1234797 玖、發明說明： 【發明所屬之技術領域】 本發明係關於-包含噴嘴清掃裝置及具備該噴嘴清掃裝置 之基板處理裝置，紐j於i彳級祕就基板表I之 -處J里後供典噴嘴。 【先前技術】 一將處理液供應至半導體晶圓、液晶顯示面板用玻璃基板或 半導造裝置用光罩基板等基板而處理之基板處理裝置， 係使用藉由一面從開缝狀之吐出口吐出處理液，一面對基板 相對地移動之方式，將處理液供應至基板表面之處理液供應 噴嘴時，隨著基板處理，夺i理炙供應1嘴中的開缝 口1通ϋ—留_直_處1液，其形成污染物質而產生處理液供應 賣觜之污染。使用光阻，尤其含有稱為彩色光阻等之顏料的 光阻，當作處理液時，尤其容易產生如此之污染。因此，必 須着由噴嘴—清掃裝置定期地清掃處理液供應喷嘴。 如此之噴嘴清掃裝置，4前係將清潔用之拂拭構件抵接在 處理液供應噴嘴，形成藉由該拂拭構件清掃處理液供應噴嘴 之構成。然後，於如此之噴嘴清掃裝置，使用捲繞在傳送滾 筒和捲繞滾筒之間的長拂拭構件（例如，參照特許文獻〇。 [特許文獻1] 曰本特開2001-1 13213號公報 近年來，由於基板尺寸變大，處理液供應噴嘴中的開缝狀 吐出口之全長，亦有變長之傾向。因此，於先前之噴嘴清掃 裝置，產生拂拭構件之消耗量變多，成本增加之問題。 87695 -6 - 1234797 本發明係為了解決上述課題而研發者，其目的在於提供 面確實地清掃處理液供 包含嘴嘴清择裝置及具備該噴嘴清掃裝置之基板處理裝置 其可一面降低拂拭構件之消耗量， 應噴嘴。 【發明内容】 一申請專利範圍第巧之發明係…#嘴清掃裝置，其特徵為 藉由一面從開縫狀之吐出吐出# 、、· 梦击、 土岀口吐出處理硬，-面對基板相對地 夕力<万式，料清掃將處理液供應至前述基板表面之處理 =應喷嘴，其包含♦•傳送滾筒，捲繞有長拂拭構件；捲繞 …捲繞從前述傳送滾筒送出至前述處理液供應噴嘴中的 =出口之長度方向之拂拭構件；旋轉機構，旋轉前述捲繞滾 同，弟二青掃機構，藉由將從前述傳送滾筒送出之拂拭構件 抵接在前述處理液供應噴嘴之方式，清掃前述處理液供應嗜 嘴；和第2清掃機構，於藉由前述第味掃機構清掃前述處理 液=射嘴之前，使藉由從前述傳送滾筒送出之拂拭構件中 、J h第1 知機構〈作用而抵接在前述處理液供應喷嘴後 的區域，释由抵接在前述處理液供應嘴嘴之方式，預先 前述處理液供應噴赏。 -......................................... 申請專利範圍第2項之發明係一喷嘴清掃裝 藉由一面從開縫狀之吐出口吐出虛為 土出處理硬，一面對基板相對地 移動（万式，用於清掃將處理液供應至前述基板表面之處理 液供應喷嘴，其包含：拂拭部，其包含：傳送滾筒，捲繞長 拂拭構件，捲繞㈣，捲繞從前述傳送㈣送出至前述處理 液供應喷嘴中的吐出口之長度方向之拂拭構件；旋轉機構， 87695 1234797 硬轉前述捲 〜η ,不娜才幾構， 以 =抵接於前述處理液供應”之前迷:栻二=7 中的前述傳送滾筒和前述捲繞 牛口夕動路控 機構，配設在用於將前述拂拭構件抵^^置；和第2清掃 嘴夕a $祕κ 件抵接於前述處理液佯廡啥 k則迷拂拭構件之移動路徑中的前 之^貧 捲繞滾筒之間的位置；和移 /知機構和前述 處理液供應嘴嘴中的吐出 μ述拂拭構件在前述 ,, 度万向來回移動。 專利範圍第3項之發明，係根 發明，前述第2清掃機構係於前 把園心頁疋 滾筒之拂拭構件的捲繞方向同— //Μ至與前述捲繞 —理液供應噴嘴，於前述拂栻部移動至 _ 农筒之拂拭構件的捲繞方向反方 ^ /、則以捲，兀 述處理液供應噴嘴㈣。 °，’將料拂拭構件從前 _請專利範圍第4項之發明，+ 發明，前述旋轉機構係於前述拂令請專利範園第3項之 之拂拭構件的捲繞方向同—方向^移動至與前述捲繞滾筒 中請專利範圍第5項之發明 捲m 双π0孙 係根據中請專利範圍第3項之 1月，其具備旋轉限制機構， 、 袪一^、μ 〗述拂拭部移動至與前述捲 %浓同芡拂拭構件的捲繞方向 之旋轉。 〇反万向時，限制前述捲出滾筒 申請專利範圍第6項之發明，传相诚士 · ..,Jif . ^ , 係根據申請專利範圍第1項至- 罘5項弋任一項發明，前述 抵接在前述處理液供應喷嘴之;;機面構包含將前述拂拭構件 貧倒角面的第1推壓構件，和將 心拂拭構件抵接在前述處㈣ 87695 1234797 【實施方式】 以下’根據圖式說明本發明之實施型態。 首先，就明關於適用本發明相關之噴嘴清掃裝置1 8之基板 處理裝置之構成。圖1係適用本發明相關之噴嘴清掃裝置之 基板處理裝置概要圖。 本基板處理裝置係用於在形成矩形之液晶面板用之彩色基 板（以下稱作「基板」）w塗佈稱為彩色光阻之顏料的光阻者， 其包含：在吸附保持基板w之狀態藉由驅動馬達u而以軸12 為中心旋轉之旋轉夹頭13、於將光阻塗佈於保持在旋轉夾 頭13之基板W的處理液供應喷嘴14、移動該處理液供應喷嘴 14之噴嘴移動機構15、對處理液供應噴嘴⑽應光阻之光阻 供應機構16、於旋轉藉由旋轉夾頭13塗佈光阻後之基板料 用於捕獲從基板w端緣飛散之綠的綠捕獲用杯件17、本 發明相關之噴嘴清掃裝置丨8。 上述旋轉夹頭U及軸12係藉由不圖示之夾頭升降機構，而 形成可在圖丨以實線表示之旋轉位置和匕點料表示之塗 饰位置<間升降。此處，旋轉位置係將塗佈光阻後之基板W 收容在杯件17而旋轉之位置，而塗佈位置係藉由處㈣供應 喷> 14將光阻塗佈在基板％之位置。 上乂賣背和動機構15具備沿著水平地延伸之移動導件^而 來回移動〈移動框22。處理液供應喷嘴以係介置以喷嘴支持 框23而於水平方向以可自由移動方式支持在該移動框22。炊 後，上述噴嘴移動機構15不具備於上下方向移動之機構。因 此’可防止處理液供應喷嘴14沿著移動導件η移動時，處理 87695 1234797 =供應噴嘴u和基板w之距離變動。因而，使處理液供應喷 嘴14水平移動而將綠塗佈在基板w時，可形成均等厚^ 塗佈膜。 上述光阻供應機構16包含具有密閉之構成的加壓槽^，和 收容在該加壓槽24内之光阻槽25。加壓槽㈣藉由加壓配管 27而與不圖示之氮氣或氣體供應源連接。然後，該加壓配管 27内配設有氮氣給排切換用之三通閥28.，和調節器μ。且， 光阻槽25内插入有與該光阻槽25和處理液供應噴嘴μ連接之 光阻供應配管31之-端。該光阻供應配管31中配設有開閉闕 33 〇 於具有如此構成之光阻供應機構16，開閉閥33處於開放狀 態時’光阻槽25内之光阻係介置以光阻供應配管加藉由加 壓槽24内之氮氣壓力壓送至處理液供應噴嘴丨4，且藉由關閉 開閉閥3 3之方式而停止壓送光阻。 圖2係以模型方式表示處理液供應噴嘴14之光阻供應動作 說明圖。該處理液供應噴嘴14具有延伸至該長度方向（於圖2 之垂直於紙面之方向）之開縫狀吐出口34。該吐出口 34之長 度方向之長度，係基板W中的矩形元件形成部分之短邊長度 以上之長度，但此處設定成和前述矩形元件形成部分之短邊 長度大致相等。如圖2所示，藉由光阻供應配管31供應之光 阻3 5係介置以該開縫狀吐出口 34而供應至基板w表面。 圖3係處理液供應嘴嘴14之下端部放大圖。如該圖所示， 該處理液供應喷嘴14具備傾斜之側面39，用於將附著於該處 之光阻35之量設定成最小。於該圖，符號38係形成吐出口 34 87695 -12· 1234797 又唇緣面。孩唇緣面38構成側面39之下端部。 接著口兒明關於藉由上述基板處理裝置而將光阻塗佈在基 ^ ^ $作1 4係表示藉由基板處理裝置在基板^塗 光阻之塗佈動作說明圖。然後，根據以下說明，處理液供 底貪觜14之移動係藉由上述噴嘴移動機構工$實行。 万、貝行光阻塗佈動作之前的狀態，處理液供應喷嘴14係配 <在铃本發明相關之嘴嘴清掃裝置^ 8相對之位置。關於此時 〈處理’夜供應噴嘴14等之狀態，隨後詳細地說明。 於S狀悲，開始光阻之塗佈動作時，在喷嘴清掃裝置1 8上 方使處理液供應噴嘴14從待機狀態，如箭頭①所示，使處理 液供應#嘴14對嘴嘴清掃|置j 8水平移重力至遠方側之基板w <一端上万。接著，藉由夾頭升降機構將基板w配設在塗佈 位置。此時，基板冒表面和處理液供應喷嘴14之吐出口 “之 間隔’係形成適於塗佈光阻之特定值。 於孩狀態’從處理液供應喷嘴14中的開縫狀吐出口 34吐出 光阻，同時如箭頭②所示，使處理液供應噴嘴14沿著基板w 表面水平私動。於該狀態，如圖2所示，將從處理液供應噴 觜14中的開縫狀吐出口 34吐出之光阻35 ,在基板w表面塗佈 成薄膜狀。 處理液供應噴嘴14中的開縫狀吐出口 34移動至與基板w另 一端部相對之位置時，停止從處理液供應噴嘴14中的開縫狀 吐出口 34吐出光阻，而移動至噴嘴清掃裝置18上方。 接著’說明關於本發明相關之喷嘴清掃裝置丨8之構成。圖 5係同時表示本發明相關之喷嘴清掃裝置18和待機筒件36之 87695 • 13 - 1234797 側視圖。 該噴嘴清絲置18包含：&架42，可沿著與上述處理液供 應喷嘴14平行地配設之軌條41移動；馬達料，藉由使和該托 架42連結之同步皮帶43來时轉之方式，而使減42和處理 液供應喷嘴U平行地來回移動；和拂拭部45，配設在按架42 上方。如後述，該拂拭部45係用於拂拭處理液供應噴嘴丨斗中 的開縫狀吐出口 34者。該拂拭部45係藉由驅動馬達44，而於 圖5以實線所示之位置和以二點鎖線所示之位置之間來回移 動0 另-方面，待機筒件36係於不塗佈光阻之狀態，用於防止 處理液供應噴嘴14中的開縫狀吐出口34附近之光阻乾燥而變 質者。該待機筒件36之㈣例如儲存有溶解綠之溶劑等。 該待機筒件36係藉由驅動汽筒37，而形成可於圖5以二點鎖 線所示之該上端開π部與處理液供應噴嘴14中的開縫狀吐出 口 34相對之上升位置，和以實線所示之下降位置之間升降之 構成。因此，於使處理液供應噴嘴14在喷嘴清掃裝Μ上方 待機之狀態’待機筒件36處於上升位置時，處理液供應喷嘴 14《吐出口 34形成露出在藉由待機筒件％關閉之空間。此 時’由於該空間充滿含有溶劑蒸汽之氣體’因此可防止吐出 口 34附近之光阻乾燥。 ▲接著，說明關於上述拂拭部45之構成。圖㈣拂拭部伙 則視圖，，請拂拭部45之側面剖視圖^係拂拭部伙俯 :圖2之圖ί。於圖7及圖8 ’為了便於說明而省略部分拂拭構 87695 -14- 1234797 該拂拭構件45包含··外殼51、捲繞有長拂拭構件52之傳送 滾筒53、捲繞從傳送滾筒53送出之拂拭構件52的捲繞滾筒 54、將洗净液供應至拂拭構件52之洗淨液供應噴嘴55、56、 第1、第2清掃機構57、58。然後，在拂拭構件52使用薄板狀 <多孔性物質。如此之多孔性物質可使用濾紙等紙或不織布 等布或樹脂。 在傳送滾筒53之軸61附設有齒輪62。該齒輪62係介置以齒 輪63而與旋轉阻尼器等張力產生構件64連結。因此，傳送滾 筒53係於具有特定阻力之狀態旋轉。 且，如圖9所示，於附設在傳送滾筒53之軸61的齒輪“下 方，配設有用於限制旋轉傳送滾筒53之旋轉限制機構67。該 旋轉限制機構67具備連結在汽筒66之筒桿的齒條構件65。該 齒條構件65係藉由驅動汽筒66，於圖9以實線所示之待機位 置，和圖9以假設線所示之限制位置之間升降。於齒條構件65 配設在限制位置之狀態，齒條構件65和齒輪62咬合而限制旋 轉傳送液筒5 3。 再度參照圖6至圖8,捲繞滾筒54之軸71係介置以耦合器72 而與馬達73之軸74連結。因此，捲繞滾筒⑽藉由驅動馬達 73而旋轉。 於從傳送滾筒53到捲繞滾筒54之拂拭構件52下方之位置， 即拂拭構件52之移動路徑中的傳送滾筒53和捲繞滾筒批間 之位置’配設有第1清掃機構57，用於藉由朝向處理液供應 噴嘴Μ推㈣拭構件52之以，使㈣構件52抵接在處理液 供應噴嘴14。 87695 -15- 1234797 以下，說明關於第i清掃機構57之構成。圖1〇係表示第1清 掃機構57之構成之說明圖，圖U係表示該主要部之立體圖。 然後’圖10(a)係取下第丨清掃機構57之外殼75所見之俯視 圖’圖i〇(b)係第丨清掃機構57之縱向剖視圖，圖i〇(c)係第1 清掃機構57之側視圖。且，於圖丨丨，以假設線表現第i清掃 機構57之外殼75。 該第1清掃機構57係用於將從傳送滾筒53送出之拂拭構件 52抵接在處理液供應噴嘴14而清掃處理液供應噴嘴14者，其 包含·外殼75、該下端部收容在該外殼75内之一對第丨推壓 構件76、該下端部收容在外殼75内之第2推壓構件77、支持 板80。用於將洗淨液供應至上述拂拭構件52之洗淨液供應噴 嘴55(參照圖8)係配設在該第}清掃機構57上方。 前述第1推壓構件76係使用於將拂拭構件52抵接在處理液 供應噴嘴14之唇緣面38者。該第丨推壓構件％之該頭部形成 倒角成圓弧形之彎曲形，於後述處理液供應噴嘴14之清掃步 驟’用於緩和與處理液供應喷嘴丨4接觸時之衝擊。然後，亦 可設定成推拔狀代替彎曲形。 忒第1推壓構件76下面和支持板80之間，配設有使第i推壓 構件76彈壓至拂拭構件52方向之一對彈簧82。且，第丨推壓 構件76下端部形成有用於防止第丨推壓構件％從外殼乃脫出 之凸部8 1。 前述第2推壓構件77係使用於將拂拭構件52抵接在處理液 供應噴嘴14之側面39者。該第2推壓構件77形成有對應於處 理液供應噴嘴14之側面39之形狀的凹部78。且，該第2推壓 87695 -16- 1234797 構件77之孩頭邵亦形成倒角成圓弧形之彎曲形，於後述處理 液供應喷嘴14之清掃步驟，用於緩和與處理液供應噴嘴μ接 觸時之衝擊。 該第2推壓構件77下面和支持板8〇之間，配設有使第2推壓 構件77彈壓至拂拭構件52方向之一對彈簧“。且，第2推壓 構件77下端部形成有用於防止第2推壓構件77從外殼乃脫出 之凸部84。再者，外殼75内部配設有可對外殼乃滑動之一對 移動構件85，該移動構件85和第2推壓構件”之間配設有一 對彈簧86。 藉由該等彈簧83、86及移動構件85之作用，以可移動方式 支持第2推壓構件77。即，藉由彈簧83、86及移動構件以之 作用，於將後述清掃步驟中的拂拭部45之移動方向當作圖 及圖11所示之X方向時，以可移動至γ方向及z方向之方式支 持該第2推壓構件77。藉此，即使第丨清掃機構57和處理液供 應喷嘴14之位置精確度有誤差時，仍可與形成在第2推壓構 件77之凹部78和處理液供應喷嘴14之側面39確實地抵接。 第2推壓構件77上端部形成有一對引導部79。該一對引導 部79係用於引導藉由捲出滾筒53捲出之拂拭構件52之兩端 者。即，如圖12(a)所示，該等一對引導部77係配設成互相 地隔開與拂拭構件52之寬度大致同一距離，I有和拂拭構件 52兩端抵接之構成。因此，藉由該等引導部之作用，可有效 地防止拂拭構件52從第2推壓構件77上部之位置脫離。 然後，於後述清掃步驟，處理液供應噴嘴14和第2推壓構 件77介置以拂拭構件52而處於抵接狀態時，如圖i2(b)所示， 87695 -17- 1234797 藉由處理液供應噴嘴14之側面39推壓拂拭構件52，而進入第 2推壓構件77中的凹部78内。 再度參照圖6至圖8，於拂拭構件52之移動路徑中的第丄清 掃機構57和捲繞滾筒54之間之位置，配設有第2清掃機構μ， 用於藉由再度朝向處理液供應喷嘴14推壓暫時和處理液供應 噴嘴14抵接後之拂拭構件52的方式，使該拂拭構件52抵接在 處理液供應噴嘴14。 該第2清掃機構58具備用於引導拂拭構件52之固定引導滾 琦87及升降引導滾筒88。以可旋轉方式將固定引導滾筒^了支 持在外殼51。另一方面，藉由驅動汽筒9〇而以可旋轉方式將 升降引導滾筒88支持在升降之大致l字形托架89前端。因 此，升降引導滾筒88係藉由驅動汽筒9〇 ,於圖6以實線表示 之清掃位置，和以假設線表示之退避位置之間升降。此處， 該清掃位置係升降引導滾筒88將拂拭構件52抵接在處理液供 應噴14之唇緣面3 8 ’藉由拂拭構件5 2清掃該處之位置。然 傻’用於將洗淨液供應至上述拂拭構件5 2之洗淨液供應噴嘴 56，係配設在該升降引導滾筒88之側方。 然後’於上述拂拭邵45 ’將第1、第2清掃機構5 7、5 8等與 傳送滾筒5 3或捲繞滾筒5 4等同時地採用可裝卸之卡匣機構。 接著，說明關於本發明相關之噴嘴清掃裝置丨8之處理液供 應喷嘴14之清掃動作。 使用該噴嘴清掃裝置實行處理液供應噴嘴14之清掃動作 時，於處理液供應喷嘴14位於清掃機構18上方之狀態，待機 筒件36於圖5從以二點鎖線所示之上升位置下降至以實線表 87695 -18- 1234797 不I下降位置。且’拂拭部45停止在圖5以假設線表示之移 動行程右端之位置。該位置係拂拭構件视設在傳送滾筒^ 側端部之位置。 然後，藉由驅動馬達44，拂拭部45和托架42同時地開始移 動至圖5所不〈左方。該方向係與處理液供應噴嘴μ中的開 縫狀吐出口 34平行之方向，係與捲繞滾筒54之拂拭構件52的 捲繞方向同一方向。且，於拂拭構件52朝向左方移動時，使 第2清掃機構58之升降料滾_配設在圖化實線表示之清 掃位置。 於該狀態繼續移動拂拭部45時，最初，處理液供應噴嘴Μ 《唇緣面38和拂拭構件52藉由第2清掃機構58中的升降引導 滾筒88之作用抵接，而藉由拂拭構件52預先清掃處理液供應 喷嘴14之唇緣面38。於該預先清掃步驟，對應必要而從洗淨 液供應喷嘴56將洗淨液供應至拂拭構件52。 此時，使用於該預先清掃之拂拭構件52如後述，係於其以 前之清掃步驟，已使用於藉由第丨清掃機構57清掃處理液供 應喷嘴14之唇緣面38及側面39之部分。因而，使用於該預先 清掃之拂拭構件52由於光阻而受到某種程度之污染，但由於 其後實行第1清掃機構57之清掃，因此於預先清掃步驟，該 程度之污染不會造成問題。 然後，進一步繼續移動拂拭部45時，處理液供應噴嘴14和 拂拭構件52藉由第1清掃機構57之作用抵接，而藉由拂拭構 件5 2正式清掃處理液供應嘴嘴14。 參知、圖1 3詳細地說明關於讀弟1清掃機構$ 7之清掃動作。 87695 -19- 1234797 1 4之清掃動作 模型圖。1234797 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a device including a nozzle cleaning device and a substrate processing device provided with the nozzle cleaning device. Supply code nozzle. [Prior art] A substrate processing apparatus that supplies a processing liquid to a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display panel, or a photomask substrate for a semi-conductor device, and processes the substrate through a slit-shaped ejection outlet. When the processing liquid is discharged and the substrate is moved relatively to the substrate, the processing liquid is supplied to the processing liquid supply nozzle on the surface of the substrate. As the substrate is processed, the slit opening 1 in the mouth of the supply nozzle is opened. There is 1 liquid at _Straight_, which forms a contaminated substance and causes contamination of the supply of processing liquid. When using a photoresist, especially a photoresist containing a pigment such as a color photoresist, it is particularly prone to such contamination when used as a treatment liquid. Therefore, it is necessary to periodically clean the processing liquid supply nozzle by the nozzle-sweeping device. In such a nozzle cleaning device, the front part is formed by abutting the wiping member for cleaning against the processing liquid supply nozzle, and cleaning the processing liquid supply nozzle by the wiping member. Then, in such a nozzle cleaning device, a long wiping member wound between a transfer drum and a winding drum is used (for example, refer to Patent Document 0. [Patent Document 1] Japanese Patent Laid-Open No. 2001-1 13213 As the size of the substrate becomes larger, the entire length of the slit-shaped discharge port in the processing liquid supply nozzle also tends to become longer. Therefore, in the previous nozzle cleaning device, the consumption of the wiping member increases and the cost increases. 87695 -6-1234797 The present invention was developed to solve the above-mentioned problems. The purpose of the present invention is to provide a surface cleaning treatment liquid for a nozzle cleaning device and a substrate processing device provided with the nozzle cleaning device. Consumption and nozzle. [Summary] One of the most invented patent applications is the #mouth cleaning device, which is characterized by spitting out and spitting out from the slit-shaped ## ,, · dream strike, and spitting out of the mouth. Hard,-the relative force of the surface of the substrate < 10,000, material cleaning, the processing solution to supply the processing liquid to the aforementioned substrate surface = application nozzle, which contains , A long wiping member is wound; winding ... winding the wiping member in the length direction of == outlet which is sent out from the conveying roller to the processing liquid supply nozzle; a rotation mechanism, which rotates the aforementioned winding roller, and the second sweeping mechanism Cleaning the processing liquid supply nozzle by abutting the wiping member sent out from the transfer roller to the processing liquid supply nozzle; and a second cleaning mechanism for cleaning the processing liquid by the first taste scanning mechanism = Before the nozzle is sprayed, the area where the first known mechanism of the wiper member sent out from the transfer roller abuts on the area behind the processing liquid supply nozzle is released, and the area abutted on the processing liquid supply nozzle is released. Mode, in advance the supply of the treatment liquid spray in advance. -............ .. The invention of item 2 of the scope of the patent application is a nozzle cleaning device that discharges fictitious soil from one of the slit-shaped spouts on one side and treats it hard while moving it relatively to the substrate. The processing liquid supply nozzle supplied to the aforementioned substrate surface includes a wiping portion including: The feed roller, winds the long wiping member, winds the reel, and winds the wiping member in the length direction sent from the conveying reel to the discharge port in the processing liquid supply nozzle; the rotating mechanism, 87695 1234797 hardly rotates the aforementioned roll ~ η, not Nacai structure, to = abut on the aforementioned supply of the processing liquid "before the fan: the second transport roller and the aforementioned winding cattle road movement control mechanism in the second = 7 are arranged for the aforementioned wiping member against ^ The position of the second cleaning nozzle and the second cleaning nozzle are in abutment with the position between the ^ lean winding roller in the moving path of the aforesaid treatment liquid and the wiper member; and the shift / knowledge mechanism The above-mentioned wiping member and the spouting member in the mouth of the treatment liquid supply mouth are moved back and forth in the direction described above. The invention of item 3 of the patent is a root invention. The aforementioned second cleaning mechanism is in the same winding direction as the wiping member of the front sheet cylinder roller. The aforesaid whisking unit moves to the opposite side of the winding direction of the wiping member of the agricultural tube ^ /, and then uses a roll to describe the processing liquid supply nozzle ㈣. °, 'Move the wiper member in the past_Please invent the 4th invention of the patent range, + the invention, the rotation mechanism is the winding direction of the wiper member in the third paragraph of the above-mentioned patent, please move to the same direction ^ to According to the invention of the invention in the above-mentioned winding roller, the invention is in roll 5 m double π0. According to the January in the scope of patent claim 3, it is equipped with a rotation restricting mechanism, and the wiper moves to Rotate the winding direction of the wiping member in the same way as the aforementioned% roll. 〇In the case of anti-universal, the invention of item 6 in the scope of patent application of the aforementioned roll-up roller shall be restricted, sincerely, sincerely, .., Jif. ^, It is based on any one of the patent application scope items 1 to-罘 5 弋The abutment is on the processing liquid supply nozzle; the machine structure includes a first pressing member that leans the chamfered surface of the aforesaid wiping member, and abuts the heart wiping member on the aforesaid place. 87695 1234797 [Embodiment] The following 'An embodiment of the present invention will be described with reference to the drawings. First, the configuration of a substrate processing apparatus to which the nozzle cleaning apparatus 18 according to the present invention is applied will be described. FIG. 1 is a schematic view of a substrate processing apparatus to which a nozzle cleaning apparatus according to the present invention is applied. This substrate processing device is a photoresist for applying a pigment called a color photoresist to a color substrate (hereinafter referred to as a “substrate”) w for forming a rectangular liquid crystal panel, and includes a state in which the substrate w is adsorbed and held. A processing liquid supply nozzle 14 for applying a photoresist to a substrate W held on the rotation chuck 13 by a rotary chuck 13 that rotates around a shaft 12 by a drive motor u, and a nozzle that moves the processing liquid supply nozzle 14 Moving mechanism 15, photoresist supply mechanism 16 that applies photoresist to processing solution supply nozzle, substrate material after coating photoresist by rotating chuck 13 for capturing green light scattered from end edge of substrate w The cup member 17 and the nozzle cleaning device related to the present invention are used. The above-mentioned rotary chuck U and the shaft 12 are raised and lowered by a chuck lifting mechanism (not shown) that can be rotated between the rotation position indicated by a solid line and the painting position indicated by a dagger. Here, the rotation position is a position where the substrate W coated with the photoresist is accommodated and rotated in the cup member 17, and the coating position is a position where the photoresist is coated by the substrate spray 14>. The upper back selling mechanism 15 is provided with a moving guide ^ extending horizontally and moving back and forth (moving frame 22). The processing liquid supply nozzle is interposed with a nozzle support frame 23 and is supported in the movable frame 22 in a horizontally freely movable manner. After cooking, the nozzle moving mechanism 15 is not provided with a mechanism for moving in the vertical direction. Therefore, when the processing liquid supply nozzle 14 is moved along the moving guide η, the processing 87695 1234797 = the variation in the distance between the supply nozzle u and the substrate w can be prevented. Therefore, when the processing liquid supply nozzle 14 is moved horizontally and green is coated on the substrate w, a coating film of uniform thickness ^ can be formed. The above-mentioned photoresist supply mechanism 16 includes a pressurized tank having a closed structure, and a photoresist tank 25 housed in the pressurized tank 24. The pressure tank 连接 is connected to a nitrogen or gas supply source (not shown) through a pressure pipe 27. Then, a three-way valve 28 for nitrogen supply / discharge switching and a regulator μ are provided in the pressurizing pipe 27. The photoresistor tank 25 has a negative end of a photoresistor supply pipe 31 connected to the photoresistor tank 25 and the processing liquid supply nozzle μ. The photoresist supply pipe 31 is provided with an opening / closing 阙 33. In the photoresist supply mechanism 16 having such a structure, the photoresist in the photoresist tank 25 is interposed with the photoresist supply pipe when the on-off valve 33 is in an open state. It is pressure-fed to the processing liquid supply nozzle 4 by the nitrogen pressure in the pressure tank 24, and the pressure-fed photoresist is stopped by closing the on-off valve 33. Fig. 2 is an explanatory view showing a photoresist supply operation of the processing liquid supply nozzle 14 in a model manner. The treatment liquid supply nozzle 14 has a slit-shaped discharge port 34 extending to the longitudinal direction (a direction perpendicular to the paper surface in FIG. 2). The length in the length direction of the discharge port 34 is equal to or greater than the length of the short side of the rectangular element forming portion in the substrate W, but it is set here to be approximately equal to the length of the short side of the aforementioned rectangular element forming portion. As shown in FIG. 2, the photoresist 3 5 supplied through the photoresist supply pipe 31 is supplied to the surface of the substrate w through the slit-shaped discharge port 34. FIG. 3 is an enlarged view of the lower end of the processing liquid supply nozzle 14. As shown in the figure, the treatment liquid supply nozzle 14 is provided with an inclined side surface 39 for minimizing the amount of the photoresist 35 attached thereto. In this figure, the symbol 38 is to form an outlet 34 87695 -12 · 1234797 and a lip surface. The child's labial surface 38 constitutes the lower end of the side surface 39. Next, Kou Erming explained the application of photoresist coating on the substrate by the substrate processing apparatus described above. 4 is a diagram illustrating the operation of coating the photoresist on the substrate by the substrate processing apparatus. Then, according to the following description, the movement of the processing fluid supply base 14 is performed by the nozzle moving mechanism. In the state before the photoresist coating operation, the processing liquid supply nozzle 14 is equipped with < the relative position of the nozzle cleaning device related to the present invention. The state of the "treatment" night supply nozzle 14 and the like at this time will be described in detail later. When the coating operation of the photoresist is started in the S shape, the processing liquid supply nozzle 14 is placed above the nozzle cleaning device 18 from the standby state, and as shown by the arrow ①, the processing liquid supply # 嘴 14 is cleaned against the mouth j 8 horizontally move gravity to the substrate w on the far side w < tens of thousands at one end. Next, the substrate w is arranged at a coating position by a chuck lifting mechanism. At this time, the "interval" between the surface of the substrate and the discharge opening of the processing liquid supply nozzle 14 is formed to a specific value suitable for coating the photoresist. In the state "is discharged from the slit-shaped discharge opening 34 in the processing liquid supply nozzle 14." At the same time, as shown by arrow ②, the photoresist moves the processing liquid supply nozzle 14 horizontally along the surface of the substrate w. In this state, as shown in FIG. 2, the slit-shaped discharge port in the processing liquid supply nozzle 14 is moved. The photoresist 35 discharged from 34 is coated on the surface of the substrate w into a thin film. When the slit-shaped discharge port 34 in the processing liquid supply nozzle 14 moves to a position opposite to the other end of the substrate w, the processing liquid supply nozzle 14 is stopped. The slit-shaped discharge port 34 in the middle emits a photoresist and moves above the nozzle cleaning device 18. Next, the structure of the nozzle cleaning device related to the present invention 8 will be described. FIG. 5 also shows the nozzle cleaning device 18 related to the present invention. And stand-by cylinder 36, 87695 • 13-1234797 side view. The nozzle clearing set 18 includes: & frame 42, which can be moved along a rail 41 arranged in parallel with the processing liquid supply nozzle 14; By using The 42-connected timing belt 43 rotates in a clockwise manner so that the minus 42 and the processing liquid supply nozzle U move back and forth in parallel; and the wiping portion 45 is disposed above the pressing frame 42. As described later, the wiping portion 45 is used for The wiping treatment liquid supply nozzle 丨 the slit-shaped discharge port 34 in the bucket. The wiping portion 45 is driven by the driving motor 44 between the position shown by the solid line in FIG. 5 and the position shown by the two-point lock line. On the other hand, on the other hand, the standby cylinder 36 is in a state where the photoresist is not applied, and is used to prevent the photoresist near the slit-shaped ejection outlet 34 in the processing liquid supply nozzle 14 from drying and deteriorating. The standby cylinder For example, the solvent 36 dissolves green solvent and the like. The standby cylinder 36 is formed by driving the steam cylinder 37 to form the upper opening portion π and the processing liquid supply nozzle 14 shown by a two-point lock line in FIG. 5. The slit-shaped ejection outlet 34 is configured to rise and fall between the lowered position shown by the solid line and the lowered position shown by the solid line. Therefore, in a state where the processing liquid supply nozzle 14 is on standby above the nozzle cleaning device M, the standby cylinder 36 is in the standby state. In the raised position, the processing liquid supply nozzle 14 34 is formed to be exposed in the space closed by the standby cylinder. At this time, 'because the space is filled with a gas containing solvent vapor,' the photoresist near the discharge port 34 can be prevented from drying. ▲ Next, the structure of the wiping part 45 will be described. Figure 视图 is the view of the wiper part, please cross-sectional view of the wiper part 45 ^ is the figure of the wiper part: Figure 7 and Figure 8 ′ part of the wiper structure is omitted for convenience of explanation 87695 -14-1234797 The wiping member 45 includes a housing 51, a transfer drum 53 around which a long wiping member 52 is wound, a winding drum 54 around which a wiping member 52 sent from the transfer drum 53 is wound, and a washing liquid is supplied to the wiping member 52. The clean liquid supply nozzles 55 and 56 and the first and second cleaning mechanisms 57 and 58. A thin plate-shaped < porous substance is used for the wiping member 52. As such a porous material, a paper such as a filter paper or a cloth such as a nonwoven fabric or a resin can be used. A gear 62 is attached to the shaft 61 of the transfer drum 53. The gear 62 is connected to a tension generating member 64 such as a rotary damper via a gear 63. Therefore, the transfer roller 53 rotates in a state having a specific resistance. Further, as shown in FIG. 9, a rotation restricting mechanism 67 for restricting rotation of the conveying roller 53 is provided below a gear “attached to the shaft 61 of the conveying roller 53. The rotation restricting mechanism 67 includes a cylinder rod connected to the cylinder 66. Rack member 65. The rack member 65 is driven up and down between the standby position shown by the solid line in FIG. 9 and the limit position shown by the hypothetical line by driving the cylinder 66. The rack member 65 In the state of being disposed at the restricted position, the rack member 65 and the gear 62 are engaged to restrict the rotation of the transfer liquid cylinder 53. Referring again to FIGS. 6 to 8, the shaft 71 of the winding drum 54 is interposed with the coupler 72 and the motor. The shaft 74 of 73 is connected. Therefore, the winding drum 旋转 is rotated by the driving motor 73. It is located below the wiper member 52 from the transfer roller 53 to the winding drum 54, which is the transfer roller 53 in the moving path of the wiper member 52. A first cleaning mechanism 57 is disposed at a position “between the winding drum batch” for pushing the wiping member 52 toward the processing liquid supply nozzle M so that the cleaning member 52 abuts the processing liquid supply nozzle 14. 87695 -15- 1234797 The following explains the i-th cleaning machine Structure of 57. FIG. 10 is an explanatory diagram showing the structure of the first cleaning mechanism 57, and FIG. U is a perspective view of the main part. Then, FIG. 10 (a) is a view of the housing 75 of the 丨 cleaning mechanism 57 is removed. Top view 'Figure i0 (b) is a longitudinal sectional view of the first cleaning mechanism 57, and Figure i0 (c) is a side view of the first cleaning mechanism 57. Also, in Figure 丨 丨, the i-th cleaning mechanism 57 is represented by a hypothetical line Housing 75. The first cleaning mechanism 57 is for cleaning the processing liquid supply nozzle 14 by abutting the wiping member 52 sent from the conveying roller 53 against the processing liquid supply nozzle 14, and includes a casing 75 and a lower end housing. One pair of the first pressing member 76 in the casing 75, the second pressing member 77 and the support plate 80 whose lower ends are accommodated in the casing 75. It is used to supply the cleaning liquid to the cleaning of the wiping member 52. The liquid supply nozzle 55 (refer to FIG. 8) is disposed above the third cleaning mechanism 57. The first pressing member 76 is used to abut the wiping member 52 against the lip surface 38 of the processing liquid supply nozzle 14. The head of the first pushing member% forms a curved shape that is chamfered into an arc shape, and will be processed later. The cleaning step of the liquid supply nozzle 14 is used to alleviate the impact when it comes in contact with the processing liquid supply nozzle 丨 4. Then, it can be set in a push shape instead of a curved shape. 之间 Between the lower surface of the first pressing member 76 and the support plate 80 A pair of springs 82 are provided to urge the i-th pressing member 76 to the direction of the wiping member 52. Further, a lower end of the first pressing member 76 is formed with a protrusion for preventing the first pressing member 76 from coming out of the housing.部 8.1 1. The second pressing member 77 is used for abutting the wiping member 52 on the side surface 39 of the processing liquid supply nozzle 14. The second pressing member 77 is formed with a side surface 39 corresponding to the processing liquid supply nozzle 14. The shape of the recess 78. In addition, the second pressing of the 87675 -16-1234797 member 77 of the member 77 also forms a curved shape with a chamfered arc, which is used to ease the treatment liquid supply nozzle μ in the cleaning step of the treatment liquid supply nozzle 14 described later. Shock during contact. Between the lower surface of the second pressing member 77 and the support plate 80, a pair of springs "to urge the second pressing member 77 to one of the directions of the wiping member 52" is provided. The lower end of the second pressing member 77 is useful The protruding portion 84 prevents the second pressing member 77 from coming out of the casing. Furthermore, a pair of moving members 85 are provided inside the casing 75, and the moving member 85 and the second pressing member are provided. " A pair of springs 86 are arranged therebetween. The springs 83 and 86 and the moving member 85 support the second pressing member 77 in a movable manner. That is, with the action of the springs 83 and 86 and the moving member, when the moving direction of the wiping part 45 in the cleaning step described later is taken as the X direction shown in the figure and FIG. 11, it can be moved to the γ direction and the z direction. This method supports the second pressing member 77. Thereby, even if there is an error in the positional accuracy of the cleaning mechanism 57 and the processing liquid supply nozzle 14, it is possible to reliably abut the concave portion 78 formed on the second pressing member 77 and the side surface 39 of the processing liquid supply nozzle 14. . A pair of guide portions 79 are formed at the upper end portion of the second pressing member 77. The pair of guide portions 79 is used to guide both ends of the wiping member 52 rolled out by the take-up roller 53. That is, as shown in Fig. 12 (a), the pair of guide portions 77 are arranged so as to be spaced apart from each other at substantially the same distance as the width of the wiping member 52, and are configured to be in contact with both ends of the wiping member 52. Therefore, it is possible to effectively prevent the wiping member 52 from being detached from the upper portion of the second pressing member 77 by the action of these guides. Then, in a cleaning step described later, when the treatment liquid supply nozzle 14 and the second pressing member 77 are interposed with the wiping member 52 to be in abutting state, as shown in FIG. I2 (b), 87695 -17-1234797 is passed through the treatment liquid. The side surface 39 of the supply nozzle 14 presses the wiping member 52 and enters the recess 78 in the second pressing member 77. Referring to FIGS. 6 to 8 again, a second cleaning mechanism μ is provided at a position between the first cleaning mechanism 57 and the winding drum 54 in the moving path of the wiping member 52 to supply the processing liquid again. The nozzle 14 presses the wiping member 52 that temporarily comes into contact with the processing liquid supply nozzle 14 so that the wiping member 52 abuts against the processing liquid supply nozzle 14. The second cleaning mechanism 58 includes a fixed guide roller 87 and a lifting guide roller 88 for guiding the wiping member 52. The fixed guide roller is rotatably supported by the casing 51. On the other hand, the raising and lowering guide roller 88 is rotatably supported at the front end of the substantially l-shaped bracket 89 for raising and lowering by driving the cylinder 90. Therefore, the lifting guide roller 88 is driven up and down between the cleaning position shown by a solid line in FIG. 6 and the retreat position shown by a hypothetical line by driving the cylinder 90. Here, the cleaning position is a position where the elevating guide roller 88 abuts the wiping member 52 against the lip surface 3 8 ′ of the treatment liquid supply spray 14 and cleans the position by the wiping member 52. Of course, the cleaning liquid supply nozzle 56 for supplying the cleaning liquid to the above-mentioned wiping member 52 is disposed on the side of the elevating guide roller 88. Then, at the above-mentioned wiping shao 45 ', the first and second cleaning mechanisms 5 7, 5 and 8 and the conveying roller 5 3 or the winding roller 5 4 and the like simultaneously adopt a removable cassette mechanism. Next, the cleaning operation of the processing liquid supply nozzle 14 of the nozzle cleaning device 8 related to the present invention will be described. When the cleaning operation of the processing liquid supply nozzle 14 is performed by using the nozzle cleaning device, in a state where the processing liquid supply nozzle 14 is located above the cleaning mechanism 18, the standby cylinder 36 is lowered from the rising position shown by the two-point lock line to The solid line table 87695 -18- 1234797 does not indicate the lowered position. And the 'swipe portion 45 is stopped at the position on the right end of the movement stroke indicated by the hypothetical line in Fig. 5. This position is a position where the wiping member is provided at the side end of the conveyance roller as seen. Then, by the drive motor 44, the wiping part 45 and the bracket 42 simultaneously start to move to the left of FIG. 5. This direction is parallel to the slit-shaped discharge port 34 in the processing liquid supply nozzle µ, and is the same direction as the winding direction of the wiping member 52 of the winding drum 54. When the wiping member 52 moves to the left, the lifting roller_ of the second cleaning mechanism 58 is arranged at the cleaning position indicated by the solid line in the figure. When the wiping part 45 continues to move in this state, initially, the processing liquid supply nozzle M, the lip surface 38, and the wiping member 52 abut by the action of the lifting guide roller 88 in the second cleaning mechanism 58, and the wiping member 52 The lip surface 38 of the processing liquid supply nozzle 14 is cleaned in advance. In this pre-cleaning step, the cleaning liquid is supplied from the cleaning liquid supply nozzle 56 to the wiping member 52 as necessary. At this time, as described later, the wiping member 52 used for the pre-cleaning is the previous cleaning step, and has been used to clean the lip surface 38 and the side surface 39 of the processing liquid supply nozzle 14 by the cleaning means 57. Therefore, the wiping member 52 used for the pre-cleaning is contaminated to some extent due to the photoresist, but since the cleaning by the first cleaning mechanism 57 is performed thereafter, the pre-cleaning step does not cause a problem with such a degree of contamination. Then, when the wiping part 45 is further moved, the processing liquid supply nozzle 14 and the wiping member 52 are brought into contact by the action of the first cleaning mechanism 57 and the processing liquid supply nozzle 14 is officially cleaned by the wiping member 52. Refer to FIG. 13 for details on the cleaning operation of the reading device 1 cleaning mechanism $ 7. 87695 -19- 1234797 1 4 cleaning action model diagram.
掃處理液供應噴嘴14之唇緣面38。 圖丨3係表示第丨清掃機構57之處理液供應噴嘴 隨著拂拭部45之移動，處理液供應喷嘴14和 那拭構件52藉由捲繞滾 反接’而藉由拂拭構件52清 。於該狀態，將捲繞滾筒54 側之第1推壓構件76推壓在處理液供應噴嘴14而下降。然後， 如上述’由於^推壓構件76之頭部形成倒角成圓孤形之彎# 曲形，因此可緩和第1推壓構件76和處理液供應噴嘴14接觸 時之衝擊。 從該狀態進一步移動拂拭部45，處理液供應噴嘴14和第i 清掃機構57之配設關係變成圖13(c)所示之狀態時，處理液 供應喷嘴14之側面39和拂拭構件52藉由第2推壓構件77之作 用抵接，而藉由拂拭構件52清掃處理液供應噴嘴14之側面 39。於該狀態，將第2推壓構件77推壓在處理液供應噴嘴w 修 而下降。然後，如上述，由於第2推壓構件77之頭部亦形成 倒角成圓派形之彎曲形，因此可緩和第2推壓構件7 7和處理 液供應噴嘴14接觸時之衝擊。 此時，如上述，由於以可移動至Y方向及Z方向乏方式支 .”丨..· t 持第2推壓構件77，即使第1清掃機構57和處理液供應喷嘴14 之位置精確度有誤差’仍可確貫地抵接形成在第2推壓構件7 7 .. . 之凹部78和處理液供應喷嘴I4之側面39。因此，可確實地^越· · . : ' 接處理液供應喷嘴14之側面39和拂拭構件52，而藉由拂拔.構 . 87695 -20 - 1234797 件52確貫地清掃處理液供應噴嘴ι4之側面39。 進一步移動拂拭部45,處理液供應噴嘴14和第丨清掃機構57 之配设關係變成圖13(d)所示之狀態時，處理液供應噴嘴14 之唇緣面38和拂拭構件52藉由傳送滾筒53側之第丨推壓構件 76足作用再度抵接，而藉由拂拭構件52再度清掃處理液供應 喷嘴14之唇緣面38。於該狀態，將捲繞滾筒54側之第丨推壓 構件76推壓在處理液供應噴嘴丨4而下降。然後，由於該第工 推壓構件76之頭邵亦形成倒角成圓弧形之彎曲形，因此可緩 和第1推壓構件76和處理液供應噴嘴丨4接觸時之衝擊。 於清掃上述第1清掃機構57之處理液供應噴嘴14時，對應 必要而從洗淨液供應噴嘴55將洗淨液供應至拂拭構件52。 且，於清掃上述第1清掃機構57之處理液供應噴嘴14時，藉 由驅動馬達73，以低速旋轉捲繞滾筒54。因此，可藉由新的 拂拭構件52清潔地清掃處理液供應噴嘴14之唇緣面列及側面 39。然後，藉由第}清掃機構57而已使用於清掃後的拂拭構 件52，如上述，再利用於第2清掃機構58之預先清掃。 然後，處理液供應喷嘴14中的開縫狀吐出口 34之長度方向 之長度較短時，亦可不旋轉捲繞滾筒54，而清掃處理液供應 嘴嘴14之唇緣面3 8及側面3 9。 藉由以上動作，拂拭部45從於圖5以假設線表示之掃描行 程右端之位置移動至於圖5以實線表示之移動行程左端之位 置時，藉由馬達44之驅動，拂拭部45和拢架42同時地移動至 圖5所不之右方。該方向係與處理液供應噴嘴14中的開缝狀 吐出口34平行之方向，且係與捲繞滾筒54之拂拭構件52之捲 87695 -21- 1234797 繞方向反方向。 该拂拭構件5 2朝向左方移動時，由於第1清掃機構5 7之作 用，而藉由拂拭構件52再度清掃處理液供應噴嘴14之唇緣面 3 8及側面39。但是，該拂拭構件52朝向左方移動時，第2清 掃機構58之升降引導滾筒88係配設在圖6以假設線表示之退 避位置。因此’清掃後之處理液供應噴嘴14之唇緣面38及側 面39不會和已使用於預先清掃之拂拭構件52抵接而污染。 且，於該拂拭構件52朝向左方移動時，圖9所示之旋轉限 制機構67之齒條構件65係配設在限制位置，限制旋轉傳送滾 筒53。因此，拂拭構件52朝向左方移動時，由於拂拭構件52 和處理液供應喷嘴14之間的摩擦力而拉動拂拭構件52時，亦 不會逆轉傳送滾筒53。 然後，拂拭部45移動至於圖5以假設線表示之移動行程右 端之位置時，即完成處理液供應喷嘴丨4之清掃動作。但是， 亦可使拂拭部45複數次來回而清掃處理液供應噴嘴丨4。 然後，於上述實施型態，已說明關於使本發明相關之喷嘴 清掃裝置18適用於基板處理裝置之情形，該基板處理裝置係 藉由處理液供應噴嘴14將光阻塗佈在基板w之後，藉由旋轉 夾頭13旋轉該基板W之構成，但亦可使本發明相關之噴嘴清 掃裝置適用於藉由處理液供應噴嘴14將處理液供應至基板w 後，不旋轉基板W之型態的基板處理裝置。 且，於上述實施型態，已說明關於在第1清掃機構57配設 複數個第1推壓構件76之情形，但亦可在第1清掃機構57配設 複數個第2推壓構件77。 87695 -22- 1234797 令請專利㈣第㈣、第2項、第12項、第13項及第i4项之 發明，由於使使用於藉由拂拭構件中的第掃機構清掃處 理液供應噴嘴之區域’可使用於藉由第2清掃機構預先清掃 處：液供應噴嘴，因此可一面降低拂拭構件之消耗量，—面 確實地清掃處理液供應喷嘴。 _請專利範圍第3項之發明由於第2清掃機構僅於拂拭部移 動至與捲繞滾筒之拂拭構件的捲繞方向同_方向時，將拂試 構件抵接在處理液供應喷嘴，因此可防止已使用於預先清掃 ，拂拭構件再度抵接在處理液供應嘴嘴而污染處理液供= 嘴0 ^ 申請專利範圍第4項之發明由於旋轉機構料拂拭部移動 至與捲繞滾筒之純構件之捲繞方向同—方向時旋轉滾筒， 因此可藉由新的拂拭構件清潔地清掃處理液供應噴嘴。 申請專利範圍第5項之發明由於具備於拂拭部移動至與捲 繞滾筒之拂拭構件的捲繞方向反方向時限制I繞滾筒旋轉之 旋轉限制機構，因此於拂拭構件移動時，可確實地防止因為 拂拭構件和處理液供應噴嘴之間的摩擦力而逆轉傳送滾筒Y 申請專利範圍第6項之發明由於使第i清掃機構包含使:拭 構件抵接在處理液供應噴嘴之唇緣面的第壓構件，和使 拂拭構㈣接在處㈣供應噴嘴之側面的第2推壓構件，因 此可確實地清掃處理液供應噴嘴之唇緣面和倒面。 ㈣專利範圍第7項之發，……㈣心再丹爾複數個 1推壓構件或第2推壓構件，因此可更確實地清掃處理液供 喷^之唇緣面或側面。 87695 -23- 1234797 申請專利範圍第8項之發明由於第2推壓構件形 <有對應處 理液供應喷嘴側面之形狀的凹部，同時進一步具備以可移動 方式支持該第2推壓構件之支持機構，即使第丨清掃機構和處 理液供應噴嘴之位置精確度有誤差時，仍可確實地抵接形成 在第2推壓構件之凹部和處理液供應噴嘴之側面。 申請專利範圍第9之發明由於支持機構係由將拂拭部之移 動方向當作X方向時，以可移動至γ方向和2；方向之方式支持 第2推壓構件之複數彈簧所構成，即使第丨清掃機構和處理液 供應噴嘴之位置精確度有誤差時，仍可確實地抵接形成在第 2推壓構件之凹部和處理液供應噴嘴之側面。 申請專利範圍第1 〇項之發明由於第2推壓構件具有引導藉 由捲出滾筒捲出之拂拭構件之兩端的引導部，因此可有效地 防止拂拭構件從第2推壓構件上部之位置脫離。 申請專利範圍第11項之發明由於具備將洗淨液供應至拂拭 構件之洗淨液供應機構，因此可利用洗淨液確實地清掃處理 液供應噴嘴。 【圖式簡單說明】 圖1係適用本發明相關之噴嘴清掃裝置之基板處理裝置概 要圖。 圖2係以模型方式表示處理液供應噴嘴丨4之光阻供應動作 說明圖。 圖3係處理液供應喷嘴14之下端部放大圖。 圖4係表示藉由基板處理裝置在基板w塗佈光阻之塗佈動 作說明圖。 87695 -24- 1234797 圖5係同時地表示本發明相關之噴嘴清掃裝置丨8和待機筒 件3 6之側視圖。 圖6係拂拭部45之前視圖。 圖7係拂拭部45之側視圖。 圖8係拂拭部45之俯視圖。 圖9係同時地表示旋轉限制機構67和齒輪62之前視圖。 圖1〇係表示第1清掃機構57之構成之說明圖。 圖11係表示第1清掃機構5 7之主要部之立體圖。 圖12係表示第2推壓構件77和拂拭構件52之關係之說明 圖0 圖13係表 作模型圖。 不第1清掃機構57之處理液供應噴嘴14之清掃動 【圖式代表符號說明】 11 、 44 、 73 12 、 61 、 71 、 74 13 14 15 16 17 18 21 22 23 馬達 轴 旋轉夾頭 處理液供應噴嘴 噴嘴移動機構 光阻供應機構 光阻捕獲用杯件 噴嘴清掃裝置 移動導件 移動框 噴嘴支持臂 87695 -25- 1234797 24 加壓槽 25 光阻槽 27 加壓配管 28 三通閥 29 調節器 31 光阻供應配管 33 開閉閥 34 吐出口 35 光阻 36 待機筒件 37、 66 > 90 汽筒 38 唇緣面 39 側面 41 軌條 42 技架 43 同步皮帶 45 拂拭部 5卜 75 外殼 52 拂拭構件 53 傳送滾筒、捲出滾筒 54 捲繞滾筒 55 ^ 56 洗净液供應喷嘴 57 第1清掃機構 58 第2清掃機構 -26- 87695 1234797 62、63 齒輪 64 張力產生部 65 齒條構件 67 旋轉限制機構 72 耦合器 76 第1推壓構件 77 第2推壓構件 78 凹部 79 引導部 80 支持板 81、84 凸部 82 、 83 、 86 彈簧 85 移動構件 87 固定引導滾筒 88 升降引導滾筒 89 托架 W 基板 87695 -27 -The lip surface 38 of the treatment liquid supply nozzle 14 is swept. FIG. 3 shows the processing liquid supply nozzle of the cleaning mechanism 57. With the movement of the wiping part 45, the processing liquid supply nozzle 14 and the wiping member 52 are reversely connected by the winding roller, and are cleaned by the wiping member 52. In this state, the first pressing member 76 on the side of the winding drum 54 is pressed against the processing liquid supply nozzle 14 and descends. Then, as described above, since the head of the pressing member 76 is chamfered into a round solitary curved shape, the impact when the first pressing member 76 and the processing liquid supply nozzle 14 come into contact can be alleviated. When the wiping part 45 is further moved from this state, and the arrangement relationship between the processing liquid supply nozzle 14 and the i-th cleaning mechanism 57 becomes the state shown in FIG. 13 (c), the side surface 39 of the processing liquid supply nozzle 14 and the wiping member 52 The second pressing member 77 comes into contact with each other, and the side surface 39 of the processing liquid supply nozzle 14 is cleaned by the wiping member 52. In this state, the second pressing member 77 is pressed against the processing liquid supply nozzle w and is lowered. Then, as described above, since the head of the second pressing member 77 is also formed into a curved shape with a chamfered shape, the impact when the second pressing member 77 and the treatment liquid supply nozzle 14 come into contact can be alleviated. At this time, as described above, since it can be moved to the Y direction and Z direction, the second pushing member 77 is held, even if the position accuracy of the first cleaning mechanism 57 and the processing liquid supply nozzle 14 is maintained. There is an error 'the abutment on the recessed portion 78 formed on the second pressing member 7 7... And the side surface 39 of the processing liquid supply nozzle I4 can be made surely. Therefore, it is possible to reliably contact the processing liquid. The side surface 39 of the supply nozzle 14 and the wiping member 52 are cleaned by the brushing mechanism 87695 -20-1234797 52 side 39 of the processing liquid supply nozzle ι4. The wiper 45 and the processing liquid supply nozzle 14 are further moved. When the arrangement relationship with the cleaning mechanism 57 becomes the state shown in FIG. 13 (d), the lip surface 38 and the wiping member 52 of the processing liquid supply nozzle 14 pass through the first pushing member 76 on the side of the transfer drum 53. The action abuts again, and the lip surface 38 of the processing liquid supply nozzle 14 is cleaned again by the wiping member 52. In this state, the first pushing member 76 on the side of the winding drum 54 is pressed against the processing liquid supplying nozzle 4 Then it descends. Then, because the head of the first pushing member 76 is also chamfered into a circular arc shape The curved shape makes it possible to reduce the impact when the first pressing member 76 comes in contact with the processing liquid supply nozzle 丨 4. When cleaning the processing liquid supply nozzle 14 of the first cleaning mechanism 57, the cleaning liquid supply nozzle 55 is cleaned as necessary. The cleaning liquid is supplied to the wiping member 52. When the processing liquid supply nozzle 14 of the first cleaning mechanism 57 is cleaned, the driving roller 73 is used to rotate the winding drum 54 at a low speed. Therefore, a new wiping can be performed. The member 52 cleans the lip surface row and the side surface 39 of the treatment liquid supply nozzle 14 cleanly. Then, the wiping member 52 which has been used for cleaning by the} cleaning mechanism 57 is reused in the second cleaning mechanism 58 as described above. If the length of the slit-shaped discharge opening 34 in the treatment liquid supply nozzle 14 is short, the lip surface 38 of the treatment liquid supply nozzle 14 may be cleaned without rotating the winding drum 54 and Side 3 9. With the above operation, when the wiping part 45 moves from the position at the right end of the scanning stroke indicated by the hypothetical line in FIG. 5 to the position at the left end of the moving stroke indicated by the solid line in FIG. 5, the wiping is driven by the motor 44 45 and the holding frame 42 move simultaneously to the right as shown in Fig. 5. This direction is parallel to the slit-shaped discharge opening 34 in the processing liquid supply nozzle 14 and is parallel to the wiping member 52 of the winding drum 54. Volume 87695 -21- 1234797 The direction is reversed. When the wiping member 52 is moved to the left, the lip surface 3 of the processing liquid supply nozzle 14 is cleaned again by the wiping member 52 due to the action of the first cleaning mechanism 57. 8 and the side surface 39. However, when the wiping member 52 is moved to the left, the elevating guide roller 88 of the second cleaning mechanism 58 is disposed at a retreated position indicated by a hypothetical line in FIG. Therefore, the lip surface 38 and the side surface 39 of the processing liquid supply nozzle 14 after cleaning are not brought into contact with the wiping member 52 which has been used for cleaning in advance and contaminated. When the wiping member 52 is moved to the left, the rack member 65 of the rotation restricting mechanism 67 shown in Fig. 9 is disposed at the restricting position to restrict the rotation of the transfer roller 53. Therefore, when the wiping member 52 is moved to the left, when the wiping member 52 is pulled due to the frictional force between the wiping member 52 and the processing liquid supply nozzle 14, the conveying roller 53 is not reversed. Then, when the wiping part 45 is moved to the position at the right end of the moving stroke indicated by the hypothetical line in Fig. 5, the cleaning operation of the processing liquid supply nozzle 4 is completed. However, the wiping unit 45 may be repeatedly moved back and forth to clean the processing liquid supply nozzles 1-4. Then, in the above embodiment, the case where the nozzle cleaning device 18 related to the present invention is applied to a substrate processing device has been described. The substrate processing device applies a photoresist to the substrate w through the processing liquid supply nozzle 14. The substrate W is rotated by the rotating chuck 13, but the nozzle cleaning device related to the present invention can also be applied to the type in which the substrate W is not rotated after the processing liquid is supplied to the substrate w through the processing liquid supply nozzle 14. Substrate processing device. Moreover, in the above embodiment, the case where a plurality of first pressing members 76 are arranged in the first cleaning mechanism 57 has been described, but a plurality of second pressing members 77 may be arranged in the first cleaning mechanism 57. 87695 -22- 1234797 Order patents ㈣, ㈣, 、, 、, 12, 、, 4, 由于, and i4, which make the area where the processing liquid supply nozzle is cleaned by the sweep mechanism in the wiping member. 'It can be used to clean the place in advance: the liquid supply nozzle by the second cleaning mechanism, so that the consumption amount of the wiping member can be reduced while cleaning the processing liquid supply nozzle. _Please invent the invention in item 3 because the second cleaning mechanism can only abut the test member against the treatment liquid supply nozzle when the wiper moves to the same direction as the winding direction of the wiper of the winding drum. To prevent the cleaning solution from being contaminated with the cleaning solution when it has been used in advance for cleaning, the cleaning solution supply = nozzle 0 ^ The invention in item 4 of the scope of patent application due to the rotating mechanism of the material wiping part moves to the pure member with the winding drum The winding direction is the same as the rotating direction of the drum, so the processing liquid supply nozzle can be cleaned cleanly by a new wiping member. The invention of claim 5 is provided with a rotation restricting mechanism for restricting the rotation of the drum when the wiper moves to a direction opposite to the winding direction of the wiper member of the winding drum. Therefore, it can reliably prevent the wiper member from moving. Due to the friction between the wiping member and the processing liquid supply nozzle, the invention of the sixth aspect of the patent application scope of the transfer roller Y is reversed. The i-th cleaning mechanism includes the following: the wiping member abuts on the lip surface of the processing liquid supply nozzle Since the pressing member and the second pressing member that connects the wiping structure to the side of the supply nozzle, the lip surface and the inverted surface of the processing liquid supply nozzle can be cleaned with certainty. (Issue of the 7th scope of the patent, ..... Heart again and again a plurality of 1 pushing members or 2 pushing members, so that the lip surface or side of the treatment liquid for spraying can be cleaned more reliably. 87695 -23- 1234797 The invention in the eighth aspect of the patent application is due to the shape of the second pressing member < has a recess corresponding to the shape of the side of the processing liquid supply nozzle, and further includes support for moving the second pressing member in a movable manner Even if there is an error in the positional accuracy between the cleaning mechanism and the processing liquid supply nozzle, the mechanism can reliably abut the recessed portion of the second pressing member and the side surface of the processing liquid supply nozzle. The invention of the ninth scope of the patent application, because the support mechanism is composed of a plurality of springs that support the second pressing member when the moving direction of the wiping part is taken as the X direction, and can be moved to the γ direction and the 2; direction.丨 When there is an error in the positional accuracy of the cleaning mechanism and the processing liquid supply nozzle, it is possible to reliably abut the concave portion formed on the second pressing member and the side surface of the processing liquid supply nozzle. Since the second pressing member has a guide portion that guides both ends of the wiping member rolled out by the take-up roller, the invention of the tenth invention in the scope of patent application can effectively prevent the wiping member from detaching from the upper portion of the second pressing member. . The invention according to claim 11 includes a cleaning liquid supply mechanism for supplying the cleaning liquid to the wiping member, so that the processing liquid supply nozzle can be cleaned with the cleaning liquid reliably. [Brief description of the drawings] FIG. 1 is a schematic diagram of a substrate processing apparatus to which the nozzle cleaning apparatus related to the present invention is applied. FIG. 2 is an explanatory diagram showing a photoresist supply operation of the processing liquid supply nozzles 4 as a model. FIG. 3 is an enlarged view of a lower end portion of the processing liquid supply nozzle 14. Fig. 4 is an explanatory view showing a coating operation of coating a photoresist on a substrate w by a substrate processing apparatus. 87695 -24- 1234797 FIG. 5 is a side view showing the nozzle cleaning device 8 and the standby cylinder 36 in the present invention simultaneously. FIG. 6 is a front view of the wiping portion 45. FIG. 7 is a side view of the wiping portion 45. FIG. 8 is a plan view of the wiping portion 45. FIG. 9 is a front view of the rotation restricting mechanism 67 and the gear 62 simultaneously. FIG. 10 is an explanatory diagram showing the configuration of the first cleaning mechanism 57. Fig. 11 is a perspective view showing a main part of the first cleaning mechanism 57. Fig. 12 is a diagram showing the relationship between the second pressing member 77 and the wiping member 52. Fig. 0 and Fig. 13 are model diagrams. Cleaning operation of the processing liquid supply nozzle 14 of the first cleaning mechanism 57 [Illustration of the representative symbols of the drawings] 11, 44, 73 12, 61, 71, 74 13 14 15 16 17 18 21 22 23 Motor shaft rotation chuck processing liquid Supply nozzle Nozzle moving mechanism Photoresist Supply mechanism Photoresist capture cup cup nozzle cleaning device Moving guide moving frame Nozzle support arm 87695 -25- 1234797 24 Pressure tank 25 Photoresist tank 27 Pressure piping 28 Three-way valve 29 Regulator 31 Photoresistance supply piping 33 On-off valve 34 Discharge outlet 35 Photoresistance 36 Stand-by tube 37, 66 > 90 Steam cylinder 38 Lip surface 39 Side surface 41 Rail 42 Technical frame 43 Timing belt 45 Wiping part 5 Bu 75 Housing 52 Wiping member 53 Conveying roller, unwinding roller 54 Winding roller 55 ^ 56 Cleaning liquid supply nozzle 57 First cleaning mechanism 58 Second cleaning mechanism -26- 87695 1234797 62, 63 Gear 64 Tension generating section 65 Rack member 67 Rotation restricting mechanism 72 Coupler 76 First pressing member 77 Second pressing member 78 Concave portion 79 Guide portion 80 Support plate 81, 84 Convex portion 82, 83, 86 Moving member 85 fixed to the guide rollers 87 guide rollers 88 lift bracket 89 W substrate 87695-27--