KR20190136927A - Substrate treatment apparatus and substrate treatment method - Google Patents

Abstract

Provided is a technique for smoothly applying a treatment liquid to a substrate which a lifting force is applied to and conveyed. A coating device (1) includes a lifting stage (3) applying a lifting force to a substrate (W), a conveying mechanism (5) moving the substrate (W) given the floating force in a first direction (D1), a nozzle (61) discharging a treatment liquid toward a top surface (Wf) of the lifted substrate (W), a measuring device (70) measuring a vertical position of the top surface (Wf) of the substrate (W), and a moving mechanism (63) moving the nozzle (61) and the measuring device (70). The moving mechanism (63) moves the nozzle (61) and the measuring device (70) so that an attached horizontal position at which the treatment liquid from the nozzle (61) is attached to the substrate (W) may become closer to a measure horizontal position (XM1) of an area in which the measuring device (70) measures the vertical position of the substrate (W) in advance.

Description

Substrate processing apparatus and substrate processing method {SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD}

TECHNICAL FIELD This invention relates to the substrate processing apparatus and substrate processing method which process a board | substrate. Specifically, It is related with the technique of performing application | coating of the processing liquid to the board | substrate conveyed with the floating force. Examples of the substrate to be processed include a semiconductor substrate, a liquid crystal display device and a substrate for flat panel display (FPD) such as an organic EL (Electroluminescence) display device, an optical disk substrate, a magnetic disk substrate, and an optical magnetic disk. Substrates, substrates for photomasks, ceramic substrates, and substrates for solar cells are included.

In manufacturing processes, such as an electronic component, such as a semiconductor device and a liquid crystal display device, the coating apparatus which apply | coats a coating liquid to the surface of a board | substrate is used. In such a coating apparatus, the coating liquid is supplied from a nozzle extending in the width direction of the substrate with respect to the surface (corresponding to the main surface of the substrate) of the substrate while conveying the substrate while injecting air onto the back surface of the substrate to make the substrate float. The apparatus which apply | coats a coating liquid to a board | substrate by discharging a metal is known (for example, patent document 1).

In the substrate processing apparatus of patent document 1, the said board | substrate is conveyed by hold | maintaining the periphery of a board | substrate and traveling in a horizontal direction, floating a board | substrate on a floating stage, and apply | coating from the slit nozzle arrange | positioned above the board | substrate conveyance path | route Discharge the liquid.

In the substrate processing apparatus of patent document 1, the optical distance sensor which measures the floating height of a board | substrate above the board | substrate is provided. It is possible to supply a coating liquid from an appropriate height by adjusting the height of a slit nozzle according to the height of a board | substrate.

Japanese Laid-Open Patent Publication 2012-142583

In the said prior art, the horizontal position of the area | region where an optical distance sensor measures a vertical position is an upstream side of a conveyance direction rather than the horizontal position which the process liquid from a nozzle adheres to a board | substrate. That is, in the prior art, the horizontal position where the processing liquid adheres to the substrate was far from the horizontal position of the area measured by the optical distance sensor. For this reason, even if there existed an abnormality in the height of a board | substrate in the horizontal position to which a process liquid adheres, for example, since the said abnormality was difficult to detect with the said optical distance sensor, there existed a possibility that coating defect might arise.

Then, an object of this invention is to provide the technique of apply | coating a process liquid favorable to the board | substrate conveyed with a floating force.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, 1st aspect is a substrate processing apparatus which processes the board | substrate which has a 1st main surface and a 2nd main surface, The floating mechanism which gives a floating force to the said board | substrate whose said 1st main surface is a perpendicular upward direction. And a conveying mechanism for moving the floating substrate, which is the substrate to which the floating force is applied, in a first direction in a horizontal direction, and a discharge port extending in a second direction in a horizontal direction orthogonal to the first direction. A nozzle capable of discharging the processing liquid from the discharge port toward the first main surface of the substrate, a measuring unit for measuring the vertical position of the first main surface of the floating substrate, and a horizontal surface of the processing liquid from the nozzle attached to the floating substrate Position so that the attachment horizontal position is close to the measurement horizontal position which is the horizontal position of the region where the measuring device measures the vertical position of the floating substrate in advance. And a moving mechanism for moving the nozzle and the measuring device.

2nd aspect is a substrate processing apparatus of a 1st aspect, The said moving mechanism moves the said nozzle and the said measuring device so that the said attachment horizontal position may correspond to the said measurement horizontal position.

A 3rd aspect is a substrate processing apparatus of a 1st aspect or 2nd aspect, Comprising: The said floating mechanism is the stage which has an upper surface, The some surface which is formed in the said upper surface, and blows air toward the upper side of the said vertical direction, And a plurality of suction ports formed on the upper surface and sucking air above the vertical direction.

A fourth aspect is any one of the substrate processing apparatuses of the first to third aspects, wherein the moving mechanism positions the nozzle at an application position that is a predetermined horizontal position, and the nozzle is moved from the application position. It can be moved to a position away from the horizontal direction.

A fifth aspect is the substrate processing apparatus in any one of the first aspect to the fourth aspect, wherein the moving mechanism positions the measuring instrument at a measurement position that is a predetermined horizontal position, and the measuring instrument is located from the measuring position. It can be moved to a position away from the horizontal direction.

A sixth aspect is the substrate processing apparatus of any one of the first to fifth aspects, further comprising a connector for connecting the nozzle and the measuring device, and the moving mechanism includes the nozzle and the measuring device connected by the connector. Move all together.

A seventh aspect is the substrate processing apparatus of a sixth aspect, wherein the connector connects the measuring device to an upstream side in the first direction with respect to the nozzle, and the moving mechanism includes the nozzle and the measuring device in the first direction. Move to the upstream side in the direction.

An eighth aspect is any one of the first to seventh substrate processing apparatuses, wherein the measuring device includes a reflective sensor that detects light reflected from the first main surface of the floating substrate.

A ninth aspect is any one of the first to eighth substrate processing apparatuses, wherein the conveying mechanism is stopped after the floating substrate is moved to a predetermined position, and the moving mechanism is the floating substrate. In the state where it has stopped at a predetermined position, while moving the measuring device which measured the vertical position in the said measurement horizontal position of the said floating board to another position, the nozzle is made to approach the said measurement horizontal position.

A tenth aspect is a substrate processing apparatus of a ninth aspect, wherein the moving mechanism is configured to measure the vertical position at the measurement horizontal position of the floating substrate stationary at the predetermined position in the first direction. While moving to an upstream position, the measuring device measures the vertical position of the floating substrate while moving toward the upstream position in the first direction.

The eleventh aspect is any one of the substrate processing apparatuses of the first to tenth aspects, wherein the moving mechanism changes the vertical position of the nozzle in accordance with the vertical position of the floating substrate measured by the measuring device.

A twelfth aspect is any one of the first to eleventh aspects of the substrate processing apparatus, wherein the plurality of measuring devices are formed at intervals in the second direction, and the plurality of measuring devices are used in the floating substrate. Vertical positions of a plurality of different points in the second direction can be measured.

A thirteenth aspect is a substrate processing apparatus of a twelfth aspect, further comprising a difference obtaining portion that obtains a difference value of the vertical positions of the plurality of points measured by the plurality of measuring devices.

A fourteenth aspect is a substrate processing method for treating a substrate having a first main surface and a second main surface, wherein the floating substrate, which is the substrate to which the floating force is applied in a state where the first main surface is upward in the vertical direction, is a horizontal direction. The conveyance process of moving to a 1st direction, the measuring process of measuring the vertical position of the said 1st main surface of the said floating substrate, and the said of the said floating substrate moved to the said 1st direction by the said conveyance process after the said measuring process The application | coating process which supplies a process liquid from a nozzle to a 1st main surface, and the horizontal position where the process liquid adheres to the said floating substrate after the said measurement process and before the said application process are the said in a said measurement process, The nozzle and the measurement such that a meter approaches a measurement horizontal position that is a horizontal position of an area where the vertical position of the floating substrate is previously measured A migration process for moving the group.

A fifteenth aspect is the substrate processing method of the fourteenth aspect, wherein the conveying step includes a step of moving the floating substrate to a predetermined position and then stopping, and the moving step includes the position where the floating substrate is already determined. Moving the measuring device that measured the vertical position in the measurement horizontal position to another position in a stopped state, and in the state where the floating substrate is stopped at the predetermined position, measuring the nozzle Approaching a horizontal position.

According to the substrate processing apparatus of the first aspect, the horizontal position (attachment horizontal position) at which the processing liquid from the nozzle adheres to the floating substrate at the horizontal position (measuring horizontal position) of the area where the measuring device measures the vertical position of the floating substrate. Approach For this reason, the processing liquid can supply the processing liquid to the floating substrate in a region where the vertical direction of the floating substrate is measured or near thereto. Therefore, the processing liquid can be favorably applied to the floating substrate.

According to the substrate processing apparatus of the second aspect, the processing liquid is supplied to the floating substrate in a region where the measuring device measures the vertical direction of the floating substrate. Therefore, the processing liquid can be favorably applied to the floating substrate.

According to the substrate processing apparatus of the third aspect, the floating substrate can be stably held at a predetermined vertical position by balancing the suction by the air from the suction port while applying the floating force to the aero substrates from the plurality of jet ports.

According to the substrate processing apparatus of the fourth aspect, the nozzle is positioned at the application position, and the processing liquid can be supplied to the floating substrate. In addition, the nozzle can be moved to a position away from the application position in the horizontal direction.

According to the substrate processing apparatus of the fifth aspect, the measuring device is positioned at the measurement position, and the vertical position of the floating substrate can be measured. In addition, the measuring device can be moved to a position away from the measuring position in the horizontal direction.

According to the substrate processing apparatus of the sixth aspect, since the nozzle and the measuring device are connected, the moving mechanism can move them integrally. For this reason, compared with the case where a nozzle and a measuring device are moved individually, a movement mechanism can be comprised simply.

According to the substrate processing apparatus of the seventh aspect, after the measuring device measures the vertical position of the floating substrate at the measuring position, the moving mechanism moves the nozzle and the measuring device to the upstream side in the first direction, thereby moving the attachment scheduled position to the measuring position. I can approach it.

According to the substrate processing apparatus of the eighth aspect, the vertical position of the first main surface can be measured by detecting the light reflected from the first main surface of the floating substrate with the light receiving sensor.

According to the substrate processing apparatus of the ninth aspect, in the state where the floating substrate is stopped, the measuring device which measures the vertical position at the measuring horizontal position of the floating substrate is moved to another position, and the nozzle approaches the measuring horizontal position. For this reason, it can arrange | position so that a nozzle may approach the position which a vertical position measured beforehand. Thereby, the processing liquid can be appropriately applied to the floating substrate.

According to the substrate processing apparatus of the tenth aspect, the vertical position of the floating substrate can be measured in the horizontal range from the measurement horizontal position to the position upstream from the measurement horizontal position.

According to the substrate processing apparatus of the eleventh aspect, the vertical position of the nozzle is adjusted in accordance with the vertical position of the floating substrate measured by the measuring device. As a result, the processing liquid can be supplied to the floating substrate from the nozzle at the appropriate vertical position, so that the processing liquid can be favorably applied to the floating substrate.

According to the substrate processing apparatus of the twelfth aspect, the vertical positions of a plurality of points different in the second direction among the floating substrates can be measured.

According to the substrate processing apparatus of the thirteenth aspect, by obtaining the difference value of the vertical positions measured at a plurality of points, it is possible to easily detect the point where the abnormal position is at the vertical position of the floating substrate.

According to the substrate processing method of the fourteenth aspect, the horizontal position (attachment horizontal position) at which the processing liquid from the nozzle adheres to the floating substrate at the horizontal position (measurement horizontal position) of the area where the measuring device measures the vertical position of the floating substrate. Approach For this reason, a process liquid can be supplied to a floating board in the area | region where the measuring device measures the perpendicular direction of a floating board | substrate, or near this. Therefore, the processing liquid can be favorably applied to the floating substrate.

According to the substrate processing method of the fifteenth aspect, in the state where the floating substrate is stopped, the measuring device which measures the vertical position in the measuring horizontal position of the floating substrate is moved to another position, and the nozzle approaches the measuring horizontal position. For this reason, it can arrange | position so that a nozzle may approach the position which a vertical position measured beforehand. Thereby, the processing liquid can be appropriately applied to the floating substrate.

FIG. 1: is a side view which shows typically the whole structure of the coating device 1 which is an example of the substrate processing apparatus of embodiment.
2 is a schematic plan view of the coating device 1 of the embodiment as seen from the upper side in the vertical direction.
3 is a schematic plan view of the coating device 1 except for the coating mechanism 6 of the embodiment.
4 is a schematic cross-sectional view of the coating device 1 at a position along the line AA shown in FIG. 2.
5 is a schematic plan view showing a part of the floating stage portion 3 of the embodiment.
6 is a schematic plan view of the nozzle 61 of the embodiment.
7 is a schematic block diagram showing a control unit 9 of the embodiment.
FIG. 8: is a figure which shows each process of the substrate processing operation which the coating device 1 of embodiment performs.
9 is a diagram illustrating a modification of the operation of the coating device 1 of the embodiment.
FIG. 10: is a figure which shows the modification of the operation | movement of the coating device 1 of embodiment.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described, referring an accompanying drawing. In addition, the component described in this embodiment is an illustration to the last, and is not the meaning which limits the scope of this invention only to them. In the drawings, the size and number of each part may be exaggerated or simplified for convenience in understanding.

Expressions representing relative or absolute positional relationships (e.g., "parallel", "orthogonal", "center", "concentric", "coaxial", etc.), unless specifically stated otherwise, not only express the positional relationship strictly, In the range in which the function of accuracy is obtained, the state displaced with respect to angle or distance is also to be shown. Expressions that indicate equal status (for example, "identical", "equal", "homogeneous" "match", etc.), unless specifically stated otherwise, exhibit not only quantitatively strictly equivalent states, but also tolerances or equivalent functions It shall also show the state in which this obtained difference exists. The expression representing the shape (for example, "square shape" or "cylindrical shape", etc.), unless specifically stated, indicates the shape strictly geometrically, and in the range where an effect of the same degree is obtained, for example, For example, the shape which has unevenness, chamfering, etc. shall also be shown. Unless otherwise indicated, "to phase" includes the case where two elements are apart from each other in addition to the case where two elements are in contact.

FIG. 1: is a side view which shows typically the whole structure of the coating device 1 which is an example of the substrate processing apparatus of embodiment. 2 is a schematic plan view of the coating device 1 according to the embodiment as seen from the upper side in the vertical direction. 3 is a schematic plan view of the coating device 1 except for the coating mechanism 6 of the embodiment. FIG. 4: is schematic sectional drawing of the coating device 1 in the position along the A-A line shown in FIG. 5 is a schematic plan view showing a part of the floating stage portion 3 of the embodiment. 6 is a schematic plan view of the nozzle 61 of the embodiment.

The coating device 1 is configured such that the horizontal substrate (the upper surface Wf (first main surface) and the lower surface (second main surface) of the rectangular substrate W are parallel to the horizontal surface (XY plane). It is a slit coater which conveys a process liquid (coating liquid) to the upper surface Wf of the said board | substrate W, while conveying to a posture. In each figure, in order to make the positional relationship of each part of the coating device 1 clear, the direction parallel to the 1st direction D1 in which the board | substrate W is conveyed is called "X direction", and input conveyor 100 ), The direction toward the output conveyor 110 is referred to as "+ X direction", and the opposite direction is referred to as "-X direction". The horizontal direction orthogonal to the X direction is called "Y direction", the direction toward the front of FIG. 1 is called "-Y direction", and the opposite direction is called "+ Y direction". The vertical direction orthogonal to the X direction and the Y direction is referred to as the Z direction, and the upward direction toward the application mechanism 6 side when viewed from the floating stage 3 is referred to as the "+ Z direction" and the opposite direction is referred to as the "-Z direction". .

The basic structure and operating principle of the coating device 1 are partially or common to those described in JP 2010-227850 A and JP 2010-240550 A. Therefore, in this specification, among the structures of the coating device 1, about the structure which can be easily inferred based on the same as those described in these well-known documents, or technical common sense, etc., it may be abbreviate | omitted suitably.

The coating device 1 in order along the 1st direction D1 (+ X direction) with which the board | substrate W is conveyed, the input conveyor 100, the input movement mounting part 2, the floating stage part 3, The output movement mounting part 4 and the output conveyor 110 are provided. These are arrange | positioned so that they may mutually adjoin, and the conveyance path | route of the board | substrate W is formed by these. In addition, in the following description, when showing a positional relationship with respect to the 1st direction D1 which is a conveyance direction of a board | substrate, "upstream side of the 1st direction D1" is simply "upstream side", and it is called "1st The downstream side of the direction D1 "may be abbreviated as" downstream side. " In this example, from a certain reference position, the -X side is the "upstream side" and the + X side is the "downstream side".

The input conveyor 100 is equipped with the roller conveyor 101 and the rotation drive mechanism 102 which rotationally drives this roller conveyor 101. As shown in FIG. By rotation of the roller conveyor 101, the board | substrate W is conveyed to the downstream side (+ X side) in a horizontal attitude | position.

The input movement mounting part 2 is equipped with the roller conveyor 21 and the rotation drive mechanism 22 which rotates this roller conveyor 21. As shown in FIG. As the roller conveyor 21 rotates, the substrate W is conveyed in the + X direction. Moreover, the vertical position (position in the vertical direction) of the board | substrate W changes by the roller conveyor 21 raising and lowering. By the operation of the input movement mounting part 2, the board | substrate W is moved-mounted from the input conveyor 100 to the floating stage part 3.

The floating stage part 3 includes three flat plate-like stages along the first direction D1. Specifically, the floating stage 3 includes an inlet floating stage 31, an application stage 32, and an outlet floating stage 33 in order along the first direction D1. The upper surface of each of these stages is on the same plane. The upper surface of each stage may be a horizontal surface, for example.

On each of the upper surfaces of the inlet floating stage 31 and the outlet floating stage 33, a plurality of jets 31h, 33h for blowing air (compressed air) supplied from the floating control mechanism 35 are formed in a matrix. have. The floating force is imparted to the board | substrate W by the compressed air blown out from some blower outlet 31h, 33h, and the lower surface (second main surface) of the board | substrate W is separated from the upper surface of each stage 31, 33. In one state, the substrate W is supported in the horizontal position. The distance of the lower surface of the board | substrate W and the upper surface of the stages 31 and 33 may be 10 micrometers (micrometer)-500 micrometers, for example.

The upper surface of the application stage 32 is provided with a plurality of ejection openings 321h for ejecting air (compressed air) and a plurality of suction ports 322h for sucking the atmosphere above the application stage 32. On the upper surface of the application stage 32, the jet port 321h and the suction port 322h are alternately formed along the X direction and the Y direction. The floating control mechanism 35 controls the ejection amount of the compressed air from each ejection opening 321h and the suction amount of the atmosphere to each suction opening 322h to be balanced so that the lower surface of the substrate W and the coating stage 32 are controlled. The distance of the upper surface is precisely controlled. Thereby, the vertical position of the upper surface Wf of the board | substrate W which passes above the application | coating stage 32 is controlled to the predetermined value. As a structure of the floating stage part 3, you may apply the thing of Unexamined-Japanese-Patent No. 2010-227850.

The board | substrate W carried in to the floating stage part 3 via the input movement mounting part 2 acquires the propulsion force to + X direction by the rotation of the roller conveyor 21, and conveys it on the inlet floating stage 31. do. The conveyance of the board | substrate W in the floating stage part 3 is performed by the conveyance mechanism 5.

The conveyance mechanism 5 is equipped with the chuck 51 and the adsorption | running | working run control mechanism 52. As shown in FIG. The chuck 51 supports the substrate W from below by partially contacting the peripheral portion of the lower surface of the substrate W. As shown in FIG. The adsorption / run control mechanism 52 has a function of applying negative pressure to a suction pad formed at a support portion at the upper end of the chuck 51 to suck and hold the substrate W on the chuck 51. Moreover, the adsorption | running | working run control mechanism 52 is equipped with the function which makes the chuck 51 reciprocately run linearly along an X direction.

In the state where the chuck 51 holds the substrate W, the lower surface of the substrate W is located on the + Z side than the upper surface of each stage 31, 32, 33 of the floating stage part 3. The board | substrate W adsorbs and hold | maintains the periphery part by the chuck | zipper 51, and maintains a horizontal attitude as a whole by the floating force provided from the floating stage part 3.

The chuck 51 holds the substrate W carried from the input movement mounting portion 2 to the floating stage 3, and the chuck 51 moves in the + X direction in this state, whereby the substrate W floats. It is conveyed from the upper side of the stage 31 to the upper side of the exit floating stage 33 via the upper side of the application | coating stage 32. As shown in FIG. The board | substrate W is transmitted to the output movement mounting part 4 arrange | positioned at the + X side of the exit floating stage 33. As shown in FIG.

The output movement mounting part 4 is equipped with the roller conveyor 41 and the rotation drive mechanism 42 which rotationally drives this roller conveyor 41. As shown in FIG. As the roller conveyor 41 rotates, the driving force in the + X direction is applied to the substrate W, and the substrate W is conveyed in the first direction D1. By the operation of the output movement mounting part 4, the board | substrate W is moved to the output conveyor 110 from the upper side of the exit floating stage 33.

The output conveyor 110 is equipped with the roller conveyor 111 and the rotation drive mechanism 112 which rotates this roller conveyor 111. As shown in FIG. By rotation of the roller conveyor 111, the board | substrate W is conveyed to + X direction and sent to the exterior of the coating device 1. The input conveyor 100 and the output conveyor 110 may be formed as part of the coating device 1, but may be separate from the coating device 1. For example, the input conveyor 100 may be a board | substrate conveyance mechanism of the separate unit provided in the upstream of the coating device 1. In addition, the output conveyor 110 may be a board | substrate accommodation mechanism of the other unit provided in the downstream of the coating device 1.

On the conveyance system of the board | substrate W, the application mechanism 6 which apply | coats a process liquid to the upper surface Wf of the board | substrate W is provided. The coating mechanism 6 includes a nozzle unit 60 including a nozzle 61 for discharging a processing liquid, a moving mechanism 63 for positioning the nozzle 61, and a maintenance unit 65 for maintaining the nozzle 61. ).

The nozzle 61 is a member extending in the second direction D2 (Y direction) which is a horizontal direction orthogonal to the first direction D1. The lower end of the nozzle 61 has a discharge port 611 extending in the width direction (Y direction) and opening downward (-Z side). The processing liquid is discharged from the discharge port 611.

The moving mechanism 63 moves the nozzle 61 in the X direction and the Z direction to position the nozzle 61. By the operation of the moving mechanism 63, the nozzle 61 is positioned at the application position L11 and the downstream position L12 above the application stage 32. Each horizontal position (position in the horizontal direction) of the application | coating position L11 and the downstream position L12 is set to the predetermined horizontal position. In the state where the nozzle 61 is positioned at the application position L11, the processing liquid is applied to the substrate W by discharging the processing liquid toward the upper surface Wf of the substrate W. As shown in FIG. In this way, the application position L11 is the position of the nozzle 61 at the time of performing the application. The downstream position L12 is a position separated from the application position L11 to the downstream side (+ X side).

The maintenance unit 65 includes a bat 651, a preliminary discharge roller 652, a nozzle cleaner 653, and a maintenance control mechanism 654. The bat 651 stores the cleaning liquid used for cleaning the nozzle 61. The maintenance control mechanism 654 controls the preliminary discharge roller 652 and the nozzle cleaner 653. As a structure of the maintenance unit 65, you may apply the structure of Unexamined-Japanese-Patent No. 2010-240550, for example.

The moving mechanism 63 positions the nozzle 61 at the preliminary ejection position L13 where the ejection opening 611 faces the surface of the preliminary ejection roller 652 above the preliminary ejection roller 652. The nozzle 61 discharges the processing liquid from the discharge port 611 to the surface of the preliminary discharge roller 652 at the preliminary discharge position L13 (preliminary discharge processing). The nozzle 61 is positioned at the preliminary ejection position L13 before positioning at the application position L11 described above, and performs the preliminary ejection process. Thereby, discharge of the process liquid to the board | substrate W can be stabilized from an initial stage. When the maintenance control mechanism 654 rotates the preliminary discharge roller 652, the processing liquid discharged from the nozzle 61 is mixed with the cleaning liquid stored in the bat 651 and recovered.

The movement mechanism 63 has the nozzle 61 with the cleaning position L14 which the front-end | tip part (it includes the discharge port 611 and the area | region near it) of the nozzle 61 opposes above the nozzle cleaner 653. Decide on your location. In the state where the nozzle 61 is in the washing position L14, the nozzle cleaner 653 is attached to the tip end of the nozzle 61 by moving in the width direction (Y direction) of the nozzle 61 while discharging the cleaning liquid. The treated liquid is washed away.

The moving mechanism 63 may position the nozzle 61 below the washing position L14 at a standby position where the lower end of the nozzle 61 is accommodated in the bat 651. When the coating process using the nozzle 61 is not performed in the coating device 1, the nozzle 61 may be positioned at the standby position. Although not shown, a standby pod may be provided to prevent drying of the processing liquid at the discharge port 611 of the nozzle 61 positioned at the standby position.

In FIG. 1, the nozzle 61 in the preliminary discharge position L13 is shown by the solid line, and the nozzle 61 in the application | coating position L11, the downstream position L12, and the washing position L14 is shown with the broken line, respectively.

Although the coating mechanism 6 of this embodiment is equipped with only one nozzle 61, you may be equipped with the some nozzle 61. As shown in FIG. The some nozzle 61 may be provided at intervals along the 1st direction D1. In this case, different processing liquids may be applied to the substrate W by supplying different processing liquids to the plurality of nozzles 61. In addition, you may form the moving mechanism 63 and the maintenance unit 65 corresponding to each nozzle 61, respectively. In addition, the maintenance unit 65 may make it possible to use two or more nozzles 61 in common.

As shown in FIG. 4, the nozzle unit 60 includes beam members 631 extending in the Y direction from above the floating stage 3, and both end portions (both ends) of the beam member 631. It has a crosslinked structure including two pillar members 632 and 633 to support. The pillar members 632 and 633 are formed to stand upward from the base 10. The lifting mechanism 634 is attached to the pillar member 632, and the lifting mechanism 635 is attached to the pillar member 633. Each lifting mechanism 634, 635 includes, for example, a ball screw mechanism. The lifting mechanism 634 is equipped with the + Y side end portion (the end on the + Y side) of the beam member 631, and the lifting mechanism 635 is equipped with the -Y side end portion (the end on the -Y side) of the beam member 631. The beam members 631 are supported by the elevating mechanisms 634 and 635. The lifting mechanisms 634 and 635 cooperate with the control command from the control unit 9 to move the beam member 631 in the vertical direction (Z direction) with the horizontal posture.

The nozzle 61 of the attitude | position which set the discharge port 611 downward is attached to the center lower part of the beam member 631. As shown in FIG. By operating the lifting mechanisms 634 and 635, the movement in the vertical direction (Z direction) of the nozzle 61 is realized.

The pillar members 632 and 633 are configured to be movable on the base 10. Two travel guides 81L and 81R extending in the X direction are formed at the + Y side end (the end of the + Y side) and the -Y side end (the end of the -Y side) on the upper surface of the base 10. . The pillar member 632 is engaged with the travel guide 81L on the + Y side through the slider 636 attached to the lower portion of the pillar member 632, and the pillar member 633 is connected to the pillar member 633. It engages with the traveling guide 81R on the side of -Y via the slider 637 mounted in the lower part. The sliders 636 and 637 can move freely in the X direction along the travel guides 81L and 81R.

The pillar members 632 and 633 move in the X direction by the operation of the linear motors 82L and 82R. The linear motors 82L and 82R include a magnet module as a stator and a coil module as a mover. The magnet module is formed in the base 10 and extends in the X direction. The coil module is attached to each lower part of the pillar members 632 and 633. The mover of the linear motors 82L and 82R operates in accordance with the control command from the control unit 9, so that the entire nozzle unit 60 moves along the X direction. As a result, the movement of the nozzle 61 in the X direction (first direction D1) is realized. The X direction positions (positions in the X direction) of the pillar members 632 and 633 are detected by the linear scales 83L and 83R formed in the vicinity of the sliders 636 and 637.

In this way, the nozzle 61 moves in the Z direction by the operation of the lifting mechanisms 634, 635, and moves in the X direction by the operation of the linear motors 82L and 82R. That is, by the control unit 9 controlling the lifting mechanisms 634 and 635 and the linear motors 82L and 82R, positioning of the nozzle 61 to each stop position L11, L12, L13, L14 is realized. . Therefore, the lifting mechanisms 634 and 635 and the linear motors 82L and 82R function as the moving mechanism 63.

As the maintenance unit 65, the thing of Unexamined-Japanese-Patent No. 2010-240550 may be employ | adopted. The bat 651 is supported by the beam member 661 extending in the Y direction. One of both ends of the beam member 661 is supported by the pillar member 662, and the other end is supported by the pillar member 663. The pillar members 662 and 663 are attached to both ends of the Y direction (both ends in the Y direction) of the plate 664 extending in the Y direction.

Below the both ends of the plate 664, two travel guides 84L and 84R extending in the X direction are formed, respectively. Two travel guides 84L and 84R are formed on the upper surface of the base 10. The slider 666 is formed in the + Y side edge part of the Y direction both ends of the lower surface of the plate 664, and the slider 667 is formed in the -Y side edge part. The sliders 666 and 667 are engaged with the traveling guides 84L and 84R and are free to move in the X direction.

The linear motor 85 is formed below the plate 664. The linear motor 85 includes a magnet module that is a stator and a coil module that is a mover. The magnet module is formed in the base 10 and extends in the X direction. The coil module is formed in the lower portion of the maintenance unit 65 (here, the plate 664).

The linear motor 85 operates according to the control command from the control unit 9, so that the entire maintenance unit 65 moves in the X direction. The X direction position of the maintenance unit 65 is detected by the linear scale 86 formed in the vicinity of the sliders 666 and 667.

As shown in FIG. 4, the chuck 51 includes two chuck members 51L and 51R. The chuck members 51L and 51R have shapes symmetrical with respect to the XZ plane, and are disposed apart in the Y direction.

The chuck member 51L disposed on the + Y side is supported by the travel guide 87L formed on the base 10 and extending in the X direction. The chuck member 51L includes two horizontal plate portions formed by different positions in the X direction, and a base portion 512 including a connecting portion for connecting these plate portions (see FIG. 2). The sliders 511 are formed one by one under the two plate portions of the base portion 512. The slider 511 is engaged with the travel guide 87L, whereby the chuck member 51L can travel in the X direction along the travel guide 87L.

On each of the upper portions of the two plate portions of the base portion 512, one support portion 513 is formed. The support part 513 is extended upward and has an adsorption pad (not shown) in the upper end part. When the base portion 512 moves in the X direction along the travel guide 87L, two support portions 513 move in the X direction integrally with this. In addition, the two plate portions of the base portion 512 are separated from each other, and by moving these plate portions while maintaining a constant distance in the X direction, the structure may function as an integral base portion apparently. If this distance is set in accordance with the length of the substrate, it becomes possible to correspond to substrates of various lengths.

The chuck member 51L moves in the X direction by the linear motor 88L. The linear motor 88L includes a magnet module that is a stator and a coil module that is a mover. The magnet module is formed in the base 10 and extends in the X direction. The coil module is formed below the chuck member 51L. The linear motor 88L operates in accordance with the control command from the control unit 9, so that the chuck member 51L moves along the X direction. The X direction position of the chuck member 51L is detected by the linear scale 89L formed in the vicinity of the travel guide 87L.

The chuck member 51R formed on the -Y side has a base portion 512 and two support portions 513 and 513, similarly to the chuck member 51L. The shape of the chuck member 51R is symmetrical with the chuck member 51L with respect to the XZ plane. One slider 511 is formed in the lower part of the two plate parts of the base part 512 of 51C of chuck members. The slider 511 is engaged with the travel guide 87R, whereby the chuck member 51R can travel in the X direction along the travel guide 87R.

The chuck member 51R is movable in the X direction by the linear motor 88R. The linear motor 88R includes a magnet module as a stator formed in the base 10 while extending in the X direction, and a coil module as a mover formed below the chuck member 51R. The linear motor 88R operates in accordance with the control command from the control unit 9, so that the chuck member 51R moves in the X direction. The X-direction position of the chuck member 51R is detected by the linear scale 89R formed in the vicinity of the travel guide 87R.

The control unit 9 performs these position control so that the chuck members 51L and 51R may always be the same position in the X direction. As a result, the pair of chuck members 51L and 51R move as an apparently integral chuck 51. Thereby, compared with the case where the chuck members 51L and 51R are mechanically engaged, interference between the chuck 51 and the floating stage 3 can be easily avoided.

As shown in FIG. 3, four support parts 513 are respectively disposed corresponding to four corners of the substrate W to be held. That is, the two support parts 513 of the chuck member 51L are the + Y side peripheral part (the peripheral part on the + Y side) of the substrate W, and the upstream end part (the upstream end part) in the first direction D1. The downstream ends (downstream ends) are respectively maintained. The two support parts 513 and 513 of the chuck member 51R are the -Y side peripheral part (the peripheral part of the -Y side) of the board | substrate W, and an upstream end part and a downstream end part in a 1st direction D1 are provided. Keep each. A negative pressure is supplied to the adsorption pad of each support part 513 as needed, and four corners of the board | substrate W are adsorbed-held from below by the chuck 51.

The substrate W is conveyed by the chuck 51 moving in the X direction while holding the substrate W. As shown in FIG. In this way, the mechanism (not shown) for supplying the negative pressure to the linear motors 88L and 88R and the respective support portions 513 functions as the adsorption / travel control mechanism 52 shown in FIG. 1.

As shown in FIG. 1 and FIG. 4, the chuck 51 is dropped above the upper surfaces of the inlet floating stage 31, the application stage 32, and the outlet floating stage 33 to hold the substrate W. As shown in FIG. The chuck 51 holds the lower surface of the substrate W and conveys the substrate W. As shown in FIG. The chuck 51 holds only a part of the periphery of the outer side in the Y direction (outer side in the Y direction) than the center portion of the substrate W that faces the stages 31, 32, and 33. For this reason, the center part of the board | substrate W was extended below the peripheral part. The floating stage part 3 controls the vertical position of the board | substrate W by giving a floating force to the center part of the board | substrate W of this state, and hold | maintains the board | substrate W in a horizontal attitude | position.

<Measurement machine>

The coating device 1 includes a plurality of measuring devices 70 (here two). The measuring device 70 measures the vertical position of the upper surface Wf of the substrate W to which the floating force is applied by the floating stage 3. In detail, the measuring device 70 measures the vertical position of the upper surface Wf by measuring the distance from the reference position of the vertical direction already determined to the vertical position of the upper surface Wf.

From the vertical position of the upper surface Wf measured by the measuring device 70, the height of the upper surface Wf based on the height (vertical position) of the upper surface of the application stage 32 can be calculated | required. In addition, it is possible to determine the floating amount of the substrate W (the distance from the upper surface of the coating stage 32 to the lower surface of the floating substrate W) from the height of the upper surface Wf and the thickness of the substrate W. FIG. .

Each measuring device 70 includes a light transmitting unit 70a for outputting light having a predetermined wavelength, and an optical sensor (for example, a line sensor) for detecting light reflected from the light emitting unit 70a and reflected from the substrate W. It includes a light receiving portion 70b including (see FIG. 7). In this way, each measuring device 70 includes a reflective sensor that can measure the vertical position of the upper surface Wf in a non-contact manner.

In addition, the vertical position of the upper surface Wf may be measured by ultrasonic waves instead of being measured by light. In this case, each measuring device 70 should just be equipped with the output part which outputs an ultrasonic wave, and the detection part which detects the ultrasonic wave reflected from the upper surface Wf.

Each measuring device 70 is connected to the nozzle 61 via a connector 72. Of the both end portions (end portions on both sides in the X direction) of the connector 72, one end portion (end portion on the + X side) has a structure that can be attached to an upstream side surface (side surface on the upstream side) of the nozzle 61, The other end (end of the side on the -X side) has a structure which can be attached to the measuring device 70. Each measuring device 70 is disposed on the upstream side (-X side) rather than the nozzle 61 by being supported by the connector 72.

Since each measuring device 70 is connected to the nozzle 61 via the connector 72, it moves following the nozzle 61 and moves. That is, when the nozzle 61 moves in the horizontal direction or the vertical direction by the moving mechanism 63, each measuring device 70 also follows this and moves in the same direction.

In this embodiment, each measuring device 70 is positioned at the measurement positions L21a and L21b and the upstream positions L22a and L22b above the application stage 32 by the operation of the movement mechanism 63 ( 8). The horizontal positions of each of the measurement positions L21a and L21b and the upstream positions L22a and L22b are set to already defined horizontal positions. In the state where each measuring device 70 is positioned at the measuring positions L21a and L21b, each measuring device 70 measures the vertical position of the upper surface Wf of the substrate W. As shown in FIG. The upstream positions L22a and L22b are positions separated from the measurement positions L21a and L21b to the upstream side (-X side) in the first direction D1. In this embodiment, when the nozzle 61 is arrange | positioned in the downstream position L12, each measuring device 70 is arrange | positioned in the measurement positions L21a and L21b, and when the nozzle 61 is arrange | positioned in the application | coating position L11, each measuring instrument 70 is disposed at the upstream positions L22a and L22b (see FIG. 8).

The connector 72 may directly connect the measuring device 70 to the nozzle 61 as in the present embodiment, but may also indirectly connect the measuring device 70 to the nozzle 61 via another member. For example, the connector 72 may have a structure which can be attached to the beam member 631 to which the nozzle 61 is mounted. In this case, the connector 72 connects the measuring device 70 to the nozzle 61 via the beam member 631.

As shown in FIG. 6, the two measuring devices 70 are formed at intervals shorter than the width (length in the width direction) of the substrate W in the second direction D2. By providing these two measuring devices 70, it is possible to measure the vertical position of two points which differ in the width direction in the board | substrate W. As shown in FIG. In addition, the number of the measuring instruments 70 is not limited to two, may be single, or may be three or more.

7 is a schematic block diagram showing the control unit 9 of the embodiment. The coating device 1 includes a control unit 9 for controlling the operation of each part. The hardware configuration of the control unit 9 may be the same as a general computer. The control unit 9 displays a CPU 91 that performs various arithmetic processing, a ROM that is a read-only memory that stores basic programs, a memory 92 that can freely read and write various kinds of information, and various kinds of information. And a display unit 93 including a display. The memory 92 includes, in addition to the main memory device (RAM), a fixed disk for storing control applications (programs), data, and the like. The control unit 9 reads information (programs) stored in an interface unit responsible for exchanging information with a user or an external device, and in a storage medium (optical media, magnetic media, semiconductor memory, etc.) having portable properties. You may be provided with a reading apparatus.

As will be described later, the CPU 91 of the control unit 9 is operated in accordance with a program so that the vertical position of two points on the upper surface Wf of the substrate W measured by the two measuring devices 70 is reduced. Get the difference between positions. In this way, the CPU 91 functions as a difference acquisition unit. In addition, the difference acquisition unit may be configured by a dedicated circuit.

FIG. 8: is a figure which shows each process of the substrate processing operation which the coating apparatus 1 of embodiment performs. First, the substrate processing operation includes a conveyance step S11 as shown in FIG. 8A. In conveyance process S11, the control unit 9 controls the conveyance mechanism 5, and the board | substrate W by which the floating force is provided from the floating stage part 3 (henceforth a "floating substrate W" is called.) It conveys toward the downstream side (+ X direction) of 1st direction D1. In other words, at this time, the upper surface Wf (first main surface) of the floating substrate W is upward in the vertical direction, and the floating force from the floating stage portion 3 on the lower surface (second main surface) of the floating substrate W. Is given.

As shown to FIG. 8 (b), conveyance process S11 includes the stop step S111. In the stop step S111, the control unit 9 controls the conveying mechanism 5, conveys the floating substrate W to the already defined position LW1, and moves the floating substrate W at the already defined position LW1. Stop it.

Here, the floating board | substrate W arrange | positioned at the predetermined position LW1 spans the application | coating stage 32 and the entrance floating stage 31. As shown in FIG. In addition, the horizontal position (position in the horizontal direction) of the upstream end (upstream end) of the floating substrate W that is already disposed at the predetermined position LW1 is upstream from the center of the application stage 32. Has become.

As shown in FIG.8 (b), the measurement process S12 is performed in the state in which the floating board | substrate W has stopped in the position LW1 already determined by the stop step S111. Measuring step S12 is a step in which each measuring device 70 measures the vertical position of the floating substrate W. FIG. Each measuring device 70 measures the vertical position at the measurement horizontal position XM1 in the floating substrate W. As shown in FIG. The measurement horizontal position XM1 is in the first direction D1 (X direction) of the region in which each measuring device 70 arranged at the measurement positions L21a and L21b measures the vertical position of the floating substrate W. Is the horizontal position. Here, the measurement horizontal position XM1 is in the application | coating stage 32 (here, the center position of the 1st direction D1 in the application | coating stage 32) which can hold | maintain the floating board | substrate W in a precise perpendicular position. It is set. In this embodiment, since a vertical position is measured with respect to the floating board | substrate W of the stationary state, it can measure with a more accurate precision than the case where the floating board | substrate W which is moving is made into object.

After measurement process S12, the 1st determination process which the control unit 9 determines whether there exists an abnormality with respect to the perpendicular position of the floating board | substrate W which each measuring device 70 measured may be performed. When the value of the vertical position of the floating board | substrate W measured by each measuring device 70 is set to A1 and A2, it is determined whether these values A1 and A2 are already within a predetermined reference range in the first determination step. It is preferable. When either of the values A1 and A2 or both are out of the reference range, the control unit 9 may notify the outside of the effect by the predetermined output means (the display unit 93, the lamp, the speaker, or the like). . In addition, the control unit 9 may stop the operation | movement of the coating device 1 so that an operator can confirm at this time.

The reason why the vertical position of the floating substrate W is abnormal is, for example, the floating substrate due to clogging in any of the plurality of jet ports 321h or the plurality of suction ports 322h formed on the upper surface of the application stage 32. The abnormality of the wound amount of (W) can be considered. In addition, as another reason, the thickness of the floating substrate W or more (in addition to the thickness of the floating substrate W itself or more, includes an ideal of physically varying the vertical position of the upper surface Wf of the floating substrate W). I can think of it. By detecting the abnormality of the vertical position of the floating substrate W, generation | occurrence | production of the application | coating defect of the processing liquid on the floating substrate W can be suppressed. Further, by measuring the vertical positions of the floating substrate W at a plurality of points different from each other in the second direction D2 by the measuring device 70, clogging occurs in the plurality of jets 321h or the plurality of suction ports 322h. It is possible to easily specify a region or a portion of the floating substrate W where a thickness or more is generated.

After the measuring process S12, the control unit 9 calculates a difference value from the values A1 and A2 of the vertical position of the floating substrate W measured by each measuring device 70, and determines whether the difference value is within the reference range. A second determination step of determining may be performed. To the difference value, the value of the difference between the value A1 and the value A2 can be applied. By acquiring the difference value, it is possible to easily specify the point where the vertical position is strange. In the second determination step, when the control unit 9 determines that the difference value is outside the reference range, the control unit 9 may notify the outside to the effect by a predetermined output means. In addition, the control unit 9 may stop the operation | movement of the coating device 1 so that an operator may confirm.

When the measurement process S12 is completed, as shown to FIG. 8 (c), the control unit 9 performs the movement process S13. The moving step S13 includes a measuring device moving step S131 and a nozzle moving step S132. In the measuring device moving step S131, the moving mechanism 63 moves each measuring device 70 toward the upstream positions L22a and L22b, which are positions different from the measuring positions L21a and L21b. In the nozzle movement step S132, the movement mechanism 63 causes the nozzle 61 to approach the measurement horizontal position XM1 from the downstream position L12.

Here, each measuring device 70 is connected to the upstream side of the nozzle 61 by the connection port 72, respectively. For this reason, by the movement mechanism 63, the nozzle movement step S132 which makes the nozzle 61 approach the measurement horizontal position XM1 of the upstream from the downstream position L12 is performed, and each measuring device 70 moves to an upstream side. The moving measuring instrument moving step S131 is also executed in parallel.

At this time, the horizontal position in the first direction D1 of the discharge port 611 of the nozzle 61 coincides with the measurement horizontal position XM1.

When the moving step S13 is completed, as shown in FIG. 8 (d), the coating step S14 is performed. In the coating step S14, the nozzle 61 discharges the processing liquid from the discharge port 611, the processing liquid is supplied to the upper surface Wf of the floating substrate W, and the conveying mechanism 5 is the floating substrate W. Is conveyed in the first direction D1. Thereby, the process liquid is apply | coated in the area | region of the prescribed width in the 2nd direction D2 among the upper surface Wf of the floating board | substrate W. As shown in FIG.

As shown in FIG.8 (c), in this case, when each measuring device 70 reaches the predetermined upstream position L22a, L22b by the movement process S13, the 1st direction of the discharge port 611 of the nozzle 61 will be carried out here. The horizontal position in (D1) coincides with the measurement horizontal position XM1. Here, since the discharge port 611 of the nozzle 61 is opened vertically downward, the process liquid is discharged vertically downward. Then, the attachment horizontal position which is the horizontal position of the 1st direction D1 which the process liquid discharged from the nozzle 61 adheres to the upper surface Wf of the floating board W is corresponded with the measurement horizontal position XM1 ( Overlaps the vertical direction). Thus, in this embodiment, since the processing liquid can be supplied to the floating substrate W in the area where the vertical position of the floating substrate W is measured, the processing liquid can be applied to the floating substrate W well. Can be.

In addition, it is not essential to make the attachment horizontal position coincide with the measurement horizontal position XM1. The adhesion horizontal position may be set near the measurement horizontal position XM1 (in a constant region centered on the measurement horizontal position XM1).

9 is a diagram illustrating a modification of the operation of the coating device 1 of the embodiment. In this modification, in the movement process S13, after the measuring instrument movement step S131 and the nozzle movement step S132 (refer FIG. 8 (c)), as shown in FIG. 9, nozzle vertical position adjustment step S133 is implemented.

In the nozzle vertical position adjusting step S133, the vertical position of the nozzle 61 is adjusted in accordance with the vertical position of the floating substrate W measured by each measuring device 70. In the nozzle vertical position adjusting step S133, the CPU 91 of the control unit 9 calculates the vertical position of the upper surface Wf from the measurement result of each measuring device 70 by a predetermined calculation. As a method of calculating the vertical position, for example, when the value of the vertical position of the floating substrate W measured by the two measuring devices 70 is A1, A2, the average value of these values A1, A2 is floated. What is necessary is just to make it the perpendicular position of the board | substrate W. Alternatively, one of the values may be the vertical position of the floating substrate W. FIG. The control unit 9 controls the lifting mechanisms 634 and 635 to raise and lower the beam member 631 so that the nozzle 61 is disposed at a suitable vertical position with respect to the vertical position of the obtained floating substrate W. FIG. When the nozzle vertical position adjusting step S133 is completed, as shown in Fig. 8 (d), it is preferable that the coating step S14 is performed.

By the nozzle vertical position adjusting step S133, the vertical position of the nozzle 61 can be optimized in accordance with the vertical position of the floating substrate W. FIG. Thereby, since the processing liquid can be supplied to the floating substrate W from the optimum vertical position, the processing liquid can be favorably applied to the floating substrate W. FIG.

In addition, nozzle vertical position adjustment step S133 may be performed before nozzle movement step S132 which moves the nozzle 61 to an upstream (here, before meter movement step S131), and parallel to nozzle movement step S132 (here, a measuring instrument here). Parallel to the movement step S131). In the latter case, when it is necessary to adjust the vertical position of the nozzle 61, the nozzle 61 is moved in the combined direction of the horizontal direction and the vertical direction.

FIG. 10: is a figure which shows the modification of the operation | movement of the coating apparatus 1 of embodiment. In this modification, in the measuring device moving step S131, the vertical position of the floating substrate W is measured while the measuring devices 70 move from the measuring positions L21a and L21b to the upstream positions L22a and L22b. . In this case, in the horizontal range from the measurement horizontal position XM1 to the predetermined position on the upstream side, the vertical position of the floating substrate W in which the processing liquid is uncoated can be measured. A third determination step in which the control unit 9 determines whether there is an abnormality in the vertical position of the floating substrate W in this horizontal range may be performed. For example, it is preferable that the control unit 9 determines whether or not the vertical position at all points measured by each measuring device 70 is within a predetermined reference range. In addition, the control unit 9 may determine the difference value of the vertical position of the floating substrate W between the different points in the first direction D1 and determine whether the difference value is within a predetermined reference range.

In this embodiment, the nozzle 61 and each measuring device 70 are connected by the connector 72, and the moving mechanism 63 can move them integrally in the horizontal direction and the vertical direction. However, the nozzles 61 and the measuring devices 70 may be separated from each other, and the moving mechanism may be moved separately so as not to interfere with each other. However, as in the present embodiment, the structure of the moving mechanism can be simplified by connecting each measuring device 70 with respect to the nozzle 61 and integrally moving.

Although this invention was demonstrated in detail, the said description is an illustration in all the aspects, This invention is not limited to it. It is construed that numerous modifications not illustrated are contemplated without departing from the scope of this invention. Each structure described by each said embodiment and each modified example can be combined suitably, or abbreviate | omitted unless there is a contradiction.

One ; Coating device (substrate processing device)
3; Floating Stage (Injury Mechanism)
32; Application stage
31h, 321h, 33h; vent
322h; Suction port
5; Conveying mechanism
51; chuck
52; Adsorption, running control mechanism
6; Applicator
61; Nozzle
611; Outlet
63; Moving mechanism
634, 635; Lifting mechanism
70; Measuring instrument
70a; Floodlight
70b; Receiver
72; Connector
88L, 88R; Linear motor
9; Control unit
91; CPU
D1; First direction
D2; Second direction
L11; Application location
L12; Downstream position
L21a, L21b; Measuring position
L22a, L22b; Upstream position
LW1; Already defined location
S11; Conveying process
S111; Stop phase
S12; Measuring process
S13; Moving process
S131; Meter move step
S132; Nozzle moving stage
S133; Nozzle Vertical Positioning Step
S14; Application process
W; Board, Floating Board
Wf; Top face (first face)
XM1; Measuring horizontal position

Claims (15)

A substrate processing apparatus for processing a substrate having a first main surface and a second main surface,
A floating mechanism for applying a floating force to the substrate having the first main surface upward in the vertical direction;
A conveying mechanism for moving the floating substrate, which is the substrate to which the floating force is applied, in a first direction in a horizontal direction;
A nozzle having a discharge port extending in a second direction, which is a horizontal direction orthogonal to the first direction, and capable of discharging the processing liquid from the discharge port toward the first main surface of the floating substrate;
A measuring device for measuring a vertical position of the first main surface of the floating substrate;
The nozzle so that the attachment horizontal position, which is a horizontal position at which the processing liquid from the nozzle attaches to the floating substrate, is close to a measurement horizontal position that is a horizontal position of an area where the measuring device measures the vertical position of the floating substrate in advance; And a moving mechanism for moving the measuring device. The method of claim 1,
The moving mechanism moves the nozzle and the measuring device such that the attachment horizontal position coincides with the measurement horizontal position. The method according to claim 1 or 2,
The injury mechanism,
A stage having an upper surface,
A plurality of ejection openings formed on the upper surface, for ejecting air toward the upper side in the vertical direction;
It is formed in the said upper surface, The substrate processing apparatus containing the some suction port which sucks the air of the upper side of the said vertical direction. The method according to claim 1 or 2,
The moving mechanism is capable of moving the nozzle to a position away from the application position in a horizontal direction while positioning the nozzle at an application position that is a predetermined horizontal position. The method according to claim 1 or 2,
And the moving mechanism is capable of moving the measuring device to a position away from the measuring position in a horizontal direction while positioning the measuring device at a measuring position which is a predetermined horizontal position. The method according to claim 1 or 2,
Further provided with a connector for connecting the nozzle and the measuring instrument,
And the movement mechanism integrally moves the nozzle and the meter connected by the connector. The method of claim 6,
The connector connects the measuring device to an upstream side in the first direction with respect to the nozzle,
The moving mechanism moves the nozzle and the measuring device to the upstream side in the first direction. The method according to claim 1 or 2,
And the measuring device includes a reflective sensor that detects light reflected from the first main surface of the floating substrate. The method according to claim 1 or 2,
The conveyance mechanism is stopped after moving the floating substrate to a predetermined position,
The moving mechanism moves the measuring device that measured the vertical position at the measurement horizontal position of the floating substrate to another position while the floating substrate is stopped at the predetermined position. A substrate processing apparatus, which approximates a measurement horizontal position. The method of claim 9,
The said moving mechanism moves the said measuring device which measured the vertical position in the said measurement horizontal position of the said floating board stopped at the said predetermined position to the position of the upstream of a said 1st direction,
The measuring device measures the vertical position of the floating substrate while moving toward the position on the upstream side in the first direction. The method according to claim 1 or 2,
The said moving mechanism changes the vertical position of the said nozzle according to the vertical position of the said floating substrate measured by the said measuring device. The method according to claim 1 or 2,
A plurality of said measuring devices are formed at intervals in said second direction,
The plurality of measuring devices can measure vertical positions of a plurality of points that are different in the second direction on the floating substrate. The method of claim 12,
The substrate processing apparatus further equipped with the difference acquisition part which acquires the difference value of the perpendicular position of the said several points measured by the said some measuring machine. A substrate processing method for processing a substrate having a first main surface and a second main surface,
A conveying step of moving the floating substrate, which is the substrate to which the floating force is applied, in the state in which the first main surface is upward in the vertical direction, in the first direction in the horizontal direction;
A measuring step of measuring a vertical position of the first main surface of the floating substrate;
An application step of supplying a processing liquid from a nozzle to the first main surface of the floating substrate that is moved in the first direction after the measurement step;
After the measuring step and before the coating step, the horizontal position where the treatment liquid adheres to the floating substrate is the horizontal position of the area where the measuring device previously measured the vertical position of the floating substrate in the measuring step. And a moving step of moving the nozzle and the measuring device so as to be close to the measuring horizontal position which is the position. The method of claim 14,
The conveying process includes moving the floating substrate to a predetermined position and then stopping,
The moving step,
Moving the measuring device that has measured the vertical position in the measurement horizontal position to another position while the floating substrate is stopped at the predetermined position;
And bringing the nozzle close to the measurement horizontal position while the floating substrate is stationary at the already predetermined position.

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