TWI293578B - Nozzle cleaning apparatus and substrate processing apparatus - Google Patents

Nozzle cleaning apparatus and substrate processing apparatus Download PDF

Info

Publication number
TWI293578B
TWI293578B TW094101573A TW94101573A TWI293578B TW I293578 B TWI293578 B TW I293578B TW 094101573 A TW094101573 A TW 094101573A TW 94101573 A TW94101573 A TW 94101573A TW I293578 B TWI293578 B TW I293578B
Authority
TW
Taiwan
Prior art keywords
nozzle
cleaning
liquid
cleaning liquid
specific
Prior art date
Application number
TW094101573A
Other languages
English (en)
Chinese (zh)
Other versions
TW200534925A (en
Inventor
Yoshinori Takagi
Yasuhiro Kawaguchi
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200534925A publication Critical patent/TW200534925A/zh
Application granted granted Critical
Publication of TWI293578B publication Critical patent/TWI293578B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW094101573A 2004-03-19 2005-01-19 Nozzle cleaning apparatus and substrate processing apparatus TWI293578B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004080188A JP4451175B2 (ja) 2004-03-19 2004-03-19 ノズル洗浄装置および基板処理装置

Publications (2)

Publication Number Publication Date
TW200534925A TW200534925A (en) 2005-11-01
TWI293578B true TWI293578B (en) 2008-02-21

Family

ID=35041240

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094101573A TWI293578B (en) 2004-03-19 2005-01-19 Nozzle cleaning apparatus and substrate processing apparatus

Country Status (4)

Country Link
JP (1) JP4451175B2 (ko)
KR (1) KR100642666B1 (ko)
CN (1) CN100381216C (ko)
TW (1) TWI293578B (ko)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399822B (zh) * 2009-04-03 2013-06-21 Dainippon Screen Mfg 基板處理裝置
TWI565526B (zh) * 2011-07-12 2017-01-11 Toray Industries Nozzle cleaning method and coating device
TWI665023B (zh) * 2017-03-24 2019-07-11 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法
TWI686243B (zh) * 2017-02-09 2020-03-01 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法
US10622225B2 (en) 2016-08-29 2020-04-14 SCREEN Holdings Co., Ltd. Substrate processing apparatus and nozzle cleaning method
US11174549B2 (en) * 2018-11-02 2021-11-16 Samsung Electronics Co., Ltd. Substrate processing methods
US11806763B2 (en) 2021-03-11 2023-11-07 Kioxia Corporation Substrate cleaning device and substrate cleaning method

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006088033A (ja) 2004-09-24 2006-04-06 Future Vision:Kk ウェット処理装置
JP4792787B2 (ja) * 2005-03-31 2011-10-12 凸版印刷株式会社 洗浄装置付塗布装置
KR100708314B1 (ko) 2005-11-04 2007-04-17 세메스 주식회사 노즐 처리 유닛 및 방법, 그리고 상기 유닛을 가지는 기판처리 장치
JP4493034B2 (ja) * 2005-11-21 2010-06-30 東京エレクトロン株式会社 塗布膜の成膜方法及びその装置
JP4884038B2 (ja) * 2006-03-10 2012-02-22 東京応化工業株式会社 スリットノズル洗浄装置
JP4985007B2 (ja) * 2006-03-22 2012-07-25 東レ株式会社 塗布器の洗浄装置、塗布方法及び塗布装置、ならびに液晶ディスプレイ用部材の製造方法
JP4808147B2 (ja) 2006-12-15 2011-11-02 中外炉工業株式会社 塗布用ダイの清掃装置
JP4857193B2 (ja) 2007-05-28 2012-01-18 大日本スクリーン製造株式会社 ノズル洗浄装置
JP5518284B2 (ja) * 2007-07-12 2014-06-11 東京応化工業株式会社 ノズル洗浄装置、ノズル洗浄方法、塗布装置及び塗布方法
KR100893670B1 (ko) * 2007-08-10 2009-04-20 주식회사 케이씨텍 노즐 세정장치 및 세정방법
TW200911389A (en) 2007-08-17 2009-03-16 Dainippon Screen Mfg Nozzle keeping device and coating device
JP4972504B2 (ja) * 2007-09-12 2012-07-11 大日本スクリーン製造株式会社 塗布装置
KR100897240B1 (ko) 2007-09-21 2009-05-14 주식회사 디엠에스 세정장치를 구비한 슬릿코터
JP5352080B2 (ja) * 2007-12-05 2013-11-27 東京応化工業株式会社 ノズル洗浄装置、ノズル洗浄方法、塗布装置及び塗布方法
CN101271277B (zh) * 2008-05-06 2010-12-22 友达光电股份有限公司 喷嘴清洁装置
KR100975129B1 (ko) * 2008-06-27 2010-08-11 주식회사 디엠에스 노즐 립 클리너를 구비한 슬릿 코터
JP2010045138A (ja) * 2008-08-11 2010-02-25 Murata Machinery Ltd ノズル
JP5036664B2 (ja) * 2008-09-04 2012-09-26 東京エレクトロン株式会社 液処理におけるノズル洗浄、処理液乾燥防止方法及びその装置
DE102010022309A1 (de) * 2010-06-01 2011-12-01 Dürr Systems GmbH Vorrichtung, Verfahren und System zur Aufnahme und/oder Abgabe von Entsorgungsmittel
JP5226046B2 (ja) * 2010-08-18 2013-07-03 東京エレクトロン株式会社 塗布装置及びノズルのメンテナンス方法
JP5864232B2 (ja) * 2011-02-01 2016-02-17 東京エレクトロン株式会社 液処理装置および液処理方法
CN202087472U (zh) * 2011-05-10 2011-12-28 深圳市华星光电技术有限公司 狭缝涂布机喷嘴的清洗装置
KR101335219B1 (ko) * 2011-08-04 2013-11-29 주식회사 케이씨텍 슬릿 노즐의 비접촉식 세정기구 및 이를 이용한 세정 방법
KR101383755B1 (ko) * 2011-09-30 2014-04-10 세메스 주식회사 기판 처리 장치 및 헤드 유닛의 세정 방법
JP5841449B2 (ja) * 2012-02-10 2016-01-13 東京エレクトロン株式会社 拭き取りパッド及びこのパッドを用いたノズルメンテナンス装置並びに塗布処理装置
TWI544291B (zh) * 2012-05-22 2016-08-01 斯克林半導體科技有限公司 顯像處理裝置
JP5701822B2 (ja) * 2012-06-20 2015-04-15 東レエンジニアリング株式会社 洗浄装置および洗浄方法
JP6000782B2 (ja) * 2012-09-26 2016-10-05 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および液受け洗浄装置
CN103041943B (zh) * 2013-01-10 2015-09-02 深圳市华星光电技术有限公司 喷嘴清洁装置和具有该喷嘴清洁装置的涂布机
JP2014184357A (ja) * 2013-03-21 2014-10-02 Toshiba Corp ノズル洗浄ユニット、およびノズル洗浄方法
JP2015060932A (ja) * 2013-09-18 2015-03-30 株式会社東芝 スパイラル塗布装置
CN103846183A (zh) * 2013-12-20 2014-06-11 深圳市华星光电技术有限公司 一种涂布机喷嘴清洁装置
KR20150075368A (ko) * 2013-12-25 2015-07-03 시바우라 메카트로닉스 가부시끼가이샤 접착제 도포 장치, 접착제 도포 부재의 클리닝 방법 및 표시 패널 제조 장치, 표시 패널의 제조 방법
KR102232667B1 (ko) * 2014-06-12 2021-03-30 세메스 주식회사 기판 처리 장치
CN104941876A (zh) * 2015-07-15 2015-09-30 合肥鑫晟光电科技有限公司 一种涂胶机胶头的清洁设备
JP6697324B2 (ja) * 2016-05-26 2020-05-20 株式会社Ｓｃｒｅｅｎホールディングス ノズル清掃装置、塗布装置およびノズル清掃方法
CN106378331A (zh) * 2016-11-28 2017-02-08 武汉华星光电技术有限公司 一种混合型口金非接触清洗装置及清洗方法
CN107694811B (zh) * 2017-09-25 2019-08-20 武汉华星光电技术有限公司 清洁装置
CN109807027A (zh) * 2017-11-20 2019-05-28 沈阳芯源微电子设备股份有限公司 一种使用电控回吸阀的胶嘴清洗系统及其清洗方法
CN108704897B (zh) * 2018-05-21 2021-04-23 昆山龙腾光电股份有限公司 涂布机喷嘴的清洁装置以及清洁方法
CN110000036A (zh) * 2019-03-31 2019-07-12 池州华宇电子科技有限公司 一种芯片点胶枪内壁除胶装置
CN110237971A (zh) * 2019-05-31 2019-09-17 溧阳嘉拓智能设备有限公司 锂电池狭缝挤压式涂布模头在线全自动清洁装置及方法
KR102450703B1 (ko) * 2022-06-08 2022-10-04 창녕군시설관리공단 약액 노즐 세척기

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3116297B2 (ja) * 1994-08-03 2000-12-11 東京エレクトロン株式会社 処理方法及び処理装置
JP3679904B2 (ja) * 1997-08-29 2005-08-03 大日本スクリーン製造株式会社 ノズル洗浄装置および該ノズル洗浄装置を備えた塗布装置
JP2003260423A (ja) * 2002-03-12 2003-09-16 Tatsumo Kk ノズル先端部の洗浄装置及び洗浄方法
JP2004058016A (ja) * 2002-07-31 2004-02-26 Sharp Corp 洗浄装置、切削加工装置、及びインクジェット記録ヘッドの製造方法
JP3976644B2 (ja) * 2002-08-22 2007-09-19 株式会社大気社 塗料供給装置の洗浄装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399822B (zh) * 2009-04-03 2013-06-21 Dainippon Screen Mfg 基板處理裝置
TWI565526B (zh) * 2011-07-12 2017-01-11 Toray Industries Nozzle cleaning method and coating device
US10622225B2 (en) 2016-08-29 2020-04-14 SCREEN Holdings Co., Ltd. Substrate processing apparatus and nozzle cleaning method
TWI686243B (zh) * 2017-02-09 2020-03-01 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法
TWI665023B (zh) * 2017-03-24 2019-07-11 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法
US11174549B2 (en) * 2018-11-02 2021-11-16 Samsung Electronics Co., Ltd. Substrate processing methods
US11806763B2 (en) 2021-03-11 2023-11-07 Kioxia Corporation Substrate cleaning device and substrate cleaning method

Also Published As

Publication number Publication date
CN1669680A (zh) 2005-09-21
TW200534925A (en) 2005-11-01
JP2005262127A (ja) 2005-09-29
JP4451175B2 (ja) 2010-04-14
KR100642666B1 (ko) 2006-11-10
KR20060041868A (ko) 2006-05-12
CN100381216C (zh) 2008-04-16

Similar Documents

Publication Publication Date Title
TWI293578B (en) Nozzle cleaning apparatus and substrate processing apparatus
TWI296211B (en) Substrate processing apparatus
CN104106125B (zh) 擦拭垫、使用该垫的喷嘴维护装置和涂覆处理装置
TW201200243A (en) Slit nozzle cleaning apparatus and coating apparatus
JP4986490B2 (ja) 予備吐出装置
TW201143913A (en) Slit nozzle cleaning apparatus and coating apparatus
JP2005329340A (ja) スリットコータの予備吐出装置
TWI604509B (zh) 基板處理裝置及基板處理裝置之控制方法
JP2008290031A (ja) ノズル洗浄装置
JP2007165554A (ja) 基板処理装置及び基板処理方法
JP2004221244A5 (ko)
TWI298908B (en) Substrate processing apparatus and substrate processing method
TW201503227A (zh) 基板液體處理裝置及基板液體處理方法
JP4033709B2 (ja) 基板洗浄方法及びその装置
JP2009011919A (ja) 洗浄装置、洗浄方法、予備吐出装置、塗布装置及び予備吐出方法
JP2000107706A (ja) 洗浄装置
KR101460272B1 (ko) 노즐 어셈블리 및 이를 포함하는 기판 처리 장치, 그리고 이를 이용한 기판 처리 방법
KR101914991B1 (ko) 기판 처리 장치 및 방법
JP2005177707A (ja) 塗工ノズル清浄装置
JP2004327475A (ja) 現像処理方法及び現像処理装置
JP6656255B2 (ja) 基板をリンスするシステム及び方法
JP5298083B2 (ja) 塗布装置及びノズルのプライミング処理方法
WO2023219118A1 (ja) 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法
JP2006000748A (ja) 基板端縁部被膜の除去装置
TW543112B (en) Substrate holding apparatus, substrate processing apparatus and substrate edge cleaning apparatus