TWI336522B - Multiple floating guard ring edge termination for silicon carbide devices and methods of fabricating silicon carbide devices incorporating same - Google Patents

Multiple floating guard ring edge termination for silicon carbide devices and methods of fabricating silicon carbide devices incorporating same Download PDF

Info

Publication number
TWI336522B
TWI336522B TW093100255A TW93100255A TWI336522B TW I336522 B TWI336522 B TW I336522B TW 093100255 A TW093100255 A TW 093100255A TW 93100255 A TW93100255 A TW 93100255A TW I336522 B TWI336522 B TW I336522B
Authority
TW
Taiwan
Prior art keywords
surface charge
layer
floating
charge compensation
guard rings
Prior art date
Application number
TW093100255A
Other languages
English (en)
Chinese (zh)
Other versions
TW200505018A (en
Inventor
Sei-Hyung Ryu
Anant K Agarwai
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Publication of TW200505018A publication Critical patent/TW200505018A/zh
Application granted granted Critical
Publication of TWI336522B publication Critical patent/TWI336522B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/60Schottky-barrier diodes 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Element Separation (AREA)
TW093100255A 2003-01-15 2004-01-06 Multiple floating guard ring edge termination for silicon carbide devices and methods of fabricating silicon carbide devices incorporating same TWI336522B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US44019303P 2003-01-15 2003-01-15
US10/731,860 US7026650B2 (en) 2003-01-15 2003-12-09 Multiple floating guard ring edge termination for silicon carbide devices

Publications (2)

Publication Number Publication Date
TW200505018A TW200505018A (en) 2005-02-01
TWI336522B true TWI336522B (en) 2011-01-21

Family

ID=32718154

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093100255A TWI336522B (en) 2003-01-15 2004-01-06 Multiple floating guard ring edge termination for silicon carbide devices and methods of fabricating silicon carbide devices incorporating same

Country Status (7)

Country Link
US (4) US7026650B2 (enExample)
EP (2) EP2261987B1 (enExample)
JP (3) JP5122810B2 (enExample)
KR (1) KR101036380B1 (enExample)
CA (1) CA2512580A1 (enExample)
TW (1) TWI336522B (enExample)
WO (1) WO2004066392A1 (enExample)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9515135B2 (en) * 2003-01-15 2016-12-06 Cree, Inc. Edge termination structures for silicon carbide devices
US7026650B2 (en) * 2003-01-15 2006-04-11 Cree, Inc. Multiple floating guard ring edge termination for silicon carbide devices
JPWO2004097914A1 (ja) * 2003-04-25 2006-07-13 住友電気工業株式会社 半導体装置の製造方法
US8901699B2 (en) * 2005-05-11 2014-12-02 Cree, Inc. Silicon carbide junction barrier Schottky diodes with suppressed minority carrier injection
US8026160B2 (en) * 2005-09-08 2011-09-27 Mitsubishi Electric Corporation Semiconductor device and semiconductor device manufacturing method
US8432012B2 (en) 2006-08-01 2013-04-30 Cree, Inc. Semiconductor devices including schottky diodes having overlapping doped regions and methods of fabricating same
US7728402B2 (en) * 2006-08-01 2010-06-01 Cree, Inc. Semiconductor devices including schottky diodes with controlled breakdown
EP2631951B1 (en) 2006-08-17 2017-10-11 Cree, Inc. High power insulated gate bipolar transistors
US7955929B2 (en) * 2007-01-10 2011-06-07 Freescale Semiconductor, Inc. Method of forming a semiconductor device having an active area and a termination area
US8835987B2 (en) 2007-02-27 2014-09-16 Cree, Inc. Insulated gate bipolar transistors including current suppressing layers
US8866150B2 (en) * 2007-05-31 2014-10-21 Cree, Inc. Silicon carbide power devices including P-type epitaxial layers and direct ohmic contacts
US8110888B2 (en) * 2007-09-18 2012-02-07 Microsemi Corporation Edge termination for high voltage semiconductor device
US7687825B2 (en) * 2007-09-18 2010-03-30 Cree, Inc. Insulated gate bipolar conduction transistors (IBCTS) and related methods of fabrication
US9640609B2 (en) * 2008-02-26 2017-05-02 Cree, Inc. Double guard ring edge termination for silicon carbide devices
US8232558B2 (en) 2008-05-21 2012-07-31 Cree, Inc. Junction barrier Schottky diodes with current surge capability
US8097919B2 (en) * 2008-08-11 2012-01-17 Cree, Inc. Mesa termination structures for power semiconductor devices including mesa step buffers
US7759186B2 (en) * 2008-09-03 2010-07-20 The United States Of America As Represented By The Secretary Of The Navy Method for fabricating junction termination extension with formation of photosensitive dopant mask to control doping profile and lateral width for high-voltage electronic devices
US7825487B2 (en) * 2008-09-30 2010-11-02 Northrop Grumman Systems Corporation Guard ring structures and method of fabricating thereof
US8105911B2 (en) * 2008-09-30 2012-01-31 Northrop Grumman Systems Corporation Bipolar junction transistor guard ring structures and method of fabricating thereof
US8106487B2 (en) 2008-12-23 2012-01-31 Pratt & Whitney Rocketdyne, Inc. Semiconductor device having an inorganic coating layer applied over a junction termination extension
US8294507B2 (en) 2009-05-08 2012-10-23 Cree, Inc. Wide bandgap bipolar turn-off thyristor having non-negative temperature coefficient and related control circuits
US8637386B2 (en) * 2009-05-12 2014-01-28 Cree, Inc. Diffused junction termination structures for silicon carbide devices and methods of fabricating silicon carbide devices incorporating same
RU2390880C1 (ru) * 2009-05-25 2010-05-27 Общество с ограниченной ответственностью "Мегаимпульс" ИНТЕГРИРОВАННЫЙ ШОТТКИ-pn ДИОД НА ОСНОВЕ КАРБИДА КРЕМНИЯ
US8629509B2 (en) * 2009-06-02 2014-01-14 Cree, Inc. High voltage insulated gate bipolar transistors with minority carrier diverter
US8193848B2 (en) 2009-06-02 2012-06-05 Cree, Inc. Power switching devices having controllable surge current capabilities
RU2395868C1 (ru) * 2009-06-05 2010-07-27 Учреждение Российской академии наук, Физико-технический институт им. А.Ф. Иоффе РАН СПОСОБ ИЗГОТОВЛЕНИЯ ИНТЕГРИРОВАННЫХ ШОТТКИ-pn ДИОДОВ НА ОСНОВЕ КАРБИДА КРЕМНИЯ
US8541787B2 (en) * 2009-07-15 2013-09-24 Cree, Inc. High breakdown voltage wide band-gap MOS-gated bipolar junction transistors with avalanche capability
US8354690B2 (en) 2009-08-31 2013-01-15 Cree, Inc. Solid-state pinch off thyristor circuits
US9117739B2 (en) 2010-03-08 2015-08-25 Cree, Inc. Semiconductor devices with heterojunction barrier regions and methods of fabricating same
US8415671B2 (en) 2010-04-16 2013-04-09 Cree, Inc. Wide band-gap MOSFETs having a heterojunction under gate trenches thereof and related methods of forming such devices
WO2011141981A1 (ja) 2010-05-10 2011-11-17 株式会社日立製作所 半導体装置
US8803277B2 (en) * 2011-02-10 2014-08-12 Cree, Inc. Junction termination structures including guard ring extensions and methods of fabricating electronic devices incorporating same
WO2012131878A1 (ja) * 2011-03-28 2012-10-04 トヨタ自動車株式会社 縦型半導体装置
US9318623B2 (en) * 2011-04-05 2016-04-19 Cree, Inc. Recessed termination structures and methods of fabricating electronic devices including recessed termination structures
US9142662B2 (en) 2011-05-06 2015-09-22 Cree, Inc. Field effect transistor devices with low source resistance
US9673283B2 (en) 2011-05-06 2017-06-06 Cree, Inc. Power module for supporting high current densities
US9029945B2 (en) 2011-05-06 2015-05-12 Cree, Inc. Field effect transistor devices with low source resistance
JP2013030618A (ja) 2011-07-28 2013-02-07 Rohm Co Ltd 半導体装置
US8664665B2 (en) 2011-09-11 2014-03-04 Cree, Inc. Schottky diode employing recesses for elements of junction barrier array
US8618582B2 (en) 2011-09-11 2013-12-31 Cree, Inc. Edge termination structure employing recesses for edge termination elements
US9373617B2 (en) 2011-09-11 2016-06-21 Cree, Inc. High current, low switching loss SiC power module
US9640617B2 (en) 2011-09-11 2017-05-02 Cree, Inc. High performance power module
US8680587B2 (en) 2011-09-11 2014-03-25 Cree, Inc. Schottky diode
CN104221151B (zh) * 2012-03-16 2017-02-22 三菱电机株式会社 半导体装置及其制造方法
CA2872941C (en) * 2012-05-17 2021-03-30 General Electric Company Semiconductor device with junction termination extension
US8901639B2 (en) 2012-07-26 2014-12-02 Cree, Inc. Monolithic bidirectional silicon carbide switching devices
WO2014087601A1 (ja) * 2012-12-03 2014-06-12 パナソニック株式会社 半導体装置およびその製造方法
JP6242633B2 (ja) 2013-09-03 2017-12-06 株式会社東芝 半導体装置
US9711600B2 (en) 2013-09-09 2017-07-18 Hitachi, Ltd. Semiconductor device and method of manufacturing the same, power conversion device, three-phase motor system, automobile, and railway vehicle
WO2015040675A1 (ja) * 2013-09-17 2015-03-26 株式会社日立製作所 半導体装置、電力変換装置、鉄道車両、および半導体装置の製造方法
JP2015126193A (ja) * 2013-12-27 2015-07-06 株式会社豊田中央研究所 縦型半導体装置
CN103824760B (zh) * 2014-01-30 2017-04-26 株洲南车时代电气股份有限公司 一种碳化硅功率器件结终端的制造方法
CN106256024B (zh) 2014-04-30 2019-11-26 三菱电机株式会社 碳化硅半导体装置
JP6265274B2 (ja) * 2014-09-17 2018-01-24 富士電機株式会社 半導体装置
EP3012870A1 (en) 2014-10-20 2016-04-27 ABB Technology AG Edge termination for high voltage semiconductor devices
DE112016004086T5 (de) 2015-09-09 2018-06-14 Sumitomo Electric Industries, Ltd. Halbleiterbauelement
US9818862B2 (en) 2016-01-05 2017-11-14 Nxp Usa, Inc. Semiconductor device with floating field plates
US9691752B1 (en) * 2016-04-11 2017-06-27 United Microelectronics Corp. Semiconductor device for electrostatic discharge protection and method of forming the same
KR102550521B1 (ko) 2016-10-21 2023-06-30 한국전기연구원 실리콘 카바이드 반도체 소자의 제조방법
DE112018002359T5 (de) * 2017-05-08 2020-01-23 Rohm Co., Ltd. Halbleiterbauteil
US20210273090A1 (en) * 2020-03-02 2021-09-02 Cree, Inc. Semiconductor die with improved edge termination
TWI743818B (zh) * 2020-06-02 2021-10-21 台灣半導體股份有限公司 具有多保護環結構之蕭特基二極體
KR102372131B1 (ko) 2020-11-27 2022-03-08 재단법인 부산테크노파크 고내압 실리콘 카바이드 쇼트키 베리어 다이오드 및 제조방법
JP7628874B2 (ja) * 2021-04-14 2025-02-12 株式会社デンソー 半導体装置及びその製造方法
US12009389B2 (en) * 2021-11-30 2024-06-11 Wolfspeed, Inc. Edge termination for power semiconductor devices and related fabrication methods

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL230857A (enExample) 1958-08-26
NL108185C (enExample) 1958-08-27
BE760009A (fr) 1969-12-10 1971-05-17 Western Electric Co Oscillateur a haute frequence
US4096622A (en) 1975-07-31 1978-06-27 General Motors Corporation Ion implanted Schottky barrier diode
US4329699A (en) 1979-03-26 1982-05-11 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method of manufacturing the same
JPS56124273A (en) * 1980-03-04 1981-09-29 Semiconductor Res Found Semiconductor device
JPS57211752A (en) 1981-06-24 1982-12-25 Hitachi Ltd Semiconductor device
DE3279779D1 (en) 1981-09-11 1989-07-27 Nippon Telegraph & Telephone Low-loss and high-speed diodes
JPS58148469A (ja) 1982-02-27 1983-09-03 Nippon Telegr & Teleph Corp <Ntt> シヨツトキダイオ−ド
JPS58140139A (ja) 1982-02-16 1983-08-19 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
US4638551A (en) 1982-09-24 1987-01-27 General Instrument Corporation Schottky barrier device and method of manufacture
US4816879A (en) 1982-12-08 1989-03-28 North American Philips Corporation, Signetics Division Schottky-type rectifier having controllable barrier height
GB2134705B (en) 1983-01-28 1985-12-24 Philips Electronic Associated Semiconductor devices
JPS59232467A (ja) 1983-06-16 1984-12-27 Toshiba Corp ガ−ドリング付きシヨツトキ−バリヤ−ダイオ−ド
US4762806A (en) 1983-12-23 1988-08-09 Sharp Kabushiki Kaisha Process for producing a SiC semiconductor device
CA1270931A (en) 1984-06-15 1990-06-26 Jun Takada Heat-resistant thin film photoelectric converter with diffusion blocking layer
JPS61137368A (ja) * 1984-12-10 1986-06-25 Hitachi Ltd 半導体装置
US4742377A (en) 1985-02-21 1988-05-03 General Instrument Corporation Schottky barrier device with doped composite guard ring
US4738937A (en) 1985-10-22 1988-04-19 Hughes Aircraft Company Method of making ohmic contact structure
JPS62279672A (ja) 1986-05-28 1987-12-04 Kanegafuchi Chem Ind Co Ltd 半導体装置
US4907040A (en) 1986-09-17 1990-03-06 Konishiroku Photo Industry Co., Ltd. Thin film Schottky barrier device
JPH0671074B2 (ja) 1986-11-25 1994-09-07 日本電気株式会社 半導体装置
US4901120A (en) 1987-06-10 1990-02-13 Unitrode Corporation Structure for fast-recovery bipolar devices
US4875083A (en) 1987-10-26 1989-10-17 North Carolina State University Metal-insulator-semiconductor capacitor formed on silicon carbide
US4866005A (en) 1987-10-26 1989-09-12 North Carolina State University Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
US5270252A (en) 1988-10-25 1993-12-14 United States Of America As Represented By The Secretary Of The Navy Method of forming platinum and platinum silicide schottky contacts on beta-silicon carbide
US4918497A (en) 1988-12-14 1990-04-17 Cree Research, Inc. Blue light emitting diode formed in silicon carbide
JP3221673B2 (ja) 1989-11-01 2001-10-22 新電元工業株式会社 高耐圧半導体装置
CA2128213A1 (en) * 1992-01-16 1993-07-22 Jainagesh A. Sekhar Electrical heating element, related composites, and composition and method for producing such products using dieless micropyretic synthesis
JPH0750420A (ja) 1994-03-31 1995-02-21 Semiconductor Energy Lab Co Ltd 絶縁ゲート型電界効果トランジスタの製造方法
US5565384A (en) 1994-04-28 1996-10-15 Texas Instruments Inc Self-aligned via using low permittivity dielectric
JPH088242A (ja) 1994-06-17 1996-01-12 Toshiba Chem Corp 半導体装置
TW286435B (enExample) 1994-07-27 1996-09-21 Siemens Ag
JPH0897441A (ja) 1994-09-26 1996-04-12 Fuji Electric Co Ltd 炭化けい素ショットキーダイオードの製造方法
JP3581447B2 (ja) * 1995-08-22 2004-10-27 三菱電機株式会社 高耐圧半導体装置
US5967795A (en) 1995-08-30 1999-10-19 Asea Brown Boveri Ab SiC semiconductor device comprising a pn junction with a voltage absorbing edge
US5932394A (en) * 1996-03-14 1999-08-03 Agfa-Gevaert N.V. Producing a lithographic printing plate by sequentially exposing a thermo-sensitive imaging element by a set of radiation beams
JP3147331B2 (ja) 1996-04-02 2001-03-19 株式会社ワコール 補整機能を備えた股部を有する衣類
DE19616605C2 (de) 1996-04-25 1998-03-26 Siemens Ag Schottkydiodenanordnung und Verfahren zur Herstellung
US6002159A (en) 1996-07-16 1999-12-14 Abb Research Ltd. SiC semiconductor device comprising a pn junction with a voltage absorbing edge
US5801836A (en) 1996-07-16 1998-09-01 Abb Research Ltd. Depletion region stopper for PN junction in silicon carbide
SE9700156D0 (sv) 1997-01-21 1997-01-21 Abb Research Ltd Junction termination for Si C Schottky diode
CN1131548C (zh) 1997-04-04 2003-12-17 松下电器产业株式会社 半导体装置
SE9702220D0 (sv) 1997-06-11 1997-06-11 Abb Research Ltd A semiconductor device with a junction termination and a method for production thereof
US5932894A (en) 1997-06-26 1999-08-03 Abb Research Ltd. SiC semiconductor device comprising a pn junction
JPH1187331A (ja) 1997-09-01 1999-03-30 Matsushita Electron Corp 半導体装置の製造方法
US6972436B2 (en) 1998-08-28 2005-12-06 Cree, Inc. High voltage, high temperature capacitor and interconnection structures
SE9802909L (sv) 1998-08-31 1999-10-13 Abb Research Ltd Metod för framställning av en pn-övergång för en halvledaranordning av SiC samt en halvledaranordning av SiC med pn-övergång
EP1064684A1 (de) 1999-01-15 2001-01-03 Infineon Technologies AG Randabschluss für ein halbleiterbauelement, schottky-diode mit einem randabschluss und verfahren zur herstellung einer schottky-diode
US6313482B1 (en) 1999-05-17 2001-11-06 North Carolina State University Silicon carbide power devices having trench-based silicon carbide charge coupling regions therein
US6242784B1 (en) 1999-06-28 2001-06-05 Intersil Corporation Edge termination for silicon power devices
GB2355110A (en) * 1999-08-11 2001-04-11 Mitel Semiconductor Ltd High voltage semiconductor device termination structure
FR2803103B1 (fr) 1999-12-24 2003-08-29 St Microelectronics Sa Diode schottky sur substrat de carbure de silicium
US6686616B1 (en) 2000-05-10 2004-02-03 Cree, Inc. Silicon carbide metal-semiconductor field effect transistors
US6573128B1 (en) 2000-11-28 2003-06-03 Cree, Inc. Epitaxial edge termination for silicon carbide Schottky devices and methods of fabricating silicon carbide devices incorporating same
JP3708057B2 (ja) * 2001-07-17 2005-10-19 株式会社東芝 高耐圧半導体装置
FR2837322B1 (fr) 2002-03-14 2005-02-04 Commissariat Energie Atomique DIODE SCHOTTKY DE PUISSANCE A SUBSTRAT SiCOI, ET PROCEDE DE REALISATION D'UN TELLE DIODE
US7026650B2 (en) 2003-01-15 2006-04-11 Cree, Inc. Multiple floating guard ring edge termination for silicon carbide devices
WO2004066391A1 (ja) 2003-01-20 2004-08-05 Mitsubishi Denki Kabushiki Kaisha 半導体装置

Also Published As

Publication number Publication date
US20060054895A1 (en) 2006-03-16
EP2261987B1 (en) 2019-09-18
US7842549B2 (en) 2010-11-30
US7419877B2 (en) 2008-09-02
JP2011243999A (ja) 2011-12-01
CA2512580A1 (en) 2004-08-05
JP5670308B2 (ja) 2015-02-18
KR101036380B1 (ko) 2011-05-23
JP2006516815A (ja) 2006-07-06
US20090035926A1 (en) 2009-02-05
EP1584110A1 (en) 2005-10-12
JP5122810B2 (ja) 2013-01-16
KR20050109924A (ko) 2005-11-22
US8124480B2 (en) 2012-02-28
JP5695996B2 (ja) 2015-04-08
WO2004066392A1 (en) 2004-08-05
EP1584110B1 (en) 2018-02-21
US20110081772A1 (en) 2011-04-07
US20040135153A1 (en) 2004-07-15
EP2261987A3 (en) 2014-01-15
JP2012084910A (ja) 2012-04-26
US7026650B2 (en) 2006-04-11
TW200505018A (en) 2005-02-01
EP2261987A2 (en) 2010-12-15

Similar Documents

Publication Publication Date Title
TWI336522B (en) Multiple floating guard ring edge termination for silicon carbide devices and methods of fabricating silicon carbide devices incorporating same
TWI441342B (zh) 用於碳化矽裝置之邊緣終止結構及含該終止結構之碳化矽裝置之製造方法
US7781786B2 (en) Semiconductor device having a heterojunction diode and manufacturing method thereof
JP6622343B2 (ja) 炭化ケイ素半導体デバイス及びその製造方法
JP3958404B2 (ja) 横型高耐圧素子を有する半導体装置
JP4855636B2 (ja) トレンチショットキー整流器
US9711599B2 (en) Wide bandgap high-density semiconductor switching device and manufacturing process thereof
JP2004529506A5 (enExample)
TW201246390A (en) Semiconductor device and manufacturing method thereof
JP2009044177A (ja) 電圧吸収エッジを有するpn接合を含むSiC半導体装置
JP2004515080A5 (enExample)
WO2006058216A2 (en) Junction terminations structures for wide-bandgap power devices
CN117059673A (zh) 半导体结构、半导体结构的制作方法以及半导体器件
JP2007227949A (ja) 横型高耐圧素子を有する半導体装置の製造方法
JP7055537B2 (ja) 半導体デバイスおよびその製作方法
JP2001068689A (ja) ショットキーバリアダイオードの製造方法
US7709864B2 (en) High-efficiency Schottky rectifier and method of manufacturing same
JP2011165924A (ja) 半導体装置
WO2015006074A1 (en) High-voltage field-effect transistor having multiple implanted layers
CN117199105A (zh) 功率器件及其制造方法、功率模块和电子设备
TW201041147A (en) Schottky diode device and method for fabricating the same

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MK4A Expiration of patent term of an invention patent