KR102525265B1 - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

[Problem] To provide a technique for favorably applying a treatment liquid to a substrate conveyed with a levitation force applied thereto.
[Solution] The coating device 1 includes a conveying mechanism 5 for moving the floating substrate W to which the floating force is applied by the floating stage unit 3 in the X direction, and the vertical movement of the floating substrate W A measuring instrument 72 for measuring a position and a measuring instrument moving part 76 for moving the measuring instrument 72 in the Y direction are provided. The measuring device 72 measures the vertical position of the floating substrate W at a plurality of different points in the Y direction by being moved in the Y direction.

Description

Substrate processing apparatus and substrate processing method {SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD}

The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly, to a technique for preferably applying a processing liquid to a substrate transported with a levitation force applied thereto. Substrates to be processed include, for example, semiconductor substrates, flat panel display (FPD) substrates such as liquid crystal display devices and organic EL (electroluminescence) display devices, optical disk substrates, magnetic disk substrates, and magneto-optical disk substrates. Substrates, photomask substrates, ceramic substrates, and solar cell substrates are included.

BACKGROUND ART In manufacturing processes of electronic components such as semiconductor devices and liquid crystal display devices, a coating device for applying a coating liquid to the surface of a substrate is used. In such an application device, while transporting the substrate in a state where the substrate is raised by spraying air on the back side of the substrate, the substrate is extended in the width direction of the substrate with respect to the surface (corresponding to the main surface of the substrate). An apparatus for discharging a coating liquid from a nozzle to apply a coating liquid to a substrate is known (for example, Patent Document 1).

In the substrate processing apparatus described in Patent Literature 1, the substrate is transported by moving the substrate in a horizontal direction while holding the periphery of the substrate while the substrate is raised in a horizontal posture on a floating stage, and the substrate is transported, and the substrate is applied from a slit nozzle disposed above the substrate transport path. discharge the liquid

In the substrate processing apparatus of Patent Literature 1, an optical distance sensor for measuring the floating height of the substrate is provided above the substrate. It is possible to supply the coating liquid while adjusting the height of the slit nozzle according to the floating height of the substrate.

Japanese Unexamined Patent Publication No. 2012-142583

However, in Patent Literature 1, since the optical distance sensor is fixed to the slit nozzle, the floating height of the substrate can be measured only at a fixed position in the transverse direction (transverse direction of the substrate) orthogonal to the transport direction. For this reason, distribution of the floating height in the transverse direction of the substrate could not be obtained. For example, when the levitation height of the substrate in the horizontal direction varies due to insufficient levitation force of the levitation stage or the like, there is a concern that coating failure of the treatment liquid may occur.

Therefore, an object of the present invention is to provide a technique for favorably applying a processing liquid to a substrate transported with a levitation force applied thereto.

In order to solve the above problems, a first aspect is a substrate processing apparatus for processing a substrate having a first main surface and a second main surface, wherein the first main surface is provided with a lifting mechanism for imparting a lifting force to a substrate upward in the vertical direction; , a transport mechanism for moving the substrate to which the levitation force is applied, in a first horizontal direction, and a discharge port extending in a second direction, a horizontal direction orthogonal to the first direction, wherein the levitating substrate a nozzle capable of discharging the processing liquid toward the first main surface of the substrate through the discharge port, a measuring device for measuring a vertical position of the floating substrate, and a measuring device moving mechanism for moving the measuring device in the second direction.

A second aspect is the substrate processing apparatus of the first aspect, wherein the measuring device moving mechanism moves the measuring device upstream and downstream in the second direction and the first direction.

A 3rd aspect is the substrate processing apparatus of the 2nd aspect, It is a position on the upstream side of the said 1st direction with respect to the said nozzle, and at least a shock absorber provided in the position overlapping with the tip part of the said discharge port of the said nozzle in the horizontal direction further comprises provide

A fourth aspect is the substrate processing apparatus of the third aspect, wherein the measuring instrument moving mechanism moves the measuring instrument to the floating substrate at an attaching horizontal position, which is a horizontal position in which the processing liquid from the nozzle is attached to the floating substrate. is moved in the second direction from a position where the vertical position of the floating substrate can be measured to a position where the vertical position of the floating substrate can be measured in a horizontal position of the shock absorber when the nozzle discharges the treatment liquid.

A fifth aspect is the substrate processing apparatus according to any one of the first to fourth aspects, including a plurality of measuring devices for measuring vertical positions of the floating substrates at different positions in the second direction.

A 6th aspect is the substrate processing apparatus of the 5th aspect, further comprising a connector connecting the plurality of measuring devices, and the measuring device moving mechanism moves the connecting tool in the second direction.

A seventh aspect is the substrate processing apparatus according to any one of the first to sixth aspects, wherein the lifting mechanism includes a stage having a horizontal surface, and a plurality of stages formed on the horizontal surface and blowing air upward in the vertical direction. and a plurality of suction ports formed on the horizontal surface and sucking air upward in the vertical direction.

An eighth aspect is the substrate processing apparatus according to any one of the first to seventh aspects, wherein the measuring instrument moving mechanism is such that an end portion of the floating substrate on a downstream side in the first direction is disposed on the first surface of the stage. In a state of being disposed at the edge portion on the downstream side of the direction, the measuring device is moved in the second direction.

A ninth aspect is a substrate processing method for processing a substrate having a first main surface and a second main surface, comprising: (a) a step of imparting a levitation force to a substrate in which the first main surface is vertically upward; (b) the above Step (a) of moving the substrate to which the levitation force is applied in a horizontal first direction, (c) measuring a vertical position of the levitation substrate in the first direction and measuring the vertical position of the floating substrate at a plurality of points in the second direction by moving it in a second direction, which is an orthogonal horizontal direction.

According to the substrate processing apparatus of the first aspect, the vertical position can be measured along the second direction by moving the measuring device in the second direction. For this reason, the vertical position can be measured at a plurality of points along the second direction of the substrate. In this way, in the second direction, since it is possible to detect a height higher than the floating height of the substrate by the floating mechanism, the processing liquid can be applied to the substrate satisfactorily.

According to the substrate processing apparatus of the second aspect, the vertical position of a plurality of in-plane points of the first main surface of the substrate can be measured by moving the substrate in the first direction and the second direction.

According to the substrate processing apparatus of the third aspect, when there is a foreign substance on the substrate, the buffer unit collides with the foreign substance before the discharge port of the nozzle. In this way, the front end of the nozzle can be protected from foreign matter.

According to the substrate processing apparatus of the fourth aspect, when the processing liquid is discharged from the nozzle, since the vertical position of the substrate can be measured at the horizontal position where the buffer unit is disposed, an abnormality in the floating height at the position of the buffer unit is detected. can do. Therefore, it is possible to reduce contact of the substrate to the buffer portion during the application process.

According to the substrate processing apparatus of the fifth aspect, since the vertical position of the floating substrate can be measured simultaneously at a plurality of points, the moving distance can be shortened compared to the case where a single measuring device is moved in the Y direction, so the measurement time can be shortened. can be shortened

According to the substrate processing apparatus of the sixth aspect, a plurality of measuring devices can be moved integrally. For this reason, compared with the case where a some measuring device is moved independently, the structure of a moving mechanism can be simplified.

According to the substrate processing apparatus of the seventh aspect, the substrate to be processed can be conveyed accurately by blowing air while also sucking it.

According to the substrate processing apparatus of the eighth aspect, since the downstream end of the floating substrate is disposed at the downstream edge of the stage, the substrate lifting height due to clogging of the suction port formed at the downstream end of the stage abnormality can be detected.

According to the substrate processing method of the ninth aspect, the vertical position can be measured along the second direction by moving the measuring device in the second direction. For this reason, the vertical position can be measured at a plurality of points along the second direction of the substrate. In this way, in the second direction, since it is possible to detect a height higher than the floating height of the substrate by the floating mechanism, the processing liquid can be applied to the substrate satisfactorily.

1 is a side view schematically showing the entire configuration of an application device 1 that is an example of a substrate processing device according to an embodiment.
Fig. 2 is a schematic plan view of the applicator 1 of the embodiment seen from above in the vertical direction.
3 is a schematic plan view showing the applicator 1 excluding the applicator 6 of the embodiment.
FIG. 4 is a schematic cross-sectional view of the coating device 1 at a position along line AA shown in FIG. 2 .
5 is a schematic plan view showing a part of the floating stage part 3 of the embodiment.
6 is a schematic plan view showing the nozzle support 601 and the measuring unit 70 .
7 is a schematic side view showing the nozzle 61, the measurement unit 70, and the shock absorber 80. As shown in FIG.
8 is a schematic front view showing the nozzle 61, the measurement unit 70, and the shock absorber 80. As shown in FIG.
9 is a schematic block diagram showing the control unit 9 of the embodiment.
Fig. 10 is a diagram showing each step of the vertical position measurement process executed by the coating device 1.
Fig. 11 is a diagram showing each step of the vertical position measurement process executed by the coating device 1.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described, referring an accompanying drawing. In addition, the constituent elements described in this embodiment are examples only, and are not intended to limit the scope of the present invention only to them. In the drawings, for ease of understanding, the dimensions and numbers of each part may be exaggerated or simplified as needed.

Expressions indicating relative or absolute positional relationships (for example, "parallel", "orthogonal", "center", "concentric", "coaxial", etc.) not only strictly represent the positional relationship, but also have tolerances or equivalent A relatively displaced state with respect to an angle or a distance within a range where a function of precision is obtained is also assumed to be indicated. Expressions indicating the same state (for example, "same", "same", "homogeneous", "consistent", etc.), unless otherwise specified, not only represent strictly the same state quantitatively, but also tolerance or equivalent function It is also assumed that the state in which this obtained difference exists is also indicated. Expressions indicating a shape (for example, "rectangular shape" or "cylindrical shape", etc.), unless otherwise specified, not only represent the shape strictly geometrically, but also to the extent that the same degree of effect is obtained, for example For example, shapes having irregularities, chamfers, and the like are also shown. "Phase of to" includes a case where two elements are apart from each other as well as a case where two elements are in contact unless otherwise specified.

<1. 1st Embodiment>

1 is a side view schematically showing the overall configuration of an application device 1 that is an example of a substrate processing device according to an embodiment. 2 is a schematic plan view of the applicator 1 of the embodiment viewed from above in the vertical direction. 3 is a schematic plan view showing the applicator 1 excluding the applicator 6 of the embodiment. 4 is a schematic cross-sectional view of the coating device 1 at a position along line A-A shown in FIG. 2 . 5 is a schematic plan view showing a part of the floating stage part 3 of the embodiment.

The coating device 1 holds the rectangular substrate W in a horizontal posture (a posture in which the upper surface Wf (first main surface) and lower surface (second main surface) of the substrate W are parallel to the horizontal plane (XY plane) ), and also applies a processing liquid (coating liquid) to the upper surface Wf of the substrate W. In each drawing, in order to clarify the positional relationship of the respective parts of the coating device 1, the direction parallel to the first direction D1 in which the substrate W is conveyed is set as the "X direction", and from the input conveyor 100 The direction toward the output conveyor 110 is referred to as the "+X direction", and the opposite direction is referred to as the "-X direction". The horizontal direction orthogonal to the X direction is referred to as the "Y direction", the forward direction in Fig. 1 is referred to as the "−Y direction", and the opposite direction is referred to as the "+Y direction". The vertical direction orthogonal to the X and Y directions is referred to as the Z direction, and the upward direction toward the coating mechanism 6 side as seen from the floating stage portion 3 is referred to as the "+Z direction", and the reverse direction is referred to as the "-Z direction".

The basic configuration and operation principle of the coating device 1 are partially common or similar to those described in Japanese Unexamined Patent Publication No. 2010-227850 and Japanese Unexamined Patent Publication No. 2010-240550. So, in this specification, among each structure of the coating device 1, the same as what was described in these well-known literatures, or the structure which can be easily inferred based on technical common sense, etc., may be omitted suitably.

The coating device 1 sequentially along the first direction D1 (+X direction) in which the substrate W is conveyed includes an input conveyor 100, an input transfer unit 2, a lifting stage unit 3, and an output transfer unit. A part (4) and an output conveyor (110) are provided. These are arranged so as to be close to each other, and the conveyance path of the substrate W is formed by them. In the following description, when expressing a positional relationship in relation to the first direction D1, which is the transport direction of the substrate, "upstream side in the first direction" is simply referred to as "upstream side" and "downstream side in the first direction D1". ” is sometimes abbreviated as “downstream”. In this example, when viewed from a certain reference position, the -X side is the "upstream side" and the +X side is the "downstream side".

The input conveyor 100 includes a roller conveyor 101 and a rotation drive mechanism 102 that rotationally drives the roller conveyor 101 . By the rotation of the roller conveyor 101, the board|substrate W is conveyed downstream (+X side) in a horizontal posture.

The input transfer unit 2 includes a roller conveyor 21 and a rotation drive mechanism 22 that rotates the roller conveyor 21 . When the roller conveyor 21 rotates, the substrate W is conveyed in the +X direction. Moreover, when the roller conveyor 21 moves up and down, the vertical position of the board|substrate W is changed. By the operation of the input transfer unit 2, the substrate W is transferred from the input conveyor 100 to the lifting stage unit 3.

The floating stage part 3 includes three flat stages along the first direction D1. Specifically, the floating stage part 3 is equipped with the entrance floating stage 31, the application|coating stage 32, and the exit floating stage 33 in order along the 1st direction D1. The upper surface of each of these stages is on the same plane.

A plurality of air outlets 31h and 33h for ejecting air (compressed air) supplied from the floating control mechanism 35 are formed in a matrix on the upper surface of each of the inlet floating stage 31 and the exit floating stage 33, there is. The levitation force is buoyant on the substrate W by the compressed air blown out from the plurality of air outlets 31h and 33h, and the lower surface of the substrate W (second main surface) is separated from the upper surfaces of the stages 31 and 33. It is supported in a horizontal position in one state. The distance between the lower surface of the substrate W and the upper surfaces of the stages 31 and 33 may be, for example, 10 - 500 µm (micrometers).

As shown in FIG. 5 , on the upper surface of the coating stage 32, a plurality of air outlets 321h for blowing air (compressed air) and a plurality of suction ports 322h for sucking the atmosphere above the coating stage 32 ) is formed. On the upper surface of the application stage 32, the ejection port 321h and the suction port 322h are formed alternately along the X direction and the Y direction. The floating control mechanism 35 controls the amount of compressed air ejected from each ejection port 321h and the suction amount of the atmosphere from each suction inlet 322h to achieve a balance, so that the lower surface of the substrate W and the coating stage 32 The distance of the top surface of is precisely controlled. Thereby, the vertical position of the upper surface Wf of the substrate W passing above the coating stage 32 is controlled to a preset value. As a structure of the floating stage part 3, you may apply what was described in Unexamined-Japanese-Patent No. 2010-227850.

The application stage 32 has an upstream area|region 32A, a middle area|region 32B, and downstream area|region 32C sequentially toward +X direction. Here, each of the three regions obtained by dividing the upper surface of the application stage 32 by 1/3 in the X direction is an upper region 32A, a middle region 32B, and a lower region 32C, and the middle region 32B is It becomes the area|region which occupies the center of the upper surface of the application|coating stage 32.

The distribution density (quantity per unit area) of the jetting port 321h and the suction port 322h is larger on the middle region 32B side than each of the upstream region 32A and the downstream region 32C. For this reason, the intermediate region 32B can control the floating amount of the substrate W more accurately than each of the upstream region 32A and the downstream region 32C.

An application position L11 of the nozzle 61 is set above the middle region 32B. That is, in a state where the discharge port 611 of the nozzle 61 is disposed above the intermediate region 32B, the substrate W to which the levitation force is applied from the coating stage 32 (hereinafter referred to as "floating substrate W") Also referred to as.), the processing liquid from the discharge port 611 is supplied. Further, the horizontal position, which is the position in the horizontal direction when the processing liquid discharged from the discharge port 611 is attached to the floating substrate W, is also above the intermediate region 32B. In this way, by supplying the processing liquid to the floating substrate W on the intermediate region 32B where the amount of floating can be precisely controlled, the coating process can be satisfactorily performed.

The board|substrate W carried into the lifting stage part 3 via the input transfer part 2 acquires the propulsion force in the +X direction by the rotation of the roller conveyor 21, and is raised to the entrance lifting stage 31 is returned Transport of the substrate W in the floating stage unit 3 is performed by the transport mechanism 5 .

The transport mechanism 5 includes a chuck 51 and a suction/travel control mechanism 52 . The chuck 51 supports the substrate W from below by partially abutting the periphery of the lower surface of the substrate W. The suction/travel control mechanism 52 has a function of adsorbing and holding the substrate W on the chuck 51 by applying a negative pressure to the suction pad provided on the upper end of the chuck 51 . In addition, the suction/travel control mechanism 52 has a function of reciprocating the chuck 51 linearly along the X direction.

In the state where the substrate W is held by the chuck 51, the lower surface of the substrate W is located on the +Z side of the upper surfaces of the respective stages 31, 32, and 33 of the floating stage unit 3. The board|substrate W adsorbs and holds the periphery by the chuck 51, and maintains a horizontal posture as a whole by the levitation force applied from the levitation stage part 3.

The substrate W carried from the input transfer unit 2 to the lifting stage unit 3 is held by the chuck 51, and in this state, the chuck 51 moves in the +X direction so that the substrate W is lifted at the entrance. It is conveyed from above the stage 31 via above the application stage 32 to above the exit floating stage 33 . The board|substrate W is passed to the output transfer part 4 arrange|positioned on the +X side of the exit floating stage 33.

The output transfer unit 4 includes a roller conveyor 41 and a rotation drive mechanism 42 that rotationally drives the roller conveyor 41 . When the roller conveyor 41 rotates, a driving force in the +X direction is applied to the substrate W, and the substrate W is conveyed in the first direction D1. By the operation of the output transfer unit 4, the substrate W is transferred to the output conveyor 110 from above the exit floating stage 33.

The output conveyor 110 includes a rotation drive mechanism 112 that rotates the roller conveyor 111 . By rotation of the roller conveyor 111, the substrate W is conveyed in the +X direction and discharged to the outside of the coating device 1. The input conveyor 100 and the output conveyor 110 may be provided as some parts of the coating device 1, but may be separate from the coating device 1. For example, the input conveyor 100 may be a substrate discharge mechanism of another unit installed upstream of the coating device 1 . In addition, the output conveyor 110 may be a substrate receiving mechanism of another unit provided on the downstream side of the coating device 1 .

An application mechanism 6 for applying a treatment liquid to the upper surface Wf of the substrate W is installed on the transport path of the substrate W. The application mechanism 6 includes a nozzle unit 60 including a nozzle 61 for discharging the treatment liquid, a nozzle moving mechanism 63 for positioning the nozzle 61, and a maintenance unit for maintaining the nozzle 61 ( 65) is provided.

The nozzle 61 is a member extending in a second direction D2 (Y direction), which is a horizontal direction orthogonal to the first direction D1. The lower end of the nozzle 61 has a discharge port 611 extending in the width direction and opening downward. The processing liquid is discharged from the discharge port 611 .

The nozzle moving mechanism 63 moves the nozzle 61 in the X direction and the Z direction to determine its position. By the operation of the nozzle moving mechanism 63, the nozzle 61 is positioned at the application position L11 above the application stage 32. With the nozzle 61 positioned at the application position L11, the nozzle 61 discharges the processing liquid toward the upper surface Wf of the substrate W, thereby applying the processing liquid to the substrate W. In this way, the application position (L11) is the position of the nozzle 61 when performing application.

With the nozzle 61 disposed at the application position L11, the processing liquid is discharged onto the substrate W, so that the processing liquid is applied to the inner area to be coated excluding the periphery of the upper surface Wf of the substrate W. A coating film of is formed.

The maintenance unit 65 includes a bat 651 , a preliminary discharge roller 652 , a nozzle cleaner 653 and a maintenance control mechanism 654 . The vat 651 stores the cleaning liquid used for cleaning the nozzle 61 . The maintenance control mechanism 654 controls the preliminary discharge roller 652 and the nozzle cleaner 653 . As a structure of the maintenance unit 65, you may apply the structure described in Unexamined-Japanese-Patent No. 2010-240550, for example.

The nozzle moving mechanism 63 positions the nozzle 61 at the preliminary discharge position L13 where the discharge port 611 faces the surface of the preliminary discharge roller 652 from above. The nozzle 61 discharges the treatment liquid from the discharge port 611 to the surface of the preliminary discharge roller 652 at the preliminary discharge position L13 (preliminary discharge treatment). The nozzle 61 is positioned at the preliminary discharge position L13 before being positioned at the above-described application position L11 to perform a preliminary discharge process. This makes it possible to stabilize the discharge of the processing liquid to the substrate W from the initial stage. When the maintenance control mechanism 654 rotates the preliminary discharge roller 652, the treatment liquid discharged from the nozzle 61 is mixed with the cleaning liquid stored in the vat 651 and is recovered.

The nozzle moving mechanism 63 positions the nozzle 61 at a cleaning position L14 where its front end (including the discharge port 611 and the area around it) opposes the nozzle cleaner 653 upward. do. In the state where the nozzle 61 is at the cleaning position L14, the nozzle cleaner 653 moves in the width direction (Y direction) of the nozzle 61 while discharging the cleaning liquid, thereby removing the treatment attached to the front end of the nozzle 61. The liquid, etc., is washed away.

The nozzle moving mechanism 63 may position the nozzle 61 at a standby position lower than the washing position L14 and where the lower end of the nozzle 61 is housed in the bat 651 . When the coating process using the nozzle 61 is not executed in the coating device 1, the nozzle 61 may be positioned at the standby position. Although not shown, a stand-by pod for preventing drying of the treatment liquid at the discharge port 611 of the nozzle 61 positioned at the stand-by position may be provided.

In Fig. 1, the nozzle 61 at the pre-discharge position L13 is indicated by a solid line, and the nozzles 61 at the application position L11, the downstream position L12, and the washing position L14 are indicated by broken lines, respectively.

Although the application mechanism 6 of this embodiment is equipped with only one nozzle 61, you may be equipped with several nozzle 61. A plurality of nozzles 61 may be provided at intervals along the first direction D1. In this case, different processing liquids may be applied to the substrate W by supplying different processing liquids to the plurality of nozzles 61 . Moreover, you may provide the nozzle moving mechanism 63 and the maintenance unit 65 corresponding to each nozzle 61, respectively. In addition, the maintenance unit 65 may be used in common by two or more nozzles 61 .

As shown in FIG. 4 , the nozzle unit 60 includes a cross-beam member 631 extending in the Y-direction above the floating stage portion 3 and two pillars that support both end portions of the cross-beam member 631. It has a cross-linked structure including members 632 and 633. The pillar members 632 and 633 are vertically formed upward from the base 10 . A lifting mechanism 634 is attached to the pillar member 632 , and a lifting mechanism 635 is attached to the pillar member 633 . The elevating mechanisms 634 and 635 include, for example, ball screw mechanisms. The +Y side end of the cross-beam member 631 is attached to the elevating mechanism 634, and the -Y-side end of the cross-beam member 631 is attached to the elevating mechanism 635, and the cross-beam member ( 631) is supported. When the elevating mechanisms 634 and 635 interlock according to the control command from the control unit 9, the cross-beam member 631 moves in the vertical direction (Z direction) with the horizontal posture.

As shown in the figure, a nozzle support body 601 extending in the Y-axis direction is provided in the center lower part of the cross-beam member 631 . As shown in FIGS. 7 and 8 , an intermediate portion 603 having an L-shape when viewed from the -Y side side is attached to the lower portion of the nozzle support body 601 . The nozzle 61 is attached to the lower part of the horizontally extending part of the intermediate part 603 . The nozzle 61 is attached to the nozzle support 601 with the discharge port 611 facing downward. When the lifting mechanisms 634 and 635 operate, the nozzle support 601 and the nozzle 61 move in the vertical direction (Z direction).

The pillar members 632 and 633 are configured to be movable on the base 10 . Two travel guides 81L and 81R extending in the X direction are provided at +Y side end portions and -Y side end portions on the upper surface of the base 10 . The pillar member 632 is engaged with the travel guide 81L on the +Y side through a slider 636 attached thereto, and the pillar member 633 is engaged through a slider 637 attached thereto - It is engaged with the travel guide 81R on the Y side. Sliders 636 and 637 are freely movable in the X direction along travel guides 81L and 81R.

The pillar members 632 and 633 are moved in the X direction by the operation of the linear motors 82L and 82R. The linear motors 82L and 82R include a magnet module as a stator and a coil module as a mover. The magnet module is installed on the base 10 and extends in the X direction. The coil module is mounted under each of the pillar members 632 and 633 . When the movers of the linear motors 82L and 82R operate according to a control command from the control unit 9, the nozzle unit 60 as a whole moves along the X direction. This realizes the movement of the nozzle 61 in the X direction (first direction D1). The positions of the pillar members 632 and 633 in the X direction are detected by linear scales 83L and 83R provided near the sliders 636 and 637 .

In this way, the nozzle support 601 and the nozzle 61 move in the Z direction by the operation of the elevating mechanisms 634 and 635 and move in the X direction by the operation of the linear motors 82L and 82R. That is, when the control unit 9 controls the lifting mechanisms 634 and 635 and the linear motors 82L and 82R, positioning of the nozzle 61 to each of the stop positions L11-L14 is realized. Accordingly, the elevating mechanisms 634 and 635 and the linear motors 82L and 82R function as the nozzle moving mechanism 63 .

As the maintenance unit 65, you may employ what was described in Unexamined-Japanese-Patent No. 2010-240550. The bat 651 is supported by a cross-beam member 661 extending in the Y direction. Among both ends of the beam member 661, one end is supported by the pillar member 662, and the other end is supported by the pillar member 663. The pillar members 662 and 663 are attached to both ends in the Y direction of a plate 664 extending in the Y direction, respectively.

Below both ends of the plate 664, two travel guides 84L and 84R extending in the X direction are provided. Two traveling guides 84L and 84R are installed on the upper surface of the base 10 . Of both ends in the Y direction of the lower surface of the plate 664, a slider 666 is provided at the +Y side end, and a slider 667 is provided at the -Y side end. The sliders 666 and 667 are engaged with the traveling guides 84L and 84R, and are freely movable in the X direction.

Below the plate 664, a linear motor 85 is installed. The linear motor 85 includes a magnet module as a stator and a coil module as a mover. The magnet module is attached to the base 10 and extends in the X direction. The coil module is installed under the maintenance unit 65 (here, the plate 664).

When the linear motor 85 operates according to the control command from the control unit 9, the maintenance unit 65 as a whole moves in the X direction. The position of the maintenance unit 65 in the X direction is detected by a linear scale 86 provided near the sliders 666 and 667 .

As shown in Fig. 4, the chuck 51 includes two chuck members 51L and 51R. Chuck members 51L and 51R have shapes symmetrical to each other with respect to the XZ plane, and are disposed apart from each other in the Y direction.

The chuck member 51L disposed on the +Y side is supported by a traveling guide 87L that is installed on the base 10 and extends in the X direction. The chuck member 51L includes two horizontal plate portions disposed at different positions in the X direction, and a base portion 512 including a connecting portion connecting these plate portions (see Fig. 2). Sliders 511 are provided below the two plate portions of the base portion 512 one by one. The slider 511 is engaged with the travel guide 87L, whereby the chuck member 51L can travel in the X direction along the travel guide 87L.

On each upper part of the two plate parts of the base part 512, one support part 513 is provided. The support portion 513 extends upward and has a suction pad (not shown) at its upper end. When the base part 512 moves in the X direction along the running guide 87L, the two support parts 513 move in the X direction integrally with this. Further, the two plate portions of the base portion 512 may be separated from each other, and these plate portions may move while maintaining a constant distance in the X direction, thereby apparently functioning as an integral base portion. If this distance is set according to the length of the substrate, it becomes possible to correspond to substrates of various lengths.

The chuck member 51L is moved in the X direction by the linear motor 88L. The linear motor 88 includes a magnet module as a stator and a coil module as a mover. The magnet module is installed on the base 10 and extends in the X direction. The coil module is installed under the chuck member 51L. When the linear motor 88L operates according to the control command from the control unit 9, the chuck member 51L moves along the X direction. The position of the chuck member 51L in the X direction is detected by a linear scale 89L provided near the traveling guide 87L.

The chuck member 51R provided on the -Y side is provided with a base portion 512 and two support portions 513 and 513, similarly to the chuck member 51L. Also, the shape of the chuck member 51R is symmetrical to that of the chuck member 51L with respect to the XZ plane. One slider 511 is provided below the two plate portions of the base portion 512 of the chuck member 51R. The slider 511 is engaged with the travel guide 87R, so that the chuck member 51R can travel in the X direction along the travel guide 87R.

The chuck member 51R is movable in the X direction by the linear motor 88R. The linear motor 88R extends in the X direction and includes a magnet module as a stator installed on the base 10 and a coil module as a mover installed under the chuck member 51R. When the linear motor 88R operates according to the control command from the control unit 9, the chuck member 51R moves in the X direction. The position of the chuck member 51R in the X direction is detected by a linear scale 89R provided near the traveling guide 87R.

The control unit 9 controls the positions of the chuck members 51L and 51R so that they are always at the same position in the X direction. This causes the pair of chuck members 51L and 51R to move as an integral chuck 51 in appearance. Compared to the case where the chuck members 51L and 51R are mechanically coupled, interference between the chuck 51 and the lifting stage portion 3 can be easily avoided.

As shown in FIG. 3 , the four support portions 513 are disposed corresponding to the four corners of the substrate W to be held. That is, the two supporting parts 513 of the chuck member 51L are the periphery on the +Y side of the substrate W, and each hold an upstream end and a downstream end in the first direction D1. The two supporting parts 513 and 513 of the chuck member 51R are peripheral portions on the -Y side of the substrate W and hold upstream and downstream ends in the first direction D1, respectively. Negative pressure is supplied to the suction pads of each support portion 513 as needed, whereby the four corners of the substrate W are suction-held by the chuck 51 from below.

When the chuck 51 moves in the X direction while holding the substrate W, the substrate W is conveyed. In this way, the linear motors 88L and 88R and the mechanism for supplying negative pressure to each support portion 513 (not shown) function as the suction/travel control mechanism 52 shown in FIG. 1 .

As shown in FIGS. 1 and 4 , the chuck 51 holds the substrate W apart from the upper surfaces of the entrance lifting stage 31 , the application stage 32 , and the exit lifting stage 33 . The chuck 51 holds the lower surface of the substrate W and conveys the substrate W. The chuck 51 retains only a part of the outer edge in the Y direction than the central portion of the substrate W facing each of the stages 31, 32, and 33. For this reason, the central portion of the substrate W is bent downward relative to the peripheral portion. The lifting stage unit 3 applies a lifting force to the central portion of the substrate W in this state, thereby controlling the vertical position of the substrate W and holding the substrate W in a horizontal posture.

<Measurement Unit (70)>

6 is a schematic plan view showing the nozzle support 601 and the measurement unit 70 . 7 is a schematic side view showing the nozzle 61, the measurement unit 70, and the shock absorber 80. As shown in FIG. 8 is a schematic front view showing the nozzle 61, the measurement unit 70, and the shock absorber 80. As shown in FIG.

The application device 1 is equipped with a measuring unit 70 . The measurement unit 70 is provided with a plurality of (here three) measuring devices 72 . Each measuring device 72 measures the vertical position of the upper surface Wf of the substrate W to which the levitation force is applied by the levitation stage part 3 . In detail, the measuring device 72 measures the vertical position of the upper surface Wf by measuring the distance from the predetermined reference position in the vertical direction to the vertical position of the upper surface Wf. From the vertical position of the upper surface Wf measured by the measuring instrument 72, the height of the upper surface Wf can be obtained from the height (vertical position) of the upper surface of the coating stage 32. In addition, from the height of the upper surface Wf and the thickness of the substrate W, it is possible to obtain the floating amount of the substrate W (the distance from the upper surface of the coating stage 32 to the lower surface of the floating substrate W). .

Each meter 72 includes a light projecting unit 72a that outputs light of a predetermined wavelength, and an optical sensor (for example, a line sensor) that detects light output from the light transmitting unit 72a and reflected by the substrate W. It is equipped with the light receiving part 72b containing (refer FIG. 9). The light receiving unit 72b is an example of a reflective sensor that measures the vertical position of the upper surface Wf in a non-contact manner. In addition, the vertical position of the upper surface Wf may be measured by ultrasonic waves instead of being measured by light. In this case, each measurement device 72 should just be equipped with an output part which outputs an ultrasonic wave, and a detection part which detects the ultrasonic wave reflected by the upper surface Wf.

The measuring unit 70 has a coupler 74 connecting the three measuring devices 72 to each other. The coupler 74 is a plate-like member extending in the Y direction, and each measuring device 72 is attached to the side surface on the upstream side (-X side) of the coupler 74 . Here, the three measuring devices 72 are attached to the coupling tool 74 in a state spaced apart in the second direction (Y direction).

The measurement unit 70 is equipped with a measuring device moving part 76 (measuring device moving mechanism). The measuring instrument moving part 76 is connected to the +X side of the coupler 74. The measuring instrument moving part 76 is equipped with a drive mechanism, such as a linear motor mechanism or a ball screw mechanism. The measuring instrument moving part 76 moves in the Y direction along the guide rail part 78 (refer to FIG. 8) which extends in the Y direction provided in the central part of the -X side surface of the nozzle support body 601. When the measuring instrument moving part 76 moves in the Y direction, the coupler 74 moves in the Y direction, so that the three measuring instruments 72 move integrally in the Y direction (second direction D2).

As shown in Fig. 8, when the three measuring instruments 72 move in the Y direction, the measuring instrument 72 on the +Y side is the measuring instrument 72 at the center of the Y direction in the measuring range RY1 in the Y direction ( 72) measures the vertical position of the floating substrate W in the measurement range RY2 in the Y direction, and the measuring device 72 on the -Y side measures the vertical position of the floating substrate W in the measurement range RY3 in the Y direction. As shown in Fig. 8, each measurement range (RY1, RY2, RY3) may have an overlap in the Y direction, but this is not essential.

The three measuring devices 72 are installed on the upstream side (-X side) with respect to the nozzle 61 . Since each meter 72 is connected to the nozzle support 601, it moves together with the nozzle 61 attached to the nozzle support 601. That is, when the nozzle 61 moves in the X direction and the Z direction by the nozzle moving mechanism 63, each measuring device 72 also follows the nozzle 61 and moves in the same direction.

＜Buffer (80)＞

As shown in FIGS. 7 and 8 , a shock absorber 80 is attached to the central portion of the side surface on the -X side of the nozzle support 601 . The buffer portion 80 is a plate-like member extending in the Y-axis direction (second direction D2), and is disposed parallel to the YZ plane. The shock absorber 80 is provided at a position overlapping the discharge port 611 (lower end of the nozzle 61) in the first direction D1.

The shock absorber 80 is disposed upstream of the nozzle 61 in the first direction D1, which is the transport direction. For this reason, when a foreign substance having a height capable of contacting the discharge port 611 adheres to the upper portion of the floating substrate W, the foreign substance contacts the buffer portion 80 before contacting the discharge port 611 . In this way, the foreign matter adheres to the buffer portion 80 and is removed from the floating substrate W, and therefore, contact of the foreign matter with the discharge port 611 can be reduced. In addition, you may install the said vibration sensor which detects that a foreign material contacted the shock absorber part 80 to the shock absorber part 80. Then, when the vibration sensor detects the contact of the foreign matter, the control unit 9 may control the transport mechanism 5 to stop the transport of the floating substrate W.

9 is a schematic block diagram showing the control unit 9 of the embodiment. The application device 1 includes a control unit 9 for controlling the operation of each part. The hardware configuration of the control unit 9 may be the same as that of a general computer. The control unit 9 includes a CPU 91 that performs various arithmetic processes, a ROM that is a memory dedicated to reading and output storing basic programs, a memory 92 that can freely read and write various types of information, and various types of information. A display unit 93 including a display for displaying is provided. The memory 92 includes a main storage device (RAM), as well as a fixed disk for storing control applications (programs) and data. The control unit 9 includes an interface unit in charge of exchanging information with users and external devices, and reading information (programs) stored in a storage medium (optical media, magnetic media, semiconductor memory, etc.) having portability. A reading device may be provided.

<Perpendicular position measurement processing>

The coating device 1 performs an inspection (hereinafter, also referred to as a vertical position measurement process) to acquire the distribution of the vertical position of the substrate W by the coating stage 32 . As described above, in the application stage 32, since the suction port 322h suctions the atmosphere, there are cases where foreign matter is sucked. In this case, when the suction port 322h is clogged, there is a possibility that an abnormality in the floating height of the floating substrate W, such as an insufficient floating height, may occur. The vertical position measurement process is performed to detect such an abnormality in the floating height. The vertical position measurement process may be performed at an appropriate timing according to the manufacturing schedule of the substrate W in the coating device 1 . For example, it may be carried out at the timing of applying the first substrate of the lot, the first substrate of each day, and the first substrate of every afternoon, or may be carried out at the timing of coating all the substrates W.

Although the vertical position measurement process may be performed using a substrate W as an application target on which the treatment liquid is actually applied, the substrate W as an uncoated target on which the treatment liquid is not applied (hereinafter also referred to as "dummy substrate W") referred to as). It is preferable that the dummy board|substrate W has no pattern, such as a wiring pattern, formed on the upper surface Wf. When there is a pattern on the upper surface Wf of the substrate W, the light from the light transmitting portion 72a of the measuring device 72 is reflected in the pattern and is directed in a direction different from that of the light receiving portion 72b, thereby illuminating the light from the upper surface Wf. In some cases, reflected light cannot be detected. Then, by using the dummy board|substrate W which does not have a pattern on the upper surface Wf, the measuring instrument 72 can detect reflected light from the upper surface Wf satisfactorily. Therefore, the measurement of the vertical position can be preferably performed.

10 is a diagram showing each step of the vertical position measurement process executed by the coating device 1 . 10 shows an aspect of the vertical position measurement process performed on the substrate W of the dummy. When the control unit 9 starts the vertical position measurement process, it carries out the carrying-in process S11. In the carrying step S11, the control unit 9 controls the transport mechanism 5 to move the substrate (floating substrate) W to which the levitation force is applied from the levitation stage unit 3 to the downstream in the first direction D1. side (+X direction).

Carry-in process S11 includes stop step S111. In the stop step S111, as shown in FIG. 10(b) , after the control unit 9 controls the conveying mechanism 5 to convey the floating substrate W to the predetermined position LW1, the floating substrate W ) at the predetermined position (LW1). When the floating substrate W is placed at the predetermined position LW1, the horizontal position of the downstream end (top end) of the floating substrate W is the same as the horizontal position of the downstream end (edge part) of the coating stage 32. It is the same or a position slightly upstream of it.

Control unit 9 performs measuring process S12 after stop step S111. Measurement step S12 is a step of measuring the vertical position of the floating substrate W at a plurality of points in the region 32UR above the coating stage 32 by means of the three measuring instruments 72 arranged in the Y direction. . The upper region 32UR is a region covering at least the entire upper region of the middle region 32B, and in this example, the part on the upstream side of the middle region 32B (part of the upper region 32A) and the middle region 32B It is a region covering the upper side of a more downstream part (a part of the downstream region 32C).

In the measurement step S12, as shown in FIG. 10(b), the control unit 9 controls the transport mechanism 5 to move the three measuring devices 72 to the floating substrate (W ) is placed in a horizontal position slightly upstream of the downstream end of In this way, the three measuring devices 72 are in a state in which the vertical position of the floating substrate W in a horizontal position slightly upstream from the downstream end can be measured. In this state, the control unit 9 controls the measuring instrument moving part 76 to move the three measuring instruments 72 in the Y direction (second direction D2). During this Y-direction movement, the control unit 9 measures the vertical position of the floating substrate W with each of the three measuring devices 72 at a predetermined cycle. In this way, the vertical positions of the floating substrate W at a plurality of points on a straight line extending in the Y direction are measured. By the movement of the three measuring devices 72 in the Y direction, not only the area corresponding to the coating target area in the upper surface Wf of the dummy floating substrate W, but also protrudes from that area to the +Y side and -Y side. The vertical position of the floating substrate W may also be measured at the .

When the Y-direction movement of the three measuring devices 72 is completed, the control unit 9 controls the nozzle moving mechanism 63 to move the measuring unit 70 to the upstream side (-X side) of the first direction D1. (move in the X direction). The amount of movement of the three measuring instruments 72 at this time is moved by one pitch, which is a distance smaller than the dimension of the X direction of the application stage 32, more preferably the dimension of the X direction of the intermediate region 32B. Then, the control unit 9 measures the vertical position of the floating substrate W at a plurality of points in the Y direction at each of the three measuring devices 72 while moving the three measuring devices 72 in the Y-direction movement again. let it

In this way, the control unit 9 moves the three measuring instruments 72 zigzag in the Y direction and the X direction by performing the X-direction movement and the Y-direction movement of the three measuring instruments 72 alternately. Thereby, as shown in FIG. 10(c) , the control unit 9 measures the vertical position of the floating substrate W at a plurality of points in the area 32UR above the coating stage 32 . By this measuring process S12, the control unit 9 acquires the distribution of the vertical position of the floating substrate W in the area|region 32UR above the coating stage 32.

The control unit 9 may determine whether each measured vertical position is normal after measuring process S12, or in the middle of measuring process S12. This determination may be performed by comparing the measured value and the threshold value. When it is determined that the vertical position is abnormal, the control unit 9 may notify the outside by a predetermined output means (display unit 93, lamp, speaker, etc.). Moreover, when it determines with an abnormal vertical position, the control unit 9 may stop the operation|movement of the applicator 1.

If control unit 9 completes measurement process S12, control unit 9 will carry out process S13. The substrate W used in the measurement step S12 is a dummy substrate W as an uncoated target. For this reason, in unloading process S13, as shown in FIG. 10(d), the control unit 9 controls the transport mechanism 5 to move the floating substrate W downstream. Thereby, the floating substrate W is carried downstream from the coating stage 32 top. This makes it possible for the next substrate W to be coated to be carried into the coating stage 32 .

The vertical position measurement process shown in FIG. 10 may be performed using the substrate W as an application target. In this case, the control unit 9 controls the moving mechanism 63 and moves the nozzle 61 to the application|coating position L11 after measuring process S12 shown to FIG.10(c). The application position L11 is the position of the nozzle 61 when the horizontal position of the processing liquid discharged from the nozzle 61 and adhered to the floating substrate W is inside the intermediate region 32B. In addition, the control unit 9 moves the floating substrate W upstream, and moves the floating substrate W to the position at which application is started. When the movement of the nozzle 61 and the floating substrate W is completed, the control unit 9 controls the coating mechanism 6 to discharge the treatment liquid from the nozzle 61, and the conveying mechanism 5 It is controlled to move the floating substrate W to the downstream side. As a result, the treatment liquid is applied to the application target area of the floating substrate W on the middle area 32B of the application stage 32 .

In the present embodiment, the vertical positions of a plurality of points in the Y direction can be measured by moving the measuring instrument 72 in the Y direction (the second direction D2). In this way, since the distribution of the vertical position of the floating substrate W in the Y direction can be acquired, an abnormality in the floating height of the floating substrate W can be detected satisfactorily. By moving the measuring device 72 also in the X direction (first direction D1), the distribution of the vertical position of the floating substrate W in the upper region 32UR of the coating stage 32 can be obtained. This makes it possible to favorably detect abnormalities in the floating height of the floating substrate W in an area where application may be affected. In this way, the coating treatment can be preferably performed.

Further, as shown in FIG. 10( b ), the downstream end of the floating substrate W is disposed at the downstream end (edge) of the coating stage 32 . As a result, the floating substrate W is hardly affected by the floating force from the exit floating stage 33 on the upstream side of the coating stage 32 . For this reason, an abnormality in the floating height of the floating substrate W due to clogging of the suction port 322h formed at the downstream end of the coating stage 32 can be detected.

11 is a diagram showing each step of the vertical position measurement process executed by the coating device 1 . Fig. 11 shows an aspect of a vertical position measurement process performed on a floating substrate W as an application target. If the control unit 9 starts a vertical position measurement process, it will implement carrying-in process S11, as shown to FIG.11(a). Carrying-in process S11 is the same as the carrying-in process shown in FIG.10(a).

Carry-in process S11 includes stop step S111a. In the stop step S111a, as shown in FIG. 11(b) , after the control unit 9 controls the conveying mechanism 5 to convey the floating substrate W to the predetermined position LW2, the floating substrate W ) at the predetermined position (LW2). When the floating substrate W is disposed at the predetermined position LW2, the horizontal position of the downstream end of the floating substrate W is disposed above the downstream region 32C. In addition, the horizontal position of the downstream end at this time may be above the intermediate region 32B of the application stage 32, or may be on the boundary between the intermediate region 32B and the downstream region 32C.

Control unit 9 performs measurement step S12a after stop step S111a. In the measurement step S12a, similarly to the measurement step S12, the vertical measurement of the floating substrate W is performed at a plurality of points in the upper region 321UR of the application stage 32 by the three measuring instruments 72 arranged in the Y direction. It is the process of measuring position. The upper region 321UR is a region covering the upper side of the intermediate region 32B where the treatment liquid is applied and a portion upstream of the intermediate region 32B (a part of the upper region 32A).

In the measurement step S12a, as shown in FIG. 11(b), the control unit 9 controls the transport mechanism 5 to move the three measuring devices 72 to the floating substrate W at the predetermined position LW2. Arranged in a horizontal position slightly upstream from the downstream end of the In this way, the three measuring devices 72 are in a state in which the vertical position of the floating substrate W in a horizontal position slightly upstream from the downstream end can be measured. In this state, the control unit 9 controls the measuring instrument moving part 76 to move the three measuring instruments 72 in the Y direction (second direction D2).

During this Y-direction movement, the control unit 9 measures the vertical position of the floating substrate W with each of the three measuring devices 72 at a predetermined cycle. In this way, the vertical positions of the floating substrate W at a plurality of points on a straight line extending in the Y direction are measured.

When the Y-direction movement of the three measuring instruments 72 is completed, the control unit 9 controls the moving mechanism 63 to move the measuring unit 70 to the upstream side (-X side) of the first direction D1. (move in the X direction). The amount of movement of the three measuring instruments 72 at this time is moved by one pitch, which is a distance smaller than the dimension of the X direction of the application stage 32, more preferably the dimension of the X direction of the intermediate region 32B. Then, the control unit 9 measures the vertical position of the floating substrate W at a plurality of points in the Y direction at each of the three measuring devices 72 while moving the three measuring devices 72 in the Y-direction movement again. let it

In this way, the control unit 9 moves the three measuring instruments 72 zigzag in the Y direction and the X direction by performing the X-direction movement and the Y-direction movement of the three measuring instruments 72 alternately. Thus, the control unit 9 measures the vertical position of the floating substrate W at a plurality of points in the area 321UR above the coating stage 32, as shown in FIG. 11(c). By this measuring process S12a, the control unit 9 acquires the distribution of the vertical position of the floating substrate W in the area|region 321UR above the coating stage 32.

The control unit 9 may determine whether each measured vertical position is normal after measuring process S12a or in the middle of measuring process S12a. This determination may be performed by comparing the measured value and the threshold value. When it is determined that the vertical position is abnormal, the control unit 9 may notify the outside by a predetermined output means (display unit 93, lamp, speaker, etc.). Moreover, when it determines with an abnormal vertical position, the control unit 9 may stop the operation|movement of the applicator 1.

When the control unit 9 completes the measurement step S12a, it will perform the application step S14. In application step S14, the control unit 9 controls the moving mechanism 63 to move the nozzle 61 to the application position L11. Moreover, at the completion point of measurement process S12a, the X-direction movement of each measuring device 72 or the setting of the distance between the nozzle 61 and the measuring device 72 so that the nozzle 61 may come to the application position L11 This may be implemented. In this case, movement of the nozzle 61 at the time of transferring to application|coating process S14 after measuring process S12a can be omitted. Further, the control unit 9 controls the transport mechanism 5 to move the floating substrate from the nozzle 61 at the application position L11 to a predetermined supply start position where the treatment liquid is supplied to the upstream end of the application target region. Move (W). Further, when the preset position LW2 coincides with this supply start position, the movement of the floating substrate W can be omitted. When the movement of the nozzle 61 and the floating substrate W is completed, the control unit 9 controls the coating mechanism 6 to discharge the processing liquid from the nozzle 61, and the conveying mechanism 5 It is controlled to move the floating substrate W to the downstream side. As a result, the treatment liquid is applied to the application target area of the floating substrate W on the middle area 32B of the application stage 32 .

According to the vertical position measuring process shown in FIG. 11 , in the middle region 32B where the coating process is performed among the coating stage 32, the distribution of the vertical position of the floating substrate W in the Y direction can be acquired. there is. Because of this, since it is possible to satisfactorily specify the point where the floating substrate W has an abnormal floating amount in the Y direction, occurrence of coating defects can be reduced. Moreover, since upper area|region 321UR which acquires distribution of a vertical position is smaller than upper area|region 32UR corresponding to the substantially whole surface of the application|coating stage 32, measurement time can be shortened.

In the example shown in FIG. 11, each measuring device 72 moves the range which includes the measurement position ML2 from the measurement position ML1 in measurement process S12a. This is the horizontal position of each measuring device 72 when the vertical position of the floating substrate W in the horizontal position where the processing liquid from the nozzle 61 adheres to the floating substrate W can be measured. In addition, the measurement position ML2 is at the horizontal position of the buffer part 80 when the nozzle 61 discharges the treatment liquid (ie, when the nozzle 61 is disposed at the application position L11). is the horizontal position of each measuring device 72 when the vertical position of the floating substrate W of is measurable. By arranging each measuring device 72 at the measuring position ML2, the vertical position of the floating substrate W in the horizontal position of the buffer part 80 when the nozzle 61 is disposed at the application position L11 is determined. Since it can be measured, an abnormality in the floating height of the shock absorber 80 in a horizontal position can be detected. Therefore, contact of the floating substrate W with the buffer portion 80 during the application process can be reduced.

<2. Modified example>

As mentioned above, although the embodiment has been described, the present invention is not limited to the above, and various modifications are possible.

It is not essential that the measuring unit 70 includes the three measuring devices 72 . For example, the measuring unit 70 may be equipped with two or four or more measuring devices 72 . Moreover, the measuring unit 70 may be equipped with the single measuring device 72. However, by arranging a plurality of measuring devices 72 at intervals in the Y direction, the vertical position of the floating substrate W can be measured at a plurality of different positions in the Y direction. As a result, since the moving distance of each measuring device 72 can be shortened compared to the case where a single measuring device 72 is provided, the measurement time can be shortened.

It is not essential that the measuring instrument moving part 76 (measuring instrument moving mechanism) moves the three measuring instruments 72 integrally in the Y direction. For example, a measuring instrument moving mechanism that moves the three measuring instruments 72 individually in the Y direction may be provided. However, by moving the plurality of measuring instruments 72 integrally, the configuration for moving the measuring instruments 72 can be simplified.

It is not essential to move the measuring unit 70 integrally with the nozzle 61 by the moving mechanism 63 in the X direction. For example, a measuring instrument moving mechanism that moves the measuring unit 70 in the X direction independently of the nozzle 61 may be provided. However, by moving the plurality of measuring instruments 72 integrally with the nozzle 61, the configuration for moving the measuring instruments 72 can be simplified.

The measuring unit 70 may include two or more measuring devices 72 at regular intervals in the X direction. In this case, the vertical position of the floating substrate W on two straight lines can be simultaneously measured by the movement of each measuring device 72 in the Y direction.

The measurement unit 70 may not be attached to the nozzle support 601, but another crosslinked structure may be provided separately, and the measurement unit 70 may be attached to this crosslinked structure. Further, since the maintenance unit 65 is a cross-linked structure, the measurement unit 70 may be attached to the bat 651 of the maintenance unit 65 so as to be freely movable in the Y and X directions. In this case, it is good also as a structure which moves the measurement unit 70 manually, without providing a drive part.

Although the present invention has been described in detail, the above description is, in all aspects, illustrative, and the present invention is not limited thereto. It is understood that numerous variations not illustrated can be assumed without departing from the scope of the present invention. Each configuration described in each of the above embodiments and each modification can be appropriately combined or omitted as long as they do not contradict each other.

1: Applicator
3: Floating stage part (floating mechanism)
31: entrance injury stage
32: application stage
321h: spout
322h: suction port
33: Exit Floating Stage
5: transport mechanism
6: Applicator
601: nozzle support
61: nozzle
611: discharge port
63: nozzle moving mechanism
70: measurement unit
72: meter
72a: light emitter
72b: light receiving unit
74: connector
76: measuring instrument moving part (measuring instrument moving mechanism)
80: buffer part
9: control unit
D1: first direction
D2: 2nd direction
L11: application position
L13: preliminary discharge position
L14: cleaning position
ML1, ML2: location
S11: Carry-in process
S12, S12a: Measurement process
S13: export process
S14: coating process
W: substrate, floating substrate
Wf: top surface (first main surface)

Claims (14)

A substrate processing apparatus for processing a substrate having a first main surface and a second main surface,
a levitation mechanism for imparting a levitation force to the substrate in which the first main surface is vertically upward;
A transport mechanism for moving the floating substrate, which is the substrate to which the lifting force is applied, in a first direction that is a horizontal direction;
a nozzle having a discharge port extending in a second direction, which is a horizontal direction perpendicular to the first direction, and capable of discharging a processing liquid from the discharge port toward the first main surface of the floating substrate;
A measuring device for measuring the vertical position of the floating substrate;
a measuring device moving mechanism for moving the measuring device upstream and downstream in the second direction and the first direction;
a shock absorber provided at a position on the upstream side of the nozzle in the first direction and overlapping at least with the distal end of the discharge port of the nozzle in the horizontal direction;
The meter moving mechanism moves the measuring device from a position capable of measuring the vertical position of the floating substrate in an attached horizontal position, which is a horizontal position in which the processing liquid from the nozzle is attached to the floating substrate, so that the nozzle moves the processing liquid from the nozzle to the floating substrate. A substrate processing apparatus that moves a vertical position of the floating substrate in the second direction from a horizontal position of the buffer unit at the time of discharging the liquid to a position where a vertical position of the floating substrate can be measured. According to claim 1,
and a plurality of said measuring devices for measuring vertical positions of said floating substrates at different positions in said second direction. According to claim 2,
Further comprising a connector connecting the plurality of measuring devices,
The measuring instrument moving mechanism moves the coupler in the second direction. According to any one of claims 1 to 3,
The injury mechanism,
a stage having a horizontal surface;
a plurality of air outlets formed on the horizontal surface and ejecting air upward in the vertical direction;
and a plurality of suction ports formed on the horizontal surface and sucking air upward in the vertical direction. According to any one of claims 1 to 3,
The measuring instrument moving mechanism moves the measuring instrument in the second direction in a state in which an end portion of the floating substrate downstream in the first direction is disposed at an edge portion of a stage included in the floating mechanism downstream in the first direction. A substrate processing device that moves. A substrate processing apparatus for processing a substrate having a first main surface and a second main surface,
a levitation mechanism for imparting a levitation force to the substrate in which the first main surface is vertically upward;
A transport mechanism for moving the floating substrate, which is the substrate to which the lifting force is applied, in a first direction that is a horizontal direction;
a nozzle having a discharge port extending in a second direction, which is a horizontal direction perpendicular to the first direction, and capable of discharging a processing liquid from the discharge port toward the first main surface of the floating substrate;
A measuring device for measuring the vertical position of the floating substrate;
a measuring device moving mechanism for moving the measuring device in the second direction;
The measuring instrument moving mechanism moves the measuring instrument in the second direction in a state in which an end portion of the floating substrate downstream in the first direction is disposed at an edge portion of a stage included in the floating mechanism downstream in the first direction. A substrate processing device that moves. According to claim 6,
The measuring device moving mechanism moves the measuring device upstream and downstream in the second direction and the first direction. According to claim 7,
The substrate processing apparatus further includes a buffer portion provided at a position upstream of the nozzle in the first direction and overlapping at least with a distal end of the discharge port of the nozzle in a horizontal direction. According to claim 8,
The meter moving mechanism moves the measuring device from a position capable of measuring the vertical position of the floating substrate in an attached horizontal position, which is a horizontal position in which the processing liquid from the nozzle is attached to the floating substrate, so that the nozzle moves the processing liquid from the nozzle to the floating substrate. A substrate processing apparatus that moves a vertical position of the floating substrate in the second direction from a horizontal position of the buffer unit at the time of discharging the liquid to a position where a vertical position of the floating substrate can be measured. According to any one of claims 6 to 9,
and a plurality of said measuring devices for measuring vertical positions of said floating substrates at different positions in said second direction. According to claim 10,
Further comprising a connector connecting the plurality of measuring devices,
The measuring instrument moving mechanism moves the coupler in the second direction. According to any one of claims 6 to 9,
The injury mechanism,
the stage having a horizontal surface;
a plurality of air outlets formed on the horizontal surface and ejecting air upward in the vertical direction;
and a plurality of suction ports formed on the horizontal surface and sucking air upward in the vertical direction. A substrate processing method for processing a substrate having a first main surface and a second main surface,
The substrate processing method is carried out using a substrate processing apparatus having a nozzle and a buffer, and the substrate processing method includes:
(a) a step of imparting a levitation force to a substrate in which the first main surface faces vertically upward;
(b) a step of moving the floating substrate, which is the substrate to which the levitation force is applied in the step (a), in a first direction, which is a horizontal direction;
(c) moving a measuring device for measuring the vertical position of the floating substrate in a second direction, which is a horizontal direction orthogonal to the first direction, and upstream and downstream of the first direction; Including the process of measuring the vertical position in a plurality of points in two directions,
The nozzle has a discharge port extending in the second direction, and is capable of discharging a treatment liquid from the discharge port toward the first main surface of the floating substrate;
The shock absorber is provided at a position upstream of the nozzle in the first direction and overlaps at least a front end of the discharge port of the nozzle in a horizontal direction;
In the step (c), the measuring device, from a position capable of measuring the vertical position of the floating substrate in an attaching horizontal position, which is a horizontal position at which the processing liquid from the nozzle is attached to the floating substrate, determines that the nozzle is attached to the floating substrate. and moving in the second direction from a horizontal position of the buffer unit at the time of discharging the processing liquid to a position at which a vertical position of the floating substrate can be measured. A substrate processing method for processing a substrate having a first main surface and a second main surface,
The substrate processing method is carried out using a substrate processing apparatus having a lifting mechanism for imparting a lifting force to the substrate in which the first main surface is vertically upward, and the substrate processing method includes:
(a) a step of imparting a levitation force to a substrate in which the first main surface faces vertically upward;
(b) a step of moving the floating substrate, which is the substrate to which the levitation force is applied in the step (a), in a first direction, which is a horizontal direction;
(c) by moving a measuring device for measuring the vertical position of the floating substrate in a second direction, which is a horizontal direction orthogonal to the first direction, the vertical position of the floating substrate at a plurality of points in the second direction; Including the process of measuring
In the step (c), in a state in which an end portion of the floating substrate on the downstream side in the first direction is disposed on an edge portion of a stage included in the lifting mechanism on the downstream side in the first direction, the measuring device is configured to perform the measurement on the first direction. A substrate processing method that is moved in two directions.

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