200537585 (1) 九、發明說明 【發明所屬之技術領域】 本發明是有關在被處理基板塗佈處理液形成膜之際， 提昇膜形成處理的生產量，同時能在被處理基板均勻塗佈 處理液的塗佈膜形成裝置。 【先前技術】200537585 (1) IX. Description of the invention [Technical field to which the invention belongs] The present invention relates to the improvement of the throughput of the film formation process when the substrate to be processed is coated with the processing solution to form a film, and at the same time, the substrate can be evenly coated and processed. Liquid coating film forming apparatus. [Prior art]
® 在例如LCD的製造方面，藉由在被處理基板的LCD 基板’成膜特定的膜之後，塗佈光阻液而形成光阻膜，對 應電路圖案而曝光光阻膜，將此行進顯像處理的所謂微影 技術形成電路圖案。在此微影技術，被處理基板的LCD 基板’主要的工程是經過所謂洗淨處理-> 脫水烘乾附著 (疎水化）處理-光阻塗佈—預烘-曝光-顯像-後烘的 一連串處理，於光阻層形成特定的電路圖案。 以往在此種處理方面，行進各處理的處理單元是以在 ® 搬送路的兩側意識處理順序的形態而配置。而對各處理單 元的LCD基板的搬入搬出，是藉由可在搬送路移行的中 央搬送裝置行進。此種處理系統，因基本上是隨機存取所 以處理的自由度極高。 於此種處理系統方面，在LCD基板塗佈光阻液形成 光阻膜的方法，有一種使帶狀塗佈光阻液的光阻供給噴嘴 與LCD基板，在與噴嘴吐出口的長邊方向正交的方向相 對移動而塗佈的方法。此時，在光阻供給噴嘴設置具有在 基板寬幅方向延伸的微小間隙的縫隙狀吐出口，將由此縫 -5- 200537585 (2) 隙狀吐出口被帶狀吐出的光阻液供給到基板的表面全體， 藉此形成光阻膜。 若根據此方法，由基板一邊至另一邊，帶狀吐出（供 給）光阻液的緣故，不會浪費光阻液，就能在角型的基板 全面形成光阻膜。再者，針對採用此種塗佈膜形成方法的 塗佈膜形成裝置，係揭示於日本專利文獻1 (特開平1 0 -156255) ° [專利文獻1]日本特開平〗〇 — ：[ 5 625 5號公報（第3頁 右欄第5行至第4頁左欄第6行、第1圖） 【發明內容】 [發明欲解決的課題] 可是有關利用前述塗佈膜形成方法的塗佈膜形成裝置 ，只是提昇膜形成處理的生產量，如第15圖所示，可設 置兩個由載置基板G的台面200、光阻供給噴嘴201、調 整附著在噴嘴201前端的光阻液狀態的噴嘴待機部202所 形成的裝置。若像這樣形成，於各個台面200，對基板並 進施行膜形成處理。 因而此時會有所謂印跡及裝置成本大增的技術性課題 〇 本發明是如前述情況下的發明，其目的在於提供一即 可極力抑制印跡及裝置成本大增還可使處理液塗佈在被處 理基板行進膜形成之際，提昇膜形成處理的生產量，同時 對各被處理基板均勻塗佈處理液的塗佈膜形成裝置。 -6 - 200537585 (3) [用以解決課題的手段] 爲解決前述的課題，有關本發明的塗佈膜形成裝置， 是針對被處理基板的表面塗佈處理液形成膜的塗佈膜形成 裝置，具有，具備··被並列配置且分別載置被處理基板的 第一台面及第二台面；和具有延伸於被處理基板的寬幅方 向的縫隙狀吐出口的一個處理液供給噴嘴；和移動前述處 ® 理液供給噴嘴的噴嘴移動手段；和對前述處理液供給噴嘴 供給處理液的處理液供給手段；和使來自前述吐出口的處 理液吐出到旋轉自如形成的滾輪的周面且使前述滾輪旋轉 藉此均勻化處理附著在前述吐出口的處理液的塗底處理手 段；藉此前述處理液供給噴嘴，對載置在第一台面及第二 台面的被處理基板的表面塗佈處理液爲其特徵。 像這樣，並到配置兩個台面，藉此對載置在各個台面 的被處理基板有效率的行進塗佈處理。即，在其中一方的 ® 台面進行塗佈處理中，在另一方的台面進行搬入搬出作業 的緣故，比以往單一台面的情況，更能節省基板搬入搬出 所需要的時間，可提昇生產量。 而前述塗底處理手段希望設置在前述第一台面與第二 台面之間。 而希望在對前述被處理基板行進塗佈處理之前，前述 噴嘴移動手段使前述處理供給噴嘴的吐出口接近前述滾輪 的周面，均勻化處理附著在前述吐出口的處理液。 像這樣所構成，藉此無論載置在哪一台面的基板，均 200537585 (4) 可在附著於處理液供給噴嘴的吐出口的處理液之均勻化處 理後，立刻進行塗佈處理。因而，對在任一台面所處理的 基板，都可行進膜厚均勻的塗佈處理，且提昇生產量。 而前述塗底處理手段，具備控制前述滾輪旋轉的滾輪 旋轉控制手段；希望在均勻化處理附著在前述吐出口的處 理液之際，前述滾輪旋轉控制手段是根據該均勻化處理後 的塗佈處理以前述第一台面或者前述第二台面的任一個台 ® 面所進行，來決定前述滾輪的旋轉方向。 若像這樣所構成，在噴嘴前端部，以吐出口爲邊境， 在與噴嘴行進方向相反側附著許多處理液的方式加以控制 。即，在噴嘴前端部方面，若以吐出口爲邊境，在與噴嘴 行進方向相反側附著許多處理液的狀態，就能在塗佈開始 時抑制因塗佈膜不均勻的掃帚痕等的發生。 並希望在前述塗底處理手段，設置抑制前述處理液供 給噴嘴前端乾燥的保濕手段。 ® 像這樣藉由設置保濕手段，就能在待機時抑制噴嘴前 端乾燥。 並希望前述塗底手段具備第一塗底處理手段及第二塗 底處理手段；前述第一塗底處理手段及第二塗底處理手段 ，分別配置在前述第一台面及第二台面的右側或左側。 並希望對載置在前述第一台面的被處理基板進行塗佈 處理之前，前述噴嘴移動手段使前述處理液供給噴嘴的吐 出口接近前述滾輪的周面，前述第一塗底處理手段均勻化 處理附著在前述吐出口的處理液，且對載置在前述第二台 -8- 200537585 (5) 面的被處理基板進行塗佈處理之前，前述噴嘴穆 前述處埋液供給噴嘴的吐出口接近前述滾輪的周 第二塗底處理手段均勻化處理附著在前述吐出口 〇 像這樣，並列配置兩個台面，藉此對載置在 的被處理基板有效率的進行塗佈處理。即，在其 台面進行塗佈處理中在另一方的台面進行搬入搬 ® 緣故，比以往單一台面的情況，更能節省基板搬 需要的時間，可提昇生產量。 而分別配置對應各台面的滾輪的緣故，對載 台面的基板，均可在附著於處理液供給噴嘴之吐 理液的均勻化處理後，立刻進行塗佈處理。因而 一台面所處理的基板，都可進行膜厚均勻的塗佈 提昇生產量。 並希望前述第一及第二塗底手段，具備控制 ^ 旋轉的滾輪旋轉控制手段；前述第一塗底處理手 與前述第二塗底處理手段的滾輪的旋轉方向爲同· 若像這樣所構成，在噴嘴前端部方面，以吐 境，在與噴嘴行進方向相反側附著許多處理液的 控制。即，在噴嘴前端部方面，如果以吐出口爲 與噴嘴行進方向相反側附著許多處理液的狀態， 佈開始時抑制因塗佈膜不均勻發生掃帚痕等的情3 再者，希望在前述第一塗底處理手段或者前 底處理手段設置抑制前述處理液供給噴嘴前端乾 ，動手段使 面，前述 的處理液 各個台面 中一方的 出作業的 入搬出所 置在任一 出口的處 對於在任 處理，且 前述滾輪 段的滾輪 一方向。 出口爲邊 方式加以 邊境，在 就可在塗 述第二塗 燥的保濕 -9 - 200537585 (6) 手段。 像這樣藉由設置保濕手段，就能在待機時抑制噴嘴前 端乾燥。 [發明效果] 若根據本發明，可提供一能極力抑制印跡及裝置成本 大增，並將處理液塗佈於被處理基板進行膜形成之際，提 ^ 昇膜形成處理的生產量，同時對各被處理基板均勻塗佈處 理液的塗佈膜形成裝置。 【實施方式】 [用以實施發明的最佳形態] 以下針對有關本發明的第一實施形態，根據圖面做說 明。第1圖是表示具備有關本發明之塗佈膜形成裝置（光 阻塗佈裝置）的光阻塗佈顯像處理裝置的全體構成的平面 圖。 此光阻塗佈顯像處理裝置1 00，係具備：載置收容被 處理基板之複數LCD基板G (以下稱爲基板G )的複數晶 圓匣C的晶圓匣站1 ;和具備欲對基板G施以包含處理液 的光阻液的塗佈及顯像之一連串的處理的複數處理單元的 處理站2 ;和欲在與曝光裝置4之間進行基板G之交接的 介面站3。 再者，在前述處理站2的兩端，分別配置前述晶圓匣 站1及介面站3。而於第1圖中，光阻塗佈顯像處理裝置 -10- 200537585 (7) loo的長邊方向爲x方向，於平面上與x方向正交的方向 爲Y方向。 晶圓匣站1具備欲在晶圓匣c與處理站2之間進行基 板G的搬入搬出的搬送裝置11°此搬送裝置Η具有搬送 臂1 1 a，可在沿著晶圓匣C之配列方向的Υ方向所設的搬 送路1 0上移動，藉由搬送臂1 1 a在晶圓匣c與處理站2 之間進行基板G的搬入搬出。 # 處理站2具有延伸於X方向的基板G搬送用之平行的 兩列搬送線A、B，沿著搬送線A由晶圓匣站1側向著介 面站3配列擦洗清淨處理單元（SCR ) 2 1、第1熱處理單 元區段26、光阻處理單元23及第2熱處理單元區段27的 一部分。 再者，在擦洗清淨處理單元（SCR) 21之上的一部分 ，設置準分子UV照射單元（e - UV ) 22。 而沿著搬送線B由介面站3側向著晶圓匣站1配列第 • 2熱處理單元區段27的一部分、顯像處理單元（DEV ) 24 、1線UV照射單元（i — UV ) 25及第3熱處理單元28。 而在處理站2，以構成前述兩列搬送線A，B的方式 ，且基本上依處理順序的方式配置各處理單元及搬送裝置 ，在該等搬送線A、B之間，設置空間部40。且可在此空 間部40往復移動地設置搬運梭4 1。此搬運梭4 1係可保持 基板G地被構成，成爲可在與搬送線A、B之間交接基板 G 〇 而介面站3具有：在處理站2與曝光裝置4之間進行 -11 - 200537585 (8) 基板G的搬入搬出的搬送裝置42 ;和配置緩衝晶圓匣的 緩衝台面（BUF ) 43 ;和具備冷卻功能的基板交接部的擴 張·冷卻台面（EXT · COL ) 44，上下積層標記器（ TITLER)與周邊曝光裝置（EE)的外部裝置區塊45是鄰 接設置在搬送裝置42。再者，搬送裝置42具備搬送臂 42a，藉由此搬送臂42a在處理站2與曝光裝置4之間進 行基板G的搬入搬出。 在像這樣所構成的光阻塗佈顯像裝置100方面，首先 被配置在晶圓匣站1的晶圓匣C內的基板G，經由搬送裝 置1 1搬入到處理站2之後，先進行利用準分子UV照射 單元（e - UV ) 22的擦洗前處理、利用擦洗清淨處理單元 (SCR) 21的擦洗清淨處理。 其次，基板G被搬入到屬於第1熱處理單元區段26 的熱處理單元區塊（TB) 31、32，施行一連串的熱處理（ 脫水烘乾處理、疎水化處理等）。再者，第1熱處理單元 區段26內的基板搬送是藉由搬送裝置33施行。 然後，基板G被搬入到光阻塗佈處理單元 23，施行 光阻液的膜形成處理。在此光阻塗佈處理單元2 3，先於光 阻塗佈裝置（CT) 23a方面，對基板G塗佈光阻液，接著 於減壓乾燥單元（VD ) 23b方面，完成減壓乾燥處理。 再者，此光阻塗佈處理單元23是包括作爲有關本發 明之塗佈膜形成裝置的光阻塗佈裝置（C T ) 2 3 a的單元， 詳細於後述。 在前述光阻塗佈處理單元2 3的光阻成膜處理後，基 -12- 200537585 (9) 板G被搬入到屬於第2熱處理單元區段27的熱處理單元 區塊（TB) 34、35，進行一連串的熱處理（預烘處理等） 。再者，第2熱處理單元區段27內的基板搬送是藉由搬 送裝置3 6進行。 其次，基板G是藉由搬送裝置36往介面站3的擴張 •冷卻台面（EXT · COL ) 44搬送，藉由搬送裝置42搬 送到外部裝置區塊45的周邊感光裝置（EE )。在此對基 ® 板G進行欲除去周邊光阻液的曝光，接著藉由搬送裝置 42搬送到曝光裝置4，基板G上的光阻膜被曝光而形成特 定的圖案。再者，按情況在緩衝台面（BUF ) 43上的緩衝 晶圓匣收容基板G之後搬送到曝光裝置4。 曝光結束後，基板G藉由介面站3的搬送裝置42被 搬送到外部裝置區塊45的上段標記器（TITLER)，並於 基板G記錄特定的資訊。然後，基板G被載置在擴張· 冷卻台面（EXT · COL ) 44，由此再次被搬送到處理站2 ^ 。並藉由例如滾柱搬送機構將基板G往顯像處理單元（ DEV ) 24搬送，在此施行顯像處理。 顯像處理結束後，基板G由顯像處理單元（DEV ) 24 被搬送到i線UV照射單元（i — UV) 25，對基板G施行 脫色處理。然後，基板G被搬入到第3熱處理單元區段 2 8，於熱處理單元區塊（T B ) 3 7、3 8施行一連串的熱處 理（後烘處理等）。再者’第3熱處理單元區段28內的 基板搬送是藉由搬送裝置39進行。 而基板G是在第3熱處理單元區段28被冷卻到特定 -13 - 200537585 (10) 溫度之後’藉由晶圓匣站1的搬送裝置1 1被收容在特定 的晶圓匣C。 其次，針對光阻塗佈處理單元2 3根據第2圖及第3 圖做說明。第2圖是構成光阻塗佈處理單元2 3的光阻塗 佈裝置（CT) 23a、及減壓乾燥單元（VD) 23b的平面圖 。第3圖是第2圖的光阻塗佈處理單元23的側面圖。 如圖所示，光阻塗佈裝置（C T ) 2 3 a及減壓乾燥單元 ·( VD) 23b是在支持台60之上按照處理工程的順序被配 置成橫一列。在支持台60的兩側舖設一對導軌62，藉由 沿著該導軌62平行移動的一組或複數組的搬送臂64，在 單元間直接取得基板G。 減壓乾燥單元（VD ) 23b，具有：上面爲開口的托架 或底淺容器型的下部真空室66 ;和能氣密密貼或是嵌合於 此下部真空室66之上面所構成的蓋狀上部真空室67。下 部真空室66爲略四角形，在中心部配置著欲水平載置而 ^ 支撐基板G的台面70，在底面的兩處設置排氣口 72。而 連接在各排氣口 72的排氣管73則連通至真空幫浦（圖未 表示）。並在下部真空室66以覆蓋前述上部真空室67的 狀態，將兩真空室內的處理空間藉由該真空幫浦減壓到特 定的真空度。 像這樣所構成的減壓乾燥單元（VD ) 23b，在光阻塗 佈裝置（C T ) 2 3 a對塗佈光阻液的基板G，施行加熱至減 ， 單 放燥 釋乾 被壓 慢減 慢此 劑在 溶， 的燥 中乾 阻遽 光急 ， 的 面時 方燥 燥乾 乾熱 壓加 減像 , 生 即產 ο 會 燥不 乾 於 壓由 -14- 200537585 (11) 元（V D ) 23 b，光阻不會受到不良影響，可促進光阻的乾 燥。 更針對光阻塗佈裝置（C T ) 2 3 a根據第2圖至第4圖 做說明。第4圖是表示光阻塗佈裝置（CT) 23a的外觀立 體圖。如圖所示，此光阻塗佈裝置（CT ) 23a，具備：水 平保持基板G的台面50(第一台面）及台面59(第二台 面）：和配設在該等台面上方的光阻供給噴嘴（處理液供 • 給噴嘴）5 1 ;和使此光阻供給噴嘴5 1 (以下稱噴嘴5 1 ) 移動的噴嘴移動手段86。於此構成中，噴嘴5 1藉由噴嘴 移動手段86做水平移動，藉此使台面50、59上的基板G (G 1、G2 )與噴嘴5 1做相對水平移動。 再者，如第3圖所示，前述台面50及台面59分別具 備設有可昇降之吸附機構的基板保持部50a、59a，藉由前 述基板保持部50a、59a收取保持被搬入的基板G。 而如第4圖所示，前述噴嘴51具有：延伸於基板G1 ^ 、G2之寬幅方向的縫隙狀吐出口 5 1 a ;和連通此吐出口 5 1 a的光阻液收容室（圖未表示），經由連接於此光阻液 收容室的光阻液供給管5 7而連接光阻液供給源9 5 (處理 液供給手段）。 再者，噴嘴5 1的前端部，如第5圖的放大斷面圖所 示，由其短邊側觀看成錐狀，沿著噴嘴短邊方向，在吐出 口 5 1 a的前後分別形成下端面5 1 b及傾斜面5 1 c。而此噴 嘴5 1在塗佈處理時的行進方向具有方向性。即，如第5 圖所示，與噴嘴行進方向相反側的下端部5 ；[ b，係寬幅地 -15- 200537585 (12) 形成噴嘴短邊方向的長度。藉此像這樣所形成，被吐出的 光阻液R會經由下端部5 1 b的面往基板表面被推壓，使塗 佈處理變得很安定。 而如第2圖至第4圖所示，在台面50與台面59之間 ，設置噴嘴待機部5 5 (塗底處理手段）。此噴嘴待磯部 5 5，具備：欲在待機時使附著在噴嘴5 1之前端的光阻液 均勻化（稱爲塗底處理）之旋轉自如的塗底滾輪52 (滾輪 );和爲洗淨該塗底滾輪52浸泡在沖淡劑的容器53 ;和 用以抑制噴嘴5 1前端乾燥的保濕部（保濕手段）54。 再者，對基板之塗佈處理前的塗底處理，如第6圖所 示，使噴嘴5 1的前端接近塗底滾輪5 2的周面而配置。並 由吐出口 51a吐出光阻液R，另一方面，藉由滾輪旋轉控 制手段65使塗底滾輪52旋轉，進行附著在噴嘴51之前 端的光阻液R的均勻化處理。 而如第6圖所示，由吐出口 5 1 a吐出的光阻液R流入 到滾輪5 2的旋轉方向。因而，於塗底處理後，在噴嘴5 J 前端之其中一方，沿著滾輪5 2的旋轉方向，附著比另一 方更多的光阻液的狀態。再者，於塗佈處理時，以吐出口 5 1 a爲邊境，少許附著光阻液R的這側爲行進方向的方式 控制噴嘴5 1的移動方向。藉由像這樣所形成，而於塗佈 開始時抑制掃帚痕等的發生，使塗佈膜更均勻。 而如第6圖所示，在塗底滾輪52的途中，設置滑動 片9 1。此滑動片91是由耐藥品性的樹脂所形成，前端滑 接到塗底滾輪52的周面，除去周面上所不要的前次之回 -16- 200537585 (13) 流的光阻液和沖淡劑8 9。 再1者’滑動片9 1的前端形狀以能發揮此光阻液除去 功能爲佳’除用在此例的楔形斷面外，可採用矩形斷面和 二股狀的斷面形狀的任意形狀。 而此滑動片91是藉由氣缸90可在接觸到塗底滾輪52 周面的下位置與遠離塗底滾輪5 2周面的上位置之間昇降 地被構成’配合需要，可變更其位置。 而如第4圖所示，在吐出口 5 1 a的長邊方向的兩側， 設置減低由此吐出口 5 1 a吐出的光阻液R的吐出壓的膜厚 控制手段80。該膜厚控制手段8〇是以分別連接於連通到 吐出口 51a之長邊方向的兩側的連通路81的吸引管82 ; 和設置在吸引管82的例如隔膜幫浦的吸引幫浦83所構成 ’以藉由吸引幫浦8 3的驅動使吐出口 5 1 a之兩側的吐出 壓減低的方式所構成。再者，在吸引管82的吸引幫浦83 的吸引側即噴嘴5 1側，介設開閉閥84。 接著，針對前述構成的光阻塗佈裝置（CT) 23a的動 作形態做說明。最初如第4圖所示，針對在例如載置於台 面5 0的基板G 1，塗佈光阻液R時的動作做說明。 首先，將噴嘴5 1配置在噴嘴待機部5 5，另一方面將 藉由搬送臂64所搬送的基板G 1吸附保持在台面5 0上。 此時，藉由設置在台面50的基板保持部50a而吸附基板 G1。並由光阻液供給源95將光阻液R供給到噴嘴5 1內的 光阻液收容室，同時藉由噴嘴移動手段8 6將噴嘴5 1由噴 嘴待機部5 5移動到台面5 0的左側端部上方。 -17· 200537585 (14) 其次，噴嘴5 1是一面由吐出口 5 1 a吐出光阻液r， 一面在基板G1上往右方向移動。再者，吐出口 51a與基 板G的距離，設置在40〜150// m左右，理想爲設定在60 [1 m 〇 而此時，驅動吸引幫浦83來吸引吐出口 5ia之長邊 方向的兩側，藉此減少吐出口 5 1 a之兩側的光阻液R的吐 出壓，吐出口 5 1 a的中央部側的吐出壓與兩側的吐出壓大 ® 致相等的狀態，即，光阻液R的液厚爲相等的狀態，帶狀 吐出到（供給）基板G上。因而，基板G與噴嘴5 1相對 水平移動，藉此在基板G的表面帶狀供給光阻液R，於基 板G的表面全體形成均勻膜厚的光阻膜。 像這樣，在基板G表面形成光阻膜之後，停止光阻液 R的供給，同時將噴嘴51移動到待機位置，且將噴嘴5 1 的吐出口 51a接近到噴嘴待機部55內的塗底滾輪52，配 備在下一塗佈處理。而形成光阻膜的基板G藉由搬送臂 ^ 64從載置台50被搬送到減壓乾燥單元（VD) 23b。 其次，針對於光阻塗佈裝置（CT) 23a方面，對複數 基板連續進行塗佈處理時的噴嘴5 1的動作，根據第7圖 及第8圖做說明。第7圖是表示噴嘴51之移動方向的模 式圖。第8圖是表示噴嘴51之動作控制工程的流程圖。 先使噴嘴51接近噴嘴待機部55的塗底滾輪52，進行 噴嘴5 1前端的塗底處理（第8圖的步驟S1 )。未塗佈處 理狀態的基板G1被搬送到台面5 0上時（第8圖的步驟 S2 )，噴嘴51移動到台面50的左側端部上，對基板G1 -18- 200537585 (15) 進行光阻液R的塗佈處理（第8圖的步驟S 3 )。再者， 此時’噴嘴5 1移動到第7圖箭頭所示的方向，進行塗佈 處理。 其次’噴嘴5 1移動到噴嘴待機部5 5，進行噴嘴5 1前 端的塗底處理（第8圖的步驟S4 )。末塗佈處理狀態的 基板G2被搬送到台面59上時（第8圖的步驟S5 )，噴 嘴5 1移動到台面5 9的右側端部上，對基板G2進行光阻 液R的塗佈處理（第8圖的步驟S 6 )。再者，此時噴嘴 5 1移動到第7圖箭頭所示的方向，進行塗佈處理。 其次，回到第8圖的步驟S 1的處理，然後未塗佈處 理狀態的基板連續搬送到各台面時，按照前述的流程，對 基板進行塗佈處理。 而在前述步驟S2或步驟S5方面，基板未被搬送到台 面上時，噴嘴51在塗底處理後移動到保濕部54，在噴嘴 5 1前端未乾燥的狀態下待機（第8圖的步驟S 7 )。 再者，如前述，噴嘴5 1於塗佈處理時在行進方向具 有方向性。因此，於塗佈處理時，對基板G1、G2，如第 7圖的箭頭所示，在同一方向，噴嘴5 1以在基板上移動的 方式藉由噴嘴移動手段86控制移動的動作。 若根據以上說明的第一實施形態，並列配置兩個台面 50、59，藉此對載置各台面的基板G有效率的進行塗佈處 理。即，在其中一方的台面進行塗佈處理中，在另一方的 台面進行搬入搬出作業的緣故，比以往單一台面時，更能 節省基板搬入搬出所需要的時間’可提昇生產量。 -19- 200537585 (16) 而在兩個台面5 0、5 9間配置噴嘴待機部5 5的緣故， 對載置在任一台面的基板G，都可在對噴嘴5 1的塗底處 理後，立刻進行塗佈處理。因此，對連接在任一台面的基 板G，都可進行膜厚均勻的塗佈處理。 而相較於第15圖所示之具備兩個由台面、噴嘴及噴 嘴待機部所形成的裝置的情形，可縮小印跡，還可減低裝 置成本。 進而，若根據前述實施形態所示的構成，在台面50 或台面59的任一方，因搬送臂64或基板保持部50a、59a 等的故障無法進行塗佈處理的狀態，均可使得有別於第8 圖所示之流程的流程動作，就可藉此在另一方的台面進行 塗佈處理。β卩，台面5 0側發生故障時，對噴嘴5 1前端的 塗底處理及台面59上之未處理的基板G2依序重複進行塗 佈處理的方式使其動作。另一方面，台面5 9側發生故障 時，對噴嘴51前端的塗底處理及台面50上之未處理的基 板G1依序重複進行塗佈處理的方式使其動作。因而，可 回避因前述故障引起光阻塗佈顯像處理裝置100的運轉中 斷。 接著，根據第9圖至第1 1圖針對有關本發明的塗佈 膜形成裝置（光阻塗佈裝置）的第二實施形態做說明。再 者’於第二實施形態，與前述之第一實施形態僅光阻塗佈 裝置23a的構成及其動作控制不同的緣故，有關其他共通 的構成省略詳細的說明。 第9圖是模式表示第二實施形態的光阻塗佈裝置的側 -20- 200537585 (17) 面圖。第1 0圖是說明利用第9圖之光阻塗佈裝置具有的 光阻供給噴嘴的塗佈處理的圖。第1 1圖是說明第9圖之 光阻塗佈裝置具有的光阻供給噴嘴的塗底處理的圖。 在該第二實施形態，如第9圖所示，噴嘴5 1是根據 藉由噴嘴移動手段8 6的動作控制，將塗佈處理時的移動 方向變更到台面5 0側或台面5 9側。 而如第1 〇圖所示，噴嘴5 1的前端部是隔著吐出口 ® 5 1 a而向對的下端部5 1 1 —同形成寬幅。像這樣所形成， 藉此就連噴嘴51的行進方向爲箭頭所示的任一方向，被 吐出的光阻液R就可利用下端部5 1 b的面往基板表面被推 壓，安定的被塗佈。 而於第1 1圖所示的塗底處理，滾輪旋轉控制手段65 是根據下一次的塗佈處理在台面50或台面59的任一個台 面進行來決定滾輪5 2的旋轉方向。即，於噴嘴5 1前端， 以吐出口 5 1 a爲邊境，在下一次塗佈處理的噴嘴行進方向 1 的相反側附著許多光阻液R的方式決定滾輪5 2的旋轉方 向。 而如圖所示，隔著噴嘴5 1在滾輪5 0的左右，分別設 置滑動片91，任一個滑動片91均藉由滾輪52的旋轉方向 滑接到滾輪5 2之周面的方式被控制。即，藉由滾輪52的 旋轉方向，任一個滑動片90被驅動，就可控制滑動片9 1 的昇降動作。 像這樣，若藉由有關本發明的第二實施形態，對被載 置在台面50的基板G1或被載置在台面59的基板G2的 -21 - 200537585 (18) 任一個，都可在塗底處理後直接使噴嘴5 1移動到處理的 基板方向，照樣進行塗佈處理。即，比在噴嘴5 1之行進 方向具有方向性的構成，更不浪費噴嘴5〗的移動動作的 緣故，更能提昇生產量，還能抑制噴嘴5 1前端乾燥。 因而，若根據本實施形態，第9圖所示的光阻塗佈裝 置2 3 a的構成，藉此比前述第二實施形態的情形，在略同 一印跡更能提昇產出量的構成。 接著，根據第1 2圖針對有關本發明的塗佈膜形成裝 置（光阻塗佈裝軍）的第三實施形態做說明。再者，於第 三實施形態，與前述的第一實施形態僅光阻塗佈裝置23 a 的構成及其動作控制不同的緣故，有關其他共通的構成省 略詳細的說明。 第1 2圖是模式表示第三實施形態的光阻塗佈裝置的 側面圖。如第12圖所示，分別載置基板G1、G2的台面 5 0及台面5 9是被橫向並列配置，在與台面5 9相反側的台 面5 0的鄰近處設置噴嘴待機部5 5 (塗底處理手段）。 於該光阻塗佈裝置23a，由噴嘴待機部55移動的噴嘴 51先對台面50上的基板G1進行塗佈處理，接著對台面 5 9上的基板G2進行塗佈處理，再回到噴嘴待機部5 5。 像這樣，若根據有關本發明的第三實施形態，可對分 別載置在台面50及台面59上的基板Gl、G2連續進行塗 佈處理的緣故，可增加相當單位時間的處理枚數。 可是，在前述第三實施形態，對基板G 1之塗佈處理 後，於塗佈處理中乾燥固化的光阻液會附著在縫隙狀的吐 -22- 200537585 (19) 出口周邊。因此，在此狀態對下一基板G2進行塗佈 的話，會有所謂來自吐出口的光阻液的吐出散亂而無 基板面進行均勻塗佈處理之虞的技術性課題。 於是，解決前述技術性課題的實施形態，是根據 圖針對有關本發明的塗佈膜形成裝置（光阻塗佈裝置 第四實施形態做說明。再者，於第四實施形態，與前 第一實施形態僅光阻塗佈裝置23a的構成及其動作控 ® 同的緣故，有關其他共通的構成省略詳細的說明。 第1 3圖是模式表示第四實施形態的光阻塗佈裝 側面圖。如第1 3圖所示，形成將滾輪52 (第一塗底 手段）及保濕部54配置在台面50的左側，且將滾輪 第二塗底處理手段）配置在台面5 9的左側的構成。 滾輪63是被配置在台面52與台面63之間。再者， 部54也可配置在滾輪63的鄰近處。而圖雖未表示， 可將滾輪52及保濕部54配置在台面50的右側，且 ^ 輪6 3配置在台面5 9的右側。而在此情況，也可將保 54配置在滾輪59的鄰近處。再者，前述滾輪52與 63是在同一方向旋轉。 若爲此種構成，就可先在利用滾輪5 2的塗底處 ，對在台面5 0的基板G 1進行塗佈處理，接著在利用 6 3的塗底處理後，對在台面5 9的基板G2進行塗佈 〇 像這樣，若藉由有關本發明的第四實施形態，對 載置在台面50與台面59的基板G1及基板G2的任 處理 法對 m 13 )的 述的 制不 置的 處理 63 ( 即， 保濕 但也 將滾 濕部 滾輪 理後 滾輪 處理 分別 一個 -23- 200537585 (20) ，均可在塗佈處理前進行塗底處理的緣故，就可解決在第 三實施形態的技術性課題。 而於第一實施形態印跡及裝置成本比第4圖所示的光 阻塗佈裝置2 3 a的構成更爲大增，但於第二實施形態可得 到與第9圖所示的光阻塗佈裝置同等的生產量。 再者，於前述第一至第四實施形態，具備有關第1圖 所示之本發明的塗佈膜形成裝置（光阻塗佈裝置）的光阻 ® 塗佈顯像處理裝置的全體構成（佈置）爲其中一例，並不 限於此。於第1 4圖表示其他形態的全體構成（佈置）。 在此，針對第1 4圖所示的光阻塗佈顯像處理裝置1 0 1 的佈置做簡單說明。再者，有關與第1圖所示的構成相同 的部份以相同的符號標示，其詳細說明省略。 光阻塗佈顯像處理裝置1 0 1與第1圖的光阻塗佈顯像 處理裝置1 0 1同樣地，沿著圖的X軸方向，並具備晶圓匣 站1、處理站2及介面站3。有關光阻塗佈顯像處理裝置 ® 1 〇 1的構成，第1圖的光阻塗佈顯像處理裝置1 00即可明 白，不同是在於廢除搬運梭41、搬送裝置33、36、39等 ，且各處理單元的基板G搬送，使用垂直搬送單元（S/A )的這點。 此垂直搬送單元（S/A)具有供搬送基板G的搬送臂 (圖示省略），其搬送臂可在X、Y及Z軸方向移動，且 可在水平方向轉動。 此構成的垂直搬送單元（S/A ) 13、15、12、14分別 鄰接配置在第1熱處理單元區段26、第2熱處理單元區段 -24- 200537585 (21) 27、第3熱處理單元區段28，甚至光阻塗佈處理單元23 〇 再者，有關鄰接配置在光阻塗佈處理單元23的垂® 搬送單元（S/A ) 14，可沿著光阻塗佈裝置（CT ) 23a的 長邊方向（X方向）大幅移動單元自體。即，對分別載® 在光阻塗佈裝置（CT) 23a的台面50及台面59的基板G 而言，可對應搬送單元。 針對以上構成的光阻撃佈顯像處理裝置1 〇 1的處理工 程做簡單說明。 首先，配置在晶圓匣站1的晶圓匣C內的基板G ’藉 由搬送裝置1 1搬送到處理站2之後，先利用準分子UV 照射單元（e - UV ) 22進行擦洗前處理，且利用擦洗清淨 處理單元（SCR ) 21進行擦洗清淨處理。 其次，基板G被搬入到屬於第1熱處理單元區段26 的熱處理單元區塊（TB) 31、32，進行一連串的熱處理（ 脫水烘乾處理、疏水化處理等）。再者，第1熱處理單元 區段26的基板搬送是藉由垂直搬送單元（S/A) 13進行 〇 然後，基板G被搬入到光阻塗佈處理單元23，施行 光阻液的膜形成處理。在此光阻塗佈處理單元23，以前述 第一至第四實施形態做說明，於光阻塗佈裝置（CT ) 23a ，對基板G塗佈光阻液，接著在減壓乾燥單元（VD ) 23b 完成壓乾燥處理。 再者，於此佈置，減壓乾燥單元（VD )構成兩段， -25- 200537585 (22) 構成可對兩枚基板G並列處理（佈置與第2圖、第3圖的 例子不同。）。即，在光阻塗佈裝置（CT ) 23a，連續有 效率地對塗佈光阻的複數基板G並列進行減壓乾燥處理， 提昇生產量 ° 而對光阻塗佈裝置（CT) 23a及減壓乾燥單元（VD) 23b內的基板G之搬入、搬出，全藉由垂直搬送單元（ S/A ) 14 進行。 在前述光阻塗佈處理單元23進行光阻成膜處理後， 基板G被搬入到屬於第2熱處理單元區段27的熱處理單 元區塊（TB) 33，進行一連串的熱處理（預烘處理等）。 再者，第2熱處理單元區段27內的基板搬送是藉由垂直 搬送單元（S/A) 15進行。 其次，基板G被搬送到介面站3的外部裝置區塊45 的周邊曝光裝置（EE)。在此對基板G進行除去周邊光 阻的曝光。其次，基板G藉由具有與垂直搬送單元（S/A )相同之構成的介面單元（I/F ) 20被搬送到曝光裝置4， 基板G上的光阻膜被曝光而形成特定的圖案。再者，按情 形，在緩衝台面（BUF ) 43上的緩衝晶圓匣收容基板G後 ，搬送到曝光裝置4。 曝光結束後，基板G藉由介面單元（I/F ) 20被搬送 到外部裝置區塊45的上段標記器（TITLER)，並於基板 G記錄特定的資訊。再者，按情形，曝光結束後，在緩衝 台面（BUF ) 43上的緩衝匣收容基板G後，搬送到外部裝 置區塊45的上段標記器（TITLER)。 -26- 200537585 (23) 然後，基板G再被搬送到處理站2，在屬於第2熱處 理單元區段27的熱處理單元區塊（HP ) 35，進行一連串 的熱處理（後曝光烘乾等）。 並藉由例如滾柱搬送機構將基板G往顯像處理單元（ DEV) 24搬送，在此施行顯像處理。 顯像處理結束後，對基板G由顯像處理單元（DEV ) 24搬入到i線UV照射單元（i一 UV) 25的基板G施行脫 ® 色處理。然後，基板G被搬入到第3熱處理單元區段2 8 ，在熱處理單元區塊（TB) 37施行一連串的熱處理（後 烘處理等），在熱處理單元區塊（TB ) 3 8冷卻到特定溫 度。再者，第3熱處理單元區段28內的基板搬送是藉由 垂直搬送單元（S/A) 12進行。 然後，基板G藉由輸送帶搬送被搬送到晶圓匣站1 ’ 藉由搬送裝置11收容在特定的晶圓匣C。 有關以上說明的光阻塗佈顯像處理裝置1 0 1的構成’ ® 如圖所示，在垂直搬送單元（S/A) 12的周邊配置第3熱 處理單元區段28，在垂直搬送單元（S/A) 13的周邊配置 第1熱處理單元區段26。更在垂直搬送單元（S/A) 14的 周邊配置光阻塗佈處理單元23，在垂直搬送單元（S/A) 15的周邊配置第2熱處理單元區段27。 因此，能有效率的進行基板搬送處理，進而，避免各 熱處理單元區段26、27、28和光阻塗佈處理單元23並設 在一方向，達到光阻塗佈顯像處理裝置的小型化。 而像這樣佈置的光阻塗佈顯像處理裝置1 0 1，均能有 -27- 200537585 (24) 效配置有關本發明的塗佈膜形成裝置。 再者，前述所有的實施形態中，以在LCD基板塗佈 形成光阻膜的情形爲例，但不限於此，適用於將處理液供 給到被處理基板上的任何塗佈膜形成裝置。本發明的處理 液除光阻液以外，例如也可爲層間絕緣材料、介電質材料 、配線材料等的液體。而本發明的被處理基板並不限於 LCD基板，也可爲半導體晶圓、CD基板、玻璃基板、光 β 罩、印刷基板等。 [產業上的可利用性] 本發明可應用於在LCD基板或半導體晶圓等使處理 液成膜的塗佈膜形成裝置，適用於半導體製造業界、電子 設備製造業界等。 【圖式簡單說明】 ® 第1圖是表示具備有關本發明的塗佈膜形成裝置（光 阻塗佈裝置）的光阻塗佈顯像處理裝置的全體構成的平面 圖。 第2圖是表示具備第1圖之光阻塗佈顯像處理裝置的 光阻塗佈處理單元的第一實施形態的平面圖。 第3圖是第2圖的光阻塗佈處理單元的側面圖。 第4圖是表示構成第2圖之光阻塗佈處理單元的光阻 塗佈裝置外觀的立體圖。 第5圖是具備第4圖之光阻塗佈裝置的光阻供給噴嘴 -28- 200537585 (25) 之前端放大剖面圖。 第6圖是說明具備第4圖之光阻塗佈裝置的光阻供給 噴嘴的吐出口附近的光阻液均勻化處理的圖。 第7圖是表示具備第4圖之光阻塗佈裝置的光阻供給 噴嘴的移動方向的模式圖。 第8圖是表示具備第4圖之光阻塗佈裝置的光阻供給 噴嘴的動作控制工程的流程圖。 第9圖是模式表示有關本發明的塗佈膜形成裝置（光 阻塗佈裝置）的第二實施形態的側面圖。 第10圖是說明利用第9圖之光阻塗佈裝置所具有的 光阻供給噴嘴的塗佈處理的圖。 第11圖是說明第9圖之光阻塗佈裝置所具有的光阻 供給噴嘴的塗底處理的圖。 第1 2圖是模式表示有關本發明的塗佈膜形成裝置（ 光阻塗佈裝置）的第三實施形態的側面圖。 第13圖是模式表示有關本發明的塗佈膜形成裝置（ 光阻塗佈裝置）的第四實施形態的側面圖。 第14圖是表示具備有關本發明的塗佈膜形成裝置（ 光阻塗佈裝置）的光阻塗佈顯像處理裝置的其他全體構成 (佈置）例的平面圖。 第15圖是表示具備兩台習知塗佈膜形成裝置時的光 阻供給噴嘴的動作圖。 【主要元件符號說明】 -29- 200537585 (26) 2 3 a :光阻塗佈處理單元 23 :光阻塗佈裝置（塗佈形成裝置） 50 :台面（第一台面） 5 1 :光阻供給噴嘴（處理液供給噴嘴） 5 1 a :吐出口 5 1 b :下端面 5 1 c :傾斜面 5 2 :塗底滾輪（第一塗底手段） 5 5 :噴嘴待機部（塗底處理手段） 59 :台面（第二台面） 8 6 :噴嘴移動手段 63 :塗底滾輪（第二塗底手段） 65 :滾輪旋轉控制手段 95 :光阻液供給源（處理液供給手段） 100 :光阻塗佈顯像處理裝置 1 0 1 :光阻塗佈顯像處理裝置 G : LCD基板（被處理基板） G1 : LCD基板（被處理基板） G2 : LCD基板（被處理基板） R :光阻液（處理液） -30-® In the manufacture of LCDs, for example, By forming a specific film on the LCD substrate 'of the substrate to be processed, Coating a photoresist liquid to form a photoresist film, Expose the photoresist film in accordance with the circuit pattern, A so-called lithography technique that progresses this development process forms a circuit pattern. In this lithography technique, The main process of the LCD substrate to be processed is a so-called cleaning process- > A series of processing of dehydration drying adhesion (hydration) treatment-photoresist coating-pre-baking-exposure-development-post-baking, A specific circuit pattern is formed on the photoresist layer. In the past, The processing units that advance each process are arranged in a manner that recognizes the processing sequence on both sides of the ® transport path. The loading and unloading of LCD substrates for each processing unit, It is driven by a central transfer device that can move on the transfer path. This processing system, Since it is basically random access, the degree of freedom of processing is extremely high. With regard to such processing systems, A method for coating a photoresist liquid on an LCD substrate to form a photoresist film, There is a photoresist supply nozzle and an LCD substrate for applying a photoresist liquid in a band shape. A method of applying by moving in a direction orthogonal to the longitudinal direction of the nozzle discharge port. at this time, The photoresist supply nozzle is provided with a slit-shaped discharge port having a small gap extending in the width direction of the substrate. -5- 200537585 (2) The photoresist liquid ejected by the slit from the slit-shaped ejection outlet is taped to the entire surface of the substrate, Thereby, a photoresist film is formed. According to this method, From the substrate to the other side, Because the photoresist is spit out (supplied) in a band, No waste of photoresist, A photoresist film can be completely formed on the corner substrate. Furthermore, For a coating film forming apparatus employing such a coating film forming method, It is disclosed in Japanese Patent Document 1 (Japanese Patent Application Laid-Open No. 10-156255) ° [Patent Literature 1] Japanese Patent Application Laid-Open No. 0-: [Bulletin 5 625 5 (page 3, right column, line 5 to page 4, left column, line 6, (Figure 1) [Summary of the Invention] [Problems to be Solved by the Invention] However, the coating film forming apparatus using the coating film forming method described above, Just to increase the throughput of the film formation process, As shown in Figure 15, Two table surfaces 200, Photoresist supply nozzle 201, A device formed by adjusting the nozzle stand-by portion 202 of the photoresist state attached to the front end of the nozzle 201. If formed like this, On each countertop 200, A film formation process is performed on the substrates in parallel. Therefore, at this time, there is a technical problem of so-called imprinting and a large increase in the cost of the device. The present invention is an invention as described above. The purpose is to provide a method that can suppress the imprint and increase the cost of the device as much as possible, and can also apply the processing liquid to the film formation of the processed substrate. Increase the throughput of the film formation process, At the same time, a coating film forming apparatus for uniformly applying a processing liquid to each substrate to be processed. -6-200537585 (3) [Means for solving problems] In order to solve the aforementioned problems, The coating film forming apparatus of the present invention, It is a coating film forming apparatus that applies a treatment solution to form a film on the surface of a substrate to be processed. have, Equipped with a first stage and a second stage, which are arranged side by side and respectively mount a substrate to be processed; And a processing liquid supply nozzle having a slit-shaped discharge port extending in a wide direction of the substrate to be processed; And nozzle movement means for moving the aforementioned processing fluid supply nozzle; And a processing liquid supply means for supplying a processing liquid to the processing liquid supply nozzle; And a base coating treatment method for discharging the processing liquid from the discharge outlet to the peripheral surface of a roller that is freely formed and rotating the roller to uniformly process the treatment liquid attached to the discharge outlet; By this, the aforementioned processing liquid is supplied to the nozzle, It is characteristic that the surface of the substrate to be processed placed on the first and second stage surfaces is coated with a processing solution. like this, And to configure two countertops, This makes it possible to efficiently perform the coating process on the substrates to be processed placed on the respective tables. which is, During the coating process on one of the ® tables, For the sake of moving in and out on the other side, Compared with the previous single table, It can also save the time needed to move substrates in and out, Can increase production. It is desirable that the aforementioned primer treatment means be disposed between the aforementioned first and second countertops. Before the coating process is performed on the substrate to be processed, The nozzle moving means brings the discharge port of the processing supply nozzle close to the peripheral surface of the roller, The treatment liquid attached to the discharge port is homogenized. Constituted like this, No matter which substrate is placed on this surface, 200537585 (4) After homogenizing the processing liquid attached to the discharge port of the processing liquid supply nozzle, The coating process was performed immediately. thus, For substrates processed on either table, Both are feasible for uniform coating thickness, And increase production. The aforementioned primer treatment method, Equipped with a roller rotation control means for controlling the rotation of the aforementioned roller; When homogenizing the treatment liquid attached to the aforementioned discharge port, The roller rotation control means is performed on either the first table or the second table according to the coating process after the homogenization process. To determine the rotation direction of the roller. If constituted like this, At the tip of the nozzle, Take the exit as the border, Control the manner in which many treatment liquids are attached on the side opposite to the direction in which the nozzle travels. which is, In terms of the nozzle tip, If the exit is the border, A state where a lot of processing liquid is adhered on the side opposite to the direction in which the nozzle travels, It is possible to suppress occurrence of broom marks and the like due to uneven coating film at the start of coating. And I hope that in the aforementioned primer treatment method, A moisturizing means is provided to suppress the dryness of the supply of the treatment liquid to the tip of the nozzle. ® By setting moisturizing means like this, This prevents the nozzle tip from drying out during standby. It is hoped that the aforementioned means for applying the primer has a first means for applying the primer and a second means for applying the primer; The aforementioned first primer treatment method and the second primer treatment method, They are arranged on the right or left of the first and second countertops, respectively. I hope that before the coating process is performed on the substrate to be processed placed on the first table, The nozzle moving means brings the discharge port of the processing liquid supply nozzle close to the peripheral surface of the roller, The first primer treatment means uniformizes the treatment liquid attached to the discharge port, And before coating the substrate to be processed placed on the second -8-200537585 (5) side, The nozzle opening of the liquid supply nozzle at the aforementioned position is close to the circumference of the roller. The second coating treatment method uniformly attaches to the discharge opening. Like this, Place two countertops side by side, In this way, the substrate to be processed is efficiently coated. which is, During the coating process on one of its countertops, it is moved in on the other countertop. Compared with the previous single table, It can save the time needed for substrate moving. Can increase production. For the sake of arranging the rollers corresponding to each table, For the substrate on the stage, After the homogenization of the discharge liquid attached to the treatment liquid supply nozzle, The coating process was performed immediately. So the substrate processed by one table, Both can be applied with uniform film thickness to increase throughput. And hope that the aforementioned first and second coating methods, Equipped with wheel rotation control means to control ^ rotation; The rotation direction of the roller of the first coating treatment hand is the same as that of the roller of the second coating treatment method. In terms of the nozzle tip, To spit A control for attaching a large number of processing liquids on the side opposite to the direction in which the nozzle travels. which is, In terms of the nozzle tip, If the discharge port is in a state where many processing liquids are adhered on the side opposite to the direction in which the nozzle travels, At the beginning of the cloth, the occurrence of broom marks due to uneven coating film is suppressed 3 Furthermore, It is desirable to install the first coating treatment means or the front treatment means to suppress the front end of the treatment liquid supply nozzle from being dry. To make use of One of the above-mentioned processing liquids, one of the exit operations, is located at any exit for the in-out process. And the roller of the aforementioned roller segment is in one direction. Exports are bordered by borders, Now you can apply the second dry moisturizing method -9-200537585 (6). By setting moisturizing means like this, This prevents the nozzle tip from drying out during standby. [Effects of the Invention] According to the present invention, Can provide a strong suppression of imprinting and equipment cost increase, When the processing liquid is applied to a substrate to be processed for film formation, To increase the throughput of the film formation process, At the same time, a coating film forming apparatus for uniformly applying a processing liquid to each substrate to be processed. [Embodiment] [Best Mode for Carrying Out the Invention] The first embodiment of the present invention is described below. Explain based on the drawing. Fig. 1 is a plan view showing the overall configuration of a photoresist coating development processing apparatus including a coating film forming apparatus (photoresist coating apparatus) according to the present invention. This photoresist coating development processing apparatus 100, Department has: A wafer cassette station 1 on which a plurality of crystal wafers C that house a plurality of LCD substrates G (hereinafter referred to as substrates G) to be processed are placed; And a processing station 2 having a plurality of processing units for applying a series of processes including coating and development of a photoresist liquid containing a processing liquid to the substrate G; And an interface station 3 for transferring the substrate G to and from the exposure device 4. Furthermore, At both ends of the aforementioned processing station 2, The aforementioned cassette station 1 and interface station 3 are respectively configured. In Figure 1, Photoresist coating development processing device -10- 200537585 (7) The long side direction of loo is the x direction, The direction orthogonal to the x direction on the plane is the Y direction. The cassette station 1 is provided with a transfer device 11 for carrying in and out of the substrate G between the cassette c and the processing station 2. This transfer device has a transfer arm 1 1 a, It can move on the conveying path 10 set in the direction Υ along the arrangement direction of the wafer cassette C, The substrate G is carried in and out between the wafer cassette c and the processing station 2 by the carrying arm 1 1 a. # Processing station 2 has two parallel rows of transfer lines A, B, Scrubbing and cleaning processing units (SCR) are arranged along the transfer line A from the magazine station 1 to the interface station 3 2 1. First heat treatment unit section 26, The photoresist processing unit 23 and a part of the second heat treatment unit section 27. Furthermore, A part above the scrub cleaning unit (SCR) 21, An excimer UV irradiation unit (e-UV) 22 is provided. A part of the second heat treatment unit section 27 is arranged along the transfer line B from the interface station 3 toward the cassette station 1. Development processing unit (DEV) 24, A 1-ray UV irradiation unit (i — UV) 25 and a third heat treatment unit 28. And at processing station 2, To form the aforementioned two rows of transport lines A, B way, And basically configure each processing unit and conveying device in a processing order manner, On these transfer lines A, Between B, The space section 40 is provided. A transfer shuttle 41 can be provided in the space portion 40 so as to reciprocate. This transfer shuttle 41 is configured to hold the substrate G, Become available in line A, The substrate G is transferred between B and the interface station 3 has: -11-200537585 between the processing station 2 and the exposure device 4 (8) a transfer device 42 for loading and unloading the substrate G; And a buffer table (BUF) 43 configured with a buffer wafer cassette; Expansion and cooling table (EXT · COL) 44 for the substrate transfer part with cooling function, The upper and lower stacked markers (TITLER) and the external device block 45 of the peripheral exposure device (EE) are disposed adjacent to the conveying device 42. Furthermore, The transfer device 42 includes a transfer arm 42a, The transfer arm 42a carries the substrate G in and out between the processing station 2 and the exposure device 4 by this. With regard to the photoresist coating and developing apparatus 100 configured as described above, First, the substrate G arranged in the cassette C of the cassette station 1 After being transferred to the processing station 2 via the transfer device 1 1, First perform pre-scrubbing treatment using excimer UV irradiation unit (e-UV) 22, The scrubbing and cleaning treatment by the scrubbing and cleaning processing unit (SCR) 21 is performed. Secondly, The substrate G is carried into a heat treatment unit block (TB) 31 belonging to the first heat treatment unit section 26. 32, Perform a series of heat treatments (dehydration drying, 疎 hydration treatment, etc.). Furthermore, The substrate transfer in the first heat treatment unit section 26 is performed by the transfer device 33. then, The substrate G is carried into the photoresist coating processing unit 23, A photoresist film formation process is performed. Here the photoresist coating processing unit 2 3, Prior to the photoresist coating device (CT) 23a, Apply photoresist to substrate G, Concerning the reduced pressure drying unit (VD) 23b, The reduced-pressure drying process was completed. Furthermore, This photoresist coating processing unit 23 is a unit including a photoresist coating device (C T) 2 3 a as a coating film forming device related to the present invention, The details will be described later. After the photoresist film-forming treatment of the aforementioned photoresist coating processing unit 23, Base -12- 200537585 (9) Board G is moved to the heat treatment unit block (TB) 34 which belongs to the second heat treatment unit section 27, 35, Perform a series of heat treatments (pre-baking treatment, etc.). Furthermore, The substrate transfer in the second heat treatment unit section 27 is performed by the transfer device 36. Secondly, The substrate G is expanded to the interface station 3 by the conveying device 36. The cooling table (EXT · COL) 44 is conveyed, The peripheral device (EE) of the external device block 45 is transferred by the transfer device 42. Here, the substrate G is exposed to remove the peripheral photoresist. Then, it is conveyed to the exposure device 4 by the conveying device 42, The photoresist film on the substrate G is exposed to form a specific pattern. Furthermore, The buffer cassette storage substrate G on the buffer table (BUF) 43 is transferred to the exposure device 4 as appropriate. After the exposure is over, The substrate G is transferred to the upper marker (TITLER) of the external device block 45 by the transfer device 42 of the interface station 3, Specific information is recorded on the substrate G. then, The substrate G is placed on the expansion / cooling table (EXT · COL) 44, As a result, it was moved to the processing station 2 ^ again. The substrate G is transferred to a development processing unit (DEV) 24 by, for example, a roller transfer mechanism. Development processing is performed here. After the development process is completed, The substrate G is transferred from an imaging processing unit (DEV) 24 to an i-ray UV irradiation unit (i — UV) 25, The substrate G is decolored. then, The substrate G is carried into the third heat treatment unit section 2 8, In heat treatment unit block (T B) 3 7, 3 8 Perform a series of heat treatments (post-baking treatment, etc.). The substrate transfer in the third heat treatment unit section 28 is performed by a transfer device 39. On the other hand, the substrate G is cooled to a specific temperature of -13-200537585 (10) after the third heat treatment unit section 28 is stored in a specific cassette C by the transfer device 11 of the cassette station 1. Secondly, The photoresist coating processing unit 23 will be described with reference to FIGS. 2 and 3. Fig. 2 is a photoresist coating device (CT) 23a constituting a photoresist coating processing unit 23; And a plan view of a vacuum drying unit (VD) 23b. FIG. 3 is a side view of the photoresist coating processing unit 23 of FIG. 2. as the picture shows, The photoresist coating device (C T) 2 3 a and the reduced-pressure drying unit (VD) 23 b are arranged in a horizontal row on the support table 60 in the order of processing processes. A pair of guide rails 62 are laid on both sides of the support table 60, With one or a plurality of transfer arms 64 moving in parallel along the guide rail 62, The substrate G is directly obtained between the cells. Reduced pressure drying unit (VD) 23b, have: Above is an open bracket or bottom shallow container type lower vacuum chamber 66; A lid-shaped upper vacuum chamber 67 which can be air-tightly adhered or fitted on the lower vacuum chamber 66. The lower vacuum chamber 66 is slightly quadrangular, In the center, a table 70 for supporting the substrate G is placed horizontally. Exhaust ports 72 are provided at two places on the bottom surface. An exhaust pipe 73 connected to each exhaust port 72 is connected to a vacuum pump (not shown). And in a state where the lower vacuum chamber 66 covers the upper vacuum chamber 67, The processing space in the two vacuum chambers is decompressed to a specific vacuum degree by the vacuum pump. The reduced-pressure drying unit (VD) 23b constituted like this, The photoresist coating device (C T) 2 3 a Perform heating to minus, Single dry, release dry, press slowly, slow down the dissolution of this agent, Dry and dry in a hurry, When the face is dry, dry, dry, hot, pressed and subtracted, Production is immediate. Ο Will dry or not. Pressure -14- 200537585 (11) Yuan (V D) 23 b, Photoresist will not be adversely affected, Can promote photoresist dryness. The photoresist coating device (C T) 2 3 a will be described with reference to FIGS. 2 to 4. Fig. 4 is a perspective view showing the appearance of a photoresist coating device (CT) 23a. as the picture shows, This photoresist coating device (CT) 23a, have: The table 50 (first table) and the table 59 (second table) of the substrate G are held horizontally: And a photoresist supply nozzle (processing liquid supply • supply nozzle) 5 1 arranged above such a table; And a nozzle moving means 86 for moving this photoresist supply nozzle 5 1 (hereinafter referred to as the nozzle 5 1). In this constitution, The nozzle 51 is moved horizontally by the nozzle moving means 86, So that the countertop 50, Substrate G on G (G 1, G2) makes a relative horizontal movement with the nozzle 51. Furthermore, As shown in Figure 3, The above-mentioned table tops 50 and 59 are respectively provided with substrate holding portions 50a, 59a, By the aforementioned substrate holding portion 50a, 59a collects and holds the substrate G carried in. As shown in Figure 4, The aforementioned nozzle 51 has: Extends on the substrate G1 ^, G2 wide slot-shaped spout 5 1 a; And a photoresist liquid storage chamber (not shown) that communicates with this outlet 5 1 a, A photoresist liquid supply source 9 5 (processing liquid supply means) is connected through a photoresist liquid supply pipe 57 connected to the photoresist liquid storage chamber. Furthermore, The front end of the nozzle 51, As shown in the enlarged sectional view of Figure 5, When viewed from its short side, it is tapered, Along the short side of the nozzle, A lower end surface 5 1 b and an inclined surface 5 1 c are formed before and after the discharge port 5 1 a, respectively. On the other hand, the travel direction of the nozzle 51 during the coating process is directional. which is, As shown in Figure 5, The lower end portion 5 on the side opposite to the traveling direction of the nozzle; [b, -15- 200537585 (12) Form the length of the short side of the nozzle. This is formed like this, The discharged photoresist liquid R is pushed toward the substrate surface through the surface of the lower end portion 5 1 b. Makes the coating process stable. As shown in Figures 2 to 4, Between the countertop 50 and the countertop 59, A nozzle standby portion 5 5 (priming treatment means) is provided. This nozzle is waiting for Isobe 5 5, have: To make the photoresist liquid adhering to the front end of the nozzle 5 1 uniform (referred to as a primer treatment), the freely rotating primer roller 52 (roller); And to wash the coated roller 52 soaked in a container 53 of diluent; And A moisturizing section (moisturizing means) 54 for suppressing dryness of the tip of the nozzle 51. Furthermore, Priming treatment before substrate coating treatment, As shown in Figure 6, The tip of the nozzle 51 is arranged close to the peripheral surface of the primer roller 52. And the photoresist liquid R is discharged from the discharge port 51a, on the other hand, The primer roller 52 is rotated by the roller rotation control means 65, A homogenization process of the photoresist liquid R attached to the front end of the nozzle 51 is performed. As shown in Figure 6, The photoresist liquid R discharged from the discharge port 5 1 a flows into the rotation direction of the roller 52. thus, After the primer treatment, On one of the 5 J front ends, Along the direction of rotation of the roller 5 2 A state where more photoresist is attached than the other. Furthermore, During the coating process, Take the exit 5 1 a as the border. The side where the photoresist liquid R is slightly adhered is the direction of travel so that the moving direction of the nozzle 51 is controlled. By forming like this, In the beginning of coating, the occurrence of broom marks and the like is suppressed, Make the coating film more uniform. As shown in Figure 6, On the way to the primer roller 52, Set the slider 9 1. The sliding sheet 91 is made of a chemical-resistant resin. The front end slides to the peripheral surface of the primer roller 52, Remove the unwanted previous return on the peripheral surface. -16- 200537585 (13) Flow of photoresist and diluent 89. Furthermore, the shape of the tip of the 'sliding sheet 91' is to be able to exert the photoresist removal function. 'Except for the wedge-shaped cross section used in this example, Any shape of a rectangular cross-section and a cross-section can be used. The sliding piece 91 is configured to be lifted and lowered by the air cylinder 90 between a lower position in contact with the peripheral surface of the primer roller 52 and an upper position remote from the peripheral surface of the primer roller 52. You can change its position. As shown in Figure 4, On both sides of the long side of the outlet 5 1 a, A film thickness control means 80 is provided to reduce the discharge pressure of the photoresist liquid R discharged from the discharge port 5 1 a. The film thickness control means 80 is a suction pipe 82 connected to the communication paths 81 connected to both sides in the longitudinal direction of the outlet 51a, respectively; It is constituted by a suction pump 83, such as a diaphragm pump, provided in the suction pipe 82 'so as to reduce the discharge pressure on both sides of the discharge port 5 1 a by driving the suction pump 8 3. Furthermore, On the suction side of the suction pump 83 of the suction pipe 82, that is, the nozzle 51 side, 介 放 开关 开关 84。 Opening and closing valve 84. then, The operation of the photoresist coating device (CT) 23a configured as described above will be described. Initially shown in Figure 4, For a substrate G 1 placed on a table 50, for example, The operation when the photoresist R is applied will be described. First of all, The nozzle 5 1 is arranged in the nozzle standby portion 5 5, On the other hand, the substrate G1 transferred by the transfer arm 64 is sucked and held on the table 50. at this time, The substrate G1 is attracted by the substrate holding portion 50a provided on the table 50. And the photoresist liquid R is supplied from the photoresist liquid supply source 95 to the photoresist liquid storage chamber in the nozzle 51, At the same time, the nozzle 51 is moved from the nozzle standby portion 55 to the left end of the table 50 by the nozzle moving means 86. -17 · 200537585 (14) Secondly, The nozzle 51 is a side that emits a photoresist liquid r through a discharge port 5 1 a. One side moves to the right on the substrate G1. Furthermore, The distance between the outlet 51a and the substrate G, Set around 40 ~ 150 // m, Ideally, it is set at 60 [1 m 〇 and at this time, Drive the suction pump 83 to attract both sides of the long side of the outlet 5ia. This reduces the discharge pressure of the photoresist liquid R on both sides of the discharge port 5 1 a, The discharge pressure at the center of the discharge port 5 1 a is equal to the discharge pressure at both sides ®, which is, The liquid thickness of the photoresist liquid R is equal, The tape is discharged onto (supply) the substrate G. thus, The substrate G and the nozzle 51 are relatively horizontally moved, Thereby, a photoresist liquid R is supplied in a band shape on the surface of the substrate G, A photoresist film having a uniform thickness is formed on the entire surface of the substrate G. like this, After forming a photoresist film on the surface of the substrate G, Stop the supply of photoresist R, At the same time move the nozzle 51 to the standby position, And close the discharge port 51a of the nozzle 51 to the primer roller 52 in the nozzle standby portion 55, Prepared for the next coating process. The substrate G on which the photoresist film is formed is transferred from the mounting table 50 to the reduced-pressure drying unit (VD) 23b by a transfer arm ^ 64. Secondly, For the photoresist coating device (CT) 23a, The operation of the nozzle 51 when a plurality of substrates are continuously coated, Explanation will be made with reference to FIGS. 7 and 8. Fig. 7 is a pattern diagram showing the moving direction of the nozzle 51. Fig. 8 is a flowchart showing the operation control process of the nozzle 51. First, the nozzle 51 is brought close to the primer roller 52 of the nozzle standby portion 55. A primer coating process is performed on the tip of the nozzle 51 (step S1 in FIG. 8). When the uncoated substrate G1 is transferred to the table 50 (step S2 in FIG. 8), The nozzle 51 moves to the left end of the table 50, The substrate G1 -18-200537585 (15) is subjected to a coating process of the photoresist liquid R (step S 3 in FIG. 8). Furthermore, At this time, the 'nozzle 51 moves to the direction shown by the arrow in FIG. 7, A coating process is performed. Next 'nozzle 5 1 moves to nozzle standby section 5 5 A primer coating process is performed on the front end of the nozzle 51 (step S4 in FIG. 8). When the substrate G2 in the uncoated processing state is transferred to the table 59 (step S5 in FIG. 8), The nozzle 5 1 is moved to the right end of the table 5 9, The substrate G2 is subjected to a coating process of the photoresist liquid R (step S 6 in FIG. 8). Furthermore, At this time, the nozzle 51 moves to the direction shown by the arrow in Fig. 7, A coating process is performed. Secondly, Returning to the processing of step S 1 in FIG. 8, When the uncoated substrate is continuously transferred to each table, Following the aforementioned process, The substrate is coated. In the foregoing step S2 or step S5, When the substrate is not transferred to the table, The nozzle 51 moves to the moisturizing section 54 after the coating process, Stand-by in a state where the tip of the nozzle 51 is not dried (step S 7 in FIG. 8). Furthermore, As mentioned before, The nozzle 51 has directivity in the traveling direction during the coating process. therefore, During the coating process, For substrate G1 G2, As shown by the arrows in Figure 7, In the same direction, The nozzle 51 is controlled to move on the substrate by the nozzle moving means 86. According to the first embodiment described above, Place two countertops side by side 50, 59, Thereby, the substrate G on which each stage is placed is efficiently coated. which is, During the coating process on one of the countertops, For the sake of moving in and out on the other side, Compared with the previous single table, It can also save the time required for board loading and unloading, and it can increase throughput. -19- 200537585 (16) while on both countertops 5 0, 5 5 9 nozzle standby parts For the substrate G placed on any of the stages, Both can be treated after the coating of nozzle 51, The coating process was performed immediately. therefore, For the substrate G connected to any table, Both can be applied with a uniform film thickness. Compared with the figure shown in Figure 15, there are two The nozzles and the devices formed by the nozzle standby section, Reduces the footprint, It also reduces installation costs. and then, According to the configuration shown in the foregoing embodiment, Either on table 50 or table 59, Because of the transfer arm 64 or the substrate holding portion 50a, 59a and other problems Can make the process different from the process shown in Figure 8, This makes it possible to perform coating on the other table. β 卩, When a fault occurs on the 50 side of the table, The coating process at the front end of the nozzle 51 and the unprocessed substrate G2 on the table 59 are sequentially repeated to perform the coating process to make it operate. on the other hand, When a failure occurs on the 5 or 9 sides of the table, The coating process at the front end of the nozzle 51 and the untreated substrate G1 on the table surface 50 are sequentially repeated to perform the coating process to make it operate. thus, The interruption of the operation of the photoresist coating development processing apparatus 100 caused by the aforementioned failure can be avoided. then, A second embodiment of the coating film forming apparatus (photoresist coating apparatus) according to the present invention will be described with reference to FIGS. 9 to 11. Furthermore, in the second embodiment, It is different from the structure and operation control of the photoresist coating device 23a in the first embodiment. Detailed descriptions of other common structures are omitted. Fig. 9 is a side view of a photoresist coating apparatus according to a second embodiment, showing a side -20-200537585 (17). Fig. 10 is a diagram illustrating a coating process using a photoresist supply nozzle provided in the photoresist coating apparatus of Fig. 9; Fig. 11 is a diagram for explaining a primer treatment of a photoresist supply nozzle provided in the photoresist coating device of Fig. 9. In this second embodiment, As shown in Figure 9, The nozzle 51 is controlled based on the movement of the nozzle moving means 86. The moving direction during the coating process was changed to the mesa 50 side or the mesa 59 side. As shown in Figure 10, The front end portion of the nozzle 5 1 is the lower end portion 5 1 1 facing the opposite side across the discharge port ® 5 1 a-forming a wide width. Formed like this, As a result, even if the traveling direction of the nozzle 51 is any direction shown by an arrow, The discharged photoresist liquid R can be pressed toward the substrate surface by the surface of the lower end portion 5 1 b. Stably coated. In the coating process shown in Figure 11, The roller rotation control means 65 determines the rotation direction of the roller 52 according to the next coating process to be performed on either the table 50 or the table 59. which is, At the front end of the nozzle 51, Take the exit 5 1 a as the border. The direction of rotation of the roller 5 2 is determined by the manner in which many photoresist liquids R are adhered on the opposite side of the nozzle traveling direction 1 of the next coating process. And as shown in the figure, Through the nozzle 5 1 is around the roller 5 0, Set the sliders 91 separately, Each of the sliding pieces 91 is controlled to slide on the peripheral surface of the roller 52 according to the rotation direction of the roller 52. which is, With the rotation direction of the roller 52, Any one of the slides 90 is driven, Then, the lifting movement of the sliding piece 9 1 can be controlled. like this, According to the second embodiment of the present invention, -21-200537585 (18) for the substrate G1 placed on the table 50 or the substrate G2 placed on the table 59, After the coating process, the nozzle 51 can be directly moved to the direction of the substrate to be processed. The coating process was performed in the same manner. which is, The structure is more directional than the direction of travel of the nozzle 51. Not to waste the movement of the nozzle 5 Can increase production, It is also possible to suppress the tip of the nozzle 51 from drying. thus, According to this embodiment, The structure of the photoresist coating device 2 3 a shown in FIG. 9, As a result, compared with the second embodiment, The composition of the output can be improved by using the same blot. then, A third embodiment of the coating film forming apparatus (photoresist coating apparatus) according to the present invention will be described with reference to FIG. 12. Furthermore, In the third embodiment, It is different from the aforementioned first embodiment only in the configuration and operation control of the photoresist coating device 23 a. Detailed explanations of other common constituents are omitted. Fig. 12 is a side view schematically showing a photoresist coating apparatus according to a third embodiment. As shown in Figure 12, Place substrate G1, respectively The countertops 50 and 59 of G2 are arranged side by side horizontally. A nozzle standby portion 5 5 (priming treatment means) is provided in the vicinity of the table surface 50 on the opposite side of the table surface 5 9. In this photoresist coating device 23a, The nozzle 51 moved by the nozzle standby portion 55 first performs a coating process on the substrate G1 on the table 50, Then, the substrate G2 on the mesa 59 is coated. Return to the nozzle standby section 5 5 again. like this, According to the third embodiment of the present invention, The substrates G1, Because of the continuous coating process of G2, Can increase the number of processing units per unit time. but, In the third embodiment, After the substrate G 1 is coated, During the coating process, the photoresist dried and solidified will adhere to the gap around the spit -22- 200537585 (19) exit. therefore, When the next substrate G2 is coated in this state, There is a technical problem that the discharge of the photoresist liquid from the discharge port is scattered without a uniform coating process on the substrate surface. then, An embodiment that solves the aforementioned technical problems, The fourth embodiment of the coating film forming apparatus (photoresist coating apparatus) according to the present invention will be described with reference to the drawings. Furthermore, In the fourth embodiment, This is the same as the structure and operation control of the photoresist coating device 23a in the first embodiment. Detailed descriptions of other common configurations are omitted. Fig. 13 is a side view schematically showing a photoresist coating device according to a fourth embodiment. As shown in Figure 13 The roller 52 (the first coating means) and the moisturizing portion 54 are arranged on the left side of the table 50, A configuration in which a roller is used for the second coating treatment) is arranged on the left side of the table 59. The roller 63 is disposed between the table surface 52 and the table surface 63. Furthermore, The portion 54 may be disposed in the vicinity of the roller 63. Although the figure is not shown, The roller 52 and the moisturizing portion 54 can be arranged on the right side of the table 50, The ^ wheel 6 3 is arranged on the right side of the table 5 9. And in this case, The protection 54 may also be arranged in the vicinity of the roller 59. Furthermore, The rollers 52 and 63 rotate in the same direction. If this is the case, You can first use the roller 5 2 at the bottom, Performing a coating process on the substrate G 1 on the mesa 50, Then, after using the 6 3 primer treatment, The substrate G2 on the mesa 5 9 is coated. According to the fourth embodiment of the present invention, Any of the processing methods for the substrate G1 and the substrate G2 placed on the table surface 50 and the table surface 59 and m 13) described above (i.e., Moisturizing but also roll the wet section roller after the roller treatment is a -23- 200537585 (20), Because the coating process can be performed before the coating process, The technical problem in the third embodiment can be solved. In the first embodiment, the footprint and the cost of the device are much larger than the configuration of the photoresist coating device 2 3 a shown in FIG. 4. However, in the second embodiment, the same throughput as that of the photoresist coating apparatus shown in Fig. 9 can be obtained. Furthermore, In the aforementioned first to fourth embodiments, The overall configuration (arrangement) of a photoresist ® coating development processing apparatus having a coating film forming apparatus (photoresist coating apparatus) of the present invention shown in FIG. 1 is an example, It is not limited to this. Fig. 14 shows the overall configuration (arrangement) of other forms. here, The arrangement of the photoresist coating development processing device 1 0 1 shown in FIG. 14 is briefly described. Furthermore, The same parts as those shown in Figure 1 are marked with the same symbols. The detailed description is omitted. The photoresist coating development processing apparatus 1 0 1 is the same as the photoresist coating development processing apparatus 1 0 1 in FIG. 1, Along the X axis of the graph, And has a cassette station 1. Processing station 2 and interface station 3. Regarding the configuration of the photoresist coating development processing device ® 101, The photoresist coating development processing apparatus of FIG. 1 can be clarified. The difference lies in the abolition of the shuttle 41, Conveying device 33, 36, 39 etc. And the substrate G of each processing unit is transferred, This uses a vertical transfer unit (S / A). This vertical transfer unit (S / A) has a transfer arm (not shown) for transferring the substrate G. Its transfer arm can be set at X, Y and Z axis movement, And can be rotated in the horizontal direction. This structure of vertical transfer unit (S / A) 13, 15, 12, 14 are respectively arranged adjacent to the first heat treatment unit section 26, 2nd heat treatment unit section -24- 200537585 (21) 27, Third heat treatment unit section 28, Even the photoresist coating processing unit 23 〇 Furthermore, Regarding the vertical transfer unit (S / A) 14 disposed adjacent to the photoresist coating processing unit 23, The unit itself can be moved largely along the long side direction (X direction) of the photoresist coating device (CT) 23a. which is, For the substrates G loaded on the mesa 50 and mesa 59 of the photoresist coating device (CT) 23a, Supports transfer units. The processing process of the photoresist cloth development processing apparatus 101 configured as described above will be briefly described. First of all, After the substrate G 'disposed in the cassette C of the cassette station 1 is transferred to the processing station 2 by the transfer device 11, First use an excimer UV irradiation unit (e-UV) 22 for pre-washing treatment. The scrubbing and cleaning processing unit (SCR) 21 is used for scrubbing and cleaning. Secondly, The substrate G is carried into a heat treatment unit block (TB) 31 belonging to the first heat treatment unit section 26. 32, Perform a series of heat treatment (dehydration drying, Hydrophobic treatment, etc.). Furthermore, The first heat treatment unit The substrate transfer in the section 26 is performed by the vertical transfer unit (S / A) 13. Then, The substrate G is carried into the photoresist coating processing unit 23, A photoresist film formation process is performed. Here the photoresist coating processing unit 23, The foregoing first to fourth embodiments will be described. For photoresist coating device (CT) 23a, Apply photoresist to substrate G, Then, the pressure-drying process is completed in the reduced-pressure drying unit (VD) 23b. Furthermore, Arranged here, The vacuum drying unit (VD) constitutes two stages, -25- 200537585 (22) The structure can process two substrates G side by side (arrangement and figure 2, The example in Figure 3 is different. ). which is, In photoresist coating device (CT) 23a, Continuously and efficiently perform a reduced-pressure drying process on a plurality of substrates G coated with photoresist in parallel, Increasing the production capacity ° When loading the substrate G in the photoresist coating device (CT) 23a and the reduced-pressure drying unit (VD) 23b, Move out, All are performed by the vertical transfer unit (S / A) 14. After the aforementioned photoresist coating processing unit 23 performs photoresist film formation processing, The substrate G is carried into a heat treatment unit block (TB) 33 belonging to the second heat treatment unit section 27, A series of heat treatments (pre-baking treatment, etc.) are performed. Furthermore, The substrate transfer in the second heat treatment unit section 27 is performed by a vertical transfer unit (S / A) 15. Secondly, The substrate G is transferred to a peripheral exposure device (EE) of the external device block 45 of the interface station 3. Here, the substrate G is exposed to remove peripheral photoresist. Secondly, The substrate G is transferred to the exposure device 4 by an interface unit (I / F) 20 having the same configuration as the vertical transfer unit (S / A). The photoresist film on the substrate G is exposed to form a specific pattern. Furthermore, According to the situation, After the buffer wafer cassette contains the substrate G on the buffer table (BUF) 43, Transported to the exposure device 4. After the exposure is over, The substrate G is transferred to the upper-stage marker (TITLER) of the external device block 45 through the interface unit (I / F) 20, Specific information is recorded on the substrate G. Furthermore, As the case may be, After the exposure is over, After the substrate G is stored in the buffer box on the buffer table (BUF) 43, It is transferred to the upper marker (TITLER) of the external device block 45. -26- 200537585 (23) Then, The substrate G is transferred to the processing station 2 again, In the heat treatment unit block (HP) 35 belonging to the second heat treatment unit section 27, A series of heat treatments (post-exposure bake, etc.) are performed. The substrate G is transferred to a development processing unit (DEV) 24 by, for example, a roller transfer mechanism. Development processing is performed here. After the development process is completed, The substrate G is transferred from the development processing unit (DEV) 24 to the i-ray UV irradiation unit (i-UV) 25 and is subjected to decoloring processing. then, The substrate G is carried into the third heat treatment unit section 2 8, A series of heat treatments (post-baking treatment, etc.) in the heat treatment unit block (TB) 37, Cool to a specific temperature in the heat treatment unit block (TB) 38. Furthermore, The substrate transfer in the third heat treatment unit section 28 is performed by a vertical transfer unit (S / A) 12. then, The substrate G is transferred to the cassette station 1 ′ by a conveyor belt, and is stored in a specific cassette C by the transfer device 11. The structure of the photoresist coating development processing apparatus 1 0 1 described above '® is shown in the figure, A third heat treatment unit section 28 is arranged around the vertical transfer unit (S / A) 12. A first heat treatment unit section 26 is arranged around the vertical transfer unit (S / A) 13. A photoresist coating processing unit 23 is further arranged around the vertical transfer unit (S / A) 14. A second heat treatment unit section 27 is arranged around the vertical transfer unit (S / A) 15. therefore, Can efficiently perform substrate transfer processing, and then, Avoid individual heat treatment unit sections 26, 27, 28 and photoresist coating processing unit 23 are arranged in one direction, Miniaturization of a photoresist coating development processing device is achieved. And the photoresist coating development processing device 1 101 arranged like this, The coating film forming apparatus according to the present invention can be effectively disposed. Furthermore, In all the foregoing embodiments, Take the case of coating and forming a photoresist film on an LCD substrate as an example. But not limited to this, It is suitable for any coating film forming apparatus that supplies a processing liquid to a substrate to be processed. In addition to the photoresist liquid, the treatment liquid of the present invention, For example, it may be an interlayer insulation material, Dielectric materials, Liquids such as wiring materials. The substrate to be processed in the present invention is not limited to an LCD substrate. Can also be a semiconductor wafer, CD substrate, Glass base board, Light beta cover, Printed substrates, etc. [Industrial Applicability] The present invention can be applied to a coating film forming apparatus that forms a processing solution on an LCD substrate, a semiconductor wafer, or the like. Suitable for the semiconductor manufacturing industry, Electronic equipment manufacturing industry. [Brief Description of the Drawings] ® Figure 1 is a plan view showing the overall configuration of a photoresist coating development processing apparatus including a coating film forming apparatus (photoresist coating apparatus) according to the present invention. Fig. 2 is a plan view showing a first embodiment of a photoresist coating processing unit including the photoresist coating development processing apparatus of Fig. 1; FIG. 3 is a side view of the photoresist coating processing unit of FIG. 2. Fig. 4 is a perspective view showing the appearance of a photoresist coating apparatus constituting the photoresist coating processing unit of Fig. 2; Fig. 5 is an enlarged sectional view of a front end of a photoresist supply nozzle provided with the photoresist coating device of Fig. -28- 200537585 (25). Fig. 6 is a view explaining a photoresist liquid homogenizing process near a discharge port of a photoresist supply nozzle of the photoresist coating device of Fig. 4; Fig. 7 is a schematic view showing a moving direction of a photoresist supply nozzle provided with the photoresist coating device of Fig. 4; Fig. 8 is a flowchart showing an operation control process of a photoresist supply nozzle provided with the photoresist coating device of Fig. 4; Fig. 9 is a side view schematically showing a second embodiment of a coating film forming apparatus (photoresist coating apparatus) according to the present invention. Fig. 10 is a diagram illustrating a coating process using a photoresist supply nozzle provided in the photoresist coating apparatus of Fig. 9. Fig. 11 is a diagram illustrating a primer application process of a photoresist supply nozzle provided in the photoresist coating apparatus of Fig. 9; Fig. 12 is a side view schematically showing a third embodiment of a coating film forming apparatus (photoresist coating apparatus) according to the present invention. FIG. 13 is a side view schematically showing a fourth embodiment of a coating film forming apparatus (photoresist coating apparatus) according to the present invention. Fig. 14 is a plan view showing another example of the entire configuration (arrangement) of a photoresist coating development processing apparatus including a coating film forming apparatus (photoresist coating apparatus) according to the present invention. Fig. 15 is a diagram showing the operation of a photoresist supply nozzle when two conventional coating film forming apparatuses are provided. [Description of main component symbols] -29- 200537585 (26) 2 3 a: Photoresist coating processing unit 23: Photoresist coating device (coating forming device) 50: Countertop (first countertop) 5 1: Photoresistance supply nozzle (treatment liquid supply nozzle) 5 1 a: Spout 5 1 b: Lower end 5 1 c: Inclined surface 5 2: Priming roller (first coating method) 5 5: Nozzle standby section (coating treatment method) 59: Countertop (second countertop) 8 6: Nozzle moving means 63: Priming roller (second coating method) 65: Wheel rotation control means 95: Photoresist liquid supply source (processing liquid supply means) 100: Photoresist coating development processing device 1 0 1: Photoresist coating development processing device G: LCD substrate (substrate to be processed) G1: LCD substrate (substrate to be processed) G2: LCD substrate (substrate to be processed) R: Photoresist liquid (treatment liquid) -30-