DE602006010346D1 - Silikon-schmelzklebstoff - Google Patents

Silikon-schmelzklebstoff

Info

Publication number
DE602006010346D1
DE602006010346D1 DE602006010346T DE602006010346T DE602006010346D1 DE 602006010346 D1 DE602006010346 D1 DE 602006010346D1 DE 602006010346 T DE602006010346 T DE 602006010346T DE 602006010346 T DE602006010346 T DE 602006010346T DE 602006010346 D1 DE602006010346 D1 DE 602006010346D1
Authority
DE
Germany
Prior art keywords
silicon melting
melting glue
glue
silicon
melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006010346T
Other languages
German (de)
English (en)
Inventor
Toyohiko Fujisawa
Yoshito Ushio
Manabu Sutoh
Yoshinori Taniguchi
Koji Nakanishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of DE602006010346D1 publication Critical patent/DE602006010346D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/20—Compositions for hot melt adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1476—Release layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
DE602006010346T 2005-03-29 2006-03-27 Silikon-schmelzklebstoff Active DE602006010346D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005094514A JP4849814B2 (ja) 2005-03-29 2005-03-29 ホットメルト型シリコーン系接着剤
PCT/JP2006/306996 WO2006104236A1 (en) 2005-03-29 2006-03-27 Hot-melt silicone adhesive

Publications (1)

Publication Number Publication Date
DE602006010346D1 true DE602006010346D1 (de) 2009-12-24

Family

ID=36616990

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006010346T Active DE602006010346D1 (de) 2005-03-29 2006-03-27 Silikon-schmelzklebstoff

Country Status (8)

Country Link
US (1) US8093333B2 (enExample)
EP (1) EP1863876B1 (enExample)
JP (1) JP4849814B2 (enExample)
KR (1) KR101275046B1 (enExample)
CN (1) CN101151328B (enExample)
DE (1) DE602006010346D1 (enExample)
TW (1) TWI386473B (enExample)
WO (1) WO2006104236A1 (enExample)

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JP5025917B2 (ja) 2005-06-15 2012-09-12 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
JP4839041B2 (ja) 2005-08-29 2011-12-14 東レ・ダウコーニング株式会社 絶縁性液状ダイボンディング剤および半導体装置
JP2008218864A (ja) * 2007-03-07 2008-09-18 Denso Corp 積層型圧電体素子
JP2014513169A (ja) * 2011-03-21 2014-05-29 エーブリー デニソン コーポレイション 非流動型シリコーン系接着剤
CN102766417A (zh) * 2012-05-10 2012-11-07 广州市鸿鹄胶粘材料科技有限公司 强离型接驳胶带
ES2895424T3 (es) * 2013-02-11 2022-02-21 Dow Silicones Corp Composiciones adhesivas de silicona termofusibles curables por humedad que incluyen una resina reactiva de siloxano con grupos alcoxi funcionales
KR20150097947A (ko) * 2014-02-19 2015-08-27 다우 코닝 코포레이션 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물
CN104774587B (zh) * 2014-03-18 2017-04-12 深圳市康利邦科技有限公司 一种高粘度强耐热的改性有机硅树脂粘胶剂及其制备方法
CN104449544A (zh) * 2014-11-05 2015-03-25 苏州培华电子材料有限公司 一种硅胶配方及其制备方法
KR102512586B1 (ko) 2015-09-10 2023-03-23 다우 실리콘즈 코포레이션 열가소성 실리콘 조성물을 이용하는 3d 인쇄 방법
CN108026373B (zh) * 2015-10-19 2020-12-22 陶氏东丽株式会社 活性能量射线可固化的热熔融有机硅组合物、该组合物的固化产物和制备膜的方法
CN105418669B (zh) * 2015-12-07 2018-02-09 武汉大学 一种多功能化烷氧基硅烷化炔属硅氢加成抑制剂及其制备方法
TWI751253B (zh) * 2016-12-28 2022-01-01 日商Ａｇｃ股份有限公司 積層體、附聚矽氧樹脂層之支持基材、附聚矽氧樹脂層之樹脂基板、電子器件之製造方法
JP6946901B2 (ja) * 2016-12-28 2021-10-13 Ａｇｃ株式会社 積層体、シリコーン樹脂層付き支持基材、シリコーン樹脂層付き樹脂基板、電子デバイスの製造方法
TWI890079B (zh) * 2016-12-28 2025-07-11 日商Ａｇｃ股份有限公司 硬化性組成物、積層體、及附聚矽氧樹脂層之玻璃
JP6946900B2 (ja) * 2016-12-28 2021-10-13 Ａｇｃ株式会社 積層体、シリコーン樹脂層付き支持基材、シリコーン樹脂層付き樹脂基板、および、電子デバイスの製造方法
CN107501942B (zh) * 2017-08-29 2020-10-02 北京康美特科技股份有限公司 可模塑成型的有机硅树脂、组合物及其半导体发光元件
KR102757326B1 (ko) * 2018-06-12 2025-01-20 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 실리콘 경화물의 제조 방법, 실리콘 경화물 및 광학용 부재
CN113166546B (zh) 2018-10-30 2023-02-21 陶氏东丽株式会社 固化反应性有机硅组合物及其固化物以及它们的用途
CN113195222B (zh) * 2018-12-25 2023-05-09 陶氏东丽株式会社 固化反应性有机硅粘合剂组合物及其固化物以及它们的用途
US12172357B2 (en) 2018-12-27 2024-12-24 Dow Toray Co., Ltd. Method for producing curable silicone sheet having hot melt properties
JP7513365B2 (ja) 2018-12-27 2024-07-09 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
WO2020138409A1 (ja) 2018-12-27 2020-07-02 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
KR20210149082A (ko) * 2019-03-29 2021-12-08 다우 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법
JP7560442B2 (ja) * 2019-03-29 2024-10-02 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
KR20210148202A (ko) 2019-03-29 2021-12-07 다우 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법
US20220195269A1 (en) * 2019-03-29 2022-06-23 Dow Toray Co., Ltd. Curable silicone composition, cured product of same, and method for producing same
JP7424733B2 (ja) * 2019-09-14 2024-01-30 ダウ・東レ株式会社 ホットメルト性を有する硬化性シリコーンシートの製造方法
JP2021107550A (ja) * 2019-12-27 2021-07-29 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体
JP2021161400A (ja) * 2020-03-30 2021-10-11 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体
TWI890864B (zh) * 2020-10-29 2025-07-21 日商陶氏東麗股份有限公司 固化性氟矽氧組成物
JP7547303B2 (ja) 2021-10-25 2024-09-09 株式会社トッパンインフォメディア ネックポップラベル
CN114058326B (zh) * 2021-11-22 2023-05-23 烟台德邦科技股份有限公司 一种粘接及可靠性优异的有机聚硅氧烷组合物及其制备方法
KR20240128883A (ko) * 2021-12-21 2024-08-27 다우 도레이 캄파니 리미티드 핫멜트성을 갖는 경화성 실리콘 조성물, 그의 경화 생성물, 및 상기 조성물을 포함하는 적층체
CN118389120A (zh) * 2024-07-01 2024-07-26 杭州盾源聚芯半导体科技有限公司 用于熔接硅部件的黏结剂、工艺及熔接得到的硅质晶舟

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Also Published As

Publication number Publication date
TWI386473B (zh) 2013-02-21
CN101151328A (zh) 2008-03-26
JP2006274007A (ja) 2006-10-12
EP1863876B1 (en) 2009-11-11
TW200636039A (en) 2006-10-16
US8093333B2 (en) 2012-01-10
JP4849814B2 (ja) 2012-01-11
US20090075009A1 (en) 2009-03-19
WO2006104236A1 (en) 2006-10-05
KR20070114303A (ko) 2007-11-30
KR101275046B1 (ko) 2013-06-14
CN101151328B (zh) 2011-03-30
EP1863876A1 (en) 2007-12-12

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