JP4490803B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus for applying a processing liquid to a substrate.

  Conventionally, a substrate is obtained by discharging a processing liquid from a discharge port to a substrate while bringing the discharge port provided at the tip of the nozzle close to the surface of the substrate and moving the nozzle parallel to the substrate holding surface. A substrate processing apparatus for applying a processing liquid to the surface of the substrate is used. In the substrate processing apparatus, the gap between the discharge port and the surface of the substrate becomes a minimum gap of several tens of μm to several hundreds of μm, and various problems may occur due to foreign matters on the front or back surface of the substrate. For example, damage to the nozzle due to contact between foreign matter on the substrate surface and the nozzle has been a problem in the substrate processing apparatus.

  In view of this, various techniques have been studied in which a nozzle protection member is provided on the traveling direction side of the nozzle parallel movement, and foreign matter is removed or detected by the nozzle protection member. For example, in Patent Document 1, a nozzle protective member (plate member) is fixed to a nozzle (coating head) of a slit coater (slit coat type coating apparatus), and vibrations caused by interference between the nozzle protective member and a foreign object are detected. A technique for detecting and stopping the parallel movement of the nozzle is disclosed.

JP 2000-24571 A

  However, in the technique of Patent Document 1, there is no means for knowing whether the nozzle protection member is appropriately fixed to the nozzle, and there is a problem that the nozzle protection member cannot properly protect the nozzle. For example, when the nozzle protection member is improperly fixed to the nozzle or the fixing position of the nozzle protection member is shifted during operation of the substrate processing apparatus, the nozzle protection member cannot properly protect the nozzle. .

  The present invention has been made to solve this problem, and an object of the present invention is to provide a substrate processing apparatus in which a nozzle protection member can appropriately protect a nozzle.

In order to solve the above-mentioned problems, the invention of claim 1 is a substrate processing apparatus for applying a treatment liquid to the surface of a substrate held on a holding surface, and is movable in a first direction parallel to the holding surface. The nozzle that discharges the processing liquid to the substrate and the first closest end that is the closest end to the holding surface are more than the second closest end that is the closest end to the holding surface in the nozzle. A nozzle protection member fixed to the nozzle on the first direction side of the second closest end so as to be close to the holding surface, and the first proximity end and the second proximity end, A linear gauge that measures a vertical position that is a position in a second direction perpendicular to the holding surface; a moving means that moves the nozzle and the nozzle protection member in the first direction and the second direction; and The vertical position of the close end is measured by the linear gauge. After that, the moving means is controlled so that the vertical position of the first closest end is measured by the linear gauge, and the distance between the first closest end and the second closest end in the second direction is set. Control means for outputting. According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, after the vertical position of the second closest end is measured by the linear gauge, the control means is arranged in the second direction. The moving means so that the nozzle is retracted and then the nozzle is horizontally moved so that the horizontal position of the first proximity end in the first direction matches the horizontal position of the linear gauge. To control.

According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect , the occurrence of an abnormality is notified when the interval is outside a predetermined range.

A fourth aspect of the present invention, in the substrate processing apparatus according to any one of claims 1 to claim 3, when the temporal change of the interval exceeds a predetermined threshold, it notifies the occurrence of abnormality.

According to a fifth aspect of the present invention, in the substrate processing apparatus according to any one of the first to fourth aspects, the coating process is stopped when the interval is outside a predetermined range.

According to a sixth aspect of the present invention, in the substrate processing apparatus according to any one of the first to fifth aspects, the coating process is stopped when a change in the interval with time exceeds a predetermined threshold value.

According to a seventh aspect of the present invention, in the substrate processing apparatus according to any one of the first to sixth aspects, the interval is measured in synchronization with the start of operation of the substrate processing apparatus.

According to an eighth aspect of the present invention, in the substrate processing apparatus according to any one of the first to seventh aspects, the interval is measured every time the coating process or a predetermined time elapses for a predetermined number of substrates.

According to a ninth aspect of the present invention, in the substrate processing apparatus according to any one of the first to eighth aspects, the control means is configured such that the vertical position of the second proximity end coincides with the holding surface. The vertical position of one adjacent end is output as the interval.

  According to the first aspect of the invention, since the distance between the closest end to the holding surface of the nozzle protection member and the closest end to the holding surface of the nozzle can be managed, the nozzle is moved in the first direction. In some cases, the nozzle protection member can appropriately protect the nozzle.

According to invention of Claim 3 or Claim 4 , it can recognize that a nozzle protection member cannot protect a nozzle appropriately.

According to the invention of claim 5 or claim 6 , since the coating process is automatically stopped when the nozzle protection member cannot properly protect the nozzle, damage to the nozzle can be prevented.

According to the seventh aspect of the invention, since it is possible to determine whether or not the nozzle protection member can protect the nozzle in synchronization with the start of operation of the substrate processing apparatus, the nozzle can be appropriately protected.

According to the eighth aspect of the present invention, since it is possible to determine whether or not the nozzle protection member can protect the nozzle every time a coating process is applied to a predetermined number of substrates or a predetermined time elapses, the nozzle can be appropriately protected. .

According to the invention of claim 9 , the interval can be easily measured.

<1. Configuration of substrate processing apparatus>
FIG. 1 is a perspective view schematically showing a substrate processing apparatus 1 according to an embodiment of the present invention. FIG. 2 is a plan view of the main body 2 of the substrate processing apparatus 1 including the main body 2 and the control unit 6 as viewed from above. 3 and 4 are a front view and a side view of the main body 2, respectively.

  The substrate processing apparatus 1 is a processing liquid coating apparatus that applies a processing liquid (chemical solution) to the surface 90 s of the substrate 90 to be processed. In the substrate processing apparatus 1, the substrate 90 is, for example, a flat panel display substrate typified by a glass substrate for a liquid crystal panel, a flexible substrate for a liquid crystal film, a substrate for a photomask, a substrate for a color filter, a ceramic substrate for a thermal head, or a semiconductor. For example, a wafer or the like, and the processing liquid is, for example, a photoresist liquid (hereinafter, also simply referred to as “resist”). In the following description, the substrate 90 is a rectangular glass substrate for a liquid crystal panel, which is a member constituting the liquid crystal panel of the liquid crystal display device, and the processing liquid selectively selects the electrode layer formed on the surface 90 s of the substrate 90. The description will be made assuming that the resist is used for forming a pattern for etching. The substrate processing apparatus 1 is a slit coater that applies a resist to the surface 90 s of the substrate 90 by discharging the resist from the slit nozzle 41 to the substrate 90.

<1.1 Main unit configuration>
As shown in FIGS. 1 to 4, the main body 2 includes a stage 3 that holds the substrate 90 and serves as a base of each attached mechanism, and a bridge structure 4 that discharges resist to the substrate 90. The bridging structure 4 can be horizontally moved in the horizontal front-rear direction (± X direction) on the stage 3 by the traveling mechanisms 70 and 71.

○ Stage;
The stage 3 is composed of a cuboid-shaped integral stone, and its upper surface and side surfaces are processed to be flat.

  The upper surface of the stage 3 is a horizontal surface and functions as the holding surface 30 of the substrate 90. A large number of vacuum suction ports are distributed and formed on the holding surface 30. In the substrate processing apparatus 1, while the substrate 90 is being processed, the substrate 90 is held in the holding area 91 by vacuum suction using the vacuum suction port.

○ Cross-linked structure;
The bridging structure 4 spanned substantially horizontally from the left and right ends of the stage 3 mainly includes a nozzle support portion 40 that supports the slit nozzle 41 downward, and an elevation that supports both ends of the nozzle support portion 40 above the stage 3. And mechanisms 43 and 44. The nozzle support unit 40 is held by the elevating mechanisms 43 and 44 so as to be substantially horizontal and elevable above the stage 3, and the longitudinal direction thereof is the horizontal left-right direction (± Y direction) of the substrate processing apparatus 1. The nozzle support portion 40 is made lighter while maintaining strength by using an aluminum die-cast material as an aggregate. As a result, the driving force required to move the bridging structure 4 can be reduced, and the bridging structure 4 can be moved using a motor having a small driving force.

  As described above, the elevating mechanisms 43 and 44 support both ends of the nozzle support portion 40 so as to be able to move up and down above the stage 3, and the nozzle support portion 40 in the vertical direction (± Z direction) perpendicular to the holding surface 30. Raise and lower. Since the slit nozzle 41 is attached to the nozzle support portion 40, the elevating mechanisms 43 and 44 also serve as means for changing the distance between the discharge port 41c and the holding surface 30 by moving the slit nozzle 41 in the vertical direction. ing. The elevating mechanisms 43 and 44 are used for moving the slit nozzle 41 in translation and adjusting the posture of the slit nozzle 41 in the YZ plane.

  Subsequently, the details of the lifting mechanisms 43 and 44 will be described. Since the lifting mechanisms 43 and 44 have substantially the same configuration, the lifting mechanism 44 will be described below with reference to FIGS. A duplicate description of the mechanism 43 is omitted. 5 and 6 are diagrams showing details of the lifting mechanism 44. FIG. 5 corresponds to a plan view of the lifting mechanism 44 viewed from above, and FIG. 6 corresponds to a front view of the lifting mechanism 44. .

  As shown in FIGS. 5 and 6, the elevating mechanism 44 includes an AC servo motor (hereinafter, also simply referred to as “servo motor”) 440, a ball screw 441, and a rotary encoder 442. The elevating mechanism 44 includes a coupling member (not shown), and each component such as the servo motor 440 and the rotary encoder 442 is attached to the coupling member and supported at a predetermined position.

  The servo motor 440 that generates the raising / lowering driving force of the nozzle support unit 40 is a motor whose rotating shaft rotates in accordance with a control signal given from the control unit 6, and controls the rotation angle and direction of the rotating shaft by the control signal. It is possible.

  The ball screw 441 is connected to the rotation shaft of the servo motor 440 at the upper end, and is rotatable about the central axis Q. The ball screw 441 is screwed into the mounting hole 40 h at the end of the nozzle support portion 40. Since a female screw structure is formed on the inner surface of the mounting hole 40h, the ball screw 441 rotates in response to the rotational driving force transmitted from the servo motor 440, thereby vertically moving the nozzle support portion 40 (slit nozzle 41). Can be raised and lowered in the direction.

  A rotary encoder 442 provided on the upper portion of the servo motor 440 detects the shaft position of the rotation shaft of the servo motor 440 and transmits a position address AR corresponding to the shaft position to the control unit 6. The vertical position that is the position of the slit nozzle 41 in the vertical direction is specified by the position address AR transmitted from the rotary encoder 442 to the control unit 6.

○ Traveling mechanism;
As described above, the bridging structure 4 can be moved horizontally in the front-rear direction of the substrate processing apparatus 1. Below, the traveling mechanisms 70 and 71 for implement | achieving the said horizontal movement of the bridge | crosslinking structure 4 are demonstrated.

  The travel mechanisms 70 and 71 include travel rails 72 and 73, support blocks 74 and 75, AC linear servo motors (hereinafter also simply referred to as “linear servo motors”) 76 and 77, and linear encoders 78 and 79, respectively. With. Among these configurations, the travel rail 72, the support block 74, the linear servo motor 76, and the linear encoder 78 are travel mechanisms for horizontally moving the elevating mechanism 43 in the horizontal front-rear direction. The travel rail 73, the support block 75, The linear motor 77 and the linear encoder 79 are traveling mechanisms for horizontally moving the elevating mechanism 44 in the horizontal front-rear direction. Since the former and the latter have substantially the same configuration, the former will be described below with reference also to FIGS. 7 and 8, and a duplicate description of the latter will be omitted. 7 is a cross-sectional view of the traveling mechanism 70 in the YZ plane, and FIG. 8 is a side view of the traveling mechanism 70 viewed from the side.

  The traveling rail 72 is fixed to the end of the holding surface 30, and the longitudinal direction thereof is the horizontal front-rear direction of the substrate processing apparatus 1. In the substrate processing apparatus 1, a linear motion guide mechanism that defines the moving direction of the lifting mechanism 43 is realized by the traveling rail 72 and the support block 74 fixed to the lower end of the lifting mechanism 43. That is, in the substrate processing apparatus 1, the moving direction of the support block 74 is defined in the direction along the traveling rail 72, so that the moving direction of the elevating mechanism 43 is defined in the horizontal front-rear direction.

  The linear motor 76 that generates the driving force for the horizontal movement of the elevating mechanism 43 is a linear motor in which the moving element 76b moves relative to the stator 76a in response to a control signal given from the control unit 6, and according to the control signal. The amount and direction of movement can be controlled. Here, since the stator 76a is fixed to the side surface of the stage 3 and extends along the moving direction of the lifting mechanism 43, and the moving element 76b is fixed to the lower end portion of the lifting mechanism 43, the moving element 76b. If it moves with respect to the stator 76a, the raising / lowering mechanism 43 will move horizontally on the holding surface 30 in the horizontal front-back direction.

  The linear encoder 78 includes a scale unit 78a and a detector 78b, detects the position of the detector 78b with respect to the scale unit 78a, and transmits a position address AL corresponding to the position of the detector 78b to the control unit 6. Here, the scale portion 78 a is fixed to the stage 3 together with the stator 76 a and extends along the moving direction of the lifting mechanism 43, and the detector 78 b is fixed to the lower end portion of the lifting mechanism 43. The position address AL transmitted from the encoder 78 also serves as information for specifying the horizontal position that is the position of the elevating mechanism 43 in the horizontal front-rear direction.

  As described above, in the substrate processing apparatus 1, since the elevating mechanisms 43 and 44 can be horizontally moved in the horizontal front-rear direction by the traveling mechanisms 70 and 71, respectively, the entire bridging mechanism 4 including the slit nozzle 41 is held on the holding surface. 30 can move horizontally in the horizontal front-rear direction parallel to 30. Further, the horizontal position of the slit nozzle 41 in the horizontal front-rear direction is specified by the position address AL transmitted from the linear encoders 78 and 79 to the control unit 6.

○ Linear gauge;
Linear gauges 81 and 82 are fixed on the front surface 31 of the stage 3. The linear gauges 81 and 82 are members for measuring the vertical position of the measurement target in the vertical direction perpendicular to the holding surface 30. Below, the structure of the linear gauge 81 (82) is demonstrated, referring the enlarged view (side view) of FIG.

  The linear gauge 81 (82) includes a probe 811 (821) that can move up and down elastically in the vertical direction. When the force is applied downward, the probe 811 (821) is pushed down in a repulsive manner, that is, the probe 811 (821) is fixed to the front surface 31 when the force is applied downward. It is pushed back into the main body 812 (822). The linear gauge 81 (82) is configured to detect the amount by which the probe 811 (821) is pushed down and to output the detection result to the control unit 6. Therefore, if the measurement object is brought into contact with the tip of the probe 811 (821) of the linear gauge 81 (82), the control unit 6 can derive the vertical position of the measurement object in the vertical direction.

  In the substrate processing apparatus 1, (1) the vertical position of the tip 813 (823) of the probe 811 (821) in a state where no force is applied is above the holding surface 30 (see FIG. 9A). 2) Linear gauge so that the vertical position of the tip 813 (823) is below the holding surface 30 when the pressing amount of the probe 811 (821) reaches a detectable upper limit (see FIG. 9B). Since 81 (82) is attached to the front surface 31 of the stage 3, the vertical position of the measuring object can be measured within a predetermined range including the holding surface 30 by the linear gauge 81 (82).

  The measured value of the linear gauge 81 is calibrated to be “0” when the tip 813 (823) is on the holding surface 30, that is, the measured value of the linear gauge is based on the holding surface 30. It is also the distance between the holding surface 30 and the measuring object or the height of the measuring object with reference to the holding surface 30.

○ Slit nozzle;
FIG. 10 is a side view of the slit nozzle 41 as viewed from the side.

  As shown in FIG. 10, the slit nozzle 41 extending in the horizontal left-right direction has a structure in which the discharge portion 41b is protruded downward from the main body portion 41a, that is, toward the substrate 90. Further, a discharge mechanism (not shown) including a pipe for supplying a resist and a resist pump is connected to the discharge port 41c at the tip of the discharge portion 41b. Thereby, in the substrate processing apparatus 1, it becomes possible to discharge the resist to the substrate 90 from the discharge port 41c. The slit nozzle 41 can apply the resist to the surface 90 s of the substrate 90 by discharging the resist to the substrate 90 while moving in the traveling direction (−X direction) parallel to the holding surface 30.

  Further, a bumper (plate) 415 that is a protective member of the slit nozzle 41 is screwed to the side surface 411 of the main body 41a. The bumper 415 is a rod-shaped member made of a material having high rigidity such as stainless steel, and the thickness (thickness in the ± X direction) is about 10 mm, for example. The bumper 415 is fixed to the slit nozzle 41 such that the flatly polished lower end surface 415a is parallel to the holding surface 30, and the lower end surface 415a is the closest end of the bumper 415 to the holding surface 30. It has become. The lower end surface 415 a is fixed so as to be closer to the holding surface 30 than the discharge port 41 c that is the closest end to the holding surface 30 in the slit nozzle 41. In addition, the vertical position of the lower end surface 415 was normally held on the holding surface 30 during resist application (with no foreign matter that could damage the resist coating or damage the slit nozzle 41). The vertical position is such that it does not contact the surface 90s of the substrate 90.

  As the bumper 415, one rod-like member having substantially the same length (± Y-direction length) as the slit nozzle 41 may be provided, or a plurality of rod-like members having a length shorter than the slit nozzle 41 may be provided. .

  By providing such a bumper 415 such that the lower end surface 415a is closer to the traveling direction than the discharge port 41c, when the slit nozzle 41 is moved in the traveling direction, the foreign matter NG or the like on the substrate 90 is bumper 415. Therefore, it is possible to prevent the foreign matter NG and the slit nozzle 41 from interfering (contacting) and damaging the slit nozzle 41 (FIG. 10A). Further, by providing such a bumper 415, when the slit nozzle 41 is moved in the traveling direction, there is a foreign matter NG ′ or the like under the substrate 90, and the surface 90s of the substrate 90 is raised. It is possible to prevent the protrusion and the slit nozzle 41 from interfering (contacting) and damaging the slit nozzle 41 (FIG. 10B). If the bumper 415 is fixed to the side surface 412, damage to the slit nozzle 41 can be prevented when the slit nozzle 41 is moved in the + X direction. If the bumper 415 is fixed to both the side surfaces 411 and 412, Even when the slit nozzle 41 is moved in any of the ± X directions, damage to the slit nozzle 41 can be prevented.

  Further, more desirably, a vibration detection sensor 416 that detects vibration caused by interference between the bumper 415 and the foreign object NG or the like is screwed on the side surface of the main body portion 41a apart from the bumper 415. The vibration detection sensor 416 is, for example, a vibration detection sensor using a piezoelectric element, and detects a vibration in the traveling direction of the slit nozzle 41 and outputs a predetermined detection signal. In the substrate processing apparatus 1, when a detection signal is output from the vibration detection sensor 416, the resist coating operation on the surface 90 s of the substrate 90 is stopped, and the slit nozzle 41 is raised by the elevating mechanisms 43 and 44 to run The slit nozzle 41 is moved to the standby position by the mechanisms 70 and 71.

<1.2 Configuration of control unit>
As shown in FIG. 1, the control part 6 comprised with the microcomputer is provided with the memory | storage part 60 which memorize | stores a program and data, and the calculating part 61 which performs the process according to a program. The storage unit 60 is, for example, a RAM that performs temporary storage, a read-only ROM, a magnetic disk device, or the like, and is realized by a storage medium such as a portable magneto-optical disk or a memory card and its reader. Also good.

  In addition, an operation unit 62 for an operator to input an instruction to the substrate processing apparatus 1 and a display unit 63 for performing various displays are provided on the front surface of the housing of the control unit 6. The operation unit 62 is, for example, various switches (including a keyboard and a mouse), but may have a function of the display unit 6 like a touch panel display. The display unit 63 is realized by, for example, a liquid crystal display or various lamps.

  The control unit 6 is connected to each component of the main body 2 by a cable or an I / O interface (not shown), and is based on an instruction input from the operation unit 62 or a signal transmitted from each component of the main unit 2. The overall control of each part of the substrate processing apparatus 1 such as the lifting mechanisms 43 and 44 is performed.

  Next, the functional configuration of the control unit 6 will be described. FIG. 11 is a block diagram illustrating a functional configuration of the control unit 6 related to detection of abnormality in the bumper 415. In FIG. 11, the linear gauge control unit 601, the traveling mechanism control unit 602, the lifting mechanism control unit 603, the measurement control unit 604, the abnormality determination unit 605, and the abnormality notification unit 606 are controlled by the control unit 6 such as an I / O interface. It is a functional block which shows the function implement | achieved by running a control program, utilizing hardware. Although the lifting mechanism 43, the traveling mechanism 70, and the linear gauge 81 are not shown in FIG. 11, the control unit 6 controls the same as the lifting mechanism 44, the traveling mechanism 71, and the linear gauge 82. It is carried out.

  In FIG. 11, the linear gauge control unit 601 derives the vertical position of the measurement target from the detection result transmitted from the linear gauge 82.

  The travel mechanism control unit 602 acquires the position address AL transmitted from the linear encoder 79 and outputs a control signal to the linear servo motor 77. Further, the traveling mechanism control unit 602 moves the slit nozzle 41 to an arbitrary horizontal position by outputting a control signal to the linear servo motor 77 while monitoring the position address AL.

  The lifting mechanism control unit 603 obtains the position address AR transmitted from the rotary encoder 442 and outputs a control signal to the servo motor 440. Further, the elevating mechanism control unit 603 moves the slit nozzle 41 to an arbitrary vertical position by outputting a control signal to the servo motor 440 while monitoring the position address AR.

  The measurement control unit 604 acquires the position address AR when the vertical position of the discharge port 41c coincides with the holding surface 30 via the lifting mechanism control unit 603, and stores it in the storage unit 60 as the reference position address AR0. . Further, the measurement control unit 604 acquires a measurement value of the vertical position of the lower end surface 415a of the bumper 415 when the vertical position of the discharge port 41c coincides with the holding surface 30, via the linear gauge control unit 601, The initial interval L0 or the regular measurement time interval L1 is output and stored in the storage unit 60. Here, the “initial interval” is an interval between the lower end surface 415a and the discharge port 41c in a direction perpendicular to the holding surface 30 measured by an initial measurement performed in synchronization with the start of the operation of the substrate processing apparatus 1. The “periodic interval for regular measurement” is an interval between the lower end surface 415a and the discharge port 41c in a direction perpendicular to the holding surface 30, which is acquired by periodic measurement periodically performed during the operation of the substrate processing apparatus 1. It is. Hereinafter, the “initial interval” and the “periodic measurement interval” are also collectively referred to as “interval”.

  In the present embodiment, since the measured value of the vertical position of the discharge port 41c when the vertical position of the discharge port 41c matches the holding surface 30 is “0”, the measured value of the vertical position of the lower end surface 415a is The distance between the lower end surface 415a and the discharge port 41c in the direction perpendicular to the holding surface 30 is maintained.

  The abnormality determination unit 605 determines the presence or absence of abnormality in the bumper 415 based on the initial interval L0 and the regular measurement time interval L1 stored in the storage unit 60. More specifically, the abnormality determination unit 605 changes the interval with time (L1-L0) when the interval falls outside the allowable range (for example, 20 μm to 30 μm) and between the initial measurement and the regular measurement. ) Exceeds a predetermined threshold value, it is determined that an abnormality has occurred in the bumper 415. Here, the “allowable range” refers to the vertical position variation in the longitudinal direction of the slit nozzle 41 due to warpage due to its own weight, the flatness of the holding surface 30, the discharge port 41 and the surface 90 s of the substrate 90 at the time of resist coating. In consideration of the gap (typically several tens of μm), the slit nozzle 41 should be set in a range that can be reliably protected, and is not necessarily limited to the above-described specific value.

  When the abnormality determination unit 605 determines that the bumper 415 is abnormal, the abnormality notification unit 606 notifies the operator of the occurrence of the abnormality. The method for notifying the occurrence of an abnormality is not limited. For example, a visual method such as a warning display on the display unit 63 and an auditory method such as an alarm sound can be used as appropriate.

<2 Operator procedure>
The operation procedure of the operator in the substrate processing apparatus 1 will be described with reference to the flowchart of FIG.

  First, the operator determines whether or not the linear gauges 81 and 82 need to be calibrated (step S1). When calibration of the linear gauges 81 and 82 is necessary, the operator performs calibration of the linear gauges 81 and 82 (step S2), then cleans the discharge port 41c (step S3), and then the substrate processing apparatus 1 Is shifted to the automatic operation state (step S4). On the other hand, when calibration of the linear gauges 81 and 82 is not necessary, the operator cleans the discharge port 41c without performing calibration of the linear gauges 81 and 82 (step S3), and then automatically activates the substrate processing apparatus 1. The operation state is changed (step S4).

○ Linear gauge calibration;
Subsequently, the calibration work of the linear gauge 81 (82) will be described with reference to FIG. FIG. 13 is an enlarged view (side view) showing the state of the linear gauge 81 (82) during calibration.

  Prior to the automatic operation of the substrate processing apparatus 1, the linear gauge 81 (82) has a measured value “0” when the tip 813 (823) of the probe 811 (821) is at the same vertical position as the holding surface 30. (Or a predetermined value) is calibrated. In addition, when the front-end | tip 813 (823) exists in the predetermined | prescribed vertical position different from the holding surface 30, it is not prevented that it calibrates so that a measurement result may become predetermined value.

  Specifically, when calibrating the linear gauge 81 (82), the operator places a plate-shaped calibrator (calibration jig) 83 having a flat surface PL on the holding surface 30 and moves upward from the holding surface 30. The protruding measuring element 811 (821) is pushed downward using the calibrator 83. Here, if the surface in contact with the holding surface 30, that is, the surface that pushes down the measuring element 811 is set as the flat surface PL, the height of the tip 813 is maintained when the flat surface PL and the holding surface 30 are in close contact with each other. It becomes the same height as the surface 30. Then, the calibration of the linear gauge 81 (82) is completed by adjusting the measurement value of the linear gauge 81 (82) to “0” while maintaining this state.

<Operation of the substrate processing apparatus>
Hereinafter, the operation of the substrate processing apparatus 1 will be described. In the description, first, the initial measurement for measuring the initial interval L0 and the periodic measurement for measuring the periodic measurement time interval L1, which are the basis for detecting the abnormality of the bumper 415, are performed. Next, an overall operation flow related to the automatic operation of the substrate processing apparatus 1 will be described.

○ Initial measurement;
The operation of the substrate processing apparatus 1 when the initial measurement is performed will be described with reference to FIGS. 14 and 15. FIG. 14 is a flowchart showing an operation flow of the initial measurement, and FIG. 15 is a side view of the linear gauge 81 (82) and the slit nozzle 41 viewed from the side when the initial measurement is performed. Since the discharge port 41c is cleaned prior to the initial measurement (see FIG. 12), at the time of the initial measurement, the discharge port 41c is in a state in which an accurate vertical position can be measured by the linear gauges 81 and 82. It has become.

  As shown in FIG. 14, when the initial measurement is started, first, the measurement control unit 604, through the traveling mechanism control unit 602, slit nozzles so that the discharge port 41c is above the linear gauge 81 (82). 41 is moved horizontally, that is, the horizontal position of the discharge port 41c is matched with the horizontal position of the linear gauge 81 (82) (FIG. 15A) (step S101). Subsequently, the measurement control unit 604 finds the origin of the discharge port 41c (step S102). More specifically, the measurement control unit 604 lowers the slit nozzle 41 while monitoring the vertical position of the discharge port 41c via the linear gauge control unit 601 and the lifting mechanism control unit 603 (FIG. 15B). When the measured value of the vertical position of the discharge port 41c becomes “0”, the descent of the slit nozzle 41c is stopped (FIG. 15C). Then, the measurement control unit 604 acquires the position address AR at this time via the lifting mechanism control unit 603 and stores it in the storage unit 60 as the reference position address AR0 (step S103).

  Subsequently, the measurement control unit 604 horizontally moves the slit nozzle 41 via the traveling mechanism control unit 602 so that the lower end surface 415a of the bumper 415 is above the linear gauge 81 (82). The horizontal positions of the lower end surface 415a and the linear gauge 81 (82) are matched (FIG. 15 (d)) (step S104). At this time, for reasons such as preventing the discharge port 41c from being damaged by the linear gauge 81 (82), the slit nozzle 41 is once retracted upward before the horizontal movement, and after the horizontal movement, the slit nozzle 41 is moved before the horizontal movement. It is desirable to return to the vertical position. That is, the horizontal movement here may be a movement in which the vertical position of the discharge port 41c does not change before and after the movement, that is, the position address AR is maintained as the reference position address AR0. There are no restrictions on the route of travel.

  After the horizontal movement is completed, the measurement control unit 604 acquires the vertical position of the lower end surface 415a via the linear gauge control unit 601, and stores it in the storage unit 60 as the initial interval L0 (step S106). The operation flow ends.

  When the initial interval L0 at the time of past initial measurement is already stored in the storage unit 60, the old initial interval L0 is overwritten and updated with the newly obtained initial interval L0.

○ Regular measurement;
Below, operation | movement of the substrate processing apparatus 1 when a periodic measurement is performed is demonstrated, referring FIG. 16 and FIG. FIG. 16 is a flowchart showing an operation flow of periodic measurement, and FIG. 17 is a side view of the linear gauge 81 (82) and the slit nozzle 41 viewed from the side when the periodic measurement is performed.

  When the periodic measurement is started, the measurement control unit 604 horizontally moves the slit nozzle 41 via the traveling mechanism control unit 602 so that the lower end surface 415a of the bumper 415 is above the linear gauge 81 (82). That is, the horizontal position of the lower end surface 415a and the horizontal position of the linear gauge 81 (82) are matched (FIG. 17A) (step S201). Subsequently, the measurement control unit 604 sets a state where the discharge port 41c is at the same vertical position as the holding surface 30 by setting the position address AR to the reference position address AR0 via the lifting mechanism control unit 603. (FIG. 17B) (step S202), the measurement value of the vertical position of the lower end surface 415a at that time is stored in the storage unit 60 as the regular measurement interval L1 (step S203), and the operation flow of the regular measurement ends. To do. In the regular measurement, if the initial measurement shown in FIGS. 14 and 15 is performed again, the accurate regular measurement time interval L1 can be measured even if the vertical position of the nozzle 41 is shifted.

○ Automatic operation of substrate processing equipment;
Next, the operation flow of the substrate processing apparatus 1 when automatic operation is performed will be described with reference to the flowchart of FIG.

  First, when the substrate processing apparatus 1 starts automatic operation, first, the measurement controller 604 performs the above-described initial measurement (step S301), and the abnormality determination unit 605 includes the initial interval L0 within a predetermined allowable range. It is determined whether or not processing is performed, and the process is branched depending on the determination result. In step S302, if the initial interval L0 is within the allowable range (YES), the process proceeds to step S303. If the initial interval L0 is not within the allowable range (NO), the process proceeds to step S309, and the abnormality notification unit 606 performs an abnormality. Is notified to the operator, and the coating process is stopped. Through steps S301, S302, and S309, it can be determined whether or not the bumper 415 can protect the slit nozzle 41 in synchronization with the operation start of the substrate processing apparatus 1, and the bumper 415 cannot properly protect the slit nozzle 41. Can be recognized by the operator. Further, in the substrate processing apparatus 1, the coating process is automatically stopped when the bumper 415 cannot properly protect the slit nozzle 41.

  In step S303, the substrate 90 to be processed is carried into the holding area 91 of the holding surface 30 and is vacuum-sucked to the holding area 91 by a transport mechanism (not shown), and a resist coating process is performed on the surface 90s. The substrate 90 on which the resist coating has been completed is carried out to the next processing step by the transport mechanism (step S304).

  Subsequently, the substrate processing apparatus 1 branches the processing depending on whether or not the number of processed substrates after the previous initial measurement or regular measurement has reached a predetermined number (for example, 100) (step S305). If the number of processed substrates has reached a predetermined number (YES), periodic measurement is performed (step S306). If the number of processed substrates has not reached the predetermined number (NO), the process returns to step S303. The resist coating process on a new substrate 90 is started.

  With this operation, the substrate processing apparatus 1 performs periodic measurement each time a resist coating process is performed on a predetermined number of substrates 90.

  In step S305, branch processing is performed depending on whether the elapsed time since the previous initial measurement or periodic measurement has reached a predetermined time, not the number of substrates processed since the previous initial measurement or periodic measurement. If it has reached (YES), the process proceeds to step S306. If the predetermined time has not been reached (NO), the process may return to step S304. Thereby, regular measurement is performed for every progress of predetermined time.

  After the end of the regular measurement, the abnormality determination unit 605 determines whether or not the regular measurement time interval L1 is within a predetermined allowable range (step S307), and the process is branched depending on the determination result. In step S307, when the regular measurement time interval L1 is within the allowable range (YES), the process proceeds to step S308, and when outside the allowable range (NO), the process proceeds to step S309, and the abnormality notification unit 606 is reached. The operator is notified of the occurrence of an abnormality, and the coating process is stopped. From S306, S307, and S309, it can be periodically determined whether or not the bumper 415 can protect the slit nozzle 41, and the operator can recognize that the bumper 415 cannot properly protect the slit nozzle 41. Further, in the substrate processing apparatus 1, the coating process is automatically stopped when the bumper 415 cannot properly protect the slit nozzle 41.

  In step S308, the abnormality detection unit derives an interval change (L1-L0) over time from the initial measurement, and determines whether the interval change (L1-L0) exceeds a predetermined threshold value. Processing is branched according to the process. In step S308, when the interval change (L1-L0) does not exceed the predetermined threshold (NO), the process proceeds to step S304, and the substrate processing apparatus 1 resumes the resist coating process on a new substrate. The On the other hand, if the predetermined threshold value is exceeded (YES), the process proceeds to step S309, the abnormality notifying unit 606 notifies the operator of the occurrence of the abnormality, and the coating process is stopped. By steps S308 and S309, it is possible to detect that the fixing position of the bumper 415 with respect to the slit nozzle 41 is shifted during the operation of the substrate processing apparatus 1 due to loosening of a screw for fixing the bumper 415 or the like.

  With the operation flow as described above, the substrate processing apparatus 1 can manage the distance between the lower end portion 415a of the bumper 415 and the discharge port 41c of the slit nozzle 41 to reliably prevent the slit nozzle 41 from being damaged, It is possible to reliably prevent the substrate 90 normally held on the holding surface 30 from contacting the bumper 415 and damaging the substrate 90.

<4 Modification>
In the above-described embodiment, a rod-shaped member is shown as an example of the protective member. However, a wire or the like disposed on the substrate 90 in the traveling direction side of the slit nozzle 41 may be used as the protective member.

  In the above-described embodiment, the presence of the foreign matter is detected by detecting vibration caused by the interference between the protective member and the foreign matter. However, the movement or deformation of the protective member caused by the interference between the protective member and the foreign matter is electrically detected. Alternatively, the presence of a foreign substance or the like may be detected by detecting by an optical method.

1 is a perspective view showing an outline of a substrate processing apparatus 1 according to an embodiment of the present invention. It is the top view which looked at the main body 2 of the substrate processing apparatus 1 from upper direction. 2 is a front view of a main body 2 of the substrate processing apparatus 1. FIG. 2 is a side view of a main body 2 of the substrate processing apparatus 1. FIG. It is the top view which looked at the raising / lowering mechanism 44 from upper direction. 4 is a front view of the lifting mechanism 44. FIG. FIG. 6 is a cross-sectional view of the traveling mechanism 70 in the YZ plane. It is the side view which looked at the traveling mechanism 70 from the side. It is a side view which shows the structure of the linear gauge 81 (82). 4 is a side view of the slit nozzle 41. FIG. It is a block diagram which shows the functional structure of the control part 6 which concerns on the detection of abnormality of the bumper 415. FIG. 3 is a diagram illustrating an operator's work procedure in the substrate processing apparatus 1. It is a side view which shows the state of the linear gauge 81 (82) at the time of calibration. It is a flowchart which shows the operation | movement flow of an initial measurement. It is the side view which looked at the linear gauge 81 (82) and the slit nozzle 41 from the side when performing the initial measurement. It is a flowchart which shows the operation | movement flow of a regular measurement. It is the side view which looked at the linear gauge 81 (82) and the slit nozzle 41 from the side when performing regular measurement. 3 is a flowchart showing an operation flow of automatic operation of the substrate processing apparatus 1.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Main body 3 Stage 4 Bridged structure 6 Control part 41 Slit nozzle 415 Bumper 415
416 Vibration detection sensor 416
41c Discharge port 43, 44 Elevating mechanism 70, 71 Traveling mechanism 76, 77 Linear servo motor 78, 79 Linear encoder 81, 82 Linear gauge 90 Substrate 440 Servo motor 442 Rotary encoder

Claims (9)

A substrate processing apparatus for applying a treatment liquid to a surface of a substrate held on a holding surface,
A nozzle that is movable in a first direction parallel to the holding surface and that discharges the processing liquid to the substrate;
The second closest end, which is the closest end to the holding surface, is closer to the holding surface than the second closest end, which is the closest end to the holding surface of the nozzle. A nozzle protection member fixed to the nozzle on the first direction side than the contact end;
A linear gauge for measuring a vertical position of the first proximity end and the second proximity end in a second direction perpendicular to the holding surface;
Moving means for moving the nozzle and the nozzle protection member in the first direction and the second direction;
Controlling the moving means so that the vertical position of the first closest end is measured by the linear gauge after the vertical position of the second closest end is measured by the linear gauge; Control means for outputting a distance between a first closest end and the second closest end;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The control means includes
After the vertical position of the second closest end is measured by the linear gauge, the nozzle is retracted in the second direction, and then the horizontal position that is the position of the first proximity end in the first direction. The substrate processing apparatus controls the moving means so that the nozzle is horizontally moved so that the horizontal position of the linear gauge coincides with that of the linear gauge. In the substrate processing apparatus of Claim 1 or Claim 2,
A substrate processing apparatus that reports the occurrence of an abnormality when the interval is outside a predetermined range. The substrate processing apparatus according to claim 1, wherein:
A substrate processing apparatus, wherein an occurrence of an abnormality is notified when a change in the interval with time exceeds a predetermined threshold value. The substrate processing apparatus according to claim 1, wherein:
The substrate processing apparatus, wherein the coating process is stopped when the interval is out of a predetermined range. The substrate processing apparatus according to claim 1, wherein:
The substrate processing apparatus, wherein the coating process is stopped when a change in the interval with time exceeds a predetermined threshold value. The substrate processing apparatus according to any one of claims 1 to 6,
The substrate processing apparatus is characterized in that the interval is measured in synchronization with the start of operation of the substrate processing apparatus. The substrate processing apparatus according to any one of claims 1 to 7,
The substrate processing apparatus, wherein the interval is measured every time the coating process or a predetermined time elapses for a predetermined number of substrates. The substrate processing apparatus according to any one of claims 1 to 8,
The control means includes
The substrate processing apparatus, wherein the vertical position of the first proximity end when the vertical position of the second proximity end coincides with the holding surface is output as the interval.

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