CN1949079A - Coating apparatus and coating method - Google Patents

Coating apparatus and coating method Download PDF

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Publication number
CN1949079A
CN1949079A CNA2006101363563A CN200610136356A CN1949079A CN 1949079 A CN1949079 A CN 1949079A CN A2006101363563 A CNA2006101363563 A CN A2006101363563A CN 200610136356 A CN200610136356 A CN 200610136356A CN 1949079 A CN1949079 A CN 1949079A
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CN
China
Prior art keywords
substrate
nozzle
zone
applying device
coating
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Granted
Application number
CNA2006101363563A
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Chinese (zh)
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CN1949079B (en
Inventor
池田文彦
池本大辅
吉富济
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN1949079A publication Critical patent/CN1949079A/en
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Publication of CN1949079B publication Critical patent/CN1949079B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

Abstract

The invention provides a coating apparatus and a coating method. When a front end of a substrate G approaches a set position (start position for coating) near an area just below a resist nozzle (78), transferring of the substrate is stopped for a second inspection. An optical distance sensor (162) measures distances (Ld, Le) above and below the substrate G. Then, measured values of thickness D of the substrate and floating height Hb are compared to their set values or fiducial values [D] and [Hb]. If absolute values of [D]-D and [Hb]-Hb are within the preset range, 'normal' is obtained, other wise 'abnormal' is obtained. Thus the time for coating the substrate with a treating solution through non-revolving coating method with floating-transferring manner is shortened, the position relationship for heights of a floating table, the substrate and the nozzle is properly managed, and a coating film of the treating solution can be formed with uniform film thickness on the substrate.

Description

Applying device and coating method
Technical field
The present invention relates on processed substrate application of liquid to form the coating method and the applying device of coated film.
Background technology
In the manufacturing process of flat-panel monitors (FPD:flat panel display) such as LCD LCD, usually in photo-mask process (photolithography process), adopt resist nozzle to scan, thereby go up the non-rotating coating process of coating resist liquid at processed substrate (glass substrate etc.) strip with flute profile ejiction opening.
With regard to this non-rotating coating process, as described in patent documentation 1, substrate is lain in a horizontal plane on the loading stage or platform (stage) of absorption maintenance, between the ejiction opening of the resist nozzle of substrate on this platform and strip, be provided with the minim gap about 100 μ m, direction of scanning, resist nozzle one edge (generally being the horizontal direction with the length direction quadrature of nozzle) is moved, resist liquid be bandedly be injected in substrate on apply on one side.Only move on to the other end from an end of substrate once, both can make resist liquid not be dropped in substrate and on substrate, form resist film with the thicknesses of layers of expecting outward by the resist nozzle that makes strip.
In the applying device of above-mentioned non-rotating method,, need manage the gap between said nozzle and substrate in conjunction with setting value for the thickness with expectation is coated in resist liquid on the substrate.In the management of this gap, with the thickness (thickness of slab) of substrate as parameter.In general, the thickness of substrate is unfixing, has deviation in margin tolerance.For example, the thickness of glass substrate is nominally 0.7mm and its tolerance is ± 0.03mm, and at this moment, there is deviation in thickness of slab in the scope of 0.67mm～0.73mm.If the height of the resist nozzle of ejection resist liquid is fixed, then the deviation of thickness of slab causes above-mentioned gap to produce deviation, thereby causes the resist thickness to produce deviation.Therefore, before carrying out the resist coating, need measure the thickness of substrate in advance, the height and position of the ejiction opening of resist nozzle be adjusted, make above-mentioned gap meet setting value according to this Determination of thickness value.The general method that adopts following method as the mensuration substrate thickness, promptly, substrate from the last direction platform is pushed the pointer of dial ga(u)ge (dial gauge), measure height and position above the substrate according to the indicator read value, then, deduct the height and position (known value) above the platform from this measured value and try to achieve the thickness of substrate.Recently, can also adopt following method, that is, the substrate thickness determination part is installed on the resist nozzle, be used to measure required the taking up room especially or drive unit of substrate thickness to save.In addition, can also use optical distance sensor to replace the method for dial ga(u)ge.
Patent documentation 1: Japanese kokai publication hei 10-156255
The non-rotating resist applying device of above-mentioned employing absorption maintenance platform if the substrate after will handling unloads or moves and make platform vacant fully from platform, then can not be moved into follow-up new substrate on the platform.Therefore, scan required time (T at the resist nozzle c) the basis on, add and untreatment base moved into and even be loaded in required time (T on the platform In) and will handle substrate from platform unloading and even take out of required time (T Out) and constitute primary coating cycle of treatment required time (T c+ T In+ T Out), it becomes the running time (tact time), existing problems aspect shortening this running time.
Summary of the invention
The present invention proposes in view of above-mentioned prior art problems, and its purpose is to provide a kind of applying device and coating method by floating carrying method, can shorten the whole time of coating processing that applies treating fluid in non-rotating mode on substrate.
Another object of the present invention is to provide a kind of applying device and coating method, can in floating mode of transport, manage the height relationships of floating between platform and substrate and the nozzle suitably, make it possible on substrate, form the coated film for the treatment of fluid with uniform thickness.
To achieve these goals, applying device of the present invention comprises: have by what gaseous tension made that processed substrate suspends and first float the platform in zone; Make it pass through the substrate transferring portion of above-mentioned first area towards the conveyance direction conveyance of stipulating the aforesaid substrate of float state; Have and liftably be arranged on above-mentioned first and float the nozzle of top in zone, in order to float coating treating fluid on the aforesaid substrate in zone and to spray the treating fluid supply unit of above-mentioned treating fluid from said nozzle by above-mentioned first; Be used to make the nozzle lifting unit of said nozzle lifting moving; And, measure the thickness of aforesaid substrate and first determination part of the levitation height of aforesaid substrate with respect to above-mentioned at the aforesaid substrate that is about to float the coated above-mentioned treating fluid in zone above-mentioned first.
In addition, coating method of the present invention, in platform upper edge conveyance direction, be provided with in the following sequence row and be used for processed substrate is moved into the zone of moving on the above-mentioned platform, be used for supplying with treating fluid to form the area of application of coated film to the substrate that moves in above-mentioned conveyance direction from the strip nozzle of top, and the aforesaid substrate after being used for coating handled is taken out of the zone from what above-mentioned platform was taken out of, wherein, pressure by the gas that sprays above above-mentioned suspends aforesaid substrate, at above-mentioned the area of application aforesaid substrate is applied and roughly to float power uniformly, aforesaid substrate is being moved into regional conveyance to above-mentioned conveyance way of taking out of the zone from above-mentioned, for the aforesaid substrate that is about at the coated above-mentioned treating fluid of above-mentioned the area of application, measure the thickness and the levitation height of aforesaid substrate of aforesaid substrate with respect to above-mentioned.
In the present invention, substrate is suspended in the platform sky, is floating in the way of zone (the area of application), accept, on substrate, form the coated film for the treatment of fluid from the treating fluid of strip nozzle ejection by first of platform.According to the present invention, because the zone is floated in clamping first, downstream side (taking out of the zone) will handle substrate take out of outside the platform taking out of action and the new substrate that upstream side (moving into the zone) will be accepted next processing move on the platform to move into action independent or carry out side by side, thereby can shorten the whole coating processing time.
Originally, the coating of this non-rotating method is handled, and need make the coating gap between nozzle-substrate meet setting value, because substrate is suspended on the platform, the deviation of substrate thickness and the deviation of levitation height are applied gap affects, influence the quality of coated film furtherly easily.About this point, in the present invention, for the substrate that is about to coated treating fluid at the area of application, the thickness by measuring this substrate and this substrate relatively with the levitation height of platform, and can suitably control or manage applying the gap.
According to preferred implementation of the present invention, when the measured value of the measured value of the substrate thickness of determining to obtain and levitation height from first determination part respectively within the limits prescribed after, substrate is applied processing.Like this, can stablize the quality of coating handled thing by the non-rotating coating process that floats the conveyance formula.
In addition, in preferred implementation of the present invention, the nozzle lifting unit comprise support nozzle and with the nozzle support body of its one lifting moving, first determination part to comprise in order measuring with platform or the distance above the substrate and to be arranged on first optical distance sensor on the nozzle support body at interval.At this moment, first optical distance sensor is by nozzle support body and nozzle-integrated lifting moving, can according to from sensor determination and platform or above the substrate between distance try to achieve nozzle and platform or above the substrate between distance.
In addition, in preferred implementation of the present invention, after the measured value of the thickness measurement value of confirming substrate and levitation height is distinguished within the limits prescribed, handle the gap of usefulness and nozzle is descended in order to form coating at the ejiction opening of nozzle and between above the substrate by the nozzle lifting unit, by first optical distance sensor measure and above the substrate between distance, determine the gap.At this moment, can calculate the measured value of trying to achieve substrate thickness and the measured value of levitation height, and the height and position above platform is in order to obtain to expect to apply the nozzle height position in gap.But when the gaseous tension that imposes on substrate from platform changed, the levitation height of substrate reality might can't be followed theoretical numerical value and change.Therefore, before being about to begin coating, measure substrate height actual or at that time, confirm whether the coating gap is normal according to first optical distance sensor.In view of the above, can further improve the credibility that applies processing by the non-rotating coating process that floats formula.
In addition, according to preferred implementation of the present invention, in coating is handled, on one side by first optical distance sensor measure with distance above the substrate at interval, change the height and position of adjusting nozzle by the nozzle lifting unit on one side, keep the gap to be of a size of setting value.Thus, in the FEEDBACK CONTROL that the range determination function of first optical distance sensor can be applied to carry out for the keeping management of gap.
In addition,, have, measure second determination part of the height and position of nozzle support body in order to check the mensuration precision of first optical distance sensor according to preferred implementation of the present invention.This second determination part preferably has the linear scale that is arranged on the nozzle elevating mechanism.
In addition, in preferred implementation of the present invention, before the mensuration precision of first optical distance sensor is checked, when using the mensuration utensil nozzle to be positioned at the altitude datum position of regulation in advance, write down first measured value that obtains by first optical distance sensor and second measured value of passing through the acquisition of second determination part by actual measurement.Then, do not measure utensil when second determination part obtains second measured value, judge whether the measured value that obtains from the first optical distance analyzer is consistent or approximate in the permissible range of first measured value regulation when in above-mentioned inspection, not using.The preferably inspection that the mensuration precision of this optical distance sensor is carried out, the mensuration of substrate being carried out prior to first determination part is handled and is carried out.
And, according to preferred implementation of the present invention, have in order to check the installation site precision of nozzle, be independent of the nozzle lifting unit, measure distance the 3rd determination part at interval between platform and the nozzle.Preferred the 3rd determination part has and is arranged on above-mentioned side, contacts the contact range sensor of measuring distance with contact pilotage in the lower end of nozzle, perhaps contacts second optical sensor of measuring distance with light beam in the lower end of nozzle.Preferably to the inspection of the installation site precision of said nozzle, the mensuration inspection of substrate being carried out prior to first determination part and carrying out.
In addition, according to preferred implementation of the present invention, first determination part has the 3rd optical distance sensor that is arranged on the nozzle support body for the thickness of measuring substrate; Has the 4th optical distance sensor that is arranged on the platform side for the thickness of measuring aforesaid substrate; And/or in order to measure substrate with respect to the levitation height of platform and have the 5th optical distance sensor that is arranged on the platform side.
In addition, the preferred implementation of applying device of the present invention comprises: be arranged on above-mentioned first ejiction opening of a plurality of ejection gases that floats in the zone; The attraction mouth that in first of platform floats the zone, mixes a plurality of suction gases that are provided with ejiction opening; And control is at by floating the raise control part of above-mentioned first aforesaid substrate that floats the zone from the balance between the additional pressure vertically upward of above-mentioned ejiction opening and the pressure vertically downward that adds by above-mentioned attraction mouth.
At this moment, preferred platform in the conveyance direction first upstream side that floats the zone have make that substrate suspends second float the zone.Second float the zone in can be provided with the portion that moves into that is used for the conveyance substrate.And, as a kind of optimal way, substrate transferring portion floats the zone from second and floats regional conveyance substrate to first, when the coating starting position of the leading section that is set in substrate arrive nozzle under the time temporarily stop substrate, first determination part is at the thickness of the basal lamina determination substrate that temporarily stops and the platform levitation height with respect to aforesaid substrate.
As optimal way, platform in the conveyance direction above-mentioned first downstream side that floats the zone have make that substrate suspends the 3rd float the zone.Can float the 3rd and be provided with the portion that takes out of that is used to take out of substrate in the zone.
In addition, according to optimal way, the choosing of substrate transferring quality award from the ministry comprises: the guide rail that is arranged on the one or both sides of platform in the mode that is parallel to the extension of aforesaid substrate moving direction; The slider that can move along guide rail; Drive the conveyance drive division that this slider moves along guide rail; And, releasably keep the maintaining part of the side portion of substrate from the central part extension of slider to platform.
According to applying device of the present invention and coating method, by above-mentioned formation and effect, can shorten the whole time that on processed substrate, applies the coating processing for the treatment of fluid by non-rotating mode, simultaneously, in floating the non-rotating coating process of conveyance mode, the height and position relation of floating between platform and substrate and the nozzle is managed aptly, can make the treating fluid coated film on substrate form uniform thickness.
Description of drawings
What Fig. 1 represented is the planimetric map that is applicable to the formation of coating video picture disposal system of the present invention.
Fig. 2 represents is the process flow diagram of the processing sequence in the coating video picture disposal system of present embodiment.
Fig. 3 represents is the simple planimetric map that the integral body of resist coating element in the coating video picture disposal system of present embodiment and drying under reduced pressure unit constitutes.
What Fig. 4 represented is the stereographic map of the integral body formation of the resist coating element in the present embodiment.
What Fig. 5 represented is the simple front view (FV) of the integral body formation of the resist coating element in the present embodiment.
What Fig. 6 represented is the planimetric map of an example of the ejiction opening in the interior platform the area of application of above-mentioned resist coating element and the pattern of rows and columns that attracts mouth.
Fig. 7 represents is the partial side view in cross section of formation of the substrate transferring portion of above-mentioned resist coating element.
Fig. 8 represents is the amplification sectional view of formation of support portion of the substrate transferring portion of above-mentioned resist coating element.
Fig. 9 represents is the stereographic map of formation of pad portion of the substrate transferring portion of above-mentioned resist coating element.
Figure 10 represents is the stereographic map of a variation of support portion of the substrate transferring portion of above-mentioned resist coating element.
What Figure 11 represented is the pie graph of nozzle elevating mechanism, pressurized air feed mechanism and the vacuum feed mechanism of above-mentioned resist coating element.
What Figure 12 represented is the partial side view in cross section of the resist nozzle of above-mentioned resist coating element and the support structure of optical distance determination part (nozzle support body).
Figure 13 is the block diagram of main composition of the control system of the above-mentioned resist coating element of expression.
Figure 14 represents is in a succession of coating action of present embodiment, about the process flow diagram of the main order of gap of the present invention management function.
Figure 15 represents is the stereographic map in a stage of the gap management function of present embodiment.
Figure 16 represents is the side view in a stage of the gap management function of present embodiment.
Figure 17 represents is the stereographic map in a stage of the gap management function of present embodiment.
Figure 18 represents is the side view in a stage of the gap management function of present embodiment.
Figure 19 represents is the stereographic map in a stage of the gap management function of present embodiment.
Figure 20 represents is the side view in a stage of the gap management function of present embodiment.
What Figure 21 represented is the side view of the coating scanning of present embodiment.
Figure 22 represents is the side view of a scene in the coating scanning of present embodiment.
Figure 23 represents is the chart of the judgement algorithm in the abnormal cause dissection process of present embodiment.
Figure 24 represents is that the side view of checking is measured in the abnormal cause dissection process of present embodiment three times.
What Figure 25 represented is the side view of the formation of a variation in the present embodiment.
What Figure 26 represented is the side view that obtains a kind of function in a variation of present embodiment.
Label declaration:
40: resist coating element (CT); 75: the nozzle elevating mechanism; 76: platform; 78: the resist nozzle; 84: substrate transferring portion; 88: ejiction opening; 90: attract mouth; 93: resist liquid supply source; 100: the conveyance drive division; 102: maintaining part; 104: the adsorption-buffering pad; 126: the stylobate plate floats portion; 134: the nozzle support body; 162: optical distance sensor; 164: linear scale; 166: the contact range sensor; 170: controller; 174: optical distance sensor; M1: move into the zone; M3: the area of application; M5: take out of the zone.
Embodiment
Below, with reference to accompanying drawing, preferred implementation of the present invention is described.
Fig. 1 is that expression is as the coating developing system that is applicable to the structure example of coating method of the present invention and applying device.This coating developing system is set in the dust free room, for example with the LCD substrate as processed substrate, in the LCD manufacture process, carry out cleaning in the photo-mask process, resist coating, prebake, development and after every processing of curing.In the exposure device (not shown) of the outside that is provided with, carrying out exposure-processed with this system.
This coating developing system is made of box station (C/S:cassette station) 10, processing station (P/S:process station) 12 and interface portion (I/F:interface) 14 substantially.
The box station (C/S) 10 that is arranged on system one end comprises: can mounting for example specified quantity mostly is the box platform 16 of the box C of a plurality of substrate G of four contain most, the carrying channel 17 that be arranged in parallel in the side on this box platform 16 and with the orientation of box C and can moving freely on this carrying channel 17, and substrate G is carried out the transport mechanism 20 that access is used with respect to the box C on the platform 16.This transport mechanism 20 has the device that can keep substrate G, carrying arm for example, and it can be in motion on four of X, Y, Z, the θ, and can carry out the handing-over of substrate G with the carrying device 38 of processing station described later (P/S) 12 sides.
For processing station (P/S) 12, from above-mentioned box station (C/S) 10 sides, make to clean to add that the Ministry of worker 22, coating add the Ministry of worker 24, developing adds the Ministry of worker 26 each is successively set on a line via (seizing on both sides by the arms) substrate relay 23, soup feed unit 25 and interlayer 27 respectively.
Clean and to add the Ministry of worker 22 and comprise: scrub clean unit (SCR) 28, two sections ultraviolet ray irradiation/cooling units (UV/COL) 30, heating unit (HP) 32 and cooling unit (COL) 34 for two.
Coating adds the Ministry of worker 24 and comprises: the resist coating element (CT) 40 of non-rotating mode, drying under reduced pressure unit (VD) 42, two sections type adhesion/cooling unit (AD/COL) 46, two sections type heating/cooling unit (HP/COL) 48 and heating unit (HP) 50.
Development adds the Ministry of worker 26 and comprises: 52, two two sections types of three developing cells (DEV) heating/cooling unit (HP/COL) 53 and heating unit (HP) 55.
Carrying channel 36,51,58 is set on the length direction of the middle body that respectively adds the Ministry of worker 22,24,26, carrying device 38,54,60 moves along each carrying channel 36,51,58, to visit each unit that respectively adds in the Ministry of worker, carry out moving into/take out of or conveyance of substrate G.Wherein,, in respectively adding the Ministry of worker 22,24,26, dispose liquid processing system unit (SCR, CT, DEV etc.), be provided with heat treatment system unit (HP, COL etc.) at opposite side in carrying channel 36,51,58 1 sides for this system.
Be arranged on the interface portion (I/F) 14 of the other end of system, be provided with appendix (extension) (substrate delivery/reception portion) 56 and buffer table 57 in abutting connection with a side, be provided with transport mechanism 59 in abutting connection with a side with exposure device with processing station 12.This transport mechanism 59 can move freely on the carrying channel 19 that extends along the Y direction, and except carrying out the access of substrate G with respect to buffer table 57, also the exposure device with appendix (substrate delivery/reception portion) 56 and adjacency carries out the handing-over of substrate G.
Fig. 2 is the processing sequence in this coating developing system of expression.At first, in box station (C/S) 10, take out a substrate G the regulation box C of transport mechanism 20 from platform 16, and it is passed to the clean carrying device 38 (step S1) that adds the Ministry of worker 22 in the processing station (P/S) 12.
Add in the Ministry of worker 22 clean, in order, substrate G is at first moved in the ultraviolet ray irradiation/cooling unit (UV/COL) 30, in initial ultraviolet irradiation unit (UV), be implemented the dry type of utilizing the ultraviolet ray irradiation to carry out and clean, in cooling unit (COL) subsequently, be cooled to set point of temperature (step S2).In this ultraviolet ray is cleaned, mainly be the organism of removing substrate surface.
Then, substrate G scrubs at one and accepts in the clean unit (SCR) 28 to scrub to clean to handle, and removes the particle shape dirt (step S3) of substrate surface.Scrub clean after, substrate G accepts the processed (step S4) of being undertaken by heating in heating unit (HP) 32, subsequently, be cooled to certain substrate temperature (step S5) in cooling unit (COL) 34.Thus, clean the processing in early stage that adds the Ministry of worker 22 and finish, substrate G is added the Ministry of worker 24 via substrate delivery/reception portion 23 by conveyance to coating by carrying device 38.
Add in the Ministry of worker 24 in coating, in order, substrate G is at first moved in adhesion/cooling unit (AD/COL) 46, accepts hydrophobization and handle (HMDS) (step S6) in initial coherent unit (AD), is cooled to certain substrate temperature (step S7) in cooling unit (COL) subsequently.
Afterwards, substrate G in resist coating element (CT) 40 by non-rotating method coated resist, subsequently, in drying under reduced pressure unit (VD) 42, accept the dried (step S8) of being undertaken by decompression.
Then, in order, substrate G is moved in heating/cooling unit (HP/COL) 48, cures (prebake) (step S9) after applying in initial heating unit (HP), subsequently, in cooling unit (COL), be cooled to certain substrate temperature (step S10).In addition, in the baking and banking up with earth after this coating, also can use heating unit (HP) 50.
After above-mentioned coating is handled, substrate G add the carrying device 54 of the Ministry of worker 24 by coating and develop the carrying device 60 that adds the Ministry of worker 26 and by conveyance to interface portion (I/F) 14, be passed to exposure device (step S11) from interface portion (I/F) 14 again.In exposure device, the circuit design of the regulation of on the resist on the substrate G, exposing to.Then, the substrate G that finishes after pattern exposure is handled is returned to interface portion (I/F) 14 from exposure device.The transport mechanism 59 of interface portion (I/F) 14 will add the Ministry of worker 26 (step S11) via the development that appendix 56 is passed to processing station (P/S) 12 from the substrate G that exposure device is obtained.
Add in the Ministry of worker 26 in development, substrate G accepts development treatment (step S12) in any one visualization unit (DEV) 52, subsequently, in order, moved into to one of heating/cooling unit (HP/COL) 53, cure (step S13) after in initial heating unit (HP), carrying out, then, in cooling unit (COL), be cooled to certain substrate temperature (step S14).Use heating unit (HP) 55 in also can after this, curing.
Add the substrate G that finishes a series of processing in the Ministry of worker 26 in development, returned to box station (C/S) 10 by the carrying device 60,54,38 in the processing station (P/S) 12, in box station (C/S) 10, be housed among any one box C (step S1) by transport mechanism 20.
In this coating developing system, the present invention can be applicable to that for example coating adds in the resist coating element (CT) 40 of the Ministry of worker 24.Below, with reference to Fig. 3～Figure 26, the embodiment that the present invention is suitable in resist coating element (CT) 40 describes.
In Fig. 3, represent the one-piece construction of the resist coating element (CT) 40 and drying under reduced pressure unit (VD) 42 of this embodiment.
As shown in Figure 3, on brace table or supporting seat 70, resist coating element (CT) 40 and drying under reduced pressure unit (VD) 42 are configured to a line along directions X.Should accept to apply the new substrate G of processing, by the carrying device 54 (Fig. 1) of carrying channel 51 sides, along arrow F AShown in direction and by being moved in the resist coating element (CT) 40.In resist coating element (CT) 40, finish the substrate G that coating is handled, by the carrying arm 74 that can move along directions X, along arrow F by 72 guiding of the guide rail on the brace table 70 BShown in direction be sent to drying under reduced pressure unit (VD) 42.In drying under reduced pressure unit (VD) 42, finish the substrate G of dried, by the carrying device 54 (Fig. 1) of carrying channel 51 sides along arrow F CShown in direction be retrieved.
Resist coating element (CT) 40 has the platform 76 that extends at directions X, constitute this on 76 in equidirectional advection ground conveyance substrate G, supply with resist from the strip resist nozzle 78 of the top that is configured in platform 76 to substrate G, thereby, with the resist coated film of non-rotating method certain thickness of (processed face) formation on substrate.To the structure and the effect of the each several part in the resist coating element (CT) 40 be described in detail in the back.
Drying under reduced pressure unit (VD) 42 has the lower chamber 80 that is plate-like or container type of the shallow end of opening in the above and can connect airtight with this lower chamber 80 top airtight or the upper chamber (not shown) of the chimeric lid shape that constitutes.Lower chamber 80 is quadrilateral substantially, is provided with also passive 82 of horizontal mounting substrate G at central part, and the Si Jiaochu in the bottom surface is provided with exhausr port 83.Each exhausr port 83 communicates with vacuum pump (not shown) via gas outlet (not shown).Under upper chamber covers state on the lower chamber 80, can utilize this vacuum pump to make the processing space that is sealed in two chambers be decompressed to the specified vacuum degree.
Fig. 4 and Fig. 5 represent the more detailed one-piece construction in the resist coating element (CT) 40 of an embodiment of the invention.
In the resist coating element (CT) 40 of this embodiment, platform 76 is not that as prior art usefulness fixes and keeps the mounting table of substrate G, but as making substrate G float over aerial substrate floating platform by air pressure.So, be configured in the substrate transferring portion 84 of the translatory movement type of platform 76 both sides, releasably keep floating over the both sides of the edge portion of the substrate G on the platform 76 respectively, the length direction (directions X) that makes it possible to along platform carries out conveyance to substrate G.
In detail, for platform 76, be divided into five regional M at its length direction (directions X) 1, M 2, M 3, M 4, M 5(Fig. 5).Left end zone M 1For moving into the zone, the new substrate G that should accept to apply processing is moved into this zone M 1Interior assigned position.Move into regional M at this 1In, in order to obtain substrate G from the carrying arm of carrying device 54 (Fig. 1) and it to be loaded on the platform 76, and above original position below the platform and the platform toward between the moving position, in accordance with regulations be arranged at intervals with can lifting moving many lifter pins 86.These lifter pins 86 for example drive lifting by use moving into lifter pin lifting unit 85 (Figure 13) of cylinder (not shown) in drive source.
This moves into regional M 1Be the beginning zone of floating the formula substrate transferring, above the platform in this zone, in order to make substrate G to move into levitation height or floatation volume H aFloat, and be provided with a plurality of ejection high pressure or the compressed-air actuated ejiction opening 88 of malleation with certain density.At this, move into regional M 1The floatation volume H of substrate G aNeed not extra high precision, for example only need remain on interior the getting final product of scope of 100～150 μ m.In addition, on conveyance direction (directions X), preferably move into regional M 1Size be slightly larger than the size of substrate G.And, moving into field M 1In, can also be provided with and make substrate G on platform 76, locate the calibration portion (not shown) of usefulness.
Be set in the regional M of the central part of platform 76 3Be resist supply area or the area of application, substrate G is passing through this area of application M 3The time, accept the resist liquid R that supplies with from the resist nozzle 78 of top.The area of application M 3Substrate floating amount H bStipulate the lower end (discharge opening) of nozzle 78 and the interval S between (processed face) (as 100 μ m) above the substrate.This interval S is the important parameters of the thickness and the resist consumption of left and right sides resist coated film, is necessary to maintain certain high precision.Thus, at the area of application M 3Platform above, in order to make substrate with desirable floatation volume H bFloat,, mix the suction inlet 90 that is provided with ejection high pressure or the compressed-air actuated ejiction opening 88 of malleation and utilizes the negative pressure suck air with arrangement or distribution patterns as shown in Figure 6.So substrate G is by the area of application M relatively 3Interior part applies the power vertically upward of utilizing pressurized air to produce from ejiction opening 88, simultaneously, applies the power vertically downward of utilizing negative pressure suction force to produce from suction inlet 90, and the twocouese equilibrium of forces by control resists mutually will be coated with application floatation volume H bMaintain setting value H sAbout (as 50 μ m).For the coating field M on the conveyance direction (directions X) 3Size, can stablize the aforesaid narrow and small coating that forms under the resist nozzle 78 leeway of S at interval as long as have, common, can be smaller slightly than the size of substrate G, for example about 1/3～1/4.
As shown in Figure 6, at the area of application M 3In, be on the straight line C at certain angle of inclination with respect to substrate transferring direction (directions X), dispose ejiction opening 88 and suction inlet 90 alternately, between each row of adjacency, the pitch on straight line C is provided with suitable biasing α.According to this configuration pattern; not only make the hybrid density homogenising of ejiction opening 88 and suction inlet 90; thereby the substrate floating acting force on the homogenising platform; but also make substrate G along conveyance direction (directions X) when mobile; the time scale relative with ejiction opening 88 and suction inlet 90 is in each homogenising of substrate; thereby, can prevent from the coated film that forms on the substrate G, to produce the track of ejiction opening 88 or suction inlet 90 or make carbon copies vestige.At the area of application M 3The porch, go up in direction (Y direction) for the leading section that makes substrate G and stablize acceptance and to float power uniformly, the preferred raising in the ejiction opening 88 of equidirectional (straight line J) arrangement and the density of suction inlet 90 with conveyance direction quadrature.In addition, at the area of application M 3In, in the both sides of the edge of platform 76 one (straight line K), hang down for the both sides of the edge subordinate who prevents substrate G, preferably only dispose ejiction opening 88.
Just be set in and move into regional M 1With the area of application M 3Between zone line M 2, it is to be used in the conveyance process the levitation height position of substrate G from moving into regional M 1In floatation volume H aChange or move and be the area of application M 3In floatation volume H bThe migration zone.Move regional M at this 4In, also can on platform 76, ejiction opening 88 and suction inlet 90 be arranged mixed configuration.In this case, the density of preferred suction inlet 90 improves gradually along the conveyance direction, thereby, make the levitation height of the substrate G in conveyance by H aGradually become H bPerhaps, also can form and move regional M at this 2In, do not comprise suction inlet 90 and the structure of ejiction opening 88 only is set.
With the area of application M 3Downstream adjacent areas M 4, be in conveyance, to be used for floatation volume with substrate G from being coated with application floatation volume H bBecome to take out of and use floatation volume H cThe migration zone of (as 100～150 μ m).Move regional M at this 4In, also can be on platform 76 with ejiction opening 88 and suction inlet 90 mixed configuration, in this case, the density of preferred suction inlet 90 reduces gradually along the conveyance direction.Perhaps, also can form the structure that does not comprise suction inlet 90 and only be provided with ejiction opening 88.In addition, as shown in Figure 6, with the area of application M 3Identical, at the regional M of migration 4In, in order to prevent on the resist coated film that forms on the substrate G, to produce the manifolding vestige, preferred its structure is on the straight line E at certain angle of inclination for suction inlet 90 (and ejiction opening 88) is configured in respect to substrate transferring direction (directions X), and connect between each row facing, suitable biasing β is set arranging pitch.
The regional M of the downstream end of platform 76 (right-hand member) 5For taking out of the zone.Accepted to apply the substrate G of processing in resist coating element (CT) 40, (Fig. 3) takes out of regional M from this by carrying arm 74 5In assigned position or take out of the position and by the drying under reduced pressure unit (VD) 42 (Fig. 3) of conveyance to the downstream adjacency.Take out of regional M at this 5In, on platform, be provided with and a plurality ofly be used to make substrate G to use floatation volume H to take out of with certain density cThe ejiction opening 88 that floats, meanwhile, for substrate G from platform 76 unloading and be sent to carrying arm 74 (Fig. 3), and be provided with the lifter pin 92 that a plurality of liftables move toward moving between the position with predetermined distance above the original position below the platform and the platform.These lifter pins 92 for example utilize to be used taking out of with lifter pin lifting unit 91 (Figure 13) of cylinder (not shown) and drives lifting in drive source.
For resist nozzle 78, it has and can pass through length that the substrate G on the platform 76 is covered and go up the nozzle body of the strip that extends with the horizontal direction (Y direction) of conveyance direction quadrature, liftably be supported on a shape or the contrary nozzle support body 130 of " コ " (Japanese ideogram) font (Figure 11) by vertical line motion 132 and nozzle support body 134, and be connected with resist liquid supply pipe 94 (Fig. 4) from resist liquid supply source 93 (Figure 13).
As Fig. 4, Fig. 7 and shown in Figure 8, substrate transferring portion 84 comprises respectively: configured in parallel is in the pair of guide rails 96 of platform 76 left and right sides, be installed on each guide rail 96 and (directions X) mobile slide block 98 vertically, on each guide rail 96, make slide block 98 directly advance mobile conveyance drive division 100, and maintaining part 102 from each slide block 98 to the central part of platform 76 that extend and releasably keep the left and right sides edge part of substrate G from.
At this, conveyance drive division 100 by the straight moving type driving mechanism for example linear motor constitute.In addition, maintaining part 102 comprises respectively: utilize vacuum adsorption force to be combined in the following adsorption-buffering pad 104 of the left and right sides edge part of substrate G; And support adsorption-buffering pad 104 at leading section, as fulcrum, can change the height and position of leading section with the base end part of slide block 98 sides, and the leaf spring type cushion pad support portion 106 of elastically deformable.Adsorption-buffering pad 104 is configured to row with a constant pitch, and cushion pad support portion 106 is supported each adsorption-buffering pad 104 respectively independently.Therefore, each adsorption-buffering pad 104 and cushion pad support portion 106 can (even different height and positions) stably keep substrate G on height and position independently.
As Fig. 7 and shown in Figure 8, the cushion pad support portion 106 in this embodiment is installed on the tabular cushion pad Lift Part 108, and wherein, this tabular cushion pad Lift Part 108 liftably is installed in the medial surface of slide block 98.The cushion pad actuator 109 (Figure 13) for example cylinder be made of of lift-launch on slide block 98 makes cushion pad Lift Part 108 at the original position lower than the levitation height position of substrate G (retreating position) and carry out lifting moving corresponding to the levitation height position of substrate G between moving position (binding site).
As shown in Figure 9, each adsorption-buffering pad 104 for example is provided with a plurality of suction inlets 112 on the cushion pad main body 110 of the cuboid of being made by synthetic rubber.These suction inlets 112 both can be the elongated slots of incision-like, also can be the apertures of sphere or rectangle.On adsorption-buffering pad 104, be connected with the banded vacuum tube of for example making 114 by synthetic rubber.The stream 116 of these vacuum tubes 114 is connected with the vacuum source of cushion pad absorption control part 115 (Figure 13) respectively.
As shown in Figure 4, with regard to maintaining part 102, the vacuum suction cushion pad 104 of preferred one-sided row and cushion pad support portion 106 are structures of the divergence type or the complete self of separation in each group.But as shown in figure 10, its structure also can be to be provided with cushion pad support portion 120 that forms one-sided row on the leaf spring of notch portion 118 and the monolithic devices structure that disposes the vacuum suction cushion pad 104 of one-sided row thereon.
As mentioned above, utilize a plurality of ejiction openings 88 on platform 76, form and provide and float power and take place, and utilization is at the area of application M of platform 76 with compressed-air actuated pressurized air feed mechanism 122 (Figure 11) to it 3In mixes a plurality of suction inlets 90 of formation with ejiction opening 88 and, makes substrate G move into regional M to the vacuum feed mechanism 124 (Figure 11) of its supply vacuum pressure 1And take out of regional M 5In move into and the floatation volume of high speed conveyance is floated to be fit to take out of, at the area of application M 3In, be useful on the floatation volume H that substrate G is set to be suitable for stable and correct resist coating scanning SThe stylobate plate that floats floats portion 126 (Figure 13).
Figure 11 represents the structure of nozzle elevating mechanism 75, pressurized air feed mechanism 122 and vacuum feed mechanism 124.Nozzle elevating mechanism 75 comprises: to go up across the area of application M in the horizontal direction (Y direction) with conveyance direction (directions X) quadrature 3Mode and the door shape supporter 130 that sets up is installed in the vertical straight-line motion mechanism 132 on this shape supporter 130, and as the nozzle support body 134 of the moving body (lifting body) of this vertical straight-line motion mechanism 132.At this, the drive division of straight-line motion mechanism 132 comprises: genemotor 138, ball-screw 140 and guiding parts 142.The revolving force of electro-motor 138 is transformed to the rectilinear motion of vertical direction by ball screw framework (140,142,134), the nozzle support body 138 of nozzle 78 and lifting body integratedly vertical universal on lifting moving.According to the rotation amount and the rotation stop position of electro-motor 138, can control the lifting moving amount and the height and position of resist nozzle 78 arbitrarily.As shown in figure 12, nozzle support body 134 for example is made of the rigid body of corner post shape, releasably resist nozzle 78 is installed in its lower section or the side by flange or keeper etc.
Pressurized air feed mechanism 122 comprises: the malleation house steward 144 that a plurality of zones of cutting apart on platform 76 are connected with ejiction opening 88 respectively, the compressed-air actuated pressurized air supply pipe 148 of carrying factory for example to exert oneself to these malleations house steward 144, and the calibrating device 150 that is arranged on the centre of this pressurized air supply pipe 148 from pressurized air supply source 146.Vacuum feed mechanism 124 comprises: the negative pressure house steward 152 that a plurality of zones of cutting apart on platform 76 are connected with suction inlet 90 respectively, the vacuum tube 156 of carrying that factory for example exerts oneself to these negative pressure house steward 152, and the air throttle 158 that is arranged on the centre of this vacuum tube 156 from the vacuum of vacuum source 154.
With regard to this resist liquid coating element (CT) 40, it is at the area of application M of platform 76 3In, in order to manage gap S between resist nozzle 78 and the substrate G and the levitation height H of substrate G suitably b, and have becoming distance that applies the various piece of handling important parameter and a plurality of determination parts or the determinator that the position is measured.
That is, in order to measure the distance interval between platform 76 or substrate G and the nozzle, supporter 134 is provided with optical distance sensor 162 (Fig. 4, Fig. 5, Fig. 7, Figure 11, Figure 12).This optical distance sensor 162, in resist nozzle 78 1 sides (preferably at the conveyance upstream side or move into regional M 1Side) be arranged to can with the 78 one liftings of resist nozzle, and optical detecting from arbitrary height under object, promptly and the distance platform 76 or the substrate G.Measure in order to carry out this optical range, optical sensor 162 comprises: to the light-projecting portion of vertical lower illumination beam and corresponding to measuring the light accepting part that the distance and position place receives the light that is reflected from the object (platform 76 or substrate G) with this light beam collision.In illustrated configuration example, be provided with a pair of optical distance sensor 162 at length direction (Y direction) left and right symmetrically of resist nozzle 78, respectively to measuring, and get the mean value of two measured values at both ends, the left and right sides with the distance of platform 76 or substrate G.The mensuration precision of this optical distance sensor 162 depends primarily on the mechanical precision of vertical line motion 132, and changes in time.
In addition, in order to check and even monitor the mensuration precision of above-mentioned optical distance sensor 162, between door shape supporter 130 and nozzle support body 134, be provided with linear scale 164 (Figure 11).This linear scale 164, by be fixed on the shape supporter 130 the 164a of scale portion that extends in the Z direction and for corresponding to the height and position horizontal optical of nozzle support body 134 read this 164a of scale portion and the scale reading part 164b that is fixed on the nozzle support body 134 constitutes.As long as door shape supporter 130 is securely fixed on the ground, then the mensuration precision of this linear range sensor 164 can cause confusion hardly, can remain correctly the height and position that nozzle support body 134 and even optical distance sensor 162 are measured.
And, in order to check and even detect the installation site precision of the resist nozzle 78 that releasably is arranged on the nozzle support body 134, be provided with contact range sensor 166 (Fig. 7, Figure 11) in platform 76 1 sides.This contact range sensor 166, constitute by dial ga(u)ge (dialgauge), from the below vertically with contact pilotage by being pressed in resist nozzle 78 lower ends, directly measure and resist nozzle 78 between distance, specifically, resist nozzle 78 is measured with respect to the height and position above the platform 76.In the example that diagram constitutes, a pair of contact range sensor about 166 is arranged on the both sides of platform 76, respectively the height and position at the two ends, the left and right sides of resist nozzle 78 is measured, and got the mean value of two measured values.
What show among Figure 13 is the main composition of the control system in the resist coating element (CT) 40 of this embodiment.Controller 170 is made of microcomputer (micro computer), it is from above-mentioned optical distance sensor 162, linear scale (linear scale) 164, contact range sensor 166 receives each measured value, and respectively to the various piece in the unit, particularly to resist liquid supply source 93, nozzle elevating mechanism 75, the stylobate plate floats portion 126, conveyance drive division 100, cushion pad absorption control part 115, cushion pad actuator 109, move into lifter pin lifting unit 85, and take out of with the single movement and the molar behavior (order) of lifter pin lifting unit 91 etc. and control.Wherein, controller 170 also is connected with primary controller or other external device (ED)s that this coating video picture disposal system integral body is totally controlled.
Below, action is handled in the coating in the resist liquid coating element (CT) 40 of this embodiment described.For controller 170, the resist coating handling procedure that for example will be contained in the storage medium such as CD reads in storer and carries out, and the continuously coating of sequencing is handled action control.Handle in the action at this continuously coating, the main order that relates to gap of the present invention management function is represented in the process flow diagram of Figure 14.
If untreated new substrate G is moved into the regional M of moving into of platform 76 from carrying device 54 (Fig. 1) 1In, then lifter pin 86 is accepted this substrate G in round shift position.After carrying device 54 withdrawed from, lifter pin 86 descended, and made substrate G drop to conveyance with height and position, promptly float position H a(Fig. 5).Then, make calibration portion (not shown) action, from the four directions with pressing component (not shown) by on the substrate G that is pressed in float state, substrate G is positioned on platform 76.If the action of calibration portion is finished, then in substrate transferring portion 84, make 109 actions of cushion pad actuator at once, so that adsorption-buffering pad 104 rises from the moving position (binding site) of original position (retreating position) yearning (UP).For adsorption-buffering pad 104, before this for opening vacuum state, if the side edge part of the substrate G of contact float state then engages by vacuum adsorption force at once.When adsorption-buffering pad 104 with after the side edge part of substrate G engages, calibration portion makes pressing component return to assigned position.
Then, for substrate transferring portion 84, under the state of the side edge part of former state maintenance substrate G on the maintaining part 102, make slide block 98 directly advance mobile to conveyance direction (directions X) from the conveyance reference position with certain high speed.Like this, substrate G directly advances mobile with quick condition along conveyance direction (directions X) on platform 76, when the leading section of substrate G arrive resist nozzle 78 under near desired location, when promptly arriving the coating starting position, substrate transferring portion 84 stops substrate transferring (the step S of Figure 14 of phase one 6).
At this moment, as shown in figure 17, resist nozzle 78 is height and position Z up aStandby.Here, this nozzle height position Z aBe with the lower end of the top resist nozzle 78 as reference field of platform 76, be the height and position of ejiction opening, at once mensuration inspection (the step S that implements before 1～S 5) in, determine Z aValue is in permissible range.In addition, the mensuration precision of Ci Shi optical distance sensor 162 is also once being measured inspection (step S 1～S 5) time and be defined in the permissible range.
Once measure inspection (step S for this 1～S 5), undertaken by the method shown in Figure 15 and 16.That is, as shown in figure 15, at first, resist nozzle 78 is dropped to above-mentioned Z from the top retreating position of stipulating aHeight and position.At this moment, controller 170 makes nozzle support body 134 drop to measured value that is shown by linear scale 164 and the absolute reference position Z that is stored in the storer C(step S till the unanimity 1).Then, as shown in figure 16, make optical distance sensor 162 measure distance L to platform 76 b(step S 2).On the other hand, the touch sensor 166 of platform 76 sides is with the following end in contact of its contact pilotage 166a and resist nozzle 78, to measure the distance interval L above the platform 76 and between the resist nozzle 78 a, be nozzle height position Z a(step S 3).
The range determination value L that controller 170 will be obtained by optical distance sensor 162 bWith the benchmark value L that is stored in the storer BCompare (step S 4).Here, benchmark value L BBe with the starting inspection of carrying out at combination resist liquid coating element (CT) 40 o'clock or when safeguarding or when making regular check on and the absolute reference value Z of linear scale 164 cCorresponding or related range determination value by optical distance sensor 162 measurements.That is, for example use shim liner utensils such as (shim), make the height and position of resist nozzle 78 or the distance above platform and stipulated standard value L o(for example 1mm) surveys when contrast, with the measured value of the height and position shown in the linear scale 164 as absolute reference position Z cBe stored in the storer, simultaneously, with the reference value L as a comparison of the range determination value shown in the optical distance sensor 162 BBe stored in the storer.Then, in service in the unit, think that the mensuration precision of linear scale 164 does not change or confusion, as mentioned above, make nozzle support body 134 drop to the measured value and the absolute reference value Z of linear scale 164 c(step S till the unanimity 1).
Therefore, in when operation if optical distance sensor 162 keeps identical mensuration precision, then range determination value L in above-mentioned starting inspection or when making regular check on bWith benchmark value L BIdentical, it is measured precision and degenerates more or reduction, then both relative errors | L B-L b| become big.Therefore, if relative error | L B-L b| (for example in 5%) within the specific limits, then the mensuration precision of 170 pairs of optical distance sensors 162 of controller is judged as " normally " (step S 5).But, work as relative error | L B-L b| in the time of not in above-mentioned permissible range, the mensuration precision of then judging optical distance sensor 162 causes confusion or other are unusual, carries out abnormal cause dissection process (step S described later 5→ S 13).
On the other hand, the range determination value L between nozzle-Tai of obtaining from contact range sensor 166 of 170 pairs of controllers aWith said reference value L o(1mm) compare (step S 4).Then, if both relative errors | L o-L a| in certain permissible range (for example 5% in), then the installation site of resist nozzle 78 is constant substantially when starting is checked or made regular check on, that is, controller 170 judges that it is " normally " (step S 5).But, if relative error | L o-L a| not in above-mentioned permissible range, then controller 170 judges that skew takes place in the installation site of resist nozzle 78 or other are unusual, carries out abnormal cause dissection process (step S described later 5→ S 13).
As mentioned above, (step S when being " normally " by the height and position of once measure to judge checking the mensuration precision of judging optical distance sensor 162 and resist nozzle 78 5), make substrate G stop at coating starting position (Figure 17, step S immediately 6), then, measure inspection (step S in order to carry out secondary 7～S 9), make optical distance sensor 162 measure to substrate G and below till distance L d, L e(Figure 18).At this moment, optical distance sensor 162 towards under substrate G shine one or more of light beams, will try to achieve the mensuration distance L from light receiving position respectively from the top and following reflected light of substrate G d, L eController 170 is based on these measured values L d, L e, calculate according to following formula (1), (2), try to achieve thickness measurement value D and the levitation height measured value H of this substrate G thus b(step S 7).
D＝L e-L d……(1)
H b＝L b-L e……(2)
Then, controller 170 is with thickness measurement value D and the levitation height measured value H of above-mentioned this substrate G that tries to achieve bRespectively with setting value or reference value " D ", " H b" compare (step S 8).Afterwards, if relative error | " D "-D|, | " H b"-H b| all in the regulation permissible range, then controller 170 is judged " normally ", if not in specialized range then judgement " unusually " (step S 9).Here, when being judged as " unusually ", carrying out alarm output and handle (step S 9～S 14).
In addition, at the area of application M 3In (particularly nozzle 78 under), make the levitation height H of substrate G bBe in setting value " H b" about, be very important not only to keeping coating the constant of gap S, and also extremely important to the levelness that keeps substrate G.That is, to levitation height setting value " H b" select only value, dangerous to keep substrate G on platform 76, not scratch, and guarantee the rigidity that the substrate G maintenance level of float state is required (substrate floating rigidity).If actual substrate floating height H bGreater than setting value " H b", then the substrate floating rigidity reduces, and substrate G teetertotters and loses levelness, is easy to generate the coating deviation.On the other hand, if the substrate floating height H bLess than setting value " H b", the problem that the substrate G in the conveyance runs into and adhere to the foreign matters such as refuse on the platform 76 then appears floating easily.Therefore, measure in the inspection, if levitation height measured value H at secondary bNot in permissible range, then can't guarantee to adopt the resist of the non-rotating method of floating the conveyance mode to apply the quality of handling.
When measuring at above-mentioned secondary when being judged as " normally " in checking, as shown in figure 19, make resist nozzle 78 drop to and the height and position Z of the gap S of the desired size of formation (for example 100 μ m) between above the substrate G at the ejiction opening of resist nozzle 78 d(step S 10).Slippage (the Z of this moment a-Z d) can utilize formula (3) to try to achieve.
Z a-Z d＝L a-(S+D+H b)……(3)
On the other hand, controller 170 after nozzle descend to finish, make optical distance sensor 162 measure and above the substrate G between distance L fIn theory, this measures distance L fCertainly with the " L that calculates by following formula (4) f" the value unanimity.
「L f」＝L d-(Z a-Z d)
＝L d-L a+(S+D+H b)……(4)
But, sometimes also can be former thereby cause range determination value L because of certain fWith theoretical value " L f" inconsistent.For example, float portion 126 by the stylobate plate and cause pressurized air and/or vacuum pressure change, make the levitation height H of substrate G because of this influence bChange, at this moment, theoretical value is just unworkable.Therefore, (step S in coating is handled 12), the preferred use as range determination value L actual or present value fIn addition, also can be before beginning be handled in coating, with range determination value L fFeed back to nozzle elevating mechanism 75, make coating gap S consistent with setting value.
Handle (step S in coating 12) in, open resist liquid supply source 93, make it above substrate G, begin to spray resist liquid from resist nozzle 78.At this moment, preferably formerly spray a small amount of resist liquid, begin to spray with normal discharge again and be advisable to clog fully after the gap S between nozzle ejiction opening and the substrate G.On the other hand, begin the substrate transferring of subordinate phase in substrate transferring portion 84.In this subordinate phase, substrate transferring when promptly applying, carry out with the certain speed of relative low speed.Like this, at the area of application M 3In, substrate G goes up in conveyance direction (directions X) with flat-hand position and moves with certain speed, simultaneously, resist nozzle 78 by strip under substrate G be with certain flow and spray resist liquid R bandedly, as shown in figure 21, form the coated film RM of resist liquid towards rear end side from the front of substrate G.
In this coating scanning, optical distance sensor 162 measure and above the substrate G between distance L f, its measured value can be provided to controller 170 constantly.Controller 170 will be from the range determination value L of optical distance sensor 162 fFeed back to nozzle elevating mechanism 75, as shown in figure 22,, also coating gap S can be maintained in the setting value even for example the pressure variation of floating in the portion 126 owing to the stylobate plate teetertotters substrate G.Wherein, in order to make the height and position high speed and the displacement minutely of resist nozzle 78, also piezoelectric device (piezoelectric device) can be set in nozzle elevating mechanism 75.
At the area of application M 3In, handle (step S when finishing coating as mentioned above 12) after, promptly the rearward end of substrate G is by after under the resist nozzle 78, and resist liquid supply source 93 is finished from the operation of resist nozzle 78 ejection resist liquid R.Meanwhile, nozzle elevating mechanism 75 makes resist nozzle 78 and keeps out of the way from substrate G to the vertical direction lifting.On the other hand, substrate transferring portion 84 is switched to the conveyance speed substrate transferring of relatively large phase III.Then, when arriving, substrate G takes out of regional M 5Behind the interior conveyance final position, substrate transferring portion 84 stops the substrate transferring of phase III.Then, cushion pad absorption control part 115 stops the vacuum feed to adsorption-buffering pad 104 immediately, meanwhile, cushion pad actuator 109 makes adsorption-buffering pad 104 drop to original position (retreating position) from coming and going shift position (binding site), from the both side ends of substrate G adsorption-buffering pad 104 is separated.At this moment, cushion pad absorption control part 115 provides malleation (pressurized air) to adsorption-buffering pad 104, and acceleration separates with substrate G's.Replace, lifter pin 92 rises to the round shift position of platform top for substrate G is unloaded from the original position of platform below.
Afterwards, take out of machine, be that carrying arm 74 arrives and takes out of regional M 5, accept substrate G and it be carried to the outside of platform 76 from lifter pin 92.Substrate transferring portion 84 is submitted to substrate G to be back at a high speed immediately behind the lifter pin 92 and moves into regional M 1As mentioned above, when taking out of regional M 5When the substrate G that handles is taken out of, moving into regional M 1Move into the new substrate G that the next one will be accepted to handle, arrange and even begin conveyance.
Here, to abnormal cause dissection process (step S 13) describe.In this embodiment, as mentioned above, adopt a plurality of distances or position transducer 162,164,166 for the gap management of floating the conveyance mode, thus, according to once measure checking (the measurement result (normal/abnormal) of each sensor of acquisition among the step S1～S5), the judgement algorithm (algorithm) by Figure 23 reason that can note abnormalities.In addition, in Figure 23, abbreviate optical distance sensor 162 as " optical sensor ", abbreviate contact range sensor 166 as " feeler ".
That is, when the measurement result of optical distance sensor 162 is " unusually ", and the measurement result of contact range sensor 166 is then judged the reason (for example offset) that belongs to platform 76 when also being " unusually ".For example, when the height above the platform 76 for example descended 10 μ m for a certain reason, the measured value of optical distance sensor 162 and contact range sensor 166 surpassed each reference value 10 μ m respectively, all can obtain the measurement result of " unusually " from both sides.
When the measurement result of optical distance sensor 162 is " unusually ", when the measurement result of contact range sensor 166 is " normally ", then judge it is that the installation site or the optical property of optical distance sensor 162 produces deviation or error.
When the measurement result of optical distance sensor 162 is " normally ", when the measurement result of contact range sensor 166 is " unusually ", can consider to have the reason of two aspects.That is, the installation site of contact range sensor 166 or measuring appliance (gauge) function produces the situation (1) of deviation or error, and the situation (2) of the installation site precision generation deviation of resist nozzle 78.In order to distinguish both of these case (1), (2), as shown in figure 24, for example can carry out measuring for three times and check.Measure for these three times and check it is that calibrated bolck 172 is arranged on for example top height and position of platform 76 of normal place, by the distance L of contact range sensor 166 measurements to this calibrated bolck 172 gIf this range determination value L gNormally, then contact range sensor 166 does not have unusually itself, and judgement is the installation site precision generation deviation of resist nozzle 78,, judges the situation that belongs to (1) that is.But, if range determination value L gExist unusually, then judge it is the mensuration precision generation confusion of contact range sensor 166, promptly belong to the situation of (2).
Like this, for controller 170, by once measuring inspection (step S 1～S 5) carry out abnormal cause dissection process (step 13), and can find out abnormal cause when noting abnormalities.Then, carrying out alarm output processing (step S 14) time, can send abnormal cause data and alarm signal to master controller together.
As mentioned above, in this embodiment, on platform 76, be provided with respectively and move into regional M 1, the area of application M 3, take out of regional M 5, substrate is moved in these zones successively, independent or carry out substrate side by side and move into that action, resist liquid are supplied with and moved, substrate is taken out of action in each zone, thus, for 1 substrate G, can shorten its integrated operation time, it is shorter than moves into action required time (T what move into platform 76 IN), with on platform 76 from moving into regional M 1To taking out of regional M 5Required conveyance time (T c) and from taking out of regional M 5Take out of required time (T OUT) addition finishes one and take turns coating and handle required time (T C+ T IN+ T OUT).
And, therefore utilize the pressure of the gas that is sprayed from the ejiction opening 88 that is arranged on the platform 76 that substrate G is suspended in the air, on one side with the substrate G conveyance that suspends to platform 76, go up to substrate G by strip resist nozzle 78 on one side and supply with resist coating liquid, therefore, can have no difficulty and efficiently corresponding to the maximization of substrate.
Then, because the relation of the height and position between platform 76 and substrate G and the resist nozzle 78 is carried out suitable management, so, greatly improved the repeatability and the reliability of the coating processing of the coating resist coated film of utilizing the non-rotating coating process that floats the conveyance formula on substrate G, to form expectation and homogeneous film thickness.
More than, be illustrated being suitable for embodiments of the present invention, but the present invention is not limited to above-mentioned embodiment, in its technological thought category, can carry out all distortion.
For example, as shown in figure 25, can change the contact range sensor 166 in the above-mentioned embodiment into optical distance sensor 174.The specified altitude position of this optical distance sensor 174 under resist nozzle 78 is installed in a side or the both sides of platform 76, the distance L between optical measurement and resist nozzle 78 lower ends iAt this moment, if optical distance sensor 174 and difference in height above the platform 76 or distance are decided to be H e(known numeric value), the distance L between then above resist nozzle 78 and the platform 76 aCan pass through L i-L eAnd try to achieve.Measure in order to carry out this optical range, optical distance sensor 174 comprises: to the light-projecting portion of vertical direction illumination beam, and with measure the light accepting part that the corresponding position of distance receives the light of collision object (lower end of the resist nozzle 78) reflection that comes from this light beam.
And, the bottom optical sensor 174 of this side, if substrate G enter on the platform 76 and resist nozzle 78 under, then as shown in figure 26, can measure and this substrate G between distance.Therefore, check (step S when measuring by secondary 6～S 9) measure thickness D and the levitation height H of substrate G bThe time, can be the top optical distance sensor 162 of resist nozzle 78 sides measure and above the substrate G between distance L d, the distance L between bottom optical distance sensor 174 mensuration and the substrate G bottom jAt this moment, the levitation height H of substrate G bCan pass through H b=L j-H eTry to achieve.In addition, the thickness D of substrate G can pass through D=L b-(L d+ H b) try to achieve.
In addition, top optical distance sensor 162 and bottom optical distance sensor 174 are arranged on the left and right sides.In this structure,, can judge that the abnormal conditions of inclination appear in substrate G when the measured value of the left and right sides exists respectively when more different.Afterwards, can export, interrupt or stop coating handling action by alarm.
In the above-described embodiment, the maintaining part 102 of substrate transferring portion 84 has the cushion pad 104 of vacuum adsorption type, at that time, also can use mechanically (for example clamping) to keep the cushion pad of the side of substrate G.In addition, for for cushion pad 104 loading and unloading being installed in freely mechanism's (cushion pad support portion 106, cushion pad lifting unit 108, cushion pad actuator 109) of the side of substrate G, also can adopt all modes and formation.In addition, in the above-described embodiment, the left and right sides portion of the 84 supporting substrate G of substrate transferring portion carries out conveyance, and still, also only the one-sided avris portion of supporting substrate G carries out the conveyance of substrate.
Above-mentioned embodiment relates to is the resist applying device of making in the coating video picture disposal system of LCD, still, and the present invention also goes for supplying with any treating apparatus for the treatment of fluid or uses on processed substrate in.Therefore, as the treating fluid among the present invention, except that resist liquid, can also be the coating liquid of interlayer dielectic, dielectric substance, line material etc. for example, also can be imaging liquid or washing fluid.Processed substrate among the present invention is not limited to the LCD substrate, also can be substrate, semiconductor wafer, CD substrate, glass substrate, photomask and printed base plate etc. that other flat-panel monitor is used.

Claims (25)

1. an applying device is characterized in that, comprising:
Having by gaseous tension makes first of processed substrate suspension float the platform in zone;
With the described substrate of float state towards the conveyance direction conveyance of regulation and make it pass through the substrate transferring portion of described first area;
Have and liftably be arranged on described first and float the nozzle of top in zone, in order to float coating treating fluid on the described substrate in zone and to spray the treating fluid supply unit of described treating fluid from described nozzle by described first;
Be used to make the nozzle lifting unit of described nozzle lifting moving; And
To the described substrate that is about to float the coated described treating fluid in zone, measure the thickness of described substrate and first determination part of the levitation height of described substrate with respect to described described first.
2. applying device as claimed in claim 1 is characterized in that:
When the measured value of the measured value of the described substrate thickness of determining to obtain and described levitation height from described first determination part respectively within the limits prescribed after, described substrate is applied processing.
3. applying device as claimed in claim 1 or 2 is characterized in that:
Described nozzle lifting unit comprise support described nozzle and with the nozzle support body of its one lifting moving,
Described first determination part to comprise in order measuring with described or distance above the described substrate and to be installed at interval first optical distance sensor on the described nozzle support body.
4. applying device as claimed in claim 3 is characterized in that:
After the measured value of the thickness measurement value of confirming described substrate and described levitation height is distinguished within the limits prescribed, handle the gap of usefulness and described nozzle is descended in order to form coating at the ejiction opening of described nozzle and between above the described substrate by described nozzle lifting unit, by described first optical distance sensor measure with above the described substrate between distance at interval, with definite described gap.
5. applying device as claimed in claim 4 is characterized in that:
In coating is handled, on one side by described first optical distance sensor measure with distance above the described substrate at interval, change the height and position of adjusting described nozzle by described nozzle lifting unit on one side, be of a size of setting value to keep described gap.
6. applying device as claimed in claim 1 or 2 is characterized in that:
Have in order to check the mensuration precision of described first optical distance sensor, measure second determination part of the height and position of described nozzle support body.
7, applying device as claimed in claim 6 is characterized in that:
Described second determination part has the linear scale that is installed on the described nozzle elevating mechanism.
8. applying device as claimed in claim 6 is characterized in that:
Before the mensuration precision of described first optical distance sensor is checked, when using the mensuration utensil described nozzle to be positioned at the altitude datum position of regulation in advance by actual measurement, record is by described first optical distance sensor first measured value that obtains and second measured value that obtains by described second determination part, when in described inspection, not using described mensuration utensil when described second determination part obtains described second measured value, judge whether the measured value that obtains from described first optical distance sensor is consistent or approximate in the permissible range of described first measured value regulation.
9. applying device as claimed in claim 6 is characterized in that:
To the inspection of the mensuration precision of described first optical distance sensor, the mensuration of described substrate being carried out prior to described first determination part is handled and is carried out.
10, applying device as claimed in claim 1 or 2 is characterized in that:
Have in order to check the installation site precision of described nozzle, be independent of described nozzle lifting unit, measure distance the 3rd determination part at interval between described and the described nozzle.
11. applying device as claimed in claim 10 is characterized in that:
Described the 3rd determination part has and is arranged on described side, contacts with contact pilotage in the lower end of described nozzle and measure the contact range sensor of distance.
12. applying device as claimed in claim 10 is characterized in that:
Described the 3rd determination part has and is arranged on described side, contacts with light beam in the lower end of described nozzle and measure second optical sensor of distance.
13., it is characterized in that as claim 10 or 11 described applying devices:
To the inspection of the installation site precision of described nozzle, the mensuration inspection of described substrate being carried out prior to described first determination part and carrying out.
14. applying device as claimed in claim 1 or 2 is characterized in that:
Described first determination part has the 3rd optical distance sensor that is installed on the described nozzle support body for the thickness of measuring described substrate.
15. applying device as claimed in claim 1 or 2 is characterized in that:
Described first determination part has the 4th optical distance sensor that is arranged on described side for the thickness of measuring described substrate.
16. applying device as claimed in claim 1 or 2 is characterized in that:
Described first determination part for measure described substrate with respect to described levitation height and have the 5th optical distance sensor that is arranged on described side.
17. applying device as claimed in claim 1 or 2 is characterized in that, comprising:
Be arranged on described first ejiction opening of a plurality of ejection gases that floats in the zone;
Described first float the attraction mouth that mixes a plurality of suction gases of setting in the zone with described ejiction opening; And
Control at the pressure vertically upward that applies from described ejiction opening by the described first described substrate that floats the zone with by the described floating control part of raising that attracts the balance between mouthful pressure vertically downward that applies.
18. applying device as claimed in claim 1 or 2 is characterized in that:
Described described first upstream side that floats the zone on described conveyance direction has makes second of described substrate suspension float the zone.
19. applying device as claimed in claim 18 is characterized in that:
Float described second and to be provided with the portion that moves into that is used for the described substrate of conveyance in the zone.
20., it is characterized in that as claim 18 or 19 described applying devices:
Described substrate transferring portion floats the zone from described second and floats the described substrate of regional conveyance to described first, the coating starting position of the leading section on being set in described substrate arrive described nozzle under the time described substrate is temporarily stopped,
Described first determination part is to thickness and described the levitation height with respect to described substrate of the described substrate of described basal lamina determination that temporarily stops.
21. applying device as claimed in claim 1 or 2 is characterized in that:
Described described first downstream side that floats the zone on described conveyance direction has makes the 3rd of described substrate suspension float the zone.
22. applying device as claimed in claim 21 is characterized in that:
Float the described the 3rd and to be provided with the portion that takes out of that is used to take out of described substrate in the zone.
23. applying device as claimed in claim 1 or 2 is characterized in that:
Described substrate transferring portion comprises:
Be arranged on the guide rail of the one or both sides of platform in the mode that is parallel to described substrate moving direction extension;
The slider that can move along described guide rail;
Drive the conveyance drive division that described slider moves along described guide rail; And
Extend from the central part of described slider, releasably keep the maintaining part of the side portion of described substrate to described.
24. a coating method is characterized in that:
In platform upper edge conveyance direction, in the following sequence a row ground be provided be used for processed substrate move on the described platform move into the zone, be used for from the strip nozzle of top to the substrate that moves in described conveyance direction supply with treating fluid with the area of application of forming coated film and be used for the described substrate after the coating processing from described take out of take out of the zone, wherein
Pressure by the gas that sprays above described suspends described substrate, and at described the area of application described substrate is applied and roughly float power uniformly,
In that described substrate is moved into regional conveyance to described conveyance way of taking out of the zone from described,, measure the thickness and the levitation height of described substrate of described substrate with respect to described at the described substrate that is about at the coated described treating fluid of described the area of application.
25. coating method as claimed in claim 24 is characterized in that:
After the measured value of the measured value of confirming described substrate thickness and described levitation height is distinguished within the limits prescribed, described substrate is applied processing.
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CN1949079B (en) 2010-11-03
JP4673180B2 (en) 2011-04-20

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