TW543112B - Substrate holding apparatus, substrate processing apparatus and substrate edge cleaning apparatus - Google Patents

Abstract

The object of this invention is to provide the function so that the large and thin substrate can be moved upwardly and downwardly between the substrate processing height level and the substrate receiving height level. The substrate retaining platform 11 is constructed by mounting four sucking strips 111A, 111B, 111C, 111D smaller than the substrate S having four round corners on the cubic frame 112. A plurality of up-down pins 12 are installed in the substrate retaining platform 11 to facilitate the moving up or down The plurality of up-down pins 12 are used to support the central portion of substrate S form back side, and the substrate S can be moved upwardly and downwardly on the substrate retaining platform 11 by moving the up-down pins 12 upwardly and downwardly. In addition, when cleaning the edge portion of the substrate S, the central portion of the substrate S is supported by the up-down pins 12, and all the portions except central portion and edge portion are sucked and retained on the retaining platform 11.

Description

543112

V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a substrate processing apparatus for holding a substrate provided with the holding device. A square substrate refers to a rectangular base rectangle such as a glass substrate for a liquid crystal display panel. It can also be shaped at the edge of the substrate. [Known technology] In the liquid crystal display device or semiconductor film formation step, imine resin is used on the surface of the substrate, and color filters are used. A thin film is formed on the dyed surface. The thin film is formed in an unnecessary area other than the effective area, but will spread to the edge outside the effective area. When this is not necessary, for example, the substrate may be peeled off due to rubbing and become a source of dust. Therefore, to remove unnecessary film on the edge of the substrate, to remove unnecessary film, the device cleans the edge of the board. The substrate edge cleaning stage of the square substrate to which it is applied is substantially smaller than the substrate when viewed from the plane; and a plurality of lifting and lowering tips, and the substrate holding stage to be described is continuously perforated, so that the substrate to be removed is attached. The substrate holding device of the shaped substrate, the earphone, and the glass substrate and plasma display panel for the device for cleaning and cracking the edge of the substrate. However, it is not necessary to be a complete lack or a notch. The manufacturing steps of the device include a thin coating of a chemical solution such as a photoresist solution, a photosensitive polychromatic toner, and the like, which are used to form the substrate on the substrate only in the edge region of the substrate. In the liquid region, the so-called thin film is formed in the edge region. It is issued when the substrate is transported or the substrate is held with various processing tools. Generally, it is washed after the application of the chemical solution. ^ 0 It is used to clean the edge of the substrate. The base is similar to a glass substrate device for a liquid crystal display device, and includes a substrate that has a similar shape, and has a size slightly larger than the substrate to surround the substrate holding stage. On the upper surface of the upper surface, the edge of the substrate with a plurality of attractive films remains.

丄 二 --- _ V. Description of the invention (2) ^, owing to the central portion of the back surface of the substrate, the back surface of the substrate, and the support plate from the vicinity of the end edge portion of the adsorption base = back surface. In addition, the use of, for example, a quotient containing ticks, is used to suck and hold the substrate to move up and down. In the substrate protection :: the driving mechanism makes a plurality of lift pins to form a film, the substrate is given to the second substrate ^ = the receiving height of the substrate,

V is mounted on the substrate holding stage. For the US technology =, μ, the lifting tip is lowered to attract and hold the substrate. The cleaning process is to lift and lower the lifting tip after the net is removed so that it does not prevent the edge of the substrate from entering. Tip up 'will: position in the plant. After finishing washing to the substrate receiving and receiving height. Lifting the substrate on the substrate holding table [Problem to be solved by the invention] Thinning has the size and shape of the substrate to be processed, and the base plate Hi: The substrate of the processing object will bend when it becomes a large edge. Dry earning :::! The mouth sharply highlights the Nichi-ji Temple, and the prominent point is its problem. 'The cleaning head with cleaning treatment at the edge is to prevent this problem. ^ ^ The projection of the substrate is reduced: f board holding stage is large &' used to make it difficult to maintain the substrate ^ 疋 when the substrate is held When the size of the platform is increased, the cost of the device will increase because the substrate is maintained. In addition, the fixed part will become the substrate holding stage of Yamato ’s strength. In addition, the to: structure will increase the cost of the device. hold. Therefore: In the state where the entire substrate is sucked on the substrate holding stage, the substrate holding stage is maintained. When the substrate is peeled off by the holding stage, a multiplicity of static electricity is generated between the substrates.

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Increasing the possibility of users on the substrate is their problem. In addition, the lift pin is used to remove the structure. 1. In the structure, when the base plate becomes the edge of the base plate, the width of the lift plate is bent. I # ^ ί ί Binding type, the base plate on the lift pin will sprout. The board prepares PA II 夂 秘 # γ i, taxi U, which is the problem. It is necessary to lift and lower the substrate and break the substrate. Therefore, the purpose of the invention is to provide a large-sized and thin substrate with such a substrate. In addition, the substrate is adsorbed and held at the base solvent supply edge. The problem of the problem is that the anti-holding device can keep the thickness along the horizontal plane, and the thin substrate can be maintained at a predetermined height, and the large substrate can be raised and lowered well. In addition, the present invention also provides a substrate processing apparatus having a plate holding device. The base holding table is constructed so that a plate with a plurality of suction holes can be mounted on the upper end of the fixed frame to be detachable. The end edge of the substrate of the board holding table protrudes from the substrate holding plate and will reach The solvent is used to dissolve and remove the thin film at the end edge. In order to supply the solvent to the edge of the substrate, the amount of the edge of the substrate protruding from the substrate suction stage must be such that the protruding portion i is equal to the degree of bending (for example, suction from the substrate The distance from the edge of the board to the edge of the substrate is less than 5 mm). Therefore, as the substrate suction plate, a size corresponding to the size of the substrate to be processed is used. For example, in the case where the size of the substrate to be processed is 55〇11111 ^ 65〇111111, a substrate absorbing plate of 5200_ > < 62〇111111 is used. When the size of the substrate to be processed is 600 mm x 72 mm, a substrate suction plate of 570 mm x 690 mm is used. In the structure of the above method, because the substrate suction plate can be attached / detached

C: \ 2D-C0DE \ 91-07 \ 91107071.ptd 543112 V. Description of the invention (4) f fixed frame, so the substrates of various sizes can be made into :: the size, replacement by following the suction plate according to the processing object Inconvenient for large substrates, U = object. But Bai: Time, and a long time. In the replacement of the dagger: it needs to be as large as possible, so the replacement of the substrate suction plate requires long work, and the device rotation rate must be reduced. In addition, a problem arises in the use of a plurality of substrate chuck devices. 4 'The cost will also become the reason, the present invention is used to solve the above-mentioned technical beauty of the substrate holding device and the substrate holding device. The second purpose is to improve the two' substrates of various sizes can be well maintained; Perform adjustment work. The substrate ruler of the patterner [the solution to the problem and the effect of the invention] a = it is the first invention in the scope of the patent application mentioned above is-a kind ^ ΪΓ), which is characterized by including: the first substrate support device side The back of the square substrate ⑻ is used to support the square substrate at a predetermined height approximately horizontally; the second substrate support device (12) touches the back of the square I plate at a ratio of 4 to the area where the i substrate is in contact The area on the H side can support the square substrate alone; lifting "'is used to lift the second substrate supporting device to the above i-th substrate; and the control device (15) is used to control the above. Ν? 2ΐ: In the above; predetermined height, so that the square substrate is supported by the above; 1 and 2 substrate support devices support both sides. Yi j In addition, the English numerals in parentheses _ 科 虚 今 德 # 表表 is not described later In the application form, corresponding components, etc. The following is the same as this.

C ·· \ 2D-C0DE \ 91 · 07 \ 9Π07071 .ptd Page 8 V. Description of the invention (5) In accordance with the present invention, at-N degrees of the last name supported by the first substrate support device, the square substrate is opposite to Party support. In this way, when the device is supported by the second substrate on the inner side, the f-shaped substrate being supported on the upper surface of the f-shaped substrate may be bent even if it is large and thin. A square substrate of a predetermined height will not be produced. In addition, by raising and lowering the second substrate such as the above-mentioned pre-soil, ancient, and arranging, the square of the square having a predetermined height or more can be increased to two or more And can be lifted to the above-mentioned 'because the heart of the square substrate is lowered to the above-mentioned predetermined height. This is even if the square substrate is supported by a large 1-base anti-support device, so the shape of the substrate does not occur, the large and thin square. In addition, if you apply, the device contains a substrate loading plate ⑴υ: ί 平 = The first substrate supports a square substrate on which a square substrate is mounted. The invention of the third item of the patent scope of the invention is φ 士 主 皇 4 丨 The plate holding device, #! _, + .. Apply for May Patent Gion Garden No. 2 Xiang Zhiji @ π 1 connects the upper surface of the above-mentioned substrate loading plate with π a,,, and connects the curved surface to the outer surface. Tian He's outer face, according to the invention in the scope of the patent application No. 4 is to keep the nightmare on the towel board, Du t 1 ^ g sacrifice the Kidan clothes of the second item, so that the above board loading board is curved Connect to the outer surface. If it is not inside, the invention with the scope of the patent application No. 5 is in the base plate of the patent application model name SB A i% solid No. 3 holding clothes, so that the connection part above the board loading board A coating film using a resin is applied. ^ $ In accordance with each of these inventions, it is possible to prevent

C. \ 2D-CODE \ 9l.〇7 \ 9n〇7〇71.ptd Page 9 543112 V. Description of the invention (6) = Friction of the square substrate on the substrate loading plate is prevented = the square is contaminated by dust Substrate. Μ 板 :: by? The base of the tenth issue of the last tenth patent application scope I :-) The back of the square substrate is sucked and supported on the upper board: = The invention of the seventh scope is the base of the sixth scope of the patent application. " ,, And centering, it also includes a gas supply device (1 1 4), connected to the above, "the hole, which is used to supply gas to the top of the substrate loading board. North ^ photo ^ please patent scope 6 When inventing, you can hold the L # of the square substrate on the top of the * board loading plate '. * Applications of patents ^ J. When it is clear, by supplying gas to the side that is adsorbed and held k # Between the substrate and the carrier plate, the adsorption state of the square substrate to the substrate loading plate can be released. The invention in item 8 of the scope of the claim is based on the basis of the item 2 in the scope of the patent application. The above-mentioned designated portion of the substrate loading plate is constructed so that it can freely swing around a horizontal axis (丨 〖7) along its outer end surface.

According to the knowledge, in the present invention, the designated portion of the substrate loading plate can be swung around the horizontal axis. In this way, for example, in a state where a square substrate is sucked and held on the soil plate f carrier plate, by shaking the designated portion of the substrate loading plate, 'air can be introduced between the substrate loading plate and the substrate, thereby relaxing the square Suction state of the substrate.

543112 V. Description of the invention (7) In addition, if the method of applying for item 9 of the patent scope, the board may also include ⑴B, luc, ⑴D) along the square base board m, respectively, in this case; ^ == 粑As shown in item 10, the patent of the four plates mentioned above can be constructed around the second solid free along the horizontal axis along the outer end surface. In addition, it can be constructed to surround the above-mentioned water slice. As shown in range u. The edge of the plate can be disconnected from the back of the square substrate, also :: set j to make the outer trunk as shown in item 12 'set to make it' application: patented back to disconnect. Winter j to square The beauty of the substrate m = item is in the substrate holding wave of item 1 of the scope of the patent application, so that the second substrate, the lifting tip (12), contacts the back of the square substrate. It is necessary to prevent the placement of the dagger 3 Falling or breaking of the substrate occurs when the substrate is raised and lowered 2 = Yes: the substrate is held ☆, which is used to suck and hold the central portion of its surface; and the holding table lifting mechanism is used to lower the substrate to the moon, on a square substrate It is sucked on the substrate supporting ':, 梏 斗 a bucket, m ,, m 丞, 丞, 保, 符, 符, and σ, and it is used to raise and lower the square substrate by making the substrate = holding σ 升.' When lifting a large substrate holding table capable of holding 2 large substrates, a large Hosuji table lifting mechanism is needed, so the size and cost of the installation must increase. In addition, it is directly used in the structure of the substrate holding table lifting. Perform the square / substrate to substrate holding stage 'but Static electricity may be generated during the delivery (especially when the square substrate is removed from the substrate holder). This static electricity may cause the square substrate to be charged. When the substrate is charged, the substrate is moved, etc., m p. 11 C: \ 2D-CODE \ 91-07 \ 91107071.ptd 543112 V. Description of the invention (8) The substrate will attract dust in the handling space, and there will be contaminated substrates. If it is constructed to be supported by the second substrate裴 置 ° 砀 Inside the substrate, the lifting shape of the second substrate supporting device is used! When the shape is raised and lowered, it is not necessary to allow the substrate holding table to be raised and lowered by the "soil plate driving mechanism", so the device size and: In the method of item 13 of Erzhisheng's patent scope, the second base plate can also include multiple lift pins. Because the lift pin and the base plate are very small, when a square substrate is granted to the lift pin, the = Static electricity 'can prevent square substrates from being caused by static electricity = The invention in item 14 of the scope of patent application is granted in the patent application scope 13 soil plate holding device. The end hole is used to attract the square substrate before the aforementioned booster pin. Back. When there is a hole 'According to the present invention, the lifting tip is used to suck the back of the square substrate, = the problem of preventing the square substrate from falling when the substrate is raised and lowered. In the base j holding device of the first patent application scope, t includes a position adjustment device ⑺, which is in contact with the end surface of the square substrate, and is used to position the position in the horizontal plane of the square substrate at a predetermined substrate holding position. " ▽, In the present invention, the position in the horizontal plane of the square substrate can be located at a predetermined substrate holding position. 1: The invention in the 16th item of the scope is the substrate holding clothes in the first item of the patent application range. In addition, it further includes a static elimination device (4) 'for neutralizing the square plate. 543112 V. Description of the invention (9), ---------- According to households, households, households, and households, it is necessary to combine: for example, 'the square is removed from the second substrate support device here In the case of i, the static electricity, 'Since the static electricity causes the square substrate to be charged, even if it is protected, the square substrate can be neutralized. Therefore, it can be more contaminated by square substrates due to electrification. Washing: # 而 = The invention of item 17 is a substrate processing device for containing the edge portion of a square substrate with a thin film of "Shen ^ 4", which is characterized by the following characteristics: the second substrate holds the substrate No. 2 holding device? Shan Lai supplies the solvent to the thin part that is held at the edge part: and the edge part is removed to be formed at the end. According to the present invention, it is held in the substrate holding device Αχ ^ bending, so its i丨 Ding Fuyi's violent board will not produce a decision. By using the positional relationship of the cleaning device, the purpose of-can be maintained: the formula: can be used to supply the solvent to the edge portion I of the square substrate to apply a good cleaning treatment to the edge portion of the substrate. In the method of item 18 of the scope of patent application D, the above-mentioned Jin Yi < LV > < LV > multi-edge cleaning f also S has a solvent ejection nozzle (3 M, 315) for the edge of the square substrate Spit out solvent. The invention of item No. 9 in the patent application scope of the facing party is to apply the above-mentioned edge cleaning nozzles (316,317) in the patent-applied substrate processing device to spray the gas toward the side / Wu Tuoyi-/ containing gas. Proximity / Proximity of bath supply position on the substrate In accordance with the present invention, by spraying the gas from the gas nozzle, the solvent from the solvent discharge nozzle to the square substrate can be supplied to the outside. In this way, it will not affect the effectiveness of

543112 V. Description of the invention (10) _ = two thin films, the solvent is supplied to the unnecessary film of the square base to remove it. Unexplainable = except, if the way of applying for the scope of patent application is the 20th, the best device includes: Wash head (31A, 31b, 31c, 3id) i; :: Out two and gas ', 3 2 D)' It is used to make the cleaning head along the side of the square substrate held by the substrate produced by Yubaozhu ^ ;. It is kept in the above. In addition, if the method of applying for the scope of the patent application is No. 21, it is best to form a base useful for accommodating the processing object. The processing space is used to discharge the processing space. It is supplied to a square uncle through Xiao Hepo's milk draining device; the solvent is dissolved: the unnecessary film (dissolved matter) can be used everywhere to prevent the cereals and dissolved matter from flying around. = The invention of item 22 in the patent scope is in the Shenji = management device, so that the above-mentioned cleaning head is provided with upper and lower surfaces; J; of (311, 312), the above-mentioned processing space is formed in the above-to-block Between, and in one of the above, ^ nozzles and gas nozzles are included. ， '@' Set up the above solvent extraction; because the substrate held by the substrate holding device will not be generated ": So, in a state of maintaining a fixed interval with a pair of blocks, apply two good cleaning treatments to the square substrate. The invention of the 23rd edge of the patent application for the patent application SI is a substrate holding device ⑴),

Page 14 543112 V. Description of the invention (11) It is characterized by including: a fixed frame (111); a plurality of substrate loading plates (丨 丨 9A, 119B; 117A, 117B, 117C, 117D; 118A, 118B, 118C, 118D , 118E, 118F), are mounted on the fixed frame, and the substrate (8,81,82,33) can be loaded on it; and the sliding mechanism (5 3,54,5 5 people, 556,112 people, 1126, 6 7), for causing at least one of the plurality of substrate loading plates to relatively slide the above-mentioned frame in a substantially horizontal direction. According to the present invention, the substrate loading plate can be slid according to the size of the substrate. Because it can support near its edge, it can be bent well. In addition, sliding the substrate loading plate using a sliding mechanism does not require a great deal of work in accordance with the size of the substrate. When compared with the structure according to the (substrate suction plate), the operation is performed. Therefore, there is no reduction in the operating rate of the device due to the large substrate. Because there are many kinds of substrate loading boards, the invention for applying the invention in the 24th aspect of the patent application includes a substrate holding device that further includes a plurality of substrate loading boards (5 7), and the back of the substrate using the board loading boards. According to the present invention, since the substrate suction plate is used to slide the substrate, even if the substrate is mounted on the substrate loading plate between the substrate suction plates having a larger interval, even a large substrate is held well. The adjustment operation that will change the end edge is only a moving operation, so the adjustment operation of the size of the substrate replacement of the substrate loading plate can complete the adjustment operation accompanied by small adjustments in a shorter time. The size setting cost can be reduced. It is the fixed tip (120) in the 23rd scope of the patent application, and it is arranged in the above to contact and be mounted between the plurality of base suction plates, and a fixed tip is provided, so when the substrate suction plate has a large interval, 'There will be no substrate bending

543112 V. Description of the Invention (12) Problem. The 25th item of the patent scope of the application is a substrate edge cleaning device, which uses the edge of the substrate (S, S1, S2, S3) with a thin film formed on the surface. The characteristics of the basin are: Contains: The substrate holding device of item 23 or 24) and the edge cleaning device (3) are used to supply a solvent to the edge of the substrate held by the device, thereby removing the thin film formed in the counter-warranty.丨 Heart = This material 'Because the substrate held by the substrate holding device will not produce · · bowing', the positional relationship between the substrate and the edge cleaning device can be: mesh = type: formula 'can supply the solvent to the square substrate The end edge portion W is provided, and a good cleaning treatment can be applied to the end edge portion of the substrate. [Embodiment of the invention] The following describes the i-th embodiment of the present invention in detail using Cangru and p. Figure 1 is a plan view of the embodiment of the sun and the moon, the substrate processing device), Figure 2 is your m々ττ ττ main 丨 Yin table set (the board edge cleaning device at the storm board is used to = =: 1 A cross-sectional view of the door 1. The bundled end of the square substrate S of the glass substrate is first covered with a film (for example, attached to a coating film) that is resistant to rubbing. An unnecessary resist is applied to the edge of the cake. The substrate edge cleaning device g I? F + ^ ^ AQ is equipped with: a substrate holding mechanism 1 to hold the substrate s of the processing object; 4 units of Jinshi two ^ ^ 1 ^ ^ ^ ^ S ^ ^ „# The substrate holding mechanism! The holding mechanism 'and the cleaning mechanism 3 are used to clean the edge of the substrate S that is leaning. In addition, the substrate protection C: \ 2D-CODE \ 91-07 \ 91107071.ptd No. 16 Page 543112

Above 4 1, as shown in FIG. 2, a static eliminator 4 is provided for removing the processed substrate S. The static eliminator 4 uses, for example, corona discharge to generate f ions and negative ions. The substrate 3 is arranged at a neutralization height He at an appropriate interval away from the static eliminator 4 and can be used to irradiate the entire substrate s with ions, thereby removing the electric charge carried by the substrate s. The substrate ^ holding mechanism 1 is provided with: a substrate holding table 丨 丨, which can load a substrate s, and suck and hold the substrate s carried thereon; and a plurality of (eight in this embodiment) lifting tips 1 2 , Used to make the substrate S relatively lift and lower the substrate holding table 1 丨. The base holder 11 has a structure in which four suction plates 111A, 111B, 111C, and 111D (collectively referred to as "substrate suction plates") are used to form a four-corner ring-shaped substrate suction plate smaller than the substrate s. ln "), mounted on the cuboid-shaped frame 1 1 2. On the substrate suction plate 丨 丨 丨, a plurality of suction grooves 1U are formed along the length direction, and the plurality of suction grooves 113, as shown in FIG. 3, are connected to the suction source and The air suction / nitrogen supply piping of the nitrogen supply source (none shown in the figure) is connected. In this way, it is possible to use the action of the suction source to suck the air in the suction groove 3 and to supply nitrogen from the nitrogen supply source into the suction groove 3. In addition, in the state where the substrate s is mounted on the substrate suction plate 1U, the substrate s can be suctioned on the substrate suction plate 丨 丨 丨 by sucking the air in the suction groove. On the other hand, the substrate s is In the state of being sucked in the substrate suction plate 丨 丨 丨, by supplying nitrogen to the suction groove 1 1 3, the suction of the substrate s to the substrate suction plate 111 can be released. In addition, the outer edge of the substrate suction plate 111 丨:! 丨 a, as shown in FIG. 3, not

543112 V. Description of the invention (14) The angle is processed into a curved surface. In other words, the upper surface N1 and the outer end surface N2 of the substrate suction plate are connected by a curved surface N3 bent to the outside. In addition, a coating film using a resin is applied to the curved surface 3 (preferably the same as above) to reduce friction with the substrate s. In addition, the upper surface N1 and the inner end surface of the substrate suction plate lu are connected by a curved surface N5 which is bent to the outside. Moment: The four outer edge portions of the substrate suction plate 114 of the outer substrate are formed. The rectangular look-up table is smaller than the size of the effective area of the substrate S that is held. However, the size of / two inches can at least prevent the edge of the substrate being held by the plate and the soil plate s from hanging down, which can keep the sides flat. The substrate suction in the orthogonal direction is equal to * ^ π. ^ B ,,,,. Θθ; the length of the substrate is kept to a horizontal dimension. In addition, the substrate suction plate ln is not held in substantially the entire area of the substrate 3. Only use a moment with a size smaller than the outer edge portion llla to open the Λ Λ outer edge portion 111M. Board ill between the inner edge portion 111 | 3 to attract the substrate 4 ". Therefore, the inner edge portion 11 Inside lb, beauty and substrate s will not contact. Therefore, "Small, ^ β A Α ^ β A / the contact area with the substrate S becomes ▲. The static electricity generated between the substrate S and the substrate suction plate 111 is changed. In addition, in this embodiment, the lock Into the substrate suction plate, the lower screw and wire 116 are used to fix the substrate suction plate 111 to the frame through the frame 112. The screw 4 holes 11 5 'can be achieved. Above lu 1 page 18 C: \ 2D-CODE \ 91-07 \ 91107071.ptd 543112 Description of the invention (15) There is no recess other than the suction groove 1 1 3. Therefore, it is loaded (sucked) on the substrate The substrate s of the plate ill does not cause problems such as local depression due to depressions other than the suction grooves 11 3 on the substrate suction plate η.

^ The root bulge beef tip 12 is placed inside the substrate holding table 11 and is vertically placed on one base plate 121. The base plate 121 is coupled to a lift driving mechanism 13 provided below it. The lifting driving mechanism 3 includes: a pair of guide rails 131, which are fixed to the substrate holding table n and extend along the vertical direction. The movable lifting frame 132 is guided by the pair of guide guides. The screw shaft 133 The position between the pair of guide rails 31 and 31 is arranged along the vertical direction (the direction parallel to the guide rail 131); the nut 134 is screwed to the screw shaft 1 3 3; and the motor 丨3 5. The upper end coupled to the lifting frame 丨 32 of the screw shaft 133 is fixed below the base plate 21. In addition, the nuts 1 3 4 are mounted on the lifting frame 3 2. Therefore, the forward / reverse rotation of the motor 3 5 is used to raise and lower the lifting frame 3 2 along the guide rail 3 1 to raise and lower the base plate 121 fixed at the upper end of the lifting frame 132. According to this structure, the base plate 丨 2 1 is raised and lowered (moved up and down) using the lift driving mechanism 13 to support the central portion of the substrate S from the rear side with the lifting tip 1 2 so that the substrate S can be placed on the substrate suction plate. The upper surface of 111 is raised and lowered between the static elimination height He or the substrate receiving height Hd above the upper surface. The substrate receiving and receiving height Hd is, for example, a position between the static elimination height He and the static eliminator 4 above it. At the substrate receiving and receiving height Hd, the substrate s is performed between the substrate carrying robot and the lifting tip 12 (not shown). Acceptance. The motor 1 3 5 is connected to, for example, a control unit 5 including a microcomputer, and the control unit 5 drives

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The contact tip 211 in the clean cup 22 is blown and sprayed with a cleaning solution, and can be used to remove the resist solution and the solidified product of the resist solution or other π-dyeing substances in contact with the tip 2 11. Therefore, the contact tip 211 is cleaned with a cleaning solution at an appropriate time, so that the clean contact tip without the contaminated substance touches the end face of the substrate S, so that the substrate s can be carried out without being contaminated. S's positioning. The soil cleaning mechanism 3 is provided with cleaning heads 31A, 31B, 31C, and 31D (collectively referred to as "washing heads 3 1"). The blades are used to clean the substrates S that are attracted and held on the substrate ^ holder 11. Edges of 4 sides. Wash head 31A, 31B, 31C, 31D *

Do not engage the guide rails 32A, 32B, 32C, and 32D (arranged to be parallel to the four sides of the base plate 7), respectively, so that they can slide freely. In this second way, the cleaning heads 31 A, 31 B, 3 1C, and 3 1D can be linearly reciprocated linearly along the four sides of the substrate S, respectively.

As shown in the side view of FIG. 4, the cleaning head 3 1 has an upper nozzle block 3 1 1 and a lower nozzle block 3 1 2 which face each other up and down, and a body block on which the nozzle blocks 3 11, 3 1 2 are mounted. 3 1 3. The upper and lower nozzle blocks 3 11 and 3 1 2 are arranged to face each other at a certain interval, and a processing space 33 is formed between the upper and lower nozzle blocks 3 for inserting end edges of the substrate S to be processed. The above-mentioned nozzle block 311 protrudes in a direction where the substrate S exists above the upper surface of the substrate s, and protrudes into a flange shape, and the nozzle block 312 protrudes in a direction where the substrate s exists below the rear surface of the substrate, and protrudes into a flange shape. In addition, the solvent ejection nozzles 3 1 4 and 3 1 5 are respectively installed in the nozzle blocks 3 1 1 and 3 1 2 and face the processing space 3 3. In addition, gas nozzles 3 1 6 and 3 1 7 are disposed on the inner side of the substrate S (the front end side of the nozzle block 3 11, 3 1 2) which is more inward than the solvent discharge nozzles 3 1 4 and 3 1 5. Gas nozzle 3 1 6, 3 1 7

543112 V. Description of the invention (18) It is constructed as a spray gas (air or nitrogen, etc.) inclined from the inside of the substrate S toward the outside, and the solvent is ejected from the nozzles 3 1 4 and 3 1 5 to be supplied to the end of the substrate s. Solvents at the edges are blown out. The solvent ejection nozzles 3 1 4, 3 1 5 and the gas nozzle will be described in detail below. The position of the solvent ejection nozzle 35 and the gas nozzle 317 applied to the lower surface of the substrate s here is opposite to that of the solvent ejection nozzle 314 and the gas nozzle 316 applied to the upper surface of the substrate δ. Therefore, the solvent ejection nozzles 3 and 4 and the gas nozzles 3 and 6 are taken as examples for explanation. °

* The solvent ejection nozzle 314 is sprayed with a thin tube-shaped nozzle to dissolve / combine the resist film, and forms a solvent (called a solvent dot) in a dot shape on the surface of the substrate. A In addition, the gas nozzle 316 also uses a thin tube nozzle to spray gas. Table: Die: ;; Point: the area where the gas is formed (called the gas point). Then, adjust the lotion ejection nozzle 314 and the gas nozzle 316. The position j is such that the position of the gas point substantially overlaps yy on a line on which the straight edge of the substrate S of each of the two J of the solvent discharge nozzle m and the gas nozzle 316 are orthogonal to each other. Also, the nozzle 314 and the gas nozzle 316 are group i. In addition, the set of the ejection nozzles 314 and the gas nozzles 316 communicate with the suctioning path 318 formed in the body block 313 along its stroke. The suction path 318 is connected via a hose 319 to a source not shown in the figure. Therefore, the solvent or the like blown by the gas nozzles 316, 317 passes through the suction path.

543112 V. Description of the invention (19) 3 1 8 and hose 3 1 9 are recovered. With this structure ', the resist film in the effective area of the substrate S is not affected, and a solvent can be supplied to the edge portion of the substrate s to dissolve the non-film and remove it. FIG. 5 is a diagram for explaining the cleaning process of the edge portion of the substrate S. The substrate s of the processing target of the agent coating film is transmitted and received on the substrate to the lifting tip 12 (step T1). When the substrate S is given to the lifting pins 1 and 2, the lifting pins 丨 2 are lowered = 3; at the same degree as the upper surface of the suction plate 111 (the upper surface of the substrate holding table), the central portion of the substrate S is raised and lowered.丨 2 support, Heyi == edge part ... part of the shape is loaded on the substrate security "11" (v ^ T2). In this state, the position adjustment machine is used to position the substrate S in the buffalo plane. Then, the substrate S is positioned at a predetermined position (step T3). After the substrate is sucked by the air in the groove 113, the substrate 8 is adsorbed on the access panel 111 (step T4). Then, The lifting pins 12 at the center of the supporting substrate s are lowered by a predetermined minute height (step T5). The above-mentioned minute heights are set so that the substrate s and the lifting pins are maintained in contact with each other. 12 When the above-mentioned minute height is lowered, the state of the substrate s: middle: portion is slightly lower than that of the rim portion, and it becomes a supported lifting tip 1 2. Therefore, A 柘 ς X joint edge is more secure than soil failure i 1 and r — The soil plate S is not shifted. The position adjustment mechanism 2 can be used to ensure that the plate S is in the position to be positioned (the above-mentioned Fixed position). In addition, the central part of the substrate S is lifted and lowered, and the part other than the 2 branches is attracted and held in the substrate holder. Page 23 \\ 312 \ 2d-code \ 9】 -07 \ 9] 107071 · ι 543112 V. Description of the invention (20)-The suction plate 1 1 1 is used to support the area where the edge of the substrate will not sag and can be kept horizontal at the same position or inside of the effective area. Therefore, the substrate The substrate portion on the inner side of the inner edge portion 1Ub of the suction plate 111 can ensure the level of the end edge portion i even when there is a slight height difference between the base plate holding table 11 and the upper edge.

Then, the end portion of the substrate s is cleaned by the cleaning mechanism 3 (step T6). That is, the washing heads 31 and 31131 (:, 311) are moved along the guide rails 32A, 32B, 32C, and 32D from one end of each side of the substrate s attracted by the substrate attracting plate to the other end, In this process, the solvent is ejected from the two-dose ejection nozzle 3 14, 315, and the gas is ejected from the gas nozzle 3 16, 317. In addition, while the gas is ejected from the gas nozzles 3 1 6 and 3 1 7, the suction in the processing space 3 3 is performed via the suction path 3 1 8. When the end edge portion of the element substrate S is cleaned, nitrogen is supplied to the suction groove 13 through the air suction / nitrogen supply pipe 114 (step T7). The rising edge lowers the above-mentioned small degree, and is used to make the substrate s become slightly depressed at the central portion than the end edge portion, because the absorption state of the substrate s to the substrate suction plate 1 1 1 can be eased. Therefore, by supplying nitrogen to the subsequent suction groove 113, the substrate s can be prevented from being shifted, and the substrate s can be released from the suction state of the substrate suction plate 111.

Next, the lifting tip 12 is raised, and the substrate s is raised to a static elimination height (step T8). Then, at a certain time thereafter, the substrate 3 is held at the neutralization height He 'during which the substrate S is irradiated with positive and negative ions from the static eliminator 4 (step T9). In this way, when the substrate 3 is charged, it is possible to perform good static elimination on the charged substrate S, which can prevent

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543112 V. Description of the invention (21) Contamination of the substrate S (adsorption of dust, etc.). After the substrate s is de-energized, the lift pins 12 are further raised 'to raise the substrate S to the substrate receiving and receiving height Hd (step T10). Then, the substrate s is carried out from the substrate receiving and receiving height Hd (step T1 1). As described above, the substrate holding mechanism 丨 (substrate holding device) of this embodiment is configured to support the central portion of the substrate s from the back side by using a plurality of lifting pins 12 and use the lifting of the lifting pins 12 to make the substrate S lifting can reduce the bending of the substrate S on the lifting tip 12. For example, even if the substrate s is large and thin, the large and thin substrate s can be lifted well. In addition, when the end edge portion of the substrate S is cleaned, the substrate s is centered.卩 It is supported by the lifting tip 12 and the part other than the central part and the edge part 彳 It is sucked and held on the substrate holding table 丨 丨. With this method, even if the substrate 1 held by the substrate holding mechanism 1 is beautiful, the problem of writing and music is not caused. Therefore, in a state of being spaced apart from the nozzle blocks 3 丨 丨, 3 丨, the edge portion of the substrate s can enter the processing space, and a good cleaning treatment can be applied to the edge portion of the substrate S. That is, the distance between the beautiful surface and the solvent ejection nozzle 314 can be accurately maintained. Therefore, it does not affect the resist film in the effective area of the substrate S. In addition, because the substrate S keeps a certain door aside from the nozzle blocks 311 and 312, the suction path 318 can be positioned with the substrate S in the up and down direction. Therefore, the intensity of the exhaust gas from the suction path 318 becomes the basis ... degree. Therefore, no tick lice k formed on the upper or lower surface and lower surface of the substrate 3 will be stronger than the zap value, and the other will become more specific.

Page 543112

543112 V. Description of the invention (23) When the substrate S slides on the substrate holding table 1 1 (substrate suction plate 1 1 1), dust will not be generated due to the friction of the substrate S or the substrate suction plate 1 1 1 ' The pollution of the substrate S may be caused by the generated dust. 'It is not otherwise, the gas f is supplied between the substrate S and the substrate suction plate 11 i, and the suction state of the substrate S is attracted to the substrate suction plate 111, and the hole 2 is released because the plate is sucked from the substrate. 111 When the processed substrate 3 is lifted, == can occur, and the substrate § can be prevented from being charged due to static electricity. In addition, when the / plate suction plate 1 1 1 is lifted, even if the substrate s is charged, the voltage k of the substrate S is removed from the substrate cleaning device at the edge of the substrate. The degree of static elimination is He. Therefore, it is possible to further improve the contamination of the substrate S due to charging. The above description is the first embodiment of the present invention, but it may be implemented in other forms. For example, in the above-mentioned embodiment, the positioning of the substrate 5 is carried out in the state of being loaded on the substrate holding table, but the positioning of the substrate s can be performed in the state of being supported by the lift pins 12. That is, it is also possible to use a substrate handler to transport the substrate s that is the object of processing, and after the substrate 12 is lifted and raised, the contact tip 2ΐ is brought into contact with the end surface of the substrate S on the lift = 12 to position the substrate s at a predetermined position. Its location. In the case of positioning the substrate 5 on the lifting tip 12, when the structure of the positioning of the substrate 5 on the 2 plate 1 holding platform η is compared ... The amount of static electricity is reduced, which can be further improved. Electricity causes charging of the substrate s. In addition, when the positioning of the substrate 3 is performed on the lifting tip 12, the lifting tip 12τ is lowered after the positioning, and becomes the W substrate holding table η to hold the substrate. 91107071.ptd 543112

543112 V. Description of the invention (25) In addition, as shown in FIG. 7, the substrate suction plate 丨 丨 1 is set to swing freely around the horizontal axis 1 1 7 along its length direction, and the lifting pin 1 2 is clamped. One of them facing each other raises the outer edge portion of the substrate suction plate 1 1 1 丨 丨 a, and uses the outer edge portion 1 of the substrate suction plate 1 1 1 to press the substrate S up, which can also be used to The substrate S is attracted to the adsorption state of the substrate adsorption plate 丨 1. In addition, both the slight upward and downward movements of the lifting tips 12 and the shaking of the substrate suction plate 1 1 1 can also be used to ease the suction state of the substrate 3 to the substrate suction plate 1 1 1. That is, in parallel with the slight rise of the lifter 丨 2, the outer edge portion 丨 丨 a of the substrate suction plate 111 is lowered downward, and the substrate S is pressed up by the inner edge portion 11b of the substrate suction plate 11 1 It can also be used to ease the adsorption state of the substrate S to the substrate adsorption plate n. In addition, the disc lifting tips 1 2 are slightly lowered in parallel, so that the outer edge of the substrate suction plate 丨 丨 1 rises 1 1 a, so that the central tribe of the substrate S enters the substrate suction plate 丨It is also possible to ease the adsorption state of the substrate S to the substrate adsorption plate 丨 丨 丨. In addition, in the above-mentioned embodiment, the illustrated example uses a spiral structure constituted by a screw 133, a nut 134, and the like as the lifting driving mechanism, and a cylinder driving mechanism using a cylinder as a driving source may also be used. In addition, in the embodiment described above, the illustrated example is an unnecessary resist film adhered to the end edge portion of the substrate 8 after the coating solution, as an unnecessary edge edge portion of the substrate S. Thin film, but this application is used to remove unnecessary thin films after coating various photochemical solutions such as photoresist liquid, photosensitive polyimide resin, and filter dyes.

543112 V. Description of the invention (26) The attached drawing is used to describe in detail the second embodiment of the present invention. The surface cleaning device for the edge cleaning of the second embodiment of the second embodiment of the present invention is used to clean the substrate. Wash and see the cross section. The edge of the substrate washes the shape of the edge of the substrate s like the square substrate of the liquid substrate. For example, it is attached to the coating of anti-moisturizer 哕 其 佑 " ). I; ::: The plate Γ device is provided with: a substrate holding mechanism 1, which is used to hold the holding base of the structure 1 / hold = set the whole machine = 'for adjusting the pure substrate holding mechanism mechanism 3, for washing Above the net body 1 above, Γ solidifies a plate s and v part. In addition, as shown in FIG. 9, the spirit plate s held by the substrate is further equipped with a static eliminator 4 for separating after processing; The static eliminator 4 uses, for example, a corona discharge to generate the substrate S disposed thereon, so that the entire charge of the substrate k can be removed from the charge of the substrate S. The structure is based on a good S, and the substrate is used to hold the machine. The board is equipped with: a substrate holding table 11, which can be loaded with 8 substrates (2), which can be used to make the rod. Phase # + At the second stage, the substrate S is brought into contact with the substrate holding stage U of the substrate holding stage U on the back surface surrounding the substrate 3 LV: f:. The area 4 'of the substantially quadrangular frame attracts the contact area, so that the J plate S can be maintained at a predetermined substrate processing height, which becomes approximately two. The lower tip 12 is provided inside the substrate holding table 11 'on the base plate 121 which becomes straight. The base plate 121 is coupled to an elevating drive mechanism 13 provided below it. The boost driving mechanism 13 includes:

C: \ 2D-OODE \ 9] -07 \ 91107071.ρί ^ 543112 V. Description of the invention (27) A ---- The guide 131 is fixed on the substrate holding table ^ and extends in a straight direction =: may The moving elevating frame 132 is guided by the pair of guide rails ⑶, and the spiral shaft 133 is positioned between the pair of guide rails 131 in a vertical direction (parallel to the guide rails 131). Direction); a nut 134 to thread the screw shaft 133; and a motor 135 coupled to the screw shaft 133. The upper end of the elevating frame 132 is fixed below the base plate 2m. In addition, the nuts 1 3 4 are mounted on the elevating frame 丨 3 2. Therefore, by turning the horse 135 forward / reverse, the lifting frame 132 can be raised and lowered along the guide path i3i, and used to raise and lower the base plate 121 fixed to the upper end of the lifting frame 132. According to this structure, the base plate 丨 2 i is raised and lowered (moved up and down) by using a lifting drive mechanism 丨 3 to support the central portion of the substrate 3 from the rear side, so that the substrate S can be raised at a substrate processing height (substrate) Above the holding stage 丨 丨) and the substrate removal height above the substrate removal height or the substrate receiving and receiving height Hd. The substrate receiving and receiving height ^ is, for example, a position between the static elimination height He and the static eliminator 4 above it.

Hd, the substrate S is received and received between the substrate carrying robot and the lifting tip 2 (not shown). The position δ rounding mechanism 2 is equipped with 21 positioners, 218, 21 (], and 210 for 4 position adjustment heads that use the cylinder to advance and retreat. 21 position position adjustment heads, 218, 21, 2, 210, and 1 or more The contact pins 21 1 are arranged to advance and retreat in the directions of approaching and leaving the substrate s to the facing positions of the sides of the substrate S held by the substrate holding table 丨 丨. In this embodiment, two The position adjustment heads 21 A and 21B each have one contact tip 2Π.

543112 V. Description of the invention (28) The whole heads 2 1 A and 2 1 B form the sandwich substrate capture heads. The whole heads 21C and 21D have 2 target pairs respectively, and the position adjustment knife is the contact tip 2 of the 100 roots. Each contact tip 2 1 1 is set to the state where the front end hangs down, = the position adjustment heads 21A, 21B, 21C, 21C, 21D are moved forward and backward by the cylinder f to make the position adjustment heads 21A, 21B, a ^ A 1 In a state of great elongation, the end face of the substrate S is brought into contact with the substrate. At the position of the substrate s in the horizontal plane of all the contact pins 21 " 妾 =, Λ time, since it is determined, U is set at A% ς > when the substrate 3 is mounted on the substrate holding table 1 1 The gift box is extended, and each contact tip 211 is brought into contact; plate = end surface, the substrate 5 on the substrate holding table η can be positioned at the above-mentioned certain position.到 22 二 # = The surface I is in the most contracted state of the cylinder rod, and the contact tip 211 is retracted, so that it will not prevent the end of the substrate S from being cleaned by the cleaning mechanism 3. ^ ^ The starting position of each contact tip 2U is configured with The cleaning cup 22 is placed in the cleaning cup 22 with the contact tip 2U. During washing; =!,! The liquid nozzle is used to spray the washing liquid. The washing liquid is used to blow the sack liquid to the contact tip 211 contained in the washing cup 22, which can be used for washing and Since the cured resist adhered to the contact tip 21 丨 is removed, the contact tip 2 1 1 can be cleaned with a cleaning solution at an appropriate time, and the contact tip can be cleaned with the solidified product without the resist solution attached. 11 is in contact with the end surface of the substrate s, so that the substrate s can be positioned without contamination. The soil / cleaning mechanism 3 is provided with cleaning heads 31 A, 31 B, 3 1C, and 31 D (collectively referred to as "cleaning heads 3 1"), which are used to clean the substrates held and held by the substrate holding table 11 respectively. 543112

543112 V. Description of the invention (30) FIG. 10 is a cross-sectional view of the substrate holding table 丨〗 v ― v. The substrate remains another'Figure η is from the figure! 〇 之 —Sliding frame lm, 112B, fixed frame 112F; fixed frame U2F for free phase? Skin: It is set so that it can be paired with 119B in the horizontal direction, and it is installed on a pair of 、, ff; and the substrate suction plate 119A, the fixed frame η, the center frame im, ii2B-. -Between the foot frame, frame; = = Character 52. On the upper surface of the leg member 51, a plurality of connecting structure guides 53 extending in the Λ-thousand direction are provided with guides 54 in the direction of the long-distance uranium and the humans. Put two sliding members that can slide freely at μ 引 ¥ 道道 53 ^ U racks U2A, 112B are formed in the shape of a mouth when viewed in plan, so that the two are facing each other, and are set to span across a pair of Foot building. . A gap 57 is formed between the open ends of the sliding frames 112A and 112B, and a fixed tip 12 is arranged at each gap 57. The fixed tip 120 is set on the upper surface of the leg member 51, and its upper end is located in a plane including the upper surfaces of the substrate suction plates n9A and 119B. The parts of the foot members 51 along the slide frames 11 2A and 1 1 2B are respectively fixed to the slide members 5 4. In this way, the slide frames 11 2 A and 11 2 B can be reciprocated along the guide rail 53. . Further, the front ends of the cylinder rods 551 of the cylinders 55A and 55B are connected to the slide frames 112A and 112B 'via the brackets 56A and 56B. The air cylinders 55A and 55B are mounted on the fixed frame 112F so that each of the cylinder rods 551 can enter and exit in opposite directions away from the cylinder body 52 and in a direction parallel to the guide guide 53. The substrate suction plates 119A and 119B are respectively formed in pairs with the sliding frames 112A and 112B.

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Should be flat: 7-shaped. A plurality of suction grooves 3 are formed thereon (沟 昭 Figure 8). The plurality of suction grooves 113 communicate with an air suction / nitrogen supply pipe connected to a suction source and a nitrogen supply source (not shown in the figure). In this way, the action of the suction source can be used to suck the air in the suction groove 113, and to supply nitrogen into the suction groove 1 from the nitrogen supply source. In addition, '119 people can be loaded on the substrate suction plate 1198, the substrate 8 can be loaded in 1198, and the substrate 8 is loaded on the substrate suction plates 119A, 11 9B, and the substrate can be attracted by the air in the suction groove 11 3'. s is adsorbed on the substrate adsorption plate 丨 丨 9 a,

11 9 B above. On the other hand, in the state where the substrate s is sucked on the substrate suction plates 11 9 A, 1 1 9 B, by supplying nitrogen to the suction grooves 3, it can be used to release the suction of the substrate S to the substrate suction. Landing plates 1 1 9A, 1 1 9B. In a state where the cylinder rods 551 of the cylinders 55A and 55B are submerged in the cylinder body 552, the substrate suction plates 1 1 9A, 1 1 9B can be loaded with a substrate s 1 having a size of 750 mm X 6 2 0 mm, and the cylinder rod 5 5 The direction of occurrence of 1 is such that the end edge portion protrudes 15 mm from the end edges of the substrate suction plates 11 9A and 1 1 9B, and protrudes 50 mm in the orthogonal direction of the direction of the cylinder rod 551. On the other hand, in the state where the cylinder rods 551 of the cylinders 55A and 55B are most in and out of the cylinder body 5 52, for example, a substrate S2 with a size of 680 mrax 880 mm can be loaded on the substrate suction plate 1 1A, 1 1B, and the cylinder rod The direction of 551 so that its end edge protrudes 15 mm from the edges of the substrate suction plates 113A and 113B, and protrudes 15 mm in the direction orthogonal to the direction of the cylinder rod 551. In addition, the substrate S3 with a size of 73.0 mmx 920 mm is mounted in the direction of the cylinder rod 551 so that its end edge protrudes 35 mm from the edge of the substrate suction plate Π 9A, 11 9B, and in the direction of the cylinder rod 551. Protrudes 40 mm in the orthogonal direction.

C: \ 2D-CODE \ 91-07 \ 91107071.ptd Page 35 543112

Therefore, according to the size of the substrate to be processed, the substrate suction plate n9A, 119B & is moved, even if the substrate is a smaller size of 75mm x 62〇_ ^ J is 73mm X 920_ compared to A The size of the substrate S3 is to ensure that the substrate edge does not attract the substrate from the substrate. 丨 9 A, 〖9 B The large protrusions. This is the substrate holding stage of this embodiment. The device) can keep the bases of various sizes ^, s2, s3, and waiting at its end edge will produce help. In addition, by using the sliding of the substrate suction plates 119A, 119B (sliding frame 112α ι 2B), even if the gap 57 between the open ends of the sliding frames 11 2A, 11 2B becomes large, because the gap 57 is provided with a fixed tip 120, Therefore, there is no problem that the substrates S2 and S3 are bent if the interval is large. Obstacle 57

In addition, the adjustment operation accompanying the change in the size of the substrate requires the cylinder rod 55. of the cylinders 55A, 55B through the input operation panel and the like not shown in the figure, so the adjustment operation does not require a lot of time, When compared with a device that replaces the structure of the substrate suction plate according to the size of the substrate, the adjustment operation can be completed in a shorter time. Therefore, there is no reduction in the operating rate of the device due to the change in the size of the substrate. In addition, since you do not need to prepare a variety of substrate suction plates according to the size of the substrate, the cost of the device can be reduced. Although the second embodiment of the present invention has been described above, the present invention may be implemented in other forms. For example, in the embodiment described above, the example shown has a structure in which a pair of substrate suction plates 11 9A, 11 9B slide in the directions of approaching and leaving each other according to the size of the substrate, but it can also be used as shown in FIG. The structure shown in Fig. 12 makes four substrates in a flat L shape.

543112 V. Description of the invention (33) The suction plates 117A, 117B, 117C, and 117D use the driving mechanism including the air cylinder 6 to slide in the connecting direction of the center of the substrate S and the corner of the substrate S. In the case of such a structure, it is preferable to arrange the fixing pins 11 4 between the substrate suction plates 117A and 117B, between the substrate suction plates 117B and 117C, between the substrate suction plates 117C and 117D, and between the substrate suction plates. Between 117D and 117A.

In addition, 'the structure shown in FIG. 13 can also be used, with six substrate suction plates 118A, 118B, 118C, 118D, 118E, 118F, and the cylinder rods 5 5 1 of the cylinders 55A, 55B are submerged into the cylinder body. The state is a rectangular frame shape, and the substrate suction plates 118A to n8F are slid according to the size of the substrate by a driving mechanism including the cylinder 7. In the case of adopting such a structure, it is preferable to arrange the fixing tips 1 1 4 between the substrate suction plates 8A to 11 8 F adjacent to each other. In addition, the illustrated structure example uses a cylinder driving mechanism using a cylinder as a driving source to slide the substrate suction plate 119 ^ 1198. However, a spiral structure may also be used, and a screw mechanism including a screw shaft and a nut is used to Sliding the suction plates 119A, 119B. In the case of 1 * monthly day τ using such a spiral mechanism, the size of the substrate can be finer == position 'to prevent the problem of warping on the substrate: holding table u: substrate held by the substrate. In addition, the ## screw screw of this effect can also use a cylinder drive mechanism which uses a gas rainbow that can adjust the protrusion of the cylinder rod as a driving source. The film is said to be cold. In the above-mentioned embodiment, "the unnecessary part of the end edge of the substrate s" is coated with the unnecessary & agent coating film that adheres to the end edge of the substrate s, but the present invention also Can be applied in coating anti-surname liquid

543112 V. Description of the invention (34) After removing various chemical liquids such as photopolyimide resin and color filters, it is used to remove unnecessary films. In addition, various design changes can be made within the scope of the patent application. [Description of component numbers] 1 Board holding mechanism 2 Position adjustment mechanism 3 Washing mechanism 4 Eliminator 5 Control unit 11 Board holding table 12 Lifting tip 13 Lift driving mechanism 21A, 21B, 21C, 21D Position adjustment heads 31A, 31B, 31C , 31D Wash head 32A, 32B, 32C, 32D Guidance channel 33 Processing space 51 Foot member 52 Connecting member 53 Guide rail 54 Slide member 55A, 55B, 6, 7 Cylinder 57 Clearance 111 Substrate suction plate 1 1 1A, 111B , 1 1 1C, 11 1D suction plate

C: \ 2D-CQDE \ 91-07 \ 91107071.ptd Page 38 543112 V. Description of the invention (35) 111a Outer edge portion 111b Inner edge portion 112A, 112B 1 12F 113 Sliding frame

114 117 1 1 7A 1 18A fixed frame suction groove air suction / nitrogen supply pipe horizontal axis 117D 1 18F 119A, 119B 120 fixed tip 311 upper nozzle block 312 lower nozzle block 313 body block 3 1 4, 3 1 5 solvent discharge Nozzles 3 1 6, 3 1 7 Gas nozzles 318 Suction path 319 Hoses S, SI, S2, S3 Substrate suction plate Substrate suction plate Substrate suction plate Substrate

\\ 312 \ 2d-code \ 91-07 \ 91107071.ptd Page 39 543112 Brief description of drawings Figure 1 is a plan view of a substrate edge cleaning device (substrate processing device) according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view seen from I I-I I in FIG. 1. Fig. 3 is a sectional view for explaining the structure of a substrate holding table. Fig. 4 is a side view showing the structure of a washing head. FIG. 5 is a diagram for explaining a cleaning process of an edge portion of a substrate. Fig. 6 is a schematic cross-sectional view for explaining another structure for relaxing the adsorption state of the substrate on the substrate adsorption plate. Fig. 7 is a schematic cross-sectional view for explaining another structure for relaxing the adsorption state of the substrate on the substrate adsorption plate. Fig. 8 is a plan view of a substrate edge cleaning device according to a second embodiment of the present invention. Fig. 9 is a cross-sectional view as seen from I I-I I in Fig. 8. FIG. 10 is a plan view of a substrate holding table. Fig. 11 is a sectional view seen from V-V of Fig. 10. Fig. 12 is a diagrammatic plan view for explaining another example of the structure of the substrate holding table. Fig. 13 is a diagrammatic plan view for explaining another example of the structure of the substrate holding table.

C: \ 2D-CODE \ 91-07 \ 91107071. Ptd Page 40

Claims (1)

543112 VI. Patent application scope ~ ^ '~' --------- _ 1 A substrate holding device, which is characterized in that it includes: a first substrate supporting device which is in contact with water on a square substrate; The square substrate is supported at a predetermined high degree of refraction; the lunar surface is used for roughly the second substrate support device, and the area in contact with the area contacted by the square substrate plate support arrangement is earlier than the above-mentioned first base square substrate; Unique support for the lifting driving mechanism is used to relatively lift the second substrate substrate supporting device; and the farmer's clothing to the above-mentioned first talented garment making device is used to control the above-mentioned lifting driving fixed height to make the square substrate It is pre-supported by the above mentioned [^]. Both sides of the Le substrate support device 2. If the substrate protection device of the patent application No. 丨 the substrate support device includes a substrate loading plate, the flat substrate described above is smaller than the rectangular shape, and can be seen on ten sides than the square 3. Such as The application of the second scope of the patent application, the above-mentioned agricultural-loaded square substrate. The upper surface and the outer end surface of the substrate loading plate are " curved " clothed " wherein the upper surface of the substrate loading plate and the upper surface of the 2 end member surface are connected according to the third outer surface of the patent application scope. The upper surface of the substrate loading plate and the outer soil plate holding device, wherein the above-mentioned resin is coated. And the connection part is applied with the use of 6 · as in the scope of the patent application No. 2 in the above-mentioned substrate loading plate, soil plate holding device, in which the back surface of the substrate; and the surface is formed with suction holes for suction square W312 \ 2d-code \ 91-07 \ 91107071. Ptd 页 Page 41 M3112 VI. Scope of patent application The above-mentioned first substrate support device supports the above-mentioned substrate loading plate ^: The back of the square substrate is sucked and 7. · If you apply Patent Scope 6 ^. There is a gas supply device, which is connected to the upper substrate holding device, and further includes the upper surface of the substrate loading plate. The suction hole is used to supply the gas. 8 If the designated part of the substrate loading plate of the patent application scope No. 2 is constructed with soil ", I, where the above-mentioned horizontal axis can be shaken freely. 9. The outer end face of the substrate loading board as in item 2 of the scope of the patent application contains the soil plate? Xiang, where the above 10. As the scope of the patent application is 9 = = ;;; 4 side plates . At least one of the 4 plates, the soil plate holding clothes, in which the above-mentioned flat axis is freely shaken to be constructed so that it can be arranged around the water along the outer end surface so that it is structured so that the above 11 If the substrate holding item No. 10 of the scope of patent application is set to be a plate that can be freely shaken about the above-mentioned horizontal axis, the "outer edge" may be > to separate the back of the square substrate. I2. The substrate holding such as the scope of patent application No. 10 is constructed as a plate that can be freely shaken about the above-mentioned horizontal axis. The inner edge of the substrate can be separated from the back of the square substrate. 1 3 · As for the substrate holding and mounting of item No. 丨 in the patent application, the second substrate support includes a plurality of lifting pins, which are in contact with the back of the square substrate. 14. The base plate holding device according to item No. 3 of the patent application scope, wherein a suction hole is formed at the rigid end of the booster pin, which is used to suck the back of the square substrate. 543112 Sixth, the scope of the patent application is 0. There are two V. Specially set Lee #: The horizontal plane of the substrate holding device substrate of the wide item is touched on the end face of the square substrate 'to make the square 16. Hold in a predetermined substrate position. There is a substrate holding device for static elimination / placement Λ, which also includes _ clothes, which is used to remove electricity from square substrates. The base / anti-adjacent position of the square substrate is used to clean the substrate and the substrate where a thin film is formed on the surface.卩, which is characterized by including: the first to the end; the substrate holding device of item 6 / any-item; and the device of the device for supplying the solvent to the end of the film-shaped substrate held by the substrate holding device. The edge portion is used to remove the inconsistency formed at the end edge. The edge processing device includes a substrate processing device according to item 17 of the patent, in which the above-mentioned edge portion spit contains a solvent discharge nozzle and is used to face the square substrate 18. ^ ^ S ^ t -h it t g1 # A 25 has a gas nozzle, which is used to inject gas near the J supply position on the square substrate. The substrate processing device of item 19, wherein the above-mentioned f ^ z, b includes: a cleaning head for ejecting the above-mentioned solvent from the head, ":::: the mouth is kept as a whole; and the moving mechanism is used for Come to make the cleaning mover? '. Perform on the side of the square substrate of the substrate holding device described above. 21. The substrate processing device according to item 20 of the patent application scope, in which \\ 312 \ 2d-code \ 91-07 \ 91107071.ptd Page 43 543112 Sixth, the scope of the application for a patent is to form a processing space at the edge of the cleaning head which is used to receive the substrate of the processing object; and the above-mentioned end The edge cleaning device further includes an exhaust device, which is connected to the processing space described above and is used to exhaust the ambient gas in the processing space. 2 2 · If the substrate processing device according to item 21 of the patent application scope, wherein the above-mentioned cleaning head is provided with a pair of blocks facing up and down, the above-mentioned processing space is formed between the above-mentioned pair of blocks; and Each of the above-mentioned pair of blocks is provided with the above-mentioned solvent discharge nozzle and gas nozzle. 2 3 · A substrate holding device, comprising: a fixed frame; a plurality of substrate loading plates mounted on the fixed frame to which a substrate can be loaded; and a sliding mechanism for loading the plurality of substrates At least one of the plates slides the aforementioned frame relatively in a substantially horizontal direction. 2 4 · The substrate holding device according to item 23 of the scope of patent application, which further includes a fixed tip, which is arranged between the plurality of substrate loading plates for contacting the substrates loaded on the plurality of substrate loading plates. back. 25 · —A substrate edge cleaning device for cleaning the edge of a substrate on which a thin film is formed on a surface, which is characterized in that it includes: a substrate holding device in the scope of patent application No. 23 or 24; and The edge cleaning device is configured to supply a solvent to the edge portion of the substrate held by the substrate holding device, thereby removing unnecessary films formed on the edge portion. 1 C: \ 2D-CODE \ 91-07 \ 91107071.ptd Page 44