JP2013000706A - Method, device, and program for forming substrate shielding layer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that an inferior product is generated when a coating agent is applied on a hole or a terminal part for an electrode although a substrate mounting the electronic component forms a substrate shielding layer by applying a resin-based coating agent and it is covered not to cause rust or corrosion.SOLUTION: A method for forming the substrate shielding layer sets a coating prohibition area on a display, calculates a nozzle path with a control part, performs programming so as to efficiently apply the coating agent, and can simply apply the coating agent since masking working is not needed.

Description

An apparatus according to the present invention is a substrate shielding layer forming method for applying a coating agent on a substrate to which an electronic component is attached, and preventing water from directly adhering to the substrate or generating rust due to moisture in the air, and The present invention relates to an apparatus and a program.

  When coating a substrate with such electronic components attached, the area where you do not want the coating agent to adhere (hereinafter referred to as the `` prohibited area '') is masked to coat the entire surface, and then the masking is removed to complete the coating operation. It was.

In addition, the coating agent must be evenly applied so as not to cause pinholes or the like that are generated due to variations in the portions not applied by the coating agent and the application thickness.

In the conventional example shown in Patent Document 1 shown in FIG. 7, the coating agent 91 is discharged from the nozzle 90 as the pressurized liquid 94, and just before the atomization in the vicinity of the maximum width of the fan-like discharge pattern (tabill-like film) 92. The substrate 20 is configured to be applied depending on the location (cross section YY).

Below the cross section YY in the figure of the conventional example, the fan-like discharge pattern 92 becomes an atomized shape 93. When the coating agent is in an atomized state 93, the number of unapplied portions and pinholes increases, and the coating agent is sprayed and sprayed onto the prohibited area.

The inside of the prohibited area is often an electrode insertion part or a connector attachment part for energizing other parts from the board, and if a coating agent is attached, it becomes a defective product.
In addition, the side and back of the substrate are also parts where the conveyors etc. come into contact with each other during transportation, which may stick to the coating agent and cause clogging of the transportation. It was hoped that.

Japanese Patent Publication No. 6-59451

In the conventional example, the entire upper surface of the substrate is applied with a coating agent. However, since there are electronic components on the substrate, it was covered with a masking tape to prevent the coating agent from adhering. The part covered with this masking tape (hereinafter referred to as “prohibited area”) must be removed later.
In order to apply without covering (hereinafter referred to as masking) to the prohibited area, it is necessary to stop the application operation when the nozzle passes over the prohibited area. Therefore, it is necessary to set the movement order of the nozzles and the discharge position of the coating agent in detail, and it takes a lot of time.

Also, depending on the setting conditions of the prohibited area, the application area may be narrow, so even if the efficiency is low, use a narrow nozzle from the beginning to apply with a uniform application thickness, or during the application work In some cases, the nozzle was forced to be replaced with a narrow one.
Further, in a single nozzle application process, if the area cannot be applied with the efficient reference application width h of the fan-like discharge pattern, the nozzle must be applied several times for application. However, when it passes several times, an overcoating region occurs, and the coating thickness may be too thick or droop. In order to reduce the overcoating area, it is necessary to change the nozzle as described above, and it takes a long time for the replacement work, and when the already applied part begins to harden, the entire application is successful. There were times when it didn't go.
The fan-like discharge pattern by the coating agent discharged from the nozzle can be changed slightly depending on the shape of the nozzle and the pressure at the time of discharge, but it takes time to change the fan-like discharge pattern by changing the pressure. It was necessary to make a fine adjustment.
In addition, the coating agent hardens at the nozzle outlet and the fan-shaped discharge pattern may change, and it is so delicate that the shape of the fan-shaped discharge pattern must be measured periodically during the coating operation. Changing the application width of the nozzle was not an easy task.

Therefore, in a coating method in a substrate coating apparatus that applies a coating agent to a substrate composed of electronic components by a nozzle, the coating agent is discharged from the nozzle in a fan-shaped pattern, and the fan-shaped pattern is applied in the nozzle traveling direction. An efficiency-priority coating process that proceeds perpendicularly to the fan-shaped pattern and that is applied to the substrate; and a fan that rotates the nozzle with respect to the nozzle traveling direction during a coating operation that is narrower than the width of the fan-shaped pattern; The substrate coating is characterized in that the controller performs the detailed coating process in which the coating operation is performed while being inclined with respect to the traveling direction and the width is narrower than the width of the fan-shaped pattern. Method,
Furthermore, in the coating apparatus which applies a coating agent to a substrate composed of electronic components by a nozzle, the fan-shaped pattern has a width in which the fan-shaped pattern is applied in the nozzle traveling direction by discharging the coating agent from the nozzle in a fan-shaped pattern. Efficiency-priority coating means that travels orthogonally to the substrate and applies a coating operation on the substrate, and when the coating operation is narrower than the fan-shaped pattern, the nozzle is rotated with respect to the nozzle traveling direction, and the fan-shaped pattern is moved in the traveling direction. A substrate coating apparatus, comprising: a detailed coating unit that applies a width narrower than a width of the fan-shaped pattern by proceeding in an oblique manner with respect to the fan-shaped pattern;
A program for causing a substrate coating apparatus to apply a coating agent to a substrate composed of electronic components by means of a nozzle to perform a coating operation, wherein the coating agent is ejected from the nozzle in a fan-shaped pattern and the fan-shaped in the nozzle traveling direction. An efficiency-priority application step for increasing the work efficiency by applying a coating operation to the substrate by proceeding so as to be orthogonal to the fan-shaped pattern with a width where the pattern is efficiently applied; Is a detailed coating step in which a nozzle is rotated with respect to the nozzle traveling direction, and the fan-shaped pattern is applied so as to be inclined with respect to the traveling direction to perform a coating operation to apply a width narrower than the width of the fan-shaped pattern; A program for executing, is presented.

In the fine coating step, the coating thickness of the coating agent is set to the width of the fan-shaped pattern in the nozzle traveling direction by increasing the traveling speed according to the nozzle rotation angle at the time of the coating work narrower than the width of the fan-shaped pattern. A substrate coating method, wherein the control unit is caused to execute so as to be the same thickness as the coating thickness when the substrate is applied and applied to the substrate;
Furthermore, the fine coating means increases the traveling speed in accordance with the nozzle rotation angle during the coating operation with a width narrower than the width of the fan-shaped pattern, so that the coating thickness of the coating agent becomes the width of the fan-shaped pattern in the nozzle traveling direction. A substrate coating apparatus, wherein the coating is performed so that the thickness is the same as the coating thickness when the coating is applied to the substrate,
In addition, when the coating operation is narrower than the width of the fan-shaped pattern, the coating speed of the coating agent is increased by the width of the fan-shaped pattern in the nozzle moving direction by increasing the traveling speed according to the nozzle rotation angle. The present invention presents a program characterized in that the control unit is executed so as to have the same thickness as the coating thickness when the coating operation is performed.

According to the present invention, the board is imaged, stored in the control unit, corrected to the actual size, arranged so that the actual image and the image are coincident with each other, projected on the display, and directly prohibited from imaging the board (not shown). ) Or a touch panel display, etc., so that the prohibited area can be easily set and the work can be completed in a short time.

Further, according to the present invention, the nozzle moving order can be changed in a short time by changing the setting condition from the input unit.
Furthermore, the most efficient nozzle operation sequence (hereinafter referred to as nozzle path) can be calculated and executed by the control unit, and the application operation can be completed efficiently.

According to the present invention, the application work procedure and the application work direction can be simulated on the display before the application work is executed, and work errors can be greatly reduced.
Once the substrate is captured by the control unit so that the size of the substrate captured via the input unit matches the size of the substrate placed on the substrate placement unit, the substrate is set once. Since the positioning image (imaging) is stored, if the substrate is set at a predetermined position, the coating operation can be performed accurately and the mass production effect can be improved.

The fan-like discharge pattern of the coating agent applied from the nozzle proceeds so as to be orthogonal to the reference application width h before changing to the atomized pattern, and the application work is performed.
In addition, when applying a width narrower than the efficient reference application width h, the fan-shaped discharge pattern advances obliquely with respect to the direction of travel by rotating the nozzle by a certain angle from the reference position. Thus, the coating operation can be performed, and the coating agent can be applied with an arbitrary width smaller than the reference application width h.

Furthermore, when performing a coating operation with a width narrower than the reference coating width h so that the fan-shaped discharge pattern advances obliquely with respect to the traveling direction by rotating the nozzle by a predetermined angle θ as described above, the rotation angle of the nozzle By increasing the traveling speed according to θ, it is possible to perform coating with the same coating thickness as when the coating operation is performed with the reference coating width h.
With such a configuration, the coating thickness is uniform and the consumption amount per unit area of the coating agent can be suppressed, the amount used can be easily calculated, and the nozzle moves quickly in narrow areas, allowing efficient coating work. .
The application width can be arbitrarily changed without changing delicate parts such as nozzle replacement, coding agent pressurization amount and discharge amount.

An example of an embodiment of the substrate shielding layer forming apparatus of the present invention has a configuration as shown in FIG. Since the substrate shielding layer forming apparatus of the present embodiment can also be used as a part of the production line, the substrate 20 is automatically fed and placed at a predetermined position on the substrate placing table 19 immediately below the nozzle 22, and the coating operation is completed. If it is configured to transfer the substrate 20 later, it is configured so that continuous operation is possible.

The present invention will be described with reference to FIG. The nozzle 22 for applying the coating agent 21 used in the substrate shielding layer forming apparatus of the present embodiment moves in the X direction by driving the X direction guide 31 and the X direction motor 311. Similarly, the Y direction guide and the Y direction motor 321 are driven to move in the Y direction, and the Z direction guide 33 and the Z direction motor 331 are driven to move in the Z direction.
The coating agent is a polyolefin-based, acrylic-based, or polyurethane-based insulating coating agent. The substrate shielding layer is formed by diluting with thinner and applying to the substrate 20 in a liquid state and drying for about 10 minutes.

Here, the configuration of the nozzle 22 and the coating agent 21 will be described with reference to an enlarged nozzle (C) in FIG. The coating agent 21 discharged from the nozzle 22 by the fan-like discharge pattern 211 has a maximum width (hereinafter referred to as a reference application width) h in the cross section AA.
The reference application width h is the most efficient application width. As shown in the enlarged nozzle view (C), the coating agent 21 ejected in the fan-shaped ejection pattern 211 becomes an atomized pattern 212 below the cross section AA, and is not suitable for application. The coating agent 21 applied with the atomized pattern 212 has many portions and pinholes that are not applied, and may become a defective product.
The nozzle 22 is configured to rotate in the θ direction by a rotary motor 34. The movement of the nozzle 22 is controlled by the control unit 2 installed in the gantry 3. The control unit 2 is a computer including an input unit 301, a calculation unit 302, and a storage unit 303.

The substrate mounting table 19 is within the movement range of the nozzle 22, and the substrate 20 is mounted on the substrate mounting table 19. A camera 35 is disposed above the substrate mounting table 19 so that the substrate 20 on the substrate mounting table 19 can be imaged.
The imaging of the camera 35 is stored in the storage unit 303 of the control unit 2 and displayed on the display 30.

In addition to the imaging of the camera 35, the control unit 2 of the present invention can also input the imaging of the substrate 20 imaged elsewhere from the input unit 301 of the control unit 2.
At this time, the image capturing 50 of the substrate displayed on the display 30 is corrected in the control unit 2 so that the substrate 20 placed on the substrate placing unit 19 completely matches. For example, when a 1 cm virtual nozzle is moved in the X direction from the origin a on the substrate imaging 50 on the display 20, the actual nozzle 22 is also 1 cm in the X direction from the origin a on the actual substrate 20 of the substrate platform 19. Moving.
The control unit 2 corrects the virtual substrate imaging 50 displayed on the display 30 and the real substrate 20 placed on the substrate platform 19 so as to completely coincide with each other.
At this time, if the actual size of the substrate 20 and the size of the imaging 50 of the substrate displayed on the display coincide with each other in the control unit 2, the amount of movement of the nozzle 22 can be determined without checking the operation with the camera 35. Can be displayed on the imaging 50.

In this apparatus, the origin position is set, and the control unit 2 corrects the virtual substrate imaging 50 displayed on the display 30 and the real substrate 20 placed on the substrate mounting table 19 completely coincide. .
For example, the corner (corner) of the substrate mounting table 19 is set to the origin a on the coordinates, and the movement distance in the XY direction of the nozzle 22 is set around the origin a.
The imaging stored in the control unit 2 and displayed on the display 30 is also set and stored so that it can be displayed in the original size with the origin a as the center. The actual substrate 20 is also placed so that the origin a of the substrate 20 coincides with the origin a of the substrate position 19, and the coating operation is started. In addition to the point like the origin a, if there is another point or a wall surface that is applied to the side of the substrate 20, the substrate 20 placed at the same position is always in the corrected imaging and display unit 2 of the display 30. Can be matched.
Actually, the pins are ejected at two places on the mounting table 19, and holes for inserting the pins are opened at two places on the substrate 20. By inserting these holes into the pins, the substrate is placed without error in positioning the substrate.

Details of the coating agent 21 by the substrate 20 and the nozzle 22 will be described with reference to FIG. A normal coating operation is performed as shown in FIG.
The nozzle 22 applies the coating agent 21 to the substrate 20 with a fan-like discharge pattern 211. The fan-shaped pattern 211 at this time is just before the atomized shape 93 (near the discharge port of the nozzle 22) as described in the conventional example, so that no pinholes or unpainted portions are generated and the coating agent 21 is applied uniformly and widely. An efficient reference application width h that can be achieved.

Then, the application is performed so that the reference discharge width h formed by the fan-shaped discharge pattern 211 is orthogonal to the nozzle traveling direction (X1 direction in the case of FIG. 2).
When the nozzle 22 reaches the prohibited areas 203 to 207, the blowing of the coating agent 21 is stopped, and the controller 2 controls the coating areas 21 so that the coating agent 21 is not applied to the prohibited areas 203 to 207.

However, the gap between the prohibition area 205 and the prohibition area 207 and the gap between the prohibition area 205 and the prohibition area 206 are very narrow. .

Therefore, as shown in FIG. 2B, if the coating agent 21 is applied so that the nozzle 22 is rotated in the θ direction so that the application width f is narrower than the nozzle traveling direction (X1 direction), the prohibited area 203 ~ 207 is not applied.

The nozzle traveling direction can be not only the X direction but also the Y direction, and can be a circular direction or an oblique direction as shown in FIG. Once the entire surface of the substrate (except for the prohibited areas 203 to 207) is applied with the coating agent 21 in the X direction, the outer periphery of the substrate 20 is applied by thinly applying only the contours of the substrate 20 and the prohibited areas 203 to 207. In addition, it can be surely applied to just before the prohibited areas 203 to 207.
The linear application 502 in FIG. 3A is the reference application width h. When applying with a narrow application width f, apply the coating agent 21 by rotating the nozzle 22 in the θ direction and increasing the moving speed in the same direction as the linear application 502 (according to the graph of FIG. 3B). Thus, the coating thickness is the same as that of the reference coating width h in the linear coating 502.
Similarly, for the circular application 503 and the oblique application 504, the same application thickness can be obtained by increasing the rotation and movement speed of the nozzle 22 when applying with a thin application width f smaller than the reference application width h. It has become.

If the nozzle path 55 is set with the reference application width h for the entire application, the entire substrate 20 may not be applied only with the reference application width h. Finally, an uncoated portion having a width smaller than the reference coating width h is generated. In such a case, it is possible to perform uniform coating by rotating the nozzle 22 so as to have a narrow coating width f, rather than overcoating and changing the coating thickness.
Here, the nozzle path 55 refers to the moving direction and work sequence of the nozzle 22 when the nozzle 22 applies the coating agent 21 to the substrate 20. As shown in FIG. 6A, the application direction is displayed in a triangular display 505 with the reference application width h, and the work order is described and displayed in the triangular display.
When working with a narrow application width f, the application width is displayed, and a direction such as a vertical direction or a horizontal direction is also displayed with a triangular display 505.
Conventionally, the movement direction and work order of the nozzles 22 are manually input one by one, but in the present invention, the control unit performs arithmetic processing so that the combination becomes the most rational work process. is there.

The thin application width f can be arbitrarily changed according to the rotation angle of the nozzle 22. Further, when the nozzle 22 is rotated to the coating width f, the moving speed corresponds to the table and graph of FIG. 3B without changing the coating setting conditions other than the moving speed of the nozzle 22 (also referred to as the feeding speed). By changing in this way, a uniform coating thickness can be obtained. The table and graph in (B) of FIG. 3 are preset moving speeds according to the rotation angle of the nozzle 22 for uniform application.
For example, when the fan-shaped discharge pattern 211 spreads in a fan shape in the Y direction and the nozzle 22 moves in the X direction, that is, when the movement direction of the fan-shaped discharge pattern 211 and the nozzle 22 is perpendicular to 90 degrees, (C) in FIG. The angle is 90 degrees, the basic application width is 10 mm, and the moving speed of the nozzle 22 is 300 mm per second.
When the movement direction of the fan-shaped discharge pattern 211 and the nozzle 22 is 45 degrees, according to FIG. 3C, the angle is 45 degrees, the thin application width f7.071068 mm, and the movement speed of the nozzle 22 is 475.7359 mm per second.
When the movement direction of the fan-shaped discharge pattern 211 and the nozzle 22 is 30 degrees, according to FIG. 3C, the angle is 30 degrees, the thin application width is 5 mm, and the movement speed of the nozzle 22 is 600 mm per second.

  FIG. 3A shows an example of the display displayed on the display 30. FIG. The origin a of the substrate imaging 50 displayed on the display 30 coincides with the origin a of the substrate 20 placed on the substrate platform 19. The substrate imaging 50 is corrected so as to coincide with the displayed vertical and horizontal scales 511 and 512, and these coordinates coincide with the coordinates of the substrate 20 placed on the substrate platform 19.

The area that should not be applied is the area surrounded by the prohibited area 501. The area to be applied is a linear application 502 in the XY direction. A triangular display 505 drawn in the linear direction application 502 indicates the traveling direction of the nozzle 22. The numbers described in the triangular display 505 indicate the order of the nozzle paths 55.
Similarly, circular application 503 and oblique application 504 are shown.

  (B) in FIG. 3 rotates the nozzle 22 in the θ direction as shown in FIG. 2 (B), the angle θ changes with respect to the nozzle traveling direction X1, and the efficient application width h becomes a narrow application width f. A graph 52 shows the relationship between the nozzle traveling speed g (mm per second) when changed.

FIG. 3C shows a partial extraction of the graph 52 of FIG. According to this, when the fan-shaped discharge pattern 211 is orthogonal to the traveling direction, the angle θ is 90 degrees, the efficient width h is 10, and the nozzle traveling speed is set to 300.
This indicates that when the angle θ is 30 degrees, the thin coating width f is 5, and the nozzle traveling speed g (mm per second) at this time is 600.

FIG. 4 is a flowchart showing the work according to the present invention.
Step S1 for imaging the substrate will be described. The substrate 20 may be imaged by the camera 35 installed in the coating apparatus to produce the substrate imaging 50, or the image data of the substrate imaging 50 imaged elsewhere may be used.
With this configuration, it is not necessary to set the actual substrate 20 in the coating apparatus 1 and simulate the tact of coating work and the amount of coating agent 21, etc. Time can be shortened and rough estimates can be made easily.

  Step S2 for storing the imaging in the control unit will be described. Since the board imaging 50 is stored in the control unit 2 and displayed on the display, the electronic parts on the board can be easily grasped, and the prohibited areas 203 to 207 can be easily set.

Step S3 for correcting the imaging to an actual size will be described. The substrate imaging 50 is displayed on the display 30 and the data stored in the storage unit 303 is corrected so that the substrate imaging 50 stored in the control unit 2 is the same size as the actual substrate 20. That is, as described above in paragraph 21, correction is performed in the control unit 2 so that the imaging 50 of the substrate displayed on the display 30 and the substrate 20 placed on the substrate placement unit 19 completely coincide. For example, when a 1 cm virtual nozzle is moved in the X direction from the origin a on the substrate imaging 50 on the display 20, the actual nozzle 22 is also 1 cm in the X direction from the origin a on the actual substrate 20 of the substrate platform 19. Is configured to move.
The control unit 2 corrects the virtual substrate imaging 50 displayed on the display 30 and the real substrate 20 placed on the substrate platform 19 so as to completely coincide with each other.
The board imaging 50 taken by the camera 35 installed in the device 1 can be controlled by the control unit 2 so as to be stored in perfect agreement with the actual board 20, but taken by various cameras elsewhere. Since the size of the captured image (imaging) varies depending on the resolution, the imaging 50 of the substrate must be corrected so that the actual size matches the scale of the control unit 2. In the present invention, such correction is also possible.

Step S4 for setting the nozzle path origin position for the imaging will be described. The nozzle path 55 is the order in which the nozzles 22 pass. This is an operation for making the origin of the nozzle 22 of the apparatus 1 according to the present invention coincide with the imaging 50 of the substrate stored in the control unit 2. The origin 20 of the imaging 50 of the board | substrate 20 actually displayed and the board | substrate 50 displayed on the display 30 is made to correspond. For example, the corner a of the substrate platform 19 is set as the origin of the nozzle 22, and the corner a of the substrate 20 is brought into contact with that position to place the substrate 20 at a predetermined position on the substrate platform 19.
The control unit 2 stores the angle a of the substrate platform 19 so that it is the origin, and displays the imaging 50 of the substrate on the display 30 so as to coincide with the substrate 20 actually placed. .

Step S5 for setting a spray pattern or a fan-shaped pattern (nozzle type) will be described. The spray pattern or fan-like discharge pattern 211 of the nozzle 22 differs depending on the pressure of the pressurized liquid 34 and the type of the nozzle 22. Conventionally, since the coating agent 21 was applied to the substrate 20 by atomizing with a spray pattern, masking was necessary. In the present apparatus 1, since the film-like liquid agent is applied using a tabtil (fan-shaped film) portion that does not atomize, the application work can be performed without masking.
By setting the conditions for the efficient application width h and application thickness of the fan-shaped discharge pattern 211, the order of the nozzle paths 55 and the settings such as overcoating differ.

Step S6 for setting the overcoat amount will be described. This is a step of setting how much to be applied to the adjacent already applied portion when applying with an efficient application width h. The overcoated portion is illustrated by the overcoated portion 57. Normally, even if the nozzle path 55 is set without overcoating, the adjacent applications are combined by a slight expansion after the application of the liquefied coating agent 21, and the application without a gap is completed.
However, it is necessary to set a large amount of overcoating when a coating operation for completely preventing a non-adhering portion or a pinhole or a thick coating is required.
However, if the coating thickness of coating agent 21 becomes too thick, bubbles may form in the coating film or cracks may occur, causing moisture to adhere to the substrate 20 and causing electrode corrosion, so set the overcoat amount carefully. There is a need.

  Step S7 for setting the margin for the substrate outer periphery will be described. When the coating agent 21 is applied to the end surface of the substrate 20, the coating agent 21 may flow down to form a pinhole or a portion that does not adhere. Further, when the coating agent 21 flows out and adheres to the side surface or the back surface of the substrate 20, the adhesiveness is generated and the thickness changes, which may hinder subsequent conveyance. In addition, the amount of coating agent 21 required is inaccurate.

  If a substrate outer margin 56 that is not applied at intervals of several millimeters is set on the outer periphery of the substrate 20, a coating film is created by maintaining the coating thickness on the substrate 20 by the surface tension of the coating agent 21 applied before the substrate outer peripheral margin 56. can do. The coating agent 21 does not flow down due to this surface tension.

Step S8 for setting the thickness of the substrate will be described. By setting the thickness of the substrate, the height of the nozzle 22 is determined, and it is possible to always apply with the efficient application width h. The coating agent 21 exiting from the nozzle 22 is deformed from a liquid film to a droplet by the YY line described in the conventional example, or has an efficient coating width h above the YY line or the YY line.
When the coating operation is performed with this efficient coating width h, there is no splashing and a uniform coating thickness can be obtained.

Step S9 for setting the application direction will be described. In order to complete the coating operation efficiently and in a short time, it is set whether the substrate 20 should be moved mainly in the horizontal direction (X direction) or the vertical direction (Y direction). The work efficiency is increased and the application work can be shortened.

Step S10 for setting the coating height will be described. As described in step S8 for setting the thickness of the substrate 20, the fan-shaped pattern 211 of the coating agent 21 is formed by selecting the shape of the nozzle 22 and the discharge pressure.
The height of the nozzle 22 corresponding to the height of the electronic component on the substrate 20 and the height for application using the tabtil-shaped portion where the fan-like discharge pattern 211 is not atomized must be set. If past data is available, it is possible to automatically set an efficient application width h simply by inputting conditions.
Further, by performing the operation of step S10 for setting the coating height, the height of the nozzle 22 can be set so as not to contact the irregularities on the substrate 20, and the coating operation can be performed.

Step S11 for setting the moving height will be described. When the nozzle 22 passes over the substrate 20 without performing a coating operation, the nozzle 22 must move in consideration of the height of the electronic components 201 to 202 on the substrate 20. The nozzle 22 should not contact the electronic components 201 to 202 and be damaged.
However, if the moving height is set too high, it takes time for the head 22 to move in the Z direction, resulting in inefficiency.

Step S12 for setting the coating speed will be described. The coating thickness of the coating agent 21 is determined by selecting the nozzle 22, setting the discharge pressure, and setting the coating speed.
If the coating speed is lowered, the coating agent 21 is applied thickly, which may cause cracks or overflow and enter the prohibited areas 203 to 207.
When the application speed is increased, the coating agent 21 is thinly applied, and a portion where the coating agent 21 is not applied is formed, and the amount of splash is increased, and the splash of the prohibited areas 203 to 207 may fly. Here, the application speed when applying the linear direction application 501 is set.

  As shown in the graph of FIG. 3 (B), the nozzle 22 is rotated by the work in step S12 for setting the coating speed so that the same coating thickness can be applied even when the coating work is performed with a narrow coating width f. A uniform coating thickness can be maintained by adjusting the angle and speed.

Step S13 for setting the oblique line application speed will be described. By setting the coating speed at the time of coating as in the oblique coating 504 in FIG. 3A, it is possible to perform coating with the same coating thickness.
If there are slanted parts in the prohibited area, the process, means, and program in step S9 for setting the application direction apply only from the XY direction, so that the application is finished in a staircase at the oblique part. Therefore, finally, the coating can be finished along the vicinity of the oblique portion of the prohibited area by overcoating as shown in the oblique application 504 in FIG.

Step S14 for setting the application speed of arc application will be described. By setting the coating speed at the time of coating as in the circular direction coating 503 in FIG. 3A, it is possible to perform coating with the same coating thickness.
If there is an arc-shaped part in the prohibited area, the process, means, and program in step S9 for setting the application direction apply only from the XY direction, and thus the arc-shaped portion finishes in a staircase pattern. Therefore, the final application can be performed along the vicinity of the arc-shaped portion of the prohibited area by recoating lastly as in the circular application 503 in FIG.

In particular, in the case of circular application 503, the application speed is set differently from the linear application because the inner side of the circle is thicker and the outer side is thinner.

Step S15 for setting the application timing will be described. When the nozzle 22 moves in the application direction, the coating agent 21 discharged from the state in which the nozzle 22 is stopped until the nozzle 22 is accelerated and reaches a constant speed is thickly applied. Similarly, the coating agent 21 discharged before the nozzle 22 is decelerated and stopped is also thickly applied.

Further, when the coating agent 21 is discharged until the nozzle 22 that has moved at a constant speed stops, the coating agent 21 is applied before the stop position of the nozzle 22 due to inertial force. Therefore, the coating agent 21 is applied after the movement of the nozzle 22 reaches a constant speed, and the application of the coating agent 21 is stopped when decelerating from the constant speed until the nozzle 22 reaches a constant speed from the stopped state. The coating agent 21 is set not to be applied during the acceleration and during the deceleration until the nozzle 22 at a constant speed stops.

The prohibited area setting step S16 will be described. This is a step of setting an area where the coating agent 21 is not applied by displaying the captured image of the substrate 20 on the display 30 and surrounding the application prohibited areas 203 to 207. The prohibited areas 203 to 207 are set by setting a prohibited area using a mouse, a touch pen, or the like at a location where the imaging 50 of the substrate displayed on the display 30 is not to be applied.

  The creation step S17 of the nozzle path 55 will be described. By incorporating the conditions described so far, the direction and order of the nozzle path 55 as shown in FIG. 6B are calculated and displayed on the display 30. Since this display has been opened in consideration of the conditions and splash set in step S15 for setting the application timing for the start position and end position of application, each prohibition area 203 is applied after the whole is applied in the X direction. The periphery of ˜207 and the outer periphery of the substrate 20 are overcoated.

  Further, in the fan-shaped discharge pattern 211 having a constant width around the prohibited areas 203 to 207 and at the edge of the substrate, the nozzle 22 is rotated in the θ direction, and the line graph in FIG. The coating speed can be changed based on a numerical value as shown in an example (which varies depending on the nozzle 22), and only the remaining gap can be applied with a thin coating width f. Although an example, the coating thickness can be uniformly finished by performing the coating operation based on the numerical values of (B) and (C) in FIG.

The simulation execution step S18 of the nozzle path 55 will be described. The nozzle path 55 created in step S17 for creating the nozzle path 55 described above is simulated by displaying the operation of the nozzle 22 on the substrate imaging 50 displayed on the display 30. In addition, if necessary, each condition can be changed and simulated many times, so that the coating agent is not consumed and it is efficient.

The application work execution step S19 will be described. The coating operation is executed as described in the simulation execution step S18 of the nozzle path 55 described above.

  The input operation of the setting conditions from step S5 for setting the spray pattern or fan-shaped pattern (nozzle type) to step S15 for setting the application timing is set as step S30 for setting the substrate shielding layer forming condition (see FIG. 4 (B)). .

Next, setting of the prohibited areas 203 to 207 will be described with reference to FIG. A display 304 is an imaging 50 of the substrate 20 displayed on the display 30.
The Y direction of the substrate 20 is stored in the storage unit 303 of the control unit 2 so that the Y direction of the substrate 20 matches the horizontal scale 512 of the imaging 50 of the substrate with reference to the angle a. Similarly, the X direction of the substrate 20 is stored in the storage unit 303 of the control unit 2 so that the X direction of the substrate 20 coincides with the vertical scale 511 of the imaging 50 of the substrate with reference to the angle a.

As a result, the imaging 50 of the substrate on the display matches the actual substrate 20. The distance traveled by the nozzle 22 is reflected in the imaging 50 displayed on the display 30 at the same scale.
Therefore, if the forbidden areas 203 to 207 are designated by the input unit 301 as indicated by the hatched portion in FIG. 5B as indicated by the display 305 in FIG. 5B, the enclosed portion indicates the coating agent 21. As a range not to be applied, it is stored as a portion where the nozzle 22 or the coating agent 21 is not discharged.

That is, when the prohibited areas 203 to 207 are input on the substrate imaging 50, the same portion of the substrate 20 placed as shown in FIG. Set as This setting work is the prohibited area setting step S16 in the flowchart of FIG.

Next, the nozzle path creation step S17 shown in FIG. 6A will be described. A display 306 is a display 306 when the nozzle path creation step S17 is executed after the prohibited areas 203 to 207 are set.

The nozzle path 55 is set so as not to apply to the prohibited areas 203 to 207. These nozzle paths 55 are set with the reference application width h set in step S5 for setting a spray pattern or a fan-shaped pattern.
When the reference application width h overlaps and the application thickness increases, the application width f must be smaller than the reference application width h. In such a case, the coating operation is performed by rotating the nozzle 22 to change the coating width to the necessary thin coating width f.

In addition, since the arbitrarily thin coating width f can be changed as such, the width of the substrate peripheral margin 56 set in step S7, which is set in step S7, can be changed arbitrarily by changing the thin coating width f. It can also be set.

In the display 306, a triangle display 505 is displayed for each of the nozzle paths 55, and the direction of the path movement is indicated by the direction of the triangle display 505.
In addition, a number indicating the order of the nozzle paths 55 is written inside the triangular display 505.

According to the display 306 in FIG. 6A, the application operation is performed so that the prohibited areas 203 to 207 are not applied in the direction of the horizontal scale 512 with the angle a as the origin.
At this time, the entire area is applied in the direction of the horizontal scale 512 so that the coating agent 21 does not adhere to the prohibited areas 203 to 207 with a sufficient space from the prohibited areas 203 to 207, and then the prohibited areas 203 to 207 are enclosed. So that it can be applied as soon as possible.
In this way, the coating is applied so as to surround the prohibited areas 203 to 207, so that the coating agent 21 is prevented from adhering to the prohibited areas 203 to 207 and can be applied just before.

  Finally, the coating operation is performed so as to make a round around the outer periphery of the substrate 20 and the imaging 50 of the substrate, so that the peripheral margin 56 of the substrate outer periphery can be maintained at a constant width, and the overcoat portion 57 can be maintained at a constant width. it can.

FIG. 6B is an enlarged view of the upper portion of the prohibited area 203. The upper path of the electronic component 201 is a portion where the nozzle 22 is rotated and coating is performed with a small coating width f. In FIG. 6 (B), the portion marked in black is the one where the overcoat portion 57 is overcoated in a triangular shape by coating with the nozzle 22 rotating.

The simulation execution unit 551 displayed in white in the enlargement of the display 306 in FIG. 6B shows the simulation of the nozzle path simulation execution 519 in the flowchart of FIG.
The nozzle path simulation execution step S19 is executed in accordance with the order of the triangular display 505 of the nozzle path 55 so that the state of the simulation can be displayed on the display 30 and confirmed.
By this simulation, it is possible to check whether the nozzle path 55 is efficient and the setting contents are correct.

According to the present invention, the board 20 is imaged, stored in the control unit 2, corrected to the actual size, arranged so that the actual image and the imaging coincide with each other, projected on the display 30, and directly on the board 20 imaging area 203. ... 207 can be set on the same scaled image as the actual one from the input unit 301 such as a keyboard or a touch panel display 30, so that the prohibited areas 203 to 207 can be easily set and the work can be completed in a short time.
Further, according to the present invention, the moving order of the nozzles 22 can be set in the calculation unit 302 of the control unit 2 so that all conditions are cleared in a short time.
Further, the most efficient work order can be calculated and executed, and the application work can be completed efficiently.

According to the present invention, the order of the application work and the direction of the application work can be simulated on the display 30 before the application work is executed, and the operation mistake can be greatly reduced.
Since there are positioning processes / means / programs for correcting the imaging of the substrate 20 and the actual substrate 20, if the substrate 20 is set at a predetermined position any number of times, the coating operation can be performed accurately, so that the mass production effect can be improved. .

The fan-like discharge pattern 211 of the coating agent 21 applied from the nozzle 22 proceeds so as to be orthogonal to the reference application width h before the change into the atomized pattern 93 and performs the application operation. However, when applying a width narrower than the efficient application width h, the nozzle 22 is rotated in the θ direction so that the fan-shaped discharge pattern 211 advances obliquely with respect to the traveling direction, and the efficient application width h is achieved. A narrower width can be applied to an arbitrary width. As a result, the coating width can be changed as necessary, so there is no unpainted area. There is also no significant overcoating.

Further, when the fan 22 is rotated in the θ direction so that the fan-like discharge pattern 211 advances obliquely with respect to the advancing direction and the application work with a width smaller than the efficient application width h of the fan-like discharge pattern 211 is performed, the nozzle Since the traveling speed is increased according to the rotational angle θ of 22, coating can be performed with the same coating thickness as when coating is performed with an efficient coating width.
With such a configuration, the coating thickness becomes uniform and the consumption amount per unit area of the coating agent 21 does not increase, so it is easy to calculate the usage amount, and the nozzle 22 moves quickly in a narrow area so that an efficient coating operation can be performed. .
The application width can be arbitrarily changed without changing delicate portions such as the replacement of the nozzle 22 and the pressurization amount and discharge amount of the coding agent 21.

The present invention is not limited to a coating apparatus, but can be applied to a substrate bonding apparatus or a laser processing apparatus.

2 is a bird's-eye view of the main body 1. FIG. FIG. 4 is a diagram showing a relationship between a substrate 20 and a nozzle 22. 5 is a graph and a table showing a relationship between a coating direction and a coating width and a coating speed displayed on the display 30. FIG. 4 is a flowchart showing steps from imaging of a substrate 20 to application work. The board imaging 50 and the prohibited areas 203 to 207 displayed on the display 30 are displayed. The nozzle path 55 displayed on the display 30 and a part of the enlarged view. FIG. 5 is a diagram showing a discharge state of a nozzle 90 and a coating agent 91 of a time-derived example.

1 body
2
Control unit
Three
Stand
19
Substrate placement part
20
substrate
201
Electronic components
202
Electronic components
203
Prohibited area
204
Prohibited area
205
Prohibited area
206
Prohibited area
207
Prohibited area
twenty one
Coating agent
211
Fan discharge pattern
212 Atomized pattern
22 nozzles
30 Display (monitor)
301
Input section
302 Calculation unit
303 memory
304
display
305
display
306 views
31
X direction guide
311
X direction motor
32
Y direction guide
321
Y direction motor
33
Z direction guide
331
Z direction motor
34
Rotating motor
35
camera
50
Board imaging
501
Prohibited area
502
Linear direction application
503
Circular application
504
Diagonal application
505
Triangular display
511
Vertical scale
512
Horizontal scale
52 Graph
53 Table
55
Nozzle path
551 Simulation execution unit
56 Board margin
57 Overpainted part
90
Nozzle (conventional)
91
Coating agent
92
Fan pattern
93
Atomized pattern
94 Pressurized liquid


a Origin θ (nozzle) rotation angle
h
Standard application width
f
Thin application width

Claims (6)

In a coating method in a substrate coating apparatus that applies a coating agent to a substrate composed of electronic components by a nozzle,
An efficiency-priority application step in which the coating agent is ejected from the nozzle in a fan-shaped pattern, and the fan-shaped pattern is applied in the nozzle advancing direction so as to be orthogonal to the fan-shaped pattern and applied to the substrate.
At the time of application work having a width narrower than the width of the fan-shaped pattern, the nozzle is rotated with respect to the nozzle traveling direction, and the fan-shaped pattern is applied so as to be inclined with respect to the traveling direction. A substrate coating method characterized by causing a control unit to execute a detail coating step of coating a width narrower than the width.   In the fine coating process, the coating thickness of the coating agent is increased in the nozzle traveling direction by the width of the fan-shaped pattern by increasing the traveling speed according to the nozzle rotation angle at the time of coating work having a width smaller than the width of the fan-shaped pattern. 2. The substrate coating method according to claim 1, wherein the control unit is caused to perform the same thickness as a coating thickness when the substrate is coated. In a coating apparatus that applies a coating agent to a substrate composed of electronic components by a nozzle,
Efficiency-priority application means that discharges the coating agent from the nozzle in a fan-shaped pattern and proceeds to be orthogonal to the fan-shaped pattern at a width in which the fan-shaped pattern is applied in the nozzle traveling direction;
At the time of application work having a width narrower than the width of the fan-shaped pattern, the nozzle is rotated with respect to the nozzle traveling direction, and the fan-shaped pattern is applied so as to be inclined with respect to the traveling direction. Detailed application means for applying a width narrower than the width;
A substrate coating apparatus comprising:   The fine coating means increases the traveling speed according to the nozzle rotation angle during a coating operation having a width narrower than the width of the fan-shaped pattern, so that the coating thickness of the coating agent advances in the nozzle traveling direction by the width of the fan-shaped pattern. 4. The substrate coating apparatus according to claim 3, wherein the coating is performed so as to have the same thickness as that applied when the substrate is coated. A program for causing a substrate coating apparatus that applies a coating agent to a substrate composed of electronic components by a nozzle to execute a coating operation,
The coating agent is discharged from the nozzle in a fan-shaped pattern, and the fan-shaped pattern is applied in the nozzle advancing direction so as to be perpendicular to the fan-shaped pattern and applied to the substrate to increase work efficiency. An efficiency priority application step,
At the time of application work having a width narrower than the width of the fan-shaped pattern, the nozzle is rotated with respect to the nozzle traveling direction, and the fan-shaped pattern is applied so as to be inclined with respect to the traveling direction. A detail application step for applying a width narrower than the width;
A program that executes During the coating operation with a width narrower than the width of the fan-shaped pattern, the coating speed of the coating agent is increased in the nozzle traveling direction by the width of the fan-shaped pattern by increasing the traveling speed according to the nozzle rotation angle. The program according to claim 5, wherein the control unit is caused to execute so as to be the same thickness as the coating thickness at the time of application.

Images