CN1757439A - Substrate processing device and method - Google Patents
Substrate processing device and method Download PDFInfo
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- CN1757439A CN1757439A CNA2005100999261A CN200510099926A CN1757439A CN 1757439 A CN1757439 A CN 1757439A CN A2005100999261 A CNA2005100999261 A CN A2005100999261A CN 200510099926 A CN200510099926 A CN 200510099926A CN 1757439 A CN1757439 A CN 1757439A
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- substrate
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- ejiction opening
- upright position
- nozzle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
To provide a substrate treatment apparatus capable of accurately controlling the distance between a discharging port and a substrate and having a nozzle easy to manufacture. In the substrate treatment 1, linear gauges 81, 82 for measuring the vertical position as the position in the direction perpendicular to the substrate to be treated measure the vertical position of the discharging port 41c of the slit nozzle 41 to discharge the treatment liquid to the substrate to be treated and the measured sites P, P' and control vertical movement of the slit nozzle 41 by lift mechanisms 43, 44 to transfer the slit nozzle 41 in the direction vertical to the substrate utilizing the measured result of the vertical position.
Description
Technical field
The present invention relates to a kind of substrate board treatment and substrate processing method using same.
Background technology
All the time, people are using by making the ejiction opening that is installed in spray nozzle front end close and discharge treatment fluid from ejiction opening to substrate with substrate, thereby treatment fluid is coated on substrate board treatment on the substrate.In this substrate board treatment, because the distance between ejiction opening and substrate can influence the coating state of treatment fluid, so the distance between ejiction opening and the substrate need be controlled within the distance of regulation.For this reason, about the technology within the distance that the distance between ejiction opening and the substrate is controlled at regulation various discussion researchs are arranged.For example, such technology being disclosed in Patent Document 1: is determined at determined the position that forms in the plane identical with ejiction opening, utilizes this measurement result, the distance between ejiction opening and the substrate is controlled within the distance of regulation.
Patent documentation 1 is the flat 9-206652 communique of TOHKEMY.
But, in the technology of patent documentation 1,, just the distance between ejiction opening and the substrate can not be controlled within the distance of regulation if on the face identical, do not form determined with ejiction opening with high dimensional accuracy.Therefore, in the technology of patent documentation 1, having is needing the expensive time and the problem of expense aspect the making nozzle.In addition, also can consider to replace the mensuration of determined position, and measure the position of ejiction opening itself, but can take place this moment because of the evaluated error attached to the treatment fluid generation of ejiction opening, the problem of the distance between ejiction opening and the substrate can not be correctly controlled in generation.
Summary of the invention
The present invention proposes for head it off, and when its purpose was to provide a kind of distance that can correctly control between ejiction opening and the substrate, the making of nozzle was easy to substrate board treatment.
In order to address the above problem, substrate board treatment of the present invention has: determinator, and it measures the upright position as the position on the direction vertical with the substrate that becomes the processing object; Nozzle, it has the ejiction opening to aforesaid substrate ejection treatment fluid, measures the mensuration position of using the upright position and is defined within beyond the above-mentioned ejiction opening; Vertical mobile device, it makes said nozzle move along the direction vertical with aforesaid substrate; Control device, it controls above-mentioned vertical mobile device, and above-mentioned control device utilizes the measurement result of the upright position at above-mentioned ejiction opening and said determination position, controls above-mentioned vertical mobile device.
Substrate board treatment of the present invention, also has storage device, the measurement result of upright position when the upright position of the above-mentioned ejiction opening of this memory device stores is the upright position of stipulating, the said determination position, above-mentioned control device moves said nozzle by above-mentioned vertical mobile device, consistent up to the measurement result of the upright position at said determination position with measurement result in being stored in above-mentioned storage device, handle thereby carry out the correction that above-mentioned ejiction opening is moved to the upright position of regulation.
The measurement result of the upright position at substrate board treatment of the present invention, the measurement result of upright position that is stored in measurement result in the above-mentioned storage device and the is above-mentioned ejiction opening said determination position during for the measurement result of regulation.
Substrate board treatment of the present invention begins synchronously with the action of aforesaid substrate treating apparatus and carries out above-mentioned correction and handle.
Substrate board treatment of the present invention, the processing of the substrate of the regulation number of every process aforesaid substrate treating apparatus or process stipulated time just carry out above-mentioned correction and handle.
Substrate board treatment of the present invention, above-mentioned control device is by the amount of movement of the upright position of above-mentioned vertical mobile device control said nozzle, thus the distance of control aforesaid substrate and above-mentioned ejiction opening.
Substrate board treatment of the present invention, also has horizontally moving device, this horizontally moving device makes said nozzle move along the direction parallel with aforesaid substrate, by above-mentioned horizontally moving device said nozzle is moved along the direction parallel with aforesaid substrate, between above-mentioned ejiction opening and said determination position, switch the determination object of said determination device.
A kind of substrate processing method using same of the present invention by from the nozzle with ejiction opening substrate ejection treatment fluid being handled aforesaid substrate, comprising: the first mensuration operation of measuring the upright position of the above-mentioned ejiction opening on the direction vertical with aforesaid substrate; Be determined at the above-mentioned ejiction opening second mensuration operation of the upright position at the mensuration position of the said nozzle of definition in addition; Utilize above-mentioned first to measure the measurement result that operation and above-mentioned second is measured operation, the vertical mobile process that said nozzle is moved along the direction vertical with aforesaid substrate.
According to the invention described above, because the measurement result of utilizing ejiction opening and measuring both upright positions, position, when can correctly controlling the distance of ejiction opening and substrate, do not need to make the nozzle that makes ejiction opening and measure the upright position unanimity at position, therefore can easily make nozzle.
According to the invention described above, because make ejiction opening when move the upright position of regulation, do not need to measure the upright position of ejiction opening, so, can make the upright position of ejiction opening correctly adjust to the upright position of regulation even adhered to treatment fluid on the ejiction opening yet.
In a single day according to the invention described above,, just do not need to measure the upright position of ejiction opening thereafter, so can save the cleaning work of ejiction opening if can correctly measure the upright position of ejiction opening.
According to the invention described above, because the action of proofread and correct handling with substrate board treatment begins to carry out synchronously, so the precision of the measured value of upright position is low can eliminate the action of each substrate board treatment and begin the time.
According to the invention described above, because every just carry out to proofread and correct through the processing substrate of regulation piece number in the substrate board treatment or through official hour handle, so can be every through the processing substrate of regulation piece number in the substrate board treatment or eliminate the precision of measured value of upright position through official hour low.
According to the invention described above, because do not need to be provided with the mensuration member that the absolute value of the upright position of measuring nozzle is used, so can simplify the structure of substrate board treatment.
According to the invention described above, because the upright position that just can measure ejiction opening and measure the position by a determinator, so can simplify the structure of substrate board treatment.
Description of drawings
Fig. 1 is the stereogram of overview of the substrate board treatment 1 of expression the invention process form.
Fig. 2 is the vertical view from the main body 2 of top finding substrate board treatment 1.
Fig. 3 is the front view of the main body 2 of substrate board treatment 1.
Fig. 4 is the side view of the main body 2 of substrate board treatment 1.
Fig. 5 is the side view of slit jet nozzle 41.
Fig. 6 is the vertical view from top finding elevating mechanism 44.
Fig. 7 is the front view of elevating mechanism 44.
Fig. 8 is the interior sectional view of YZ face of travel mechanism 70.
Fig. 9 is the side view of finding travel mechanism 70 from the side.
Figure 10 is the side view of the structure of the linear gauge 81 (82) of expression.
Figure 11 is that expression relates to the lifting of slit jet nozzle 41 and the block diagram of the functional structure of the control part 6 of the control that moves horizontally.
Figure 12 is the operating personnel's of expression substrate board treatment 1 the figure of the sequence of operation.
Figure 13 is the side view of state of the linear gauge 81 (82) of expression timing.
Figure 14 is the flow chart of the motion flow of expression initial calibration.
Figure 15 is side view when finding is carried out initial calibration from the side, linear gauge and slit jet nozzle.
Figure 16 is the flow chart of the each motion flow of proofreading and correct of expression.
Figure 17 is that finding is carried out the side view of gauge each timing, linear and slit jet nozzle from the side.
Figure 18 is the expression flow chart of the motion flow of running automatically.
The specific embodiment
＜1. the structure of substrate board treatment 〉
Fig. 1 is the stereogram of overview of the substrate board treatment 1 of expression embodiment of the present invention.
Fig. 2 comprises main body 2 and control part 6 and the vertical view of the main body 2 of the substrate board treatment 1 that constitutes from the top finding.Fig. 3 and Fig. 4 are respectively the front view and the side views of main body 2.
Substrate board treatment 1 is a treatment fluid applying device from coating treatment fluid (soup) to the surperficial 90s that becomes the substrate 90 of handling object that go up.In substrate board treatment 1, substrate 90 for example is a liquid crystal panel with the flat-panel monitor of glass substrate representative with substrate, liquid crystal film with flexible base, board, base board for optical mask, colour filter with substrate, temperature-sensitive magnetic head with ceramic substrate, semiconductor wafer etc., and treatment fluid for example is photoresist liquid (below abbreviate " resist liquid " as).In addition, below, with substrate 90 is square liquid crystal panel glass substrate as the member of the liquid crystal panel that constitutes liquid crystal indicator, and treatment fluid is to describe for the surperficial 90s that is etched in substrate 90 selectively goes up the resist liquid that uses in the formation of figure of electrode layer of formation.Substrate board treatment 1 passes through from 41 pairs of substrates of slit jet nozzle, 90 ejection resist liquid, thereby becomes the fine seam type coating machine of coating resist liquid on substrate 90 surperficial 90s.
The structure of＜1.1 main bodys 〉
Shown in Fig. 1～4, main body 2 has: the objective table 3 that becomes the pedestal of each affiliated mechanism when keeping substrate 90; Portal structure 4 to substrate 90 ejection resist liquid.Portal structure 4 can move horizontally at the horizontal fore-and-aft directions in objective table 3 upper edges (directions X) by travel mechanism 70,71.
Zero objective table;
Objective table 3 is made of the stone of the integral body of rectangular shape, and above it and side is processed into smooth state.
The upper surface of objective table 3 is horizontal planes, and the function as the maintenance face 30 of substrate 90 is arranged.On maintenance face 30, distribute and forming a plurality of vacuum suction mouths.In substrate board treatment 1, carry out substrate 90 processing during, by using the vacuum suction of this vacuum suction mouth, make substrate 90 remain on retaining zone 91.
Zero portal structure;
From two ends, the left and right sides approximate horizontal of objective table 3 the portal structure 4 that sets up, mainly by the nozzle support portion 40 that supports slit jet nozzle 41, the elevating mechanism 43,44 at 40 two ends, support nozzle support portion constitutes above objective table 3.Nozzle support portion 40 is being held with approximate horizontal and liftable mode above objective table 3 by elevating mechanism 43,44, and it vertically becomes the horizontal left and right directions (Y direction) of substrate board treatment 1.Nozzle support portion 40 keeps intensity and realizes lightness by using the aluminium diecasting material as aggregate.Like this, can reduce making portal structure 4 move needed driving force, can use the little motor travelling bridge shelf structure 4 of driving force.
As shown in Figure 3, in nozzle support portion 40 slit jet nozzle 41 is installed.The slit jet nozzle 41 that extends to horizontal left and right directions, shown in the side view of Fig. 5 like that, have make the 41b of ejection portion from main part 41a downwards, promptly to the outstanding structure of the direction of substrate 90.In addition, on the ejiction opening 41c of the front end of the 41b of ejection portion, connecting and containing the pipe arrangement of supplying with resist liquid and resist ejection mechanism (not shown) with pump.Like this, in substrate board treatment 1, can be from ejiction opening 41c to substrate 90 ejection resists.Slit jet nozzle 41 has enough rigidity, can not change because of the distortion of slit jet nozzle 41 from the relative position of main part 41a finding ejiction opening 41c.
As mentioned above, elevating mechanism 43,44 is supporting the two ends of nozzle support portion 40 in liftable mode above objective table 3, make nozzle support portion 40 towards with perpendicular vertical direction (Z direction) lifting of maintenance face 30 or substrate 90.Because in nozzle support portion 40 slit jet nozzle 41 is installed, elevating mechanism 43,44 is by making slit jet nozzle 41 along moving with the perpendicular direction of substrate 90, becomes the device that the distance of the surperficial 90s that makes 41c of ejection portion and substrate 90 changes. Elevating mechanism 43,44 when making slit jet nozzle 41 synchronization liftings, can also be used to adjust the attitude of slit jet nozzle 41 in the YZ plane.
Next the details of elevating mechanism 43,44 is described, because the structure that elevating mechanism 43,44 has much at one, so below with reference to Fig. 6 and Fig. 7 elevating mechanism 44 is described, and omit repeat specification at elevating mechanism 43.Here, Fig. 6 and Fig. 7 are the figure of the details of expression elevating mechanism 44, and Fig. 6 is equivalent to from the vertical view of top finding elevating mechanism 44, and Fig. 7 is equivalent to the front view of elevating mechanism 44.
Shown in Fig. 6 and 7, elevating mechanism 44 has AC servo motor (following also abbreviate as " servo motor ") 440, ball-screw 441 and rotary encoder 442.Elevating mechanism 44 possesses combination member not shown in the figures, and servo motor 440 and rotary encoder 442 wait each structure to be installed on this combination member, are supported on the position of regulation.
The servo motor 440 of the generation lifting driving force of nozzle support portion 40 is motors that the rotating shaft rotation is provided corresponding to the control signal that provides from control part 6, by this control signal, can control the anglec of rotation and the direction of rotation of rotating shaft.
Ball-screw 441 joins at the rotating shaft of upper end and servo motor 440, can be that the center is rotated with central shaft Q.Ball-screw 441 is threaded among the installing hole 40h of nozzle support portion 40 ends.Because the inner surface at installing hole 40h is formed with the internal thread structure, accept to transmit the rotary driving force that comes by ball-screw 441 and rotate from servo motor 440, can make nozzle support portion 40 (slit jet nozzle 41) lifting in vertical direction.
At the rotary encoder 442 that the top of servo motor 440 is provided with, detect the shaft position of the rotating shaft of servo motor 440, location address AR that will be corresponding with shaft position transmits to control part 6.In addition, based on the anglec of rotation (anglec of rotation of the servo motor 440) decision of the amount of movement (lifting distance) of the vertical direction of the nozzle support portion 40 of elevating mechanism 44 by ball-screw 441.Therefore, in substrate board treatment 1, because the amount of movement of the variable quantity of the location address AR that comes from rotary encoder 442 transmission and the vertical direction of nozzle support portion 40 corresponds to 1: 1,, can control the amount of movement of the vertical direction of nozzle support portion 40 by the variable quantity of address, control position AR.
Zero travel mechanism;
As mentioned above, portal structure 4 can move horizontally towards the horizontal fore-and-aft direction of substrate board treatment 1.The following describes this that realize portal structure 4 and move horizontally the travel mechanism 70,71 of usefulness.
Moving guide rail 72 is fixedly installed on the end of maintenance face 30, and it vertically is the horizontal fore-and-aft direction of substrate board treatment 1.In substrate board treatment 1,, realized the Direct Action Type guiding mechanism of the moving direction of regulation elevating mechanism 43 by moving guide rail 72 and the supporting seat 74 that is fixedly installed on elevating mechanism 43 lower ends.That is, in substrate board treatment 1, move horizontally along moving guide rail 72, the moving direction of elevating mechanism 43 is defined as horizontal fore-and-aft direction by supporting seat 74.
Producing the linear motor 76 of the driving force that moves horizontally of elevating mechanism 43, is the linear motor that moving member 76b moves with respect to fixture 76a corresponding to the control signal that provides from control part 6, can control amount of movement and moving direction according to this control signal.Here, when fixture 76a extends along the moving direction of the elevating mechanism 43 of the side that is fixedly installed on objective table 3, because moving member 76b is in the bottom that is fixedly installed on elevating mechanism 43, so if moving member 76b moves with respect to fixture 76a, then elevating mechanism 43 moves horizontally at the horizontal fore-and-aft direction in maintenance face 30 upper edges.
As described above, in substrate board treatment 1, by travel mechanism 70,71 elevating mechanism 43,44 is moved horizontally along horizontal fore-and-aft direction respectively, therefore, portal structure 4 integral body that include slit jet nozzle 40 are moved horizontally along the horizontal fore-and-aft direction parallel with maintenance face 30 or substrate 90.And then the horizontal level of the horizontal fore-and-aft direction of slit jet nozzle 40 is specific by the location address AL that passes on to control part 6 from linear encoder 78,79.
Zero linear gauge
Be set with linear gauge 81,82 on the front surface 31 of objective table 3.Linear gauge the 81, the 82nd is measured the member that the upright position of the determination object on the vertical direction vertical with substrate 90 is used.The structure of linear gauge 81 (82) is described below with reference to the enlarged drawing (side view) of Figure 10.
Linear gauge 81 (82) but possess the mensuration part 811 (821) of elasticity knee-action in vertical direction.Measure part 811 (821), when being applied in power downwards, be pressed, that is, measure part 811 (821), when being applied in power downwards, be pushed in the main part 812 (822) that is fixedly installed on the front surface 31 in recoverable mode in the mode that can rebound.And linear gauge 81 (82) outputs to the mode of control part 6 and constitutes to detect the amount of pressing of measuring part 811 (821) and will detect the result.Therefore, if become the contacted state of front end of the mensuration part 811 (821) that makes determination object and linear gauge 81 (82),, can derive the upright position of this determination object on the vertical direction then at control part 6.
In substrate board treatment 1, because when being in the top of maintenance face 30 (with reference to Figure 10 (a)) with the upright position of the front end 813 (823) of the mensuration part 811 (821) of (1) not afterburning state, (2) amount of pressing of mensuration part 811 (821) reaches the mode (with reference to Figure 10 (b)) that the possible upright position of going up front end 813 (823) in limited time is in the below of maintenance face 30 that detects, linear gauge 81 (82) is installed on the front surface 31 of objective table 3, so, can in the prescribed limit that comprises maintenance face 30, measure the upright position to determination object by linear gauge 81 (82).
In addition, the measured value of linear gauge 81 is when front end 813 (823) is in maintenance face 30, be corrected as " 0 ", that is, the measured value of linear gauge is to be the distance of maintenance face 30 with the determination object of benchmark with maintenance face 30, perhaps also can be to be the height of the determination object of benchmark with maintenance face 30.
The structure of＜1.2 control parts 〉
As shown in Figure 1, the control part 6 that is made of microcomputer possesses the storage part 60 of storage program and data and the operational part of handling according to program 61.Storage part 60 for example is the RAM that can temporarily store, read-only ROM and disk set etc., but also can realize by storage mediums such as portable light disk or storage card and reading device thereof.
In addition, the basket front surface at control part 6 is provided with the operating portion 62 and the display part 63 that carry out various demonstration usefulness of operator to substrate board treatment 1 input indication usefulness.Operating portion 62 for example is various switches (comprising keyboard and mouse etc.), can be the device with the function of display part 6 as touching-type monitor also.Display part 63 is for example realized by LCD or various lamp.
Control part 6, by not shown cable or I/O interface, constitute with each of main body 2 and to be connected,, carry out the Comprehensive Control of each several part of the substrate board treatment 1 of elevating mechanism 43,44 etc. based on constituting the signal that transmits from the indication of operating portion 62 inputs or from each of main body 2.
Next the formation of the function of control part 6 is described.Figure 11 is the block diagram of formation of the function of the related control part 6 of the lifting of expression slit jet nozzle 41 and the control that moves horizontally.Linear gauge control part 601 among Figure 11, travel mechanism's control part 602, elevating mechanism control part 603, initial calibration control part 604, each correction control part 605 and coating control part 606 are functional blocks of utilizing the function that various hardware executive control programs such as I/O interface realize by control part 6.In addition, elevating mechanism 43, travel mechanism 70 and linear gauge 81 show in Figure 11, but control part 6 also carries out the control same with elevating mechanism 44, travel mechanism 71 and linear gauge 82 to them.
Among Figure 11, linear gauge control part 601 is according to the upright position of being transmitted by linear gauge 82 that the result derives determination object that detects.
Travel mechanism's control part 602 is being obtained in the location address AL that linear encoder 79 transmits, to linear servo motor 77 output control signals.And then, travel mechanism's control part 602 by monitored position address AL the time to linear servo motor 77 output control signals, thereby ejiction opening 41c is moved to horizontal level arbitrarily.
Elevating mechanism control part 603 is being obtained in the location address AR that rotary encoder 442 transmits, to servo motor 440 output control signals.And then, elevating mechanism control part 603 by monitored position address AR the time to servo motor 440 output control signals, thereby ejiction opening 41c is moved to upright position arbitrarily.
Initial calibration control part 604 carries out the Comprehensive Control of the initial calibration that carries out under the state that does not adhere to treatment fluid on the ejiction opening 41c.More specifically, the upright position H0 of (when the measured value of upright position is " 0 ") when the upright position that initial calibration control part 604 is measured ejiction opening 41c and maintenance face 30 are consistent, the mensuration position P (with reference to Fig. 5) that on the main part 41a of slit jet nozzle 41, defines, and conduct initially is stored in the storage part 60 upright position.In addition, the situation of the consistent state of the upright position that will realize ejiction opening 41c below and maintenance face 30 is called " initial point centering ".
In this form of implementation, as Fig. 3 and shown in Figure 5, at the level and smooth lower surface of main part 41a, during the mensuration of linear gauge 81 (82) and the position that do not interfere of the 41b of ejection portion is selected as measuring the mensuration position P that uses the upright position (P ').The selection of this mensuration position P (P ') only is an example, so long as the lifting of slit jet nozzle 41 and when moving horizontally and the relative position of ejiction opening 41c does not have to change, the position that do not interfere with the 41b of ejection portion during the mensuration of linear gauge 81 (82), can select it is mensuration position P (P ').In addition, in this form of implementation, do not need so that ejiction opening 41c and the mode of measuring the upright position unanimity of position P (P ') are made slit jet nozzle 41.Therefore, can easily make the slit jet nozzle 41 of this form of implementation.
The Comprehensive Control of each correction that each correction control part 605 carries out when carrying out substrate board treatment 1 being connected power supply etc. at every turn.Each correction control part 605 reads out in the initial upright position H0 of storage part 60 storages, by by elevating mechanism 43,44 move slit jet nozzle 41, till the initial upright position H0 that the measurement result of the upright position of measuring position P and storage part 60 are stored is consistent, thereby make ejiction opening 41c move to the initial point consistent with maintenance face 30.That is, each correction control part 605 is not measured the upright position of ejiction opening 41c and is carried out the initial point centering.Therefore, in each the correction,, also can make ejiction opening 41c correctly move to initial point even adhered to treatment fluid on the ejiction opening 41c.And then, each correction control part 605, the location address AR when obtaining the end of initial point centering via elevating mechanism control part 603 is stored in the storage part 60 as address, reference position AR1.
Coating control part 606, in the process of the surperficial 90s of substrate 90 coating resist liquid, control elevating mechanism 44 makes the distance of surperficial 90s of ejiction opening 41c and substrate 90 become suitable position.The measurement result that this control utilizes initial calibration and each timing ejiction opening 41c and measures the upright position of position P (P ') is carried out.
＜2. operating personnel's operating sequence 〉
Operating sequence with reference to the operating personnel of the flowchart text substrate board treatment 1 of Figure 12.
At first, operating personnel judge whether to carry out the correction (step S1) of linear gauge 81,82.At the timing of the linear gauge 81,82 of needs, operating personnel transfer to the judgement (step S3) that whether needs initial calibration after the correction (step S2) of having carried out linear gauge 81,82.On the other hand, at the timing that does not need to do linear gauge 81,82, operating personnel do not carry out the correction of linear gauge 81,82, directly transfer to the judgement (step S3) that whether needs initial calibration.
Next, operating personnel need to judge whether initial calibration (step S3).When the needs initial calibration, operating personnel clean ejiction opening 41c (step S4), after substrate board treatment 1 is carried out initial calibration (step S5), make substrate board treatment 1 transfer to automatic operating condition (step S6).The opposing party and, when not needing initial calibration, operating personnel make substrate board treatment 1 transfer to automatic operating condition (step S6).
In addition, initial calibration, in when the first running of substrate board treatment 1 etc., when initial upright position H0 does not store storage part 60 into, perhaps wait the initial upright position H0 that store in the storage part 60 to need to carry out under the situation of suitable value after the replacing operation of slit jet nozzle 41.In addition, in automatic operating condition, because will proofread and correct at every turn, so do not need to clean ejiction opening 41c.
The correction of zero linear gauge;
The correction operation of linear gauge 81 (82) next, is described with reference to Figure 13.Figure 13 is the enlarged drawing (side view) of linear gauge 81 (82) states of expression timing.
Linear gauge 81 (82) before initial calibration, when the front end 813 (823) of measuring part 811 (821) is in the upright position identical with maintenance face 30, is proofreaied and correct measured value and is " 0 " (perhaps setting).In addition, when the front end 813 (823) of measuring part 811 (821) was in the upright position of the regulation different with maintenance face 30, also can not hinder measurement result proofreaied and correct became setting.
Specifically, in the trimming process of linear gauge 81 (82), operating personnel will press downwards from the outstanding upward mensuration part 811 (821) of maintenance face 30 with adjuster 83 when the tabular adjuster (aligning tool) 83 that will have flat surfaces PL is arranged on the maintenance face 30.Here, the face that contacts with maintenance face 30, be about to press measure part 811 face as tabular surface PL, then when tabular surface PL and maintenance face 30 became fit-state, the height of front end 813 was identical height with maintenance face 30.And it is constant to keep this state, is adjusted into " 0 " by the measured value with linear gauge 81 (82), finishes the correction of linear gauge 81 (82).
＜3. the action of substrate board treatment 〉
The following describes the action of substrate board treatment 1, in explanation, initial calibration and each motion flow of proofreading and correct at first are described, then the motion flow of the automatic running of explanation.
Zero initial calibration;
The action of the substrate board treatment 1 when initial calibration is carried out in explanation with reference to Figure 14 and Figure 15.Figure 14 is the flow chart of motion flow of expression initial calibration, and Figure 15 is the linear gauge 81 (82) when finding is carried out initial calibration from the side and the side view of slit jet nozzle 41.In addition, because (with reference to Figure 12) carried out in the cleaning of ejiction opening 41c before initial calibration, when initial calibration, ejiction opening 41c is in the state that can correctly be measured by linear gauge 81,82.
When initial correction began, initial calibration control part 604 moved horizontally slit jet nozzle 41 via travel mechanism's control part 602, thereby made ejiction opening 41c be positioned at the top of linear gauge 81 (82).That is, make the horizontal level unanimity (Figure 15 (a)) (step S101) of horizontal level and the linear gauge 81 (82) of ejiction opening 41c.Next, initial calibration control part 604 carries out the initial point centering (step S102) of ejiction opening 41c.More specifically, initial calibration control part 604 is via linear gauge control part 601 and elevating mechanism control part 603, in the upright position that monitors ejiction opening 41c, make slit jet nozzle 41 declines (Figure 15 (b)), when the measured value of the upright position of ejiction opening 41c is " 0 ", the decline of slit jet nozzle 41 is stopped (Figure 15 (c)).
Initial calibration control part 604 and then via travel mechanism's control part 602 moves horizontally slit jet nozzle 41, makes the mensuration position P (P ') of the slit jet nozzle 41 of having finished the initial point centering be in the top of linear gauge 81 (82).That is, make the horizontal level unanimity (Figure 15 (d)) (step S103) of measuring position P (P ') and linear gauge 81 (82).At this moment, impaired in order to prevent ejiction opening 41c because of linear gauge 81 (82), also can before moving horizontally, make above slit jet nozzle 41 temporarily keeps out of the way, after moving horizontally, make slit jet nozzle 41 turn back to upright position before moving horizontally.That is, moving horizontally so long as before moving and after moving here, the upright position of ejiction opening 41c not variation just can, do not limit mobile alignment midway.
After moving horizontally end, initial calibration control part 604 is via linear gauge control part 601, obtains the upright position of measuring position P (P '), is stored in the storage part 60 as initial stage upright position H0.
In addition, when the initial upright position H0 the during initial calibration in past has been stored in the storage part 60,, upgrade original initial upright position H0 by the initial upright position H0 that newly obtains.Thus, when the measured value of the upright position of ejiction opening 41c is " 0 ", can obtain measuring the upright position H0 of position P (P ').
In addition, in the initial calibration, slit jet nozzle 41 is moved horizontally, can and measure the determination object that switches linear gauge 81 (82) between the position P (P ') at ejiction opening 41c by travel mechanism 70,71.Thus, with a linear gauge, the upright position that just can measure ejiction opening 41c and measure position P (P '), thereby can simplify the structure of substrate board treatment 1.
Zero proofreaies and correct at every turn;
The action of the substrate board treatment 1 that carries out each timing is described below with reference to Figure 16 and Figure 17.Figure 16 is the flow chart of the each motion flow of proofreading and correct of expression, and Figure 17 is that finding is carried out the linear gauge 81 (82) of each timing and the side view of slit jet nozzle 41 from the side.
When each correction begins, each correction control part 605 is via travel mechanism's control part 602, slit jet nozzle 41 is moved horizontally, make to measure the top that position P (P ') is in linear gauge 81 (82), that is, make the horizontal level of measuring position P (P ') and the horizontal level unanimity (Figure 17 (a)) (step S201) of linear gauge 81 (82).Next, each correction control part 605 carries out the initial point centering (step S202) of ejiction opening 41c.More specifically, via linear gauge control part 601 and elevating mechanism control part 603, when monitoring the upright position of measuring position P, make slit jet nozzle 41 declines (Figure 17 (b)), when consistent, the decline of slit jet nozzle 41 is stopped (Figure 17 (c)) in the upright position of measuring position P with the initial upright position H0 in being stored in storage part 60.In this initial point centering, different with initial calibration, because do not carry out the mensuration of ejiction opening 41c, so even each initial point centering of proofreading and correct also can carry out under the state that is attached with treatment fluid on the ejiction opening 41c.
Next, each correction control part 605 is obtained location address AR when having finished the initial point centering via elevating mechanism control part 603, as address, reference position AR, is stored in (step S203) in the storage part 60.
The automatic running of zero substrate board treatment;
The motion flow of the substrate board treatment 1 when next turning round automatically with reference to the flowchart text of Figure 18.
When substrate board treatment 1 beginning is turned round automatically, initial, by each correction control part 605, carry out previous described each correction, carry out the initial point centering (step S301) of slit jet nozzle 41.
After each correction finishes,, will move in the retaining zone 91 of maintenance face 30, carry out vacuum suction (step S302) in retaining zone 91 as the substrate 90 of handling object by there not being illustrated conveyer.
Next, undertaken (step S304) handled in the coating of the resist of surperficial 90s by coating control part 606.Coating control part 606, in the coating process that carries out resist, according to the thickness T that waits the substrate of importing as data to control part 6 90 by operating personnel and interval G (the 50 μ m～300 μ m for example that can suitably carry out the resist coating, be typically 150 μ m～200 μ m), calculate ejiction opening 41c and maintenance face 30 apart from T+G the time, read address, reference position AR1 from storage part 60, based on formula 1, calculate the location address AR2 of the rotary encoder 442 that in the resist coating, should keep.Here, constant k is the lifting amount of slit jet nozzle 41 of the unit change of location address AR, in advance by experiment or theoretical and determine.
Formula 1:
Then, coating control part 606 is by controlling travel mechanisms 70,71 via travel mechanism's control part 602, make slit jet nozzle 41c on resist the area of application when horizontal fore-and-aft direction moves, the location address AR2 that calculates is offered elevating mechanism control part 603, at elevating mechanism control part 603, export control signals to servo motor 440 in the mode that realizes location address AR2.Thus, the distance of 30 in ejiction opening 41c and maintenance face is maintained T+G, will keep distance maintaining between ejiction opening 41c and the surface 90 at certain state.
The substrate 90 of having finished the resist coating is transported next treatment process (step S305) by conveyer.
Next, at substrate board treatment 1, whether the treatment substrate number that shifts according to the each correction of last time reaches stated number (for example 100) is carried out branch process (step S306).And when the treatment substrate number reaches stated number, return step S1, proofread and correct once more at every turn.On the other hand, when the treatment substrate number does not reach stated number, return step S3, begin the processing of new substrate.
By such action, in substrate board treatment, proofread and correct by the processing substrate of carrying out stated number at every turn at every turn.
In addition, in step S306, it also can not the treatment substrate number after shifting according to each correction of last time, carry out branch process but whether reach the stipulated time according to elapsed time of each correction of last time, when reaching the stipulated time, return step S301, when not reaching the stipulated time, return step S302.Therefore, by the processing substrate of carrying out stated number at every turn, perhaps pass through official hour, the precision of the control of the upright position of elimination ejection portion 41 is low at every turn.Thus, can correctly keep distance between ejiction opening 41c and surperficial 90s.
As mentioned above, as address, the reference position AR1 on the basis controlled of coating control part 606 is that the measured value of the upright position of the measured value of ejiction opening 41c when utilizing initial calibration and the upright position of measuring position P (P ') and the mensuration position P of each timing (P ') is determined, therefore, coating control part 606 and elevating mechanism control part 603 results utilize these measured values, control elevating mechanism 43,44.Promptly, in the substrate board treatment 1, ejiction opening 41c when utilizing initial calibration and measure the measured value of upright position of position P (P ') and the measured value of the upright position of the mensuration position P of each timing (P ') is carried out the initial point centering, by according to the variable quantity of the variable quantity of location address AR control from the upright position that initial point begins, thus the distance between control ejiction opening 41c and surperficial 90s.Because by carrying out based on such amount of movement, be the control of relative value, do not need to be provided with the mensuration member that the absolute value of the upright position of measuring slit jet nozzle 41 is used, so can simplify the structure of substrate board treatment 1.
In addition, in this form of implementation, as long as the upright position of ejiction opening 41c in the time of can only once correctly measuring initial calibration, just can correctly control later the distance between ejiction opening 41c and surperficial 90s, simultaneously do not need correctly to measure the upright position of ejiction opening 41c, can save the cleaning work of ejiction opening 41c.Thus, the automatic running of substrate board treatment 1 has just become easily.
＜variation 〉
In the above-mentioned form of implementation, though represented that substrate 90 is fixed, example that slit jet nozzle 41 moves to the direction vertical with substrate 90, fixedly slit jet nozzle 41, and moving substrate 90 also is fine.So long as be relative just passable with respect to the slit jet nozzle 41 of substrate 90 mobile.
Claims (8)
1. substrate board treatment is characterized in that having:
Determinator, it measures the upright position as the position on the direction vertical with the substrate that becomes the processing object;
Nozzle, it has the ejiction opening to aforesaid substrate ejection treatment fluid, measures the mensuration position of using the upright position and is defined within beyond the above-mentioned ejiction opening;
Vertical mobile device, it makes said nozzle move along the direction vertical with aforesaid substrate;
Control device, it controls above-mentioned vertical mobile device,
Above-mentioned control device utilizes the measurement result of the upright position at above-mentioned ejiction opening and said determination position, controls above-mentioned vertical mobile device.
2. substrate board treatment as claimed in claim 1 is characterized in that, also has storage device, the measurement result of upright position when the upright position of the above-mentioned ejiction opening of this memory device stores is the upright position of stipulating, the said determination position,
Above-mentioned control device moves said nozzle by above-mentioned vertical mobile device, consistent up to the measurement result of the upright position at said determination position with measurement result in being stored in above-mentioned storage device, handle thereby carry out the correction that above-mentioned ejiction opening is moved to the upright position of regulation.
3. substrate board treatment as claimed in claim 2 is characterized in that, the measurement result of the upright position at the said determination position of the measurement result of upright position that is stored in measurement result in the above-mentioned storage device and is above-mentioned ejiction opening during for the measurement result of regulation.
4. substrate board treatment as claimed in claim 2 is characterized in that, begins synchronously with the action of aforesaid substrate treating apparatus and carries out above-mentioned correction and handle.
5. substrate board treatment as claimed in claim 2 is characterized in that, the processing of the substrate of the regulation number of every process aforesaid substrate treating apparatus or process stipulated time just carry out above-mentioned correction and handle.
6. substrate board treatment as claimed in claim 1 is characterized in that, above-mentioned control device is by the amount of movement of the upright position of above-mentioned vertical mobile device control said nozzle, thus the distance of control aforesaid substrate and above-mentioned ejiction opening.
7. substrate board treatment as claimed in claim 1 is characterized in that, also has horizontally moving device, and this horizontally moving device makes said nozzle move along the direction parallel with aforesaid substrate,
By above-mentioned horizontally moving device said nozzle is moved along the direction parallel with aforesaid substrate, between above-mentioned ejiction opening and said determination position, switch the determination object of said determination device.
8. a substrate processing method using same by from the nozzle with ejiction opening substrate ejection treatment fluid being handled aforesaid substrate, is characterized in that, comprising:
Measure the first mensuration operation of the upright position of the above-mentioned ejiction opening on the direction vertical with aforesaid substrate;
Be determined at the said nozzle that is defined beyond the above-mentioned ejiction opening the mensuration position the upright position second measure operation;
Utilize above-mentioned first to measure the measurement result that operation and above-mentioned second is measured operation, the vertical mobile process that said nozzle is moved along the direction vertical with aforesaid substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004294705A JP4490780B2 (en) | 2004-10-07 | 2004-10-07 | Substrate processing apparatus and substrate processing method |
| JP2004-294705 | 2004-10-07 | ||
| JP2004294705 | 2004-10-07 |
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| CN1757439A true CN1757439A (en) | 2006-04-12 |
| CN1757439B CN1757439B (en) | 2011-10-19 |
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| CN2005100999261A Active CN1757439B (en) | 2004-10-07 | 2005-09-08 | Substrate processing device and method |
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| JP (1) | JP4490780B2 (en) |
| KR (1) | KR100685216B1 (en) |
| CN (1) | CN1757439B (en) |
| TW (1) | TWI268812B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101502822B (en) * | 2008-02-04 | 2012-05-30 | 联华电子股份有限公司 | Calibrating equipment of nozzle and calibration method of nozzle |
| CN101274313B (en) * | 2007-03-29 | 2012-12-19 | 东丽工程株式会社 | Coating device and coating method |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4752286B2 (en) * | 2004-12-28 | 2011-08-17 | 株式会社ニコン | Position adjustment apparatus control method, position adjustment apparatus, and exposure apparatus |
| JP4705517B2 (en) | 2006-05-19 | 2011-06-22 | 東京エレクトロン株式会社 | Substrate cleaning method, substrate cleaning apparatus, program, and recording medium |
| JP4799390B2 (en) * | 2006-12-15 | 2011-10-26 | 中外炉工業株式会社 | Application method |
| KR101020681B1 (en) | 2008-11-18 | 2011-03-11 | 세메스 주식회사 | Apparatus of coating photo resist composition in a Flat Panel Display manufacturing |
| KR101343502B1 (en) | 2009-07-24 | 2013-12-19 | 엘지디스플레이 주식회사 | Coater chuck of coating apparatus |
| JP5449239B2 (en) * | 2010-05-12 | 2014-03-19 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and storage medium storing program |
| JP6803120B2 (en) * | 2016-11-28 | 2020-12-23 | 東レエンジニアリング株式会社 | Origin detector and coating device |
| KR102641446B1 (en) * | 2017-07-19 | 2024-02-28 | 주식회사 탑 엔지니어링 | Dispenser |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH07256180A (en) * | 1994-03-23 | 1995-10-09 | Sony Corp | Method for applying fluid material to planar member and device therefor |
| JP3731616B2 (en) * | 1996-01-30 | 2006-01-05 | 東レ株式会社 | Coating apparatus and coating method, and color filter manufacturing apparatus and manufacturing method |
| JP3199239B2 (en) * | 1998-01-06 | 2001-08-13 | 東レ株式会社 | Manufacturing method and apparatus for plasma display member |
| JP3499438B2 (en) | 1998-05-28 | 2004-02-23 | 東京エレクトロン株式会社 | Application method |
| JP2003001165A (en) * | 2001-06-26 | 2003-01-07 | Seiko Instruments Inc | Liquid coating device |
| JP2003243286A (en) * | 2002-02-14 | 2003-08-29 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus |
| JP2004014393A (en) * | 2002-06-10 | 2004-01-15 | Dainippon Printing Co Ltd | Phosphor screen forming method and phosphor screen forming device of plasma display panel |
| JP2004351261A (en) * | 2003-05-27 | 2004-12-16 | Canon Inc | Coater and coating method |
| KR100566405B1 (en) * | 2003-09-08 | 2006-03-31 | 세메스 주식회사 | Apparatus and method for coating photoresist on a substrate for manufacturing flat panel display devices |
| JP4372606B2 (en) | 2004-04-16 | 2009-11-25 | 東京エレクトロン株式会社 | Coating film forming device |
-
2004
- 2004-10-07 JP JP2004294705A patent/JP4490780B2/en active Active
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- 2005-08-12 TW TW094127597A patent/TWI268812B/en active
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101274313B (en) * | 2007-03-29 | 2012-12-19 | 东丽工程株式会社 | Coating device and coating method |
| CN101502822B (en) * | 2008-02-04 | 2012-05-30 | 联华电子股份有限公司 | Calibrating equipment of nozzle and calibration method of nozzle |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4490780B2 (en) | 2010-06-30 |
| TWI268812B (en) | 2006-12-21 |
| JP2006102684A (en) | 2006-04-20 |
| CN1757439B (en) | 2011-10-19 |
| KR100685216B1 (en) | 2007-02-22 |
| TW200626250A (en) | 2006-08-01 |
| KR20060051365A (en) | 2006-05-19 |
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