JP2014103258A - Liquid discharge device, spray path setting method and program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To precisely discharge an application liquid to a processing object such as a circuit board.SOLUTION: A liquid discharge device comprises: a nozzle for discharging an application liquid in a fan shape or a conical shape; a needle for discharging the application liquid in a filament shape; and move means for moving the nozzle and the needle. Spray path setting processing is then performed for setting spray paths (a nozzle path and a needle path) which are moving paths of the nozzle and the needle during application work, with respect to an application processing object, and the application liquid is discharged to the application processing object while moving the nozzle and the needle by means of the move means on the basis of the set spray paths. In such a case, the nozzle path including a discharge moving path excluding at least a first application inhibition area and a non-discharge moving path in accordance with the setting of a nozzle moving height is set for the nozzle, and the needle path including a discharge moving path excluding at least a second application inhibition area and a non-discharge moving path in accordance with the setting of a needle moving height is set for the needle.

Description

  The present invention relates to a liquid ejection apparatus that ejects a spray pattern in order to coat a processing target such as an electronic circuit board with a thin film such as a protective film.

Japanese Patent Publication No. 6-59451

An electronic circuit board or the like is coated with a thin film serving as a protective film for the purpose of moisture proofing and rust prevention.
For example, Patent Document 1 discloses an apparatus for discharging a coating liquid.

By the way, when coating an electronic circuit board or the like, it is required that the coating film be formed with a uniform thickness as much as possible, and that the film can be formed efficiently. In particular, when there are a portion to be coated and a portion not to be coated on the object to be treated, it is also important to control the application position of the coating agent.
Accordingly, an object of the present invention is to enable efficient and accurate coating in a liquid ejection apparatus.

The liquid discharge device of the present invention is a nozzle that discharges the application liquid in a fan shape or a conical shape, a needle that discharges the application liquid in a thin line shape, a moving means that moves the nozzle and the needle, and an object to be processed. While performing a spray path setting process for setting a spray path that is a movement path during the application operation of the nozzle and the needle, the application means while moving the nozzle and the needle by the moving means based on the set spray path And control means for executing discharge of the coating liquid onto the processing object. The control means includes, as the spray path setting process, a process for capturing an object image to be applied, a process for setting a nozzle movement height that is a height position when the nozzle is not ejected, and a non-ejection of the needle. A process of setting a needle movement height which is a height position at the time of movement, a process of setting a first application prohibited area for the nozzle on the application process object image, and a process on the application process object image In the process of setting the second application prohibited area for the needle and the spray path for the nozzle, the discharge movement path excluding at least the first application prohibited area and the nozzle movement height are set. As a process of creating a nozzle path including the non-ejection movement path according to the above, and the spray path for the needle, the second application prohibited area is at least And a process of creating a needle path including the non-ejection movement path in accordance with the setting of the ejection movement path and the needle moves height excluding.
By having the nozzle that discharges the application liquid in a fan shape or a conical shape and the needle that discharges the application liquid in a thin line shape, the application liquid can be discharged in a shared manner by the nozzle and the needle according to the state of the object to be processed. For example, when there is a narrow part that cannot be handled by the nozzle as the application area, or when the application is applied to a position where the nozzle cannot enter, a needle can be used. The nozzle path and the needle path can be applied by an efficient route in consideration of the first and second application prohibited areas, respectively. Furthermore, since the nozzle path and the needle path include a non-ejection movement path according to the setting of the nozzle movement height and the needle movement height, the movement in the non-ejection state in the application process can be executed at an appropriate height.

In the spray path setting process, the control unit further performs a process of performing a nozzle movement trial operation on the created nozzle path, and corrects the nozzle path or determines the nozzle path according to the trial result, and the created needle path. The needle movement trial operation is executed, and the needle path is corrected or the needle path is determined according to the trial result.
Thereby, verification according to the actual application | coating process object about the produced spray path (nozzle path, needle path), and correction to an appropriate spray path can be performed.
The nozzle moving height and the needle height are set to a height exceeding the height of the structure provided on the coating object. As a result, it is possible to avoid a situation in which the nozzle or the needle collides with the structure during the non-ejection movement in the coating process.

The control means further includes one or both of a process for setting the first application prohibited area and a process for setting the second application prohibited area based on an input from the input means. Do.
This makes it possible to set an application prohibited area that reflects the will of the operator.
Further, the control means performs one or both of a process for setting the first application prohibited area and a process for setting the second application prohibited area based on an image analysis result of the application object image. . Thereby, it becomes possible to set the application prohibition area without requiring the operator's trouble, and the efficiency of the process is improved.

A dummy nozzle that is substantially the same size as the tip of the nozzle and can be elastically deformed or refracted and outputs a contact detection signal in accordance with the elastic deformation or refraction of the tip is replaced with the nozzle. The control means corrects the nozzle path according to the reception of the contact detection signal when the trial operation of nozzle movement is executed in a state where the dummy nozzle is mounted.
A dummy needle that is substantially the same size as the tip of the needle and can be elastically deformed or refracted and outputs a contact detection signal in accordance with the elastic deformation or refraction of the tip is replaced with the needle. The control means corrects the needle path according to the reception of the contact detection signal when the trial operation of the needle movement is executed in a state where the dummy needle is mounted.
Thus, a trial operation (nozzle pass, needle pass simulation) that does not cause breakage, damage, or the like on the nozzle or needle or the processing object side can be executed. In addition, the nozzle path and needle path created by the trial operation can be verified and corrected if necessary.

In addition, an imaging unit is provided, and the control unit performs a process of taking in the application object image picked up by the imaging unit. As a result, the processing object image can be easily captured.
In addition, a discarding unit is provided for discharging the coating liquid as a discarding from the nozzle or the needle. Further, a soaking part for soaking the nozzle or the needle in the diluent of the coating liquid is provided. It is possible to prevent clogging of the coating liquid and a change in the spray pattern due to discarding or soaking.
Further, the tip of the needle is bent. Thereby, it becomes possible to apply | coat also to the place which cannot apply | coat from the upper direction on a process target object.

The spray path setting method of the present invention includes a step of capturing a coating object image, a step of setting a nozzle moving height that is a height position during non-ejection movement of the nozzle, and a non-ejection movement of the needle. A step of setting a needle movement height which is a height position, a step of setting a first application prohibited area for the nozzle on the application processing object image, and the application processing object image According to the setting of the nozzle movement height, the step of setting the second application prohibited area for the needle, the discharge movement path excluding at least the first application prohibited area as the spray path for the nozzle A step of creating a nozzle path including a non-discharge movement path, and a discharge transfer excluding at least the second application prohibited area as the spray path for the needle. A path and, a step of creating a needle path including the non-ejection movement path in accordance with the setting of the needle movement height.
The program of the present invention is a program that causes the arithmetic processing unit to execute processing of each process in order to realize the above spray path setting method.

  According to the present invention, it is possible to perform liquid discharge by sharing a nozzle and a needle according to the situation of a portion to be coated, such as the shape of a processing object, the shape and width of a coating area, and an accurate and fine coating. Can be realized. In addition, by individually setting the nozzle path and the needle path, the liquid discharge operation using both the nozzle and the needle can be executed accurately and efficiently. In particular, the nozzle path and the needle path have discharge movement paths set in consideration of the first and second application prohibited areas, respectively, and include a non-discharge movement path according to the settings of the nozzle movement height and the needle movement height. Thus, coating can be performed by an efficient route.

It is explanatory drawing of the example of an external appearance of the coating apparatus of embodiment of this invention. It is explanatory drawing of the discharge operation | movement of the coating apparatus of embodiment. It is explanatory drawing of the discharge operation of the coating apparatus of an embodiment, a dummy nozzle, and a dummy needle. It is explanatory drawing of the spray pattern width | variety of embodiment, and a needle modification. It is a block diagram of the control composition of the coating device of an embodiment. It is explanatory drawing of the prohibition area of embodiment. It is explanatory drawing of the prohibition area and nozzle path setting of embodiment. It is explanatory drawing of the needle path setting of embodiment. It is a flowchart of the spray path | pass setting process of embodiment. It is explanatory drawing of the simulation operation | movement of embodiment. It is explanatory drawing of the other example of needles of embodiment.

Embodiments of the present invention will be described below. As an embodiment of the liquid ejecting apparatus, an example of a coating apparatus that ejects a coating agent for forming a thin film on a circuit board that is a processing target is given.
The description will be given in the following order.
<1. Configuration of Coating Apparatus of Embodiment>
<2. Control configuration of coating equipment>
<3. Spray path setting of embodiment>
<4. Other needle examples>
<5. Program>
<6. Modification>

<1. Configuration of Coating Apparatus of Embodiment>
FIG. 1 shows an example of the appearance of a coating apparatus 1 which is an embodiment of a liquid ejection apparatus of the present invention.
The coating apparatus 1 discharges and sprays a coating agent from a nozzle 3 or a needle 16 onto a circuit board 100 placed on the work table unit 2 to protect the circuit board 100 from moisture and rust. Is a device for forming
In addition, although mentioned later, the nozzle 3 is a nozzle which discharges application liquid (coating agent) in fan shape or cone shape. On the other hand, the needle is a “nozzle” whose tip is formed in a needle shape, for example, and discharges a coating liquid in a thin line shape. In order to distinguish each nozzle, for the sake of explanation, a nozzle having a thin tip portion and a thin line-like liquid discharge pattern is referred to as a “needle”.

As shown in the figure, a substrate mounting table 10 is provided on the work table 2, and a circuit board 100 that is a coating object is mounted on the substrate mounting table 10.
For example, the coating apparatus 1 can be used as part of a production line for electronic circuit boards and the like, and the circuit board 100 is set on the substrate mounting table 10 by a transport mechanism (not shown). Then, a coating process is performed in the coating apparatus 1, and then the circuit board 100 is taken out by a transport mechanism (not shown) and transferred to the next process. Thereby, the coating process as a continuous operation is executed on the line.
Of course, the coating apparatus 1 may not only configure the line as described above, but also may be an apparatus that individually coats a processing target such as the circuit board 100.

Above the work table portion 2, the nozzle 3 and the needle 16 for discharging the coating agent are located.
The nozzle 3 has a structure in which a cylindrical tip 3a is attached to a nozzle base 3b.
The needle 16 has a structure in which a needle-like tip 16a is attached to a needle base 16b.
The nozzle 3 and the needle 16 are configured to be movable in the X direction, the Y direction, and the Z direction in the upper space of the work table 2 while being attached to the nozzle holder 4.

  The nozzle holder 4 is attached to the X direction guide 11 so as to be slidable in the X direction. The X direction guide 11 is provided with an X motor 7 and a drive shaft 11a rotated by the X motor 7. The nozzle holder 4 moves in the X direction along the X direction guide 11 by the rotation of the drive shaft 11a. It is possible. For this reason, a connection mechanism is adopted between the drive shaft 11a and the nozzle holder 4 with a gear configuration or the like in which the rotation of the drive shaft 11a is converted into the slide movement direction.

  The X direction guide 11 is fixed to a guide holder 13. The guide holder 13 is attached to the Y-direction guide 12 so as to be slidable in the Y direction. The Y-direction guide 12 is provided with a Y motor 8 and a drive shaft 12a rotated by the Y motor 8, and the guide holder 13 (that is, the entire X-direction guide 11) is rotated by the drive shaft 12a. 12 is movable in the Y direction. For this reason, a connection mechanism is employed between the drive shaft 12a and the guide holder 13 such as a gear configuration in which the rotation of the drive shaft 12a is converted into the slide movement direction.

A nozzle Z motor 5 is disposed in the nozzle holder 4, and the tip of the nozzle 3 is moved up and down (Z direction) by the nozzle Z motor 5. That is, the height position of the cylindrical tip 3a of the nozzle 3 with respect to the work table 2 is changed.
Furthermore, a needle Z motor 15 is disposed in the nozzle holder 4, and the tip of the needle 16 is moved up and down (Z direction) by the needle Z motor 5. That is, the height position of the needle-like tip portion 16a of the needle 16 with respect to the work table portion 2 is changed.
With the above configuration, the nozzle 3 and the needle 16 are positioned in the X direction, the Y direction, and the Z direction in the upper space of the work table 2 by the X motor 7, the Y motor 8, the nozzle Z motor 5, and the needle Z motor 15. It becomes possible to move.
By moving in the X direction, the Y direction, and the Z direction, it is possible to perform spraying of the coating agent while moving each place on the mounted circuit board 100, and to simulate a spray path described later. .

  Further, a nozzle rotation motor 6 is attached to the nozzle holder 4, and the rotation angle position of the nozzle 3 can be changed by the nozzle rotation motor 6. The rotation angle position is a position in the θ direction of FIG. 2A.

FIG. 2A shows an enlarged view of the nozzle 3 discharging and spraying a coating agent (spray pattern 90) from above the circuit board 100. FIG.
FIG. 3A shows an enlarged view of the needle 16 ejecting and spraying a coating agent (spray pattern 91) from above the circuit board 100. FIG.
As shown in FIG. 2A, various electronic components 110 and 111 such as resistors, capacitors, and IC chips are mounted on the circuit board 100. The heights w and v of the various electronic components 110 and 111, and the electronic components There are various sizes k and m between parts. In the present embodiment, for example, the shape and component arrangement of the circuit board 100 are performed by spraying such a circuit board 100 while the nozzle 3 and the needle 16 are moved in the X direction, the Y direction, and the Z direction. It is possible to form an appropriate thin film according to the conditions.

  Regarding the movement control in the X direction and the Y direction, for example, the corner (corner) of the substrate platform 10 is the origin a on the coordinates, and the movement distance of the nozzle 3 and the needle 16 in the XY direction is centered on the origin a. Is set. Note that the substrate platform 10 is provided with pins at two locations, for example, and has holes for inserting the pins at two locations on the circuit board 100. By arranging these holes so as to be inserted into the pins, the circuit board 100 is positioned and arranged so that the corner (corner) of the circuit board 100 becomes the origin a.

The cylindrical tip 3a of the nozzle 3 is formed as shown in FIGS. 2B and 2C, and discharges the pressurized liquid coating agent from the discharge hole 3c. Since the discharge hole 3c is formed at a position deeper than the protrusions 3d and 3d, the spray pattern 90 of the discharged coating agent has a flat fan shape as shown in FIG. 2D. FIG. 2E shows the aa cross section of the spray pattern 90 of FIG. 2D, but the fan-shaped spray pattern 90 has a thick width portion 90a in the vicinity of the edge, and the edge and the center have a thickness. Relatively thin.
When the spray pattern 90 as shown in FIG. 2D goes further below the position of the a-a section line, it becomes atomized and becomes unsuitable for coating. The coating agent applied in an atomized pattern increases the number of unapplied parts and pinholes, which may result in a defective product. Therefore, for example, it is appropriate to reach the surface of the circuit board 100 around the position of the aa sectional line.
FIG. 2A shows a state where the height position of the nozzle 3 from the surface of the circuit board 100 is adjusted to the distance t by the above-described movement in the Z direction, and the coating agent is applied. The distance t from the application surface in this case is a distance for obtaining a height at which the application width by the spray pattern 90 is the width h at which application can be performed most efficiently. By being moved in the Y direction in this state, application is performed so as to progress in a band shape in the Y direction in the state of the width h.

Further, as described above, the rotation angle position of the nozzle 3 can be changed by the nozzle rotation motor 6. For example, if the rotation angle position is changed by 90 ° from the state shown in FIG. 2A and moved in the X direction, the application proceeds in a strip shape in the X direction in the state of the width h.
Furthermore, the width of the coating band to be advanced can be adjusted by the rotational angle position. For example, if the 45 ° rotation angle position is changed from the state of FIG. 2A and moved in the Y direction, it is possible to perform coating that progresses in a band shape in the Y direction in the state of a half width of the width h shown in the figure. .
4A, 4B, and 4C show application widths of the spray pattern 90 and the application region 92 when viewed from the Y direction side, for example, in the case of various rotation angle positions θ1, θ2, and θ3. As shown in the figure, the coating width can be adjusted by the rotation angle position.
Therefore, when adjusting the coating width in consideration of the overcoating part or spraying in a relatively narrow part, adjust the rotation angle position and adjust the spray pattern width as seen from the direction of travel. Application of width becomes possible.

On the other hand, even such adjustment of the rotational angle position of the nozzle 3 may not be able to cope. For example, when spraying is performed in a considerably narrow portion such as the size m between parts, the fan-shaped spray pattern 90 from the nozzle 3 may not be applied properly. Even if the area is not a narrow area, the cylindrical tip 3a of the nozzle 3 hits the electronic component 110 in the vicinity of the tall electronic component 110, and the nozzle 3 cannot be lowered to the position of the distance t from the application surface. Sometimes. In such a case, as shown in FIG. 3A, the coating agent is sprayed by the fine needle-shaped spray pattern 91 by the fine needle 16.
That is, the coating apparatus 1 of the present embodiment includes the nozzle 3 that discharges the application liquid in a fan shape and the needle 16 that discharges the application liquid in a thin line shape, so that it matches the state of the processing object (circuit board 100 or the like). Thus, the application work can be performed by discharging the application liquid in a shared manner by the nozzle 3 and the needle 16. For this reason, it is possible to perform appropriate coating in a flexible manner corresponding to the arrangement of the electronic components 110 on the circuit board 100.

Although not shown in FIGS. 1, 2, and 3, a supply mechanism and a discharge mechanism for supplying a coating agent are provided to the nozzle 3 and the needle 16 in order to discharge the coating agent as a pressurized liquid. Provided. The discharge amount of the coating agent and the spray pattern width are adjusted by adjusting the pressure by the discharge mechanism.
The coating agent is, for example, a polyolefin-based, acrylic-based, or polyurethane-based insulating coating agent. When diluted with thinner and applied to the circuit board 100 in a liquid state, a thin film as a substrate shielding layer is formed on the circuit board 100 by drying for about 10 minutes.

By the way, in the coating apparatus 1 of this Embodiment, the nozzle 3 and the needle 16 can be removed from the nozzle holder 4. As shown in FIGS. 3B and 3C, the dummy nozzle 200 and the dummy needle 300 can be exchanged.
The dummy nozzle 200 and the dummy needle 300 are used for simulation in setting processing of a spray pass (nozzle pass and needle pass) described later.
The dummy nozzle 200 has a tip portion 200a that is substantially the same size as the cylindrical tip portion 3a of the nozzle 3, and can be elastically deformed or refracted. In the figure, an example is shown in which a tip portion 200a by a spring is attached to a dummy nozzle base portion 200b. The spring as the tip portion 200 a has a winding diameter and a length that are substantially the same size as the cylindrical tip portion 3 a of the nozzle 3. The dummy nozzle base portion 200b incorporates a sensor mechanism that outputs a contact detection signal in accordance with elastic deformation or refraction of the tip portion 200a.
The dummy needle 300 has a tip portion 300a that is substantially the same size as the needle-like tip portion 16a of the needle 16, and can be elastically deformed or refracted. In the figure, an example is shown in which a tip portion 300a by a spring is attached to a dummy needle base portion 300b. The spring as the tip portion 300a has a winding diameter and a length that are substantially the same size as the needle-like tip portion 16a. The dummy needle base portion 300b incorporates a sensor mechanism that outputs a contact detection signal in accordance with elastic deformation or refraction of the tip portion 300a.
When each of the dummy nozzle 200 and the dummy needle 300 is attached to the nozzle holder 4, it is moved in the Z direction by the nozzle Z motor 5 and the needle Z motor 15 as in the case of the nozzle 3 and needle 16. That is, a state where the dummy nozzle 200 is lowered as shown in FIG. 3B and a state where the dummy needle 300 is lowered as shown in FIG. 3C can be obtained.

As shown in FIG. 1, the coating apparatus 1 according to the present embodiment includes a light emitting unit 21, a light receiving unit 22, a discarding unit 23, and a soaking unit 24 that constitute an optical sensor on the work table unit 2. It is done.
The light emitting unit 21 and the light receiving unit 22 constituting the optical sensor are arranged to face each other in the X direction. The light emitting unit 21 is constituted by a semiconductor laser, for example, and outputs laser light having a diameter of about 1.5 mm, for example. This laser beam is received by the light receiving unit 22. The light receiving unit 22 outputs a detection signal according to the amount of received light.
In this case, the light beam of the laser light has a linear shape extending in the X direction. For example, when the nozzle 3 is moved in the Y direction and crosses the light beam of the laser light, the light beam is blocked by the nozzle 3 and does not reach the light receiving unit 22. As a result, the light receiving unit 22 decreases the amount of received light, and outputs a detection signal indicating a light amount reduction state.
In order to perform application with an appropriate application width, the width of the fan-shaped spray pattern 90 from the nozzle 3 is adjusted. For this purpose, while discharging the spray pattern 90 from the nozzle 3, the nozzle 3 is moved in a direction across the light beam of the sensor, and the width of the spray pattern 90 is measured. Depending on the measurement result, the spray pattern width can be adjusted to a desired width by adjusting the spray pressure of the coating agent.

The discarding unit 23 is used for discharging a coating agent as so-called discarding. The soaking part 24 is provided for soaking the tip of the nozzle 3 and the needle 16 in the diluent. A brush 26 is attached to the side wall of the soaking part 24.
In this example, a coating agent diluted with a highly volatile solvent is used, and this is dried and cured at the discharge hole 3a of the nozzle 3 or the tip (discharge hole) of the needle-like tip portion 16a of the needle 16 and discharged. The spray patterns 90 and 91 to be changed may be changed.
Therefore, when not in use, the tip of the nozzle 3 and the needle 16 is immersed in the immersion portion 24 containing the diluent. For example, a thinner solvent is placed in the soaking part 24. This prevents clogging of the nozzle 3 and the needle 16.
Prior to use, with the nozzle 3 and needle 16 positioned above the throwing-out portion 23, ejection as a throw-away is performed to blow off the cured portion, or the tip of the nozzle 3 and needle 16 is brought into contact with the brush 26 It is made to move in the Y direction so that it can be cleaned. With these operations, a stable spray pattern can be obtained during the actual coating operation.

Further, in this example, while the spray pattern 90 is ejected from the nozzle 3, the nozzle 3 is moved in the direction across the light beam of the sensor, and the width of the spray pattern 90 is measured.
At this time, since the above-described immersion, disposal, and brush cleaning are performed, the width of the spray pattern 90 can be measured stably even during measurement.
Further, the position above the thrown-out portion 23 is the position of the laser beam from the light emitting portion 21. Therefore, the operation of moving the nozzle 3 while discharging the spray pattern 90 as a measurement process to be described later can be performed above the discarding portion 23. That is, the throwing-out portion 23 also functions as a receiving portion for the spray pattern 90 discharged during the measurement process.
In addition, a slope is formed in the discarding portion 23 as shown in the figure, and the coating agent discarded by the slope is configured to scatter in a certain direction. In the case of FIG. 1, the coating agent 91 is scattered in the direction of the soaking part 24. For this reason, it is possible to prevent the coating agent from being scattered on the work table portion 2 at the time of disposal and measurement processing.

As shown in FIG. 1, an imaging unit 25 is attached above the workbench unit 2. The imaging unit 25 can capture an image of the circuit board 100 placed on the substrate platform 10.
Further, for example, a display unit 9 constituted by a liquid crystal panel or the like is provided. The display unit 9 is equipped with a touch panel, and an operator can perform an input operation.
The display unit 9 displays an image captured by the imaging unit 25 (captured image), an image obtained by processing the captured image, operation icons, a message display, and various other images for a user interface.
By displaying the image of the circuit board 100, the operator can designate a part to be coated on the image or designate a region where coating is prohibited.

<2. Control configuration of coating equipment>
FIG. 5 shows a control configuration of the coating apparatus 1. Here, an electric system is particularly shown here, and description of a fluid control system such as coating agent supply and pressurization control is omitted.

The main control unit 30 is an arithmetic processing unit formed by, for example, a microcomputer (CPU: Central Processing Unit), and controls the operation of each unit.
The memory unit 34 has a storage area such as a non-volatile memory such as a ROM (Read Only Memory), a RAM (Random Access Memory), and an EEP-ROM (Electrically Erasable and Programmable Read Only Memory) used by the main control unit 30 for various controls. It is shown generally.
The memory unit 34 includes both a storage area (register, RAM, ROM, EEP-ROM, etc.) formed inside the microcomputer and a memory chip area external to the chip as the microcomputer. Shown together. That is, since any storage area may be used, it is shown without distinction.

The ROM area in the memory unit 34 stores a program executed by the CPU as the main control unit 30.
The RAM area in the memory unit 34 is used by the CPU as the main control unit 30 as a work memory for various arithmetic processes, or for temporary storage of image data.
The nonvolatile memory area in the memory unit 34 stores necessary information such as coefficients and constants for arithmetic control processing.
The main control unit 30 performs necessary arithmetic processing and control processing based on a program stored in the memory unit 34, an operator's operation input from the input unit 31, or based on an instruction from a line control computer (not shown). I do.

The input unit 31 is a part where an operator inputs an operation. For example, when a touch panel is formed on the display unit 9 as described above, the touch panel becomes the input unit 31. Moreover, the input part 31 by an operation key, a remote controller, etc. may be provided.
Input information from the input unit 31 is supplied to the main control unit 30, and the main control unit 30 performs processing according to the input information.

  The imaging unit 25 captures an image based on the control of the main control unit 30. For example, the circuit board 100 mounted on the substrate mounting table 10 is imaged as described above. A captured image signal (for example, a still image captured signal) from the image capturing unit 25 is subjected to A / D conversion processing, image adjustment processing, encoding processing, and the like by the image processing unit 32, and is transmitted to the main control unit 30 as captured image data in a predetermined format. Delivered. The main control unit 30 stores the captured image data in the memory unit 34. The main control unit 30 can read out the captured image data as necessary and perform image analysis processing, enlargement / reduction processing, image editing processing, external transmission processing, or the like.

The main control unit 30 supplies display data to the display driving unit 33 and causes the display unit 9 to execute display. The display driving unit 33 generates an image signal based on the supplied display data and drives the display unit 9.
For example, the main control unit 30 can transfer the captured image data to the display drive unit 33 and display the captured image on the display unit 9 or edit the captured image data and display the captured image data on the display unit 9.

The external interface 46 performs communication with external devices and network communication. The main control unit 30 can input and transmit various information via the external interface 46 by communication. For example, when each device on the line is networked, communication can be performed with the host device and other devices.
Through this communication, it is possible to receive captured image data and the like from an external device, load an upgrade program, and accept various processing coefficient and constant change settings. In addition, the main control unit 30 can transmit an error message, a warning, or the like to the host device, or can transmit captured image data.
In addition, as described above, the imaging unit 25 captures the circuit board 100 to capture the captured image of the circuit board 100, but the captured image of the circuit board 100 is received from an external device such as a host device via the external interface 46. You can also try to capture.

The main control unit 30 transmits a nozzle movement command to the motor controller 35. The command contents are contents for instructing the nozzle movement direction (X, Y, Z direction and rotation angle position θ direction), the movement amount, and the movement speed.
For example, before starting the coating process, the main control unit 30 performs a spray pass (a nozzle pass and a needle pass, which will be described later) in accordance with an analysis of a captured image obtained by capturing the circuit board 100 and a prohibited area setting by an operation input by an operator. Process to create. After the actual coating process is started, the nozzle movement direction is instructed to the motor controller 35 according to the created nozzle path, and the needle movement direction is instructed to the motor controller 35 according to the needle path. .
The main control unit 30 also instructs the motor controller 35 to perform a predetermined movement of the nozzle 3 during a simulation in a spray path setting process described later.
In response to these nozzle movement commands, the motor controller 35 drives and controls each motor driver (36, 37, 38, 39, 45).

The X motor driver 36 gives a driving current for forward rotation or reverse rotation to the X motor 7. As a result, the X motor 7 is driven, and the nozzle 3 (the entire nozzle holder 4) is slid in the forward or reverse direction of the X direction.
The Y motor driver 38 gives a driving current for forward rotation or reverse rotation to the Y motor 8. As a result, the Y motor 7 is driven, and the nozzle 3 (the X direction guide 11 as a whole) is slid in the forward or reverse direction of the Y direction.
The nozzle Z motor driver 39 gives a drive current for forward rotation or reverse rotation to the nozzle Z motor 5. As a result, the nozzle Z motor 5 is driven, and the nozzle 3 is moved so as to be drawn out or pulled up in the vertical direction.
The nozzle rotation motor driver 38 gives a drive current for forward rotation or reverse rotation to the nozzle rotation motor 6. As a result, a rotation operation for changing the rotation angle position of the nozzle 3 is performed.
The needle Z motor driver 45 gives a drive current for forward rotation or reverse rotation to the needle Z motor 15. Thereby, the needle Z motor 15 is driven, and the needle 16 is moved so as to be drawn out or pulled up in the vertical direction.
The motor controller 35 issues instructions to the motor drivers 36, 37, 38, 39, and 45 in response to commands from the main control unit 30, and causes the motors to cooperate with each other. The movement of the nozzle 3 and the needle 16 on the part 2 is executed.

The position detector 51 detects the position in the X direction of the nozzle 3 moved by the X motor 7. For example, it is assumed that the information space of the workbench unit 2 is managed as a three-dimensional coordinate space as an X coordinate, a Y coordinate, and a Z coordinate. The position detection unit 51 detects the position in the X direction as an X coordinate value and notifies the main control unit 30 of the current X coordinate value.
The position detector 52 detects the rotational angle position of the nozzle 3 that is rotationally driven by the nozzle rotation motor 6. Then, the main control unit 30 is notified of the rotation angle position.
The position detection unit 53 detects the position in the Y direction of the nozzle 3 moved by the Y motor 8 as a Y coordinate value, and notifies the main control unit 30 of it.
The position detection unit 54 detects the position in the Z direction of the nozzle 3 moved up and down by the nozzle Z motor 5 as a Z coordinate value and notifies the main control unit 30 of the detected value.
The position detection unit 55 detects the position in the Z direction of the needle 16 moved up and down by the needle Z motor 15 as a Z coordinate value and notifies the main control unit 30 of the detected value.
The position detectors 51, 53, 54, and 55 may be provided with mechanical or optical sensors provided in the X direction guide 11, the Y direction guide 12, and the nozzle holder 4, respectively, or may detect the position. When the X motor 7, the Y motor 8, the nozzle Z motor 5, and the needle Z motor 15 are stepping motors, the position detectors 51, 53, 54, and 55 are counters that count up / down the number of forward and reverse drive steps. The count value may be the detection position. Alternatively, the current position may be measured using signals from an FG (Frequency Generator) or a rotary encoder attached to the X motor 7, the Y motor 8, the nozzle Z motor 5, and the needle Z motor 15. In any case, the position detectors 51, 53, 54, and 55 may be configured to detect the X coordinate value, the Y coordinate value, and the Z coordinate value as the current positions of the nozzle 3 and the needle 16. I will not.
Similarly, the position detection unit 52 may be a sensor that mechanically or optically detects the nozzle rotation position. For example, an FG of the nozzle rotation motor 6, a rotary encoder, or an up / down counter of the number of steps in the case of a stepping motor. It is good.

Therefore, the position detectors 51, 52, 53, 54, 55 may be configured by an internal counter or the like of the motor controller 35, or configured so that the motor controller 35 takes in information of a mechanical or optical external sensor. May be.
The motor controller 35 performs the nozzle drive obtained from the main control unit 30 while monitoring the position information from the position detection units 51, 52, 53, 54, and 55.
In addition, the main control unit 30 can receive the position information from the position detection units 51, 52, 53, 54, and 55 via the motor controller 35 so that the current position of the nozzle 3 and the needle 16 can be grasped. Nozzle movement control and needle movement control can be executed.
In this case, the X and Y coordinate values as the position of the nozzle 3 and the position of the needle 16 are only detected as the position of the nozzle holder 4. Accordingly, the main control unit 30 may calculate the X and Y coordinate values as the application position of the nozzle 3 and the application position of the needle 16 so as to be offset by a predetermined amount from the position of the nozzle holder 4.

The discharge controller 40 controls the execution / stop of the discharge of the coating agent from the nozzle 3 and the needle 16 in accordance with an instruction from the main controller 30. In this figure, the discharge mechanism 41 is conceptually shown as a mechanism portion that supplies, pressurizes, and discharges the coating agent to the nozzle 3 and the needle 16.
The discharge control unit 40 can also adjust the width and amount of the spray pattern 90, 91 of the coating agent by adjusting the pressure at the time of discharge in accordance with an instruction from the main control unit 30.
For example, the discharge mechanism 41 uses an electropneumatic regulator to adjust the air pressure for discharging the coating agent. By controlling the electropneumatic regulator, the discharge control unit 40 can adjust the width of the spray patterns 90 and 91 of the coating agent with the injection pressure. Since the air pressure can be controlled steplessly in proportion to the electric signal by the electropneumatic regulator, the width of the spray patterns 90 and 91 can be changed steplessly. Thereby, adjustment of the spray patterns 90 and 91 or change of settings can be easily performed.

The sensor driving unit 42 executes laser light emission driving from the light emitting unit 21, detects a light reception signal of the light receiving unit 22, and generates a detection signal.
The sensor driving unit 42 performs laser emission driving in accordance with an instruction from the main control unit 30 and supplies a detection signal to the main control unit 30 at that time.

As shown in FIGS. 3B and 3C, a dummy nozzle 200 and a dummy needle 300 may be attached instead of the nozzle 3 and the needle 16 in some cases. In this case, as shown in FIG. 5, the detection signal of the dummy nozzle sensor 56 provided in the dummy nozzle base portion 200 b is sent to the main control portion 30. Further, a detection signal of a dummy needle sensor 57 provided in the dummy needle base 300 b is sent to the main control unit 30.
As will be described later, for example, the dummy nozzle 200 is not in contact with the electronic component 110 as shown in FIG. 10A, or the tip 200a is elastically deformed or refracted in contact with the electronic component 110 as shown in FIG. 10B. It can be detected.

<3. Spray path setting of embodiment>
The coating apparatus 1 of the present embodiment having the above configuration can perform fine coating according to the circuit board 100 by using the nozzle 3 and the needle 16 in combination. In particular, in order to perform coating efficiently and accurately, before the actual application work, the movement path (nozzle path) during the application work by the nozzle 3 and the movement path (needle path) during the application work by the needle 16 are described below. It is set to explain.

First, an outline of spray path (nozzle path and needle path) setting will be described with reference to FIGS.
FIG. 6A shows a circuit board 100 that is an object to be coated. In order to coat the circuit board 100, the first prohibited area AR1 and the second prohibited area AR2 are set as shown in FIGS. 6B and 6B.
The first prohibited area AR1 is an area where the nozzle 3 does not discharge the spray pattern 90. However, it includes a region that is desired to be applied but cannot be applied depending on the nozzle 3.
The second prohibited area AR2 is an area within the first prohibited area where the spray pattern 91 is not ejected by the needle 16. That is, the second prohibited area AR2 is an area that is included in the first prohibited area AR1 but excludes places where application should be performed. In other words, the area that should not be coated on the circuit board 100 is represented as the second prohibited area AR2. For example, the upper surface of the electronic components 110 and 111.

7 and 8 show such a prohibited area setting and a subsequent spray pass setting as captured images.
FIG. 7A is a captured image of the circuit board 100 displayed on the display unit 9. The circuit board 100, the electronic components 110 and 111, and the like are displayed as images.
For such an image, the first prohibited area AR1 is set as shown in FIG. 7B by the touch input of the operator or the image analysis of the main control unit 30. The main control unit 30 sets the nozzle path in consideration of the first prohibited area AR1. That is, a route for moving the nozzle 3 so as to avoid the first prohibited area AR1 is calculated. FIG. 7C shows a state in which the created nozzle path is displayed on the display unit 9. Each pass marker PM1 indicates a nozzle pass. The moving direction of the nozzle 3 is indicated by a triangular path marker PM1. Further, for example, each pass marker PM1 is numbered to indicate the order of the path for moving the nozzle 3 during application.
Depending on each pass marker PM1, a discharge movement path through which the nozzle 3 moves while discharging the coating agent is shown. Each path marker PM1 indicates one discharge movement path. When moving from a certain discharge movement path to the next discharge movement path, there are places where the nozzle 3 can move while continuing discharge, and there are also cases where the discharge of the coating agent is temporarily stopped and moved. For example, in FIG. 7C, when application is performed on the ejection movement path of the “No. 7” pass marker PM1 and then the application moves on the ejection movement path of the “No. 8” pass marker PM1, the nozzle 3 is moved in a non-ejection state. . A path that moves in such a non-ejection state (non-ejection movement path) is not directly indicated by the path marker PM1, but is substantially a nozzle movement path during application work and is included in the nozzle path. .

FIG. 8A is an image example showing the second prohibited area AR2. The second prohibited area AR2 is also set by an operator's touch input on the captured image or an image analysis of the main control unit 30.
In FIG. 8B, the first prohibited area AR1 is overlapped with the second prohibited area AR2 by a broken line. As can be seen from this figure, the second prohibited area AR2 indicates an area in the first prohibited area AR1 that is not coated.
The main control unit 30 sets the needle path in consideration of the second prohibited area AR2 in FIG. 8A. That is, a path for moving the needle 16 is calculated so that a portion within the first prohibited area AR1 and not included in the second prohibited area AR2 is applied by the needle 16. FIG. 8C shows a state in which the created needle path is displayed on the display unit 9. Each path marker PM2 indicates a needle path. The moving direction of the needle 16 is indicated by the triangular path marker PM2. Although not shown, for example, a number is assigned to each path marker PM2 to indicate the order of the path for moving the needle 16.
Depending on each path marker PM2, a discharge movement path through which the needle 16 moves while discharging the coating agent is shown. In the case of the needle 16 as well, when moving from one discharge movement path to the next discharge movement path, the discharge of the coating agent may be temporarily stopped and moved. The non-ejection movement path in this case is not directly indicated by the path marker PM2, but is substantially a needle movement path at the time of application work and is included in the needle path.

As described above, the main control unit 30 sets the nozzle path and the needle path in the spray path setting process in consideration of the first prohibited area AR1 and the second prohibited area AR2.
Hereinafter, a specific example of the spray pass setting process will be described in detail with reference to FIG.

When the spray pass setting process is started, first, the main control unit 30 performs substrate imaging, storage, and image correction processing in step S101. In this case, the main control unit 30 first causes the imaging unit 25 to image the circuit board 100 mounted on the substrate mounting table 10 and captures a captured image from the image processing unit 32. The captured image data is stored in the memory unit 34. Then, the captured image is corrected and displayed on the display unit 9. Here, the correction is a process of reducing or enlarging the image so that the captured image of the circuit board 100 is displayed on the display unit 9 with the same size as the actual object. For example, when the virtual nozzle is moved 1 cm in the X direction from the origin a on the substrate image on the display of the display unit 9, the actual 1 cm in the X direction from the origin a is also applied on the actual circuit board 100 of the substrate platform 10. The image and the actual size are matched so that the nozzle 3 moves.
As step S101, image data of the circuit board 100 may be captured from an external device (for example, a host computer) via the external interface 46 and stored in the memory unit 34 instead of image capturing by the image capturing unit 25. good. Alternatively, it may be acquired in advance and stored in the memory unit 34 before the spray pass setting process is started. Since the image data in this case varies in size depending on the resolution, image correction is performed so that the actual size of the circuit board 100 matches the scale managed by the main control unit 30.

  Next, in step S102, the main control unit 30 performs a process of setting the spray path origin position on the captured image. This is a process of matching the origins of movement of the nozzle 3 and needle 16 in the X and Y directions with the origin positions of the displayed images. For example, the movement coordinate values (detected position on the X direction guide 11 and detected position on the Y direction guide 12) when the nozzle 3 is at a position corresponding to the position of the origin a of the captured image are set as the nozzle origin coordinates, and the needle 16 Is the coordinate value of the needle when it is at a position corresponding to the position of the origin a of the captured image.

In step S103, the main control unit 30 performs coating condition setting. Here, for example, the following settings (1) to (9) are made.
(1) Setting the width and application thickness of the fan-shaped spray pattern 90 of the nozzle 3 The width of the fan-shaped spray pattern 90 varies depending on the pressure of the pressurized liquid and the type of the nozzle 3. If the width of the spray pattern 90 is different, the efficient nozzle path also changes. Therefore, the width of the fan-shaped spray pattern 90 is set to create a nozzle path. The setting of the coating thickness is related to the moving speed of the nozzle 3 and the overcoating amount on the adjacent already applied portion.
(2) Setting of overcoating amount When coating is performed with the coating width h, it is set how much the coating is applied to the adjacent already coated portion. Normally, even if the nozzle path is set without overcoating, adjacent applications are combined by a slight expansion after application of the liquefied coating agent, and application without gaps is completed. However, it is necessary to set a large amount of overcoating when a coating operation for completely preventing a non-adhering portion or a pinhole or a thick coating is required.
(3) Setting of margin for substrate outer periphery When the coating agent is applied to the end surface of the circuit board 100, the coating agent may flow down to form a pinhole or a portion that does not adhere. Further, when the coating agent flows out and adheres to the side surface or the back surface of the circuit board 100, adhesiveness is generated and the thickness is changed, which may hinder subsequent conveyance. In addition, useless coating agent is consumed. Therefore, a margin for applying no coating agent on the outer periphery can be set. If a paste margin not to be applied at intervals of several millimeters is set on the outer periphery of the circuit board 100, the coating thickness can be maintained on the circuit board 100 to create a coating film by the surface tension of the coating agent applied before the paste margin. it can. This surface tension does not cause the coating agent to flow down.
(4) Substrate thickness setting By setting the thickness of the substrate, the height of the nozzle 3 and the needle 16 (Z coordinate value at the time of application) is determined. As described above, the nozzle 3 that discharges the fan-shaped spray pattern 90 determines the height position at which application can be performed with an efficient application width h.
(5) Setting of application direction In order to complete the application work efficiently and in a short time, the nozzle 3 and the needle 16 are mainly moved in either the horizontal direction (X direction) or the vertical direction (Y direction) of the circuit board 100. Set whether it is better to let them.
(6) Setting of application height Dovetail in which the fan 3 spray pattern 90 is not atomized by setting the height positions of the nozzle 3 and the needle 16 according to the height of the electronic components 110, 111, etc. on the circuit board 100. It is the height setting for applying using the shaped part. If past data is available, it is possible to automatically set the application width h efficiently by simply inputting the conditions.
(7) Moving height setting As described above, the spray path (nozzle path, needle path), which is the moving path during the coating operation, includes the discharge moving path and the non-discharge moving path.
When the nozzle 3 and the needle 16 pass over the circuit board 100 without discharging the coating agent in the non-ejection movement path, the nozzle 3 and the needle 16 do not move in consideration of the height of the electronic components 110, 111, etc. on the circuit board 100. must not. Therefore, the moving heights (nozzle moving height and needle moving height) are set so that the nozzle 3 and the needle 16 do not come into contact with the electronic component and are not damaged.
Specifically, the height position of the nozzle 3 and the height position of the needle 16 in the non-ejection movement path in which movement is performed in the non-ejection state are set as the nozzle movement height and the needle movement height.
Here, the nozzle moving height and the needle height are set to a height exceeding the height of the structure (electronic components 110 and 111) provided on the circuit board 100 that is the object to be coated, so that non-ejection is performed. In the movement path, the nozzle 3 and the needle 16 are prevented from colliding with the electronic components 110 and 111.
However, if the nozzle movement height and the needle movement height are set too high, it takes time to move in the Z direction when the non-ejection movement path is moved, resulting in inefficiency. Therefore, the nozzle moving height, the needle moving height, and the height exceeding the height of the electronic components 110 and 111 are set so as not to be too high, thereby ensuring the moving efficiency.
The set values of the nozzle movement height and the needle movement height may be set as Z coordinate values, or may be set as offset values in the Z direction (upward direction) from the height during liquid ejection.
The nozzle movement height and the needle movement height may be set individually or may be the same value. In the case of the same value, the nozzle movement height and the needle movement height may be collectively set as the “movement height” in the non-ejection movement path.
Further, the nozzle moving height and the needle moving height may be set by an operator numerically inputting a Z coordinate value or an offset value, or may be automatically set by the main control unit 30. For example, the main control unit 30 can analyze the board captured image captured in step S <b> 101, determine the type of a structure such as an electronic component, and perform automatic setting according to the highest structure. Furthermore, the height of the structure can be determined by analyzing the captured image and calculating the subject distance from the imaging unit 25. It is also conceivable to automatically set the nozzle moving height and the needle moving height according to the height.
(8) Application speed setting The application thickness of the coating agent is determined by selecting the nozzle 3, setting the discharge pressure, and setting the application speed. If the coating speed is lowered, the coating agent may be applied thickly, causing cracks or overflowing and entering the prohibited areas AR1 and AR2. When the coating speed is increased, the coating agent is thinly applied, and a portion where the coating agent is not applied is formed, and the amount of splash is increased, and the splash may fly to the prohibited areas AR1 and AR2. Therefore, an appropriate application speed is set.
The application speed to be set includes a linear application speed by the nozzle 3, an application speed corresponding to the θ rotation angle, an application speed for oblique movement, an application speed for arc movement, an application speed of the needle 16, and the like. is there.
(9) Application timing setting When the nozzle 3 or the needle 16 moves in the application direction, the coating agent discharged during the period from the stop state to the acceleration and reaching a constant speed is applied thickly. Similarly, the coating agent discharged until the speed of the nozzle 3 or the needle 16 is reduced and stopped is also thickly applied. Further, when the coating agent is discharged until the nozzle 3 and the needle 16 that have moved at a constant speed are stopped, the coating agent is applied before the stop position due to inertial force. Therefore, the application timing is set so that the coating agent is applied after the movement of the nozzle 3 and the needle 16 reaches a constant speed, and the application of the coating agent is stopped when the nozzle 3 and the needle 16 are decelerated from the constant speed.

In step S103, the main control unit 30 executes various settings such as the above (1) to (9) by operator input, information from the host device, or computation based on the input. Of course, settings other than those described above are performed as necessary.
Subsequently, in step S104, the main control unit 30 sets the first prohibited area AR1.
When the image of the circuit board 100 is displayed on the display unit 9 as described above, the operator performs an input from the input unit 31 such as surrounding the area range that the operator wants to prohibit using a mouse or a touch pen. Accordingly, the main control unit 30 sets the prohibited area AR1 as shown in FIG. 7B.
Note that the main control unit 30 can determine the area of the electronic components 110 and 111 by analyzing the captured image. Therefore, an electronic component area, an area that cannot be applied with the application width set in the setting process described above, or the like may be determined from the image analysis result, and the location may be automatically set as the first prohibited area AR1.
When the automatically set first prohibited area AR1 is displayed as shown in FIG. 7B, the operator makes correction input as necessary, and the main control unit 30 corrects the setting of the first prohibited area AR1. You may do it.

  In step S105, the main control unit 30 sets the second prohibited area AR2. Also in this case, in response to an input from the input unit 31 such as using an mouse or a touch pen to enclose a region range where the operator wants to prohibit application, the main control unit 30 displays the prohibited area as shown in FIG. 8A. The area of AR2 may be set, or the main control unit 30 may automatically set by image analysis. In the case of automatic setting, it is preferable that the operator can make correction input as necessary.

In the processing example of FIG. 9, the first prohibited area AR1 and the second prohibited area AR2 are set separately and sequentially, but can be set in an interlocking manner.
For example, when the operator inputs a portion to be prohibited, the area is set as the second prohibited area AR2. Then, the main control unit 30 sets the first prohibited area AR1 by combining the second prohibited area AR2 and a region having a width that cannot be applied by the nozzle 3 together. In this way, the operator only has to input an area that is not desired to be applied, and the workability is improved.
Similarly, in the case of image analysis, first, the main control unit 30 sets a region such as the electronic components 110 and 111 as the second prohibited area AR2. Then, the second prohibited area AR2 and a region having a width that cannot be applied by the nozzle 3 may be detected, and these may be collectively set as the first prohibited area AR1. If the main control unit 30 automatically sets both the first prohibited area AR1 and the second prohibited area AR2 based on image analysis, the labor of the work is reduced and the work efficiency is greatly improved.

In step S106, the main control unit 30 creates a nozzle path. In this case, the main control unit 30 calculates the direction and order of the application route based on the various coating conditions set in step S103 and the first prohibited area AR1 set in step S104, and sets at least the first application prohibited area as the first application prohibited area. A nozzle path including the excluded ejection movement path and the non-ejection movement path according to the setting of the nozzle movement height is created. Then, as shown in FIG. 7C, the nozzle path is displayed on the display unit 9 by the path marker PM1. Note that the pass marker PM1 in FIG. 7C is an example that is displayed at approximately the center of each discharge movement path that constitutes the entire nozzle path.
The specific nozzle path creation process sets the entire path, and for each discharge movement path indicated by one path marker PM1, the start position, end position, path length, direction, nozzle rotation angle (θ), This is a process for setting the nozzle height (Z coordinate value), the moving speed, and the like during ejection. The nozzle movement height of the non-ejection movement path is also included in the nozzle path information.
By such nozzle path setting, the movement of the discharge movement path of the nozzle 3 does not include the first prohibited area AR1, the movement of the non-discharge movement path is performed at an appropriate height, and more efficiently according to various coating conditions. To be done.

In step S107, the main control unit 30 creates a needle path. Based on the various coating conditions set in step S103 and the second prohibited area AR2 set in step S105, the main control unit 30 applies the needle 3 to the area excluding the application area by the second prohibited area AR2 and the nozzle 3. The direction and order of the path to be calculated are calculated, and a needle path including a discharge movement path and a non-discharge movement path according to the setting of the needle movement height is created.
Then, as shown in FIG. 8C, the needle path is displayed on the display unit 9 by the path marker PM2. The path marker PM2 in FIG. 8C is an example that is displayed at substantially the center of each path that constitutes the entire needle path.
The specific needle path creation process sets the entire path, and for each path indicated by one path marker PM2, the start position, end position, path length, direction, needle height during discharge (Z Coordinate value), moving speed, and the like. Further, the needle movement height of the non-ejection movement path is also included in the needle path information.
With such a needle path setting, the movement of the discharge movement path of the needle 16 does not include the second prohibited area AR2 and the application area by the nozzle 3, the movement of the non-discharge movement path is performed at an appropriate height, It should be carried out efficiently according to the coating conditions.

  Actually, the needle pass display by the pass marker PM2 in FIG. 8C and the nozzle pass display by the pass marker PM1 in FIG. 7C may be executed simultaneously on one screen, or may be switched and displayed individually. Good. The display of the prohibited areas AR1 and AR2 may be collected or switched.

The nozzle path and the needle path are created by the processing so far, and an actual coating operation may be performed based on the nozzle path and the needle path.
However, in the example of FIG. 9, the final nozzle path and the needle path are determined through a simulation for verifying whether an appropriate spray path setting has been made, instead of immediately moving to an actual coating operation. .
The actual moving speed of the nozzle 3 and the needle 16 at the time of the coating operation is considerably high for quick coating completion, and the nozzle 3 and the needle 16 are produced as high-precision parts. If the nozzle 3 and the needle 16 that are actually moving come into contact with the electronic components 110, 111, etc., breakage and deformation occur, and replacement is unavoidable. Of course, the electronic components 110 and 111 may be damaged. These should be avoided as much as possible. Therefore, the appropriateness of the path is verified by simulation.
Accordingly, if the nozzle path has not been determined, the process of FIG. 9 proceeds from step S108 to step S109, and first a nozzle path simulation is executed.
The main control unit 30 instructs the motor controller 35 to execute actual nozzle movement according to the nozzle path created in step S106 and displayed on the display unit 9 as the nozzle path simulation of step S109.

  However, before executing the nozzle path simulation and the needle path simulation in step S112 described later, the dummy nozzle 200 and the dummy needle 300 are mounted on the nozzle holder 4 as described in FIGS. 3B and 3C. deep. For example, the operator replaces the nozzle before starting the spray pass setting process of FIG. Alternatively, if the nozzle is not replaced, the main control unit 30 displays a message prompting nozzle replacement on the display unit 9 before the simulation is started, and it is confirmed that the dummy nozzle 200 and the dummy needle 300 are attached. After that, run the simulation. The main control unit 30 can detect the mounting state of the dummy nozzle 200 and the dummy needle 300 based on the electrical connection state with the dummy nozzle sensor 56 and the dummy needle sensor 57.

  With the dummy nozzle 200 mounted as shown in FIG. 3B, the dummy nozzle 200 is moved in the same manner as the nozzle 3 during actual spraying. That is, the X motor 7, the Y motor 8, the nozzle Z motor 5, and the nozzle rotation motor 6 are driven and controlled, and the movement of each path indicated by each path marker PM1 is changed to the set start position, end position, path length, direction. The nozzle rotation angle (θ), the nozzle height, and the moving speed are executed. The main control unit 30 monitors detection information of the dummy nozzle sensor 56 during the simulation movement.

FIG. 10A shows a state in which the dummy nozzle 200 is moved to the simulation at the application height position. If the created nozzle path is not appropriate, the tip 200a may come into contact with the electronic component 110 or collide strongly as shown in FIG. 10B. The main control unit 30 confirms such contact based on detection information from the dummy nozzle sensor 56.
During the nozzle path simulation, the main control unit 30 stores the X, Y, and Z coordinates when contact is detected, corresponding to the path.
If there is a contact point at the end of the series of nozzle path simulation movements, the main control unit 30 returns from step S110 to step S106 to correct the nozzle path. In other words, the nozzle path is corrected so that no contact portion is generated.
In addition, since the needle path may need to be corrected along with the correction of the nozzle path, the needle path is also corrected in step S107.
After these corrections, the main control unit 30 proceeds again from step S108 to step S109, and again executes the nozzle path simulation.
That is, the nozzle path simulation is repeated while correcting as necessary, and finally the nozzle path is set so that the tip end portion 200a of the dummy nozzle 200 does not contact the electronic components 110, 111, and the like.
If it is confirmed as a result of one or a plurality of nozzle path simulations that the nozzle path is not in contact, the process proceeds from step S110 to step S111, and the nozzle path at that time is determined as the nozzle path to be actually used.

  In the above description, when a series of nozzle path simulation movements is completed, if contact is detected in the movement process, the correction in step S106 is performed. However, if contact is detected during simulation movement, nozzle path movement is performed. Instead of waiting for completion of the above, it is possible to immediately move to the correction of step S106. That is, it is good also as a process which corrects a path | pass every time a contact location is found one by one.

After determining the nozzle path, the main control unit 30 performs a needle path simulation in step S112. With the dummy needle 300 attached as shown in FIG. 3C, the dummy needle 300 is moved in the same manner as the needle 16 during actual spraying. That is, the X motor 7, the Y motor 8, and the needle Z motor 15 are driven and controlled, and the movement of each path indicated by each path marker PM2 is changed to the set start position, end position, path length, direction, needle height, and movement. Let it run at speed.
As in the case of the dummy nozzle 200 described above, the tip 300a of the dummy needle 300 may come into contact with or collide with the electronic components 110, 111, etc. if the created needle path is not appropriate. The main control unit 30 confirms such contact based on detection information from the dummy needle sensor 57. During the needle path simulation, the main control unit 30 stores the X, Y, and Z coordinates when contact is detected, corresponding to the path.
If there is a contact point at the end of the series of needle path simulation movements, the main control unit 30 returns from step S113 to S107 to correct the needle path. In other words, the needle path is corrected so as to avoid contact points.
After this correction, since the nozzle path has already been determined, the main control unit 30 proceeds from step S108 to step S112, and executes the needle path simulation again.
In other words, the needle path simulation is repeated while correcting as necessary, and finally the needle path 300 is a needle path in which the tip portion 300a of the dummy needle 300 does not come into contact with the electronic components 110, 111 and the like.
If it is confirmed as a result of one or more needle path simulations that the needle path does not cause contact, the process proceeds from step S113 to S114, and the needle path at that time is determined as the needle path to be actually used.

In the above description, when a series of needle path simulation movements is completed, if contact is detected in the movement process, the correction in step S107 is performed. However, if contact is detected during simulation movement, the needle path is corrected. Instead of waiting for the completion of the movement, the correction may be immediately started in step S107. That is, it is good also as a process which corrects a path | pass every time a contact location is found one by one.
Further, although not shown in the processing example of FIG. 9, it is also possible to perform processing in which the nozzle path can be corrected as the needle path is corrected. That is, if contact is detected in the needle path simulation, both correction processes may be performed in steps S106 and S107, or the nozzle path may be corrected after the needle path is corrected.
In addition, when the nozzle path correction is performed after such a needle path simulation, a processing example in which the process is restarted from the nozzle path simulation is also conceivable. In other words, when there is no problem in both the nozzle path simulation and the needle path simulation, the process may be such that both the nozzle path and the needle path are determined for the first time.

After the nozzle path and needle path are determined by the above spray path setting process, the nozzle 3 and needle 16 are mounted instead of the dummy nozzle 200 and dummy needle 300, and the actual coating operation can be performed. For example, after the operator replaces the nozzle 3 and needle 16, the input unit 31 instructs the start of coating.
As a result, the main control unit 30 controls the execution of the coating agent coating on the circuit board 100.
For example, the main control unit 30 first instructs the motor controller 35 to execute the movement according to the nozzle path, and instructs the discharge control unit 40 to discharge the coating agent from the nozzle 3. Thereby, application | coating is performed on the circuit board 100 by the path | route of a nozzle path.
When the application in the nozzle path is completed, the main control unit 30 then instructs the motor controller 35 to perform movement according to the needle path, and also instructs the discharge control unit 40 to apply the coating agent from the needle 16. The discharge is performed. Thereby, application | coating is performed on the circuit board 100 by the path | route of a needle path.
With the above control, application of the coating agent on the circuit board 100 is completed.

According to such processing of the present embodiment, by setting the nozzle path and the needle path, respectively, the application can be performed with an efficient discharge movement path and considering the first and second prohibited areas AR1 and AR2. It can be carried out. Further, since the nozzle movement height and needle movement height for the non-ejection movement path are set, the movement of the non-ejection movement path can be performed efficiently and without colliding with the electronic components 110, 111, and the like.
Moreover, the path is corrected as necessary by the simulation process, and the nozzle 3 or the needle 16 is determined as a spray path that does not come into contact with the electronic components 110, 111, etc., thereby damaging the device and the circuit board 100. It is possible to perform a safe spray application operation that does not cause the above.

In the simulation, the dummy nozzle 200 and the dummy needle 300 are used, and the tip portions 200a and 300a are elastically deformable or bendable members such as springs. Therefore, there is no possibility of damaging the electronic components 110, 111, etc. during the simulation.
An example of the dummy nozzle 200 that can refract the tip end portion 200a is shown in FIGS. 10C and 10D. For example, let the front-end | tip part 200a be the rod-shaped body pivotally supported by the dummy nozzle base 200b. Even in such a configuration, the tip part 200a is bent at the time of contact with the electronic parts 110, 111, etc., as shown in the figure, so that the electronic parts 110, 111, etc. are not damaged. The dummy nozzle sensor 56 provided in the dummy nozzle base 200b may be configured to detect such a bent state mechanically or optically.
Of course, it is conceivable to use a rubber material, a sponge material, or other flexible materials in addition to the above-described spring as the elastically deformable tip portion 200a.
As the contact detection, it is conceivable to use a contact sensor such as a piezoelectric element in addition to mechanical detection and optical detection.
Each of the above points can be considered as a modified example in the case of the dummy needle 300 as well.

Further, since the dummy nozzle 200 and the dummy needle 300 are used for the simulation and the coating agent is not actually discharged, the coating agent is not consumed during the simulation. Considering the case where the simulation is performed many times with correction in particular, the simulation using the dummy nozzle 200 and the dummy needle 300 without using the coating agent is suitable.
The main control unit 30 includes an imaging unit 25 and performs processing for capturing an image of the circuit board 100 captured by the imaging unit 25. As a result, the processing object image can be easily captured, and the spray path setting process can be made more efficient.

<4. Other needle examples>
As another example of the needle 16, a needle 16 </ b> Aa whose bent end portion 16 </ b> Aa is bent can be considered as in the needle 16 </ b> A shown in FIG. 11A. For example, a needle shape in which the distal end portion 16Aa is bent by 90 ° is shown.
As a result, as shown in FIG. 11B, it is possible to apply to a place such as a side surface of the component 112 that cannot be applied from above. Further, it is possible to apply the side surface of the substrate 100 as shown in FIG.

Further, when the tip portion is bent as described above, a needle rotation motor may be provided so that the needle 16A can also rotate in the θ direction. Then, as shown in FIG. 11C, it is also possible to apply each side surface of the parts 112, 113, 114, and 115. The figure schematically shows only the bent portion of the tip 16Aa. First, the side surface of the component 112 is applied. Then, as indicated by the arrow d1, the component moves to the vicinity of the component 113 and is rotated by 90 ° in the θ direction. As a result, the front end portion 16Aa faces the side surface of the component 113, and side surface application is executed. Thereafter, the movement of arrow d2 → 90 ° rotation → side application of component 114 → arrow d3 movement → 90 ° rotation → part 115 side application is advanced, so that the operation is continued by the parts 112, 113, 114, 115. Side application of each part can be performed in a narrow area.
It is also possible to apply through a narrow portion. In that case, the θ rotation direction position may be controlled so that the bending direction matches the narrow road direction as shown in FIG. 11D.

  11 shows an example in which the distal end portion 16Aa is bent by 90 °, a bent needle of another angle such as 30 ° or 45 ° from the vertical direction is also assumed. For example, when it is desired to apply a gap or the like below the component 112, a 45 ° bending needle may be suitable.

<5. Program>
The program according to the embodiment is a program that causes an arithmetic processing device such as a CPU or a DSP (Digital Signal Processor) to execute the above-described spray path setting process of FIG.
That is, a process for capturing an image of an object to be coated, a process for setting a nozzle movement height that is a height position when the nozzle 3 is not ejected, and a needle movement that is a height position when the needle 16 is not ejected. A process for setting the height, a process for setting the first prohibited area AR1 for the nozzle 3 on the application object image, and a second prohibited area AR2 for the needle 16 on the application object image. A process of creating a nozzle path including a discharge movement path excluding at least the first prohibited area AR1 and a non-discharge movement path according to the setting of the nozzle movement height as a spray path for the nozzle 3, and a needle 16 As the spray path, a discharge movement path excluding at least the second prohibited area AR2 and a non-discharge movement path according to the setting of the needle movement height are included. A process of creating a Dorupasu a program to be executed by the processor.
In addition, a process for performing a nozzle movement trial operation on the created nozzle path and correcting the nozzle path or determining the nozzle path according to the trial result, and a needle movement trial operation on the created needle path are executed. A program for causing the arithmetic processing unit to execute a process of correcting the needle path or determining the needle path according to the trial result may be used.

Such a program can be recorded in advance in a memory unit 34 as a recording medium built in the coating apparatus 1, an HDD (Hard Disk Drive), or a ROM in a microcomputer having a CPU. .
Alternatively, a flexible disk, CD-ROM (Compact Disc Read Only Memory), MO (Magneto optical) disk, DVD (Digital Versatile Disc), Blu-ray Disc (Blu-ray Disc (registered trademark)), magnetic disk, semiconductor memory, It can be stored (recorded) temporarily or permanently in a removable recording medium such as a memory card. Such a removable recording medium can be provided as so-called package software.
Further, such a program can be downloaded from a removable recording medium to a personal computer or the like, or downloaded from a download site via a network such as a LAN (Local Area Network) or the Internet.
Moreover, according to such a program, it is suitable for wide provision of the coating apparatus 1 of embodiment.

<6. Modification>
In the embodiment, an example in which a fan-shaped spray pattern is discharged from the nozzle 3 is described. However, the nozzle does not necessarily have to discharge a fan-shaped spray pattern.
For example, the present invention can be applied even to a nozzle that discharges a spray pattern spreading in a conical shape. That is, even a combination of a nozzle having a conical spray pattern and a needle having a fine line spray pattern is assumed to be appropriately applied based on the above-described spray path setting process.

In the embodiment, the nozzle 3 and the needle 16 are mounted on the same nozzle holder 4 and moved. However, the needle 16 and the nozzle 3 are mounted on separate holders and moved individually in the X and Y directions. An example of such a configuration is also conceivable.
In the above-described spray path setting process, it is preferable to perform a path setting so that the nozzle 3 and the needle 16 do not pass over the first and second prohibited areas AR1 and AR2. Furthermore, it is preferable to control so that the nozzle 3 and the needle 16 do not pass at least above the second prohibited area AR2 either during application, after application, or before application starts. This is because it is possible to prevent the coating agent from adhering to at least the second prohibited area AR2 due to liquid dripping from the nozzle 3 or the needle 16.

The coating apparatus according to the embodiment is not limited to a coating apparatus that forms a thin film on a circuit board, but can be applied to a coating apparatus that forms a thin film or the like on various objects to be processed. The thin film can be applied to coating various films such as a moisture-proof film, a rust-proof film, a paint film, and a colored film.
The liquid discharge apparatus of the present invention is not limited to the coating apparatus as in the embodiment, and a liquid discharge apparatus that discharges pressurized liquid for various purposes such as film formation, cleaning, and painting, and a spray path setting method thereof Or, it can be widely applied as a program.
Furthermore, the present invention can be applied to a substrate bonding apparatus and a laser processing apparatus.

In addition, the present invention is a liquid ejection device provided with two nozzles (nozzle and needle), but as an invention grasped from the detailed description of the above invention, at least one of the following (1) to (13) A liquid ejection apparatus having one nozzle, a nozzle path setting method, and a program are also assumed.
(1) a nozzle for discharging a coating liquid;
Moving means for moving the nozzle;
While performing a nozzle path setting process for setting a nozzle path, which is a movement path at the time of the application of the nozzle, to the application processing object, the moving means moves the nozzle based on the set nozzle path while moving the nozzle. Control means for executing discharge of the coating liquid with respect to
With
The control means, as the nozzle path setting process,
Processing to capture an object image to be applied;
A process of setting the nozzle movement height, which is the height position at the time of non-ejection movement of the nozzle,
A process of setting an application prohibited area on the application object image;
A process of creating a nozzle path including a discharge movement path excluding at least the application prohibited area and a non-discharge movement path according to the setting of the nozzle movement height;
Liquid ejecting device that performs.
(2) In the nozzle path setting process, the control unit further includes:
The liquid ejecting apparatus according to (1), wherein a trial operation of nozzle movement is executed in the created nozzle path, and the spray path is corrected or the spray path is determined according to the trial result.
(3) The liquid ejection device according to (1), wherein the nozzle moving height is set to a height that exceeds a height of a structure provided on the coating object.
(4) Provide input means,
The liquid ejecting apparatus according to (1), wherein the control unit performs a process of setting the application prohibited area based on an input from the input unit.
(5) The liquid ejecting apparatus according to (1), wherein the control unit performs a process of setting the application prohibited area based on an image analysis result of the application object image.
(6) A dummy nozzle that has a tip portion substantially the same size as the tip portion of the nozzle and can be elastically deformed or refracted, and outputs a contact detection signal in accordance with the elastic deformation or refraction of the tip portion. It can be replaced and installed,
The liquid ejecting apparatus according to (2), wherein the control unit corrects a nozzle path according to reception of the contact detection signal when a trial operation of nozzle movement is performed in a state where the dummy nozzle is mounted. .
(7) provided with imaging means;
The liquid ejecting apparatus according to (1), wherein the control unit performs a process of capturing the application object image picked up by the image pickup unit.
(8) The liquid ejecting apparatus according to (1), wherein a discarding unit that performs discharge of the coating liquid as discarding from the nozzle is provided.
(9) The liquid ejecting apparatus according to (1), wherein a soaking part for soaking the nozzle in a diluent of the coating liquid is provided.
(10)
A nozzle for discharging a coating liquid;
Moving means for moving the nozzle;
As a nozzle path setting method for setting a nozzle path, which is a movement path at the time of the application operation of the nozzle, with respect to an object to be applied in a liquid ejection apparatus provided with:
Capturing a coating object image;
A step of setting a nozzle moving height which is a height position at the time of non-ejection movement of the nozzle;
A step of setting a coating prohibited area on the coating object image;
A step of creating a nozzle path including a discharge movement path excluding at least the application prohibited area and a non-discharge movement path according to the setting of the nozzle movement height;
A nozzle path setting method.
(11) The nozzle path setting method according to (10), further including a step of performing a nozzle movement trial operation on the created nozzle path and performing a nozzle path correction or a nozzle path determination according to the trial result.
(12) a nozzle for discharging a coating liquid;
Moving means for moving the nozzle;
As a program for causing the arithmetic processing unit of the liquid ejection apparatus including
Processing to capture an object image to be applied;
A process of setting the nozzle movement height, which is the height position at the time of non-ejection movement of the nozzle,
On the application object image, a process for setting an application prohibition area;
A process of creating a nozzle path including a discharge movement path excluding at least the application prohibited area and a non-discharge movement path according to the setting of the nozzle movement height;
A program that executes
(13) The program according to (12), further causing the arithmetic processing unit to execute a process of performing a nozzle movement trial operation on the created nozzle path and correcting the nozzle path or determining the nozzle path according to the trial result.

DESCRIPTION OF SYMBOLS 1 ... Coating apparatus 2 ... Worktable part 3 ... Nozzle 4 ... Nozzle holder 5 ... Nozzle Z motor 6 ... Nozzle rotation motor 7 ... X motor 8 ... Y motor 9 ... Display part 10 ... Substrate mounting table 11 ... X direction guide 12 ... Y direction guide 15 ... Needle Z motor 16 ... Needle 21 ... Light emitting part 22 ... Light receiving part 23 ... Discarding part 24 ... Soaking part 25 ... Imaging part 26 ... Brush 27 ... Mirror 30 ... Control part 31 ... Input part 32 ... Image Processing unit 33: Display drive unit 34 ... Memory unit 35 ... Motor controller 42 ... Sensor drive unit 46 ... External interface 51, 52, 53, 54, 55 ... Position detection unit 56 ... Dummy nozzle sensor 57 ... Dummy needle sensor 200 ... Dummy Nozzle 300 ... Dummy needle

Claims (15)

A nozzle for discharging the application liquid in a fan shape or a conical shape;
A needle for discharging the coating liquid into a thin line;
Moving means for moving the nozzle and the needle;
A spray path setting process for setting a spray path, which is a movement path during the application operation of the nozzle and the needle, is performed on an object to be coated, and the nozzle and the needle are moved by the moving means based on the set spray path. Control means for causing the application liquid to be discharged onto the object to be applied while being moved;
With
The control means, as the spray path setting process,
Processing to capture an object image to be applied;
A process of setting the nozzle movement height, which is the height position at the time of non-ejection movement of the nozzle,
Processing for setting the needle moving height which is the height position at the time of non-ejection movement of the needle;
A process of setting a first application prohibited area for the nozzle on the application object image;
A process for setting a second application prohibited area for the needle on the application object image;
As the spray path for the nozzle, a process for creating a nozzle path including a discharge movement path excluding at least the first application prohibited area and a non-discharge movement path according to the setting of the nozzle movement height;
A process of creating a needle path including a discharge movement path excluding at least the second application prohibition area and a non-discharge movement path according to the setting of the needle movement height as the spray path for the needle. Perform liquid ejection device. In the spray path setting process, the control means further includes:
A process of performing a nozzle movement trial operation on the created nozzle path and correcting the nozzle path or determining the nozzle path according to the trial result;
In the created needle path, a process for performing a needle movement trial operation and correcting the needle path or determining the needle path according to the trial result; and
The liquid ejecting apparatus according to claim 1, wherein   The liquid ejecting apparatus according to claim 1, wherein the nozzle moving height and the needle height are set to a height that exceeds a height of a structure provided on the coating object. With input means,
The control means includes
2. The liquid ejection apparatus according to claim 1, wherein one or both of the process of setting the first application prohibited area and the process of setting the second application prohibited area is performed based on an input from the input unit. The control means includes
The one or both of the process which sets the said 1st application prohibition area and the process which sets the said 2nd application prohibition area are performed based on the image analysis result of the said application | coating process target image. Liquid ejection device. The tip is substantially the same size as the tip of the nozzle and can be elastically deformed or refracted, and a dummy nozzle that outputs a contact detection signal according to the elastic deformation or refraction of the tip is replaced with the nozzle. It can be installed,
The liquid ejecting apparatus according to claim 2, wherein the control unit corrects a nozzle path according to reception of the contact detection signal when a trial operation of nozzle movement is executed in a state where the dummy nozzle is mounted. The tip of the needle is approximately the same size as the tip of the needle and can be elastically deformed or refracted, and a dummy needle that outputs a contact detection signal in accordance with the elastic deformation or refraction of the tip is replaced with the needle. It can be installed,
3. The liquid ejection according to claim 2, wherein the control unit corrects a needle path in response to reception of the contact detection signal when a trial operation of needle movement is executed in a state where the dummy needle is mounted. apparatus. Comprising imaging means,
The liquid ejecting apparatus according to claim 1, wherein the control unit performs a process of taking in the application object image captured by the imaging unit.   The liquid ejection apparatus according to claim 1, further comprising a discarding unit that discharges the coating liquid as the discarding from the nozzle or the needle.   The liquid ejection apparatus according to claim 1, further comprising a soaking part for immersing the nozzle or the needle in a diluent of a coating liquid.   The liquid ejecting apparatus according to claim 1, wherein the needle has a bent tip. A nozzle for discharging the application liquid in a fan shape or a conical shape;
A needle for discharging the coating liquid into a thin line;
Moving means for moving the nozzle and the needle;
As a spray path setting method for setting a spray path, which is a movement path at the time of the application work of the nozzle and the needle, with respect to the object to be applied in the liquid ejection apparatus provided with
Capturing a coating object image;
A step of setting a nozzle moving height which is a height position at the time of non-ejection movement of the nozzle;
A step of setting a needle moving height which is a height position at the time of non-ejection movement of the needle,
Setting a first application prohibited area for the nozzle on the application object image;
Setting a second application prohibited area for the needle on the application object image;
Creating a nozzle path including a discharge movement path excluding at least the first application prohibition area and a non-discharge movement path according to the setting of the nozzle movement height as the spray path for the nozzle;
Creating a needle path including a discharge movement path excluding at least the second application prohibition area and a non-discharge movement path according to the setting of the needle movement height as the spray path for the needle;
A spray path setting method. A step of performing a nozzle movement trial operation on the created nozzle path, and correcting the nozzle path or determining the nozzle path according to the trial result; and
The spray path setting method according to claim 12, further comprising a step of executing a trial operation of needle movement with the created needle path and correcting the needle path or determining the needle path according to the trial result. A nozzle for discharging the application liquid in a fan shape or a conical shape;
A needle for discharging the coating liquid into a thin line;
Moving means for moving the nozzle and the needle;
As a program for causing the arithmetic processing unit of the liquid ejection apparatus provided with a process for setting a spray path, which is a movement path during the application operation of the nozzle and the needle, to the application processing object,
Processing to capture an object image to be applied;
A process of setting the nozzle movement height, which is the height position at the time of non-ejection movement of the nozzle,
Processing for setting the needle moving height which is the height position at the time of non-ejection movement of the needle;
A process of setting a first application prohibited area for the nozzle on the application object image;
A process for setting a second application prohibited area for the needle on the application object image;
As the spray path for the nozzle, a process for creating a nozzle path including a discharge movement path excluding at least the first application prohibited area and a non-discharge movement path according to the setting of the nozzle movement height;
A process of creating a needle path including a discharge movement path excluding at least the second application prohibition area and a non-discharge movement path according to the setting of the needle movement height as the spray path for the needle. The program to be executed. A process of performing a nozzle movement trial operation on the created nozzle path and correcting the nozzle path or determining the nozzle path according to the trial result;
The program according to claim 14, further comprising: causing the arithmetic processing device to further execute a process of executing a needle movement trial operation on the created needle path and correcting the needle path or determining the needle path according to the trial result. .

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