201228735 六、發明說明： 【發明所屬之技術領域】 本發明是有關對被處理基板塗佈處理液的塗佈裝置、 及被搭載彼之具有狹縫狀的吐出口的噴嘴的維護方法。 【先前技術】 例如，在FPD( Flat Panel Display)的製造中，藉由 所謂的光微影技術（Photolithography)工程來形成電路圖 案。 此光微影技術工程是在玻璃基板等的被處理基板形成 預定的膜後，塗佈處理液的光阻劑（以下稱阻劑）形成阻 劑膜（感光膜）。然後，對應於電路圖案，上述阻劑膜曝 光，予以顯像處理而形成圖案。 在如此的光微影技術工程中，對被處理基板塗佈阻劑 液而形成阻劑膜的方法，有從狹縫狀的噴嘴吐出口帶狀地 吐出阻劑液，將阻劑塗佈於基板上的方法。 利用圖1 2來簡單說明使用此方法的以往的阻劑塗佈裝 置。 圖12所示的阻劑塗佈裝置200是具備：載置基板G的平 台201、及被配設於此平台201上方的阻劑供給噴嘴202、 及使此噴嘴202移動的噴嘴移動手段203。 在阻劑供給噴嘴202設置具有延伸於基板的寬度方向 的微小間隙之狹縫狀的吐出口 202a，可從吐出口 202a吐出 由阻劑液供給源2〇4所供給的阻劑液R。 201228735 可是，由於狹縫狀的吐出口 2 02a是藉由微小的間隙所 形成，因此在噴嘴待機時若不實施噴嘴前端的維護處理， 則會因爲阻劑液的乾燥等而產生阻塞。因此，如圖1 2所示 ，阻劑塗佈裝置200是具備用以洗淨噴嘴前端的噴嘴維護 手段208。 此噴嘴維護手段208是具有： 噴嘴洗淨部208a，其係例如對噴嘴吐出口 202a噴上洗 淨液（稀釋劑（thinner))，而洗淨噴嘴前端；及 噴嘴浴缸208b，其係用以在溶劑的蒸汽環境下保持吐 出口 202 a，而使在待機時吐出口 202 a不會乾燥。 更具有上底材處理部2 08c，其係於基板G的塗佈處理 前，對旋轉自如的圓柱形狀的上底材滾輪的表面吐出阻劑 液R，使附著於噴嘴前端的阻劑液R均一化（上底材 (priming)處理）。 在此構成中，對基板G的阻劑塗佈處理時，是一邊藉 由噴嘴移動手段203來使噴嘴202水平移動，一邊從狹縫狀 的吐出口 202a帶狀地吐出阻劑液R至基板的表面全體，藉 此進行阻劑液R的塗佈處理。 並且，在噴嘴202的待機時，進行利用上述噴嘴維護 手段208之噴嘴的維護處理。此維護處理，首先噴嘴202會 藉由噴嘴移動手段203來移動至噴嘴洗淨部208a。然後， 在噴嘴洗淨部208a中實施對噴嘴前端的洗淨處理，其次， 如圖13所示，在噴嘴浴缸2〇8b中以噴嘴吐出口 2〇2a不會乾 燥的方式保持噴嘴202。 201228735 而且，在進行其次的基板G的塗佈處理前，噴嘴2 02是 被移動至上底材處理部2〇8c ’進行對上底材滾輪的阻劑液 吐出，藉此實施噴嘴前端的上底材處理。 另外，有關如此的維護處理的裝置構成是被記載於專 利文獻1。 〔先行技術文獻〕 〔專利文獻〕 [專利文獻1]專利第4040025號公報 【發明內容】 (發明所欲解決的課題） 如上述般，在噴嘴待機期間的噴嘴202的維護處理時 ，噴嘴202是其前端部（吐出口 202a)會藉由噴嘴洗淨部 2〇8a來洗淨，如圖13所示，在噴嘴浴缸208b中以噴嘴吐出 口 2 02 a不會乾燥的方式保持噴嘴202。 在此，若是在同一批內連續被處理的基板間的待機期 間，則至其次的基板G的塗佈處理爲止不會有長時間空閑 的情形，因此在噴嘴202內的流路202b維持充塡著處理液 的阻劑液。 另一方面，在不同批間的待機期間也會有成爲長時間 待機的情形，噴嘴202內的流路202b基於阻劑的乾燥附著 防止、流路洗淨等的目的，從阻劑液R置換成溶劑T (稀釋 劑）。 然而，若在噴嘴流路202b被置換成溶劑T的狀態下長 201228735 時間放置，則伴隨待機中的時間經過，被充塡至噴嘴前端 (吐出口 202a )的溶劑T蒸發，如圖1 4所示，溶出至溶劑T 的阻劑成分會在溶劑T的界面T1附近析出，而有在流路 2 02b內成爲異物D黏著之課題。 並且，若如此異物D附著於流路202b，則來自吐出口 202a的阻劑吐出狀態會形成不均一，在對基板G之阻劑液R 的塗佈處理中恐有在塗佈膜產生斑紋之虞。 而且，爲了不傷及流路20 2b內來除去異物D，需要分 解噴嘴202來洗淨，而有費事費時的課題。 並且，在將流路202b內置換成溶劑T後，爲了防止吐 出口 202a附近的乾燥，而有吐出溶劑T進行所謂假配給（ Dummy dispense)的方法，但需要吐出廢棄多量的溶劑T ，因此有成本增高的課題。 本發明是有鑑於上述那樣以往技術的問題點而硏發者 ，提供一種在被處理基板塗佈處理液的塗佈裝置中，防止 噴嘴內的流路之異物的附著，在對被處理基板的處理液塗 佈時，可從狹縫狀的噴嘴吐出口均一地吐出處理液之塗佈 裝置及噴嘴的維護方法。 (用以解決課題的手段） 爲了解決上述的課題，本發明的塗佈裝置，係具備： 長狀的噴嘴’其係從吐出口吐出處理液；及 維護手段，其係於上述噴嘴的待機期間，上述噴嘴內 的流路係被保持於從上述處理液置換成上述處理液的溶劑 -8- 201228735 之狀態， 從上述噴嘴的吐出口吐出處理液至上述基板，形成塗 佈膜之塗佈裝置，其特徵爲： 上述維護手段係具有： 溶劑供給手段，其係對上述噴嘴供給上述溶劑；及 液保持面，其係在與上述噴嘴的吐出口之間形成預定 的間隙， 在上述待機期間，上述噴嘴係被保持於對上述液保持 面吐出預定量的溶劑之狀態，上述溶劑對上述噴嘴的界面 係被形成於上述噴嘴的外面。 或者，本發明的塗佈裝置，係具備： 長狀的噴嘴，其係從吐出口吐出處理液；及 維護手段，其係於上述噴嘴的待機期間，上述噴嘴內 的流路係被保持於從上述處理液置換成上述處理液的溶劑 之狀態， 從上述噴嘴的吐出口吐出處理液至上述基板，形成塗 佈膜之塗佈裝置，其特徵爲： 上述維護手段係具有： 溶劑供給手段，其係對上述噴嘴供給上述溶劑；及 儲存容器，其係用以儲存至少可浸漬上述吐出口之預 定量的溶劑， 在上述待機期間，上述噴嘴係被保持於其吐出口會被 浸漬於上述儲存容器所儲存的溶劑之狀態，且上述溶劑對 上述噴嘴的界面係被形成於上述噴嘴的外面。 -9 - 201228735 藉由如此構成，即使溶出至溶劑的處理液的成分因爲 溶劑的蒸發而在界面附近析出，還是可以防止析出的異物 往流路內附著。 亦即，將流路內設爲清淨的狀態，對被處理基板的處 理液塗佈時，可從狹縫狀的噴嘴吐出口均一地吐出處理液 〇 並且，由從溶劑析出的處理液成分所構成的異物因爲 附著於噴嘴外面，所以不用分解噴嘴，可容易進行其除去 作業。 爲了解決上述的課題，本發明的噴嘴的維護方法，係 從吐出口吐出處理液的長狀的噴嘴，在上述噴嘴的待機期 間，把上述噴嘴內的流路從上述處理液置換成上述處理液 的溶劑而保持之噴嘴的維護方法，其特徵係包括： 替換上述處理液來對上述噴嘴供給上述溶劑之步驟； 在上述吐出口的下方配置液保持面，且在上述吐出口 與上述液保持面之間形成預定的間隙之步驟；及 將上述噴嘴保持於從上述吐出口來對上述液保持面吐 出預定量的溶劑之狀態，且把上述溶劑對上述噴嘴的界面 形成於上述噴嘴的外面之步驟。 或者，爲了解決上述的課題，本發明的噴嘴的維護方 法，係從吐出口吐出處理液的長狀的噴嘴，在上述噴嘴的 待機期間，把上述噴嘴內的流路從上述處理液置換成上述 處理液的溶劑而保持之噴嘴的維護方法，其特徵係包括： 替換上述處理液來對上述噴嘴供給上述溶劑之步驟： -10- 201228735 將至少可浸漬上述吐出口之預定量的溶劑儲存於儲存 容器之步驟；及 將上述噴嘴的吐出口保持於浸漬在上述儲存容器所儲 存的溶劑之狀態，且把上述溶劑對上述噴嘴的界面形成於 上述噴嘴的外面之步驟。 或者，爲了解決上述的課題，本發明的噴嘴的維護方 法，係從吐出口吐出處理液的長狀的噴嘴，在上述噴嘴的 待機期間，防止上述噴嘴內的流路之異物的附著之噴嘴的 維護方法，其特徵係包括： 在上述吐出口的下方配置液保持面，且在上述吐出口 與上述液保持面之間形成預定的間隙之步驟； 將上述噴嘴保持於從上述吐出口來對上述液保持面吐 出預定量的處理液之狀態.，且把上述處理液對上述噴嘴的 界面形成於上述噴嘴的外面之步驟。 若根據如此的方法，則即使溶出至溶劑的處理液的成 分因爲溶劑的蒸發而在界面附近析出，還是可以防止析出 的異物往流路內附著。 亦即，將流路內設爲清淨的狀態，對被處理基板的處 理液塗佈時，可從狹縫狀的噴嘴吐出口均一地吐出處理液 〇 並且，由從溶劑析出的處理液成分所構成的異物因爲 附著於噴嘴外面，所以不用分解噴嘴，可容易進行其除去 作業。 -11 - 201228735 〔發明的效果〕 若根據本發明，則可取得一種在被處理基板塗佈處理 液的塗佈裝置中，防止噴嘴內的流路之異物的附著，在對 被處理基板之處理液的塗佈時，可從狹縫狀的噴嘴吐出口 均一地吐出處理液之塗佈裝置及噴嘴的維護方法。 【實施方式】 以下，根據圖面來說明本發明的塗佈裝置及噴嘴的維 護方法之一實施形態。另外，此實施形態是舉一將塗佈裝 置適用於阻劑塗佈處理單元時爲例來說明，該阻劑塗佈處 理單元是一邊浮上搬送被處理基板的玻璃基板，一邊對上 述基板進行處理液之阻劑液的塗佈處理。 如圖1、圖2所示，此阻劑塗佈處理單元1是具備： 浮上搬送部2A，其係用以將玻璃基板G單片式地一片 一片浮上搬送；及 轉子搬送部2B，其係自上述浮上搬送部2 A接受基板G ，進行轉子搬送， 構成基板G會被進行所謂平流式搬送。 在上述浮上搬送部2A中設有延伸於基板搬送方向的X 方向之浮上平台3。在浮上平台3的上面，如圖示般，多數 的氣體噴出口 3 a及氣體吸氣口 3b會在X方向及Y方向以一定 間隔交替設置，將來自氣體噴出口 3a的不活性氣體的噴出 量與來自氣體吸氣口 3b的吸氣量的壓力負荷設爲一定，藉 此使玻璃基板G浮上。 -12- 201228735 另外，此實施形態是藉由氣體的噴出及吸氣來使基板 G浮上，但並非限於此，亦可藉由僅氣體噴出的構成來使 基板浮上。 並且，在轉子搬送部2B中，在平台3的後段，並列設 有藉由轉子驅動部40來旋轉驅動的複數根的轉子軸41»在 各轉子軸41安裝有複數的搬送轉子42，成爲藉由該等搬送 轉子42的旋轉來搬送基板G的構成。 在浮上搬送部2A的浮上平台3的寬度方向（Y方向） 的左右側方設有平行延伸於X方向的一對的導軌5。在此一 對的導軌5上設有4個的基板載體6，該4個的基板載體6是 由下方來吸附保持玻璃基板G的四角落的緣部，而移動於 導軌5上。藉由該等基板載體6來使在浮上平台3上浮上的 玻璃基板G沿著搬送方向（X方向）移動。 另外，爲了順暢地進行從浮上搬送部2A往轉子搬送部 2B的基板交接，導軌5是不僅浮上平台3的左右側方，還延 伸設置至轉子搬送部2B的側方。 如圖3 (圖1的A-A箭號剖面）所示，各基板載體6是具 有： 滑動構件6a，其係設成可沿著導軌5移動； 吸附構件6b，其係可藉由吸引·開放動作來對基板G的 下面吸附：及 昇降驅動部6c，其係使吸附構件6b昇降移動。 另外，在吸附構件6b連接吸引泵（未圖示），吸引與 基板G的接觸領域的空氣而使接近真空狀態，藉此吸附於 -13- 201228735 基板G。 並且，上述滑動構件6a、昇降驅動部6c及上述吸引泵 是分別藉由電腦所構成的控制部50來控制其驅動。 又，如圖1、圖2所示，在浮上搬送部2 A的浮上平台3 上設有對玻璃基板G吐出阻劑液的噴嘴1 6。噴嘴1 6是朝Y 方向例如形成長的大致長方體形狀，形成比玻璃基板G的 Y方向的寬度更長。如圖2、圖3所示，在噴嘴16的下端部 形成有在浮上平台3的寬度方向長的狹縫狀的吐出口 16a。 並且，從阻劑液供給源30經由送出泵31及切換閥32來 供給阻劑液至此噴嘴1 6。 另一方面，在噴嘴1 6的維護時（待機時），可從溶劑 供給部33經由送出泵34及切換閥32來供給阻劑的溶劑（稀 釋劑液）。亦即，藉由溶劑供給部33及送出泵34來構成溶 劑供給手段。 又，如圖1所示，在噴嘴16的兩側設有延伸於X方向的 —對的導軌10。沿著此導軌10設有可滑移的一對的滑動構 件17，如圖3所示，在各滑動構件17之上垂直立設有傳動 軸（shaft) 18。在上述傳動軸18設有可沿著此傳動軸18昇 降移動的昇降驅動部19，在對向於Y方向的一對的昇降驅 動部19之間架設有保持噴嘴16的直棒狀的噴嘴臂π。 藉由該構成，噴嘴16可昇降移動，且可沿著導軌1〇來 移動於X方向。 並且，在平台3上方，比噴嘴1 6更上游側，設有：洗 淨噴嘴前端（吐出口 1 6a )，使噴嘴1 6待機預定時間的待 -14 - 201228735 機部1 4、及在塗佈處理前使附著於噴嘴前端的阻劑液均一 化的上底材處理部2 0，作爲噴嘴1 6的維護手段。 待機部14是具有： 噴嘴洗淨部24，其係將附著於噴嘴16的吐出口 16a的 多餘的阻劑液予以洗淨除去；及 噴嘴浴缸26，其係於溶劑（稀釋劑）的蒸汽環境下保 持吐出口 16a，而使在待機時吐出口 16a不會乾燥。 並且，上底材處理部20是具備： 箱狀的箱子21，其係具有在基板寬度方向（Y方向） 細長的上部開口 21a;及 圓筒或圓柱形狀的上底材滾輪23，其係於箱子21內藉 由馬達等的旋轉驅動部22來設成可繞著軸旋轉》 如圖2所示，上底材滾輪23的上部是設成從箱子21的 上部開口 21a突出的狀態。 如上述般，噴嘴16是可昇降移動，且可沿著導軌10來 移動於X方向，可移動於對玻璃基板G吐出阻劑液的吐出 位置與位於更上游側的上底材處理部20及待機部1 4之間。 亦即，構成噴嘴待機時，噴嘴16是被移動至待機部14 ，在此進行噴嘴洗淨等，在塗佈處理前被移動至上底材處 理部20，實施上底材處理。 更詳細說明有關上述待機部14。 如圖4的剖面圖所示，噴嘴洗淨部24是具備噴嘴洗淨 頭25。 噴嘴洗淨頭25是具有： -15- 201228735 稀釋劑吐出噴嘴25a，其係朝噴嘴吐出口 16a附近吐出 稀釋劑等的洗淨液； 稀釋劑排出管25b，其係吸引回收洗淨使用後的稀釋 劑；及 氣體噴射噴嘴25c，其係朝噴嘴吐出口 16a附近噴射氮 氣等預定的氣體。 此噴嘴洗淨頭25是藉由掃描頭機構（未圖示）來掃描 移動於基板寬度方向（Y方向），藉此可從噴嘴吐出口 16a 的一端到另一端洗淨。 並且，噴嘴浴缸26是具有箱狀的箱子27，該箱狀的箱 子27是具有在基板寬度方向（Y方向）細長的上部開口 27a ，且在此箱子27內儲存有預定量的溶劑T (稀釋劑）。在 箱子27的側部設有排出管27b，被儲存的溶劑T不會超過預 定的容量。 如圖4所示，在噴嘴待機時，噴嘴前端部（吐出口 16a )會被保持於從上述上部開口 27a插入箱子27內的狀態。 並且，如圖4、圖5(圖4的B-B箭號剖面）所示，在箱 子27內，在所被儲存的溶劑T的上方，延伸於基板寬度方 向的長方形板狀的液保持板28 (板構件）會從下方例如被 棒狀的支撐構件36所支撐而設置。在此液保持板28的上面 形成有面一致的液保持面28a，此液保持面28a是由具有耐 藥品性（耐阻劑性、耐溶劑性）、低摩擦係數的材質所構 成。 並且，此液保持板28是被使用在批間的待機期間，在 -16- 201228735 該待機期間藉由控制部5 0的控制來把噴嘴1 6內的流路1 6b 從阻劑液置換成溶劑T (稀釋劑）。而且，從噴嘴吐出口 16a吐出預定量的溶劑T至液保持板28 (液保持面28a)上 〇 藉此，如圖6(噴嘴前端部的擴大圖）所示，在噴嘴 吐出口 16a與液保持板28之間，溶劑T會藉由其表面張力來 保持於形狀被維持的狀態。然後，溶劑T對噴嘴16的界面 T1不是在噴嘴16的流路16b內，而是被形成於噴嘴16的外 面。 接著，更利用圖7來說明有關在如此構成的阻劑塗佈 處理單元1中包含從對基板G的阻劑液塗佈到待機時的噴嘴 的上底材處理之一連串的流程。 在阻劑塗佈處理單元1中，一旦在浮上平台3上搬入新 的玻璃基板G，則基板G會藉由被形成於平台3上的不活性 氣體的氣流來從下方支撐，藉由基板載體6來保持（圖7的 步驟S1 )。 然後，藉由控制部5 0的控制來驅動基板載體6，在基 板搬送方向開始搬送（圖7的步驟S 2 )。 並且，從阻劑噴嘴1 6的吐出口 1 6 a吐出處理液的阻劑 液，對通過噴嘴16下方的基板G實施塗佈處理（圖7的步驟 S3 ) ° 一旦基板G上的阻劑液的塗佈處理終了，則停止來自 噴嘴16的阻劑液的吐出，完成塗佈處理的基板G會從浮上 搬送部2A交接至轉子搬送部2B，藉由轉子搬送來搬出至後 -17- 201228735 段的處理部（圖7的步驟S4)。 —旦形成待機期間，則控制部50會使噴嘴1 6沿著軌道 10來往待機部14的上方移動（圖7的步驟S5)。 然後，首先在待機部14的噴嘴洗淨部24，對噴嘴16的 前端部掃描噴嘴洗淨頭25，進行使用洗淨液（稀釋劑）的 洗淨處理（圖7的步驟S6)。 其次，噴嘴16會被移動至噴嘴浴缸26，噴嘴前端部會 被保持於從箱子27的上部開口 27a插入箱子27內的狀態（ 圖7的步驟S7 )。 在此，當對批內的全部基板G的塗佈處理未完了時（ 圖7的步驟S8)，噴嘴16是原封不動被保持預定時間，期 間，吐出口 16a是被暴露於溶劑T的蒸汽，而使不乾燥（圖 7的步驟S9 )。 在噴嘴浴缸26的預定時間的待機後，噴嘴16是被移動 至上底材處理部20的上方。然後，從吐出口 16a吐出預定 量的阻劑液至上底材滾輪23的表面，且上底材滾輪23會被 旋轉於預定方向，藉此實施噴嘴前端的上底材處理（圖7 的步驟S 1 0 )。 並且，被施以上底材處理的噴嘴16會被移動至對基板 G之阻劑液的塗佈處理位置，進行對其次的基板G的塗佈 處理（圖7的步驟S3)。 另一方面，在步驟S8中，當對批內的全部基板G的塗 佈處理完了時，控制部50會進行切換閥32的切換控制，從 溶劑供給部3 3對噴嘴1 6供給溶劑T (稀釋劑）。藉此，噴 -18 - 201228735 嘴1 6內的流路1 6b是從阻劑液置換成溶劑τ ’成爲被充塡溶 劑Τ的狀態（圖7的步驟SI 1 )。並且’更從噴嘴吐出口 16a 對液保持板28吐出預定量的溶劑T (圖7的步驟S12)。藉 此，如圖6所示，在吐出口 16a與液保持板28 (液保持面 28a)之間，溶劑T會藉由其表面張力來成爲形狀維持的狀 態，在該狀態下保持預定時間（圖7的步驟S 1 3 )。 並且，在該狀態中，對噴嘴16之溶劑T的界面T1是被 形成於噴嘴16的外面》因此，即使溶出至溶劑T的阻劑成 分因爲溶劑T的蒸發而析出於界面T1附近，還是可防止析 出的異物往流路16b內附著。 並且，在阻劑塗佈處理單元1中有新進行塗佈處理的 一批時（圖7的步驟S14)，噴嘴16是被移動至上底材處理 部20的上方。 然後，控制部50會進行切換閥32的切換控制，從阻劑 供給部3 0對噴嘴1 6供給阻劑液。藉此，噴嘴1 6內的流路 16b是從溶劑T再度置換至阻劑液（圖7的步驟S 15)。 然後，從吐出口 1 6a吐出預定量的阻劑液至上底材滾 輪23的表面，且上底材滾輪23會旋轉於預定方向，藉此施 以上底材處理（圖7的步驟S10)。 並且，被施以上底材處理的噴嘴16會被移動至對基板 G之阻劑液的塗佈處理位置，進行對次批的基板G之塗佈 處理（圖7的步驟S 3 )。 如以上般，若根據本發明的實施形態，則在未被實施 利用噴嘴1 6的塗佈處理的批間的待機期間，噴嘴內的流路 -19- 201228735 16b會從阻劑液置換成溶劑Τ，且溶劑T對噴嘴16的界面ΤΙ 會被保持於形成在噴嘴16的外面的狀態。 藉此，即使溶出至溶劑Τ的阻劑成分因爲溶劑Τ的蒸發 而析出於界面Τ1附近，還是可以防止析出的異物往流路 16b內附著。 亦即，將流路16b內設爲清淨的狀態，對基板G之阻劑 液的塗佈時，可從狹縫狀的噴嘴吐出口 16a均一地吐出阻 劑液。 並且，由從溶劑T析出的阻劑成分所構成的異物因爲 附著於噴嘴外面，所以不用分解噴嘴16，可容易進行其除 去作業。 另外，在上述實施形態中是顯示在噴嘴浴缸26的箱子 27內的預定位置經常配置液保持板28的構成，但並非限於 該形態，亦可爲因應所需在噴嘴1 6 (吐出口 1 6a )的下方 配置液保持板28的構成。 該情況，亦可例如圖8 ( a )、圖8 ( b )所示，對於被 配置於箱子27上的噴嘴16的下方位置，由側方進退移動自 如地設置液保持板2 8，藉由滾珠螺桿機構、步進馬達等所 構成的進退移動手段29來使液保持板28進退移動。 藉由如此構成，在批內的待機期間，如圖8 ( a )所示 ，在使液保持板28從噴嘴16下方退避之下，可效率佳地將 溶劑T的蒸汽供給至噴嘴16的吐出口 16a防止其乾燥。 並且，一旦形成批間的待機期間，則噴嘴1 6內的流路 16b會被置換成溶劑T，但至置換完了爲止是如圖8 (a)所 -20- 201228735 示使液保持板28從噴嘴16下方退避，藉此可將液置換時所 被排出的阻劑液直接排出至被儲存於下方的溶劑T。亦即 ，從噴嘴16排出的阻劑液不會附著於液保持板28，因此液 置換後如圖8 ( b )所示在噴嘴16下方配置液保持板28之下 ，可更確實地藉由溶劑T的表面張力來形成界面T1。 或者，亦可不是像上述實施形態那樣使用液保持板28 ，而是使用上底材滾輪23的滾輪面作爲液保持面。 此情況，在批間的待機期間，例如在噴嘴洗淨部24的 噴嘴洗淨後，噴嘴16會被移動至上底材處理部2 0的上方。 然後，噴嘴16的流路16b內會被置換成溶劑T，在上底 材滾輪23的旋轉被停止的狀態下，從吐出口 16a吐出預定 量的溶劑T至滾輪面。藉此，在吐出口 16a與滾輪面之間， 溶劑T會藉由其表面張力來成爲形狀維持的狀態，且溶劑T 對噴嘴16的界面會被形成於噴嘴外面。 因此，至次批的塗佈處理前進行的上底材處理爲止， 是只要保持該狀態即可。 並且，在上述實施形態中，液保持面28a是設爲面一 致的狀態，但亦可如圖9所示，在液保持面28a中，於吐出 口 16a的前後位置，設置延伸於基板寬度方向的一對溝部 28b ° 藉由設置此溝部28b，從噴嘴1 6吐出的溶劑T對液保持 板28之界面的位置會被強制性決定，隨之，可更確實地在 噴嘴16的外面形成預定量吐出至液保持板28的溶劑T對噴 嘴16的界面T1。 -21 - 201228735 並且，在上述的實施形態中，藉由從噴嘴1 6對液保持 板2 8吐出預定量的溶劑T，可在噴嘴16的外面形成溶劑T對 噴嘴1 6的界面T1。 然而，本發明並非限於此，亦可藉由使噴嘴前端浸漬 於儲存的溶劑T之中，在噴嘴外面形成溶劑τ對噴嘴1 6的界 面T1 ° 此情況，例如圖1 〇所示，亦可從吐出口 1 6a吐出溶劑T 來積蓄於剖面Y字形的儲存容器35的同時，使噴嘴前端浸 漬於溶劑T，在噴嘴外面形成界面T1。 或者，亦可爲如圖11 (a)、圖11(b)所示之噴嘴浴 缸26的構成，其係具有：以噴嘴前端不會接觸於被儲存在 箱子27 (儲存容器）的溶劑T之方式設置的排出管27b、及 設於更上方的排出管27c。 該情況，藉由閥切換，在批內的待機期間，如圖1 1 ( a )所示只使用排出管27b，在批間的待機期間，如圖1 1 ( b )所示只使用排出管27c。並且，排出管27c所設的高度 是如圖11 (b)所示形成溶劑T可儲存成至少噴嘴前端會被 浸漬於溶劑T的高度。 藉由如此構成，如圖1〗（b )所示亦可在噴嘴外面形 成溶劑T對噴嘴16的界面T1。 或者，亦可爲圖1 5所示那樣的噴嘴形狀。圖1 5是其他 實施形態的噴嘴的剖面圖。另外，與已述的噴嘴相同的部 分則是省略說明。噴嘴60是在形成有吐出口 16a的面61的 端部連續的斜面62形成有溝部63。藉由形成溝部63 ’從噴 -22- 201228735 嘴60吐出的溶劑對噴嘴60的界面的位置會被強制性 可更確實地在噴嘴6 0的外面形成對噴嘴60的界面。 並且，在已述的實施形態中是將噴嘴16內的阻 換成溶劑來實施本發明，但亦可不將噴嘴16內置換 維持阻劑液實施本發明。該情況，由於阻劑液對噴 界面是形成於噴嘴1 6的外側，所以可防止析出的異 路1 6b內附著。並且，可削減溶劑的使用量，置換 的時間也不需要。 或者，在將噴嘴1 6內的阻劑液置換成溶劑時， 送出泵3 1作用於反方向，把噴嘴1 6內的阻劑液送回 給部30後切換切換閥32，使送出泵34作用，從溶劑 3 3供給溶劑至噴嘴1 6內。藉由使如此動作，可不廢 1 6內的阻劑液來置換成溶劑。 另外，噴嘴16並非限於具有狹縫狀的吐出口的 嘴，例如即使是形成比玻璃基板G的寬度長的長狀 ，或排列設置複數的微細孔作爲吐出口的噴嘴也可 樣的效果》 當然亦可部分地組合已述的實施形態來進行。 【圖式簡單說明】 圖1是表示本發明之一實施形態的全體槪略構 面圖。 圖2是表示本發明之一實施形態的全體槪略構 面圖。 決定， 劑液置 成溶劑 嘴16的 物往流 成溶劑 亦可使 阻劑供 供給部 棄噴嘴 狹縫噴 的噴嘴 取得同 成的平 成的側 -23- 201228735 圖3是圖1的A-A箭號剖面圖。 圖4是本發明的塗佈裝置所具備的待機部的剖面圖。 圖5是圖4的B-B箭號剖面圖。 圖6是圖4的待機部所具有的噴嘴浴缸的部分擴大剖面 圖。 圖7是表示本發明的塗佈裝置的動作流程的流程圖。 圖8(a) ，（b)是表示本發明的塗佈裝置的其他形 態的剖面圖。 圖9是表示本發明的塗佈裝置的其他形態的剖面圖。 圖1 〇是表示本發明的塗佈裝置的其他形態的剖面圖。 圖11 (a) - (b)是表示本發明的塗佈裝置的其他形 態的剖面圖。 圖12是用以說明以往的塗佈處理單元的槪略構成的立 體圖。 圖13是以往的塗佈處理單元所具備的噴嘴浴缸的剖面 圖β 圖14是表示被配置於圖13的噴嘴浴缸的噴嘴的前端部 的狀態的部分擴大剖面圖。 圖1 5是表示本發明的噴嘴的其他形態的剖面圖。 【主要元件符號說明】 1 :阻劑塗佈處理單元（塗佈裝置） 1 6 :噴嘴 1 6 a :吐出口201228735 VI. [Technical Field] The present invention relates to a coating device for applying a treatment liquid to a substrate to be processed, and a method for maintaining a nozzle having a slit-shaped discharge port. [Prior Art] For example, in the manufacture of FPD (Flat Panel Display), a circuit pattern is formed by a so-called photolithography project. In the photolithography technique, after a predetermined film is formed on a substrate to be processed such as a glass substrate, a photoresist (hereinafter referred to as a resist) to which the treatment liquid is applied forms a resist film (photosensitive film). Then, the resist film is exposed to light corresponding to the circuit pattern, and subjected to development processing to form a pattern. In such a photolithography technology project, a resist film is applied to a substrate to be processed to form a resist film, and a resist liquid is discharged from a slit-shaped nozzle discharge port, and a resist is applied thereto. The method on the substrate. A conventional resist coating apparatus using this method will be briefly described using Fig. 12 . The resist application device 200 shown in Fig. 12 includes a stage 201 on which the substrate G is placed, a resist supply nozzle 202 disposed above the stage 201, and a nozzle moving means 203 for moving the nozzle 202. The resist supply nozzle 202 is provided with a slit-shaped discharge port 202a having a small gap extending in the width direction of the substrate, and the resist liquid R supplied from the resist liquid supply source 2A4 can be discharged from the discharge port 202a. 201228735 However, since the slit-shaped discharge port 02a is formed by a small gap, if the nozzle tip is not subjected to the maintenance process during the standby of the nozzle, the blockage is caused by drying of the resist liquid or the like. Therefore, as shown in Fig. 12, the resist application device 200 is provided with a nozzle maintenance means 208 for washing the tip end of the nozzle. The nozzle maintenance means 208 includes a nozzle cleaning unit 208a that ejects a cleaning liquid (thinner) to the nozzle discharge port 202a, and washes the nozzle tip end; and a nozzle bathtub 208b, which is used for the nozzle cleaning unit 208a. The discharge port 202a is held in a vapor atmosphere of the solvent so that the discharge port 202a does not dry during standby. Further, the upper substrate processing unit 208c discharges the resist liquid R to the surface of the cylindrical upper substrate roller that is rotatable before the coating process of the substrate G, and causes the resist liquid R attached to the tip end of the nozzle. Homogenization (priming treatment). In this configuration, in the resist coating treatment of the substrate G, the nozzle liquid 202 is horizontally moved by the nozzle moving means 203, and the resist liquid R is discharged from the slit-shaped discharge port 202a to the substrate. The entire surface is thereby subjected to the coating treatment of the resist liquid R. Further, at the time of standby of the nozzle 202, maintenance processing by the nozzle of the nozzle maintenance means 208 is performed. In this maintenance process, first, the nozzle 202 is moved to the nozzle cleaning portion 208a by the nozzle moving means 203. Then, the nozzle cleaning unit 208a performs the cleaning process on the nozzle tip end. Next, as shown in Fig. 13, the nozzle 202 is held in the nozzle bathtub 2〇8b so that the nozzle discharge port 2〇2a does not dry. 201228735 Further, before the coating process of the substrate G is performed next, the nozzle 022 is moved to the upper substrate processing unit 2〇8c' to discharge the resist liquid to the upper substrate roller, thereby performing the upper end of the nozzle tip. Material processing. Further, the device configuration for such maintenance processing is described in Patent Document 1. [PRIOR ART DOCUMENT] [Patent Document] [Patent Document 1] Patent No. 4040025 SUMMARY OF INVENTION [Problem to be Solved by the Invention] As described above, at the time of maintenance processing of the nozzle 202 during the nozzle standby period, the nozzle 202 is The tip end portion (discharge port 202a) is cleaned by the nozzle cleaning portion 2A8a. As shown in Fig. 13, the nozzle 202 is held in the nozzle bathtub 208b so that the nozzle discharge port 202a does not dry. Here, in the standby period between the substrates which are continuously processed in the same batch, the coating process of the next substrate G does not remain idle for a long time, and therefore the flow path 202b in the nozzle 202 is maintained full. A resist solution for the treatment liquid. On the other hand, in the standby period between different batches, there is a case where standby is performed for a long period of time, and the flow path 202b in the nozzle 202 is replaced by the resist liquid R for the purpose of preventing dry adhesion of the resist, cleaning of the flow path, and the like. Solvent T (diluent). However, when the nozzle flow path 202b is placed in the state of being replaced with the solvent T for a period of 201228735, the solvent T that has been charged to the tip end of the nozzle (the discharge port 202a) evaporates as time elapses during standby, as shown in FIG. It is shown that the resist component eluted to the solvent T precipitates in the vicinity of the interface T1 of the solvent T, and there is a problem that the foreign matter D adheres in the flow channel 202b. In addition, when the foreign matter D adheres to the flow path 202b, the discharge state of the resist from the discharge port 202a is uneven, and the coating film of the substrate G may be stained in the coating film. Hey. Further, in order to remove the foreign matter D without damaging the inside of the flow path 20 2b, it is necessary to disassemble the nozzle 202 for washing, which is a problem that is time consuming and time consuming. In addition, after replacing the inside of the flow path 202b with the solvent T, in order to prevent drying in the vicinity of the discharge port 202a, there is a method of discharging the solvent T to perform a so-called "dummy dispense". However, it is necessary to discharge a large amount of waste solvent T. The issue of increasing costs. In view of the above-described problems of the prior art, the present invention provides a coating apparatus for applying a processing liquid to a substrate to prevent adhesion of foreign matter in a flow path in the nozzle, and to the substrate to be processed. When the treatment liquid is applied, the coating device and the nozzle maintenance method can be uniformly discharged from the slit-shaped nozzle discharge port. (Means for Solving the Problem) In order to solve the above-described problems, the coating apparatus of the present invention includes: a long nozzle that discharges a processing liquid from a discharge port; and a maintenance means that is in a standby period of the nozzle The flow path in the nozzle is held in a state in which the treatment liquid is replaced with the solvent -8 - 201228735 of the treatment liquid, and the treatment liquid is discharged from the discharge port of the nozzle to the substrate to form a coating film coating device. Further, the maintenance means includes: a solvent supply means for supplying the solvent to the nozzle; and a liquid holding surface which forms a predetermined gap with the discharge port of the nozzle, and during the standby period The nozzle is held in a state in which a predetermined amount of solvent is discharged to the liquid holding surface, and an interface of the solvent to the nozzle is formed on the outer surface of the nozzle. Alternatively, the coating apparatus of the present invention includes: a long nozzle that discharges the processing liquid from the discharge port; and a maintenance means that is maintained in the flow path of the nozzle during the standby period of the nozzle In the state in which the treatment liquid is replaced with the solvent of the treatment liquid, the treatment liquid is discharged from the discharge port of the nozzle to the substrate to form a coating film coating device, wherein the maintenance means includes a solvent supply means. Providing the solvent to the nozzle; and a storage container for storing a predetermined amount of solvent at least immersed in the discharge port, wherein the nozzle is held at the discharge port and immersed in the storage container during the standby period The state of the stored solvent, and the interface of the solvent to the nozzle is formed outside the nozzle. -9 - 201228735 According to this configuration, even if the component of the treatment liquid eluted to the solvent is precipitated in the vicinity of the interface due to evaporation of the solvent, it is possible to prevent the deposited foreign matter from adhering to the flow path. In other words, when the processing liquid is applied to the processing liquid of the substrate to be processed, the processing liquid can be uniformly discharged from the slit-shaped nozzle discharge port, and the processing liquid component precipitated from the solvent can be used. Since the foreign matter to be formed adheres to the outside of the nozzle, the removal operation can be easily performed without disassembling the nozzle. In order to solve the problem, the nozzle maintenance method of the present invention is a long nozzle that discharges the processing liquid from the discharge port, and the flow path in the nozzle is replaced with the treatment liquid from the treatment liquid during the standby period of the nozzle. The method for maintaining a nozzle for holding a solvent includes the steps of: supplying the treatment liquid to the nozzle to supply the solvent; and disposing a liquid holding surface below the discharge port, and the discharge port and the liquid holding surface a step of forming a predetermined gap therebetween; and maintaining the nozzle in a state in which a predetermined amount of solvent is discharged from the discharge port to the liquid holding surface, and forming an interface of the solvent on the outside of the nozzle . In order to solve the problem, the nozzle maintenance method of the present invention is a long nozzle that discharges the processing liquid from the discharge port, and replaces the flow path in the nozzle from the processing liquid in the standby period of the nozzle. A method for maintaining a nozzle for maintaining a solvent of a treatment liquid, comprising the steps of: replacing the treatment liquid to supply the solvent to the nozzle: -10- 201228735 storing a predetermined amount of solvent at least immersing the discharge port in storage And a step of holding the discharge port of the nozzle in a state of being immersed in a solvent stored in the storage container, and forming an interface of the solvent on the nozzle to the outside of the nozzle. In order to solve the problem, the method of maintaining the nozzle of the present invention is a long nozzle that discharges the processing liquid from the discharge port, and a nozzle that prevents foreign matter from adhering to the flow path in the nozzle during the standby period of the nozzle. The maintenance method is characterized in that: a liquid holding surface is disposed below the discharge port, and a predetermined gap is formed between the discharge port and the liquid holding surface; and the nozzle is held by the discharge port The liquid holding surface discharges a predetermined amount of the processing liquid, and the interface of the processing liquid to the nozzle is formed on the outer surface of the nozzle. According to such a method, even if the component of the treatment liquid eluted to the solvent is precipitated in the vicinity of the interface due to evaporation of the solvent, it is possible to prevent the deposited foreign matter from adhering to the flow path. In other words, when the processing liquid is applied to the processing liquid of the substrate to be processed, the processing liquid can be uniformly discharged from the slit-shaped nozzle discharge port, and the processing liquid component precipitated from the solvent can be used. Since the foreign matter to be formed adheres to the outside of the nozzle, the removal operation can be easily performed without disassembling the nozzle. -11 - 201228735 [Effects of the Invention] According to the present invention, it is possible to obtain a coating device for applying a processing liquid to be processed, and to prevent adhesion of foreign matter in a flow path in the nozzle, and to treat the substrate to be processed. At the time of application of the liquid, the coating device and the nozzle maintenance method can be uniformly discharged from the slit-shaped nozzle discharge port. [Embodiment] Hereinafter, an embodiment of a coating apparatus and a nozzle maintenance method of the present invention will be described based on the drawings. Further, in this embodiment, a case where the coating apparatus is applied to a resist coating processing unit that processes the substrate while floating and transporting the substrate to be processed is described as an example. The coating treatment of the liquid resist liquid. As shown in FIG. 1 and FIG. 2, the resist coating processing unit 1 includes a floating upper conveying unit 2A for conveying a glass substrate G in a single piece, and a rotor conveying unit 2B. The substrate G is received from the floating transport unit 2 A and the rotor is transported, and the substrate G is subjected to so-called advection transport. The floating upper conveying unit 2A is provided with a floating upper platform 3 extending in the X direction of the substrate conveying direction. As shown in the figure, a plurality of gas discharge ports 3a and gas suction ports 3b are alternately arranged at regular intervals in the X direction and the Y direction, and the inert gas from the gas discharge port 3a is ejected. The amount of pressure and the amount of intake air from the gas intake port 3b are constant, whereby the glass substrate G is floated. -12-201228735 Further, in this embodiment, the substrate G is floated by gas ejection and suction, but the present invention is not limited thereto, and the substrate may be floated by a configuration in which only gas is ejected. Further, in the rotor transport unit 2B, a plurality of rotor shafts 41»rotually driven by the rotor drive unit 40 are arranged in parallel in the rear stage of the stage 3, and a plurality of transport rotors 42 are attached to the respective rotor shafts 41. The configuration of the substrate G is carried out by the rotation of the transfer rotor 42. A pair of guide rails 5 extending in parallel in the X direction are provided on the left and right sides in the width direction (Y direction) of the floating platform 3 of the floating upper conveying portion 2A. On the pair of guide rails 5, four substrate carriers 6 are provided, and the four substrate carriers 6 are sucked and held by the edges of the four corners of the glass substrate G, and are moved on the guide rail 5. The glass substrate G floating on the floating upper stage 3 is moved in the transport direction (X direction) by the substrate carriers 6. In addition, in order to smoothly transfer the substrate from the floating upper conveying portion 2A to the rotor conveying portion 2B, the guide rail 5 is not only floated to the left and right sides of the platform 3 but also extends to the side of the rotor conveying portion 2B. As shown in FIG. 3 (AA arrow section of FIG. 1), each of the substrate carriers 6 has a sliding member 6a that is configured to be movable along the guide rail 5, and an adsorption member 6b that can be attracted and opened. The lower side of the substrate G is attracted: and the elevation drive unit 6c moves the adsorption member 6b up and down. Further, a suction pump (not shown) is connected to the adsorption member 6b, and the air in the contact area with the substrate G is sucked to be in a vacuum state, thereby being adsorbed to the substrate G of -13 - 201228735. Further, the slide member 6a, the elevation drive unit 6c, and the suction pump are controlled by the control unit 50 constituted by a computer, respectively. Further, as shown in Figs. 1 and 2, a nozzle 16 for discharging a resist liquid to the glass substrate G is provided on the floating platform 3 of the floating upper conveying portion 2A. The nozzle 16 is formed into a long substantially rectangular parallelepiped shape in the Y direction, for example, and is formed to be longer than the width of the glass substrate G in the Y direction. As shown in Fig. 2 and Fig. 3, a slit-shaped discharge port 16a having a long width in the width direction of the floating platform 3 is formed at the lower end portion of the nozzle 16. Then, the resist liquid is supplied from the resist liquid supply source 30 to the nozzle 16 via the delivery pump 31 and the switching valve 32. On the other hand, at the time of maintenance of the nozzle 16 (at the time of standby), the solvent (dilution solution liquid) of the resist can be supplied from the solvent supply unit 33 via the delivery pump 34 and the switching valve 32. That is, the solvent supply unit 33 and the delivery pump 34 constitute a solvent supply means. Further, as shown in Fig. 1, a pair of guide rails 10 extending in the X direction are provided on both sides of the nozzle 16. Along the guide rail 10, there are provided a pair of sliding members 17 which are slidable. As shown in Fig. 3, a shaft 18 is vertically disposed above each of the sliding members 17. The transmission shaft 18 is provided with an elevation drive unit 19 that is movable up and down along the transmission shaft 18, and a straight rod-shaped nozzle arm that holds the nozzle 16 is placed between a pair of elevation drive units 19 that face the Y direction. π. With this configuration, the nozzle 16 can be moved up and down and can move in the X direction along the guide rail 1〇. Further, above the stage 3, on the upstream side of the nozzle 16, there is provided a washing nozzle tip end (discharge port 16a), and the nozzle 16 is waited for a predetermined period of time - 14 - 201228735 machine part 1 4 , and is coated The upper substrate processing unit 20 that homogenizes the resist liquid adhering to the tip end of the nozzle before the cloth treatment serves as a maintenance means for the nozzle 16. The standby unit 14 includes a nozzle cleaning unit 24 that removes excess resist liquid adhering to the discharge port 16a of the nozzle 16, and a nozzle bathtub 26 that is sealed in a solvent (diluent) steam environment. The discharge port 16a is held downward, so that the discharge port 16a does not dry during standby. Further, the upper substrate processing unit 20 includes a box-shaped case 21 having an upper opening 21a that is elongated in the substrate width direction (Y direction) and a cylindrical or cylindrical upper substrate roller 23 that is tied to The inside of the case 21 is provided to be rotatable about an axis by a rotary drive unit 22 such as a motor. As shown in Fig. 2, the upper portion of the upper substrate roller 23 is provided to protrude from the upper opening 21a of the case 21. As described above, the nozzle 16 is movable up and down, and is movable in the X direction along the guide rail 10, and is movable to the discharge position at which the resist liquid is discharged to the glass substrate G and the upper substrate processing portion 20 located on the upstream side. Standby unit 14 between. In other words, when the nozzle is in standby, the nozzle 16 is moved to the standby unit 14, where nozzle cleaning or the like is performed, and before the coating process, the upper substrate processing unit 20 is moved to perform the upper substrate processing. The standby unit 14 described above will be described in more detail. As shown in the cross-sectional view of Fig. 4, the nozzle cleaning unit 24 is provided with a nozzle cleaning head 25. The nozzle cleaning head 25 has a -15-201228735 thinner discharge nozzle 25a which discharges a cleaning liquid such as a diluent toward the vicinity of the nozzle discharge port 16a, and a diluent discharge pipe 25b which is sucked, recovered, and washed. The diluent; and the gas injection nozzle 25c spray a predetermined gas such as nitrogen gas toward the vicinity of the nozzle discharge port 16a. The nozzle cleaning head 25 is scanned by a scanning head mechanism (not shown) to move in the substrate width direction (Y direction), whereby it can be washed from one end of the nozzle discharge port 16a to the other end. Further, the nozzle bathtub 26 is a box-shaped case 27 having an upper opening 27a elongated in the substrate width direction (Y direction), and a predetermined amount of solvent T is stored in the case 27 (diluted Agent). A discharge pipe 27b is provided at the side of the case 27, and the stored solvent T does not exceed a predetermined capacity. As shown in Fig. 4, when the nozzle is in standby, the nozzle tip end portion (discharge port 16a) is held in a state of being inserted into the case 27 from the upper opening 27a. Further, as shown in FIG. 4 and FIG. 5 (the BB arrow cross section of FIG. 4), in the case 27, a rectangular plate-shaped liquid holding plate 28 extending in the substrate width direction is provided above the stored solvent T ( The plate member) is provided from below, for example, supported by a rod-shaped support member 36. A liquid holding surface 28a having a uniform surface is formed on the upper surface of the liquid holding plate 28. The liquid holding surface 28a is made of a material having chemical resistance (resistance, solvent resistance) and a low friction coefficient. Further, the liquid holding plate 28 is used during the standby period between the batches, and the flow path 16b in the nozzle 16 is replaced with the resist liquid by the control of the control unit 50 during the standby period of -16-201228735. Solvent T (diluent). Then, a predetermined amount of the solvent T is discharged from the nozzle discharge port 16a to the liquid holding plate 28 (liquid holding surface 28a), whereby the nozzle discharge port 16a and the liquid are as shown in Fig. 6 (enlarged view of the nozzle tip end portion). Between the holding plates 28, the solvent T is maintained in a state in which the shape is maintained by the surface tension thereof. Then, the interface T1 of the solvent T to the nozzle 16 is not formed in the flow path 16b of the nozzle 16, but is formed on the outer surface of the nozzle 16. Next, a flow of one of the upper substrate processes including the application of the resist liquid from the substrate G to the nozzle at the standby in the resist coating processing unit 1 thus constructed will be described with reference to Fig. 7 . In the resist coating processing unit 1, once a new glass substrate G is carried on the floating upper stage 3, the substrate G is supported from below by an air flow of an inert gas formed on the stage 3, by the substrate carrier 6 to maintain (step S1 of Fig. 7). Then, the substrate carrier 6 is driven by the control of the controller 50, and transport is started in the substrate transport direction (step S2 in Fig. 7). Then, the resist liquid of the treatment liquid is discharged from the discharge port 16 6 a of the resist nozzle 16 , and the coating process is performed on the substrate G passing through the nozzle 16 (step S3 of FIG. 7 ) ° once the resist liquid on the substrate G When the coating process is completed, the discharge of the resist liquid from the nozzle 16 is stopped, and the substrate G that has been subjected to the coating process is transferred from the floating transfer unit 2A to the rotor transfer unit 2B, and is transported by the rotor to the rear -17-201228735 The processing unit of the segment (step S4 of Fig. 7). When the standby period is formed, the control unit 50 moves the nozzle 16 along the rail 10 to the upper side of the standby unit 14 (step S5 of Fig. 7). Then, in the nozzle cleaning unit 24 of the standby unit 14, the nozzle cleaning head 25 is scanned at the tip end portion of the nozzle 16, and the cleaning process using the cleaning liquid (diluent) is performed (step S6 in Fig. 7). Then, the nozzle 16 is moved to the nozzle bathtub 26, and the tip end portion of the nozzle is held in a state of being inserted into the case 27 from the upper opening 27a of the case 27 (step S7 of Fig. 7). Here, when the coating process for all the substrates G in the batch is not completed (step S8 of FIG. 7), the nozzle 16 is left untouched for a predetermined period of time, during which the discharge port 16a is steam exposed to the solvent T, It is not dried (step S9 of Fig. 7). After the standby of the nozzle bathtub 26 for a predetermined period of time, the nozzle 16 is moved to the upper side of the upper substrate processing portion 20. Then, a predetermined amount of the resist liquid is discharged from the discharge port 16a to the surface of the upper substrate roller 23, and the upper substrate roller 23 is rotated in a predetermined direction, whereby the upper substrate processing of the nozzle front end is performed (step S of FIG. 7). 1 0 ). Then, the nozzle 16 subjected to the above substrate treatment is moved to the coating processing position of the resist liquid of the substrate G, and the coating process of the next substrate G is performed (step S3 of Fig. 7). On the other hand, in step S8, when the coating process of all the substrates G in the batch is completed, the control unit 50 performs switching control of the switching valve 32, and supplies the solvent T to the nozzle 16 from the solvent supply unit 3 ( Thinner). As a result, the flow path 16b in the nozzle 166 is discharged from the resist liquid into the solvent τ' to be filled with the solvent ( (step SI1 in Fig. 7). Further, a predetermined amount of the solvent T is discharged from the nozzle discharge port 16a to the liquid holding plate 28 (step S12 of Fig. 7). As a result, as shown in FIG. 6, between the discharge port 16a and the liquid holding plate 28 (liquid holding surface 28a), the solvent T is maintained in a shape maintained by the surface tension thereof, and is maintained in this state for a predetermined time ( Step S 1 3 ) of Figure 7. Further, in this state, the interface T1 of the solvent T of the nozzle 16 is formed on the outer surface of the nozzle 16. Therefore, even if the resist component eluted to the solvent T is precipitated near the interface T1 due to evaporation of the solvent T, it is possible The deposited foreign matter is prevented from adhering to the inside of the flow path 16b. Further, when there is a batch in which the coating process is newly performed in the resist coating processing unit 1 (step S14 in Fig. 7), the nozzle 16 is moved above the upper substrate processing portion 20. Then, the control unit 50 performs switching control of the switching valve 32, and supplies the resist liquid to the nozzle 16 from the resist supply unit 30. Thereby, the flow path 16b in the nozzle 16 is again replaced with the solvent T from the solvent T (step S15 of Fig. 7). Then, a predetermined amount of the resist liquid is discharged from the discharge port 16a to the surface of the upper substrate roller 23, and the upper substrate roller 23 is rotated in a predetermined direction, whereby the above substrate processing is performed (step S10 of Fig. 7). Then, the nozzle 16 subjected to the above substrate treatment is moved to the coating processing position of the resist liquid of the substrate G, and the coating process of the next batch of the substrate G is performed (step S3 of Fig. 7). As described above, according to the embodiment of the present invention, the flow path -19-201228735 16b in the nozzle is replaced with the solvent from the resist liquid during the standby period between the batches in which the coating process by the nozzle 16 is not performed. That is, the interface ΤΙ of the solvent T to the nozzle 16 is maintained in a state of being formed outside the nozzle 16. Thereby, even if the resist component eluted to the solvent enthalpy is precipitated in the vicinity of the interface Τ1 due to evaporation of the solvent enthalpy, it is possible to prevent the deposited foreign matter from adhering into the flow path 16b. In other words, the inside of the flow path 16b is cleaned, and when the resist liquid of the substrate G is applied, the resist liquid can be uniformly discharged from the slit-shaped nozzle discharge port 16a. Further, since the foreign matter composed of the resist component deposited from the solvent T adheres to the outside of the nozzle, the nozzle 16 can be removed without disassembling the nozzle. Further, in the above-described embodiment, the liquid holding plate 28 is often disposed at a predetermined position in the case 27 of the nozzle bathtub 26. However, the present invention is not limited to this embodiment, and may be required to be in the nozzle 16 (discharge port 16a). The configuration of the liquid holding plate 28 is disposed below. In this case, for example, as shown in FIG. 8(a) and FIG. 8(b), the liquid holding plate 2 is movably provided by the side advance and retreat to the lower position of the nozzle 16 disposed on the case 27. The advance/retract movement means 29 constituted by a ball screw mechanism, a stepping motor or the like moves the liquid holding plate 28 forward and backward. With such a configuration, as shown in FIG. 8(a), during the standby period in the batch, the liquid holding plate 28 is retracted from below the nozzle 16, and the steam of the solvent T can be efficiently supplied to the nozzle 16 The outlet 16a prevents it from drying out. Further, once the standby period between batches is formed, the flow path 16b in the nozzle 16 is replaced with the solvent T, but until the replacement is completed, the liquid holding plate 28 is shown as shown in Fig. 8(a)-20-201228735. The nozzle 16 is retracted downward, whereby the resist liquid discharged at the time of liquid replacement can be directly discharged to the solvent T stored below. That is, the resist liquid discharged from the nozzle 16 does not adhere to the liquid holding plate 28, so that after the liquid replacement, the liquid holding plate 28 is disposed under the nozzle 16 as shown in Fig. 8(b), which can be more reliably The surface tension of the solvent T forms the interface T1. Alternatively, instead of using the liquid holding plate 28 as in the above embodiment, the roller surface of the upper substrate roller 23 may be used as the liquid holding surface. In this case, during the standby period between the batches, for example, after the nozzles of the nozzle cleaning unit 24 are washed, the nozzles 16 are moved to the upper side of the upper substrate processing unit 20. Then, the inside of the flow path 16b of the nozzle 16 is replaced with the solvent T, and a predetermined amount of the solvent T is discharged from the discharge port 16a to the roller surface in a state where the rotation of the upper substrate roller 23 is stopped. Thereby, the solvent T is maintained in a shape maintained by the surface tension between the discharge port 16a and the roller surface, and the interface of the solvent T with the nozzle 16 is formed on the outside of the nozzle. Therefore, it is only necessary to maintain the state of the upper substrate before the coating treatment of the next batch. In the above-described embodiment, the liquid holding surface 28a is in a state in which the surfaces are aligned. However, as shown in FIG. 9, the liquid holding surface 28a may be provided in the front and rear positions of the discharge port 16a so as to extend in the substrate width direction. By providing the groove portion 28b, the position of the solvent T discharged from the nozzle 16 to the interface of the liquid holding plate 28 is forcibly determined, and accordingly, the predetermined shape of the nozzle 16 can be formed more reliably. The amount of solvent T discharged to the liquid holding plate 28 to the interface T1 of the nozzle 16 is discharged. Further, in the above-described embodiment, the solvent T to the nozzle 16 is formed on the outer surface of the nozzle 16 by discharging a predetermined amount of the solvent T from the nozzle 16 to the liquid holding plate 28. However, the present invention is not limited thereto, and the tip end of the nozzle may be immersed in the stored solvent T, and the interface T1 of the solvent τ to the nozzle 16 may be formed on the outside of the nozzle, for example, as shown in FIG. The solvent T is discharged from the discharge port 16 6 to be stored in the storage container 35 having a Y-shaped cross section, and the tip end of the nozzle is immersed in the solvent T to form an interface T1 on the outer surface of the nozzle. Alternatively, the nozzle bathtub 26 may be configured as shown in Figs. 11(a) and 11(b), and the nozzle tip is not in contact with the solvent T stored in the case 27 (storage container). The discharge pipe 27b provided in the manner and the discharge pipe 27c provided above are provided. In this case, by the valve switching, only the discharge pipe 27b is used as shown in Fig. 11 (a) during the standby period in the batch, and only the discharge pipe is used as shown in Fig. 1 1 (b) during the standby period between the batches. 27c. Further, the height of the discharge pipe 27c is such that the solvent T is formed as shown in Fig. 11(b) so that at least the tip end of the nozzle is immersed in the solvent T. With such a configuration, the interface T1 of the solvent T to the nozzle 16 can be formed on the outer surface of the nozzle as shown in Fig. 1 (b). Alternatively, it may be a nozzle shape as shown in Fig. 15. Fig. 15 is a cross-sectional view showing a nozzle of another embodiment. In addition, the same portions as those of the above-described nozzles are omitted. The nozzle 60 is formed with a groove portion 63 on a slope 62 which is continuous at the end portion of the surface 61 on which the discharge port 16a is formed. The position of the interface of the nozzle 60 by the solvent which is formed by the groove portion 63' from the nozzle -22-201228735 is forced to more reliably form the interface with the nozzle 60 on the outer surface of the nozzle 60. Further, in the above-described embodiment, the present invention is practiced by blocking the inside of the nozzle 16 into a solvent, but the present invention may be carried out without replacing the inside of the nozzle 16 with a resist liquid. In this case, since the resist liquid-to-spray interface is formed outside the nozzle 16, it is possible to prevent adhesion in the separated outer path 16b. Further, the amount of the solvent used can be reduced, and the replacement time is not required. Alternatively, when the resist liquid in the nozzle 16 is replaced with a solvent, the delivery pump 3 1 acts in the opposite direction, and the resist liquid in the nozzle 16 is returned to the donor unit 30, and the switching valve 32 is switched to cause the pump 34 to be sent. Acting, solvent is supplied from solvent 3 3 into nozzle 16. By performing such an operation, the solvent solution in the waste 16 can be replaced with a solvent. In addition, the nozzle 16 is not limited to a nozzle having a slit-shaped discharge port, and for example, it is possible to form a long shape longer than the width of the glass substrate G or a nozzle in which a plurality of fine holes are arranged as a discharge port. It can also be carried out in part by combining the embodiments described above. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic overall view showing an embodiment of the present invention. Fig. 2 is a schematic overall view showing an embodiment of the present invention. It is determined that the solution of the solvent liquid into the solvent nozzle 16 can be made into a solvent, and the nozzle can be used to supply the nozzle of the nozzle slit nozzle to obtain the flat side of the same -23-201228735. FIG. 3 is the AA arrow of FIG. Sectional view. Fig. 4 is a cross-sectional view showing a standby unit provided in the coating apparatus of the present invention. Figure 5 is a cross-sectional view of the arrow B-B of Figure 4; Fig. 6 is a partially enlarged cross-sectional view showing a nozzle bathtub of the standby unit of Fig. 4; Fig. 7 is a flow chart showing an operational flow of the coating device of the present invention. Figures 8(a) and 8(b) are cross-sectional views showing other forms of the coating apparatus of the present invention. Fig. 9 is a cross-sectional view showing another embodiment of the coating device of the present invention. Fig. 1 is a cross-sectional view showing another embodiment of the coating device of the present invention. Fig. 11 (a) - (b) are cross-sectional views showing other forms of the coating apparatus of the present invention. Fig. 12 is a perspective view for explaining a schematic configuration of a conventional coating processing unit. Fig. 13 is a cross-sectional view showing a nozzle bathtub provided in a conventional coating processing unit. Fig. 14 is a partially enlarged cross-sectional view showing a state in which a tip end portion of a nozzle of the nozzle bathtub of Fig. 13 is disposed. Fig. 15 is a cross-sectional view showing another embodiment of the nozzle of the present invention. [Explanation of main component symbols] 1 : Resist coating processing unit (coating device) 1 6 : Nozzle 1 6 a : Exhaust
S -24- 201228735 1 6 b :流路 26 :噴嘴浴缸（維護手段） 2 8 a :液保持面 3 3 :溶劑供給部（溶劑供給手段） 34 :送出泵（溶劑供給手段） G:玻璃基板（被處理基板） T :溶劑 T 1 ·界面 -25-S -24- 201228735 1 6 b : Flow path 26 : Nozzle bathtub (maintenance means) 2 8 a : Liquid holding surface 3 3 : Solvent supply unit (solvent supply means) 34 : Feed pump (solvent supply means) G: Glass substrate (substrate to be processed) T : solvent T 1 · interface-25-