丄⑽339 九、發明說明： 【發明所屬之技術領域】 本發明係與控制縫隙塗佈器之處理液的喷出之技術有 關。更詳細而言，係與用於施行正確之控制的測定技術有 【先前技術】丄(10)339 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a technique for controlling the ejection of a treatment liquid from a slit coater. In more detail, it is related to the measurement technique for performing the correct control. [Prior Art]
在液晶用玻璃角形基板、半導體晶圓、薄膜液晶用可撓 式基板、光罩用基板 '彩色濾光片用基板等（以下，簡稱 為「基板」）之表面進行塗佈光抗蝕劑等處理液之塗佈裝 置，已經為一般所知。譬如，就塗佈裝置而言，有縫隙塗 佈盗，其係使用具有縫隙狀之喷出部的縫隙喷嘴以施行縫 :、塗佈者在縫隙塗佈器，由於塗佈膜厚之參差不齊（塗 佈不均）係造成布線寬度變化的原因，因此塗佈膜厚之控 制（均一性）為尤其重要之要素。 縫隙塗佈器係藉由從縫隙噴嘴噴出抗蝕劑，且與之 使縫隙噴嘴以-定之速度移動，藉此形成均一之膜厚，因 此施行膜厚控制之情形，係以塗佈開始位置與塗佈結束 位置之膜厚控制最為困難。尤其，在塗佈開始位置，如缝 隙贺嘴之移動加速時間與喷出流量之加速時間 厚之不穩定區域越減小。 則膜 縫隙塗佈器之—般塗佈速度為2〇〇 mm/秒程度 塗佈開始位置之不敎區域限制在1G mm以内，則二 移動加速時間在0.025秒程度之間内完成。另 :’ 塗佈之膜厚係受來自縫隙喷嘴之喷出流量的很大影響， 121851.doc 1325339 此，在臈厚控制上必須將喷出流量作正確計測。然而，將 噴出流量作直接計測之流量計並不適合於短時間之計測 (無法正確計測），因而在如此短時間内計測正確之值，實 質上並不可能。 .. 因此，從先前起，使用壓力感測器以觀察喷出狀態之手 、k 法已被提出。譬如，專利文獻1中記载了此種技術。專利 文獻1提出如下技術：在縫隙喷嘴之一次側（噴出泵與縫隙 • 噴嘴之間）設置1個壓力感測器，根據藉由此壓力感測器所 測定之處理液的壓力，控制喷出。 [專利文獻1]曰本特開2〇〇3-181360號公報 【發明内容】 [發明所欲解決之問題] 在專利文獻1中所記載之技術，壓力感測器係設於縫隙 喷嘴之一次側。 圖11係顯示使供應流路之結構（配管徑、長度、配管之 • 配置等）作各種變化時之設於縫隙喷嘴之一次側的壓力感 測器之測定值之圖。如圖i i所示般，設於缝隙噴嘴之一次 側的壓力感測器之測定值，係因供應流路之結構而呈現各 種父化亦即’此現象顯示，將壓力感測器設於縫隙喷嘴 之"人侧之情形時’從噴出泵至縫隙喷嘴之間的壓力損失 對測定值有極大影響。 換D之專利文獻i所記載之壓力感測器有如下問題： 並未測疋她加於縫隙噴嘴之壓力（實際上並無法正確測定 ’縫隙噴嘴所噴出之處理液之狀態）。因此，以如此之壓力 121851.doc 感測器所測定之壓力係受一 用於貫際之控制之情形時， 才行的問題。 次延遲之影響後的數值，在使 具有須考慮此一延遲而作計算 :發明係有鑑於上述待解決問題而研發者，纟目的為， 確進行測定縫隙喷嘴所噴出之處理液之狀態。 [解決問題之技術手段] 為解決上述待解決問題，請求们之發明係—種基板處 理裝置’其特徵為：將處理液塗佈於基板者，i包含：縫 隙噴嘴’其係在内部設有處理液之流路，從前述流路經由 缝隙狀之嗔出口噴出處理液者；移動機構，其係使塗佈處 理液之基板與前述縫隙喷嘴作相對性移動者；送液機構， /、係、’’坐由處理液之第i流路將處理液送液至前述縫隙喷嘴 内之前述流路者；處理液之第2流路，其係與前述第丨流路 呈獨立設置，且與前述縫隙喷嘴内之前述流路直接連通 者，壓力測定機構，其係設置於前述第2流路者；及移動 控制機構’其係根據前述壓力測定機構之測定結杲，控制 前述移動機構者。 又’請求項2之發明係與請求項1之發明有關之基板處理 裝置’其中更包含預備塗佈部，其係在對基板之處理之 前’先被塗佈處理液者；前述移動控制機構係根據在將處 理液塗佈於前述預備塗佈部之際的前述壓力測定機構之測 定結果’控制在將處理液塗佈於基板之際的前述移動機構 者0 又，請求項3之發明係與請求項2之發明有關之基板處理 12185 丨,doc 裝置’其中更包含：送液壓 由送液機構所送液之處理液 其係根據在將處理液塗佈於 液壓力測定機構之測定結果 之際的前述送液機構者。 力測定機構，其係進行測定藉 的壓力者，及送液控制機構， 月1J述預備塗佈部之際的前述送 ，控制在將處理液塗佈於基板 又，請求項4之發明係與請求項1至3中任—項之發明有Applying a photoresist or the like to the surface of a liquid crystal glass substrate, a semiconductor wafer, a thin film liquid crystal flexible substrate, a photomask substrate, a color filter substrate, or the like (hereinafter, simply referred to as a "substrate") A coating device for a treatment liquid is generally known. For example, in the case of a coating device, there is a slit coating, which uses a slit nozzle having a slit-like ejection portion to perform a slit: the coater is in the slit coater, and the coating film thickness is not uneven. Since the coating (uneven coating) causes a change in the wiring width, the control (uniformity) of the coating film thickness is an especially important factor. The slit coater is formed by spraying a resist from the slit nozzle and moving the slit nozzle at a constant speed to form a uniform film thickness, so that the film thickness control is performed at the coating start position and Film thickness control at the end of coating is the most difficult. In particular, at the coating start position, the unstable region such as the acceleration time of the movement of the slit nozzle and the acceleration time of the discharge flow rate is decreased. Then, the film coating speed of the film gap coater is about 2 〇〇 mm / sec. The unfolding position of the coating start position is limited to 1 G mm, and the second movement acceleration time is completed within the range of 0.025 sec. Another :' The film thickness of the coating is greatly affected by the discharge flow from the slit nozzle. 121851.doc 1325339 Therefore, the discharge flow must be correctly measured in the thickness control. However, a flow meter that directly measures the discharge flow rate is not suitable for short-term measurement (it cannot be measured correctly), so it is practically impossible to measure the correct value in such a short time. Therefore, from the past, the hand using the pressure sensor to observe the discharge state, the k method has been proposed. For example, Patent Document 1 describes such a technique. Patent Document 1 proposes a technique in which a pressure sensor is provided on the primary side of the slit nozzle (between the discharge pump and the slit/nozzle), and the discharge is controlled based on the pressure of the treatment liquid measured by the pressure sensor. . [Problem to be Solved by the Invention] In the technique described in Patent Document 1, the pressure sensor is provided once in the slit nozzle. side. Fig. 11 is a view showing measured values of a pressure sensor provided on the primary side of the slit nozzle when the structure of the supply flow path (the piping diameter, the length, the piping arrangement, and the like) is variously changed. As shown in Fig. ii, the measured value of the pressure sensor provided on the primary side of the slit nozzle is due to the structure of the supply flow path, which is a variety of patrimony, that is, the phenomenon is displayed, and the pressure sensor is placed in the gap. In the case of the nozzle " human side, the pressure loss from the discharge pump to the slit nozzle has a great influence on the measured value. The pressure sensor described in Patent Document i of D has the following problems: The pressure applied to the slit nozzle is not measured (actually, the state of the treatment liquid sprayed by the slit nozzle cannot be accurately measured). Therefore, when the pressure measured by the 121851.doc sensor is subjected to a situation of continuous control, it is a problem. The numerical value after the influence of the secondary delay is calculated by considering the delay: the invention has been made in view of the above-mentioned problem to be solved, and it is an object of the invention to determine the state of the processing liquid sprayed by the slit nozzle. [Means for Solving the Problems] In order to solve the above-mentioned problems to be solved, the invention of the invention relates to a substrate processing apparatus characterized in that: a coating liquid is applied to a substrate, i includes: a slit nozzle which is internally provided a flow path of the treatment liquid, wherein the treatment liquid is ejected from the flow path through the slit-shaped exit port; and the moving mechanism moves the substrate of the application treatment liquid relative to the slit nozzle; the liquid supply mechanism, /, And ''the flow path of the treatment liquid supplied to the slit nozzle by the i-th flow path of the treatment liquid; the second flow path of the treatment liquid is independently provided with the second flow path, and The flow path is directly connected to the flow path in the slit nozzle, and the pressure measuring means is provided in the second flow path; and the movement control means ' controls the moving mechanism based on the measurement of the pressure measuring means. Further, the invention of claim 2 relates to the substrate processing apparatus according to the invention of claim 1 further comprising a preliminary coating portion which is used to apply the treatment liquid before the treatment of the substrate; the movement control mechanism According to the measurement result of the pressure measuring means when the processing liquid is applied to the preliminary coating unit, the moving mechanism is applied to the processing mechanism when the processing liquid is applied to the substrate, and the invention of claim 3 is According to the invention of claim 2, the substrate processing 12185 doc, the doc device further includes: a processing liquid for sending a liquid to be supplied by the liquid feeding mechanism according to the measurement result of applying the processing liquid to the liquid pressure measuring mechanism The aforementioned liquid feeding mechanism. The force measuring means, which is a pressure-measuring person and a liquid-feeding control means, which is used to apply the processing liquid to the substrate, and the invention of claim 4 is The invention of any one of claims 1 to 3 has
關之基板處理裝置’其中前述第2流路係用於從前述縫隙 喷嘴之内部將空氣排除之配管。 【實施方式】 [發明之效果]The substrate processing apparatus </ RTI> wherein the second flow path is a pipe for removing air from the inside of the slit nozzle. [Embodiment] [Effect of the Invention]
請求項1至4所記載之發明包含：送液機構，其係經由處 理液之第1流路將處理&進行送液至縫隙喷嘴内之流路 者，處理液之第2流路，其係與第丨流路呈獨立設置，且與 缝隙喷嘴内之流路作直接連通者；壓力測定機構，其係設 置於第2流路者；及移動控制機構，其係根據壓力測定機 構之測定結果，而控制移動機構者。藉由此方式，可正確 測疋處理液之噴出狀態。因此，可正確控制移動機構。 請求項2所記載之發明更包含預備塗佈部，其係在對基 板之處理之前，先被進行塗佈處理液者；移動控制機構係 根據在將處理液塗佈於預備塗佈部之際的壓力測定機構之 測定結果’把在將處理液塗佈於基板之際的移動機構予以 控制，藉由此方式，無須按各塗佈處理進行每次測定，亦 可抑制運算處理量。 請求項3所記載之發明更包含：送液壓力測定機構，其 .〆 \ 121851.doc 1325339 係進行測定藉由送液機構所送液之處理液的塵力者，·及送 液控制機構，其係根據在將處理液塗佈於預備塗饰部之際 的送液屋力測定機構之測定結果，把在將處理液塗佈於基 板之際的送液機構予以控制者。藉由此方式，可正確控= 送液機構，因此，可更提昇塗佈處理之精度。 在請求項4所記載之發明中，第2流路係用於從縫隙喷嘴 之内部將空氣排除之配管。藉由此方式’可兼作為空氣排 除配管，無須另設用於安裝壓力測定機構之流路。 以下，參考附圖，針對本發明之良好實施型態作詳细 明。 … 第1實施型態> 圖1係顯示與本發明有關之基板處理裝置丨之概略的立體 圖。圖2係顯示基板處理裝置丨之本體2之側剖面及與抗蝕 劑液之塗佈動作有關之主要構成要素之圖。 再者’在圖1中，基於圖示及說明的方便，係作如下定 義：Z軸方向係表示錯直方向、χγ平面係表示水平面。但 此等係為了把握位^關係而在權宜上作如此定義者，並非 用於限定以下所說明之各方向者。在以下之圖亦為相同。 基板處理裝置1係構成為：概略分成本體2與控制部8， 將用於製造液晶顯示裝置之畫面面板之角形玻璃基板作為 被處理基板(以下，簡稱為「基板J)90;在將形成於基板 90之表面的電極層等作選擇性餃刻的製程上，係作為把作 為處理液之抗蝕劑液塗佈於基板9〇之表面的塗佈裝置。因 此，在此實施型態中，縫隙噴嘴41係噴出抗钱劑液。再 121851.doc 1325339 基板處理裝置1係非僅液晶顯示裝置用之玻璃基板， 般亦可作為將處理液塗佈於平面面板顯示器用之各種基 板的裝置，而加以變形利用。 本體2包含平台3，其係作為用於載置基板90且並保持之 =持台而發揮功能，^作為附屬之各機構的基台亦發擇功 月b者。平台3係具有正方體形狀之譬如一體之石製，其上 面（保持面30)及側面係已加工為平坦面。 平〇3之上面係設為水平面，成為基板％之保持面川。 未圖示之多個真空吸附孔係分佈形成於保持面3〇，在基板 處理裝置1上進行處理基板9〇之期間，係藉由吸附基板9〇 而將基板90保持於特定之水平位置。又，藉由未圖示之驅 動機構而可往上下自由昇降的複數個提昇銷1^，係以適當 之間隔設置於保持面30。提昇銷Lp係在將基板9〇取除之際 用於將基板90推上者。 在保持面30之中，於夾著基板9〇之保持區（保持基板％ 之區域）的兩端部，係固設著往略水平方向作平行延伸之 一對行走軌31。行走軌31係與支持區塊（未圖示）—起，進 行引導架橋結構4之移動（將移動方向規定在特定之方向）， 構成將架橋結構4支持於保持面30之上方的線性引導.而 該支持區塊係固設於架橋結構4之兩端部之最下方者。 在平σ 3之上方’係设有從此平台3之兩側部分以略水平 方式跨越的架橋結構4。架橋結構4係主要由筚L α s如以％纖補 強樹脂為骨材之喷嘴支持部40、及支持其兩端之昇降機構 43、44所構成。 *21851.doc 1325339 在喷嘴支持部40係安裝著縫隙喷嘴41。在缝隙喷嘴“係 連接著對縫隙噴嘴4 1供應抗蝕劑液之抗蝕劑供應機構6(圖 2) ’而縫隙噴嘴41係在圖1中於Y軸方向具有長邊方向者。 再者關於縫隙喷嘴4 1與抗蝕劑供應機構6之詳細内容， • · 係如後所述。 • ' 幵降機構43、44係分別位於縫隙喷嘴41之兩側，藉由喷 嘴支持部40而與縫隙喷嘴41連結。昇降機構43、44係主要 籲 已3 AC伺服馬達43a、4牦及未圖示之球狀螺絲，根據來自 控制器8之控制信號而產生架橋結構4之昇降驅動力。藉由 此方式，昇降機構43、44係使縫隙喷嘴。作並進式昇降。 又，汁降機構43、44亦使用於進行調整缝隙喷嘴41之在 YZ平面內的姿勢。 在架橋結構4之兩端部，沿著平台3之兩側的緣側係分別 固設著-對AC無;^、線性馬達（以下，「線性馬 達」）5〇、51，而其係分別包含固定子（固定具）5Ga與移動 | 子働、及固定子51a與移動子川者。又在架橋結構“ 兩端部，係分別固設著線性編碼器52、53,而其係分別包 含刻度部與檢測子者。線性編碼器52、53係檢測線性馬達 5 0、5 1之位置。 以此等線性馬達50、51與線性編碼器52、53為主，而構 成行走機構5 ’其係用於將架橋結構4引導於行走㈣並在 平台3上移動者。控制部8係根據來自線性編碼器& ”之 檢測結果’而控制線性馬達50之動作，且控制在平台3上 之架橋結構4的移動（亦即，控制藉由縫隙噴嘴^之基板知 121851.doc -12- Ϊ325339 的掃描）。 圖3係顯示縫隙噴嘴41與抗蝕劑供應機構6之圖。在圖3 中，縫隙噴嘴41係作為概略剖面而顯示。 縫隙喷嘴4 1包含第1本體部41 a與第2本體部41 b。詳細情 - 況雖未作圖示，但在第1本體部41a之接合面，係設有特定 . 之形狀的凹部。第1本體部41a之接合面與第2本體部41b之 接合面，係以與X軸方向呈對向之方式進行接合。 % 如此方式般，藉由將第1本體部41a與第2本體部41b之接 合面予以接合，而使形成於第丨本體部4U之接合面的凹部 成為縫隙噴嘴41之内部的抗蝕劑液之流路41〇。再者，用 於形成流路410之凹部，如形成於第2本體部4ib亦可，如 形成於兩者亦可。 再者’流路410係往（-Z)方 此開口形成喷出口 川。喷出口411係沿著縫隙噴嘴41之長邊方向（γ轴方向） 延伸，而成為縫隙狀。 :縫隙噴嘴41之上部中央，係以直接連通於流路彻之 方式連接著配管42。配管42係用於排除積存於縫㈣ 内之空氣的空氣排除用配管❶如圖3 配管《呈獨立設置，且首M a斤Μ又’配管42係與 呈獨立认置，且直接連通於縫隙 川。在從縫隙噴嘴41將空氣進行排除時，配内广路 抗韻劑液將空氣予以排除，因此配管㈣ :*連同 流路。亦即，配管42係具有作為本發明楚几钱劑液之 能。 之第2流路的功 口又置於配管42之屢 在配管42係安裝著壓力感測器413 12I85I.docThe invention according to any one of claims 1 to 4 includes a liquid supply mechanism that performs a process of feeding a liquid to a flow path in the slit nozzle via a first flow path of the treatment liquid, and a second flow path of the treatment liquid. The first flow path is provided separately from the second flow path, and the pressure measurement mechanism is provided in the second flow path; and the movement control mechanism is determined by the pressure measuring mechanism. As a result, the person who controls the mobile mechanism. In this way, the discharge state of the treatment liquid can be accurately measured. Therefore, the moving mechanism can be controlled correctly. The invention according to claim 2 further includes a preliminary coating portion which is applied to the substrate before the treatment of the substrate, and the movement control mechanism is based on the application of the treatment liquid to the preliminary coating portion. The measurement result of the pressure measuring means 'controls the moving mechanism at the time of applying the processing liquid to the board|substrate, and it is not necessary to carry out each measurement by each coating process, and can suppress the calculation processing amount. The invention according to claim 3 further includes: a liquid supply pressure measuring means, wherein: 121 \ 121851.doc 1325339 is a method for measuring the dust force of the treatment liquid supplied by the liquid supply means, and the liquid supply control means. This is controlled by the liquid supply mechanism at the time of applying the treatment liquid to the substrate, based on the measurement result of the liquid supply strength measuring means when the treatment liquid is applied to the preliminary coating portion. In this way, the liquid supply mechanism can be correctly controlled, and therefore, the precision of the coating process can be further improved. In the invention of claim 4, the second flow path is a pipe for removing air from the inside of the slit nozzle. In this way, it can be used as an air exhaust pipe, and there is no need to separately provide a flow path for mounting the pressure measuring mechanism. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. [First Embodiment] Fig. 1 is a perspective view showing an outline of a substrate processing apparatus according to the present invention. Fig. 2 is a view showing a side cross section of the main body 2 of the substrate processing apparatus and a main constituent element relating to the coating operation of the resist liquid. Further, in Fig. 1, based on the convenience of illustration and description, the definition is as follows: the Z-axis direction indicates the misalignment direction, and the χγ plane indicates the horizontal plane. However, these are defined as such in order to grasp the positional relationship, and are not intended to limit the directions described below. The same is true in the following figures. The substrate processing apparatus 1 is configured to be roughly divided into a main body 2 and a control unit 8, and a corner glass substrate for manufacturing a screen panel of a liquid crystal display device as a substrate to be processed (hereinafter simply referred to as "substrate J" 90); In the process of selectively depositing an electrode layer or the like on the surface of the substrate 90, a coating device for applying a resist liquid as a processing liquid to the surface of the substrate 9 is used. Therefore, in this embodiment, The slit nozzle 41 ejects the anti-money agent liquid. Further, 121851.doc 1325339 The substrate processing apparatus 1 is a glass substrate for a liquid crystal display device, and can be used as a device for applying a treatment liquid to various substrates for a flat panel display. The main body 2 includes a platform 3 that functions as a platform for holding the substrate 90 and holding it, and the base of each of the attached mechanisms also selects the power b. The 3 series has a rectangular parallelepiped shape, and the upper surface (the holding surface 30) and the side surface are processed into a flat surface. The upper surface of the flat cymbal 3 is a horizontal plane, and is a holding surface of the substrate. many The vacuum adsorption hole system is formed on the holding surface 3〇, and the substrate 90 is held at a specific horizontal position by the adsorption substrate 9 while the substrate processing device 1 is performing the processing of the substrate 9〇. A plurality of lifting pins 1^ which are freely movable up and down by a driving mechanism are provided on the holding surface 30 at an appropriate interval. The lifting pin Lp is used to push the substrate 90 while the substrate 9 is being removed. In the holding surface 30, a pair of traveling rails 31 extending in a direction parallel to the horizontal direction are fixed to both end portions of the holding region (the region holding the substrate %) sandwiching the substrate 9A. The traveling rail 31 is fixed in parallel. And the support block (not shown), the movement of the guide bridge structure 4 (the direction of movement is defined in a specific direction), constitutes a linear guide that supports the bridge structure 4 above the holding surface 30. The support The block system is fixed at the bottom of the two ends of the bridge structure 4. Above the flat σ 3, there is a bridge structure 4 which is slightly horizontally spanned from both sides of the platform 3. The bridge structure 4 is mainly Since αL α s is as strong as % fiber The nozzle supporting portion 40 of the aggregate and the lifting mechanisms 43 and 44 supporting the both ends thereof are formed. *21851.doc 1325339 The slit nozzle 41 is attached to the nozzle supporting portion 40. The slit nozzle is connected to the slit nozzle. 4 1 The resist supply mechanism 6 (FIG. 2) for supplying the resist liquid is used, and the slit nozzle 41 has a longitudinal direction in the Y-axis direction in FIG. Further, the details of the slit nozzle 41 and the resist supply mechanism 6 will be described later. • The descending mechanisms 43 and 44 are respectively located on both sides of the slit nozzle 41, and are coupled to the slit nozzle 41 by the nozzle support portion 40. The elevating mechanisms 43 and 44 mainly call the 3 AC servo motors 43a and 4牦 and the ball screws (not shown), and the lifting/lowering driving force of the bridge structure 4 is generated based on the control signal from the controller 8. In this way, the lifting mechanisms 43, 44 are the slit nozzles. Make a parallel lift. Further, the juice dropping mechanisms 43 and 44 are also used to adjust the posture of the slit nozzle 41 in the YZ plane. At both end portions of the bridge structure 4, along the edge sides of the platform 3, respectively, a pair of ACs are not fixed; ^, a linear motor (hereinafter, "linear motor") 5〇, 51, respectively It includes a fixed (fixed) 5Ga and a moving | sub-, and a fixed sub-51a and a mobile sub-streamer. Further, in the bridge structure, the linear encoders 52 and 53 are respectively fixed at the both ends, and the scales and the detectors are respectively included in the bridge structure. The linear encoders 52 and 53 detect the positions of the linear motors 50 and 51. The linear motors 50, 51 and the linear encoders 52, 53 are mainly used to form the traveling mechanism 5' for guiding the bridging structure 4 to the walking (4) and moving on the platform 3. The control portion 8 is based on From the detection result of the linear encoder & ", the action of the linear motor 50 is controlled, and the movement of the bridge structure 4 on the platform 3 is controlled (i.e., controlled by the substrate of the slit nozzle) 121851.doc -12- Ϊ 325339 scan). 3 is a view showing the slit nozzle 41 and the resist supply mechanism 6. In Fig. 3, the slit nozzle 41 is shown as a schematic cross section. The slit nozzle 41 includes a first body portion 41a and a second body portion 41b. In detail, although not shown, a concave portion having a specific shape is provided on the joint surface of the first main body portion 41a. The joint surface between the joint surface of the first main body portion 41a and the second main body portion 41b is joined to face the X-axis direction. In the same manner as in the above-described manner, the concave portion formed on the joint surface of the second main body portion 4U is a resist liquid inside the slit nozzle 41 by joining the joint faces of the first main body portion 41a and the second main body portion 41b. The flow path is 41〇. Further, the concave portion for forming the flow path 410 may be formed in the second main body portion 4ib, and may be formed in either case. Further, the flow path 410 is directed to the (-Z) side, and the opening forms a discharge port. The discharge port 411 extends in the longitudinal direction (γ-axis direction) of the slit nozzle 41 and has a slit shape. The center of the upper portion of the slit nozzle 41 is connected to the pipe 42 so as to be in direct communication with the flow path. The piping 42 is used for the air-removing piping for removing the air accumulated in the slit (4). As shown in Fig. 3, the piping is "independently arranged, and the first M a Μ and the piping 42 are independently recognized and directly connected to the gap. Chuan. When the air is removed from the slit nozzle 41, the air is removed by the inner channel anti-supplement liquid, so the pipe (4): * together with the flow path. That is, the pipe 42 has the function as the agent liquid of the present invention. The function of the second flow path is again placed in the pipe 42. The pressure sensor 413 is mounted on the pipe 42. 12I85I.doc
-13- U25339 力感測器413係測定配管42内之抗蝕劑液的壓力並傳達至 控制部8。又，壓力感測器413如測定配管42内之空氣壓力 亦可。亦即，壓力感測器413係主要相當於本發明中之壓 力測定機構。 •. 又，在配管42係安裝著閥4 1 4，其係依據來自控制部8之 . 控制信號而將配管42進行開閉者。在塗佈處理等，當從縫 隙噴嘴4 1喷出抗蝕劑液之際，閥4丨4係呈關閉。 • 圖4係顯示把對縫隙喷嘴41供應抗蝕劑液之供應流路之 結構作各種變化時之壓力感測器413的測定值之圖。圖4所 不第1結構至第6結構係分別相當於圖丨丨所示第丨結構至第6 結構之結構。 如圖4所示般，從壓力感測器413之測定值可知：在各結 構之差異很小，即使供應流路之結構變化，其影響亦报 小。從此事實可知，壓力感測器41 3係可測定施加於縫隙 噴嘴41(流路410)之實際之壓力。 • 回到圖3，抗蝕劑供應機構6包含儲存抗蝕劑液之抗蝕劑 瓶60、將抗蝕劑液進行送液之泵61、作為抗蝕劑液之流路 的配管62、63、及閥64、65。 栗61係依據來自控制部8之控制信號而驅動，經由配管 62而將儲存於抗蝕劑瓶6〇内之抗蝕劑液進行抽吸，同時將 已抽吸之抗蝕劑液經由配管63而朝縫隙噴嘴4丨進行送液。 配管62係形成從抗蝕劑瓶6〇至泵6丨之間的抗蝕劑液之流 路，依照需要，藉由閥64而進行開閉。 又，配管63係與縫隙噴嘴41之流路41〇呈連通連接，依 121851.doc 14 1325339 照需要，藉由閥65而進行開閉。再者，在圖3中雖省略詳 細内谷，但在本實施型態、中之基板處理裝置1，在流路41〇 之Y軸方向之兩端部係連通連接著配管w，配管μ係形成 從系61至縫隙喷嘴4〗之間的抗蝕劑液之流路。 • 亦Ρ泵61係具有經由抗蝕劑液之第1流路（配管63)將 • 抗蝕劑液進行送液至縫隙喷嘴41内之流路410的功能，往 縫隙喷嘴4 1之抗㈣液的供應係從γ軸方向之兩端部施 • 行。再者，配管63與流路41〇之連接結構並不限定於Υ軸方 向之兩端部的連接，譬如，如為連接於中央部之結構亦 可〇 安裝於配管62之閥64係具有開閉配管62之功能，同樣 的，安裝於配管63之閥65係具有開閉配管63之功能。再 者，雖省略圖示，但閥64、65係藉由來自控制部8之控制 信號而開閉。 壓力感測器66、67係分別設置於配管62、63。此外，壓 鲁力感測器66、67係測定藉由泵6 !所送液之抗蝕劑液之壓力 並傳達至控制部8。 藉由以上構成，抗蝕劑供應機構6係依據來自控制部8之 控制信號而將閥64、65進行開閉，並同時驅動泵61。藉由 此方式，從抗蝕劑瓶60所抽吸之抗蝕劑液，係通過配管 62、63而被供應至縫隙喷嘴41之流路41〇。再者，已供應 至缝隙噴嘴41 (流路4 10)之抗蝕劑液，係通過流路4丨〇而被 從縫隙喷嘴41之噴出口 411噴出。 回到圖1及圖2，在本體2之保持面3〇，於保持區之（χ) 121851.doc 15 向側係叹有開口 32。開口 32係與縫隙喷嘴4i同樣，在γ 轴方向具有長邊方向，且該長邊方向長度係與縫隙喷嘴Μ 之長，方向長度約略相同。又，在開口32之下方的本體2 之内部，係設有喷嘴初期化機構7。此喷嘴初期化機構7係 在施行預備處理（如後述）之際使用，而該預備處理係在對 基板90之抗蝕劑液的塗佈之前所施行者。 圖5係顯示設於開口32内之噴嘴初期化機構7的詳細内容 之圖。喷嘴初期化機構7包含氣體供應機構71、排氣機構 72、預備塗佈機構73、噴嘴洗淨機構74及洗淨液供應機構 75 =者’以下’將縫隙喷嘴41之在圖5中以實線所示的 位置稱為「預備塗佈位置」。 在先前之基板處理裝¥φ 发置中亦包含，在對作為製品之基 板的塗佈處理之空妙 ^ 於將縫隙喷嘴進行初期化（洗淨 1之機構（相當於喷嘴初期化機構7之機構）。詳細内㈣ 2後所述，然而，本實施型態中之基板處理袭置1係將嗔 嘴:期化機構7作為用於取得塗佈處理之參數的機構而予 二兼用，藉由此方式’在抑制成本的同時，並實現塗佈處 理之正確控制與運算處理之抑制。 壁氣體供應機構71係從未圖示之鋼槪經由供應配管， s如將氮氣等惰性翁於祝 乳體供應至預備塗佈機構73之機 又，排氣機構72係經由妯# s _ 之管720’將預備塗佈機構乃 之匡體732内的氣體環垮 丄雄 展兄進仃抽吸排氣之機構。再者，就 此等之機構而言，可採用 a , 别起已為一般所知之機構。嬖 如，排氣機構72係可藉由 機構言 用具二產生裝置、壓縮機而得 121851.doc 以實現。 預備塗佈機構73包含旋轉機構730、滾筒731、筐體 732、除液刃板733'遮蔽刃板734及喷灑喷嘴735。 雖賓略詳細内容，但旋轉機構73〇係由產生旋轉驅動力 • <旋轉馬達及傳達該當旋轉驅動力之連杆構件等所構成之 .-_。藉由該當旋轉馬達所產生之旋轉驅動力係經由連杆 構件而傳達至滾筒73 !，在圖5中，滚筒73 i係往順時鐘方 φ 向旋轉。 圓筒狀之滾筒731，其圓筒面係構成塗佈面731&，而 其係在預備塗佈處理上被從縫隙喷嘴41塗佈抗姓劑液者； =圓筒中心係構成軸心73 lb。滾筒73】之軸心73 ^係以沿 著γ軸方向之方式配置。滾筒73i之軸心73ib係從旋轉機構 被傳達旋轉驅動力，藉由此方式，在圖5中，滾筒7” 係以軸心73 lb為中心，往順時鐘方向旋轉。 圖5所示般，筐體732係略箱狀之構件，其係配置為， • 從上面使滾筒731之—部分露出者。在筐體732之内部係儲 ^著適量之洗淨液，其係將滚筒731之塗佈面731&之一部 ”進订浸泡者。亦即，藉由旋轉機構73〇使滚筒731旋轉， 而使滾筒73 1之塗佈面73丨a浸泡於此儲存中之洗淨液。 又，塗佈面731a中之浸泡於洗淨液的部分，係藉由滾筒 7 3 1之$疋轉而從洗淨液被拉起。 如此方式般，在預備塗佈機構73，係藉由將滾筒乃丨之 塗佈面73 la次泡於洗淨液，而將塗佈於塗佈面73ι&之抗蝕 背J液予以洗淨除去。再者，就洗淨塗佈面乃h之機構而 121851.doc *17· 1325339 言，並不限定於此，譬如，在筐體732内設置朝塗佈面 731a喷出洗淨液之噴嘴亦可。-13- U25339 The force sensor 413 measures the pressure of the resist liquid in the pipe 42 and transmits it to the control unit 8. Further, the pressure sensor 413 may measure the air pressure in the pipe 42. That is, the pressure sensor 413 is mainly equivalent to the pressure measuring mechanism in the present invention. Further, a valve 4 1 4 is attached to the pipe 42 to open and close the pipe 42 in accordance with a control signal from the control unit 8. In the coating treatment or the like, when the resist liquid is ejected from the slit nozzle 41, the valve 4丨4 is closed. Fig. 4 is a view showing measured values of the pressure sensor 413 when the configuration of the supply flow path for supplying the resist liquid to the slit nozzle 41 is variously changed. The first to sixth structures in Fig. 4 correspond to the structures of the second to sixth structures shown in Fig. 4, respectively. As shown in Fig. 4, it is known from the measured values of the pressure sensor 413 that the difference in each structure is small, and even if the structure of the supply flow path changes, the influence is small. From this fact, it is understood that the pressure sensor 41 3 can measure the actual pressure applied to the slit nozzle 41 (flow path 410). Referring back to Fig. 3, the resist supply mechanism 6 includes a resist bottle 60 for storing a resist liquid, a pump 61 for supplying a resist liquid, and a pipe 62, 63 for a flow path of the resist liquid. And valves 64, 65. The pump 61 is driven by a control signal from the control unit 8, and the resist liquid stored in the resist bottle 6 is sucked through the pipe 62, and the sucked resist liquid is supplied through the pipe 63. The liquid is supplied to the slit nozzle 4丨. The pipe 62 forms a flow path of the resist liquid from the resist bottle 6 〇 to the pump 6 ,, and is opened and closed by the valve 64 as needed. Further, the pipe 63 is connected to the flow path 41A of the slit nozzle 41, and is opened and closed by the valve 65 as needed in accordance with 121851.doc 14 1325339. In addition, in the substrate processing apparatus 1 of the present embodiment, the pipe w is connected and connected to both ends of the flow path 41A in the Y-axis direction, and the pipe is connected. A flow path of the resist liquid between the system 61 and the slit nozzle 4 is formed. • The pump 61 has a function of supplying the resist liquid to the flow path 410 in the slit nozzle 41 via the first flow path (the pipe 63) of the resist liquid, and the resistance to the slit nozzle 4 (4) The supply of the liquid is performed from both ends of the γ-axis direction. Further, the connection structure between the pipe 63 and the flow path 41A is not limited to the connection at both end portions in the z-axis direction. For example, the valve 64 attached to the pipe 62 may be opened and closed as shown in the structure connected to the center portion. Similarly to the function of the pipe 62, the valve 65 attached to the pipe 63 has a function of opening and closing the pipe 63. Further, although not shown, the valves 64 and 65 are opened and closed by a control signal from the control unit 8. The pressure sensors 66 and 67 are provided in the pipes 62 and 63, respectively. Further, the pressure sensor 66, 67 measures the pressure of the resist liquid supplied by the pump 6 and transmits it to the control unit 8. According to the above configuration, the resist supply mechanism 6 opens and closes the valves 64 and 65 in accordance with a control signal from the control unit 8, and simultaneously drives the pump 61. In this manner, the resist liquid sucked from the resist bottle 60 is supplied to the flow path 41 of the slit nozzle 41 through the pipes 62 and 63. Further, the resist liquid supplied to the slit nozzle 41 (flow path 4 10) is ejected from the discharge port 411 of the slit nozzle 41 through the flow path 4丨〇. Referring back to Figures 1 and 2, at the holding surface 3 of the body 2, an opening 32 is slid to the side of the holding area (χ) 121851.doc. Similarly to the slit nozzle 4i, the opening 32 has a longitudinal direction in the γ-axis direction, and the length in the longitudinal direction is longer than that of the slit nozzle ,, and the direction length is approximately the same. Further, a nozzle initializing mechanism 7 is provided inside the main body 2 below the opening 32. This nozzle initializing mechanism 7 is used when performing preparatory processing (described later), and this preliminary processing is performed before the application of the resist liquid to the substrate 90. Fig. 5 is a view showing the details of the nozzle initializing mechanism 7 provided in the opening 32. The nozzle initializing mechanism 7 includes a gas supply mechanism 71, an exhaust mechanism 72, a preliminary coating mechanism 73, a nozzle cleaning mechanism 74, and a cleaning liquid supply mechanism 75 = "below" the slit nozzle 41 in Fig. 5 The position shown by the line is called "pre-coating position". Also included in the previous substrate processing package φ ing, the coating process for the substrate as a product is used to initialize the slit nozzle (the mechanism for cleaning 1 (corresponding to the nozzle initializing mechanism 7) In the detailed description (4), the substrate processing in the present embodiment is the same as the mechanism for obtaining the parameters of the coating process. In this way, while suppressing the cost, the correct control of the coating process and the suppression of the arithmetic processing are achieved. The wall gas supply mechanism 71 is supplied from a steel sill (not shown) via a supply pipe, such as an inert gas such as nitrogen. The milk is supplied to the pre-coating mechanism 73. Further, the exhaust mechanism 72 is used to pump the gas in the carcass 732 of the pre-coating mechanism via the tube 720' of the 妯# s _ The mechanism of the exhaust. Further, for such a mechanism, a can be used, and a mechanism that is generally known can be used. For example, the exhaust mechanism 72 can be powered by the mechanism and the compressor. Get 121851.doc to achieve. Pre-coating mechanism 73 The rotating mechanism 730, the drum 731, the casing 732, the liquid removing blade 733', the shielding blade 734, and the spray nozzle 735. Although the details of the details are given, the rotating mechanism 73 is driven by the rotational driving force. And a link member configured to transmit the rotational driving force, etc., by which the rotational driving force generated by the rotary motor is transmitted to the drum 73 through the link member, and in Fig. 5, the roller 73 i is Rotating toward the clockwise direction φ. The cylindrical drum 731 has a cylindrical surface that constitutes the coated surface 731 & and is coated with the anti-surname liquid from the slit nozzle 41 in the preliminary coating process; The center of the cylinder constitutes the axis 73 lb. The axis 73 of the drum 73 is arranged along the γ-axis direction. The axis 73ib of the drum 73i transmits a rotational driving force from the rotating mechanism, whereby In Fig. 5, the drum 7" is rotated clockwise about the axis 73 lb. As shown in Fig. 5, the casing 732 is a box-like member which is configured to: • make the drum 731 from above. Partially exposed. A proper amount of cleaning liquid is stored inside the casing 732. A portion of the coated surface 731 & amp of the roller 731 is stapled. That is, the roller 731 is rotated by the rotating mechanism 73, and the coated surface 73丨a of the roller 73 1 is immersed in the storage. Further, the portion of the coated surface 731a soaked in the cleaning liquid is pulled up from the cleaning liquid by the rotation of the drum 633. In this manner, the preliminary coating mechanism is used. 73. The anti-corrosion solution J coated on the coated surface 73i& is washed and removed by soaking the coating surface 73 la of the roller is applied to the cleaning liquid. Further, the coating is washed and removed. The cloth surface is a mechanism of h, and 121851.doc *17· 1325339 is not limited thereto. For example, a nozzle for discharging the cleaning liquid toward the application surface 731a may be provided in the casing 732.
在僮體732之内部係固設著除液刃板733。又，除液刃板 733係包含往Y軸方向呈略均一之板狀的刃板733&。刃板 733a係在被朝滾筒731之塗佈面731&約略按壓之狀態下， 往γ軸方向作均一抵接。在此狀態下，如滾筒73ι進行旋 轉’則刃板733a與塗佈面7化係作相對性移動，藉由刃板 733a而將塗佈面731a進行掃描。再者，—般而言在刃板 733a如作用部（抵接於塗佈面73丨a之部分）往長邊方向呈均 一即足夠，而該作用部係具有附著物之除去作用者。 精由此方式，刃板733a係將附著於塗佈面乃“之附著物 (殘存之抗#劑液、洗淨液等）予以刮除。如前述般，刃板 733a係對塗佈面731Μ±γ軸方向呈均一抵接，因此，可在 往Υ軸方向呈均一狀態下從塗佈面73丨a除去附著物，故可 提昇塗佈面731a之狀態的均一性。再者，刃板733a係以比A liquid removal blade 733 is fixed inside the body 732. Further, the liquid removing blade 733 includes a blade 733 & which is slightly uniform in the Y-axis direction. The blade 733a is uniformly abutted in the γ-axis direction while being pressed approximately toward the coated surface 731 & In this state, if the roller 73 is rotated, the blade 733a and the coating surface 7 are relatively moved, and the coated surface 731a is scanned by the blade 733a. Further, in general, it is sufficient that the blade 733a is uniform in the longitudinal direction such as the action portion (portion abutting against the coated surface 73丨a), and the action portion has a function of removing the adhering matter. In this way, the blade 733a scrapes off the adhering matter (the residual anti-agent solution, the cleaning solution, and the like) adhering to the coated surface. As described above, the blade 733a is applied to the coated surface 731Μ. Since the ±γ-axis direction is uniformly abutted, the deposit can be removed from the coated surface 73丨a in a uniform state in the z-axis direction, so that the uniformity of the state of the coated surface 731a can be improved. 733a
塗佈面73U硬度更低之材質’具體…係藉由樹脂或橡 膠等形成。 在筐體732之長邊方向的内側面，係設有氣體喷出口 732a。氣體喷出口 732以系沿著筐體乃2之長邊方向呈略均 一之縫隙形狀，且係成為將筐體732之側面構件予以貫通 之孔的内側開口部…在此貫通孔，係連通連接著= 供應機構71之供應配管71 〇。 藉由如此結構，Μ體732係經由供應配管71〇被從氣體供 應機構71供應惰性氣體（譬如，乾淨之氮氣），所供應之氮 12I85i.doc -18- 1325339 氣係攸氣體噴出口 732a朝滾筒731之塗佈面Mb，以往Y軸 方向呈均一狀態進行嗔出。藉由此方式，可促進附著於塗 佈面731a之洗淨液的乾燥，同時並提高塗佈面之在γ 軸方向之乾燥狀態的均一性。 • 筐體732之内部氣體環境係從設於筐體732之長邊方向的 内側面之抽吸〇 732b，經由排氣配管720，藉由排氣機構 72而進打抽吸排氣。藉由此方式，洗淨液之溶劑氣體環境 φ 係迅速被排氣，而促進附著於滚筒731之塗佈面731a之洗 淨液的乾燥。再者，在筐體732之内部，越靠近筐體732之 底部近旁則洗淨液的溶劑氣體環境濃度越高。因此，如圖 5所示般，在本實施型態中之基板處理裝置丨，係將抽吸口 732b設於低位置，藉由此方式，可將筐體乃2之内部的溶 劑成分以良好效率進行排氣。 又，當滾筒73 1以軸心73 lb為中心進行旋轉，則在筐體 732之内部，係以追蹤塗佈面731a之旋轉方向的方式，產 # 生朝縫隙喷嘴41流動之氣流。在此，筐體732之内部氣體 環境係浮游著造成微粒子之原因的污染物（洗淨液之溶劑 成分、除去後之抗蝕劑液等），此若朝縫隙噴嘴41流動則 並非理想。然而，在本實施型態中之基板處理裝置丨，係 將抽吸口 732b設於比氣體喷出口 732a更低之位置，藉由此 方式，在筐體732之内部，係形成往圖5之箭頭所示方向流 動之氣流。因此，可防止含有微粒子之原因物質的氣體環 境朝缝隙喷嘴41流動。 6支於盧體732之上部的遮蔽刃板734係接近（接近間隔j 121851.doc •19· 1325339 mm程度）滾筒731之塗佑 < 1佈面731a，且係以成為略水平方向 的方式所配置之板狀之構件^藉由如此之配置，遮蔽刀板 =係遮蔽：塗佈面73la中之未乾燥部分所暴露之氣體環 浼（在圖5中，存在於筐體732内部左側之氣體環境）、及縫 隙噴嘴41之先端部附近之氣體環境。藉由此方式，可更有 效防止含有洗淨液成分之氣體環境對縫隙喷嘴“之先端部 造成不良影響。The material having a lower hardness of the coated surface 73U is specifically formed of a resin or a rubber. A gas discharge port 732a is provided on the inner side surface of the casing 732 in the longitudinal direction. The gas discharge port 732 has a slightly uniform slit shape along the longitudinal direction of the casing 2, and is an inner opening portion of a hole through which the side member of the casing 732 is penetrated. = Supply piping 71 of supply organization 71 〇. With such a configuration, the body 732 is supplied with an inert gas (for example, clean nitrogen gas) from the gas supply mechanism 71 via the supply pipe 71, and the supplied nitrogen 12I85i.doc -18-1325339 gas system gas discharge port 732a The coated surface Mb of the drum 731 is ejected in a uniform state in the conventional Y-axis direction. By this means, the drying of the cleaning liquid adhering to the coating surface 731a can be promoted, and the uniformity of the dried state of the coated surface in the γ-axis direction can be improved. The internal gas atmosphere of the casing 732 is sucked and exhausted by the exhaust mechanism 72 through the exhaust pipe 720 from the suction side 732b provided on the inner side in the longitudinal direction of the casing 732. By this means, the solvent gas atmosphere φ of the cleaning liquid is quickly exhausted, and the cleaning of the cleaning liquid adhering to the coated surface 731a of the drum 731 is promoted. Further, in the inside of the casing 732, the solvent gas atmosphere concentration of the washing liquid is higher as it is near the bottom of the casing 732. Therefore, as shown in Fig. 5, in the substrate processing apparatus 本 in the present embodiment, the suction port 732b is set at a low position, whereby the solvent component inside the casing 2 can be made good. Efficiency is exhausted. Further, when the drum 73 1 is rotated about the axis 73 lb, the airflow flowing toward the slit nozzle 41 is generated inside the casing 732 so as to track the direction of rotation of the coated surface 731a. Here, the internal gas atmosphere of the casing 732 floats on the contaminants (solvent components of the cleaning liquid, the resist liquid after the removal, etc.) which cause the fine particles, and it is not preferable to flow into the slit nozzles 41. However, in the substrate processing apparatus 本 in the present embodiment, the suction port 732b is provided at a position lower than the gas ejection port 732a, and in this way, the inside of the casing 732 is formed in FIG. The airflow flowing in the direction indicated by the arrow. Therefore, the gas atmosphere of the substance containing the fine particles can be prevented from flowing toward the slit nozzle 41. The 6 shielding blades 734 on the upper part of the luer 732 are close to each other (close to the interval j 121851.doc • 19·1325339 mm). The roller 731 is coated with a < 1 cloth surface 731a, and is in a slightly horizontal direction. The plate-like member disposed is configured such that the shielding blade is shaded: the gas ring exposed by the undried portion of the coated surface 73la (in FIG. 5, present on the left side of the casing 732) The gas environment) and the gas environment in the vicinity of the tip end portion of the slit nozzle 41. In this way, it is possible to more effectively prevent the gas environment containing the components of the cleaning liquid from adversely affecting the tip end portion of the slit nozzle.
喷灑噴嘴73 5係沿著γ軸方向呈約略均一設置，將洗淨液 供應機構75所供應之洗淨液朝除液刃板733之刃板733&喷 出之噴嘴。藉由此方式，可從刃板733a把除液刃板733所 刮除之附著物持續洗去，故可防止附著物累積於刃板 73 3a。因此，藉由刃板733a之附著於塗佈面Mb之附著物 的除去，彳寸以尚效率施行。再者，喷灑噴嘴73 5所喷出之 洗淨液，係儲存於筐體732内部，而藉由未圖示之排出機 構所排出。 再者，如圖5所示般，在本實施型態中之基板處理裝置1 之預備塗佈機構73，係沿著滾筒73丨之塗佈面73 la之旋轉 方向（圖5之順時鐘方向），配置著縫隙噴嘴4丨、洗淨液積存 及氣體噴出口 732a。 噴嘴洗淨機構74係由驅動機構74〇、引導區塊74丨及待機 壺742所構成，具有將抗蝕劑液洗淨除去之功能，而該抗 姓劑液係藉由反覆施行本塗佈處理而附著於縫隙喷嘴4丨之 先端部側面者。 驅動機構740係使引導區塊741往Y軸方向移動之機構。 121851.doc -20- 就驅動機構740而言 一般直線運動機構。 可採用使用旋轉馬達與球狀螺絲之 引導區塊7 41係設署反 置為，藉由驅動機構740而可沿著鲦俺 噴嘴41之長邊方向、 。者縫1¾ (Y軸方向）移動。引導區塊741係將藉 洗淨液供應機構75所佴廄夕、土、盈、产± a β供應之洗淨液朝縫隙噴嘴4丨之先 噴出，並同時藉由駆叙地 ° 駆動機構74〇而進行移動， 式，將縫隙噴嘴41予以掃^。S由此方 丁从倖拖。稭由此方式，引導區塊74ι 係將縫隙喷嘴41之喷出口411之近旁奸洗淨。再者，縫 ㈣嘴41係在喷嘴洗淨處理前，先往特定之位置（以下， 私為「洗淨位置」）移動，在噴嘴洗淨處理時，係對位於 此洗淨位置之縫㈣嘴41施行藉由引導區塊741之掃描。 待機壺742係固定配置於引導區塊741之之約略正下方， :具有與·縫隙噴嘴41之長邊方向 < 寬度約略相同大小的略 相狀之構件。在待機壺742之内部，係儲存著抗蝕劑液之 溶劑。待機壺742係以如下方式設置之機構：在較長時間 未施行本塗佈處理之情形時，使縫隙噴嘴41之尤其在噴出 口 4 11之附近的抗蝕劑液不乾燥變質。 在待機壺742之上面，係設有用於將縫隙噴嘴41之先端 部插入内部的開口部742a。縫隙噴嘴41在待機中，係從洗 淨位置移動至更往Z轴方向下降之特定之位置（以下，稱為 「待機位置」）❶當缝隙喷嘴41位於此待機位置時，縫隙 噴嘴41之先端部係成為從開口部742a插入待機壺742之内 部的狀態’藉由暴露於溶劑氣體環境而抑制抗蝕劑液之乾 燥。 121851.doc -21 - jjy 至® 1 ’控制部8係在内部包含：運算部8〇，其係遵照 夂L iτ處理各種貝料者；及記1:1'部81，其係保存程式及 資料者。又’在前面，包含：操作部Μ，其係用於讓 ^乍者對基板處理裝置！進行輸人必要之指令者；及顯示 4 83 ’其係顯示各種資料者。 控制部8係藉由在圖^未圖示之連接線而與附屬於本體 2之，機構呈電性連接。控制部8係根據來自操作部Μ之輸 入信號、或來自塵力感測器413、“、⑺等之信號而進 行控制藉由昇降機構43、44之昇降動作、藉由行走機· 之仃走動作、藉由抗蝕劑供應機構6之之抗蝕劑液的供應 動作，進而進行控制附隨於喷嘴初期化機構7及預備塗佈 機構73之各驅動機構、各旋動機構及各閥等的動作。尤 其，控制部8係具有作為本發明中之移動控制機構及送液 控制機構之功能，而該等之功能係如後所述。 又，將資料作一時性記憶之RAM、讀取專用之驗及 磁性碟片裝置等係該當於記憶部81。或是，如為可攜式光 磁性碟Μ、記憶切記㈣體及該等之讀取裝置亦可。 又’按鍵及開關類（含鍵盤、滑鼠等）等係該當於操作部 82 ,但如為點觸式面板顯示器般兼具有顯示部w之功能者 亦可。液晶顯示器、各種指示燈等係該當於顯示部二 以上’係本實施型態中之基板處理裝置ι之構成及功能 的說明。接著，針對基板處理裝置丨之動作作說明。 圖6係顯示基板處理裝置!之動作的流裎圖。基板處理裝 置1係當電源接通，在施行特定之初期設定後，執行預備 l2I85I.doc -22- 1325339 塗佈處理（步驟sil)。 圖7及圖8係顯示基板處理裝置丨之控制值取得處理之詳 細内谷的机耘圖。在控制值取得處理，首先，縫隙喷嘴* ^ 往洗淨位置移動，施行藉由引導區塊74丨之掃描，施行對 缝隙喷嘴4 1之洗淨處理（步驟S2 j )。 當洗淨處理結束，則在昇降機構43、44及行走機構5使 縫隙喷嘴41往預備塗佈位置移動的同肖，壓力感測器“係 開始進行壓力的測定（步驟S22)。 S縫隙噴嘴41往預備塗佈位置移動，則預備塗佈機構73 之旋轉機構730係開始進行驅動，滾筒731開始進行旋轉。 與此動作並行，抗姓劑供應機構之閱64、65係成為開放狀 態’泵61被焉區動。冑㈣被驅動，則抗蚀劑液被供應至縫 隙噴嘴41，從喷出口 411喷出而塗佈於滾筒731之塗佈面 7 3 1 a 〇 藉由此等一連之動作，而開始進行藉由預備塗佈機構乃 之預備塗佈（步驟S23)，藉由壓力感測器66，而測定該期 間之壓力並傳達至控制部8。亦即，#由壓力感測器“， 而進行觀測驅動開始時之泵61之舉動。 從藉由步驟S23而開始進行預備塗佈起，在經過特定之 時間後，抗蝕劑供應機構6係將泵61停止（步驟S24)。藉由 此方式’預備塗佈係暫時停止。 接著，控制部8係根據壓力感測器66所傳達之測定值， 而設定驅動開始時之泵61的控制值（參數）（步驟s25)。詳細 内容雖省略’但控制值㈣定為不產生超越量且盡可能在 I2I85I.doc •23- 1325339 短時間内穩定於所期望之喷出流量。 在本實施型態中’係使用泵6丨之驅動速度值作為控制 值，當然不限定於此。又，控制部8係根據已設定之控制 值而進行控制後述之塗佈處理之系6 j。 如此方式般’藉由執行步驟S22至步驟S25之處理，控制 部8係根據將抗蝕劑液塗佈於預備塗佈機構73之際之壓力 感測器66的測定結果，而進行控制將抗蝕劑液塗佈於基板 90之際的泵6 1。亦即，如前述般，控制部8係具有作為本 發明中之送液控制機構的功能。 圖9係將泵61之喷出流量與以壓力感測器413、66、67分 別測定之測定值之關係進行例示之圖。從圖9可知，壓力 之測定值係因測定之位置而參差不齊，因此依據目的而決 定該測定何位置極為重要。 在此’因壓力感測器66係配置於泵6丨的較為近旁（配管 62) ’故可正確觀測泵6丨之舉動。因此’基板處理裝置1可 將對系61之控制值決定為更適切之值。再者，為了設定控 制值’亦可構成為’在進行變更該當控制值的同時並反覆 施行複數次步驟S22至步驟S24之處理。 當已設定栗6 1之控制值，則在開始進行藉由壓力感測器 4 13之壓力測定的同時（步驟S31)，預備塗佈機構73之旋轉 機構730開始進行驅動，滾筒731開始進行旋轉◊與此動作 並灯，抗蝕劑供應機構之閥64、65成為開放狀態，泵6 j係 根據在步驟S25所設定之控制值而被驅動。當泵61被驅 動’則抗钱劑液被供應至缝隙噴嘴4〗，從喷出口 4〗丨喷 121851.doc -24- 出’而塗佈於滾筒731之塗佈面731a。 " 等連之動作，而開始進行藉由預備塗佈機構73 之預備塗佈（步驟S32)，藉由壓力感測器413、67,而測.定 該期間之壓力並傳達至控制部8。在此時之預備塗佈，因 • 》61之控制值係成為塗佈處理之控制值，故泵61之舉動係 成為將塗佈處理之實際的舉動予以重現者。 從開始進行藉由步驟S32之預備塗佈起，在經過特定之 • 時間後，抗蝕劑供應機構6係將泵61停止（步驟S33)。控制 部8係根據此期間之壓力感測器4 i 3之測定值而設定行走機 構5之控制值（步驟S34) » 圖10係㈣力感測H 413之敎值與時間之關係進行例 示之圖。在圖10中，係將壓力感測器67之測定值用虛線表 不，以作為參考。又，在圖丨〇所示之例中，泵6丨係在從藉 由壓力感測器41 3之測定開始起經過〇5 (sec)後，開始進行 驅動。 Φ 设於縫隙喷嘴41之一次側之壓力感測器67的測定值，係 從泵61之驅動開始起延遲丨8 (msec)開始進行上昇。另一方 面，設於縫隙噴嘴41之二次側之壓力感測器413的測定 值，係從泵61之驅動開始起延遲38 (msec)開始進行上昇。 從縫隙喷嘴41之喷出口 411的抗钱劑液的喷出，係藉由 流路410中之壓力上昇而開始進行。因此，從圖丨〇之例可 知，即使縫隙喷嘴41之一次側之壓力開始進行上昇，在此 時點，來自縫隙噴嘴41之喷出並不開始進行。此係起因 於：藉由設於縫隙喷嘴W之一次側之過濾器（未圖示）、閥 121851.doc -25- 1325339 65等而造成供應流路内之壓力損失。 因此，如先前般，根據縫隙喷嘴之一次側之壓力的測定 值’而將難噴嘴之掃描予以控帝】（進行控㈣走機構）的 情形時，必須藉由預測此一延遲（在圖1〇所示之例為 msec之延遲）而作修正並進行控制才行，因而有精度下降 的問題。 然而，在基板處理裝置丨，係藉由將壓力感測器413設於 缝隙噴嘴4 1之二次側（配管42)，而可測定約略相當於流路 4 10之壓力之值，故·可正確掌握縫隙喷嘴41之噴出狀態。 因此，控制部8係可適切進行設定塗佈處理之行走機構5之 控制值。再者，本實施型態中之控制部8，係以如下方式 設定行走機構5之控制值：使行走機構5之速度曲線跟隨藉 申壓力感測器413之測定值的上昇曲線。 當已設定行走機構5之控制值，則基板處理裝置丨係在執 行喷嘴初期化處理（步驟S35)後，結束控制值取得處理， 而返回圖6所示之處理。 再者，雖未作詳細說明，但喷嘴初期化處理係指，首 先，使縫隙噴嘴41移動至洗淨位置並作洗淨後，藉由預備 塗佈機構73施行預備塗佈處理。此預備塗佈處理係在縫隙 噴嘴41之噴出口 411附近形成抗蝕劑液之積存液的處理。 接著，其後’使缝隙喷嘴41移動至待機位置，而結束喷嘴 初期化處理。 回到圖6，當結束控制值取得處理，則基板處理裝置 進行待機直到基板90被搬入為止（步驟s 12) ^當基板9〇被The spray nozzles 73 5 are arranged approximately uniformly in the γ-axis direction, and the cleaning liquid supplied from the cleaning liquid supply mechanism 75 is sprayed toward the nozzles of the blade 733 & By this means, the adhering matter scraped off by the liquid removing blade 733 can be continuously washed away from the blade 733a, so that the deposit can be prevented from accumulating on the blade 73 3a. Therefore, the removal of the adhering matter attached to the coated surface Mb by the blade 733a is performed efficiently. Further, the washing liquid sprayed from the spray nozzle 73 5 is stored in the inside of the casing 732, and is discharged by a discharge mechanism (not shown). Further, as shown in Fig. 5, the preliminary coating mechanism 73 of the substrate processing apparatus 1 in the present embodiment is along the rotation direction of the coated surface 73 la of the drum 73 (the clockwise direction of Fig. 5). The slit nozzle 4, the cleaning liquid, and the gas discharge port 732a are disposed. The nozzle cleaning mechanism 74 is composed of a driving mechanism 74A, a guiding block 74, and a standby pot 742, and has a function of washing and removing the resist liquid, and the anti-surname liquid is repeatedly applied by the coating. The treatment is attached to the side of the tip end portion of the slit nozzle 4丨. The drive mechanism 740 is a mechanism that moves the guide block 741 in the Y-axis direction. 121851.doc -20- Generally linear motion mechanism for drive mechanism 740. The guide block 7 41 using a rotary motor and a ball screw can be reversed by the drive mechanism 740 along the longitudinal direction of the 喷嘴 nozzle 41. The slot 13b (Y-axis direction) moves. The guiding block 741 ejects the cleaning liquid supplied by the cleaning liquid supply mechanism 75, which is supplied by the soil, the profit, and the production ± a β, toward the slit nozzle 4, and at the same time, by means of the tilting mechanism When 74 〇 is moved, the slit nozzle 41 is swept. S is thus fortunately dragged. In this manner, the guiding block 74ι cleans the vicinity of the discharge port 411 of the slit nozzle 41. Further, the slit (four) nozzle 41 is moved to a specific position (hereinafter, "private position") before the nozzle cleaning process, and the seam located at the washing position is used in the nozzle cleaning process (four) The mouth 41 is scanned by the guide block 741. The standby pot 742 is fixedly disposed approximately below the guide block 741, and has a slightly-shaped member having a size approximately the same as the longitudinal direction of the slit nozzle 41. Inside the standby kettle 742, a solvent for the resist liquid is stored. The standby pot 742 is a mechanism that is provided in such a manner that the resist liquid of the slit nozzle 41, particularly in the vicinity of the discharge port 41, is not dried and deteriorated when the coating treatment is not performed for a long period of time. On the upper surface of the standby kettle 742, an opening portion 742a for inserting the tip end portion of the slit nozzle 41 into the inside is provided. When the slit nozzle 41 is in standby, it moves from the cleaning position to a specific position (hereinafter referred to as "standby position") which is lowered in the Z-axis direction. When the slit nozzle 41 is located at the standby position, the tip end of the slit nozzle 41 The part is inserted into the inside of the standby pot 742 from the opening 742a. The drying of the resist liquid is suppressed by exposure to a solvent gas atmosphere. 121851.doc -21 - jjy to ® 1 'The control unit 8 internally includes: a calculation unit 8A, which processes various kinds of materials according to 夂L iτ; and a 1:1' part 81, which is a program and Information. In addition, in the front, it includes: an operation unit, which is used to allow the substrate to be processed by the substrate! Those who are required to enter the necessary instructions; and those who display 4 83 '' The control unit 8 is electrically connected to the main body 2 by a connecting wire (not shown). The control unit 8 controls the movement of the lift mechanism 43 and 44 based on the input signal from the operation unit 或 or the signals from the dust force sensor 413, “, (7), etc., by the traveling machine. The operation and the supply operation of the resist liquid by the resist supply mechanism 6 further control the drive mechanisms, the respective rotation mechanisms, the valves, and the like that are attached to the nozzle initializing mechanism 7 and the preliminary coating mechanism 73. In particular, the control unit 8 has functions as a movement control mechanism and a liquid supply control mechanism in the present invention, and the functions are as described later. Further, the data is temporarily stored in RAM and read. The special inspection and magnetic disc device should be in the memory unit 81. Alternatively, it can be a portable optical magnetic disk, a memory memory (four) body, and the like. The keyboard, the mouse, and the like may be used in the operation unit 82. However, the function of the display unit w may be the same as that of the touch panel display. The liquid crystal display and various indicator lights may be two or more on the display unit. 'Based in the substrate of this embodiment Description of the configuration and function of the processing device 。 Next, the operation of the substrate processing apparatus 丨 will be described. Fig. 6 is a flow chart showing the operation of the substrate processing apparatus! The substrate processing apparatus 1 is configured to be powered when the power is turned on. After the initial setting, the preparatory l2I85I.doc -22-1325339 coating process (step sil) is performed. Fig. 7 and Fig. 8 are machine diagrams showing the details of the control value acquisition process of the substrate processing apparatus. To obtain the processing, first, the slit nozzle *^ is moved to the washing position, and the cleaning of the slit nozzle 41 is performed by the scanning of the guiding block 74 (step S2 j ). When the washing process is finished, The elevating mechanisms 43 and 44 and the traveling mechanism 5 move the slit nozzle 41 to the preliminary application position, and the pressure sensor "measures the pressure measurement (step S22). When the S-slot nozzle 41 moves to the preliminary application position, the rotation mechanism 730 of the preliminary coating mechanism 73 starts driving, and the drum 731 starts to rotate. In parallel with this action, the anti-surname agent supply unit 64, 65 is in an open state, and the pump 61 is moved. When the crucible (four) is driven, the resist liquid is supplied to the slit nozzle 41, and the coating surface 7 3 1 a which is ejected from the ejection port 411 and applied to the drum 731 is started to be borrowed. The pre-coating mechanism is pre-coated (step S23), and the pressure of the period is measured by the pressure sensor 66 and transmitted to the control unit 8. That is, the action of the pump 61 at the start of the observation drive is performed by the "pressure sensor". From the start of the preliminary coating by the step S23, after a certain period of time, the resist supply mechanism 6 is attached. The pump 61 is stopped (step S24). In this way, the preparatory coating system is temporarily stopped. Next, the control unit 8 sets the control value of the pump 61 at the start of driving based on the measured value transmitted from the pressure sensor 66. (Parameter) (Step s25). Although the details are omitted, the control value (4) is set to not generate the overshoot and is as stable as possible to the desired discharge flow rate in the short period of time I2I85I.doc •23-1325339. In the state of the present invention, the driving speed value of the pump 6 is used as the control value, and the control unit 8 is not limited to this. Further, the control unit 8 controls the coating processing 6 to be described later based on the set control value. By performing the processing of steps S22 to S25, the control unit 8 controls the resist liquid based on the measurement result of the pressure sensor 66 when the resist liquid is applied to the preliminary coating mechanism 73. Pump 6 applied to substrate 90 1. That is, as described above, the control unit 8 has a function as the liquid supply control unit in the present invention. Fig. 9 is a measurement of the discharge flow rate of the pump 61 and the pressure sensors 413, 66, and 67, respectively. The relationship between the measured values is illustrated. As can be seen from Fig. 9, the measured value of the pressure is uneven due to the position of the measurement. Therefore, it is extremely important to determine the position of the measurement according to the purpose. Here, the pressure sensor 66 is used. It is disposed near the pump 6丨 (pipe 62). Therefore, the behavior of the pump 6丨 can be correctly observed. Therefore, the substrate processing device 1 can determine the control value of the pair 61 to a more appropriate value. The value 'may also be configured as 'the process of changing the control value while repeating the plurality of steps S22 to S24. When the control value of the pump 6 is set, the pressure sensor 4 13 is started. At the same time as the pressure measurement (step S31), the rotation mechanism 730 of the preliminary coating mechanism 73 starts driving, the roller 731 starts to rotate, and the operation is performed, and the valves 64 and 65 of the resist supply mechanism are opened, and the pump is opened. 6 j series It is driven according to the control value set in step S25. When the pump 61 is driven, the anti-money agent liquid is supplied to the slit nozzle 4, and is sprayed from the discharge port 4 by spraying 121851.doc -24- On the coated surface 731a of the drum 731, the pre-coating by the preliminary coating mechanism 73 is started (step S32), and the pressure sensor 413, 67 is used for measurement. The pressure during the period is transmitted to the control unit 8. At this time, the control value of the "61" is the control value of the coating process, so the behavior of the pump 61 is the actual behavior of the coating process. The reappearer starts from the preliminary coating of step S32, and after a certain period of time elapses, the resist supply mechanism 6 stops the pump 61 (step S33). The control unit 8 sets the control value of the traveling mechanism 5 based on the measured value of the pressure sensor 4 i 3 during this period (step S34) » FIG. 10 is an illustration of the relationship between the value of the force sensing H 413 and time. Figure. In Fig. 10, the measured value of the pressure sensor 67 is indicated by a broken line as a reference. Further, in the example shown in Fig. ,, the pump 6 is driven to start after 〇 5 (sec) from the start of the measurement by the pressure sensor 41 3 . Φ The measured value of the pressure sensor 67 provided on the primary side of the slit nozzle 41 starts to rise from the start of the driving of the pump 61 by the delay 丨8 (msec). On the other hand, the measured value of the pressure sensor 413 provided on the secondary side of the slit nozzle 41 starts to rise from the start of driving of the pump 61 by a delay of 38 (msec). The discharge of the anti-money solution from the discharge port 411 of the slit nozzle 41 is started by the pressure rise in the flow path 410. Therefore, as is apparent from the example of the figure, even if the pressure on the primary side of the slit nozzle 41 starts to rise, at this point, the discharge from the slit nozzle 41 does not start. This is caused by a pressure loss in the supply flow path by a filter (not shown) provided on the primary side of the slit nozzle W, a valve 121851.doc -25 - 1325339 65 or the like. Therefore, as before, according to the measured value of the pressure on the primary side of the slit nozzle, the scanning of the difficult nozzle is controlled (in the case of controlling (four) walking mechanism), it is necessary to predict this delay (in Figure 1). The example shown in 〇 is the delay of msec and is controlled and controlled, so there is a problem that the accuracy is lowered. However, in the substrate processing apparatus, the pressure sensor 413 is provided on the secondary side (the pipe 42) of the slit nozzle 41, and the value corresponding to the pressure of the flow path 4 10 can be measured. The discharge state of the slit nozzle 41 is correctly grasped. Therefore, the control unit 8 can appropriately control the value of the traveling mechanism 5 that sets the coating process. Further, in the control unit 8 of the present embodiment, the control value of the traveling mechanism 5 is set such that the speed curve of the traveling mechanism 5 follows the rising curve of the measured value by the pressure sensor 413. When the control value of the traveling mechanism 5 is set, the substrate processing apparatus performs the nozzle initialization processing (step S35), and ends the control value acquisition processing, and returns to the processing shown in Fig. 6 . Further, although not described in detail, the initializing of the nozzle means that the slit nozzle 41 is first moved to the washing position and washed, and then the preliminary coating process is performed by the preliminary coating mechanism 73. This preliminary coating treatment is a process of forming a reservoir of the resist liquid in the vicinity of the discharge port 411 of the slit nozzle 41. Then, the slit nozzle 41 is moved to the standby position, and the nozzle initializing process is ended. Referring back to Fig. 6, when the control value acquisition processing is ended, the substrate processing apparatus waits until the substrate 90 is carried in (step s 12).
121851.doc -26- 入則執行塗佈處理（步驟S 13)。 當開私、^:- 移動1仃塗佈處理，首先，行走機構5係使架橋結構4 43、知仃基板90上之塗佈處理的位置，同時昇降機構 係將縫隙噴嘴41之高度調節至特定之高度。 〜 位置調整結束，抗蝕劑供應機構0隨即開始進 隙噴嘴41之抗蝕劑液的供應。此時，泵61係藉由控 ' 根據於步驟S25所設定之控制值而被進行控制。 者藉由行走機構5將架橋結構4移動，而施行往基板 心抗钱劑液的塗佈（亦即，塗佈處理）。此時，行走機構5 係稭由控制部8，根據於步驟S34所設定之控制值而被進行 控制。 當結束對1片基板90之塗佈處理，則再度執行噴嘴初期 處理（v驟S 14)，並進行判定針對全部基板9〇處理是否 已經結束（步驟S15)e如仍殘留應處理之基板90之情形 時，則回到步驟S12反覆進行處理，如為針對全部基板90 處理已經結束之情形時，則將處理予以結束。 如上述般，在基板處理裝置丨，係在與縫隙喷嘴4丨内之 流路410作直接連通之配管42設置壓力感測器413，並根據 該當壓力感測H4 13之測定結果而控制行走機構5 ,藉由此 方式，可正確測定抗蝕劑液之喷出狀態，而壓力感測器 413係與用於把抗蝕劑液送液至缝隙噴嘴“的配管63呈獨 立設置者。因此’可正確控制行走機構5。 又，根據將抗蝕劑液塗佈於預備塗佈機構73之際的壓力 感測器413之測定結杲，而控制將抗蝕劑液塗佈於基板9〇 121851.doc 1325339 之際的行走機構5，藉由此方式，則可無須將各塗佈處理 進行每次測定，故可控制運算處理量。 又’包含壓力感測器66，根據將抗蝕劑液塗佈於預備塗 佈機構7 3之際的壓力感測器6 6之測定結果，而控制將抗钱 劑液塗佈於基板90之際的聚61 ’藉由此方式，則可將栗61 作正確控制，而壓力感測器66係測定藉由泵6 1而被進行送 液之抗蝕劑液的壓力者。因此，可更提昇塗佈處理之精 度。 又，就設置壓力感測器4 1 3之二次側流路而言，藉由使 用用於從縫隙噴嘴4 1之内部將空氣排除之配管42，而無須 另外設置用於安裝壓力感測器41 3之流路。 再者’在上述實施型態中，雖未作詳細說明，但係將塗 佈處理之壓力感測器6 6 ' 6 7作為用於檢測栗6 1之異常（嬖 如’脈動等）的監視感測器使用。藉由此方式，基板處理 裝置1無須另外設置檢測感測器，而可進行檢測塗佈處理 之異常。 <2.第2實施型態> 在第1實施型態，非僅泵6 1之控制值且行走機構5之控制 值亦在控制值取得程序（步驟S11)上進行設定。亦即，行走 機構5之控制值亦在塗佈處理之前已預先進行設定。 然而’在塗佈處理（步驟S13)，如以如下方式控制行走 機構5亦可：一直施行藉由壓力感測器4丨3之測定，在塗佈 開始時追蹤此測定值。亦即，每當執行塗佈處理，則依據 壓力感測器41 3之測定結果而控制行走機構5亦可。 I2I851.doc -28- < S ) 1325339 藉由如此之構成，亦可獲得與第1實施型態同樣的效果。 <3.變形例> 以上’針對本發明之實施型態作了說明，但本發明並不 限定於上述實施型態而可作各種變形。 -* 譬如，在上述實施型態中係說明，每當結束對1片基板 . 處理則執行贺嘴初期化處理，然而，執行噴嘴初期 化處理的時點並不限定於此，譬如，每當結束特定之片數 φ 則鈿行亦可，每當經過特定之時間則施行亦可。或是，依 據來自操作者之指令而施行亦可。 又，上述實施型態所示之各程序係例示，並不受限於此 處所不之内容及順序，如可獲得同樣之效果，則將内容或 順序作適宜變更亦可。 【圖式簡單說明】 圖1係顯示與本發明有關之基板處理裝置之概略的立體 圖。 • 圖2係顯不基板處理裝置之本體之側剖面及與抗蝕劑液 之塗佈動作有關之主要構成要素之圖。 圖3係顯示縫隙噴嘴與抗蝕劑供應機構之圖。 圖4係顯示把對縫隙噴嘴供應抗蝕劑液之供應流路之結 構作各種變化時之壓力感測器的測定值之圖。 圖5係顯示設於開口内之噴嘴初期化機構的詳細内容之 圖。 圖6係顯示基板處理裝置之動作的流程圖。 圖7係顯示基板處理裝置之控制值取得處理之詳細内容 121851.doc •29- 丄 的流程圖。 圖_&基板處理裝置之控制值取得處理 的流程圖》 f、.，田η夺 圖9係將泵之喷出流量與以壓力感測器分別測定之測定 • 值之關係進行例示之圖。 . 圖1Q係、將壓力感測器之測定值與時間之關係、進行例示之 圖0 • 圖11係顯示使供應流路之結構作各種變化時之設於縫隙 噴嘴之一次側的壓力感測器之測定值之圖。 【主要元件符號說明】 1 基板處理裝置 41 縫隙喷嘴 410 流路 411 喷出口 42, 62, 63 配管 66, 67, 413 壓力感測器 5 行走機構 50, 51 線性馬達 6 抗蝕劑供應機構 61 泵 73 預備塗佈機構 8 控制部 90 基板 121851.doc -30-121851.doc -26- Then the coating process is performed (step S13). When the opening and closing process is performed, first, the traveling mechanism 5 is used to fix the position of the coating structure on the bridging structure 4 43 and the substrate 90, and the lifting mechanism adjusts the height of the slit nozzle 41 to Specific height. ~ When the position adjustment is completed, the resist supply mechanism 0 starts the supply of the resist liquid to the slit nozzle 41. At this time, the pump 61 is controlled by the control based on the control value set in step S25. The bridge structure 4 is moved by the traveling mechanism 5, and application to the substrate anti-money solution (i.e., coating treatment) is performed. At this time, the traveling mechanism 5 is controlled by the control unit 8 based on the control value set in step S34. When the coating process for the one substrate 90 is completed, the initial nozzle processing is again performed (v step S 14), and it is determined whether or not the processing for all the substrates 9 is completed (step S15) e if the substrate 90 to be processed remains. In the case of the case, the process returns to step S12 to repeat the process. If the processing for all the substrates 90 has ended, the process is terminated. As described above, in the substrate processing apparatus, the pressure sensor 413 is provided in the pipe 42 which is in direct communication with the flow path 410 in the slit nozzle 4, and the traveling mechanism is controlled based on the measurement result of the pressure sensing H4 13 5. In this way, the discharge state of the resist liquid can be accurately measured, and the pressure sensor 413 is independently provided with the piping 63 for supplying the resist liquid to the slit nozzle. The traveling mechanism 5 can be accurately controlled. Further, the resist liquid is applied to the substrate 9 〇 121851 based on the measurement of the pressure sensor 413 when the resist liquid is applied to the preliminary coating mechanism 73. In the case of the traveling mechanism 5 at the time of .doc 1325339, it is possible to control the amount of calculation processing without having to perform each measurement process for each coating process. Further, the pressure sensor 66 is included, and the resist liquid is used. By measuring the measurement results of the pressure sensor 66 applied to the preliminary coating mechanism 713, and controlling the poly 61' when the anti-money solution is applied to the substrate 90, the pump 61 can be used. For proper control, the pressure sensor 66 is measured by the pump 6 1 The pressure of the liquid resist liquid is supplied. Therefore, the precision of the coating process can be further improved. Further, in order to provide the secondary side flow path of the pressure sensor 4 1 3, by using the gap for use in the gap The inside of the nozzle 41 is provided with a pipe 42 for removing air, and there is no need to separately provide a flow path for mounting the pressure sensor 41 3. Further, in the above embodiment, although not described in detail, it is coated. The processed pressure sensor 6 6 ' 6 7 is used as a monitoring sensor for detecting an abnormality (such as 'pulsation, etc.) of the pump 6 1. By this means, the substrate processing apparatus 1 does not need to additionally provide a detecting sensor In addition, the abnormality of the coating process can be detected. <2. Second embodiment> In the first embodiment, the control value of the pump 6 is not only the control value of the pump 6 but also the control value acquisition program. The setting is performed in step S11. That is, the control value of the traveling mechanism 5 is also set in advance before the coating process. However, in the coating process (step S13), the traveling mechanism 5 can be controlled as follows: Always performed by the pressure sensor 4丨3, at the beginning of coating The measured value is tracked. That is, each time the coating process is performed, the traveling mechanism 5 can be controlled according to the measurement result of the pressure sensor 41 3. I2I851.doc -28- < S ) 1325339 The same effect as that of the first embodiment can be obtained. <3. Modifications> The above description has been made on the embodiments of the present invention, but the present invention is not limited to the above-described embodiments and can be variously used. For example, in the above-described embodiment, the process of initializing the nozzle is performed every time the processing of one substrate is completed. However, the timing at which the nozzle initializing process is performed is not limited thereto, for example, each When the specific number of pieces φ is ended, it may be performed, and it may be performed every time a specific time passes. Or, depending on the instructions from the operator. Further, the respective programs shown in the above embodiments are not limited to the contents and the order of the places, and the same effects may be obtained, and the contents or the order may be appropriately changed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the outline of a substrate processing apparatus according to the present invention. Fig. 2 is a view showing a side cross section of the main body of the substrate processing apparatus and main components related to the coating operation of the resist liquid. Fig. 3 is a view showing a slit nozzle and a resist supply mechanism. Fig. 4 is a graph showing the measured values of the pressure sensor when the structure of the supply flow path for supplying the resist liquid to the slit nozzle is variously changed. Fig. 5 is a view showing the details of the nozzle initializing mechanism provided in the opening. Fig. 6 is a flow chart showing the operation of the substrate processing apparatus. Fig. 7 is a flow chart showing the details of the control value acquisition processing of the substrate processing apparatus 121851.doc • 29- 。. FIG. 1 is a flow chart showing the control value acquisition processing of the substrate processing apparatus. f, . . Fig. 1Q shows the relationship between the measured value of the pressure sensor and time, and is illustrated in Fig. 0. Fig. 11 shows the pressure sensing provided on the primary side of the slit nozzle when the structure of the supply flow path is changed variously. A plot of the measured value of the device. [Description of main components] 1 substrate processing apparatus 41 slit nozzle 410 flow path 411 discharge port 42, 62, 63 piping 66, 67, 413 pressure sensor 5 traveling mechanism 50, 51 linear motor 6 resist supply mechanism 61 pump 73 Preparation Coating Mechanism 8 Control Unit 90 Substrate 121851.doc -30-