TW200534925A - Nozzle cleaning apparatus and substrate processing apparatus - Google Patents

Abstract

To improve washing effect in washing treatment of a discharge nozzle for discharging a prescribed treating liquid with respect to washing technique for the discharge nozzle. A guide block 743 for approaching below a discharge port 41a of a slit nozzle 41 is provided at a washing section 74 for washing a slit nozzle 41. Gas nozzles 710 for blowing gaseous nitrogen and washing nozzles 750 for ejecting rinse liquid LQ are provided and further a suction mechanism sucks the lower part of the discharge port 41a of the slit nozzle 41. Thickness of the guide block 743 in a X-axis direction is made to be larger than the width of the discharge port 41a in the X-axis direction, and thereby adjustment is performed so that suction force by the suction mechanism may not directly act on the discharge port 41a. Thereby suction force of the suction mechanism can be raised and washing effect is improved.

Description

200534925 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a technology for cleaning a spray nozzle that sprays a specific treatment liquid. [Prior art] The following substrate processing devices are well known, which are used for liquid crystal glass rectangular substrates, semiconductor wafers, flexible substrates for thin film liquid crystals, substrates for photomasks, substrates for color filters (hereinafter referred to as "substrates"), etc. The surface is coated with a treatment liquid such as a resist. In such a substrate processing apparatus, a resist liquid is sprayed from a spray nozzle to form a coating film of the resist liquid on the substrate surface. Figs. 18 to 20 are conceptual diagrams showing the following situations in a staged manner: In the substrate processing apparatus t for applying a resist solution to a substrate, the adherence of the resist solution remains on the substrate due to repeated coating processes. Spray the nozzle. FIG. 18 shows the end state before the slit nozzle 100 in a normal state in the initial state. Fig. 9 shows a state in which a coating process is performed on several tens of substrates, and Fig. 20 shows a state in which a coating process is performed on several hundreds of substrates. That is, in such a substrate processing apparatus, if the coating process is repeatedly performed on the substrate, the resist liquid r will gradually remain on the periphery of the nozzle 101 or the side of the end of the slit nozzle 100 before. > In particular, as shown in FIG. 19 and FIG. 20, in a substrate processing apparatus (slot coater) using a 100% coating process using a slit nozzle, if a resist is unevenly adhered Applying the coating process to the slit nozzle ιο under the state of the liquid level will cause streaky coating plaques m to be stably performed. Butchery must be cleaned at regular intervals to remove the residual 98458.doc 200534925 etchant solution R remaining around the nozzle 101. In view of this reason + ~ Juda, it has been suggested that there is a substrate processing apparatus for performing nozzle cleaning processing. For example, it is disclosed in the patent document. The previous substrate processing apparatus has a cleaning nozzle that sprays cleaning liquid. A common method in the nozzle cleaning process is to supply a cleaning liquid from the cleaning head toward the end portion before the nozzle is ejected. In addition, in order to improve the cleaning effect, the industry requires that the supply amount of the cleaning liquid is increased, and the cleaning liquid used for cleaning is quickly attracted and discharged. ~ ‘Industrial manufacturers have demanded increased suction power when suctioning the front end of the nozzle.

[Patent Document 1] Japanese Patent Laid-Open Publication No. u_074179 [Problems to be Solved by the Invention] However, in the conventional substrate processing method, there are the following problems: • If the attraction force is increased, the nozzle will be discharged from the nozzle to the nozzle. The resist liquid filled therein is attracted and sucked out. This problem is particularly significant when the resist liquid (treatment liquid) has a low viscosity. Fig. 21 shows a state in which air is mixed in a portion where the anti-money liquid r is sucked out. Fig. 22 shows a state where a cleaning liquid (cleaning liquid LQ) is mixed in a portion where the anti-reagent liquid R is sucked out. In this way, in the conventional substrate processing apparatus, if the attraction force is increased in order to increase the cleaning power, the state of the spray jets after cleaning becomes uneven in the longitudinal direction, and the attraction force cannot be increased. There is a limit in improving the cleaning effect in the cleaning process. Further, in the conventional substrate processing apparatus, there are the following problems ... Even in the state where the spray cleaning process is completed, the stripe-shaped adhered matter remains on the side surface of the end portion before the ejection nozzle. Fig. 23 is a view showing a stripe-shaped adherend RL found after a nozzle cleaning process in a conventional substrate processing apparatus. Fig. 98458.doc 200534925 23 The attachment on the side of the front end of the slit nozzle ⑽ is near the highest position in the cleaning liquid range, and because of the retention of the dissolved antiseptic solution and cleaning liquid, etc. And it was formed. Such an attached rainbow also deteriorates the state of the slit nozzle after washing. The present invention was made in view of the above-mentioned problems, and its object is to improve the cleaning effect in the cleaning process of the ejection nozzle. [Summary of the Invention] In order to solve the above problem, the invention of claim 1 is a nozzle cleaning device, which is characterized in that it is a person who cleans a spray nozzle that sprays a specific treatment liquid from a nozzle provided at the front end. It includes a cleaning liquid supply mechanism that supplies a specific cleaning liquid from the mouth toward the vicinity of the front end of the ejection nozzle, and sucks the specific cleaning liquid supplied by the cleaning liquid supply mechanism through a suction port. The attraction mechanism of the suction mechanism is adjusted in such a manner that the periphery of the nozzle can substantially become the stagnation point of the specific treatment liquid. In addition, the invention of claim 2 is a nozzle cleaning device related to the invention of claim 1 which further includes a shielding member. The shielding member has a thickness greater than the width in the short direction of the ejection nozzle of the ejection nozzle and is disposed in the above-mentioned 嗔Around the lower part of the nozzle of the nozzle, and the suction port of the suction mechanism performs suction from below the blocking member, thereby adjusting the attraction of the suction mechanism around the nozzle of the jet. In addition, the invention of claim 3 is a nozzle cleaning 98458.doc 200534925 related to the invention of claim 2, wherein the shielding member has a guide surface, and the guide surface will be subjected to the specific cleaning provided by the cleaning liquid supply mechanism. The fluid is directed downward. + M, Mao Ming is the nozzle cleaning related to the invention of claim 1 \ The above suction mechanism sucks * from the side of the front end of the nozzle before suction, thereby adjusting the attraction of the above mentioned suction mechanism. ^ ㈣ 2: The invention of item 5 is the nozzle cleaning 2ha related to the invention of claim 4, wherein the suction port of the suction mechanism is arranged closer to the discharge nozzle than the nozzle of the cleaning liquid supply mechanism. In addition, the invention of claim 6 relates to the nozzle cleaning related to the invention of claim 4: it is set from the position below the front end of the above-mentioned ejection nozzle = the above is supplied by the upper cleaning liquid supply mechanism. Specific cleaning solution. The invention of claim 7 is a nozzle cleaning device related to the invention of claim 6, further comprising a guide member having a guide surface disposed at a front end of the ejection nozzle, and the guide surface is provided by the cleaning liquid supply mechanism. The supplied specific washing liquid is guided downward. In addition, the invention of claim 8 relates to the invention of claim 1, and further includes an adjustment mechanism for adjusting the supply position of the cleaning liquid in the cleaning liquid supply mechanism. Moreover, the invention of claim 9 is a device related to the invention of claim 8 ', wherein the above-mentioned adjustment mechanism has a partition with a specific thickness / again, the claim! The invention of 〇 is related to the invention of claim i. “The nozzle of the above-mentioned ejection nozzle is a gap extending in a specific direction 98458.doc 200534925, and is further provided with the above-mentioned cleaning liquid supply mechanism along the feeding direction. Mobile scanning mechanism. ° ^ The invention of claim item 系 is related to the invention of claim item], wherein the nozzle of the above-mentioned spray nozzle is a slit extending in a specific direction, and the cleaning liquid supply mechanism can supply the above-mentioned specific cleaning at substantially the same time. The liquid contention is across the entire width in the specific direction in the front end portion of the ejection nozzle. The invention of claim 12 is a nozzle cleaning device related to the invention of claim 1 and further includes a tipping gas supply mechanism before supplying a specific gas to the nozzle out of the nozzle. The supply position of the specific gas is provided above the supply position of the special cleaning liquid from the cleaning liquid supply mechanism. The invention according to item 13 is a nozzle cleaning device, which is characterized in that a person who cleans and sprays a specific treatment from a nozzle provided at the front end portion is provided and exits near the front end portion facing the nozzle. “Supply” fixed-liquid supply mechanism, without cold suction, the specific cleaning and night suction mechanism supplied by the cleaning liquid supply mechanism, and ^^^ The cleaning liquid supply mechanism is provided with a plurality of nozzles directed toward the ejection nozzle. The cleaning nozzle sprays the above-mentioned cleaning liquid and comes from the above-mentioned plurality of cleaning nozzles to the supply position μ of the specific cleaning liquid above to be specific to 98458.doc -J0- 200534925 from other cleaning nozzles The supply position of the cleaning liquid is set in a different way in the direction of the degree. The invention of month 14 is a substrate processing device, which is a person who applies a specific processing liquid on a substrate, and A holding mechanism for holding a substrate, a nozzle for discharging a specific processing liquid from a nozzle provided at a front end portion to a surface of a substrate of the holding mechanism, and a nozzle cleaning method for "cleaning the above-mentioned injection nozzle" And the nozzle cleaning device is provided with a liquid-liquid supply mechanism toward the vicinity of the front end of the ejection nozzle, and the suction and cleaning mechanism for the pregnant liquid is sucked by the suction mechanism provided by the cleaning liquid supply mechanism, Wash the liquid and adjust the attraction of the suction mechanism in such a way that the area around the nozzle can be large, and $ # is the stagnation point of the specific treatment liquid. The invention of claim 15 is based on: it is a method for coating a substrate with a specific treatment; it is a holding mechanism for holding a substrate, and a nozzle is provided from the surface of the substrate of a spraying mechanism provided at the front end Temple: and a nozzle cleaning device for holding the processing liquid to the above-mentioned cleaning and cleaning the above-mentioned ejection nozzle, and the above-mentioned nozzle cleaning device is provided with a liquid supply mechanism attached to the front end of the above-mentioned ejection nozzle. Washing 98458.doc 200534925 Suction mechanism for suctioning the specific cleaning liquid supplied by the cleaning liquid supply mechanism, the cleaning liquid supply mechanism is provided with a plurality of specific cleaning liquids ejected toward the front end of the discharge nozzle The cleaning nozzles, and the supply position of the specific cleaning solution from at least one of the plurality of cleaning nozzles is different from the supply position of the specific cleaning solution from other cleaning nozzles in the height direction. [Effect of the invention] In the inventions of claims 1 to 12 and 14, the suction mechanism can be adjusted by making the periphery of the nozzle approximately the stagnation point of the specific processing liquid. Suction force, and rapidly discharging the cleaning liquid by suction and contaminants, and to suppress discharge within the treatment liquid sucked out of the nozzle opening. In the invention of claim 2, a shielding member is further provided, and the suction port of the suction machine is suctioned from below the blocking member, thereby adjusting the suction of the suction mechanism around the nozzle of the spray nozzle ^ l, and thus the angular force can be easily made. The invention of claim 1 is realized, and the shielding member has a thickness greater than or equal to the width in the direction of the nozzle of the ejection nozzle, and is disposed around the ejection nozzle. Only in the invention of claim 3, the cleaning liquid can be borrowed. The above-mentioned guide ^ has a guide surface, and then the D surface is quickly discharged. The special cleaning liquid supplied by the cleaning liquid supply mechanism is directed to the lower one. . In the invention of claim 4, "Zishan A + Zhongjing" was sucked from the side of the front end of the self-ejection nozzle. 98458.doc 12 200534925 Fine suction 2 'to adjust the attraction of the suction mechanism around the mouth of the ejection nozzle. Thereby, the invention of claim 1 can be easily realized. In the invention of claim 6, "due to the fact that the clean liquid supplied by the cleaning liquid supply mechanism is discharged from the end portion before the ejection nozzle", the liquid can be discharged instead of relying solely on the suction mechanism. Therefore, the σ × X small-capacity mechanism serves as an attraction mechanism. According to the invention order of claim 7, further provided with the above-mentioned guidance of the bottom of the distribution part and the top ends of Shiboyao and Shanbejiao can effectively discharge the cleaning liquid from the discharge port. ^ &Quot; Noodles are supplied by the cleaning liquid The liquid supplied by the institution is directed to the lower one. The above 4 special cleaning. In invention 10 of claim 8, the specific washing of the supply mechanism can be used to adjust the washing position flexibly. According to the invention of claim 9, the invention of claim 8 can be easily realized by the partition '. The invention of claim 8 has a specific thickness. In this invention, a slit in a specific direction can be sprayed, and furthermore, it is greedy. It is a scanning mechanism that extends in the direction, and presents the 'Yin' and the mechanism along a specific evaluation structure. The miniaturization of the entire A device is also in the request for the invention. It can be supplied by the cleaning liquid supply mechanism%. The specific cleaning liquid in the cross spray 11 is approximately the same as χ ^ _ bay angle of the moon 丨 J end Shen Shen 4 Shi a king width, thereby shortening the nozzle cleaning time f. < Special direction: The fortune of claim 12 'is provided with a gas supply mechanism at the end of w for supplying a specific I body, and the supply position of the nozzle gas is located at the specific cleaning liquid from the cleaning liquid structure. 98458.doc 200534925 above the supply position, which promotes drying of the cleaning solution. In the inventions of claims 13 and 15, the supply position of the specific cleaning solution of at least one cleaning nozzle to the supply position of the specific cleaning solution of the other cleaning nozzles by the plurality of cleaning nozzles is in the height direction. They are arranged in different ways to prevent streaks from adhering to the discharge nozzle. Thereby, the washing effect can be improved. [Embodiment] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. < 1. First Embodiment > Fig. 1 is a perspective view showing a substrate processing apparatus of the present invention. FIG. 2 is a side view showing a main configuration of a coating process of the substrate processing apparatus i. θ For the convenience of illustration and explanation in Fig. 1, the axis direction is defined as the vertical direction, and the XY plane is the horizontal plane, but these are only for the convenience of definition for grasping the positional relationship, and are not limited to the directions described below. The same applies to the drawings described below. The substrate processing device i is roughly divided into a main body 2 and a control unit 8, and a rectangular broken glass substrate used for manufacturing a screen panel of a liquid crystal display device is used as a substrate to be processed (hereinafter, referred to simply as "substrate J" 90). In the lithography process such as electrode layer engraved on the surface of the substrate 90, it is constituted as a coating processing device for coating the anti-money liquid as a processing liquid on the% surface of the substrate. Therefore, in this embodiment, the narrow The slit nozzle 41 can spray the anti-leak agent liquid. In addition, the substrate processing unit 1 can also be deformed and used as a glass substrate for applying a processing liquid not only to a liquid crystal display device, but also to a flat liquid. 200534925 A device for various substrates for a panel display. The main body 2 is provided with a platform 3 which functions as a holding table for placing and holding the substrate 90, and also functions as a base for each attached mechanism. Platform 3 It is made of, for example, an integrated stone having a rectangular parallelepiped shape, and the upper surface (holding surface 30) and the side surface are processed into a flat surface.

A horizontal plane is formed on the upper surface of the flat hall 3 and becomes a holding surface 30 of the substrate 90. A plurality of vacuum suction ports (not shown) are formed on the holding surface 30, and the substrate 90 is held at a specific horizontal position during the processing of the substrate 90 on the substrate processing apparatus 1 by sucking the substrate 90. In addition, a plurality of jacks are provided on the holding surface 30 at a suitable interval for freely lifting up and down by a driving mechanism (not shown). The ejector pin lp is used to push on the substrate 90 when the substrate 90 is removed. The two sides of the holding area (the area holding the substrate 90) of the substrate 90 are held in the holding surface 30. That is, a pair of moving rails 3 extending parallel to the substantially horizontal direction are fixedly provided. The moving rails 31 and the supporting blocks (not shown) fixedly arranged at the bottom of both ends of the bridge structure 共同 together constitute a guide bridge structure 4 Move (the movement direction is specified as a specific direction) 'and the bridge structure 4 is supported by the linear guide above the holding surface 30. Above the platform 3, a bridge structure 4 is set up which is roughly erected from both sides of the platform 3. The bridge structure 4 mainly includes, for example, a nozzle support portion using carbon fiber, resin as an aggregate, and supporting the elevator phases at both ends. 43, 4 Μ The support portion 40 is equipped with a narrow nozzle 4 and a diagram β. The slit nozzle 41 in the longitudinal direction is connected to the anti-hypertensive agent supply device 2), and the cymbal supply mechanism 6 includes a pipe or a pump for resist for supplying the anti-antiseptic solution to the narrow 98458.doc 200534925 41. While scanning the surface of the substrate 90, the resist liquid supplied by the resist pump was ejected to a special area (hereinafter referred to as a "resist coating area") of the substrate 90. ), The slit nozzle 41 applies the anti-remainder liquid to the substrate 90. Here, the term "resist coating area" means a region on the surface of the substrate 90 where the resist liquid is to be applied, and is generally a region in which a specific width region along the edge is removed from the entire area of the substrate 90. The φ elevating mechanisms 43 and 44 are spaced apart from each other on both sides of the slit nozzle 41, and are connected to the slit nozzle 41 by a nozzle support portion 40. The lifting mechanism 43 mainly includes AC servo motors 43a and 44a and round head bolts (not shown), and generates a lifting driving force for the bridge structure 4 based on a control signal from the control unit 8. Thereby, the elevating mechanisms 43, 44 raise and lower the slit nozzle 4] [translationally. The lift mechanisms 43 and 44 can also be used to adjust the state of the slit nozzle 4 in a plane.

Both ends of the paste 4 are fixed along the edges of the sides of the platform 3:-AC hollow linear motors (hereinafter referred to as a factory linear motors) 50 and 51 are also placed. 〇It is provided with a stator (stator) 50a, a mobile 50b, and a stator 5] a at both ends of the bridge structure 4, and linear decoders 52 and 53 each having a stator and a detector are fixedly provided. The linear decoders 52 and 53 detect the positions of the lines 焉 up to 5G 5]. These linear motors are mainly composed of linear motors and linear Zemei 52 and 53 to constitute a moving mechanism 5 which is used to guide the bridge structure to the moving track 3] and move on the platform 3. Control unit _ Controls the movement of 9S458.doc 16 200534925 of the horse based on the results from the linear decoders 52 and 53 so as to control the movement of the bridge structure 4 on the platform 3, that is, to control the substrate 9 of the slit jet 4 1 〇's scan. In the holding surface 30 of the main body 2, an opening 32 is provided on the holding area (-X) direction side. The opening 32 is the same as the slit nozzle 41, and has a length direction in the γ-axis direction, and the length in the length direction is the same as that of the slit nozzle 41. The length in the longitudinal direction is approximately the same. Further, inside the body 2 below the opening 32, a nozzle initialization mechanism 7 is provided. The nozzle initialization mechanism 7 is used for a preliminary process (described below), which is performed before a process of applying a resist liquid to the substrate 90 (hereinafter, referred to as "this coating process"). The nozzle initialization mechanism 7 not placed in the opening 32 is provided with a pre-coating mechanism 73 ° The pre-coating mechanism 73 is provided with a rotation mechanism 730 ′ which generates a rotational driving force, and a roller 73 1 which is rotated by the rotation mechanism 73 ° and stores a roller 731 The dewatering blades 733 of the substantially box-shaped frame body 732 and the attachments on the removal drum 73 are located inside. The roller 731 is disposed so as to expose a part from the opening on the upper surface of the frame 732, and the side surface of the cylinder is a coating surface coated with a resist liquid. The substrate processing apparatus 1 ejects the resist liquid from the slit nozzle 41 to the drum 731 during the preliminary coating process. In addition, the pre-coating process refers to the following process: Before the main coating process, a small amount of the resist liquid is sprayed from a slit nozzle moved above the drum 731 to pre-coat the resist liquid. It is placed on the roller 731. The substrate processing apparatus 1 in this embodiment makes the state of the slit nozzle 41 1 uniform in the γ-axis direction by a preliminary coating process. The coating surface of the roller 731 can be applied to the frame meat / 32 The inner part is immersed in the accumulated cleaning solution. That is, in the pre-coating process, the coating surface of the anti-corrosion cloth with a resist solution is applied on the surface. After being washed by the washing liquid, the pollutants adhering to the coating surface taken out of the washing liquid after washing are removed by the dewatering blade 733. In this way, the coating surface is rotated during a 73 rpm rotation of the drum It can be restored to a clean state, so the slit nozzle 4 will not be polluted during the preliminary coating process by the slit nozzle ^. The nozzle initialization mechanism 7 includes a nozzle cleaning mechanism 70. Fig. 3 shows Diagram of the structure of the nozzle cleaning mechanism 70. Nozzle cleaning machine Gogawa has a gas supply mechanism 71, a suction mechanism 72, a cleaning unit 74, a cleaning liquid supply mechanism, and a drive mechanism 76, and it is a mechanism that mainly performs the above-mentioned nozzle cleaning process. Moreover, although the illustration is omitted in FIG. 3 The gas supply mechanism 71, the suction mechanism 72, the cleaning liquid supply mechanism 75, and the drive mechanism are connected to the control unit 8 in a state capable of sending and receiving signals, and the control signals from the control unit 8 are controlled. The gas supply mechanism 71 is a mechanism that supplies nitrogen gas from a cylinder (not shown) to the cleaning unit 74 through a supply pipe. The nitrogen gas supplied to the cleaning unit 74 is ejected from the gas nozzle 710 in a specific direction (detailed) The substrate processing apparatus 1 in this embodiment uses a nitrogen gas as the inert gas, but the inert gas is not limited to the nitrogen gas. If it is a clean gas, even air can be used. After repeated addition of air). The suction mechanism 72 is a suction port provided in the washing section 74 through a waste pipe:: 0 (Fig. 5) sucks the washing liquid or is removed by the washing liquid The mechanism of the resist solution temple. Moreover, as the attraction mechanism 72, a conventionally well-known mechanism can be generally used. For example, it can also be a mechanism that uses a vacuum to generate clothes or repeatedly shrink the machine to attract. Gas-liquid separation box mechanism 98458.doc 200534925, etc. Also, for example, as long as the required force can be obtained, the exhaust equipment installed in the factory can also be used. The cleaning section 74 mainly includes a base 74 and a partition 741. , Ejection section, guide block 743, and support member 744, and has the following functions: in the nozzle cleaning process, cleaning and removal of the corrosion that adheres to the side of the front end of the slit nozzle 41 due to repeated formal coating processes As the base of each component of the cleaning unit 74, the cooking base 74 is connected to the driving mechanism 76, and can be reciprocated in the direction of the γ sleeve by the driving mechanism%. & The spacer 741 is a plate-shaped member having a specific thickness, and is inserted between the base 74o and the ejection portion 742 in a detachable state. In this embodiment, the partition 741 is fastened by the connection from the base 74o, and is fixed by a screw inserted toward the ejection portion 742 after the morning, and can be removed by loosening the screw. In this way, by appropriately exchanging the spacers 741 'disposed between the base 740 and the ejection portion 742 for those having different thicknesses, the z-axis direction position of the ejection portion% can be adjusted. As described below, 'the cleaning nozzle 750 is provided at a specific position of the ejection portion 742', and adjusting the position in the two-axis direction of the ejection portion 742 is equivalent to adjusting the height position of the cleaning nozzle 750 (the position in the direction). Therefore, the nozzle cleaning mechanism 70 in this embodiment can adjust the supply position of the cleaning liquid supplied by the cleaning liquid supply mechanism 75 to a biaxial direction. FIG. 4 is a front view of a & The ejection portion 742 is a member in which a gas nozzle 7 ι and a cleaning nozzle 配置 are arranged in a positional relationship with the temple. Pull + ^ Hunt b, and determine the position of the nitrogen gas in the gas nozzle 710 μ. Wash the supply position of the cleaning solution. In addition, 9S45S.doc 19-200534925, Z1 to Z4 in Fig. 4 indicate the Z-axis coordinates of the gas nozzle 71 and the cleaning nozzle 750 in the facing surface 742a. In addition, Z1 to Z4 in the ejection portion μ] in this embodiment are positioned at equal intervals, but it is not limited to this. _ Opposite side that is configured to face the front end of the slit nozzle 41 • Surface 742 & According to the inclination of the front end of the slit nozzle 41, it becomes an inclined surface with a specific angle of inclination to the plane of Ya. As shown in FIG. 3, a gas nozzle 71o and a cleaning nozzle 75o are distributed on the facing surface 742a, and are connected to φ and connected to the gas supply mechanism 71 and the cleaning liquid supply mechanism 75, respectively. The nitrogen gas supplied by the gas supply mechanism 71 is ejected from the gas nozzle 71 to the slit nozzle 41. Thereby, the cleaning liquid adhering to the slit nozzle 41 can be effectively volatilized (or blown off) by the nozzle cleaning process. In addition, the cleaning liquid sprayed from the self-cleaning nozzle 750 is impacted by the slit nozzle 41, and is scattered to a number of locations in the south and at a moderate position during spraying. As shown in FIG. 4, in the substrate processing apparatus of the present target form, the gas nozzle 710 is provided so that the supply position of the nitrogen gas from the gas nozzle 71 is positioned above the scattering position of the cleaning liquid, and the gas nozzle 710 is set at Above the cleaning nozzle 750. This allows the slit nozzle 41 to be dried more effectively during the nozzle drying process. The gas nozzle 7 10 includes a lower gas nozzle 710a and an upper gas nozzle 710b. In the facing surface 742 &, the lower gas nozzle 71 (^ is arranged at the height position, and the upper gas nozzle 710b is arranged at the south position Z4 above the lower gas nozzle 710 &. Also, the cleaning nozzle 750 Contains the lower washing nozzle 750a and the upper washing nozzle 75〇b. In the facing surface 742a, the lower washing nozzle 750a is arranged at the 21 height position, and the upper washing nozzle 750b is arranged at the lower gas nozzle 75〇a 98458. doc -20- 200534925 above Z2 height position. Figure 5 is a perspective view of the guide block 7 4 3 of the washing section 74. The guide block 743 is a rod-shaped member having a substantially uniform cross section in the Y-axis direction. The thickness in the X-axis direction is equal to or larger than the width (X-axis width) of the nozzle 41a of the slit nozzle 41, and is less than the X-axis width of the support member 744. The guide block 743 is fixedly supported by the pair of support members 744 to support the γ-axis direction. The two end portions are secured with respect to the base 740 via the support member 744. That is, the lower side of the guide block 743 is separated from the base 740, and a space is formed between the base 74 and the guide block 743. The 'base' in the washing section 74 in this embodiment The relative position of the seat 740 and the guide block 743 is fixed. The upper surface of the guide block 743 is an approaching surface 743a close to the front end of the slit nozzle 41. The approaching surface 743a is bent downward at both ends toward the X-axis direction. In addition, the side of the guide block 743 facing the ejection portion 742 is a guide surface 743b substantially parallel to the YZ plane. The guide surface is flung away from the ejection portion 742, so there is a space between them. The (-Y side) support member 744 of the pair of support members 744 is provided with a suction port 720 and is connected to the suction mechanism 72 (FIG. 3) through the above-mentioned waste pipe. The suction port 720 passes through the support member 744. The hole is provided below the guide block 743 mounted on the support member 744. With this, if the suction mechanism 72 starts to attract, the space under the guide block 743 will be attracted. Furthermore, it can be configured as follows: A suction port 720 is provided in the support member 744 of the two, and the suction mechanism is carried out from the respective directions to perform suction. Returning to FIG. 3, the cleaning liquid supply mechanism 75 is a plastic bottle containing a cleaning liquid or a pump of 98458.doc -21 · 200534925 liquid. Pumps, etc. The cleaning liquid is supplied to the cleaning unit 74 through a supply pipe. The driving mechanism 76 is a mechanism that moves the cleaning unit 74 to the Y-axis direction. As the driving mechanism 76, a straight motor using a rotary motor and a round head bolt can be used. Fig. 6 is a diagram showing the state where the ejection portion 742 is moved together with the slit nozzle 41. In addition, the position of the slit nozzle 41 shown in Fig. 6 is hereinafter referred to as "cleaning position". The front end portion 742 of the slit nozzle 41 in the cleaning position moves back and forth in the Y-axis direction, so that the gas nozzle 710 and the cleaning nozzle 75 provided in the ejection portion 742 can scan the slit nozzle "front end portion" . Further, the 'driving mechanism 76 can perform not only the operation of scanning the slit nozzle 41 in the cleaning section 74, but also the operation of retracting the cleaning section 74 from below the slit nozzle 41. Therefore, when a person is inserted at the front end portion of the slit nozzle 41 into the standby box π described below, the cleaning portion 74 and the slit nozzle 41 can not interfere with each other. Returning to Fig. 2 ', the standby box 77 is a substantially box-shaped member having substantially the same size as the width of the slit nozzle 41 in the longitudinal direction. Anti-I insecticide liquid solvent in the standby box 77 0 standby each 7 7 in the knockout &, "... No formal coating treatment has been implemented for a long time, Si Bei J prepared with a slit pout 41 $, f & amp ...... 41 items near the mouth of the mouth. The mechanism is provided in such a way that the resist liquid does not mix with each other to produce dryness or deterioration. No. θ is provided on the standby box 77 to open a slit to the inside. Introduce. P is inserted and then lowered to #, square; in the standby mode, the self-washing position is moved down to a specific position in the Z-axis direction. J). The slit 啧 嘴 41 位 # is called the standby position and the end becomes Λ Of the white M Qixia T 'slit nozzle 41, ~ Feng Feng inserts it from the opening to the state inside the box 77 to be removed, and ... When the heart 4 standby position, the slit nozzle 41 is exposed before 98458.doc > 22 -200534925 In the solvent environment, the drying of the resist solution will be suppressed. Return to Z Figure 1. Inside the control unit 8 is provided with a calculation unit 80 that processes various data according to programs, and a memory unit 81 that stores programs or various data. In addition, the front panel has the necessary instructions for the input of the manipulator for the substrate processing device. The operation section 82 and the display section 83 for displaying various data. '' 4 The work section 8 is electrically connected to the mechanisms attached to the body 2 by the boundary lines not shown in FIG. 1. The control section 8 Control is based on the input signal from the operation unit 82, or signals from various sensors (not shown), such as: lifting movement of descent = hibiscus, movement movement of the moving mechanism 5, antiseptic supply, 4 structure The resist liquid supply operation of 6. In addition, the operations of the drive mechanism, the rotation mechanism, and the valves of the nozzle initialization mechanism 7 are controlled, and the supply flow of the gas supply mechanism 71 and the cleaning liquid supply mechanism is controlled. Furthermore, “specifically” are RAMs for reading data temporarily, read-only, and magnetic disk devices, which are equivalent to the memory section 8 or a storage medium such as a compact optical disk or a memory card, and the like. Read the second class, buttons and switches (including keyboard or slide ^ 4〇 ^ 4 J brother looking for a lot of work. P82. Or, it can also be a display panel such as the touch panel display and display panel 83 Those who do the same. The LCD or various lights are equivalent to the display unit U The above is the description of the substrate processing device σ in this embodiment. The function and configuration of 1 is followed by the nozzle cleaning mechanism 70. The cleaning slit sprays ^,, + + only when the end of the bucket 1 is operated. (Yuzu washing process) to explain. Figure 7 to ^ ^ ^ Figure of the situation in the washing area of Ding Yi Hegai. Furthermore, the narrow position of Figure 1 to 98 in Figure 7 to 9 is 98458.doc -23- 200534925 is a washing position. In FIGS. 7 to 9, the supporting member 744 is omitted, and the guide block 743 and the slit nozzle 41 are shown in cross section. First, the control unit 8 controls the drive mechanism 76 before the nozzle washing process, so that the washing unit 74 in the retracted state is moved to a position where the slit nozzle 41 is subjected to the washing process. In addition, the control unit 8 controls the elevating mechanisms 43, 44 and the moving mechanism 5 in parallel with this process, thereby moving the slit nozzle 41 to the cleaning position. Thereby, the slit nozzle 41 and the cleaning portion 74 have the arrangement relationship shown in Fig. 7. At this time, as shown in Fig. 7, the resist solution is adhered to the side surface of the front end portion of the slit nozzle 41 due to the repeated coating process. Further, in the substrate processing apparatus 1 in this embodiment, the distance (approach distance) between the lower end of the slit nozzle 41 and the approach surface 743a of the guide block 743 during the nozzle cleaning process is positioned to be about 1.5 mm, and positioned. The cleaning position of the slit nozzle 41 is, of course, not limited to this. The approach distance can also be set appropriately in advance according to the nature of the cleaning liquid used or the discharge flow rate. When the preparation for the nozzle cleaning process is completed by the movement operation so far, the valve is opened by the cleaning liquid supply mechanism 75 to start the supply of the cleaning liquid. As shown in FIG. 8, the cleaning nozzle 75 The cleaning liquid is sprayed from the side of the slit nozzle. The suction mechanism 72 starts suction from the suction port 720 in parallel with the operation of the cleaning nozzle 750 to spray the cleaning liquid. FIG. 10 is an enlarged view of the state shown in FIG. 8. As shown in FIG. 10, the cleaning liquid (cleaning liquid LQ) is sprayed from the lower cleaning nozzle 75a and the upper cleaning nozzle, and the cleaning liquid sprayed is called to impact the side surface of the front end of the slit nozzle 41. This cleaning slit nozzle 41. 98458.doc -24- 200534925 At this time, the anti-name agent liquid r adhering to the side surface of the front end of the slit nozzle 41 is dissolved by the cleaning liquid Lq sprayed from the lower cleaning nozzle 750a. It is expected that on the side of the front end of the slit nozzle 41, there will be a mixed liquid of the resist liquid r and the cleaning liquid LQ (a mixed liquid with a higher concentration of the resist liquid R). Because in the previous device, the cleaning nozzle The height position is arranged so that there is a step difference, so the mixed liquid will form Rl deposit of 23 shown in FIG.

However, the substrate processing apparatus in this embodiment includes an upper cleaning nozzle 750b in addition to the lower cleaning nozzle 750a. Therefore, as shown in FIG. 10, by using the upper cleaning nozzle 750b, the cleaning liquid can be supplied to a position higher than the supply position of the cleaning liquid LQ of the lower cleaning nozzle 750a. That is, the cleaning liquid supplied from the upper cleaning nozzle 75013 can supply the mixed liquid generated by supplying the cleaning liquid 1q from the lower cleaning nozzle 750a, and then rinse from the upper direction downward. Therefore, since the stripe-like attachment RL does not remain as in the previous device, and the cleaning effect in the nozzle cleaning process is improved, the state of the slit nozzle 41 can be restored well. The cleaning liquid sprayed from the cleaning nozzle 75 will flow down the side of the front end of the slit nozzle ^ and its part will be attached to the Z surface of the slit nozzle 41 = and 'attached to the slit nozzle 41T' The cleaning solution of ® is called to be guided along the approaching surface by contacting 4a. ^ The W3 on both sides can be used to wash the narrow surface by the flow. 4 Spear angle #mR "and quickly Remove the M surface that is dissolved by the cleaning solution: And: the green cleaning liquid LQ can be guided to the guide group ⑽ of the guide 4々 丨 L is downward 0, so 'the approach surface 743a becomes a curved surface curved downward and washed 98458.doc -25- 200534925 74 can quickly discharge the cleaning liquid LQ. Moreover, the guide block 743 has a guide surface 743b, and the cleaning liquid LQ attached to the slit nozzle 41 can be quickly discharged. The guide surface 743b is The cleaning liquid LQ supplied by the cleaning liquid supply mechanism is guided to the lower side. As described above, while the cleaning liquid Lq is sprayed from the cleaning nozzle 75 °, the suction mechanism 72 will suck the slit nozzle 41 below. As shown in Figure ι, the attraction of the attraction mechanism 72 is guided by the block% The method that does not directly act on the nozzle and the perimeter of the nozzle is blocked. That is, the cleaning liquid lq for cleaning will be formed from the opening above the space formed between the ejection portion 742 and the guide surface 743b (along the Y axis). The slit-shaped opening in the direction is attracted. The anti-money liquid R filled in the slit nozzle 41 is mainly sucked out by the force acting in the (-Z) direction. However, it is shown as a downward arrow in FIG. As shown, the attraction force of the right suction mechanism 72 acts on the position separated from the nozzle 41a, and the attraction force around the nozzle 41a will mainly act in the x-axis direction, and the attraction force acting in the direction (7) will weaken. In the cleaning section 74, the attraction force of the suction mechanism M acts on the position in the ⑺ direction: it is positioned by the position of the guide surface 743b of the guide block 743. Therefore, 'by adjusting the thickness of the guide block 743 in the axial direction, The attractive force in the (-Z) direction of the adjustable nozzle. '： In the cleaning section 74 in this embodiment, the guide block is determined in advance so that the periphery of the nozzle 4u becomes the stagnation point of the anti-money liquid R. The thickness of M3, thereby suppressing the outflow of anti-rhenium R. In addition, by the position of the attraction force being located below the side surface of the front end of the slit nozzle 41, it is possible to quickly suck the resist liquid attached to the side of the end surface and the cleaning liquid Lq to the bottom 98458.doc • 26 -200534925 Citation: non-extracting. Χ, the thickness of the azimuth direction of the guide block 743 is used to locate the interval between the spray 742 and the guide block 743, but the narrower the interval is, the suction bow will be. The weaker 'the attraction force acting on the slit nozzle 41 will be increased. As a result, the J-face will reduce the action on the nozzle due to the thickness of the guide block 743 in the nozzle cleaning mechanism 70 in this implementation. The attraction force of the suction mechanism 72 of the resist liquid r is included. Therefore, even if more cleaning fluids • LQ than the previous device are used, the suction force of the suction mechanism 72 can be increased to appropriately attract and discharge the used cleaning fluid. LQ. Therefore, the cleaning effect in the nozzle cleaning process can be improved. The scanning operation of the cleaning unit 74 is performed in parallel with the supply operation of the cleaning liquid LQ from the cleaning liquid supply mechanism and the suction operation by the suction mechanism 72. In other words, the drive mechanism% performs the following operation: the cleaning section M is moved back and forth along the γ = direction across the entire width of the slit nozzle 41, and thereby 'on the ¥ axis of the slit nozzle 41 In the entire width of the nozzle, the cleaning liquid LQ is discharged from the 750 nozzles of the cleaning nozzle to perform the nozzle cleaning process. In this way, by the scanning of the cleaning unit 74 by the driving mechanism 76, for example, it is necessary to arrange the cleaning nozzle 75 across the entire width of the slit nozzle 41, so that the size of the I unit can be reduced. In addition, the number of times the scanning operation is repeated is arbitrary, and an appropriate value is set in advance according to the number of times of the official coating process performed after the previous nozzle cleaning process is performed or the anti-liquid recording quality used. When the scanning operation is completed a specific number of times, the cleaning liquid supply mechanism 75 stops supplying the cleaning liquid LQ. As a result, the cleaning liquid 98458.doc -27 · 200534925 LQ which was sprayed through the cleaning nozzle 75 was stopped. Further, the gas supply mechanism body nozzle 710 ejects nitrogen gas. Furthermore, the scanning operation of the cleaning unit 74 by the self-aspirating nitrogen gas and the nitrogen gas is performed. In this way, the mechanism 76 is continued to drive the gas from the gas nozzle 710, and the cleaning portion 74 is sprayed with nitrogen at the end along the γ-axis side = 1, and the clean and dry adheres to the discharge portion. ? As shown by ^ in the facing surface of 42, the body nozzle 710 which is higher than all the cleaning nozzles 75 () is provided. The nitrogen gas is supplied to the main body, so that the gas nozzle 710 is effective. Areas with alpha lotion LQ. In addition, the scanning operation with # 熘 cleaning liquid LQ can also be set in advance; t value. Hibiscus 76Γ: The person "the end of the drawing operation, the control unit 8 stops the scanning operation of the washing unit 74 by stopping the moving mechanism 76, and stops the mechanism 71 for the recognition service. The scanning operation for stopping the ejection of nitrogen from the gas and nitrogen to dry the slit nozzle 41 is completed. Σ, the above-mentioned operation 'the nozzle cleaning process of the substrate processing apparatus i in this embodiment is completed. After the nozzle cleaning process is completed, a preliminary coating process is performed in the preparation: k cloth stack structure 73, and the slit nozzle 4] is adjusted to form a formal coating process after the state is bad. The operation is not limited to this. If it takes a long time until the main coating process is performed, the slit nozzle 41 can be moved to the standby position to prevent the resist liquid R of the slit nozzle M from drying. That is, by The driving mechanism 76 retracts the cleaning section from below the slit nozzle 41, and further lowers the slit nozzle 4 from the cleaning position, so that the front end portion thereof is exposed to the solvent environment in the standby box 77. 98458.doc- 28- 200534925 With the above method, as shown in Figure 7 As shown in the figure, the substrate processing device in the present embodiment is M-u. If it is delivered, the guide block 743 has a thickness of Λ white or more than the I of the nozzle 41 of the slit nozzle 41, and is arranged at Around the nozzle 41a of the slit nozzle 41, and the suction port 72 of the suction mechanism 72 is sucked from below the guide block 3, and the area around the nozzle 41a of the slit nozzle 41 becomes roughly the etchant liquid R The attraction force of the suction mechanism M is adjusted by the stagnation point, whereby the cleaning liquid and pollutants can be quickly discharged by suction and discharge, and the resist liquid r in the slit nozzle 41 can be suppressed from being sucked out from the nozzle 41a. The block 743 has a guide surface 74 that guides the cleaning liquid LQ supplied by the cleaning liquid supply mechanism to the lower side, thereby allowing the used cleaning liquid LQ to be quickly discharged. The partition 74 of the supply position of the cleaning liquid LQ of the supply mechanism 75 changes the cleaning position according to the situation, so that, for example, even if the range of the resist liquid R is different, it can be flexibly coped with. 1 七七 、、、 '° position adjustment by The partition P having a specific thickness 74 1 can be realized only by this, which can be easily realized without requiring a complicated mechanism. Further, it can be provided with a driving mechanism that moves the cleaning portion 74 privately along the length direction of the slit nozzle 41 76, so that the entire device can be miniaturized. In addition, the gas supply device 71 for supplying I gas to the front end of the slit nozzle 41 and the supply mechanism 71 are provided, and the supply position of the nitrogen gas from the gas supply mechanism 71 is set to The supply level of the cleaning liquid LQ from the cleaning liquid supply mechanism 75: above, so as to promote the drying of the cleaning liquid. In addition, the supply level of the cleaning liquid LQ from the cleaning nozzle 7 soup above is 98458.doc -29- 200534925 is arranged so that the height direction of the supply position of the cleaning liquid LQ from the lower cleaning nozzle 750a is different from each other, thereby preventing the stripe-like attachment RL (Fig. 23) from remaining on the front end of the slit nozzle 41 Department side. Therefore, the washing effect can be improved.

Furthermore, the substrate processing apparatus 1 in this embodiment is configured such that the lower cleaning nozzle 750a and the upper cleaning nozzle 750b can simultaneously eject the cleaning liquid 1q. However, for example, the lower cleaning nozzle 75〇a and the upper cleaning nozzle 75Ob are connected to the cleaning liquid supply mechanism 75 through the piping of another system, and it can also be controlled as follows: Scanning on the way (by ejection In the scanning of the slit nozzle 41 of the portion 742), only the discharge of the lower cleaning nozzle 750a is performed, and in the scan of the return path, only the discharge of the upper cleaning nozzle 750b is performed. When the cleaning liquid LQ is ejected from the self-cleaning nozzle 750 and a scanning operation is performed, a nitrogen gas may be ejected in parallel. In this case, since a so-called nitrogen gas curtain is formed above the cleaning nozzle 750, it is possible to prevent mist or the like of the cleaning liquid LQ from being scattered above the slit nozzle 41. < 2 · Second Embodiment > Dibei configured the suction system 720 as the suction port 720 of the suction mechanism 72 below the spout ... Therefore, the cleaning liquid lq is suctioned from below the guide block 743, but the suction mechanism 72 The suction position (the position where the suction port is provided) is not only / 11, which means that in the second embodiment constructed based on such a principle: Ming washing: mechanism 7. Made up of figures. Fig. 2 is a front view of the facing surface of the discharge portion in the second embodiment. The nozzle cleaning mechanism 7q in this embodiment has a wound cleaning section% instead of 98458.doc -30 ^ 200534925 The cleaning section 74 in the first embodiment is in this respect similar to the nozzle cleaning in the first embodiment. The net institution 70 is different. It should be noted that the same components as those of the substrate processing apparatus in the first embodiment are denoted by the same reference numerals, and descriptions thereof are appropriately omitted.

The ejection portion 745 has a facing surface 745a and a pair of facing surfaces 74 as a surface facing the side surface of the front end portion of the slit nozzle 41 located at the cleaning position. The opposing surface 745a is a surface corresponding to the opposing surface 742a of the ejection portion 742 in the first embodiment. As shown in FIG. 12, it is substantially the same as the first embodiment, and is provided with a gas nozzle 71o and a cleaning nozzle 75. 〇. The pair of facing surfaces 745b are substantially parallel to the facing surface 745a, and are provided on both sides in the y-axis direction of the facing surface 744. Each of the facing surfaces 74 is formed so as to be closer to the side surface of the front end of the slit nozzle 41 in the cleaning position and closer to the facing surface 745a, and is provided with suction ports 721, respectively. The suction port 721 is connected to the suction mechanism μ via a suction pipe. Fig. 13 is a view showing a state when the cleaning liquid LQ is discharged from the cleaning nozzle 750 in the nozzle cleaning process in the second embodiment. In addition, each part of the figure is shown as a cross section of the plane parallel to the XZ plane, which intersects the opposite plane 7 and ^. In the figure Π, although the illustration is omitted, in the base 740 of the real betrothal complaint, it is located below the guide block 743 and the yam / night discharge port 740a is arranged along the Y-axis direction Since it is slot-shaped, the cleaning liquid lq which can be guided to the lower side by the guide block 743 is discharged from the discharge port 740a. In this way, the suction and discharge of the suction mechanism 72 can be supplemented. 98458.doc -31-200534925 Furthermore, each part in FIG. 14 is shown as a cross section of a surface parallel to the χζ plane and intersecting with the suction inlet 721. As shown in FIG. 14, in the substrate processing apparatus of this embodiment, the suction port 721 is located on the side of the front end of the slit nozzle 41 in the cleaning position, so it is implemented from the side of the front end of the slit nozzle 41. Attraction of the attraction mechanism 72. Therefore, the attraction force of the suction mechanism 72 of the resist liquid R filled in the slit nozzle 41 will be weaker than when suction is performed from below the front end of the slit nozzle 41. As described above, in the substrate processing apparatus of this embodiment, the suction port 6 is placed on the opposite surface 745b of the ejection portion 745, and the cleaning liquid LQ is suctioned from the side of the front end of the slit nozzle 41, and The manner in which the periphery of the nozzles ... approximately becomes the stagnation point of the resist liquid R is adjusted. Therefore, even if the attraction force of the suction mechanism 72 is increased, the phenomenon that the anti-buttoning agent liquid r is sucked out of the slit nozzle 41 can be suppressed, so that the cleaning effect of the nozzle cleaning process can be improved. Further, the facing surface 745b is closer to the side surface of the slit nozzle-shaped tip portion than the facing surface ⑽. Therefore, when comparing Fig. 13 and Fig. 14, it is clear that the 'suction port 721 is arranged closer to the side surface of the front end of the nozzle 41 than the cleaning nozzle 75o. In this way, by connecting the suction port 721 to the side surface of the front end of the slit nozzle 41, the cleaning liquid LQ adhering to the side surface of the front end portion can be effectively sucked and discharged. In addition, FIG. 14 is a diagram for convenience, showing whether there is a cleaning liquid LQ 'around the guide block 743, but a part of the cleaning liquid LQ that is actually cleaned in the cleaning section 7 is guided by ... rain ... It is guided downward by the guide block 743, and is discharged from the discharge port 740a at 98458.doc -32- 200534925. As described above, even in the substrate processing apparatus 1 in the second embodiment, the suction port 72 1 is provided on the side of the front end of the slit nozzle 41, and suction by the suction mechanism 72 is performed from this position. This is the same as the substrate processing apparatus 1 in the first embodiment, and can be adjusted in such a manner that the periphery of the nozzle 41a becomes a stagnation point of the resist liquid R. Therefore, the same effect can be obtained. The discharge port 740a under the front end of the nozzle 41 discharges the cleaning liquid LQ without relying on the suction mechanism. Therefore, a small-capacity mechanism can be used as the suction mechanism 72. Or, because the cleaning liquid Lq can be quickly discharged, The cleaning effect of the nozzle cleaning process can be improved. Furthermore, by having a guide block 743 arranged below the front end of the slit nozzle 41, the cleaning liquid LQ is guided downward, and has the approach surface 74 and the guide surface, The cleaning liquid lq can be more effectively discharged from the discharge port 740a.

Moreover, as shown in FIG. U, the substrate processing apparatus u in this embodiment does not use the spacer 741. That is, the partition 741 is not necessarily a component which can be removed by cleaning the desired height position of the nozzle 75, and can be removed. In the cleaning section% in this embodiment, the height of the ejection section 72 is adjusted by the partition 741, so that the distance between the suction port 721 and the side surface of the front end of the slit nozzle ^ can also be adjusted. In this case, it is better to adjust the distance to about (M to 5 mm.) In the substrate processing apparatus ^ in this embodiment, a virtual substrate is used—the substrate processing unit for each successive step ... the same guide block ..., However ,: 98458.doc -33- 200534925 In the embodiment, since suction discharge is not performed from the discharge port 740a, the cleaning liquid acetylene is mainly discharged from the discharge port 740a by gravity. This acts on the nozzle 41a ( The force in the -Z) direction (the force that causes the resist solution R to be sucked out) is mainly gravity. Therefore, even if the guide block 743 is a plate-shaped member having a thin thickness in the x-axis direction, it can also eject the nozzle 4] a The surroundings are adjusted so as to become the stagnation point of the resist liquid R. < 3. Third Embodiment > From the description, it can be seen that the nozzle cleaning mechanism 70 of the above embodiment ejects the cleaning liquid and scans the slits. The mechanism of the nozzle 41 (the cleaning unit 74 and the driving mechanism%) performs the nozzle cleaning process. However, if the mechanism that performs the nozzle cleaning process can uniformly clean the periphery of the nozzle 41a of the slit nozzle 41 in the direction of the y-axis, then 15 is a diagram showing the arrangement relationship between the ejection portion 746 and the slit nozzle 4 in the cleaning position in the third embodiment constructed based on such a principle. As can be understood from FIG. 15, this In the embodiment, the size of the γ-axis direction φ of the discharge portion 746 is approximately equal to the width of the Y-axis direction of the nozzle 41a of the slit nozzle 41. In addition, although not shown in detail, the base 74 and the partition are the same. The size of the Y-axis direction of the physical tool and the guide block 743 is also determined by the width of the nozzle 41 & Y-axis direction. That is, the substrate processing apparatus in the third embodiment! The cleaning section? 4b has a slit nozzle. The width of the nozzle 41a in the γ-axis direction is approximately equal to the size, which is different from the cleaning section M $ of the substrate processing apparatus i in the first embodiment. Furthermore, regarding the structure other than the cleaning section 74b, It is almost the same as the substrate processing apparatus in the first embodiment, so 98458.doc • 34- 200534925 is omitted as appropriate. Fig. 对 The opposite view of the ejection part w in the third embodiment. A gas nozzle is purchased on the opposite side. 71〇: Positive, In the gas nozzle facing surface 746a, 'across the γ axis 2 = part width, it is arranged above the rabbit, soil one, + king, and 75% of the cleaning nozzle. Also, in the cleaning nozzle 750, The upper washing nozzle No. 2: 7463 is arranged at a height position above the lower washing nozzle 750a so as to span the entire width in the γ-axis direction. This embodiment has the structure described above. The nozzle cleaning process will be described in a short time. First, the cleaning liquid supply mechanism 75 starts to supply the cleaning liquid LQ, and the two cleaning nozzles 75 spray the cleaning liquid LQ before the slit nozzles ^ located at the cleaning position. In parallel with this action, the suction machine = 72 starts to attract. Thereby, the front end part of the slit nozzle 41 is cleaned. Since the cleaning nozzle 750 of the first embodiment is provided so as to extend across the entire width of the slit nozzle 4 in the y-axis direction, the entire area of the front end portion is cleaned at the same time. X, as described in the above embodiment, it is not necessary to perform the operation (scanning operation) of moving the cleaning portion 74b along the nozzle 41a by the driving mechanism 76. This is the same in the treatment (described later) of the nitrogen gas. That is, when the slit nozzle 41 is moved from the cleaning position to the standby position, the driving mechanism 76 in the third embodiment has only a function of retreating the cleaning portion 74b. Also, similar to the first embodiment, the cleaning liquid B (5 series for nozzle cleaning treatment) is guided downward by the approach surface 743 & and the guide surface 74313 of the guide block 743, and the suction mechanism 72 The attraction force can be quickly sucked and discharged by 98458.doc -35- 200534925. Even in the substrate processing apparatus 1 in this embodiment, the nozzle 41 a is covered by the guide block 743 and is set as a suction mechanism. The gravitational force of 72 and the gravity does not directly act on the nozzle 41 a. That is, the nozzle & 1 a may also be adjusted in such a manner that the stagnation point of the resist liquid R becomes approximately. The cleaning nozzle 750 starts to eject and elapses a specific time. After that, the supply of the cleaning liquid Lq by the cleaning liquid t and the π branch structure 75 is stopped, and therefore, the discharge of the cleaning liquid LQ from the cleaning nozzle will also be stopped. The gas supply mechanism 71 starts supplying nitrogen gas toward the slit nozzle. At the end of 41, all the gas nozzles 71 will emit the atmosphere gas. This promotes the drying of the cleaning liquid LQ attached to the front end of the slit nozzle 41. Furthermore, the nitrogen gas is supplied from the gas supply mechanism 71. period, The suction from the suction mechanism = will also continue 'so that, for example, it contains% of the cleaning liquid component' or the mist of the cleaning liquid lq blown off by nitrogen gas will be quickly sucked and discharged. 71G of the orifice nozzle starts to spray and After a certain period of time, the gas supply mechanism will stop supplying nitrogen gas, so the process of ejecting the nitrogen gas from the gas nozzle 71 will also stop. As a result, the nozzle cleaning process in this embodiment will end. Therefore, in the substrate processing apparatus of this embodiment, the steps of the nozzle cleaning process are performed simultaneously on the γ-axis direction of the slit nozzle 41. Therefore, it is possible to increase the ¥ axis early force in the nozzle cleaning process. Uniformity, so that the state of the slit nozzle 41 after the flattening is uniformized in the Y-axis direction. As described above, even in the third embodiment, the substrate processing apparatus [98458.doc -36- 200534925] is also implemented with 罘- The morphology phase @ can adjust the attractive force of the suction mechanism U in such a manner that the nozzle 41a of the slit nozzle 41 becomes approximately the stagnation point of the etchant liquid R, so that the same effect as the above embodiment can be obtained. The clean section 74b (ejection section 746) has approximately the same size as the width in the γ-axis direction of the nozzle 4U of the slit nozzle ", and the gas section 71 and the cleaning are arranged in the ejection section 746 so as to span the entire width of the nozzle 41a. The nozzle 750 can simultaneously spray the cleaning liquid LQ across the entire width of the slit nozzle 41. Therefore, the time required for the nozzle cleaning process can be shortened. ≪ 4. Modifications > The embodiment is described, but the present invention is not limited to the above-mentioned embodiment, and various modifications can be made. For example, like the substrate processing apparatus in the second embodiment, the suction from the side of the nozzle 41a of the slit nozzle 41 can be adopted The structure of the cleaning liquid [(^) and the substrate processing apparatus as in the third embodiment! In general, a structure in which substantially the entire width in the Y-axis direction of the nozzle 41a is simultaneously cleaned may be employed. In this case φ, a suction port connected to the suction mechanism 72 may be provided on the facing surface 746a of the discharge portion 746, and further below the cleaning nozzle 750a. In this case, it is preferable that the suction port has a slit shape extending in the Y-axis direction. Further, in the ejection portion 742 in the first embodiment, it is on the facing surface M. The lower cleaning nozzle 75〇a is provided on both sides in the Y-axis direction, and the upper cleaning nozzle 7⑽ is disposed on the central portion in the Y-axis direction of the facing surface 7 4 2a. It is not limited to such a configuration. Fig. 17 is a front view of the facing surface 742 & of the ejection portion 742 in the modified example. In this way, '98458.doc -37- 200534925 can also be provided with the upper cleaning nozzle 75 on both sides in the Y-axis direction of the opposing surface 742a, and the lower cleaning nozzle 75 can be provided in the central portion in the Y-axis direction of the opposing surface 742a. 〇a. In addition, the position of the lower washing nozzle 75 (^ in the y-axis direction and the position of the upper washing nozzle in the y-axis direction can be made the same. That is, it can be washed in the ejection sections 742, 745, and 746. The upper nozzle 750b is disposed directly above the nozzle. The shape of the openings of the gas nozzle 710 and the cleaning nozzle 75 is not limited to a circle, and may have a slit-like shape extending in the γ-axis direction. [Figure Brief description of the formula] Fig. 1 is a perspective view showing a substrate processing apparatus of the present invention. Fig. 2 is a side view showing a main configuration related to coating processing in the substrate processing apparatus. Fig. 3 is a view showing nozzle cleaning in the first embodiment. A diagram of the structure of the mechanism. Fig. 4 is a front view of the facing surface of the ejection section in the first embodiment. Fig. 5 is a perspective view of the guide block. Fig. 6 is a view illustrating the movement of the slit nozzle and the ejection section. A diagram of the situation. Fig. 7 is a diagram showing the configuration and configuration of each nozzle when the nozzle cleaning process is started. Fig. 8 is a diagram showing a state in which the cleaning liquid is discharged during the cleaning process. Months ~ Fig. 9 is a diagram showing nitrogen during the nozzle cleaning process. Gas is ejected FIG. 10 is an enlarged view showing the state of FIG. 8. FIG. 11 is a 98458.doc -38-200534925 showing the configuration of the nozzle cleaning mechanism in the second embodiment. FIG. 12 is a view of the second embodiment. A front view of the opposite side of the ejection portion. Fig. 13 is a view showing a state in which the cleaning liquid is ejected in the second embodiment. T Fig. 14 is a view explaining the function of the suction mechanism in the second embodiment. Fig. 15 The figure shows the positional relationship between the ejection part in the second embodiment and the slit nozzle located at the cleaning position. Φ Figure M is a front view of the opposite surface of the ejection part in the third embodiment. Fig. 17 is a deformation A front view of the facing surface of the ejection portion in the example. Fig. 18 is a diagram showing an initial state of the front end of the slit nozzle. Fig. 19 is a diagram showing a state in which a coating process is performed on a substrate having a thickness of several dozens. 2 0 is a view showing a state where a coating treatment is performed on a substrate of several hundreds of thicknesses. FIG. 2 1 shows a spray nozzle of a conventional substrate processing apparatus, and a part in which an anti-etching solution is sucked is mixed. Figure 22 shows the state of air. FIG. 2 is a view showing a state in which a cleaning solution (a cleaning solution) is mixed in a portion of the ejection nozzle of the substrate processing apparatus. Picture of the stripe-like attachments observed afterwards. [Description of main component symbols] 1 Substrate processing device 2 Main body 98458.doc 39- 200534925

3 Platform 5 Moving mechanism 6 Resist supply mechanism 7 Nozzle initialization mechanism 8 Control unit 30 Holding surface 41 Slot nozzle 41a Nozzle 435 44 Lifting mechanism 70 Nozzle cleaning mechanism 71 Gas supply mechanism 72 Suction mechanism 74, 74a, 74b Cleaning Section 75 Washing liquid supply mechanism 76 Drive mechanism (scanning mechanism) 77 Standby box 90 Substrate 710 Gas nozzle 710a Bottom gas nozzle 710b Top gas nozzle 720? 721 Suction port 740a Discharge port 741 Separator 742, 745, 746 Ejection section 98458. doc -40- 200534925 742a, 745a, 745b, 746a facing surface 743 guide block (blocking member, guide member) 743a approach surface 743b guide surface

750 750a 750b LQ R

Washing nozzle Bottom washing nozzle Bottom washing nozzle Washing liquid Anti-residue liquid

98458.doc • 41-

Claims (1)

200534925 10. Scope of patent application: 1. A nozzle cleaning device 'characterized in that: it cleans the spray nozzle that emits a specific treatment liquid from a nozzle provided at the front end m = to: the front end of the spray nozzle Near the department, a cleaning liquid supply mechanism that supplies a specific cleaning liquid from the spray port; and a soil: a suction mechanism that attracts the above-mentioned special cleaning liquid supplied by the above-mentioned cleaning liquid supply mechanism; The attraction of the mechanism 'makes the vicinity of the above-mentioned nozzle become a stagnation point of the upper 4 special treatment liquid. 2. The nozzle cleaning device according to claim 1, further comprising: a nozzle having a width in the short side direction of the nozzle of the above-mentioned ejection nozzle; and ^, and arranged below the nozzle of the above-mentioned ejection nozzle with a two-suction 51 mechanism The suction port sucks and sucks from below the above-mentioned blocking member, and adjusts the nozzle setting of the above-mentioned suction mechanism 3.2 near the nozzle of the discharge nozzle. The above-mentioned shielding member has a guide feature and a guide surface. The special cleaning liquid supplied by the cleaning liquid supply mechanism is guided to the lower one. 4. The spray nozzle, apricots, and accommodating evils according to claim 1 ^ spray spray nozzle, wash washing device, wherein the suction mechanism sucks from the side of the mouth end of the mouth, thereby adjusting the spray nozzle ^ Pay close attention to the attraction of the above-mentioned attraction agencies. Mouth | ;: two nozzle cleaning device, in which the suction of the suction mechanism of the e-liquid supply mechanism is closer to the nozzle of the above-mentioned discharge 98458.doc 200534925. 6. · As described in claim 4, before spraying, spraying, spraying, etc. before the mouth ... "The above-mentioned specific cleaning liquid supplied from the discharge port provided below the spray spraying section in the washing device 1. Overwash Follow-up mechanism 7. If the nozzle cleaning device of claim 6, the spraying 啧 喈 夕 Α 山 八 1 胥 is arranged on the above guide surface and is a guide member with a guide surface below the guide part. The above-mentioned specificity supplied by the clean liquid supply mechanism 8. If the nozzle cleaning device of the request is made, in which the clean liquid supply mechanism °° the above-mentioned washing ... requirement term s ": = washing :: position adjustment mechanism. Partitions of a specific thickness. Said adjustment mechanism has 1. · If the nozzle cleaning device is requested, it is a slit that extends in a specific direction; the nozzle is provided with a scanning mechanism for moving the cleaning liquid supply machine. TThe special direction 11 on the above. The item 啧 y ^ 冼 of item 1 is a clean clothes set, in which the 上述 σ of the above-mentioned ejection nozzle is a slit extending in a specific direction; and the supply mechanism on the convection mouth is provided at the same time as the full width of the front end of the above-mentioned ejection nozzle at about 12 '. Specific cleaning solution. 12 ·: = Nozzle cleaning device, further comprising a gas supply mechanism that supplies the front end of the nozzle to the nozzle; and the position where the gas supply mechanism supplies the specific gas is higher than that provided by the clean liquid supply mechanism. The position of the cleaning solution is higher. 9845S.doc 200534925 The Hewei Suning clothes set is characterized by ... the end of the nozzle is sprayed with the surname a Shifanxuan and sighed on the moon 丨 J The person who sprays out the special treatment liquid spray nozzle, and has : Towards the above-mentioned spraying ha 乂 乂 ... near the end of the bird, supply specific cleaning liquid> Yin liquid supply mechanism; and, and the suction mechanism that misleads the liquid supplied by the above cleaning liquid supply mechanism; Yi Fu, Wu Ping, the above-mentioned cleaning liquid supply mechanism is provided with: a plurality of cleaning nozzles spraying the b liquid toward the above; "congratulations on the position of the above-mentioned specific cleaning to the above-mentioned plurality of cleaning liquid b / specific cleaning liquid ^ The position where the washing liquid is supplied by the washing nozzle, and d is arranged in a way that the other washing nozzles supply the specific washing in the same direction with different directions. 1 4 · A substrate processing device, which is used to determine the processing liquid, and is provided with: The substrate is held on the substrate by a holding mechanism for holding the substrate; from the nozzle provided at the front end, the special treatment liquid is ejected to the ejection nozzle on the surface of the substrate held by the Shangchengbaoxing mechanism; Spray nozzle A nozzle cleaning device; the nozzle cleaning device is provided with a cleaning liquid supply mechanism for supplying a specific cleaning liquid toward the vicinity of the crotch toward the ejection nozzle 喈 ϋ / ν, and an r-shaped and drained straw is washed by the above The suction mechanism for the liquid supply; the above-mentioned special cleaning means adjusts the W force of the suction mechanism, so that the vicinity of the mouth is the approximate stagnation point of the specific processing liquid described in 98458.doc 200534925. 15 A substrate The processing device is characterized by: · It is a person who applies a processing solution on the substrate and has a holding mechanism for holding the substrate · The specific processing solution is discharged from the nozzle of the & A nozzle cleaning device for cleaning the substrate surface held by the protection mechanism; and, a nozzle cleaning device for washing / injecting the nozzle; the nozzle cleaning device includes: supplying a specific cleaning cleaning solution toward a vicinity of an end portion before the nozzle; Supply mechanism; suction mechanism that sucks the specific liquid supplied by the cleaning liquid supply mechanism; / 'the cleaning liquid supply mechanism includes: The cleaning nozzle of the upper heart liquid before spraying the nozzle; / ^ top: the position where at least one of the plurality of cleaning nozzles supplies the above-mentioned special cleaning liquid to supply the above-mentioned specific cleaning with other cleaning nozzles / The position of the night is configured in a way that the direction of the degree is different. 9S45S.doc