200533427 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種技術，其無需停止對於基板之處理即 可洗淨狹縫喷嘴，藉此可縮短間歇時間。 【先前技術】 作為基板製造步驟中所使用之裝置，眾所周知有一種狹 縫塗佈機（基板處理裝置），其藉由自狹縫喷嘴向基板表面吐 出光阻劑液等處理液，從而於基板上塗佈光阻劑液。 先鈉以來，考慮到業者要求於基板之製造步驟中提高生 產性的請求，一直希望可縮短基板處理之間歇時間，例如， 於專利文獻1中揭示有如此之狹縫塗佈機。於專利文獻】所 揭示的裝置中，提出有一種技術，其藉由以複數個狹縫喷 嘴同時處理複數個基板，從而縮短間歇時間。 【專利文獻1】曰本專利特開平10一 216599號公報 [發明所欲解決之問題] =一方面，於狹縫塗佈機中為提高塗佈處理精度，較女 的是對於基板每實施—讀佈處理，就實H用以洗^ 狹縫噴嘴前端等之維護。但是，例如當 /’ 縫塗佈機處於鸯 :中，於實施對於狹縫喷嘴之維護之期間，由 使用該狹縫喷嘴’故而狹縫塗佈機亦無法實施針對於：相 =塗佈處理。因此，於實施基板搬出人之處理期間内未士 、維濩之情形時，存有基板處理之間歇時間 疋 特別是’去除滞留於狹縫噴嘴内部之：的問題。 長守間，故而存有於基板搬出入處理 、 了間内難以完成上 98703.doc 200533427 述去除空氣處理的問題。 於專利文獻1所揭示之裝置甲，當複數個狹 二心 應地處於待機狀態，故而無法解决由於維 濩斤k成之間歇時間延長的問題。 嘖:產文：1所揭示之狹縫塗佈機中，例如-方狹縫 "，吊，品要對於該狹縫喷嘴實施大幅度維護之情 形％，亦會產生必須停止全部狹鏠塗佈機的問題。即，若 增加狹縫喷嘴數量，則亦會增加維護機會，故而於專利文 獻1_示之狹縫噴嘴中’進—步會產生由於維護所造成之 間歇時間延長的問題。 本發明係蓉於上述問韻— ^ 上边問碭而元成者，目的在於防止由於維 邊所造成之間歇時間之增大。 【發明内容】 為料上述問題，請求们之發明係_種基㈣理裝置， ”特被在於·於基板塗佈區域上塗佈特定處理液，且具備 ”寺钱構纟保持一片基板；複數個狹縫喷嘴，其朝向保 持於上述保持機構之上述基板塗佈區域之幾乎全部區域， 直線狀吐出口吐出上述特定處理液，·供給機構，其向上 料數個狹縫噴嘴供給上述特定處理液；升降機構，其分 別單獨升降上述複數個狹縫噴嘴；移動機構，其分別使保 、、、、述保持钱構之上述基板與i述複數個系丸縫喷嘴沿上 述基板表面之方向單獨地相對性移動；及維護機構，其對 於上述複數個狹縫喷嘴實施特定維護。 98703.doc 200533427 又，請求項2之發明係請求項丨之發 其特徵在於：上述維護機構 ““理裝置， 基板實施吐出的狹缝喷嘴。 Μ淨液洗淨未向上述 二=項3之發明係請求項2之發明之基板處理裝置， ί於：上述洗淨機構對於上述複數個狹縫噴嘴，八 別具備單獨的洗淨液供給路。 、 刀 又’請求項4之發明係請求項1 其特徵在於:上述維護機構進而::明之基板處理裝置， 槿 $而具備脫氣機構，該脫氣機 '、°上述基板實施吐出的狹縫噴嘴實行脫氣。 又」請求項5之發明係請求们之發明之基板處理裝置， 八特欲在於.上述供給機構對於上述複數個狹縫喷嘴，分 別具備單獨的處理液供給路。 又1求項6之發明係請求们之發明之基板處理裝置， ”特k在於·進而具備獲取機構’其獲取維護條件；儲存 機構，其儲存藉由上述獲取機構所獲取之維護條件；及控 制機構’其依據儲存於上述儲存機構中之維護條件控制上 述維護機構。 明求項7之發明係請求項1之發明之基板處理裝置， 其特徵在於：進而具備測定機構，其係對於上述複數個狹 縫喷嘴之各個敎與保持於上㈣持機構之上述基板之間 隔’上述升降機構根據上述測定機構之測定結果，升降上 述複數個狹縫噴嘴。 又’睛求項8之發明係請求項1之發明之基板處理裝置， 其特徵在於：上述移動機構係線性馬達。 98703.doc 200533427 又，請求項9之發明係請求項丨之發明之基板處理裝置， 其特徵在於：上述複數個狹縫喷嘴含有長度方向之寬度互 為不同者。 [發明之效果] 匕如請求項1至請求項9之發明中，藉由具備複數個狹縫噴 嘴以及維護機構，可繼續對於基板之處理並且可充分地維 濩其他狹缝噴嘴，上述複數個狹縫喷嘴係朝向保持於保持 機構之基板塗佈區域之幾乎全部區域，自直線狀之吐出口 吐出上述特定處理液，上述維護機構係對於複數個狹縫噴 嘴實施特定維護。 ' 士如請求項2之發明中，維護機構藉由具備洗淨機構而可繼 續對於基板之處理並且可充分地洗淨其他狹縫噴嘴，上述 洗淨機構藉由特定洗淨液從而洗淨並非處於向基板實施吐 出處理之狀態之狹縫喷嘴。 +如請求項3之發明中，洗淨機構藉由具備對於複數個狹縫 喷嘴分別獨立的洗淨液供給路’從而可分別供給適合於各 狹縫喷嘴之洗淨液。 如明求項4之發明中，維護機構藉由進而具備脫氣機構從 而可龜績對於基板之處理並且可充分地脫氣其他狹縫喷 嘴，上述脫氣機構自並非處於向基板實施吐出處理之狀態 之狹縫噴嘴實行脫氣處理。 〜 + =請求項5之發明中，供給機構藉由具備對於複數個狹縫 賀嘴分別獨立的處理液供給路，&而可分別供給適合於各 狹縫喷嘴之處理液。 98703.doc 200533427 藉由進而具備依 護機構之控制機 據儲存於儲存機構 構，從而可有效率 如請求項6之發明中， 中之維護條件而控制維 地貫行必要維護。 ^貝7之發明中，進而具傷測定機構， 上述複數個㈣㈣與經保 _ _疋各 隔;升降機構根據藉由測定機構所測定:::板：間的間 個狭縫喷嘴，藉此複數個狹縫嗔嘴均；:二’升降複數 基板。 哭買嗝均了對應於任何厚度之 藉由移動機構係線性馬達，從而可 方 如請求項8之發明中 防止增加佔據面積。 複數個狹縫喷嘴藉由含有於長度 從而可對應於不同寬度之基板。 如睛求項9之發明中， 向上寬度互為不同者， 【實施方式】 爹添附圖式加以詳 以下，就本發明較好之實施形態 細說明。 <:1·第1實施形態> 圖1係表示本發明之基板處理裝置丨概略的立體圖。圖2 係表不基板處理裝置丨之本體2之側剖面，並且表示光阻劑 液之塗佈動作相關之主要構成要素的示意圖。 再者，圖1中為便於圖示以及說明，定義為2軸方向表示 垂直方向，XY平面表示水平面，為便於掌握位置關係而簡 單地定義該等，並非僅限定於以下所說明之各方向。對於 下述各圖亦同樣。 <整體構成> 98703.doc •10· 200533427 置處理裝置1大致分為本體2與控制部該基板處理裝 置1中將用以製造液晶顯示裳置之圖像面板之方形玻璃基 板設為被處理基板（以下篩 ^ Θ ^為基板」）90，於選擇性钱刻 形成於基板90表面上之^^ 、、 之兒極層等之製程中，構成為於基板 、塗佈光阻劑液作為處理液之塗佈處理裝置。因 此，於該實施形態中，狹縫噴嘴仏、川用以吐出光阻劑 液。、再者，基板處理裝置丨不僅係液晶顯示裝置用之玻璃基 板，通吊亦可變形為將處理液（藥液）塗佈於平板顯示器用各 種基板之裝置而加以利用。 本體2具備平臺3，其可作為用以載置保持基板90之保持 口發揮功肊’亚且亦可作為附屬之各機構之基台發揮功 能。平臺3具有正方體形狀且係例如通體石製製品，其上面 (保持面30)以及側面均加工為平坦面。 平上面設為水平面，從而成為基板90之保持面30。保 持面30上分佈形成有未圖示之多個真空吸附口，於基板處 理裝置1處理基板90之期間，藉由吸附基板90從而將基板9〇 保持於特定水平位置上。又，於保持面3〇上藉由未圖示之 驅動機構，可上下自由升降之複數個起模頂桿設置為相 隔適當間隔。起模頂桿LP用於於取出基板90時擠壓抬升基 板90等。 & 於保持面30中夾持有基板9〇保持區域（保持基板9〇之區 域）之兩端部，固設有於大致水.平方向上平行延伸之一對行 進執道31。行進執道31構成固設於架橋構造4a、4b之兩端 部取下方且未圖示之支持組塊，以及引導架橋構造乜、讣 98703.doc 200533427 之移動（將移動方向規定為特定方向）且將架橋構造化、讣 支持於保持面3 0上方之線性導執。 於平臺3上方設有架橋構造4a、外，其自該平臺3之兩側 部分架設為大致水平。 架橋構造4a主要包含喷嘴支持部術，其將例如碳纖維增 強樹脂作為骨材，·以及升降機構43a、…，其用以支持架 橋構造4a兩端。再者，架橋構造仆與架橋構造乜之構成： 致相同，因此適當省略相關說明。 嘴嘴支持部4〇a上安裝有狹缝喷嘴…與間隙感測器 2a於圖1中γ軸方向上具有長度方向之狹縫噴嘴—與供 給機構7(光阻劑泵72a)相連接，上述供給機構7用以向狹縫 喷嘴41 a供給光阻劑液。 狹縫喷嘴仏掃描基板9〇之表面，並且將藉由供給機構7 所供給之光阻劑液吐出至基板9〇表面之特定區域（以下稱 為、「光阻劑塗佈區域」° )上。藉此’狹縫噴嘴41a將光阻劑 液塗佈至基板90上。此處’所謂光阻劑塗佈區域，其係指 於基板90表面中將要塗佈光阻劑液之區域，通常係指自基 板:〇之總面積中減去沿端緣之具有特定寬度之區域的區 S、再者，關於供給機構7之詳細說明如後所述。 隙感測器42a、42b分別位於狹縫噴嘴41a、41b附近， 女衣於贺嘴支持部4Ga、俱上，測定下方存在物（例如基板 面，光阻膜表面）間之高低差（間隙），將測定結果傳達 至控制部6。即，間隙感測器42a測定狹縫喷嘴41a與下方存 門隙，間隙感測器42b測定狹縫噴嘴4 1 b與下方存在 98703.doc 200533427 物之間隙。以如此之方式，基板處理裝置1分別單獨測定保 持於平臺3上之基板90與複數個狹缝喷嘴41a、41b之各間 升降機構43a、44a分開配置於喷嘴支持部4〇a兩側，介以 喷嘴支持部40a連結至狹缝噴嘴4 la。升降機構43 &、44a主 要包含AC伺服馬達430a、440a以及未圖示之滾珠螺桿，依 據來自控制部6之控制訊號，產生架橋構造4a之升降驅動 力。藉此，升降機構43a、44a可使狹縫噴嘴4la並進升降。 又，升降機構43a、44a用以調整狹縫喷嘴4U於γζ平面内之 文勢。再者，藉由升降機構43 b、44b之AC伺服馬達430b、 440b，亦可使狹縫喷嘴41b與狹縫噴嘴41&單獨分開實施同 樣的動作。 暴板處理裝置1中 /口卞堂j兩側邊緣分別叫δ又β⑵疋· (stat〇r)500、510。又，於架橋構造物之兩端部設有移動· 5〇la、511a，於架橋構造仆之兩端部設有移動子 511b。固定子500以及移動子5〇u、構成从無芯線性丨 達（以下僅簡稱為「線性馬達」。）5〇,固定子5⑽以及移動: 5〇la、501b構成線性馬達51。即，線性馬達5〇、51分別^ 備-對移料5〇la、5Glb以及5Ua、训，單獨使該等牙 動子於X軸方向上移動。 以如此之方式’本實施形態中之基板處理裝置礴 線性馬達5〇、51料使架橋料4am :構：而可通用固定子-，。因此，例如藉::: 有㈣馬達與滚珠螺桿之—般性移動機構，與使架橋= 98703.doc -13- 200533427 4a、4b單獨移動之情形相比，可減小佔據面積。 又’於架橋構造4a兩端部分別固設具備標尺部與檢測子 之線丨生、’扁碼态52a(未圖示）、53a。線性編碼器52&用以檢測 線性馬達50之移動子501 a之位置，線性編碼器53a用以檢測 線性馬達51之移動子511a之位置。以相同之方式，於架橋 構造4b兩端部固設線性編碼器52b、53b，線性編碼器52b 用以核測線性馬達5〇之移動子5〇 lb之位置，線性編碼器53b 用以檢測線性馬達51之移動子511b之位置。各線性編碼器 52a、52b、5 3a、53b將檢測出之位置資訊輸出至控制部6。 以如此之方式，各線性編碼器52a、52b、53a、53b分別 用以檢測各移動子5〇la、501b、511a、51 lb之位置，根據 该檢測結果，控制部6分別控制線性馬達5 〇、5 1，藉此基板 處理裝置1可分別使架橋構造4a、仆單獨移動。因此，不會 對一方之狹缝喷嘴（例如狹縫噴嘴41 a)之狀態造成影響，即 可使他方之狹缝噴嘴（例如狹縫喷嘴41b)移動。 於本體2之保持面30上，於保持區域X軸方向兩側設有開 口 32a、32b。開口 32a、32b與狹縫喷嘴41a、41b—樣於Y軸 方向上具有長度方向，並且該長度方向之長度與狹縫喷嘴 41a、41b之長度方向之長度大致相同。又，於圖1中省略下 述圖示：於開口 32a下方之本體2之内部設有洗淨液吐出機 構8 3 a、待機盒8 5 a以及預塗佈機構8 6 a，於開口 3 2 b下方之 本體2之内部設有洗淨液吐出機構83b、待機盒85b以及預塗 佈機構86b。 圖3係表示供給機構7以及洗淨機構8的圖。向狹縫喷嘴 98703.doc 14 200533427 4 1 a、4 1 b供給光阻劍潘夕糾μ (、、、'β機構7如圖3所示，主要包含 光阻劑容器70’作為光阻劑液流路之配管以及光 阻劑栗72a、72b。自光阻劑容器7〇介以光阻劑泵72a連接狹 縫嘴嘴仏之配管7U與將光阻劑液輸送至配管71a内之光 阻劑泵72_成針對於狹縫喷嘴…之㈣劑液供給路 73a。以相同之方式’自光阻劑容器7〇介以光阻劑泵”b連 接狹縫喷嘴41b之配管71b與將光阻劑液輸送至配管川内 之光阻劑栗72b構成針對於狹縫噴嘴川之光阻劑液供仏路 73\。即，供給機構7針對於各狹缝噴嘴41&、41卜，分別設 有單獨的光阻劑液供給路73a、73 b。 又，用以洗淨狹縫喷嘴41a、41b之洗淨機構8主要包含洗 渗液容器80,作為洗淨液流路之配管81&、8ib，泵8沘 以及洗淨液吐出機構83a、83b。自洗淨液容器8〇介以泵“a 連接洗淨液吐出機構83a之配管81a，將洗淨液輸送至配管 81a内之泵82a以及向狹縫喷嘴41a吐出洗淨液之洗淨液吐 出機構83a構成針對於狹縫噴嘴41a之洗淨液供給路84&。以 相同之方式，自洗淨液谷裔8〇介以泵82b連接洗淨液吐出機 構83b之配管81b，將洗淨液輸送至配管81b内之泵8沘以及 向狹縫喷嘴41b吐出洗淨液之洗淨液吐出機構83b構成針對 於狹縫喷嘴41b之洗淨液供給路84b。即，洗淨機構8針對於 複數個狹縫喷嘴41a、41b，分別具備單獨的洗淨液供給路 84a 、 84b 〇 洗淨液吐出機構83a、83b係分別向狹縫嘴嘴41a、斗化之 前端部吐出由洗淨液容器80所供給之洗淨液的機構。又， 98703.doc -15- 200533427 雖有省略圖示，伯 w 供給部…〖 出機構83a、83b中可自氣體 …、0 g性軋體（氮）且向狹縫噴嘴41a =咖—藉由未圖示之移動機構，可：、= 狹縫喷嘴—前端部，並且可藉由吹出氮氣 «而使洗淨液乾燥。 ,< 乂士此之方式，純處理裝藉由使用洗淨機構8以洗 :液洗淨複數個狹縫喷嘴41a、41b中之未處於對基板90實 =吐出處理之狀態的狹縫喷嘴’從而可實行洗淨處理⑽ 護），並且另外可繼續對於基板90實施處理。因此，可抑制 間歇時間之延長’並且可充分確保維護時間。 再者於本Λ施形態之基板處理裝置丨中，對於狹縫噴嘴 41a、41b使用相同洗淨液之情形時，亦可通用洗淨液供給 路84a、84b中之直至泵82a、8沘為止之路徑。該情形時 亦可如下構成··藉由開閉閥門從而打開關閉自泵至洗淨液 吐出機構83a、83b為止之配管，從而僅對於用以實施洗淨 處理之洗淨液吐出機構83 a、83 b供給洗淨液。 圖4係用以詳細說明狹縫噴嘴4丨a之光阻劑液供給路7 3 & 的說明圖。於配管71a上安裝有三向閥門71〇以及閥門711。 再者，於狹縫喷嘴41b側亦設有相同構造。又，於圖4中， 省略圖示一種電磁閥，其中三向閥門7丨〇、閥門7丨丨以及闊 門741連接至控制部6，藉由控制部6之控制實施開閉動作。 二向閥門7 10設置於配管71 a上連接有配管8 1 a之位置 處，可將配管71 a之上游側或配管8 1 a選擇連接於狹縫喷嘴 98703.doc -16- 200533427 4 la(配管71 a之下游側）。具體說來，向狹縫噴嘴41&供給光 阻劑液之情形時，打開配管71a之上游側，關閉配管81a。 藉此，自光阻劑泵72a所輸送之光阻劑液供給至狹縫喷嘴 41a。另一方面，向狹縫喷嘴41a供給洗淨液之情形時，關 閉配管71&之上流側，打開配管81a。藉此，自泵82&所輸送 之洗淨液供給至狹縫喷嘴41 a。 又，於狹縫喷嘴41a中安裝有脫氣機構74a。脫氣機構7牦 具備脫氣配管740以及閥門741。脫氣配管74〇連通連接至未 圖示之回收機構，藉由閥門74丨實行開閉。 再者，於本實施形態之基板處理裝置丨中，光阻劑液以及 洗淨液係自狹縫噴嘴41a左右兩側供給’亦可自例如中央部 分某一處供給。 待機盒85a、85b係使待機中之各狹縫喷嘴4u、4ib之前 端不會乾燥而加以設計者，於長時間未實施塗佈處理之期 間，狹縫噴嘴41a、41b主要於待機盒85a、85b之上方待機。 預塗佈機構86a、86b係於狹縫喷嘴41a、41b對 實行㈣處理之前不久，用《實施預備塗佈的機構1塗 佈機構86a、86b分別具備分配滾筒’狹縫喷嘴4ι &、川對 於4 7刀配滾同吐出光阻劑液後實施預備塗佈。冑此，可提 高基板處理裝置1之塗佈處理之精度。 返回至圖 1，控制部6於内部具備根據程式處理各種資 之演算部60，以及禪在於a > > — 、 於控制部6之前面，具備 輸入必要之指示之操作部62， • 夂保存耘式或各種資料之儲存部61。又， 用以使控制器對於基板處理裝置j 以及用以顯示各種資料之顯 98703.doc 200533427 示部63。 控制部6於圖1中藉由去闰-> ^ 精由未圖不之線纜，電性連接至附屬於 本體2之各機構。控制部6依撼#六 依據儲存於儲存部6 1中之資料或 來自操作部62之輸入訊號、或 、 凡I术目間隙感測器42a、42b 以及其他未圖示之各種感測器之訊號等，從而控制各構成。 >特別是’控制部6將維護條件儲存於儲存部㈣，上述維 護條件係藉由控制器操作操作部62而加以設定者。又，適 “ ϋ貝出儲存部61所儲存之維罐/欠& 仔之維遵條作，控制線性馬達50、51、 供給機構7以及洗淨機構8孳 — 成偁8寺彳文而可貫行相應當時狀況之 維護。 士再者’具體說來’儲存部61可為可暫時儲存資料之罐、 讀取專用之ROM以及磁盤裝置等。或者亦可為具有可移動 性之光磁盤或記憶卡等記憶媒體以及該等讀取裝置等。 又’操作部62可為按紐以及開關類（含有鍵盤或滑鼠等）等。 或者，亦可為如觸4莫面板顯示器般兼具顯示部Ο之功能 者。顯示部63可為液晶顯示器或各種指示燈等。 如上所述，用以說明本實施形態之基板處理裝置丨之構成 以及功能。 <動作說明> 圖5以及圖6係表示本實施形態之基板處理裝置丨動作的 流程圖。以下使用圖5以及圖6說明基板處理裝置丨之動作。 再者，下述基板處理裝置丨之動作若未作特別說明，則均依 據控制部6之控制加以實施。 首先，基板處理裝η實行完畢特定初期設定（步驟⑽) 98703.doc *18- 200533427 後，直至搬入基板90為止一直處於待機狀態（步驟Su)。再 者，所謂特定初期設定係指實行基板處理裝置丨之動作所需 之必要準備的步驟。例如，不僅包含基板處理裝置丨自動動 作之步驟（讀出資料等），而且包含控制器以手動方式實施特 定設定作業的步驟（追加新式方法或設定維護條件等）。又， 狹縫喷鳴41 a、41 b之初始化維護亦於初期設定中實行。 圖7係表示初期設定中所實行之初始化維護詳細說明的 流程圖。本實施形態之基板處理裝置！中，於初始化維護 中，對於狹縫喷嘴41a、41b實行内部洗淨處理以及外部洗 淨處理。再者，維護不僅限定於該等處理。又，以大致相 同之方式對於狹縫喷嘴41a以及狹縫噴嘴4ib實行初始化維 護，故而此處僅以對於狹缝喷嘴4丨&之處理為例加以說明。 首先，控制部6藉由控制線性馬達50、5丨從而使狹縫喷嘴 41 a移動至預塗佈機構86a之上方（步驟s 101)。 若狹縫噴嘴41a完成移動，則控制部6控制三向閥門710使 配管81a處於打開狀態，並且使配管71a之上游側處於關閉 狀態。又，控制閥門71WT開配管7lat下游側。藉此，可 連通連接自洗淨液容器80至狹縫喷嘴41 a為止之洗淨液流 路。進而，控制部6使脫氣機構74a之閥門741處於打開狀 態’打開脫氣配管740。 其次，控制部6驅動泵82a，自洗淨液容器80向狹缝喷嘴 4 la供給洗淨液（步驟S 102)，並且實施狹縫噴嘴41a之脫氣 (步驟S103)。若實行步驟S102，向狹縫喷嘴41a供給洗淨 液’則所供給之洗淨液輸送至配管71a之下游側且自狹縫喷 98703.doc -19· 200533427 觜化吐出。藉此，可洗淨狹縫嘴嘴41a之内部。 又，藉纟栗82&所輸送且供給之洗淨液亦 74a中溢出。藉由該洗淨液，狹縫喷嘴㈣ 乳機構 機構％擠壓，從而可向回收機構排出。因此，二氣向脫氣 =圖二=驟_與步驟Sl°3作為兩個不同之 匕不但只際上该兩個步驟係同時並行實施 者’亦可如下構成：於脫氣機構74a中設 再 制性實施脫氣。 礼用泵，可強 :開始驅動粟82a後再經過特定時間，則控制部6將合停 泵82a之動作從而使洗淨液停止供給。其次， 門，關閉配管8 la並且打開配管7U上游側。藉此了 =接自光阻劑容器7。至狹縫噴嘴仏為止之光阻劑液之 再者，實行步驟咖（S103)之時間（内部洗淨處理中之者 際洗淨時間）可作為維護條件預先加以設定，儲存於儲^ “I二以如此之方式，於基板處理裝置1中，將控制器預先 所δ又疋之維護條件儲存於儲在 居存於储存相中’控制部6將該維護條 牛：為-種方法(維護方法)加以實施，藉此於適合的時機， 可貫行必要之維護。 m藉由於以下所實行之基板處理方法（通常方 法）中加_入必要的維護方法，即使控制器沒有逐-下達指示 亦可實行維護，從而可推進自動化。因此，可減少控制器 必f介入之情形’故而可減輕控制器之負擔。以下若未特 m ’則維5!過程中控制部6所需之諸多條件作為維護條 98703.doc •20· 200533427 件預先加以設定且加以儲存。 其次，控制部6驅動光阻劑泵72a，自光阻劑容器70向狹 縫喷嘴41&供給光阻劑液（步驟81〇4)。藉此，狹縫喷嘴41&、 配笞7 1 a以及脫氣機構74a内之洗淨液受到排擠從而替換為 光阻劑液。 若開始驅動光阻劑泵72a後再經過特定時間，則控制部6 將會停止光阻劑泵72a動作從而使光阻劑液停止供給。其 次，關閉閥門711，關閉配管7;^之下游側並且關閉閥門 74 1，關閉脫氣配管740。藉此，狹縫喷嘴4丨a以及配管7工& 内成為填充有光阻劑液之狀態，至此内部洗淨處理完成。 若内部洗淨處理完成時，則控制部6控制線性馬達5〇、 51，使狹縫喷嘴41a移動至待機盒85a之上方（步驟sl〇5)。此 牯，控制部6以洗淨液吐出機構83a達到可掃描狹縫喷嘴4 j a 之吐出口附近之高度位置（狹縫喷嘴41a與洗淨液吐出機構 83&互不干擾之而度位置）的方式而控制升降機構43&、44&。 若狹縫喷嘴41a完成移動時，則控制部6根據洗淨液吐出 機構83a之掃描次數，判定是否要吐出洗淨液（步驟si〇6)， 需要吐出洗淨液之情形時，驅動泵82a向洗淨液吐出機構 83a供給洗淨液。藉此，洗淨液吐出機構向狹縫喷嘴 吐出洗淨液（步驟S107)，並且掃描狹縫噴嘴4U(步驟 S108)。因此，狹縫喷嘴41a之前端部自外部得以洗淨。再 者，洗淨液吐出機構83a掃描時之速度等亦可作為維護條件 加以設定。 另一方面，無需吐出洗淨液之情形時（步驟讓中判定為 98703.doc 21 200533427 十跳過步驟S1()7’掃描狹縫噴嘴4u(步驟siq8)。步驟 議：，洗淨液吐出機構…嘴出氮氣，故而不會吐出洗淨 液，猎由實行步驟S1〇8從而可乾燥處理狹縫嘴嘴…。 士再者’本實施形態之基板處理裝置^，實行步驟· 日守’由於亦實行步驟咖故而可吹出氮氣。其目的在於抑 制所吐出之洗淨液無必要地飛散等，若無需要亦可m 過程中停止吹出氮氣。根據亦預先設定有如此判斷之维護 條件，控制部6控制各構成，故美 要實施處理。 基板處理裝置1可根據需 每次實行步驟S108時，控制部6計數洗淨液吐出機構83a 之掃描次數直至完成㈣次數為止，重複實施步驟㈣至 S109之處理（步驟si〇9)。 若藉由洗淨液吐出機構83a完成特定次數之掃描後，則外 部洗淨處理完成，返回圖6所示之處理。此時，控制部咕 制升降機構43a、44a，使狹縫喷嘴4U下降且前端部侵入待 機盒85a内。藉此，可抑制狹縫喷嘴—之前端部之乾燥。 以下，將此時狹縫噴嘴41a、41b之狀態稱為「待機狀態」。 以上係初始化維護之處理。 返回圖6,於基板處理裝L中藉由控制器或者未圖示之 搬送機構，將基板90搬送至特^位置，則平臺3之起模 LP將會上升接收基板9G。而且’藉由起模頂桿Lp下降d 可將基板90載置於平臺3保持面3〇上之特定位置，從而：臺 3吸附保持基板9〇。藉由該動作’完成基板卯之搬 ： S11中判定為Yes)。 乂卜 98703.doc -22- 200533427 若完成搬入基板90，則基板處理裝置1結束狹縫喷嘴41a 之維護，開始II由狹縫喷嘴41a所實施之塗佈冑理（步驟 S12)，直至塗佈處理完成為止一直繼續處理（步驟si3)。再 者’步驟S12中之維護不僅限於初始化維護，亦可含有如後 所述之、、隹叹即，較好的是針對於狹縫喷嘴41 a之維護直至 可實行步驟S12為止方可結束，更加詳細的是於可實行步驟 S12之時刻，狹缝噴嘴41a處於待機狀態。 若說明藉由狹縫噴嘴41a所實施之塗佈處理，則首先根據 來自控制部6之控制訊號，升降機構43a、4乜以及線性馬達 50、51使狹縫噴嘴4 la移動至預塗佈機構86a之上方。其次， 藉由供給機構7將特定量之光阻劑液供給至狹縫噴嘴41&， 狹縫喷嘴41a向預塗佈機構86a之分配滾筒吐出光阻劑液。 藉此，於基板處理裝置i中可實行預備塗佈處理，完成狹縫 喷嘴41a之準備，處於可實施塗佈處理之狀態。 若結束預備塗佈處理，則依據來自控制部6之控制訊號， 升降機構43a、44a使安裝於噴嘴支持部4〇a上之間隙感測器 42a移動至高於基板9〇之厚度之特定高度處（以下稱為「測 定高度」。）。 右間隙感測器42a設置於測定高度，則線性馬達5〇、5 !使 架橋構造4a移動至（+x)方向（即，僅使移動子5〇la、5na)， 藉此可使間隙感測器42a移動至光阻劑塗佈區域上方為 止。此時’控制部6依據線性編碼器52a、53a之檢測結果， 藉由向各線性馬達50、5 1供給控制訊號，從而控制間隙感 測器42a之X軸方向位置。 98703.doc -23 - 200533427 其次’間隙感測器42a開始測定基板90表面之光阻劑塗佈 區域中基板90表面與狹縫喷嘴41 a之間隙，將測定結果傳達 至控制部6。此時，控制部6將間隙感測器42a之測定結果保 存於儲存部61中。 若結束藉由間隙感測器42a所實施之測定，則控制部6藉 由演算部60，依據來自間隙感測器42a之檢測結果從而算出 喷嘴支持部40a之位置，該喷嘴支持部4(^之位置係狹縫喷 嘴41a於YZ平面中之姿勢成為適當之姿勢（狹縫喷嘴41&與 光阻剤塗佈區域之間隔係適於塗佈光阻劑液之間隔時的姿 勢。以下稱為「適當姿勢」。）時之位置。進而，依據演算 部60之算出結果，向各升降機構43&、4物分別供給控制訊 號。依據來自控制部6之控制訊號，各升降機構43a、4乜使 贺嘴支持部40a於Z軸方向上移動，將狹縫噴嘴4U調整為適 當姿勢。 。。以如此之方式，為實現可均句地塗佈光阻劑液，則必須 嚴密地調整狹缝喷嘴41a與基板9G表面之距離。基板處理裝 置1中’㈣部6根據間隙感測器42a之檢測結果從而控制升 降機構43a、44a，藉此可調整該距離。 又，如上所述，本實施形態之基板處理裳置工對於各狹縫 喷嘴4U、41b ’分別單獨地設有升降機構 44b以及間隙感測器42a、42b，故@ ^ + 故而對於各狹缝嘴嘴4 1 a 41 b可分別單獨實施上述姿勢纟 文羿凋整。因此，即使於基板處: 裝置1處理任何厚度之基板9 〇之棒 攸川之1^形時，均可藉由狹縫喷1 4 1 a、41 b加以處理。即，根據所虎 像所處理之基板90之不同厚度 98703.doc -24- 200533427 無需限定可實施處理之狹縫噴嘴4ia、41b。 進而，線性馬達50、51使架橋構造4a於X軸方向上移動， 使狹缝喷嘴4 1 a移動至吐出開始位置。此處，所謂吐出開始 位置，其係指狹縫喷嘴41 a大致沿光阻劑塗佈區域一邊之位 置。 若狹縫喷嘴41a移動至吐出開始位置為止，則控制部6向 線性馬達50、51供給控制訊號。依據該控制訊號，線性馬 達5〇、51使架橋構造4a移動至（+χ)方向，藉此狹縫噴嘴 掃描基板90之表面。進而，控制部6依據線性編碼器52&、 5 3 a之檢測結果監視狹縫噴嘴4丨a是否移動至吐出結束位 置。 、口 又，與狹縫喷嘴41a之掃描並行實施，控制部6向供給機 構7供給控制訊號，根據該控制訊號從而供給機構7驅動光 阻劑泵72a。藉此，自光阻劑容器7〇介以相對於狹縫噴嘴4卜 而獨立没置之光阻劑液供給路73a，可向狹縫噴嘴供給 光阻劑液。再者，控制部6控制供給機構7以將自狹縫喷嘴 41a所吐出之光阻劑液流量設定為可形成期望膜厚之薄膜 所需之流量。具體說來，即控制光阻劑泵72a之驅動速度。 藉由如上所述之動作，狹縫喷嘴41a於光阻劑塗佈區^内 吐出光阻劑液，於基板90表面上可形成光阻劑液層（薄膜）。 即，可實施藉由狹縫噴嘴41a所實行之塗佈處理。 若狹縫噴嘴4U移動至吐出結束位置為止，則控制部㈣ 控制訊號供給至供給機構7。依據該控制訊號，供給機構7 停止光阻劑泵72a之動作。藉此，停止自狹縫噴嘴“a吐出 98703.doc 25 200533427 光阻劑液，從而結束藉由狹縫噴嘴41a所實施之塗佈處理 (步驟S 13中判定為Yes)。再者，亦可大致同樣地實施下述藉 由狹縫噴嘴41b所實施之塗佈處理。 9 若完成藉由狹縫喷嘴41a所實施之塗佈處理，則基板處理 裝置1開始實施針對於狹缝噴嘴41a之維護（步驟si4)。 本實施形態之基板處理裝置丨中，關於針對於狹縫噴嘴 4&所實施之維護加以說明，首先，控制部6向升降機構 43a、44a以及線性馬達50、5 1供給控制訊號，升降機構43&、 44a以及線性馬達50、5 1使狹縫噴嘴41 a移動至待機盒85&之 上方。 其次，供給機構7將特定量光阻劑液供給至狹缝噴嘴 41a，藉此狹缝噴嘴41a向待機盒85a吐出光阻劑液。藉此， 例如藉由塗佈結束時之倒吸等，從而可去除混入至狹3縫噴 嘴41a内部之空氣。因此，下一次藉由狹縫噴嘴4u實施塗 佈處理時，可提高吐出應答性以及吐出均勻性，故而可提 高狹縫喷嘴4U之吐出精度。以如此之方式，本實施形態之 基板處理裝置1中，藉由控制部6、供給機構7以及待機盒 85a(預塗佈機構86a)亦可實行脫氣處理。即，不僅脫氣機構 74a ’而且該等構成亦具有作為本申請案發明之脫氣機構可 發揮之功能。 若脫氣處理結束，則洗淨機構8驅動泵82a，自洗淨液容 器80向洗淨液吐出機構83a供給洗淨液，使洗淨液吐出機構 83a於Y軸方向上移動。藉此，可實行狹縫噴嘴41&之前端部 之洗淨處理（與圖7所示之外部洗淨處理相同之處理），可清 98703.doc -26- 200533427 除所附著之光阻劑液或其他污染物。因此，下一次藉由狹 縫喷嘴41 a實施塗佈處理時，可抑制顆粒附著於基板9〇上或 所形成之膜厚不均勻，故而可提高藉由狹縫噴嘴41a所實施 之塗佈精度。 以上主要係基板處理中之基板處理裝置1中針對於狹縫 噴夤4 la之維遵内谷。再者，下述針對於狹縫喷嘴々lb之維 護亦為大致相同之内容。 實行步驟S14，開始實施針對於狹縫喷嘴4U之維護，與 此同時基板處理裝置i實施已結束塗佈處理之基板9〇之搬 出處理，控制部6監視基板9〇之搬出處理之完成（步驟 S15)。於基板90之搬出處理中，首先，平臺3停止吸附基板 9〇且上升起模頂桿LP，藉此將基板9〇抬升至特定高度位 置。控制器或者搬送機構接收處於該狀態之基板9〇，搬送 至下一處理步驟，從而完成基板90之搬出處理（步驟Sl5中 判定為Yes)。 若基板90之搬出處理結束，則基板處理裝置1根據是否存 在有需要進一步處理之基板90(以下將下一需要處理之基 板90%為基板91」），判定是否結束動作（步驟S16)，於未 存在有基板9丨之情形時（步驟S16中判定為Yes)結束處理 取另一方面，基板處理裝置！於存在有基板91之情形時（步 驟S16中判定為N。）’對於基㈣實施搬入作業，監視該搬 入作業之完成（步驟S21)。 :元成搬人基板9卜則狹縫噴嘴川之維護結束，從 始貫行藉由狹縫喷嘴41b所實施之塗佈處理（步驟s22)。藉 98703.doc -27- 200533427 由狹縫噴嘴41 b所實施之塗佈處理以與藉由狹縫喷嘴41 a所 實施之塗佈處理大致相同之方式加以實行。 以如此之方式，本實施形態之基板處理裝置1中，狹縫喷 嘴41b實行針對於基板91之塗佈處理，藉此於搬入基板91 之時刻’無需結束針對於狹縫喷嘴41a之維護。即，於先前 之裝置中，實行步驟S14後，基板搬出入時間（相當於實行 步驟S15、S16、S21之時間）僅充當為維護時間，但於基板 處理裝置1中，可將實行步驟815、S16，步驟S21至S26以及 步驟sii之時間充當為狹縫喷嘴41a之維護時間。因此，無 需停止基板處理裝置1，即使實行如脫氣處理般需要較長時 間之維護，亦不會延長針對於基板9〇之間歇時間。 若完成藉由狹縫喷嘴41 b對於基板91所實施之塗佈處理 (步驟S23中判定為Yes)，則基板處理裝置”#始實施狹縫噴 嘴41b之維護（步驟S24)，並且開始基板91之搬出作業，監 視該搬出作業之完成（步驟S25)。 若完成搬出基板91，則藉由判定是否存在需要進一步處 理之基板90，從而判定是否結束動作（步驟S26)，於未存在 有需要處理之基板90之情形時結束處理。 另一方面，存在有需要處理之基板9〇之情形時，返回步 驟sii繼續實施處理。以如此之方式，基板處理裝置1直至 未存在有需要處理之基板90為止（直至步驟Sl6或者步驟 S26中判定為No為止），繼續實施步驟su至su以及步驟m 至S26之處理。 如上所述，本實施形態之基板處理裝置丨具備可向保持於 98703.doc -28- 200533427 平臺3上之基板90光阻劑塗佈區域之幾乎全部區域而吐出 光阻劑液之複數個狹縫噴嘴41a、41b，於複數個狹縫噴嘴 4la、41b中，可針對於未向基板9〇實施吐出處理之狹縫喷 嘴實行維護，藉此可繼續實施針對於基板9〇之處理，並且 可充分洗淨其他狹縫噴嘴。 又，本實施形態之基板處理裝置丨具備分別使複數個狹缝 喷嘴41a、41b單獨升降之升降機構43a、4牦、4扑、4朴以 及用以分別測定複數個狹縫喷嘴41a、41b與保持於平臺3上 之基板90之間隔的間隙感測器42a、42b，根據藉由間隙感 測器42a、42b所測定之測定結果從而升降複數個狹縫喷嘴 41a、41b，藉此複數個狹縫噴嘴41a、411)均可對應於任何 厚度之基板9 0。 又，作為使架橋構造4a、4b於X軸方向上移動之機構，藉 由採用線性馬達50、51從而可防止增大佔據面積。 再者，於本實施形態之基板處理裝置丨中，供給至狹縫噴 嘴41a、41b之光阻劑液均可自光阻劑容器7〇處供給，且係 通用光阻劑液。但是，亦可分別單獨設置分別連接至光阻 劑液供給路73a、73b之光阻劑容器70，於該等光阻劑容器 70内財存互不相同之光阻劑液。即，本實施形態之基板處 理裝置1亦可如下構成：可分別單獨設有光阻劑液供給路 73a、73b，故而狹縫噴嘴41a、41b可吐出互不相同之處理 液。該情形時，對於基板90與基板91可塗佈互不相同之處 理液，但即使於該情形時，亦可充分確保狹缝噴嘴4u、4ib 之維護時間。 98703.doc -29- 200533427 又，洗淨機構8向洗淨液吐出機構83a、83b所供給之洗淨 液均自洗淨液容器80處供給，且係通用洗淨液。但是，亦 可分別單獨設置分別連接至洗淨液供給路⑷、州之洗淨 液容器8G，於該等洗淨液容器8()内貯存互不相同之洗淨 液。即’本實施形態之基板處理裝亦可如下構成：由於 分別單獨設置有洗淨液供給路8化、_，故而根據例如狹 缝喷實41a、4 lb所使用之處理液，從而可使用最適合之洗 淨液洗淨各狹縫喷嘴41a、4 lb。 又，步驟S14(或者步驟S24)中之維護（藉由基板處理裝置i 所實施之基板處理過程中之維護)於處理一片基板期間難 以結束之情形時，狹縫噴嘴41a、41b亦可繼續對兩片基板 實行塗佈處理。即，每處理多少片基板後交替使用狹縫喷 嘴41a與狹縫喷嘴41b ’其亦可根據實行維護所需之時間加 以決定。 <2.第2實施形態> 上述第1實施形態中，就藉由交替使用狹縫噴嘴41a、41b 實施塗佈處理從而可確保狹縫噴嘴41a、4仙之維護時間的 方法加以說明。但是，维螬I版 + 疋維邊不僅限定於基板處理裝置丨之動 作過程中所實施者，例如亦可為由於狹缝喷嘴之異常，分 解該狹縫噴嘴後洗淨或加以更換之維護（以下稱為「恢復維 護」）。恢復維護係需要較長時間之維護，通常需要藉由控 制器實：作業’故而於先前停止裝置動作且結束維護之時 刻’可#由控制器之指示從而再次啟動裝置運轉。本發明 之基板處理裝Μ於實行如此之恢復維護之情形時，亦可抑 98703.doc -30- 200533427 制間歇時間延長。 圖8以及圖9係表示依據如此原理所構成之第2實施形態 中基板處理裳置i之動作的流程圖。再者1 2實施形態中 基板處理裝置1之構成與第1實施形態之基板處理裝置1大 致相同，故而省略關於構成之說明。 首先田、纟α束未圖示之初期設定時，則判定狹縫喷嘴4 i a 疋否產生異常（步驟S31)，於產生異常之情形時，開始實施 狹縫喷嘴41a之恢復維護（步驟S41)。再者，藉由實行步驟 S31，狹縫噴嘴41a未發現異常之情形時之處理如後所述。 又/、$松測亦可根據經過處理之基板90之檢查結果或藉 由控制器所實施之操作等加以檢測，亦可藉由處理特定片 數從而定期性實施異常檢測。 另一方面，狹縫噴嘴41a未產生異常之情形時，搬入基板 90 ’監視該搬入作業之完成（步驟S32)。 本實施形態之基板處理裝置！當搬入基板9〇時，則結束狹 縫喷嘴41a之維護，開始實施藉由狹縫噴嘴41&所實行之塗 佈處理（步驟S33)。本實施形態之塗佈處理與第1實施形態 之塗佈處理相同故而省略說明。 藉由實行步驟S34，若可檢測出已完成藉由狹縫喷嘴4u 所實行之塗佈處理，則開始實施狹縫噴嘴4U之維護(步驟 S35)並且搬出基板9〇。 藉由實行步驟S36,若檢測出基板9〇之搬出完成，則判定 是否存在有需要進一步處理之基板90(步驟S37)，於存在有 需要處理之基板90之情形時，返回步驟丨繼續處理。另一 98703.doc 31 200533427 方面’未存在有需要處理之基板90之情形時結束處理。 即’第2實施形態之基板處理裝置1直至狹缝噴嘴41 a產生 需要恢復維護之異常為止（直至步驟S3 1中判定為Yes為 止）’藉由狹縫噴嘴41 a實施與先前裝置相同之處理。因此， 動作過程中’針對於狹縫噴嘴41a所實施之維護係主要於搬 出入基板90之時間内（實行步驟S36、s37、S31、S32之時間） 結束者。 於第2實施形態之基板處理裝置1之動作過程中，檢測出 狹縫喷嘴41&產生異常之情形時（步驟831中判定為心〇，如 上所述’實行步驟S41，開始實施狹缝喷嘴41a之恢復維護。 進而’搬入需要處理之基板9〇，並且監視基板9〇之搬入 作業之完成（步驟S42)。而且，若搬入基板9〇，則結束狹縫 喷鳴41b之維護，開始實施藉由狹縫噴嘴41b所實行之塗佈 處理（步驟S43)。 即’若第2實施形態之基板處理裝置1需要對於狹縫喷嘴 4 la實施恢復維護，則使用狹缝喷嘴411)繼續實行塗佈處 理。於先前裝置中，該情形時，有必要停止動作（生產線停 止）且實行恢復維護，該期間内處於完全無法處理基板9〇之 狀態。但是，本實施形態之基板處理裝置丨即使於如此情形 時，亦無需停止生產線，可抑制由於恢復維護所造成之間 歇時間的延長。 藉由實行步驟S44，若完成藉由狹缝喷嘴41b所實施之塗 佈處理，則基板處理I置1開始實施狹縫喷嘴41 b之維護（步 驟S45)並且搬出基板90。 98703.doc •32- 200533427 進而’藉由實行步驟〜 •w S46 ’若檢測出基板90之搬出之完 成，則判定是否結東飪掷μ # 、十對於狹縫噴嘴41 a之恢復維護（步驟 S47) ’於結束恢復維譜 之U形時，返回圖8之步驟S37從而 繼續處理。 於未結束對於狹縫喷喈 — $為41a所貫施之恢復維護之情形 時’判定是否存在有需尊一 要進一步處理之基板9〇(步驟S48)， 於存在有需要處理之基柘 板90之h形時，返回步驟S42從而繼 績處理。另一方面，於 、子在有需要處理之基板9 0之情形 時結束處理。 如上所述，第2實施形態之基板處理裝置！與第旧施形態 之基板處理裝置1-樣，可抑制由於維護所造成之間歇時間 之延長。 再者’恢復維護中不僅限定於如「異常」般無法預測之 情形時所需之維護。例如，介γ A， 例如亦可包含如光阻劑液之更換處 理等可預測將會實行之維護。 <3·第3實施形態> 於第1實施形態中，僅以初期設定中需要較長時間之内部 洗淨處理為例加以說明。但是，藉由適宜地設定維護條件， 基板處理裝置1亦可如下構成·門私每 傅战·開始實施塗佈處理後，繼續 塗佈處理並且可實行内部洗淨處理。 ’ 圖10以及圖11係表示第3實施形態之基板處理裝置i之動 作的流程圖。再者，本實施形態之基板處理裝置丨之構成與 第1實施形態之基板處理裝置丨大致相同故而省略說明。 首先，以與第1實施形態之步驟81〇、§11相同之方 — 98703.doc -33- 200533427 施初期設定（步驟S 5 1 )以及確認基板9 〇之搬入完成（步驟 S52)。 若搬入基板9 0，則控制部6判定是否結束針對於狹縫噴嘴 4 1 a所貫行之維護（步驟S 5 3 )，於針對於狹缝喷嘴4 1 a實行維 護之情形時，進而判定是否結束針對於狹縫噴嘴41b所實施 之維護（步驟S54)。即，本實施形態之基板處理裝置i直至 均可使用狹縫喷嘴41 a以及狹縫噴嘴41 b為止，重複步驟 S5 3、S54並且塗佈處理處於待機狀態。 於可使用狹缝喷嘴41a之情形時（步驟s53中判定為Yes)， 開始實施藉由狹縫喷嘴41a所實行之塗佈處理（步驟S55)，於 可使用狹縫喷嘴41b之情形時（步驟S54中判定為Yes)，開始 實施藉由狹縫噴嘴41b所實行之塗佈處理（步驟S56)。以如 此之方式，以下將於狹缝噴嘴41a以及狹縫噴嘴41b中的作 為可對於基板90實施塗佈處理之狹縫噴嘴而得以選擇者稱 為「對象狹縫喷嘴」。再者，藉由對象狹縫喷嘴所實施之塗 佈處理與第丨實施形態中所說明之塗佈處理相同故而省略 說明。 若控制部6完成藉由對象狹縫噴嘴所實施之塗佈處理（步 驟S61中判定為Yes)，則會增加對象狹縫嘴嘴之使用次數。 所謂使用次數’其係指自上:欠内部洗淨處理開始連續使用 該對象狹射嘴實行塗佈處理之次數1此，於以後之處 理中，控制部6可獲知已連續使用多少次狹縫喷嘴4^4化 實行塗佈處理。 其次，控制部6開始實施維護處理（步驟S62)並且監視基 98703.doc -34- 200533427 板9 0之搬出元成（步驟§ 6 3 )。即，本實施形態之基板處理襄 置1藉由步驟S62開始實施維護處理，但未等到維護處理結 束，即可繼續實行塗佈處理。 圖12係表示第3實施形態之維護處理之動作的流程圖。於 維護處理中，首先可實行狹縫喷嘴檢查（步驟S71)。所謂狹 縫育嘴彳欢查’其係指特定用以實行維護處理之狹縫噴嘴的 處理，於本實施形態中可選擇之前不久剛實施過塗佈處理 之狹縫喷嘴（對象狹縫噴嘴）。 若已決定對象狹縫喷嘴，則控制部6參照經過計數之該對 象狹縫噴嘴之使用次數，從而判定是否已使用特定次數（步 驟S72)。成為此時判定基準之特定次數係藉由控制器作為 維護條件預先加以輸入設定。控制部6藉由參照作為特定次 數儲存於儲存部61内之該設定値，從而實行步驟S72之判 定。 於已使用特定次數之情形時，控制部6控制線性馬達5〇、 51 ’使對象狹縫噴嘴移動至預塗佈機構86a(或者預塗佈機 構86b)之上方（步驟S73)。而且，若完成對象狹缝喷嘴之移 動，則實行内部洗淨處理（步驟S74)。再者，步驟S74之内 部洗）尹處理係與第丨實施形態之步驟81〇2至sl〇吖圖7)大致 相同之處理故而省略說明。 另方面’於還未使用有特定次數之情形時，由於省略 内部洗淨處理故而跳過步驟S73、S74。 其次，控制部6控制線性馬達5〇、51，使對象狹縫喷嘴移 動至待機i85a(或者待機盒85b)之上方（步驟§75)。而且， 98703.doc -35- 200533427 右元成對象狹縫噴嘴之移動，則實行外部洗淨處理（步驟 S76)。再者’步驟S76之外部洗淨處理係與第1實施形態之 步私S106至Sl〇9(圖7)大致相同之處理故而省略說明。 以如此之方式，控制部6對於以連續特定次數實行塗佈處 理之狹縫贺嘴41a、41b，於該塗佈處理結束後連續實行内 邻洗淨處理（步驟S74)與外部洗淨處理（步驟。另一方 面對於連績使用次數還未達到特定次數之狹縫喷嘴41a、 41b於塗佈處理後僅實施外部洗淨處理（步驟以如 此之方式，於本實施形態之基板處理裝置丨中，控制部石根 康維又條彳ϋ由適宜地實行必要之維護，從而可確保狹 縫喷嘴41 a、41b之正常狀態。 、、Ό 部洗淨處理，則控制部6控制升降機構43a 4山4a(^者升降機構43b、桃），下降對象狹缝噴嘴從而使 端（M又入待機益85a(或者待機盒㈣）内。π，使對象狹缝 為私動至待機位置（步驟S77)。 以上述之方式結束維護處理。如上所述，維護處理係 f 6期11)開始實施，但未㈣維護處理結束即可 2仃塗佈處理。因此，即使未結束維護處理，亦可當 成搬出基板9。時’判定是否存在有需要進一步處理之基 ，驟S64)’於存在有還未施以塗佈處理之基 守，返回步驟S52(圖10)重複處理。 =，作為維護處理對象之狹縫嘴嘴…，無法實 主佈處理，故而於藉由+ 处束牛％ S77 . 乂. 特定為對象狹縫喷嘴後直 細7之處理為止之期間，該對象狹縫喷嘴之狀態 98703.doc -36- 200533427 直處於「維護中I。批 夫昭W,…：lJwM於步驟S53、S5· 10)中，藉由 “…決定下-步可實施塗佈處理之狹缝噴嘴 41a、41b。 个八又貝角 方式本實施形態之基板處理裝置1具備複數個 41a、41b’若可使用其卡任-者(步驟S53、S54中 任一者判定為Yes)則可訾 + 則了貝仃塗佈處理。因此，一方之狹縫 贺鳴中貫施如内部淡、、容考 — ，尹處理叙萬要較長時間之維護時，可 藉由他方之狹縫喷嘴繼續實 爲貝订主佈處理，從而可提高基板 90之處理效率。 再者’於本實施形態之基板處理裝置”，亦存有對於狹 縫喷嘴仏、41b可並行實施輯處理之狀態，於該情形時， 直至結束任一狹縫噴嘴之维讀考 、、择邊處理為止，重複步驟S53、S54 之處理並且塗佈處理處於待機狀態。 基板處理裝置1於步驟S64中，若可剌宁去六士 > T 右j判疋未存在有需要進 -步處理之基板90,料待結束維護處理從而結束處理。 如上所述，本實施形態中之基板處理裝置i亦可獲得與上 述實施形態相同之效果。 再者’如本實施形態所示’若自塗佈處理開始時交替使 用狹縫噴嘴41a、41b ’則幾乎可同時達到特定次數，需要 幾乎同時實施内部洗淨處理（步驟S74)。此情形時，於較長 時間内兩方狹缝喷嘴4U、41b均無法使用。因此，亦可例 如僅藉由狹缝喷嘴41a實施最初固定片數份之塗佈處理，而 後再開始實施交替運用。 <4·第4實施形態> 98703.doc -37- 200533427 基板處理裝晋^ H @ m ^ r 才罝1具備早獨的光阻劑 而可供給不同之井阻句、广… ^…路73a、73 b ’故 』之先阻劑液從而可交替實施不同 理，s亥情形已經於上 ’、处 田、—私從 貝^ I恶中加以說明。但是，使 用稷數種光阻劑液之情形時 劑液所需H 確保更換光阻 nJ:°兄月本貝她形恶之原理，於僅藉由狹縫喷嘴412 之劑液績實行之塗佈處理㈣，供給至狹縫喷 wlb之光阻劑液更換為光阻劑B。藉此，可確保更換為 光阻劑液B所需之維護時間。 … 若結束更換為光阻劑㈣之處理，則藉由狹縫嘴嘴仏與 狹縫贺嘴41b交替實施塗佈處理。藉此’可確保各狹縫喷嘴 41a、41b之外部洗淨處理所需之維護時間。 進而’若結束用U塗佈光阻劑液八之塗佈處理，則僅藉由 ^縫噴嘴做繼續實施塗佈處理，將光阻劑液从換為綠 d液C。藉此，可確保更換為光阻劑液c所需之維護時間。 以如此之方式，若藉由製造計劃等預先明確以何種光阻 劑液分別處理多少片基板90，則將其設定為維護條件，藉 此可有效地加以運用。 <5.第5實施形態> 至於為去除附著於狹缝喷嘴4la、41b上之光阻劑液所實 施之維護，於上述實施形態中，主要就外部洗淨處理加以 說明，但至於用以去除光阻劑液之方法，並非僅限定於此。 圖13係表示依據如此原理所構成之第5實施形態中基板 處理波置1之去除機構75的示意圖。再者，於圖13中，僅圖 98703.doc -38- 200533427 示有一個去除機構75，但本實施形態之基板處理裝置1具備 兩個去除機構75，分別配置於待機盒85a、85b之上方。 去除機構75具備基座750、一對收集構件751、進給螺母 部752、滾珠螺桿753以及未圖示之旋轉馬達。 基座750為板狀構件，於（+ z)側面上於γ軸方向上排列固 定有一對收集構件751。收集構件751為板狀樹脂製構件， 如圖13所示，分別於其上部形成有切口部75U。該切口部 75 la形成為可迎合狹縫喷嘴4U、4邝之前端部之形狀。再 者，收集構件75 1之個數或形狀不僅限於圖13中所示者。 於基座750之（一Z)側面上固定有進給螺母部752。於大致 箱狀構件之進給螺母部752中形成有於γ軸方向上貫通之螺 釘孔，於該螺釘孔中旋入有滾珠螺桿753。 ” 順沿Y轴配置有滾珠螺桿753，其¥軸方向長度大於等於 狹縫喷嘴仏、411^軸方向長度。又，於滾珠螺桿75p 端安褒有旋轉馬達，藉由驅動旋轉馬達，滾珠螺桿753 致平行於Y軸之轴為中心旋轉。 . 一 、 疋褥再者，基座750為迎合省略 ST之引導構件’設定為不會由於旋轉滾珠螺桿753而旋 因此’讀由旋轉馬達旋轉滾珠螺桿w，則進給螺 部752與基座750以及一對收隹禮 ° 對收木構件751—同於γ軸方向 動。又，旋轉馬達藉由來自控制部 旋轉方向以及旋轉速度。 之而可調節其 根據如上構成之去除機禮 4la、41h 1 說明去除附著於狹縫嗔嘴 41 a 4 1 b上之光阻劑液 貝角 是，(下稱為「去除處理」）。作 疋處理狹縫噴嘴41a、41b彳古、^ ^仁 法成乎相同，故而此處僅 98703.doc -39- 200533427 關於狹縫喷嘴41 a加以說明。 於本貫施形怨之基板處理裝置丨中，於針對於狹缝噴嘴 4 1 a貫^之外部洗淨處理（與圖7所示之步驟§丨〇6至s丨〇9相 同之處理）後繼績實施去除處理。 首先，控制部6控制線性馬達5〇、51以及升降機構43&、 44a，使已經結束外部洗淨處理之狹縫喷嘴4U移動至去除 機構75之上方。進而，藉由升降機構43&、44&從而使狹縫 喷嘴41a下降若干高度，以迎合收集構件751之切口部751a 之方式擠壓狹縫噴嘴41 a之前端部。 於該狀態下，控制部6驅動旋轉馬達從而使滾珠螺桿753 旋轉。藉此，收集構件751抵接於狹縫噴嘴41a之前端部， 於該狀態下收集構件751於¥軸方向上移動。因此，附著於 狹縫噴嘴4la上之附著物藉由收集構件751得以收集且加以 去除。 再者於本貫施形態之基板處理裝置1中，至於收集構件 751之材料，可採用樹脂，但只要係與形成狹縫喷嘴41a、 41b之材料相比更加柔軟者，則亦可使用任何一種材料。 又，收集構件751亦可介以可使收集構件751於（+z)方向上 施力之構件（例如彈簧或橡膠等），安裝於基座750上。 控制部6重複掃描直至達到設定為維護條件之次數後結 束去除處理。 如上所述，維護機構即使與去除機構75_樣，係用以收 集且去除光阻劑液之機構，亦可獲得與上述實施形態相同 98703.doc -40- 200533427 再者，取代收集構件75 1，亦可使用佈製擦拭構件實現去 除處理。該情形時，亦可如下構成：藉由捲曲滾筒狀之擦 拭構件從而可擦拭所附著之光阻劑液。 <6.變形例> 以上，關於本發明之實施形態加以說明，但本發明不僅 限定於上述實施形態，亦可作出各種變形。 例如，於狹縫喷嘴41a、41b任一方中，直至需要實施維 護為止，以與第丨實施形態之基板處理裝置1相同之方式， 藉由狹縫喷嘴41a、41b交替實施塗佈處理；並且於必須實 施維護之情形時，亦可以與第2實施形態之基板處理裝置1 相同之方式，構成為使用無需實施維護一方之狹縫噴嘴實 行處理。 又，洗淨液吐出機構83a、83b以及預塗佈機構86&、86b 亦可分別僅為一個。圖14係表示依據如此原理所構成之基 板處理裝置1之本體部2a側剖面與光阻劑液塗佈動作相關 之主要構成要素的示意圖。圖14中所示之本體部2a未設定 為相當於上述實施形態中基板處理裝置i之洗淨液吐出機 構83b以及預塗佈機構86b之構成。即使為如此之構成，例 如亦可實施與第2實施形態之基板處理裝置1相同之動作。 即，通常藉由狹縫喷嘴41 a實行塗佈處理，於對於狹縫噴嘴 41心必須實施分解維護等恢復維護之情形時，狹縫喷嘴 大巾曰度退避後，可藉由狹縫喷嘴4 1 b實行塗佈處理。此時， 針對於狹縫喷嘴4lb於動作過程中所實施之維護係於開口 32a内貫仃。即，於待機盒85a之上方，於狹縫喷嘴4比處於 98703.doc -41 - 200533427 待機之狀態下，洗淨液吐出機構83a吐出洗淨液，藉此洗淨 狹縫噴嘴41b ;並且於狹縫喷嘴41b實行預備塗佈處理之情 形時，可使用預塗佈機構86a。藉由如此構成，亦可獲得^ 如與第2實施形態之基板處理裝置丨相同之效果。 又複數個狹縫喷嘴41a、41b亦可相互具有不同之長产 方向（Y軸方向）寬度。該情形時，基板處理裝置i可對應於 不同寬度之基板。 【圖式簡單說明】 圖1係表示本發明之基板處理裝置之概略的立體圖。 圖2係表示基板處理裝置之本體之側剖面，並且表示光阻 劑液塗佈動作相關之主要構成要素的示意圖。 圖3係表示基板處理裝置中光阻劑液以及洗淨液之供給 路徑的示意圖。 圖4係用以詳細說明狹縫喷嘴之光阻劑液供給路的說明 圖。 圖5係表示第1實施形態中基板處理裝置之動作的流程 圖。 圖6係表示第1實施形態中基板處理裝置之動作的流程 圖。 圖7係表示第丨實施形態中初始化維護之動作的流程圖。 圖8係表示第2實施形態中基板處理裝置之動作的流程 圖。 圖9係表示第2實施形態中基板處理裝置之動作的流程 圖0 98703.doc -42- 200533427 圖1 〇係表示第3實施形態中基板處理裝置之動作的S|L粒 圖 圖11係表示第3實施形態中基板處理裝置之動作的流程 圖 圖12係表示第3實施形態中維護處理之動作的流程圖。 圖13係表示第5實施形態中基板處理裝置之去除機構的 示意圖。 圖14係表示變形例中基板處理裝置之本體部之側剖 久 光阻劑液塗佈動作相關之主要構成要素的示意圖。 〃 【主要元件符號說明】 1 基板處理裝置 2，2a 本體部 3 平臺 30 保持面 41a，41b 狹縫噴嘴 42a，42b 間隙感測器 43a，43b，44a，44b 升降機構 4a，4b 架橋構造 50, 51 線性馬達 6 控制部 61 儲存部 62 操作部（獲取機構） 6 供給機構 73a，73b 光阻劑液供給路 98703.doc -43 - 200533427 74a 脫氣機構 75 去除機構 8 洗淨機構 80 洗淨液容器 84a，84b 洗淨液供給路 85a，85b 待機盒 90, 91 基板 98703.doc - 44 -200533427 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a technology that can clean the slit nozzle without stopping the processing of the substrate, thereby reducing the intermittent time. [Prior art] As a device used in a substrate manufacturing step, a slit coating machine (substrate processing device) is well known, which discharges a processing solution such as a photoresist liquid onto a substrate surface from a slit nozzle, thereby Coated with photoresist solution. Since the introduction of sodium, in view of the industry's request to improve the productivity in substrate manufacturing steps, it has been desired to reduce the intermittent time of substrate processing. For example, Patent Document 1 discloses such a slit coater. In the device disclosed in Patent Literature, a technique is proposed which reduces the intermittent time by processing a plurality of substrates simultaneously with a plurality of slit nozzles. [Patent Document 1] Japanese Patent Laid-Open No. 10-216599 [Problems to be Solved by the Invention] = On the one hand, in order to improve the coating processing accuracy in the slit coater, it is more feminine for the substrate to implement- The cloth reading process is used to maintain the front of the slit nozzle. However, for example, when / 'the slit coating machine is in the middle of :, during the maintenance of the slit nozzle, the slit nozzle can not be implemented due to the use of the slit nozzle. . Therefore, during the processing period of the substrate carrying out person, there is a problem with the intermittent time of substrate processing 疋 especially the problem of removing the stagnation inside the slit nozzle. There is a problem of removing air treatment in the long room, so it is difficult to complete the board removal, in and out processing, etc. 98703.doc 200533427. In the device A disclosed in Patent Document 1, when a plurality of narrow cores are in a standby state, it is impossible to solve the problem that the intermittent time is extended due to the maintenance.啧: Production text: In the slit coater disclosed in 1, for example-square slit ", hanging, it is necessary to carry out large-scale maintenance on the slit nozzle%, it will also cause that all narrow coating must be stopped The problem of cloth machine. That is, if the number of slit nozzles is increased, maintenance opportunities will also be increased. Therefore, the advancement of the slit nozzles shown in Patent Document 1_ will cause a problem of prolonged intermittent time due to maintenance. The present invention is based on the above-mentioned question rhyme-the above question is asked, and the purpose is to prevent the increase of the intermittent time caused by edge maintenance. [Summary of the Invention] In order to solve the above-mentioned problems, the inventor of the applicant _ seed-based processing device, "is specially designed to apply a specific processing solution on the substrate coating area, and has" Siqianzhuo to maintain a substrate; plural The slit nozzles are directed toward almost the entire area of the substrate coating area held by the holding mechanism, and the specific ejection solution is ejected by a linear ejection port. The supply mechanism supplies the specific ejection solution to a plurality of slit nozzles. ; A lifting mechanism, which separately lifts the plurality of slit nozzles; a moving mechanism, which separately makes the substrates holding the money structure and the plurality of pill slit nozzles along the surface of the substrate separately Relative movement; and a maintenance mechanism that performs specific maintenance on the plurality of slit nozzles. 98703.doc 200533427 In addition, the invention of claim 2 is issued according to claim 1, which is characterized in that the above-mentioned maintenance mechanism is a "slitting device, and the substrate is a slit nozzle for discharging. The cleaning solution for the M cleaning liquid does not request the substrate processing device of the invention of the second = Item 3, which is claimed in the second item, and the above: The cleaning mechanism has a separate cleaning liquid supply path for the plurality of slit nozzles. . The invention of claim 4 is claim 1 which is characterized by the above-mentioned maintenance mechanism and further: the substrate processing device of Ming, which has a degassing mechanism, and the degassing device, and the slit on which the substrate is discharged. The nozzle is degassed. The invention of claim 5 is the substrate processing apparatus of the invention of the claim. The eighth feature is that the supply mechanism has separate processing liquid supply paths for the plurality of slit nozzles. The invention of claim 1 is the substrate processing apparatus of the invention of the claimants, "wherein it further includes an acquisition mechanism and its acquisition and maintenance conditions; a storage mechanism that stores the maintenance conditions acquired by the acquisition mechanism; and control The mechanism 'controls the maintenance mechanism based on the maintenance conditions stored in the storage mechanism. The invention of claim 7 is a substrate processing apparatus of the invention of claim 1, further comprising a measurement mechanism for the plurality of the above-mentioned plurality. The interval between each slit of the slit nozzle and the substrate held by the upper holding mechanism. 'The lifting mechanism raises and lowers the plurality of slit nozzles based on the measurement result of the measuring mechanism. The invention of claim 8 is the request item 1 The substrate processing apparatus of the invention is characterized in that the above-mentioned moving mechanism is a linear motor. 98703.doc 200533427 The invention of claim 9 is the substrate processing apparatus of the invention of claim 丨, characterized in that the plurality of slit nozzles are described above. The widths in the length direction are different from each other. [Effects of the invention] In the inventions of claim 1 to claim 9, By having a plurality of slit nozzles and a maintenance mechanism, the substrate processing can be continued and other slit nozzles can be fully maintained. The plurality of slit nozzles are directed to almost all areas of the substrate coating area held by the holding mechanism. The specific processing liquid is discharged from the linear discharge port, and the maintenance mechanism performs specific maintenance on the plurality of slit nozzles. In the invention of claim 2, the maintenance mechanism can continue to perform processing on the substrate by having a cleaning mechanism. And the other slit nozzles can be sufficiently cleaned, and the above-mentioned cleaning mechanism cleans the slit nozzles that are not in a state of performing the ejection processing to the substrate by using a specific cleaning liquid. + As in the invention of claim 3, the cleaning The cleaning mechanism is provided with a separate cleaning liquid supply path ′ for each of the plurality of slit nozzles, so that a cleaning liquid suitable for each of the slit nozzles can be supplied. As in the invention of claim 4, the maintenance mechanism is further provided with The degassing mechanism can thus handle the substrate and fully degas the other slit nozzles. The above-mentioned degassing mechanism is not in the The slit nozzle in a state where the plate is discharged is subjected to degassing treatment. ~ + = In the invention of claim 5, the supply mechanism may be provided with a separate processing liquid supply path for each of the plurality of slit nozzles. Supply the processing liquid suitable for each slit nozzle. 98703.doc 200533427 The control mechanism with the supporting mechanism is stored in the storage mechanism, so it can be controlled efficiently as the maintenance conditions in the invention of claim 6 Dimensional maintenance is necessary. ^ In the invention of Baye 7, there is also a damage measurement mechanism, the above-mentioned plural ㈣㈣ and the security _ _ 隔 are separated; the lifting mechanism is measured by the measuring mechanism :::: 板: 间 的 间The slit nozzles are used to make multiple slits; and the two substrates are lifted and lowered. The crying nozzles are linear motors with a moving mechanism corresponding to any thickness, so that it can be used as in the invention of claim 8 Prevent increased footprint. A plurality of slit nozzles are included in the length so that they can correspond to substrates of different widths. For example, in the invention of item 9 above, the upward widths are different from each other. [Embodiment] The detailed description is given below with reference to the preferred embodiments of the present invention. <: 1. First Embodiment > Fig. 1 is a schematic perspective view showing a substrate processing apparatus of the present invention. Fig. 2 is a schematic side view of the main body 2 of the substrate processing apparatus and shows the main constituent elements related to the application of the photoresist solution. In addition, in FIG. 1, for convenience of illustration and explanation, the two-axis direction is defined as the vertical direction, and the XY plane is expressed as the horizontal plane. These are simply defined for the convenience of grasping the positional relationship, and are not limited to the directions described below. The same applies to the following drawings. < Overall Structure > 98703.doc • 10 · 200533427 The processing device 1 is roughly divided into a main body 2 and a control unit. In the substrate processing device 1, a square glass substrate for manufacturing an image panel for a liquid crystal display is set as a substrate. The processing substrate (the following screen ^ Θ ^ is the substrate ") 90 is formed in the process of selectively engraving ^^,, and the polar layer formed on the surface of the substrate 90, and is configured to coat the substrate with a photoresist solution A coating treatment device as a treatment liquid. Therefore, in this embodiment, the slit nozzles 仏 and 用以 are used to discharge the photoresist solution. Moreover, the substrate processing device 丨 is not only a glass substrate for a liquid crystal display device, but also can be transformed into a device that applies a processing liquid (medicine liquid) to various substrates for flat panel displays and uses it. The main body 2 is provided with a platform 3, which can function as a holding port for holding the holding substrate 90, and can also function as a base for each of the attached organizations. The platform 3 has a rectangular parallelepiped shape and is made of, for example, a full-body stone product, and the upper surface (holding surface 30) and the side surfaces thereof are processed into flat surfaces. The flat surface is set to a horizontal plane, and thus becomes a holding surface 30 of the substrate 90. A plurality of vacuum suction ports (not shown) are formed on the holding surface 30 in a distributed manner. During the processing of the substrate 90 by the substrate processing apparatus 1, the substrate 90 is held at a specific horizontal position by sucking the substrate 90. In addition, a plurality of ejector jacks which can be moved up and down freely on the holding surface 30 by a driving mechanism (not shown) are provided at appropriate intervals. The ejector pin LP is used to press and lift the substrate 90 and the like when the substrate 90 is taken out. & Both ends of the holding area of the substrate 90 (the area holding the substrate 90) are held on the holding surface 30, and a pair of travel guides 31 extending parallel to the water approximately squarely are fixedly provided. The travelling road 31 constitutes a support block which is fixed at both ends of the bridge structure 4a and 4b and is not shown, and guides the movement of the bridge structure 乜, 讣 98703.doc 200533427 (the movement direction is specified as a specific direction) The bridge is structured and supported on a linear guide above the holding surface 30. A bridging structure 4a is provided above the platform 3, and it is erected from both sides of the platform 3 to be substantially horizontal. The bridge structure 4a mainly includes a nozzle supporting part technique, which uses, for example, carbon fiber reinforced resin as a bone material, and lifting mechanisms 43a, ... to support both ends of the bridge structure 4a. In addition, the structure of the bridge structure and the structure of the bridge structure are the same, so the relevant description is appropriately omitted. A slit nozzle is installed on the mouth support portion 40a ... and a slit nozzle having a length direction in the γ-axis direction in the gap sensor 2a in FIG. 1-connected to the supply mechanism 7 (photoresist pump 72a), The supply mechanism 7 is used to supply the photoresist liquid to the slit nozzle 41a. The slit nozzle 仏 scans the surface of the substrate 90 and discharges the photoresist liquid supplied by the supply mechanism 7 to a specific area on the surface of the substrate 90 (hereinafter referred to as “photoresist coating area” °). . By this' slit nozzle 41a, a photoresist liquid is applied onto the substrate 90. Here, the so-called photoresist coating area refers to the area on the surface of the substrate 90 where the photoresist solution is to be applied, and generally refers to the area of the substrate: 0 minus the area with a specific width along the end edge. The area S of the area and the detailed description of the supply mechanism 7 will be described later. The gap sensors 42a and 42b are respectively located near the slit nozzles 41a and 41b. The women's clothing is placed on the 4ga and the support of the nozzle, and the height difference (gap) between the existing objects (such as the substrate surface and the photoresist film surface) is measured. The measurement result is transmitted to the control unit 6. That is, the gap sensor 42a measures the gap between the slit nozzle 41a and the lower door, and the gap sensor 42b measures the gap between the slit nozzle 4 1b and the object 98703.doc 200533427 below. In this way, the substrate processing apparatus 1 separately measures the substrate 90 held on the platform 3 and each of the plurality of slit nozzles 41a and 41b of the lifting mechanisms 43a and 44a separately disposed on both sides of the nozzle support portion 40a. The nozzle support portion 40a is connected to the slit nozzle 41a. The lifting mechanisms 43 & 44a mainly include AC servo motors 430a, 440a and ball screws (not shown), and generate a driving force for lifting and lowering the bridge structure 4a according to a control signal from the control section 6. Thereby, the lifter mechanisms 43a and 44a can raise and lower the slit nozzle 41a in parallel. In addition, the lifting mechanisms 43a and 44a are used to adjust the pattern of the slit nozzle 4U in the? Ζ plane. Furthermore, the AC servo motors 430b and 440b of the elevating mechanisms 43b and 44b can also perform the same operation separately from the slit nozzle 41b and the slit nozzle 41 &. The edges on both sides of the plate processing device 1 / 口 卞 堂 j are called δ and β⑵ 疋 (stator) 500 and 510, respectively. Mobile bridges 501a and 511a are provided at both ends of the bridge structure, and movers 511b are provided at both ends of the bridge structure. The fixed element 500 and the moving element 50u constitute a coreless linear system (hereinafter referred to simply as "linear motor"). 50, the fixed element 5o and the moving element 50a, 501b constitute a linear motor 51. That is, the linear motors 50 and 51 are respectively prepared-to-shifted 50la, 5Glb, and 5Ua, and training, so that the dental movers move in the X-axis direction alone. In this way, the substrate processing apparatus in this embodiment 形态 The linear motors 50 and 51 are used to make the bridge material 4am: structure: but the universal fixture-. Therefore, compared with the case of moving the bridge = 98703.doc -13- 200533427 4a, 4b alone, the general moving mechanism with ::: ㈣ motor and ball screw can reduce the occupied area. Further, a line including a scale portion and a detector, and a flat code state 52a (not shown) and 53a are fixed to both ends of the bridge structure 4a. The linear encoder 52 & is used to detect the position of the mover 501a of the linear motor 50, and the linear encoder 53a is used to detect the position of the mover 511a of the linear motor 51. In the same way, linear encoders 52b and 53b are fixed at the two ends of the bridge structure 4b. The linear encoder 52b is used to check the position of the 50m of the mover of the linear motor 50. The linear encoder 53b is used to detect the linearity. Position of the mover 511b of the motor 51. Each of the linear encoders 52a, 52b, 53a, and 53b outputs the detected position information to the control unit 6. In this manner, each of the linear encoders 52a, 52b, 53a, and 53b is used to detect the position of each of the mobile units 50a, 501b, 511a, and 51 lb, and based on the detection results, the control section 6 controls the linear motors 5 respectively. And 51, whereby the substrate processing apparatus 1 can separately move the bridge structure 4a and the slave. Therefore, the state of one slit nozzle (for example, slit nozzle 41a) is not affected, and the other slit nozzle (for example, slit nozzle 41b) can be moved. On the holding surface 30 of the main body 2, openings 32a and 32b are provided on both sides in the X-axis direction of the holding area. The openings 32a, 32b and the slit nozzles 41a, 41b have a length direction in the Y-axis direction, and the length of the length direction is substantially the same as the length of the slit nozzles 41a, 41b. In addition, the following illustration is omitted in FIG. 1: a cleaning liquid discharge mechanism 8 3 a, a standby box 8 5 a, and a pre-coating mechanism 8 6 a are provided inside the body 2 below the opening 32a, and the opening 3 2 The inside of the main body 2 below b is provided with a cleaning liquid discharge mechanism 83b, a standby box 85b, and a pre-coating mechanism 86b. FIG. 3 is a diagram showing the supply mechanism 7 and the cleaning mechanism 8. Supply the photoresist to the slit nozzle 98703.doc 14 200533427 4 1 a, 4 1 b Pan Xiji μ (,,, 'β mechanism 7 as shown in FIG. 3, which mainly contains a photoresist container 70' as a photoresist Pipes of the liquid flow path and photoresist pumps 72a and 72b. The photoresist pump 70a is used to connect the pipe 7U of the slit nozzle and the photoresist solution to the light in the pipe 71a through the photoresist pump 72a. The resist pump 72_ becomes a liniment liquid supply path 73a for the slit nozzle. In the same manner, 'the photoresist pump 70 is connected from the resist container 70 to the pipe 71b of the slit nozzle 41b and the The photoresist pump 72b conveyed by the photoresist solution to the pipe Kawachi constitutes the photoresist solution supply path 73 for the slit nozzle Kawa. That is, the supply mechanism 7 is directed to each of the slit nozzles 41 and 41, respectively. Separate photoresist liquid supply channels 73a and 73b are provided. The cleaning mechanism 8 for cleaning the slit nozzles 41a and 41b mainly includes a washing liquid container 80 as a piping 81 of the cleaning liquid flow path. , 8ib, the pump 8 洗, and the cleaning liquid discharge mechanism 83a, 83b. The self-cleaning liquid container 80 is connected to the pipe 81a of the cleaning liquid discharge mechanism 83a through the pump "a", and The cleaning liquid is sent to the pump 82a in the piping 81a and the cleaning liquid discharge mechanism 83a that discharges the cleaning liquid to the slit nozzle 41a constitutes a cleaning liquid supply path 84 & for the slit nozzle 41a. The cleaning solution is connected to the pipe 81b of the cleaning solution discharge mechanism 83b via the pump 82b, and the cleaning solution is sent to the pump 8 沘 in the pipe 81b and the cleaning solution is discharged to the slit nozzle 41b. The mechanism 83b constitutes a cleaning liquid supply path 84b for the slit nozzle 41b. That is, the cleaning mechanism 8 includes separate cleaning liquid supply paths 84a and 84b for each of the plurality of slit nozzles 41a and 41b. The ejection mechanisms 83a and 83b are mechanisms for ejecting the cleaning liquid supplied from the cleaning liquid container 80 to the slit nozzle 41a and the ends before the buckets. 98703.doc -15- 200533427 Although not shown,伯 w Supply unit… [The outlet mechanisms 83a, 83b can be self-gas ..., 0 g rolled body (nitrogen) and directed to the slit nozzle 41a = coffee—with a movement mechanism not shown, can :, = = slit nozzle —Front end, and the washing liquid can be dried by blowing out nitrogen « < In this way, the pure processing device uses the cleaning mechanism 8 to wash: the slit nozzles 41a and 41b of the plurality of slit nozzles 41a and 41b are not in a state where the substrate 90 is in a state of being ejected. Thereby, cleaning process protection can be performed), and processing of the substrate 90 can be continued. Therefore, it is possible to suppress the prolongation of the intermittent time 'and to sufficiently secure the maintenance time. Furthermore, in the substrate processing apparatus of this embodiment, when the same cleaning liquid is used for the slit nozzles 41a and 41b, the cleaning liquid supply channels 84a and 84b can be used up to the pumps 82a and 8b. Its path. In this case, it is possible to configure as follows: By opening and closing the valve, the piping from the pump to the cleaning liquid discharge mechanism 83a, 83b is opened and closed, so that only the cleaning liquid discharge mechanism 83a, 83 for performing the cleaning process is opened. b Supply the cleaning solution. FIG. 4 is an explanatory diagram for describing in detail the photoresist liquid supply path 7 3 & of the slit nozzle 4a. A three-way valve 71 and a valve 711 are attached to the piping 71a. The same structure is provided on the slit nozzle 41b side. In addition, in FIG. 4, a solenoid valve is omitted, in which the three-way valve 7 丨 0, the valve 7 丨, and the wide door 741 are connected to the control unit 6, and an opening and closing operation is performed by the control of the control unit 6. The two-way valve 7 10 is installed at the position where the pipe 8 1 a is connected to the pipe 71 a, and the upstream side of the pipe 71 a or the pipe 8 1 a can be selectively connected to the slit nozzle 98703.doc -16- 200533427 4 la ( Downstream side of piping 71a). Specifically, when the photoresist liquid is supplied to the slit nozzle 41 &, the upstream side of the pipe 71a is opened and the pipe 81a is closed. Thereby, the photoresist liquid conveyed from the photoresist pump 72a is supplied to the slit nozzle 41a. On the other hand, when the cleaning liquid is supplied to the slit nozzle 41a, the piping 71 & upstream side is closed and the piping 81a is opened. Thereby, the cleaning liquid conveyed from the pump 82 & is supplied to the slit nozzle 41a. A deaeration mechanism 74a is attached to the slit nozzle 41a. The deaeration mechanism 7 牦 includes a deaeration pipe 740 and a valve 741. The degassing pipe 74 is connected to a recovery mechanism (not shown), and is opened and closed by a valve 74. Furthermore, in the substrate processing apparatus of this embodiment, the photoresist liquid and the cleaning liquid are supplied from the left and right sides of the slit nozzle 41a ', and may be supplied from, for example, a certain portion of the central portion. The standby boxes 85a and 85b are designed so that the leading ends of the slit nozzles 4u and 4ib during standby are not dried. During the period when the coating process has not been performed for a long time, the slit nozzles 41a and 41b are mainly located on the standby boxes 85a and 85b. Stand above 85b. The pre-coating mechanisms 86a and 86b are attached to the slit nozzles 41a and 41b. The coating mechanism 86a and 86b are provided with a distribution roller 'slot nozzle 4m and amp. For 4 7 blades, roll and discharge the photoresist solution and perform preliminary coating. As a result, the accuracy of the coating process of the substrate processing apparatus 1 can be improved. Returning to FIG. 1, the control unit 6 internally includes a calculation unit 60 that processes various data according to a program, and a > > —, in front of the control unit 6, an operation unit 62 for inputting necessary instructions, • 夂A storage unit 61 for storing a hard disk or various data. 98703.doc 200533427 display unit 63 is used to make the controller display the substrate processing device j and display various data. The control unit 6 is electrically connected to each mechanism attached to the main body 2 by removing the unillustrated cables in FIG. 1. The control unit 6 according to the data # 6 is based on the data stored in the storage unit 61 or the input signal from the operation unit 62, or any of the various gap sensors 42a, 42b and other sensors not shown in the figure. Signals, etc. to control each component. > In particular, the 'control section 6 stores the maintenance conditions in the storage section ㈣, and the maintenance conditions are set by the controller operating the operation section 62. In addition, it is appropriate to control the linear motors 50, 51, the supply mechanism 7, and the cleaning mechanism 8 to the storage tanks / owers & babies stored in the storage unit 61.— 偁 成 8 寺 彳 文 而The maintenance of the situation at that time can be carried out. The storage unit 61 can be a tank for temporarily storing data, a ROM for reading and a magnetic disk device, etc., or a magneto-optical disk with removable properties. Or a storage medium such as a memory card and such a reading device, etc. The operation unit 62 may be a button, a switch (including a keyboard or a mouse, etc.), etc. Alternatively, it may have both the touch and a panel display. The function of the display unit 0. The display unit 63 may be a liquid crystal display or various indicators, etc. As described above, the structure and function of the substrate processing apparatus of this embodiment are described. < Description of operation > Figs. 5 and 6 are flowcharts showing the operation of the substrate processing apparatus according to this embodiment. The operation of the substrate processing apparatus will be described below with reference to FIGS. 5 and 6. It should be noted that the operations of the substrate processing apparatus 丨 described below are implemented under the control of the control unit 6 unless otherwise specified. First, after the specific initial setting of the substrate processing device η is completed (step 98) 98703.doc * 18- 200533427, it is in a standby state until the substrate 90 is carried in (step Su). It should be noted that the specific initial setting refers to the necessary preparation steps required to perform the operation of the substrate processing apparatus. For example, it includes not only steps for automatically processing the substrate processing apparatus (reading data, etc.), but also steps for the controller to manually perform specific setting operations (adding a new method or setting maintenance conditions, etc.). In addition, the initial maintenance of the slit blasts 41 a and 41 b is also performed in the initial setting. Fig. 7 is a flowchart showing a detailed description of the initial maintenance performed in the initial setting. The substrate processing apparatus of this embodiment! During the initial maintenance, the internal cleaning process and the external cleaning process are performed on the slit nozzles 41a and 41b. Furthermore, maintenance is not limited to such processes. Since the slit nozzle 41a and the slit nozzle 4ib are initialized and maintained in substantially the same manner, only the processing of the slit nozzle 4 & will be described here as an example. First, the control unit 6 controls the linear motors 50 and 5 to move the slit nozzle 41 a above the pre-coating mechanism 86 a (step s 101). When the slit nozzle 41a has been moved, the control unit 6 controls the three-way valve 710 to open the pipe 81a and close the upstream side of the pipe 71a. The control valve 71WT opens the pipe 7lat downstream. Thereby, the cleaning liquid flow path from the cleaning liquid container 80 to the slit nozzle 41a can be connected. Further, the control unit 6 opens the deaeration pipe 740 by opening the valve 741 of the deaeration mechanism 74a. Next, the control unit 6 drives the pump 82a, supplies the cleaning liquid from the cleaning liquid container 80 to the slit nozzle 41a (step S102), and performs deaeration of the slit nozzle 41a (step S103). When step S102 is performed, the cleaning liquid is supplied to the slit nozzle 41a, and the supplied cleaning liquid is conveyed to the downstream side of the pipe 71a, and is sprayed from the slit 98703.doc -19 · 200533427. Thereby, the inside of the slit nozzle 41a can be cleaned. In addition, the cleaning liquid delivered and supplied through the chestnut 82 & also overflowed in 74a. With this cleaning solution, the slit nozzle milking mechanism mechanism is squeezed, and it can be discharged to the recovery mechanism. Therefore, the two-gas degassing = Figure two = step_ and step Sl ° 3 as two different daggers, not only the two steps are performed simultaneously in parallel, can also be constituted as follows: set in the degassing mechanism 74a Reconstituted degassing. A courtesy pump can be strong: The control unit 6 stops the operation of the pump 82a to stop the supply of the washing liquid after a certain period of time has elapsed after starting to drive the millet 82a. Next, the door closes the pipe 8 la and opens the upstream side of the pipe 7U. This is taken from the photoresist container 7. In addition to the photoresist liquid up to the slit nozzle ，, the time for performing step C (S103) (inter-personal cleaning time in the internal cleaning process) can be set in advance as a maintenance condition and stored in the storage ^ "I In this way, in the substrate processing apparatus 1, the maintenance conditions previously stored by the controller δ and 疋 are stored in the storage phase in the storage phase. The control section 6 takes the maintenance bar as a method (maintenance Method), so that the necessary maintenance can be carried out at the right time. By adding the necessary maintenance methods to the substrate processing method (usual method) implemented below, even if the controller does not issue instructions one by one Maintenance can also be implemented, which can promote automation. Therefore, it can reduce the situation that the controller must be involved, so it can reduce the burden on the controller. If the following is not true, then the maintenance of the controller 6 in the process 5 is necessary. As the maintenance bar 98703.doc • 20 · 200533427, preset and store them. Next, the control section 6 drives the photoresist pump 72a, and supplies the photoresist liquid from the photoresist container 70 to the slit nozzle 41 & (step 81). 4). As a result, the cleaning liquid in the slit nozzle 41 & dispense 7 1 a and the deaeration mechanism 74a is squeezed out and replaced with the photoresist liquid. If the photoresist pump 72a starts to drive, a specific time elapses Then, the control section 6 will stop the photoresist pump 72a to stop the photoresist liquid supply. Next, the valve 711 is closed, the piping 7 is closed, and the downstream side is closed, the valve 741 is closed, and the degassing piping 740 is closed. Then, the slit nozzle 4a and the pipe 7 are filled with the photoresist liquid, and the internal cleaning process is completed. When the internal cleaning process is completed, the control unit 6 controls the linear motor 50, 51, the slit nozzle 41a is moved above the standby box 85a (step s105). At this point, the control unit 6 reaches the height position near the ejection outlet of the slit nozzle 4ja by the cleaning liquid discharge mechanism 83a ( Lifting mechanism 43 &, 44 & is controlled in such a way that the slit nozzle 41a and the washing liquid discharge mechanism 83 & do not interfere with each other.) When the slit nozzle 41a has finished moving, the control unit 6 controls the washing liquid discharge mechanism based on the washing liquid discharge mechanism. 83a scan times When the cleaning liquid is discharged (step sio6), when it is necessary to discharge the cleaning liquid, the pump 82a is driven to supply the cleaning liquid to the cleaning liquid discharge mechanism 83a. As a result, the cleaning liquid discharge mechanism discharges the cleaning liquid to the slit nozzle. (Step S107), and scan the slit nozzle 4U (Step S108). Therefore, the front end of the slit nozzle 41a can be cleaned from the outside. Furthermore, the speed of the cleaning liquid discharge mechanism 83a during scanning can also be used for maintenance. The conditions are set. On the other hand, when it is not necessary to spit out the cleaning solution (it is judged as 98703.doc 21 200533427 in the step letting) 10. Skip step S1 () 7 'and scan the slit nozzle 4u (step siq8). Steps: The cleaning liquid discharge mechanism ... The mouth emits nitrogen gas, so the cleaning liquid will not be discharged. By performing step S108, the slit mouth can be dried. "Furthermore," the substrate processing apparatus of this embodiment ^, the execution steps and the day guard "can also be used to blow out nitrogen because the steps are also performed. The purpose is to prevent the spouted cleaning solution from scattering unnecessarily, etc., and if necessary, stop blowing nitrogen during the process. The control section 6 controls the respective components based on the maintenance conditions in which such judgments are also set in advance, so the United States needs to perform processing. The substrate processing apparatus 1 may perform steps S108 each time, and the control unit 6 counts the number of scans of the cleaning liquid discharge mechanism 83a until the number of scans is completed, and repeats the processes of steps ㈣ to S109 (step s099). After the scan is performed a specific number of times by the washing liquid discharge mechanism 83a, the external washing process is completed, and the process returns to the process shown in FIG. At this time, the control unit controls the lifting mechanisms 43a and 44a to lower the slit nozzle 4U and the front end portion penetrates into the standby case 85a. Thereby, drying of the slit nozzle-front end portion can be suppressed. Hereinafter, the state of the slit nozzles 41a and 41b at this time is called "standby state". The above is the process of initial maintenance. Returning to FIG. 6, in the substrate processing apparatus L, the substrate 90 is transferred to a special position by a controller or a transfer mechanism (not shown), and the lifting mold LP of the platform 3 will rise to receive the substrate 9G. Moreover, by lowering the ejector lever Lp by d, the substrate 90 can be placed at a specific position on the holding surface 30 of the platform 3, so that the stage 3 adsorbs and holds the substrate 90. By this operation ', the transfer of the substrate is completed: Yes in S11). 98 卜 98703.doc -22- 200533427 When the substrate 90 has been carried in, the substrate processing apparatus 1 ends the maintenance of the slit nozzle 41a, and starts II the coating process performed by the slit nozzle 41a (step S12) until the coating Processing continues until the processing is completed (step si3). Furthermore, the maintenance in step S12 is not limited to the initialization maintenance, and may include the following, sigh, it is better to perform maintenance on the slit nozzle 41a until step S12 can be performed. More specifically, the slit nozzle 41a is in a standby state at the time when step S12 can be performed. If the coating process performed by the slit nozzle 41a is described, first, according to a control signal from the control unit 6, the lift mechanisms 43a, 4 乜, and the linear motors 50, 51 move the slit nozzle 41a to the pre-coating mechanism. Above 86a. Next, a specific amount of the photoresist liquid is supplied to the slit nozzle 41 & by the supply mechanism 7, and the slit nozzle 41a ejects the photoresist liquid to the distribution roller of the pre-coating mechanism 86a. Thereby, the preliminary coating process can be performed in the substrate processing apparatus i, and the preparation of the slit nozzle 41a is completed, and the coating process can be performed. When the pre-coating process is finished, according to a control signal from the control section 6, the elevating mechanisms 43a, 44a move the gap sensor 42a mounted on the nozzle support section 40a to a specific height higher than the thickness of the substrate 90. (Hereinafter referred to as "measurement height.") When the right gap sensor 42a is set at the measurement height, the linear motors 50 and 5 move the bridge structure 4a to the (+ x) direction (that is, only the movers 50a and 5na), thereby making the gap sense The detector 42a is moved until it is over the photoresist application area. At this time, the 'control section 6 controls the position of the X-axis direction of the gap sensor 42a by supplying a control signal to each of the linear motors 50 and 51 based on the detection results of the linear encoders 52a and 53a. 98703.doc -23-200533427 Next, the gap sensor 42a starts to measure the gap between the surface of the substrate 90 and the slit nozzle 41a in the area where the photoresist is applied on the surface of the substrate 90, and transmits the measurement result to the control unit 6. At this time, the control section 6 stores the measurement result of the gap sensor 42a in the storage section 61. When the measurement performed by the gap sensor 42a is completed, the control unit 6 calculates the position of the nozzle support portion 40a by the calculation unit 60 based on the detection result from the gap sensor 42a. The nozzle support portion 4 (^ The position of the slit nozzle 41a in the YZ plane becomes a proper posture (the distance between the slit nozzle 41 & and the photoresist coating area is a posture suitable for applying a photoresist liquid. The following is called "Appropriate posture."). Further, according to the calculation result of the calculation unit 60, control signals are supplied to each of the lifting mechanisms 43 & and 4 respectively. Based on the control signal from the control unit 6, each lifting mechanism 43a, 4 乜Move the nozzle support part 40a in the Z-axis direction, and adjust the slit nozzle 4U to an appropriate posture ... In this way, in order to achieve uniform application of the photoresist liquid, the slits must be adjusted tightly The distance between the nozzle 41a and the surface of the substrate 9G. In the substrate processing apparatus 1, the ㈣ part 6 controls the lifting mechanisms 43a and 44a according to the detection result of the gap sensor 42a, thereby adjusting the distance. As described above, this embodiment form The substrate processing equipment is separately provided with a lifting mechanism 44b and gap sensors 42a and 42b for each of the slit nozzles 4U and 41b, so @ ^ + Therefore, for each slit nozzle 4 1 a 41 b The above postures are implemented. Therefore, even at the substrate: When the device 1 handles a substrate of any thickness of 90 mm, it can be sprayed by slits 1 4 1 a, 41 b. Processing. That is, depending on the thickness of the substrate 90 processed by the tiger image 98703.doc -24- 200533427, it is not necessary to limit the slit nozzles 4ia, 41b that can be processed. Furthermore, the linear motors 50 and 51 make the bridge structure 4a on the X axis. Move the slit nozzle 41a to the discharge start position. Here, the discharge start position refers to a position where the slit nozzle 41a is substantially along one side of the photoresist coating area. If the slit nozzle 41a moves Until the ejection start position, the control section 6 supplies control signals to the linear motors 50 and 51. Based on the control signals, the linear motors 50 and 51 move the bridge structure 4a to the (+ χ) direction, and the slit nozzle scans the substrate 90 的 面。 Further, control The unit 6 monitors whether the slit nozzle 4a is moved to the ejection end position based on the detection results of the linear encoders 52 & 5 3a. The mouth 6 is implemented in parallel with the scanning of the slit nozzle 41a, and the control unit 6 sends to the supply mechanism 7 A control signal is supplied, and based on the control signal, the supply mechanism 7 drives the photoresist pump 72a. As a result, the photoresist liquid supply path 73a is independent from the photoresist container 70 through the slit nozzle 4b. The photoresist liquid can be supplied to the slit nozzle. In addition, the control unit 6 controls the supply mechanism 7 to set the flow rate of the photoresist liquid discharged from the slit nozzle 41a to a flow rate required to form a film with a desired film thickness. . Specifically, the driving speed of the photoresist pump 72a is controlled. By the operation described above, the slit nozzle 41a discharges the photoresist liquid in the photoresist coating area ^, and a photoresist liquid layer (thin film) can be formed on the surface of the substrate 90. That is, the coating process performed by the slit nozzle 41a can be performed. When the slit nozzle 4U is moved to the discharge end position, the control unit ㈣ controls a signal to be supplied to the supply mechanism 7. Based on the control signal, the supply mechanism 7 stops the operation of the photoresist pump 72a. Thereby, the discharge of the 98703.doc 25 200533427 photoresist liquid from the slit nozzle "a is stopped, and the coating process performed by the slit nozzle 41a is ended (determined as Yes in step S13). Alternatively, The coating process performed by the slit nozzle 41b described below is performed substantially the same. 9 When the coating process performed by the slit nozzle 41a is completed, the substrate processing apparatus 1 starts to perform maintenance for the slit nozzle 41a. (Step si4) In the substrate processing apparatus of this embodiment, the maintenance performed on the slit nozzle 4 & will be described. First, the control unit 6 supplies control to the lifting mechanisms 43a and 44a and the linear motors 50 and 51. The signal, the lifting mechanism 43 &, 44a and the linear motors 50, 51 move the slit nozzle 41a above the standby box 85 & Next, the supply mechanism 7 supplies a specific amount of photoresist liquid to the slit nozzle 41a, This slit nozzle 41a discharges the photoresist solution to the standby box 85a. This allows, for example, the air sucked into the inside of the slit nozzle 41a to be removed by back suction at the end of coating, etc. Therefore, the next time Slot nozzle 4u solid During the coating process, the discharge responsiveness and the discharge uniformity can be improved, so that the discharge accuracy of the slit nozzle 4U can be improved. In this way, in the substrate processing apparatus 1 of this embodiment, the control unit 6 and the supply mechanism 7 And the standby box 85a (pre-coating mechanism 86a) can also perform degassing processing. That is, not only the degassing mechanism 74a 'but also these components have functions that can be performed as the degassing mechanism invented by the present application. At the end, the washing mechanism 8 drives the pump 82a, and the washing liquid discharge mechanism 83a is supplied with the washing liquid from the washing liquid container 80, so that the washing liquid discharge mechanism 83a is moved in the Y-axis direction. This allows the slit to be implemented. Nozzle 41 & front end cleaning process (the same process as the external cleaning process shown in Figure 7), can clear 98703.doc -26- 200533427 except the attached photoresist liquid or other contaminants. Therefore, When the coating process is performed by the slit nozzle 41 a next time, it is possible to suppress particles from adhering to the substrate 90 or to form a non-uniform film thickness, so that the coating accuracy performed by the slit nozzle 41 a can be improved. Mainly substrate In the substrate processing apparatus 1 being processed, the Zunei valley for the slit nozzle 4 la is also described. In addition, the maintenance of the slit nozzle 々lb described below is also substantially the same. Step S14 is performed, and the implementation of the During the maintenance of the slit nozzle 4U, at the same time, the substrate processing apparatus i performs the removal process of the substrate 90 that has completed the coating process, and the control unit 6 monitors the completion of the removal process of the substrate 90 (step S15). In the unloading process, first, the platform 3 stops attracting the substrate 90 and raises the mold ejector LP, thereby lifting the substrate 90 to a specific height position. The controller or the transfer mechanism receives the substrate 90 in this state and transfers the substrate 90 to the next processing step, thereby completing the unloading processing of the substrate 90 (determined as Yes in step S15). When the carrying-out processing of the substrate 90 is completed, the substrate processing apparatus 1 determines whether or not the operation is terminated based on whether there is a substrate 90 that needs further processing (hereinafter, 90% of the substrate to be processed next is substrate 91) (step S16). When there is no substrate 9 丨 (Yes in step S16), the processing is terminated and the substrate processing apparatus is taken out! When the substrate 91 is present (determined as N in step S16) ', the base unit performs a loading operation and monitors the completion of the loading operation (step S21). : The maintenance of the slit nozzle nozzles of Yuancheng moving the substrate 9 is completed, and the coating process by the slit nozzle 41b is performed from the beginning (step s22). The coating process performed by the slit nozzle 41 b by 98703.doc -27- 200533427 is performed in substantially the same manner as the coating process performed by the slit nozzle 41 a. In this way, in the substrate processing apparatus 1 of the present embodiment, the slit nozzle 41b performs a coating process for the substrate 91, whereby it is not necessary to end the maintenance for the slit nozzle 41a at the time when the substrate 91 is carried in. That is, in the previous device, after step S14 is performed, the substrate carrying in / out time (equivalent to the time when steps S15, S16, and S21 are performed) is only used as a maintenance time. However, in the substrate processing apparatus 1, steps 815, The time of S16, steps S21 to S26, and step sii serve as the maintenance time of the slit nozzle 41a. Therefore, there is no need to stop the substrate processing apparatus 1, and even if it takes a long time to perform maintenance such as degassing, the intermittent time for the substrate 90 will not be extended. If the coating process on the substrate 91 by the slit nozzle 41 b is completed (Yes in step S23), the substrate processing apparatus “#” starts the maintenance of the slit nozzle 41 b (step S24), and starts the substrate 91. When the unloading operation is completed, the completion of the unloading operation is monitored (step S25). When the unloaded substrate 91 is completed, it is determined whether the operation is completed by determining whether there is a substrate 90 that needs further processing (step S26). If there is a substrate 90 that needs to be processed, on the other hand, if there is a substrate 90 that needs to be processed, the process returns to step sii to continue the processing. In this way, the substrate processing apparatus 1 until no substrate 90 that needs to be processed exists. (Until it is determined as No in step S16 or step S26), the processing of steps su to su and steps m to S26 is continued. As described above, the substrate processing apparatus of this embodiment is provided with a direction that can be maintained at 98703.doc- 28- 200533427 A plurality of slit nozzles 41a, 41b of the photoresist solution are ejected from almost all areas of the substrate 90 photoresist coating area on the platform 3. Among the slit nozzles 41a and 41b, maintenance can be performed on the slit nozzles that have not been ejected to the substrate 90, so that the processing for the substrate 90 can be continued and other slit nozzles can be sufficiently cleaned. In addition, the substrate processing apparatus of the present embodiment includes lifting mechanisms 43a, 4a, 4b, 4b, and 4b that individually raise and lower a plurality of slit nozzles 41a, 41b, and measure the plurality of slit nozzles 41a, 41b, and The gap sensors 42a and 42b held at intervals between the substrates 90 on the platform 3 are moved up and down by a plurality of slit nozzles 41a and 41b based on the measurement results measured by the gap sensors 42a and 42b. The slit nozzles 41a and 411) can correspond to the substrate 90 of any thickness. As a mechanism for moving the bridge structure 4a and 4b in the X-axis direction, linear motors 50 and 51 can be used to prevent an increase in occupied area. In addition, in the substrate processing apparatus of this embodiment, the photoresist liquid supplied to the slit nozzles 41a and 41b can be supplied from the photoresist container 70, and is a general photoresist liquid. However, Can also be set separately A photoresist container 70 connected to each of the photoresist liquid supply paths 73a and 73b is provided, and different photoresist liquids are stored in the photoresist containers 70. That is, the substrate processing apparatus 1 of this embodiment The photoresist liquid supply channels 73a and 73b can be separately provided, so that the slit nozzles 41a and 41b can discharge different processing liquids. In this case, the substrate 90 and the substrate 91 can be coated with each other. Different treatment liquids, but even in this case, the maintenance time of the slit nozzles 4u and 4ib can be sufficiently ensured. 98703.doc -29- 200533427 Moreover, the cleaning mechanism 8 sends to the cleaning liquid discharge mechanisms 83a and 83b. The supplied cleaning liquid is supplied from the cleaning liquid container 80, and is a general-purpose cleaning liquid. However, a separate washing liquid container 8G connected to the washing liquid supply circuit and the state may be separately provided, and different washing liquids are stored in these washing liquid containers 8 (). In other words, the substrate processing device of this embodiment may be configured as follows: Since the cleaning liquid supply channels 8b and _ are separately provided, the processing liquid used for 41a and 4 lb is sprayed according to the slit, for example, so that the most A suitable cleaning solution washes each slit nozzle 41a, 4 lb. In addition, when the maintenance in step S14 (or step S24) (maintenance during the substrate processing performed by the substrate processing device i) is difficult to end during the processing of a substrate, the slit nozzles 41a, 41b may continue to The two substrates are coated. That is, the slit nozzle 41a and the slit nozzle 41b 'are alternately used every number of substrates processed, which can also be determined according to the time required for performing maintenance. < 2. Second Embodiment > In the first embodiment described above, a method of ensuring the maintenance time of the slit nozzles 41a and 4 cents by performing the coating treatment by alternately using the slit nozzles 41a and 41b will be described. However, the Dimension I version + Dimension dimension is not limited to those implemented during the operation of the substrate processing apparatus. For example, it can also be maintained after cleaning or replacing the slit nozzle due to the abnormality of the slit nozzle due to the abnormality of the slit nozzle ( Hereinafter referred to as "recovery maintenance"). The restoration and maintenance requires a long time of maintenance. Usually, the controller needs to perform the operation: Therefore, at the moment when the operation of the device is stopped and the maintenance is ended, the operation of the device can be restarted by the instruction of the controller. When the substrate processing device of the present invention performs such restoration and maintenance, the interval between 98703.doc -30-200533427 can also be extended. Fig. 8 and Fig. 9 are flowcharts showing the operation of the substrate processing device i in the second embodiment constructed based on such a principle. In addition, the configuration of the substrate processing apparatus 1 in the 12th embodiment is substantially the same as that of the substrate processing apparatus 1 in the first embodiment, so the description of the configuration is omitted. First, when the initial setting of the field and 纟 α beams is not shown, it is determined whether an abnormality occurs in the slit nozzle 4 ia (step S31). When an abnormality occurs, the restoration and maintenance of the slit nozzle 41a is started (step S41). . In addition, by performing step S31, the processing when no abnormality is found in the slit nozzle 41a will be described later. Also, the loose test can also be detected based on the inspection result of the processed substrate 90 or the operation performed by the controller, etc., or the abnormality detection can be performed periodically by processing a specific number of pieces. On the other hand, if there is no abnormality in the slit nozzle 41a, the carrying-in substrate 90 'monitors completion of the carrying-in operation (step S32). The substrate processing apparatus of this embodiment! When the substrate 90 is carried in, the maintenance of the slit nozzle 41a is ended, and the coating process performed by the slit nozzle 41 & is started (step S33). Since the coating process of this embodiment is the same as the coating process of the first embodiment, description thereof will be omitted. By executing step S34, if it can be detected that the coating process performed by the slit nozzle 4u is completed, maintenance of the slit nozzle 4U is started (step S35) and the substrate 90 is removed. By executing step S36, if it is detected that the removal of the substrate 90 is completed, it is determined whether there is a substrate 90 that needs further processing (step S37). When there is a substrate 90 that needs to be processed, it returns to step 丨 to continue processing. In another 98703.doc 31 200533427 aspect, the processing is terminated when there is no substrate 90 to be processed. That is, 'the substrate processing apparatus 1 of the second embodiment until the slit nozzle 41 a has an abnormality that requires maintenance maintenance (until it is determined to be Yes in step S31 1)', the slit nozzle 41 a performs the same processing as the previous apparatus . Therefore, the maintenance performed on the slit nozzle 41a during the operation is mainly completed within the time when the substrate 90 is carried out (the time when steps S36, s37, S31, and S32 are performed). During the operation of the substrate processing apparatus 1 according to the second embodiment, it is detected that the slit nozzle 41 & an abnormality is detected (it is determined as heart in step 831, as described above, 'step S41 is performed, and the slit nozzle 41a is started. Then, the substrate 90 that needs to be processed is moved in, and the completion of the substrate 90 moving operation is monitored (step S42). When the substrate 90 is moved in, the maintenance of the slit blast 41b is ended, and borrowing is started. The coating process performed by the slit nozzle 41b (step S43). That is, 'if the substrate processing apparatus 1 of the second embodiment needs to perform restoration maintenance on the slit nozzle 41a, the slit nozzle 411 is used to continue the coating deal with. In the previous device, in this case, it was necessary to stop the operation (the production line was stopped) and perform restoration and maintenance. During this period, the substrate 90 was completely incapable of processing. However, even in such a case, the substrate processing apparatus of this embodiment does not need to stop the production line, and the extension of the break time due to the restoration and maintenance can be suppressed. By performing step S44, if the coating process performed by the slit nozzle 41b is completed, the substrate processing I is set to 1 to start the maintenance of the slit nozzle 41b (step S45) and the substrate 90 is taken out. 98703.doc • 32- 200533427 Furthermore, 'through execution steps ~ • w S46' If the completion of the removal of the substrate 90 is detected, it is determined whether the repair of the tossing μ #, ten, and the maintenance and repair of the slit nozzle 41 a (steps) S47) 'When the U-shape restoration of the dimensional spectrum is finished, return to step S37 in FIG. 8 to continue processing. In the case where the slit spraying is not completed— $ is the maintenance and repair situation implemented by 41a ', it is determined whether there is a substrate 90 that needs to be further processed (step S48), and if there is a substrate that needs to be processed, When the h-shape is 90, the process returns to step S42 to continue the processing. On the other hand, Yu and Zi finish processing when there is a substrate to be processed 90. As described above, the substrate processing apparatus of the second embodiment! As with the substrate processing apparatus of the first embodiment, the extension of the intermittent time due to maintenance can be suppressed. Furthermore, the recovery and maintenance are not limited to the maintenance required in the case of unpredictable conditions such as "abnormal". For example, the medium γ A, for example, may include maintenance that can be performed, such as replacement of a photoresist solution. < 3. Third Embodiment > In the first embodiment, only the internal cleaning process that requires a long time in the initial setting will be described as an example. However, by appropriately setting the maintenance conditions, the substrate processing apparatus 1 can also be configured as follows. After the coating process is started, the coating process can be continued and the internal cleaning process can be performed. 10 and 11 are flowcharts showing the operation of the substrate processing apparatus i according to the third embodiment. The configuration of the substrate processing apparatus of this embodiment is substantially the same as that of the substrate processing apparatus of the first embodiment, and therefore description thereof is omitted. First, the initial setting (step S 51) is performed in the same way as step 810 and § 11 of the first embodiment (98703.doc -33- 200533427), and it is confirmed that the transfer of the substrate 9 0 is completed (step S52). When the substrate 90 is carried in, the control unit 6 determines whether or not the maintenance performed on the slit nozzle 4 1 a has been completed (step S 5 3), and further determines when the maintenance is performed on the slit nozzle 4 1 a. Whether or not the maintenance performed on the slit nozzle 41b is completed (step S54). That is, until the substrate nozzle i of this embodiment can use both the slit nozzle 41 a and the slit nozzle 41 b, steps S5 3 and S54 are repeated and the coating process is in a standby state. When the slit nozzle 41a can be used (YES in step s53), the coating process by the slit nozzle 41a is started (step S55), and when the slit nozzle 41b can be used (step It is judged as Yes in S54), and the coating process by the slit nozzle 41b is started (step S56). In this manner, those who will be selected from among the slit nozzles 41a and 41b as the slit nozzles that can perform the coating process on the substrate 90 will be referred to as "target slit nozzles". The coating process performed by the target slit nozzle is the same as the coating process described in the first embodiment, so the description is omitted. When the control unit 6 completes the coating process performed by the target slit nozzle (YES in step S61), the number of times the target slit nozzle is used will be increased. The so-called "number of uses" means from the top: the number of times that the target narrow nozzle has been used to perform the coating process continuously since the internal cleaning process was started. 1 In this process, the control unit 6 can know how many times the slit has been used continuously. The nozzles 4 and 4 are coated. Next, the control unit 6 starts the maintenance process (step S62) and monitors the base unit 98703.doc -34- 200533427 board 90 to move out (step § 63). That is, in the substrate processing apparatus 1 of this embodiment, the maintenance processing is started in step S62, but the coating processing can be continued until the maintenance processing is completed. Fig. 12 is a flowchart showing the operation of the maintenance process in the third embodiment. During the maintenance process, the slit nozzle inspection may be performed first (step S71). The so-called “slot educator” refers to the treatment of a specific slit nozzle for performing maintenance. In this embodiment, a slit nozzle (target slit nozzle) that has just been subjected to a coating treatment can be selected. . If the target slit nozzle has been determined, the control unit 6 refers to the counted number of times that the target slit nozzle has been used, and determines whether a specific number of times has been used (step S72). The specific number of times to be the judgment criterion at this time is input and set in advance by the controller as a maintenance condition. The control section 6 executes the determination of step S72 by referring to the setting value stored in the storage section 61 as a specific number of times. When it has been used a certain number of times, the control unit 6 controls the linear motors 50, 51 'to move the target slit nozzle above the pre-coating mechanism 86a (or pre-coating mechanism 86b) (step S73). When the movement of the target slit nozzle is completed, an internal cleaning process is performed (step S74). In addition, the washing process in step S74) and the Yin process are substantially the same processes as those in steps 8102 to 1010 in the first embodiment, and therefore description thereof is omitted. On the other hand, when the specific number of times has not been used, steps S73 and S74 are skipped because the internal cleaning process is omitted. Next, the control unit 6 controls the linear motors 50 and 51 to move the target slit nozzle above the standby i85a (or the standby box 85b) (step §75). In addition, 98703.doc -35- 200533427 moves the slit nozzle of the right element to perform external cleaning processing (step S76). In addition, the external washing process in step S76 is substantially the same as that in steps S106 to S109 (Fig. 7) of the first embodiment, and therefore description thereof is omitted. In this way, the control unit 6 continuously performs the inner neighbor washing process (step S74) and the outer washing process (step S74) on the slit nozzles 41a, 41b that are subjected to the coating process a specified number of times in succession. On the other hand, for the slit nozzles 41a and 41b that have not been used a certain number of times in a row, only external cleaning is performed after the coating process (the steps are in this way in the substrate processing apparatus of this embodiment) The control department Shigen Kangwei also implemented necessary maintenance appropriately to ensure the normal state of the slit nozzles 41a and 41b. The cleaning unit 6 and the control unit 6 control the lifting mechanism 43a 4 mountain 4a (^ lifting mechanism 43b, peach), lower the target slit nozzle so that the end (M again enters the standby benefit 85a (or standby box ㈣). Π, make the target slit private to the standby position (step S77) . End the maintenance process in the manner described above. As mentioned above, the maintenance process is implemented in Phase 6) 11), but the coating process can be completed before the maintenance process ends. Therefore, it can be taken out even if the maintenance process is not completed. Board 9. At the time, 'determine whether there is a basis for further processing, step S64)' If there is a basis that has not yet been coated, return to step S52 (Figure 10) and repeat the process. =, As the maintenance processing target The slit nozzle can not be processed by the main cloth, so the state of the slit nozzle of the object is 98703 during the period until the narrow slit 7 of the target slit nozzle is processed. doc -36- 200533427 is directly under "Maintenance I. Approved by W, ...: lJwM in steps S53, S5 · 10)," ... determines the next-step slit nozzles 41a, 41b that can be coated. . Eight-dimensional angle method The substrate processing apparatus 1 of this embodiment includes a plurality of 41a and 41b '. If the card can be used (any of steps S53 and S54 is determined as Yes), then 訾 + 了Coating process. Therefore, one side of the slit He Ming Zhong Guan Shi such as internal light, and yong kao-Yin Yin Suwan to maintain for a long time, can continue to be treated as the main cloth by the slit nozzle of the other side, so that The processing efficiency of the substrate 90 is improved. Furthermore, in the "substrate processing apparatus of this embodiment", there is also a state in which the slit nozzles 仏 and 41b can be processed in parallel. In this case, until the end of any slit nozzle, The processing at steps S53 and S54 is repeated until the processing is completed, and the coating processing is in a standby state. In the substrate processing apparatus 1 in step S64, if it is possible to go to six or more, it is judged that there is no need for further processing. The substrate 90 is expected to end the maintenance process and thus the process is completed. As described above, the substrate processing device i in this embodiment can also obtain the same effect as the above embodiment. Furthermore, 'as shown in this embodiment' if self-coating If the slit nozzles 41a and 41b are used alternately at the beginning of the cloth treatment, a certain number of times can be reached at the same time, and the internal cleaning process needs to be performed almost simultaneously (step S74). In this case, the two slit nozzles 4U, 41b cannot be used. Therefore, for example, it is also possible to perform the coating process of the first fixed number of pieces only by the slit nozzle 41a, and then start the alternate operation. < 4 · Fourth Embodiment > 98703.doc -37- 200533427 Substrate processing equipment ^ H @ m ^ r 罝 1 has early photoresist and can provide different well resistance, wide ... ^ ... Road 73a, 73 b 'previous' pre-resistor liquid can thus implement different principles alternately, the situation has already been described above, Chu Tian,-private from the ^ I evil. However, in the case of using several kinds of photoresist liquids, the liquid solution needs H. Make sure to replace the photoresist nJ: ° Brother Moon Ben Beth ’s principle of evil is applied by only the liquid solution of the slit nozzle 412. After the cloth was treated, the photoresist liquid supplied to the slit spray wlb was replaced with photoresist B. This ensures the maintenance time required for replacement with the photoresist liquid B. … When the process of replacing the photoresist ㈣ is completed, the coating process is alternately performed by the slit nozzle 仏 and the slit nozzle 41b. In this way, the maintenance time required for the external cleaning process of each of the slit nozzles 41a, 41b can be secured. Furthermore, when the coating process of coating the photoresist solution eight with U is finished, the coating process is continued only by using a slit nozzle, and the photoresist solution is changed from green d liquid C. Thereby, the maintenance time required for replacement with the photoresist liquid c can be ensured. In this way, if the number of substrates 90 to be processed with which photoresist liquid is determined in advance by a manufacturing plan or the like, it is set as a maintenance condition, and thereby it can be effectively used. < 5. Fifth Embodiment > As for the maintenance performed to remove the photoresist liquid adhering to the slit nozzles 41a, 41b, in the above embodiment, the external cleaning process is mainly described, but it is used for The method for removing the photoresist solution is not limited to this. Fig. 13 is a schematic diagram showing a removing mechanism 75 for setting the substrate processing wave 1 in the fifth embodiment constructed based on such a principle. Furthermore, in FIG. 13, only one removal mechanism 75 is shown in FIG. 98703.doc -38- 200533427, but the substrate processing apparatus 1 of this embodiment includes two removal mechanisms 75, which are respectively disposed above the standby boxes 85 a and 85 b. . The removal mechanism 75 includes a base 750, a pair of collection members 751, a feed nut portion 752, a ball screw 753, and a rotation motor (not shown). The base 750 is a plate-like member, and a pair of collection members 751 are fixed and arranged on the (+ z) side in the γ-axis direction. The collecting member 751 is a plate-like resin member, and as shown in FIG. 13, a notch portion 75U is formed on each of the upper portions. The notch portion 75a is formed to conform to the front ends of the slit nozzles 4U and 4 邝. Furthermore, the number or shape of the collecting members 751 is not limited to those shown in FIG. A feed nut portion 752 is fixed on the (Z) side of the base 750. A screw hole penetrating in the γ-axis direction is formed in the feed nut portion 752 of the substantially box-shaped member, and a ball screw 753 is screwed into the screw hole. A ball screw 753 is arranged along the Y axis, and its length in the ¥ axis direction is equal to or greater than the length of the slit nozzle 仏 and the length in the direction of the 411 ^ axis. A rotary motor is installed at the 75p end of the ball screw. The rotary motor is driven by the ball screw. 753 causes the axis parallel to the Y-axis to rotate as the center. First, the mattress is 750. In addition, the base 750 is designed to cater for the omission of the ST guide member. It is set to not rotate due to the rotation of the ball screw 753. Therefore, the ball is read by the rotary motor. Screw w, feed screw 752, base 750, and a pair of retracting gears 751 to the receiving member 751-the same direction as the γ axis. In addition, the rotation motor by the rotation direction and speed of the control unit. It can be adjusted according to the above-mentioned removal machine ceremonies 4la, 41h 1 to explain the removal of the photoresist liquid angle attached to the slit nozzle 41 a 4 1 b (hereinafter referred to as "removal treatment"). The processing of the slit nozzles 41a and 41b is similar to that of the conventional method, so only 98703.doc -39- 200533427 will be described here about the slit nozzle 41a. In the substrate processing apparatus of the present embodiment, the external cleaning process for the slit nozzle 4 1 a (the same process as the steps § 丨 〇6 to s 丨 〇9 shown in FIG. 7) Subsequent performance will be removed. First, the control unit 6 controls the linear motors 50 and 51 and the elevating mechanisms 43 and 44a to move the slit nozzle 4U, which has completed the external cleaning process, above the removal mechanism 75. Further, the slit nozzles 41a are lowered by some height by the lifting mechanisms 43 &, 44 &, and the front ends of the slit nozzles 41a are pressed so as to meet the cutout portions 751a of the collecting member 751. In this state, the control unit 6 drives the rotary motor to rotate the ball screw 753. Thereby, the collecting member 751 abuts on the front end portion of the slit nozzle 41a, and in this state, the collecting member 751 moves in the ¥ -axis direction. Therefore, the adhered matter attached to the slit nozzle 41a is collected and removed by the collecting member 751. Furthermore, in the substrate processing apparatus 1 of the present embodiment, as the material of the collecting member 751, resin can be used, but as long as it is softer than the material forming the slit nozzles 41a and 41b, any one can be used. material. In addition, the collecting member 751 may be mounted on the base 750 via a member (such as a spring or a rubber) that enables the collecting member 751 to apply a force in the (+ z) direction. The control section 6 repeats the scanning until the number of times set as the maintenance condition is reached, and the removal processing is terminated. As described above, even if the maintenance mechanism is the same as the removal mechanism 75, the mechanism used to collect and remove the photoresist liquid can obtain the same as the above embodiment 98703.doc -40- 200533427 Furthermore, instead of the collection member 75 1 , You can also use a cloth wiping member to achieve the removal process. In this case, it may be configured such that the adhered photoresist liquid can be wiped by curling the roller-shaped wiping member. < 6. Modifications > As mentioned above, the embodiments of the present invention have been described. However, the present invention is not limited to the above embodiments, and various modifications can be made. For example, in either of the slit nozzles 41a and 41b, until maintenance is required, the coating process is alternately performed by the slit nozzles 41a and 41b in the same manner as the substrate processing apparatus 1 of the first embodiment; and In the case where maintenance is required, it is also possible to configure the processing using a slit nozzle that does not require maintenance in the same manner as the substrate processing apparatus 1 of the second embodiment. In addition, there may be only one cleaning liquid discharge mechanism 83a, 83b and the pre-coating mechanism 86 &, 86b, respectively. Fig. 14 is a schematic diagram showing the main components related to the photoresist liquid application operation in the side section of the main body portion 2a of the substrate processing apparatus 1 constructed in accordance with such a principle. The main body portion 2a shown in FIG. 14 is not set to have a configuration equivalent to the cleaning liquid discharge mechanism 83b and the pre-coating mechanism 86b of the substrate processing apparatus i in the above embodiment. Even with such a configuration, for example, the same operation as that of the substrate processing apparatus 1 according to the second embodiment can be performed. That is, the coating process is usually performed by the slit nozzle 41 a. When the restoration of the slit nozzle 41 is necessary to perform maintenance such as disassembly and maintenance, the slit nozzle can be retracted, and then the slit nozzle 4 can be used. 1 b The coating process is performed. At this time, the maintenance performed on the slit nozzle 4lb during the operation is performed inside the opening 32a. That is, above the standby box 85a, when the slit nozzle 4 ratio is 98703.doc -41-200533427 in standby, the washing liquid discharge mechanism 83a discharges the washing liquid, thereby washing the slit nozzle 41b; and When the slit nozzle 41b performs a preliminary coating process, a pre-coating mechanism 86a can be used. With this structure, the same effect as that of the substrate processing apparatus of the second embodiment can also be obtained. The plurality of slit nozzles 41a and 41b may have different widths in the long production direction (Y-axis direction). In this case, the substrate processing apparatus i may correspond to substrates having different widths. [Brief Description of the Drawings] FIG. 1 is a perspective view schematically showing a substrate processing apparatus according to the present invention. Fig. 2 is a schematic view showing a side cross-section of a main body of a substrate processing apparatus and a main constituent element related to a photoresist liquid coating operation. Fig. 3 is a schematic view showing a supply path of a photoresist liquid and a cleaning liquid in a substrate processing apparatus. Fig. 4 is a diagram for explaining a photoresist liquid supply path of a slit nozzle in detail. Fig. 5 is a flowchart showing the operation of the substrate processing apparatus in the first embodiment. Fig. 6 is a flowchart showing the operation of the substrate processing apparatus in the first embodiment. Fig. 7 is a flowchart showing an operation of initializing maintenance in the first embodiment. Fig. 8 is a flowchart showing the operation of the substrate processing apparatus in the second embodiment. Fig. 9 is a flowchart showing the operation of the substrate processing apparatus in the second embodiment. 0 98703.doc -42- 200533427 Fig. 10 is an S | L grain diagram showing the operation of the substrate processing apparatus in the third embodiment. Flowchart of Operation of Substrate Processing Device in Third Embodiment FIG. 12 is a flowchart showing the operation of maintenance processing in the third embodiment. Fig. 13 is a schematic view showing a removal mechanism of a substrate processing apparatus in a fifth embodiment. Fig. 14 is a schematic diagram showing the main components related to the photoresist liquid application operation of the main body of the substrate processing apparatus in the modification. 〃 [Description of main component symbols] 1 Substrate processing device 2, 2a Body 3 Platform 30 Holding surface 41a, 41b Slit nozzles 42a, 42b Gap sensors 43a, 43b, 44a, 44b Lifting mechanism 4a, 4b Bridge structure 50, 51 Linear motor 6 Control unit 61 Storage unit 62 Operating unit (acquisition mechanism) 6 Supply mechanism 73a, 73b Photoresist liquid supply path 98703.doc -43-200533427 74a Degassing mechanism 75 Removal mechanism 8 Washing mechanism 80 Washing liquid Containers 84a, 84b Cleaning liquid supply channels 85a, 85b Standby boxes 90, 91 Substrates 98703.doc-44-