JP2020006282A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

To provide a technology capable of coating excellently process liquid onto a substrate conveyed by floating force imparted thereto.SOLUTION: A coating applicator 1 includes a conveyance mechanism 5 for moving, to the X-direction, a floating substrate W to which floating force is imparted by a floating stage 3, a measuring device 72 for measuring a vertical position of the floating substrate W, and a measuring device moving part 76 for moving the measuring device 72 to the Y-direction. The measuring device 72 measures each vertical position of the floating substrate W at a plurality of different spots in the Y-direction, by being moved to the Y-direction.SELECTED DRAWING: Figure 10

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly to a technique for suitably applying a processing liquid to a substrate to which a levitation force is applied and conveyed. The substrate to be processed includes, for example, a semiconductor substrate, a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device and an organic EL (Electroluminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, Photomask substrates, ceramic substrates, and solar cell substrates are included.

  2. Description of the Related Art In a manufacturing process of an electronic component such as a semiconductor device or a liquid crystal display device, a coating apparatus that applies a coating liquid to a surface of a substrate is used. In such a coating apparatus, the substrate is conveyed in a state where the substrate is floated by blowing air to the back surface of the substrate, and extends in the width direction of the substrate with respect to the surface of the substrate (corresponding to the main surface of the substrate). 2. Description of the Related Art There is known an apparatus that applies a coating liquid to a substrate by discharging the coating liquid from a nozzle (for example, Patent Document 1).

  In the substrate processing apparatus described in Patent Literature 1, the substrate is transported by moving the substrate in a horizontal direction while holding the peripheral portion of the substrate while floating the substrate in a horizontal posture on a floating stage, and moving the substrate in a substrate transport path. The coating liquid is discharged from a slit nozzle arranged above.

  In the substrate processing apparatus of Patent Document 1, an optical distance sensor that measures the flying height of the substrate is provided above the substrate. The application liquid can be supplied while adjusting the height of the slit nozzle according to the flying height of the substrate.

JP 2012-142583 A

  However, in Patent Literature 1, since the optical distance sensor is fixed to the slit nozzle, the flying height of the substrate can be measured only at a position fixed in a lateral direction (width direction of the substrate) orthogonal to the transport direction. . For this reason, the distribution of the flying height in the lateral direction of the substrate could not be obtained. For example, when the floating height of the substrate in the horizontal direction varies due to an insufficient floating force of the floating stage or the like, there is a possibility that application failure of the processing liquid may occur.

  Therefore, an object of the present invention is to provide a technique for satisfactorily applying a processing liquid to a substrate to which a levitation force is applied and conveyed.

  In order to solve the above-mentioned problem, a first aspect is a substrate processing apparatus for processing a substrate having a first main surface and a second main surface, wherein the first main surface exerts a floating force on a vertically upward substrate. A floating mechanism for applying, a transport mechanism for moving the floating substrate, which is the substrate to which the floating force is applied, in a first direction that is a horizontal direction, and a transfer mechanism that moves the floating substrate in a second direction that is a horizontal direction orthogonal to the first direction. A nozzle that has a discharge port that extends and is capable of discharging the processing liquid from the discharge port toward the first main surface of the floating substrate, a measuring device that measures a vertical position of the floating substrate, and the measuring device A measuring device moving unit configured to move the measuring device in the second direction.

  A second aspect is the substrate processing apparatus according to the first aspect, wherein the measuring device moving unit moves the measuring device upstream and downstream in the second direction and the first direction.

  A third aspect is the substrate processing apparatus according to the second aspect, wherein the position is an upstream position in the first direction with respect to the nozzle, and at least a position horizontally overlapping at least a tip end of the discharge port of the nozzle. The apparatus further includes a buffer unit provided in the apparatus.

  A fourth aspect is the substrate processing apparatus according to the third aspect, wherein the measuring device moving mechanism moves the measuring device at an adhesion horizontal position, which is a horizontal position at which the processing liquid from the nozzle adheres to the floating substrate. The second direction between a position at which the vertical position of the floating substrate can be measured and a position at which the vertical position of the floating substrate at a horizontal position of the buffer when the nozzle discharges the processing liquid can be measured. Move to

  A fifth aspect is the substrate processing apparatus according to any one of the first to fourth aspects, including a plurality of the measuring devices for measuring a vertical position of the floating substrate at different positions in the second direction.

  A sixth aspect is the substrate processing apparatus according to the fifth aspect, further comprising a connector for connecting the plurality of measuring devices, wherein the measuring device moving unit moves the connecting device in the second direction.

  A seventh aspect is the substrate processing apparatus according to any one of the first aspect to the sixth aspect, wherein the levitation mechanism is provided on a stage having a horizontal surface, and the air is provided on the horizontal surface, and the air is directed upward in the vertical direction. And a plurality of suction ports provided on the horizontal surface for sucking the air on the upper side in the vertical direction.

  An eighth aspect is the substrate processing apparatus according to any one of the first aspect to the seventh aspect, wherein the measuring device moving mechanism is configured such that an end of the floating substrate on the downstream side in the first direction is the second end of the stage. The measuring instrument is moved in the second direction while being arranged at the edge on the downstream side in one direction.

  A ninth aspect is a substrate processing method for processing a substrate having a first main surface and a second main surface, wherein (a) applying a levitation force to a vertically upward substrate having the first main surface; (B) moving the levitation substrate, which is the substrate to which levitation force is applied in the step (a), in a first direction that is a horizontal direction, and (c) measuring the vertical position of the levitation substrate. Measuring the vertical positions at a plurality of points in the second direction on the floating substrate by moving the container in a second direction that is a horizontal direction orthogonal to the first direction.

  According to the substrate processing apparatus of the first aspect, the vertical position can be measured along the second direction by moving the measuring instrument in the second direction. Therefore, the vertical position can be measured at a plurality of points along the second direction on the substrate. Thus, in the second direction, an abnormality in the floating height of the substrate by the floating mechanism can be detected, so that the processing liquid can be favorably applied to the substrate.

  According to the substrate processing apparatus of the second aspect, by moving the substrate in the first direction and the second direction, the vertical positions of a plurality of points in the plane of the first main surface of the substrate can be measured.

  According to the substrate processing apparatus of the third aspect, when there is foreign matter on the substrate, the buffer unit collides with the foreign matter before the discharge port of the nozzle. Thus, the tip of the nozzle can be protected from foreign matter.

  According to the substrate processing apparatus of the fourth aspect, since the vertical position of the substrate can be measured at the horizontal position where the buffer is disposed when the processing liquid is discharged from the nozzle, the abnormality of the flying height at the position of the buffer is detected. it can. Therefore, the contact of the substrate with the buffer during the coating process can be reduced.

  According to the substrate processing apparatus of the fifth aspect, since the vertical position of the floating substrate can be measured at a plurality of points at the same time, the moving distance can be shorter than when a single measuring device is moved in the Y direction, and the measurement time is reduced. it can.

  According to the substrate processing apparatus of the sixth aspect, a plurality of measuring instruments can be moved integrally. Therefore, the configuration of the moving mechanism can be simplified as compared with a case where a plurality of measuring instruments are moved independently.

  According to the substrate processing apparatus of the seventh aspect, it is possible to transport the substrate precisely by ejecting and sucking air to the substrate to be processed.

  According to the substrate processing apparatus of the eighth aspect, since the downstream end of the floating substrate is disposed at the downstream edge of the stage, the suction port provided at the downstream end of the stage is clogged. An abnormality in the flying height of the substrate can be detected.

  According to the substrate processing method of the ninth aspect, the vertical position can be measured along the second direction by moving the measuring instrument in the second direction. Therefore, the vertical position can be measured at a plurality of points along the second direction on the substrate. Thus, in the second direction, an abnormality in the floating height of the substrate by the floating mechanism can be detected, so that the processing liquid can be favorably applied to the substrate.

It is a side view which shows typically the whole structure of the coating device 1 which is an example of the substrate processing apparatus of embodiment. It is the schematic plan view which looked at the coating device 1 of embodiment from the vertical direction upper side. FIG. 2 is a schematic plan view showing the coating apparatus 1 excluding a coating mechanism 6 of the embodiment. FIG. 3 is a schematic sectional view of the coating apparatus 1 at a position along line AA shown in FIG. 2. FIG. 4 is a schematic plan view showing a part of a floating stage unit 3 of the embodiment. FIG. 3 is a schematic plan view showing a nozzle support 601 and a measurement unit 70. FIG. 3 is a schematic side view illustrating a nozzle 61, a measurement unit 70, and a buffer unit 80. FIG. 3 is a schematic front view illustrating a nozzle 61, a measurement unit 70, and a buffer unit 80. It is a schematic block diagram showing control unit 9 of an embodiment. It is a figure which shows each process of the vertical position measurement process which the coating device 1 performs. It is a figure which shows each process of the vertical position measurement process which the coating device 1 performs.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Note that the components described in this embodiment are merely examples, and are not intended to limit the scope of the present invention. In the drawings, the dimensions and the numbers of the respective parts may be exaggerated or simplified as necessary for easy understanding.

  Expressions indicating relative or absolute positional relationships (for example, “parallel”, “orthogonal”, “center”, “concentric”, “coaxial”, etc.) not only express the positional relationship strictly, but also express tolerance or It also represents a state in which it is relatively displaced with respect to the angle or the distance within a range where the same function can be obtained. Unless otherwise specified, expressions that indicate equal states (eg, “identical,” “equal,” “homogeneous,” “match,” etc.) not only represent strictly equal states quantitatively, but also have tolerances or similar functions. Also represents a state where there is a difference that can be obtained. Unless otherwise specified, expressions indicating shapes (eg, “square shape” or “cylindrical shape”) not only represent the shape strictly geometrically, but also within a range where the same effect can be obtained, for example. A shape having irregularities and chamfers is also represented. Unless otherwise specified, "on" includes a case where two elements are in contact with each other and a case where two elements are distant from each other.

<1. First Embodiment>
FIG. 1 is a side view schematically illustrating an entire configuration of a coating apparatus 1 which is an example of the substrate processing apparatus according to the embodiment. FIG. 2 is a schematic plan view of the coating apparatus 1 of the embodiment as viewed from above in the vertical direction. FIG. 3 is a schematic plan view showing the coating apparatus 1 excluding the coating mechanism 6 of the embodiment. FIG. 4 is a schematic sectional view of the coating apparatus 1 at a position along the line AA shown in FIG. FIG. 5 is a schematic plan view showing a part of the floating stage unit 3 of the embodiment.

  The coating apparatus 1 transports the rectangular substrate W in a horizontal posture (a posture in which the upper surface Wf (first main surface) and the lower surface (second main surface) of the substrate W are parallel to a horizontal plane (XY plane)). In addition, it is a slit coater that applies a processing liquid (coating liquid) to the upper surface Wf of the substrate W. In each figure, in order to clarify the positional relationship of each part of the coating apparatus 1, a direction parallel to the first direction D1 in which the substrate W is transported is defined as an “X direction”, and a direction from the input conveyor 100 to the output conveyor 110 is defined as “X direction”. The “+ X direction” and the opposite direction are “−X direction”. The horizontal direction orthogonal to the X direction is referred to as “Y direction”, the direction toward the front of FIG. 1 is referred to as “−Y direction”, and the opposite direction is referred to as “+ Y direction”. A vertical direction perpendicular to the X direction and the Y direction is defined as a Z direction, an upward direction toward the coating mechanism 6 as viewed from the floating stage unit 3 is defined as a “+ Z direction”, and the opposite direction is defined as a “−Z direction”.

  The basic configuration and operation principle of the coating apparatus 1 are partially common or similar to those described in JP-A-2010-227850 and JP-A-2010-240550. Therefore, in the present specification, among the components of the coating apparatus 1, components that are the same as those described in these known documents or that can be easily inferred based on technical common sense may be appropriately omitted.

  The coating apparatus 1 sequentially moves the input conveyor 100, the input transfer unit 2, the floating stage unit 3, the output transfer unit 4, and the output conveyor 110 along the first direction D1 (+ X direction) in which the substrate W is transported. Prepare. These are arranged so as to be close to each other, and thereby, a transport path of the substrate W is formed. In the following description, when the positional relationship is indicated in association with the first direction D1, which is the substrate transfer direction, “upstream in the first direction” is simply referred to as “upstream” and “downstream in the first direction D1”. "May be abbreviated as" downstream. " In this example, the -X side is the "upstream side" and the + X side is the "downstream side" when viewed from a certain reference position.

  The input conveyor 100 includes a roller conveyor 101 and a rotation drive mechanism 102 that rotationally drives the roller conveyor 101. Due to the rotation of the roller conveyor 101, the substrate W is transported to the downstream side (+ X side) in a horizontal posture.

  The input transfer unit 2 includes a roller conveyor 21 and a rotation drive mechanism 22 that rotates the roller conveyor 21. As the roller conveyor 21 rotates, the substrate W is transported in the + X direction. Further, the vertical position of the substrate W is changed by moving the roller conveyor 21 up and down. The substrate W is transferred from the input conveyor 100 to the floating stage unit 3 by the operation of the input transfer unit 2.

  The floating stage section 3 includes three flat stages along the first direction D1. Specifically, the levitation stage unit 3 includes an entrance levitation stage 31, a coating stage 32, and an exit levitation stage 33 in this order along the first direction D1. The upper surface of each of these stages is on the same plane.

  On the upper surface of each of the entrance levitation stage 31 and the exit levitation stage 33, a plurality of ejection ports 31h, 33h for ejecting air (compressed air) supplied from the levitation control mechanism 35 are provided in a matrix. A floating force is buoyant on the substrate W by the compressed air jetted from the plurality of jet ports 31h and 33h, and the substrate W is in a horizontal posture while being separated from the lower surface (second main surface) of the substrate W and the upper surfaces of the stages 31 and 33. Supported. The distance between the lower surface of the substrate W and the upper surfaces of the stages 31 and 33 may be, for example, 10-500 μm (micrometer).

  As shown in FIG. 5, on the upper surface of the application stage 32, a plurality of ejection ports 321h for ejecting air (compressed air) and a plurality of suction ports 322h for sucking an atmosphere above the application stage 32 are provided. I have. On the upper surface of the application stage 32, ejection ports 321h and suction ports 322h are provided alternately along the X direction and the Y direction. By controlling the floating control mechanism 35 so that the amount of compressed air ejected from each ejection port 321h and the amount of suction of the atmosphere from each suction port 322h are balanced, the lower surface of the substrate W and the upper surface of the coating stage 32 are controlled. The distance is precisely controlled. Thus, the vertical position of the upper surface Wf of the substrate W passing above the coating stage 32 is controlled to a predetermined value. As the configuration of the floating stage section 3, the configuration described in JP-A-2010-227850 may be applied.

  The application stage 32 has an upstream area 32A, an intermediate area 32B, and a downstream area 32C in order in the + X direction. Here, each of three regions obtained by dividing the upper surface of the application stage 32 in the X direction by 1/3 is an upstream region 32A, an intermediate region 32B, and a downstream region 32C, and the intermediate region 32B is the upper surface of the application stage 32. The area occupies the center of the

  The distribution density (quantity per unit area) of the ejection port 321h and the suction port 322h is higher in the intermediate area 32B than in each of the upstream area 32A and the downstream area 32C. For this reason, the floating amount of the substrate W can be controlled more precisely in the intermediate region 32B than in each of the upstream region 32A and the downstream region 32C.

  The application position L11 of the nozzle 61 is set above the intermediate region 32B. That is, in a state where the ejection port 611 of the nozzle 61 is disposed above the intermediate region 32B, the ejection port 611 is applied to the substrate W (hereinafter, also referred to as “floating substrate W”) to which the levitation force is applied from the application stage 32. Is supplied. The horizontal position, which is the horizontal position when the processing liquid discharged from the discharge port 611 adheres to the floating substrate W, is also set above the intermediate region 32B. As described above, by supplying the processing liquid to the floating substrate W on the intermediate region 32B where the floating amount can be precisely controlled, the coating processing can be performed satisfactorily.

  The substrate W carried into the floating stage unit 3 via the input transfer unit 2 receives the propulsive force in the + X direction by the rotation of the roller conveyor 21 and is transferred onto the entrance floating stage 31. The transfer of the substrate W in the floating stage unit 3 is performed by the transfer mechanism 5.

  The transport mechanism 5 includes a chuck 51 and a suction / travel control mechanism 52. The chuck 51 supports the substrate W from below by partially contacting the lower peripheral edge of the substrate W. The suction / running control mechanism 52 has a function of applying a negative pressure to a suction pad provided at a support portion at the upper end of the chuck 51 to cause the chuck 51 to suck and hold the substrate W. Further, the suction / run control mechanism 52 has a function of causing the chuck 51 to reciprocate linearly in the X direction.

  When the chuck 51 holds the substrate W, the lower surface of the substrate W is located on the + Z side of the upper surfaces of the stages 31, 32, and 33 of the floating stage unit 3. The peripheral edge of the substrate W is suction-held by the chuck 51, and the substrate W maintains a horizontal posture as a whole due to the levitation force applied from the levitation stage unit 3.

  The chuck 51 holds the substrate W carried from the input transfer unit 2 to the floating stage unit 3, and in this state, the chuck 51 moves in the + X direction, whereby the substrate W is moved from above the entrance floating stage 31 to the coating stage. 32, and is conveyed above the exit floating stage 33. The substrate W is transferred to the output transfer section 4 arranged on the + X side of the exit floating stage 33.

  The output transfer unit 4 includes a roller conveyor 41 and a rotation driving mechanism 42 that rotationally drives the roller conveyor 41. When the roller conveyor 41 rotates, a propulsive force in the + X direction is applied to the substrate W, and the substrate W is transported in the first direction D1. By the operation of the output transfer section 4, the substrate W is transferred to the output conveyor 110 from above the exit floating stage 33.

  The output conveyor 110 includes a rotation drive mechanism 112 that rotates the roller conveyor 111. Due to the rotation of the roller conveyor 111, the substrate W is transported in the + X direction and discharged to the outside of the coating apparatus 1. The input conveyor 100 and the output conveyor 110 may be provided as a part of the coating apparatus 1, but may be separate from the coating apparatus 1. For example, the input conveyor 100 may be a substrate payout mechanism of another unit provided on the upstream side of the coating apparatus 1. Further, the output conveyor 110 may be a substrate receiving mechanism of another unit provided on the downstream side of the coating apparatus 1.

  An application mechanism 6 for applying the processing liquid to the upper surface Wf of the substrate W is provided on the transport system path of the substrate W. The coating mechanism 6 includes a nozzle unit 60 including a nozzle 61 for discharging the processing liquid, a nozzle moving mechanism 63 for positioning the nozzle 61, and a maintenance unit 65 for maintaining the nozzle 61.

  The nozzle 61 is a member extending in a second direction D2 (Y direction) which is a horizontal direction orthogonal to the first direction D1. The lower end of the nozzle 61 has a discharge port 611 that extends in the width direction and opens downward. The processing liquid is discharged from the discharge port 611.

  The nozzle moving mechanism 63 moves and positions the nozzle 61 in the X direction and the Z direction. By the operation of the nozzle moving mechanism 63, the nozzle 61 is positioned at the coating position L11 above the coating stage 32. The processing liquid is applied to the substrate W by the nozzle 61 discharging the processing liquid toward the upper surface Wf of the substrate W while the nozzle 61 is positioned at the application position L11. Thus, the application position L11 is the position of the nozzle 61 when performing the application.

  When the processing liquid is discharged to the substrate W in a state where the nozzle 61 is disposed at the coating position L11, the coating film of the processing liquid is coated on the inner surface of the upper surface Wf of the substrate W except for the peripheral portion. It is formed.

  The maintenance unit 65 includes a butt 651, a preliminary ejection roller 652, a nozzle cleaner 653, and a maintenance control mechanism 654. The vat 651 stores a cleaning liquid used for cleaning the nozzle 61. The maintenance control mechanism 654 controls the preliminary discharge roller 652 and the nozzle cleaner 653. As a configuration of the maintenance unit 65, for example, a configuration described in Japanese Patent Application Laid-Open No. 2010-240550 may be applied.

  The nozzle moving mechanism 63 positions the nozzle 61 at the preliminary ejection position L13 where the ejection port 611 faces the surface above the preliminary ejection roller 652. The nozzle 61h discharges the processing liquid from the discharge port 611 to the surface of the preliminary discharge roller 652 at the preliminary discharge position L13 (preliminary discharge processing). The nozzle 61 is positioned at the preliminary ejection position L13 before the nozzle 61 is positioned at the application position L11, and performs the preliminary ejection process. Thus, the discharge of the processing liquid onto the substrate W can be stabilized from the initial stage. When the maintenance control mechanism 654 rotates the preliminary discharge roller 652, the processing liquid discharged from the nozzle 61 is mixed with the cleaning liquid stored in the vat 651 and collected.

  The nozzle moving mechanism 63 positions the nozzle 61 at the cleaning position L14 where the tip (including the discharge port 611 and a region near the outlet 611) faces above the nozzle cleaner 653. With the nozzle 61 in the cleaning position L14, the nozzle cleaner 653 moves in the width direction (Y direction) of the nozzle 61 while discharging the cleaning liquid, whereby the processing liquid and the like attached to the tip of the nozzle 61 are washed away.

  The nozzle moving mechanism 63 may position the nozzle 61 at a standby position below the cleaning position L14 and the lower end of the nozzle 61 is housed in the butt 651. When the coating process using the nozzle 61 is not performed in the coating apparatus 1, the nozzle 61 may be positioned at the standby position. Although not shown, a standby pod for preventing drying of the processing liquid at the discharge port 611 of the nozzle 61 positioned at the standby position may be provided.

  In FIG. 1, the nozzle 61 at the preliminary ejection position L13 is indicated by a solid line, and the nozzle 61 at the application position L11, the downstream position L12, and the cleaning position L14 is indicated by a broken line.

  The application mechanism 6 of the present embodiment includes only one nozzle 61, but may include a plurality of nozzles 61. The plurality of nozzles 61 may be provided at intervals along the first direction D1. In this case, different processing liquids may be applied to the substrate W by supplying different processing liquids to the plurality of nozzles 61. Further, a nozzle moving mechanism 63 and a maintenance unit 65 corresponding to each nozzle 61 may be provided. In addition, the maintenance unit 65 may be configured such that two or more nozzles 61 can be shared and used.

  As shown in FIG. 4, the nozzle unit 60 is a bridge including a beam member 631 extending in the Y direction above the floating stage unit 3 and two column members 632 and 633 supporting both end portions of the beam member 631. Having a structure. The column members 632 and 633 are provided upright from the base 10. An elevating mechanism 634 is attached to the column member 632, and an elevating mechanism 635 is attached to the column member 633. The lifting mechanisms 634 and 635 include, for example, a ball screw mechanism. The + Y side end of the beam member 631 is attached to the elevating mechanism 634, and the −Y side end of the beam member 631 is attached to the elevating mechanism 635. The elevating mechanisms 634 and 635 support the beam member 631. The beam members 631 move in the vertical direction (Z direction) while keeping the horizontal posture by interlocking the lifting mechanisms 634 and 635 in response to a control command from the control unit 9.

  As shown in the figure, a nozzle support 601 extending in the Y-axis direction is provided at the lower center of the beam member 631. As shown in FIGS. 7 and 8, an intermediate portion 603 having an L-shape when viewed from the −Y side is attached to a lower portion of the nozzle support 601. The nozzle 61 is attached to a lower portion of a horizontally extending portion of the intermediate portion 603. The nozzle 61 is attached to the nozzle support 601 with the discharge port 611 facing downward. By operating the lifting mechanisms 634 and 635, the nozzle support 601 and the nozzle 61 move in the vertical direction (Z direction).

  The column members 632 and 633 are configured to be movable on the base 10. Two traveling guides 81 </ b> L and 81 </ b> R extending in the X direction are provided at the + Y side end and the −Y side end on the upper surface of the base 10. The column member 632 is engaged with the traveling guide 81L on the + Y side via a slider 636 attached to the lower portion thereof, and the column member 633 is engaged with the traveling guide 81R on the −Y side via a slider 637 attached to the lower portion. Is engaged. The sliders 636 and 637 are movable in the X direction along the travel guides 81L and 81R.

  The column members 632 and 633 move in the X direction by the operation of the linear motors 82L and 82R. Each of the linear motors 82L and 82R includes a magnet module as a stator and a coil module as a moving element. The magnet module is provided on the base 10 and extends in the X direction. The coil module is attached to a lower portion of each of the column members 632 and 633. When the movers of the linear motors 82L and 82R operate in response to a control command from the control unit 9, the entire nozzle unit 60 moves in the X direction. Thereby, the movement of the nozzle 61 in the X direction (first direction D1) is realized. The X-direction positions of the column members 632 and 633 are detected by linear scales 83L and 83R provided near the sliders 636 and 637.

  Thus, the nozzle support 601 and the nozzle 61 move in the Z direction by the operation of the lifting mechanisms 634 and 635, and move in the X direction by the operation of the linear motors 82L and 82R. That is, the control unit 9 controls the elevating mechanisms 634 and 635 and the linear motors 82L and 82R, so that the nozzle 61 is positioned at the respective stop positions L11 to L14. Therefore, the elevating mechanisms 634 and 635 and the linear motors 82L and 82R function as the nozzle moving mechanism 63.

  As the maintenance unit 65, a unit described in JP-A-2010-240550 may be employed. The bat 651 is supported by a beam member 661 extending in the Y direction. Of the two ends of the beam member 661, one end is supported by the column member 662, and the other end is supported by the column member 663. The column members 662 and 663 are respectively attached to both ends in the Y direction of a plate 664 extending in the Y direction.

  Below the both ends of the plate 664, two traveling guides 84L and 84R extending in the X direction are provided, respectively. The two traveling guides 84L, 84R are provided on the upper surface of the base 10. A slider 666 is provided at an end on the + Y side, and a slider 667 is provided at an end on the −Y side, of both ends in the Y direction of the lower surface of the plate 664. The sliders 666 and 667 engage with the traveling guides 84L and 84R, and are movable in the X direction.

  Below the plate 664, a linear motor 85 is provided. The linear motor 85 includes a magnet module as a stator and a coil module as a mover. The magnet module is provided on the base 10 and extends in the X direction. The coil module is provided below the maintenance unit 65 (here, the plate 664).

  When the linear motor 85 operates in response to a control command from the control unit 9, the entire maintenance unit 65 moves in the X direction. The position in the X direction of the maintenance unit 65 is detected by a linear scale 86 provided near the sliders 666 and 667.

  As shown in FIG. 4, the chuck 51 includes two chuck members 51L and 51R. The chuck members 51L and 51R have shapes symmetrical to each other with respect to the XZ plane, and are spaced apart in the Y direction.

  The chuck member 51L disposed on the + Y side is supported by a travel guide 87L provided on the base 10 and extending in the X direction. The chuck member 51L includes a base portion 512 including two horizontal plate portions provided at different positions in the X direction and a connection portion connecting these plate portions (see FIG. 2). One slider 511 is provided below each of the two plate portions of the base portion 512. The slider 511 is engaged with the travel guide 87L, so that the chuck member 51L can travel in the X direction along the travel guide 87L.

  One support portion 513 is provided on each of the upper portions of the two plate portions of the base portion 512. The support portion 513 extends upward and has a suction pad (not shown) at an upper end thereof. When the base portion 512 moves in the X direction along the travel guide 87L, the two support portions 513 move in the X direction integrally therewith. The two plate portions of the base portion 512 may be separated from each other, and the plate portions may move while maintaining a certain distance in the X direction, so that the structure may function as an apparently integrated base portion. If this distance is set according to the length of the substrate, it is possible to cope with substrates of various lengths.

  The chuck member 51L is moved in the X direction by a linear motor 88L. The linear motor 88 includes a magnet module as a stator and a coil module as a mover. The magnet module is provided on the base 10 and extends in the X direction. The coil module is provided below the chuck member 51L. By operating the linear motor 88L in response to a control command from the control unit 9, the chuck member 51L moves in the X direction. The X-direction position of the chuck member 51L is detected by a linear scale 89L provided near the travel guide 87L.

  Like the chuck member 51L, the chuck member 51R provided on the −Y side includes a base portion 512 and two support portions 513 and 513. The shape of the chuck member 51R is symmetric with respect to the chuck member 51L with respect to the XZ plane. One slider 511 is provided below each of the two plate portions of the base portion 512 of the chuck member 51R. The slider 511 is engaged with the travel guide 87R, so that the chuck member 51R can travel in the X direction along the travel guide 87R.

  The chuck member 51R is movable in the X direction by a linear motor 88R. The linear motor 88R includes a magnet module as a stator provided on the base 10 and extending in the X direction, and a coil module as a movable member provided below the chuck member 51R. When the linear motor 88R operates in response to a control command from the control unit 9, the chuck member 51R moves in the X direction. The X-direction position of the chuck member 51R is detected by a linear scale 89R provided near the travel guide 87R.

  The control unit 9 controls these positions so that the chuck members 51L and 51R are always at the same position in the X direction. As a result, the pair of chuck members 51L and 51R apparently move as the integrated chuck 51. Interference between the chuck 51 and the floating stage 3 can be easily avoided as compared with the case where the chuck members 51L and 51R are mechanically connected.

  As shown in FIG. 3, the four support portions 513 are respectively arranged corresponding to the four corners of the substrate W to be held. In other words, the two support portions 513 of the chuck member 51L hold the upstream end and the downstream end in the first direction D1 on the + Y side peripheral edge of the substrate W, respectively. The two support portions 513 and 513 of the chuck member 51R hold the upstream end and the downstream end in the first direction D1 at the -Y side peripheral edge of the substrate W, respectively. Negative pressure is supplied to the suction pads of the support portions 513 as necessary, whereby the four corners of the substrate W are suction-held by the chucks 51 from below.

  The substrate W is transported by the chuck 51 moving in the X direction while holding the substrate W. As described above, the mechanism (not shown) for supplying the negative pressure to the linear motors 88L and 88R and the respective support portions 513 functions as the suction / running control mechanism 52 shown in FIG.

  As shown in FIGS. 1 and 4, the chuck 51 holds the substrate W at a position higher than the upper surfaces of the entrance levitation stage 31, the coating stage 32, and the exit levitation stage 33. The chuck 51 transports the substrate W while holding the lower surface of the substrate W. The chuck 51 holds only a part of the peripheral portion of the substrate W, which is located outside the central portion facing each of the stages 31, 32, and 33 in the Y direction. For this reason, the central portion of the substrate W bends downward with respect to the peripheral portion. The levitation stage unit 3 controls the vertical position of the substrate W by applying a levitation force to the central portion of the substrate W in this state, and maintains the substrate W in a horizontal posture.

<Measurement unit 70>
FIG. 6 is a schematic plan view showing the nozzle support 601 and the measurement unit 70. FIG. 7 is a schematic side view illustrating the nozzle 61, the measurement unit 70, and the buffer unit 80. FIG. 8 is a schematic front view showing the nozzle 61, the measurement unit 70, and the buffer unit 80.

  The coating device 1 includes a measurement unit 70. The measurement unit 70 includes a plurality of (here, three) measurement devices 72. Each measuring device 72 measures the vertical position of the upper surface Wf of the substrate W to which the levitation force is applied by the levitation stage unit 3. Specifically, the measuring device 72 measures the vertical position of the upper surface Wf by measuring the distance from a predetermined reference position in the vertical direction to the vertical position of the upper surface Wf. From the vertical position of the upper surface Wf measured by the measuring device 72, the height of the upper surface Wf can be obtained from the height of the upper surface of the coating stage 32 (vertical position). Further, the floating amount of the substrate W (the distance from the upper surface of the application stage 32 to the lower surface of the floating substrate W) can be obtained from the height of the upper surface Wf and the thickness of the substrate W.

  Each measuring device 72 includes a light emitting unit 72a that outputs light of a predetermined wavelength, and a light receiving unit 72b that includes an optical sensor (for example, a line sensor) that detects light output from the light emitting unit 72a and reflected by the substrate W. (See FIG. 9). The light receiving unit 72b is an example of a reflective sensor that measures the vertical position of the upper surface Wf in a non-contact manner. Note that the vertical position of the upper surface Wf may be measured by ultrasonic waves instead of by light. In this case, each measuring device 72 may include an output unit that outputs an ultrasonic wave and a detection unit that detects the ultrasonic wave reflected on the upper surface Wf.

  The measuring unit 70 includes a connecting tool 74 for connecting the three measuring devices 72 to each other. The connecting tool 74 is a plate-shaped member extending in the Y direction, and each measuring device 72 is attached to a side surface on the upstream side (−X side) of the connecting tool 74. Here, the three measuring devices 72 are attached to the connector 74 with an interval in the second direction (Y direction).

  The measurement unit 70 includes a measurement device moving unit 76. The measuring device moving unit 76 is connected to the + X side surface of the connecting tool 74. The measuring device moving unit 76 includes a driving mechanism such as a linear motor mechanism or a ball screw mechanism. The measuring instrument moving section 76 moves in the Y direction along a guide rail section 78 (see FIG. 8) provided in the center of the −X side surface of the nozzle support 601 and extending in the Y direction. When the measuring device moving section 76 moves in the Y direction, the three measuring devices 72 move integrally in the Y direction (second direction D2) by moving the connecting member 74 in the Y direction.

  As shown in FIG. 8, when the three measuring devices 72 move in the Y direction, the measuring device 72 closest to the + Y side is in the measurement range RY1 in the Y direction, and the measuring device 72 at the center in the Y direction is Y In the measurement range RY2 in the direction, the measuring device 72 on the −Y side measures the vertical position of the floating substrate W in the measurement range RY3 in the Y direction. As shown in FIG. 8, the measurement ranges RY1, RY2, and RY3 may have an overlap in the Y direction, but this is not essential.

  The three measuring devices 72 are provided upstream (−X side) with respect to the nozzle 61. Since each measuring device 72 is connected to the nozzle support 601, it moves together with the nozzle 61 attached to the nozzle support 601. That is, when the nozzle 61 moves in the X direction and the Z direction by the nozzle moving mechanism 63, each measuring device 72 also moves in the same direction following the nozzle 61.

<Buffer 80>
As shown in FIGS. 7 and 8, a buffer section 80 is attached to a central portion of a side surface on the −X side of the nozzle support 601. The buffer section 80 is a plate-shaped member extending in the Y-axis direction (second direction D2), and is arranged parallel to the YZ plane. The buffer 80 is provided at a position overlapping the discharge port 611 (the lower end of the nozzle 61) in the first direction D1.

  The buffer section 80 is disposed upstream of the nozzle 61 in the first direction D1 which is the transport direction. For this reason, when a foreign substance having a height that can contact the ejection port 611 is attached to the upper portion of the floating substrate W, the foreign substance contacts the buffer unit 80 before contacting the ejection port 611. Thereby, the foreign matter adheres to the buffer portion 80 and is removed from the floating substrate W, so that the contact of the foreign matter with the ejection port 611 can be reduced. Note that the vibration sensor that detects that a foreign substance has contacted the buffer unit 80 may be provided in the buffer unit 80. Then, when the vibration sensor detects the contact of the foreign matter, the control unit 9 may control the transfer mechanism 5 to stop the transfer of the floating substrate W.

  FIG. 9 is a schematic block diagram illustrating the control unit 9 of the embodiment. The coating apparatus 1 includes a control unit 9 for controlling the operation of each unit. The hardware configuration of the control unit 9 may be the same as a general computer. The control unit 9 includes a CPU 91 for performing various arithmetic processes, a read-only memory (ROM) for storing a basic program, a readable and writable memory 92 for storing various information, and a display unit 93 including a display for displaying various information. The memory 92 includes a fixed disk that stores a control application (program), data, and the like, in addition to a main storage device (RAM). The control unit 9 includes an interface unit that exchanges information with a user or an external device, and a reading device that reads information (program) stored in a portable storage medium (optical medium, magnetic medium, semiconductor memory, or the like). May be provided.

<Vertical position measurement processing>
The coating apparatus 1 performs an inspection for acquiring the distribution of the vertical position of the substrate W by the coating stage 32 (hereinafter, also referred to as a vertical position measurement process). As described above, in the application stage 32, the suction port 322h may suck foreign matter in order to suction the atmosphere. In this case, when the suction port 322h is clogged, there is a possibility that the flying height of the flying substrate W becomes insufficient, such as an insufficient flying height. The vertical position measurement processing is performed to detect such an abnormality in the flying height. The vertical position measurement processing may be performed at an appropriate timing according to the production schedule of the substrate W in the coating apparatus 1. For example, the process may be performed at the timing of performing the coating process on the first substrate of the lot, the first substrate of each day, and the first substrate of every afternoon, or may be performed at the timing of performing the coating process on all the substrates W.

  The vertical position measurement processing may be performed using the substrate W to which the processing liquid is actually applied. However, the substrate W to which the processing liquid is not applied and which is not applied (hereinafter, “dummy substrate W”) May also be used.) It is preferable that a pattern such as a wiring pattern is not formed on the upper surface Wf of the dummy substrate W. When there is a pattern on the upper surface Wf of the substrate W, the light from the light projecting unit 72a of the measuring instrument 72 is reflected by the pattern and travels in a different direction from the light receiving unit 72b, so that the reflected light from the upper surface Wf cannot be detected. There are cases. Therefore, by using the dummy substrate W having no pattern on the upper surface Wf, the measuring device 72 can detect the reflected light from the upper surface Wf satisfactorily. Therefore, the vertical position can be suitably measured.

  FIG. 10 is a diagram showing each step of the vertical position measurement processing executed by the coating apparatus 1. FIG. 10 shows a vertical position measurement process performed on the dummy substrate W. When starting the vertical position measurement processing, the control unit 9 performs the loading step S11. In the loading step S11, the control unit 9 controls the transport mechanism 5 to move the substrate (floating substrate) W to which the levitation force is applied from the levitation stage unit 3 downstream (in the + X direction) of the first direction D1. To be transported.

  The loading step S11 includes a stopping step S111. In the stopping step S111, as shown in FIG. 10B, the control unit 9 controls the transfer mechanism 5 to transfer the floating substrate W to the predetermined position LW1, and then stops the floating substrate W at the predetermined position LW1. It is. When the floating substrate W is disposed at the predetermined position LW1, the horizontal position of the downstream end (leading end) of the floating substrate W is the same as the horizontal position of the downstream end (edge) of the coating stage 32, or not. The position is slightly upstream.

  After the stopping step S111, the control unit 9 performs the measuring step S12. The measurement step S12 is a step of measuring the vertical position of the floating substrate W at a plurality of points in the upper region 32UR of the coating stage 32 by using three measuring devices 72 arranged in the Y direction. The upper region 32UR is a region that covers at least the entire middle region 32B, and in this example, a portion upstream of the middle region 32B (part of the upstream region 32A) and a portion downstream of the middle region 32B ( This is a region that covers the upper part of the downstream region 32C).

  In the measurement step S12, as shown in FIG. 10B, the control unit 9 controls the transport mechanism 5 to move the three measuring devices 72 to a position lower than the downstream end of the floating substrate W at the predetermined position LW1. It is arranged at a horizontal position slightly upstream. Thus, the three measuring devices 72 can measure the vertical position of the floating substrate W at the horizontal position slightly upstream of the downstream end. In this state, the control unit 9 controls the measuring device moving unit 76 to move the three measuring devices 72 in the Y direction (second direction D2). During the movement in the Y direction, the control unit 9 causes each of the three measuring devices 72 to measure the vertical position of the flying substrate W at a predetermined cycle. Thereby, the vertical positions of the floating substrate W at a plurality of points on a straight line extending in the Y direction are measured. Due to the movement of the three measuring devices 72 in the Y direction, not only the region corresponding to the coating target region on the upper surface Wf of the dummy floating substrate W, but also the portion protruding from the region on the + Y side and the −Y side, floats. The vertical position of the substrate W may be measured.

  When the control unit 9 completes the movement of the three measuring devices 72 in the Y direction, the control unit 9 controls the nozzle moving mechanism 63 to move the measuring unit 70 toward the upstream side (−X side) in the first direction D1 ( X direction movement). At this time, the three measuring devices 72 are moved by one pitch, which is a distance smaller than the X-direction dimension of the application stage 32, more preferably the X-direction dimension of the intermediate region 32B. Then, the control unit 9 causes each of the three measuring devices 72 to measure the vertical position of the floating substrate W at a plurality of points in the Y direction while moving the three measuring devices 72 again in the Y direction movement.

  As described above, the control unit 9 alternately moves the three measuring devices 72 in the X direction and the Y direction, thereby moving the three measuring devices 72 in a zigzag manner in the Y direction and the X direction. Thereby, the control unit 9 measures the vertical position of the floating substrate W at a plurality of points in the upper region 32UR of the coating stage 32, as shown in FIG. In the measurement step S12, the control unit 9 acquires the distribution of the vertical position of the floating substrate W in the upper region 32UR of the coating stage 32.

  After the measuring step S12 or during the measuring step S12, the control unit 9 may determine whether or not each measured vertical position is normal. This determination may be made by comparing the measured value with a threshold. When it is determined that the vertical position is abnormal, the control unit 9 may notify the outside by a predetermined output unit (the display unit 93, a lamp, a speaker, and the like). When it is determined that the vertical position is abnormal, the control unit 9 may stop the operation of the coating device 1.

  When the control unit 9 completes the measurement step S12, the control unit 9 performs an unloading step S13. The substrate W used in the measurement step S12 is a dummy substrate W to be uncoated. Therefore, in the unloading step S13, as shown in FIG. 10D, the control unit 9 controls the transport mechanism 5 to move the floating substrate W to the downstream side. Thus, the floating substrate W is carried out from above the coating stage 32 to the downstream side. Thus, the next substrate W to be coated can be carried into the coating stage 32.

  The vertical position measurement processing shown in FIG. 10 may be performed using the substrate W to be coated. In this case, after the measurement step S12 shown in FIG. 10C, the control unit 9 controls the moving mechanism 63 to move the nozzle 61 to the application position L11. The application position L11 is the position of the nozzle 61 when the horizontal position of the processing liquid when it is discharged from the nozzle 61 and adheres to the floating substrate W is inside the intermediate region 32B. Further, the control unit 9 moves the floating substrate W to the upstream side, and moves the floating substrate W to a position where the floating substrate W starts coating. When the movement of the nozzle 61 and the floating substrate W is completed, the control unit 9 controls the coating mechanism 6 to discharge the processing liquid from the nozzle 61, and controls the transport mechanism 5 to move the floating substrate W to the downstream side. . Thus, the processing liquid is applied to the application target area of the floating substrate W on the intermediate area 32B of the application stage 32.

  In the present embodiment, the vertical positions of a plurality of points in the Y direction can be measured by moving the measuring device 72 in the Y direction (second direction D2). Thus, the distribution of the vertical position of the floating substrate W in the Y direction can be obtained, and therefore, an abnormality in the floating height of the floating substrate W can be detected well. By moving the measuring device 72 also in the X direction (first direction D1), the distribution of the vertical position of the floating substrate W in the upper region 32UR of the coating stage 32 can be obtained. Thus, an abnormality in the flying height of the flying substrate W in a region that may affect the coating can be detected satisfactorily. Thereby, the coating process can be suitably performed.

  Further, as shown in FIG. 10B, the downstream end of the floating substrate W is disposed at the downstream end (edge) of the coating stage 32. Thus, the floating substrate W is hardly affected by the floating force from the outlet floating stage 33 located on the upstream side of the coating stage 32. For this reason, it is possible to detect an abnormality in the flying height of the floating substrate W due to clogging of the suction port 322h provided at the downstream end of the coating stage 32.

  FIG. 11 is a diagram showing each step of the vertical position measurement processing executed by the coating apparatus 1. FIG. 11 shows a vertical position measurement process performed on the floating substrate W to be coated. When starting the vertical position measurement processing, the control unit 9 performs a loading step S11 as shown in FIG. The loading step S11 is the same as the loading step shown in FIG.

  The loading step S11 includes a stop step S111a. In the stopping step S111a, as shown in FIG. 11B, the control unit 9 controls the transfer mechanism 5 to transfer the floating substrate W to the predetermined position LW2, and then stops the floating substrate W at the predetermined position LW2. It is. When the floating substrate W is located at the predetermined position LW2, the horizontal position of the downstream end of the floating substrate W is located above the downstream area 32C. At this time, the horizontal position of the downstream end may be above the intermediate region 32B of the coating stage 32, or may be on the boundary between the intermediate region 32B and the downstream region 32C.

  After the stop step S111a, the control unit 9 performs the measurement step S12a. The measurement step S12a is a step of measuring the vertical position of the floating substrate W at a plurality of points in the upper region 321UR of the coating stage 32 by using the three measurement devices 72 arranged in the Y direction similarly to the measurement step S12. The upper region 321UR is a region that covers the intermediate region 32B where the processing liquid is applied and a portion upstream of the intermediate region 32B (a part of the upstream region 32A).

  In the measurement step S12a, as shown in FIG. 11B, the control unit 9 controls the transport mechanism 5 to move the three measuring devices 72 slightly more than the downstream end of the floating substrate W at the predetermined position LW2. At the horizontal position on the upstream side. Thus, the three measuring devices 72 can measure the vertical position of the floating substrate W at the horizontal position slightly upstream of the downstream end. In this state, the control unit 9 controls the measuring device moving unit 76 to move the three measuring devices 72 in the Y direction (second direction D2).

  During the movement in the Y direction, the control unit 9 causes each of the three measuring devices 72 to measure the vertical position of the flying substrate W at a predetermined cycle. Thereby, the vertical positions of the floating substrate W at a plurality of points on a straight line extending in the Y direction are measured.

  When the movement of the three measuring devices 72 in the Y direction is completed, the control unit 9 controls the moving mechanism 63 to move the measuring unit 70 toward the upstream side (−X side) in the first direction D1 (X Direction). At this time, the three measuring devices 72 are moved by one pitch, which is a distance smaller than the X-direction dimension of the application stage 32, more preferably the X-direction dimension of the intermediate region 32B. Then, the control unit 9 causes each of the three measuring devices 72 to measure the vertical position of the floating substrate W at a plurality of points in the Y direction while moving the three measuring devices 72 again in the Y direction movement.

  As described above, the control unit 9 alternately moves the three measuring devices 72 in the X direction and the Y direction, thereby moving the three measuring devices 72 in a zigzag manner in the Y direction and the X direction. Thereby, the control unit 9 measures the vertical positions of the floating substrate W at a plurality of points in the upper region 321UR of the coating stage 32, as shown in FIG. In the measurement step S12a, the control unit 9 acquires the distribution of the vertical position of the floating substrate W in the upper region 321UR of the coating stage 32.

  After the measuring step S12a or during the measuring step S12a, the control unit 9 may determine whether or not each measured vertical position is normal. This determination may be made by comparing the measured value with a threshold. When it is determined that the vertical position is abnormal, the control unit 9 may notify the outside by a predetermined output unit (the display unit 93, a lamp, a speaker, and the like). When it is determined that the vertical position is abnormal, the control unit 9 may stop the operation of the coating device 1.

  After completing the measurement step S12a, the control unit 9 performs an application step S14. In the application step S14, the control unit 9 controls the moving mechanism 63 to move the nozzle 61 to the application position L11. At the completion of the measurement step S12a, the movement of each measuring device 72 in the X direction or the setting of the distance between the nozzle 61 and the measuring device 72 may be performed so that the nozzle 61 comes to the application position L11. . In this case, after the measurement step S12a, the movement of the nozzle 61 when moving to the coating step S14 can be omitted. Further, the control unit 9 controls the transport mechanism 5 to move the floating substrate W to a predetermined supply start position where the processing liquid is supplied from the nozzle 61 at the application position L11 to the upstream end of the application target area. When the predetermined position LW2 coincides with the supply start position, the movement of the floating substrate W can be omitted. When the movement of the nozzle 61 and the floating substrate W is completed, the control unit 9 controls the coating mechanism 6 to discharge the processing liquid from the nozzle 61, and controls the transport mechanism 5 to move the floating substrate W to the downstream side. . Thus, the processing liquid is applied to the application target area of the floating substrate W on the intermediate area 32B of the application stage 32.

  According to the vertical position measurement processing shown in FIG. 11, the distribution of the vertical position of the floating substrate W in the Y direction can be acquired in the intermediate region 32B of the coating stage 32 where the coating processing is performed. This makes it possible to satisfactorily identify a portion of the flying substrate W where the flying height is abnormal in the Y direction, thereby reducing the occurrence of coating failure. Further, since the upper region 321UR for acquiring the distribution of the vertical position is smaller than the upper region 32UR corresponding to almost the entire surface of the coating stage 32, the measurement time can be reduced.

  In the example illustrated in FIG. 11, each measuring device 72 moves in a range including the measurement position ML2 from the measurement position ML1 in the measurement step S12a. This is the horizontal position of each measuring device 72 when the vertical position of the floating substrate W at the horizontal position where the processing liquid from the nozzle 61 adheres to the floating substrate W can be measured. The measurement position ML2 can measure the vertical position of the floating substrate W at the horizontal position of the buffer 80 when the nozzle 61 discharges the processing liquid (that is, when the nozzle 61 is disposed at the application position L11). The horizontal position of each measuring device 72 at that time. By disposing each measuring device 72 at the measurement position ML2, the vertical position of the floating substrate W at the horizontal position of the buffer 80 when the nozzle 61 is disposed at the application position L11 can be measured. Can detect an abnormal flying height. Therefore, the contact of the floating substrate W with the buffer 80 during the coating process can be reduced.

<2. Modification>
Although the embodiments have been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible.

  It is not essential that the measurement unit 70 includes the three measurement devices 72. For example, the measurement unit 70 may include two or four or more measurement devices 72. Further, the measurement unit 70 may include a single measurement device 72. However, by arranging the plurality of measuring devices 72 at intervals in the Y direction, the vertical position of the flying substrate W can be measured at a plurality of different positions in the Y direction. Thus, the moving distance of each measuring device 72 can be reduced as compared with the case where a single measuring device 72 is provided, and thus the measurement time can be reduced.

  It is not essential that the measuring device moving section 76 integrally moves the three measuring devices 72 in the Y direction. For example, a measuring device moving mechanism for individually moving the three measuring devices 72 in the Y direction may be provided. However, by moving the plurality of measuring devices 72 integrally, the configuration for moving the measuring devices 72 can be simplified.

  It is not essential that the measuring unit 70 be moved in the X direction integrally with the nozzle 61 by the moving mechanism 63. For example, a measuring device moving mechanism that moves the measuring unit 70 in the X direction independently of the nozzle 61 may be provided. However, by moving the plurality of measuring devices 72 integrally with the nozzle 61, the configuration for moving the measuring devices 72 can be simplified.

  The measurement unit 70 may include two or more measurement devices 72 at regular intervals in the X direction. In this case, the vertical position of the floating substrate W on two straight lines can be measured simultaneously by moving the measuring devices 72 in the Y direction.

  Instead of attaching the measurement unit 70 to the nozzle support 601, another bridge structure may be separately provided, and the measurement unit 70 may be attached to this bridge structure. Further, since the maintenance unit 65 is a bridge structure, the measurement unit 70 may be attached to the butt 651 of the maintenance unit 65 so as to be movable in the Y and X directions. In this case, the measurement unit 70 may be manually moved without providing a driving unit.

  Although the present invention has been described in detail, the above description is illustrative in all aspects and the present invention is not limited thereto. It is understood that innumerable modifications that are not illustrated can be assumed without departing from the scope of the present invention. Each configuration described in each of the above embodiments and modifications can be appropriately combined or omitted as long as they do not contradict each other.

DESCRIPTION OF SYMBOLS 1 Coating apparatus 3 Floating stage part (floating mechanism)
31 Inlet floating stage 32 Coating stage 321h Spout port 322h Suction port 33 Outlet floating stage 5 Transport mechanism 6 Coating mechanism 601 Nozzle support 61 Nozzle 611 Discharge port 63 Nozzle moving mechanism 70 Measuring unit 72 Measuring instrument 72a Light emitting section 72b Light receiving section 74 Connector 76 Measuring device moving unit 80 Buffer unit 9 Control unit D1 First direction D2 Second direction L11 Coating position L13 Pre-discharge position L14 Washing position ML1, ML2 position S11 Loading process S12, S12a Measuring process S13 Unloading process S14 Coating process W Substrate, floating substrate Wf Upper surface (first principal surface)

Claims (9)

A substrate processing apparatus for processing a substrate having a first main surface and a second main surface,
A levitation mechanism in which the first main surface applies a levitation force to a vertically upward substrate;
A transport mechanism for moving the floating substrate, which is the substrate to which the floating force is applied, in a first direction that is a horizontal direction;
A nozzle having a discharge port extending in a second direction that is a horizontal direction perpendicular to the first direction, and capable of discharging a processing liquid from the discharge port toward the first main surface of the floating substrate;
A measuring device for measuring the vertical position of the floating substrate,
A measuring device moving unit that moves the measuring device in the second direction;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the measuring device moving unit moves the measuring device upstream and downstream in the second direction and the first direction. The substrate processing apparatus according to claim 2, wherein
A buffer portion provided at a position on the upstream side in the first direction with respect to the nozzle, at least at a position horizontally overlapping with a tip end portion of the discharge port of the nozzle;
A substrate processing apparatus, further comprising: The substrate processing apparatus according to claim 3, wherein
The measuring device moving mechanism, the measuring device, from the position at which the vertical position of the floating substrate can be measured at the adhesion horizontal position where the processing liquid from the nozzle is attached to the floating substrate, A substrate processing apparatus, wherein the vertical position of the floating substrate at a horizontal position of the buffering unit when discharging the processing liquid is moved in the second direction to a position where the vertical position can be measured. The substrate processing apparatus according to any one of claims 1 to 4, wherein
A substrate processing apparatus, comprising: a plurality of measuring devices for measuring a vertical position of the floating substrate at different positions in the second direction. The substrate processing apparatus according to claim 5, wherein
A connector for connecting the plurality of measuring instruments,
Further comprising
The substrate processing apparatus, wherein the measuring device moving unit moves the connecting tool in the second direction. The substrate processing apparatus according to any one of claims 1 to 6, wherein
The levitation mechanism,
A stage having a horizontal surface,
A plurality of ejection ports that are provided on the horizontal plane and eject air toward the upper side in the vertical direction,
A plurality of suction ports provided on the horizontal surface, for suctioning the air on the upper side in the vertical direction,
And a substrate processing apparatus. The substrate processing apparatus according to claim 1, wherein:
The measuring device moving mechanism moves the measuring device in the second direction in a state where an end of the floating substrate on the downstream side in the first direction is arranged on an edge of the stage on the downstream side in the first direction. Substrate processing equipment. A substrate processing method for processing a substrate having a first main surface and a second main surface,
(A) applying a levitation force to a substrate whose first main surface is vertically upward;
(B) moving the levitation substrate, which is the substrate to which the levitation force has been applied in the step (a), in a first direction that is a horizontal direction;
(C) moving a measuring device for measuring the vertical position of the floating substrate in a second direction, which is a horizontal direction orthogonal to the first direction, so that the vertical positions at a plurality of points in the second direction on the floating substrate. Measuring the
And a substrate processing method.

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