JP4762596B2 - Chip bonding apparatus and bonding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bonding apparatus of a chip and a bonding method of a chip capable of securing a stabilized amount of discharge of paste with a simplified setting operation in the case where pneumatic paste discharge means is used. <P>SOLUTION: The bonding apparatus of a chip bonds a chip to a board by drawing and applying paste while discharging paste with a pneumatic dispenser. In the apparatus, a discharge pressure calculator 46 calculates discharge pressure, based on chip shape/size data 21a, paste shape data 21b and drawing pattern data 21c, and a relative moving speed of a nozzle to the board in drawing and application and discharge characteristic data (paste viscosity or the like) when discharging the paste. <P>COPYRIGHT: (C)2007,JPO&amp;INPIT

Description

  The present invention relates to a chip bonding apparatus and bonding method for bonding a semiconductor chip to a substrate such as a lead frame via an adhesive paste.

In a die bonding process for manufacturing a semiconductor device, a paste for bonding a semiconductor chip to a substrate such as a lead frame is applied. Conventionally, as this paste coating apparatus, a paste coating technique for applying a paste having a desired shape on a substrate in a predetermined drawing pattern by moving the coating nozzle relative to the substrate while discharging the paste from the coating nozzle. Is known (see, for example, Patent Document 1). In this patent document example, a plunger pump excellent in quantitative discharge characteristics is used as a paste discharge mechanism for discharging paste from an application nozzle. As a result, even when a high-viscosity paste is targeted, a necessary amount of paste is always discharged, and high-precision drawing application can be performed.
JP 2001-135651 A

  By the way, although the above-mentioned plunger type pump has the advantage that it has excellent quantitative discharge characteristics, it has a complicated structure with a high-precision sliding part, so when targeting pastes that are highly viscous and easily cured However, there is a problem that malfunction is likely to occur. In other words, if the paste is left in contact with the wetted part with the sliding part, the normal operation of the sliding part will be hindered. It is required to perform the work repeatedly with high frequency.

  In order to avoid such complicated maintenance work, it is desired to use a pneumatic dispenser with a simple structure and easy handling for paste application. However, since the pneumatic dispenser has a structure that extrudes the paste with a compressible gas, it is difficult to stabilize the discharge amount of the paste, and in order to ensure an accurate discharge amount, it is necessary to carry out condition work by complicated trial and error. It was necessary to execute it repeatedly.

  Accordingly, an object of the present invention is to provide a chip bonding apparatus and a chip bonding method capable of ensuring a stable paste discharge amount by a simple setting operation when using a pneumatic paste discharge means.

According to the first aspect of the present invention, the paste is moved to the chip bonding position by moving the nozzle relative to the substrate by the moving mechanism while discharging the paste from the nozzle by the pneumatic paste discharging means on the substrate. A chip bonding apparatus for applying a drawing and bonding the chip to the substrate via the drawing applied paste, the paste defining the shape / size data of the chip and the paste shape in a state where the chip is bonded a library data storage unit for memorize a library data including drawing pattern data defining a drawing pattern in the shape data and the rendering application, the viscosity of the paste, including the inner and conduit length of the nozzle, the paste from the nozzle Regarding discharge characteristics when discharging The operation input unit for inputting the ejection characteristic data and the relative movement speed of the nozzle in the drawing application, the shape / size data of the chip, and the necessity of the paste from the paste shape data defining the paste shape in a state where the chip is bonded An application amount calculation unit for obtaining a volume, a drawing length calculation unit for obtaining a drawing length of the paste from drawing pattern data for defining a drawing pattern in the drawing application, and an input from the operation input unit at the start of a bonding operation A drawing time calculation unit for calculating a drawing time based on the relative movement speed of the nozzle and the drawing length in the drawing application; and driving the paste discharging unit based on the required volume, drawing time, and discharge characteristic data. A discharge pressure calculation unit for calculating a discharge pressure when discharging the paste; Actuates said paste discharge means on the basis of the discharge pressure was, and a drawing processing unit that controls the moving mechanism based on the relative moving speed and the drawing pattern.

According to the second aspect of the present invention, the paste is moved to the bonding position of the chip by moving the nozzle relative to the substrate by the moving mechanism while discharging the paste from the nozzle by the pneumatic paste discharging means on the substrate. A chip bonding method for applying a drawing and bonding the chip to the substrate via the drawing-applied paste, the paste defining the shape / size data of the chip and the paste shape in a state where the chip is bonded determining a required volume of the paste from the shape data; from drawing pattern data defining the writing pattern in the drawing is applied determining the drawing length of the paste, the relative of the nozzle in the drawing applied at the commencement of the bonding operation Specify the moving speed And a step of calculating a drawing time based on the drawing length and the relative moving speed, and a discharge characteristic when discharging the paste from the nozzle, including a viscosity of the paste, an inner diameter of the nozzle, and a pipe length A step of inputting discharge characteristic data relating to the above, a step of calculating a discharge pressure when discharging the paste by driving the paste discharge means based on the required volume, drawing time and discharge characteristic data, and the calculated discharge Operating the paste discharge means based on the pressure, and controlling the moving mechanism based on the relative moving speed and the drawing pattern.

  According to the present invention, when setting the discharge pressure of the paste discharge means, the shape / size data of the chip, the paste shape data and the drawing pattern data, the relative movement speed of the nozzle to the substrate in the drawing application, and the discharge when discharging the paste from the nozzle By calculating the discharge pressure of the paste discharge means based on the discharge characteristic data relating to the characteristics, it is possible to eliminate the condition setting work by trial and error and ensure a stable paste discharge amount by a simple setting operation. .

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a chip bonding apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing a configuration of a control system of a chip bonding apparatus according to an embodiment of the present invention, and FIG. FIG. 4A is a functional block diagram showing the processing function of the paste application process of the chip bonding apparatus according to the embodiment, and FIG. 4A is a perspective view of the substrate and chip that are the objects of paste application according to the embodiment of the present invention. 4 (b) is an explanatory diagram of paste shape data in the paste application process according to the embodiment of the present invention. FIG. 5 is a flow chart of the bonding operation by the chip bonding apparatus according to the embodiment of the present invention. 7, 8, 9 and 10 are diagrams showing display screens of the chip bonding apparatus according to the embodiment of the present invention, and FIG. 11 is a diagram of the chip bonding apparatus according to the embodiment of the present invention. It is a flow diagram of a strike coating process.

  First, the structure of a chip bonding apparatus will be described with reference to FIG. In FIG. 1, a wafer sheet 2 is held in a chip supply unit 1 by a holding table (not shown). The wafer sheet 2 has a large number of semiconductor chips 3 attached thereto. A conveyance path 5 is disposed on the side of the chip supply unit 1. The conveyance path 5 conveys the substrate 6 and positions the substrate 6 at the paste application position and the bonding position. A bonding head 4 is disposed above the chip supply unit 1, and the bonding head 4 is moved horizontally and moved up and down by a head moving mechanism (not shown).

  A paste application unit 9 is disposed on the side of the conveyance path 5. The paste application unit 9 has a configuration in which a syringe 16 having a nozzle 16 a is attached to the moving table 10. The moving table 10 is configured by stacking an X-axis table 12 on a Y-axis table 11 and further connecting a Z-axis table 14 in the vertical direction via an L-shaped bracket 13 thereon. The Y-axis table 11, the X-axis table 12, and the Z-axis table 14 include a Y-axis motor 11a, an X-axis motor 12a, and a Z-axis motor 14a, respectively. By driving the X-axis motor 12a, the Y-axis motor 11a, and the Z-axis motor 14a, the syringe 16 moves horizontally and vertically on the substrate 6. The moving table 10 is a moving mechanism that moves the nozzle 16 a relative to the substrate 6. Instead of moving the nozzle 16a by the moving table 10, the substrate 6 may be moved relative to the nozzle 16a.

  A paste 7 for adhering the chip 3 to the substrate 6 is stored inside the syringe 16, and the paste 16 is discharged from the nozzle 16 a by applying air pressure to the syringe 16 through the tube 17 by the dispenser 18. Air is supplied to the dispenser 18 by a positive pressure supply source 19. The dispenser 18 that applies air pressure to the syringe 16, the nozzle 16 a, and the syringe 16 is a pneumatic paste discharging means.

  The bonding position where the chip 3 on the upper surface of the substrate 6 is bonded is an application area 6a where paste is applied. The nozzle 16a is discharged while the discharge port of the nozzle 16a is positioned in the application area 6a and the paste is discharged from the nozzle 16a. By moving, the paste 7 is drawn and applied in a cross-shaped (X-shaped) application pattern in the application area 6 a set at the chip mounting position on the surface of the substrate 6.

  After applying the paste, the substrate 6 is sent to the bonding position 8 on the conveyance path 5 and positioned. The chip 3 picked up from the chip supply unit 1 by the nozzle 4a of the bonding head 4 is bonded onto the paste 7 applied in the application area 6a. That is, the chip bonding apparatus shown in FIG. 1 moves the nozzle 16a relative to the substrate 6 by the moving mechanism while discharging the paste 7 from the nozzle 16a by the pneumatic paste discharging means on the substrate 6. The paste 7 is drawn and applied to the bonding position of the chip, and the chip is bonded to the substrate 6 through the paste 7 applied with the drawing.

Next, the configuration of the control system will be described with reference to FIG. In FIG. 2, the dispenser driving unit 30 drives the dispenser 18 to apply a positive pressure for discharging the paste into the syringe 16. By controlling the dispenser drive unit 30 by the control unit 20, the positive pressure applied to the syringe 16 by the dispenser 18 is controlled, and thereby the amount of paste discharged from the nozzle 16a is controlled. The X-axis motor drive unit 31, the Y-axis motor drive unit 32, and the Z-axis motor drive unit 33 drive the X-axis motor 12a, the Y-axis motor 11a, and the Z-axis motor 14a of the moving table 10, respectively. The bonding head drive unit 34 drives the bonding head 4 for bonding the chip 3.

  The storage unit 21 stores programs and control data necessary for the operation and processing of each unit. The control unit 20 controls each unit based on the program and control data stored in the storage unit 21 so that a paste application process described later is executed. The operation / input unit 22 is input means such as a keyboard and a mouse, and inputs operation commands and data. The display unit 23 is a display device and displays a guidance screen at the time of operation input.

  Next, the paste application processing function will be described with reference to FIG. In FIG. 3, the input processing unit 40, the display processing unit 41, the drawing length calculation unit 42, the speed pattern calculation unit 43, the drawing time calculation unit 44, the application amount calculation unit 45, and the discharge pressure calculation unit 46 are controlled by the control unit 20. The process performed by controlling each part based on the following data is shown.

First, library data stored in the storage unit 21 will be described. The library data is data having characteristics as design data for each product type and reference data common to the product types of each chip. The library data is input in advance prior to chip bonding work and is read from the storage unit 21 when the work is executed. The chip shape / size data 21a is data relating to the shape and size of a chip to be bonded. The paste shape data 21 b is data that defines the paste shape in a state where the chip 3 is bonded to the substrate 6. As shown in FIG. 4A, the chip 3 is pressed against the substrate 6 from above the paste 7 applied to the substrate 6, whereby the paste 7 protrudes into the fillet shape around the chip 3. .

  The paste shape in this state is numerically represented by the three parameters (paste thickness T, protrusion B, and rising H) shown in FIG. 4B together with the chip dimensions X and Y shown in FIG. When bonding the chip 3 to the substrate 6 via the paste 7 applied by drawing, if these three parameters T, B, and H are appropriately managed, good bonding quality can be obtained. The paste thickness T indicates the thickness of the paste 7 interposed in the gap between the chip 3 and the substrate 6. The protrusion B is the horizontal dimension of the fillet part, or the rising H is the vertical direction of the fillet part. The spread dimension is shown. By combining the chip dimensions X, Y and these parameters T, B, H, the required volume of the paste 7 for bonding one chip 3 can be obtained by calculation. Note that the calculation is performed by appropriately approximating or ignoring the curved portion of the paste shape.

  The drawing pattern data 21c is data defining a drawing pattern in drawing application in which the paste 16 is applied to the substrate 6 by moving the nozzle 16a (see FIG. 7). The basic speed pattern 21d is data that defines the basic pattern of the rotational speed of the Y-axis motor 11a, the X-axis motor 12a, and the Z-axis motor 14a when the moving table 10 is driven to move the nozzle 16a relative to the substrate 6. (See FIG. 8). Accordingly, the storage unit 21 stores library data including shape / size data of the chip 3, paste shape data that defines the paste shape in a state where the chip 3 is bonded, and drawing pattern data that defines a drawing pattern in drawing application. It is a data storage unit.

The input processing unit 40 processes the operation input signal input from the operation input unit 22, outputs a control command to each unit, and writes data to the storage unit 21. The display processing unit 41 processes the data stored in the storage unit 21 and causes the display unit 23 to display an operation screen during the paste discharge amount setting process. The drawing length calculation unit 42 calculates the drawing length in the drawing application for bonding one chip 3 based on the chip shape / size data 21 a and the drawing pattern data 21 c stored in the storage unit 21. That is, the chip size is given by the chip shape / size data 21a, and the actual drawing shape is specified by specifying the drawing pattern. Therefore, it is possible to geometrically calculate the drawing length when actually performing the drawing application. That is, the drawing pattern data 21c includes data related to the drawing shape and data for calculating the drawing length.

  The speed pattern calculation unit 43 determines the Y-axis motor 11a, the X-axis motor 12a, and the Z-axis motor 14a based on the basic speed pattern 21d stored in the storage unit 21 and the speed command input by the operator from the operation input unit 22. A speed pattern for driving is calculated. The drawing time calculation unit 44 is based on the drawing length calculated by the drawing length calculation unit 42 and the speed pattern calculated by the speed pattern calculation unit 43, and the drawing time required for drawing application for one chip 3. t is calculated.

  Based on the chip shape / size data 21 a and the paste shape data 21 b stored in the storage unit 21, the application amount calculation unit 45 requires a necessary volume of the paste 7 required for bonding one chip 3, that is, a paste The application amount is calculated (see FIG. 4). Based on the drawing time calculated by the drawing time calculation unit 44, the paste application amount calculated by the application amount calculation unit 45, and the discharge characteristic data input via the operation input unit 22, the discharge pressure calculation unit 46 A discharge pressure when discharging the paste 7 from 16a, that is, a positive pressure value applied to the syringe 16 by the dispenser 18 is calculated.

  Here, the ejection characteristic data is data indicating the ease of ejection when the paste 7 is ejected from the nozzle 16a. Here, the viscosity of the paste 7 and the resistance to the fluid in the pipe flow path of the nozzle 16a are used. That is, when the viscosity of the paste 7 is high or the resistance of the nozzle 16a to the fluid is large, even if the same discharge discharge is given to the syringe 16 by the dispenser 18, the discharge of the paste 7 actually discharged by the nozzle 16a The amount is reduced.

  Therefore, in the present embodiment, a discharge pressure corresponding to the viscosity of the paste 7 to be used and the resistance to the fluid of the nozzle 16a is applied to stabilize the paste discharge amount as much as possible. Here, the pressure loss value is calculated using a calculation formula described later on the basis of the inner diameter and pipe length of the nozzle 16a in consideration of the friction between the inner wall of the nozzle 16a and the paste 7. That is, the ejection characteristic data has a form including the viscosity of the paste 7, the inner diameter of the nozzle 16a, and the pipe length.

  The drawing processing unit 47 controls the X-axis motor drive unit 31, the Y-axis motor drive unit 32, and the Z-axis motor drive unit 33 based on the speed pattern calculated by the speed pattern calculation unit 43, and further discharge pressure calculation unit 46. By controlling the dispenser driving unit 30 based on the discharge pressure calculated by the above, the nozzle 16a is moved in accordance with a predetermined drawing pattern while discharging a predetermined amount of the paste 7 from the nozzle 16a, whereby the paste 7 is transferred to the substrate 6. Apply drawing.

  In the above configuration, the operation / input unit 22 and the input processing unit 40 input data for inputting ejection characteristic data relating to the relative movement speed of the nozzle 16a with respect to the substrate 6 in the drawing application and ejection characteristics when the paste 7 is ejected from the nozzle 16a. It is a means. The discharge pressure calculation unit 46 is a discharge pressure calculation unit that calculates the discharge pressure when the paste discharge unit is driven to discharge the paste based on the library data, the moving speed, and the discharge characteristic data. The drawing processing unit 47 operates as a paste application control unit that operates the paste discharge unit based on the calculated discharge pressure and controls the movement mechanism (movement table 10) based on the relative movement speed and the drawing pattern.

  Next, a chip bonding method will be described with reference to FIGS. 6 to 10 in accordance with the flow of FIG. Each of FIGS. 6 to 10 shows an operation screen displayed on the display unit 23. In FIG. 5, first, library data including chip shape / size data 21a, paste shape data 21b, and drawing pattern data 21c is stored prior to the start of the bonding operation (library data storage step) (ST1).

  In this data input, as shown in FIG. 6, the operation screen 23a displays the outer shape of the chip 3 in the chip shape display frame 24a, and displays the paste application shape 24b indicating the paste shape in the bonding state. Along with these displays, a data input frame 24c for inputting each value of X, Y, T, B, and H is displayed. After inputting data in each input frame, the operation button 24d is operated to paste. Data input necessary to calculate the required volume of 7, that is, the paste application amount, is completed.

  Next, an operation screen 23b shown in FIG. A plurality of types of drawing patterns 25a for selecting a drawing shape and a drawing path are displayed on the operation screen 23b. Here, two types of drawing shapes are prepared in advance: a cross shape (X shape) and a snow star shape (a cross shape on which a cross shape is superimposed). Normal drawing and one-stroke drawing can be selected as the drawing path.

  Normal drawing is a form in which the discharge of the paste 7 is individually started and stopped for each drawing element when these drawing shapes are drawn and applied by the nozzles 16a. The one-stroke writing is a form in which the discharge of the paste 7 to all the drawing elements is performed continuously without interruption. Even in the same drawing shape, the drawing length differs between the normal drawing and the one-stroke drawing, and therefore, in the present embodiment, these are distinguished. Then, the drawing pattern selection number classified by combining the drawing shape and the drawing path is input to the selection number input frame 25b, and the operation button 25c is operated to complete the input of the drawing pattern data. As described above, in the library data storage step, data relating to the drawing shape and data for calculating the drawing length are stored as the drawing pattern data.

  Next, when the bonding operation is started, discharge characteristic data relating to the relative movement speed of the nozzle 16a with respect to the substrate 6 in the drawing application and the discharge characteristics when the paste 7 is discharged from the nozzle 16a is input (data input step) (ST2). Here, first, as shown in FIG. 8, a trapezoidal speed pattern 26a for defining a rotational speed pattern of each motor of the moving table 10 for relative movement of the nozzles is displayed on the operation screen 23c. Then, the maximum speed in the trapezoidal speed pattern 26a is input to the input frame 26b as a percentage with respect to the rated maximum speed of each motor, and the operation button 26c is operated to complete the input of the relative movement speed.

  Next, as shown in FIGS. 9 and 10, operation screens 23 d and 23 e for inputting discharge characteristic data are sequentially displayed on the display unit 23. In these screens, a viscosity input frame 27b for inputting paste viscosity is displayed together with a nozzle cross-sectional shape 27a indicating the detailed shape of the pipe cross-section of the nozzle 16a. Here, since the nozzle 16a is generally composed of a plurality of pipeline elements having different inner diameters, an operation screen for data input is displayed for each pipeline element, and each operation screen shows the pipeline element. An index display frame 27c for indicating an index number is displayed.

In each operation screen, the pipe length L and the inner diameter D are input to the pipe length input frame 27d and the pipe inner diameter input frame 27e for each specific pipe element. Further, the operation button 27f is operated when data is input for the next pipeline element, and the operation button 27g is operated when there is no subsequent pipeline element. That is, by operating the operation button 27f in the example of FIG. 9, the operation screen 23e shown in FIG. 10 is displayed, and the same input operation is executed for the next pipeline element. As described above, in the data input process, the viscosity of the paste 7, the inner diameter D of the nozzle 16a, and the pipe length L are input as ejection characteristic data.

  Based on this data input, the discharge pressure when the paste discharge means is operated to discharge the paste is calculated based on the library data, relative movement speed and discharge characteristic data (discharge pressure calculation step) (ST3). Here, the discharge pressure is calculated using the calculation formula shown in (Expression 1).

  Formula (1) is a calculation formula for pressure loss in a pipe having a circular cross section, L, U, and D indicate the pipe length, flow velocity, and pipe inner diameter, respectively, and η indicates the viscosity of the paste. Yes. Here, the flow velocity U is calculated by the equation (2) using the paste application amount V and the drawing time t. Therefore, as shown in FIGS. 9 and 10, when the nozzle 16a composed of two pipe elements is targeted, the expression (3) obtained by substituting the expression (2) into the expression (1) is expressed as follows. It is used as a practical formula for calculating the pressure loss P. In addition, as a calculation formula for obtaining an appropriate discharge pressure, a calculation formula other than (Equation 1), for example, an approximate formula obtained by organizing the results obtained by actually measuring the pressure loss may be used. .

In this way, the paste discharge means is operated based on the calculated discharge pressure, and the nozzle is moved relative to the substrate based on the input relative movement speed and drawing pattern (ST4). That is, the dispenser 18 is operated based on the calculated discharge pressure, and the movement table 10 (movement mechanism) is controlled based on the input relative movement speed and drawing pattern (drawing application control process). In this drawing application control step, a desired paste application amount V is discharged from the nozzle 16a during the drawing time t by applying a discharge pressure corresponding to the pressure loss P obtained by calculation to the syringe 16. Then, the chip 3 is bonded to the substrate 6 on which the paste 7 is drawn and applied in this way (ST5).

  The paste application process in the above-described chip bonding method can be grasped in the form of a process flow shown in FIG. First, the required volume (paste application amount V) of the paste 7 is obtained from the shape / size data of the chip 3 and the paste shape data defining the paste shape in a state where the chip 3 is bonded (ST11). Next, the drawing length of the paste 7 is obtained from the drawing pattern data defining the drawing pattern in the drawing application (ST12). At the start of the bonding operation, the relative movement speed of the nozzle 16a in the drawing application is designated (ST13).

  Thereafter, the drawing time t is calculated based on the drawing length and the above-mentioned relative movement speed (ST14). Next, discharge characteristic data relating to the discharge characteristics when discharging the paste 7 from the nozzle 16a, including the viscosity of the paste, the inner diameter D of the nozzle and the pipe length L, is input (ST15). Next, based on the required volume, drawing time t, and discharge characteristic data, the dispenser 18 is driven to calculate the discharge pressure when discharging the paste 7 (ST16). Then, the dispenser 18 is operated based on the calculated discharge pressure, and the moving table 10 (moving mechanism) is controlled based on the above-described relative moving speed and drawing pattern (ST17).

As described above, in the present embodiment, when setting the discharge pressure of the pneumatic paste discharge means, the shape / size data of the chip, the paste shape data defining the paste shape in a state where the chip is bonded, and the drawing application The drawing pattern data defining the drawing pattern is stored in advance as library data. The data that is strongly changed according to the type of the chip, such as the relative movement speed of the nozzle 16a, the viscosity of the paste 7, and the resistance to the fluid of the nozzle 16a, is input as necessary when executing the bonding operation. Yes.

  By adopting such a configuration, even when it is necessary to frequently change the type of paste or nozzle according to the application target, an appropriate discharge pressure can be set only by simple data input. Therefore, it is not necessary to perform the condition setting work by the complicated trial and error required when adopting a pneumatic dispenser that has a simpler structure and is easier to handle as the paste discharging means than the conventional one, and is stable by a simple setting operation. The amount of paste discharged can be ensured.

  The chip bonding apparatus and the chip bonding method of the present invention have an effect that a stable discharge amount of paste can be ensured by a simple setting operation without the condition setting work by trial and error, such as a lead frame. This is useful in the field of bonding a semiconductor chip to a substrate of the substrate via an adhesive paste.

1 is a perspective view of a chip bonding apparatus according to an embodiment of the present invention. The block diagram which shows the structure of the control system of the bonding apparatus of the chip | tip of one embodiment of this invention The functional block diagram showing the processing function of the paste application | coating process of the chip bonding apparatus of one embodiment of this invention (A) Perspective view of substrate and chip that are targets of paste application according to one embodiment of the present invention (b) Explanatory diagram of paste shape data in paste application processing according to one embodiment of the present invention The flowchart of the bonding operation | work by the chip | tip bonding apparatus of one embodiment of this invention The figure which shows the display screen of the chip bonding apparatus of one embodiment of this invention The figure which shows the display screen of the chip bonding apparatus of one embodiment of this invention The figure which shows the display screen of the chip bonding apparatus of one embodiment of this invention The figure which shows the display screen of the chip bonding apparatus of one embodiment of this invention The figure which shows the display screen of the chip bonding apparatus of one embodiment of this invention FIG. 3 is a flowchart of paste application processing in the chip bonding apparatus according to the embodiment of the present invention.

Explanation of symbols

3 Chip 6 Substrate 7 Paste 9 Paste Application Unit 10 Moving Table 16 Syringe 16a Nozzle 18 Dispenser

Claims (2)

While the paste was ejected from the nozzle by the pneumatic paste ejecting means on the substrate, the paste was drawn and applied to the chip bonding position by moving the nozzle relative to the substrate by the moving mechanism, and the drawing was applied. A chip bonding apparatus for bonding a chip to the substrate via a paste,
Shape and size data of said chip, said chip library data storage unit for memorize a library data including drawing pattern data defining a drawing pattern in the paste shape data and the drawing application defines the paste shape in the bonded state An operation input unit that includes the viscosity of the paste, the inner diameter of the nozzle, and the pipe length, and inputs discharge characteristic data relating to discharge characteristics when discharging the paste from the nozzle, and the relative movement speed of the nozzle in the drawing application , The shape / size data of the chip, a coating amount calculation unit for obtaining a required volume of paste from paste shape data that defines the paste shape in a state where the chip is bonded, and drawing pattern data that defines a drawing pattern in the drawing application To the pace A drawing length calculation unit for obtaining a drawing length of the drawing, and a drawing for calculating a drawing time based on the relative movement speed of the nozzle and the drawing length in the drawing application input from the operation input unit at the start of a bonding operation A time calculation unit, a discharge pressure calculation unit that calculates a discharge pressure when the paste discharge unit is driven to discharge a paste based on the required volume, drawing time, and discharge characteristic data; and the calculated discharge pressure A chip bonding apparatus comprising: a drawing processing unit that activates the paste discharge unit based on the relative movement speed and controls the moving mechanism based on the relative movement speed and the drawing pattern . While the paste was ejected from the nozzle by the pneumatic paste ejecting means on the substrate, the paste was drawn and applied to the chip bonding position by moving the nozzle relative to the substrate by the moving mechanism, and the drawing was applied. A chip bonding method for bonding a chip to the substrate via a paste,
Determining the required volume of the paste from the shape / size data of the chip, the paste shape data defining the paste shape in a state where the chip is bonded, and the drawing pattern data defining the drawing pattern in the drawing application. determining a drawing length, a step of specifying the relative moving speed of the nozzle in the drawing applied at the commencement of the bonding operation, a step of computing the drawing time on the basis of the drawing length and the relative speed, Based on the step of inputting discharge characteristic data relating to discharge characteristics when discharging paste from the nozzle, including the viscosity of the paste, the inner diameter of the nozzle, and the pipe length, and the required volume, drawing time, and discharge characteristic data Drive the paste discharging means to paste A step of calculating a discharge pressure at the time of discharge, and a step of operating the paste discharge unit based on the calculated discharge pressure and controlling the moving mechanism based on the relative movement speed and the drawing pattern. A chip bonding method characterized by the above.

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