CN1262888C - Substrate processing device, liquid processing device and liquid processing method - Google Patents

Substrate processing device, liquid processing device and liquid processing method Download PDF

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Publication number
CN1262888C
CN1262888C CNB02141002XA CN02141002A CN1262888C CN 1262888 C CN1262888 C CN 1262888C CN B02141002X A CNB02141002X A CN B02141002XA CN 02141002 A CN02141002 A CN 02141002A CN 1262888 C CN1262888 C CN 1262888C
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China
Prior art keywords
substrate
treating fluid
liquid
transmission
developer solution
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Expired - Fee Related
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CNB02141002XA
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CN1392454A (en
Inventor
立山清久
元田公男
佐田彻也
宫崎一仁
筱木武虎
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority claimed from JP2001184717A external-priority patent/JP3916891B2/en
Priority claimed from JP2001204170A external-priority patent/JP3704064B2/en
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)

Abstract

The invention aims to cutting processing liquid supplied to a substrate being processed on a carrying path laid in the horizontal direction from the substrate efficiently in a short time. When a substrate G reaches a specified position on a carrying path 108, rotation of a carrying roller 138 is interrupted to stop the substrate G. A drive section 188 is operated immediately thereafter to elevate an elevating/lowering shaft 186. Consequently, a base plate 182 and a lift pin 184 are raised too, and the substrate G is pushed up by the lift pin 184 above the carrying path 108. Subsequently, the base plate 182 is turned rearward at a specified angle about a shaft 196 extending in the widthwise direction of the carrying path 108. Consequently, a lift pin 192, a stopper member 194, and the substrate G incline rearward by the same angle on the carrying path 108. The substrate G is received by the stopper member 194 and liquid Q on the substrate G slips gravitationally rearward on the inclining face of the substrate and drops to the outside of the substrate. The liquid Q dropped from the substrate G is received in a pan 130.

Description

Substrate processing device, liquid processing device and liquid processing method
Technical field
The present invention relates to the processed substrate of horizontal transport limit, a kind of limit and carry out the substrate processing device of single or a succession of liquid treatment process.The present invention relates to a kind of liquid processing device and liquid processing method that substrates such as for example liquid crystal indicator (LCD) glass substrate is carried out liquid processing such as development treatment.
Background technology
Recently, in the resist-coating developing system that LCD (LCD) makes, as the visualization way that can advantageously maximize, lay transmission roller bearing or delivery in the horizontal direction and be with the so-called advection mode of a succession of development treatment operations such as develop in transmission in the transmission path top transmission LCD substrate limit that is constituted, rinsing, drying noticeable corresponding to the LCD substrate.This advection mode is compared with the spinner mode of the substrate that rotatablely moves, and following advantage is arranged: the processing of substrate or transmission system and drive system simple in structure, do not produce mist, and few etc. to adhering to again of substrate.
Usually, in the development processing apparatus of advection mode, fall ware shape container or the dish that the liquid under the transmission path is used being provided with to collect to each liquid handling part of developing procedure that downstream side is set successively, rinsing process along transmission path from upstream side, leakage fluid dram of each dish is connected on the other drainage system.
But, under existing advection mode, former state keeps flat-hand position on transmission path, from the liquid handling part of upstream side liquid handling part substrate transport to downstream side, so the treating fluid that uses in the liquid handling part of upstream side remains on the substrate, former state is delivered to the liquid handling part of downstream side, falls in the dish of downstream side and mixes, and is difficult to reclaim respectively each treating fluid.
In the manufacturing of LCD, LCD glass substrate (below be called ' LCD substrate ') go up form resist film after, corresponding to circuit pattern this resist film that exposes, use the so-called photoetching technique of carrying out development treatment afterwards, on the LCD substrate, form the circuit pattern of regulation.Here, for example for development treatment, open in the flat 11-87210 communique the spy and to disclose a kind of disposal route and treating apparatus, with flat-hand position behind coating developer solution on the substrate surface of a direction transmission, on substrate, form liquid layer, keep the stipulated time to carry out developing reaction, afterwards, lift end face one side of the direction vertical, substrate is transformed into inclination attitude with the substrate transmission direction, developer solution is flowed down, and the limit provide rinsing liquid with inclination attitude substrate transport limit to substrate.
But recently, strong request LCD substrate maximizes, Yi Bian till occurring reaching the huge LCD substrate of 1m.In the development treatment of LCD substrate, come to flow down under the situation of developer solution by the LCD substrate being become inclination attitude from the LCD substrate, if can not provide pure water to clean the developer solution residue to the LCD substrate rapidly, stop developing reaction, then produce the problem that development inequality or live width homogeneity worsen.
Therefore, in order to provide rinsing liquid to this large LCD substrate with inclination attitude high-speed transfer LCD substrate because be applied to the load of on-chip mechanical load of LCD or transmitting device, the various reasons such as stop condition of the LCD substrate under the high-speed transfer LCD substrate situation are difficult.For example, under the situation of high-speed transfer LCD substrate, the LCD substrate does not stop on the assigned position afterwards, crosses line and breakage when promptly stopping the LCD substrate, applies big load on the LCD substrate, the LCD damaged substrate.On the other hand, slowly under the situation, exist the photomechanical printing of developing apparatus must become big problem in the transmission speed of LCD substrate.
Summary of the invention
The invention provides a kind of substrate processing device, have: transmission path, lay in the horizontal direction and flatly carry the transmission body that processed substrate uses and constitute; The transmission driver part drives described transmission body, with the described substrate of transmission on described transmission path; Treating fluid provides parts, comprises one or more nozzles that the processed face of the described substrate on described transmission path provides predetermined processing liquid to use; With the substrate tilt component, on described transmission path, to the place ahead of described transmission path or the rear described substrate that tilts, so that liquid falls from described substrate because of gravity, described treating fluid provides one side direction the other end, an end, one side of the transmission direction of parts from described substrate to be coated with first treating fluid, described substrate tilt component relatively improves an end one side that begins to supply with treating fluid on described substrate, makes described substrate tilt.
The present invention also provides a kind of substrate is carried out the liquid processing device that standard solution is handled, and possesses: the first liquid handling part is coated with treating fluid on the substrate that keeps flat-hand position; The second liquid handling part is removed described treating fluid from the substrate that has been coated with described treating fluid; And substrate transmission mechanism, from the described first liquid handling part to the described second liquid handling part with flat-hand position to a direction substrate transport, the described first liquid handling part has treating fluid provides mechanism, from the place ahead of the substrate transmission direction of described substrate transmission mechanism rearward, the described treating fluid of coating on described substrate, the described second liquid handling part has the substrate leaning device, lift the place ahead of the transmission direction of the substrate that has been coated with described treating fluid, described substrate is transformed to inclination attitude, removes and be coated on described on-chip treating fluid.
The present invention also provides a kind of substrate is carried out the liquid processing device that standard solution is handled, and possesses: the first liquid handling part, coating first treating fluid on the substrate that keeps flat-hand position; The second liquid handling part is removed described first treating fluid from the substrate that has been coated with described first treating fluid; And substrate transmission mechanism, be coated with the substrate of described first treating fluid to a direction transmission with flat-hand position to the described second liquid handling part from the described first liquid handling part, the described first liquid handling part is coated with first treating fluid from one side direction the other end, an end, one side of the transmission direction of described substrate, the described second liquid handling part has: the substrate leaning device, lift a described end one side of the substrate that has been coated with described first treating fluid, described substrate is transformed to inclination attitude, removes and be coated on described on-chip first treating fluid; The treating fluid jetting nozzle, the residue of described first treating fluid of outflow sprays second treating fluid to described substrate from the substrate that is remained inclination attitude by described substrate leaning device; And nozzle moving mechanism, along the substrate surface that remains inclination attitude by described substrate leaning device, oblique mobile described treating fluid jetting nozzle.
It is a kind of to implementing the liquid processing method that standard solution is handled with flat-hand position along the substrate of a direction transmission that the present invention also provides, and has: with first operation of flat-hand position to the first liquid processing region substrate transport of coating first treating fluid on substrate; Stopping under the state of described substrate,, rearward be coated with second operation of described first treating fluid from the place ahead of described substrate transmission direction at described substrate by on described substrate, moving the nozzle of described first treating fluid of ejection; Be coated with the 3rd operation of the substrate of described first treating fluid to the second liquid processing region transmission of removing first treating fluid from described substrate with flat-hand position; Lift the transmission direction front side of described substrate, and make described substrate inclination predetermined angular, remove the 4th operation of described first treating fluid from described substrate; With the state that described substrate is remained on the inclination predetermined angular, the limit is from the position that provides that the downward square end of the upper end of described substrate moves described second treating fluid, and the limit provides the 5th operation that flows out second treating fluid of described first treating fluid from described substrate to described substrate.
The present invention further provides and a kind of the substrate of having implemented exposure-processed is implemented the liquid processing device of development treatment, possess: the first liquid handling part is coated with developer solution on the substrate that keeps flat-hand position; The second liquid handling part is removed described developer solution from the substrate that has been coated with described developer solution; And substrate transmission mechanism, from the described first liquid handling part to the described second liquid handling part with flat-hand position to a direction substrate transport, the described first liquid handling part has: developing nozzle sprays described developer solution; With developing nozzle travel mechanism, flatly move described developing nozzle with fixing speed along described substrate surface, so that from the place ahead of the substrate transmission direction of described substrate transmission mechanism rearward at the described developer solution of described substrate coating, the described second liquid handling part has: the substrate leaning device, lift the transmission direction front side of the substrate that has been coated with described developer solution, described substrate is transformed to inclination attitude, removes and be coated on described on-chip developer solution; Rinse nozzle, the rinsing liquid of described developer solution is cleaned in ejection; With rinse nozzle travel mechanism, move described rinse nozzle along described substrate surface obliquely with fixing speed, spray described rinsing liquid to described substrate so that the limit, position that provides that the downward square end of upper end of the substrate of inclination attitude moves described second treating fluid is provided from described substrate leaning device on the limit.
The present invention also provides a kind of liquid processing method of development treatment of the substrate that has carried out exposure-processed, has: with first operation of flat-hand position to the first liquid processing region substrate transport of coating developer solution on substrate; Stopping under the state of described substrate,, rearward be coated with second operation of described developer solution from the place ahead of described substrate transmission direction at described substrate by on described substrate, moving the nozzle of the described developer solution of ejection; Be coated with the 3rd operation of the substrate of described developer solution to the second liquid processing region transmission of removing developer solution from described substrate with flat-hand position; Lift the transmission direction front side of described substrate, and make described substrate inclination predetermined angular, remove the 4th operation of described developer solution from described substrate; With the state that described substrate is remained on the inclination predetermined angular, the limit is from the position that provides that the downward square end of the upper end of described substrate moves rinsing liquid, and the limit provides the 5th operation that flows out the rinsing liquid of described developer solution from described substrate to described substrate.
In view of above-mentioned prior art problems, the object of the present invention is to provide a kind of substrate processing device, in the horizontal direction on the transmission path of Pu Sheing, remove the treating fluid that provides to processed substrate from substrate efficiently with the unit interval.
Another object of the present invention is to provide a kind of substrate processing device, on the transmission path of Pu Sheing, reclaim to high-purity the treating fluid that provides to processed substrate respectively in the horizontal direction.
In view of above-mentioned item, the invention provides a kind of liquid processing device and liquid processing method, even large-scale substrate also can carry out uniform liquid on the whole at substrate and handle.
To achieve these goals, substrate processing device of the present invention has: transmission path, and lay in the horizontal direction and essentially horizontally carry the transmission body that processed substrate uses and constitute; The transmission driver part drives described transmission body, with the described substrate of transmission on described transmission path; Treating fluid provides parts, comprises one or more nozzles that the processed face of the described substrate on described transmission path provides predetermined processing liquid to use; With the substrate tilt component, described substrate is tilted, so that liquid falls from described substrate because of gravity.
In said structure, provide the processed face of the substrate of parts that treating fluid is provided by treating fluid to flat-hand position, the liquid stipulated is handled, and handles on the meron still residual liquid.But, at the downstream side of transmission path, substrate is tilted by the substrate tilt component, adhere to or remain in on-chip liquid because of gravity from the landing of substrate dip plane, and fall outside the substrate rapidly.The direction of inclination substrate is the place ahead or the rear of transmission path preferably.
In substrate processing device of the present invention, the structure of the preferred example of substrate tilt component is to have Lift Part, mobile substrate between the primary importance of transmission path and the second place above it; With the heeling condition holding member, on the second place, keep the state of inclination substrate.In this structure, Lift Part lifts substrate from primary importance to the second place, and the second place place of substrate above transmission path tilted.Preferably, substrate posture switching part is set, in the posture of between horizontality and heeling condition, switching substrate on the second place.
The structure of other preferred example of substrate tilt component has transmission body tilt component, in the interval of setting on mobile transmission path, moves the transmission body between the 4th position of the inclination that the 3rd position and the liquid of the basic horizontal on the transmission path falls usefulness; With the heeling condition holding member, on the transmission body of the 4th position, keep the state of inclination substrate.In this structure, clutch mechanism preferably is set, the transmission body that belongs to this interval releasably is connected on the transmission driver part.
In substrate processing device of the present invention,, preferably be provided for collecting the liquid collecting parts of falling liquid below the transmission path for recycle process fluids.In the difference recycle process fluids, the structure of liquid collecting parts is preferably in and comprises the first and second liquid collecting portions that fall the liquid under the transmission path of collecting that are respectively applied in first and second intervals that the front and back adjacency is set on the transmission path, and treating fluid provides the structure of parts preferably to comprise and is configured in the first and second interval first and second interior nozzles respectively.At this moment, in order to improve the purity of the liquid that reclaims respectively in first and second intervals, the substrate tilt component preferably includes the first substrate rake that substrate is tilted, so that the on-chip liquid that provides in first interval falls into the first liquid collecting portion before entering second interval.
According to a first aspect of the invention, provide a kind of substrate carried out the liquid processing device that standard solution is handled, possess:
The first liquid handling part is coated with treating fluid on the substrate of basic maintenance flat-hand position; The second liquid handling part is removed described treating fluid from the substrate that has been coated with described treating fluid; And substrate transmission mechanism, from the described first liquid handling part to the described second liquid handling part with the basic horizontal posture to a direction substrate transport,
The described first liquid handling part has treating fluid provides mechanism, from the place ahead of the substrate transmission direction of described substrate transmission mechanism rearward, and the described treating fluid of coating on described substrate,
The described second liquid handling part has the substrate leaning device, lifts the place ahead of the transmission direction of the substrate that has been coated with described treating fluid, and described substrate is transformed to inclination attitude, remove to be coated on described on-chip treating fluid,
The described second liquid handling part has the substrate leaning device, lifts the place ahead of the transmission direction of the substrate that has been coated with described treating fluid, and described substrate is transformed to inclination attitude, removes to be coated on described on-chip treating fluid.
In the liquid processing device of this first aspect, the direction that flows down from substrate at the direction of coating treating fluid on substrate treating fluid when removing the treating fluid that is coated with on the substrate is an equidirectional, because the time for the treatment of fluid contact substrate is whole impartial to substrate, handle so can carry out uniform liquid to substrate integral body.
According to a second aspect of the invention, provide a kind of substrate carried out the liquid processing device that standard solution is handled, possess:
The first liquid handling part, coating first treating fluid on the substrate of basic maintenance flat-hand position; The second liquid handling part is removed described first treating fluid from the substrate that has been coated with described first treating fluid; And substrate transmission mechanism, transmit the substrate that be coated with described first treating fluid with the basic horizontal posture to a direction to the described second liquid handling part from the described first liquid handling part,
The described second liquid handling part has the substrate leaning device, lifts an end of the substrate that has been coated with described first treating fluid, and described substrate is transformed to inclination attitude, removes to be coated on described on-chip first treating fluid; The treating fluid jetting nozzle, the residue of described first treating fluid of outflow sprays second treating fluid to described substrate from the substrate that is remained inclination attitude by described substrate leaning device; And nozzle moving mechanism, along the substrate surface that remains inclination attitude by described substrate leaning device, oblique mobile described treating fluid jetting nozzle.
In the liquid processing device of this second aspect, spray second treating fluid limit with fixing speed, preferably high-speed mobile treating fluid jetting nozzle from the treating fluid jetting nozzle to substrate by the limit, remove the residue of first treating fluid from substrate.Therefore, the time of first treating fluid contact substrate is whole impartial to substrate, so available first treating fluid carries out uniform treatment to substrate.
According to a third aspect of the invention we, provide a kind of substrate carried out the liquid processing device that standard solution is handled, possess:
The first liquid handling part, coating first treating fluid on the substrate of basic maintenance flat-hand position; The second liquid handling part is removed described first treating fluid from the substrate that has been coated with described first treating fluid; And substrate transmission mechanism, from the described first liquid handling part to the described second liquid handling part with the basic horizontal posture to a direction substrate transport,
The described first liquid handling part has first treating fluid provides mechanism, from the place ahead of the substrate transmission direction of described substrate transmission mechanism rearward, and described first treating fluid of coating on described substrate,
The described second liquid handling part has the substrate leaning device, lifts the transmission direction front of the substrate that has been coated with described first treating fluid, and described substrate is transformed to inclination attitude, removes to be coated on described on-chip first treating fluid; Provide mechanism with second treating fluid, the limit is moved described second treating fluid from the downward square end of the upper end of described substrate the position is provided, and the limit provides to described substrate flows out the second used treating fluid of the described first treating fluid residue from the substrate that is remained inclination attitude by described substrate leaning device.
In the liquid processing device of this third aspect, be coated on on-chip first treating fluid and begin by from the part that begins to be coated with first treating fluid, removing, the time of first treating fluid contact substrate is whole impartial to substrate, and available first treating fluid carries out uniform treatment to substrate.
According to a forth aspect of the invention, provide a kind of, have implementing the liquid processing method that standard solution is handled along the substrate of a direction transmission with the basic horizontal posture:
With first operation of basic horizontal posture to the first liquid processing region substrate transport of coating first treating fluid on substrate; Second operation of described first treating fluid of coating on described substrate; Be coated with the 3rd operation of the substrate of described first treating fluid to the second liquid processing region transmission of removing first treating fluid from described substrate with the basic horizontal posture; Lift the transmission direction front side of described substrate, and make described substrate inclination predetermined angular, remove the 4th operation of described first treating fluid from described substrate; With the state that described substrate is remained on the inclination predetermined angular, the limit is from the position that provides that the downward square end of the upper end of described substrate moves described second treating fluid, and the limit provides the 5th operation that flows out second treating fluid of described first treating fluid from described substrate to described substrate.
According to a fifth aspect of the invention, provide a kind of the substrate of having implemented exposure-processed implemented the liquid processing device of development treatment, possess:
The first liquid handling part is coated with developer solution on the substrate of basic maintenance flat-hand position; The second liquid handling part is removed described developer solution from the substrate that has been coated with described developer solution; And substrate transmission mechanism, from the described first liquid handling part to the described second liquid handling part with the basic horizontal posture to a direction substrate transport,
The described second liquid handling part has the substrate leaning device, lifts the transmission direction front side of the substrate that has been coated with described developer solution, and described substrate is transformed to inclination attitude, removes to be coated on described on-chip developer solution; Rinse nozzle, the rinsing liquid of described developer solution is cleaned in ejection; With rinse nozzle travel mechanism, move described rinse nozzle along described substrate surface obliquely with fixing speed, spray described rinsing liquid to described substrate so that the limit, position that provides that the downward square end of upper end of the substrate of inclination attitude moves described second treating fluid is provided from described substrate leaning device on the limit.
In the liquid processing device aspect the 5th, be coated on on-chip developer solution and begin by removing from the part that begins to be coated with developer solution, the time of developer solution contact substrate is whole impartial to substrate.Therefore, can prevent the inequality of developing, obtain high live width homogeneity.
According to a sixth aspect of the invention, provide a kind of substrate that has carried out exposure-processed development treatment liquid processing method, have:
With first operation of basic horizontal posture to the first liquid processing region substrate transport of coating developer solution on substrate; Second operation of coating developer solution on described substrate; Be coated with the 3rd operation of the substrate of described developer solution to the second liquid processing region transmission of removing developer solution from described substrate with the basic horizontal posture; Lift the transmission direction front side of described substrate, and make described substrate inclination predetermined angular, remove the 4th operation of described developer solution from described substrate; With the state that described substrate is remained on the inclination predetermined angular, the limit is from the position that provides that the downward square end of the upper end of described substrate moves described rinsing liquid, and the limit provides the 5th operation that flows out the rinsing liquid of described developer solution from described substrate to described substrate.
According to liquid processing device of the present invention and liquid processing method, because the time that can contact with substrate the whole equalization process liquid of substrate, so can evenly carry out the liquid processing of substrate on the whole at substrate.Therefore, can obtain high-quality substrate.In addition, because high-speed transfer substrate not improves so handle security, suppressed the damaged of substrate or damage, essential space does not enlarge yet when the transmission that stops substrate.In addition, flow out in the situation of coating first treating fluid on the substrate, with second treating fluid under the situation or situation of first treating fluid with rinsing liquid cleaning developer solution, by moving the nozzle that treating fluid is provided to substrate, the liquid that can carry out at short notice in the first liquid handling part and the second liquid handling part is handled, and can boost productivity.
Description of drawings
Fig. 1 is the planimetric map of the structure of expression development processing apparatus of the present invention coating developing system applicatory.
Fig. 2 is the outboard profile of the structure of the thermal treatment portion in the above-mentioned coating developing system of expression.
Fig. 3 is the process flow diagram of the processing sequence in the above-mentioned coating developing system of expression.
Fig. 4 is the integrally-built front view (FV) of developing cell among the expression embodiment.
Fig. 5 is that substrate is moved into portion and pre-wet end structural plan figure on every side in the above-mentioned developing cell of expression.
Fig. 6 is the part section planimetric map that substrate is moved into portion and pre-wet end structure on every side in the above-mentioned developing cell of expression.
Fig. 7 is that substrate is moved into the structure of portion and the part section planimetric map of effect (transmission of substrate) in the above-mentioned developing cell of expression.
Fig. 8 is that the above-mentioned substrate of expression is moved into the structure of portion and the part section planimetric map of effect (moving of substrate).
Fig. 9 is the part section planimetric map of the structure of nozzle scan mechanism in the above-mentioned developing cell of expression.
Figure 10 is the oblique view of the above-mentioned scanning mechanism structure of expression.
Figure 11 is the structure of substrate leaning device among the expression embodiment and the part section front view (FV) of effect (substrate lifts).
Figure 12 is the structure of substrate leaning device among the expression embodiment and the part section front view (FV) of effect (substrate inclination).
Figure 13 A and 13B are the general lateral figure of the effect of nozzle scan mechanism among the expression embodiment.
Figure 14 is the general lateral figure of the effect of air knife among the expression embodiment.
Figure 15 is the part section front view (FV) of the structure of substrate leaning device among other embodiment of expression.
Figure 16 is the structure of substrate leaning device among the expression embodiment and the part section front view (FV) of effect (substrate level posture).
Figure 17 is the structure of substrate leaning device among the expression embodiment and the part section front view (FV) of effect (substrate inclination attitude).
Figure 18 A, 18B and 18C are the figure that spendable substrate arrives the structure example of detecting sensor in the substrate leaning device of expression embodiment.
Figure 19 is as the resist-coating with development treatment unit of liquid processing device one embodiment of the present invention, the schematic plan view of developing system.
Figure 20 is the outboard profile of the first thermal treatment unit portion of expression resist-coating shown in Figure 19, developing system.
Figure 21 is the outboard profile of the second thermal treatment unit portion of expression resist-coating shown in Figure 19, developing system.
Figure 22 is the outboard profile of the 3rd thermal treatment unit portion of expression resist-coating shown in Figure 19, developing system.
Figure 23 is the outboard profile of expression as the development treatment unit schematic construction of one embodiment of the invention.
Figure 24 is the outboard profile of expression as the development treatment unit schematic construction of one embodiment of the invention.
Figure 25 A, 25B and 25C are the key diagrams that is arranged on the substrate leaning device in removal/rinsing district that the development treatment unit has.
Figure 26 is the key diagram (process flow diagram) of expression development treatment operation signal.
Embodiment
(embodiment 1)
Fig. 1 represents the coating developing system as a structure example that is suitable for development processing apparatus of the present invention.This coating developing system 10 is arranged in the dust free room, for example with the LCD substrate as processed substrate, in the LCD manufacture process, each is handled to carry out cleaning in the lithography operation, resist-coating, prebake, development and back oven dry etc.By carrying out exposure-processed in abutting connection with the outside exposure device 12 that is provided with this system.
This coating developing system 10 is gone up configuration tray salver platform (C/S) 14 and interface platform (I/F) 18 in the laterally long machine table (P/S) 16 of central part configuration at its length direction (both ends of directions X).
Tray salver platform (C/S) the 10th, the tray salver of system 10 are moved into and are taken out of end, possess multistage overlapping substrate G ground in the horizontal direction, load the tray salver platform 20 of four tray salver C that can hold multi-disc on for example Y direction side by side and this tray salver C on 20 carried out substrate G send into the transport sector of sending 22.Transport sector 22 has the parts that can keep substrate G, and for example transfer arm 22a can move on X, Y, four axles of Z, θ, carries out the transmission of substrate G with adjacent machine table (P/S) 16 sides.
Parallel and last each handling part of arranged in order of pair of opposite line A, B that machine table (P/S) 16 is extended in director's direction (directions X) according to work flow or step.Particularly, from the processing line A of the upper reaches portion of tray salver platform (C/S) 14 side direction interface platforms (I/F) 18 sides, a horizontal row ground configuration is cleaned and is added the Ministry of worker 24, the first thermal treatment portion 26, coating and add the Ministry of worker 28, the second thermal treatment portion 30.On the other hand, from the processing line B of the dirty portion of interface platform (I/F) 18 side direction tray salver platforms (C/S) 14 sides, horizontal row ground configuration second a thermal treatment portion 30, development adds the Ministry of worker 32, fading adds the Ministry of worker 34, the 3rd thermal treatment portion 36.Under this line states, the second thermal treatment portion 30 is positioned at the least significant end of upstream side processing line A, is positioned at the top of downstream side processing line B simultaneously, between two line A, B.
Auxiliary transmission space 38 is set, so that be that the shuttle 40 of unit level loading substrate G can move by not shown driving mechanism direction along the line (directions X) two-wayly with one between two processing line A, B.
In the processing line A of upper reaches portion, clean and to add the Ministry of worker 24 and comprise washing and clean unit (SCR) 42, dispose excite state atom UV illumination unit (e-UV) 41 cleaning on the adjacent position of tray salver platform (C/S) 10 in the unit (SCR) 42 with this washing.Though omit diagram, the clean portion limits that washing is cleaned in the unit (SCR) 42 transmits LCD substrate G by roller bearing transmission or band transmission with flat-hand position on the A direction, the limit to top (the processed face) of substrate G wash clean or wind clean.
The adjacent first thermal treatment portion 26 is provided with the transport sector 46 of longitudinal type along processing line A at central part with cleaning the downstream side add the Ministry of worker 24, and the multistage lamination in both sides is provided with a plurality of unit before and after it.For example, as shown in Figure 2, in the multi-level unit portion (TB) 44 of upstream side, the delivery unit (PASS) 50, heating unit (DHP) 52,54 and the coherent unit (AD) 56 that dewatered drying is used of the overlapping substrate transmission usefulness of order from bottom to top.Here, delivery unit (PASS) 50 is used for carrying out the transmission of substrate G with the clean unit (SCR) of washing 42 sides.In addition, in the multi-level unit portion (TB) 48 of downstream side, from bottom to top the order overlapping substrate transmission usefulness delivery unit (PASS) 60, cooling unit (CL) 62,64 and coherent unit (AD) 66.Here, delivery unit (PASS) 60 adds the Ministry of worker 28 with coating and carries out the transmission of substrate G.
As shown in Figure 2, transport sector 46 have the lifting transmission body 70 of guiding rail 68 lifting moving that can vertically extend, at these lifting transmission body 70 upper edge θ directions rotations or the transmission body 72 that circles round that circles round, at this circle round transmission support substrate G limit, body 72 top direction advance and retreat or flexible transfer arm or pincette 74 forwards, backwards.Base end side at vertical guide guide rail 68 is provided with the drive division 76 that lifting drives lifting transmission body 70, installation is circled round and is driven the drive division 78 of the transmission body 72 that circles round on vertical transfer body 70, installs to advance and retreat to drive the drive division 80 of transfer arm 74 usefulness on the transmission body 72 that circles round.Each drive division 76,78,80 for example is made of motor etc.
But the transport sector 46 high speed lifting or the circumnutations of above-mentioned formation, any unit in the multi-level unit portion (TB) 44,48 of two adjacency of visit also can transmit substrate G with the shuttle 40 of auxiliary transmission space 38 sides.
As shown in Figure 1, the coating in abutting connection with the first thermal treatment portion, 26 downstream sides adds the Ministry of worker 28 along processing line A one row configuration resist-coating unit (CT) 82, drying under reduced pressure unit (VD) 84 and removal unit, edge (ER) 86.Though the diagram of omission, but in coating adds the Ministry of worker 28, each moves into, takes out of the transmitting device of a substrate G by process sequence in setting on these three unit (CT) 82, (VD) 84, (ER) 86, carries out each with every substrate unit and handle in each unit (CT) 82, (VD) 84, (ER) 86.
Has identical structure in abutting connection with the second thermal treatment portion 30 that coating adds the Ministry of worker's 28 downstream sides with the above-mentioned first thermal treatment portion 26, longitudinal type transport sector 90 is set between two processing line A, B, a multi-level unit portion (TB) 88 is set, another multi-level unit portion (TB) 92 is set at processing line B (top) in processing line A side (rearmost end).
Though omit diagram, for example in the multi-level unit portion (TB) 88 of processing line A side, be provided with to subordinate and transmit the delivery unit (PASS) that substrate is used, thereon three grades of heating units (PREBAKE) that overlapping prebake is used for example.In addition, in the multi-level unit portion (TB) 92 of processing line B side, be provided with to subordinate and transmit the delivery unit (PASS) that substrate is used, the overlapping cooling unit of one-level (COL) for example thereon, the heating unit (PREBAKE) used of the overlapping prebake of secondary for example thereon.
Transport sector 90 in the second thermal treatment portion 30 can be that unit and coating add the Ministry of worker 28 and development adds the 32 transmission substrate G of the Ministry of worker with one by two multi-level unit portions (TB) 88,92 delivery unit (PASS) separately not only, and, also can one be that shuttle 40 or the interface platform described later (I/F) 18 in unit and the auxiliary transmission space 38 transmits substrate G.
In the processing line B of dirty portion, development adds the Ministry of worker 32 and comprises the so-called advection mode of a succession of development treatment operation is carried out on the limit with flat-hand position substrate transport G limit developing cell (DEV) 94.Describe the structure and the effect of this developing cell (DEV) 94 below in detail.
The downstream side clamping that adds the Ministry of worker 32 in development is faded and is added 34 configurations the 3rd thermal treatment portion 36 of the Ministry of worker.Fade and add the Ministry of worker 34 and possess the i line UV illumination unit (i-UV) 96 that carries out fade treatment to processed of substrate G irradiation i line (wavelength 365nm).
The 3rd thermal treatment portion 36 has the structure identical with the second thermal treatment portion 30 with the above-mentioned first thermal treatment portion 26, along processing line B longitudinal type transport sector 100 is set and before and after it both sides a pair of multi-level unit portion (TB) 98,102 is set.
Though omit diagram, for example in the multi-level unit portion (TB) 98 of upstream side, delivery unit (PASS) is set, thereon three grades of heating units (PREBAKE) that overlapping prebake is used for example in subordinate.In addition, in the multi-level unit portion (TB) 102 of downstream side, back drying unit (POBAKE) is set in subordinate, thereon the overlapping transmission substrate of one-level and the cooling usefulness transmission, cooling unit (PASS, COL), the heating unit (POBAKE) that the overlapping prebake of secondary is thereon used.
The not only delivery unit (PASS) by two multi-level unit portions (TB) 98,102 and the transmission of transport sector 100 in the 3rd thermal treatment portion 36, cooling unit (PASS, COL) be that unit transmits substrate G with i line UV illumination unit (i-UV) 96 and tray salver platform (C/S) 14 respectively with one, and are the interior shuttle 40 transmission substrate G of unit and auxiliary transmission space 38 with one.
Interface platform (I/F) 18 has the transmitting device 104 that carries out the reception usefulness of substrate G with adjacent exposure device 12, disposes buffer table (BUF) 106, extension, cooling bench (EXT, COL) 108 and peripheral unit 110 around it.Fixation type buffering tray salver (not shown) is set in buffer table (BUF) 106.Extend, cooling bench (EXT, COL) the 108th, have the platform that the transmission substrate of refrigerating function is used, when receiving substrate G, use with machine table (P/S) 16 side joints.Peripheral unit 110 for example can be in that up and down overlapping captions recording device (TITLER) and external exposure device (EE) constitute.Transmitting device 104 has the parts that can keep substrate G, and transfer arm 104a for example carries out the transmission of substrate G with adjacent exposure device 12 or each unit (BUF) 106, (EXT, COL) 108, (TITLER/EE) 110.
Processing sequence among Fig. 3 in this coating developing system of expression.At first, in tray salver platform (C/S) 14, take out a substrate G the regulation tray salver C of transport sector 22 from platform 20, in the clean excite state atom UV illumination unit (e-UV) 41 that adds the Ministry of worker 24 of moving into machine table (P/S) 16 (step S1).
In excite state atom UV illumination unit (e-UV) 41,, substrate G is carried out thermal drying (step S2) by irradiation ultraviolet radiation.In this ultraviolet ray is cleaned, mainly remove the organism of substrate surface.After finishing ultraviolet cleaning, transfer substrate G to cleaning the clean unit (SCR) 42 of the washing that adds the Ministry of worker 24 by the transport sector 22 of tray salver platform (C/S) 14.
Clean in the unit (SCR) 42 in washing, as mentioned above, transmit with flat-hand position advection substrate transport G on processing line A direction by roller bearing transmission or band on the limit, the limit is washed top (the processed face) of substrate G and is cleaned or wind is cleaned, and removes emboliform dirt (step S3) from substrate surface.In addition, remove liquid by air knife etc., make substrate G drying on advection substrate transport G limit, clean back.
To wash to clean to finish in the unit (SCR) 42 and clean the substrate G that handles and move in the delivery unit (PASS) 50 in the 26 upstream side multi-level unit portions (TB) 44 of the first thermal treatment portion.
In the first thermal treatment portion 26, in proper order substrate G is returned the regulation unit in accordance with regulations by transport sector 46.For example, at first from delivery unit (PASS) 50 to one of heating unit (DHP) 52,54 transfer substrates G, carry out processed (step S4) afterwards.Secondly, move to one of cooling unit (COL) 62,64, be cooled to the substrate temperature of stipulating (step S5) there to substrate G.Then, substrate G moves to coherent unit (AD) 56, accepts hydrophobic treatments (step S6) there.After hydrophobic treatments finishes, the substrate temperature (step S7) that substrate G is cooled to stipulate by one of cooling unit (COL) 62,64.At last, substrate G is moved to the delivery unit (PASS) 50 that belongs to downstream side multi-level unit portion (TB) 48.
Thus, in the first thermal treatment portion 26, can between the multi-level unit portion (TB) 48 of (TB) 44 of multi-level unit portion of upstream side and downstream side, transmit substrate G arbitrarily by transport sector 46.The second and the 3rd thermal treatment portion 30,36 also can carry out identical substrates transmission action.
The substrate G that accepts above-mentioned a succession of heat or hot series of processes in the first thermal treatment portion 26 is moved to the resist-coating unit (CT) 82 that the adjacent coating of downstream side adds the Ministry of worker 28 from the delivery unit (PASS) 60 in the downstream side multi-level unit portion (TB) 48.
Substrate G goes up painting erosion resistant agent liquid by resist-coating unit (CT) 82 by for example spin-coating method (processed face) on substrate, afterwards, receiving adjacent drying under reduced pressure unit (VD) 84 drying under reduced pressure of downstream side handles, then, remove unit (ER) 86 by the adjacent edge of downstream side and remove the resist (step S8) of substrate edge portion unnecessary (not wanting).
The substrate G that accepts above-mentioned resist-coating processing is delivered to the delivery unit (PASS) of the upstream side multi-level unit portion (TB) 88 that belongs to the adjacent second thermal treatment portion 30 from drying under reduced pressure unit (VD) 84.
In the second thermal treatment portion 30, order moves back to the regulation unit by transport sector 90 with substrate G in accordance with regulations.For example, at first substrate G is moved to one of heating unit (PREBAKE) from this delivery unit (PASS), receive the prebake (step S9) after the resist-coating afterwards.Secondly, move to one of cooling unit (COL), be cooled to the substrate temperature of stipulating (step S10) there.Afterwards, substrate G is via the delivery unit (PASS) of downstream side multi-level unit portion (TB) 92 sides or be not passed to extension, the cooling (EXT, COL) 108 of interface platform (I/F) 18 sides via delivery unit (PASS).
In interface platform (I/F) 18, substrate G is moved into the external exposure device (EE) of peripheral unit 110 from extension, cooling bench (EXT, COL) 108, after removing the exposure of using attached to the resist on the substrate G outer part when accepting to develop there, send adjacent exposure device 12 (step S11) to.
The specified circuit pattern of exposing in the resist of exposure device 12 on substrate G.Afterwards, when the substrate G after pattern exposure is finished returns interface platform (I/F) 18 from exposure device 12 (step S11), at first, move into the captions recording device (TITLRER) of peripheral unit 110, the information (step S12) of recording prescribed in on-chip regulation position.Afterwards, substrate G is returned extension, cooling bench (EXT, COL) 108.Transmitting device 104 extends, the transmission of the substrate G of cooling bench (EXT, COL) 108 and with the reception of the substrate G of exposure device 12.
In machine table (P/S) 16, transport sector 90 passes to development by the delivery units (PASS) in the multi-level unit portion (TB) 92 of processing line B side and adds the Ministry of worker 32 by the substrate G that extends, cooling bench (EXT, COL) 108 reception exposures are finished in the second thermal treatment portion 30.
Add in the Ministry of worker 32 in development, the substrate G that will receive from the delivery unit (PASS) in this multi-level unit portion (TB) 92 moves into developing cell (DEV) 94.In developing cell (DEV) 94, to processing line B dirty in the advection mode by flat-hand position substrate transport G, in this transmission, develop, rinsing, dry a succession of development treatment operation (step S13).
To add the substrate G that accepts development treatment in the Ministry of worker 32 in development and move into adjacent the fading of downstream side and add in the Ministry of worker 34, accept the fade treatment (step S14) of i line irradiation there.The substrate G that finishes fade treatment is passed to delivery unit (PASS) in the 36 upstream side multi-level unit portions (TB) 98 of the 3rd thermal treatment portion.
In the 3rd thermal treatment portion (TB) 98, at first substrate G is moved on to one of machining cell (POBAKE) from this delivery unit (PASS), accept back oven dry (step S15) there.Then, substrate G is moved to transmission cooling unit (PASS, COL) in the downstream side multi-level unit portion (TB) 102, be cooled to the substrate temperature of stipulating (step S16) there.Transport sector 100 carries out the transmission of the substrate G in the 3rd thermal treatment portion 36.
In tray salver platform (C/S) 14 sides, transport sector 22 is accepted to finish the substrate G that is coated with the whole process of development treatment from the transmission cooling unit (PASS, COL) of the 3rd thermal treatment portion 36, and the substrate G that receives is contained among arbitrary tray salver C (step S1).
In this coating developing system 10, the present invention can being applicable to for example develops adds the developing cell (DEV) 94 of the Ministry of worker 32.Below, the embodiment that the present invention is applicable to developing cell (DEV) 94 is described with reference to Fig. 4-Figure 18.
The one-piece construction in the developing cell (DEV) 94 of one embodiment of the invention has been represented on pattern ground among Fig. 4.This developing cell (DEV) 94 disposes continuously along processing line B one row and forms a plurality of for example 8 module M1-M8 that horizontal direction (directions X) goes up the continuous transmission path 108 that extends.
The module M1 that is positioned at upper reaches end among these modules M1-M8 constitutes substrate and moves into portion 110, four module M2, the M3, M4, the M5 that are connected on thereafter constitute development section 112, module M6 afterwards constitutes rinsing portion 114, module M7 again constitutes drying section 116, and last module M8 constitutes substrate and takes out of portion 118.
Move in the portion 110 to be provided with at substrate and accept with flat-hand position to transfer to liftable a plurality of stripper pins 120 of using on the transmission path 108 behind the substrate G that adjacent substrate transmission mechanism (not shown) transmission comes.Take out of at substrate liftable a plurality of stripper pins 122 of transferring to adjacent substrate transmission mechanism (not shown) usefulness after lifting substrate G with flat-hand position also are set in the portion 118.
Particularly, development section 112 is provided with pre-wet end 124 in module M2, developer solution is set in module M3, M4 portion 126 is provided, and the developer solution portion 128 of dripping is set in module M5.In pre-wet end 124, be provided with one or more on transmission path 108 to the nozzle ejiction opening along transmission path 108 can two-wayly move, to substrate provide prewetting liquid for example the prewetting liquid used of pure water nozzle PN is provided.Provide in the portion 126 at developer solution, be provided with and one or morely on transmission path 108, can two-wayly move, provide the developer solution of developer solution that nozzle DN is provided along transmission path 108 to substrate to the nozzle ejiction opening.In this structure example, the developer solution that can independently move all is set at module M3, M4 in each nozzle DNa, DNb are provided.In dripping developer solution portion 128 and pre-wet end 124, the aftermentioned substrate leaning device 180 (Figure 11, Figure 12) that makes substrate G inclination usefulness is set.
In rinsing portion 114, be provided with one or more on transmission path 108 to the nozzle ejiction opening along transmission path 108 can two-wayly move, to substrate provide rinsing liquid for example the rinsing liquid used of pure water nozzle RN is provided.In drying section 116, clamping transmission path 108 ground are provided with one or more pairs of air knife EN that remove attached to the liquid on the substrate G (mainly being rinsing liquid) usefulness along transmission path 108.
In development section 112 and rinsing portion 114, be provided with respectively to collect and fall the plate 130,132,134 that transmission path 108 following liquid are used.Particularly, in development section 112, portion 126 is provided and drips the plate 130,132 that developer solution portion 128 doses special use respectively to pre-wet end 124, developer solution.Bottom at each plate 130,132,134 is provided with leakage fluid dram, connects the discharging tube 131,133,135 of different drainage systems thereon.
Fig. 5-Fig. 8 represents that substrate moves into the structure around the transmission path 108 in portion 110 and the pre-wet end 124.
Transmission path 108 constitutes along processing line B level and is laid on the rotatable shaft 136 the roller bearing mode transmission transmission path that a pair of delivery roll 138A, the 138B of fixed interval are in accordance with regulations constituted.
Particularly, at certain intervals bearing 142A, 142B are installed in along the direction of processing line B on the top or axle bed parts 140 of left and right sides wall of each module M, rotatably across on each pair of bearings 142A, 142B, make delivery roll 138A, 138B be positioned at the inboard of left and right sides wall on axle 136.In addition, fixing spring gear 144 on an end of extending more laterally than each one-sided bearing 142A of 136, each gear of the spring 148 of rotating driveshaft 146 sides of extending along processing line B direction is engaged on each gear of the spring 144 of each 136 side from right angle orientation.Rotating driveshaft 146 is coupled with the turning axle of motor 150.When motor 150 during along prescribed direction rotation driven in rotation driving shaft 146, its rotary driving force is delivered to the gear of the spring 144 of transmission with axle 136 sides from each gear of the spring 148 of turning axle 146 sides, rotates each delivery roll 138A, 138B of 136 along prescribed direction (transmitting the direction of substrate G to the place ahead of transmission path 108).
Move in the portion 110 at substrate, the stripper pin 120 of substrate transmission usefulness will transmit substrate discretely with predetermined distance and set up or be installed in stripper pin in the lifter plate 152 of horizontal arrangement under transmission path 108.152 times the lifting drive division 154 that for example comprises cylinder (not shown) is set at this lifter plate.
As shown in Figure 7, when lifting drive division 154 is lifted to specified altitude with lifter plate 152, stripper pin 120 protrudes on the transmission path 108 by the gap of 136 on axle, on this height and position, can receive substrate G with flat-hand position from adjacent substrate transmission mechanism (not shown).
As shown in Figure 8, when on stripper pin 120, transmitting substrate G, by lifting drive division 154 lifter plate 152 is reduced to original position, with flat-hand position substrate G is moved on the transmission path 108, so that in it descended the way, the both ends of substrate G (both ends of the Width of transmission path 108) were stated from delivery roll 138A, the 138B.In addition, the external diameter of each delivery roll 138A, 138B attenuates for one section at inboard (axle central side), and the end of substrate G is stated from this minor diameter part 139.
Among Fig. 4, prewetting liquid provides nozzle PN, developer solution to provide nozzle DNa, DNb and rinsing liquid to provide nozzle RN respectively by the SC of nozzle scan mechanism P, SC DAnd SC R Above transmission path 108, move abreast with transmission path 108.
SC (the SC of nozzle scan mechanism of expression one embodiment among Fig. 9 and Figure 10 P, SC D, SC R) structure.The SC of this nozzle scan mechanism has the cross section of supporting movable nozzle N (PN, DNa, DNb, RN) usefulness and becomes the nozzle support body 156 of anti-コ font, guides the guiding rail 158 (Fig. 9) of nozzle support body 156 usefulness and driving nozzle support body 156 scanning driving part 160 to move along guiding rail 158 abreast with transmission path 108 above transmission path 108.
As shown in figure 10, for example scanning driving part 160 will by one or more vertical support member 161 be coupling in one or more endless band 162 on the nozzle transmission body 156 and guiding rail 158 (Fig. 9) abreast (promptly and transmission path 108 abreast) across at drive pulley 164 with move about between the belt pulley 166, drive pulley 164 operational coupled are on the turning axle of motor 168.The rotary driving force of motor 168 converts the forward travel that strip length direction (directions X) top nozzle transmits body 156 to by belt pulley 164,166 with 162.By the rotational speed of control motor 168, the translational speed of advancing that nozzle can be transmitted body 156 is adjusted to expectation value, by the sense of rotation of switch motor 168, and the moving direction that advances of changeable nozzle transmission body 156.In Figure 10, for simplified illustration, not shown guiding rail 158.
In nozzle transmission body 156, the lifting drive division 170 that actuator such as cylinder for example constitutes is installed respectively on the inwall of left and right sides face, level is across the horizontal support bar 172 that for example is made of hollow tube between the lifting drive division 170 of these pair of right and left.In addition, at the movable nozzle N that tubular is installed from central part downward level of ejiction opening n on the bottom of the vertical support bar that for example constitutes by hollow tube 174 that vertical lower is extended of this horizontal support bar 172.Can be on the Width of transmission path 108 can provide the ejiction opening n that forms a plurality of nozzle N in the scope for the treatment of fluid along the nozzle length direction at certain intervals substantially equably from the end to end of substrate G.
In nozzle transmission body 156, movable nozzle N can be driven by the lifting of lifting drive division 170 by horizontal support bar 172 and vertical support bar 174 liftings, usually, about between the height and position Hb that during spraying the height and position Ha for the treatment of fluid to the substrate G on the transmission path 108 and not spraying treating fluid, withdraws from from transmission path 108.Introducing the treating fluid that is arranged on outside the transmission path 108 in an end of horizontal support bar 172 provides the flexible treating fluid in source (not shown) that pipe 176 is provided.Treating fluid provides pipe 176 by being connected on the treating fluid introducing port of nozzle N in the middle of horizontal support bar 172 and the vertical support bar 174.
The lid 178 of the anti-コ font in cross section of movable area (directions X and the Z direction) usefulness of covering movable nozzle N on the transmission path 108 from the outside preferably is set along transmission path 108 as shown in Figure 9.In illustrated structure example, the left and right sides face of lid 178 vertically arrives the upper end or the axle bed parts 140 of the left and right sides wall of this module M, reduces the gap as far as possible.Form slot (opening) 178a on lid 178 or in driving a well by horizontal support bar 172.Therefore, cover or isolate movable nozzle N from scan drive system, in the processing space PS of the few foreign of lid 178 inboards, provide treating fluid by the substrate G of movable nozzle N on transmission path 108 by covering 178.
In Fig. 5 and Fig. 6, the substrate leaning device 180 of an embodiment is set in pre-wet end 124.This substrate leaning device 180 have at 108 times liftables of transmission path and be configured to substrate 182 that direction forwards, backwards tilts, at this discrete at interval according to the rules a plurality of stripper pins 184 of setting up or setting firmly and the drive division of using to carry out lifting driving and pitch drives from lower support substrate 182 by lifting shaft 186 188 above substrate 182.Lifting shaft 186 connects the opening 190 that forms in the base plate of this module M2 and developer solution dish 130.Formation of the interior end at developer solution dish 130 prevents that liquid from draining to the 130a of cylindrical wall portion that uses around the opening 190.
The dead astern of the stripper pin 184 at end is in the end born the rear end of substrate G when tilting and is prevented to fall falling of usefulness and prevent parts at the tubular stop component 194 that rubber system for example rotatably is installed from the stripper pin 184 branch backing pin 192 that rearward branch erects.
Here, the effect of Benq's sheet leaning device 180 according to Figure 11 and Figure 12.When substrate G on transmission path 108 be in substrate leaning device 108 directly over the time, the position transducer (not shown) of regulation detects substrate G, signal according to this sensor output, the control part that transmission drives system stops the rotation of interior all delivery roll 138A, 138B of this module at least, makes substrate G static.
Afterwards, the controller of substrate leaning device 180 (not shown) action makes drive division 188 actions, and lifting shaft 186 rises.At this moment, as shown in figure 11, substrate 182 and stripper pin 184 also rise, and stripper pin 184 is from lower process, and substrate G is lifted top to transmission path 108.
Then, this controller controlling and driving portion 188, the axle 196 that extends on the Width with transmission path 108 be the center forwards, backwards direction, preferably make substrate 182 only rotate predetermined angular (for example 10 degree-20 spend) as shown in the figure backward.At this moment, as shown in figure 12, the part higher, be stripper pin 192, stop component 194, the substrate G equal angular that also on transmission path 108, only tilts backward than substrate 182.At this moment, substrate G on stripper pin 184 only backward landing seldom stoped by stop component 194.But substrate G goes up liquid Q splendid attire or that adhere to because gravity landing substrate dip plane rearward falls outside substrate.The liquid Q that falls from substrate G is collected in the dish (prewetting liquid dish 130 in the pre-wet end 124) that is provided with this module.
After above-mentioned inclination attitude is kept certain hour, under the control of this controller, drive division 188 makes substrate 182 along rotating and above-mentioned angle same with above-mentioned opposite direction, returns flat-hand position (state of Figure 11), then, lifting shaft 186 is reduced to original position (position of Fig. 6).
In pre-wet end 124, because substrate G tilts to transmission direction, make the developer solution that carries out subsequent processing provide portion's 126 sides to become upside, so when pre-wet end 124 medium dip substrate G remove liquid, can reduce the possibility on the substrate G that descends the backward liquid that reflects back in the prewetting liquid dish 130 that portion's 126 sides are provided attached to the developer solution that carries out subsequent processing.
As mentioned above, in substrate leaning device 180, substrate G tilts on transmission path 108, falls liquid by utilizing gravity from substrate, can remove liquid at short notice.In addition, needn't use special external force, considerably less to the damage of substrate G.
Below, the effect of this developing cell (DEV) 94 is described.As mentioned above, it is to shift to transmission path 108 after unit receives substrate G from adjacent substrate transmission mechanism (not shown) with one that substrate is moved into portion 120 in Fig. 7 and Fig. 8.As mentioned above, the transmission of formation transmission path 108 is rotated under the rotary driving force of motor 150 by gear trains such as rotating driveshaft 146, gear of the spring 148,144 with transmission axle 138A, the 138B of axle 136, so directly the substrate G that carries on the transmission path 108 is transferred to adjacent development section 112.
In development section 112, at first substrate G is moved in the pre-wet end 124, in roller bearing transmission, provide developer solution that nozzle PN blows out pure water for example or low concentration as prewetting liquid by prewetting liquid.In this embodiment, according to Fig. 9 and Figure 10, by said nozzle scanning mechanism SC PTurntable driving, nozzle PN edge transmission path 108 moves horizontally, the limit to the transmission in substrate G above (processed face) blow attached prewetting liquid.The prewetting liquid that impacts the prewetting liquid that disperses behind the substrate G outside substrate or do not impact substrate G is collected in the prewetting liquid dish 130 that is arranged on transmission path 108 belows.
As shown in FIG. 13A, when the direction setting with the substrate G ejection prewetting liquid scan edge nozzle PN of limit on transmission path 108 is the direction opposite with the substrate transmission direction, with nozzle scan speed V NWith substrate transmission speed V GRelative velocity (the V of addition gained N+ V G) from the front end of substrate G to rear end scan nozzle N (PN), even the size of substrate G is big, but also within a short period of time with processed (resist surface) integral body of the moistening substrate G of prewetting liquid.
When substrate G in the pre-wet end 124 was on the assigned position of downstream side, according to Figure 11 and Figure 12, as mentioned above, 180 actions of substrate leaning device were lifted substrate G by transmission path 108, make it to recede.By the inclination attitude of this substrate G, the major part that substrate G goes up residual or the prewetting liquid that adheres to flows to the substrate rear, is recovered in the prewetting liquid dish 130.
In pre-wet end 124, the substrate G that receives above-mentioned pre-wet process moves into developer solution by transmission path 108 provides portion 126.Provide in the portion 126 at developer solution, by initial module M3 the time, provide nozzle DNa to blow developer solution, by next module M4 the time, provide nozzle DNb to blow developer solution by developer solution by developer solution.Each developer solution provides nozzle DNa, DNb limit by Fig. 9 and the described nozzle scan SC of mechanism of Figure 10 DTurntable driving above transmission path 108, move horizontally the processed top blast developer solution of the substrate G of limit in roller bearing transmission along transmission path 108.Fall liquid outside the substrate G and be collected in the developer solution dish 132 that transmission path 108 belows are provided with by blowing this developer solution.
As mentioned above, because residual major part to substrate G is recovered in the prewetting liquid dish 130 by substrate leaning device 180 in the prewetting liquid (pure water) that uses in the pre-wet end 124, provide the ratio in the portion 126 low so bring developer solution into, therefore, the ratio of sneaking in the developer solution dish 132 is also low.
Same with above-mentioned pre-wet end 124, even provide in the portion 126, as shown in figure 13, also the direction setting of the substrate G ejection developer solution scan edge nozzle DN of limit on transmission path 108 can be become the direction opposite with the substrate transmission direction at developer solution.Thus, with nozzle scan speed V NWith substrate transmission speed V GRelative velocity (the V of addition gained N+ V G) from the front end of substrate G to rear end scan nozzle DN, even the size of substrate G is big, but also provide developer solution to processed (resist surface) integral body of substrate G within a short period of time.
In this embodiment, because all being set respectively, developer solution provides nozzle DNa, DNb and the SC of nozzle scan mechanism in each module M3, M4 D, so the interval on time and the space can be set the substrate G on the transmission path 108, developer solution can repeatedly be provided, can be by change the characteristic (concentration etc.) of developer solution for the first time with the second time.
As mentioned above, provide in the portion 126, provide the substrate G former state of developer solution to move in the developer solution whereabouts portion 128 by transmission path 108 to processed integral body at developer solution.Then, when in developer solution whereabouts portion 128, being in the assigned position of downstream side, be arranged on substrate leaning device 180 actions at this place, upwards lift substrate G by transmission path 108, to transmission direction inclination substrate G, and for example forward, the development of promptly going up an operation provides portion's 126 sides to become upside.By this inclination attitude, be contained in and be recovered in the developer solution dish 132 after most of developer solution on the substrate G flows to substrate the place ahead.Therefore, because substrate G tilts, make the developer solution of an operation provide portion's 126 sides to become upside, so when the 128 medium dip substrate G of developer solution whereabouts portion remove liquid, can reduce the liquid that reflects back in the developer solution dish 132 and provide the possibility on the substrate G of portion's 126 sides attached to developer solution.
In development section 112, finish that above-mentioned developer solution provides and the substrate G that reclaims moves in the rinsing portion 114 by transmission path 108.In rinsing portion 114, by the turntable driving as Fig. 9 and the described nozzle scan SCR of mechanism of Figure 10, rinsing liquid provides nozzle RN edge transmission path 108 to move horizontally, and (processed face) blows rinsing liquid, for example pure water above the substrate G in transmission.Falling rinsing liquid outside the substrate G is collected in the rinsing liquid dish 134 that transmission path 108 is provided with below.
As mentioned above, residual major part to substrate G is recovered in the developer solution dish 132 by substrate leaning device 180 in developer solution whereabouts portion 128 in the developer solution that uses in the portion 126 because developer solution provides, so the ratio of bringing in the rinsing portion 114 is low, therefore, the ratio of sneaking in the rinsing liquid dish 134 is also low.
In rinsing portion 114, also preferably as shown in FIG. 13A, the direction setting that the substrate G of limit on transmission path 108 is sprayed developer solution scan edge nozzle RN is the direction opposite with the substrate transmission direction.Thus, with nozzle scan speed V NWith substrate transmission speed V GRelative velocity (the V of addition gained N+ V G) from the front end of substrate G to rear end scan nozzle RN, even the size of substrate G is big, but also provide rinsing liquid to processed (resist surface) integral body of substrate G within a short period of time, carry out the displacement (development stops) of rinsing liquid apace.In addition, the rinsing liquid of cleaning substrate G the inside provide nozzle (not shown) can be arranged on transmission path 108 below.
In rinsing portion 114, the substrate G that finishes above-mentioned rinsing process is moved into drying section 116 by transmission path 108.In drying section 116, as shown in Figure 4, substrate G by transmission on the relative transmission path 108 is arranged on the EN of air knife up and down in the assigned position, sharp keen gas stream, for example air of (processed face) and the inside impact knives shape above substrate make the liquid (mainly being rinsing liquid) that adheres on the substrate G fall substrate rear (removal liquid).
The substrate G former state that drying section 116 is removed liquid is delivered to substrate by transmission path 108 and is taken out of portion 118.Substrate is taken out of portion 118 and is had with substrate and move into the identical structure of portion 110, moves into portion 110 with substrate and moves equally, and only the substrate transmission direction is opposite on moving into and taking out of.Promptly, make the substrate transmission with stripper pin 122 standbies on the position lower than transmission path 108, wait for that substrate G flows out from upstream side (drying section 116), as long as substrate G one is on the assigned position directly over the stripper pin 122, then to upper process stripper pin 122, lift substrate G with flat-hand position, pass to adjacent substrate transmission mechanism (not shown).
In developing cell (DEV) 94, provide independent dish 130,132,134 is set in portion 126, the rinsing portion 114 at pre-wet end 124, developer solution respectively, reclaim each treating fluid (prewetting liquid, developer solution, rinsing liquid) respectively.Particularly, in pre-wet end 124 and developer solution whereabouts portion 128, go up from substrate G expeditiously by 180 short time of substrate leaning device when removal manages liquid (prewetting liquid, developer solution) everywhere in each operation (operation of prewetting, developing procedure) back, reclaimed by these dish 130,132 high-purities, the recovery significantly improves respectively.
Also substrate leaning device 180 can be set in rinsing portion 114.At this moment, but after rinsing process the short time remove rinsing liquid from substrate G expeditiously, simultaneously, can reclaim expeditiously by rinsing liquid dish 134, improve the difference recovery of rinsing liquid.
In addition, when substrate G is tilted, make substrate G become upside ground to transmission direction, for example development section 112 sides.Because inclination substrate G makes development section 112 sides become upside, provide the rinsing liquid of nozzle RN ejection to reflect back on the substrate G of inclination so can reduce from rinsing liquid, the rinsing liquid that reflects back is attached to the possibility on the substrate G of development section 112 sides.
In addition, in this developing cell (DEV) 94, the limit provides portion 126, developer solution whereabouts portion 128, rinsing portion 114 and drying section 116 orders to implement each apart from the defeated a plurality of substrate G limit of predetermined distance one biographies by pre-wet end 124, developer solution on transmission path 108 and handles, we can say, can realize the high-level efficiency of pipe method or the development treatment operation of high production.
Particularly, provide in portion 126 and the rinsing portion 114 at pre-wet end 124, developer solution, by at nozzle PN, DNa, DNb, RN that treating fluid (prewetting liquid, developer solution, rinsing liquid) is provided along the substrate G of transmission path 108 scanning on transmission path 108 above the transmission path 108, even the size of substrate G is big, even the transmission speed of transmission path 108 uprises, also can provide treating fluid heap of times to processed integral body of substrate rapidly at short notice.In addition, provide in the operation at developer solution, because can shorten transmission direction one end (leading section) of substrate G and the mistiming that the treating fluid between the other end (rearward end) provides, the mistiming of promptly developing and beginning, so can improve the inner evenness of on-chip development quality.
In the SC of nozzle scan mechanism of present embodiment, because can constitute along transmission path 108 bilateral scanning nozzle N, so shown in Figure 13 B, but the edge scanning direction nozzle N opposite with the substrate transmission direction, and the limit provides treating fluid Q to processed the integral body of substrate G.At this moment, must be with nozzle scan speed V NSet than substrate transmission speed V GGreatly.
Present embodiment constitutes by pre-wet end 124 and developer solution provides portion 126 to carry out the development of spray regime.But it is simple to be deformed into puddle (puddle) mode, provides in the portion 126 at developer solution, provides nozzle DNa, DNb to be exchanged into the ejection structure of containing the liquid type from ejection-type developer solution.In addition, under the mode of puddle, do not need pre-wet end 124.
Provide in the portion 126 at developer solution, also can omit developer solution provides one of nozzle DNa, DNb (the normally DNb of downstream side) to constitute.In addition, surpass in the scope of a module M but the scanning area of each the movable nozzle N on the transmission path 108 can be set in, adjacent movable nozzle can be the structure that feeds each other in the identical guiding rail.
In the present embodiment, as mentioned above, before the substrate leaning device 180 of configuration on dirty by development section 112 is moved into rinsing portion 114, can from substrate G, reclaim developer solution expeditiously.Therefore, advantage is, when before the rinsing process when substrate G falls developer solution, in rinsing process, can quicken the displacement or the development of rinsing liquid are stopped.
With this substrate leaning device and usefulness, it also is effective that air knife mechanism shown in Figure 14 is set near the boundary of development section 112 and rinsing portion 114.In Figure 14, air knife FN has on the Width of transmission path 108 from substrate W one end and extends to the countless air ejiction openings of the other end or slot-shaped air ejiction opening, at assigned position to by next door () the sharp keen gas stream of substrate G impact knives shape (being generally airflow or nitrogen stream) just down.Thus, when substrate G passes through air knife FN, after on-chip developer solution Q converges to the substrate rear end side, the outside of falling substrate.
Substrate leaning device 180 in the foregoing description constitutes and lifts substrate G by transmission path 108 with flat-hand position and make it to tilt.But, as alternate manner, the also substrate leaning device of the initial parts that the projection upper surface tilts below substrate G.
In addition, also in the regulation interval, make the mode of delivery roll (138A, the 138B) inclination that constitutes transmission path 108.A configuration example of having represented the substrate leaning device 200 of this transmission path inclination mode among Figure 15-Figure 17.
In this substrate leaning device 200, adopt following structure, suitable position on transmission path 108, for example be set among the interval K of tiltable in the developer solution whereabouts portion 128, each transmission is divided with axle 136 to be broken into the primary shaft 136a of transmission gear side 144 sides and the driven shaft 136b of delivery roll (138A, 138B) side, freely connects diaxon 136a, 136b by clutch coupling 202 with loading and unloading.
Driven shaft 136b rotatably is supported on pair of bearings 204A, the 204B that is arranged on two delivery roll 138A, the 138B direction of principal axis outside.By vertical support bars 208 each bearing 204A, 204B are supported on the back up pad 206 that is horizontally installed on transmission path 108 tops.Particularly, the bottom of fixed vertical support stick 208 on each bearing 204A, 204B, the upper end of vertical support bars 208 rotatably is supported on the side of back up pad 206 by pin 210.
Back up pad 206 in transmission direction one end, for example leading section (end of downstream side) rotatably is supported on the pivot 212, in the end of opposition side (rearward end), by combining with the axis of the piston 218a of horizontal cylinder 218 from the spool 214 basic vertical sagging lines 216 that are arranged on the top.
In so constituting, when connecting primary shaft 136a and driven shaft 136b by clutch coupling drive division (not shown) connection clutch coupling 202, the rotary driving force of motor 150 (Fig. 5, Fig. 6) is delivered to two delivery roll 138A, 138B by rotating driveshaft 146, gear of the spring 148,144, primary shaft 136a, clutch coupling 202 and driven shaft 136b.Therefore, on transmission path 108, substrate G can successfully enter the interval K of tiltable from upstream side, can successfully go out to downstream side from the interval K of tiltable.
But during at connection clutch coupling 202 and from primary shaft 136a separation driven shaft 136b, the rotary driving force that clutch coupling 202 cuts off from motor 150 can not pass to driven shaft 136b.Under this state, drive cylinder body 218, the axis of the piston 218a is only advanced or when retreating predetermined distance, the pivot 212 of end side is for the center back rotation or tilt, with reduction rearward end side before the back up pad 206.Therefore, when back up pad 206 recedes, being in each driven shaft 136b under the back up pad 206 and two delivery roll 138A, 138B by vertical support bars 208 and bearing 204 (204A, 204B) also descends according to position separately, when observing delivery roll 138 row of the transmission path 108 that constitutes in the interval K of tiltable, as shown in figure 17, be parallel to back up pad 206 equal angular that recedes.Thus, when substrate G was positioned on the transmission path 108 of the interval K of tiltable, substrate G was also with transmission path 108 equal angular that recedes.Can adjust this angle of inclination by the forward travel distance of the axis of the piston 218a in the cylinder body 218.
Approach than the rearward end of back up pad 206 (upstream side of transmission direction) after a while, one or more cylinders 220 vertically oppositely are set on the Width of transmission path 108, for example tubular stop component 222 of rubber system is installed on the front end of each the axis of the piston 220a.To the posture conversion of heeling condition, meet regularly in horizontality from above-mentioned back up pad 206, each cylinder 220 advances or descends by making the axis of the piston 220a, as shown in figure 17, but between stop component 222 block areas the rear end of sweptback substrate G on the transmission path 108 in the K.
Therefore, delivery roll 138 in the interval K of substrate G and tiltable recedes integratedly, and by stop component 222 stable its inclination attitude that keep, be contained in or attached to the liquid on the substrate G (in developer solution whereabouts portion 128 for developer solution) because gravity rearward slides into the substrate dip plane, fall from the substrate rear end, collect in this dish 132.
Return in the flat-hand position in above-mentioned inclination attitude, the axis of the piston 218a, the 220a that also can meet periodically two cylinders 218,222 are returned to original position respectively.In addition, after transmission path 108 in the interval K of tiltable or delivery roll 138 row return horizontality, connect clutch coupling 202, driven shaft 136b is connected on the primary shaft 136a.Primary shaft 136a also can be supported on the bearing 224 that is arranged at the gear of the spring 144 direction of principal axis outside (Figure 15).In this substrate leaning device 200, the mechanism (206,214,218,220 etc.) that is arranged on transmission path 108 tops is contained in box or encloses in 226.
The substrate G that comes from the upstream side transmission on making transmission path 108 stops in the interval K of tiltable, identical with above-mentioned substrate leaning device 180, when substrate G is in assigned position, detect by position transducer, according to this signal of sensor, the clutch coupling drive division is connected clutch coupling 202.Arrive the sensor that detects usefulness as this substrate, for example use the limit switch 230 shown in Figure 18 A-C.In this limit switch 230, when substrate G is on the assigned position on the transmission path 108 (Figure 18 A), the substrate leading section arrives to the leading section of the rotor lever 232 that is arranged on here, traction rotor lever 232, be against volute spring 234, the limit is middle mind-set prescribed direction (clockwise) rotation with axle 236, and (Figure 18 B) under the substrate G slipped on the limit.At this moment, the other end of optical sensor 238 detection rotor levers 232, the substrate of output regulation arrives detection signal.For example shown in Figure 18 C, optical sensor 238 gap 240 at interval disposes light-emitting component 238a and photo detector 238b relatively, when rotor lever 232 enters in the gap 240, when covering the light LB of self-emission device 238a, the output signal that photo detector 238b is obtained arrives detection signal as substrate.
Each modular construction of the foregoing description is an example, and the parts beyond the substrate leaning device also can carry out various distortion.For example, structures such as nozzle support body 156 among the SC of nozzle scan mechanism or scanning driving part 160 also can be out of shape arbitrarily.Or, prewetting liquid can be provided nozzle, developer solution to provide nozzle, rinsing liquid to provide nozzle etc. to constitute the nozzle of Locating Type.
In the above-described embodiments, constitute along continuous straight runs and be laid on the roller bearing mode transmission transmission path 108 that predetermined distance fixing a pair of delivery roll 138A, 138B in interval constitutes in the rotatable axle 136.In this roller bearing mode transmission transmission path, also can be at the place, centre position of two delivery roll 138A, 138B mounted substrate transmission roller.In addition, in transmission direction, the driving of transmission path 108 system is divided into a plurality ofly, can independently controls the transmission action respectively cut apart on the transmission path (speed, stop etc.).In addition, the also predetermined distance band mode transmission transmission path laying a pair of band in the horizontal direction and constituted at interval.
In addition, in pre-wet end 124, developer solution whereabouts portion 128 or rinsing portion 114, be the direction different with above-mentioned direction with the direction setting of inclination substrate, or under horizontality or heeling condition treatment substrate.
Though the foregoing description is about developing apparatus, the present invention for example also cleans unit (SCR) 42 applicable to the washing in the above-mentioned coating developing system also applicable to the substrate processing device beyond the developing apparatus.That is, substrate leaning device same as the previously described embodiments 180,200 is set, but the upward residual detergent remover limit recovery of substrate G is removed on the limit expeditiously by the back segment in the clean portion of current on the transmission path of cleaning unit (SCR) 42 in washing.
Processed substrate of the present invention is not limited to the LCD substrate, comprises development treatment any processed substrate applicatory.
As mentioned above,, can in the unit interval, remove the treating fluid that offers processed substrate on the transmission path of laying on the horizontal direction expeditiously according to substrate processing device of the present invention, but and high-purity ground recovery respectively.
(embodiment 2)
Describe embodiments of the invention with reference to the accompanying drawings in detail.Wherein, in the present embodiment, the present invention is applicable to the situation that the LCD substrate of having implemented exposure-processed is carried out the development treatment unit (DEV) of development treatment is that example describes.Figure 19 having development treatment unit (DEV), carry out the resist-coating that is formed up to development treatment from resist film, the schematic plan view of developing system continuously that be expression as one embodiment of the invention.
This resist-coating, developing system 400 have: tray salver platform (moving into the portion of taking out of) 301, load the tray salver C that holds a plurality of LCD substrate G; Treatment bench (handling part) 302 has a plurality of processing units, and LCD substrate G is implemented to comprise the resist-coating and a series of processing of developing; Interface platform (interface portion) 303, and carry out the transmission of LCD substrate G between the exposure device 304, on the two ends of treatment bench 302, dispose tray salver platform 301 and interface platform 303 respectively.In Figure 19, the length direction of establishing resist-coating, developing system 400 is a directions X, and the direction vertical with directions X is the Y direction in the plane.
Tray salver platform 301 possess along the Y direction load side by side tray salver C loading stage 309 and and treatment bench 302 between carry out the transmitting device 311 that moving into of LCD substrate G taken out of, transmission tray salver C between this loading stage 309 and outside.Transmitting device 311 has transfer arm 311a, can move on the transmission path 310 of edge as the Y direction setting of the orientation of tray salver C, by transfer arm 311a, moves between tray salver C and treatment bench 302 and takes out of LCD substrate G.
Treatment bench 302 has two row ribbon feeder A, the B that the LCD substrate G that extends along directions X basically transmits usefulness, along transmission line A, clean unit (SCR) 321, the first thermal treatment unit portion 326, resist processing unit 323 and the second thermal treatment unit portion 327 to the 303 configuration washings of interface platform from tray salver platform 301.Along transmission line B, from the interface platform 303 side direction tray salver platforms 301 configurations second thermal treatment unit portion 327, development treatment unit (DEV) 324, i line UV illumination unit (i-UV) 325 and the 3rd thermal treatment unit portion 328.In the part on the clean unit (SCR) 321 of washing excimer UV illumination unit (e-UV) 322 is set.In addition, before washing is cleaned, excite state atom UV illumination unit (e-UV) 322 is set,, i line UV illumination unit (i-UV) 325 is set, with the fade treatment of developing so that remove the organism of LCD substrate G.
Above-mentioned washing is cleaned unit (SCR) 321 therein with flat-hand position transmission LCD substrate G, and cleans and handle and dried.Describe in detail as the back, development treatment unit (DEV) 324 also essentially horizontally transmits LCD substrate G, and carries out clean processing and dried after developer solution coating, the development.Clean among unit (SCR) 321 and development treatment unit (DEV) 324 in these washings, for example transmit LCD substrate G by roller bearing transmission or band.In addition, by coming continuously to i line UV illumination unit (i-UV) 325 transmission LCD substrate G with the transport sector identical mechanism of development treatment unit (DEV) 324.
In resist processing unit 323, dispose resist-coating treating apparatus (CT) 323a in order, make the resist drop, by making LCD substrate G rotation regulation number of revolutions to the LCD of basic maintenance level substrate G, resist liquid is diffused into LCD substrate G on the whole, forms resist film; Decompression dry device (VD) 323b, drying under reduced pressure LCD substrate G goes up the resist film that forms; With edge resist stripper (ER) 323c, remove the unnecessary resist that adheres on the LCD substrate G edge by scanning LCD substrate G solvent ejecting head all around.In resist processing unit 323, the transfer arm of transmission LCD substrate G is set between these resist-coating treating apparatus (CT) 323a, decompression dry device (VD) 323b, edge resist stripper (ER) 323c.
Shown in the outboard profile of the first thermal treatment unit portion 326 of Figure 20, the first thermal treatment unit portion 326 has that lamination is implemented heat treated thermal treatment unit to LCD substrate G and two thermal treatment unit pieces (TB) 331,332 of constituting, thermal treatment unit piece (TB) 331 is arranged on washing cleansing process unit (SCR) 321 sides, and thermal treatment unit piece (TB) 332 is arranged on resist processing unit 323 sides.Between these two thermal treatment unit pieces (TB) 331,332, first transmitting device 333 is set.
Thermal treatment unit piece (TB) 331 has the delivery unit (PASS) 361 that the level Four lamination transmits LCD substrate G from bottom to top, LCD substrate G is carried out two dewatered drying unit (DHP) 362 that dewatered drying is handled, 363, LCD substrate G is implemented the structure of the adhesion process unit (AD) 364 of hydrophobic treatments, in addition, thermal treatment unit piece (TB) 332 has the delivery unit (PASS) 365 of level Four lamination transmission LCD substrate G according to order from bottom to top, two cooling units (COL) 366 of cooling LCD substrate G, 367, LCD substrate G is implemented the structure of the adhesion process unit (AD) 368 of hydrophobic treatments.
First transmitting device 333 receives LCD substrate G by delivery unit (PASS) 361 from washing cleansing process unit (SCR) 321, between above-mentioned thermal treatment unit, move into and take out of LCD substrate G, and transmit LCD substrate G to resist processing unit 323 by delivery unit (PASS) 365.
First transmitting device 333 has up and down the guiding rail 291 that extends, along the Lift Part 392 of guiding rail 391 liftings, can be rotatably set in that but substrate parts 393 and forward-reverse ground on the Lift Part 392 is arranged on the substrate parts 393, the substrate keeping arm 394 of maintenance LCD substrate G.In addition, come lifting Lift Part 392, rotate substrate parts 393, move forward and backward substrate keeping arm 394 by motor 397 by motor 396 by motor 395.Therefore, first transmitting device 333 can about, front and back, rotatablely move arbitrary unit of addressable thermal treatment unit piece (TB) 331,332.
The second thermal treatment unit platform 327 has that lamination is implemented heat treated thermal treatment unit to LCD substrate G and two thermal treatment unit pieces (TB) 334,335 of constituting, thermal treatment unit piece (TB) 334 is arranged on resist processing unit 323 sides, and thermal treatment unit piece (TB) 335 is arranged on development treatment unit (DEV) 324 sides.Between these two thermal treatment unit pieces (TB) 334,335, second transmitting device 336 is set.
Shown in the outboard profile of the second thermal treatment unit portion 327 of Figure 21, thermal treatment unit piece (TB) 334 constitutes the delivery unit (PASS) 369 that transmits LCD substrate G by order level Four lamination from bottom to top, with three the prebake unit (PREBAKE) 370 that LCD substrate G carried out the prebake processing, 371,372, thermal treatment unit piece (TB) 335 constitutes the delivery unit (PASS) 373 that transmits LCD substrate G by order level Four lamination from bottom to top, the cooling unit (COL) 374 of cooling LCD substrate G, LCD substrate G is carried out two prebake unit (PREBAKE) 375 that prebake is handled, 376.
Second transmitting device 336 receives LCD substrate G by delivery unit (PASS) 369 from resist processing unit 323, between above-mentioned thermal treatment unit, move into and take out of LCD substrate G, transmit LCD substrate G and extension, cooling bench (EXT, COL) 344 as the substrate transfer part of aftermentioned interface platform 303 are transmitted and receive LCD substrate G to development treatment unit (DEV) 324 by delivery unit (PASS) 373.Second transmitting device 336 has the structure identical with first transmitting device 333, arbitrary unit of also addressable thermal treatment unit piece (TB) 334,335.
The 3rd thermal treatment unit platform 328 has that lamination is implemented heat treated thermal treatment unit to LCD substrate G and two thermal treatment unit pieces (TB) 337,338 of constituting, thermal treatment unit piece (TB) 337 is arranged on development treatment unit (DEV) 324 sides, and thermal treatment unit piece (TB) 338 is arranged on tray salver platform 301 sides.Between these two thermal treatment unit pieces (TB) 337,338, the 3rd transmitting device 339 is set.
Shown in the outboard profile of the 3rd thermal treatment unit portion 328 of Figure 22, thermal treatment unit piece (TB) 337 have by order level Four lamination from bottom to top transmit the delivery unit (PASS) 377 of LCD substrate G, to the structure of drying unit (POBAKE) 378,379,380 behind the LCD substrate G carry out that the back oven dry handles three.In addition, thermal treatment unit piece (TB) 338 have by drying unit (POBAKE) 381 behind the order level Four lamination from bottom to top, transmit and the transmission of cooling LCD substrate G, cooling unit (PASS, COL) 382, to the structure of drying unit (POBAKE) 383,384 behind the LCD substrate G carry out that the back oven dry handles two.
The 3rd transmitting device 339 receives LCD substrate G by delivery unit (PASS) 377 from i line UV illumination unit (i-UV) 325, between above-mentioned thermal treatment unit, move into and take out of LCD substrate G, transmit LCD substrate G to tray salver platform 1 by transmission, cooling unit (PASS, COL) 382.The 3rd transmitting device 339 also has the structure identical with first transmitting device 333, arbitrary unit of also addressable thermal treatment unit piece (TB) 337,338.
As mentioned above, configuration each processing unit and transmitting device in treatment bench 302 constituting two row transmission line A, B, and constitutes processing sequence basically, between these transmission lines A, B space 340 is set.In addition, reciprocating shuttle (substrate load parts) 341 is set in this space 340.Can keep LCD substrate G ground to constitute shuttle 341, between transmission line A, B, transmit LCD substrate G by shuttle 341.Transmit LCD substrate G by above-mentioned first to the 3rd transmitting device 333,336,339 to shuttle 341.
Interface platform 303 has moves into the transmitting device 342 of taking out of LCD substrate G, the buffer table (BUF) 343 and the extension as the substrate transfer part, the cooling bench (EXT, COL) 344 that possess refrigerating function of configuration buffering tray salver between treatment bench 302 and exposure device 304, the external device (ED) piece 345 of lamination captions recording device (TITLER) and external exposure device (EE) about being provided with in abutting connection with transmitting device 342.Transmitting device 342 possesses transfer arm 342a, moves between treatment bench 302 and exposure device 304 by this transfer arm 342a and takes out of LCD substrate G.
In the resist-coating that so constitutes, developing system 400, at first, the LCD substrate G that is configured in the tray salver C on the loading stage 309 of tray salver platform 301 directly moves into the excite state atom UV illumination unit (e-UV) 322 of treatment bench 302 by transmitting device 311, washs pre-treatment.Then, by transmitting device 311, LCD substrate G is moved in the washing cleansing process unit (SCR) 321, washing is cleaned.After processing is cleaned in washing, for example LCD substrate G is taken out of to the delivery unit (PASS) 361 of the thermal treatment unit piece (TB) 331 that belongs to the first thermal treatment unit portion 326 by the roller bearing transmission.
At first, the LCD substrate G that will be configured on the delivery unit (PASS) 361 is transferred to one of dewatered drying unit (DHP) 362,363 of thermal treatment unit piece (TB) 331, carry out heat treated, then, after one of cooling unit (COL) 366,367 that is transferred to thermal treatment unit piece (TB) 332 cools off, be transferred to one of the adhesion process unit (AD) 364 of thermal treatment unit piece (TB) 331 and adhesion process unit (AD) 368 of thermal treatment unit piece (TB) 332, carry out adhesion process (hydrophobic treatments) by HMDS there, to improve the stability of resist.Afterwards, LCD substrate G is transferred to one of cooling unit (COL) 366,367 cools off, be transferred to the delivery unit (PASS) 365 of thermal treatment unit piece (TB) 332 again.Carry out all LCD substrate G transmission process when carrying out this a succession of handles by first transmitting device 333.
The LCD substrate G that transfer arm by resist processing unit 323 will be configured on the delivery unit (PASS) 365 moves in the resist processing unit 323.LCD substrate G is in resist-coating treating apparatus (CT) 323a behind the spin-coating erosion resistant agent liquid, be transferred to decompression dry device (VD) 323b and carry out drying under reduced pressure, be transferred to edge resist stripper (ER) 323c again, remove LCD substrate G unnecessary resist on every side.In addition, after removing the edge resist, LCD substrate G is delivered to the delivery unit (PASS) 69 of the thermal treatment unit piece (TB) 334 that belongs to the second thermal treatment unit portion 327 by transfer arm from resist processing unit 323.
To be configured in LCD substrate G in the delivery unit (PASS) 369 by second transmitting device 336 is transferred to after the prebake unit (PREBAKE) 375,376 of the prebake unit (PREBAKE) 370,371,372 of thermal treatment unit piece (TB) 334 and thermal treatment unit piece (TB) 335, carrying out prebake handles, afterwards, be cooled to set point of temperature after being transferred to the cooling unit (COL) 374 of thermal treatment unit piece (TB) 335.In addition, transmit the delivery unit (PASS) 373 of thermal treatment unit pieces (TB) 335 again by second transmitting device 336.
Afterwards, LCD substrate G is transferred to extension, the cooling bench (EXT, COL) 344 of interface platform 3 by second transmitting device 336, be transferred to the external exposure device (EE) of external device (ED) piece 345 by the transmitting device 342 of interface platform 303 after, remove the exposure that peripheral resist is used, then, be transferred to exposure device 304 by transmitting device 342, the resist film on the LCD substrate G that exposes there forms the pattern of stipulating.According to circumstances LCD substrate G is transferred to exposure device 304 from being contained in the buffering tray salver on the buffer table (BUF) 343.
Behind the end exposure, the transmitting device 342 by interface platform 303 after the information of recording prescribed, is loaded in the captions recording device (TITLER) that LCD substrate G moves into external device (ED) piece 345 epimeres on extension, the cooling bench (EXT, COL) 344 in LCD substrate G.By second transmitting device 336, LCD substrate G is transferred to the delivery unit (PASS) 373 of the thermal treatment unit piece (TB) 335 that belongs to the second thermal treatment unit portion 327 from extension, cooling bench (EXT, COL) 344.
By making for example roller bearing transport sector use that extends to development treatment unit (DEV) 324 from delivery unit (PASS) 373, LCD substrate G is checked development treatment unit (DEV) 324 from delivery unit (PASS) 373, carry out development treatment there.Describe this development treatment operation below in detail.
After development treatment finishes,, LCD substrate G is transferred to i line UV illumination unit (i-UV) 325 from development treatment unit (DEV) 324, LCD substrate G is implemented fade treatment by continuous transport sector, the transmission of for example roller bearing.Afterwards, by the roller bearing transport sector in the i line UV illumination unit (i-UV) 325 LCD substrate G is taken out of the delivery unit (PASS) 377 of the thermal treatment unit piece (TB) 337 that belongs to the 3rd processing unit portion 328.
By the 3rd transmitting device 339 the LCD substrate G that disposes in the delivery unit (PASS) 377 is transferred to one of the back drying unit (POBAKE) 378,379,380 of thermal treatment unit piece (TB) 337 and back drying unit (PROBAKE) 381,383,384 of thermal treatment unit piece (TB) 338, carrying out the back oven dry handles, afterwards, after transmission, the cooling unit (PASS, COL) 382 that is transferred to thermal treatment unit piece (TB) 338 is cooled to set point of temperature, by the transmitting device 311 of tray salver platform 301, be received among the regulation tray salver C of configuration in the tray salver platform 301.
Describe the structure of development treatment unit (DEV) 324 below in detail.Figure 23 is the outboard profile of the schematic construction of expression development treatment unit (DEV) 324, and Figure 24 is a schematic plan view.Development treatment unit (DEV) 324 possesses Lead-In Area 324a, first developer solution provides district 324b, second developer solution that district 324c is provided, removes liquid/rinsing district 324d, rinsing district 324e, dry section 324f, delivery unit (PASS) 373 adjacency of Lead-In Area 324a and thermal treatment unit piece (TB) 335, dry section 324f and i line UV illumination unit (i-UV) 325 adjacency.
Between delivery unit (PASS) 373 and i line UV illumination unit (i-UV) 325, roller bearing transport sector 314 is set, make the next LCD substrate G on prescribed direction transmission roller bearing 317 of roller bearing 317 rotations by drivings such as motors, by operating this roller bearing transport sector 314, can transmit LCD substrate G by development treatment unit (DEV) 324 to i line UV illumination unit (i-UV) 325 from delivery unit (PASS) 373.The roller bearing 317 of specified quantity is set on the transmission direction of LCD substrate G and the direction perpendicular to this transmission direction, makes among the LCD substrate G to be difficult to produce warpage etc.
Not shown this roller bearing transport sector 314 among Figure 24.In addition, in development treatment unit (DEV) 324, for example roller bearing transport sector 314 is divided into the different zone of transmission speed of LCD substrate G, drives independently in each zone.For example, in delivery unit (PASS) 373 and Lead-In Area 324a, transmit LCD substrate G by the driving of first motor, district 324b is provided and removes between liquid/rinsing district 324d at first developer solution and transmit, in rinsing district 324e and dry section 324f, transmit by the driving of the 3rd motor by the driving of second motor.The division driving of this roller bearing transport sector 314 can be carried out in for example constituting each district of development treatment unit (DEV) 324.
After represented the detailed structure of roller bearing transport sector 314 among Figure 25 A-25C of showing.Figure 25 A-25C is planimetric map and the outboard profile that substrate leaning device 410 (back detailed description) structure that is provided with among liquid/rinsing district 324d is removed in expression, shown in Figure 25 A-25C, roller bearing transport sector 314 has in upward extension of the transmission direction of LCD substrate G (directions X), by the pivot 318a of motor 315 along the X-axis rotation; Be fixed on the first gear 318b of pivot 318a upper edge X-axis rotation; On the Width of LCD substrate G, grow, install the pivot 319a of roller bearing 317 with predetermined distance; Be installed on the end of pivot 319a with first gear 318b engagement, convert the X-axis of the first gear 318b to the second gear 319b that Y-axis is rotated; Be installed on the other end of pivot 319a, by the rotation of the second gear 319b, the 3rd gear 319b ' that is rotated through pivot 319a; The pivot 318a ' that rotates freely along X-axis; Be installed on the pivot 318a ', convert the 4th gear 318b ' that X-axis is rotated to Y-axis with the 3rd gear 319b ' with the 3rd gear 319b ' engagement.
In roller bearing transport sector 314, the drive division that rotating hinge 319a uses is made of pivot 318a, the first gear 318b, the second gear 319b, motor 315.The 3rd gear 319b ', the 4th gear 318b ' play the effect of supporting pivot 319a, so that pivot 319a rotates smoothly.
Delivery unit (PASS) 373 possesses the lifter pin 316 of free lifting.When the substrate keeping arm 394 of second transmitting device 363 that keeps LCD substrate G rose lifter pin 316 with the state that enters delivery unit (PASS) 373, LCD substrate G was delivered to lifter pin 316 from substrate keeping arm 394.Then, substrate keeping arm 394 is withdrawed from from delivery unit (PASS) after, in case lifter pin 316 rises, then LCD substrate G is loaded on the roller bearing 317 in the delivery unit (PASS) 373.By driving the first motor 315a, LCD substrate G is taken out of Lead-In Area 324a from delivery unit (PASS) 373.
Lead-In Area 324a is designed to delivery unit (PASS) 373 and first developer solution provides the buffer area of distinguishing between the 324b, this Lead-In Area 324a prevents that developer solution from providing district 324b to disperse to delivery unit (PASS) 373 from first developer solution, pollutes delivery unit (PASS) 373.
It is the district that the LCD substrate G that comes from Lead-In Area 324a transmission is contained initial developer solution (formation puddle) that first developer solution provides district 324b, have to the main developer solution jetting nozzle 351a of LCD substrate G coating developer solution and secondary developer solution jetting nozzle 351b (below be called ' developing nozzle 351a, 351b ') two nozzles, guiding rail 359 along the directions X extension, the cursor slide 358 chimeric with guiding rail 359, the not shown driving mechanism that cursor slide 358 is moved to directions X along guiding rail 359, with the not shown elevating mechanism that is installed on the cursor slide 358, developing nozzle 351a, 351b is installed on this elevating mechanism.
Never illustrated developer solution provides the source to provide developer solution to developing nozzle 351a, 351b, for example, after adjusting the interval of developing nozzle 351a, 351b and LCD substrate G by elevating mechanism, developing nozzle 351a, 351b are moved to the direction opposite with the transmission direction of LCD substrate G in the limit, the limit to LCD substrate G ejection developer solution, can be coated with developer solution from developing nozzle 351a, 351b on LCD substrate G.
As developing nozzle 351a, 351b, preferably be suitable for following structure: the Width (Y direction) at LCD substrate G is gone up long (with reference to Figure 24), form slot-shaped ejiction opening at its lower end edge length direction, can from this slot-shaped discharge opening, be and spray developer solution roughly bandedly.In developing nozzle 351a, 351b, replace slot-shaped ejiction opening, can use a plurality of circular ejiction opening that forms with predetermined distance.
First developer solution provide district 324b with splendid attire the LCD substrate G of developer solution when being transferred to removal liquid/rinsing district 324d, have the situation of trickling down developer solution from LCD substrate G.Provide among the district 324c at second developer solution, replenish developer solution to LCD substrate G again, to prevent in the transmission way of LCD substrate G, owing to hinder developing reaction from the unrestrained developer solution of LCD substrate G.
Provide the district to fixedly install the developer solution postinjector 351c that has with developing nozzle 351a, 351b same structure among the 324c at second developer solution, make its length direction become the Y direction.Spray the developer solution of the ormal weight of the basic band shape of growing with the Y direction to the LCD substrate G of roller bearing transport sector 314 transmission from developer solution postinjector 351c.In addition, it is optional that second developer solution provides district 324c.
Providing district 324b to removing the developing reaction of carrying out LCD substrate G when liquid/rinsing district 324d transmits from first developer solution.In removing liquid/rinsing district 324d, LCD substrate G is transformed to inclination attitude, developer solution on the LCD substrate G falls, LCD substrate G is being remained under the state of inclination attitude, spray rinsing liquid from rinsing liquid jetting nozzle 352 to the surface of LCD substrate G, for example pure water washes the developer solution on the LCD substrate G.
In removing liquid/rinsing district 324d, be provided with and remove the substrate leaning device 410 that is coated on the developer solution on the LCD substrate G by LCD substrate G is transformed to inclination attitude, the LCD substrate G surface that is held in inclination attitude to substrate leaning device 410 provides the rinsing liquid of the rinsing liquid (pure water) of wash-out developer that mechanism 360 is provided, recovery is held in the developer solution returnable 347 of the developer solution that the LCD substrate G of inclination attitude flows down from substrate leaning device 410, with reclaim the rinsing liquid returnable 349 that rinsing liquid that mechanism 360 provides etc. is provided by rinsing liquid.
Figure 25 A is the planimetric map of the schematic construction of expression substrate leaning device 410, Figure 25 B is a schematic side view of representing not make the state of substrate leaning device 410 actions, and Figure 25 C is that expression makes 410 actions of substrate leaning device and LCD substrate G remained the schematic side view of the state of inclination attitude.
Substrate leaning device 410 have by the frame parts 403 that is docked at support component that roller bearing 401 on the assigned position of LCD substrate G the inside and the spindle unit 402a that is connected roller bearing 401 constitute, retainer shaft parts 402a, make frame parts 403 an end lifting elevating mechanism 406 and support end face that the lower end by LCD substrate G constitutes so as when an end that makes frame parts 403 to rise, the directing pin 404 of the not landing of LCD substrate G of roller bearing 401 inclination supports.Come coupling shaft parts 402a and frame parts 403 by the fastening means 402b that is installed on the spindle unit 402a both ends.
With predetermined distance a plurality of roller bearings 401 are installed on spindle unit 402a along the Y direction, in addition, the spindle unit 402a of roller bearing 401 have been installed on frame parts 403 with predetermined distance along directions X.Therefore, when roller bearing 401 supports LCD substrate G with LCD substrate G to fetching, do not produce big deflection among the LCD substrate G.Roller bearing 401 rotates freely around spindle unit 402a, and when the posture of conversion LCD substrate G, roller bearing is because the friction force of LCD substrate G and roller bearing 401 and according to mobile being rotated of LCD substrate G.Therefore, the inside that can prevent LCD substrate G is scratched etc.
Be connected under the state of roller bearing 317 upper ends in the inside of LCD substrate G, by roller bearing 314 LCD substrate G is moved into removal liquid/rinsing district 324d, and in order to take out of rinsing district 324e, when in removing liquid/rinsing district 324d, transmitting LCD substrate G, the upper end of roller bearing 401 is remained on the position identical with the upper end of roller bearing 317 or than on the low position, the upper end of roller bearing 317, do not transmit LCD substrate G so that roller bearing 401 does not hinder.
In frame parts 403, support the other end that elevating mechanism 406 is not installed by spindle unit 405.Frame parts 403 rotates freely along this spindle unit 405, and when elevating mechanism 406 lifted an end of frame parts 403, frame parts 403 rotations remained heeling condition under predetermined angular.When frame parts 403 was tilted, the LCD substrate G that is supported on the roller bearing 317 was transformed to the inclination attitude that is supported by roller bearing 401.
Directing pin 404 is configured to be positioned at also low position, LCD substrate G the inside than transmission directing pin upper end, so that in removing liquid/rinsing district 324d, during transmission LCD substrate G, do not hinder transmission LCD substrate G.In addition, directing pin 404 is outstanding upward when elevating mechanism 406 tilts frame parts 403, supports the below end face of LCD substrate G, prevents LCD substrate G landing.
Elevating mechanism 406 makes frame parts 403 rotations, to lift LCD substrate G transmission direction front side (rinsing district 324e side).Provide among the district 324b at first developer solution, be coated with under the situation of developer solution to LCD substrate G at transmission direction front side from LCD substrate G, in LCD substrate G, lift the end face side that begins to be coated with developer solution, G falls developer solution from the LCD substrate, can be in LCD substrate G integral body even time of developer solution contact LCD substrate G.Therefore, suppress the uneven generation of developing, improve the live width homogeneity.
The tilt angle theta of the LCD substrate G of this substrate leaning device 410 is preferably more than 10 degree.When tilt angle theta less than 10 was spent, the developer solution removal time surpassed 1 second, and the development time difference in the substrate face is big, produced the inequality of developing.On the other hand, as long as tilt angle theta is more than 10 degree, then can not produce fault, tilt even surpass 15 degree, because remove velocity-stabilization at 0.6-0.7 about second, effect is saturated, so preferably less than 15 degree.But also can be greater than 15 degree.
When substrate leaning device 410 tilted LCD substrate G, the developer solution that falls from LCD substrate G was recycled to the developer solution returnable 347.Being recovered to the high developer solution of concentration in the developer solution returnable 347 is sent on the recovery tube and circulates.Lid 348 is set in developer solution returnable 347 movably, low developer solution of the concentration of sneaking into rinsing liquid or rinsing liquid are not sneaked in the developer solution returnable 347.
Rinsing liquid provide mechanism 360 have the ejection flush away remain inclination attitude LCD substrate G the developer solution residue rinsing liquid, for example pure water rinsing liquid jetting nozzle 352 and along remaining the rinse nozzle travel mechanism 385 of the LCD substrate G surface of inclination attitude with the mobile obliquely rinsing liquid jetting nozzle 352 of fixing speed.Rinse nozzle travel mechanism 385 has with the guiding rail 386 of the angle configurations identical with LCD substrate G, chimeric and keep the nozzle keeping arm 387 of rinsing liquid jetting nozzle 352 and the driving mechanisms 388 that nozzle keeping arm 387 moved along guiding rail 386 with guiding rail 386.
By the limit from the downward square end of upper end of the LCD substrate G that remains inclination attitude by substrate leaning device 410 along the mobile rinsing liquid jetting nozzle 352 in LCD substrate G surface, limit from rinsing liquid jetting nozzle 352 to LCD substrate G ejection rinsing liquid, can remove the developer solution residue of LCD substrate G.Rinsing liquid jetting nozzle 352 move the developer solution residue can remove LCD substrate G at short notice so that can to reduce the substrate face inside dimension irregular by carry out rinsing with the speed that for example is not less than 200mm/ second.
In order effectively to remove the developer solution residue of LCD substrate G by rinsing liquid jetting nozzle 352, preferably be suitable for the height ejection of regulation and press the ejection rinsing liquid.In addition, rinsing liquid jetting nozzle 352 preferably uses the nozzle at LCD substrate G Width (Y direction) length, the basic banded rinsing liquid of ejection, so that just can be to the whole ejection of LCD substrate G rinsing liquid by once moving of rinsing liquid jetting nozzle 352.Also can from rinsing liquid jetting nozzle 352, spray rinsing liquid in spurting ground.
Height is pressed in the ejection of the rinsing liquid of ejection from rinsing liquid jetting nozzle 352, and therefore, owing to keep the LCD substrate with inclination attitude, just having from dispersing after LCD substrate G reflects back provides on the district 324c to second developer solution.In order to prevent to provide district 324c to disperse to second developer solution, provide between district 324c and the removal liquid/rinsing district 324d at second developer solution, be preferably on the height that does not hinder horizontal transport LCD substrate G dividing plate 346 is set.The rinsing liquid of ejection is recovered in the rinsing liquid returnable 349 that is arranged among removal liquid/rinsing district 324d from rinsing liquid jetting nozzle 352, discharges by discharging tube.In addition, rinsing liquid jetting nozzle 352 also can be made of the liquid cutter.
In removing liquid/rinsing district 324d,, can stop to carry out developing reaction equably to LCD substrate G integral body for the short time carries out removing by the removal of substrate leaning device 410 the developer solution residue processing before of rinsing liquid.Therefore, can suppress to produce the inequality of developing, improve the live width homogeneity.In addition, when carrying out processing before removing the developer solution residue of rinsing liquid of removal by substrate leaning device 410, consider that first developer solution provides the developer solution coating direction of district 324b, in LCD substrate G, lift a side that begins to be coated with developer solution, developer solution is flowed down from LCD substrate G, carry out the removal of developer solution, can improve the development precision.
In rinsing district 324e, the rinse nozzle 353 to rinsing liquids such as LCD substrate G ejection pure water is installed.In rinsing district 324e, the limit is with fixing speed transmission LCD substrate G, and the limit is thoroughly removed attached to the developer solution on the LCD substrate G and also cleaned surface from LCD substrate G to LCD substrate G and the inside ejection rinsing liquid.Rinse nozzle 353 has the shape longer than the width of LCD substrate G, can be to the whole ejection of the Width rinsing liquid of LCD substrate G.
In dry section 324f, the air nozzle (air knife) 354 with dry gas such as regulation blast injection nitrogen is set by rinsing district 324e transmission LCD substrate G.In dry section 324f, the limit is with fixing speed transmission LCD substrate G, and the rinsing liquid that adheres on the LCD substrate G is blown away to surface and the inside jet drying gas of LCD substrate G in the limit, dry LCD substrate G.In addition, air knife 354 has the shape longer than the width of LCD substrate G, can be to the whole ejection of the Width dry gas of LCD substrate G.By roller bearing transport sector 314, the LCD substrate G after the dried end is transferred to i line UV illumination unit (i-UV) 325.
The following describes the development treatment operation of development treatment unit (DEV) 324.Figure 26 is the key diagram (process flow diagram) of expression development treatment operation signal.By roller bearing transport sector 314, will move into LCD substrate G in the delivery unit (PASS) 373 and move into first developer solution by Lead-In Area 324a district's 324b (step 1) is provided.Provide the transmission speed of the LCD substrate G of district 324b for example to be made as 65mm/ second from this delivery unit (PASS) 373 to first developer solutions.
Provide among the district 324b at first developer solution, as making LCD substrate G stop at state (step 2) on the assigned position, from the rearward mobile developing nozzle 351a in the place ahead of substrate transmission direction, 351b, the limit is to the surface coated developer solution (step 3) of LCD substrate G with the high speed of so-called 240mm/ for example second on the limit.The state that LCD substrate G is stopped by formation, drive controlling developing nozzle 351a, 351b easily.In addition, after stable developer solution is formed LCD substrate shape.
Make roller bearing transport sector 314 action, for example the transmission speed with 46mm/ second provides district 324c to be transmitted in the LCD substrate G (step 4) that first developer solution provides the masking liquid that is through with among the district 324b to second developer solution.When LCD substrate G provides district 324c by second developer solution, replenish developer solution from developer solution postinjector 315c to LCD substrate G, the developer solution (step 5) that falls from LCD substrate G when replenishing transmission LCD substrate G.
Provide the LCD substrate G among the district 324c to be transferred to removal liquid/rinsing district 324d (step 6) with being transferred to second developer solution, there, after by substrate leaning device 410 LCD substrate G being transformed to inclination attitude, make the developer solution on the LCD substrate G flow down (step 7).Therefore, the developer solution that flows down from LCD substrate G reclaims the developer solution returnable 347, delivers in the recovery tube.
Substantially when arriving the tilt angle theta of regulation with LCD substrate G, to LCD substrate G ejection rinsing liquid, for example pure water, rinsing liquid jetting nozzle 352 (step 8) are moved with the speed of the second of 500mm/ for example in the surface of edge LCD substrate G from rinsing liquid jetting nozzle 352 on the limit.At this moment, by the peristome of lid 348 sealing developer solution returnable 347, in case rinsing liquid is sneaked in the developer solution returnable 347.
In this step 7, preferably shorten the actuation time when LCD substrate G is transformed to inclination attitude.In addition, after LCD substrate G was remained the inclination attitude of predetermined angular, preferably beginning rapidly provided rinsing liquid and stops the step 8 of developing reaction from rinsing liquid jetting nozzle 352.For example, in step 7, under the situation of the inclination attitude retention time of LCD substrate G length, because the vestige or the LCD substrate G part that exist developer solution to fall are not stained with the part of developer solution, so be easy to generate the inequality of developing.But,, can prevent the inequality of developing by after step 7, carry out step 8 rapidly.
Because, can carry out the processing of step 7 and step 8 at short notice, so can evenly stop developing reaction to LCD substrate G integral body by the action of elevating mechanism 406 and the high-speed mobile of rinsing liquid jetting nozzle 352.Step 7 among removal liquid/rinsing district 324d and a succession of processing of step 8 and first developer solution provide the orientation independent of the developer solution coating among the district 324b, can realize suppressing producing among the LCD substrate G development inequality and improve the inhomogeneity effect of live width.To this, consider that first developer solution provides the developer solution coating direction of district 324b, the processing that flows down the step 7 of developer solution by carrying out lifting among the LCD substrate G side that begins to be coated with developer solution so that from LCD substrate G can improve the development precision.
Then, LCD substrate G is transferred among the rinsing district 324e (step 9), there, the limit is with fixing speed transmission LCD substrate G, and the limit is thoroughly removed and is cleaned attached to surface from the developer solution (step 10) on the LCD substrate G to LCD substrate G and the inside ejection rinsing liquid.To carry out that this rinsing is handled and the LCD substrate G by rinsing district 324e is transferred to dry section 324f (step 11).In dry section 324f, the limit is with fixing speed transmission LCD substrate G, and dried (step 12) is carried out by air nozzle 354 in the limit.By roller bearing transport sector 314, the LCD substrate G that finishes dried is transferred to i line UV illumination unit (i-UV) 325 (step 13), the ultraviolet treatment with irradiation of stipulating there.
Above although understand embodiments of the invention, but the invention is not restricted to the foregoing description.For example, because a succession of processing and first developer solution removed among liquid/rinsing district 324d provide the orientation independent of the developer solution coating among the district 324b, can realize suppressing producing the uneven effect of developing among the LCD substrate G, needn't be the opposite direction of substrate transmission direction so first developer solution provides the developer solution coating direction among the district 324b.
In addition, though the front side that lifts the substrate transmission direction by substrate leaning device 410 makes LCD substrate G become inclination attitude, also can make LCD substrate G become inclination attitude by the rear side that lifts the substrate transmission direction.At this moment, provide among the district 324b at first developer solution, the rear side side coating forwards developer solution from the substrate transmission direction preferably is not provided with second developer solution district 324c is provided, to shorten transmission path.
Elevating mechanism 406 both can be from an end of the top pull-up frame parts 403 of removing liquid/rinsing district 324d, also can from the transmission face of LCD substrate G exert oneself lift.In addition, use the elevating mechanism of scalable framework parts 403 two ends height and positions, unchangeably by after roller bearing 401 supports, lifting the LCD substrate G integral body of roller bearing 317 upper supports, tiltable becomes predetermined angular with the basic horizontal posture.The invention is not restricted to be applicable to LCD substrate G, also handle applicable to the liquid of glass substrate that is used for other purposes beyond other LCD etc. or ceramic substrate etc.
As mentioned above, according to liquid processing device of the present invention and liquid processing method because time that can uniform treatment liquid contacts with substrate in substrate integral body, thus can be in substrate integral body evenly the liquid of substrate handle.Therefore, realization can obtain the excellent results of high-quality substrate.In addition, because high-speed transfer substrate not, so improved the processing security, suppressed the damaged of substrate or damage, the space that stops to transmit usefulness also needn't become big.By moving the nozzle that treating fluid is provided to substrate, the liquid that can carry out at short notice in the first liquid handling part and the second liquid handling part is handled, and can boost productivity.

Claims (26)

1. substrate processing device has:
Transmission path is laid in the horizontal direction and is flatly carried the transmission body that processed substrate uses and constitute;
The transmission driver part drives described transmission body, with the described substrate of transmission on described transmission path;
Treating fluid provides parts, comprises one or more nozzles that the processed face of the described substrate on described transmission path provides predetermined processing liquid to use; With
The substrate tilt component, on described transmission path, to the place ahead of described transmission path or the rear described substrate that tilts, so that liquid falls from described substrate because of gravity,
Described treating fluid provides one side direction the other end, an end, one side of the transmission direction of parts from described substrate to be coated with first treating fluid,
Described substrate tilt component relatively improves an end one side that begins to supply with treating fluid on described substrate, makes described substrate tilt.
2. substrate processing device according to claim 1 is characterized in that: described substrate tilt component has: Lift Part, mobile substrate between the primary importance of transmission path and the second place above it; With the heeling condition holding member, remain on the tilt state of substrate of the second place.
3. substrate processing device according to claim 2 is characterized in that: described substrate tilt component has substrate posture switching part, in the posture of switching substrate on the second place between horizontality and heeling condition.
4. substrate processing device according to claim 1, it is characterized in that: described substrate tilt component has: transmission body tilt component, in the interval of on mobile transmission path, setting, between the 4th position of the inclination that the 3rd position and the liquid of the level on the transmission path falls usefulness, move the transmission body; With the heeling condition holding member, the transmission body that remains on the 4th position state of substrate that tilts.
5. substrate processing device according to claim 4 is characterized in that: have clutch mechanism, the transmission body that belongs to this interval releasably is connected on the transmission driver part.
6. substrate processing device according to claim 1 is characterized in that: have and be used to collect the treating fluid recovery part of falling the liquid below the transmission path.
7. substrate processing device according to claim 6 is characterized in that: comprise to be respectively applied in described treating fluid recovery part first and second intervals that the front and back adjacency is set on transmission path and collect the first and second treating fluid recovery parts of falling the liquid under the transmission path.
8. substrate processing device according to claim 7 is characterized in that: described treating fluid provides parts to comprise and is configured in the first and second interval first and second interior nozzles respectively.
9. substrate processing device according to claim 7, it is characterized in that: described substrate tilt component comprises the first substrate rake, this rake tilts substrate, so that the on-chip liquid that provides in first interval falls into the first liquid collecting portion before entering second interval.
10. one kind is carried out the liquid processing device that standard solution is handled to substrate, possesses:
The first liquid handling part is coated with treating fluid on the substrate that keeps flat-hand position;
The second liquid handling part is removed described treating fluid from the substrate that has been coated with described treating fluid; With
Substrate transmission mechanism, from the described first liquid handling part to the described second liquid handling part with flat-hand position to a direction substrate transport,
The described first liquid handling part has treating fluid provides mechanism, from the place ahead of the substrate transmission direction of described substrate transmission mechanism rearward, and the described treating fluid of coating on described substrate,
The described second liquid handling part has the substrate leaning device, lifts the place ahead of the transmission direction of the substrate that has been coated with described treating fluid, and described substrate is transformed to inclination attitude, removes to be coated on described on-chip treating fluid.
11. liquid processing device according to claim 10 is characterized in that:
Prevent the dividing plate that the treating fluid between described first liquid handling part and the described second liquid handling part disperses mutually in setting between described first liquid handling part and the described second liquid handling part.
12. liquid processing device according to claim 10 is characterized in that:
The described first liquid handling part has first treating fluid provides mechanism, from the place ahead of the substrate transmission direction of described substrate transmission mechanism rearward, and described first treating fluid of coating on described substrate,
Described substrate leaning device lifts the transmission direction front of the substrate that has been coated with described first treating fluid, and described substrate is transformed to inclination attitude, and remove and be coated on described on-chip first treating fluid,
Second treating fluid provides mechanism, the limit is moved described second treating fluid from the downward square end of the upper end of described substrate the position is provided, and the limit provides to described substrate flows out the second used treating fluid of the described first treating fluid residue from the substrate that is remained inclination attitude by described substrate leaning device.
13. liquid processing device according to claim 12 is characterized in that:
Described first treating fluid provides mechanism to possess:
Spray the first treating fluid jetting nozzle of described first treating fluid; With
Flatly move first nozzle moving mechanism of the described first treating fluid jetting nozzle with fixing speed along the surface of described substrate.
14. liquid processing device according to claim 12 is characterized in that:
Described second treating fluid provides mechanism to possess:
Spray the second treating fluid jetting nozzle of described second treating fluid; With
Move second nozzle moving mechanism of the described second treating fluid jetting nozzle obliquely with fixing speed along the surface of described substrate.
15. liquid processing device according to claim 14 is characterized in that:
From the described second treating fluid jetting nozzle, spray described second treating fluid to vertical direction.
16. liquid processing device according to claim 14 is characterized in that:
The described second treating fluid jetting nozzle with the transmission direction vertical direction of the substrate of described substrate transmission mechanism on have long shape, spray described second treating fluid to described substrate bandedly.
17. liquid processing device according to claim 10 is characterized in that:
Described substrate leaning device has:
On the assigned position of described substrate the inside, dock and support the support component of described substrate;
Described substrate landing when preventing that described substrate from converting inclination attitude to and support directing pin as described substrate lower end surface;
The members of frame that keeps described support component; With
The driving mechanism of described members of frame tilts.
18. the liquid processing device that substrate is carried out the standard solution processing possesses:
The first liquid handling part, coating first treating fluid on the substrate that keeps flat-hand position;
The second liquid handling part is removed described first treating fluid from the substrate that has been coated with described first treating fluid; With
Substrate transmission mechanism transmits the substrate that be coated with described first treating fluid with flat-hand position to a direction to the described second liquid handling part from the described first liquid handling part,
The described first liquid handling part is coated with first treating fluid from one side direction the other end, an end, one side of the transmission direction of described substrate,
The described second liquid handling part has: the substrate leaning device, lift a described end one side of the substrate that has been coated with described first treating fluid, and described substrate is transformed to inclination attitude, remove and be coated on described on-chip first treating fluid;
The treating fluid jetting nozzle, the residue of described first treating fluid of outflow sprays second treating fluid to described substrate from the substrate that is remained inclination attitude by described substrate leaning device; With
Nozzle moving mechanism, along the substrate surface that remains inclination attitude by described substrate leaning device, oblique mobile described treating fluid jetting nozzle.
19. liquid processing device according to claim 18 is characterized in that:
Also possess the treating fluid recovery part, reclaim from be transformed into first treating fluid that flows down the substrate of inclination attitude by described substrate leaning device.
20. liquid processing device according to claim 19 is characterized in that:
Described treating fluid recovery part possesses the returnable of first treating fluid that capture falls from described substrate; Open and close the removable lid above the described returnable; With the recovery tube that transmits first treating fluid that captures in the described returnable to determined location.
21. the liquid processing method to handling along the substrate enforcement standard solution of a direction transmission with flat-hand position has:
With first operation of flat-hand position to the first liquid processing region substrate transport of coating first treating fluid on substrate;
Stopping under the state of described substrate,, rearward be coated with second operation of described first treating fluid from the place ahead of described substrate transmission direction at described substrate by on described substrate, moving the nozzle of described first treating fluid of ejection;
Be coated with the 3rd operation of the substrate of described first treating fluid to the second liquid processing region transmission of removing first treating fluid from described substrate with flat-hand position;
Lift the transmission direction front side of described substrate, and make described substrate inclination predetermined angular, remove the 4th operation of described first treating fluid from described substrate; With
Described substrate is remained on the state of inclination predetermined angular, the limit is from the position that provides that the downward square end of the upper end of described substrate moves described second treating fluid, and the limit provides the 5th operation that flows out second treating fluid of described first treating fluid from described substrate to described substrate.
22. liquid processing method according to claim 21 is characterized in that:
In described the 4th operation, the angle of inclination of described substrate is more than 10 degree.
23. liquid processing method according to claim 21 is characterized in that:
In described the 5th operation, the limit sprays described second treating fluid from the nozzle that sprays described second treating fluid, and the described substrate surface in edge moves described nozzle with fixing speed obliquely.
24. liquid processing method according to claim 23 is characterized in that:
In described the 5th operation, as the nozzle of described second treating fluid of ejection, adopt with the transmission direction vertical direction of described substrate on have long shape, be the nozzle that sprays described second treating fluid to described substrate bandedly.
25. one kind the substrate of having implemented exposure-processed implemented the liquid processing device of development treatment, possesses:
The first liquid handling part is coated with developer solution on the substrate that keeps flat-hand position;
The second liquid handling part is removed described developer solution from the substrate that has been coated with described developer solution; With
Substrate transmission mechanism, from the described first liquid handling part to the described second liquid handling part with flat-hand position to a direction substrate transport,
The described first liquid handling part has:
Developing nozzle sprays described developer solution; With
Developing nozzle travel mechanism flatly moves described developing nozzle along described substrate surface with fixing speed, so as from the place ahead of the substrate transmission direction of described substrate transmission mechanism rearward at the described developer solution of described substrate coating,
The described second liquid handling part has:
The substrate leaning device lifts the transmission direction front side of the substrate that has been coated with described developer solution, and described substrate is transformed to inclination attitude, removes and is coated on described on-chip developer solution;
Rinse nozzle, the rinsing liquid of described developer solution is cleaned in ejection; With
Rinse nozzle travel mechanism, move described rinse nozzle along described substrate surface obliquely with fixing speed, spray described rinsing liquid to described substrate so that the limit, position that provides that the downward square end of upper end of the substrate of inclination attitude moves described second treating fluid is provided from described substrate leaning device on the limit.
26. the liquid processing method of the development treatment of a substrate that has carried out exposure-processed has:
With first operation of flat-hand position to the first liquid processing region substrate transport of coating developer solution on substrate;
Stopping under the state of described substrate,, rearward be coated with second operation of described developer solution from the place ahead of described substrate transmission direction at described substrate by on described substrate, moving the nozzle of the described developer solution of ejection;
Be coated with the 3rd operation of the substrate of described developer solution to the second liquid processing region transmission of removing developer solution from described substrate with flat-hand position;
Lift the transmission direction front side of described substrate, and make described substrate inclination predetermined angular, remove the 4th operation of described developer solution from described substrate; With
Described substrate is remained on the state of inclination predetermined angular, and the limit is from the position that provides that the downward square end of the upper end of described substrate moves rinsing liquid, and the limit provides the 5th operation that flows out the rinsing liquid of described developer solution from described substrate to described substrate.
CNB02141002XA 2001-06-19 2002-06-19 Substrate processing device, liquid processing device and liquid processing method Expired - Fee Related CN1262888C (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP184717/2001 2001-06-19
JP2001184717A JP3916891B2 (en) 2001-06-19 2001-06-19 Substrate processing apparatus and development processing apparatus
JP184717/01 2001-06-19
JP204170/2001 2001-07-05
JP2001204170A JP3704064B2 (en) 2001-07-05 2001-07-05 Liquid processing apparatus and liquid processing method
JP204170/01 2001-07-05

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CN103534787B (en) * 2011-05-13 2018-02-06 株式会社尼康 The more changing device of substrate

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