TWI386473B - 熱熔型矽酮系黏著劑 - Google Patents

熱熔型矽酮系黏著劑 Download PDF

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Publication number
TWI386473B
TWI386473B TW095106727A TW95106727A TWI386473B TW I386473 B TWI386473 B TW I386473B TW 095106727 A TW095106727 A TW 095106727A TW 95106727 A TW95106727 A TW 95106727A TW I386473 B TWI386473 B TW I386473B
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Taiwan
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component
mass
group
bonded
parts
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TW095106727A
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English (en)
Chinese (zh)
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TW200636039A (en
Inventor
Toyohiko Fujisawa
Yoshito Ushio
Manabu Sutoh
Yoshinori Taniguchi
Koji Nakanishi
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Dow Corning Toray Co Ltd
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Publication of TW200636039A publication Critical patent/TW200636039A/zh
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00Compositions for adhesives
    • C08G2170/20Compositions for hot melt adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70Siloxanes defined by use of the MDTQ nomenclature
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/14Layer or component removable to expose adhesive
    • Y10T428/1476Release layer

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW095106727A 2005-03-29 2006-03-01 熱熔型矽酮系黏著劑 TWI386473B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005094514A JP4849814B2 (ja) 2005-03-29 2005-03-29 ホットメルト型シリコーン系接着剤

Publications (2)

Publication Number Publication Date
TW200636039A TW200636039A (en) 2006-10-16
TWI386473B true TWI386473B (zh) 2013-02-21

Family

ID=36616990

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106727A TWI386473B (zh) 2005-03-29 2006-03-01 熱熔型矽酮系黏著劑

Country Status (8)

Country Link
US (1) US8093333B2 (enExample)
EP (1) EP1863876B1 (enExample)
JP (1) JP4849814B2 (enExample)
KR (1) KR101275046B1 (enExample)
CN (1) CN101151328B (enExample)
DE (1) DE602006010346D1 (enExample)
TW (1) TWI386473B (enExample)
WO (1) WO2006104236A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI628236B (zh) * 2014-02-19 2018-07-01 美商道康寧公司 反應性聚矽氧組合物、由其製成之熱熔材料及可固化熱熔組合物
TWI751253B (zh) * 2016-12-28 2022-01-01 日商Agc股份有限公司 積層體、附聚矽氧樹脂層之支持基材、附聚矽氧樹脂層之樹脂基板、電子器件之製造方法
TWI808956B (zh) * 2016-12-28 2023-07-21 日商Agc股份有限公司 積層體、附聚矽氧樹脂層之支持基材、附聚矽氧樹脂層之樹脂基板、及電子器件之製造方法

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JP5025917B2 (ja) 2005-06-15 2012-09-12 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
JP4839041B2 (ja) 2005-08-29 2011-12-14 東レ・ダウコーニング株式会社 絶縁性液状ダイボンディング剤および半導体装置
JP2008218864A (ja) * 2007-03-07 2008-09-18 Denso Corp 積層型圧電体素子
JP2014513169A (ja) * 2011-03-21 2014-05-29 エーブリー デニソン コーポレイション 非流動型シリコーン系接着剤
CN102766417A (zh) * 2012-05-10 2012-11-07 广州市鸿鹄胶粘材料科技有限公司 强离型接驳胶带
ES2895424T3 (es) * 2013-02-11 2022-02-21 Dow Silicones Corp Composiciones adhesivas de silicona termofusibles curables por humedad que incluyen una resina reactiva de siloxano con grupos alcoxi funcionales
CN104774587B (zh) * 2014-03-18 2017-04-12 深圳市康利邦科技有限公司 一种高粘度强耐热的改性有机硅树脂粘胶剂及其制备方法
CN104449544A (zh) * 2014-11-05 2015-03-25 苏州培华电子材料有限公司 一种硅胶配方及其制备方法
KR102512586B1 (ko) 2015-09-10 2023-03-23 다우 실리콘즈 코포레이션 열가소성 실리콘 조성물을 이용하는 3d 인쇄 방법
CN108026373B (zh) * 2015-10-19 2020-12-22 陶氏东丽株式会社 活性能量射线可固化的热熔融有机硅组合物、该组合物的固化产物和制备膜的方法
CN105418669B (zh) * 2015-12-07 2018-02-09 武汉大学 一种多功能化烷氧基硅烷化炔属硅氢加成抑制剂及其制备方法
JP6946901B2 (ja) * 2016-12-28 2021-10-13 Agc株式会社 積層体、シリコーン樹脂層付き支持基材、シリコーン樹脂層付き樹脂基板、電子デバイスの製造方法
JP6946900B2 (ja) * 2016-12-28 2021-10-13 Agc株式会社 積層体、シリコーン樹脂層付き支持基材、シリコーン樹脂層付き樹脂基板、および、電子デバイスの製造方法
CN107501942B (zh) * 2017-08-29 2020-10-02 北京康美特科技股份有限公司 可模塑成型的有机硅树脂、组合物及其半导体发光元件
KR102757326B1 (ko) * 2018-06-12 2025-01-20 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 실리콘 경화물의 제조 방법, 실리콘 경화물 및 광학용 부재
CN113166546B (zh) 2018-10-30 2023-02-21 陶氏东丽株式会社 固化反应性有机硅组合物及其固化物以及它们的用途
CN113195222B (zh) * 2018-12-25 2023-05-09 陶氏东丽株式会社 固化反应性有机硅粘合剂组合物及其固化物以及它们的用途
US12172357B2 (en) 2018-12-27 2024-12-24 Dow Toray Co., Ltd. Method for producing curable silicone sheet having hot melt properties
JP7513365B2 (ja) 2018-12-27 2024-07-09 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
WO2020138409A1 (ja) 2018-12-27 2020-07-02 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
KR20210149082A (ko) * 2019-03-29 2021-12-08 다우 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법
JP7560442B2 (ja) * 2019-03-29 2024-10-02 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
KR20210148202A (ko) 2019-03-29 2021-12-07 다우 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법
US20220195269A1 (en) * 2019-03-29 2022-06-23 Dow Toray Co., Ltd. Curable silicone composition, cured product of same, and method for producing same
JP7424733B2 (ja) * 2019-09-14 2024-01-30 ダウ・東レ株式会社 ホットメルト性を有する硬化性シリコーンシートの製造方法
JP2021107550A (ja) * 2019-12-27 2021-07-29 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体
JP2021161400A (ja) * 2020-03-30 2021-10-11 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体
TWI890864B (zh) * 2020-10-29 2025-07-21 日商陶氏東麗股份有限公司 固化性氟矽氧組成物
JP7547303B2 (ja) 2021-10-25 2024-09-09 株式会社トッパンインフォメディア ネックポップラベル
CN114058326B (zh) * 2021-11-22 2023-05-23 烟台德邦科技股份有限公司 一种粘接及可靠性优异的有机聚硅氧烷组合物及其制备方法
KR20240128883A (ko) * 2021-12-21 2024-08-27 다우 도레이 캄파니 리미티드 핫멜트성을 갖는 경화성 실리콘 조성물, 그의 경화 생성물, 및 상기 조성물을 포함하는 적층체
CN118389120A (zh) * 2024-07-01 2024-07-26 杭州盾源聚芯半导体科技有限公司 用于熔接硅部件的黏结剂、工艺及熔接得到的硅质晶舟

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI628236B (zh) * 2014-02-19 2018-07-01 美商道康寧公司 反應性聚矽氧組合物、由其製成之熱熔材料及可固化熱熔組合物
TWI751253B (zh) * 2016-12-28 2022-01-01 日商Agc股份有限公司 積層體、附聚矽氧樹脂層之支持基材、附聚矽氧樹脂層之樹脂基板、電子器件之製造方法
TWI808956B (zh) * 2016-12-28 2023-07-21 日商Agc股份有限公司 積層體、附聚矽氧樹脂層之支持基材、附聚矽氧樹脂層之樹脂基板、及電子器件之製造方法

Also Published As

Publication number Publication date
CN101151328A (zh) 2008-03-26
JP2006274007A (ja) 2006-10-12
EP1863876B1 (en) 2009-11-11
TW200636039A (en) 2006-10-16
DE602006010346D1 (de) 2009-12-24
US8093333B2 (en) 2012-01-10
JP4849814B2 (ja) 2012-01-11
US20090075009A1 (en) 2009-03-19
WO2006104236A1 (en) 2006-10-05
KR20070114303A (ko) 2007-11-30
KR101275046B1 (ko) 2013-06-14
CN101151328B (zh) 2011-03-30
EP1863876A1 (en) 2007-12-12

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