CN1171093C - IC testing device - Google Patents

IC testing device Download PDF

Info

Publication number
CN1171093C
CN1171093C CNB991047974A CN99104797A CN1171093C CN 1171093 C CN1171093 C CN 1171093C CN B991047974 A CNB991047974 A CN B991047974A CN 99104797 A CN99104797 A CN 99104797A CN 1171093 C CN1171093 C CN 1171093C
Authority
CN
China
Prior art keywords
tested
mentioned
carriage
proving installation
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB991047974A
Other languages
Chinese (zh)
Other versions
CN1230691A (en
Inventor
Д
中村浩人
齐藤登
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of CN1230691A publication Critical patent/CN1230691A/en
Application granted granted Critical
Publication of CN1171093C publication Critical patent/CN1171093C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Abstract

The subject of this invention is to increase the precision of tested IC position relative to the contact portion. For the IC test apparatus of this invention, the test is performed after input/output terminal HB is pressed on the contact pin 51 of the test head by the IC test device. The hole 23, which is embedded to match with the soldering ball HB of the tested IC, is installed at the inserted device 19 of the test tray for the tested IC.

Description

The IC proving installation
The present invention relates to be used to detect the IC proving installation of semiconductor device (being designated hereinafter simply as IC), particularly relate to and optimize tested IC to the IC of the bearing accuracy of contact site proving installation.
In the IC proving installation that is called as processor (handler), a plurality of IC that are contained on the carriage are transported in the proving installation, each IC and detection head are electrically contacted, in IC proving installation body (hereinafter referred to as tester), test.When end of test (EOT), shift out each IC from detection head, be reapposed over the corresponding carriage of test result on, thus, carry out the differentiation of the kind of so-called high-class product and shoddy goods.
In existing IC proving installation, the carriage (hereinafter referred to as conventional carriage) of IC after being used to hold the preceding IC of test and holding test is dissimilar carriages with the carriage (hereinafter referred to as detecting carriage) that transports that circulates in the IC proving installation, in this IC proving installation, before and after test, carrying out the exchange of IC between conventional carriage and detection carriage places, IC is contacted with detection head in the detection operation that detects, and IC is forced on the detection head being loaded under the state that detects on the carriage.
Relative therewith, use heating plate to wait the IC that is contained on the conventional carriage is applied thermal stress, then, once adsorb a plurality of IC with adsorption head and be transported on the detection head, electrically contact, this type is known.In the detection operation of this IC proving installation, IC is crushed on the detection head under the state that is attracted on the adsorption head.
Therefore, when detecting ball grid array (BGA:Ball Grid Array) type IC, the contact site of detection head 104, as shown in Figure 30, by being formed by spring (not shown) a plurality of contact pilotages 51 that are provided with that stretch, shown in the B portion of Figure 31 like that, on its top, form the corresponding coniform recess 51a of spherical input and output terminal (hereinafter referred to as solder ball HB) with tested IC.In existing IC proving installation, use the peripheral shape of the package assembling PM of IC, carry out tested IC and cooperate with the position of contact pilotage 51.
But the dimensional accuracy of the package assembling PM of chip size packages (CSP:Chip Size Package) etc. is very coarse, and then the positional precision of peripheral shape and solder ball HB not necessarily can be protected.Therefore, when on the periphery of IC package assembling PM, positioning, shown in the C portion of Figure 31 like that, can under the state of solder ball HB skew, be forced on the contact pilotage 51, the danger that solder ball HB is produced damage by the sharp keen top of contact pilotage 51 is just arranged.
Even in the IC except that the chip size encapsulation, for fear of the damage that produces by contact pilotage 51 to solder ball HB, before on the contact pilotage 51 that tested IC is pressed onto detection head, separate tested IC with socket, position thus, thereby have the elongated problem of shift time of IC proving installation.
In view of the above problems, the purpose of this invention is to provide a kind of IC proving installation, can optimize the bearing accuracy of tested IC to contact site.
To achieve these goals, IC proving installation of the present invention is pressed onto the input and output terminal of tested IC on the contact site of detection head, detect, it is characterized in that, the guide piece that contacts and position with the input and output terminal of above-mentioned tested IC is set on the maintenance medium of above-mentioned tested IC.
In IC proving installation of the present invention, the IC package assembling is not positioned, and come the input and output terminal body that is crimped onto on the contact site is positioned with guide piece, therefore, between the maintenance medium of tested IC and tested IC, can not produce error, and significantly improve the bearing accuracy of the input and output terminal of tested IC contact site.Its result, the operation that need not carry out the position correction of tested IC before being pressed onto contact site can shorten the shift time of IC proving installation.
The whole medium that keep this tested IC in during in maintenance medium of the present invention, comprising on the contact site that can be transported to detection head at the tested IC before the detection.
In the IC proving installation of the present invention, above-mentioned maintenance medium are to be used for detection carriage that above-mentioned tested IC is transported to above-mentioned detection head from the loading part of above-mentioned tested IC, and above-mentioned maintenance medium also can be the heating plates that is used for before above-mentioned tested IC is pressed onto above-mentioned contact site above-mentioned tested IC being applied thermal stress.And above-mentioned maintenance medium can also be the IC carriers that circulates in sensing chamber and transport, and are that carrying is moved into the above-mentioned tested IC in the above-mentioned sensing chamber and is transplanted near the above-mentioned detection head IC carrier.Self-evident, in IC proving installation of the present invention, be intended to comprise other maintenance medium except that the adsorption head of conveyer.
The not special restriction of employed in the present invention tested IC comprises the IC of all types, when the input and output terminal that is used for above-mentioned tested IC is a spherical terminal when being so-called ball grid array type IC, and particular significant effect.
Guide piece among the present invention comprises with the input and output terminal of tested IC and contacts the function that it is positioned that its shape, desired location, quantity, material etc. are not particularly limited, and comprise whole types.
In of the present invention one routine IC proving installation, above-mentioned guide piece is the hole with the spherical terminal tabling of ball grid array type IC.In the case, the hole with whole spherical terminal tablings can be set respectively, the hole with several spherical terminal tablings perhaps is set respectively.And, except the device of a spherical terminal and a hole tabling, also can be in a hole end of a chimeric spherical terminal and an end of another spherical terminal.Wherein so-called " hole " is meant and also comprises the meaning that does not connect the recess that keeps medium etc. except the through hole that connect to keep medium.
In another routine IC proving installation of the present invention, above-mentioned guide piece be and two spherical terminals between the projection of tabling.In the case, can be provided with respectively and whole spherical terminal between the projection of tabling, perhaps be provided with respectively and several spherical terminal between the projection of tabling.And, can be and the spherical terminal more than three between the projection of tabling.The shape of this projection is not particularly limited, can be can and spherical terminal between the shape of tabling, still, if taper surface is set or tip size is reduced on its top, can realize better with spherical terminal along sliding chimeric.
In another routine IC proving installation of the present invention, above-mentioned guide piece is the taper surface that engages with above-mentioned spherical terminal.In the case, the taper surface that engages with whole spherical terminals respectively can be set, the taper surface that engages with several spherical terminals respectively also can be set.And, except a spherical terminal with a hole engages, also can in a hole, engage an end of a spherical terminal and an end of another spherical terminal.Various conditions such as the angle of inclination of taper surface and the degree of depth are not particularly limited.
In IC proving installation of the present invention, comprise following various IC proving installation: be depressed into the IC proving installation type on the contact site of detection head at state on the carriage that tested IC is loaded in and keeping the state of tested IC to be depressed into IC proving installation type on the contact site of detection head with adsorption head absorption.
These and other purpose, advantage and feature of the present invention will be in conjunction with the drawings to the description of embodiments of the invention and further specified.In these accompanying drawings:
Fig. 1 is the skeleton view of first embodiment of expression IC proving installation of the present invention;
Fig. 2 is the carriage process flow diagram of the retrieval methods of the tested IC in the IC proving installation of presentation graphs 1;
Fig. 3 is the skeleton view of structure of IC accumulator of the IC proving installation of presentation graphs 1;
Fig. 4 is the skeleton view that is illustrated in employed conventional carriage in the IC proving installation of Fig. 1;
Fig. 5 is the fragmentary, perspective view that is illustrated in employed detection carriage in the IC proving installation of Fig. 1;
Fig. 6 is the decomposition diagram of the structure of pusher, inserter (detection carriage), socket guiding and contact pilotage (socket) in the detection head of presentation graphs 1;
Fig. 7 is the sectional drawing of Fig. 6;
Fig. 8 is the sectional drawing that is illustrated in pusher decline state in the detection head of Fig. 1;
Fig. 9 is the A portion amplification profile diagram of Fig. 8;
Figure 10 is the skeleton view of the IC accommodation section of presentation graphs 9;
Figure 11 is the sectional drawing (figure that is equivalent to the A portion of Fig. 8) of expression an alternative embodiment of the invention;
Figure 12 is the skeleton view of the device guiding of expression Figure 11;
Figure 13 is the sectional drawing (figure that is equivalent to the A portion of Fig. 8) of expression an alternative embodiment of the invention;
Figure 14 is the skeleton view of the device guiding of expression Figure 13;
Figure 15 is the skeleton view of second embodiment of expression IC proving installation of the present invention;
Figure 16 is the sectional drawing of embodiment of the guide piece of the tested IC in the heating plate of expression Figure 15;
Figure 17 is the sectional drawing of another embodiment of the guide piece of the tested IC in the heating plate of expression Figure 15;
Figure 18 is the sectional drawing of another embodiment of the guide piece of the tested IC in the heating plate of expression Figure 15;
Figure 19 is the skeleton view of the 3rd embodiment of expression IC proving installation of the present invention;
Figure 20 is the concept map of retrieval methods of the tested IC in the IC proving installation of expression Figure 19;
Figure 21 is the planimetric map that pattern ground expression is located at the transfer device in the IC proving installation of Figure 19;
Figure 22 is the skeleton view that transports the path that is used for the employed IC carrier of IC proving installation that illustrates at Figure 19;
Figure 23 is the skeleton view that transports the path that is used for the employed IC carrier of IC proving installation that illustrates at Figure 19;
Figure 24 is the planimetric map of detection order of tested IC that is used for the sensing chamber of the IC proving installation that illustrates at Figure 19;
Figure 25 is the sectional drawing along the XXV-XXV line of Figure 21;
Figure 26 is the sectional drawing that is equivalent to Fig. 9 of retrieval methods of tested IC that is used for illustrating the IC proving installation of Figure 19;
Figure 27 is the sectional drawing of embodiment of the guide piece of the tested IC in the IC carrier of expression Figure 23;
Figure 28 is another of guide piece of the tested IC in the IC carrier of expression Figure 23
The sectional drawing of embodiment;
Figure 29 is another of guide piece of the tested IC in the IC carrier of expression Figure 23
The sectional drawing of embodiment;
Figure 30 is the skeleton view of the general contact pilotage (socket) of expression;
Figure 31 is the major part sectional drawing of the contact condition of the expression spherical terminal of IC and contact pilotage.
Embodiments of the invention are described below with reference to the accompanying drawings.
First embodiment
Fig. 1 is the skeleton view of first embodiment of expression IC proving installation of the present invention; Fig. 2 is the carriage process flow diagram of the retrieval methods of the tested IC of expression; Fig. 3 is the skeleton view of structure of the IC accumulator of this IC proving installation of expression; Fig. 4 is the skeleton view that is illustrated in employed conventional carriage in this IC proving installation; Fig. 5 is the fragmentary, perspective view that is illustrated in employed detection carriage in this IC proving installation.
Fig. 2 is the figure of retrieval methods of tested IC that is used for understanding the IC proving installation of present embodiment, in fact has plane earth and is illustrated on the above-below direction part of configured parts side by side.Therefore, (three-dimensional) structure of this machinery is described with reference to Fig. 1.
The IC proving installation 1 of present embodiment is to detect (inspections) the whether operate as normal and device of IC being classified according to this testing result of IC under the state of the temperature stress that applies high temperature or low temperature to tested IC, tested IC from loading a plurality of carriages of the tested IC of detected object that become (hereinafter referred to as conventional carriage KST, with reference to Fig. 4) reappose on the detection carriage TST that in this IC proving installation 1, transports (with reference to Fig. 5), be implemented in the operation detection under the state that has applied such temperature stress then.
Thus, as depicted in figs. 1 and 2, the IC proving installation 1 of present embodiment comprises: IC storage part 200, and the tested IC that from then on detects of storage, and, to the placement of classifying of the IC after detecting; Loading part 300 is sent into portion of sensing chamber 100 to the tested IC that is sent here from IC storage part 200; Portion of sensing chamber 100 comprises detection head; Unloading portion 400 classifies the IC after the detection of having carried out detecting and takes out in portion of sensing chamber 100.
IC storage part 200
IC accumulator 202 after the detection of the tested IC that IC accumulator 201 and storage before the detection of tested IC before storage detects classify according to testing result is set in IC storage part 200.
As shown in Figure 3, IC accumulator 201 and detect back IC accumulator 202 and comprise the bearing bracket frame 203 of frame shape and can enter from the bottom of this bearing bracket frame 203 and before these detect towards the lifter 204 of top lifting.The a plurality of conventional carriage KST of stacked supporting on bearing bracket frame 203 move up and down this stacked conventional carriage KST by lifter 204.
Then, the stacked conventional carriage KST that tested IC placed that detects at this of keeping in the IC accumulator 201 before detection, on the other hand, stacked maintenance in the IC accumulator 202 after detection finishing the conventional carriage KST that tested IC after the detection carries out proper classification.
IC accumulator 201 and detect back IC accumulator 202 and has identical construction before these detect, therefore, can according to the quantity of needs separately suitably be provided with detect before IC accumulator 201 and detect back IC accumulator 202.
In example illustrated in figures 1 and 2, two accumulator STK-B are set in the IC accumulator 201 before detection, and be adjacent two empty accumulator STK-E that are admitted to unloading portion 400 are set, simultaneously, after detection, be provided with in the IC accumulator 202 8 accumulator STK-1, STK-2 ..., STK-8, according to testing result come maximum be divided into 8 classes and the storage.That is, except high-class product and shoddy goods, in high-class product, can also divide into the product of operating rate, perhaps in shoddy goods, divide into the product that need detect once more etc. for high speed, middling speed, low speed.
Loading part 300
Above-mentioned conventional carriage KST is by being located at the carriage shifting rod 205 between IC storage part 200 and the device substrate 105 and be transported to the window portion 306 of loading part 300 from the downside of device substrate 105.In this loading part 300, by X-Y conveyer 304 the tested IC that is stacked on the conventional carriage KST temporarily is transplanted in the precise localizer (preciser) 305, revise the mutual alignment of tested IC at this, then, reusing X-Y conveyer 304 is layered in the tested IC that is transplanted in this precise localizer 305 on the detection carriage TST that is parked in the loading part 300 again.
As conventional carriage KST to detecting the carriage TST X-Y conveyer 304 of stacked tested IC again, as shown in Figure 1, comprising: be erected at the top of device substrate 105 two guide rails 301, can be by these two guide rails 301 detect the movable rod 302 that move back and forth (its direction is the Y direction) between carriage TST and the conventional carriage KST, by this movable rod 302 supporting can be along movable rod 302 mobile moving head 303 on directions X.
In the moving head 303 of this X-Y conveyer 304 adsorption head is housed downwards, this adsorption head suction air on one side moves on one side, thus, from the tested IC of conventional carriage KST absorption, and this tested IC is layered on the detection carriage TST again.Such adsorption head can be installed for example 8 on moving head 303, just can once be layered in 8 tested IC again and detect on the carriage TST.
On general conventional carriage KST, form the recess that is used to keep tested IC greater than the shape of tested IC, therefore, the position of the IC under the state in being stored in conventional carriage KST has bigger deviation.Therefore, following tested IC is adsorbed on the adsorption head at this state, detects on the carriage TST if directly transport to, and formed IC holds in the recess on detecting carriage TST and be difficult to correctly fall.Therefore, in the IC of present embodiment proving installation, the position being set and detecting the position correcting apparatus that the IC that is called as precise localizer 305 is set between the carriage TST at conventional carriage KST.This precise localizer 305 has deep recess, and therefore the shape of the periphery of this recess for being centered on by the dip plane, when tested IC adsorbed on adsorption head falls into this recess, revised the lowering position of tested IC by the dip plane.Thus, the mutual alignment of 8 tested IC can correctly determine, with the adsorption head tested IC that has been corrected of absorption position once more, and is layered in again and detects on the carriage TST, thus, can be laminated to tested IC again that formed IC holds in the recess in detecting carriage TST accurately.
Portion of sensing chamber 100
Above-mentioned detection carriage TST is admitted in the portion of sensing chamber 100 after by the loading part 300 stacked tested IC that packed into, under the state that is loaded on this detection carriage TST, each tested IC is detected.
Portion of sensing chamber 100 comprises: calibration cell 101, and apply thermal stress for the stacked tested IC that detects on the carriage TST that is contained in as the high temperature or the low temperature of purpose; Sensing chamber 102 makes to be in the tested IC that has applied thermal stress to contact with detection head in this calibration cell 101; The groove 103 that reduces phlegm and internal heat is removed the thermal stress that is applied from tested IC detected sensing chamber 102.
In the groove 103 that reduces phlegm and internal heat, when in calibration cell 101, having applied under the situation of high temperature, cooling off tested IC by air-supply returns under the room temperature, and, under the situation of the low temperature that for example-30 in calibration cell 101, has applied ℃, wait with hot blast or well heater and to heat tested IC, and return under the temperature that dewfall can not take place.Then, this tested IC that has reduced phlegm and internal heat is passed out in the unloading portion 400.
As shown in Figure 1, the calibration cell 101 of portion of sensing chamber 100 and the groove 103 that reduces phlegm and internal heat are configured to be projected into the top from sensing chamber 102.As Fig. 2 shown in conceptually like that, in calibration cell 101, vertical conveying apparatus is set, in sensing chamber's 102 skies, on one side a plurality of detection carriage TST are bearing in one side standby on this vertical conveying apparatus.As main aspect, in this standby, this tested IC applies the thermal stress of high temperature or low temperature.
Central configuration detection head 104 in sensing chamber 102 is transported on the detection head 104 detecting carriage TST, and the input and output terminal HB by making tested IC and the contact pilotage 51 of detection head 104 electrically contact, and detect.On the other hand, detect the detection carriage TST that finishes and in the groove 103 that reduces phlegm and internal heat, reduced phlegm and internal heat, and the temperature of IC is turned back under the room temperature, then, be discharged in the unloading portion 400.
Between the top of the calibration cell 101 and the groove 103 that reduces phlegm and internal heat, as shown in Figure 1, mobile device substrate 105 is equipped with on this device substrate 105 and detects carriage-carried device 108.By being located at the detection carriage-carried device 108 on this device substrate 105, the detection carriage TST that is discharged from the groove 103 that reduces phlegm and internal heat is sent back to calibration cell 101 through unloading portion 400 and loading part 300.
Fig. 5 is a decomposition diagram of representing the structure of employed in the present embodiment detection carriage TST.This detection carriage TST forms like this: parallel and a plurality of (three) lined 13 equally spaced be set in square box 12, these both sides of lined 13 with the limit 12a of lined 13 relative square box 12 on equally spaced outstanding respectively a plurality of installation sheets 14.Constituting inserter accommodation section 15 by two installation sheets 14 between these lined 13 and between lined 13 and the limit 12a.
Hold an inserter 16 in each inserter accommodation section 15 respectively, this inserter 16 uses fastener 17 and is installed on two installation sheets 14 under the state that floats.Thus, form mounting hole 21 respectively at the both ends of inserter 16 to installation sheet 14.Such inserter 16 for example is installed on the detection carriage TST with 16 * 4 degree.
Each inserter 16 is identical shaped, same size, holds tested IC in each inserter 16.The IC accommodation section 19 of inserter 16 is determined by the shape of the tested IC that holds, in example shown in Figure 5, is square recess.
Wherein, if the tested IC that temporarily is connected on the detection head 104 is the tested IC with * 16 row arrangements of 4 row as shown in Figure 5, just can for example detect the tested IC of 4 row simultaneously in per 4 row.Promptly, in primary detection, since first row, be connected on the contact pilotage 51 of detection head 104 and detect being configured in per 4 16 tested IC that list, in secondary detection, move row detecting carriage TST, from secondary series, similarly detect and be configured in the per 4 tested IC that list, carry out above-mentioned detection, just can detect whole tested IC by repeating 4 times.This testing result is stored in by being added in for example identiflication number that detects on the carriage TST and on the address that numbering determined of detecting the tested IC that is distributed carriage TST inside.
Fig. 6 is the decomposition diagram of the structure of the socket 50 of expression with thruster 30, inserter 16 (detecting carriage TST side), socket guides 40 and contact pilotage 51 in the detection head 104 of this IC proving installation, Fig. 7 is the sectional drawing of Fig. 6, and Fig. 8 is the sectional drawing of thruster 30 decline states in the expression detection head 104.
Thruster 30 is arranged on the upside of detection head 104, moves up and down along Z-direction by not shown Z axial brake device (for example hydraulic cylinder).This thruster 30 is installed on the Z axial brake device according to the interval (amounting to 16 for what per 4 row 4 were gone on above-mentioned detection carriage) of the tested IC that is tested.
In the central authorities of thruster 30, be formed for crimping 31 of the tested IC of crimping, the guide finger 32 in the guide thimble 41 of the pilot hole 20 that is inserted into following inserter 16 and socket guides 40 is set in its both sides.Between crimping son 31 and guide finger 32, the spacing guides 33 that is used to limit lower limit when this thruster 30 descends by the Z axial brake device is set, touch the confined planes 42 of socket guides 40 by this spacing guides 33, decide the angle of rake lower position of carrying out crimping with the suitable pressure that can not destroy tested IC.
As illustrated in fig. 5, inserter 16 uses fasteners 17 and is installed in and detects on the carriage TST, forms the guide finger 32 of above-mentioned thruster 30 and the pilot hole 20 of guide thimble 41 from inserting respectively up and down of socket guides 40 in its both sides.As shown under the thruster decline state of Fig. 8 like that, the pilot hole 20 in left side in the drawings, the small diameter bore that the first half positions for the guide finger 32 that inserts thruster 30, and the large diameter hole that the latter half positions for the guide thimble 41 that inserts socket guides 40.The guide thimble 41 of the guide finger 32 of the pilot hole 20 on right side and thruster 30 and socket guides 40 is movable insertion state among the figure.
Central authorities at inserter 16 form IC accommodation section 19, fall into wherein by making tested IC, come detecting the tested IC of closed assembly on the carriage TST.
Particularly, in the present embodiment, as Fig. 9 and shown in Figure 10, corresponding with position on the bottom surface of IC accommodation section 19 as the solder ball HB of the ball grid array type IC of tested IC, form the pilot hole 23 that these solder ball HB can embed.And the outer peripheral face of package assembling PM between form less clearance S so that the solder ball HB of tested IC can be embedded in these pilot holes 23 smoothly without any obstacle ground.
The quantity that pilot hole 23 shown in this figure forms embeds for making whole solder ball HB, and still, guide piece of the present invention can be various forms in addition.
In Figure 11 and other embodiment shown in Figure 12, the pilot hole 23 of the solder ball HB insertion of most peripheral among the solder ball HB that only makes BGA type IC is set in the bottom surface of IC accommodation section 19, central authorities form opening 24 in the bottom surface of IC accommodation section 19, so that contact pilotage 51 can touch in addition the solder ball HB.
In Figure 13 and other embodiment shown in Figure 14, the pilot hole that the solder ball HB that makes BGA type IC inserts respectively is not set, but the opening 25 that the outer circumferential side of the solder ball HB of most peripheral leads in the bottom surface of IC accommodation section 19 forms only to these solder ball HB.
On the other hand, insert two guide fingers 32 of thruster 30 in the both sides that are fixed on the socket guides 40 on the detection head 104, and these two guide fingers 32 between the guide thimble 41 that is provided for positioning, that of the left side of this guide thimble 41 be and inserter 16 between position.
Socket 50 with a plurality of contact pilotages 51 is fixed on the downside of socket guides 40, this contact pilotage 51 by the outer spring of figure upward to holddown spring.Therefore, compress tested IC, contact pilotage 51 retreats on the upper surface of socket 50, and on the other hand, tested IC is compacted slightly obliquely, and contact pilotage 51 can contact with whole terminal HB.Form the roughly coniform recess 51a of the solder ball HB that holds ball grid array type IC on the top of contact pilotage 51.
Unloading portion 400
In unloading portion 400, be provided with and the X-Y conveyer 404 that is located at X-Y conveyer 304 same configuration in the loading part 300, again be laminated on the conventional carriage KST on the detection carriage TST that IC after detecting is transported from unloading portion 400 by X-Y conveyer 404,404.
As shown in Figure 1, on the device substrate 105 of unloading portion 400, offer two pairs of window portion 406,406.The every pair of window portion 406 is configured to the conventional carriage KST that transports to this unloading portion 400 upper surface near device substrate 105.
Though omitted diagram, but be provided for making the lifting table of conventional carriage KST lifting at the downside of each window portion 406, at this, the tested IC after the stacked again detection, and the conventional carriage KST that fills is descended, this fully loaded carriage is moved on on the carriage shifting rod 205.
In the IC of present embodiment proving installation 1, the kind that can distinguish is 8 kinds to the maximum, and maximum can only dispose 4 conventional carriage KST in the window portion 406 of unloading portion 400.Therefore, the kind that can classify in real time is restricted to 4 classes.Generally, high-class product is divided into three kinds of high-speed response elements, middling speed response element, low speed response element, increase shoddy goods more on this basis and have 4 kinds just enough, still, for example, will produce the kind that does not belong to these kinds for needs detect etc. again.
Like this, under the situation that the tested IC of the kind the kind that is classified as 4 conventional carriage KST in being assigned to the window portion 406 that is configured in unloading portion 400 produces, make a conventional carriage KST return IC storage part 200 from unloading portion 400, replace it and the conventional carriage KST of the tested IC that will store the new kind that produces is transferred in the unloading portion 400, store this tested IC.But, when carrying out the replacing of conventional carriage KST in the process in sorting operations, must interrupt sorting operations during this period, and have the problem that throughput rate is descended.For this reason, in the IC of present embodiment proving installation 1, between the detection carriage TST of unloading portion 400 and window portion 406, buffer part 405 is set, the tested IC of the kind that temporary transient keeping only seldom produces in this buffer part 405.
For example, setting can be held the capacity of 20～30 tested IC in buffer part 405, simultaneously, the storer of the kind of the IC that is held on each IC accommodated position that is stored in buffer part 405 respectively is set, the kind of the tested IC of temporary transient keeping in buffer part 405 and location storage to each tested IC.Like this, at the interval of sorting operations or buffer part 405 fill the time engrave, access the conventional carriage KST of the kind that the tested IC of keeping buffer part 405 belongs to from IC storage part 200, and be received among this routine carriage KST.At this moment, when the tested IC of temporary transient keeping in buffer part 405 has when multiple, can when accessing conventional carriage KST, once a plurality of conventional carriage KST be called out in the window portion 406 of unloading portion 400.
The following describes its effect.
In the detection operation in portion of sensing chamber 100, tested IC is being loaded under the state that detects on the carriage TST as shown in Figure 5, in more detail, under the state of each tested IC in the IC accommodation section 19 of the inserter 16 that drops into this figure, be transported to the top of detection head 104.
When detection carriage TST stopped in detection head 104, the Z axial brake device began action, and Fig. 6～thruster 30 shown in Figure 8 descends facing to an inserter.Then, two guide fingers 32,32 of thruster 30 pass the pilot hole 20,20 of inserter 16 respectively, then, and with guide thimble 41,41 tablings of socket guides 40.
In Fig. 8, represented this state, with respect to being fixed on detection head 104 (promptly, IC proving installation 1 side) socket 50 and socket guides 40, the site error that inserter 16 and thruster 30 exist to a certain degree, but the guide finger 32 in the left side by thruster 30 is embedded in the small diameter bore of pilot hole 20 of inserter 16, carry out thruster 30 and cooperate with the position of inserter 16, its result, crimping 31 of thruster 30 compresses tested IC on can be in position.
The large diameter hole of the left side pilot hole 20 by inserter 16 and left side guide thimble 41 tablings of socket guides 40 carry out inserter 16 and cooperate with the position of socket guides 40, thus, improve the positional precision of tested IC and contact pilotage 51.
Particularly, in present embodiment and other variation, as Fig. 9～shown in Figure 14, pilot hole 23 and opening 25 with the IC accommodation section 19 of inserter 16 come the solder ball HB of tested IC itself is positioned, therefore, inserter 16 can reach with the positional precision of socket guides 40, can cooperate with the position of contact pilotage 51 by done with high accuracy solder ball HB.
Under state shown in Figure 8, owing to fully reach the positional precision of solder ball HB and the contact pilotage 51 of tested IC, the position of not carrying out other cooperates, spacing guides 33 is before touching confined planes 42, thruster 30 is further descended, tested IC is contacted with contact pilotage 51 by crimping 31.Under this state, carry out predetermined detection still.
Second embodiment
Above-mentioned first embodiment is the example that the present invention is used for the IC proving installation 1 of so-called sensing chamber type, and the present invention also can be used for the IC proving installation of so-called heating template.
Figure 15 is the skeleton view of second embodiment of expression IC proving installation of the present invention, if its overview of explanation, the IC proving installation 1 of present embodiment is crimped onto the tested IC before the test of being loaded on the contact site of detection head 67 by X-Y conveyer 64,65 on supplying with carriage 62, be contained in the classification carriage 63 according to testing result having finished the tested IC that detects.
X-Y conveyer 64 wherein constitutes like this: moving head 64c can be by the guide rail 64a that is provided with along X-direction and Y direction respectively, 64b and move to arrive from classification carriage 63 and supply with carriage 62, empty carriage 61, heating plate 66 and two buffer part 68,68 zone, and this moving head 64c can go up in Z-direction (being above-below direction) by not shown Z shaft actuator and move.Can adsorb, transport and discharge two tested IC by two adsorption head 64d that are located on the moving head 64c.
Relative therewith, X-Y conveyer 65 constitutes like this: moving head 65c can be by the guide rail 65a that is provided with along X-direction and Y direction respectively, 65b moves to two buffer part 68,68 and detection head 67 between the zone, and this moving head 65c can go up in Z-direction (being above-below direction) by not shown Z shaft actuator and move.Can adsorb, transport and discharge two tested IC by two adsorption head 65d that are located on the moving head 65c.
Two buffer part 68,68 move back and forth between the operating space of two X-Y conveyers 64,65 by guide rail 68a and not shown actuator.In the drawings, the buffer part 68 of upside carries out the tested IC that is transported from heating plate 66 is transplanted on the operation of detection head 67, and on the other hand, the buffer part 68 of downside is taken out the operation of having been finished the tested IC that detects by detection head 67.By the existence of these two buffer part 68,68, two X-Y conveyers 64,65 can not interfered mutually and can be moved simultaneously.
In the operating space of X-Y conveyer 64, configuration is loaded in the supply carriage 62 of this tested IC that detects, the IC after detecting is divided into and 4 classification carriages 63 of corresponding kind of testing result and storage, the carriage 61 of sky, and, heating plate 66 is set on the position near buffer part 68.
This heating plate 66 is sheet metals for example, forms a plurality of recess 66a that tested IC is fallen into, and moves to this recess 66a from the IC before the detection of supplying with carriage 62 by X-Y conveyer 64.Heating plate 66 is the heating sources that are used for applying predetermined thermal stress to tested IC, and tested IC is heated plate 66 and is heated to predetermined temperature, and then, the buffer part 68 by a side is forced on the contact site of detection head 67.
Particularly, in the heating plate 66 of present embodiment, the input and output terminal of tested IC is set, promptly in recess 66a (the maintenance medium that are equivalent to tested IC of the present invention), if BGA type IC is provided with the guide piece that contacts and position with solder ball HB.
Figure 16 is the sectional drawing of embodiment of the guide piece of the tested IC of expression, and Figure 17 and Figure 18 are respectively the sectional drawings of another embodiment of the guide piece of the tested IC of expression.
In the embodiment shown in Figure 16, the contacted conical surface 66b of solder ball HB of the most peripheral in the recess 66a of heating plate 66 among the solder ball HB of formation and BGA type IC positions the solder ball HB of tested IC by this conical surface 66b.
In the embodiment shown in Figure 17, the guide finger 66c of tabling between the solder ball of formation and BGA type IC positions the solder ball HB of tested IC by this guide finger 66c in the recess 66a of heating plate 66.
In the embodiment shown in Figure 18, the tapered recess 66d of the solder ball HB tabling of the most peripheral in the recess 66a of heating plate 66 among the solder ball HB of formation and BGA type IC can make the solder ball HB of tested IC position by this guide finger 66c.
In the IC of present embodiment proving installation 1, because guide piece 66b, 66c, 66d that the input and output terminal HB of tested IC is positioned are located on the heating plate 66, then when tested IC being pressed to the contact site of detection head 67 by X-Y conveyer 64, buffer part 68 and X-Y conveyer 65, can significantly improve the positional precision of solder ball HB and contact pilotage, and can prevent from ball HB is produced damage.
The 3rd embodiment
The type IC of sensing chamber proving installation the type IC of the sensing chamber proving installation that the present invention can be used for illustrating except that first embodiment.
Figure 19 is the skeleton view of the 3rd embodiment of expression IC proving installation of the present invention, Figure 20 is the concept map of the retrieval methods of the tested IC in this IC proving installation of expression, Figure 21 is the planimetric map that the expression of pattern ground is located at the transfer device in this IC proving installation, Figure 22 is the skeleton view that transports the path that is used for illustrating at the employed IC carrier of this IC proving installation, Figure 23 is the skeleton view that transports the path that is used for illustrating at the employed IC carrier of this IC proving installation, Figure 24 is the planimetric map that is used for illustrating in the detection order of the tested IC of the sensing chamber of this IC proving installation, Figure 25 is the sectional drawing along the XXV-XXV line of Figure 21, and Figure 26 is the sectional drawing that is equivalent to Figure 25 of retrieval methods that is used for illustrating the tested IC of sensing chamber.
Figure 27 is the sectional drawing of embodiment of the guide piece of the tested IC in the IC carrier of expression Figure 23, and Figure 28 and Figure 29 are respectively the sectional drawings of another embodiment of the guide piece of the tested IC in the expression IC carrier.
Figure 20 and Figure 21 are the figure that is used for understanding the actuating range of the retrieval methods of tested IC of IC proving installation of present embodiment and transfer device, are actually plane earth and are illustrated on the above-below direction part of configured parts side by side.Therefore, (three-dimensional) structure of this machinery is described with reference to Figure 19.
The IC proving installation 1 of present embodiment is to detect (inspections) the whether operate as normal and device of IC being classified according to this testing result of IC under the state of the temperature stress that applies high temperature or low temperature to tested IC, tested IC from loading a plurality of carriages of the tested IC of detected object that become (hereinafter referred to as conventional carriage KST, with reference to Fig. 4) reappose on the IC carrier CR that in this IC proving installation 1, transports (with reference to Figure 23), be implemented in the operation detection under the state that has applied such temperature stress.
Thus, as Figure 19 and shown in Figure 20, the IC proving installation 1 of present embodiment comprises: IC storage part 1100, be stored in the tested IC that this detects, and, to the placement of classifying of the IC after detecting; Loading part 1200 is sent into portion of sensing chamber 1300 to the tested IC that is sent here from IC storage part 1100; Portion of sensing chamber 1300 comprises detection head; Unloading portion 1400 classifies the IC after the detection of having carried out detecting and takes out in portion of sensing chamber 1300.
IC storage part 1100
IC accumulator 1102 after the detection of the tested IC that IC accumulator 1101 and storage before the detection of tested IC before storage detects classify according to testing result is set in IC storage part 1100.
With in first embodiment, quote shown in Figure 3 identical, IC accumulator 1101 and detect back IC accumulator 1101 and comprise the bearing bracket frame 203 of frame shape and can enter from the bottom of this bearing bracket frame 203 and before these detect towards the lifter 204 of top lifting.The a plurality of conventional carriage KST such shown in the enlarged drawing of Fig. 4 of stacked supporting on bearing bracket frame 203 move up and down this stacked conventional carriage KST by lifter 204.
Then, the stacked conventional carriage KST that tested IC placed that detects at this of keeping in the IC accumulator 1101 before detection, on the other hand, stacked maintenance in the IC accumulator 1102 after detection finishing the conventional carriage KST that tested IC after the detection carries out proper classification.
IC accumulator 1101 and detect back IC accumulator 1102 and has identical construction before these detect, therefore, can according to the quantity of needs separately suitably be provided with detect before IC accumulator 1101 and detect back IC accumulator 1102.
In Figure 19 and example shown in Figure 20, an accumulator LD is set in the IC accumulator 1101 before detection, and be adjacent an empty accumulator EMP who is admitted to unloading portion 1400 is set, simultaneously, after detection, be provided with in the IC accumulator 1,102 5 accumulator UL1, UL2 ..., UL5, according to testing result come maximum be divided into 5 classes and the storage.That is, except high-class product and shoddy goods, in high-class product, can also divide into the product of operating rate, perhaps in shoddy goods, divide into the product that need detect once more etc. for high speed, middling speed, low speed.
Loading part 1200
Above-mentioned conventional carriage KST is transported to the window portion 1202 of loading part 1200 from the downside of device substrate 1201 by being located at the carriage shifting rod (not shown) between IC storage part 1100 and the device substrate 1201.Then, in this loading part 1200, by first conveyer 1204 the tested IC that is stacked on the conventional carriage KST temporarily is transplanted on the spacing conversion platform 1203, revise the mutual alignment of tested IC at this, then, use second conveyer 1205 to be layered in again on the IC carrier CR on the position CR1 (with reference to Figure 22) that is parked in the portion of sensing chamber 1300 being transplanted on tested IC on this spacing conversion platform 1203.
The spacing conversion platform 1203 that is located on the device substrate 1201 between window portion 1202 and the portion of sensing chamber 1300 has deep recess, be to have with the IC position correction and the spacing change device of dip plane around the shape of the periphery of this recess, when making the tested IC that is adsorbed on the X-Y conveyer 1204 fall into this recess, revise the lowering position of tested IC with the dip plane.Thus, decision correctly is the mutual alignment of 4 tested IC for example, simultaneously, even conventional carriage KST is different with the loading spacing of IC carrier CR, by the tested IC that has carried out position correction and spacing change with 1205 absorption of the 2nd X-Y conveyer, and be laminated on the IC carrier CR, just can be laminated to tested IC again that formed IC holds in the recess 1014 on IC carrier CR accurately.
As shown in Figure 21, tested IC is comprised from first conveyer 1204 that conventional carriage KST is laminated on the spacing conversion platform 1203 again: be erected at the top of device substrate 1201 guide rail 1204a, can between conventional carriage KST and spacing conversion platform 1203, move back and forth by this guide rail 1204a (its direction is the Y direction) movable rod 1204b, supported and the moving head 1204c that can move at directions X along movable rod 1204b by this movable rod 1204b.
In the moving head 1204c of this first conveyer 1204 adsorption head 1204d is housed downwards, this adsorption head 1204d suction air on one side moves on one side, thus, from the tested IC of conventional carriage KST absorption, and makes this tested IC fall into spacing conversion platform 1203.Such adsorption head 1204d can install for example 4 on moving head 1204c, just can once make 4 tested IC fall into spacing conversion platform 1203.
On the other hand, tested IC had identical formation from second conveyer 1205 that spacing conversion platform 1203 is laminated to the IC carrier CR in the portion of sensing chamber 1300 again, as Figure 19 and shown in Figure 21, comprising: be erected at the guide rail 1205a on the top of device substrate 1201, the movable rod 1205b that can between spacing conversion platform 1203 and IC carrier CR, move back and forth, supported and the moving head 1205c that can on directions X, move along movable rod 1205b by this movable rod 1205b by this guide rail 1205a.
In the moving head 1205c of this second conveyer 1205, adsorption head 1205d is housed downwards, this adsorption head 1205d suction air on one side moves on one side, thus, from the tested IC of spacing conversion platform 1203 absorption, this tested IC is laminated on the IC carrier CR again by the inlet 1303 of portion of sensing chamber 1300.Such adsorption head 1205d can install for example 4 on moving head 1205c, just can once be laminated to 4 tested IC again on the IC carrier CR.
Portion of sensing chamber 1300
The related portion of sensing chamber 1300 of present embodiment has to being layered in tested IC on the IC carrier CR and applies constant temperature function as the temperature stress of the high temperature of purpose or low temperature, and the tested IC that is under the state that has applied thermal stress is contacted with the contact site 1302a of detection head 1302 under temperature constant state.
In the IC of present embodiment proving installation, under the situation of the temperature stress of applying low temperature for tested IC, carry out heat extraction, and under the situation of the temperature stress of applying high temperature for tested IC, carry out heat extraction by natural heat dissipation with following hot plate 1401.But, also can be provided with in addition except that heat channel or except that the hot-zone, then when applying high temperature, turn back under the room temperature by cooling off for tested IC air-supply, when applying low temperature, with hot blast or well heater etc. tested IC is heated, turn back under the temperature that dewfall can not take place.
Detection head 1302 with contact site 1302a is arranged on the central downside of sensing chamber 1301, and the rest position CR5 of IC carrier CR is set in the both sides of this detection head 1302.By the 3rd transfer device 1304 the tested IC that is placed among the IC carrier CR that is sent on the CR5 of this position directly is transported on the detection head 1302, detects by tested IC and contact site 1302a are electrically contacted.
Finished the tested IC that detects and no longer turned back on the IC carrier CR, but reapposed haunt mobile withdraw from the carrier EXT of position CR5 in detection head 1302 both sides, and be transported to outside the portion of sensing chamber 1300.Under the situation of the temperature stress that applies high temperature,, carry out heat extraction naturally after this portion of sensing chamber 1300 transports.
The IC carrier CR of present embodiment circulates in portion of sensing chamber 1300 and transports.In Figure 22, represented the appearance that this is fetched, and in the present embodiment, at first, the IC carrier CR that has stacked the tested IC that is sent here from loading part 1200 is positioned near sensing chamber's inlet 1303 of portion of sensing chamber 1300 and portion of sensing chamber 1300 depths, and the IC carrier CR that is positioned at position CR1 is transported on the position CR2 of horizontal direction by scheming outer horizontal conveyance device.
Wherein, transport to divide several sections stacked states towards the below of vertical direction by scheming outer vertical conveying apparatus, the IC of position CR5 carrier be empty before standby, then, from the position CR3 of hypomere be transported to the roughly the same horizontal level CR4 of detection head 1302 on.As main processing, apply the temperature stress of high temperature or low temperature for tested IC.
Then, be transported to the position CR5 of horizontal direction from this position CR4 towards detection head 1302 sides,, only tested IC delivered on the contact site 1302a (with reference to Figure 20) of detection head 1302 at this.The IC carrier CR that tested IC is sent to behind the contact site 1302a is transported to the position CR6 of horizontal direction from this position CR5, then, transports towards the top of vertical direction, turns back on the original position CR1.
Like this, because IC carrier CR only circulates in portion of sensing chamber 1300 and transports, even carry out in short-term intensification or cooling, the temperature of IC carrier itself is still kept its original state, and its result can improve the thermal efficiency in the portion of sensing chamber 1300.
Figure 23 is a skeleton view of representing the structure of employed in the present embodiment IC carrier CR, upper surface at thin rectangular plate 1011 forms recess 1012, fixed blocks 1013 in this recess 1012, this square 1013 has formed the IC accommodation section 1014 that is used to place tested IC.At this, form 16 IC accommodation sections 1014 that are used to place tested IC, its spacing equally spaced is set.
For the offset of the tested IC in the IC accommodation section 1014 that prevents to be contained in this IC carrier CR with fly out, valve 1015 is set at the upper surface of IC carrier CR.This valve 1015 opens and closes freely plate 1011 by spring 1016,1014 when taking out when being contained in tested IC in the IC accommodation section 1014 or from the IC accommodation section, the outer valve releasing mechanism of use figure comes by such this valve 1015 of opening shown in two dot-and-dash lines of this figure, thus, carry out holding or taking out of tested IC.
When removing the valve releasing mechanism, corresponding valve 1015 is original state by the spring return of spring 1016, and therefore, the tested IC that is held can not produce offset and fly out and be held.
Like this, the related IC carrier CR of present embodiment does not have complicated shape, structure, only carries out holding of tested IC by the switching of valve 1015 and takes out, and therefore, its activity duration significantly shortens.
Wherein, in the detection head 1302 of present embodiment with certain spacing P 28 contact site 1302a are set, with identical spacing P 2The adsorption head of contact lever is set.In IC carrier CR with spacing P 1Hold 16 tested IC, at this moment, have P 2=2P 1Relation.
Temporarily be connected the tested IC on the detection head 1302, as shown in Figure 24,, detect the tested IC (part of representing by oblique line) of each row simultaneously with respect to the tested IC that are arranged in 1 row * 16 row.
That is, in primary detection, be connected on the contact site 1302a of detection head 1302 and detect, in secondary detection, IC carrier CR is moved a column pitch P being configured in 8 tested IC in 1,3,5,7,9,11,13,15 row 1, similarly detect the tested IC that is configured in 2,4,6,8,10,12,14,16 row.Thus, though do not illustrate, mobile device is set, this mobile device vertically moves spacing P to the IC carrier CR of the position CR5 of the both sides that are shifted into detection head 1302 along it 1
The for example identiflication number of the result of this detection on being added in IC carrier CR is stored in the address that numbering determined by the tested IC that is distributed in this IC carrier CR inside.
In the IC of present embodiment proving installation 1, detect for the contact site 1302a to detection head 1302 transfers tested IC, and the 3rd transfer device 1304 is arranged near the detection head 1304.In Figure 25, represented along the sectional drawing of the XXV-XXV line of Figure 21, and the 3rd transfer device 1304 comprises: along the rest position CR5 of IC carrier CR and the bearing of trend of detection head 1302 (Y direction) set guide rail 1304a, the moving head 1304b that can between the rest position CR5 of detection head 1302 and IC carrier CR, move back and forth, be arranged on adsorption head 1304c on this moving head 1304b downwards by this guide rail 1304a.Adsorption head 1304c can move up at upper and lower by not shown drive unit (for example hydraulic cylinder).By moving up and down of this adsorption head 1304c, can adsorb tested IC, simultaneously, can be pressed onto tested IC on the contact site 1302a.
In the 3rd transfer device 1304 of present embodiment, two moving head 1304b are set on a guide rail 1304a, it is set at interval with the interval of the rest position CR5 of detection head 1302 and IC carrier CR and equates.These two moving head 1304b are moved to the Y direction simultaneously by a drive source (for example ball screw device), and on the other hand, each adsorption head 1304c moves up at upper and lower by drive unit independently respectively.
As described above, each adsorption head 1304c can once adsorb and keep 8 tested IC, and it is set at interval with being separated by of contact site 1302a and equates.The details of the action of the 3rd transfer device 1304 will be in following description.
Particularly, in the IC of present embodiment carrier CR, the input and output terminal of tested IC is set, promptly in IC accommodation section 1014 (the maintenance medium that are equivalent to tested IC of the present invention), if BGA type IC is provided with the guide piece that contacts and position with solder ball HB.
Figure 27 is the sectional drawing of embodiment of the guide piece of the tested IC of expression, and Figure 28 and Figure 29 are respectively the sectional drawings of another embodiment of the guide piece of the tested IC of expression.
In the embodiment shown in Figure 27, the contacted conical surface CRb of solder ball HB of the most peripheral in the IC accommodation section 1014 of IC carrier CR among the solder ball HB of formation and BGA type IC positions the solder ball HB of tested IC by this conical surface CRb.
In the embodiment shown in Figure 28, the guide finger CRc of tabling between the solder ball of formation and BGA type IC positions the solder ball HB of tested IC by this guide finger CRc in the IC accommodation section 1014 of IC carrier CR.
In the embodiment shown in Figure 29, the tapered recess CRd of the solder ball HB tabling of the most peripheral in the IC accommodation section 1014 of IC carrier CR among the solder ball HB of formation and BGA type IC can make the solder ball HB of tested IC position by this guide finger CRc.
In the IC of present embodiment proving installation 1, because guide piece CRb, CRc, CRd that the input and output terminal HB of tested IC is positioned are located on the IC carrier CR, then when tested IC being pressed to the contact site 1302a of detection head 1302 by the 3rd transfer device 1304, can significantly improve the positional precision of solder ball HB and contact pilotage, and can prevent from ball HB is produced damage.
Unloading portion 1400
On the one hand, in unloading portion 1400, be provided for from what portion of sensing chamber 1300 took out IC after the above-mentioned detection withdrawing from carrier EXT.As Figure 21 and shown in Figure 25, this withdraws from carrier EXT and can move back and forth along directions X between the position EXT2 of the EXT1 of position separately of detection head 1302 both sides and unloading portion 1400.On the position EXT1 of detection head 1302 both sides, as shown in Figure 25, for fear of with the interference of IC carrier CR, be in the upside slightly of the rest position CR5 of IC carrier, with overlapping the haunting of downside slightly of the adsorption head 1304c of the 3rd transfer device 1304.
There is no particular limitation to withdraw from the concrete structure of carrier EXT, and IC carrier CR that can be as shown in figure 23 is such, and the plate that a plurality of by forming (are 8 at this) can hold tested IC constitutes.
This withdraws from carrier EXT and is provided with two respectively in the both sides of detection head 1302, during moving to the position of sensing chamber 1301 EXT1, during moving to the position of unloading portion 1400 EXT2, roughly moves symmetrically on the other hand on the one hand.
Near withdrawing from the position EXT2 of carrier EXT, hot plate 1401 is set.This hot plate 1401 is used for heating when the temperature stress of applying low temperature for tested IC and arrives the temperature that can not produce dewfall, and when applying the temperature stress of high temperature, does not need to use this hot plate 1401.
Can keep 8 tested IC corresponding successively with the adsorption head 1404d of following the 4th transfer device 1404, the hot plate 1401 of present embodiment can hold 2 row * 16 row and amount to 32 tested IC.Corresponding with the adsorption head 1404d of the 4th transfer device 1404, hot plate 1401 is divided into four zones, 8 tested IC that absorption is kept are placed into these zones successively from withdrawing from carrier EXT, intactly adsorb 8 tested IC of long heating with this adsorption head 1404d, move in the buffer part 1402.
Near hot plate 1401, be provided with respectively and have two buffer part 1402 of lifting table (not shown).The lifting table of each buffer part 1402 and the horizontal level that withdraws from carrier EXT and hot plate 1401 par positions (Z direction) and its upside specifically move along the Z direction between the horizontal level of device substrate 1201.The concrete formation of this buffer part 1402 has no particular limits, for example can with IC carrier CR and to withdraw from carrier EXT identical like that, and a plurality of by forming (they are 8 at this) can hold the plate formation of the recess of tested IC.
This a pair of lifting table carried out a side in the lifting position quiescent period, and the opposing party is then in the static so roughly action of symmetry of down position.
Withdrawing from the unloading portion 1400 of carrier EXT to the scope of buffer part 1402, the 4th transfer device 1404 is set from above-mentioned.As Figure 19 and shown in Figure 21, the 4th transfer device 1404 comprises: the guide rail 1404a that is erected at device substrate 1201 tops, can withdraw from the movable rod 1404b that moves along the Y direction between carrier EXT and the buffer part 1402 by this guide rail 1404a, supported the adsorption head 1404c that can move up and down along the Z direction with respect to movable rod 1404b by this movable rod 1404b, this adsorption head 1404c suction air on one side moves to Z direction and Y direction on one side, thus, adsorb tested IC from withdrawing from carrier EXT, make this tested IC fall into hot plate 1401, simultaneously, from the tested IC of hot plate 1401 absorption, make this tested IC fall into buffer part 1402.In the present embodiment, 8 adsorption head 1404c are housed on movable rod 1404b, then once can transfer 8 tested IC.
Though omitted diagram, movable rod 1404b and adsorption head 1404c are set on the position of the lifting position of lifting table that can be by buffer part 1402 and the horizontal level between the down position, thus, even a side lifting table rises, can not disturb yet, and can be transplanted on tested IC on the opposing party's the lifting table.
And, the 5th transfer device 1406 and the 6th transfer device 1407 are set in unloading portion 1400, are laminated to again on the conventional carriage KST by the tested IC after these the 5th transfer devices 1406 and 1407 detections that transport in the buffer part 1402 of the 6th transfer device.
Thus, on device substrate 1201, offer 4 window portion 1403 altogether, this window portion 1403 be used for the conventional carriage KST of the sky that transports from the empty accumulator EMP of IC storage part 1100 be close to device substrate 1201 above.
As Figure 19 and shown in Figure 21, the 5th transfer device 1406 comprises: be erected at the guide rail 1406a on device substrate 1201 tops, the movable rod 1406b that can move along the Y direction by this guide rail 1406a between buffer part 1402 and window portion 1403, supported the moving head 1406c that can move along directions X with respect to movable rod 1406b, be installed on this moving head 1406c the adsorption head 1406d that can move along the Z direction downwards by this movable rod 1406b.This adsorption head 1406d suction air on one side moves to X, Y and Z direction on one side, thus, from the tested IC of buffer part 1402 absorption, this tested IC is transplanted among the conventional carriage KST of corresponding kind.In the present embodiment, 2 adsorption head 1406d are housed on moving head 1406c, then once can transfer 2 tested IC.
The 5th transfer device 1406 of present embodiment forms short movable rod 1406b, so that only tested IC is transplanted among the conventional carriage KST in two window portion 1403 that are located at right-hand member, the conventional carriage KST of the high kind of occurrence frequency is set in two window portion 1403 of these right-hand members.
As Figure 19 and shown in Figure 21, the 6th transfer device 1406 comprises: two guide rail 1407a that are erected at device substrate 1201 tops, 1407a, can pass through this guide rail 1407a, the movable rod 1407b that 1407a moves along the Y direction between buffer part 1402 and window portion 1403, be supported the moving head 1407c that can move along directions X, be installed on this moving head 1407c the adsorption head 1407d that can move up and down along the Z direction downwards with respect to movable rod 1407b by this movable rod 1407b.This adsorption head 1407d suction air on one side moves to X, Y and Z direction on one side, thus, from the tested IC of buffer part 1402 absorption, this tested IC is transplanted among the conventional carriage KST of corresponding kind.In the present embodiment, 2 adsorption head 1407d are housed on moving head 1407c, then once can transfer 2 tested IC.
Above-mentioned the 5th transfer device 1406 only is transplanted on tested IC among the conventional carriage KST on two window portion 1403 that are arranged on right-hand member, relative therewith, the 6th transfer device 1407 is transported to tested IC among the conventional carriage KST that all is arranged in the window portion 1403.Therefore, the tested IC of the kind that occurrence frequency is high uses the 5th transfer device 1406 and the 6th transfer device 1407 to classify, and simultaneously, the tested IC of the kind that occurrence frequency is low is only classified by the 6th transfer device 1407.
As shown in Figure 19, these two guide rail 1406a, 1407a is provided with and goes up at various height, so that the adsorption head 1406d of two transfer devices 1406,1407,1407d can the phase mutual interference, even two adsorption head 1406d, 1407d moves simultaneously, also can disturb hardly.In the present embodiment, the 5th transfer device 1406 is arranged on the position that is lower than the 6th transfer device 1407.
Though omit among the figure, but be provided for making the lifting table of conventional carriage KST lifting at the downside of the device substrate 1201 of each window portion 1403, the conventional carriage KST that carries the tested IC after the stacked again detection and fill and descending, this carriage of filling is moved on on the carriage shifting rod, transport to the corresponding accumulator UL1～UL5 of IC storage part 1100 by this carriage shifting rod.Got in the empty window portion 1403 at conventional carriage KST, transported empty conventional carriage KST from empty accumulator EMP, be reapposed on the lifting table, and be arranged in the window portion 1403 by the carriage shifting rod.
In a buffer part 1402 of present embodiment, can hold 16 tested IC, and, the storer of the kind of the tested IC that is held in each IC accommodated position that is stored in buffer part 1402 respectively is set.
On each tested IC, be stored in kind and the position of stored tested IC in the buffer part 1402, (UL1～UL5) accesses buffer part 1402 the conventional carriage KST of kind under the stored tested IC from IC storage part 1100, with the above-mentioned the 3rd and the 6th transfer device 1406,1407 in IC after holding detection among the corresponding conventional carriage KST.
As described above, even in the such type IC of sensing chamber proving installation 1, the direct guide piece CRb that the solder ball HB of tested IC is positioned is set in IC carrier CR, CRc, CRd, therefore, when the contact site 1302a that tested IC is pressed onto detection head 1302 by the 3rd transfer device 1304 goes up, significantly improved the positional precision of solder ball HB and contact pilotage, can prevent damage solder ball HB.
More than Shuo Ming embodiment is described in order to understand the present invention easily, and the present invention is not limited to this.Therefore, each key element that is disclosed in the foregoing description comprises whole design alterations and the equivalent that belongs to technical scope of the present invention.
For example, guide piece 66b～66c of second embodiment can be arranged in the buffer part 68,68 except that heating plate 66.
According to above-mentioned the present invention, the IC package module is not positioned, come the input and output terminal itself that is pressed onto on the contact site is positioned with guide piece, therefore, between the maintenance medium of tested IC and tested IC, can not produce error, significantly improve the bearing accuracy of the input and output terminal of tested IC contact site.Its result need not carry out the operation of the position correction of tested IC before being pressed onto contact site, can shorten the index time of IC proving installation.

Claims (7)

1. IC proving installation, the spherical input and output terminal of tested IC is pressed onto on the contact site of detection head, detect, it is characterized in that, on the maintenance medium of above-mentioned tested IC, be provided with and contact the guide piece that it is positioned with the spherical input and output terminal of above-mentioned tested IC.
2. IC proving installation according to claim 1 is characterized in that, above-mentioned maintenance medium are to be used for detection carriage that above-mentioned tested IC is transported to above-mentioned detection head from the loading part of above-mentioned tested IC.
3. IC proving installation according to claim 1 is characterized in that, above-mentioned maintenance medium are the heating plates that are used for before above-mentioned tested IC is pressed onto above-mentioned contact site above-mentioned tested IC being applied thermal stress.
4. IC proving installation according to claim 1 is characterized in that, above-mentioned maintenance medium are the IC carriers that circulate in sensing chamber and transport, and is that carrying is moved into the above-mentioned tested IC in the above-mentioned sensing chamber and is transplanted near the above-mentioned detection head IC carrier.
5. IC proving installation according to claim 1 is characterized in that, above-mentioned guide piece is the hole with spherical input and output terminal tabling.
6. IC proving installation according to claim 1 is characterized in that, above-mentioned guide piece be and two spherical input and output terminals between the projection of tabling.
7. IC proving installation according to claim 1 is characterized in that, above-mentioned guide piece is the taper surface that engages with above-mentioned spherical input and output terminal.
CNB991047974A 1998-04-02 1999-04-02 IC testing device Expired - Fee Related CN1171093C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP106923/98 1998-04-02
JP106923/1998 1998-04-02
JP10106923A JPH11287842A (en) 1998-04-02 1998-04-02 Ic tester

Publications (2)

Publication Number Publication Date
CN1230691A CN1230691A (en) 1999-10-06
CN1171093C true CN1171093C (en) 2004-10-13

Family

ID=14445949

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB991047974A Expired - Fee Related CN1171093C (en) 1998-04-02 1999-04-02 IC testing device

Country Status (7)

Country Link
JP (1) JPH11287842A (en)
KR (1) KR100722643B1 (en)
CN (1) CN1171093C (en)
DE (1) DE19914775A1 (en)
MY (1) MY125922A (en)
SG (1) SG81268A1 (en)
TW (1) TW429316B (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002067000A1 (en) * 2001-02-21 2002-08-29 Advantest Corporation Insert for electronic component test device
JP2003066104A (en) * 2001-08-22 2003-03-05 Advantest Corp Insert and electronic component handling apparatus having the same
WO2003075024A1 (en) * 2002-03-06 2003-09-12 Advantest Corporation Insert and electronic component handler comprising it
JP4043339B2 (en) 2002-10-22 2008-02-06 川崎マイクロエレクトロニクス株式会社 Test method and test apparatus
KR100613168B1 (en) 2004-10-01 2006-08-17 삼성전자주식회사 Insert block for testing semiconductor device
JP2006292727A (en) * 2005-03-18 2006-10-26 Alps Electric Co Ltd Semiconductor transfer tray, burn-in board using the same, inspection apparatus for burn-in test, burn-in test method, and semiconductor manufacturing method
KR100659153B1 (en) 2006-01-26 2006-12-19 삼성전자주식회사 Insert for semiconductor package having supporting substrate
KR100647494B1 (en) * 2006-03-29 2006-11-23 주식회사 엠디플렉스 Measurement device for the electronic circuit and the method for measuring of the same
US7522401B2 (en) * 2006-05-26 2009-04-21 Intel Corporation Static dissipative layer system and method
JP4927493B2 (en) * 2006-10-13 2012-05-09 株式会社エンプラス Socket for electrical parts
US8096840B2 (en) * 2007-04-04 2012-01-17 Nhk Spring Co., Ltd. Conductive contact holder and conductive contact unit
US7545158B2 (en) * 2007-04-12 2009-06-09 Chroma Ate Inc. Method for testing system-in-package devices
WO2008125011A1 (en) * 2007-04-12 2008-10-23 Semiconductor Testing Advanced Research Lab Inc. Method and apparatus for testing system-in-package devices, micro sd devices
JP2012163550A (en) * 2011-01-18 2012-08-30 Unitechno Inc Semiconductor conveyance fixture
JP2013137286A (en) * 2011-12-28 2013-07-11 Advantest Corp Electronic component testing device
TWI470233B (en) * 2012-09-28 2015-01-21 Taiwan Elite Nano Technology Corp Probe structure and manufacture thereof
KR102010275B1 (en) * 2013-04-03 2019-08-13 (주)테크윙 Handler for testing semiconductor
CN103412251A (en) * 2013-07-24 2013-11-27 昆山迈致治具科技有限公司 PCB performance detection jig with stroke-limiting mechanism
KR102220334B1 (en) * 2014-10-16 2021-02-25 세메스 주식회사 Insert assembly for receiving electronic device
JP6404104B2 (en) * 2014-12-11 2018-10-10 株式会社エンプラス Socket for electrical parts
CN106290990A (en) * 2015-06-10 2017-01-04 鸿劲科技股份有限公司 Can the positioner of the most electronic units fixes and the implement of application thereof
CN105929321B (en) * 2016-06-12 2023-03-03 深圳市斯纳达科技有限公司 Integrated circuit test equipment
JP6842355B2 (en) * 2017-04-28 2021-03-17 株式会社アドバンテスト Carrier for electronic component testing equipment
CN110572954A (en) * 2019-09-11 2019-12-13 苏州汇川技术有限公司 pin assembly guide and circuit board assembly
TWI760230B (en) * 2020-06-09 2022-04-01 台灣愛司帝科技股份有限公司 Chip-detecting method, chip-detecting structure and chip-carrying structure
CN113884511B (en) * 2021-09-28 2023-09-29 北京环境特性研究所 Material transmissivity test support and test system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04199531A (en) * 1990-11-28 1992-07-20 Mitsubishi Electric Corp Measuring device for semiconductor
JPH05326757A (en) * 1990-12-18 1993-12-10 Toshiba Corp Ic socket
JPH06102311A (en) * 1992-09-21 1994-04-15 Kawasaki Steel Corp Test method and apparatus for semiconductor package
JPH07122625A (en) * 1993-10-22 1995-05-12 Sony Corp Positioning method for semiconductor device
DE19580814B4 (en) * 1994-06-15 2004-06-24 Advantest Corp. IC handler with IC carrier
KR0146216B1 (en) * 1995-04-24 1998-11-02 정문술 Loading, unloading apparatus of semiconductor detector
JP3644553B2 (en) * 1995-11-20 2005-04-27 株式会社アドバンテスト IC socket
JPH1058367A (en) * 1996-08-23 1998-03-03 Advantest Corp Ic carrying device
US6097201A (en) * 1997-10-31 2000-08-01 Kinetrix, Inc. System to simultaneously test trays of integrated circuit packages

Also Published As

Publication number Publication date
MY125922A (en) 2006-08-30
KR100722643B1 (en) 2007-05-28
SG81268A1 (en) 2001-06-19
KR19990082895A (en) 1999-11-25
CN1230691A (en) 1999-10-06
TW429316B (en) 2001-04-11
DE19914775A1 (en) 1999-11-11
JPH11287842A (en) 1999-10-19

Similar Documents

Publication Publication Date Title
CN1171093C (en) IC testing device
CN1232185A (en) Pallet transfer arm, changing device and treatment method, and IC test device
CN1788206A (en) Electronic part test device
CN1788205A (en) Electronic component testing apparatus
CN1124492C (en) IC test device
CN1226635C (en) Tester for semiconductor devices and test tray used for the same
CN1254768C (en) Part recognition data creation method and apparatus, electronic part mounting apparatus and recorded medium
CN102435787B (en) Testing method and testing probe platform for image sensor chip
CN1206719C (en) Contactor, method of producing the same, and method of testing using the same
CN1479873A (en) Socket for electronic component test and electronic component test apparatus using the socket
CN1825719A (en) Contactor for electronic parts and a contact method
CN1612310A (en) Manufacturing method of semiconductor device and semiconductor device
CN1798979A (en) Insert for electronic component-handling device, tray, and electronic component handling device
CN1920585A (en) Substrate detector and substrate detection method
CN1873423A (en) Electronic element automatic moving loader
CN1820357A (en) Wafer expanding apparatus, component supplying apparatus and wafer sheet expanding method
CN1363042A (en) Apparatus and method for inspection
CN1263857A (en) Palletization transporting device for integral circuit assembly processer and transporting method thereof
CN1720612A (en) Component-supplying head device, component-supplying device, comonent-mounting device, and method of moving mounting head portion
CN1855416A (en) Substrate processing device
CN1379249A (en) Automatic inspecting device for semiconductor equipment
CN1942094A (en) Electronic component moving device, surface mounting machine and ic automatically conveying device
CN1167564A (en) Method of positioning IC and IC handler using the same
CN1267771C (en) Base board transport room and base board treating device
CN1928475A (en) Vacuum drying device and drying method for substrate

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20041013

Termination date: 20110402