CN1855416A - Substrate processing device - Google Patents
Substrate processing device Download PDFInfo
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- CN1855416A CN1855416A CN 200610073620 CN200610073620A CN1855416A CN 1855416 A CN1855416 A CN 1855416A CN 200610073620 CN200610073620 CN 200610073620 CN 200610073620 A CN200610073620 A CN 200610073620A CN 1855416 A CN1855416 A CN 1855416A
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Abstract
The invention discloses a base disposing mechanism from base to support table or through elevating the support table, which comprises the following parts: first support pin (33) to contact with periphery of base (90), second support pin (34) to contact with center part of base, wherein the bottom of first support pin is set on the sliding touching board (352) of elevating board (351); the bottom of second supporting pin is supported by elevated tightening component (354), which is improved by sliding touching board (353) on the elevating board to support freely within regulated scale; the size of second support pin and upper and lower direction of improved tightening component equals the size from keeping surface (30) to fixing board (350).
Description
Technical field
The present invention relates to a kind ofly substrate be moved into the technology of brace table and the technology of taking out of substrate from brace table substrate being loaded into when handling on the brace table.
Background technology
Proposed a kind of by brace table horizontal support substrate and substrate is implemented the substrate board treatment of various processing in the prior art.In this substrate board treatment, be provided with a plurality of supporting pins of lifting, the substrate of moving into is loaded on a plurality of supporting pins of rising, descends and is embedded in the brace table by this supporting pin, thereby be loaded on the brace table.In addition, the substrate that processing finishes rises by supporting pin and is outstanding upward from brace table, thereby is lifted and take out of from this brace table.
By this structure, when being loaded into substrate on the brace table, if the back side of substrate is level, then the air between substrate and the brace table is not suitably removed, moment substrate be in unsteady state, the situation that exists the " loaded " position that produces substrate to be offset.In addition, when being in when being detained air state between substrate and the brace table, in a substrate, produce the part that directly contact with brace table and and brace table between form the part of air layer, pyroconductivity changes and the irregular situation of generation processing so for example have.
In addition, when brace table lifts substrate, when will be with substrate with level (simultaneously) when lifting, because (particularly central portion) air suitably flows between substrate and brace table, so produce the situation of substrate breakage with whole base plate.
Therefore, when the loading that carries out substrate moves and lift action, the substrate slight curvature is carried out.That is, when carrying out these actions, preferably the upper end position of an a plurality of supporting pins part is different.
On the other hand, under the situation of substrate being carried out heat treatment apparatus that temperature adjustment handles and cooling processing device or be subjected to easily under the situation of the device (for example application processing apparatus) that the soup of heat distribution influence handles, the heat distribution of preferred brace table institute substrate supported is even.Therefore, be preferably as follows state: the height and position of the upper end of a plurality of supporting pins of decline is equal to each other, and the height and position of the maintenance face of these height and positions and brace table equates.That is, preferably the back side of handled substrate equates with the spatial volume in the gap of supporting pin or maintenance face state of contact or supporting pin and substrate formation.
In order to realize above-mentioned condition simultaneously, need make a plurality of supporting pins independently carry out lifting.As a method that is used to realize it, can consider to make a plurality of supporting pin liftings by a plurality of driving mechanisms independently.The for example record in patent documentation 1 of this technology.
In addition, such technology has been proposed also: the lifter plate of a plurality of supporting pins of lifting is separated from the lower end of a plurality of supporting pins in the position of regulation, when making each supporting pin be supported on the brace table, do not drop to the below (patent documentation 2) of maintenance face.
Patent documentation 1:JP spy opens flat 08-241918 communique;
Patent documentation 2:JP spy opens the 2000-237983 communique.
But, in the technology that above-mentioned patent documentation 1 is put down in writing, because a plurality of driving mechanisms are set, so the problem that exists the cost of device to increase.
In addition, in the technology that above-mentioned patent documentation 2 is put down in writing,,, need so that the problem that the mode that substrate does not float is adsorbed so exist base plate supports during on the brace table because the loading force that supporting pin utilizes spring is by the back side that is pressed in substrate.
Summary of the invention
The present invention is in view of the above problems and proposes, and its purpose is to provide a kind of makes substrate suitably be supported on the brace table, substrate is being loaded on the brace table or the also suitable mechanism of treatment substrate when brace table lifts simultaneously during the treatment substrate.
For solving above-mentioned problem, substrate board treatment of the present invention is the substrate board treatment that substrate is handled, and it is characterized in that having: brace table, and it is the approximate horizontal state with base plate supports when carrying out above-mentioned processing; First supporting pin and second supporting pin, its rear side from the upper surface of above-mentioned brace table are inserted into the through hole on the upper surface that is arranged on above-mentioned brace table, by to the outstanding and supporting substrate in the top of above-mentioned upper surface; The pin supporting mechanism, it freely supports above-mentioned first supporting pin and above-mentioned second supporting pin with respect to above-mentioned brace table lifting; A driving mechanism, it makes above-mentioned first supporting pin and above-mentioned second supporting pin move between lifting position and down position respectively via above-mentioned pin supporting mechanism, above-mentioned second supporting pin is when being loaded into substrate on the above-mentioned brace table, arrive above-mentioned down position prior to above-mentioned first supporting pin, on the other hand, when the substrate that above-mentioned brace table is being supported rises, be later than the top that above-mentioned first supporting pin is projected into above-mentioned upper surface, above-mentioned pin supporting mechanism all is under the state of above-mentioned down position at above-mentioned first supporting pin and above-mentioned second supporting pin, support the lower end of above-mentioned first supporting pin and the lower end of above-mentioned second supporting pin respectively, so that the height and position of the upper end of the height and position of the upper end of above-mentioned first supporting pin and above-mentioned second supporting pin all is substantially equal to the height and position of above-mentioned upper surface.
In addition, substrate board treatment of the present invention is characterized in that, above-mentioned pin supporting mechanism has: board member, its actuating force with an above-mentioned driving mechanism are delivered to above-mentioned first supporting pin and above-mentioned second supporting pin; Improve strenthening member, it supports the lower end of above-mentioned second supporting pin; Fixed component, it is under the state of above-mentioned down position at above-mentioned second supporting pin, supports above-mentioned raising strenthening member, and above-mentioned raising strenthening member is not under the state of above-mentioned down position at above-mentioned second supporting pin, is supported by above-mentioned board member.
In addition, substrate board treatment of the present invention is characterized in that, above-mentioned pin supporting mechanism has: board member, its actuating force with an above-mentioned driving mechanism are delivered to above-mentioned first supporting pin and above-mentioned second supporting pin; Fixed component, it is under the state of above-mentioned down position at above-mentioned second supporting pin, connects the lower end that above-mentioned board member supports above-mentioned second supporting pin.
In addition, substrate board treatment of the present invention is characterized in that, above-mentioned pin supporting mechanism has: board member, its actuating force with an above-mentioned driving mechanism are delivered to above-mentioned first supporting pin and above-mentioned second supporting pin; Fixed component, it is under the state of above-mentioned down position at above-mentioned second supporting pin, supports the lower end of above-mentioned second supporting pin, and above-mentioned second supporting pin has the support portion of being supported by above-mentioned board member under the state of above-mentioned down position not being in.
In addition, substrate board treatment of the present invention is characterized in that, above-mentioned pin supporting mechanism has: board member, and it is provided with first supporting surface that supports above-mentioned first supporting pin and second supporting surface that supports above-mentioned second supporting pin; Cam follower, it is installed on the above-mentioned board member; Cam, it is provided with the cam path of the moving direction that is used to limit above-mentioned cam follower, the tilted shape of above-mentioned first supporting surface and above-mentioned second supporting surface forms as follows: when substrate is loaded into above-mentioned brace table, above-mentioned second supporting pin arrives above-mentioned down position prior to above-mentioned first supporting pin, on the other hand, when the substrate that above-mentioned brace table is being supported rises, above-mentioned second supporting pin is later than the top that above-mentioned first supporting pin is projected into above-mentioned upper surface, all be under the state of above-mentioned down position at above-mentioned first supporting pin and above-mentioned second supporting pin, the height and position of the upper end of the height and position of the upper end of above-mentioned first supporting pin and above-mentioned second supporting pin all is substantially equal to the height and position of above-mentioned upper surface.
In addition, substrate board treatment of the present invention, it is characterized in that, above-mentioned pin supporting mechanism has board member, this board member is provided with first supporting surface that supports above-mentioned first supporting pin and second supporting surface that supports above-mentioned second supporting pin, and transmit the actuating force of general horizontal direction from above-mentioned driving mechanism, the tilted shape of above-mentioned first supporting surface and above-mentioned second supporting surface forms as follows: when substrate is loaded into above-mentioned brace table, above-mentioned second supporting pin arrives above-mentioned down position prior to above-mentioned first supporting pin, on the other hand, when the substrate that above-mentioned brace table is being supported rises, above-mentioned second supporting pin is later than the top that above-mentioned first supporting pin is projected into above-mentioned upper surface, all be under the state of above-mentioned down position at above-mentioned first supporting pin and above-mentioned second supporting pin, the height and position of the upper end of the height and position of the upper end of above-mentioned first supporting pin and above-mentioned second supporting pin all is substantially equal to the height and position of above-mentioned upper surface.
In addition, substrate board treatment of the present invention, it is characterized in that, the tilted shape of above-mentioned first supporting surface and above-mentioned second supporting surface forms as follows: all be under the state of above-mentioned lifting position at above-mentioned first supporting pin and above-mentioned second supporting pin, the height and position of the upper end of the height and position of the upper end of above-mentioned first supporting pin and above-mentioned second supporting pin about equally.
In addition, substrate board treatment of the present invention is characterized in that, above-mentioned second supporting pin utilizes the deadweight of the aforesaid substrate supported and shrinks on long axis direction when supporting substrate.
In addition, substrate board treatment of the present invention is characterized in that, above-mentioned first supporting pin and above-mentioned second supporting pin serve as that axle rotation is freely supported with the lifting direction.
In addition, substrate board treatment of the present invention is characterized in that, at above-mentioned down position, the lower end of the lower end of above-mentioned first supporting pin and above-mentioned second supporting pin is supported in the mode of sliding contact.
In addition, substrate board treatment of the present invention is characterized in that, above-mentioned brace table has a plurality of steady pins of supporting substrate.
In the present invention, second supporting pin, when being loaded into substrate on the brace table, arrive down position earlier than first supporting pin, on the other hand, when brace table institute substrate supported is risen, some are projected into the top of upper surface late than first supporting pin, the pin supporting mechanism supports the lower end of first supporting pin and the lower end of second supporting pin respectively, so that all be under the state of down position at first supporting pin and second supporting pin, the height and position of the upper end of the height and position of the upper end of first supporting pin and second supporting pin all is substantially equal to the height and position of upper surface, thereby does not need first supporting pin and second supporting pin by being pressed on the brace table institute substrate supported.That is, because inhibitory action is in the active force of substrate, so can suppress the fracture of substrate.
In the present invention, by transmit the actuating force of general horizontal direction from a driving mechanism, increase thereby install the degree of freedom that designs.
In the present invention, the tilted shape of first supporting surface and second supporting surface is all to be under the state of lifting position at first supporting pin and second supporting pin, the upper end height and position mode about equally of the height and position of the upper end of first supporting pin and second supporting pin forms, thereby because at lifting position horizontal support substrate, so can suppress to be applied to bending stress on the substrate.Therefore can prevent the fracture of substrate.
In the present invention, first supporting pin and second supporting pin are freely supported by with the lifting direction serving as the axle rotation, thereby be applied to the stress on first supporting pin and second supporting pin in the time of can being suppressed at lifting, therefore can prevent the distortion and the breakage of first supporting pin and second supporting pin.
In the present invention, by in down position, the lower end of the lower end of first supporting pin and second supporting pin is supported in the mode of sliding contact, thereby is in the lower end of first supporting pin and the lower end of second supporting pin lets loose in the state of horizontal direction.Therefore, be applied to the stress on first supporting pin and second supporting pin in the time that lifting can being suppressed at, so can prevent the distortion and the breakage of first supporting pin and second supporting pin.
In the present invention, because brace table has a plurality of steady pins of supporting substrate, thereby can prevent that substrate tightly is adsorbed on the brace table.
Description of drawings
Fig. 1 is the stereogram of the summary of the substrate board treatment that relates to of expression embodiment of the present invention.
Fig. 2 is the pin supporting mechanism in expression first execution mode supports the situation of first supporting pin and second supporting pin in lifting position figure.
Fig. 3 is expression pin supporting mechanism supports the situation of first supporting pin and second supporting pin at down position figure.
Fig. 4 is the pin supporting mechanism of the substrate board treatment in expression second execution mode supports the situation of first supporting pin and second supporting pin in lifting position figure.
Fig. 5 is expression pin supporting mechanism supports the situation of first supporting pin and second supporting pin at down position figure.
Fig. 6 is the pin supporting mechanism of the substrate board treatment in expression the 3rd execution mode supports the situation of first supporting pin and second supporting pin in lifting position figure.
Fig. 7 is expression pin supporting mechanism supports the situation of first supporting pin and second supporting pin at down position figure.
Fig. 8 is the pin supporting mechanism of the substrate board treatment in expression the 4th execution mode supports the situation of first supporting pin and second supporting pin in lifting position figure.
Fig. 9 is illustrated in the 4th execution mode, the figure of the intermediateness that first supporting pin and second supporting pin move between lifting position and down position.
Figure 10 is the pin supporting mechanism in expression the 4th execution mode supports the situation of first supporting pin and second supporting pin at down position figure.
Figure 11 is the figure of the substrate board treatment in expression the 5th execution mode.
Figure 12 is the figure on the top of second supporting pin in expression the 5th execution mode.
Figure 13 is the figure of the substrate board treatment in expression the 6th execution mode.
Figure 14 is the figure of the pin supporting mechanism in the expression variation.
Figure 15 is the figure of the pin supporting mechanism in the expression variation.
Figure 16 is that expression is by short pin and the figure of the existing heater that makes substrate elevating of having strong market potential.
Embodiment
Below, for preferred forms of the present invention, in the reference accompanying drawing, be elaborated.
1, first execution mode
Fig. 1 is the stereogram of the summary of the substrate board treatment 1 that relates to of expression embodiment of the present invention.In addition, in Fig. 1, for the ease of diagram and explanation, as give a definition: Z-direction is represented vertical direction, and XY represents horizontal plane in the plane, but these define for the ease of holding the position relation, are not all directions that limit following explanation.To following accompanying drawing also is same.
The upper surface of objective table 3 is made horizontal plane, and it is the maintenance face 30 with approximate horizontal state supporting substrate 90.Distribute on maintenance face 30 and be formed with not shown a plurality of vacuum suction mouths, when being loaded into substrate 90 on the maintenance face 30 etc., absorption substrate 90 also remains on the horizontal level of regulation.In addition, in the substrate board treatment 1 of present embodiment, in case kept after 90s just the stopping of substrate to adsorb, this detailed content is narrated in the back.
In the maintenance face 30, be set with a pair of rail 31 of advancing that on general horizontal direction, extends in parallel at both ends across the retaining zone of substrate 90 (zone that keeps substrate 90).The rail 31 of advancing is that the most not shown back-up block of below that will be fixedly installed on the both ends of portal structure 4 constitutes moving (moving direction being defined as the direction of regulation) and portal structure 4 being supported on the linear guide spare of the top of maintenance face 30 of guiding portal structure 4 together.
In the maintenance face 30 of main body 2, retaining zone (X) the direction side is provided with opening 32.Opening 32 and gap nozzle 41 have long axis direction in Y direction equally, and the long axis direction same length of this long axis direction length and gap nozzle 41.
In Fig. 1, omit diagram, but the inside of the main body 2 below opening 32 is provided with the preparation applying mechanism of the state normalization that is used for making gap nozzle 41 and is used to suppress the standby container etc. of drying of the gap nozzle 41 of standby.The standby container is also using when liquid against corrosion is discharged liquid against corrosion with pump (not shown).
Above objective table 3, be provided with the portal structure 4 that is set up from the two side portions approximate horizontal ground of this objective table 3.Portal structure 4 mainly is made of with the elevating mechanism 43,44 that supports its two ends the nozzle support portion 40 that with for example carbon fiber-reinforced resin is aggregate.
In the time of the surface of gap nozzle 41 scanning substrates 90, the liquid of being supplied with against corrosion is ejected into the zones (hereinafter referred to as " liquid the area of application against corrosion ") of substrate 90 surface regulations, thus to substrate 90 coatings liquid against corrosion.In addition, so-called liquid the area of application against corrosion is meant the zone that will apply liquid against corrosion on the surface of substrate 90, has normally removed along the zone in the Rack zone of ora terminalis from whole base plate 90.
Elevating mechanism was connected with gap nozzle 41 by nozzle support portion 40 in the both sides of gap nozzle 41 in 43,44 minutes. Elevating mechanism 43,44 mainly is made of AC servo motor 43a, 44a and not shown ball screw, based on the control signal from control part 8, generates the lifting actuating force (actuating force of Z-direction) of portal structure 4.Thus, elevating mechanism 43,44 makes gap nozzle 41 translations ground lifting.In addition, elevating mechanism 43,44 also is used to adjust the posture of gap nozzle 41 in the YZ plane.
Both ends at portal structure 4, being set with a pair of AC respectively along the edge side of the both sides of objective table 3 does not have linear motor unshakable in one's determination (being designated hereinafter simply as " linear motor ") 50,51, and it has fixture (stator) 50a and moving member 50b and fixture 51a and moving member 51b respectively.
In addition, be set with the linear encoder 52,53 that has conversion portion and detection piece respectively respectively at the both ends of portal structure 4. Linear encoder 52,53 detects the position of linear motor 50,51.These linear motors 50,51 and linear encoder 52,53 main compositions are used to make portal structure 4 by the travel mechanism of advancing rail 31 guiding and moving on objective table 3.
In addition, in the structure of control part 8,, temporarily store the RAM of data, the ROM that reads special use and disk set etc. and relatively meet as the concrete example of storage part 81.But storage part 81 also can be by storage medium and these reading device replacement uses such as portable photomagneto disk and storage cards.In addition, button and Switch (comprising keyboard and mouse etc.) etc. are corresponding to operating portion 82, but the function that has both display part 83 as touch panel display is also passable.LCD and various lamps etc. are corresponding to display part 83.
Fig. 2 is the pin supporting mechanism 35 in expression first execution mode supports the situation of first supporting pin 33 and second supporting pin 34 in lifting position figure.In addition, Fig. 3 is expression pin supporting mechanism 35 supports the situation of first supporting pin 33 and second supporting pin 34 in lifting position figure.In addition, in Fig. 2 and Fig. 3, represent objective table 3 and lifter plate 351 with section.
As shown in Figure 2, first supporting pin 33 and second supporting pin 34 are inserted into the through hole 300 of the upper surface that is arranged on objective table 3 from the rear side (Z direction) of maintenance face 30, come supporting substrate 90 by the top that is projected into maintenance face 30.In addition, as can be seen from Figure 2, substrate board treatment 1 has the back side that touches substrate 90 by the upper end of first supporting pin 33 and second supporting pin 34 respectively, and from (Z) the function of direction supporting substrate 90.
As shown in Figure 3, even first supporting pin 33 and second supporting pin 34 at the state that moves to down position (extreme lower position), also are in the state that is inserted into through hole 300 on it.That is,, can from through hole 300, not extract even first supporting pin 33 and second supporting pin 34 carry out lifting by pin supporting mechanism 35 and driving mechanism 36 yet.Therefore, the position in the XY plane of first supporting pin 33 and second supporting pin 34 is roughly limited by through hole 300.Thus, in substrate board treatment 1, not needing to use other members to fix first supporting pin 33 and second supporting pin 34, just can be that the center rotation is freely supported with the axle parallel with the Z axle.Therefore, for example in lifting action, can suppress to be applied to the external force on first supporting pin 33 and second supporting pin 34.
In addition, in the substrate board treatment 1 of present embodiment, first supporting pin 33 uses than the supporting pin of second supporting pin 34 in the long size of above-below direction.
In addition, in Fig. 2, two first supporting pins 33, second supporting pin 34 are illustrated, the quantity of pin is not limited in this certainly, disposes in the mode that distributes suitable quantity with respect to maintenance face 30.In addition, in the present embodiment, represented that first supporting pin 33 keeps the periphery of substrate 90, the example that second supporting pin keeps the central portion of substrate 90, but the allocation position of first supporting pin 33 and second supporting pin 34 is not only for this.
Pin supporting mechanism 35 has with respect to objective table 3 and fixing tabular fixed head 350 and the tabular lifter plate 351 by driving mechanism 36 lifting on Z-direction, and first supporting pin 33 and second supporting pin 34 are freely being supported with respect to objective table 3 liftings.
Be provided with through hole at sliding contact plate 353, this through hole from (+Z) direction insert to improve the bottom of strenthening member 354.The area of section of the horizontal direction on the top of raising strenthening member 354 is wideer than the open profile area of the through hole of sliding contact plate 353, so that improve strenthening member 354 not through the below.Just, sliding contact plate 353 freely supports in the scope lifting of regulation and improves strenthening member 354.
As shown in Figure 2, improve strenthening member 354 during the lower end is left from fixed head 350, support top by sliding contact plate 353.On the other hand, as shown in Figure 3, when the lower end of improving strenthening member 354 touched fixed head 350, top was left from sliding contact plate 353, improved strenthening member 354 and was supported by fixed head 350 sliding contacts.That is, improve strenthening member 354 by being supported on fixed head 350 or lifter plate 351 (sliding contact plate 353), and determine the position of Z-direction.
As Fig. 2 and shown in Figure 3, the lower end of second supporting pin 34 always contacts with the top upper surface that improves strenthening member 354.Like this, second supporting pin 34 is defined in (Z) direction by improving strenthening member 354.But, improve between the strenthening member 354 and second supporting pin slidably in X-axis and Y direction.
In addition, in substrate board treatment 1, design in the mode that the size of Z-direction and second supporting pin 34 equal when the size of Z-direction adds together from the upper surface of fixed head 350 to the distance of the maintenance face 30 of objective table 3 to improve strenthening member 354.
Driving mechanism 36 is the mechanisms that generated actuating forces by a rotation motor 360, is by rotating driveshaft 361, and the feed nut 362 that screws togather with driving shaft 361 is along mechanism that driving shaft 361 moves.Be set with lifter plate 351 at feed nut 362, with the mobile interlock of feed nut 362, lifter plate 351 carries out lifting in Z-direction.
That is, driving mechanism 36 has been to use the translational drive mechanism of general ball screw, via pin supporting mechanism 35 (lifter plate 351), first supporting pin 33 and second supporting pin 34 is moved respectively between lifting position (Fig. 2) and down position (Fig. 3).In addition, as driving mechanism 36, also can use other known mechanisms.For example, can be to use the mechanism of cylinder.In addition, though the diagram of omission, rotation motor 360 is connected with control part 8, by control signal may command direction of rotation and rotary speed from control part 8.
Use Fig. 2 and Fig. 3 Benq plate processing unit 1 substrate 90 is loaded into objective table 3 maintenance face 30 situation and lift the situation of the substrate 90 of the maintenance face of remaining on 30.
At this, the height and position of the upper end of first supporting pin 33 in the lifting position is called " height and position A ", the height and position of the upper end of second supporting pin 34 in the lifting position is called " height and position B ".In addition, the height and position with maintenance face 30 is called " height and position C ".As shown in Figure 2, height and position A height and position B (+Z) side, the lifting position side of second supporting pin 34 are set lowlyer than the lifting position side of first supporting pin 33.
As mentioned above, at first supporting pin 33 that is in above-mentioned position and be in second supporting pin of lifting position the height and position difference of upper end.Therefore, as shown in Figure 2, substrate 90 be supported under the reclinate state of central portion objective table 30 above.In addition, in the present embodiment, the difference of height of height and position A and height and position B is set in about 1mm.But if the discrepancy of the air between substrate 90 and the maintenance face 30 is smooth and easy and bending stress that be applied to substrate does not have excessive degree, then the difference of height of height and position A and height and position B is not limited in this.
Because the substrate of moving into 90 is loaded into maintenance face 30,, begin to make lifter plate 351 to descend from state shown in Figure 2 so control part 8 makes the rotation motor 360 of driving mechanism 36 begin rotation.Thus, descend owing to support the sliding contact plate 352 of the lower end of first supporting pin 33, so first supporting pin 33 begins to descend.In addition, owing to the raising strenthening member 354 of the lower end of supporting second supporting pin 34 also along with the decline of sliding contact plate 353 descends, so second supporting pin 34 also begins to descend.
That is, arrive and fixed head 350 period of contact in the lower end of improving strenthening member 354, the relative position of the upper end of the upper end of first supporting pin 33 and second supporting pin 34 does not change and continues to descend, and substrate 90 keeps the constant decline of posture shown in Figure 2.In addition, substrate 90 is being loaded under the situation of objective table 3, when lifter plate 351 descended, second supporting pin, 34 to the first supporting pins 33 arrived down position (upper end is the position of " height and position C ") earlier.
When lifter plate 351 descends and the upper end of second supporting pin 34 when dropping to the height and position (height and position C) of maintenance face 30, the central portion of 34 substrate supported 90 of second supporting pin is loaded into maintenance face 30.At this moment, because the upper end of first supporting pin 33 is in the position of the upper end that is higher than second supporting pin 34, so the periphery of substrate 90 also is not loaded into maintenance face 30.That is, the central portion of substrate 90 is loaded into maintenance face 30 earlier than periphery.
Dropped in the upper end of second supporting pin 34 under the state of height and position C, the lower end of improving strenthening member 354 contacts with the upper surface of fixed head 350.Can not descend at the state that is supported in fixed head 350 owing to improve strenthening member 354, so even further descend from this state lifter plate 351, second supporting pin 34 does not descend yet, the upper end height and position of second supporting pin 34 maintains height and position C.That is, second supporting pin 34 than first supporting pin, 33 elder generations arrive down position even driving mechanism 36 does not stop, also stopping in this position.
Thus, the upper end of the substrate 90 and second supporting pin 34 can not form air layer in the state that is permanently connected between second supporting pin 34 and substrate 90.
And then when the upper end of lifter plate 351 declines and first supporting pin 33 dropped to the height and position of maintenance face 30, control part 8 stopped driving mechanism 36, stops the decline of lifter plate 351.At this moment, the upper end of the upper end of first supporting pin 33 and second supporting pin 34 all is in height and position C.Therefore, because first supporting pin 33 and second supporting pin 34 all can not become to the outstanding state in the top of maintenance face 30, so as shown in Figure 3, the face that is held 30 that substrate 90 roughly is flat-hand position supports.That is, the periphery of substrate 90 is later than central portion and is held face 30 supports.
Like this, in substrate board treatment 1, substrate 90 is held face 30 from central portion successively to periphery and supports, so the air between substrate 90 and the maintenance face 30 is suitably discharged to periphery.Thus, do not produce air trapping, so can not produce the quick condition of substrate 90 at the central portion back side of substrate 90.Therefore, can positioning accuracy substrate 90 be loaded into maintenance face 30 than the highland.
In addition, in the substrate board treatment 1 of present embodiment, before second supporting pin 34 arrives down position, by begin attraction at maintenance face 30 set adsorption orifices.Thus, because can discharge air between substrate 90 and the maintenance face 30 well, so can further improve the positioning accuracy of substrate 90.
As shown in Figure 3, pin supporting mechanism 35 all is under the state of down position at first supporting pin 33 and second supporting pin 34, support the lower end of first supporting pin 33 and the lower end of second supporting pin 34 respectively, so that the height and position of the upper end of the height and position of the upper end of first supporting pin 33 and second supporting pin 34 all is substantially equal to the height and position of maintenance face 30.Thus, be held under the state that face 30 supports at substrate 90, the upper end of the upper end of first supporting pin 33 and second supporting pin 34 all contacts with substrate 90, not can and substrate 90 between form air layer.Therefore, it is irregular that substrate board treatment 1 can reduce the temperature of the substrate 90 in the processing.
In addition, pin supporting mechanism 35 lower ends by support first supporting pin 33 and second supporting pin 34, and the back side of first supporting pin 33 and 30 substrate supported 90 of second supporting pin 34 and maintenance face is contacted.By this structure, not can (+Z) direction loads first supporting pin 33 and second supporting pin 34, do not need to make (+Z) external force of direction affacts the substrate 90 in the processing.Therefore, need be at (Z) direction absorption substrate 90.Therefore, substrate board treatment 1 stops by the absorption to substrate 90 that attracts to bring after substrate 90 is loaded into maintenance face 30 fully, can suppress to be applied to the stress on the part of substrate 90.Therefore, can further effectively prevent the breakage of substrate.
In addition, keep substrate 90, the opening size of adsorption orifice is increased to a certain degree in order to adsorb.At this moment, run into air layer owing to be in the part of adsorption orifice position in the back side of substrate 90, so become the irregular reason of temperature of bringing out substrate 90.
But substrate board treatment 1 owing to be the attraction that only is used to discharge the air between substrate 90 and the maintenance face 30, attracts the opening size of mouth smaller so can make when mounting substrate 90, and the temperature that can reduce substrate 90 is irregular.
So, when substrate 90 remained on the assigned position of maintenance face 30, substrate board treatment 1 was from gap nozzle 41 ejections liquid against corrosion, and the surface of scanning substrate 90 simultaneously is coated in liquid against corrosion on the surface of substrate 90.Promptly carrying out coating handles.
Then, finish 3 substrate supported of objective table, 90 rising situations (lifting substrate 90 situations from maintenance face 30) are described at the coating processing.
At first, all be in the state (state shown in Figure 3) of down position from first supporting pin 33 and second supporting pin 34, driving mechanism 36 rises lifter plate 351.Thus, sliding contact plate 352,353 begins to rise immediately, and first supporting pin 33 that sliding contact plate 352 is supported begins to rise immediately.On the other hand since the upper surface of sliding contact plate 353 and the top of improving strenthening member 354 from, can not rise immediately so improve strenthening member 354, therebetween, second supporting pin 34 does not rise.
Therefore, when vertical motion began, substrate 90 only rose by first supporting pin 33.Just substrate 90 lift the initial stage of action the time, only lift periphery by first supporting pin, 33 substrate supported 90, the central portion that is supported by second supporting pin 34 is in a direct sum and keeps face 30 state of contact.
With substrate 90 when maintenance face 30 lifts, between substrate 90 and objective table 3, form clearance space.Because this clearance space is in low-pressure state till air fully flows into, (Z) direction applies the state of the load that is produced by atmospheric pressure from surface lateral so substrate 90 becomes.When using pin jack-up substrate 90 reluctantly at this state, substrate 90 might be damaged.But, be that periphery from substrate 90 takes place to the inflow of the air of clearance space, be the state that air enters into the back side easily so the periphery of substrate 90 is compared with central portion.Therefore, the periphery of substrate 90 is compared with central portion and can be picked up safely.
Like this, substrate board treatment 1 begins and the rising of second supporting pin 34 is provided with time-delay between beginning by the rising at first supporting pin 33, can make from and objective table 3 between the part that flows into easily of air rise successively.As long as after the back side of the periphery of enough air inflow substrate 90, also reduce even lift the central portion load.Therefore, substrate board treatment 1 is owing to when lifting substrate 90, can suppress to be applied to the power of substrate 90, so can suppress the breakage of substrate 90.
As mentioned above, the substrate board treatment 1 of first execution mode is when the maintenance face 30 that substrate 90 is loaded into objective table 3, owing to begin to be loaded into earlier maintenance face 30 from the central portion of substrate 90, so can suppress by the float generation of the position deviations that cause of substrate 90.
In addition, because the back side of the substrate 90 in the upper end of the upper end of first supporting pin 33 and second supporting pin 34 and the processing contacts, so compare with the situation that forms the space between the back side of pin and substrate 90, the temperature that can suppress substrate 90 is irregular, therefore the precision of coating processing improves.
In addition, the lower end by supporting first supporting pin 33 and the lower end of second supporting pin 34 do not need the substrate 90 in handling to load first supporting pin 33 and second supporting pins.That is, can not give useless external force from the substrate 90 first supporting pin 33 and 34 pairs of processing of second supporting pin.Therefore do not need to adsorb substrate 90, just can suppress to be applied to the external force of substrate 90, so can prevent the breakage of substrate 90.
In addition,, begin to lift, thereby can suppress the breakage of substrate 90 by periphery from substrate lifting coating from maintenance face 30 when handling the substrate 90 be through with.
And then, since can enough driving mechanisms 36 (rotation motor 360) realize the lifting action of substrate 90, so increase that can the restraining device cost.
2, second execution mode
In the first embodiment, described at the example that forms second supporting pin 34 and raising strenthening member 354 with different members, still, second supporting pin 34 also can be identical member with improving strenthening member 354.
Fig. 4 is the pin supporting mechanism 35a of the substrate board treatment 1a in expression second execution mode supports the situation of first supporting pin 33 and the second supporting pin 34a in lifting position figure.In addition, Fig. 5 is expression pin supporting mechanism 35a supports the situation of first supporting pin 33 and the second supporting pin 34a at down position figure.In addition, in the structure of substrate board treatment 1a, to first execution mode in substrate board treatment 1 same structure put on identical symbol, suitably omit explanation.Also be same in the following embodiments.
Second supporting pin 34a in second execution mode and second supporting pin 34 of first execution mode are same, are the pins of the central portion of supporting substrate 90, but have connecting elements 340 this point differences in the centre of axial region.Insert the axial region of the second supporting pin 34a in the hole that the central portion of this connecting elements 340 is provided with along Z-direction.Connecting elements 340 from the side direction by be fixed on the position of the regulation of the second supporting pin 34a by pressing spring.
In addition, connecting elements 340 also can be used as with the member of the axial region one of the second supporting pin 34a and forms.In addition, in the present embodiment, the upper end of first supporting pin 33 and the second supporting pin 34a is the pad form of general planar, certainly, can be same with first execution mode, be the shape that goes out of point slightly.
The pin supporting mechanism 35a of second execution mode has the lifter plate 351a that is carried out lifting by driving mechanism 36.When lifter plate 351a directly supported the lower end of first supporting pin 33 by upper surface, the lower end position at the second supporting pin 34a on the XY plane was provided with through hole 351b.By this through hole 351b, the bottom of the second supporting pin 34a connects lifter plate 351a, to (Z) direction is outstanding.
The second supporting pin 34a supported by lifter plate 351a by connecting elements 340 and and lifter plate 351a lifting integratedly.On the other hand, be at the second supporting pin 34a under the state of lower end position (upper end is in the state of height and position C), the lower end of the second supporting pin 34a is directly supported by fixed head 350.And, the second supporting pin 34a not lifting under the state that the plate 350 that is fixed supports.
That is, in the substrate board treatment 1a of second execution mode, have and at second supporting pin 34 of first execution mode with improve the roughly the same structure of state that strenthening member 354 is mutually fixedly set.
In the substrate board treatment 1a of second execution mode, also can access the effect roughly the same with the substrate board treatment 1 of first execution mode with said structure.
3, the 3rd execution mode
In the first embodiment, constitute with different members with fixed head 350 improving strenthening member 354, improve strenthening member 354 in lifting position and described with the example that fixed head 350 separates, still, fixed head 350 also can have the function that improves strenthening member 354.
Fig. 6 is the pin supporting mechanism 35b of the substrate board treatment 1b in expression the 3rd execution mode supports the situation of first supporting pin 33 and the second supporting pin 34b in lifting position figure.In addition, Fig. 7 is expression pin supporting mechanism 35b supports the situation of first supporting pin 33 and the second supporting pin 34b at down position figure.
The pin supporting mechanism 35b of the 3rd execution mode has the fixed head 350a of the raising strenthening member 350b that has formed the pin shape.Improve strenthening member 350b and be formed on the upper surface of fixed head 350a with outstanding shape, the upper end has the shape that point slightly goes out.
Lower end at the second supporting pin 34b of the 3rd execution mode is provided with sliding contacting part 341.Because sliding contacting part 341 has the area of section also wideer than the aperture area of through hole 351b, so be configured at the second supporting pin 34b under the state (Fig. 6) of the position also higher, supported by lifter plate 351a and supported by sliding contacting part 341 than down position.
On the other hand, be under the state of height and position C at the second supporting pin 34b, the front end that improves strenthening member 350b contacts with the back side of sliding contacting part 341, and the second supporting pin 34b is supported by fixed head 350a.And and above-mentioned execution mode is same, under the state that the second supporting pin 34b is supported by fixed head 350a, even lifter plate 351a carries out lifting, and the second also not lifting of supporting pin 34b.
As mentioned above, the substrate board treatment 1b of the 3rd execution mode also can obtain the effect same with above-mentioned execution mode.
4, the 4th execution mode
In the above-described embodiment, the example that is supported second supporting pin 34 (34a, 34b) of lower end position by fixed head 350 (350a) has been described, but has been not to only limit to this structure.
Fig. 8 is the pin supporting mechanism 35c of the substrate board treatment 1c in expression the 4th execution mode supports the situation of first supporting pin 33 and second supporting pin 34 in lifting position figure.In addition, Fig. 9 is the figure that is illustrated in the intermediateness that first supporting pin 33 in the 4th execution mode and second supporting pin 34 move between lifting position and down position.In addition, Figure 10 is expression pin supporting mechanism 35c supports the situation of first supporting pin 33 and second supporting pin 34 at down position figure.
The pin supporting mechanism 35c of substrate board treatment 1c has the lifter plate 351c that is driven by driving mechanism 36a, but does not have the structure of the fixed head 350 that is equivalent in the above-mentioned execution mode.
Upper surface at lifter plate 351c is set with the sliding contact plate 352a of the lower end of supporting first supporting pin 33 and the sliding contact plate 353a of the lower end of supporting second supporting pin 34.In addition, lifter plate 351c (+Y) end of side is fixed with the connecting elements 364 of driving mechanism 36a.
Sliding contact plate 352a and lifter plate 351c move integratedly, and upper surface is smooth generally horizontal plane.Therefore, even lifter plate 351c moves in Y direction, the position of the upper end of first supporting pin 33 does not change yet.In addition, sliding contact plate 352a also can be the structure same with the sliding contact plate 352 of first execution mode.In addition and second execution mode same, can be the structure that the upper surface of lifter plate 351c directly supports first supporting pin 33.
Sliding contact plate 353a and lifter plate 351c move integratedly, and its upper surface is formed by last aspect 353b, inclined-plane 353c and subsurface 353d.Last aspect 353b is the different generally horizontal plane of mutual height and position with subsurface 353d, and its difference of height forms in the mode of the difference of height that is substantially equal to " height and position A " and " height and position B ".In addition, inclined-plane 353c is towards (+Y) direction height and position step-down slowly, the inclination angle of the described groove 366b in its inclination angle and back about equally.In addition, inclined-plane 353c (Y) side is connected smoothly with last aspect 353b, (+Y) side is connected smoothly with subsurface 353d.
In addition, from Fig. 8 to Figure 10 as can be known, in the substrate board treatment 1c of present embodiment, the lower end of first supporting pin 33 not only, the lower end of second supporting pin 34 is also always supported by sliding contact.Therefore, identical with first, second execution mode, can suppress to be applied to the external force of first supporting pin 33 and second supporting pin 34.
Driving mechanism 36a also has piston rod 363, connecting elements 364, cam follower 365, grooved cam 366 except cylinder 360a.
Flexible on Z-direction by piston rod 363, to the actuating force of connecting elements 364 transmission Z-directions.
The upper end of piston rod 363 engages with the not shown slotted hole that extends along Y direction that is arranged on connecting elements 364, and so-called slotted hole is installed.Thus, just become such structure, according to the lifting action of piston rod 363, the upper end of piston rod 363 and connecting elements 364 change at the relative position of Y direction, but the relative position of Z-direction does not change.
That is, the lifting distance of the Z-direction of piston rod 363 (flexible distance) is the lifting distance of the Z-direction of connecting elements 364 (lifter plate 351c) always.On the other hand, the position almost fixed of the Y direction of piston rod 363, even lifter plate 351c moves in Y direction, piston rod 363 can be at Y direction and its interlock yet and is moved.
Connecting elements 364 (Y) end of side is fixed on lifter plate 351c, (+Y) end of side is equipped with cam follower 365.Be provided with the groove 366a that forms along the Z direction at grooved cam 366, the Z axle has identical inclination angle with inclined-plane 353c and the groove 366b that forms relatively, to shown in Figure 10, groove 366a and groove 366b are communicated with as Fig. 8.At groove 366a and groove 366b embedding cam follower 365 is arranged.
By this structure, the moving direction of cam follower 365 is stipulated by grooved cam 366 (by the shape of groove 366a and groove 366b).In addition, the moving direction of cam follower 365 is the moving direction of lifter plate 351c.Therefore, cam follower 365 in groove 366a, move during, lifter plate 351c only moves to Z-direction.On the other hand, cam follower 365 in groove 366b, move during, lifter plate 351c also moves to Y direction not only to Z-direction.
Because first supporting pin 33 and second supporting pin 34 are all by the position on the through hole 300 regulation XY directions, so when lifter plate 351c was mobile on Y direction, the relative position of first supporting pin 33 and second supporting pin 34 and lifter plate 351c moved.
Among the pin supporting mechanism 35c in the present embodiment, because the upper surface of sliding contact plate 352a is a generally horizontal plane, so even lifter plate 351c moves in Y direction, first supporting pin 33 is not influenced by it yet.That is, moving of the Z-direction of piston rod 363 is the lifting action of first supporting pin 33 always, so about first supporting pin 33, the influence that not brought by grooved cam 366.
According to above-mentioned structure, the action when the substrate board treatment 1c that the 4th execution mode is described is loaded into objective table 3 with substrate 90.
As shown in Figure 8, piston rod 363 move to (+Z) state of direction is the lifting position that is in present embodiment.At this moment, the lower end of second supporting pin 34 is supported by the subsurface 353d of sliding contact plate 353a, and the height and position of the height and position of the lower end of first supporting pin 33 and the lower end of second supporting pin 34 is near identical.
Since second supporting pin 34 (+Z) axial size is shorter than first supporting pin 33, so its part of lacking in lifting position, is equivalent to the amount of height and position A that the height and position B of the upper end of second supporting pin 34 is lower than the upper end of first supporting pin 33.Even in the present embodiment because first supporting pin 33 is configured in periphery, second supporting pin 34 is configured in central portion, so lifting position substrate 90 be with central portion than the lowland bending state supported.
From state shown in Figure 8, make piston rod 363 to (Z) direction moves, thereby will be loaded into maintenance face 30 by first supporting pin 33 and second supporting pin, 34 substrate supported 90 by driving mechanism 36a.When lifting position began to descend, cam follower 365 moved along groove 366a at piston rod 363.Because groove 366a is provided with along the Z axle, so (initial stage of down maneuver) during this period, lifter plate 351c is only to (Z) direction moves.
Like this, only during Z-direction moves, first supporting pin 33 and second supporting pin 34 do not change with the relative position of pin supporting mechanism 35c at lifter plate 351c.Therefore, substrate 90 descends to keep the constant state of posture shown in Figure 8.
Like this, in the substrate board treatment 1c of the 4th execution mode, the tilted shape of the upper surface of the upper surface of sliding contact plate 352a and sliding contact plate 353a (going up aspect 353b, inclined-plane 353c and subsurface 353d), substrate 90 is being loaded under the situation of objective table 3, the mode that arrives down position with second supporting pin, 34 to the first supporting pins 33 earlier forms (Fig. 9).
Thus, in the present embodiment, substrate 90 is loaded into maintenance face 30 earlier from central portion (by the part of second supporting pin, 34 supports) beginning.Therefore, can suitably carry out the outflow of air at the back side of substrate 90.
The displacement on the Y direction of cam follower 365 when groove 366b moves be first supporting pin 33 and second supporting pin 34 with pin supporting mechanism 35bY direction of principal axis on relative displacement.
Because the upper surface of sliding contact plate 352a is a generally horizontal plane, so even support the lower end of first supporting pin 33 in arbitrary position of this upper surface, the height and position of the upper end of first supporting pin 33 does not change yet.That is, as long as first supporting pin 33 is supported by the upper surface of sliding contact plate 352a, lifter plate 351c exerts an influence at the height and position that moves not the upper end of first supporting pin 33 of Y direction.Therefore, cam follower 365 is during groove 366b moves, and the height and position of the upper end of first supporting pin 33 only changes the lifting distance of piston rod 363.
The subsurface 353d of sliding contact plate 353a is a generally horizontal plane.Therefore and first supporting pin 33 same, also be that the height and position of the upper end of second supporting pin 34 only changes the lifting distance of piston rod 363 during being supported by subsurface 353d for second supporting pin 34.
For the temperature that suppresses to apply the substrate 90 in the processing irregular, preferably the upper end of second supporting pin 34 contacts with the back side of substrate 90, so, just need stop the decline of second supporting pin 34 in case the upper end of second supporting pin 34 drops to after the height and position C of maintenance face 30.
In the present embodiment, when second supporting pin 34 has dropped to down position, be the shape that the mode of the inclined-plane 353c side end of subsurface 353d designs groove 366b with the position of supporting second supporting pin 34.This also we can say the shape (position of the cam follower 365 when second supporting pin 34 drops to down position) according to groove 366b conversely speaking,, the shape (here mainly being the shape of subsurface 353d) of design sliding contact plate 353a.
Driving mechanism 36a also drops to down position in order to make first supporting pin 33 after second supporting pin 34 has dropped to down position, make piston rod 363 decline that maintains the original state always.Thus, cam follower 365 further continues to move along groove 366b, lifter plate 351c to (when Z) direction moves, also to (+Y) direction moves.
During this period, support second supporting pin 34 the lower end the position along with lifter plate 351c in that (+Y) moving of direction, (Y) direction moves in 353c upper edge, inclined-plane.That is, lifter plate 351c along (Z) the direction dropping distance of mobile piston bar 363 only, but the thickness of sliding contact plate 353a only increases the amount of its dropping distance, is in the indeclinable state of height and position of the lower end of second supporting pin 34.That is, inclination angle by making groove 366b and the inclination angle of inclined-plane 353c are roughly the same, thereby the upper end position of second supporting pin 34 is maintained " height and position C ".
In addition, owing to determine these shape, so the position of lower end of supporting second supporting pin 34 is parallel with the motion track of the cam follower 365 that moves at groove 366b relative to the motion track of inclined-plane 353c when mobile on inclined-plane 353c in the mode that the inclination angle of the inclination angle of inclined-plane 353c and groove 366b equates.Therefore, can suppress lifter plate 351c (sliding contact plate 353a) and the stubborn mutually situation of second supporting pin 34.
When the upper end of first supporting pin 33 was height and position C, driving mechanism 36a stopped cylinder 360a, stopped the decline of lifter plate 351c.Thus, as shown in figure 10, all be under the state of down position at first supporting pin 33 and second supporting pin 34, the height and position of the upper end of the height and position of the upper end of first supporting pin 33 and second supporting pin 34 all is substantially equal to the height and position C of maintenance face 30.
In the substrate board treatment 1c of the 4th execution mode, owing to also apply processing with state shown in Figure 10, so can not form air layer between the back side of the upper end of the upper end of first supporting pin 33 and second supporting pin 34 and substrate 90, the temperature that can suppress substrate 90 is irregular.
On the other hand, when 3 substrate supported of objective table 90 were risen, driving mechanism 36a drove cylinder 360a, and piston rod 363 is risen.Thus, cam follower 365 rises along groove 366b, the mode that the lower end of second supporting pin 34 descends with the inclined-plane 353c at sliding contact plate 353a to (+Y) direction of principal axis moves.Therefore, when piston rod 363 began to rise, the height and position of the lower end of second supporting pin 34 did not change, and only first supporting pin 33 is outstanding from maintenance face 30.Thus, at first only the periphery of substrate 90 is picked up.
When state that the lower end that is in second supporting pin 34 is supported by the subsurface 353d of sliding contact plate 353a, rise with the rising of lifter plate 351c in the upper end of second supporting pin 34, and the upper end of second supporting pin 34 is outstanding from maintenance face 30.
Like this, identical with above-mentioned execution mode when lifting substrate 90 in the substrate board treatment 1b of the 3rd execution mode, second supporting pin 34 is later than the top (Fig. 9) that first supporting pin 33 is projected into maintenance face 30.
When the upper end of first supporting pin 33 is in height and position A, when the upper end of second supporting pin 34 was in height and position B, driving mechanism 36a stopped cylinder 360a, finished vertical motion.
As mentioned above, even the substrate board treatment 1c of the 4th execution mode does not use the structure of fixed head 350, also can access the effect same with above-mentioned execution mode.
In addition, if suitably set sliding contact plate 352a and sliding contact plate 353a, also can make first supporting pin 33 and second supporting pin 34 roughly the same in the size of Z-direction at the thickness of Z-direction.At this moment, as first supporting pin 33 and second supporting pin 34, can use shared parts.
In addition, can replace cylinder 360a, identical with other execution modes, even used the structure of motor, ball screw, feed nut also can realize.At this moment, feed nut being installed to slotted hole gets final product.
5, the 5th execution mode
In the above-described embodiment, the length of second supporting pin 34 (34a, 34b) is constant, but also can be for example second supporting pin 34 (34a, 34b) at the size variable of Z-direction.
Figure 11 is the figure of the substrate board treatment 1d of expression the 5th execution mode.Figure 11 represents to sell supporting mechanism 35d supports the state of first supporting pin 33 and the second supporting pin 34c respectively at down position figure.
The substrate board treatment 1d of present embodiment can't help under the state of first supporting pin 33 and second supporting pin, 34 supporting substrates 90 (load of substrate 90 be not applied to these pin on), and first supporting pin 33 and the second supporting pin 34c are roughly the same in the size of Z-direction.Therefore, the lifter plate 351d of the pin supporting construction 35d of present embodiment supports the lower end of first supporting pin 33 and the lower end of the second supporting pin 34c at identical height and position, thereby the mode that can all be in height and position C with the upper end of the upper end of first supporting pin 33 and the second supporting pin 34c supports (Figure 11).
Figure 12 is the figure on the top of the expression second supporting pin 34c.In addition, in Figure 12, show section at lower shaft portion 344.
The second supporting pin 34c of present embodiment is made of upper axis 342 and lower shaft 344.In the bottom of upper axis 342 rubber bodies 343 is installed.Be provided with at the upper surface of lower shaft portion 344 and be hole roughly cylindraceous, the rubber bodies 343 of last axial region 342 is inserted into inside.
By this structure, the second supporting pin 34c when supporting substrate 90, utilize substrate 90 load and (Z) direction shortens only certain-length, under the state of supporting substrate 90 not, the restoring force of utilizing rubber bodies 343 to (+Z) direction is extended.
In substrate board treatment 1d,, make first supporting pin 33 and the second supporting pin 34c rise to lifting position respectively in order to accept substrate 90.At this moment, the upper end of the upper end of first supporting pin 33 and the second supporting pin 34c all is in height and position A.
At this state, when handing-over during substrate 90, only the second supporting pin 34c utilize substrate 90 deadweight and to (Z) direction is shunk, and the upper end of the second supporting pin 34c is in height and position B.That is, substrate 90 is the shape of central portion bending.
In order to be loaded into objective table 3 by first supporting pin 33 and the second supporting pin 34c substrate supported 90, when Drive Structure 36 descended lifter plate 351d, substrate 90 kept the shape of the shape invariance of central portion bending to descend.Therefore, substrate 90 is held face 30 supports from central portion successively to periphery.
The upper end of second supporting pin 34 drops to after the height and position C, because the second supporting pin 34c only extends the amount of the dropping distance of lifter plate 351d, so keep the upper end of the second supporting pin 34c and the back side state of contact of substrate 90.That is, do not form air layer between the substrate 90 and the second supporting pin 34c.
When lifter plate 351d drops to down position, be held the state that face 30 supports fully owing to be in substrate 90, so be in the state that the load of substrate 90 is not applied to the second supporting pin 34c.Therefore, dropped under the state of down position, can not make external force (loading force of rubber bodies 343 etc.) act on substrate 90 from first supporting pin 33 and the second supporting pin 34c at first supporting pin 33.
When coating processing end, when lifting substrate 90, driving mechanism 36 rises lifter plate 351d.At this moment, because first supporting pin 33 is not flexible, so be picked up immediately by the periphery of first supporting pin, 33 substrate supported 90.But the second supporting pin 34c shrinks in that (Z) direction only shortens certain-length, so some are picked up the central portion of substrate 90 late by rubber bodies 343.Thus, under the state that the central portion back side of substrate 90 air has fully flowed into, can lift the central portion of substrate 90.
As mentioned above, in the substrate board treatment 1d of the 5th execution mode, also can access with above-mentioned
The effect that execution mode is same.
In addition, make the flexible mechanism of the second supporting pin 34c also can be arranged on the second supporting pin 34c than the below.That is, can make axial region 342 long in the size of Z-direction.Thus, pars contractilis (movable part) can be configured in the rear side of objective table 3, can suppress the influence of particulate.
In addition, the flexible mechanism of the second supporting pin 34c also can be realized with the mechanism that has used spring.Be that this structure can realize by using elastomer.
6, the 6th execution mode
In the above-described embodiment, driving mechanism 36 (36a) is the mechanism that generates the actuating force of Z-direction, but also can be the structure that drives in the horizontal direction.
Figure 13 is the figure of the substrate board treatment 1e in expression the 6th execution mode.In addition, for the ease of diagram, in Figure 13, omit objective table 3.In addition, be in first supporting pin 33 of lifting position and the position of 34 couples of lifter plate 351e of second supporting pin and represent, be in first supporting pin 33 of down position and the position of 34 couples of lifter plate 351e of second supporting pin and dot with solid line.
In the driving mechanism 36b of present embodiment, driving shaft 361 is along the Y-axis setting, and feed nut 362 moves along Y direction.Thus, lifter plate 351e only moves in Y direction.
The upper surface of sliding contact plate 352b that supports the lower end of first supporting pin 33 forms the inclined-plane 352c certain along the inclination angle of Y direction.By this structure, first supporting pin 33, lifter plate 351e along (when Y) direction of principal axis moves with certain speed, rise with certain speed, along (+when Y) direction moves with certain speed, descend with certain speed.
On the other hand, the upper surface that supports the sliding contact plate 353e of second supporting pin 34 forms the curved surface 353f that changes along the inclination angle of Y direction.Curved surface 353f (Y) side is a generally horizontal plane, become the height and position of part of this generally horizontal plane and sliding contact plate 352b inclined-plane 352c (Y) height and position of side end is roughly sustained height.In addition, curved surface 353f (+Y) height and position of side and sliding contact plate 352b inclined-plane 352c (+Y) height and position of side end is roughly the same.
At first, as at Figure 13 with shown in the solid line, in lifting position, the lower end of first supporting pin 33 by inclined-plane 352c (+Y) side end supports, and utilizes the thickness of the Z-direction of the sliding contact plate 352b in this part, the upper end of first supporting pin 33 is in height and position A.In addition, the lower end of second supporting pin 34 by curved surface 353f (+Y) side end supports, and utilizes the thickness of the Z-direction of the sliding contact plate 353e in this part, the upper end of second supporting pin 34 also is in height and position A.
Therefore, when coming supporting substrate 90 by first supporting pin 33 that is in lifting position and second supporting pin 34, substrate 90 is supported with the approximate horizontal state, can inhibitory action in the stress (mainly being bending stress) of substrate 90.
To will be loaded into the maintenance face 30 of objective table 3 by first supporting pin 33 that is in lifting position and second supporting pin, 34 substrate supported 90, rotation motor 360 rotation, make lifter plate 351e along (+Y) direction moves.
Sliding contact plate 352b and sliding contact plate 353e are towards (Y) direction all is that thickness reduces, so first supporting pin 33 and second supporting pin 34 by lifter plate 351e (+Y) moving of direction and all descending, but because the curved surface 353f angle of heel of sliding contact plate 353e is very steep, so the decrease speed of second supporting pin, 34 sides is fast, arrive down position earlier.
Thus, the central portion of 34 substrate supported 90 of second supporting pin is supported by the maintenance face 30 of objective table 3 earlier.That is, in the present embodiment, when substrate 90 is loaded into maintenance face 30, also become the shape of central portion bending.Therefore, the air at the back side of substrate 90 suitably flows out, and can not produce the phenomenon that substrate 90 floats.
In addition, move in the part of the generally horizontal plane of curved surface 353f owing to arrived the Support Position of second supporting pin 34 of down position, so even like this lifter plate 351e is moved, second supporting pin 34 does not descend yet.That is, because after the upper end of second supporting pin 34 arrived height and position C, the upper end of second supporting pin 34 did not descend, so do not form air layer between the substrate 90 and second supporting pin 34.
Arrive in the Support Position of the lower end of first supporting pin 33 inclined-plane 352c (Y) during side end (when being in the position of representing with chain-dotted line and concern), the stop the rotation rotation of motor 360 of Drive Structure 36b stop lifter plate 351e mobile in Y direction.
When lifting the substrate 90 that coating is through with from maintenance face 30, driving mechanism 36b makes lifter plate 351e along (Y) direction of principal axis moves.
At this moment, because the lower end of the first supporting pin 33 inclined-plane 352c by sliding contact plate 352b begins to rise immediately, so the upper end of first supporting pin 33 also begins to rise immediately.Thus, be picked up immediately by the periphery of first supporting pin, 33 substrate supported 90.
On the other hand, because the Support Position of the lower end of second supporting pin 34 is at the vertical motion initial stage, move in the approximate horizontal face portion of the curved surface 353f of sliding contact plate 353e, so do not rise in the upper end of second supporting pin 34.Therefore, during this period, can not be picked up, compare, be picked up later with periphery by the central portion of second supporting pin, 34 substrate supported 90.Therefore, can after fully flowing into the central portion back side of substrate 90, air be picked up.
As mentioned above, the substrate board treatment 1 of the 6th execution mode also can obtain the effect same with above-mentioned execution mode.
In addition, because different, also can realize by in the horizontal direction driving mechanism 36b, so the degree of freedom increase of device design with driving mechanism 36, the 36a of above-mentioned execution mode.
7, variation
More than, be illustrated at present embodiment, but the present invention is not limited in above-mentioned execution mode, can carry out various distortion.
For example, in the substrate board treatment 1 of first execution mode, improve strenthening member 354 and support the position of second supporting pin 34 and improve the be fixed position of plate 350 supports of strenthening member 354 identical in the XY plane.But the position of support is not limited in this position relation.Figure 14 and Figure 15 are that expression improves the example of second supporting pin 34 is supported in strenthening member 354 in the position of staggering figure.Figure 14 represents to sell supporting mechanism 35f supports first supporting pin 33 and second supporting pin 34 in lifting position situation.In addition, Figure 15 represents to sell supporting mechanism 35f supports first supporting pin 33 and second supporting pin 34 at down position situation.Substrate board treatment 1f and the substrate board treatment 1a in second execution mode in the variation are same, possess the lifter plate 351a with through hole 351b.But in substrate board treatment 1f, the position of the through hole 351b of lifter plate 351a is different with the substrate board treatment 1a of second execution mode.Like this, even support to improve the position of strenthening member 354a and support second supporting pin 34 the position mistake structure of position, also can realize the action same with the substrate board treatment 1 of first execution mode, can obtain same effect.
In addition, in the above-described embodiment, illustrated that the face (maintenance face 30) of supporting substrate 90 is situations of tabular surface, but be not limited in this.When lifting substrate 90, flow into the back side swimmingly in order to make air, can be provided with a plurality of at the upper surface of objective table 3 near pin.At this moment, be equivalent to maintenance face 30 with a plurality of faces that form near the upper end of pin.
In addition, we can say that by first supporting pin 33 and second supporting pin 34 (34a, 34b, 34c) it is that example is illustrated that two stages made substrate 90 liftings, three phases or its above stage can certainly be set.The shape of the length that this structure is sold by the stage decision, the length that improves strenthening member or sliding contact plate waits and realizes.
In addition, substrate board treatment 1 is illustrated as applying device, but also can use in the device of for example other purposes such as heater and cooling device.When being applied to heater, objective table 3 internal heater at substrate board treatment 1 make objective table 3 have the function of heating plate.On this heating plate, load and formed for example substrate 90 of etchant resist, make the etchant resist drying that forms on the surface of this substrate 90.In addition, when being applied to cooling device, in the objective table 3 of substrate board treatment 1, be provided for making the pipe arrangement of cooling water circulation, make objective table 3 have the function of coldplate.On this coldplate, load the substrate 90 that for example heats, this substrate 90 is cooled to for example normal temperature with heater.
Figure 16 is expression by the short pin 101 and 102 figure that make the existing heater 100 of substrate 91 liftings that have strong market potential.Heater 100 adopts when handing-over substrate 91, makes the mechanism of the short pin 101 and the 102 one liftings of having strong market potential by lifter plate 103.Therefore, under the state that lifter plate 103 descends, the front end of short pin 101 is embedded in the inside of lifter plate 104.That is, be loaded at substrate 91 under the state of heating plate 104, between short pin 101 and substrate 91, have blank part 105.
As mentioned above, in heater 100, as shown in figure 16, above short pin 101, there is blank part 105, but do not have the space that is equivalent to blank part 105 on 102 having strong market potential.In this state because according to blank part 105 have or not the pyroconductivity difference, so produce the temperature that the acts on substrate uneven problem that in real estate, becomes.The irregular drying mark that causes etchant resist R of this temperature.
But, when applying the present invention to heater, owing to can not form blank part 105, so can suppress drying mark.In addition, also be same when being applied to cooling device, it is irregular to suppress the irregular processing that causes of temperature.
Claims (11)
1. a substrate board treatment is the substrate board treatment that substrate is handled, and it is characterized in that having:
Brace table, it is the approximate horizontal state with base plate supports when carrying out above-mentioned processing;
First supporting pin and second supporting pin, its rear side from the upper surface of above-mentioned brace table are inserted into the through hole on the upper surface that is arranged on above-mentioned brace table, by to the outstanding and supporting substrate in the top of above-mentioned upper surface;
The pin supporting mechanism, it freely supports above-mentioned first supporting pin and above-mentioned second supporting pin with respect to above-mentioned brace table lifting;
A driving mechanism, it makes above-mentioned first supporting pin and above-mentioned second supporting pin move between lifting position and down position respectively via above-mentioned pin supporting mechanism,
Above-mentioned second supporting pin is when being loaded into substrate on the above-mentioned brace table, arrive above-mentioned down position prior to above-mentioned first supporting pin, on the other hand, when the substrate that above-mentioned brace table is being supported rises, be later than the top that above-mentioned first supporting pin is projected into above-mentioned upper surface
Above-mentioned pin supporting mechanism all is under the state of above-mentioned down position at above-mentioned first supporting pin and above-mentioned second supporting pin, support the lower end of above-mentioned first supporting pin and the lower end of above-mentioned second supporting pin respectively, so that the height and position of the upper end of the height and position of the upper end of above-mentioned first supporting pin and above-mentioned second supporting pin all is substantially equal to the height and position of above-mentioned upper surface.
2. substrate board treatment as claimed in claim 1 is characterized in that,
Above-mentioned pin supporting mechanism has:
Board member, its actuating force with an above-mentioned driving mechanism are delivered to above-mentioned first supporting pin and above-mentioned second supporting pin;
Improve strenthening member, it supports the lower end of above-mentioned second supporting pin;
Fixed component, it is under the state of above-mentioned down position at above-mentioned second supporting pin, supports above-mentioned raising strenthening member,
Above-mentioned raising strenthening member is not under the state of above-mentioned down position at above-mentioned second supporting pin, is supported by above-mentioned board member.
3. substrate board treatment as claimed in claim 1 is characterized in that,
Above-mentioned pin supporting mechanism has:
Board member, its actuating force with an above-mentioned driving mechanism are delivered to above-mentioned first supporting pin and above-mentioned second supporting pin;
Fixed component, it is under the state of above-mentioned down position at above-mentioned second supporting pin, connects the lower end that above-mentioned board member supports above-mentioned second supporting pin.
4. substrate board treatment as claimed in claim 1 is characterized in that,
Above-mentioned pin supporting mechanism has:
Board member, its actuating force with an above-mentioned driving mechanism are delivered to above-mentioned first supporting pin and above-mentioned second supporting pin;
Fixed component, it is under the state of above-mentioned down position at above-mentioned second supporting pin, supports the lower end of above-mentioned second supporting pin,
Above-mentioned second supporting pin has the support portion of being supported by above-mentioned board member under the state of above-mentioned down position not being in.
5. substrate board treatment as claimed in claim 1 is characterized in that,
Above-mentioned pin supporting mechanism has:
Board member, it is provided with first supporting surface that supports above-mentioned first supporting pin and second supporting surface that supports above-mentioned second supporting pin;
Cam follower, it is installed on the above-mentioned board member;
Cam, it is provided with the cam path of the moving direction that is used to limit above-mentioned cam follower,
The tilted shape of above-mentioned first supporting surface and above-mentioned second supporting surface forms as follows: when substrate is loaded into above-mentioned brace table, above-mentioned second supporting pin arrives above-mentioned down position prior to above-mentioned first supporting pin, on the other hand, when the substrate that above-mentioned brace table is being supported rises, above-mentioned second supporting pin is later than the top that above-mentioned first supporting pin is projected into above-mentioned upper surface, all be under the state of above-mentioned down position at above-mentioned first supporting pin and above-mentioned second supporting pin, the height and position of the upper end of the height and position of the upper end of above-mentioned first supporting pin and above-mentioned second supporting pin all is substantially equal to the height and position of above-mentioned upper surface.
6. substrate board treatment as claimed in claim 1 is characterized in that,
Above-mentioned pin supporting mechanism has board member, and this board member is provided with first supporting surface that supports above-mentioned first supporting pin and second supporting surface that supports above-mentioned second supporting pin, and transmits the actuating force of general horizontal direction from an above-mentioned driving mechanism,
The tilted shape of above-mentioned first supporting surface and above-mentioned second supporting surface forms as follows: when substrate is loaded into above-mentioned brace table, above-mentioned second supporting pin arrives above-mentioned down position prior to above-mentioned first supporting pin, on the other hand, when the substrate that above-mentioned brace table is being supported rises, above-mentioned second supporting pin is later than the top that above-mentioned first supporting pin is projected into above-mentioned upper surface, all be under the state of above-mentioned down position at above-mentioned first supporting pin and above-mentioned second supporting pin, the height and position of the upper end of the height and position of the upper end of above-mentioned first supporting pin and above-mentioned second supporting pin all is substantially equal to the height and position of above-mentioned upper surface.
7. as claim 5 or 6 described substrate board treatments, it is characterized in that, the tilted shape of above-mentioned first supporting surface and above-mentioned second supporting surface forms as follows: all be under the state of above-mentioned lifting position at above-mentioned first supporting pin and above-mentioned second supporting pin, the height and position of the upper end of the height and position of the upper end of above-mentioned first supporting pin and above-mentioned second supporting pin about equally.
8. substrate board treatment as claimed in claim 1 is characterized in that, above-mentioned second supporting pin utilizes the deadweight of the aforesaid substrate supported and shrinks on long axis direction when supporting substrate.
9. substrate board treatment as claimed in claim 1 is characterized in that, above-mentioned first supporting pin and above-mentioned second supporting pin serve as that axle rotation is freely supported with the lifting direction.
10. substrate board treatment as claimed in claim 1 is characterized in that, at above-mentioned down position, the lower end of the lower end of above-mentioned first supporting pin and above-mentioned second supporting pin is supported in the mode of sliding contact.
11. substrate board treatment as claimed in claim 1 is characterized in that, above-mentioned brace table has a plurality of steady pins of supporting substrate.
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| JP2005128175 | 2005-04-26 | ||
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| JP2006013493 | 2006-01-23 |
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