KR100685216B1 - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

Provided is a substrate processing apparatus capable of precisely controlling the distance between the discharge port and the substrate and facilitating the manufacture of the nozzle.

In the substrate processing apparatus 1, the linear gauges 81 and 82 which measure the vertical position which is a position in the direction perpendicular | vertical to the board | substrate which are a process target are the slit nozzle 41 which discharges a process liquid to the board | substrate of a process target. The lifting mechanism 43 for measuring the vertical position of the discharge port 41c and the measuring portions P and P 'of the discharge hole and moving the slit nozzle 41 in the direction perpendicular to the substrate using the measurement result of the vertical position. Lifting control of the slit nozzle 41 by 44 is performed.

Description

Substrate processing apparatus and substrate processing method {SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD}

1 is a perspective view showing an outline of a substrate processing apparatus 1 according to an embodiment of the present invention;

2 is a plan view of the main body 2 of the substrate processing apparatus 1 seen from above,

3 is a front view of the main body 2 of the substrate processing apparatus 1,

4 is a side view of the main body 2 of the substrate processing apparatus 1,

5 is a side view of the slit nozzle 41,

6 is a plan view of the elevating mechanism 44 viewed from above;

7 is a front view of the lifting mechanism 44,

8 is a cross-sectional view in the YZ plane of the traveling mechanism 70;

9 is a side view of the traveling mechanism 70 viewed from the side,

10 is a side view illustrating the configuration of the linear gauges 81 and 82;

11 is a block diagram showing the functional configuration of the control unit 6 according to the control of the lifting and lowering of the slit nozzle 41.

FIG. 12 is a diagram showing an operation procedure of an operator in the substrate processing apparatus 1;

Fig. 13 is a side view showing the state of the linear gauges 81 and 82 at the time of calibration;

14 is a flowchart showing the operational flow of initial calibration;

15 is a side view of the linear gauge and the slit nozzle viewed from the side when initial calibration is being performed;

16 is a flowchart showing the operational flow of occasional calibration;

Fig. 17 is a side view of the linear gauge and the slit nozzle viewed from the side when performing the occasional calibration;

18 is a flowchart showing the operational flow of automatic driving.

<Description of the symbols for the main parts of the drawings>

1 substrate processing apparatus 2 main body

3: stage 4: crosslinked structure

6: control unit 41: slit nozzle

41c: discharge port 43, 44: lifting mechanism

70, 71: traveling mechanism 76, 77: linear servo motor

78, 79: linear encoder 81, 82: linear gauge

90: substrate P, P ': measurement site

440: servo motor 442: rotary encoder

The present invention relates to a substrate processing apparatus and a substrate processing method.

Conventionally, the substrate processing apparatus which apply | coats a process liquid to a board | substrate by discharging a process liquid with respect to a board | substrate and the board | substrate with which the discharge port provided in the front-end | tip of a nozzle is discharged is used. In the said substrate processing apparatus, since the distance of a discharge port and a board | substrate affects the application | coating state of a process liquid, it is necessary to control the distance of a discharge port and a board | substrate to a predetermined distance. For this reason, various techniques for controlling the distance between the discharge port and the substrate to a predetermined distance have been studied. For example, Patent Literature 1 discloses a technique for measuring the position of the measurement target surface formed in the same plane as the discharge port, and controlling the distance between the discharge port and the substrate to a predetermined distance using the measurement result.

(Patent Document 1) Japanese Unexamined Patent Publication No. 9-206652

However, in the technique of Patent Literature 1, the distance between the discharge port and the substrate cannot be controlled to a predetermined distance unless the surface to be measured is formed on the same plane as the discharge port with high dimensional accuracy. For this reason, in the technique of patent document 1, there exists a problem that a lot of time and cost are required for manufacture of a nozzle. It is also conceivable to measure the position of the discharge port itself instead of the measurement of the position of the measurement target surface. In this case, however, a measurement error due to the processing liquid attached to the discharge port occurs, so that the distance between the discharge port and the substrate is accurately measured. The problem arises that it is out of control.

This invention is made | formed in order to solve this problem, and an object of this invention is to provide the substrate processing apparatus which can control the distance of a discharge port and a board | substrate correctly, and is easy to manufacture a nozzle.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, According to invention of Claim 1, it is a substrate processing apparatus which measures the vertical position which is a position in the direction perpendicular | vertical to the board | substrate to process, and which discharges a process liquid with respect to the said board | substrate. And a nozzle having a discharge port, wherein a measuring portion for measuring a vertical position is defined other than the discharge port, vertical moving means for moving the nozzle in a direction perpendicular to the substrate, and control means for controlling the vertical moving means. And the said control means controls the said vertical movement means using the measurement result of the vertical position of the said discharge port and the said measurement site | part.

According to invention of Claim 2, the substrate processing apparatus of Claim 1 is further provided with the storage means which memorize | stores the measurement result of the vertical position of the said measurement site, when the vertical position of the said discharge port is a predetermined vertical position, The control means moves the discharge port to a predetermined vertical position by moving the nozzle by the vertical moving means until the measurement result of the vertical position of the measurement site coincides with the measurement result stored in the storage means. Perform the calibration process.

According to the invention of claim 3, in the substrate processing apparatus according to claim 2, the measurement result stored in the storage means is based on the vertical position of the measurement site when the measurement result of the vertical position of the discharge port is a predetermined measurement result. It is a measurement result.

According to invention of Claim 4, in the substrate processing apparatus of Claim 2, the said correction process is performed in synchronization with the operation start of the said substrate processing apparatus.

According to the invention of claim 5, in the substrate processing apparatus of claim 2, the correction processing is performed every time the predetermined number of substrates or a predetermined time elapse in the substrate processing apparatus.

According to invention of Claim 6, in the substrate processing apparatus of Claim 1, the said control means controls the distance of the said board | substrate and the said discharge port by controlling the movement amount of the vertical position of the said nozzle by the said vertical movement means.

According to the invention of claim 7, the substrate processing apparatus of claim 1, further comprising horizontal moving means for moving the nozzle in a direction parallel to the substrate, wherein the horizontal moving means moves the nozzle in parallel with the substrate. By moving in the direction, the measuring object of the measuring means is switched between the discharge port and the measuring part.

According to the invention of claim 8, the substrate processing method for processing the substrate by discharging the processing liquid to the substrate from the nozzle having the discharge port, the first measurement of measuring a vertical position of the discharge port in a direction perpendicular to the substrate. The substrate by using the process, a second measurement step of measuring a vertical position of the measurement site of the nozzle defined in the other than the discharge port, and measurement results in the first measurement step and the second measurement step. And a vertical movement step of moving in a direction perpendicular to the direction of the movement.

<1. Structure of Substrate Processing Unit>

1 is a perspective view illustrating an outline of a substrate processing apparatus 1 according to an embodiment of the present invention. 2 is a plan view of the main body 2 of the substrate processing apparatus 1 including the main body 2 and the control unit 6 as viewed from above. 3 and 4 are front and side views of the main body 2, respectively.

The substrate processing apparatus 1 is a processing liquid application apparatus which applies a processing liquid (chemical liquid) to the surface 90s of the substrate 90 to be processed. In the substrate processing apparatus 1, the substrate 90 is, for example, a flat panel display substrate, a flexible substrate for a liquid crystal film, a photomask substrate, a color filter substrate, a thermal head represented by a glass substrate for a liquid crystal panel, for example. It is a ceramic substrate, a semiconductor wafer, etc., and a process liquid is a photoresist liquid (henceforth simply a "resist" hereafter). In addition, below, the board | substrate 90 is a glass substrate for square liquid crystal panels which is a member which comprises the liquid crystal panel of a liquid crystal display device, and a process liquid selectively selects the electrode layer formed in the surface 90s of the board | substrate 90. The description proceeds as being a resist used for forming a pattern for etching. The substrate processing apparatus 1 is a slit coater which applies a resist to the surface 90s of the board | substrate 90 by discharging a resist with respect to the board | substrate 90 from the slit nozzle 41. FIG.

<1.1 Configuration of Main Unit>

As shown in FIGS. 1-4, the main body 2 hold | maintains the board | substrate 90, and discharges a resist with respect to the stage 3 and the board | substrate 90 which become a base plate of each mechanism attached. It has a crosslinked structure (4). The bridge | crosslinking structure 4 is able to move horizontally in the horizontal front-back direction (X direction) on the stage 3 by the traveling mechanisms 70 and 71. FIG.

○ stage;

The stage 3 is comprised from the integral stone of rectangular parallelepiped shape, The upper surface and the side surface are processed flat.

The upper surface of the stage 3 is a horizontal surface and functions as the holding surface 30 of the substrate 90. On the holding surface 30, many vacuum suction ports are distributed and formed. In the substrate processing apparatus 1, the substrate 90 is held in the holding region 91 by vacuum suction using the vacuum suction port while the substrate 90 is being processed.

○ crosslinked structure;

The crosslinked structure 4 which runs substantially horizontally from the left and right ends of the stage 3 mainly has the nozzle support part 40 which supports the slit nozzle 41, and the both ends of the nozzle support part 40 upper part of the stage 3, respectively. Lifting mechanism (43, 44) is supported by. The nozzle support portion 40 is held by the elevating mechanisms 43 and 44 so that the stage 3 can be raised and lowered substantially horizontally, and the longitudinal direction thereof is the horizontal left and right directions (Y direction) of the substrate processing apparatus 1. ) By using the aluminum die-cast material as an aggregate, the nozzle support part 40 is designed to reduce weight while maintaining strength. Thereby, the driving force required for moving the bridge | crosslinking structure 4 can be reduced, and it becomes possible to move the bridge | crosslinking structure 4 using the motor with a small drive force.

As shown in FIG. 3, the slit nozzle 41 is attached to the nozzle support part 40. As shown in FIG. As shown in the side view of FIG. 5, the slit nozzle 41 extending in the horizontal left and right direction has a structure in which the discharge part 41b protrudes downward from the main body part 41a, that is, in the direction of the substrate 90. . In addition, a discharge mechanism (not shown) including a pipe for supplying a resist and a pump for resist is connected to the discharge port 41c at the tip of the discharge portion 41b. Thereby, in the substrate processing apparatus 1, a resist can be discharged with respect to the board | substrate 90 from the discharge port 41c. The slit nozzle 41 has sufficient rigidity, and the relative position of the discharge port 41c seen from the main-body part 41a does not change with the deformation of the slit nozzle 41.

As described above, the lifting mechanisms 43 and 44 are supported at both ends of the nozzle support 40 so as to be lifted and lowered above the stage 3, and are perpendicular to the holding surface 30 or the substrate 90. The support part 40 is raised and lowered in the vertical direction (Z direction). Since the slit nozzle 41 is attached to the nozzle support part 40, the lifting mechanisms 43 and 44 move the slit nozzle 41 in a direction perpendicular to the substrate 90, thereby discharging the discharge part 41c and It also serves as a means for changing the distance from the surface 90s of the substrate 90. The lifting mechanisms 43 and 44 are also used to raise and lower the slit nozzle 41 in a translational manner and to adjust the posture in the YZ plane of the slit nozzle 41.

Subsequently, the lifting mechanisms 43 and 44 will be described in detail. However, since the lifting mechanisms 43 and 44 have almost the same configuration, the lifting mechanism 44 will be described below with reference to FIGS. 6 and 7. The overlapping description of the elevating mechanism 43 is omitted. Here, FIG. 6 and FIG. 7 are the figures which show the detail of the lifting mechanism 44, FIG. 6 corresponds to the top view which looked at the lifting mechanism 44 from the top, and FIG. 7 is the front view of the lifting mechanism 44. FIG. Corresponds to

As shown in FIG. 6 and FIG. 7, the lifting mechanism 44 includes an AC servo motor (hereinafter, also simply referred to as a "servo motor") 440, a ball screw 441, and a rotary encoder 442. do. The lifting mechanism 44 is provided with the coupling member which is not shown in figure, and each structure, such as the servo motor 440 and the rotary encoder 442, is attached to the said coupling member, and is supported by a predetermined position.

The servo motor 440 which generates the lifting driving force of the nozzle support part 40 is a motor whose rotating shaft rotates according to the control signal provided from the control part 6, and controls the rotation angle and rotation direction of a rotating shaft by the said control signal. It is possible.

The ball screw 441 is connected to the rotating shaft of the servo motor 440 at the upper end, and can rotate around the center axis Q. As shown in FIG. The ball screw 441 is screwed into the mounting hole 40h at the end of the nozzle support portion 40. Since the internal thread structure is formed in the inner surface of the mounting hole 40h, the ball screw 441 rotates in response to the rotational drive force transmitted from the servo motor 440, thereby rotating the nozzle support portion 40 (slit nozzle 41). Can be elevated in the vertical direction.

The rotary encoder 442 provided on the upper portion of the servo motor 440 detects the axis position of the rotation shaft of the servo motor 440, and transmits a position address AR corresponding to the axis position to the controller 6. In addition, the movement amount (rising distance) of the nozzle support part 40 by the lifting mechanism 44 in the vertical direction is determined by the rotation angle of the ball screw 441 (rotation angle of the servo motor 440). Therefore, in the substrate processing apparatus 1, since the change amount of the position address AR transmitted from the rotary encoder 442 and the movement amount of the nozzle support part 40 in the vertical direction correspond to 1: 1, the position address AR By controlling the amount of change of), the amount of movement in the vertical direction of the nozzle support portion 40 can be controlled.

○ driving mechanism;

As described above, the crosslinked structure 4 is capable of horizontal movement in the horizontal front-rear direction of the substrate processing apparatus 1. Hereinafter, the traveling mechanisms 70 and 71 for realizing the said horizontal movement of the bridge | crosslinking structure 4 are demonstrated.

The traveling mechanisms 70 and 71 are the traveling rails 72 and 73, the support blocks 74 and 75, and an AC linear servo motor (hereinafter, also simply referred to as a "linear servo motor") (76, 77). ) And linear encoders 78 and 79. Among these structures, the traveling rail 72, the support block 74, the linear servo motor 76, and the linear encoder 78 are traveling mechanisms for horizontally moving the lifting mechanism 43 in the horizontal front and rear directions, and traveling The rail 73, the support block 75, the linear motor 77, and the linear encoder 79 are traveling mechanisms for horizontally moving the lifting mechanism 44 in the horizontal front and rear directions. In addition, since the former and the latter have substantially the same structure, the former is demonstrated below, also referring FIG. 8 and FIG. 9, and the duplicate description of the latter is abbreviate | omitted. 8 is sectional drawing in the YZ surface of the travel mechanism 70, and FIG. 9 is a side view which looked at the travel mechanism 70 from the side.

The traveling rail 72 is fixed to the edge part of the holding surface 30, and the longitudinal direction becomes the horizontal front-back direction of the substrate processing apparatus 1. In the substrate processing apparatus 1, the linear motion guide mechanism which defines the moving direction of the lifting mechanism 43 by the support block 74 fixed to the lower end of the traveling rail 72 and the lifting mechanism 43. Is realized. That is, in the substrate processing apparatus 1, the support block 74 horizontally moves along the travel rail 72, and the moving direction of the lifting mechanism 43 is prescribed | regulated to the horizontal front-back direction.

The linear motor 76 which generates the driving force of the horizontal movement of the lifting mechanism 43 is a linear motor in which the mover 76b moves with respect to the stator 76a in response to the control signal given from the control part 6, The movement amount and the movement direction can be controlled by the control signal. Here, the stator 76a is fixed to the side surface of the stage 3 and extends along the moving direction of the lifting mechanism 43, while the mover 76b is fixed to the lower end of the lifting mechanism 43. Therefore, when the mover 76b moves with respect to the stator 76a, the lifting mechanism 43 will move horizontally in the horizontal front-back direction on the holding surface 30. As shown in FIG.

The linear encoder 78 is provided with the scale part 78a and the detector 78b, detects the position of the detector 78b with respect to the scale part 78a, and respond | corresponds to the position of the detector 78b. The position address AL is transmitted to the control unit 6. Here, the scale portion 78a is fixed to the stage 3 together with the stator 76a and extends along the moving direction of the lifting mechanism 43, while the detector 78b of the lifting mechanism 43 Since it is fixed to the lower end, the position address AL transmitted from the linear encoder 78 may be information for specifying the horizontal position in the horizontal front-rear direction of the lifting mechanism 43.

As described above, in the substrate processing apparatus 1, the lifting mechanisms 43 and 44 are horizontally movable in the horizontal front and rear directions by the traveling mechanisms 70 and 71, respectively, and thus include the slit nozzle 40. The whole of the bridge | crosslinking mechanism 4 can be horizontally moved in the horizontal front-back direction parallel to the holding surface 30 or the board | substrate 90. FIG. In addition, the horizontal position of the slit nozzle 40 in the horizontal front-back direction is specified by the position address AL transmitted to the control part 6 from the linear encoder 78,79.

○ linear gauge

Linear gauges 81 and 82 are fixed to the front surface 31 of the stage 3. The linear gauges 81 and 82 are members for measuring the vertical position of the measurement target in the vertical direction perpendicular to the substrate 90. Hereinafter, the structure of the linear gauge 81 and 82 is demonstrated, referring an enlarged view (side view) of FIG.

The linear gauges 81 and 82 are provided with the measuring members 811 and 821 which can be moved up and down elastically in the vertical direction. The measuring members 811 and 821 are fixed to the front surface 31 when the force is applied downward, so that the measuring members 811 and 821 are pressed down so that they can be repulsed, that is, the measuring members 811 and 821 are applied downward. It is press-fitted in the main body parts 812 and 822 provided so that returning is possible. Then, the linear gauges 81 and 82 are configured to detect the reduction amount of the measurers 811 and 821 and output the detection result to the control unit 6. Therefore, when the measurement object is brought into contact with the tip ends of the measuring devices 811 and 821 of the linear gauges 81 and 82, the control unit 6 can derive the vertical position of the measurement object in the vertical direction. Do.

In the substrate processing apparatus 1, (1) the vertical positions of the front ends 813 and 823 of the measurers 811 and 821 in the state where no force is applied become higher than the holding surface 30 (FIG. 10). (a)), (2) so that the vertical positions of the tip 813 and 823 when the rolling reduction amounts of the measuring members 811 and 821 reach a detectable upper limit are lower than the holding surface 30 (Fig. 10). (b)), since the linear gauges 81 and 82 are mounted on the front surface 31 of the stage 3, the linear gauges 81 and 82 provide a predetermined surface including the holding surface 30. The vertical position of the measurement object can be measured within the range.

In addition, the measured value of the linear gauge 81 is calibrated so that it becomes "0" when the front end 813 (823) is in the holding surface 30, ie, the measured value of the linear gauge is the holding surface 30 ), And the height of the measurement target based on the distance between the holding surface 30 and the measurement target or the holding surface 30.

<1.2 Configuration of Control Unit>

As shown in FIG. 1, the control part 6 comprised by the microcomputer is equipped with the memory | storage part 60 which memorize | stores a program and data, and the calculating part 61 which performs the process according to a program. The storage unit 60 is, for example, RAM for temporary storage, read-only ROM, a magnetic disk device, or the like, but is suitable for a storage medium such as a portable magneto-optical disk or a memory card and a read device. May be realized.

Moreover, the operation part 62 for an operator to input an instruction with respect to the substrate processing apparatus 1, and the display part 63 for performing various displays are provided in the front surface of the housing body of the control part 6. As shown in FIG. The operation unit 62 is, for example, various switches (including a keyboard, a mouse, and the like), but may have a function of the display unit 6 as in a touch panel display. The display unit 63 is realized by, for example, a liquid crystal display or various lamps.

The control part 6 is connected with each structure of the main body 2 by the cable or I / O interface which is not shown in figure, and is transmitted from the instruction | indication input from the operation part 62, and each structure of the main body 2, Based on the ON signal, integrated control of each part of the substrate processing apparatus 1, such as the lifting mechanisms 43 and 44, is performed.

Subsequently, the functional configuration of the control unit 6 will be described. 11 is a block diagram showing the functional configuration of the control unit 6 according to the control of the lifting and lowering of the slit nozzle 41. In FIG. 11, the linear gauge control unit 601, the traveling mechanism control unit 602, the lifting mechanism control unit 603, the initial calibration control unit 604, the occasional calibration control unit 605, and the application control unit 606 are as follows. The control unit 6 is a functional block representing a function realized by executing a control program while using various hardware such as an I / O interface. In addition, although the lifting mechanism 43, the traveling mechanism 70, and the linear gauge 81 are not shown in FIG. 11, the control part 6 has the lifting mechanism 44, the traveling mechanism 71, and these with respect to these. The same control as that of the linear gauge 82 is performed.

In FIG. 11, the linear gauge control unit 601 derives the vertical position of the measurement object from the detection result transmitted from the linear gauge 82.

The traveling mechanism control unit 602 acquires the position address AL transmitted from the linear encoder 79, and outputs a control signal to the linear servo motor 77. In addition, the traveling mechanism control unit 602 outputs a control signal to the linear servomotor 77 while monitoring the position address AL to move the discharge port 41c to an arbitrary horizontal position.

The lifting mechanism control unit 603 acquires the position address AR transmitted from the rotary encoder 442 and outputs a control signal to the servo motor 440. In addition, the lifting mechanism control unit 603 outputs a control signal to the servo motor 440 while monitoring the position address AR to move the discharge port 41c to an arbitrary vertical position.

The initial calibration control unit 604 performs integrated control of initial calibration performed in a state where the processing liquid is not attached to the discharge port 41c. More specifically, the initial calibration control unit 604 uses the slit nozzle 41 when the vertical position of the discharge port 41c coincides with the holding surface 30 (when the measured value of the vertical position is "0"). The vertical position H0 of the measurement part P (refer FIG. 5) defined in the main-body part 41a of () is measured, and is stored in the memory | storage part 60 as an initial vertical position. In addition, below, what realizes the state which the vertical position of the discharge port 41c coincided with the holding surface 30 is also called "origin detection."

In this embodiment, as shown to FIG. 3 and FIG. 5, the main body part 41a is a smooth lower surface and the site | part which does not interfere with the discharge part 41b at the time of the measurement by the linear gauge 81 and 82. Is selected as the measurement site P (P ') for measuring the vertical position. Selection of this measurement site | part P (P ') is an example, and the measurement by the linear gauge 81 and 82 is not carried out, and the discharge port 41c and the relative position do not change at the time of raising and lowering the slit nozzle 41 and horizontal movement. If it is a site | part which does not interfere with the discharge part 41b at the time, it can select as measurement site | part P (P '). In addition, in this embodiment, it is not necessary to produce the slit nozzle 41 so that the vertical position of the discharge port 41c and the measurement site P (P ') may correspond. Therefore, the slit nozzle 41 of this embodiment can be manufactured easily.

The occasional calibration control unit 605 performs integrated control of the occasional calibration that is performed at each time, for example, when power is supplied to the substrate processing apparatus 1. The occasional calibration control part 605 reads out the initial vertical position H0 memorize | stored in the memory | storage part 60, the measurement result of the vertical position of the measurement site | part P, and the initial vertical position memorize | stored in the memory | storage part 60. By moving the slit nozzle 4 by the lifting mechanisms 43 and 44 until (H0) coincides, the discharge port 41c is moved to the origin which coincides with the holding surface 30. That is, the occasional calibration control unit 605 performs origin detection without measuring the vertical position of the discharge port 41c. Therefore, in the occasional calibration, even if the processing liquid adheres to the discharge port 41c, the discharge port 41c can be moved to the origin accurately. Also, the occasional calibration control unit 605 acquires the position address AR at the time when the home position detection is completed via the elevating mechanism control unit 603, and stores it in the storage unit 60 as the reference position address AR1. .

The application control unit 606 lifts and lowers the mechanism 44 so that the distance between the discharge port 41c and the surface 90s of the substrate 90 becomes an appropriate distance in applying the resist to the surface 90s of the substrate 90. ). This control is performed using the measurement result of the vertical position of the discharge port 41c and the measurement site P (P ') at the time of initial calibration and occasional calibration.

<2. Operator's Work Order>

The operation procedure of the operator in the substrate processing apparatus 1 is demonstrated referring a flowchart of FIG.

Initially, the operator determines whether calibration of the linear gauges 81 and 82 is necessary (step S1). When calibration of the linear gauges 81 and 82 is required, the operator performs the calibration (step S2) of the linear gauges 81 and 82, and then proceeds to determining whether initial calibration is necessary (step S3). On the other hand, when the calibration of the linear gauges 81 and 82 is unnecessary, the operator does not perform the calibration of the linear gauges 81 and 82 and proceeds to determining whether initial calibration is necessary (step S3).

Subsequently, the operator determines whether initial calibration is necessary (step S3). When the initial calibration is necessary, the operator cleans the discharge port 41c (step S4), and after performing the initial calibration on the substrate processing apparatus 1 (step S5), automatically operates the substrate processing apparatus 1 in the operating state. (Step S6). On the other hand, when the initial calibration is unnecessary, the operator makes the substrate processing apparatus 1 move to the automatic driving state (step S6).

In the initial calibration, the initial vertical position H0 is not stored in the storage unit 60 at the time of the first operation of the substrate processing apparatus 1, or after the replacement operation of the slit nozzle 41. It is necessary to execute when the initial vertical position H0 stored in the storage unit 60 is not an appropriate value. In addition, in the automatic operation state, it is not necessary to clean the discharge port 41c for occasional correction.

○ calibration of linear gauge;

Subsequently, a calibration operation of the linear gauges 81 and 82 will be described with reference to FIG. 13. FIG. 13 is an enlarged view (side view) showing a state of the linear gauges 81 and 82 at the time of calibration.

Before the initial calibration, the linear gauges 81 and 82 have a measured value of "0" when the front ends 813 and 823 of the measurers 811 and 821 are at the same vertical position as the holding surface 30. (Or a predetermined value). In addition, when the front-end | tip 813, 823 is in the predetermined vertical position different from the holding surface 30, it may be correct | amended so that a measurement result may become a predetermined value.

Specifically, in the calibration of the linear gauges 81 and 82, the operator places the plate-shaped straightener (calibration jig) 83 having the flat surface PL on the holding surface 30 and at the same time holding the surface. Measuring instruments 811 and 821 protruding upward from 30 are pressed downward using the calibrator 83. Here, when the surface which contacts the holding surface 30, ie, the surface which presses down the measuring device 811, is made into the flat surface PL, when the flat surface PL and the holding surface 30 are in close contact, The height of the front end 813 becomes the same height as the holding surface 30. And the calibration of the linear gauges 81 and 82 is completed by adjusting so that the measured value of the linear gauges 81 and 82 may be "0", maintaining this state.

<3. Operation of Substrate Processing Equipment>

Hereinafter, although the operation | movement of the substrate processing apparatus 1 is demonstrated, in description, first, the operation | movement flow by initial calibration and occasional calibration is demonstrated, and then the operation | movement flow according to automatic operation is demonstrated.

Initial calibration;

The operation of the substrate processing apparatus 1 when the initial calibration is performed will be described with reference to FIGS. 14 and 15. FIG. 14 is a flowchart showing an operation flow of initial calibration, and FIG. 15 is a side view of the linear gauges 81 and 82 and the slit nozzle 41 when the initial calibration is being performed from the side. In addition, since the cleaning of the discharge port 41c is performed prior to initial calibration (refer FIG. 12), at the time of initial calibration, the discharge port 41c is in the state in which the accurate measurement by the linear gauges 81 and 82 is possible. .

When the initial calibration is started, the initial calibration control unit 604 moves the slit nozzle 41 horizontally so that the discharge port 41c is above the linear gauges 81 and 82 through the traveling mechanism control unit 602. That is, the horizontal position of the discharge port 41c coincides with the horizontal position of the linear gauges 81 and 82 (Fig. 15 (a)) (step S101). Subsequently, the initial calibration control unit 604 detects the origin of the discharge port 41c (step S102). More specifically, the initial calibration control unit 604 lowers the slit nozzle 41 while monitoring the vertical position of the discharge port 41c through the linear gauge control unit 601 and the lifting mechanism control unit 603 (FIG. 15). (b)) When the measured value of the vertical position of the discharge port 41c becomes "0", the fall of the slit nozzle 41c is stopped (FIG. 15 (c)).

The initial calibration control unit 604 further includes, through the traveling mechanism control unit 602, the measured portion P (P ′) of the slit nozzle 41 from which the home position detection is completed, above the linear gauges 81 and 82. The slit nozzle 41 is horizontally moved as much as possible, that is, the horizontal positions of the measurement portions P (P ') and the linear gauges 81 and 82 are coincident with each other (Fig. 15 (d)) (step S103). At this time, in order to prevent the discharge port 41c from being damaged by the linear gauges 81 and 82, the slit nozzle 41 is once retracted upward before the horizontal movement, and the slit nozzle 41 is horizontal after the horizontal movement. You may make it return to a vertical position before moving. That is, the horizontal movement here may be a movement such that the vertical position of the discharge port 41c does not change before and after the movement, and the movement path in the middle is not limited.

After completion of the horizontal movement, the initial calibration control unit 604 acquires the vertical position of the measurement site P (P ′) through the linear gauge control unit 601, and stores the storage unit 60 as the initial vertical position H0. Remember to.

In addition, when the initial vertical position H0 at the time of past initial calibration is already memorize | stored in the memory | storage part 60, the old initial vertical position H0 is overwritten and updated by the newly obtained initial vertical position H0. do. Thereby, the vertical position H0 of the measurement site | part P (P ') when the measured value of the vertical position of the discharge port 41c is "0" is obtained.

In the initial calibration, the traveling mechanisms 70 and 71 move the slit nozzle 41 horizontally to move the measurement targets of the linear gauges 81 and 82 to the discharge portion 41c and the measurement site P (P). Switching between '). Thereby, the vertical position of the discharge part 41c and the measurement site P (P ') can be measured with one linear gauge, and the structure of the substrate processing apparatus 1 can be simplified.

○ occasional correction;

Hereinafter, the operation of the substrate processing apparatus 1 when the occasional calibration is performed will be described with reference to FIGS. 16 and 17. FIG. 16 is a flowchart showing the operational flow of the occasional calibration, and FIG. 17 is a side view of the linear gauges 81 and 82 and the slit nozzle 41 when the occasional calibration is being performed from the side.

When the occasional calibration is started, the occasional calibration control unit 605 passes through the traveling mechanism control unit 602 so that the measurement site P (P ′) is above the linear gauges 81 and 82. Is moved horizontally, that is, the horizontal position of the measurement site P (P ') and the horizontal position of the linear gauges 81 and 82 coincide (Fig. 17 (a)) (step S201). Subsequently, the occasional calibration control unit 605 detects the origin of the discharge port 41c (step S202). More specifically, through the linear gauge control unit 601 and the lifting mechanism control unit 603, the slit nozzle 41 is lowered while monitoring the vertical position of the measurement site P (FIG. 17 (b)) to measure the measurement site. When the vertical position of P coincides with the initial vertical position H0 stored in the storage unit 60, the lowering of the slit nozzle 41c is stopped (Fig. 17 (c)). In this detection, unlike the initial calibration, since the measurement of the discharge port 41c is not performed, the occasional calibration can be detected even in a state where the processing liquid is attached to the discharge port 41c.

Subsequently, the occasional calibration control unit 605 acquires the position address AR at the time when the home position detection is completed through the elevating mechanism control unit 603, and stores it in the storage unit 60 as the reference position address AR1. (Step S203).

○ automatic operation of the substrate processing apparatus;

Subsequently, the operation flow of the substrate processing apparatus 1 when the automatic operation is performed will be described with reference to the flowchart of FIG. 18.

When the substrate processing apparatus 1 starts the automatic operation, the occasional calibration described above is first performed by the occasional calibration control unit 605, and the origin detection of the slit nozzle 41 is performed (step S301).

After completion of the occasional calibration, the substrate 90 to be processed is loaded into the holding region 91 of the holding surface 30 by a conveyance mechanism (not shown) and vacuum-adsorbed to the holding region 91 (step S302). .

Subsequently, the coating process of the resist to the surface 90s is performed by the coating control unit 606 (step S304). In the application of the resist, the coating control unit 606 includes a thickness T of the substrate 90 input as data to the control unit 6 by an operator or the like, and a gap G for properly applying the resist (for example, For example, although it is 50 micrometers-300 micrometers, typically, the reference position address AR1 is calculated from 150 micrometers-200 micrometers, while calculating the distance T + G of the discharge port 41c and the holding surface 30. Is read out from the storage unit 60, and the position address AR2 of the rotary encoder 442 to be held during resist application is calculated based on the equation (1). Here, the constant k is the lifting amount of the slit nozzle 41 per unit change of the position address AR, and is determined experimentally or theoretically in advance.

(Wed 1)

Thereafter, the coating control unit 606 controls the traveling mechanisms 70 and 71 through the traveling mechanism control unit 602 to move the slit nozzle 41c in the horizontal front and rear directions on the resist coating area, and to calculate the position. The address AR2 is given to the lifting mechanism control unit 603, and the lifting mechanism control unit 603 outputs a control signal to the servo motor 440 so that the position address AR2 is realized. As a result, the distance between the discharge port 41c and the holding surface 30 is maintained at T + G, and the gap between the discharge port 41c and the surface 90 is kept constant.

The board | substrate 90 on which resist coating was completed is carried out to the next process process by a conveyance mechanism (step S305).

Subsequently, in the substrate processing apparatus 1, the branching process is performed depending on whether or not the number of processed substrates in the previous occasional calibration shift reaches a predetermined number (for example, 100) (step S306). And when the number of process board | substrate reaches | attains predetermined number, it returns to step S1 and performs correction at any time. On the other hand, when the number of process board | substrates does not reach predetermined number, it returns to step S3 and starts a process of a new board | substrate.

By such an operation, the substrate processing apparatus performs a calibration at any time every time a predetermined number of substrates are processed.

In addition, in step S306, the branching process is performed according to whether the elapsed time from the last on-time calibration reached a predetermined time, not the number of processed substrates after the last on-the-fly calibration transition, and when the predetermined time is reached, step S301. The process may return to S302 and return to step S302 if the predetermined time has not been reached. Thereby, the fall of the precision of the control of the vertical position of the discharge port 41 is eliminated every time the predetermined number of board | substrates is processed, or every predetermined time passes. This makes it possible to accurately maintain the distance between the discharge port 41c and the surface 90s.

As above-mentioned, the reference position address AR1 which the coating control part 606 controls is based on the measured value of the vertical position of the discharge port 41c and the measurement site P (P ') at the time of initial calibration, Since it is determined using the measured value of the vertical position of the measurement site P (P ') at the time of a calibration, the application | coating control part 606 and the lifting mechanism control part 603 finally use these measured values. The elevating mechanisms 43 and 44 are controlled. That is, in the substrate processing apparatus 1, the measured value of the vertical position of the discharge port 41c and the measurement site P (P ') at the time of initial calibration, and the measurement site P (P') of the occasional calibration The home position is detected using the measured value of the vertical position, and the distance between the discharge port 41c and the surface 90s is controlled by controlling the amount of change in the vertical position from the origin in accordance with the amount of change in the position address AR. By controlling the movement amount, that is, the relative value, there is no need to provide a measuring member for measuring the absolute value of the vertical position of the slit nozzle 41, so that the configuration of the substrate processing apparatus 1 can be simplified. Do.

In the present embodiment, if the vertical position of the discharge port 41c can be accurately measured only once at the time of initial calibration, then the distance between the discharge port 41c and the surface 90 can be precisely controlled and the discharge port ( It is not necessary to accurately measure the vertical position of 41c, and the cleaning operation of the discharge port 41c can be omitted. This facilitates the automatic operation of the substrate processing apparatus 1.

<Variation example>

In the above-mentioned embodiment, although the board | substrate 90 is being fixed and the example which the slit nozzle 41 moves to the direction perpendicular | vertical to the board | substrate 90 was shown, the slit nozzle 41 is fixed and the board | substrate 90 ) May be moved. The movement of the slit nozzle 41 with respect to the board | substrate 90 may be relative.

According to the invention of Claims 1 to 8, since the measurement results of the vertical positions of both the discharge port and the measurement site are used, the nozzles can be precisely controlled at the same time, and the nozzle is positioned so that the vertical positions of the discharge port and the measurement site coincide. There is no need to manufacture, and a nozzle can be manufactured easily.

According to the invention of claim 2 or 3, since it is not necessary to measure the vertical position of the discharge port when moving the discharge port to the predetermined vertical position, the vertical position of the discharge port is set even if the processing liquid is attached to the discharge port. Can be set exactly.

According to the invention of claim 3, once the vertical position of the discharge port can be accurately measured, there is no need to measure the vertical position of the discharge port thereafter, and the cleaning operation of the discharge port can be omitted.

According to the invention of claim 4, since the calibration processing is executed in synchronization with the start of the operation of the substrate processing apparatus, the accuracy decrease of the measured value at the vertical position is eliminated at each start of the operation of the substrate processing apparatus.

According to the invention of claim 5, since the correction processing is performed for each of the predetermined number of substrates or the elapse of the predetermined time in the substrate processing apparatus, the vertical position is performed for each of the predetermined number of substrates or the elapse of the predetermined time in the substrate processing apparatus. The decrease in accuracy of the measured value can be eliminated.

According to invention of Claim 6, since it is not necessary to provide the measuring member for measuring the absolute value of the vertical position of a nozzle, the structure of a substrate processing apparatus can be simplified.

According to invention of Claim 7, since the vertical position of a discharge port and a measurement site | part can be measured by one measuring means, the structure of a substrate processing apparatus can be simplified.

Claims (8)

As a substrate processing apparatus, Measuring means for measuring a vertical position which is a position in a direction perpendicular to the substrate to be processed; A nozzle having a discharge port for discharging the processing liquid to the substrate, and a measurement site for measuring a vertical position is defined other than the discharge port; Vertical moving means for moving the nozzle in a direction perpendicular to the substrate; And control means for controlling the vertical movement means, And the control means controls the vertical movement means by using measurement results of both the vertical position of the discharge port and the vertical position of the measurement site. The method of claim 1, A storage means for storing the measurement result of the vertical position of the measurement site when the vertical position of the discharge port is the origin; The control means moves the nozzle by the vertical movement means until the measurement result of the vertical position of the measurement site coincides with the measurement result stored in the storage means, thereby performing a calibration process of moving the discharge port to the origin. The substrate processing apparatus characterized by the above-mentioned. The method of claim 2, And the measurement result stored in the storage means is a measurement result of the vertical position of the measurement site when the measurement result of the vertical position of the discharge port is the measurement result at the origin. The method of claim 2, And the correction processing in synchronization with the start of the operation of the substrate processing apparatus. The method of claim 2, The substrate processing apparatus is characterized in that the calibration processing is executed every time the predetermined number of substrates or a predetermined time elapses in the substrate processing apparatus. The method of claim 1, And the control means controls the distance between the substrate and the discharge port by controlling the movement amount of the vertical position of the nozzle by the vertical movement means. The method of claim 1, Further comprising horizontal moving means for moving the nozzle in a direction parallel to the substrate, The horizontal processing means moves the nozzle in a direction parallel to the substrate, whereby the measurement object of the measuring means is switched between the discharge port and the measuring portion. As a substrate processing method for processing the substrate by discharging the processing liquid to the substrate from a nozzle having a discharge port, A first measurement step of measuring a vertical position of the discharge port in a direction perpendicular to the substrate; A second measurement step of measuring a vertical position of a measurement portion of the nozzle defined in addition to the discharge port; And a vertical movement step of moving the nozzle in a direction perpendicular to the substrate using the measurement results in the first measurement step and the second measurement step.

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