the workbench 3 with mensuration, make a plurality of slit jet nozzle 41a, 41b lifting by the measurement result corresponding to gap sensor 42a, 42b, all the substrate 90 with any thickness is corresponding can to make a plurality of slit jet nozzle 41a, 41b.
And, as making bridge members 4a, 4b, adopt linear motor 50,51, so can prevent the increase of track trace along the mechanism that X-direction moves.
In addition, in the substrate board treatment 1 of this form of implementation, the resist liquid of supplying with slit jet nozzle 41a, 41b is the resist of supplying with from any resist container 70, and they are general resist liquid.But following situation is also passable, that is, the resist container 70 that is connected to each resist liquid feed path 73a, 73b is provided with respectively independently, stores different resist liquid mutually in these resist containers 70.That is, the substrate board treatment 1 of this form of implementation, because resist liquid feed path 73a, 73b setting independently respectively, so also can make slit jet nozzle 41a, 41b ejection different treatment fluid mutually.In this case, though even substrate 90 and 91 coated different treatment fluids mutually in this case, also can be guaranteed the maintenance time of slit jet nozzle 41a, 41b fully.
And wiper mechanism 8 is that they are general cleaning fluid from any soda liquor container 80 cleaning liquid supplied to the cleaning fluid ejection 83a of mechanism, 83b cleaning liquid supplied.But following situation is also passable, that is, the soda liquor container 80 that is connected to each cleaning solution supplying path 84a, 84b is provided with respectively independently, stores different cleaning fluid mutually in these soda liquor containers 80.That is, the substrate board treatment 1 of this form of implementation, because cleaning solution supplying path 84a, 84b setting independently respectively, so also can use suitable cleaning fluid to clean each slit jet nozzle 41a, 41b for example corresponding to the treatment fluid of slit jet nozzle 41a, 41b use.
And safeguarding in step S14 (perhaps S24) (maintenance in the processing substrate of being undertaken by substrate board treatment 1) handled under the situation that is difficult to finish during the substrate, and slit jet nozzle 41a, 41b also can continue two substrates are applied processing.That is, make slit jet nozzle 41a and slit jet nozzle 41b alternately during how many substrates of every processing, can determine corresponding to the needed time of maintenance of carrying out.
2, second form of implementation
In above-mentioned first form of implementation, illustrated by alternately applying processing by slit jet nozzle 41a, 41b, guarantee the method for the maintenance time of slit jet nozzle 41a, 41b.But, safeguard to be not limited in the action of substrate board treatment 1, carry out, for example also comprise, because slit jet nozzle unusual taken this slit jet nozzle apart and it is cleaned or such safeguarding such as replacing (below, be called " recovering maintenance ").Recovery is maintained as the maintenance that needs the long period, and the generally operation that must be undertaken by the operator is so in the prior art, arresting stop is in the indication running of safeguarding when finishing according to the operator of starting apparatus once more.Even substrate board treatment 1 of the present invention also can suppress the increase of intermittent time under the situation of carrying out this recovery maintenance.
Fig. 8 and Fig. 9 are the flow chart of expression based on the action of the substrate board treatment 1 of second form of implementation of this principle formation.The structure of the substrate board treatment 1 of second form of implementation and the substrate board treatment 1 of first form of implementation are basic identical, so omit the explanation to its structure.
At first, when not shown initial setting finishes, judge whether slit jet nozzle 41a (step S31) unusually takes place, under unusual situation about taking place, (step S41) safeguarded in the recovery of beginning slit jet nozzle 41a.And by execution in step S31, the processing of situation about noting abnormalities in slit jet nozzle 41a as described later.And, also passable for unusual detecting corresponding to the check result of the substrate 90 after handling and operator's operation etc. are detected, carry out also passable termly by the processing of carrying out specified quantity.
On the other hand, in slit jet nozzle 41a, do not take place to carry out being transported into of substrate 90 under the unusual situation, and monitor that this is transported into the end of operation (step S32).
The substrate board treatment 1 of this form of implementation finishes the maintenance of slit jet nozzle 41a when substrate 90 is transported into, beginning is handled (step S33) by the coating that slit jet nozzle 41a carries out.It is identical with the coating processing of first form of implementation that the coating of this form of implementation is handled, so omit its explanation.
When by execution in step S34, when detecting the coating processing end of being undertaken by slit jet nozzle 41a, begin safeguard (the step S35) of slit jet nozzle 41a, carry out the operation that transports of substrate 90 simultaneously.
When by execution in step S36, detect transporting of substrate 90 when finishing, judge whether also to exist the substrate 90 (step S37) that should handle, under the situation that the substrate 90 that should handle exists, return step S31 and continue to handle.On the other hand, under the substrate 90 non-existent situations that should handle, end process.
That is, the substrate board treatment 1 of second form of implementation slit jet nozzle 41a take place to recover safeguard needed unusual before (before being judged to be "Yes" among the step S31), carry out the processing roughly the same by slit jet nozzle 41a with existing apparatus.Therefore, in the action, the maintenance that slit jet nozzle 41a is carried out mainly finishes in the time (time during execution in step S36, S37, S31, the S32) of carrying out during being transported into of substrate 90 transports.
In the action of the substrate board treatment 1 of second form of implementation, under detecting the unusual situation of slit jet nozzle 41a, (be "Yes" among the step S31), as previously mentioned, and execution in step S41, the recovery of beginning slit jet nozzle 41a is safeguarded.
In addition, when carrying out being transported into of treatment substrate 90, what monitor substrate 90 is transported into EO (step S42).And when substrate 90 was transported into, the maintenance of slit jet nozzle 41b finished, and beginning is handled (step S43) by the coating that slit jet nozzle 41b carries out.
That is, the substrate board treatment 1 of second form of implementation in the time must recovering to safeguard in slit jet nozzle 41a, uses slit jet nozzle 41b to proceed coating and handles.In conventional device, in this case, action (production line stops) that must arresting stop recovers to safeguard, therebetween, device be in fully can not treatment substrate 90 state.But, at the substrate board treatment 1 of this form of implementation,, also there is no need production line is stopped, thereby can suppress by the increase that recovers to safeguard the intermittent time that causes even in this case.
When passing through execution in step S44, when the coating that finishes to be undertaken by slit jet nozzle 41b was handled, substrate board treatment 1 began safeguard (the step S45) of slit jet nozzle 41b, carries out transporting of substrate 90 simultaneously.
In addition,, judge and the recovery of slit jet nozzle 41a safeguarded whether finishes (step S47), recovering to safeguard under the situation about finishing that the step S37 that returns Fig. 8 continues processing when detecting transporting of substrate 90 by execution in step S46 when finishing.
In that the recovery of slit jet nozzle 41a is safeguarded under the situation that does not have to finish, judge whether also to exist the substrate 90 (step S48) that should handle, under the situation that the substrate 90 that should handle exists, return step S42 and continue to handle.On the other hand, under the substrate 90 non-existent situations that should handle, end process.
As mentioned above, identical with the substrate board treatment 1 of first form of implementation in the substrate board treatment 1 of second form of implementation, also can suppress the increase of intermittent time of causing by maintenance.
And, in recover safeguarding, be not limited to as " unusually " can not foreseeable situation under essential maintenance.Also comprise for example so predictable maintenances of execution such as exchange processing of resist liquid.
3, the 3rd form of implementation
In first form of implementation, the example of only carrying out the inside cleaning treatment that needs the long period in initial setting has been described.But, safeguard condition by suitable setting, after the coating in beginning substrate board treatment 1 is handled, continue coating processing on one side, carry out inner cleaning treatment on one side and also be fine.
Figure 10 and Figure 11 are the flow chart of the action of the substrate board treatment 1 of expression the 3rd form of implementation.The structure of the substrate board treatment 1 of this form of implementation and the substrate board treatment 1 of first form of implementation are roughly the same, so omit its explanation.
At first, identical with step S10, the S11 of first form of implementation, carry out being transported into of initial setting (step S51) and substrate 90 and finish to confirm (step S52).
When substrate 90 was transported into, control part 6 judged that whether the maintenance to slit jet nozzle 41a finishes (step S53), under the situation of carrying out the maintenance of slit jet nozzle 41a, judged also whether the maintenance to slit jet nozzle 41b finishes (step S54).That is, the substrate board treatment 1 of this form of implementation be before any can use in slit jet nozzle 41a and slit jet nozzle 41b, on one side repeating step S53, S54, processing to be applied such as one side.
Under the spendable situation of slit jet nozzle 41a (being "Yes" among the step S53), beginning is handled (step S55) by the coating that slit jet nozzle 41a carries out; Under the spendable situation of slit jet nozzle 41b (being "Yes" among the step S54), beginning is handled (step S56) by the coating that slit jet nozzle 41b carries out.Like this, be called " target slit jet nozzle " with being selected as the slit jet nozzle that substrate 90 is applied processing among slit jet nozzle 41a and the slit jet nozzle 41b.And, the coating of being undertaken by the target slit jet nozzle handle and first form of implementation in the coating processing that illustrates identical, so omit its explanation.
(be "Yes" among the step S61) when the coating processing of being undertaken by the object slit jet nozzle finishes, control part 6 increases progressively the access times of target slit jet nozzle.So-called access times are meant the inside cleaning treatment since last time, and this target slit jet nozzle applies the number of times of processing continuously.Like this, in the processing afterwards, control part 6 can learn that slit jet nozzle 41a, 41 has carried out the coating processing of how many times continuously.
Then, control part 6 begins safeguard to handle (step S62), and what monitor substrate 90 simultaneously transports end (step S63).That is, handle, do not wait it to finish just to proceed coating and handle though the substrate board treatment 1 of this form of implementation is begun to safeguard by step S62.
Figure 12 is the flow chart of the action of the maintenance processing of expression the 3rd form of implementation.In safeguarding processing, at first, carry out slit jet nozzle inspection (step S71).So-called slit jet nozzle inspection is meant the processing of the slit jet nozzle of determining to safeguard processing, in this form of implementation, and the slit jet nozzle (target slit jet nozzle) that the coating before selecting to carry out is handled.
When having determined the target slit jet nozzle, control part 6 judges whether to have used stipulated number (step S72) with reference to the access times of this target slit jet nozzle of being added up.Stipulated number as at this moment judgment standard is imported in advance and is set by the operator as the maintenance condition.Control part 6 is by with reference to be stored in this setting value in the storage part 61, the judgement of steps performed S72 as stipulated number.
Under the situation of having used stipulated number, control part 6 control linear motors 50,51 make the target slit jet nozzle move to the top (step S73) of the 86a of pre-coated mechanism (the perhaps 86b of pre-coated mechanism).And, when the mobile end of target slit jet nozzle, carry out inner cleaning treatment (step S74).The inside cleaning treatment of step S74 be and first form of implementation in the roughly the same processing of step S102 to S104 (Fig. 7), so omit its explanation.
On the other hand, also do not using under the situation of stipulated number, in order to omit inner cleaning treatment, skips steps S73, S74.
Then, control part 6 control linear motors 50,51 make the target slit jet nozzle move to the top (step S75) of standby jar 85a (perhaps standby jar 85b).And, when the mobile end of target slit jet nozzle, carry out exterior washings and handle (step S76).The exterior washings of step S76 is treated to the roughly the same processing of step S106 to S107 (Fig. 7) with first form of implementation, its explanation of Therefore, omited.
Like this, for having carried out slit jet nozzle 41a, 41b that the stipulated number coating is handled continuously, control part 6 continuously it is carried out inner cleaning treatment (step S74) after this coating processing finishes and exterior washings is handled (step S76).On the other hand, also do not reach slit jet nozzle 41a, the 41b of stipulated number, after coating is handled, only carry out exterior washings processing (step S76) for continuous access times.Like this, in the substrate board treatment 1 of this form of implementation, control part 6 is carried out suitably necessary maintenance corresponding to the maintenance condition, thereby can normally keep the state of slit jet nozzle 41a, 41b.
When the exterior washings processing finished, control part 6 control elevating mechanism 43a, 44a (perhaps elevating mechanism 43b, 44b) descended the target slit jet nozzle, and leading section is entered in the standby jar 85a (or standby jar 85b).That is, make the target slit jet nozzle move to position of readiness (step S77).
Like this, safeguard that processing finishes.As previously mentioned, though safeguard that processing by step S62 (Figure 11) beginning, does not wait it to finish just to continue to apply processing.Therefore, do not finish, when transporting of substrate 90 finished, judge whether also to exist substrate 90 to be processed (step S64), under the situation that the substrate 90 that also should implement to apply processing exists, return step S52 (Figure 10) and repeat to handle even safeguard to handle.
But, can not apply processing owing to become the slit jet nozzle 41a, the 41b that safeguard to handle object, thus from specific by step S71 be the target slit jet nozzle to processing tailend of step S77, the state of this target slit jet nozzle is " in the maintenance ".In step S53, S54 (Figure 10), control part 6 determines to apply next time slit jet nozzle 41a, the 41b of processing with reference to described state.
Like this, the substrate board treatment 1 of this form of implementation, owing to have a plurality of slit jet nozzle 41a, 41b, so, can both apply processing as long as can use any (any is "Yes" among step S53, the S54).Therefore, on one side a slit jet nozzle is carried out the maintenance that needs the long period as inner cleaning treatment, can continue coating by another slit jet nozzle on one side and handle, thereby can improve the treatment effeciency of substrate 90.
In addition, the substrate board treatment 1 of this form of implementation, though can safeguard processing concurrently to slit jet nozzle 41a, 41b, in this case, the either party safeguard that processing finishes before, execution in step S53, S54 wait processing to be applied repeatedly.
In step S64, judge when not having the substrate 90 that to handle when substrate board treatment 1, wait for and safeguard that the end of handling also finishes described processing.
As mentioned above, the substrate board treatment 1 of this form of implementation can obtain the effect identical with above-mentioned form of implementation.
In addition, shown in this form of implementation, when the time started of handling from coating, when being used alternatingly slit jet nozzle 41a, 41b, they reach stipulated number substantially simultaneously, and basic simultaneously essential inner cleaning treatment (step S74).In this case, the long period can not be used two slit jet nozzle 41a, 41b.Therefore, for example, also can be, the substrate of initial some only applies processing by slit jet nozzle 41a, begins to be used alternatingly slit jet nozzle 41a, 41b afterwards.
4, the 4th form of implementation
The principle of this form of implementation below is described simply, during only carrying out the coating processing relevant, the resist liquid of supplying with slit jet nozzle 41b is replaced with resist liquid B with resist liquid A by slit jet nozzle 41a.Like this, can guarantee the maintenance time replaced to resist liquid B.
When the replacement to resist liquid B finished, slit jet nozzle 41a and slit jet nozzle 41b alternately applied processing.Like this, can guarantee the maintenance time of the exterior washings processing of each slit jet nozzle 41a, 41b.
In addition, when the coating processing of coating resist liquid A finishes, handle Yi Bian only continue coating, Yi Bian resist liquid A is replaced with resist liquid C by slit jet nozzle 41b.Like this, can guarantee to replace with the maintenance time of resist liquid C.
Like this,, just it can be set as the maintenance condition as long as clearly which kind of resist liquid to handle how many substrates 90 by according to manufacturing planning in advance, thus can the higher operation of efficient.
5, the 5th form of implementation
As the maintenance of carrying out in order to remove the resist liquid that is attached on slit jet nozzle 41a, the 41b, in above-mentioned form of implementation, though mainly outside cleaning treatment is illustrated, the method for removing resist liquid is not limited thereto.
Figure 13 represent the 5th form of implementation that constitutes based on this principle substrate board treatment 1 remove mechanism 75.In Figure 13, remove mechanism 75 though only illustrate one, the substrate board treatment 1 of this form of implementation has two and removes mechanism 75, is configured in the top of standby jar 85a, 85b respectively.
Remove that mechanism 75 has pedestal 750, a pair of scraping got parts 751, feed nut portion 752, ball-screw 753 and not shown rotation motor.
On the surface of (Z) of pedestal 750 side, be fixed with feed nut portion 752.Form the screwed hole that connects along Y direction on as the feed nut portion 752 of the element that roughly is the case shape, ball-screw 753 is threaded in the described screwed hole.
Ball-screw 753 is along the Y-axis configuration, and the length of its Y direction is greater than the length of the Y direction of slit jet nozzle 41a, 41b.And, at an end of ball-screw 753 rotation motor is installed, drive by rotation motor, ball-screw 753 is the center rotation with the axle that is roughly parallel to Y-axis.And pedestal 750 and the illustrated guiding part of omission cooperate, and can not rotate because of the rotation of ball-screw 753.Therefore, when ball-screw 753 rotated by rotation motor, feed nut portion 752 and pedestal 750 and a pair of scraping were got parts 751 and are moved along Y direction together.And rotation motor can be regulated its direction of rotation and rotary speed by the control from control part 6.
The following describes by the mechanism 75 of removing of said structure and remove the method for the resist liquid that is attached on slit jet nozzle 41a, the 41b (below, be called " removing processing ").But, since basic identical at the method for slit jet nozzle 41a, 41b, so here only slit jet nozzle 41a is described.
In the substrate board treatment 1 of this form of implementation, then the exterior washings of slit jet nozzle 41a is handled (processing same with step S106 to S109 shown in Figure 7), remove processing.
At first, control part 6 control linear motor 50,51 and elevating mechanism 43a, 44a make exterior washings handle the slit jet nozzle 41a that has finished and move to the top of removing mechanism 75.In addition, elevating mechanism 43a, 44a make slit jet nozzle 41a descend a little, the leading section of slit jet nozzle 41a is pressed in the mode that meets scrapes on the notch 751a that gets parts 751.
In this state, control part 6 drives rotation motor, makes ball-screw 753 rotations.Like this, scrape and get the leading section that parts 751 are contacting slit jet nozzle 41a, scrape simultaneously and get parts 751 and move along Y direction.Therefore, being attached to attachment on the slit jet nozzle 41a is scraped and gets parts 751 and scrape and get and be removed.
And, in the substrate board treatment 1 of this form of implementation, adopt resin, but can use any material than the material softer that forms slit jet nozzle 41a, 41b as scraping the material of getting parts 751.And, scrape get parts 751 warp-wises (+Z) direction pushing is scraped the element (for example spring or rubber etc.) of getting parts 751 and is installed on the pedestal 750 also passable.
After the scanning of carrying out repeatedly by the number of times of safeguarding condition enactment, control part 6 finishes to remove processing.
As mentioned above, even attending device for to get the mechanism of removing resist liquid as removing scraping of mechanism 75, also can obtain the effect identical with above-mentioned form of implementation.
In addition, replace scraping getting parts 751, use fabric wiper member also can realize removing processing.In this case, can wipe the resist liquid that adheres to by the wiper member of crimping roller shape.
6, variation
Above although understand form of implementation of the present invention, but the invention is not restricted to above-mentioned form of implementation, all distortion can be arranged.
For example, also can so constitute, promptly in any of slit jet nozzle 41a, 41b, before essential the maintenance, as the substrate board treatment 1 of first form of implementation, the coating of alternately carrying out being implemented by slit jet nozzle 41a, 41b is handled, simultaneously under essential situation about safeguarding, as the substrate board treatment 1 of second form of implementation, use maintenance-free that slit jet nozzle to carry out and handle.
And, cleaning fluid the ejection 83a of mechanism, 83b and the 86a of pre-coated mechanism, 86b respectively do for oneself 1 also passable.The side section of the main part 2a of the substrate board treatment 1 that Figure 14 constitutes based on this principle for expression is with the view of the main composition element relevant with the coating action of resist liquid.Main part 2a shown in Figure 14 is not provided with cleaning fluid ejection 83b of mechanism and the suitable formation of the 86b of pre-coated mechanism with the substrate board treatment 1 of above-mentioned form of implementation.Even in this structure, for example also can carry out action as the substrate board treatment 1 of second form of implementation.That is, apply processing by slit jet nozzle 41a usually, must dismantle slit jet nozzle 41a under the situation that maintenance wait to recover safeguards, make slit jet nozzle 41a bigger keep out of the way after, the coating of carrying out being implemented by slit jet nozzle 41b is handled.At this moment, being maintained in the opening 32a in the action of slit jet nozzle 41b carried out.Promptly, slit jet nozzle 41b be in standby jar 85a above under the state of standby, carry out the cleaning of slit jet nozzle 41b by the cleaning fluid ejection 83a of mechanism ejection cleaning fluid, carry out using the pre-coated 86a of mechanism under the situation of pre-coated processing at slit jet nozzle 41b simultaneously.By this structure, also can obtain the effect identical with the substrate board treatment 1 of for example second form of implementation.
And a plurality of slit jet nozzle 41a, the 41b longitudinally mutual difference of width of (Y direction) are also passable.In this case, substrate board treatment 1 can be tackled the different substrate of width.
Claims (9)
1. substrate board treatment, the area of application coating predetermined process liquid at substrate is characterized in that, comprising:
Holding device, it keeps a substrate;
A plurality of slit jet nozzles, it is to the roughly whole zone of the area of application of the aforesaid base plate that is kept by aforementioned holding device, sprays aforementioned predetermined process liquid from the ejiction opening of linearity;
Feed mechanism, it supplies to aforementioned a plurality of slit jet nozzle with aforementioned predetermined process liquid;
Lowering or hoisting gear, it makes the lifting independently respectively of aforementioned a plurality of slit jet nozzle;
Mobile device, it makes the aforesaid base plate that kept by aforementioned holding device and aforementioned a plurality of slit jet nozzle respectively independently along relatively moving on the direction on aforesaid base plate surface;
Attending device, the maintenance that it is stipulated aforementioned a plurality of slit jet nozzles.
2. substrate board treatment as claimed in claim 1 is characterized in that aforementioned attending device has cleaning device, and its cleaning fluid by regulation cleans the slit jet nozzle that aforesaid base plate is not being sprayed.
3. substrate board treatment as claimed in claim 2 is characterized in that, aforementioned cleaning device has respectively independently cleaning solution supplying path with respect to aforementioned a plurality of slit jet nozzles.
4. substrate board treatment as claimed in claim 1 is characterized in that aforementioned attending device also has air-cleaning device, and its slit jet nozzle that never aforesaid base plate is being sprayed is removed air.
5. substrate board treatment as claimed in claim 1 is characterized in that, aforementioned feed mechanism has respectively independently treatment fluid feed path with respect to aforementioned a plurality of slit jet nozzles.
6. substrate board treatment as claimed in claim 1 is characterized in that also having:
Acquisition device, it obtains the maintenance condition;
Storage device, the maintenance condition that its storage is obtained by aforementioned acquisition device;
Control device, it controls aforementioned attending device based on the maintenance condition that is stored in the aforementioned storage device.
7. substrate board treatment as claimed in claim 1, it is characterized in that, at each of aforementioned a plurality of slit jet nozzles, also have the determinator of measuring with by the interval between the aforesaid base plate of aforementioned holding device maintenance, aforementioned lowering or hoisting gear makes aforementioned a plurality of slit jet nozzle lifting corresponding to the testing result of aforementioned determinator.
8. substrate board treatment as claimed in claim 1 is characterized in that, aforementioned mobile device is a linear motor.
9. substrate board treatment as claimed in claim 1 is characterized in that, aforementioned a plurality of slit jet nozzles comprise the mutual different slit jet nozzle of width longitudinally.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004015823 | 2004-01-23 | ||
| JP2004015823 | 2004-01-23 | ||
| JP2004341546 | 2004-11-26 | ||
| JP2004341546A JP4490797B2 (en) | 2004-01-23 | 2004-11-26 | Substrate processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1644246A true CN1644246A (en) | 2005-07-27 |
| CN1321748C CN1321748C (en) | 2007-06-20 |
Family
ID=34889297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100046580A Active CN1321748C (en) | 2004-01-23 | 2005-01-21 | Substrate processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4490797B2 (en) |
| KR (1) | KR100711069B1 (en) |
| CN (1) | CN1321748C (en) |
| TW (1) | TWI296211B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20050076760A (en) | 2005-07-27 |
| JP2005230807A (en) | 2005-09-02 |
| KR100711069B1 (en) | 2007-04-24 |
| JP4490797B2 (en) | 2010-06-30 |
| TW200533427A (en) | 2005-10-16 |
| TWI296211B (en) | 2008-05-01 |
| CN1321748C (en) | 2007-06-20 |
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