JP2007111612A - Coating method and coating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable an easy decision of the most suitable priming position wherein, to carry out a priming treatment, a discharge opening of a nozzle and a crowning of a priming roller are correctly faced in the predetermined positional relationship. <P>SOLUTION: When a positioning of the priming is carried out, a resist nozzle 78 is moved in a horizontal direction (X direction) perpendicular to a nozzle longitudinal direction above the priming roller 188 by a nozzle elevation mechanism and a nozzle horizontal conveyance mechanism. At that time, an optical distance sensor 162 attached integrally to the resist nozzle 78 is operated to measure a distance from an outer peripheral surface of the priming roller 188 at each position where the resist nozzle 78 moves, by which the shortest measured distance d on the move is asked. The priming position is decided based on the position where the minimum distance measured value d is obtained. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a coating method and a coating apparatus for forming a liquid coating film on a substrate to be processed by a spinless method using a long nozzle.

  In photolithography in the manufacturing process of a flat panel display (FPD) such as an LCD, a long resist nozzle having a slit-like discharge port is scanned to apply a resist solution onto a substrate to be processed (glass substrate or the like). The spinless method is often used.

  In the spinless method, as disclosed in, for example, Patent Document 1, a substrate is horizontally placed on a suction-holding type placement table or stage, and the substrate on the stage and the discharge port of the long resist nozzle are placed between them. For example, a small application gap of about 100 μm is set, and the resist nozzle is moved in the scanning direction (generally in the horizontal direction perpendicular to the longitudinal direction of the nozzle) above the substrate, and the resist solution is discharged onto the substrate in a band shape. By simply moving the long resist nozzle once from one end to the other end of the substrate, the resist coating film can be formed on the substrate with a desired film thickness without dropping the resist solution outside the substrate.

  In such a spinless method, in order to prevent unevenness of coating thickness of the resist coating film and coating unevenness, the resist solution discharged onto the substrate during coating scanning rotates to the back side of the resist nozzle in the scanning direction. It is desirable that the meniscus formed in this way be aligned horizontally in the longitudinal direction of the nozzle, and for this purpose, the coating gap between the discharge port of the resist nozzle and the substrate is closed with an appropriate amount of resist solution immediately before the start of coating scanning. Is a necessary condition. In order to satisfy this requirement, a priming process for forming a liquid film of a resist solution on the lower end portion (especially the lower end portion of the back surface) of the resist nozzle is performed as a preparation for coating scanning.

  A typical priming treatment method is to install a cylindrical priming roller having a length equal to or longer than that of the resist nozzle near the stage, and register the resist to a position facing the outer peripheral surface of the priming roller through a small gap. The nozzle is brought close to discharge the resist solution, and at the same time, the priming roller is rotated in a predetermined direction. Then, the resist solution coming out from the discharge port of the resist nozzle wraps around the lower back of the nozzle and is wound around the priming roller, and after the resist solution is stopped and the resist nozzle is released from the priming roller, A liquid film of the resist solution remains. The resist nozzle that has been subjected to the priming process is moved above the substrate and lowered to a height position where the coating gap is formed between the substrate and the substrate at the coating start position.

FIG. 29 shows a state when the resist nozzle that has finished the priming process is lowered to the application start position. As shown in the figure, the liquid film 202 of the resist solution adhering to the lower end of the back surface of the resist nozzle 200 adheres to the substrate G so as to close the coating gap of the set size d in a bead shape. From this state, discharge of the resist solution from the resist nozzle 200 is started, and horizontal movement in the scanning direction (direction of arrow X in FIG. 25) is started. Then, the resist solution comes out in a strip shape from the discharge port of the resist nozzle 200, and a convex meniscus is smoothly formed at the lower part of the back of the nozzle. The other end of the substrate G from the one end (application start position) as the resist nozzle scans. A coating film of a resist solution is applied flat toward the surface.
JP-A-10-156255

  In the priming process as described above, it is important that the discharge port of the resist nozzle and the top of the priming roller face each other in parallel, and a gap with an appropriate interval (for example, 100 μm) is formed between them. When the resist nozzle discharge port is shifted to the left or right from the top of the priming roller, or when the gap size is deviated from the optimum value, the resist solution liquid film should be uniformly and uniformly formed along the resist nozzle discharge port. As a result, it becomes difficult to stably and successfully form a bead of the resist liquid film in the coating gap between the resist nozzle and the substrate at the coating start position.

  Usually, the priming roller is arranged at a fixed position, and the resist nozzle is moved from the application region to the position of the priming roller. The resist nozzle is a replacement part, and is detachably attached to a nozzle support coupled to a nozzle lifting mechanism and a nozzle horizontal movement mechanism. Therefore, when the registration nozzle is replaced, the positioning of the newly installed registration nozzle with respect to the priming roller is adjusted. Conventionally, in this positioning adjustment work, in order to adjust the gap formed between the discharge port of the resist nozzle and the top of the priming roller to the set interval, adjustment is performed with a jig such as a shim interposed between the gaps. , It took manpower. For this reason, not only does the positioning adjustment take a long time, but there is also a risk of work.

  The present invention has been made in view of such problems of the prior art, and specially determines the optimum priming position where the nozzle outlet and the top of the priming roller are correctly opposed in a predetermined positional relationship for the priming process. An object of the present invention is to provide a spinless coating method and a coating apparatus which can be easily determined without requiring manual labor.

  In order to achieve the above object, the coating method of the present invention is applied to a long coating nozzle used for a spinless coating process at a lower end of the nozzle at a predetermined priming position for preparation of the coating process. The discharge port and the top of the cylindrical priming roller face each other with a desired gap therebetween, and the processing liquid is discharged from the nozzle while rotating the priming roller. After the discharge is completed, the processing liquid is discharged to the lower end of the nozzle. A coating method for performing a priming process for forming a liquid film, wherein a sensor for detecting a relative position or distance with respect to an object directly below is provided on the nozzle side, and the nozzle and the sensor are disposed on the priming roller. Relative movement across the priming roller horizontally across the priming roller between the sensor and the priming roller Distance interval detects a specific position becomes minimum, determines the priming position based on the specific position.

  Further, the coating apparatus of the present invention includes a stage that supports the substrate to be processed substantially horizontally, and a long length that discharges the processing liquid from above to the substrate on the stage in order to apply the processing liquid on the substrate. A mold application nozzle, a horizontal moving unit that moves the application nozzle relative to the substrate in a first horizontal direction perpendicular to the longitudinal direction of the nozzle, and the application nozzle in a vertical direction with respect to the substrate. A lifting part to be relatively moved, and a discharge port at the lower end of the nozzle and a top part of the cylindrical priming roller face each other with a desired gap at a predetermined priming position for preparation for the coating process, A priming processing section that discharges the processing liquid from the nozzle while rotating the priming roller, and forms a liquid film of the processing liquid on the lower end of the nozzle after the discharge ends, and an object directly below A sensor provided integrally with the nozzle for detecting a relative position or distance to be moved, and the nozzle and the sensor are moved relative to the priming roller so as to cross horizontally above the priming roller. And a priming position determining unit that detects a specific position at which a distance between the sensor and the priming roller is minimized and determines the priming position based on the specific position.

  In the present invention, a sensor for detecting a relative position or distance with respect to an object directly below is provided on the nozzle side, and this sensor is moved relative to the priming roller together with the nozzle so as to cross horizontally above the priming roller. The specific position where the distance between the priming roller and the priming roller is minimized is detected. For example, when an optical distance sensor is used for this sensor, the distance between the priming roller is measured at each moving position, and the position where the minimum distance measurement value can be obtained is set as the specific position. it can. Or if it is an optical position sensor which can detect the light intensity of reflected light, the position where the reflected light intensity of the maximum level is obtained can be made into a specific position. Since the relative position of the sensor with respect to the nozzle is known, an optimum priming position for correctly facing the nozzle to the top of the priming roller during the priming process can be obtained from the specific position and the relative position.

  According to a preferred aspect of the present invention, in order to position the nozzle relative to the priming position relative to the priming roller, the rotation axis of the priming roller is disposed at a predetermined fixed position, and the nozzle is arranged in a vertical first direction. It is possible to move in the direction and the horizontal second direction orthogonal to the nozzle longitudinal direction. In this case, the nozzle accesses the stationary priming roller, is positioned at the priming position, and the priming process is performed. Alternatively, as another aspect, the nozzle may be movable in a first vertical direction, and the rotation axis of the priming roller may be movable in a second horizontal direction perpendicular to the longitudinal direction of the nozzle at a predetermined height position. . In this case, the nozzle is positioned at a predetermined position in the vertical direction corresponding to the height position of the priming roller, and the priming roller is moved closer to the horizontal direction and positioned at the predetermined position. That is, in priming alignment, the priming position is determined for the nozzle in the vertical direction, and the priming position is determined for the priming roller in the horizontal direction.

  According to a preferred aspect of the present invention, a pair of the sensors are provided on both ends in the longitudinal direction of the nozzle, and the first and second positions at which the distance between the sensors and the priming roller are minimized. And the priming position is determined based on the first and second positions. When there is a horizontal inclination between the nozzle and the priming roller, the nozzle position (first and second) when the sensors on the left and right sides detect the minimum distance interval (that is, the distance interval from the top of the priming roller). ) Position does not match. The degree of this mismatch is proportional to the magnitude of the slope.

  According to a preferred aspect of the present invention, the difference between the first position and the second position in the horizontal direction orthogonal to the longitudinal direction of the nozzle is obtained, and at least the nozzle and the priming roller are so canceled as to cancel the difference. One side is displaced in a direction substantially rotating in a horizontal plane.

  According to a preferred aspect of the present invention, the difference between the first distance measured at the first position and the second distance measured at the second position in the vertical direction is obtained, In order to cancel this difference, at least one of the nozzle and the priming roller is displaced in a direction that substantially rotates in the vertical plane.

  In this invention, the structure which attaches the said sensor directly to a nozzle may be sufficient, or the structure which attaches a nozzle and a sensor separately to a common support body is also possible.

  In the individual case, the sensor is generally semi-permanently attached to the support, and the nozzle is detachably attached to the support as a replacement part. For this reason, it is easy to produce a shift | offset | difference in the attachment position of a nozzle. According to a preferred aspect of the present invention, an inspection for confirming the relative positional relationship of the nozzle with respect to the support is performed before the priming alignment. According to a preferred aspect, this inspection is performed by positioning the nozzle at a reference position set above the stage using a position sensor or a distance sensor attached to the stage side for supporting the substrate substantially horizontally for performing the coating process. And a step of reading the position of the support at that time.

  According to the coating method or the coating apparatus of the present invention, the optimum priming position where the nozzle discharge port and the top of the priming roller are correctly opposed to each other in a predetermined positional relationship for the priming process by the configuration and operation as described above. It can be easily determined without requiring special jigs such as shims or manpower.

  A preferred embodiment of the present invention will be described below with reference to FIGS.

  FIG. 1 shows a coating and developing treatment system as a configuration example to which the coating method and the coating apparatus of the present invention can be applied. This coating / development processing system is installed in a clean room and uses, for example, an LCD substrate as a substrate to be processed, and performs cleaning, resist coating, pre-baking, development, and post-baking in the photolithography process in the LCD manufacturing process. is there. The exposure process is performed by an external exposure apparatus (not shown) installed adjacent to this system.

  This coating and developing system is roughly divided into a cassette station (C / S) 10, a process station (P / S) 12, and an interface unit (I / F) 14.

  A cassette station (C / S) 10 installed at one end of the system includes a cassette stage 16 on which a predetermined number, for example, four cassettes C for storing a plurality of substrates G can be placed, and a side on the cassette stage 16. And a transport path 17 provided in parallel with the arrangement direction of the cassette C, and a transport mechanism 20 that is movable on the transport path 17 and that allows the substrate C to be taken in and out of the cassette C on the stage 16. The transport mechanism 20 has a means for holding the substrate G, for example, a transport arm, can be operated with four axes of X, Y, Z, and θ, and is transported on the process station (P / S) 12 side described later. And the substrate G can be transferred.

  The process station (P / S) 12 includes, in order from the cassette station (C / S) 10 side, a cleaning process unit 22, a coating process unit 24, and a development process unit 26, a substrate relay unit 23, a chemical solution supply unit 25, and It is provided in a horizontal row via (spaced) the space 27.

  The cleaning process unit 22 includes two scrubber cleaning units (SCR) 28, an upper and lower ultraviolet irradiation / cooling unit (UV / COL) 30, a heating unit (HP) 32, and a cooling unit (COL) 34. Contains.

  The coating process unit 24 includes a spinless resist coating unit (CT) 40, a vacuum drying unit (VD) 42, an upper and lower two-stage adhesion / cooling unit (AD / COL) 46, and an upper and lower two-stage heating / cooling. A unit (HP / COL) 48 and a heating unit (HP) 50 are included.

  The development process unit 26 includes three development units (DEV) 52, two upper and lower two-stage heating / cooling units (HP / COL) 53, and a heating unit (HP) 55.

  Conveying paths 36, 51, and 58 are provided in the longitudinal direction in the center of each process unit 22, 24, and 26, and the conveying devices 38, 54, and 60 move along the conveying paths 36, 51, and 58, respectively. Each unit in the process unit is accessed to carry in / out or carry the substrate G. In this system, in each process part 22, 24, 26, a liquid processing unit (SCR, CT, DEV, etc.) is disposed on one side of the transport paths 36, 51, 58, and heat treatment is performed on the other side. System units (HP, COL, etc.) are arranged.

  The interface unit (I / F) 14 installed at the other end of the system is provided with an extension (substrate transfer unit) 56 and a buffer stage 57 on the side adjacent to the process station 12, and is transported to the side adjacent to the exposure apparatus. A mechanism 59 is provided. The transport mechanism 59 is movable on the transport path 19 extending in the Y direction, and is used to load and unload the substrate G with respect to the buffer stage 57, and to extend from the extension (substrate transfer unit) 56 and the adjacent exposure device. The substrate G is transferred.

  FIG. 2 shows a processing procedure in this coating and developing processing system. First, in the cassette station (C / S) 10, the transport mechanism 20 takes out one substrate G from a predetermined cassette C on the stage 12 and transports it to the cleaning process unit 22 of the process station (P / S) 12. It is passed to the device 38 (step S1).

  In the cleaning process section 22, the substrate G is first sequentially carried into an ultraviolet irradiation / cooling unit (UV / COL) 30, subjected to dry cleaning by ultraviolet irradiation in the first ultraviolet irradiation unit (UV), and then subjected to the next cooling unit ( In COL), the temperature is cooled to a predetermined temperature (step S2). This UV cleaning mainly removes organic substances on the substrate surface.

  Next, the substrate G is subjected to a scrubbing cleaning process by one of the scrubber cleaning units (SCR) 28 to remove particulate dirt from the substrate surface (step S3). After the scrubbing cleaning, the substrate G is subjected to dehydration treatment by heating in the heating unit (HP) 32 (step S4), and then cooled to a constant substrate temperature by the cooling unit (COL) 34 (step S5). Thus, the pretreatment in the cleaning process unit 22 is completed, and the substrate G is transferred to the coating process unit 24 by the transfer device 38 via the substrate transfer unit 23.

  In the coating process unit 24, the substrate G is first sequentially carried into an adhesion / cooling unit (AD / COL) 46, and undergoes a hydrophobic treatment (HMDS) in the first adhesion unit (AD) (step S6). The cooling unit (COL) cools to a constant substrate temperature (step S7).

  Thereafter, the substrate G is coated with a resist solution by a spinless method in a resist coating unit (CT) 40, and then subjected to a drying process by reduced pressure in a reduced pressure drying unit (VD) 42 (step S8).

  Next, the substrate G is sequentially carried into the heating / cooling unit (HP / COL) 48, and the first heating unit (HP) performs baking after coating (pre-baking) (step S9), and then the cooling unit ( COL) to cool to a constant substrate temperature (step S10). In addition, the heating unit (HP) 50 can also be used for baking after this application | coating.

  After the coating process, the substrate G is transported to the interface unit (I / F) 14 by the transport device 54 of the coating process unit 24 and the transport device 60 of the development process unit 26, and is passed from there to the exposure apparatus (step). S11). In the exposure apparatus, a predetermined circuit pattern is exposed on the resist on the substrate G. After the pattern exposure, the substrate G is returned from the exposure apparatus to the interface unit (I / F) 14. The transport mechanism 59 of the interface unit (I / F) 14 passes the substrate G received from the exposure apparatus to the development process unit 26 of the process station (P / S) 12 via the extension 56 (step S11).

  In the development process unit 26, the substrate G is subjected to development processing in any one of the development units (DEV) 52 (step S12), and then sequentially carried into one of the heating / cooling units (HP / COL) 53, Post baking is performed in the first heating unit (HP) (step S13), and then the substrate is cooled to a constant substrate temperature in the cooling unit (COL) (step S14). A heating unit (HP) 55 can also be used for this post-baking.

  The substrate G that has undergone a series of processing in the development process section 26 is returned to the cassette station (C / S) 10 by the transfer devices 60, 54, and 38 in the process station (P / S) 24, where the transfer mechanism 20 Is stored in one of the cassettes C (step S1).

  In this coating and developing system, the present invention can be applied to, for example, the resist coating unit (CT) 40 of the coating process unit 24. Hereinafter, an embodiment in which the present invention is applied to a resist coating unit (CT) 40 will be described with reference to FIGS.

  FIG. 3 shows the overall configuration of the resist coating unit (CT) 40 and the vacuum drying unit (VD) 42 in this embodiment.

As shown in FIG. 3, a resist coating unit (CT) 40 and a vacuum drying unit (VD) 42 are arranged in a horizontal row on the support base or support frame 70 in the X direction. A new substrate G to be subjected to the coating process is carried into the resist coating unit (CT) 40 as indicated by an arrow F _A by the transfer device 54 (FIG. 1) on the transfer path 51 side. Substrate G after completion of the coating process in the resist coating unit (CT) 40 is a transfer arm 74 which is movable in the X direction is guided by the guide rails 72 on the support table 70, a vacuum drying unit as indicated by the arrow F _B (VD) 42. Substrate G having been subjected to the drying treatment in a vacuum drying unit (VD) 42 is drawn off as shown by the arrow F _C by the transfer device 54 of the transport path 51 side (FIG. 1).

  The resist coating unit (CT) 40 includes a stage 76 that extends long in the X direction, and a long shape disposed above the stage 76 while carrying the substrate G in a flat flow on the stage 76 in the same direction. A resist solution is supplied onto the substrate G from the resist nozzle 78, and a resist coating film having a constant film thickness is formed on the upper surface (surface to be processed) of the substrate by a spinless method. The configuration and operation of each part in the unit (CT) 40 will be described in detail later.

  The vacuum drying unit (VD) 42 includes a tray or shallow container type lower chamber 80 having an open upper surface, and a lid-shaped upper chamber configured to be tightly fitted or fitted to the upper surface of the lower chamber 80. (Not shown). The lower chamber 80 is substantially rectangular, and a stage 82 for placing and supporting the substrate G horizontally is disposed at the center, and exhaust ports 83 are provided at the four corners of the bottom surface. Each exhaust port 83 communicates with a vacuum pump (not shown) through an exhaust pipe (not shown). With the lower chamber 80 covered with the upper chamber, the sealed processing space in both chambers can be depressurized to a predetermined degree of vacuum by the vacuum pump.

  4 and 5 show a more detailed overall configuration in the resist coating unit (CT) 40 in one embodiment of the present invention.

  In the resist coating unit (CT) 40 of this embodiment, the stage 76 does not function as a mounting table for fixing and holding the substrate G as in the prior art, but a substrate for floating the substrate G in the air by the force of air pressure. It functions as a levee. Then, the linear movement type substrate transport portions 84 arranged on both sides of the stage 76 hold both side edges of the substrate G floating on the stage 76 in a detachable manner, and the stage longitudinal direction (X direction) The substrate G is transferred to the substrate.

Specifically, the stage 76 is divided into _five regions M ₁ , M ₂ , M ₃ , M ₄ , and M ₅ in the longitudinal direction (X direction) (FIG. 5). The leftmost area M ₁ is a carry-in area, and a new substrate G to be subjected to the coating process is carried into a predetermined position in this area M ₁ . In this carry-in area M ₁ , the substrate G is received from the transfer arm of the transfer device 54 (FIG. 1) and loaded onto the stage 76 so as to move up and down between the original position below the stage and the forward movement position above the stage. A plurality of possible lift pins 86 are provided at predetermined intervals. These lift pins 86 are driven up and down by, for example, a lift pin lifting / lowering unit (not shown) for loading using an air cylinder (not shown) as a drive source.

The loading area M ₁ is also the area substrate transfer of a floating starts, high-pressure or positive pressure to the stage upper surface of the region to float in flying height or flying height H _a for carrying the substrate G A number of jet outlets 88 for jetting compressed air are provided at a constant density. Here, the flying height H _a of the substrate G in the carrying region M ₁ does not require a particularly high accuracy, for example if kept in the range of 100-150 .mu.m. Further, it is preferable that the size of the carry-in area M ₁ exceeds the size of the substrate G in the transport direction (X direction). Further, an alignment unit (not shown) for aligning the substrate G on the stage 76 may be provided in the carry-in area M ₁ .

A region M ₃ set at the center of the stage 76 is a resist solution supply region or a coating region, and the substrate G is supplied with the resist solution R from the upper resist nozzle 78 when passing through the coating region M ₃ . Substrate flying height H _b in the coating area M ₃ are defining a coating gap S configuration interval (e.g. 100 [mu] m) between the lower end of the nozzle 78 (the ejection port) and the substrate upper surface (surface to be processed). The coating gap S is an important parameter that affects the film thickness of the resist coating film and the resist consumption, and must be kept constant with high accuracy. For this reason, high-pressure or positive-pressure compressed air is jetted onto the upper surface of the stage in the coating region M ₃ in order to float the substrate G at a desired flying height H _b in an arrangement or distribution pattern as shown in FIG. A jet port 88 and a suction port 90 for sucking air at a negative pressure are mixed and provided. Then, a vertical upward force due to compressed air is applied from the jet outlet 88 to a portion passing through the coating region M ₃ of the substrate G, and at the same time, a vertical downward force due to a negative pressure suction force is applied from the suction port 90. In addition, the flying height _Hb for coating is maintained in the vicinity of a set value H _S (for example, 50 μm) by controlling the balance of the opposing forces against each other. The size of the coating region M ₃ in the transport direction (X direction) only needs to be large enough to stably form the narrow coating gap S as described above immediately below the resist nozzle 78, and is usually larger than the size of the substrate G. It may be small, for example, about 1/3 to 1/4.

As shown in FIG. 6, in the application region M ₃ , the jet ports 88 and the suction ports 90 are alternately arranged on a straight line C that forms an angle inclined with respect to the substrate transport direction (X direction). An appropriate offset α is provided for the pitch on the straight line C between the columns. According to such an arrangement pattern, not only can the mixing density of the nozzles 88 and the suction ports 90 be made uniform, the substrate levitation force on the stage can be made uniform, but also when the substrate G moves in the transport direction (X direction). It is also possible to make the ratio of the time facing the 88 and the suction port 90 uniform in each part of the substrate, whereby the coating film formed on the substrate G is traced or transferred by the ejection port 88 or the suction port 90. Can be prevented. At the entrance of the coating region M ₃ , the jet outlets 88 arranged in the same direction (on the straight line J) so that the tip of the substrate G stably receives a uniform levitation force in the direction (Y direction) perpendicular to the transport direction, and It is preferable to increase the density of the suction port 90. Also in the coating region M ₃ , it is preferable to arrange only the ejection port 88 at both side edges (on the straight line K) of the stage 76 in order to prevent the both side edges of the substrate G from dripping.

Middle area M ₂ that is set between the loading area M ₁ and the application area M ₃ are, floating in the coating area M ₃ the height position of the substrate G during transport from flying height H _a of the loading area M ₁ This is a transition region for changing or transitioning to the height _Hb . Even in the transition region M ₂ , the jet port 88 and the suction port 90 can be mixed and arranged on the upper surface of the stage 76. In that case, the density of the suction port 90 gradually increases along the conveying direction, whereby it as moves to H _b from the flying height progressively H _a of the substrate G during transport. Alternatively, in this transition region M ₂ , a configuration in which only the ejection port 88 is provided without including the suction port 90 is also possible.

A region M ₄ adjacent to the downstream side of the coating region M ₃ is for changing the flying height of the substrate G from the flying height H _b for coating to the floating height H _c for unloading (for example, 100 to 150 μm) during transportation. Transition region. Even in the transition region M ₄ , the ejection port 88 and the suction port 90 may be mixed on the upper surface of the stage 76, and in this case, the density of the suction port 90 should be gradually reduced along the transport direction. . Alternatively, a configuration in which only the ejection port 88 is provided without including the suction port 90 is also possible. In addition, as shown in FIG. 6, in the transition region M ₄ as well as the coating region M ₃ , the suction port 90 (and the spray nozzle 90) is used to prevent the transfer mark from being applied to the resist coating film formed on the substrate G. It is preferable that the outlet 88) is disposed on a straight line E that forms a certain inclined angle with respect to the substrate transport direction (X direction), and an appropriate offset β is provided in the arrangement pitch between adjacent rows.

A region M ₅ at the downstream end (right end) of the stage 76 is a carry-out region. The resist coating unit (CT) substrate G having received a coating process with 40, the transport arm 74 from a predetermined position or unloading position of the unloading area M ₅ vacuum drying unit on the downstream side next (FIG. 3) (VD) 42 ( 3). In the carry-out area M ₅ , a number of jet outlets 88 for floating the substrate G at a floating height H _c for carrying out are provided on the upper surface of the stage at a constant density, and the substrate G is unloaded from the stage 76. Then, a plurality of lift pins 92 that can be moved up and down between the original position below the stage and the forward movement position above the stage are provided at predetermined intervals for delivery to the transfer arm 74 (FIG. 3). . These lift pins 92 are driven up and down by a lift pin lifting / lowering unit (not shown) for carrying out using, for example, an air cylinder (not shown) as a drive source.

  The resist nozzle 78 has a long nozzle body that extends in the horizontal direction (Y direction) perpendicular to the transport direction and has a length that can cover the substrate G on the stage 76 from one end to the other end. The nozzle horizontal movement mechanism 77 can move within a predetermined range in the vertical direction (Z direction) and in the horizontal direction (X direction) perpendicular to the longitudinal direction of the nozzle (FIGS. 3 and 11). 93 (FIG. 14) is connected to a resist solution supply pipe 94 (FIG. 4).

  As shown in FIGS. 4, 7, and 8, the substrate transport unit 84 includes a pair of guide rails 96 arranged in parallel on the left and right sides of the stage 76, and an axial direction (X direction) on each guide rail 96. A slider 98 movably attached to each other, a transport drive unit 100 for moving the slider 98 linearly on each guide rail 96, and right and left side edges of the substrate G extending from each slider 98 toward the center of the stage 76. And a holding portion 102 that holds the detachable holder.

  Here, the conveyance drive unit 100 is configured by a linear drive mechanism such as a linear motor. The holding unit 102 supports the suction pad 104 coupled to the lower surfaces of the left and right side edges of the substrate G by a vacuum suction force, and supports the suction pad 104 at the distal end, with the proximal end on the slider 98 side serving as a fulcrum. And a plate spring type pad support portion 106 that can be elastically deformed so that the height position of each can be changed. The suction pads 104 are arranged in a line at a constant pitch, and the pad support part 106 supports each suction pad 104 independently. As a result, the individual suction pads 104 and the pad support portions 106 can stably hold the substrate G at independent height positions (even at different height positions).

  As shown in FIGS. 7 and 8, the pad support portion 106 in this embodiment is attached to a plate-like pad elevating member 108 attached to the inner surface of the slider 98 so as to be elevable. A pad actuator 109 (FIG. 14) made of, for example, an air cylinder mounted on the slider 98 moves the pad lifting / lowering member 108 to an original position (retracted position) lower than the flying height position of the substrate G and the flying height of the substrate G. It is configured to move up and down between the forward movement position (coupling position) corresponding to the position.

  As shown in FIG. 9, each suction pad 104 is provided with a plurality of suction ports 112 on the upper surface of a rectangular parallelepiped pad body 110 made of, for example, synthetic rubber. These suction ports 112 are slit-like long holes, but may be round or rectangular small holes. For example, a belt-like vacuum tube 114 made of synthetic rubber is connected to the suction pad 104. The pipe lines 116 of these vacuum pipes 114 respectively communicate with the vacuum source of the pad suction control unit 115 (FIG. 14).

  As shown in FIG. 4, the holding unit 102 preferably has a separation type or completely independent type in which the vacuum suction pads 104 and the pad support units 106 on one side are separated for each set. However, as shown in FIG. 10, a single plate spring provided with a notch 118 is used to form a pad support portion 120 for one row on one side, and a vacuum suction pad 104 is placed on one row on the pad support portion 120. Configuration is also possible.

As described above, the large number of jets 88 formed on the upper surface of the stage 76, the compressed air supply mechanism 122 (FIG. 11) for supplying the compressed air for generating the levitation force to them, and the coating region M _{3 of the} stage 76. The substrate G is carried in the carry-in area M ₁ and the carry-out area M ₅ by a large number of suction ports 90 formed in the inside of the jet outlet 88 and a vacuum supply mechanism 124 (FIG. 11) for supplying vacuum pressure thereto. A stage substrate floating portion 126 (FIG. 14) for floating the substrate G at a set flying height H _S suitable for stable and accurate resist coating scanning is formed in the coating region M ₃ . Has been.

FIG. 11 shows the configuration of the nozzle lifting mechanism 75, the nozzle horizontal movement mechanism 77, the compressed air supply mechanism 122, and the vacuum supply mechanism 124. The nozzle raising / lowering mechanism 75 is attached to the gate-shaped frame 130 and the portal frame 130 laid so as to straddle the coating region M _{3 in} the horizontal direction (Y direction) orthogonal to the transport direction (X direction). It has a pair of left and right vertical motion mechanisms 132L and 132R, and a nozzle support 134 of a moving body (lifting body) straddling between these vertical motion mechanisms 132L and 132R. The drive units of the vertical motion mechanisms 132L and 132R include electric motors 138L and 138R made of, for example, pulse motors, ball screws 140L and 140R, and guide members 142L and 142R. The rotational force of the pulse motors 138L, 138R is converted into a vertical linear motion by the ball screw mechanisms (140L, 142L, 134L) and (140R, 142R, 134R), and the resist nozzle 78 is integrated with the nozzle support 134 of the lifting body. Move up and down in the vertical direction. The amount of elevation movement and the height position of the left and right sides of the registration nozzle 78 can be arbitrarily controlled by the rotation amounts and rotation stop positions of the pulse motors 138L and 138R. As shown in FIG. 12, the nozzle support 134 is made of, for example, a prismatic rigid body, and a resist nozzle 78 is detachably attached to the lower surface or side surface of the nozzle support 134 via a flange, a bolt, or the like.

  The nozzle horizontal movement mechanism 77 includes a pair of left and right guide rails (not shown) for guiding the portal frame 130 in a horizontal direction (X direction) orthogonal to the longitudinal direction of the nozzle, and the portal frame 130 on the guide rails. It has a pair of left and right horizontal movement mechanisms that move linearly, for example, a pulse motor driven ball screw mechanism 135L, 135R, and is configured so that the portal frame 130 can be positioned at an arbitrary position on the guide rail.

  The compressed air supply mechanism 122 includes a positive pressure manifold 144 connected to a jet outlet 88 for each of a plurality of areas divided on the upper surface of the stage 76, and compressed air from a compressed air supply source 146 of factory force, for example, to the positive pressure manifold 144. Compressed air supply pipe 148 and a regulator 150 provided in the middle of the compressed air supply pipe 148. The vacuum supply mechanism 124 includes a negative pressure manifold 152 connected to the suction port 90 for each of a plurality of areas divided on the upper surface of the stage 76, and a vacuum that feeds, for example, vacuum from a vacuum source 154 of factory power into the negative pressure manifold 152. A pipe 156 and a throttle valve 158 provided in the middle of the vacuum pipe 156 are provided.

  As shown in FIG. 5, the resist coating unit (CT) 40 has a nozzle standby unit 170 disposed slightly upstream from the stage 76 in the substrate transport direction (X direction). A priming processing section is provided in the interior.

  FIG. 13 shows a configuration in the nozzle standby unit 170. As shown in the figure, the nozzle standby unit 170 has a priming processing unit 172, a solvent atmosphere chamber 174, and a cleaning unit 176 arranged in a horizontal row in the X direction. Among them, the priming processing unit 172 is installed at a location closest to the coating processing position. The straight drive units 135L and 135R of the nozzle horizontal movement mechanism 77 (FIG. 11) extend to the nozzle standby unit 170 (FIG. 3), and the resist nozzle 78 is transferred to each part (172, 174, 176) in the nozzle standby unit 170. It can be done.

The cleaning unit 176 has a nozzle cleaning head 178 that moves or scans in the longitudinal direction (Y direction) under the resist nozzle 78 positioned at a predetermined position. The nozzle cleaning head 178 is equipped with a cleaning nozzle 180 and a gas nozzle 182 for spraying a cleaning liquid (for example, thinner) and a drying gas (for example, N ₂ gas) toward the lower end portion of the resist nozzle 78 and the discharge port 78a. In addition, a drain portion 184 is provided that collects and collects the cleaning liquid that has fallen on the resist nozzle 78 with a vacuum force.

  The solvent atmosphere chamber 174 has a length that covers the entire length of the resist nozzle 78 and extends in the Y direction, and a solvent (for example, thinner) is contained in the chamber. On the upper surface of the solvent atmosphere chamber 174, a lid 186 having a V-shaped cross section provided with a slit-like opening 186a extending in the longitudinal direction (Y direction) is attached. When the nozzle portion of the resist nozzle 78 is aligned with the lid 186 from above, only the discharge port 78a and the lower end portion of the tapered nozzle are exposed to the solvent vapor standing in the room through the opening 186a. Yes. While the coating process is not performed on the stage 76 for a while, the resist nozzle 78 is cleaned by the cleaning unit 176 for the discharge port 78a and the nozzle unit, and then waits in the solvent atmosphere chamber 174.

  The priming processing unit 172 includes a columnar priming roller 188 that covers the entire length of the resist nozzle 78 and extends in the horizontal direction (Y direction) in the solvent bath 190. In the solvent bath 190, a solvent or cleaning liquid (for example, thinner) is accommodated at a liquid level that allows the lower part of the priming roller 188 to be immersed. A rotation support mechanism 192 disposed outside the solvent bath 190 supports the rotation shaft 188 a of the priming roller 188 and rotationally drives the priming roller 188. Further, in the solvent bath 174, a solvent nozzle 194 that sprays the solvent of the new liquid onto the outer peripheral surface of the priming roller 188 and a wiper 196 that rubs against the outer peripheral surface of the priming roller 188 at a position above the cleaning liquid reservoir. Yes. The operation of the priming processing unit 172 will be described later.

  The resist coating unit (CT) 40 detects the relative positional relationship between the resist nozzle 78 and the object immediately below it, that is, the stage 76, the substrate G, or the priming roller 188, as shown in FIGS. 11, a pair of optical distance sensors 162L and 162R are attached to the left and right ends of the resist nozzle 78 as shown in FIG. Each of the optical distance sensors 162L and 162R receives a light projecting unit that projects a light beam vertically downward, and light that is reflected vertically upward from an object that the light beam hits at a position corresponding to the measurement distance. The distance between the light receiving unit and the stage 76 is measured directly when facing the stage 76 directly below, and when there is a substrate G floating on the stage 76 directly below, the distance to the substrate G is measured. The distance interval is measured, and when it is positioned directly above the priming roller 188, the distance interval with the outer peripheral surface of the priming roller 188 can be measured. More detailed functions and operations of these optical distance sensors 162L and 162R will be described later.

  Further, in this resist coating unit (CT) 40, a position for measuring or reading an arbitrary position of the nozzle support 134 that detachably supports the resist nozzle 78 in its movable direction (Z direction, X direction). A pair of left and right vertical linear scales 164L and 164R and a pair of left and right horizontal linear scales 166L and 166R are provided as sensors.

  The pair of left and right vertical linear scales 164L and 164R measure or read the positions (height positions) in the Z direction of the left and right ends of the nozzle support 134 with reference to the portal frame 130. A scale portion 164a that is fixed to both the left and right sides and extends in the Z direction, and is attached to the left and right ends of the nozzle support 134 so as to optically read the scale portion 164a at a level corresponding to the height position of the nozzle support 134. And a graduation reading unit 164b. Since the portal frame 130 is robust and hardly fluctuates or displaces in the vertical direction, the measurement accuracy of the vertical linear scales 164L and 164R is hardly distorted, and the height positions of the left and right ends of the nozzle support 134 are respectively set. It can always be measured or read accurately.

  The pair of left and right horizontal linear scales 166L and 166R measure or read the positions of the left and right ends of the portal frame 130 relative to the floor (not shown) in the X direction. A scale portion 166a fixed in the X direction through a notch (not shown), and the scale-shaped portion 166a is optically read at a position corresponding to the position on the guide rail of the gate-shaped frame 130. It is comprised with the scale reading part 166b attached to the both right and left side surfaces. The measurement accuracy of the linear scale 166 is very high, and the positions of the left and right side surfaces of the portal frame 130 in the X direction, and thus the positions of the left and right ends of the nozzle support 134 can always be measured or read accurately.

  FIG. 14 shows a main configuration of a control system in the resist coating unit (CT) 40 of this embodiment. The controller 198 comprises a microcomputer, receives each measurement value from the optical distance sensor 162 (162L, 162R), vertical linear scale 164 (164L, 164R), horizontal linear scale 166 (166L, 166R), etc. In particular, the resist solution supply mechanism 93, the nozzle elevating mechanism 75, the nozzle horizontal moving mechanism 77, the stage substrate floating portion 126, the transport driving unit 100, the pad suction control unit 115, the pad actuator 109, and the loading lift pin elevating unit (see FIG. (Not shown), the lift pin lifting / lowering unit (not shown), the priming roller rotation support mechanism 192, the nozzle cleaning head 178, etc., and the entire operation (sequence) are controlled. The controller 198 is also connected to a host controller and other external devices that control the entire coating and developing treatment system.

  Next, the coating processing operation in the resist coating unit (CT) 40 of this embodiment will be described. The controller 198 fetches and executes a resist coating processing program stored in a storage medium such as an optical disk in the main memory, and controls a series of programmed coating processing operations.

When the transport device 54 new substrate G (FIG. 1) than the untreated is carried into the carry-area M ₁ stage 76, the lift pins 86 receives the substrate G at the forward position. After conveying device 54 has exited, the lift pins 86 are lowered down to a height position that is floating position H _a for conveying the substrate G (Figure 5). Next, an alignment unit (not shown) is operated, and a pressing member (not shown) is pressed against the floating substrate G from four directions to align the substrate G on the stage 76. When the alignment operation is completed, the pad actuator 109 is actuated immediately after that in the substrate transport section 84, and the suction pad 104 is raised (UP) from the original position (retracted position) to the forward movement position (coupled position). The suction pad 104 is vacuum-on from before, and is bonded by a vacuum suction force as soon as it comes into contact with the side edge of the floating substrate G. Immediately after the suction pad 104 is coupled to the side edge of the substrate G, the alignment unit retracts the pressing member to a predetermined position.

  Next, the substrate transport unit 84 moves the slider 98 straight from the transport start point position to the transport direction (X direction) at a relatively high constant speed while holding the side edge of the substrate G by the holding unit 102. In this way, the substrate G moves straight in the transport direction (X direction) while floating on the stage 76, and when the front end of the substrate G reaches the set position near the resist nozzle 78, that is, the application start position, the substrate transport unit 84 stops the substrate transfer in the first stage.

While the operation of loading a new unprocessed substrate G onto the stage 76 in the loading area M ₁ as described above is performed, the resist nozzle 78 is subjected to a priming process by the priming processing unit 172 of the nozzle standby unit 170. .

  In this priming process, under the control of the controller 198, the nozzle elevating mechanism 75 and the nozzle horizontal moving mechanism 77 face the discharge port 78a of the resist nozzle 78 in parallel with the top of the priming roller 188 with a gap Q of a set interval. The resist nozzle 78 is brought close to the priming roller 188 to a position where the resist nozzle 78 is moved, and the resist solution supply mechanism 93 discharges the resist solution R to the resist nozzle 78. Rotate in the direction (clockwise in FIG. 13). Then, as shown in an enlarged view in FIG. 15, the resist solution R that has come out from the discharge port 78 a of the resist nozzle 78 wraps around the nozzle back surface 78 c and is wound around the outer peripheral surface of the priming roller 188. The outer peripheral surface of the priming roller 188 on which the resist solution is wound immediately enters the solvent bath to wash off the resist solution R. The outer peripheral surface of the priming roller 188 raised from the solvent bath is finished with a new liquid solvent sprayed from the solvent nozzle 194, and immediately after that, the liquid is wiped off by the wiper 196 to restore a clean surface. Then, it passes under the discharge port 78a of the resist nozzle 78 again and receives the resist solution there. The amount of rotation of the priming roller 188 for the priming process may be arbitrary, for example, half rotation. The gap Q formed between the discharge port of the resist nozzle 78 and the priming roller 188 is an application gap S formed between the discharge port of the resist nozzle 78 and the substrate G on the stage 76 during the coating process. The same or approximate size (for example, 100 μm) may be set.

  In this priming process, it is preferable to start the rotation operation of the priming roller 188 after a certain delay time (for example, 1 second) after the resist nozzle 78 starts the resist solution discharge operation. R can be fully and evenly wound around the taper back surface 78c side of the resist nozzle 78. Thus, even after the priming process is completed, a resist film that extends straight and uniformly in the longitudinal direction of the nozzle (Y direction) is formed below the discharge port 78a or the back surface 78c of the resist nozzle 78 as shown in FIG. RF remains.

When the priming process as described above is completed, the nozzle horizontal moving mechanism 77 first moves the resist nozzle 78 horizontally from the priming processing unit 172 to a position just above the coating position set in the stage coating area M ₃ , and then the nozzle The elevating mechanism 75 lowers the resist nozzle 78 toward the stage 76 directly below. At this time, on the stage 76 substrate G that has been transported from the loading area M ₁ is stopped arriving to the coating start position of the application region M _3. In this way, the resist nozzle 78 is lowered to a height position at which the discharge port 78a of the resist nozzle 78 is opposed to the substrate G with a coating gap S at a set interval. Then, as shown in FIG. 17, the resist solution film at the lower end of the resist nozzle 78 is deposited on the substrate G, and a bead RB of resist solution is formed so as to close the coating gap S without any gap.

Next, the substrate transfer unit 84 starts the second-stage substrate transfer. In this second stage, that is, the substrate conveyance during coating is performed at a relatively low constant speed. In this way, in the coating region M ₃ , the substrate G moves in a horizontal posture at a constant speed in the transport direction (X direction), and at the same time, the long resist nozzle 78 keeps the resist solution R constant toward the substrate G immediately below. By discharging the belt at a flow rate, a resist solution coating film RM is formed from the front end side to the rear end side of the substrate G as shown in FIG. As described above, the resist gap meniscus MS formed on the lower portion of the back surface 78c of the resist nozzle 78 in the application scan is horizontally aligned by closing the application gap S with the resist solution bead RB immediately before the start of the application process. And a flat resist coating film RM without coating unevenness can be formed.

When the above-described coating process is completed in the coating region M ₃ , that is, when the rear end portion of the substrate G passes just below the resist nozzle 78, the resist solution supply mechanism 93 finishes discharging the resist solution R from the resist nozzle 78. Let At the same time, the nozzle lifting mechanism 75 lifts the resist nozzle 78 vertically upward and retracts it from the substrate G. On the other hand, the substrate transport unit 84 switches to the third stage substrate transport with a relatively high transport speed. When the substrate G arrives at the conveying end position in the unloading area M _5, the substrate conveying unit 84 to stop the substrate carrying the third stage. Immediately after this, the pad suction control unit 115 stops the supply of vacuum to the suction pad 104, and at the same time, the pad actuator 109 lowers the suction pad 104 from the forward movement position (coupling position) to the original position (retraction position), and the substrate The suction pad 104 is separated from both end portions of G. At this time, the pad suction control unit 115 supplies positive pressure (compressed air) to the suction pad 104 to speed up the separation from the substrate G. Instead, the lift pins 92 rise from the original position below the stage to the forward movement position above the stage in order to unload the substrate G.

Thereafter, the unloader, that is, the transfer arm 74 accesses the unloading area M ₅ , receives the substrate G from the lift pins 92, and unloads it out of the stage 76. The substrate transport unit 84 immediately returns the substrate G to the loading region M ₁ at a high speed when the substrate G is transferred to the lift pins 92. When the processed substrate G is unloaded as described above in the unloading area M ₅ , loading, alignment, or transfer start is performed on the new substrate G to be subjected to the next coating process in the loading area M ₁ . Further, the resist nozzle 78 is moved to the priming processing unit 172 of the nozzle standby unit 170 by the nozzle lifting mechanism 75 and the nozzle horizontal moving mechanism 77, and receives the priming process as described above.

As described above, in this resist coating unit (CT) 40, a long resist nozzle 78 is used to perform spinless coating processing in the coating region M ₃ set on the floating stage 76, and coating is performed. and so as to apply a priming process in preparation in the priming processing unit 172 to the resist nozzle 78 prior to processing, coating unevenness or thickness upon application scanning in the coating area M ₃ by performing successfully this priming process every time Can be prevented or suppressed. The degree of completion of the priming process depends on the accuracy of the priming position, that is, the positional relationship that the discharge port 78a of the resist nozzle 78 faces the top of the priming roller 188 in parallel with a gap Q of the set distance. However, the registration nozzle 78 is a replacement part that is detachably attached to the nozzle support 134. If the registration position of the registration nozzle 78 is shifted due to replacement or collision or contact with another object, the accuracy of the priming position is lowered. In addition, the quality of the priming process and the quality of the coating process deteriorates.

  The resist coating unit (CT) 40 of this embodiment has a function of determining or correcting the priming position not only when the resist nozzle 78 is replaced, but also periodically or as needed. The controller 198 fetches and executes a priming position determination (correction) program stored in a storage medium such as an optical disk in the main memory, and controls a series of programmed operations.

  Hereinafter, with reference to FIGS. 19 to 24, an embodiment of a technique for performing priming alignment in the resist coating unit (CT) 40 will be described.

When aligning the priming position, the registration nozzle 78 is moved to the priming processing section 172 of the nozzle standby section 170 by the nozzle raising / lowering mechanism 75 and the nozzle horizontal movement mechanism 77, and the nozzle is moved on the priming roller 188 as shown in FIG. The resist nozzle 78 is moved in a horizontal direction (X direction) orthogonal to the longitudinal direction. At that time, the optical distance sensors 162L and 162R integrally attached to the resist nozzle 78 are operated to measure the distance between the resist nozzle 78 and the outer peripheral surface of the priming roller 188 at each position where the resist nozzle 78 moves. As described above, each of the optical distance sensors 162L and 162R projects a light beam vertically downward, receives light reflected vertically upward from an object hit by the light beam, and obtains a measurement distance. Therefore, the reflected light having the highest light intensity P is received when the position of each optical distance sensor 162L, 162R coincides with the position X _S of the top of the priming roller 188, and the shortest measurement distance d during movement is received. Can be requested.

When the minimum measurement distance d is obtained from each of the optical distance sensors 162L and 162R, the controller 198 detects the position (X _L , X _R ) in the X direction indicated by the horizontal linear scales 164L and 164R and the vertical linear scales 166L and 166R. The Z-direction position (Z _L , Z _R ) shown is read.

Here, if the registration nozzle 78 is parallel to the priming roller 188 in the horizontal direction, the left and right X-direction positions (X _L , X _R ) at which the minimum measurement distance d can be obtained should match each other. That is, X _L = X _R. However, when there is a horizontal inclination between the two, for example, when the registration nozzle 78 moves in the X direction on the priming roller 188 in the positional relationship as shown in FIG. 20, as shown in FIG. _L and X _R do not coincide with each other. Further, when there is a vertical inclination, for example, when the registration nozzle 78 moves in the X direction on the priming roller 188 in the positional relationship as shown in FIG. 23, the minimum value obtained from the left optical distance sensor 162L. The measurement distance d _L and the minimum measurement distance d _R obtained from the optical distance sensor 162R on the right side do not match.

  In general, since the priming roller 188 is fixedly disposed at fixed positions in the X, Y, and Z directions, its mounting accuracy is very high and changes with time are small. On the other hand, the resist nozzle 78 is detachably attached to the nozzle support 134 as a part having a high replacement frequency or maintenance frequency. Further, the registration nozzle 78 may collide with or contact other objects during the movement, and the positional deviation is caused. Prone to occur. In view of this point, in this embodiment, when there is a relative inclination between the priming roller 188 and the registration nozzle 78, there is an absolute inclination or displacement of the mounting position toward the registration nozzle 78. Assuming that there is something, the controller 198 corrects the relative position of the registration nozzle 78 with respect to the priming roller 188 through the nozzle lifting mechanism 75 and / or the nozzle translation mechanism 77.

For example, with respect to the horizontal inclination as shown in FIG. 20, the horizontal movement mechanism on the left and right sides of the nozzle horizontal movement mechanism 77 cancels the error or difference between the minimum distance measurement positions X _L and X _{R in} the X direction. By controlling the pulse motors 135L and 135R, the registration nozzle 78 can be parallel to the priming roller 188 in the horizontal direction as shown in FIG. Note that the inclination shown in FIG. 20 is exaggerated for the sake of illustration, and the actual left-right shift is in units of microns. Therefore, the registration nozzle 78 can be substantially displaced in the θ direction (rotation direction) in the horizontal plane to such an extent that the horizontal inclination can be corrected by the relative position adjustment between the left and right horizontal motion mechanisms 135L and 135R.

Further, for the vertical inclination as shown in FIG. 23, the left and right vertical motion mechanisms 132L so as to cancel the error or difference between the minimum distance measurement values d _L and d _{R in} the Z direction in the nozzle lifting mechanism 75. , 132R can be controlled to make the registration nozzle 78 parallel to the priming roller 188 in the vertical plane as shown in FIG. Here, in order to cancel the difference between the minimum distance measurement values d _L and d _R , the heights of the left and right ends of the resist nozzle 78 are set so as to be equal to an intermediate value d _S = (d _L + d _R ) / 2. Each position may be adjusted. The inclination shown in FIG. 23 is also exaggerated for illustration, and the actual left-right shift is in units of microns. Therefore, the registration nozzle 78 can be substantially displaced in the θ direction (rotation direction) within the vertical plane to such an extent that the vertical inclination can be corrected by the relative position adjustment between the left and right vertical motion mechanisms 132L and 132R. .

Theoretically, a correction value for correcting the inclination of the resist nozzle 78 can be obtained from the minimum distance measurement position (X _L , X _R ) and the minimum distance measurement value (d _L , d _R ) as described above. . However, it is desirable to check the corrected parallel state. Therefore, the registration nozzle 78 is moved in the X direction above the priming roller 188 until it is confirmed that the parallel conditions (X _L = X _R = X _S and d _L = d _R = d _S ) are satisfied. Processing for determining the minimum distance measurement position (X _L , X _R ) and the minimum distance measurement value (d _L , d _R ), processing for determining the presence / absence of an inclination from these measurement values, and determining the amount of inclination, and a nozzle lifting mechanism 75 and the process of correcting the misalignment through the nozzle horizontal movement mechanism 77 may be repeated.

The parallel conditions (X _L = X _R = X _S and d _L = d _R = d _S ) are established between the optical distance sensors 162L and 162R and the priming roller 188. It is not established between the nozzle 78 and the priming roller 188. However, both optical distance sensors 162L and 162R are attached to the nozzle support 134 in a state of being integrally coupled to the resist nozzle 78, and the attachment positions of the both optical distance sensors 162L and 162R with respect to the resist nozzle 78 are predetermined values. And its accuracy is very high. Therefore, when the parallel condition is satisfied, it can be considered that both the registration nozzle 78 and the priming roller 188 are in a parallel state.

Thus, the controller 198 determines the registration nozzle based on the minimum distance measurement position X _S and the minimum distance measurement value d _S when the parallel condition is satisfied and the relative positions of the optical distance sensors 162L and 162R with respect to the registration nozzle 78. The positions on the horizontal linear scales 164L and 164R and the vertical linear scales 166L and 166R for the 78 discharge ports 78a to face the top of the priming roller 188 in parallel with a gap Q of the set interval can be determined as the priming positions. .

  As described above, in this embodiment, the position of the resist nozzle 78, that is, the priming position, is such that the discharge port 78a of the resist nozzle 78 faces the top of the priming roller 188 in parallel with a gap Q of the set distance during the priming process. The positioning operation for determining the position can be automatically performed without requiring a jig such as a shim or manpower.

  Further, in the above-described embodiment, by utilizing the high positional accuracy of the priming roller 188 installed at a fixed position, the position shift of the registration nozzle 78 detachably attached to the nozzle support 134 is detected by the controller 198. Under control, the correction can be automatically performed through the nozzle lifting mechanism 75 and the nozzle horizontal movement mechanism 77. That is, there is an advantage that the displacement of the registration nozzle 78 can be corrected with respect to the stage 76 and the substrate G.

  As another embodiment of the present invention, as shown in FIG. 25, a resist nozzle 78 and an optical distance sensor 162 may be individually attached to a nozzle support 134, respectively. In this case, since the optical distance sensor 162 (162L, 162R) is semi-permanently fixed to the nozzle support 134, the optical distance sensor 162 (162L, 162L, 162R, 166R, 166R, 166R) is disposed on the horizontal linear scale 164L, 164R and the vertical linear scale 166L, 166R. 162R) can always be read with high accuracy in the X and Y positions. On the other hand, the resist nozzle 78 is detachably attached to the nozzle support 134 and is replaced or repaired relatively frequently. For this reason, there is a possibility that the mounting position of the resist nozzle 78 is shifted. If the mounting position of the resist nozzle 78 is shifted, the relative positional relationship between the resist nozzle 78 and the optical distance sensor 162 (162L, 162R) may be shifted.

  Therefore, in this embodiment, the mounting position of the resist nozzle 78 is inspected on the stage 76 before the priming processing unit 172 performs priming alignment.

This test, as shown in FIG. 26, unload the resist nozzle 78 to a predetermined height position Z _a which is set on the stage 76 upward. In this case, the controller 198 lowers the nozzle support 134 until the measured value indicated by the vertical linear scale 164 matches the reference position Z _C stored in the memory. Then, the optical distance sensor 162 (162L, 162R) is caused to measure the distance to the upper surface of the stage 76. Meanwhile, the stage 76 side (e.g. the side surface of the stage 76) is provided in contact type distance sensor 168, the distance interval L _a clogging nozzle height between the stage 76 top and the resist nozzle 78 against the stylus 168a to the lower end of the resist nozzle 78 It is to measure the position Z _a.

If there is no error in the attachment position of the resist nozzle 78, the measured value La of the nozzle height position obtained from the contact-type distance sensor 168 indicates _a set value (for example, 1 mm). However, when the mounting position of the resist nozzle 78 has an error, since the probe 168a of the contact type distance sensor 168 is not properly abut against the lower end of the resist nozzle 78, the measured value L _a of the nozzle height position setting value Not equal. In this case, the controller 198 adjusts the position of the registration nozzle 78 through the nozzle lifting mechanism 75 and the nozzle horizontal movement mechanism 77. Then, when the measured value L _a of the nozzle height position obtained from the contact-type distance sensor 168 coincides with the set value, the controller 198 reads the height position Z _C 'indicated by the vertical linear scale 164, the readings Z _C ′ is registered in the memory as a correction reference position in the Z direction. Further, the position X _C ′ in the X direction indicated by the horizontal linear scale 166 is read, and the read value X _C ′ is registered as a correction reference position in the X direction. Further, the relative position of the optical distance sensor 162 with respect to the registration nozzle 78 is corrected from the correction reference position Z _C ′ in the Z direction and the correction reference position X _C ′ in the X direction. Further, the optical distance sensor 162 measures the distance L _b to the stage 76, and the distance measurement value L _b is also registered as the correction reference distance.

  Thus, in this embodiment, a measuring instrument (in the example shown, a contact-type distance sensor 168) for aligning the registration nozzle 78 with the absolute reference position is provided on the stage 76 side, so that the nozzle support 134 is detachably attached. The positional deviation of the registration nozzle 78 can be automatically corrected on the stage 76 through the nozzle lifting mechanism 75 and the nozzle horizontal movement mechanism 77 under the control of the controller 198. Even if the registration nozzle 78 is misaligned, the current relative positional relationship between the registration nozzle 78 and the optical distance sensor 162 can be accurately obtained.

  The priming alignment operation and the correction process may be the same as those in the first embodiment (FIGS. 19 to 24). However, in this embodiment, the error in the mounting position of the registration nozzle 78 is corrected on the stage 76, so that the registration nozzle 78 is horizontally or vertically with respect to the priming roller 188 as shown in FIG. There is almost no possibility of tilting. If there is a relative inclination between the registration nozzle 78 and the priming roller 188, it can be presumed that the cause is rather on the priming roller 188 side. Actually, as a modification, in the priming processing unit 172, the priming roller 188 is configured to be movable in the X direction, for example, and the priming roller 188 is laterally moved with respect to the resist nozzle 78 stationary at a predetermined height position. It is also possible to position it close to the priming position. Thus, when the priming roller 188 is configured to be movable, there is a possibility that the position of the priming roller 188 is shifted over time.

Therefore, in priming alignment, the optimum priming position can be determined by correcting the positional deviation of the priming roller 188 through the rotation support mechanism 192 under the control of the controller 198.
Alternatively, as another method, the optimum priming position is determined by correcting the position on the registration nozzle 78 side through the nozzle lifting mechanism 75 and the nozzle horizontal movement mechanism 77 under the control of the controller 198 without changing the priming roller 188 side. Is also possible. In this case, under the control and data management of the controller 98, the first correction reference position for the stage 76 and the second correction reference position for the priming roller 188 for the registration nozzle 78 are the vertical linear scale 164 and the horizontal linear scale 166. Set above. When performing the coating process on the stage 76, the resist nozzle 78 is moved or positioned to a desired position based on the first correction reference position, and when performing the priming process, it is based on the second correction reference position. Thus, the registration nozzle 78 is positioned at a predetermined priming position facing the priming roller 188.

Furthermore, in this embodiment, the plate thickness and the flying height of the substrate G can be measured immediately before starting the coating process on the stage 76. That is, as shown in FIG. 27, with respect to the substrate G that has been transferred from the carry-in area M ₁ to the application area M ₃ and stopped at the application start position, the resist nozzle 78 is moved to a predetermined position, for example, the first correction reference position. wear. Then, as shown in FIG. 28, the distance L _d to the upper surface and the lower surface of the substrate G in distance sensors 162 in the reference position, thereby measuring the L _e. In this case, the optical distance sensor 162 projects one or a plurality of light beams toward the substrate G immediately below, and the measurement distance L _d from the position where the reflected light from the upper surface and the lower surface of the substrate G is received. , determine the L _e. Controller 198, these distances measurements L _d, L _e following equation based on (1), determine the thickness measurement value D and the flying height measurement H _b of the operation to the substrate G (2).
D = L _e −L _d (1)
H _b = L _b −L _e (2)

Thus, by obtaining the thickness D and the flying height _Hb of the substrate G immediately before the coating process, the height positional relationship between the stage 76, the substrate G, and the resist nozzle 78 during the coating process is accurately determined. The reproducibility and reliability of the coating process for forming a resist coating film on the substrate G in a desired and uniform film thickness by the floating transport type spinless coating method can be greatly improved. it can.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment, and various modifications can be made within the scope of the technical idea.

  For example, the contact distance sensor 168 installed on the stage 76 side can be replaced with an optical distance sensor. In that case, the optical distance sensor can measure not only the distance between the lower end of the resist nozzle 78 but also the distance between the substrate G on the stage 76.

  If the height accuracy of the registration nozzle 78 is very high and only the parallelism in the X direction is required between the registration nozzle 78 and the priming roller 188 in priming alignment, the optical system on the side of the registration nozzle 78 is used. The distance sensor 162 can be replaced with an optical position sensor. That is, as shown in FIGS. 19 and 21, the position where the light intensity P of the reflected light is maximum can be set to the top of the priming roller 188, and the optical system only has a function of detecting the light intensity of the reflected light. Even using the position sensor, the position of the top of the priming roller 188 in the X direction can be detected. Further, the optical distance sensor 162 on the resist nozzle 78 side can be replaced with a contact sensor. Further, a configuration in which only one sensor on the registration nozzle 78 side is provided instead of a pair of left and right is also possible.

  The holding unit 102 of the substrate transport unit 84 in the above-described embodiment has the vacuum suction type pad 104, but a pad that holds the side edge of the substrate G mechanically (for example, tightly) is also possible. It is. Also, various systems and configurations can be employed for a mechanism (pad support unit 106, pad lifting unit 108, pad actuator 109) for detachably coupling the pad 104 to the side edge of the substrate G. Moreover, although the board | substrate conveyance part 84 in the said embodiment hold | maintained and conveyed the right and left both-sides edge part of the board | substrate G, it is also possible to hold | maintain only the one side edge part of the board | substrate G, and to carry a board | substrate.

  The present invention is not limited to the levitation conveyance spinless coating method as in the above embodiment. A substrate is fixedly mounted horizontally on a mounting stage, and a resist solution is discharged onto the substrate in a strip shape while the long resist nozzle is moved in the horizontal direction perpendicular to the longitudinal direction of the nozzle above the substrate. The present invention can also be applied to a spinless coating method.

  The above-described embodiment relates to a resist coating apparatus in a coating / development processing system for LCD manufacturing. However, the present invention is applicable to any processing apparatus or application that supplies a processing liquid onto a substrate to be processed. Therefore, as the processing liquid in the present invention, in addition to the resist liquid, for example, a coating liquid such as an interlayer insulating material, a dielectric material, and a wiring material can be used, and a developing liquid or a rinsing liquid can also be used. The substrate to be processed in the present invention is not limited to an LCD substrate, and other flat panel display substrates, semiconductor wafers, CD substrates, glass substrates, photomasks, printed substrates, and the like are also possible.

It is a top view which shows the structure of the application | coating development processing system which can apply this invention. It is a flowchart which shows the procedure of the process in the application | coating development processing system of embodiment. It is a schematic plan view showing the entire configuration of a resist coating unit and a vacuum drying unit in the coating and developing treatment system of the embodiment. It is a perspective view which shows the whole structure of the resist coating unit in embodiment. It is a schematic front view which shows the whole structure of the resist coating unit in embodiment. It is a top view which shows an example of the array pattern of the jet nozzle and suction inlet in the stage application | coating area | region in the said resist application unit. It is a partial cross section schematic side view which shows the structure of the board | substrate conveyance part in the said resist application unit. It is an expanded sectional view which shows the structure of the holding | maintenance part of the board | substrate conveyance part in the said resist application unit. It is a perspective view which shows the structure of the pad part of the board | substrate conveyance part in the said resist application unit. It is a perspective view which shows one modification of the holding | maintenance part of the board | substrate conveyance part in the said resist application unit. It is a figure which shows the structure of the nozzle raising / lowering mechanism, nozzle horizontal movement mechanism, compressed air supply mechanism, and vacuum supply mechanism in the said resist application unit. It is a partial cross section side view which shows the structural example which integrates an optical distance sensor in a resist nozzle in the said resist application unit, and attaches it to a nozzle support body. It is a partial cross section front view which shows the structure in the nozzle standby part in the said resist application unit. It is a block diagram which shows the main structures of the control system in the said resist application unit. It is a figure which expands and shows the principal part of the priming process in the said resist application unit. It is a partial expanded sectional view which shows the liquid film state formed in the lower end part of a resist nozzle by the said priming process. It is a side view which shows a liquid landing state when a resist nozzle is lowered | hung to the application | coating start position on a board | substrate after a priming process in the said resist application unit. It is a side view which shows application | coating scanning. It is a side view which shows the alignment of priming in the said resist application unit. FIG. 5 is a schematic plan view showing a positional relationship between a registration nozzle and a priming roller when the registration nozzle is inclined in the horizontal direction in priming alignment. It is a figure which shows the reflected light intensity distribution of the X direction obtained by the optical distance sensor on either side when a resist nozzle inclines in a horizontal direction with respect to a priming roller in alignment of priming. FIG. 5 is a schematic plan view showing a state in which a resist nozzle is made parallel to a priming roller by correcting a horizontal inclination in priming alignment. FIG. 5 is a schematic plan view showing a positional relationship between a registration nozzle and a priming roller when the registration nozzle is inclined in a vertical direction in priming alignment. FIG. 6 is a schematic side view showing a state in which the vertical nozzle is corrected by priming alignment and the resist nozzle is made parallel to the priming roller. It is a partial cross section side view which shows the structural example which attaches an optical distance sensor to a nozzle support body separately with a resist nozzle in 2nd Example. It is a schematic front view which shows the effect | action in a 2nd Example. It is a perspective view which shows the incidental effect | action in a 2nd Example. It is a schematic front view which shows the incidental effect | action in a 2nd Example. It is a fragmentary perspective view which shows a liquid landing state when a long resist nozzle is lowered | hung to the application | coating start position on a board | substrate after a priming process.

Explanation of symbols

40 resist coating unit (CT)
75 Nozzle lifting mechanism 76 Stage 77 Nozzle horizontal movement mechanism 78 Resist nozzle 84 Substrate transport unit 93 Resist liquid supply mechanism 100 Transport drive unit 132 (132L, 132R) Vertical motion mechanism 134 Nozzle support 135 (135L, 135R) Horizontal motion mechanism 162 (162L, 162R) Optical distance sensor 164 (164L, 164R) Vertical linear scale 166 (166L, 166R) Horizontal linear scale 172 Priming processing unit 188 Priming roller 192 Priming roller rotation support mechanism 198 Controller

Claims (17)

In order to prepare for the coating process, a long gap between the discharge port at the lower end of the nozzle and the top of the columnar priming roller is formed on the long coating nozzle used in the spinless coating process. It is a coating method in which a treatment liquid is discharged from the nozzle while facing each other while rotating the priming roller, and a priming process is performed to form a liquid film of the treatment liquid at the lower end of the nozzle after completion of the discharge,
A sensor for detecting a relative position or distance with respect to an object directly below is provided on the nozzle side,
The nozzle and the sensor are moved relative to the priming roller so as to cross horizontally above, and a specific position where the distance between the sensor and the priming roller is minimized is detected. A coating method for determining the priming position based on a specific position.   The coating method according to claim 1, wherein an optical distance sensor for optically measuring a distance from an object directly below is used as the sensor.   The coating method according to claim 1, wherein an optical position sensor for measuring light intensity of light reflected from an object directly below is used as the sensor.   In order to position the nozzle and the priming roller relative to the priming position, the rotation axis of the priming roller is disposed at a predetermined fixed position, and the nozzle is perpendicular to the first vertical direction and the longitudinal direction of the nozzle. The coating method according to claim 1, wherein the coating method is movable in a horizontal second direction.   In order to relatively position the nozzle and the priming roller at the priming position, the nozzle is movable in a first vertical direction, and the rotation axis of the priming roller is set at a predetermined height position in the longitudinal direction of the nozzle. The coating method according to claim 1, wherein the coating method is movable in a second horizontal direction orthogonal to the direction.   A pair of the sensors are provided on both ends in the longitudinal direction of the nozzle to detect first and second positions at which distance intervals between both the sensors and the priming roller are minimized, respectively, The coating method according to claim 1, wherein the priming position is determined based on a second position.   The difference between the first position and the second position in the horizontal direction orthogonal to the longitudinal direction of the nozzle is obtained, and at least one of the nozzle and the priming roller is substantially within a horizontal plane so as to cancel the difference. The coating method according to claim 6, wherein the coating method is displaced in a rotational direction. Find the difference between the first distance measured at the first position and the second distance measured at the second position in the vertical direction, and vertically position the nozzle so as to cancel the difference. The coating method according to claim 6, wherein the coating method is displaced in a direction substantially rotating in a plane.   Determining the difference between a first distance measured at the first position in the vertical direction and a second distance measured at the second position, and canceling the difference between the nozzle and the nozzle The coating method according to claim 6, wherein at least one of the priming rollers is displaced in a direction substantially rotating in a vertical plane.   The coating method according to claim 1, wherein the sensor is directly attached to the nozzle.   The coating method according to claim 1, wherein the nozzle and the sensor are individually attached to a common support.   The coating method according to claim 11, wherein a relative positional relationship of the nozzle with respect to the support is inspected before performing the priming alignment.   In the inspection, the nozzle is positioned at a reference position set above the stage by using a position or distance sensor provided on the stage side for supporting the substrate substantially horizontally in order to perform the coating process. The coating method according to claim 12, comprising a step of reading the position of the support.   The substrate for coating treatment introduced into the coating region of the stage is formed with a gap for coating processing between a discharge port of the nozzle and the substrate using a sensor on the nozzle side. The coating method as described in any one of these. A stage that supports the substrate to be processed substantially horizontally;
A long coating nozzle for discharging the processing liquid from above to the substrate on the stage in order to apply the processing liquid on the substrate;
A horizontal movement unit that moves the application nozzle relative to the substrate in a horizontal first direction orthogonal to the nozzle longitudinal direction;
An elevating unit that moves the coating nozzle relative to the substrate in a vertical direction;
At a predetermined priming position for preparation of the coating process, the discharge port at the lower end of the nozzle and the top of the cylindrical priming roller face each other with a desired gap therebetween, and the priming roller is rotated while the priming roller is rotated. A priming processing unit that discharges the processing liquid and forms a liquid film of the processing liquid at the lower end of the nozzle after the discharge is completed;
A sensor provided integrally with the nozzle to detect a relative position or distance with respect to an object directly below;
The specific position where the distance between the sensor and the priming roller is minimized is detected by moving the nozzle and the sensor relative to the priming roller so as to cross horizontally above the priming roller. And a priming position determination unit that determines the priming position based on the specific position.   The coating apparatus according to claim 15, wherein the stage is a floating type stage that floats and supports the substrate by the pressure of gas ejected from the upper surface of the stage. The coating apparatus according to claim 15, wherein the stage is a suction-fixed type stage that places the substrate on the stage upper surface and sucks and fixes the substrate by a vacuum force.

Images