CN100404146C - Base plate processing device - Google Patents
Base plate processing device Download PDFInfo
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- CN100404146C CN100404146C CNB2005100874088A CN200510087408A CN100404146C CN 100404146 C CN100404146 C CN 100404146C CN B2005100874088 A CNB2005100874088 A CN B2005100874088A CN 200510087408 A CN200510087408 A CN 200510087408A CN 100404146 C CN100404146 C CN 100404146C
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
Abstract
To reduce the load on workers while preventing lowering of the precision of the detection of an object. A substrate processing apparatus is provided with a light projecting part 450a and a light receiving part 450b which constitute a detection sensor 450. The light receiving part 450b is shifted in the (+Z) direction from a position where laser beam emitted from the light projecting part 450a is received and arranged at a position where the reflection light reflected by the object is received. In the substrate processing apparatus, when the light receiving part 450b receives the laser beam, it is judged that the object is existed and a movement mechanism of a slit nozzle is controlled.
Description
Technical field
The present invention relates to by in nozzle ejection treatment fluid, substrate being scanned, thus on the surface of substrate the technology of the substrate board treatment of coating treatment fluid.More specifically, relate in the scanning that utilizes nozzle, interfere, and detect the technology of object accurately for preventing nozzle and foreign matter (object).
Background technology
Liquid crystal with glass square substrate, semiconductor wafer, film liquid crystal with flexible base, board, base board for optical mask, colour filtering manufacturing process with substrate (being designated hereinafter simply as " substrate ") etc. in, adopt applying device (substrate board treatment) at the surface applied treatment fluid of substrate.As applying device, the known finedraw coating machine that has the slit jet nozzle that adopts ejection portion to carry out the finedraw coating, and the finedraw spinner etc. that after having implemented described finedraw coating, makes the substrate rotation with finedraw shape.
In such applying device, because under the approaching state of the front end that makes slit jet nozzle and substrate, slit jet nozzle and substrate are relatively moved and apply treatment fluid, so because of surface attachment foreign matter at substrate, or make substrate become the state of rising owing between substrate and objective table, accompanying foreign matter, will produce with slit jet nozzle and interfere, following problem occur:
(1) slit jet nozzle damage;
(2) crackle appears in substrate, or wounded substrate;
(3) apply while drawing foreign matter, thereby become the bad reason of coating etc.
Therefore, in the past, in the applying device that adopts slit jet nozzle, such technology was proposed: by carrying out inspection of foreign substance, judge whether there is the object (interferences) that contacts with slit jet nozzle, avoid the conflict of slit jet nozzle and object.Such technology is for example on the books in patent documentation 1.
Applying device described in the patent documentation 1, by transmission-type laser sensor (detecting the sensor of the next laser of transmission), carry out detecting of object, detect at this laser sensor under the situation of object, handle by forcing to finish coating, prevent that slit jet nozzle from contacting with object.
Figure 12～Figure 15 illustrates that the transmission-type laser sensor 100 that uses in the applying device of record in the patent documentation 1 detects the concept map of the principle of object.Transmission-type laser sensor 100, be used on the optical axis relative with light-projecting portion 101 to and the light accepting part 102 of configuration is accepted the laser that penetrates from light-projecting portion 101, detect the sensor that has or not object according to its light income.
In laser sensor 100, as shown in figure 12, under the situation that has any object (object) on the light path, on light path, laser is blocked by this object.Therefore, as shown in figure 13, the light income of the laser on the light accepting part 102 reduces.Thereby laser sensor 100 under the situation of light income less than the threshold value Q of regulation of light accepting part 102, can be judged to have object on light path.
Patent documentation 1:JP spy opens the 2002-001195 communique.
; different with large-scale He-Ne gas laser etc.; in the small-sized semiconductor laser; as Figure 12 and shown in Figure 14; laser has along be offset the character that its diameter also enlarges to optical axis direction from focusing position (at utmost dwindling the position of light beam: be the irradiation starting position of light-projecting portion 101 example shown here).Therefore, as shown in figure 14, be positioned at object under the situation of the position (position of enlarged-diameter) away from light-projecting portion 101, laser is blocked hardly and is accepted by light accepting part 102.In such cases, such situation appears: because the light income of the laser of light accepting part 102, as shown in figure 15, greater than threshold value Q, although therefore exist originally should be able to detected size object, can not detect this object.Under the situation that adopts general transmission-type laser sensor, can keep the scope that required precision is handled in coating, be that the interval of light-projecting portion 101 and light accepting part 102 is up to about 500mm.
Promptly, in the applying device of patent documentation 1 record, the for example maximization by substrate, in laser sensor 100, dispose under the situation of light-projecting portion 101 and light accepting part 102 (detecting at lengthening under the situation of light path of laser of usefulness) at needs quite dividually, have the problem that precision reduces that detects the zone of light accepting part 102 sides.
In addition, in laser sensor 100, utilize attenuation to detect.Thereby must correctly be relative to the configuration light-projecting portion 101 and light accepting part 102 are so exist the adjustment operation of laser sensor 100 to need the problem of time.
In addition, in order to improve the sensitivity of laser sensor 100, detected foreign matter even need also judge to very little decay.But, in device in the past, the vibration when mobile, light-projecting portion 101 and light accepting part 102 can be offset, and thereupon, the light income of laser is decayed sometimes.That is, in device in the past, if existence improves sensitivity then the problem that flase drop goes out can occur.
Summary of the invention
The present invention proposes in view of above problem, and its purpose is to provide a kind of substrate board treatment, prevents the reduction that detects precision of object, alleviates operator's burden simultaneously.
For addressing the above problem, the described a kind of substrate board treatment of first invention of the present invention to coating of substrates predetermined process liquid, is characterized in that having: the holding device that keeps substrate; Blowoff, it sprays predetermined process liquid to the described substrate that described holding device kept; Mobile device, its described substrate and described blowoff that described holding device is kept relatively moves, and makes described blowoff carry out scanning to described substrate; At least one detection device, it detects in the scanning of described blowoff the object that might interfere with described blowoff; Control device, it controls described mobile device based on the result that detects of described detection device, and described detection device has: the light-projecting portion of irradiating laser; Light accepting part, it is configured in from the position of acceptance by the position deviation of the direct sunshine the laser of described light-projecting portion irradiation, acceptance by in the laser of described light-projecting portion irradiation, by described object laser light reflected as detecting light, described detection device, accepted to pass to described control device as the result that detects who detects described object under the described situation that detects light at described light accepting part.
In addition, second invention is as the described substrate board treatment of first invention, it is characterized in that, described light accepting part be configured in to the position of the direction skew of the scanning direction approximate vertical of described blowoff on.
In addition, the 3rd invention is as the described substrate board treatment of first invention, it is characterized in that, described light-projecting portion is to the direction irradiating laser of the surperficial almost parallel of the described substrate that is kept with described holding device.
In addition, the 4th invention is as the described substrate board treatment of first invention, it is characterized in that, also has auxiliary detection device, should auxiliary detection device detect in the scanning of described blowoff the object that might interfere with described blowoff, described auxiliary detection device has auxiliary light accepting part, should auxiliary light accepting part be configured in relative with described light-projecting portion or auxiliary light-projecting portion to the position on, acceptance is from the direct sunshine of the described laser of described light-projecting portion or described auxiliary light-projecting portion irradiation, described auxiliary detection device, the light income of the described direct sunshine of described auxiliary light accepting part for the situation below the threshold value of regulation under, to pass to described control device as the result that detects who detects described object, described control device, the result that detects who detects result and described auxiliary detection device according to described detection device controls described mobile device.
In addition, the 5th invention is as the described substrate board treatment of first invention, it is characterized in that, described at least one detection device is more than two, the described light-projecting portion of a detection device and the described light-projecting portion of another detection device, separate configuration is in the both sides of the described substrate that described holding device kept respectively.
In the described invention of first～the 5th invention, owing to have light accepting part, this light accepting part is configured in from the position of acceptance by the position deviation of the direct sunshine the laser of light-projecting portion irradiation, acceptance by in the laser of light-projecting portion irradiation, by the object laser light reflected as detecting light, accepted to detect under the situation of light at light accepting part, to pass to control device as the result that detects who detects object, thereby the position of light accepting part relatively inaccuracy also can, therefore can alleviate the burden of adjusting operation.In addition, because light accepting part is as long as accept even the very faint light that detects just can detect object,, can suppresses flase drop and go out, the raising precision so compare with the situation that attenuation according to light income detects.
In the described invention of second invention and since light accepting part be configured in to the position of the direction skew of the scanning direction approximate vertical of blowoff on, therefore can suppress because the influence of the vibration that the scanning of blowoff produces.Thereby, can suppress flase drop and go out, so can access the correct result that detects.
In the described invention of the 4th invention, owing to have auxiliary light accepting part, should auxiliary light accepting part be configured in relative with light-projecting portion or auxiliary light-projecting portion to the position on, acceptance is from the direct sunshine of the laser of light-projecting portion or the irradiation of auxiliary light-projecting portion, the light income of the direct sunshine of auxiliary light accepting part for the situation below the threshold value of regulation under, setting detects object, therefore can enlarge the scope of the object that can detect.
In the described invention of the 5th invention, because the light-projecting portion of a detection device and the light-projecting portion of another detection device, separate configuration is in the both sides of the substrate that holding device kept respectively, thus can not be subjected to substrate width influence and detect object.
Description of drawings
Fig. 1 is the front view of the substrate board treatment of first embodiment of the present invention.
Fig. 2 is the enlarged drawing of the periphery of the detecting element in the substrate board treatment.
Fig. 3 is the sweep limits of expression slit jet nozzle and the vertical view that detects the configuration relation of sensor.
Fig. 4 is expression slit jet nozzle and the right view that detects the configuration relation of sensor.
Fig. 5 is expression slit jet nozzle and the left view that detects the configuration relation of sensor.
Fig. 6 is illustrated in to utilize when detecting sensor and detecting the figure of the track of the laser when not having object.
Fig. 7 is illustrated in to utilize when detecting sensor and detecting the figure of the track of the laser when having object.
Fig. 8 is the figure of the situation of explanation when detecting sensor and detecting object near the position of light accepting part.
Fig. 9 is the flow chart of the action of expression substrate board treatment.
Figure 10 is the flow chart of the action of expression substrate board treatment.
Figure 11 is the enlarged drawing of the periphery that detects sensor of the substrate board treatment of second embodiment.
Figure 12 is the concept map that the transmission-type laser sensor that uses in the applying device that illustrates in the past detects the principle of interferences.
Figure 13 is the concept map that the transmission-type laser sensor that uses in the applying device that illustrates in the past detects the principle of interferences.
Figure 14 is the concept map that the transmission-type laser sensor that uses in the applying device that illustrates in the past detects the principle of interferences.
Figure 15 is the concept map that the transmission-type laser sensor that uses in the applying device that illustrates in the past detects the principle of interferences.
Figure 16 is detecting sensor and assisting the figure that detects sensor in the expression variation.
The specific embodiment
Below, the better embodiment that present invention will be described in detail with reference to the accompanying.
1, first embodiment
1.1 the explanation that constitutes
Fig. 1 is the front view of the substrate board treatment 1 of first embodiment of the present invention, and Fig. 2 is the enlarged drawing of the periphery of the detecting element 45 in the substrate board treatment 1.In addition, in Fig. 1 and Fig. 2, for ease of illustrating and explanation, be defined as Z-direction and represent vertical direction, XY represents horizontal plane in the plane, and this is to hold position relation and definition for convenience, does not limit all directions of following explanation.Among the figure afterwards too.
The upper surface of objective table 3 is a horizontal plane, is the maintenance face 30 of substrate 90.On maintenance face 30, distribute and form a plurality of vacuum suction mouths (not shown).During the treatment substrate 90, by this vacuum suction mouth absorption substrate 90, objective table 3 remains on substrate 90 horizontal level of regulation in substrate board treatment 1.
Above objective table 3, be provided with from the two side portions approximate horizontal of this objective table 3 the bridge formation structure 4 of setting up.Bridge formation structure 4 is mainly by constituting as the nozzle support 40 of skeleton, elevating mechanism 43,44, the travel mechanism 5 of supporting its two ends with the graphite fibre resin.
Be connected with ejection mechanism (not shown) on the slit jet nozzle 41 that extends towards horizontal Y direction, this ejection mechanism comprises pipe arrangement and the resist pump to slit jet nozzle 41 supply of chemical (resist liquid).Slit jet nozzle 41 is carried resist liquid by resist with pump, by scanning substrate 90 surfaces, to zone (hereinafter referred to as " resist the area of application ") the ejection resist liquid of the regulation on substrate 90 surfaces.
Thus, control part 7 based on the result that detects of gap sensor 42, can detect the surface of substrate 90 and the distance of slit jet nozzle 41.In addition, in the substrate board treatment 1 of present embodiment, have two gap sensors 42, but the quantity of gap sensor 42 is not limited thereto, also can has more a plurality of gap sensor 42.
On the both ends of bridge formation structure 4, be set with respectively along the travel mechanism 5 of the edge configuration of the both sides of objective table 3.Travel mechanism 5 does not mainly have iron core line motor (being designated hereinafter simply as " linear electric machine ") 50 by a pair of AC and a pair of linear encoder 51 constitutes.
The motor that linear electric machine 50 is such: have fixture and moving member (not shown) respectively,, produce the driving force that bridge formation structure 4 (slit jet nozzle 41) is moved to X-direction by the interaction between the electromagnetism of fixture and moving member.In addition, utilize the amount of movement and the moving direction of linear electric machine 50 controls, can be according to controlling from the control signal of control part 7.
In the travel mechanism on the both sides that are fixedly installed on bridge formation structure 45, detecting element 45 is installed also.In the substrate board treatment 1 of present embodiment, the detecting element 45 that detects object has two and detects 450,451 and 1 auxiliary sensors 452 that detect of sensor.
Fig. 3 is the vertical view of the configuration relation of expression sweep limits E0 of slit jet nozzle 41 and detecting element 45, and Fig. 4 is the right view of the configuration relation of expression slit jet nozzle 41 and detecting element 45, and Fig. 5 is the left view of the configuration relation of expression slit jet nozzle 41 and detecting element 45.
In addition, so-called sweep limits E0 is the sweep limits of the slit jet nozzle 41 of substrate top.If be described more specifically, be to move to X-direction by travel mechanism 5, in the track zone (becoming planar zone) that the lower end (end of Z direction) of slit jet nozzle 41 is described, substrate 90 relative down with the immediate state in the lower end of slit jet nozzle 41 (gap during coating resist liquid) to the zone.That is, so-called sweep limits E0 is in the scanning that utilizes slit jet nozzle 41 to carry out, and has the zone of the possibility that slit jet nozzle 41 contacts with object.In the substrate board treatment 1, by travel mechanism 5, can make slit jet nozzle 41 move to all places, but when elevating mechanism 43,44 makes slit jet nozzle 41 maintain very high position and under the situation about moving, or slit jet nozzle 41 with substrate 90 not relative to the position under the situation about moving, the danger that slit jet nozzle 41 does not almost interfere with object.
In addition, so-called object is a detected object in sweep limits E0, is the object that slit jet nozzle 41 might interfere in sweep limits E0 is scanned.In fact, outside the such foreign matter of particle-removing, substrate 90 itself also becomes object sometimes.Because if having foreign matter between objective table 3 and substrate 90, substrate 90 will raise, and interferes with slit jet nozzle 41.
Detecting element 45, being configured in the scanning direction with respect to slit jet nozzle 41 (is slit jet nozzle 41 moving direction when mobile in sweep limits E0, be on the anterior position of (X) direction) in the present embodiment, along with slit jet nozzle 41 moving on X-direction, when moving, equidirectional carrying out detecting of object.In addition, the relative distance of detecting element 45 and slit jet nozzle 41 is set according to slit jet nozzle 41 moves by travel mechanism 5 the speed and the arithmetic speed of control part 7.That is, according to the detecting under the situation that the result controls travel mechanism 5 of detecting element 45, set the contact distance that fully to avoid object and slit jet nozzle 41 at control part 7.
With the direction setting that detects of detecting element 45 is Y direction, detects sensor 450,451 and auxiliaryly detects sensor 452 and be arranged on the X-direction.In addition, detect sensor 450,451 and auxiliaryly detect the position of sensor 452 on Z-direction, can adjust respectively by the operator.
Detect sensor 450,451 and auxiliaryly detect sensor 452, have light-projecting portion (light-projecting portion 450a, 451a, 452a) and light accepting part ( light accepting part 450b, 451b, 452b) respectively.Each light-projecting portion 450a, 451a in the present embodiment, 452a adopt the small-sized semiconductor laser of the laser of irradiation spot type, but also are not limited to this.For example, also can adopt the laser instrument of the laser of irradiation slot type.
Detect sensor the 450, the 451st, whether received the sensor that detects object from the laser of light-projecting portion 450a, 451a irradiation by light accepting part 450b, 451b.
As shown in Figure 3, light-projecting portion 450a be configured in substrate 90 (Y) side, light accepting part 450b is configured in the (+Y) side of substrate 90.On the other hand, light-projecting portion 451a be configured in substrate 90 (+Y) side, light accepting part 451b is configured in the (Y) side of substrate 90.That is, in the substrate board treatment 1 of present embodiment, detect the light-projecting portion 450a of sensor 450 and detect the light-projecting portion 451a of sensor 451, the both sides of the substrate 90 that is placed in respectively and disposing.Thus, detect sensor 450 towards (+Y) direction irradiating laser detects sensor 451 towards (Y) direction irradiating laser.
Detect each light accepting part 450b, 451b of sensor 450,451, as Fig. 4 and shown in Figure 5, than the height and position of each light-projecting portion 450a, 451a on Z-direction, to (+Z) direction is offset and disposes.If illustrate in greater detail, then be than position, to (+Z) direction skew and dispose each light accepting part 450b, 451b from the direct sunshine incident of the laser of each light-projecting portion 450a, 451a irradiation.Light-projecting portion 450a, 451a respectively (also can be a little to (Z) direction tilts) irradiating lasers to the direction along Y-axis.
Fig. 6 is illustrated in to utilize when detecting sensor 450 and detecting, the figure of the track of the laser when not having object, and Fig. 7 is illustrated in to utilize when detecting sensor 450 and detecting the figure of the track of the laser when having object.By Fig. 6 and Fig. 7, the principle that sensor 450 detects object that detects of present embodiment is described.In addition, about detecting sensor 451, because the direction of illumination difference of laser just, the principle that detects object is with to detect sensor 450 basic identical, so omit explanation.
As shown in Figure 6, light accepting part 450b is configured in from accepting by the position of the direct sunshine the laser of light-projecting portion 450a irradiation towards the (+Z) position of direction skew.That is, under the situation of no object, the laser from light-projecting portion 450a irradiation does not incide light accepting part 450b.On the other hand, as shown in Figure 7, exist under the situation of object, reflected by object from the part of the laser of light-projecting portion 450a irradiation, light accepting part 450b accepts this reverberation.
That is, present embodiment detect sensor 450,451, be with by the object laser light reflected as the laser sensor that detects light, transmit the light quantity that detects light that expression is accepted by light accepting part 450b, 451b to control part 7.
Details aftermentioned, but control part 7 being that judgement can not detect object under the situation of " 0 " from this light income that detects sensor 450,451 transmission, under the situation of light income greater than " 0 ", are judged to detect object.
As shown in Figure 7, even have object, the part of laser is run into object, and diffuse reflection takes place, and be small because common object is compared with the spot diameter of laser, so it is most walked along the track as direct sunshine.Thereby in transmission-type laser sensor in the past, even exist under the situation of object, light accepting part is also accepted direct sunshine more.Therefore, to block the attenuation of the light income that direct sunshine causes be small to object.In addition, if the size of substrate 90 maximizes, the distance of light-projecting portion and light accepting part becomes far away, and then the spot diameter of laser enlarges (with reference to Figure 12 and Figure 14).In such cases, the attenuation of being blocked the light income that causes by object is littler.
On the other hand, because sensor moves with slit jet nozzle, therefore, also vibrate although the vibration of the light beam of laser is very small because of following mobile vibration.Thus, when departing from light accepting part, the decay of the light income of light accepting part in device in the past, is judged as and detects object from the laser (direct sunshine) of light-projecting portion.Promptly, because the attenuation when object exists is small, so can not distinguish the decay of the light income that produces because of the decay of being blocked the light income that produces by object with because of the moving of sensor (vibration), the possibility that in device in the past, has the generation flase drop to go out.If flase drop frequently takes place,, therefore have the problem of disposal ability reduction owing to all will stop slit jet nozzle at every turn.
But in the substrate board treatment 1 of present embodiment, light accepting part 450b, 451b are configured in from the position of the position deviation of the direct sunshine of accepting laser, detect having or not of object according to detecting having or not of light.That is, the previous methods that has or not that detects object with attenuation according to light income is compared, and can suppress flase drop and go out.
In addition, light accepting part 450b be configured in from accept by the position of the direct sunshine of the laser of light-projecting portion 450a irradiation to the position of the direction skew of scanning direction (X-direction) approximate vertical of slit jet nozzle 41 on.The vibration of the laser that vibration causes mainly is created in the scanning direction of slit jet nozzle 41, and the vibration of Z-direction is smaller.Thereby, by light accepting part 450b is configured in towards (+Z) on the position of direction skew, can suppress to vibrate the flase drop that causes more and go out.
Fig. 8 is the figure of explanation when detecting sensor 450 and detecting object near the position of light accepting part 450b.Under object was present in locational situation near light accepting part 450b, the reverberation LFL of the laser that penetrates from light-projecting portion 450a was in the position of light accepting part 450b, by the low relatively position of Z-direction.Especially, at substrate 90 is under the situation of large substrate, because the distance of light-projecting portion 450a and light accepting part 450b, therefore in order to accept this reverberation LFL, light accepting part 450b must be adjusted to low relatively position, and accept from the direct sunshine DRL of the laser of light-projecting portion 450a ejaculation.Detect sensor 450,,, the possibility that can not detect object is arranged therefore in such cases owing to can not distinguish direct sunshine DRL and reverberation LFL.
Be anti-problem here, as long as light accepting part 450b is configured in from the end of substrate 90 towards (just passable on+the position that Y) direction is left relatively.But if consider the foothold of substrate board treatment 1, preferred light accepting part 450b is located near the end of substrate 90.
Therefore, in the substrate board treatment 1 of present embodiment, when existing on the position shown in Figure 8 under the situation of object, utilize from (+Y) sensor 451 that detects of direction irradiating laser detects.Because (+Y) object and the light accepting part 451b that exist of side has enough distances, so, also can be received in (+Y) the object laser light reflected that exists of side even light accepting part 451b is located at the very high position of not accepting direct sunshine.
Like this, by light-projecting portion 450a that detects sensor 450 and the light-projecting portion 451a that detects sensor 451, be configured in the both sides of the substrate 90 that is maintained on the objective table 3 respectively dividually, detect sensor 450 and detect sensor 451 and have complementary function, can not be subjected to the influence of the width of substrate 90, and detect the object in the sweep limits E0.
Assist and detect sensor 452, as Fig. 4 and shown in Figure 5, light-projecting portion 452a and light accepting part 452b are configured in the position (position of Z-direction) of roughly the same height, and light-projecting portion 452a is relative with light accepting part 452b to be disposed to ground.The auxiliary sensor 452 that detects of present embodiment is the laser that blocks light-projecting portion 452a irradiation by object, and the attenuation of the light income of the laser of accepting based on light accepting part 452b detects the transmission-type laser sensor of object.That is, detect use in the principle of object and in the past the device to detect sensor 100 (with reference to Figure 12 and Figure 13) identical.But, different with device in the past, the lower threshold value that is used to detect object of setting (attenuation is big), with in the attenuation degree that causes in vibration not the form that goes out of flase drop set.That is, assisting and detect sensor 452, is the sensor that detects large-scale relatively object, can not detect little object, has the function of the thinless sensor of the precision of detecting.
The side (+Y side) of laser no show configuration light accepting part 450b detects sensor 450, if then can not detect object.The side (Y side) of laser no show configuration light accepting part 451b equally, detects sensor 451, if then can not detect object.For example all block under the situation of the so large-scale object of laser in existence, the laser of any one irradiation from light-projecting portion 450a, 451a is less than reaching light accepting part 450b, 451b.Like this, under situation about existing greater than the big object of predicting, control part 7 might be thought by mistake and not have object.
Therefore, in the substrate board treatment 1 of present embodiment, be provided with and auxiliary detect sensor 452, detect and block the so large-scale object of laser.So, owing to can prevent to miss object, so substrate board treatment 1 can detect object more accurately.In addition,, the situation of setting lowlyer has been described, but terrifically, only the light income at light accepting part 452b is (under situation about being blocked fully) under the situation of " 0 ", is judged as that to have detected object also passable about the auxiliary threshold value that detects sensor 452.
Turn back to Fig. 1, control part 7 is according to the various data of routine processes.Control part 7 is connected with each mechanism of substrate board treatment 1 by not shown cable, and according to the input from gap sensor 42, linear encoder 51 and detecting element 45 etc., each of control objective table 3, elevating mechanism 43,44 and travel mechanism 5 etc. constitutes.
Especially, control part 7 based on from the input that detects sensor 450,451, monitors whether each light accepting part 450b, 451b have accepted laser, has received under the situation of laser at any simultaneously, judges to have detected object.
In addition, control part 7, based on from the auxiliary input that detects sensor 452, the light income of the laser of computing light accepting part 452b under the situation of the light income of obtaining by computing less than pre-set threshold, is judged to have object in sweep limits E0.
In the substrate board treatment 1 of present embodiment, control part 7 exists in judgement under the situation of object, this object is regarded as the interferences that contacts with slit jet nozzle 41.And contact with slit jet nozzle 41 for fear of this object, control travel mechanism 5 (linear electric machine 50) stops the scanning that slit jet nozzle 41 carries out.In addition, the control action back of the control part 7 when detecting object is described in detail.
In addition, control part 7, be connected with not shown operating portion (guidance panel, keyboard etc.) and display part (LCD or the Show Button etc.), by the indication of operating portion acceptance from the operator, by showing required data, give the operator simultaneously with the state untill further notice of substrate board treatment 1 at display part.
More than be the formation of substrate board treatment 1 of present embodiment and the explanation of function.
1.2 adjustment operation
In substrate board treatment 1, before substrate 90 is applied the processing of resist liquid, detect sensor 450,451 by the operator and reach the auxiliary position adjustment operation of sensor 452 on Z-direction that detect.This position adjustment adopts the micrometer with the following positioning accuracy of 10 μ m to carry out.
Detect light-projecting portion 450a, the 451a of sensor 450,451, carry out the position adjustment of Z-direction along the mode on the surface of substrate 90 with the laser that shines.In this case, because laser also can be blocked a part by substrate 90, so the position adjustment of Z-direction can be allowed the error of the spot diameter degree of laser, adjustment with can comparing inaccuracy.That is,, can alleviate the burden of adjusting operation owing to do not need strict adjustment operation.
In addition, this means, in detecting sensor 450,451, even the scope of the varied in thickness spot diameter of substrate 90 also can be corresponding.That is, even under the situation of handling the different substrate 90 of thickness,, just do not need to adjust once more, so can alleviate the burden of adjusting operation as long as the variation of its thickness within the limits prescribed.
When determining the position of light-projecting portion 450a, 451a, detect light accepting part 450b, the 451b of sensor 450,451, just temporarily be set in acceptance from the position of the direct sunshine of the laser of light-projecting portion 450a, 451a irradiation.At this moment, light accepting part 450b, 451b are owing to as long as a part of accepting laser (direct sunshine) is just passable, so this position adjustment can be more coarse.Then, to (+Z) the slow mobile light accepting part 450b of direction, 451b do not accepting fixed-site light accepting part 450b, the 451b of laser.So,, compare, can alleviate the burden of operation with device in the past even adjust in the operation in the position of light accepting part 450b, 451b.
The auxiliary light-projecting portion 452a that detects sensor 452 is carried out the position adjustment, make the light path of its laser be in substrate 90 surfaces (+Z) the position of direction, thus will not remain on substrate 90 on the objective table 3 as object and flase drop goes out with normal condition.That is when considering the thickness of substrate 90, be that benchmark carries out the position adjustment, with the maintenance face 30 of objective table 3.At this moment, preferably consider the thickness of substrate 90 uniformity (usually, design thickness ± 1% in) or the smooth machining accuracy of maintenance face 30 etc. and adjusting.Thus, can be in the light path of laser substrate 90 surfaces (+Z) mode of side is adjusted.
In addition, in substrate board treatment 1, contact with object, must detect the (Z) object of side existence at sweep limits E0 in order to prevent slit jet nozzle 41.Thereby, with the sweep limits of laser comprise sweep limits E0 (Z) mode in the zone of side is adjusted the position of the Z-direction of light-projecting portion 452a.
When determining the position of light-projecting portion 452a, adjust the auxiliary light accepting part 452b that detects sensor 452, make with the position of light-projecting portion 452a on Z-direction roughly the same.But in the substrate board treatment 1 of present embodiment, the auxiliary precision that detects that detects sensor 452 is set on inaccuracy ground.Thereby, do not need to device in the past like that, accept strictly to adjust the position of light accepting part 452b from the mode of the laser of light-projecting portion 452a irradiation with 100% ground roughly.That is, to accept the part of luminous point of this laser just enough, compared with the past as long as adjust to light accepting part 452b, can alleviate the burden of adjusting operation.
1.3 the explanation of action
Below, the action of substrate board treatment 1 is described.Fig. 9 and Figure 10 are the flow charts of the action handled of the coating of expression substrate board treatment 1.In addition, the action of each one shown below control only otherwise specify, is undertaken by control part 7.
In substrate board treatment 1, by operator or not shown conveyer, transport substrate 90, thereby the coating of beginning resist liquid is handled to the position of regulation.In addition, begin to handle the indication of usefulness, also can by the operator operating portion be operated and import in the moment of transporting end of substrate 90.
At first, objective table 3 is with the position of the regulation on substrate 90 absorption and the maintenance face of remaining on 30.Then, move, gap sensor 42 is moved to measure the mensuration starting position of using with the gap of substrate 90 (step S11) by making slit jet nozzle 41.This action is adjusted to the mensuration height by elevating mechanism 43,44 with the height and position of slit jet nozzle 41, and while linear electric machine 50 is adjusted to X-direction with bridge formation structure 4 and carried out.
When gap sensor 42 when measuring the mobile end of starting position, linear electric machine 5 make bridge formation structure 4 to (+X) direction moves.Thus, gap sensor 42 is guaranteed the mensuration height stipulated, measures substrate 90 surfaces of the area of application on substrate 90 surfaces and the gap (step S12) of slit jet nozzle 41 simultaneously.In addition, so-called the area of application is the zone that will apply resist liquid on the surface of substrate 90, usually, is that whole area from substrate 90 deducts the zone behind the zone of the Rack of end edge.In addition, during utilizing that gap sensor 42 measures, for slit jet nozzle 41 does not contact with substrate 90 or the object that is called foreign matter, in substrate board treatment 1, fully guarantee to measure the distance on Z-direction between the slit jet nozzle 41 of height and the maintenance face 30.
The measurement result of gap sensor 42 passes to control part 7.Then, control part 7 with the measurement result of the gap sensor 42 that transmitted, is kept in the storage part with setting up related by linear encoder 51 detected horizontal levels (position of X-direction).
When the scanning (mensuration) that utilizes gap sensor 42 to carry out finished, linear electric machine 50 made bridge formation structure 4 move to X-direction, makes detecting element 45 move to the end position (step S13) of substrate 90.In addition, so-called end position is to be present in the detecting element 45 that (X) optical axis of the sensor of side (being to detect sensor 450 in the present embodiment) is for roughly along the (+X) position on the limit of side of substrate 90.In addition, by the mensuration of utilizing gap sensor 42 to carry out, the thickness of judging substrate 90 not specified scope with interior situation under, substrate board treatment 1, in demonstration alarms such as display parts, make slit jet nozzle 41 move to position of readiness, discharge simultaneously and be detected unusual substrate 90.
When detecting element 45 moved to end position, control part 7 stopped by making linear electric machine 50, and bridge formation structure 4 is stopped.And then, based on the measurement result from gap sensor 42, calculating the posture of slit jet nozzle 41 on the YZ plane, to reach suitable posture (be the posture that the interval of slit jet nozzle 41 and the area of application reaches the interval (being 50～200 μ m in the present embodiment) that is fit to the coating resist.Hereinafter referred to as " suitably posture ".) the position of nozzle support 40, based on the result who calculates, control elevating mechanism 43,44 respectively, slit jet nozzle 41 is adjusted to suitable posture.
The detecting element 45 of substrate board treatment 1 and since be configured in slit jet nozzle 41 (X) side, thus be positioned at detecting element 45 under the state of end position, slit jet nozzle 41 to not with substrate 90 relative to the position move.Thereby, be positioned at detecting element 45 under the state of end position, by making slit jet nozzle 41 to (Z) direction moves, and adjusts to suitable posture, also has the danger that slit jet nozzle 41 contacts with object hardly.
When the stance adjustment of slit jet nozzle 41 finished, control part 7 began to utilize detecting element 45 to detect object (step S14).Then, drive linear electric machine 50, to (X) direction movable stand bridge construction 4 (step S21) simultaneously based on the output from detecting element 45, judges whether detected object (step S22).Judge by any detect sensor 450,451 and auxiliary detecting under the situation that sensor 452 detected object, carry out the later processing of step S27, prevent that slit jet nozzle 41 from contacting with object, but the details aftermentioned.
On the other hand, not detecting under the situation of object, based on the output of linear encoder 51, control part 7 is confirmed the position of slit jet nozzle 41, and the processing of repeating step S21～S23 simultaneously moves to ejection starting position (step S23) up to slit jet nozzle 41.In addition, so-called ejection starting position is that slit jet nozzle 41 is roughly along the (+X) position on the limit of side of the area of application.
When slit jet nozzle 41 moves to the ejection starting position, utilize resist with pump (not shown), carry resist liquid to slit jet nozzle 41, slit jet nozzle 41 is to the area of application ejection resist liquid.With this ejection action while, linear electric machine 50 makes slit jet nozzle 41 to (X) direction moves (step S24).Thus, utilize the area of application of slit jet nozzle 41 scanning substrates 90, coating resist liquid.Parallel with the shift action of step S24, S22 is same with step, whether has been detected the judgement (step S25) of object by control part 7.
In step S25, judge (being "Yes") under the situation that has detected object at control part 7 in step S25, by control part 7 linear electric machine 50 is stopped, stopping slit jet nozzle 41 to (X) shift action of direction is simultaneously to output alarms (step S27) such as display parts.In addition, in step S22, judge at control part 7 to have detected under the situation of object, also execution in step S27 similarly roughly.
Like this, in substrate board treatment 1, in the moving of slit jet nozzle 41 (in the scanning), detecting by detecting element 45 under the situation of object,, can prevent that slit jet nozzle 41 from contacting with object by stopping to move of slit jet nozzle 41 immediately.Thereby, can prevent effectively that slit jet nozzle 41 or substrate 90 etc. are because of contact breakage etc.
In addition, by the output alarm, take place unusually owing to can inform the operator, so can carry out comeback job effectively.In addition, so long as alarm can make the operator learn that the generation abnormal conditions get final product, can be any method, also can be from output alarm songs such as loudspeakers.
Behind execution in step S27, stop the resist pump, stop to spray resist liquid, utilize linear electric machine 50 and elevating mechanism 43,44, slit jet nozzle 41 is kept out of the way position of readiness (step S28).Then, transport substrate 90 (step S29) from substrate board treatment 1.In addition, at step S22, detecting under the situation of object, because the ejection of resist liquid does not also begin, therefore do not stop the processing of the ejection of resist liquid, in addition, be different from other substrate 90 having carried out the substrate 90 that transports behind the step S27, be transported to treatment process again by operator or conveyer.In addition, as Fig. 4 and shown in Figure 5, owing to consider that foreign matter NG is also attached on the objective table 3, so under the situation of having carried out step S27, preferably carry out the cleaning of objective table 3 sometimes.
On the other hand, in step S25, do not detecting (step S25 is a "No") under the situation of object, output based on linear encoder 51, control part 7 is confirmed the position of slit jet nozzle 41, repeat the processing of step S24～S26 simultaneously, move to ejection end position (step S26) up to slit jet nozzle 41.Like this, under the situation that does not have object, utilize 41 pairs of entire coating zones of slit jet nozzle to scan, on substrate 90 surfaces in the whole zone of this area of application, form the layer of resist liquid.
When slit jet nozzle 41 moved to the ejection end position, control part 7 stopped the resist pump, stops the ejection of resist liquid, utilizes linear electric machine 50 and elevating mechanism 43,44 to make slit jet nozzle 41 keep out of the way position of readiness (step S28).Action is parallel therewith, and control part 7 stops to utilize detecting of object that detecting element 45 carries out.
Then, objective table 3 stops the absorption to substrate 90, and operator or conveyer take off substrate 90 from maintenance face 30, and substrate 90 is transported next treatment process (step S29).
In addition, in the moment that the coating that is through with is handled, also can carry out the inspection of the thickness of resist liquid and handle.That is, by elevating mechanism 43,44 make nozzle support 40 to (+Z) direction moves, gap sensor 42 is moved to measures height.Then, by linear electric machine 50 make bridge formation structure 4 to (+X) direction moves, the gap of the resist film on the substrate 90 is measured and be formed on to gap sensor 42 scanning the area of application, passes to control part 7.Control part 7, apply the gap width (with the distance on resist film surface) that the back is measured by relatively applying gap width (with the distance on substrate 90 surfaces) and the resist measured before the resist liquid, calculate the thickness of the resist film on the substrate 90, will calculate the result and be presented on display part etc.
When the transporting processing (step S29) and finish of substrate 90, under situation about further continuously many pieces of substrates 90 being handled, turn back to step S11, repeat to handle, under the situation that does not have substrate 90 to be processed, end process (step S30).
As mentioned above, the substrate board treatment 1 of present embodiment, be configured in from the position of acceptance by the position deviation of the direct sunshine the laser of light-projecting portion 450a, 451a irradiation, have will by in the laser of light-projecting portion 450a, 451a irradiation by the object laser light reflected as detecting light and the light accepting part 450b, the 451b that accept, owing to accepted to detect under the situation of light at light accepting part 450b, 451b, setting has detected object, so the position of light accepting part 450b, 451b comparatively speaking can inaccuracy, therefore can alleviate the burden of adjusting operation.In addition, since light accepting part 450b, 451b as long as accept even the faint light that detects just can detect object, so can suppress the influence of substrate 90 width, the raising precision.
In addition, by light accepting part 450b, 451b be configured in from the position of the direct sunshine of accepting laser to the position of the direction skew of the scanning direction approximate vertical of slit jet nozzle 41 on, can suppress the influence of the vibration that the scanning of slit jet nozzle produces.Thereby, can suppress flase drop and go out, thereby can access the correct result that detects.
In addition, has the auxiliary sensor 452 that detects that in the scanning of slit jet nozzle 41, detects the object that might interfere with slit jet nozzle 41, the auxiliary light accepting part 452b that detects sensor 452 be configured in relative with light-projecting portion 452a to the position on, acceptance is from the direct sunshine of the laser of light-projecting portion 452a irradiation, the light income of the direct sunshine of light accepting part 452b is under the situation below the threshold value of regulation, by detecting object, the scope of the object that expansion can detect.
In addition, by light-projecting portion 450a that detects sensor 450 and the light-projecting portion 451a that detects sensor 451, the both sides of the substrate 90 that kept at objective table 3 of separate configuration respectively, can not be subjected to substrate width influence and detect object.
In addition, by detecting element 45 is installed,, can make the operation high efficiency in travel mechanism 5 even under the situation of changing slit jet nozzle 41, also do not need to carry out once more the position adjustment of detecting element 45.
2, second embodiment
In the first embodiment, constitute in travel mechanism 5, the mode of detecting element 45 to be installed, but the installation site of detecting element 45 is not limited to this, gets final product so long as can detect the position of object, can be installed in any position.
Figure 11 is based on the enlarged drawing of periphery of detecting element 45 of the substrate board treatment 1a of second embodiment that such principle constitutes.Substrate board treatment 1a, as shown in figure 11, detecting element 45 is installed on the nozzle support 40.Slit jet nozzle 41, same with above-mentioned embodiment, be fixedly installed on the nozzle support 40, slit jet nozzle 41 moves with nozzle support 40 one.On nozzle support 40, be set with slit jet nozzle 41.Thereby detecting element 5 is to guarantee that one moves under the state with the relative distance of slit jet nozzle 41.
In addition, substrate board treatment 1a except detecting element 45 is installed on the nozzle support 40, has the formation roughly the same with the substrate board treatment 1 of first embodiment.In addition, about the action of substrate board treatment 1a, also roughly the same with substrate board treatment 1.But, in substrate board treatment 1, position with the maintenance face 30 of objective table 3 is a benchmark, detect sensor 450,451 and assist and detect the position adjustment operation of sensor 452 on Z-direction, but in substrate board treatment 1a, with slit jet nozzle 41 (Z) end of side is a benchmark, carries out their positions on Z-direction and adjusts operation.
As mentioned above, as the substrate board treatment 1a of second embodiment,, also can access the effect roughly the same with the substrate board treatment 1 of first embodiment even under detecting element 45 is installed in situation on the nozzle support 40.
In addition, by to detect sensor 450,451 and the auxiliary sensor 452 that detects keeping one moves under the state of relative distances mode to install with slit jet nozzle 41, thereby after the adjustment of the relative distance of temporarily having carried out detecting element 45 and slit jet nozzle 41, no matter the posture (mainly being the position of Z-direction) of slit jet nozzle 41 how, because its relative distance reaches necessarily, so can improve and detect precision.In addition, in substrate board treatment 1a,, do not need to carry out once more the position yet and adjust operation, can realize efficiency of operationization even the thickness of the substrate of handling 90 etc. change.
3, variation
More than, embodiments of the present invention have been described, but the present invention is not limited to above-mentioned embodiment, can carry out numerous variations.
For example, in the substrate board treatment 1a of second embodiment, illustrated that detecting element 45 is installed on the nozzle support 40, still, for example detecting element 45 is directly installed on the slit jet nozzle 41 also passable.
In the above-described embodiment, assist and detect sensor 452, have light-projecting portion 452a and light accepting part 452b respectively.But, detecting 452 formations of sensor even assist with light accepting part 452b, also can realize.Figure 16 is that expression is based on detecting sensor 450 and assisting the figure that detects sensor 452 in the variation of such principle formation.As shown in figure 16, relative with the light-projecting portion 450a that detects sensor 450 to the position on the auxiliary light accepting part 452b that detects sensor 452 of configuration.That is, on the position of light-projecting portion 450a and light accepting part 452b, dispose in the position mode about equally of X-direction and Z-direction.According to such configuration, light accepting part 452b can accept from the direct sunshine of the laser of light-projecting portion 450a irradiation.By such formation, auxiliary detect sensor 452 and also can access the effect identical with above-mentioned embodiment.In addition, owing to auxiliary detect sensor 452 and be also used as the light-projecting portion 450a that detects sensor 450, thereby can constitute by simplification device.In addition, adopting the auxiliary light-projecting portion that detects sensor 452, also be not limited to light-projecting portion 450a, also can be light-projecting portion 451a.
Claims (5)
1. substrate board treatment to coating of substrates predetermined process liquid, is characterized in that having:
The holding device that keeps substrate;
Blowoff, it sprays predetermined process liquid to the described substrate that described holding device kept;
Mobile device, its described substrate and described blowoff that described holding device is kept relatively moves, and makes described blowoff carry out scanning to described substrate;
At least one detection device, it detects in the scanning of described blowoff the object that might interfere with described blowoff;
Control device, it controls described mobile device based on the result that detects of described detection device,
Described detection device has:
The light-projecting portion of irradiating laser;
Light accepting part, it is configured on accepting the position by the position deviation of the direct sunshine the laser of described light-projecting portion irradiation, accept by in the laser of described light-projecting portion irradiation, by described object laser light reflected as detecting light,
Described detection device has been accepted will pass to described control device as the result that detects who detects described object under the described situation that detects light at described light accepting part.
2. substrate board treatment as claimed in claim 1 is characterized in that,
Described light accepting part be configured in to the position of the direction skew of the scanning direction approximate vertical of described blowoff on.
3. substrate board treatment as claimed in claim 1 is characterized in that,
Described light-projecting portion is to the direction irradiating laser of the surperficial almost parallel of the described substrate that is kept with described holding device.
4. substrate board treatment as claimed in claim 1 is characterized in that,
Also have auxiliary detection device, this auxiliary detection device detects in the scanning of described blowoff the object that might interfere with described blowoff,
Described auxiliary detection device has auxiliary light accepting part, this auxiliary light accepting part be configured in relative with described light-projecting portion or auxiliary light-projecting portion to the position on, accept from the direct sunshine of the described laser of described light-projecting portion or described auxiliary light-projecting portion irradiation,
Described auxiliary detection device, the light income of the described direct sunshine of described auxiliary light accepting part for the situation below the threshold value of regulation under, will pass to described control device as the result that detects who detects described object,
Described control device, the result that detects who detects result and described auxiliary detection device according to described detection device controls described mobile device.
5. substrate board treatment as claimed in claim 1 is characterized in that,
Described at least one detection device is more than two,
The described light-projecting portion of a detection device and the described light-projecting portion of another detection device, separate configuration is in the both sides of the described substrate that described holding device kept respectively.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| JP2004248297A JP4417205B2 (en) | 2004-08-27 | 2004-08-27 | Substrate processing equipment |
| JP2004248297 | 2004-08-27 |
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| CN100404146C true CN100404146C (en) | 2008-07-23 |
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| JP (1) | JP4417205B2 (en) |
| KR (1) | KR100676240B1 (en) |
| CN (1) | CN100404146C (en) |
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| KR100643397B1 (en) * | 2005-11-17 | 2006-11-10 | 삼성전자주식회사 | Wafer sensing apparatus |
| JP4587950B2 (en) * | 2005-12-22 | 2010-11-24 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP4967446B2 (en) * | 2006-05-12 | 2012-07-04 | 凸版印刷株式会社 | Method for detecting foreign matter adhering during coating film formation by slit nozzle and method for monitoring thickness of glass substrate |
| JP4520975B2 (en) * | 2006-12-06 | 2010-08-11 | 東京エレクトロン株式会社 | Coating method and coating apparatus |
| JP4916971B2 (en) * | 2007-07-30 | 2012-04-18 | 株式会社アルバック | Coating device |
| JP5122371B2 (en) * | 2008-05-26 | 2013-01-16 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, program, and storage medium |
| JP2010217086A (en) * | 2009-03-18 | 2010-09-30 | Anritsu Corp | Device and method for inspection of printed solder |
| JP2010240550A (en) * | 2009-04-03 | 2010-10-28 | Dainippon Screen Mfg Co Ltd | Apparatus for treating substrate |
| JP5108909B2 (en) | 2010-03-12 | 2012-12-26 | 東京エレクトロン株式会社 | Backside foreign matter detection method, backside foreign matter detection device, and coating device |
| JP5679866B2 (en) * | 2011-02-28 | 2015-03-04 | 東レエンジニアリング株式会社 | Coating apparatus and coating method |
| CN102680496B (en) * | 2011-04-15 | 2016-04-20 | 京东方科技集团股份有限公司 | Detection device for foreign matter and method |
| JP6106964B2 (en) * | 2012-06-25 | 2017-04-05 | セイコーエプソン株式会社 | Printing apparatus and printing method |
| JP5714616B2 (en) * | 2013-01-21 | 2015-05-07 | 中外炉工業株式会社 | Coating equipment |
| KR102532040B1 (en) * | 2015-04-09 | 2023-05-15 | 도쿄엘렉트론가부시키가이샤 | Foreign substance removal apparatus, foreign substance removal method, separation apparatus, foreign substance detection method, and foreign substance detection apparatus |
| JP6635888B2 (en) * | 2016-07-14 | 2020-01-29 | 東京エレクトロン株式会社 | Plasma processing system |
| JP6787294B2 (en) * | 2017-10-31 | 2020-11-18 | セイコーエプソン株式会社 | Robot systems, control methods, and robots |
| JP7028607B2 (en) * | 2017-11-06 | 2022-03-02 | 株式会社ディスコ | Cutting equipment |
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| Publication number | Publication date |
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| JP2006061854A (en) | 2006-03-09 |
| KR20060053901A (en) | 2006-05-22 |
| KR100676240B1 (en) | 2007-01-30 |
| TWI295590B (en) | 2008-04-11 |
| TW200607578A (en) | 2006-03-01 |
| CN1739865A (en) | 2006-03-01 |
| JP4417205B2 (en) | 2010-02-17 |
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