JP4758326B2 - Coating device - Google Patents

Description

  The present invention relates to a coating apparatus that discharges a liquid material from an application nozzle and applies the liquid material to an upper surface of a substrate.

  Application that applies the liquid material continuously or intermittently to the upper surface of a glass substrate or the like arranged on the stage by relatively moving the stage and an application nozzle that is arranged above the stage and discharges the liquid material In the apparatus, when the substrate is distorted, it is difficult to apply the liquid material to the upper surface of the substrate so that the liquid material has a certain height. Therefore, in the coating apparatus described in Patent Document 1, a height sensor is fixed to a syringe having a coating nozzle attached to the tip. When the liquid material is continuously applied to the upper surface of the substrate, the liquid material is discharged from the tip of the application nozzle and the application nozzle and the stage are relatively moved. At the same time, the height sensor measures the height of the tip of the coating nozzle from the upper surface of the substrate on the stage on the front side of the coating nozzle, and based on the measurement result, the control device determines the height of the tip of the coating nozzle. The height of the coating nozzle is adjusted by moving the syringe up and down so that the height is constant with respect to the upper surface of the substrate.

Further, in the coating apparatus described in Patent Document 1, when drawing a plurality of patterns with a liquid material on the upper surface of the substrate, the height of the tip of the coating nozzle from the representative measurement point that is the center of each pattern on the upper surface of the substrate is set. Measured with a height sensor provided in the syringe. Thereafter, based on the measurement result, the coating nozzle is moved up and down so that the height of the tip of the coating nozzle is constant with respect to the upper surface of the substrate, and a desired pattern is drawn with a liquid material on the upper surface of the substrate.
JP-A-9-99268

  However, in the coating apparatus described in Patent Document 1, the height of the tip of the coating nozzle from the upper surface of the substrate on the stage is measured with a height sensor while applying the liquid material, and based on the measurement result. When raising and lowering the application nozzle, the control device calculates the elevation amount of the application nozzle based on the measurement result of the height sensor while the application nozzle advances by a distance between the height sensor and the tip of the application nozzle. The application nozzle is moved up and down by the calculated lift amount. Therefore, it takes a certain amount of time to calculate the amount of lifting and lowering of the application nozzle, and a time lag occurs from the measurement by the height sensor until the liquid material can be applied, so the speed of applying the liquid material is high. There is a limit to the conversion.

  Further, in the coating apparatus described in Patent Document 1, when a plurality of patterns are drawn on the upper surface of the substrate, when the pattern is enlarged and the number of representative measurement points per pattern increases, a syringe is attached to each representative measurement point. Since the height of the tip of the application nozzle from the representative measurement point is measured in order, the time required for the measurement becomes long. As a result, it takes a long time to draw each pattern.

  The present invention has been made in view of such circumstances, and its purpose is to apply a liquid material while maintaining a substantially constant distance between the tip of the application nozzle and the upper surface of the substrate. An object of the present invention is to provide a coating apparatus capable of reducing the time required for coating.

  In order to solve the above-mentioned problem, the invention according to claim 1 is configured such that the substrate fixed on the stage and the application nozzle are relatively moved, and the liquid material discharged from the tip of the application nozzle is placed on the upper surface of the substrate. A coating apparatus for coating in a desired shape, the suction means for generating a suction force for fixing the substrate on the stage, and a height of the upper surface of the substrate from the stage. A plurality of fixed measuring means for outputting the corresponding measurement signals, and a control means for controlling the adsorption means, the control means from the stage on the upper surface of the substrate based on the plurality of measurement signals After calculating the height and controlling the suction means so as to increase the suction force as the calculated height is higher, the upper surface of the substrate is determined based on a plurality of newly input measurement signals. The height from the stage is calculated over the entire substrate, and the calculated upper surface is set based on the upper surface reference height that is the reference height from the stage on the upper surface of the substrate. When included in the allowable range, the deviation amount of the calculated average value with respect to the upper surface reference height is calculated as a correction value, and then the application nozzle is set at the reference height of the application nozzle. The gist is to apply the liquid material to the substrate in accordance with a height obtained by adding the correction value to a certain nozzle reference height.

  According to this configuration, the control means calculates the height from the stage on the upper surface of the substrate based on the measurement signals output from each of the plurality of fixed measurement means, controls the suction means, and the calculated height is high. The adsorption power for the substrate is increased. In general, when the substrate is distorted, the height of the upper surface of the substrate from the stage increases as the distortion increases. Therefore, by increasing the suction force to the substrate as the calculated height is higher, the portion of the substrate that is distorted is attracted to the stage side with a larger suction force, so that the distortion of the substrate is reduced. The liquid material is applied to the substrate only when the height of the upper surface of the substrate from the stage is included in the upper surface allowable range, that is, when the distortion of the substrate is below a certain level. However, by applying the liquid material to the upper surface of the substrate with the height of the application nozzle being a height obtained by adding a correction value to the nozzle reference height, the distance between the tip of the application nozzle and the upper surface of the substrate is reduced. The liquid material can be applied while being kept substantially constant. In addition, as in the past, during the application of the liquid material, the distance between the tip of the coating nozzle and the top surface of the substrate is measured to keep the distance between the tip of the coating nozzle and the top surface of the substrate constant. The amount of elevation of the application nozzle need not be calculated, and during application of the liquid material, the application nozzle is not raised or lowered according to the distance between the tip of the application nozzle and the upper surface of the substrate. Therefore, the speed at which the liquid material is applied to the upper surface of the substrate, that is, the movement speed of the application nozzle with respect to the substrate can be made faster than before. Accordingly, the liquid material can be applied while the distance between the tip of the application nozzle and the upper surface of the substrate is kept substantially constant, and the time required for applying the liquid material can be shortened. In this coating apparatus, the distance between the top surface of the substrate and the tip of the coating nozzle is kept substantially constant, so that the shape of the liquid material applied to the top surface of the substrate is stabilized.

  According to the second aspect of the present invention, the substrate fixed on the stage and the application nozzle are relatively moved, and the liquid material discharged from the tip of the application nozzle is applied to the upper surface of the substrate in a desired shape. An apparatus for generating a suction force for fixing the substrate on the stage; and a measurement signal disposed on the stage, the measurement signal corresponding to the height of the upper and lower surfaces of the substrate from the stage. A plurality of fixed measuring means each for outputting and a control means for controlling the suction means, and the control means calculates a height of the lower surface of the substrate from the stage based on a plurality of the measurement signals. The stage on the upper surface of the substrate is controlled based on a plurality of newly input measurement signals after the suction means is controlled to increase the suction force as the calculated height increases. These heights are calculated over the entire substrate, and the calculated height falls within the upper surface allowable range set based on the upper surface reference height, which is the reference height from the stage on the upper surface of the substrate. If included, the deviation amount of the calculated average value with respect to the upper surface reference height is calculated as a correction value, and then the application nozzle is set to a nozzle reference that is the reference height of the application nozzle. The gist is to apply the liquid material to the substrate in accordance with the height obtained by adding the correction value to the height.

  According to this configuration, the control means calculates the height from the stage on the lower surface of the substrate based on the measurement signals output from each of the plurality of fixed measurement means, controls the suction means, and the calculated height is high. The adsorption power for the substrate is increased. In general, when the substrate is distorted, the height of the lower surface of the substrate from the stage increases as the distortion increases. Therefore, by increasing the suction force to the substrate as the calculated height is higher, the portion of the substrate that is distorted is attracted to the stage side with a larger suction force, so that the distortion of the substrate is reduced. The liquid material is applied to the substrate only when the height of the upper surface of the substrate from the stage is included in the upper surface allowable range, that is, when the distortion of the substrate is below a certain level. However, by applying the liquid material to the upper surface of the substrate with the height of the application nozzle being a height obtained by adding a correction value to the nozzle reference height, the distance between the tip of the application nozzle and the upper surface of the substrate is reduced. The liquid material can be applied while being kept substantially constant. In addition, as in the past, during the application of the liquid material, the distance between the tip of the coating nozzle and the top surface of the substrate is measured to keep the distance between the tip of the coating nozzle and the top surface of the substrate constant. The amount of elevation of the application nozzle need not be calculated, and during application of the liquid material, the application nozzle is not raised or lowered according to the distance between the tip of the application nozzle and the upper surface of the substrate. Therefore, the speed at which the liquid material is applied to the upper surface of the substrate, that is, the movement speed of the application nozzle with respect to the substrate can be made faster than before. Accordingly, the liquid material can be applied while the distance between the tip of the application nozzle and the upper surface of the substrate is kept substantially constant, and the time required for applying the liquid material can be shortened. In this coating apparatus, the distance between the top surface of the substrate and the tip of the coating nozzle is kept substantially constant, so that the shape of the liquid material applied to the top surface of the substrate is stabilized.

  The invention according to claim 3 is an application in which the substrate fixed on the stage and the application nozzle are relatively moved, and the liquid material discharged from the tip of the application nozzle is applied to the upper surface of the substrate in a desired shape. An apparatus comprising: a suction unit that generates a suction force for fixing the substrate on the stage; a moving unit that is bridged on the stage and is moved relative to the stage; and the moving unit. As the moving means moves relative to the stage, the moving means moves relative to the stage, and scans the substrate on the stage and outputs measurement signals corresponding to the distance to the upper surface of the substrate. A plurality of movement measuring means, and a control means for controlling the adsorption means, wherein the control means is based on the measurement signals respectively output from the plurality of movement measuring means. The distance from the tip of the coating nozzle at the nozzle reference height, which is the reference height of the coating nozzle, to the upper surface of the substrate is calculated, and the suction force is increased as the calculated distance is shorter. After controlling the suction means, the distance from the tip of the coating nozzle at the nozzle reference height to the upper surface of the substrate is spread over the entire substrate based on the plurality of newly inputted measurement signals. And the calculated distance is included in a distance tolerance set based on a reference distance that is a reference distance between the coating nozzle and the upper surface of the substrate. A deviation amount of the average value with respect to the reference distance is calculated as a correction value, and then the application nozzle is adjusted to a height obtained by adding the correction value to the nozzle reference height, and the liquid material is applied to the substrate. To make the cloth has as its gist.

  According to this configuration, the control means calculates the distance from the tip of the application nozzle at the nozzle reference height to the upper surface of the substrate based on the measurement signals output from each of the plurality of movement measurement means, and By controlling, the shorter the calculated distance is, the larger the adsorption force to the substrate is. In general, when the substrate is distorted, the greater the distortion, the greater the distance between the stage and the upper surface of the substrate. Therefore, the greater the distortion, the greater the distance from the tip of the coating nozzle at the nozzle reference height. The distance to the upper surface of the substrate is shortened. Therefore, when the calculated distance is shorter, the portion of the substrate that is distorted is attracted to the stage side with a larger suction force by increasing the suction force for the roller, so that the strain of the substrate is reduced. The liquid material is applied to the substrate when the distance from the tip of the application nozzle at the nozzle reference height to the upper surface of the substrate is included in the distance tolerance range, that is, when the distortion of the substrate is below a certain level. Therefore, the control means applies the liquid material to the upper surface of the substrate by setting the height of the coating nozzle to a height obtained by adding a correction value to the nozzle reference height, and thereby the tip of the coating nozzle and the substrate. It is possible to apply the liquid material while keeping the distance between the upper surface and the upper surface of the liquid material substantially constant. In addition, as in the past, during the application of the liquid material, the distance between the tip of the coating nozzle and the top surface of the substrate is measured to keep the distance between the tip of the coating nozzle and the top surface of the substrate constant. The amount of elevation of the application nozzle need not be calculated, and during application of the liquid material, the application nozzle is not raised or lowered according to the distance between the tip of the application nozzle and the upper surface of the substrate. Therefore, the speed at which the liquid material is applied to the upper surface of the substrate, that is, the movement speed of the application nozzle with respect to the substrate can be made faster than before. Accordingly, the liquid material can be applied while the distance between the tip of the application nozzle and the upper surface of the substrate is kept substantially constant, and the time required for applying the liquid material can be shortened. In this coating apparatus, the distance between the top surface of the substrate and the tip of the coating nozzle is kept substantially constant, so that the shape of the liquid material applied to the top surface of the substrate is stabilized.

  According to the fourth aspect of the present invention, the substrate fixed on the stage and the application nozzle are relatively moved, and the liquid material discharged from the tip of the application nozzle is applied to the upper surface of the substrate in a desired shape. An apparatus comprising: a suction unit that generates a suction force for fixing the substrate on the stage; a moving unit that is bridged on the stage and is moved relative to the stage; and the moving unit. As the moving means moves relative to the stage, the moving means moves relative to the stage and scans the substrate on the stage to generate a measurement signal corresponding to the distance to the upper and lower surfaces of the substrate. A plurality of movement measuring means for outputting each of the output signals; and a control means for controlling the adsorption means. The control means outputs the measurement signals output by each of the plurality of movement measuring means. Based on the above, the distance from the tip of the coating nozzle at the nozzle reference height, which is the reference height of the coating nozzle, to the lower surface of the substrate is calculated, and the suction force is reduced as the calculated distance is shorter. After controlling the suction means so as to increase the distance, the distance from the tip of the coating nozzle at the nozzle reference height to the upper surface of the substrate is determined based on the plurality of newly input measurement signals. And the calculated distance is included in a distance tolerance set based on a reference distance that is a reference distance between the coating nozzle and the upper surface of the substrate. The amount of deviation of the average distance from the reference distance is calculated as a correction value, and then the application nozzle is adjusted to a height obtained by adding the correction value to the nozzle reference height, and the base of the liquid material is adjusted. And as its gist to carry out application to.

  According to this configuration, the control means calculates the distance from the tip of the coating nozzle at the nozzle reference height to the lower surface of the substrate based on the measurement signals output from each of the plurality of movement measurement means, and By controlling, the shorter the calculated distance is, the larger the adsorption force to the substrate is. Generally, when the substrate is distorted, the greater the distortion, the greater the distance between the stage and the lower surface of the substrate. Therefore, the greater the distortion, the greater the distance from the tip of the coating nozzle at the nozzle reference height. The distance to the lower surface of the substrate is shortened. Therefore, when the calculated distance is shorter, the portion of the substrate that is distorted is attracted to the stage side with a larger suction force by increasing the suction force for the roller, so that the strain of the substrate is reduced. The liquid material is applied to the substrate when the distance from the tip of the application nozzle at the nozzle reference height to the upper surface of the substrate is included in the distance tolerance range, that is, when the distortion of the substrate is below a certain level. Therefore, the control means applies the liquid material to the upper surface of the substrate by setting the height of the coating nozzle to a height obtained by adding a correction value to the nozzle reference height, and thereby the tip of the coating nozzle and the substrate. It is possible to apply the liquid material while keeping the distance between the upper surface and the upper surface of the liquid material substantially constant. In addition, as in the past, during the application of the liquid material, the distance between the tip of the coating nozzle and the top surface of the substrate is measured to keep the distance between the tip of the coating nozzle and the top surface of the substrate constant. The amount of elevation of the application nozzle need not be calculated, and during application of the liquid material, the application nozzle is not raised or lowered according to the distance between the tip of the application nozzle and the upper surface of the substrate. Therefore, the speed at which the liquid material is applied to the upper surface of the substrate, that is, the movement speed of the application nozzle with respect to the substrate can be made faster than before. Accordingly, the liquid material can be applied while the distance between the tip of the application nozzle and the upper surface of the substrate is kept substantially constant, and the time required for applying the liquid material can be shortened. In this coating apparatus, the distance between the top surface of the substrate and the tip of the coating nozzle is kept substantially constant, so that the shape of the liquid material applied to the top surface of the substrate is stabilized.

  According to a fifth aspect of the present invention, in the coating apparatus according to any one of the first to fourth aspects, the control means measures in advance when the liquid material is applied to the upper surface of the substrate. The gist of the invention is to raise and lower the application nozzle by a stage correction amount set based on the flatness of the upper surface of the stage.

  According to this configuration, the distance between the upper surface of the stage and the tip of the coating nozzle is kept constant by raising and lowering the coating nozzle by the amount of the stage correction amount by the control means during application of the liquid material. As a result, the distance between the upper surface of the substrate disposed on the stage and the tip of the coating nozzle can be kept more nearly constant. The “flatness” in the present invention includes the degree of inclination of the upper surface of the stage.

  A sixth aspect of the present invention is the coating apparatus according to any one of the first to fifth aspects, wherein the control unit is configured so that the substrate is placed on the stage in order from the center of the substrate toward the periphery. The gist is to control the adsorption means so as to be adsorbed.

  According to this configuration, the substrate can be easily flattened by adsorbing in order from the center of the substrate toward the periphery.

  According to the present invention, there is provided an application apparatus capable of applying a liquid material while maintaining a substantially constant distance between the tip of the application nozzle and the upper surface of the substrate and reducing the time required for applying the liquid material. Can be provided.

(First embodiment)
A first embodiment of the present invention will be described below with reference to the drawings.
FIG. 1: is a schematic block diagram of the bonding board | substrate manufacturing apparatus which implements the process of liquid crystal injection | pouring and bonding in a cell manufacturing process among the manufacturing processes of a liquid crystal display device.

  The bonded substrate manufacturing apparatus 21 manufactures a liquid crystal display panel by enclosing a liquid crystal between two types of supplied substrates W1 and W2. In addition, the liquid crystal display panel manufactured with the apparatus of this embodiment is an active matrix liquid crystal display panel, for example. The lower substrate W1 is an array substrate (TFT substrate) on which a TFT or the like is formed on a glass substrate, and the upper substrate W2 is a color filter substrate (CF on which a color filter, a light shielding film, or the like is formed on the glass substrate. Substrate). The lower substrate W1 and the upper substrate W2 are created and supplied by respective processes.

  The bonded substrate manufacturing device 21 includes a control device 22, a seal drawing device 23 as a coating device controlled by the control device 22, a liquid crystal dropping device 24, a bonding device 25, and an inspection device 26. The laminating device 25 includes a press device 27 and a curing device 28, and these devices 27 and 28 are controlled by the control device 22. Moreover, the bonded substrate manufacturing apparatus 21 includes transport devices 29a to 29d that transport the supplied lower substrate W1 and upper substrate W2. And the control apparatus 22 controls the conveying apparatuses 29a-29d, and conveys the lower board | substrate W1 and the upper board | substrate W2, and the bonding board | substrate W3 manufactured by it.

  The bonded substrate manufacturing apparatus 21 will be described in detail. The lower substrate W1 and the upper substrate W2 are first supplied to the seal drawing device 23. The seal drawing device 23 applies a seal material to the upper surface of the lower substrate W1 in a frame shape. As the sealing material, an adhesive containing at least a photo-curable adhesive is used. The lower substrate W1 and the upper substrate W2 are supplied to the transport device 29a, and the transport device 29a transports the lower substrate W1 and the upper substrate W2 as a set to the liquid crystal dropping device 24.

  The liquid crystal dropping device 24 drops liquid crystal at a plurality of preset positions on the conveyed lower substrate W1. Then, the lower substrate W1 and the upper substrate W2 onto which the liquid crystal has been dropped are transported to the press device 27 by the transport device 29b.

  The press device 27 includes a chamber (not shown) as a processing chamber. The lower substrate W1 and the upper substrate W2 are transported into the chamber by the transport device 29b, and are disposed horizontally so as to face each other in the chamber. The press device 27 evacuates the chamber after the lower substrate W1 and the upper substrate W2 are transferred into the chamber. Next, the press device 27 optically aligns the lower substrate W1 and the upper substrate W2 using the alignment mark (alignment mark) in a non-contact manner (at least on the sealing material on the upper surface of the lower substrate W1). (With the bottom surface not touching). Then, the press device 27 releases the chamber to the atmosphere after pressurizing until the distance between the lower substrate W1 and the upper substrate W2 becomes a predetermined distance at which the sealing material comes into close contact. As a result, the lower substrate W1 and the upper substrate W2 are compressed to a final substrate interval having a predetermined cell thickness (cell gap) due to a pressure difference from the atmospheric pressure, and the lower substrate W1 and the upper substrate W2 are in close contact with each other. Thus, it is difficult for relative displacement between the substrates W1 and W2.

  The bonded lower substrate W1 and upper substrate W2, that is, the bonded substrate W3, are transferred to the curing device 28 by the transfer device 29c. At this time, the control device 22 monitors the elapse of time after the lower substrate W1 and the upper substrate W2 are bonded together, and when a predetermined time elapses, the transfer device 29c is driven to bond the bonded substrate W3. Is supplied to the curing device 28. The curing device 28 cures the sealing material by irradiating the bonded substrate W3 with light having a predetermined wavelength.

  In this way, the lower substrate W1 and the upper substrate W2 that are bonded together are irradiated with light for curing the sealing material after a predetermined time has elapsed since the bonding. This predetermined time is obtained in advance by experiments based on the diffusion rate of the liquid crystal and the time required to release the stress remaining on the bonded substrate W3 due to the pressure applied to both the substrates W1 and W2 during bonding. Further, the liquid crystal sealed between the lower substrate W1 and the upper substrate W2 by the press device 27 is diffused by the pressure and the atmospheric pressure applied when the substrates W1 and W2 are bonded together. Then, after the liquid crystal is diffused, the sealing material is cured.

  The bonded substrate W3 on which the sealing material has been cured is transported to the inspection device 26 by the transport device 29d. The inspection device 26 measures the positional deviation (the direction of positional deviation and the amount of positional deviation) between the lower substrate W1 and the upper substrate W2 in the transferred bonded substrate W3, and outputs the measured value to the control device 22. The control device 22 corrects the alignment in the press device 27 based on the inspection result of the inspection device 26. That is, the bonded substrate W3 to be manufactured next is obtained by shifting the amount of shift between the lower substrate W1 and the upper substrate W2 in the bonded substrate W3 having the cured sealing material in the direction opposite to the direction of the positional shift. The positional deviation between the lower substrate W1 and the upper substrate W2 is controlled.

Next, the seal drawing device 23 will be described in detail.
FIG. 2 is a schematic view of the seal drawing device 23 for applying the sealing material R to the upper surface W1a of the lower substrate W1 as viewed from the side.

  As shown in FIG. 2, a stage 32 having a rectangular parallelepiped shape smaller than the base 31 is placed on a base 31 in the shape of a rectangular parallelepiped constituting the seal drawing device 23. A gantry 33 is provided so as to straddle the stage 32. The gantry 33 is integrally formed with a pair of support legs 33a extending parallel to each other upward from the base 31, and a connecting portion 33b spanning between the two support legs 33a and connecting the upper ends of the support legs 33a. It is formed and the shape seen from the side is U-shaped. The base end portions of the pair of support legs 33 a are inserted into a pair of guide grooves 31 a formed in parallel along the stage 32 on both sides of the stage 32 on the upper surface of the base 31. The gantry 33 is moved in the y direction along the guide groove 31a by a y-axis actuator 34 provided in the base 31 corresponding to the pair of support legs 33a. In FIG. 2, the direction perpendicular to the paper surface is the y direction.

  The connecting portion 33b is provided with an x-axis base 36 that is moved in the x-direction along the connecting portion 33b by the driving force of the x-axis actuator 35. The x-axis base 36 includes a z-axis actuator 37. A z-axis base 38 that is moved along the z direction by a driving force is provided. The x direction is a direction orthogonal to the y direction, and the z direction is a direction orthogonal to both the y direction and the x direction. In FIG. 2, the horizontal direction is the x direction, and the vertical direction is the z direction.

  A substantially cylindrical syringe 41 is attached to the z-axis base 38 so as to be able to move integrally with the z-axis base 38, and the syringe 41 is filled with a sealing material R for applying to the lower substrate W1. ing. As described above, the sealing material R is an adhesive containing at least a photocurable adhesive. In addition, the lower end portion of the syringe 41 is formed in a conical shape whose diameter decreases toward the lower end, and an application nozzle 42 is attached to the lower end thereof.

  A distance sensor 43 for measuring the distance between the upper surface W1a of the lower substrate W1 disposed on the stage 32 and the tip of the coating nozzle 42 is fixed to the lower end of the z-axis base 38. The distance sensor 43 irradiates light perpendicularly to the upper surface W1a of the lower substrate W1 disposed on the stage 32 and receives the reflected light, whereby the upper surface W1a of the lower substrate W1 and the coating are applied based on the received reflected light. A first measurement signal S1 corresponding to the distance from the tip of the nozzle 42 is output.

  The stage 32 has an upper surface 32a formed horizontally, and a plurality (32 in this embodiment) of suction areas A are set on the upper surface 32a of the stage 32 as shown in FIG. The 32 suction regions A each have a quadrangular shape, and are equally set in a range where the lower substrate W1 is disposed on the upper surface 32a of the stage 32. In each suction region A, a plurality (12 in this embodiment) of suction holes 32b are formed in a matrix. Then, the suction device 45 (see FIG. 6) provided in the stage 32 sucks the gas between the lower substrate W1 disposed on the stage 32 and the stage 32 from the suction hole 32b. A vacuum suction force is generated between the lower substrate W1 and the lower substrate W1 is fixed on the stage 32 by the vacuum suction force. Further, the suction device 45 is configured to be able to change the magnitude of the vacuum suction force with respect to the lower substrate W1 on the stage 32 for each suction region A.

  As shown in FIG. 4, a plurality (15 in this embodiment) of accommodating recesses 32 c are formed on the upper surface 32 a of the stage 32. The fifteen receiving recesses 32c are formed at positions facing the lower substrate W1 in the z direction when the lower substrate W1 is disposed on the upper surface of the stage 32. Specifically, the fifteen receiving recesses 32 c are formed so as to be arranged in three rows of five along the longitudinal direction of the stage 32. Further, five receiving recesses 32c constituting each row are provided at equal intervals in the y direction, and three rows constituting the receiving recesses 32c are provided at equal intervals in the x direction. The distance sensors 51a to 51o are accommodated one by one in the 15 accommodating recesses 32c. These distance sensors 51a to 51o are the height of the upper surface W1a of the lower substrate W1 disposed on the stage 32 from the upper surface 32a of the stage 32, and the height of the lower surface W1b of the lower substrate W1 from the upper surface 32a of the stage 32. It is for measuring.

  As shown in FIG. 5, the upper ends of the distance sensors 51a to 51o are cut into a triangular shape, and two inclined surfaces 52 and 53 facing each other are formed at the cut portion. A light emitting element 54 is provided on one of the slopes 52 and 53, and a light receiving element 55 is provided on the other slope 53. The light emitting element 54 irradiates light (see a broken line in FIG. 5) to the upper surface W1a of the lower substrate W1, and is reflected by the reflected light reflected by the upper surface W1a of the lower substrate W1 and the lower surface W1b of the lower substrate W1. The light receiving element 55 receives the reflected light. The light receiving element 55 is composed of, for example, a PSD (Position Sensitive Detector), and outputs a second measurement signal S2 corresponding to the light receiving position of the reflected light in the light receiving element 55. In FIG. 5, the lower substrate W1 without distortion is shown by a solid line, and the reflected light reflected by the lower substrate W1 without distortion is shown by a broken line. Further, the distorted lower substrate W1 is illustrated by a two-dot chain line, and the reflected light reflected by the distorted lower substrate W1 is illustrated by a one-dot chain line.

  As shown in FIG. 6, the y-axis actuator 34, the x-axis actuator 35, the z-axis actuator 37, the distance sensor 43, the suction device 45, and the distance sensors 51 a to 51 o are controlled by a control device 61.

  More specifically, the control device 61 uses the sealing material R to draw a desired pattern on the upper surface W1a of the lower substrate W1 disposed on the stage 32, so that the y-axis actuator 34, the x-axis actuator 35, and the z-axis actuator are drawn. 37 is controlled. The control device 61 controls the suction device 45 so as to fix and release the lower substrate W1 disposed on the stage 32 with respect to the stage 32, and vacuum suction for sucking the lower substrate W1 for each suction region A. Adjust the force.

  Further, the control device 61 calculates various values based on the first measurement signal S1 input from the distance sensor 43 and the second measurement signal S2 input from the distance sensors 51a to 51o. For example, the control device 61 calculates the distance between the upper surface W1a of the lower substrate W1 disposed on the stage 32 and the tip of the coating nozzle 42 based on the first measurement signal S1. Further, the control device 61 uses the triangulation method based on the second measurement signals S2 respectively input from the distance sensors 51a to 51o, and the upper surface of the stage 32 of the upper surface W1a of the lower substrate W1 disposed on the stage 32. The height from 32a and the height from the upper surface 32a of the stage 32 of the lower surface W1b of the lower substrate W1 are calculated.

  The control device 61 measures the flatness (including the degree of inclination) of the upper surface 32a of the stage 32 in advance, and has a stage correction amount calculated based on the measurement result. The stage correction amount is a shift amount (shift amount in the z direction) of the upper surface 32a of the stage 32 with respect to the upper surface of the stage in a completely flat (horizontal) state, and is calculated corresponding to the entire upper surface 32a of the stage 32. Yes. The stage correction amount is calculated by measuring the flatness of the upper surface 32a of the stage 32 when the stage 32 is first installed, and also when the seal drawing device 23 is maintained or the like. Calculated and updated by measuring flatness.

Next, the application of the sealing material R to the lower substrate W1 performed by the seal drawing device 23 as described above will be described in detail.
[First step]
First, the lower substrate W1 is disposed at a predetermined position on the stage 32. At this time, the control device 61 arranges the syringe 41 at a position where an interval equal to or larger than the thickness of the lower substrate W1 is provided between the tip of the application nozzle 42 and the upper surface 32a of the stage 32.

[Second step]
Next, the control device 61 drives the suction device 45 to fix (temporarily fix) the lower substrate W1 on the stage 32 by a vacuum suction force. At this time, the control device 61 controls the suction device 45 so as to suck the lower substrate W1 in order from the center of the lower substrate W1 toward the periphery. At this time, the control device 61 controls the suction device 45 so that the vacuum suction force in each suction region A becomes equal, and the magnitude of the vacuum suction force minimizes the relative movement of the lower substrate W1 with respect to the stage 32. The adsorbing device 45 is controlled so as to have a size that is limited.

[Third step]
Next, the control device 61 drives the distance sensors 51a to 51o so that the distance sensors 51a to 51o move downward from the upper surface 32a of the stage 32 at 15 points where the distance sensors 51a to 51o are arranged. The height of the lower surface W1b of the substrate W1 is measured.

[Fourth step]
Next, the control device 61 determines the height of the lower surface W1b of the lower substrate W1 from the upper surface 32a of the stage 32 based on the second measurement signal S2 input from the distance sensors 51a to 51o. Obtained by calculation over the entire top surface.

[Fifth step]
Next, the control device 61 adjusts the vacuum suction force for each suction region A according to the calculated height of the lower surface W1b of the lower substrate W1 from the upper surface 32a of the stage 32.

  Here, in general, when the lower substrate W1 is distorted, the lower substrate W1 disposed on the stage 32 has a partially raised shape. Therefore, a gap is generated between the lower surface W1b of the lower substrate W1 and the upper surface 32a of the stage 32 in a portion where the distortion occurs in the lower substrate W1. Therefore, the control device 61 controls the suction device 45 so that the vacuum suction force increases as the height increases according to the calculated height of the lower surface W1b of the lower substrate W1 from the upper surface 32a of the stage 32. Thus, the vacuum suction force is controlled for each suction region A. That is, the control device 61 controls the suction device 45 so that the vacuum suction force of the suction region A corresponding to the portion where the calculated height of the lower surface W1b of the lower substrate W1 from the upper surface 32a of the stage 32 is high. . At this time, the controller 61 responds to the calculated height of the lower surface W1b of the lower substrate W1 from the upper surface 32a of the stage 32 while maintaining the vacuum suction force that fixes the lower substrate W1 on the stage 32 in the second step. The suction device 45 is controlled so that a vacuum suction force of a certain magnitude is generated simultaneously over the entire lower substrate W1. As a result, the raised portion of the lower substrate W1 on the stage 32 is sucked toward the stage 32, and the lower substrate W1 is corrected so as to reduce distortion.

[Sixth step]
Next, the control device 61 drives the distance sensors 51a to 51o again, and from the upper surface 32a of the stage 32 at the 15 points where the distance sensors 51a to 51o are arranged by the distance sensors 51a to 51o. The height of the upper surface W1a of the lower substrate W1 and the height of the lower surface W1b of the lower substrate W1 from the upper surface 32a of the stage 32 are measured.

[Seventh step]
Next, the control device 61 determines the height of the upper surface W1a of the lower substrate W1 from the upper surface 32a of the stage 32 based on the second measurement signal S2 newly input from the distance sensors 51a to 51o. It is obtained by calculation over the entire upper surface of W1. And the control apparatus 61 determines whether the height of the upper surface W1a from the upper surface 32a calculated | required by calculation is contained in a predetermined upper surface allowable range. In the present embodiment, the upper surface allowable range is a range obtained by adding an allowable error to the upper surface reference height, which is a reference height from the upper surface 32a of the stage 32 of the upper surface W1a of the lower substrate W1. For example, it is a predetermined region centered on the upper surface reference height. The upper surface reference height is a height from the upper surface 32a of the stage 32 of the upper surface W1a of the lower substrate W1 with no error in thickness and no distortion.

  When the calculated height of the upper surface W1a of the lower substrate W1 from the upper surface 32a of the stage 32 is within the upper surface allowable range, the control device 61 calculates an average value of the height of the upper surface W1a from the upper surface 32a. The deviation amount of the average value with respect to the upper surface reference height is calculated as a correction value. Thereafter, the control device 61 controls the z-axis actuator 37 to adjust the height of the application nozzle 42 to a height obtained by adding a correction value to the nozzle reference height. The “nozzle reference height” is a preset value, and is set in consideration of the sealing material R applied to the upper surface W1a of the lower substrate W1 so as to have a desired height and width. This is the height of the nozzle 42.

  On the other hand, when the calculated height of the upper surface W1a of the lower substrate W1 from the upper surface 32a of the stage 32 is not included in the upper surface allowable range, the control device 61 applies the newly input second measurement signal S2. Based on this, the height of the lower surface W1b of the lower substrate W1 from the upper surface 32a of the stage 32 is calculated. Then, the control device 61 returns to the fifth step, and based on the calculated height of the lower surface W1b of the lower substrate W1 from the upper surface 32a of the stage 32, the higher the height, the greater the vacuum suction force. As described above, the suction device 45 is controlled to control the vacuum suction force for each suction region A. At this time, the control device 61 controls the suction device 45 so that a larger vacuum suction force than that in the previous control of the suction device 45 is generated. Thereafter, the sixth step and the seventh step are performed again. If the height of the upper surface W1a of the lower substrate W1 from the upper surface 32a of the stage 32 is not included in the upper surface allowable range even if the fifth to seventh steps are repeated a predetermined number of times, the manufacturing is performed. Interrupt.

[Eighth step]
Next, the control device 61 drives the y-axis actuator 34 and the x-axis actuator 35 to move the syringe 41 having the application nozzle 42 at the tip with respect to the stage 32, and seal material R discharged from the application nozzle 42. Is continuously applied to the upper surface W1a of the lower substrate W1. Thereby, a desired pattern is drawn with the sealing material R on the upper surface W1a of the lower substrate W1. Then, the distortion of the lower substrate W1 is corrected by adjusting the vacuum suction force, and the height of the upper surface W1a of the lower substrate W1 from the upper surface 32a of the stage 32 is a value within the upper surface allowable range. By setting the height of the coating nozzle 42 to a height obtained by adding a correction value to the nozzle reference height, the distance between the upper surface W1a of the lower substrate W1 and the tip of the coating nozzle 42 is kept substantially constant.

  In the same process, the control device 61 raises and lowers the application nozzle 42 by the amount of the stage correction amount according to the position of the syringe 41 in the x and y directions. Further, in the same process, the control device 61 drives the distance sensor 43 to measure the distance between the upper surface W1a of the lower substrate W1 and the tip of the coating nozzle 42, and the first input from the distance sensor 43. The distance between the upper surface W1a of the lower substrate W1 and the tip of the coating nozzle 42 is calculated based on one measurement signal S1. Then, when the calculated distance between the upper surface W1a of the lower substrate W1 and the tip of the coating nozzle 42 exceeds a preset threshold value, the control device 61 discharges the sealing material R from the coating nozzle 42. And the drive of each actuator 34, 35, 37 is stopped. The “threshold value” is an upper limit value and a lower limit value of a predetermined area centered on the distance between the tip of the application nozzle 42 and the upper surface W1a of the lower substrate W1 when the tip of the application nozzle 42 is at the nozzle reference height. Corresponds to the value. “Exceeding the threshold value” means that the distance between the upper surface W1a of the lower substrate W1 calculated based on the first measurement signal S1 and the tip of the coating nozzle 42 is longer than the upper limit value, or the same distance. Means that becomes shorter than the lower limit.

[Ninth step]
When the application of the sealing material R to the upper surface W1a of the lower substrate W1 is completed, the control device 61 drives the z-axis actuator 37 to place the lower substrate W1 between the tip of the application nozzle 42 and the upper surface 32a of the stage 32. The syringe 41 is arranged at a position where an interval equal to or greater than the thickness is provided. Next, the control device 61 controls the suction device 45 to release the fixation of the lower substrate W1 on the stage 32. Thereafter, as shown in FIG. 1, the lower substrate W1 is moved from the seal drawing device 23 to the liquid crystal dropping device 24 by the transfer device 29a.

As described above, according to the first embodiment, the following operational effects are obtained.
(1) The control device 61 calculates the height of the lower surface W1b of the lower substrate W1 from the upper surface 32a of the stage 32 based on the second measurement signal S2 output by each of the fifteen distance sensors 51a to 51o, and sucks it. By controlling the apparatus 45, the higher the calculated height, the greater the vacuum suction force for the lower substrate W1. In this way, by increasing the vacuum suction force on the lower substrate W1 as the calculated height increases, a portion of the lower substrate W1 that is distorted is attracted to the stage 32 side with a larger vacuum suction force. The distortion of the lower substrate W1 is reduced. The application of the sealing material R to the lower substrate W1 is performed when the height of the upper surface W1a of the lower substrate W1 from the upper surface 32a of the stage 32 is included in the upper surface allowable range, that is, the distortion of the lower substrate W1 becomes below a certain level. Therefore, the controller 61 applies the sealing material R to the upper surface W1a of the lower substrate W1 with the height of the application nozzle 42 as a height obtained by adding a correction value to the nozzle reference height. By doing so, it is possible to apply the liquid material while keeping the distance between the tip of the application nozzle 42 and the upper surface W1a of the lower substrate W1 substantially constant. In addition, as in the past, during the application of the sealing material, the distance between the tip of the coating nozzle and the top surface of the substrate is measured to keep the distance between the tip of the coating nozzle and the top surface of the substrate constant. The amount of elevation of the application nozzle need not be calculated, and during application of the sealing material R, the application nozzle 42 is not raised or lowered according to the distance between the tip of the application nozzle 42 and the upper surface W1a of the lower substrate W1. Therefore, the speed at which the sealing material R is applied to the upper surface W1a of the lower substrate W1, that is, the moving speed of the application nozzle 42 with respect to the lower substrate W1, can be made higher than before. For these reasons, the seal material R is applied while the distance between the tip of the application nozzle 42 and the upper surface W1a of the lower substrate W1 is kept substantially constant, and the time required for applying the seal material R can be shortened. it can. In this seal drawing device 23, the distance between the upper surface W1a of the lower substrate W1 and the tip of the coating nozzle 42 is kept substantially constant, so that the sealing material R applied to the upper surface W1a of the lower substrate W1. The shape of is stabilized.

  (2) The application nozzle 42 is moved up and down by the amount of the stage correction amount by the control device 61 during application of the sealing material R, so that the distance between the upper surface 32a of the stage 32 and the tip of the application nozzle 42 is kept constant. Be drunk. As a result, the distance between the upper surface W1a of the lower substrate W1 disposed on the stage 32 and the tip of the coating nozzle 42 can be kept in a more nearly constant state.

  (3) In the second step, the control device 61 controls the suction device 45 so as to suck the lower substrate W1 in order from the center of the lower substrate W1 to the periphery, so that the lower substrate W1 can be more easily flattened. It can be carried out.

  (4) In the fifth step, since the suction device 45 is controlled so that the vacuum suction force is simultaneously increased with respect to the distorted portion in the lower substrate W1, the distortion of the lower substrate W1 is corrected in a shorter time. be able to.

  (5) In the seventh step, the control device 61 calculates a correction value only when the calculated height of the upper surface W1a of the lower substrate W1 from the upper surface 32a of the stage 32 is included in the upper surface allowable range, and coating is performed. The eighth and ninth steps are performed by adjusting the height of the nozzle 42 to the height obtained by adding a correction value to the nozzle reference height. When the thickness of the lower substrate W1 is thicker than the allowable thickness or thinner than the allowable thickness, the sealing material R is not applied to the lower substrate W1. Therefore, the rate at which defective products are manufactured by the bonded substrate manufacturing apparatus 21 is reduced.

(Second Embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to the drawings. In addition, about the structure same as the said 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  FIG. 7 is a schematic view of the seal drawing device 71 for applying the sealing material R to the upper surface W1a of the lower substrate W1 as viewed from the side. The seal drawing device 71 of the second embodiment is replaced with a plurality of (fixed to the connecting portion 33b of the gantry 33 instead of the distance sensors 51a to 51o (see FIG. 4) provided on the stage 32 in the first embodiment. In this embodiment, four distance sensors 72a to 72d are provided.

  The distance sensors 72a to 72d are distances from the distance sensors 72a to 72d to the upper surface W1a of the lower substrate W1 disposed on the stage 32, and distances from the distance sensors 72a to 72d to the lower surface W1b of the lower substrate W1. Provided for measuring. These distance sensors 72 a to 72 d are fixed to the lower surface of the connecting portion 33 b and face the upper surface 32 a of the stage 32. Of the four distance sensors 72a to 72d, the two distance sensors 72a and 72d disposed at both ends are slightly inside the both ends in the x direction of the lower substrate W1 disposed on the stage 32, It is arranged at a position that can face the lower substrate W1 in the z direction. Further, as shown in FIG. 9, in the state where the syringe 41 is arranged in the center in the longitudinal direction of the connecting portion 33b, that is, in the state where the distance sensor 43 is arranged in the center in the longitudinal direction of the connecting portion 33b, The five distance sensors 43 and 72a to 72d including the fixed distance sensor 43 are equally spaced in the longitudinal direction of the connecting portion 33b (the same in the x direction). These distance sensors 72a to 72d irradiate the lower substrate W1 disposed on the stage 32 with light, and reflect the reflected light reflected by the upper surface W1a of the lower substrate W1 and the lower surface W1b of the lower substrate W1. The reflected light is received, and third measurement signals S3 corresponding to the received reflected light are output.

  8, the y-axis actuator 34, the x-axis actuator 35, the z-axis actuator 37, the distance sensor 43, the suction device 45, and the distance sensors 72a to 72d are controlled by a control device 73.

  More specifically, the control device 73 is similar to the control device 61 of the first embodiment described above in order to draw a desired pattern with the sealing material R on the upper surface W1a of the lower substrate W1 disposed on the stage 32. The y-axis actuator 34, the x-axis actuator 35, and the z-axis actuator 37 are controlled. The control device 73 controls the suction device 45 so as to fix and release the lower substrate W1 arranged on the stage 32 with respect to the stage 32, and vacuum suction for sucking the lower substrate W1 for each suction region A. Adjust the force.

  Further, the control device 73 calculates various values based on the first measurement signal S1 input from the distance sensor 43 and the third measurement signal S3 input from the distance sensors 72a to 72d. For example, the control device 73 calculates the distance between the tip of the coating nozzle 42 and the upper surface W1a of the lower substrate W1 based on the first measurement signal S1. Further, the control device 73 determines the distances from the distance sensors 72a to 72d to the upper surface W1a of the lower substrate W1 on the stage 32 based on the third measurement signal S3 input from the distance sensors 72a to 72d, and the distances. The distance from the sensors 72a to 72d to the lower surface W1b of the lower substrate W1 is calculated. Note that, similarly to the control device 61 of the above-described embodiment, the control device 73 of the present embodiment measures in advance the flatness (including the degree of inclination) of the upper surface 32a of the stage 32 and calculates based on the measurement result. Have a stage correction amount.

Next, the application of the sealing material R to the lower substrate W1 performed by the seal drawing apparatus 71 as described above will be described.
[First step]
First, the lower substrate W1 is disposed at a predetermined position on the stage 32. At this time, the control device 73 arranges the syringe 41 at a position where a space larger than the thickness of the lower substrate W1 is provided between the tip of the coating nozzle 42 and the upper surface 32a of the stage 32.

[Second step]
Next, the control device 73 drives the suction device 45 to fix (temporarily fix) the lower substrate W1 on the stage 32 by a vacuum suction force. At this time, the control device 73 controls the suction device 45 so as to suck the lower substrate W1 in order from the center of the lower substrate W1 toward the periphery. At this time, the control device 73 controls the suction device 45 so that the vacuum suction force in each suction region A becomes equal, and the magnitude of the vacuum suction force minimizes the relative movement of the lower substrate W1 relative to the stage 32. The adsorbing device 45 is controlled so as to have a size that is limited.

[Third step]
Next, as shown in FIG. 9, the control device 73 drives the y-axis actuator 34 (see FIG. 7) to move the gantry 33 to one end of the stage 32 in the y direction (the left end in FIG. 9). Move. Further, the control device 22 drives the x-axis actuator 35 to move the x-axis base 36 (see FIG. 7), and places the syringe 41 at a position where the distance sensor 43 is arranged at the center in the longitudinal direction of the connecting portion 33b. At the same time, the z-axis actuator 37 is driven to move the z-axis base 38, and the height of the syringe 41 (distance sensor 43) is set to a predetermined height (for example, the height at which the application nozzle 42 becomes the nozzle reference height). To do.

  Next, the control device 73 drives the distance sensor 43 and the distance sensors 72 a to 72 d and drives the y-axis actuator 34 to move the gantry 33 from one end to the other end of the stage 32 in the y direction. Thereby, each distance sensor 43 and 72a-72d is moved so that the lower board | substrate W1 may be operated along ay direction, as shown by the dashed-two dotted line in FIG. Then, while the gantry 33 moves from one end to the other end of the stage 32 in the y direction, the distance sensors 43 and 72a to 72d are moved each time the gantry 33 moves by a predetermined distance, that is, the distance sensors 43 and 72a to 72d. Each time 72d reaches predetermined measurement points P1 to P25, the distance to the lower surface W1b of the lower substrate W1 is measured, and the first measurement signal S1 or the third measurement signal S3 is output. In the present embodiment, five measurement points P1 to P25 are set for each of the distance sensors 43 and 72a to 72d, and are set at equal intervals in the y direction.

[Fourth step]
Next, based on the first and third measurement signals S1, S3 input from the distance sensors 43, 72a to 72d, the control device 73 starts from the tip of the coating nozzle 42 at the nozzle reference height to the lower substrate W1. The distance to the lower surface W1b is calculated over the entire lower substrate W1.

[Fifth step]
Next, the control device 73 adjusts the vacuum suction force for each suction region A according to the distance from the tip of the application nozzle 42 at the calculated nozzle reference height to the lower surface W1b of the lower substrate W1. More specifically, the shorter the distance from the tip of the coating nozzle 42 to the lower surface W1b of the lower substrate W1, the higher the height of the lower surface W1b of the lower substrate W1 from the upper surface 32a of the stage 32 in the lower substrate W1. Therefore, the controller 73 calculates the lower substrate W1 such that the higher the height of the lower surface W1b of the lower substrate W1 from the upper surface 32a of the stage 32, that is, the shorter the calculated distance, the greater the suction force. The suction device 45 is controlled so as to increase the vacuum suction force of the suction region A corresponding to the short distance. At this time, the control device 73 applies a vacuum suction force having a magnitude corresponding to the calculated distance over the entire lower substrate W1 while maintaining the vacuum suction force with the lower substrate W1 fixed on the stage 32 in the second step. Then, the suction device 45 is controlled so as to be generated simultaneously. As a result, the raised portion of the lower substrate W1 on the stage 32 is sucked toward the stage 32, and the lower substrate W1 is corrected so as to reduce distortion.

[Sixth step]
Next, the control device 73 drives the y-axis actuator 34 (see FIG. 7) to move the gantry 33 to one end of the stage 32 in the y direction. Then, the control device 73 drives the distance sensor 43 and the distance sensors 72a to 72d again and drives the y-axis actuator 34 to move the gantry 33 from one end to the other end of the stage 32 in the y direction (FIG. 7). The distance sensor 43, 72a to 72d measures the distance to the upper surface W1a of the lower substrate W1 and the distance to the lower surface W1b of the lower substrate W1 at the measurement points P1 to P25.

[Seventh step]
Next, based on the first and third measurement signals S1 and S3 newly input from the distance sensors 43 and 72a to 72d, the control device 73 starts from the tip of the coating nozzle 42 at the reference height to the lower substrate. The distance to the upper surface W1a of W1 is obtained by calculation over the entire upper surface W1a of the lower substrate W1. Then, the control device 73 determines whether or not the distance from the tip of the coating nozzle 42 at the reference height to the upper surface W1a of the lower substrate W1 obtained by the calculation is within a predetermined distance tolerance range. In the present embodiment, the distance allowable range is a reference that is a distance between the tip of the coating nozzle 42 at the nozzle reference height and the upper surface W1a of the lower substrate W1 having no thickness error and distortion. This is a range in which an allowable error is added to the distance, for example, a predetermined region centered on the reference distance.

  When the distance from the tip of the application nozzle 42 at the calculated nozzle reference height to the upper surface W1a of the lower substrate W1 is included in the allowable distance range, the control device 73 determines that the application nozzle is at the nozzle reference height. An average value of the distance from the tip of 42 to the upper surface W1a of the lower substrate W1 is calculated, and a deviation amount of the average value with respect to the reference distance is calculated as a correction value. Thereafter, the control device 73 controls the z-axis actuator 37 to adjust the height of the application nozzle 42 to a height obtained by adding a correction value to the nozzle reference height.

  On the other hand, when the distance from the tip of the application nozzle 42 at the calculated nozzle reference height to the upper surface W1a of the lower substrate W1 is not included in the distance allowable range, the controller 73 newly inputs the first Based on the third measurement signals S1 and S3, the distance from the tip of the application nozzle 42 at the calculated nozzle reference height to the lower surface W1b of the lower substrate W1 is calculated. Then, the control device 73 returns to the fifth step, and based on the distance from the tip of the coating nozzle 42 at the nozzle reference height calculated again to the lower surface W1b of the lower substrate W1, the longer the distance is, the vacuum suction force becomes. The suction device 45 is controlled so as to increase the vacuum suction force for each suction region A. At this time, the control device 73 controls the suction device 45 so that a larger vacuum suction force than that in the previous control of the suction device 45 is generated. Thereafter, the sixth step and the seventh step are performed again. If the distance from the tip of the application nozzle 42 at the nozzle reference height to the upper surface W1a of the lower substrate W1 is not included in the distance allowable range even if the fifth to seventh steps are repeated a preset number of times. , Interrupt production.

[Eighth step]
Next, the control device 73 drives the y-axis actuator 34 and the x-axis actuator 35 to move the syringe 41 having the application nozzle 42 at the tip with respect to the stage 32, and seal material R discharged from the application nozzle 42. Is continuously applied to the upper surface W1a of the lower substrate W1. Thereby, a desired pattern is drawn with the sealing material R on the upper surface W1a of the lower substrate W1. Since the distance from the tip of the application nozzle 42 at the reference height to the upper surface W1a of the lower substrate W1 is within a distance allowable range by adjusting the vacuum suction force, the height of the application nozzle 42 is set. Is set to a height obtained by adding a correction value to the nozzle reference height, the distance between the upper surface W1a of the lower substrate W1 and the tip of the coating nozzle 42 is kept substantially constant.

  In the same process, the control device 73 moves the application nozzle 42 up and down by the amount of the stage correction amount according to the position of the syringe 41 in the x direction and the y direction. Further, in the same process, the control device 73 drives the distance sensor 43 to measure the distance between the upper surface W1a of the lower substrate W1 and the tip of the coating nozzle 42, and the first input from the distance sensor 43. The distance between the upper surface W1a of the lower substrate W1 and the tip of the coating nozzle 42 is calculated based on one measurement signal S1. And the control apparatus 73 is the case where the distance between the calculated upper surface W1a of the lower board | substrate W1 and the front-end | tip of the coating nozzle 42 exceeds the preset threshold value similarly to the control apparatus 61 of the said 1st Embodiment. First, the discharge of the sealing material R from the coating nozzle 42 and the driving of the actuators 34, 35, 37 are stopped.

[Ninth step]
When the application of the sealing material R to the upper surface W1a of the lower substrate W1 is completed, the control device 73 drives the z-axis actuator 37 to place the lower substrate W1 between the tip of the application nozzle 42 and the upper surface 32a of the stage 32. The syringe 41 is arranged at a position where an interval equal to or greater than the thickness is provided. Next, the control device 73 controls the suction device 45 to release the fixation of the lower substrate W1 to the stage 32. Thereafter, the lower substrate W1 is moved from the seal drawing device 23 to the liquid crystal dropping device 24 by the transfer device 29a (see FIG. 1).

As described above, according to the second embodiment, the following functions and effects are provided in addition to the functions and effects (2) to (4) of the first embodiment.
(1) The control device 73 starts from the tip of the application nozzle 42 at the nozzle reference height based on the first and third measurement signals S1 and S3 output from the total of five distance sensors 43 and 72a to 72d, respectively. The distance to the lower surface W1b of the lower substrate W1 is calculated, the suction device 45 is controlled, and the vacuum suction force to the lower substrate W1 is increased as the calculated distance is shorter. Generally, if the lower substrate W1 is distorted, the greater the distortion, the greater the distance between the upper surface 32a of the stage 32 and the lower surface W1b of the lower substrate W1. The distance from the tip of the coating nozzle 42 at the height to the lower surface W1b of the lower substrate W1 is shortened. Accordingly, when the calculated distance is shorter, the portion of the lower substrate W1 that is distorted is increased toward the stage 32 with a larger vacuum suction force by increasing the vacuum suction force as the roller is shorter. Is reduced. Then, the sealing material R is applied to the lower substrate W1 when the distance from the tip of the application nozzle 42 at the nozzle reference height to the upper surface W1a of the lower W1 substrate is included in the distance allowable range, that is, the distortion of the lower substrate W1. Therefore, the controller 73 seals the upper surface W1a of the lower substrate W1 with the height of the application nozzle 42 as a height obtained by adding a correction value to the nozzle reference height. By applying the material R, it is possible to apply the sealing material R while keeping the distance between the tip of the application nozzle 42 and the upper surface W1a of the lower substrate W1 substantially constant. In addition, as in the past, during the application of the sealing material, the distance between the tip of the coating nozzle and the top surface of the substrate is measured to keep the distance between the tip of the coating nozzle and the top surface of the substrate constant. The amount of elevation of the application nozzle need not be calculated, and during application of the sealing material R, the application nozzle 42 is not raised or lowered according to the distance between the tip of the application nozzle 42 and the upper surface W1a of the lower substrate W1. Therefore, the speed at which the sealing material R is applied to the upper surface W1a of the lower substrate W1, that is, the moving speed of the application nozzle 42 with respect to the lower substrate W1, can be made higher than before. For these reasons, the seal material R is applied while the distance between the tip of the application nozzle 42 and the upper surface W1a of the lower substrate W1 is kept substantially constant, and the time required for applying the seal material R can be shortened. it can. In the seal drawing apparatus 71, the distance between the upper surface W1a of the lower substrate W1 and the tip of the coating nozzle 42 is kept substantially constant, so that the sealing material R applied to the upper surface W1a of the lower substrate W1. The shape of is stabilized.

In addition, you may change embodiment of this invention as follows.
In each of the above embodiments, in the fifth step, the control devices 61 and 73 maintain the vacuum suction force that fixes (temporarily fixes) the lower substrate W1 on the stage 32 in the second step, while maintaining the upper surface 32a of the stage 32. A vacuum suction force having a magnitude corresponding to the height of the lower surface W1b of the lower substrate W1 from the top (the distance from the tip of the coating nozzle 42 at the nozzle reference height to the lower surface W1b of the lower substrate W1) is spread over the entire lower substrate W1. Then, the suction device 45 is controlled so as to be generated simultaneously. However, the adjustment of the vacuum suction force in the fifth step is not limited to this.

  For example, in the fifth step, the control devices 61 and 73 reduce the vacuum suction force around the portion of the lower substrate W1 due to distortion in the lower substrate W1, and then reduce the lower substrate W1 from the upper surface 32a of the stage 32. Even if the suction device 45 is controlled so as to generate a vacuum suction force according to the height of the lower surface W1b (the distance from the tip of the coating nozzle 42 at the nozzle reference height to the lower surface W1b of the lower substrate W1). Good. Note that which part of the lower substrate W1 has a raised shape depends on the height of the lower surface W1b of the lower substrate W1 from the upper surface 32a of the stage 32 (from the tip of the coating nozzle 42 at the nozzle reference height to the lower substrate). Based on the distance to the lower surface W1b of W1, the control devices 61 and 73 determine. In this way, the distortion of the lower substrate W1 can be corrected more smoothly.

  Further, for example, in the fifth step, the control devices 61 and 73 release the vacuum suction force that fixes (temporarily fixes) the lower substrate W1 on the stage 32 in the second step and then moves from the center of the lower substrate W1 to the periphery. The suction device 45 is arranged so that the lower substrate W1 is fixed on the stage 32 in order, and the vacuum suction force increases as the height of the lower surface W1b of the lower substrate W1 from the upper surface 32a of the stage 32 increases. It may be one that controls. In this way, the distortion of the lower substrate W1 can be corrected more smoothly.

  Further, for example, in the fifth step, the control devices 61 and 73 release the vacuum suction force temporarily fixing the lower substrate W1 on the stage 32 in the second step, and then the lower surface of the lower substrate W1 from the upper surface 32a of the stage 32. The suction device 45 may be controlled so that a vacuum suction force having a magnitude corresponding to the height of W1b is generated simultaneously over the entire lower substrate W1.

  In each of the above embodiments, in the second step, the control devices 61 and 73 control the suction device 45 so as to suck the lower substrate W1 in order from the center of the lower substrate W1 toward the periphery. However, adsorption of the lower substrate W1 to the upper surface 32a of the stage 32 in the second step may be performed from any part of the lower substrate W1. Further, the control devices 61 and 73 may control the suction device 45 so that the entire surface of the lower substrate W1 is simultaneously sucked.

  In the second embodiment, 25 measurement points P1 to P25 are set. However, as long as the number of measurement points is set at a plurality of locations, it may be set to be more than 25 locations or may be set to be less. Further, the distance sensors 43 and 72a to 72d may continuously measure the distance to the upper surface W1a of the lower substrate W1 as the gantry 33 moves in the y direction.

  In each of the above embodiments, 32 suction areas A are set on the upper surface 32 a of the stage 32. However, the number of the suction areas A set on the upper surface 32a of the stage 32 may be plural, and may be more than 32 or less than 32. The plurality of suction areas A may not be set to be uniform on the upper surface 32 a of the stage 32. Further, the shape of the suction region A is not limited to a quadrangular shape, and may be a polygonal shape other than the quadrangular shape or a circular shape. Furthermore, the number of suction holes 32b provided in each suction region A and the formation positions of the suction holes 32b may be changed as appropriate.

  In each of the above embodiments, the suction device 45 fixes the lower substrate W1 to the upper surface 32a of the stage 32 by a vacuum suction force, but fixes the lower substrate W1 to the upper surface 32a of the stage 32 by an electrostatic suction force. May be. In this case, the stage 32 is provided with an electrostatic chuck corresponding to each suction region A.

  In the first embodiment, fifteen distance sensors 51 a to 51 o are arranged on the stage 32. However, the number of distance sensors 51a to 51o arranged on the stage 32 is not limited to 15 and may be any number. It should be noted that the plurality of distance sensors arranged on the stage 32 is desirably arranged uniformly or regularly on the portion of the upper surface 32a of the stage 32 where the lower substrate W1 is arranged. As the number of distance sensors arranged on the stage 32 increases, the calculation accuracy of various values based on the second measurement signal S2 by the control device 61 is improved.

  In the second embodiment, four distance sensors 72 a to 72 d are provided at the connecting portion of the gantry 33. However, the number of distance sensors 72a to 72d provided in the connecting portion 33b is not limited to four, and may be a plurality. And the calculation accuracy of various values based on the 3rd measurement signal S3 by the control apparatus 73 improves, so that there are many distance sensors provided in the connection part 33b.

  In the first embodiment, the control device 61 calculates the height of the lower surface W1b of the lower substrate W1 from the upper surface 32a of the stage 32 based on the second measurement signal S2, and based on the calculated height, The suction device 45 is controlled so that the vacuum suction force for fixing the lower substrate W1 on the stage 32 increases as the height increases. By the way, in general, when the lower substrate W1 is distorted, the lower substrate W1 has a partially raised shape. Therefore, in a portion where the distortion occurs, the greater the degree of distortion, In the lower substrate W1, the height of the upper surface W1a from the upper surface 32a of the stage 32 is increased. Therefore, in the fourth step, the control device 61 calculates the height of the upper surface W1a of the lower substrate W1 from the upper surface 32a of the stage 32 over the entire lower substrate W1, based on the second measurement signal S2. In the fifth step, the suction device 45 may be controlled so that the vacuum suction force increases as the calculated height increases. Even if it does in this way, the effect similar to (1) of the said 1st Embodiment can be acquired.

  In the second embodiment, the control device 73 calculates the distance from the tip of the coating nozzle 42 at the reference height to the lower surface W1b of the lower substrate W1 based on the first and third measurement signals S1 and S3. Then, based on the calculated distance, the suction device 45 is controlled such that the vacuum suction force for fixing the lower substrate W1 on the stage 32 increases as the distance becomes shorter. In general, if the lower substrate W1 is distorted, the distance from the tip of the coating nozzle 42 at the reference height to the upper surface W1a of the lower substrate W1 increases as the degree of distortion increases in the distorted portion. Becomes shorter. Therefore, in the fourth step, the control device 73 determines the distance from the tip of the coating nozzle 42 at the reference height to the upper surface W1a of the lower substrate W1 based on the first and third measurement signals S1 and S3. The suction device 45 may be calculated so that the vacuum suction force increases as the calculated distance becomes shorter in the fifth step. Even if it does in this way, the effect similar to (1) of the said 2nd Embodiment can be acquired.

  In each of the above embodiments, in the eighth step, the control devices 61 and 73 raise and lower the application nozzle 42 by the amount of the stage correction amount according to the position of the syringe 41 in the x direction and the y direction. However, the control devices 61 and 73 may apply the sealing material R without raising and lowering the application nozzle 42 by the amount of the stage correction amount while keeping the application nozzle 42 at the height obtained by adding the correction value to the nozzle reference height. Good. In this way, control in the z direction is further omitted, and the moving speed of the coating nozzle 42 in the x direction and y direction with respect to the lower substrate W1 can be further increased.

The configuration of the distance sensors 51a to 51o is not limited to the configuration of the first embodiment. For example, an image sensor or the like may be used as the light receiving element 55.
In the seventh step of the first embodiment, even if the fifth to seventh steps are repeated a preset number of times, the height of the upper surface W1a of the lower substrate W1 from the upper surface 32a of the stage 32 is within the upper surface allowable range. When not included, the control device 61 measures the distance between the upper surface W1a of the lower substrate W1 and the tip of the coating nozzle 42 with the distance sensor 43 as in the prior art, and based on the measurement result, The sealing material R may be applied to the upper surface W1a while raising and lowering the application nozzle 42 so that the distance between the upper surface W1a of the substrate W1 and the tip of the application nozzle 42 is constant. Similarly, in the second embodiment as well, even if the fifth to seventh steps are repeated a preset number of times in the seventh step, the lower substrate W1 is formed from the tip of the application nozzle 42 at the nozzle reference height. When the distance to the upper surface W1a is not included in the allowable distance range, the control device 73 determines the distance between the upper surface W1a of the lower substrate W1 and the tip of the coating nozzle 42 by using the distance sensor 43 as in the related art. Based on the measurement result, the sealing material R is applied to the upper surface W1a while raising and lowering the application nozzle 42 so that the distance between the upper surface W1a of the lower substrate W1 and the tip of the application nozzle 42 is constant. May be.

  -The seal drawing apparatuses 23 and 71 of the above embodiments each include one syringe 41 having an application nozzle 42. However, a plurality of such syringes 41 may be provided in the connecting portion 33b together with the x-axis base 36 moved in the x-direction by the x-axis actuator 35 and the z-axis base 38 moved in the z-direction by the z-axis actuator 37. Good.

  The seal drawing apparatuses 23 and 71 of the above embodiments have a configuration in which the application nozzle 42 is moved relative to the fixed stage 32 by moving the gantry 33, the x-axis base 36, and the z-axis base 38. It has become. However, other configurations may be used as long as the stage 32 and the application nozzle 42 can be relatively moved in the x direction, the y direction, and the z direction. For example, the stage 32 may be configured to move in the x direction, the y direction, and the z direction with respect to the fixed application nozzle 42. Moreover, you may comprise so that both the stage 32 and the gantry 33 may move. Further, the stage 32 may be configured to be rotatable in the θ direction (direction rotating around the z axis).

  In each of the above embodiments, the present invention has been described in detail with the seal drawing devices 23 and 71 for applying the sealing material R for sealing liquid crystal between the lower substrate W1 and the upper substrate W2. The present invention may be embodied in any coating apparatus as long as it is a coating apparatus that applies a liquid material to a flat plate in a desired shape, not limited to the seal drawing apparatuses 23 and 71. For example, the present invention may be embodied in a coating apparatus that applies solder to the upper surface of the substrate.

The technical ideas that can be grasped from each of the above embodiments and each of the above modifications are described below.
(A) In the coating apparatus according to any one of claims 1 to 6, when the control unit controls the suction unit to increase the suction force, the substrate is placed on the stage. The suction force according to the height from the stage on either the upper surface or the lower surface of the substrate is generated simultaneously over the entire surface of the substrate while maintaining the suction force temporarily fixed. An applicator for controlling the adsorbing means. According to this configuration, since the suction unit is controlled so that the suction force simultaneously increases for a portion of the substrate that is distorted, the distortion of the substrate can be corrected in a shorter time.

  (B) The coating apparatus according to any one of claims 1 to 6, wherein the control unit controls the substrate on the stage before controlling the adsorption unit to increase the adsorption force. The suction means is controlled to temporarily fix the suction force, and when the suction means is controlled so as to increase the suction force, the suction force around the portion is raised for each portion raised by distortion in the substrate. An application apparatus that controls the suction unit so as to generate the suction force according to the height of either one of the upper surface and the lower surface of the substrate from the stage after being reduced. According to this configuration, the distortion of the substrate can be corrected more smoothly.

  (C) In the coating apparatus according to any one of claims 1 to 6, when the control unit controls the suction unit to increase the suction force, the substrate is placed on the stage. After releasing the temporarily fixed adsorption force, the substrate is fixed on the stage in order from the center to the periphery of the substrate, and either the upper surface or the lower surface of the substrate. The coating apparatus, wherein the suction unit is controlled so that the suction force increases as the height from the stage increases. According to this configuration, the distortion of the substrate can be corrected more smoothly.

The schematic block diagram of a bonded substrate manufacturing apparatus. The schematic block diagram of the sticker drawing apparatus of 1st Embodiment. The top view of a stage. The top view of the board | substrate and stage in the seal | sticker drawing apparatus of 1st Embodiment. The enlarged view near the distance sensor in the sticker drawing apparatus of the first embodiment. 1 is a block diagram showing an electrical configuration of a seal drawing apparatus according to a first embodiment. The schematic block diagram of the sticker drawing apparatus of 2nd Embodiment. The block diagram which shows the electric constitution of the sticker drawing apparatus of 2nd Embodiment. The top view of the board | substrate and stage in the seal | sticker drawing apparatus of 2nd Embodiment.

Explanation of symbols

  23, 71 ... Seal drawing device as application device, 32 ... Stage, 32a ... Upper surface of stage, 42 ... Application nozzle, 43 ... Distance sensor as movement measurement means, 45 ... Adsorption device as adsorption means, 51a to 51o ... Distance sensor as fixed measurement means, 61, 73 ... Control device as control means, 72a to 72d ... Distance sensor as movement measurement means, R ... Sealing material as liquid material, S1 ... First measurement as measurement signal Signal, S2: Second measurement signal as measurement signal, S3: Third measurement signal as measurement signal, W1: Lower substrate as substrate, W1a: Upper surface of substrate, W1b: Lower surface.

Claims (6)

A coating apparatus that relatively moves a substrate fixed on a stage and a coating nozzle and applies a liquid material discharged from the tip of the coating nozzle to the upper surface of the substrate in a desired shape,
Suction means for generating a suction force for fixing the substrate on the stage;
A plurality of fixed measuring means arranged on the stage and each outputting a measurement signal corresponding to a height from the stage on the upper surface of the substrate;
Control means for controlling the adsorption means,
The control means calculates the height of the upper surface of the substrate from the stage based on a plurality of the measurement signals, and controls the suction means so that the suction force increases as the calculated height increases. After that, the height of the upper surface of the substrate from the stage is calculated over the entire substrate based on the plurality of newly input measurement signals, and the calculated height is the height of the upper surface of the substrate. When included in the upper surface allowable range set based on the upper surface reference height, which is the reference height from the stage, the deviation amount of the calculated average value of the height with respect to the upper surface reference height is corrected. And then applying the liquid material to the substrate in accordance with a height obtained by adding the correction value to a nozzle reference height that is a reference height of the application nozzle. Coating equipment featuring . A coating apparatus that relatively moves a substrate fixed on a stage and a coating nozzle and applies a liquid material discharged from the tip of the coating nozzle to the upper surface of the substrate in a desired shape,
Suction means for generating a suction force for fixing the substrate on the stage;
A plurality of fixed measuring means arranged on the stage and each outputting a measurement signal corresponding to the height from the stage on the upper and lower surfaces of the substrate;
Control means for controlling the adsorption means,
The control means calculates the height of the lower surface of the substrate from the stage based on the plurality of measurement signals, and controls the suction means so that the suction force increases as the calculated height increases. After that, the height of the upper surface of the substrate from the stage is calculated over the entire substrate based on the plurality of newly input measurement signals, and the calculated height is the height of the upper surface of the substrate. When included in the upper surface allowable range set based on the upper surface reference height, which is the reference height from the stage, the deviation amount of the calculated average value of the height with respect to the upper surface reference height is corrected. And then applying the liquid material to the substrate in accordance with a height obtained by adding the correction value to a nozzle reference height that is a reference height of the application nozzle. Coating equipment featuring . A coating apparatus that relatively moves a substrate fixed on a stage and a coating nozzle and applies a liquid material discharged from the tip of the coating nozzle to the upper surface of the substrate in a desired shape,
Suction means for generating a suction force for fixing the substrate on the stage;
A moving means that spans the stage and is moved relative to the stage;
According to the distance to the upper surface of the substrate by scanning the substrate on the stage and being moved relative to the stage as the moving unit moves relative to the stage. A plurality of movement measuring means for outputting measurement signals,
Control means for controlling the adsorption means,
The control means, from the tip of the application nozzle at the nozzle reference height, which is the reference height of the application nozzle, to the upper surface of the substrate, based on the measurement signals respectively output by the plurality of movement measurement means And the suction means is controlled to increase the suction force as the calculated distance is shorter, and then the nozzle reference height is set based on the plurality of newly input measurement signals. A distance from the tip of the coating nozzle to the upper surface of the substrate is calculated over the entire substrate, and the calculated distance is a reference distance that is a reference distance between the coating nozzle and the upper surface of the substrate. If it is included in the distance allowable range set on the basis of the calculated distance, a deviation amount of the calculated average value with respect to the reference distance is calculated as a correction value, and then the application nozzle is moved to the nozzle. To match the height to the reference height plus the correction value, applying apparatus characterized by performing coating to the substrate of the liquid material. A coating apparatus that relatively moves a substrate fixed on a stage and a coating nozzle and applies a liquid material discharged from the tip of the coating nozzle to the upper surface of the substrate in a desired shape,
Suction means for generating a suction force for fixing the substrate on the stage;
A moving means that spans the stage and is moved relative to the stage;
It is disposed on the moving means, and is moved relative to the stage as the moving means moves relative to the stage, and scans the substrate on the stage to reach the upper surface and the lower surface of the substrate. A plurality of movement measuring means for outputting corresponding measurement signals,
Control means for controlling the adsorption means,
The control means, from the tip of the application nozzle at the nozzle reference height, which is the reference height of the application nozzle, to the lower surface of the substrate, based on the measurement signals respectively output by the plurality of movement measurement means And the suction means is controlled to increase the suction force as the calculated distance is shorter, and then the nozzle reference height is set based on the plurality of newly input measurement signals. A distance from the tip of the coating nozzle to the upper surface of the substrate is calculated over the entire substrate, and the calculated distance is a reference distance that is a reference distance between the coating nozzle and the upper surface of the substrate. If it is included in the distance allowable range set on the basis of the calculated distance, a deviation amount of the calculated average value with respect to the reference distance is calculated as a correction value, and then the application nozzle is moved to the nozzle. To match the height to the reference height plus the correction value, applying apparatus characterized by performing coating to the substrate of the liquid material. In the coating device according to any one of claims 1 to 4,
When applying the liquid material to the upper surface of the substrate, the control means raises and lowers the application nozzle by a stage correction amount set based on the flatness of the upper surface of the stage measured in advance. A characteristic coating apparatus. In the coating device according to any one of claims 1 to 5,
The said control means controls the said adsorption | suction means so that this board | substrate is adsorbed on the said stage in order toward the periphery from the center of the said board | substrate, The coating device characterized by the above-mentioned.

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