JP6738373B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate, and particularly to a technique for suitably applying a processing liquid to a substrate that is transported with a levitation force applied thereto. The substrate to be processed is, for example, a semiconductor substrate, an FPD (Flat Panel Display) substrate such as a liquid crystal display device and an organic EL (Electroluminescence) display device, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, A photomask substrate, a ceramic substrate, and a solar cell substrate are included.

In the manufacturing process of electronic components such as semiconductor devices and liquid crystal display devices, a coating device for coating a coating liquid on the surface of a substrate is used. As such a coating device, air is blown onto the back surface of the substrate so that the substrate is floated while the substrate is conveyed, and the substrate extends in the width direction of the substrate (corresponding to the main surface of the substrate). There is known an apparatus that discharges a coating liquid from a nozzle to coat the substrate with the coating liquid (for example, Patent Document 1).

In the substrate processing apparatus described in Patent Document 1, while the substrate is levitated in a horizontal posture on the levitating stage, the peripheral portion of the substrate is held and the substrate is transported in the horizontal direction, thereby transporting the substrate, and The coating liquid is discharged from a slit nozzle arranged above.

The substrate processing apparatus of Patent Document 1 includes an optical distance sensor that measures the flying height of the substrate above the substrate. By adjusting the height of the slit nozzle according to the flying height of the substrate, it is possible to supply the coating liquid from an appropriate height.

JP, 2012-142583, A

In the above-mentioned conventional technique, the horizontal position of the region where the optical distance sensor measures the vertical position is upstream of the horizontal position where the processing liquid from the nozzle adheres to the substrate in the transport direction. That is, in the prior art, the horizontal position where the processing liquid adheres to the substrate is far away from the horizontal position of the area measured by the optical distance sensor. Therefore, for example, even if there is an abnormality in the height of the substrate at the horizontal position where the treatment liquid adheres, it is difficult for the optical distance sensor to detect the abnormality, and therefore coating failure may occur. It was

Therefore, it is an object of the present invention to provide a technique for satisfactorily applying a treatment liquid to a substrate that is transported with a levitation force.

In order to solve the above problems, a first aspect is a substrate processing apparatus for processing a substrate having a first main surface and a second main surface, wherein the first main surface applies a levitation force to a substrate facing vertically upward. A levitation mechanism for imparting the levitation force, a transport mechanism for moving the levitation substrate, which is the substrate to which the levitation force is imparted, in a first direction which is a horizontal direction, and a second direction which is a horizontal direction orthogonal to the first direction. A nozzle having a discharge port that extends and capable of discharging a processing liquid from the discharge port toward the first main surface of the floating substrate; a measuring device that measures the vertical position of the first main surface of the floating substrate; The adhesion horizontal position, which is the horizontal position where the processing liquid from the nozzle adheres to the floating substrate, approaches the measurement horizontal position, which is the horizontal position of the region in which the measuring device previously measures the vertical position of the floating substrate. A moving mechanism for moving the nozzle and the measuring device , wherein the moving mechanism positions the measuring device at the measurement horizontal position, and a downstream position downstream of the measurement horizontal position in the first direction. The nozzle is positioned at, the transport mechanism moves the floating substrate to a predetermined position and then stops, and the measuring device moves the floating substrate while the measuring device and the floating substrate are both stopped. After measuring the vertical position, the moving mechanism measures the vertical position of the floating substrate while the measuring device and the floating substrate are both stopped, and then the floating substrate moves to the predetermined position. in a state that stops, along with moving the instrument in a different position, the nozzle Before moving the nozzle closer to the measuring horizontal position from said downstream position.
A second aspect is the substrate processing apparatus of the first aspect, wherein the moving mechanism includes the measuring device that measures the vertical position of the floating substrate at the measurement horizontal position that is stopped at the predetermined position. The measuring device measures the vertical position of the floating substrate while moving to a position on the upstream side in one direction and moving toward the position on the upstream side in the first direction.
A third aspect is a substrate processing apparatus for processing a substrate having a first main surface and a second main surface, wherein the first main surface applies a levitation force to a substrate whose vertical direction faces upward, and A transport mechanism for moving a floating substrate, which is the substrate to which a floating force is applied, in a first horizontal direction; and a discharge port extending in a second horizontal direction orthogonal to the first direction, A nozzle capable of ejecting the processing liquid from the ejection port toward the first main surface of the floating substrate, a measuring device for measuring the vertical position of the first main surface of the floating substrate, and the processing liquid from the nozzle The nozzle and the measuring device are arranged so that the horizontal attachment position, which is the horizontal position attached to the floating substrate, approaches the measurement horizontal position, which is the horizontal position of the region in which the measuring device previously measures the vertical position of the floating substrate. And a control unit, wherein the transport mechanism moves the floating substrate to a predetermined position and then stops the moving substrate, and the moving mechanism stops the floating substrate at the predetermined position. In this state, while moving the measuring device that has measured the vertical position of the floating substrate at the measurement horizontal position to another position, the nozzle is brought closer to the measurement horizontal position, and the moving mechanism stops at the predetermined position. Moving the measuring device that has measured the vertical position of the floating substrate in the measurement horizontal position from the measurement horizontal position to a position on the upstream side in the first direction, the measurement device from the measurement horizontal position While moving toward the upstream side position in the first direction, the vertical position of the floating substrate is measured, and the control unit causes the measuring device to move from the horizontal measurement position to the upstream side position in the first direction. Of all the vertical positions of the floating substrate measured while moving toward, and whether the measuring device is located upstream of the measurement horizontal position in the first direction. Of whether or not the difference value between the different points regarding the vertical position of the floating board measured at different points in the first direction while moving toward the position is within a specified reference range, At least one of them is judged.

A fourth aspect is the substrate processing apparatus according to any one of the first to third aspects , wherein the moving mechanism is configured so that the nozzle and the nozzle are arranged so that the attached horizontal position matches the measured horizontal position. Move the measuring device.

The fifth aspect is the first aspect be any one of the substrate processing apparatus of the fourth embodiment, the floating mechanism includes a stage having a horizontal surface, is provided in the horizontal plane, towards the upper side of the vertical air And a plurality of suction ports that are provided on the horizontal plane and that suction the air on the upper side in the vertical direction.

A sixth aspect is the substrate processing apparatus according to any one of the first to fifth aspects, wherein the moving mechanism positions the nozzle at a coating position which is a predetermined horizontal position, and the nozzle is the It can be moved to a position horizontally separated from the coating position.

A seventh aspect is the substrate processing apparatus according to any one of the first to sixth aspects, wherein the moving mechanism positions the measuring instrument at a measurement position which is a predetermined horizontal position, and the measuring instrument. Can be moved to a position horizontally separated from the measurement position.

An eighth aspect is the substrate processing apparatus according to any one of the first to seventh aspects, further comprising a connector that connects the nozzle and the measuring instrument, and the moving mechanism is connected by the connector. The nozzle and the measuring device thus moved are moved together.

A ninth aspect is the substrate processing apparatus of the eighth aspect, wherein the connecting tool connects the measuring device to an upstream side in the first direction with respect to the nozzle, and the moving mechanism includes the nozzle and the nozzle. The measuring device is moved in the first direction.

A tenth aspect is the substrate processing apparatus according to any one of the first to ninth aspects, wherein the measuring device includes a reflective sensor that detects light reflected by the first main surface of the floating substrate. ..

An eleventh aspect is the substrate processing apparatus according to any one of the first to tenth aspects, wherein the moving mechanism vertically adjusts the vertical position of the nozzle according to the vertical position of the floating substrate measured by the measuring device. Change the position.

A twelfth aspect is the substrate processing apparatus according to any one of the first to eleventh aspects, in which a plurality of the measuring devices are provided at intervals in the second direction, and the plurality of measuring devices are It is possible to measure vertical positions at a plurality of different points on the floating substrate in the second direction.

A thirteenth aspect is the substrate processing apparatus of the twelfth aspect, further comprising a difference acquisition unit that acquires a difference from the vertical positions of the plurality of locations measured by the plurality of measuring instruments.

A fourteenth aspect is a substrate processing method for processing a substrate having a first main surface and a second main surface, comprising: (a) applying a levitation force to a substrate whose first main surface is vertically upward. , (B) a step of moving a floating substrate, which is the substrate to which the floating force is applied in the step (a), in a first direction which is a horizontal direction, and (c) a measuring device is a first main part of the floating substrate. A step of measuring the vertical position of the surface, and (d) after the step (c), the nozzle applies the processing liquid to the first main surface of the floating substrate which is moved in the first direction by the step (b). And (e) after the step (c) and before the step (d), an attachment horizontal position, which is a horizontal position at which the processing liquid is attached to the floating substrate, is the step (a). as the measuring instrument approaches the measurement horizontal position is a horizontal position of the region measured in advance the vertical position of the floating substrate at c), seen including and a step of moving the nozzle and the measuring device, wherein In the step (b), the measuring device is positioned at the measurement horizontal position, the nozzle is positioned at a downstream position downstream of the measurement horizontal position in the first direction, and the floating substrate is moved to a predetermined position. And then stopping. The step (c) includes the step of measuring the vertical position of the floating substrate by the measuring device while the measuring device and the floating substrate are both stopped. In the step (e), in the state where the floating substrate is stopped at the predetermined position, the step of moving the measuring device, which has measured the vertical position in the measurement horizontal position, to another position; Moving the nozzle so that the nozzle approaches the measurement horizontal position from the downstream position while stopped at the specified position .

A fifteenth aspect is a substrate processing method for processing a substrate having a first main surface and a second main surface, comprising: (a) applying a levitation force to a substrate whose first main surface is vertically upward. , (B) a step of moving a floating substrate, which is the substrate to which the floating force is applied in the step (a), in a first direction which is a horizontal direction, and (c) a measuring device is a first main part of the floating substrate. A step of measuring the vertical position of the surface, and (d) after the step (c), the nozzle applies the processing liquid to the first main surface of the floating substrate which is moved in the first direction by the step (b). And (e) after the step (c) and before the step (d), an attachment horizontal position, which is a horizontal position at which the processing liquid is attached to the floating substrate, is the step (a). a step of moving the nozzle and the measuring instrument so that the measuring instrument approaches a measurement horizontal position which is a horizontal position of a region in which the vertical position of the floating substrate is previously measured in c); And the step (b) includes a step of moving the floating substrate to a predetermined position and then stopping the floating substrate, and the step (c) includes a state in which the floating substrate is stopped at the specified position. And the measuring device measures a vertical position of the floating substrate at the measurement horizontal position, wherein the step (e) includes the step of measuring the horizontal position of the floating substrate at the predetermined position. Moving the measuring device measuring the vertical position in the position from the measuring horizontal position to a position on the upstream side in the first direction, and stopping the nozzle at the specified position of the floating substrate. And a step of measuring the vertical position of the levitation substrate while the measurement device moves toward the position on the upstream side in the first direction from the measurement horizontal position. In the step (f), all the vertical positions of the floating substrate measured during the movement of the measuring device from the measurement horizontal position toward the upstream side position in the first direction are within a specified reference range. The step of determining whether there is, and the verticality of the floating substrate measured at different points in the first direction while the measuring device moves from the measurement horizontal position toward the upstream side position in the first direction. Determining at least one of a difference value between the different points of position within a prescribed reference range .

Also I by the any of the substrate processing apparatus of the first aspect and the third aspect, the horizontal position of the area where the measuring instrument measures the vertical position of the floating substrate (measured horizontal position), the processing liquid from the nozzles in the floating substrate Close the horizontal position of adhesion (horizontal position of adhesion). Therefore, the processing liquid can be supplied to the floating substrate in a region where the measuring device measures the vertical direction of the floating substrate or in a region close to this. Therefore, the processing liquid can be favorably applied to the floating substrate.

According to the substrate processing apparatus of the fourth aspect, the processing liquid is supplied to the floating substrate in a region where the measuring device measures the vertical direction of the floating substrate. Therefore, the processing liquid can be favorably applied to the floating substrate.

According to the substrate processing apparatus of the fifth aspect, the floating substrate is stably placed at a predetermined vertical position by applying a floating force to the substrate by air from a plurality of ejection ports and balancing the air by suction from the suction port. Can hold

According to the substrate processing apparatus of the sixth aspect, it is possible to position the nozzle at the coating position and supply the processing liquid to the floating substrate. Further, the nozzle can be moved to a position horizontally separated from the coating position.

According to the substrate processing apparatus of the seventh aspect, it is possible to position the measuring device at the measurement position and measure the vertical position of the floating substrate. Further, the measuring device can be moved to a position horizontally separated from the measurement position.

According to the substrate processing apparatus of the eighth aspect, since the nozzle and the measuring device are connected, the moving mechanism can move them integrally. Therefore, the moving mechanism can be configured simply as compared with the case where the nozzle and the measuring device are individually moved.

According to the substrate processing apparatus of the ninth aspect, after the measuring device measures the vertical position of the floating substrate at the measurement position, the moving mechanism moves the nozzle and the measuring device to the downstream side in the first direction, so that the planned adhesion position is changed. It can be brought close to the measurement position.

According to the substrate processing apparatus of the tenth aspect, the vertical position of the first main surface can be measured by detecting the light reflected by the first main surface of the floating substrate with the light receiving sensor.

Also it by the any of the substrate processing apparatus of the first aspect and the third aspect, in the state in which the floating board is stopped, to measure the vertical position of the measuring horizontal position of the flying substrate instrument is moved to another location , The nozzle is brought closer to its measuring horizontal position. Therefore, the nozzle can be arranged close to the position where the vertical position is measured in advance. Thereby, the processing liquid can be appropriately applied to the floating substrate.

Also I by the any of the substrate processing apparatus of the second aspect and third aspect, the horizontal range of the measurement horizontal position to a position upstream of the measuring horizontal position, it is possible to measure the vertical position of the floating substrate.

According to the substrate processing apparatus of the eleventh aspect, the vertical position of the nozzle is adjusted according to the vertical position of the floating substrate measured by the measuring device. As a result, the processing liquid can be supplied to the floating substrate from the nozzle at an appropriate vertical position, so that the processing liquid can be favorably applied to the floating substrate.

According to the substrate processing apparatus of the twelfth aspect, it is possible to measure vertical positions at a plurality of different positions in the second direction on the floating substrate.

According to the substrate processing apparatus of the thirteenth aspect, it is possible to easily detect a location where the vertical position of the floating substrate is abnormal by obtaining the difference value of the vertical locations measured at a plurality of locations.

Also I by the any of the substrate processing method of the 14th aspect and the 15th aspect, in the horizontal position of the area where the measuring instrument measures the vertical position of the floating substrate (measured horizontal position), the processing liquid from the nozzles in the floating substrate Close the horizontal position of adhesion (horizontal position of adhesion). Therefore, the processing liquid can be supplied to the floating substrate in a region where the measuring device measures the vertical direction of the floating substrate or in a region close to this. Therefore, the processing liquid can be favorably applied to the floating substrate.

Also it by the any of the substrate processing method of the 14th aspect and the 15th aspect, in the state in which the floating board is stopped, to measure the vertical position of the measuring horizontal position of the flying substrate instrument is moved to another location , The nozzle is brought closer to its measuring horizontal position. Therefore, the nozzle can be arranged close to the position where the vertical position is measured in advance. Thereby, the processing liquid can be appropriately applied to the floating substrate.

It is a side view which shows typically the whole structure of the coating device 1 which is an example of the substrate processing apparatus of embodiment. It is the schematic plan view which looked at coating device 1 of an embodiment from the perpendicular direction upper side. It is a schematic plan view which shows the coating device 1 except the coating mechanism 6 of embodiment. It is a schematic sectional drawing of the coating device 1 in the position which follows the AA line shown in FIG. It is a schematic plan view which shows some floating stage parts 3 of embodiment. It is a schematic plan view which shows the nozzle 61 of embodiment. It is a schematic block diagram which shows the control unit 9 of embodiment. It is a figure which shows each process of the substrate processing operation which the coating device 1 of embodiment carries out. It is a figure which shows the modification of operation|movement of the coating device 1 of embodiment. It is a figure which shows the modification of operation|movement of the coating device 1 of embodiment.

Embodiments of the present invention will be described below with reference to the accompanying drawings. The constituent elements described in this embodiment are merely examples, and the scope of the present invention is not limited thereto. In the drawings, for ease of understanding, the dimensions and number of each part may be exaggerated or simplified as necessary.

Expressions indicating relative or absolute positional relationship (eg, “parallel”, “orthogonal”, “center”, “concentric”, “coaxial”, etc.) not only represent the positional relationship strictly, but also include tolerances or It also represents a state of being displaced relative to an angle or a distance within a range where a similar function can be obtained. Unless otherwise specified, expressions that indicate equal states (for example, “identical”, “equal”, “homogeneous”, “match”, etc.) not only represent quantitatively exactly equal states, but also have tolerances or similar functions. It also represents the state in which there is a difference that gives Unless otherwise specified, expressions indicating a shape (for example, “square shape” or “cylindrical shape”) not only represent the shape in a geometrically strict manner, but also within a range in which a similar effect can be obtained, for example. A shape having irregularities, chamfers, etc. is also represented. The term “above” includes not only the case where two elements are in contact with each other but also the case where two elements are apart from each other, unless otherwise specified.

FIG. 1 is a side view schematically showing the overall configuration of a coating apparatus 1 which is an example of the substrate processing apparatus of the embodiment. FIG. 2 is a schematic plan view of the coating apparatus 1 of the embodiment as seen from the upper side in the vertical direction. FIG. 3 is a schematic plan view showing the coating apparatus 1 excluding the coating mechanism 6 of the embodiment. FIG. 4 is a schematic cross-sectional view of the coating apparatus 1 at a position along the line AA shown in FIG. FIG. 5 is a schematic plan view showing a part of the levitation stage unit 3 of the embodiment. FIG. 6 is a schematic plan view showing the nozzle 61 of the embodiment.

The coating apparatus 1 conveys the quadrangular substrate W in a horizontal posture (the posture in which the upper surface Wf (first main surface) and the lower surface (second main surface) of the substrate W are parallel to the horizontal plane (XY plane)). At the same time, it is a slit coater for applying the treatment liquid (coating liquid) to the upper surface Wf of the substrate W. In each drawing, in order to clarify the positional relationship of each part of the coating apparatus 1, the direction parallel to the first direction D1 in which the substrate W is transported is defined as “X direction”, and the direction from the input conveyor 100 to the output conveyor 110 is defined. The “+X direction” and the opposite direction are the “−X direction”. The horizontal direction orthogonal to the X direction is defined as "Y direction", the direction toward the front in Fig. 1 is defined as "-Y direction", and the opposite direction is defined as "+Y direction". A vertical direction orthogonal to the X direction and the Y direction is defined as a Z direction, an upward direction toward the coating mechanism 6 side as viewed from the floating stage portion 3 is defined as a "+Z direction", and an opposite direction thereof is defined as a "-Z direction".

The basic configuration and operating principle of the coating device 1 are partially common or similar to those described in JP 2010-227850 A and JP 2010-240550 A. Therefore, in the present specification, among the respective configurations of the coating apparatus 1, configurations that can be easily inferred from the same as those described in these known documents or based on common general technical knowledge may be appropriately omitted.

The coating apparatus 1 sequentially installs the input conveyor 100, the input transfer unit 2, the levitation stage unit 3, the output transfer unit 4, and the output conveyor 110 along the first direction D1 (+X direction) in which the substrate W is transported. Prepare These are arranged so as to be close to each other, and a transport path for the substrate W is formed by these. In the following description, when the positional relationship is shown in association with the first direction D1 that is the substrate transport direction, “upstream side in the first direction” is simply referred to as “upstream side” and “downstream side in the first direction D1. May be abbreviated as “downstream side”. In this example, the −X side is the “upstream side” and the +X side is the “downstream side” when viewed from a certain reference position.

The input conveyor 100 includes a roller conveyor 101 and a rotation driving mechanism 102 that rotationally drives the roller conveyor 101. By the rotation of the roller conveyor 101, the substrate W is transported in the horizontal posture to the downstream side (+X side).

The input transfer unit 2 includes a roller conveyor 21 and a rotation drive mechanism 22 that rotates the roller conveyor 21. As the roller conveyor 21 rotates, the substrate W is transported in the +X direction. The vertical position of the substrate W is changed as the roller conveyor 21 moves up and down. The substrate W is transferred from the input conveyor 100 to the floating stage section 3 by the operation of the input transfer section 2.

The levitation stage unit 3 includes three flat plate-shaped stages along the first direction D1. Specifically, the levitation stage unit 3 includes an entrance levitation stage 31, a coating stage 32, and an exit levitation stage 33 in order along the first direction D1. The upper surface of each of these stages is coplanar.

A plurality of ejection ports 31h and 33h for ejecting air (compressed air) supplied from the levitation control mechanism 35 are provided in a matrix on the upper surfaces of the inlet levitation stage 31 and the outlet levitation stage 33, respectively. The levitation force is buoyant on the substrate W by the compressed air ejected from the plurality of ejection ports 31h and 33h, and the substrate W is placed in a horizontal posture while being separated from the lower surface (second main surface) of the substrate W and the upper surfaces of the stages 31 and 33. Supported. The distance between the lower surface of the substrate W and the upper surfaces of the stages 31 and 33 may be, for example, 10-500 μm (micrometer).

On the upper surface of the coating stage 32, a plurality of jet ports 321h for jetting air (compressed air) and a plurality of suction ports 322h for sucking the atmosphere above the coating stage 32 are provided. On the upper surface of the coating stage 32, the ejection ports 321h and the suction ports 322h are provided alternately along the X direction and the Y direction. The levitation control mechanism 35 controls the ejection amount of compressed air from each ejection port 321h and the suction amount of the atmosphere from each suction port 322h so as to balance the lower surface of the substrate W and the upper surface of the coating stage 32. The distance is precisely controlled. Thereby, the vertical position of the upper surface Wf of the substrate W passing above the coating stage 32 is controlled to a predetermined value. As the configuration of the levitation stage unit 3, the configuration described in JP 2010-227850 A may be applied.

The substrate W carried into the levitation stage section 3 via the input transfer section 2 obtains a propulsive force in the +X direction by the rotation of the roller conveyor 21, and is carried onto the entrance levitation stage 31. The transfer mechanism 5 transfers the substrate W on the levitation stage unit 3.

The transport mechanism 5 includes a chuck 51 and a suction/travel control mechanism 52. The chuck 51 supports the substrate W from below by partially contacting the peripheral edge of the lower surface of the substrate W. The suction/travel control mechanism 52 has a function of applying a negative pressure to a suction pad provided at a support portion on the upper end of the chuck 51 to cause the chuck 51 to suck and hold the substrate W. Further, the suction/travel control mechanism 52 has a function of linearly reciprocating the chuck 51 along the X direction.

When the chuck 51 holds the substrate W, the lower surface of the substrate W is located on the +Z side of the upper surfaces of the stages 31, 32, and 33 of the levitation stage unit 3. The substrate W is suction-held on the peripheral portion by the chuck 51, and maintains a horizontal posture as a whole by the levitation force applied from the levitation stage unit 3.

The chuck 51 holds the substrate W carried in from the input transfer unit 2 to the floating stage unit 3, and the chuck 51 moves in the +X direction in this state, so that the substrate W moves from above the entrance floating stage 31 to the coating stage. It is conveyed to above the exit floating stage 33 via above 32. The substrate W is transferred to the output transfer section 4 arranged on the +X side of the exit levitation stage 33.

The output transfer unit 4 includes a roller conveyor 41 and a rotation drive mechanism 42 that rotationally drives the roller conveyor 41. By rotating the roller conveyor 41, a propulsive force in the +X direction is applied to the substrate W, and the substrate W is transported in the first direction D1. By the operation of the output transfer unit 4, the substrate W is transferred onto the output conveyor 110 from above the exit floating stage 33.

The output conveyor 110 includes a rotation drive mechanism 112 that rotates the roller conveyor 111. The substrate W is conveyed in the +X direction by the rotation of the roller conveyor 111 and is discharged to the outside of the coating apparatus 1. The input conveyor 100 and the output conveyor 110 may be provided as a part of the coating apparatus 1, but may be separate from the coating apparatus 1. For example, the input conveyor 100 may be a substrate payout mechanism that is a separate unit provided on the upstream side of the coating apparatus 1. Further, the output conveyor 110 may be a substrate receiving mechanism that is a separate unit provided on the downstream side of the coating apparatus 1.

A coating mechanism 6 that coats the processing liquid onto the upper surface Wf of the substrate W is provided on the transport path of the substrate W. The coating mechanism 6 includes a nozzle unit 60 including a nozzle 61 that discharges the processing liquid, a moving mechanism 63 that positions the nozzle 61, and a maintenance unit 65 that maintains the nozzle 61.

The nozzle 61 is a member extending in a second direction D2 (Y direction) which is a horizontal direction orthogonal to the first direction D1. The lower end of the nozzle 61 has a discharge port 611 that extends in the width direction and opens downward. The processing liquid is discharged from the discharge port 611.

The moving mechanism 63 moves and positions the nozzle 61 in the X and Z directions. By the operation of the moving mechanism 63, the nozzle 61 is positioned at the coating position L11 and the downstream position L12 above the coating stage 32. The processing liquid is applied to the substrate W by ejecting the processing liquid toward the upper surface Wf of the substrate W with the nozzle 61 positioned at the coating position L<b>11. Thus, the application position L11 is the position of the nozzle 61 when executing the application. The downstream position L12 is a position distant from the coating position L11 to the downstream side (+X side).

The maintenance unit 65 includes a butt 651, a preliminary ejection roller 652, a nozzle cleaner 653, and a maintenance control mechanism 654. The vat 651 stores the cleaning liquid used for cleaning the nozzle 61. The maintenance control mechanism 654 controls the preliminary ejection roller 652 and the nozzle cleaner 653. As the configuration of the maintenance unit 65, for example, the configuration described in JP 2010-240550 A may be applied.

The moving mechanism 63 positions the nozzle 61 at the preliminary ejection position L13 where the ejection port 611 faces the surface above the preliminary ejection roller 652. The nozzle 61h ejects the treatment liquid from the ejection port 611 to the surface of the preliminary ejection roller 652 at the preliminary ejection position L13 (preliminary ejection processing). The nozzle 61 is positioned at the preliminary ejection position L13 before performing the preliminary ejection process before being positioned at the coating position L11. This makes it possible to stabilize the discharge of the processing liquid onto the substrate W from the initial stage. When the maintenance control mechanism 654 rotates the preliminary ejection roller 652, the processing liquid ejected from the nozzle 61 is mixed with the cleaning liquid stored in the vat 651 and collected.

The moving mechanism 63 positions the nozzle 61 at the cleaning position L14 in which the tip portion (including the discharge port 611 and the region in the vicinity thereof) faces above the nozzle cleaner 653. When the nozzle 61 is in the cleaning position L14, the nozzle cleaner 653 moves in the width direction (Y direction) of the nozzle 61 while discharging the cleaning liquid, so that the processing liquid and the like attached to the tip of the nozzle 61 are washed away.

The moving mechanism 63 may position the nozzle 61 at a standby position below the cleaning position L14 and the lower end portion of the nozzle 61 is accommodated in the bat 651. The nozzle 61 may be positioned at the standby position when the coating process using the nozzle 61 is not executed in the coating apparatus 1. Although not shown, a standby pod may be provided to prevent the processing liquid from drying at the discharge port 611 of the nozzle 61 positioned at the standby position.

In FIG. 1, the nozzle 61 at the preliminary ejection position L13 is shown by a solid line, and the nozzles 61 at the coating position L11, the downstream position L12, and the cleaning position L14 are shown by broken lines.

Although the coating mechanism 6 of this embodiment includes only one nozzle 61, it may include a plurality of nozzles 61. The plurality of nozzles 61 may be provided at intervals along the first direction D1. In this case, different processing liquids may be applied to the substrate W by supplying different processing liquids to the plurality of nozzles 61. Further, a moving mechanism 63 and a maintenance unit 65 corresponding to each nozzle 61 may be provided respectively. The maintenance unit 65 may be shared by two or more nozzles 61.

As shown in FIG. 4, the nozzle unit 60 includes a beam member 631 that extends in the Y direction above the floating stage unit 3 and two pillar members 632 and 633 that support both end portions of the beam member 631. Have a structure. The pillar members 632 and 633 are provided upright from the base 10. An elevating mechanism 634 is attached to the pillar member 632, and an elevating mechanism 635 is attached to the pillar member 633. The lifting mechanisms 634 and 635 include, for example, a ball screw mechanism. The +Y side end of the beam member 631 is attached to the elevating mechanism 634, and the −Y side end of the beam member 631 is attached to the elevating mechanism 635, and the elevating mechanisms 634 and 635 support the beam member 631. The beam members 631 move in the vertical direction (Z direction) in a horizontal posture by interlocking the elevating mechanisms 634 and 635 in response to a control command from the control unit 9.

A nozzle 61 having an ejection port 611 facing downward is attached to the lower center of the beam member 631. By operating the elevating mechanisms 634 and 635, the movement of the nozzle 61 in the vertical direction (Z direction) is realized.

The pillar members 632 and 633 are configured to be movable on the base 10. Two traveling guides 81L and 81R extending in the X direction are provided at the +Y side end and the −Y side end on the upper surface of the base 10. The column member 632 is engaged with the +Y side traveling guide 81L via a slider 636 attached to its lower portion, and the column member 633 is connected to the −Y side traveling guide 81R via a slider 637 attached to its lower portion. Is engaged with. The sliders 636 and 637 are movable in the X direction along the travel guides 81L and 81R.

The column members 632 and 633 move in the X direction by the operation of the linear motors 82L and 82R. The linear motors 82L and 82R include a magnet module as a stator and a coil module as a mover. The magnet module is provided on the base 10 and extends in the X direction. The coil module is attached to the lower portion of each of the pillar members 632 and 633. When the movers of the linear motors 82L and 82R operate in response to the control command from the control unit 9, the entire nozzle unit 60 moves in the X direction. As a result, the movement of the nozzle 61 in the X direction (first direction D1) is realized. The X-direction positions of the column members 632 and 633 are detected by the linear scales 83L and 83R provided near the sliders 636 and 637.

In this way, the nozzle 61 moves in the Z direction by the operation of the elevating mechanisms 634, 635, and moves in the X direction by the operation of the linear motors 82L, 82R. That is, the control unit 9 controls the elevating mechanisms 634, 635 and the linear motors 82L, 82R to realize the positioning of the nozzle 61 at each stop position L11-L14. Therefore, the lifting mechanisms 634 and 635 and the linear motors 82L and 82R function as the moving mechanism 63.

As the maintenance unit 65, the one described in JP 2010-240550 A may be adopted. The bat 651 is supported by the beam member 661 extending in the Y direction. Of the both ends of the beam member 661, one end is supported by the column member 662 and the other end is supported by the column member 663. The column members 662 and 663 are attached to both ends of the plate 664 extending in the Y direction in the Y direction.

Two traveling guides 84L and 84R extending in the X direction are provided below both ends of the plate 664, respectively. The two travel guides 84L and 84R are provided on the upper surface of the base 10. Of the both ends in the Y direction of the lower surface of the plate 664, the slider 666 is provided at the +Y side end and the slider 667 is provided at the −Y side end. The sliders 666 and 667 engage with the travel guides 84L and 84R and are movable in the X direction.

A linear motor 85 is provided below the plate 664. The linear motor 85 includes a magnet module that is a stator and a coil module that is a mover. The magnet module is provided on the base 10 and extends in the X direction. The coil module is provided under the maintenance unit 65 (here, the plate 664).

When the linear motor 85 operates in response to a control command from the control unit 9, the entire maintenance unit 65 moves in the X direction. The X-direction position of the maintenance unit 65 is detected by a linear scale 86 provided near the sliders 666 and 667.

As shown in FIG. 4, the chuck 51 includes two chuck members 51L and 51R. The chuck members 51L and 51R have shapes symmetrical to each other with respect to the XZ plane and are arranged apart from each other in the Y direction.

The chuck member 51L arranged on the +Y side is supported by a traveling guide 87L provided on the base 10 and extending in the X direction. The chuck member 51L includes a base portion 512 including two horizontal plate portions that are provided at different positions in the X direction and a connecting portion that connects these plate portions (see FIG. 2). One slider 511 is provided under each of the two plate portions of the base portion 512. The slider 511 is engaged with the travel guide 87L, whereby the chuck member 51L can travel in the X direction along the travel guide 87L.

One support portion 513 is provided on each of the upper portions of the two plate portions of the base portion 512. The support portion 513 extends upward and has a suction pad (not shown) at the upper end thereof. When the base portion 512 moves in the X direction along the travel guide 87L, the two support portions 513 move integrally in the X direction. The two plate portions of the base portion 512 may be separated from each other, and the plate portions may move in the X direction while keeping a certain distance, so that the base portion may apparently function as an integral base portion. By setting this distance according to the length of the substrate, it becomes possible to accommodate substrates of various lengths.

The chuck member 51L is moved in the X direction by the linear motor 88L. The linear motor 88 includes a magnet module that is a stator and a coil module that is a mover. The magnet module is provided on the base 10 and extends in the X direction. The coil module is provided below the chuck member 51L. The linear motor 88L operates in response to a control command from the control unit 9, whereby the chuck member 51L moves along the X direction. The position of the chuck member 51L in the X direction is detected by the linear scale 89L provided near the traveling guide 87L.

Like the chuck member 51L, the chuck member 51R provided on the −Y side includes a base portion 512 and two support portions 513 and 513. The shape of the chuck member 51R is symmetrical with the chuck member 51L with respect to the XZ plane. One slider 511 is provided under each of the two plate portions of the base portion 512 of the chuck member 51R. The slider 511 is engaged with the travel guide 87R, whereby the chuck member 51R can travel in the X direction along the travel guide 87R.

The chuck member 51R can be moved in the X direction by the linear motor 88R. The linear motor 88R includes a magnet module as a stator provided on the base 10 and extending in the X direction, and a coil module as a mover provided below the chuck member 51R. The linear motor 88R operates in response to a control command from the control unit 9 to move the chuck member 51R in the X direction. The position of the chuck member 51R in the X direction is detected by a linear scale 89R provided near the traveling guide 87R.

The control unit 9 controls the chuck members 51L and 51R so that they are always at the same position in the X direction. As a result, the pair of chuck members 51L and 51R apparently move as the integrated chuck 51. Interference between the chuck 51 and the floating stage unit 3 can be easily avoided as compared with the case where the chuck members 51L and 51R are mechanically coupled.

As shown in FIG. 3, the four support portions 513 are arranged corresponding to the four corners of the substrate W to be held. That is, the two support portions 513 of the chuck member 51L hold the +Y side peripheral portion of the substrate W and the upstream end portion and the downstream end portion in the first direction D1, respectively. The two support portions 513 and 513 of the chuck member 51R respectively hold the −Y side peripheral portion of the substrate W and the upstream end portion and the downstream end portion in the first direction D1. Negative pressure is supplied to the suction pads of each of the support portions 513 as needed, whereby the four corners of the substrate W are suction-held by the chucks 51 from below.

The substrate W is transported as the chuck 51 moves in the X direction while holding the substrate W. In this way, the mechanism (not shown) for supplying the negative pressure to the linear motors 88L and 88R and each support portion 513 functions as the suction/travel control mechanism 53 shown in FIG.

As shown in FIGS. 1 and 4, the chuck 51 holds the substrate W apart from the upper surfaces of the entrance floating stage 31, the coating stage 32, and the exit floating stage 33. The chuck 51 holds the lower surface of the substrate W and conveys the substrate W. The chuck 51 holds only a part of the peripheral portion of the substrate W outside the central portion facing the respective stages 31, 32, 33 in the Y direction. Therefore, the central portion of the substrate W bends downward with respect to the peripheral portion. The levitation stage unit 3 controls the vertical position of the substrate W by applying a levitation force to the central portion of the substrate W in this state, and maintains the substrate W in a horizontal posture.

<Measuring device>
The coating device 1 includes a plurality of (here, two) measuring devices 70. The measuring device 70 measures the vertical position of the upper surface Wf of the substrate W to which the levitation force is applied by the levitation stage unit 3. Specifically, the measuring device 70 measures the vertical position of the upper surface Wf by measuring the distance from the predetermined reference position in the vertical direction to the vertical position of the upper surface Wf.

From the vertical position of the upper surface Wf measured by the measuring instrument 70, the height of the upper surface Wf can be obtained from the height (vertical position) of the upper surface of the coating stage 32. Further, the flying height of the substrate W (the distance from the upper surface of the coating stage 32 to the lower surface of the floating substrate W) can be obtained from the height of the upper surface Wf and the thickness of the substrate W.

Each measuring device 70 includes a light projecting unit 70a that outputs light of a predetermined wavelength, and a light receiving unit 70b that includes an optical sensor (for example, a line sensor) that detects light output from the light projecting unit 70a and reflected by the substrate W. (See FIG. 7). As described above, each measuring device 70 includes a reflective sensor that can measure the vertical position of the upper surface Wf in a non-contact manner.

The vertical position of the upper surface Wf may be measured by ultrasonic waves instead of light. In this case, each measuring device 70 may include an output unit that outputs an ultrasonic wave and a detection unit that detects the ultrasonic wave reflected by the upper surface Wf.

Each measuring device 70 is connected to the nozzle 61 via a connecting tool 72. Of both side ends of the connector 72, one end has a structure attachable to the upstream side surface of the nozzle 61, and the other end has a structure attachable to the measuring instrument 70. Each measuring instrument 70 is arranged on the upstream side (−X side) of the nozzle 61 by being supported by the connector 72.

Since each measuring instrument 70 is connected to the nozzle 61 via the connecting tool 72, it moves following the nozzle 61. That is, when the nozzle 61 is moved in the horizontal direction or the vertical direction by the moving mechanism 63, each measuring device 70 also follows this and moves in the same direction.

In the present embodiment, the measuring mechanism 70 is positioned at the measurement positions L21a, L21b and the upstream positions L22a, L22b above the coating stage 32 by the operation of the moving mechanism 63. Each measuring instrument 70 measures the vertical position of the upper surface Wf of the substrate W in a state where each measuring instrument 70 is positioned at the measurement positions L21a and L21b. The upstream positions L22a and L22b are positions away from the measurement positions L21a and L21b on the upstream side (−X side) in the first direction D1. In the present embodiment, when the nozzle 61 is arranged at the downstream position L12, the measuring devices 70 are arranged at the measuring positions L21a and L21b, and when the nozzle 61 is arranged at the coating position L11, the measuring devices 70 are arranged at the upstream position L22a, It is arranged in L22b (see FIG. 8).

The connector 72 may directly connect the measuring instrument 70 to the nozzle 61 as in the present embodiment, but may indirectly connect the measuring instrument 70 to the nozzle 61 via another member. For example, the connector 72 may have a structure that can be attached to the beam member 631 to which the nozzle 61 is attached. In this case, the connector 72 connects the measuring instrument 70 to the nozzle 61 via the beam member 631.

As shown in FIG. 6, the two measuring devices 70 are provided in the second direction D2 with an interval shorter than the width (length in the width direction) of the substrate W. By providing the two measuring devices 70, it is possible to measure the vertical position of the substrate W at two different positions in the width direction. Note that the number of measuring devices 70 is not limited to two, and may be single or three or more.

FIG. 7 is a schematic block diagram showing the control unit 9 of the embodiment. The coating apparatus 1 includes a control unit 9 for controlling the operation of each part. The hardware configuration of the control unit 9 may be the same as that of a general computer. The control unit 9 includes a CPU 91 that performs various arithmetic processes, a ROM that is a read-only memory that stores a basic program, a readable/writable memory 92 that stores various information, and a display unit 93 that includes a display that displays various information. The memory 92 includes a main storage device (RAM) as well as a fixed disk for storing control applications (programs) and data. The control unit 9 is an interface unit for exchanging information with a user or an external device, and a reading device for reading information (program) stored in a portable storage medium (optical medium, magnetic medium, semiconductor memory, etc.). May be provided.

As will be described later, the CPU 91 of the control unit 9 operates according to a program to acquire a difference value between two vertical positions on the upper surface Wf of the substrate W measured by the two measuring devices 70. In this way, the CPU 91 functions as a difference acquisition unit. The difference acquisition unit may be configured by a dedicated circuit.

FIG. 8 is a diagram showing each step of the substrate processing operation executed by the coating apparatus 1 of the embodiment. The substrate processing operation first includes a transfer step S11 as shown in FIG. In the carrying step S11, the control unit 9 controls the carrying mechanism 5 to move the substrate W to which the levitation force is applied from the levitation stage unit 3 (hereinafter, also referred to as “floating substrate W”) in the first direction D1. It is transported toward the downstream side (+X direction).

The carrying step S11 includes a stopping step S111, as shown in FIG. In the stop step S111, the control unit 9 controls the transport mechanism 5 to transport the levitation substrate W to the predetermined position LW1 and stop the levitation substrate W at the predetermined position LW1.

Here, the floating substrate W arranged at the predetermined position LW1 straddles the coating stage 32 and the entrance floating stage 31. Further, the horizontal position of the upstream end of the floating substrate W arranged at the predetermined position LW1 is upstream of the center of the coating stage 32.

As shown in FIG. 8B, the measurement step S12 is performed in a state where the floating substrate W is stopped at the predetermined position LW1 by the stop step S111. The measuring step S12 is a step in which each measuring device 70 measures the vertical position of the floating substrate W. Each measuring instrument 70 measures the vertical position of the floating substrate W at the measurement horizontal position XM1. The measurement horizontal position XM1 is a horizontal position in the first direction D1 (X direction) of a region in which the measuring devices 70 arranged at the measurement positions L21a and L21b measure the vertical position of the floating substrate W. Here, the measurement horizontal position XM1 is set to the coating stage 32 (here, the central position of the coating stage 32 in the first direction D1) that can hold the floating substrate W at a precise vertical position. In the present embodiment, since the vertical position of the floating substrate W in the stopped state is measured, the measurement can be performed more accurately than when the floating substrate W that is moving is targeted.

After the measurement step S12, the control unit 9 may perform the first determination step of determining whether or not the vertical position of the floating substrate W measured by each measuring device 70 is abnormal. When the values of the vertical position of the floating substrate W measured by each measuring device 70 are A1 and A2, it is determined in the first determination step whether these values A1 and A2 are within the predetermined reference range. It is good. If either or both of the values A1 and A2 are out of the reference range, the control unit 9 notifies the outside by a predetermined output means (display unit 93, lamp, speaker, etc.). Good. At this time, the control unit 9 may stop the operation of the coating apparatus 1 so that the operator can confirm it.

The reason why the vertical position of the levitation substrate W is abnormal is, for example, that the levitation amount of the levitation substrate W due to clogging of any of the plurality of ejection ports 321h or the plurality of suction ports 322h provided on the upper surface of the coating stage 32. Abnormality is considered. Further, as another reason, an abnormality in the thickness of the floating substrate W (including an abnormality in the thickness of the floating substrate W itself and an abnormality that physically changes the vertical position of the upper surface Wf of the floating substrate W) are conceivable. By detecting the abnormality of the vertical position of the floating substrate W, it is possible to suppress the occurrence of coating failure of the floating substrate W. In addition, by measuring the vertical position of the floating substrate W at a plurality of different locations in the second direction D2 by each measuring device 70, it is possible to measure the vertical position of the levitation substrate W in the plurality of ejection ports 321h or the plurality of suction ports 322h. It is possible to easily specify the part, or the part of the floating substrate W where the thickness abnormality occurs.

After the measurement step S12, the control unit 9 obtains a difference value from the vertical position values A1 and A2 of the floating substrate W measured by each measuring device 70, and determines whether or not the difference value is within the reference range. The second determination step of performing may be performed. By obtaining the difference value, it is possible to easily specify the location where the vertical position is abnormal. When the control unit 9 determines that the difference value is outside the reference range in the second determination step, the control unit 9 may notify the outside by a predetermined output means. Further, the control unit 9 may stop the operation of the coating apparatus 1 so that the operator can confirm.

When the measuring step S12 is completed, the control unit 9 performs the moving step S13 as shown in FIG. 8C. The moving step S13 includes a measuring instrument moving step S131 and a nozzle moving step S132. In the measuring instrument moving step S131, the moving mechanism 63 moves each measuring instrument 70 toward the upstream positions L22a and L22b which are positions different from the measuring positions L21a and L21b. In the nozzle moving step S132, the moving mechanism 63 moves the nozzle 61 from the downstream position L12 to the measurement horizontal position XM1.

Here, each measuring device 70 is connected to the upstream side of the nozzle 61 by a connecting tool 72. Therefore, the moving mechanism 63 executes the nozzle moving step S132 of bringing the nozzle 61 closer to the upstream measurement horizontal position XM1 from the downstream position L12, so that each measuring instrument 70 moves to the upstream measuring instrument moving step S131. Are also executed concurrently.

The horizontal position of the ejection port 611 of the nozzle 61 in the first direction D1 coincides with the measurement horizontal position XM1.

When the moving step S13 is completed, the coating step S14 is performed as shown in FIG. In the coating step S14, the nozzle 61 discharges the processing liquid from the ejection port 611 to supply the processing liquid to the upper surface Wf of the floating substrate W, and the transport mechanism 5 transports the floating substrate W in the first direction D1. As a result, the processing liquid is applied to the upper surface Wf of the floating substrate W in the area having the specified width in the second direction D2.

As shown in FIG. 8C, here, when each measuring instrument 70 reaches the predetermined upstream positions L22a and L22b by the moving step S13, the horizontal position of the discharge port 611 of the nozzle 61 in the first direction D1 is: The measurement horizontal position XM1 is matched. Here, since the ejection port 611 of the nozzle 61 is opened vertically downward, the processing liquid is ejected vertically downward. Then, the attachment horizontal position, which is the horizontal position in the first direction at which the processing liquid ejected from the nozzle 61 adheres to the upper surface Wf of the floating substrate W, coincides with the measurement horizontal position XM1 (overlaps in the vertical direction). As described above, in the present embodiment, since the processing liquid can be supplied to the floating substrate W in the region where the vertical position of the floating substrate W is measured, the processing liquid can be favorably applied to the floating substrate W.

It should be noted that it is not essential that the attached horizontal position coincides with the measured horizontal position XM1. The adhesion horizontal position may be near the measurement horizontal position XM1 (within a certain area centered on the measurement horizontal position XM1).

FIG. 9: is a figure which shows the modification of operation|movement of the coating device 1 of embodiment. In this modification, in the moving step S13, after the measuring instrument moving step S131 and the nozzle moving step S132 (see FIG. 8C), the nozzle vertical position adjusting step S133 is performed as shown in FIG.

In the nozzle vertical position adjusting step S133, the vertical position of the nozzle 61 is adjusted according to the vertical position of the floating substrate W measured by each measuring device 70. In the nozzle vertical position adjusting step S133, the CPU 91 of the control unit 9 calculates the vertical position of the upper surface Wf from the measurement result of each measuring device 70 by a predetermined calculation. As a method of obtaining the vertical position, for example, when the values of the vertical positions of the floating substrate W measured by the two measuring devices 70 are A1 and A2, the average value of these values A1 and A2 is the vertical position of the floating substrate W. It is good to do. Alternatively, one of the values may be the vertical position of the floating substrate W. The control unit 9 controls the elevating mechanisms 634 and 635 to elevate the beam member 631 so that the nozzle 61 is arranged at a suitable vertical position with respect to the obtained vertical position of the floating substrate W. When the nozzle vertical position adjusting step S133 is completed, the applying step S14 may be performed as shown in FIG. 8D.

Through the nozzle vertical position adjusting step S133, the vertical position of the nozzle 61 can be optimized according to the vertical position of the floating substrate W. As a result, the treatment liquid can be supplied to the floating substrate W from an optimum vertical position, and thus the treatment liquid can be favorably applied to the floating substrate W.

The nozzle vertical position adjusting step S133 may be performed before the nozzle moving step S132 that moves the nozzle 61 to the upstream side (here, before the measuring instrument moving step S131). Alternatively, it may be performed in parallel with the nozzle moving step S132 (here, in parallel with the measuring instrument moving step S131). In the latter case, when it is necessary to adjust the vertical position of the nozzle 61, the nozzle 61 moves in the combined horizontal and vertical directions.

FIG. 10: is a figure which shows the modification of operation|movement of the coating device 1 of embodiment. In this modified example, in the measuring instrument moving step S131, each measuring instrument 70 measures the vertical position of the floating substrate W while moving from the measurement positions L21a, L21b to the upstream positions L22a, L22b. In this case, the vertical position of the floating substrate W to which the processing liquid has not been applied can be measured in the horizontal range from the measurement horizontal position XM1 to the predetermined upstream position. A third determination process may be performed by the control unit 9 to determine whether or not the vertical position of the floating substrate W is abnormal in this horizontal range. For example, the control unit 9 may determine whether or not the vertical positions at all points measured by the respective measuring instruments 70 are within the predetermined reference range. In addition, the control unit 9 may obtain a difference value of vertical positions of the floating substrate W between different points in the first direction D1 and determine whether the difference value is within a predetermined reference range.

In the present embodiment, the nozzle 61 and each measuring device 70 are connected by the connecting tool 72, and the moving mechanism 63 can integrally move them in the horizontal direction and the vertical direction. However, the nozzle 61 and each measuring device 70 may be separated from each other, and the moving mechanism may individually move them so as not to interfere with each other. However, as in the present embodiment, by connecting each measuring device 70 to the nozzle 61 and moving them integrally, the structure of the moving mechanism can be simplified.

Although the present invention has been described in detail, the above description is illustrative in all aspects, and the present invention is not limited thereto. It is understood that innumerable variants not illustrated can be envisaged without departing from the scope of the invention. The configurations described in the above-described embodiments and modified examples can be appropriately combined or omitted as long as they do not contradict each other.

1 Coating equipment (substrate processing equipment)
3 Levitation stage section (levitation mechanism)
32 coating stage 31h, 321h, 33h ejection port 322h suction port 5 transfer mechanism 51 chuck 52 adsorption/running control mechanism 6 coating mechanism 61 nozzle 611 discharge port 63 moving mechanism 634, 635 lifting mechanism 70 measuring device 70a light emitting unit 70b light receiving unit 72 Connection tool 88L, 88R Linear motor 9 Control unit 91 CPU
D1 1st direction D2 2nd direction L11 Coating position L12 Downstream position L21a, L21b Measuring position L22a, L22b Upstream position LW1 Default position S10 Transport process S101 Stop stage S12 Measuring process S13 Moving process S131 Measuring device moving stage S132 Nozzle moving stage S133 Nozzle Vertical position adjusting step S14 Coating process W substrate, floating substrate Wf upper surface (first main surface)
XM1 horizontal measurement position

Claims (15)

A substrate processing apparatus for processing a substrate having a first main surface and a second main surface,
A levitation mechanism for imparting levitation force to the substrate whose first main surface is vertically upward;
A transport mechanism that moves a floating substrate, which is the substrate to which the floating force is applied, in a first direction that is a horizontal direction;
A nozzle having a discharge port extending in a second direction which is a horizontal direction orthogonal to the first direction, and capable of discharging the processing liquid from the discharge port toward the first main surface of the floating substrate;
A measuring device for measuring the vertical position of the first main surface of the floating substrate;
The adhesion horizontal position, which is the horizontal position where the processing liquid from the nozzle adheres to the floating substrate, approaches the measurement horizontal position, which is the horizontal position of the region in which the measuring device previously measures the vertical position of the floating substrate. A moving mechanism for moving the nozzle and the measuring device,
Equipped with
The moving mechanism positions the measuring device at the measurement horizontal position, and positions the nozzle at a downstream position downstream of the measurement horizontal position in the first direction,
The transfer mechanism moves the floating substrate to a predetermined position and then stops the floating substrate,
The measuring device measures the vertical position of the floating substrate in a state where both the measuring device and the floating substrate are stopped,
The moving mechanism is in a state where the floating substrate is stopped at the predetermined position after the measuring device measures the vertical position of the floating substrate in a state where the measuring device and the floating substrate are both stopped. , along with moving the instrument in a different position, the nozzle Before moving the nozzle closer to the measuring horizontal position from the downstream position, the substrate processing apparatus. The substrate processing apparatus according to claim 1 , wherein
The moving mechanism moves the measuring device measuring the vertical position at the measurement horizontal position of the floating substrate stopped at the predetermined position to a position on the upstream side in the first direction,
The substrate processing apparatus, wherein the measuring device measures the vertical position of the floating substrate while moving toward the position on the upstream side in the first direction. A substrate processing apparatus for processing a substrate having a first main surface and a second main surface,
A levitation mechanism for imparting levitation force to the substrate whose first main surface is vertically upward;
A transport mechanism that moves a floating substrate, which is the substrate to which the floating force is applied, in a first direction that is a horizontal direction;
A nozzle having a discharge port extending in a second direction which is a horizontal direction orthogonal to the first direction, and capable of discharging the processing liquid from the discharge port toward the first main surface of the floating substrate;
A measuring device for measuring the vertical position of the first main surface of the floating substrate;
The adhesion horizontal position, which is the horizontal position where the processing liquid from the nozzle adheres to the floating substrate, approaches the measurement horizontal position, which is the horizontal position of the region in which the measuring device previously measures the vertical position of the floating substrate. A moving mechanism for moving the nozzle and the measuring device,
A control unit,
Equipped with
The transfer mechanism moves the floating substrate to a predetermined position and then stops the floating substrate,
The moving mechanism moves the measuring device measuring the vertical position of the floating substrate at the measurement horizontal position to another position while the floating substrate is stopped at the predetermined position, and the nozzle is Move closer to the measurement horizontal position,
The moving mechanism moves the measuring device that has measured the vertical position at the measurement horizontal position of the floating substrate stopped at the predetermined position from the measurement horizontal position to a position on the upstream side in the first direction,
The measuring device measures a vertical position of the floating substrate while moving from the measurement horizontal position toward a position on the upstream side in the first direction,
Whether all vertical positions of the floating board measured by the control unit while the measuring device moves from the measurement horizontal position toward the upstream side position in the first direction are within a prescribed reference range. The determination as to whether or not the vertical position of the floating substrate is measured at different points in the first direction while the measuring device moves from the measurement horizontal position toward the upstream side position in the first direction. A substrate processing apparatus that performs at least one of determination of whether a difference value between different points is within a prescribed reference range . The substrate processing apparatus according to any one of claims 1 to 3 ,
The substrate processing apparatus, wherein the moving mechanism moves the nozzle and the measuring device so that the attached horizontal position matches the measured horizontal position. The substrate processing apparatus according to any one of claims 1 to 4 , wherein:
The levitation mechanism is
A stage having a horizontal plane,
A plurality of jet ports provided on the horizontal plane and jetting air toward the upper side in the vertical direction,
A plurality of suction ports provided on the horizontal surface for sucking the air on the upper side in the vertical direction,
A substrate processing apparatus including: The substrate processing apparatus of any one of claims 1 to 5,
The substrate moving apparatus is capable of positioning the nozzle at a coating position which is a predetermined horizontal position and moving the nozzle to a position horizontally separated from the coating position. The substrate processing apparatus according to any one of claims 1 to 6 , wherein:
A substrate processing apparatus wherein the moving mechanism is capable of positioning the measuring device at a measurement position which is a predetermined horizontal position and moving the measuring device to a position horizontally separated from the measuring position. The substrate processing apparatus according to any one of claims 1 to 7 , wherein
A connector for connecting the nozzle and the measuring device,
Further equipped with,
The substrate processing apparatus, wherein the moving mechanism integrally moves the nozzle and the measuring device connected by the connecting tool. The substrate processing apparatus according to claim 8 , wherein
The connector connects the measuring device to the nozzle in an upstream side in the first direction,
The substrate processing apparatus, wherein the moving mechanism moves the nozzle and the measuring device in the first direction. The substrate processing apparatus according to any one of claims 1 to 9 ,
The substrate processing apparatus, wherein the measuring device includes a reflective sensor that detects light reflected by the first main surface of the floating substrate. The substrate processing apparatus according to any one of claims 1 to 10, wherein
The substrate processing apparatus, wherein the moving mechanism changes the vertical position of the nozzle according to the vertical position of the floating substrate measured by the measuring device. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus comprises:
A plurality of the measuring devices are provided at intervals in the second direction,
The substrate processing apparatus, wherein the plurality of measuring devices can measure vertical positions at a plurality of different positions on the floating substrate in the second direction. The substrate processing apparatus according to claim 12, wherein
A difference acquisition unit that acquires a difference from the vertical positions of the plurality of locations measured by the plurality of measuring devices,
A substrate processing apparatus further comprising: A substrate processing method for processing a substrate having a first main surface and a second main surface, comprising:
(A) a step of imparting a levitation force to the substrate whose first main surface is vertically upward,
(B) a step of moving the floating substrate, which is the substrate to which the floating force is applied in the step (a), in a first direction which is a horizontal direction;
A step (c) measuring instrument for measuring the vertical position of the first main surface of the floating board,
(D) After the step (c), a nozzle supplies a treatment liquid to the first main surface of the floating substrate which is moved in the first direction by the step (b),
(E) After the step (c) and before the step (d), an attachment horizontal position, which is a horizontal position at which the processing liquid adheres to the floating substrate, is set in the step (c). As the measuring device approaches the measurement horizontal position, which is the horizontal position of the region in which the vertical position of the floating substrate is previously measured, a step of moving the nozzle and the measuring device,
Only including,
In the step (b), the measuring device is positioned at the measurement horizontal position, the nozzle is positioned at a downstream position downstream of the measurement horizontal position in the first direction, and the floating substrate is moved to a predetermined position. Including moving and then stopping,
The step (c) includes a step in which the measuring device measures the vertical position of the floating substrate while the measuring device and the floating substrate are both stopped,
The step (e) includes
In a state where the floating substrate is stopped at the predetermined position, moving the measuring device measuring the vertical position in the measurement horizontal position to another position,
Moving the nozzle so that the nozzle approaches the measurement horizontal position from the downstream position while the floating substrate is stopped at the specified position;
And a substrate processing method. A substrate processing method for processing a substrate having a first main surface and a second main surface, comprising:
(A) a step of imparting a levitation force to the substrate whose first main surface is vertically upward,
(B) a step of moving the floating substrate, which is the substrate to which the floating force is applied in the step (a), in a first direction which is a horizontal direction;
A step (c) measuring instrument for measuring the vertical position of the first main surface of the floating board,
(D) After the step (c), a nozzle supplies a treatment liquid to the first main surface of the floating substrate which is moved in the first direction by the step (b),
(E) After the step (c) and before the step (d), an attachment horizontal position, which is a horizontal position at which the processing liquid adheres to the floating substrate, is set in the step (c). As the measuring device approaches the measurement horizontal position, which is the horizontal position of the region in which the vertical position of the floating substrate is previously measured, a step of moving the nozzle and the measuring device,
(F) determination step,
Only including,
The step (b) includes a step of moving the floating substrate to a predetermined position and then stopping the floating substrate,
The step (c) includes a step in which the measuring device measures a vertical position of the floating substrate at the measurement horizontal position while the floating substrate is stopped at the specified position,
The step (e) includes
In a state where the floating substrate is stopped at the predetermined position, moving the measuring device measuring the vertical position in the measurement horizontal position from the measurement horizontal position to a position on the upstream side in the first direction,
Bringing the nozzle closer to the measurement horizontal position while stopped at the specified position of the floating substrate,
Measuring the vertical position of the floating substrate while the measuring device moves from the measurement horizontal position toward a position on the upstream side in the first direction;
Including
In the step (f), all the vertical positions of the floating substrate measured during the movement of the measuring device from the measurement horizontal position toward the upstream side position in the first direction are within a specified reference range. The step of determining whether there is, and the verticality of the floating substrate measured at different points in the first direction while the measuring device moves from the measurement horizontal position toward a position on the upstream side in the first direction. A substrate processing method , comprising: determining whether or not a difference value between positions at different positions is within a prescribed reference range .

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