TW200626250A - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method

Info

Publication number
TW200626250A
TW200626250A TW094127597A TW94127597A TW200626250A TW 200626250 A TW200626250 A TW 200626250A TW 094127597 A TW094127597 A TW 094127597A TW 94127597 A TW94127597 A TW 94127597A TW 200626250 A TW200626250 A TW 200626250A
Authority
TW
Taiwan
Prior art keywords
substrate
substrate processing
slit nozzle
vertical position
vertical
Prior art date
Application number
TW094127597A
Other languages
Chinese (zh)
Other versions
TWI268812B (en
Inventor
Kentaro Nishioka
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200626250A publication Critical patent/TW200626250A/en
Application granted granted Critical
Publication of TWI268812B publication Critical patent/TWI268812B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface

Abstract

To provide a substrate treatment apparatus capable of accurately controlling the distance between a discharging port and a substrate and having a nozzle easy to manufacture. In the substrate treatment 1, linear gauges 81, 82 for measuring the vertical position as the position in the direction perpendicular to the substrate to be treated measure the vertical position of the discharging port 41c of the slit nozzle 41 to discharge the treatment liquid to the substrate to be treated and the measured sites P, P' and control vertical movement of the slit nozzle 41 by lift mechanisms 43, 44 to transfer the slit nozzle 41 in the direction vertical to the substrate utilizing the measured result of the vertical position.
TW094127597A 2004-10-07 2005-08-12 Substrate processing apparatus and substrate processing method TWI268812B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004294705A JP4490780B2 (en) 2004-10-07 2004-10-07 Substrate processing apparatus and substrate processing method

Publications (2)

Publication Number Publication Date
TW200626250A true TW200626250A (en) 2006-08-01
TWI268812B TWI268812B (en) 2006-12-21

Family

ID=36372981

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127597A TWI268812B (en) 2004-10-07 2005-08-12 Substrate processing apparatus and substrate processing method

Country Status (4)

Country Link
JP (1) JP4490780B2 (en)
KR (1) KR100685216B1 (en)
CN (1) CN1757439B (en)
TW (1) TWI268812B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI478273B (en) * 2010-05-12 2015-03-21 Tokyo Electron Ltd Substrate processing device,substrate processing method,and memory medium recorded with program

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4752286B2 (en) * 2004-12-28 2011-08-17 株式会社ニコン Position adjustment apparatus control method, position adjustment apparatus, and exposure apparatus
JP4705517B2 (en) 2006-05-19 2011-06-22 東京エレクトロン株式会社 Substrate cleaning method, substrate cleaning apparatus, program, and recording medium
JP4799390B2 (en) * 2006-12-15 2011-10-26 中外炉工業株式会社 Application method
JP2008238144A (en) * 2007-03-29 2008-10-09 Toray Eng Co Ltd Apparatus and method for applying coating liquid
CN101502822B (en) * 2008-02-04 2012-05-30 联华电子股份有限公司 Calibrating equipment of nozzle and calibration method of nozzle
KR101020681B1 (en) 2008-11-18 2011-03-11 세메스 주식회사 Apparatus of coating photo resist composition in a Flat Panel Display manufacturing
KR101343502B1 (en) 2009-07-24 2013-12-19 엘지디스플레이 주식회사 Coater chuck of coating apparatus
JP6803120B2 (en) * 2016-11-28 2020-12-23 東レエンジニアリング株式会社 Origin detector and coating device
KR102641446B1 (en) * 2017-07-19 2024-02-28 주식회사 탑 엔지니어링 Dispenser

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07256180A (en) * 1994-03-23 1995-10-09 Sony Corp Method for applying fluid material to planar member and device therefor
JP3731616B2 (en) * 1996-01-30 2006-01-05 東レ株式会社 Coating apparatus and coating method, and color filter manufacturing apparatus and manufacturing method
JP3199239B2 (en) * 1998-01-06 2001-08-13 東レ株式会社 Manufacturing method and apparatus for plasma display member
JP3499438B2 (en) 1998-05-28 2004-02-23 東京エレクトロン株式会社 Application method
JP2003001165A (en) * 2001-06-26 2003-01-07 Seiko Instruments Inc Liquid coating device
JP2003243286A (en) * 2002-02-14 2003-08-29 Dainippon Screen Mfg Co Ltd Substrate processing apparatus
JP2004014393A (en) * 2002-06-10 2004-01-15 Dainippon Printing Co Ltd Phosphor screen forming method and phosphor screen forming device of plasma display panel
JP2004351261A (en) * 2003-05-27 2004-12-16 Canon Inc Coater and coating method
KR100566405B1 (en) * 2003-09-08 2006-03-31 세메스 주식회사 Apparatus and method for coating photoresist on a substrate for manufacturing flat panel display devices
JP4372606B2 (en) 2004-04-16 2009-11-25 東京エレクトロン株式会社 Coating film forming device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI478273B (en) * 2010-05-12 2015-03-21 Tokyo Electron Ltd Substrate processing device,substrate processing method,and memory medium recorded with program

Also Published As

Publication number Publication date
KR20060051365A (en) 2006-05-19
KR100685216B1 (en) 2007-02-22
TWI268812B (en) 2006-12-21
JP2006102684A (en) 2006-04-20
CN1757439B (en) 2011-10-19
JP4490780B2 (en) 2010-06-30
CN1757439A (en) 2006-04-12

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