JP4937784B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a technique for suppressing vibration of a slit nozzle that applies a processing liquid to a substrate. In particular, the present invention relates to a technique for changing a vibration having a relatively low frequency and a large amplitude into a vibration having a high frequency and a small amplitude.

  Application of treatment liquid such as photoresist on the surface of glass square substrate for liquid crystal, semiconductor wafer, flexible substrate for film liquid crystal, photomask substrate, color filter substrate, etc. (hereinafter referred to as “substrate”) There is a device. In addition, there are known a slit coater that performs slit coating using a slit nozzle having a slit-like discharge unit, and a slit & spin coater that rotates the substrate after the slit coating is performed once. .

  In a coating apparatus having such a slit nozzle, it is important to suppress vibration of the slit nozzle during the coating process (while moving the slit nozzle in the coating direction) in order to optimize the coating film thickness. It is. In general, since the slit nozzle performs a scanning operation with both ends supported, there is a problem that vibration is likely to occur in the front-rear direction or in the vertical direction. In particular, in recent years, the size of the substrate has increased, and the size of the slit nozzle in the major axis direction has increased, and vibration of the slit nozzle has become a problem.

  Conventionally, the vibration of the slit nozzle has been suppressed by increasing the rigidity of the slit nozzle.

JP 2004-014607 A

  However, in the solution method of simply increasing the rigidity of the slit nozzle, there is a problem that the weight of the slit nozzle increases, and the ability of a lifting mechanism (driving mechanism) that raises and lowers the slit nozzle has to be improved.

  The present invention has been made in view of the above problems, and an object of the present invention is to suppress the vibration of the slit nozzle without increasing the load on the lifting mechanism.

In order to solve the above problems, the invention of claim 1 is a substrate processing apparatus for applying a processing liquid to a substrate, wherein the nozzle mechanism discharges the processing liquid from a slit nozzle, and the nozzle mechanism is moved in the application direction. A pair of moving means; a connecting member for connecting the pair of moving means; a pair of driving means for moving the nozzle mechanism back and forth between a standby position and an application position; and the nozzle mechanism arranged at least at the application position. Vibration suppressing means for fixing to the connecting member, and the vibration suppressing means releases the fixing of the nozzle mechanism and the connecting member when the pair of driving means advances and retracts the nozzle mechanism. It is characterized by that.

According to the first aspect of the present invention, the vibration of the nozzle mechanism at least at the application position can be suppressed by fixing the nozzle mechanism arranged at least at the application position with respect to the connecting member. Accordingly, the coating accuracy is improved.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.

<1. First Embodiment>
FIG. 1 is an external view showing a substrate processing apparatus 1 according to the present invention.

  In FIG. 1, for the sake of illustration and explanation, the Z-axis direction is defined as the vertical direction and the XY plane is defined as the horizontal plane, but these are defined for convenience in order to grasp the positional relationship. The directions described below are not limited. The same applies to the following figures.

  In FIG. 1, in order to illustrate the nozzle mechanism 40, only the connection bracket 45 disposed in the (−X) direction of the nozzle mechanism 40 is illustrated, and the connection bracket 45 provided in the (+ X) direction is omitted. . In other words, the actual substrate processing apparatus 1 is provided with a pair of connection brackets 45 and is arranged in such a manner that the nozzle mechanism 40 is sandwiched between the front and rear in the X-axis direction.

  The substrate processing apparatus 1 uses a rectangular glass substrate for manufacturing a screen panel of a liquid crystal display device as a substrate 90 to be processed. In the process of selectively etching an electrode layer or the like formed on the surface of the substrate 90, the substrate 90 is processed. It is comprised as a coating device which apply | coats a resist liquid to the surface of this. Therefore, in this embodiment, the nozzle mechanism 40 discharges the resist solution to the substrate 90.

  In addition, the substrate processing apparatus 1 can be modified and used not only as a glass substrate for a liquid crystal display device but also as a device for applying a processing liquid (chemical solution) to various substrates for a flat panel display. Further, the shape of the substrate 90 is not limited to a rectangular shape.

  The substrate processing apparatus 1 includes a stage 3 that functions as a holding table for placing and holding the substrate to be processed 90 and also functions as a base for each attached mechanism. The stage 3 is made of an integral stone having a rectangular parallelepiped shape, and its upper surface (holding surface 30) and side surfaces are processed into flat surfaces.

  The upper surface of the stage 3 is a horizontal plane and serves as a holding surface 30 for the substrate 90. A large number of vacuum suction ports (not shown) are distributed and formed on the holding surface 30. While the substrate 90 is processed in the substrate processing apparatus 1, the vacuum suction port sucks the substrate 90, whereby the stage 3 holds the substrate 90 in a predetermined horizontal position.

  Above the stage 3, a bridging structure 4 is provided that extends substantially horizontally from both sides of the stage 3. The bridging structure 4 is mainly composed of a nozzle mechanism 40, elevating mechanisms 43 and 44 that support both ends thereof, a connecting bracket 45, and moving mechanisms 50 and 51.

  The nozzle mechanism 40 has a structure in which a slit nozzle 42 is attached to a nozzle support portion 41 that uses carbon fiber resin as an aggregate. That is, in the substrate processing apparatus 1 according to the present embodiment, the slit nozzle 42 is fixed to the nozzle support portion 41, whereby the rigidity of the slit nozzle 42 is increased.

  Although not shown in detail, the nozzle mechanism 40 is connected to a discharge mechanism including a pipe for supplying a chemical solution (resist solution) to the slit nozzle 42 and a resist pump. With such a configuration, the nozzle mechanism 40 discharges the resist solution from the slit (discharge port) of the slit nozzle 42.

  The slit nozzle 42 is supplied with a resist solution by the above-described resist pump, and scans the surface of the substrate 90 to thereby apply the resist solution to a predetermined region (hereinafter referred to as “coating region”) on the surface of the substrate 90. Discharge. In the present embodiment, the moving direction (coating direction) of the slit nozzle 42 in the coating process is the (−X) direction, but may of course be the (+ X) direction.

  The elevating mechanisms 43 and 44 are arranged separately on both sides of the slit nozzle 42. The elevating mechanisms 43 and 44 are used for moving the slit nozzle 42 in translation and adjusting the posture of the slit nozzle 42 in the YZ plane. That is, the elevating mechanisms 43 and 44 mainly correspond to a pair of drive mechanisms in the present invention.

  FIG. 2 is a view showing the lifting mechanism 44 and the housing 48.

  Each of the elevating mechanisms 43 and 44 includes a rotation motor 490, a ball screw 491, and a vertical mechanism 492. Hereinafter, the lifting mechanism 44 will be described with reference to FIG.

  The rotation motor 490 is an electric motor driven by a control signal from the control unit 7 and is fixed above the housing 48 by an attachment member (not shown). Further, the drive shaft of the rotary motor 490 is connected to a ball screw 491.

  The ball screw 491 is disposed in a direction in which the long axis direction is parallel to the Z-axis, passes through the housing 48, and is screwed into the vertical mechanism 492. The vertical mechanism 492 is provided with a screw hole (not shown) so as to penetrate in the Z-axis direction, and the above-described ball screw 491 is screwed therein. Furthermore, as shown in FIG. 2, the vertical mechanism 492 supports the (+ Y) side end portion of the nozzle support portion 41 (nozzle mechanism 40).

  With such a structure, when the rotary motor 490 rotates, the ball screw 491 rotates about the Z axis, and the vertical mechanism 492 moves up and down in the Z axis direction. Thereby, the substrate processing apparatus 1 can move the nozzle mechanism 40 forward and backward (up and down) with respect to the substrate 90 by the lifting mechanisms 43 and 44 as described above. In the present embodiment, the height position of the slit nozzle 42 when applying the resist solution to the substrate 90 is referred to as “application position”, and the other height positions are collectively referred to as “standby position”.

  The casing 48 is a hollow columnar member and is provided at the (+ Y) side end of the bridging structure 4. The casing 48 is fixed to the (+ Y) side end of the connection bracket 45 described later, and is fixed to the moving mechanism 51. The housing 47 shown in FIG. 1 has the same structure as the housing 48 and is fixed to the (−Y) side end portion of the connection bracket 45 described later and to the moving mechanism 50.

  Returning to FIG. 1, the connecting bracket 45 is a highly rigid plate-like member, and both ends in the Y-axis direction are fixed to the casings 47 and 48 as described above. However, the connection bracket 45 is not limited to a plate-like member, and may be a hollow pipe-like member.

  Further, a pair of moving mechanisms 50 and 51 arranged separately along the edge sides on both sides of the stage 3 are fixed to both ends of the bridging structure 4. Each of the moving mechanisms 50 and 51 includes an AC coreless linear motor (hereinafter simply referred to as “linear motor”) and a linear encoder.

  Each linear motor includes a stator and a mover (not shown), and generates a driving force for moving the bridging structure 4 (nozzle mechanism 40) in the X-axis direction by electromagnetic interaction between the stator and the mover. It is a motor to be generated. Further, the moving amount and moving direction by the linear motor can be controlled by a control signal from the control unit 7.

  Each linear encoder includes a scale unit and a detector (not shown), detects the relative positional relationship between the scale unit and the detector, and transmits the relative positional relationship to the control unit 7. Each detector is fixed to both ends of the bridging structure 4, and the scale portion is fixed to both sides of the stage 3. Thus, the linear encoder has a function of detecting the position of the bridging structure 4 in the X-axis direction.

  The moving mechanisms 50 and 51 are respectively fixed to the casings 47 and 48, and the casings 47 and 48 are fixed to the pair of connecting brackets 45. In other words, in the present embodiment, the pair of moving mechanisms 50 and 51 are connected via the casings 47 and 48 and the pair of connecting brackets 45, and these configurations mainly serve as the connecting members in the present invention. Constitute.

  The main reason for using such a connecting member is to reduce the load on the nozzle mechanism 40 (especially the slit nozzle 42) due to stagnation or the like generated by the pair of moving mechanisms 50 and 51 controlled independently. That is, in the substrate processing apparatus 1, it can be said that the framework of the bridge structure 4 is formed by the connecting member.

  FIG. 3 is a diagram illustrating the vibration suppressing unit 46 according to the first embodiment.

  The vibration suppression unit 46 includes an actuator 460, a drive shaft 461 and a fixed pad 462. The actuator 460 is a drive mechanism such as an air cylinder or a motor, for example, and has a function of moving the drive shaft 461 back and forth in the axial direction (X-axis direction). The actuator 460 is connected to the control unit 7, and its operation can be controlled by the control unit 7.

  The tip of the drive shaft 461 is fixed to the fixed pad 462. With such a configuration, the vibration suppression unit 46 can advance and retract the fixed pad 462 in the axial direction of the drive shaft 461. In the following description, a state where the fixed pad 462 is advanced (the drive shaft 461 is extended) is referred to as a “fixed state”, and a state where the fixed pad 462 is retracted (extended / extended) is referred to as an “open state”.

  FIG. 4 is an explanatory diagram showing a state in which the vibration suppression unit 46 is arranged at an intermediate position in the longitudinal direction of the slit nozzle 42. In FIG. 4, the slit nozzle 42 is disposed at the “application position”, and the slit nozzle 42 and the pair of connecting brackets 45 show a cross section in the XY plane. In addition, a pair of vibration suppression units 46 in the “fixed state” is shown in the upper part of FIG. 4, and a pair of vibration suppression units 46 in the “open state” is shown in the lower part.

  The “intermediate position” means an intermediate part excluding both ends, and does not mean a strict bisection position. The vibration suppressing unit 46 is provided somewhere in the intermediate position. In the present embodiment, among the intermediate positions, the position where the vibration suppression unit 46 is installed is determined by the following method.

  First, when the vibration suppression unit 46 is not used, the vibration mode generated in the nozzle mechanism 40 is obtained by numerical calculation, actual measurement, or the like, and “the position of the vibration antinode (position where the displacement due to vibration is the largest)” is obtained from the obtained vibration mode. Ask for. The vibration suppression unit 46 is provided at the position of the antinode of the vibration obtained in this way, and the nozzle mechanism 40 is fixed.

  When a plurality of types of vibration modes are obtained, the vibration suppression unit 46 is provided at the “position of vibration antinode” in the vibration mode most likely to occur. However, it is more effective to provide the vibration suppression unit 46 as much as possible at the “vibration antinode” in the obtained vibration mode.

  Thus, by providing and fixing the vibration suppression unit 46 at the position of the vibration antinode, the vibration frequency can be most effectively increased. In general, since the amplitude of vibration with a high frequency becomes small, the amplitude of vibration can be reduced by increasing the frequency of vibration.

  Explaining the influence of the vibration of the nozzle mechanism 40 on the coating process, when the moving nozzle mechanism 40 vibrates in the front-rear direction and the vertical direction along the moving direction, the amount of processing liquid supplied to the substrate 90 along with the vibration is increased. Unevenness and streaks occur. Such a stripe unevenness has a property that it becomes more prominent as the amplitude of vibration becomes larger.

  However, as described above, in the substrate processing apparatus 1 according to the present embodiment, the vibration suppression unit 46 is provided at the position of the vibration antinode and the nozzle mechanism 40 is fixed. Accuracy can be improved.

  The vibration suppression units 46 are respectively embedded in installation holes 45 a provided in the connection bracket 45. That is, the installation hole 45a has a function of determining the position of each vibration suppression unit 46.

  As shown in FIG. 4, the two vibration suppression units 46 constitute a pair of vibration suppression units 46, and the pair of vibration suppression units 46 are connected so that the individual vibration suppression units 46 are positioned to face each other. The bracket 45 is fixed.

  As described above, the slit nozzle 42 is moved up and down in the Z-axis direction by the lifting mechanisms 43 and 44. On the other hand, both the connecting brackets 45 are fixed to the casings 47 and 48 and do not move up and down. Accordingly, the position of the vibration suppression unit 46 fixed to the connection bracket 45 in the Z-axis direction is such that when the drive shaft 461 is protruded, the fixed pad 462 is brought into contact with at least the slit nozzle 42 disposed at the application position. It is a position that can be made to.

  The vibration suppression unit 46 advances the fixed pad 462 in the X-axis direction by the actuator 460 and the drive shaft 461, and causes the slit nozzle 42 (nozzle mechanism 40) at the application position to move from the front and rear in the X-axis direction to a pair of vibration suppression units 46. Press with (fixed pad 462). In this way, the vibration suppression unit 46 fixes the slit nozzle 42 to the connection bracket 45 (connection member).

  The substrate processing apparatus 1 in the present embodiment suppresses vibration when the slit nozzle 42 moves to the application position before scanning the surface of the substrate 90 while discharging the resist solution from the nozzle mechanism 40 (slit nozzle 42). The unit 46 is fixed. Then, the fixed state is maintained until the nozzle mechanism 40 completes the discharge of the resist solution. Thereby, while the slit nozzle 42 applies the resist solution, the slit nozzle 42 is fixed to the connection bracket 45, so that the rigidity of the slit nozzle 42 is improved and vibration is suppressed. In particular, since the vibration suppression unit 46 is installed at the position of the vibration antinode, the vibration amplitude can be more effectively suppressed.

  Further, the vibration suppression unit 46 in the fixed state opens the slit nozzle 42 from the connection bracket 45 by retracting the fixing pad 462. When the vibration suppression unit 46 is in the open state, the slit nozzle 42 can be lifted and lowered by the lifting mechanisms 43 and 44. That is, the substrate processing apparatus 1 opens the vibration suppression unit 46 when raising or lowering the nozzle mechanism 40 (slit nozzle 42) (or when waiting at the standby position). Therefore, it can be lifted and lowered without improving the specifications of the lifting mechanisms 43 and 44.

  Although details are not shown, the side of the fixed pad 462 that comes into contact with the slit nozzle 42 is composed of a member made of elastic hard rubber, and the side that joins the drive shaft 461 is a member of high rigidity such as metal. Consists of. As described above, the portion of the fixed pad 462 that is in contact with the slit nozzle 42 is made of a softer material than the material constituting the slit nozzle 42, thereby preventing the slit nozzle 42 from being damaged.

  Since the material of the fixed pad 462 is hard rubber, the fixed pad 462 can be slightly expanded and contracted in the X-axis direction, and can follow the displacement of the slit nozzle 42 in the X-axis direction. Therefore, even when the slit nozzle 42 vibrates in the X-axis direction, if the vibration amplitude is very small with respect to the expansion / contraction length of the fixed pad, the fixed pad 462 is the slit nozzle in the vibration suppression unit 46 in the fixed state. The separation from 42 can be prevented. That is, since it is possible to prevent the slit nozzle 42 and the fixed pad 462 from repeating the collision due to vibration, it is possible to suppress the occurrence of further vibration due to the collision.

  The elastic body of the fixed pad 462 may be a spring or the like. In addition, the side that contacts the slit nozzle 42 is not necessarily an elastic body, and a damper structure may be provided by providing an elastic body on the drive shaft 461 side. In FIG. 4, two pairs (four) of vibration suppression units 46 are illustrated, but the number of vibration suppression units 46 is not limited to this.

  As described above, the substrate processing apparatus 1 according to the first embodiment includes the nozzle mechanism 40 that discharges the resist solution from the slit nozzle 42 and the pair of moving mechanisms 50 and 51 that move the nozzle mechanism 40 in the coating direction. A connecting bracket 45 for connecting a pair of moving mechanisms 50 and 51, a pair of elevating mechanisms 43 and 44 for moving the nozzle mechanism 40 back and forth between a standby position and a coating position, and a nozzle mechanism 40 disposed at least at the coating position. By providing the vibration suppressing unit 46 that is fixed to the connection bracket 45, vibration of the nozzle mechanism 40 at least at the application position can be suppressed. Accordingly, the coating accuracy is improved.

  Further, the vibration suppression unit 46 releases the fixing of the nozzle mechanism 40 and the connecting bracket 45 when the pair of lifting mechanisms 43 and 44 moves the nozzle mechanism 40 forward and backward (lifts and lowers). Since it is not necessary to improve the specifications, the cost of the substrate processing apparatus 1 can be suppressed.

  Further, the vibration suppression unit 46 includes an elastic fixing pad 462 so that the nozzle mechanism 40 and the like are not damaged when the vibration suppressing unit 46 is fixed. In addition, since a force in the opposite direction to the vibration displacement direction can be applied, the generated vibration can be effectively attenuated.

<2. Second Embodiment>
One vibration suppression unit 46 in the first embodiment has a structure in which the slit nozzle 42 is pressed from one side in the X-axis direction, and in order to effectively suppress vibration in the X-axis direction, a pair of vibration suppression units 46 were arranged facing each other. However, the vibration suppressing means in the present invention is not limited to such a structure.

  FIG. 5 is a diagram illustrating a vibration suppression unit 46a according to the second embodiment. FIGS. 6 and 7 are views showing a state in which the vibration suppressing unit 46a in the second embodiment fixes the slit nozzle 42 and the connecting bracket 45. FIG.

  The vibration suppression unit 46 a in the second embodiment includes an actuator 460 a and fixed pads 462 a and b instead of the actuator 460 and the fixed pad 462 of the vibration suppression unit 46.

  The actuator 460a is a drive mechanism capable of rotating not only the drive shaft 461 in the axial direction but also rotating around the drive shaft 461.

  The fixed pads 462a and 462b have substantially the same shape as the YZ plane in FIG. 5, are long in the Y-axis direction, and short in the Z-axis direction. A drive shaft 461 is fixed at the center of the fixed pad 462b. Therefore, when the drive shaft 461 rotates, the fixed pads 462a and 462b rotate in the YZ plane around the drive shaft 461.

  Further, as shown in FIGS. 6 and 7, a groove 463 is provided between the fixed pad 462a on the distal end side and the fixed pad 462b on the actuator 460a side. As shown in FIG. 6, the opening width in the X-axis direction of the groove 463 is formed so as to become wider from an axis parallel to the Y-axis passing through the rotation center. That is, the opening width of the groove 463 is narrowest at both ends in the Y-axis direction, and is widest at both ends in the Z-axis direction.

  As shown in FIG. 6, when the vibration suppressing unit 46a in the second embodiment is in the fixed state, first, the drive shaft 461 is extended in the axial direction, and the fixed pad 462a is connected to the connecting hole 42a of the slit nozzle 42. To enter. Although not shown, the opening shape of the connecting hole 42a is a substantially oval shape according to the shape of the fixed pad 462a. In this state, the opening width of the groove 463 is wider than the thickness of the thin opening portion 42b of the slit nozzle 42 in the X-axis direction.

  Next, as shown in FIG. 7, the actuator 460 a rotates the drive shaft 461. Thereby, the thin opening portion 42 b of the slit nozzle 42 enters the groove 463. In other words, the opening thin portion 42b is fixed by being sandwiched between the fixing pad 462a and the fixing pad 462b.

  As described above, in the substrate processing apparatus 1 according to the second embodiment, the slit nozzle 42 and the connection bracket 45 are fixed by the vibration suppressing unit 46 a disposed on one side of the slit nozzle 42 in the X-axis direction.

  As described above, even when the vibration suppression unit 46a according to the second embodiment is used, the same effects as those of the substrate processing apparatus 1 according to the first embodiment can be obtained.

<3. Modification>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.

  For example, the vibration suppression units 46 and 46 a may be configured such that the fixed pad 462 contacts the nozzle support portion 41. In the substrate processing apparatus 1, the nozzle support portion 41 and the slit nozzle 42 move in a fixed state (integrated structure). Therefore, even when the vibration suppression units 46 and 46a fix the nozzle support portion 41, the vibration of the slit nozzle 42 can be suppressed.

  Further, the vibration suppression units 46 and 46a may be provided on the nozzle mechanism 40 (slit nozzle 42) side. In this case, the weight to be lifted / lowered together with the slit nozzle 42 (portable weight of the lifting / lowering mechanisms 43 and 44) is increased by the vibration suppression units 46 and 46a. However, since the vibration suppression units 46 and 46a are relatively small units, the increase is relatively small, so it can be said that the influence on the specifications of the elevating mechanisms 43 and 44 is small.

  Further, like the vibration suppression unit 46a shown in the second embodiment, the structure in which both directions of the slit nozzle 42 are fixed from one side is provided by providing a spiral groove on the cylindrical surface of the drive shaft 461. 461 may be a “screw”, and a screw hole may be provided on the slit nozzle 42 side. In this case, the actuator 460 rotates toward the slit nozzle 42 while rotating the drive shaft 461, and is fixed by screwing the drive shaft 461 into the screw hole.

  Alternatively, a member corresponding to the connection bracket 45 may be newly provided above the slit nozzle 42, and the vibration suppression unit 46a may be fixed to the member to fix the slit nozzle 42 above. In this case, the vertical vibration of the slit nozzle 42 can be effectively suppressed.

  In addition, in order to suppress the vertical vibration of the slit nozzle 42, a member corresponding to the connection bracket 45 is newly provided above and below the slit nozzle 42, and the pair of vibration suppression units 46 are opposed to the member. The slit nozzle 42 may be fixed so that the vertical direction of the slit nozzle 42 is fixed.

1 is an external view showing a substrate processing apparatus according to the present invention. It is a figure which shows an raising / lowering mechanism and a housing | casing. It is a figure which shows the vibration suppression unit in 1st Embodiment. It is explanatory drawing which shows the state by which the vibration suppression unit is arrange | positioned in the intermediate position of the longitudinal direction of a slit nozzle. It is a figure which shows the vibration suppression unit in 2nd Embodiment. It is the figure which showed a mode that the vibration suppression unit in 2nd Embodiment fixes a slit nozzle and a connection bracket. It is the figure which showed a mode that the vibration suppression unit in 2nd Embodiment fixes a slit nozzle and a connection bracket.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 4 Bridging structure 40 Nozzle mechanism 41 Nozzle support part 42 Slit nozzle 42a Connection hole 42b Opening thin part 43,44 Lifting mechanism 45 Connection bracket 45a Installation hole 46,46a Vibration suppression unit 460,460a Actuator 461 Drive shaft 462 462a, 462b Fixed pad 463 Groove 47, 48 Housing 50, 51 Moving mechanism 7 Control unit 90 Substrate

Claims (1)

A substrate processing apparatus for applying a processing liquid to a substrate,
A nozzle mechanism for discharging the processing liquid from the slit nozzle;
A pair of moving means for moving the nozzle mechanism in the coating direction;
A connecting member for connecting the pair of moving means;
A pair of drive means for moving the nozzle mechanism back and forth between the standby position and the application position;
Vibration suppression means for fixing the nozzle mechanism disposed at least at the application position to the connecting member;
With
The substrate processing apparatus, wherein the vibration suppressing means releases the fixation between the nozzle mechanism and the connecting member when the pair of driving means advances and retracts the nozzle mechanism.

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