TWI273702B - Capacitor structure and fabrication method therefor in a dual damascene process - Google Patents

Capacitor structure and fabrication method therefor in a dual damascene process Download PDF

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Publication number
TWI273702B
TWI273702B TW092125649A TW92125649A TWI273702B TW I273702 B TWI273702 B TW I273702B TW 092125649 A TW092125649 A TW 092125649A TW 92125649 A TW92125649 A TW 92125649A TW I273702 B TWI273702 B TW I273702B
Authority
TW
Taiwan
Prior art keywords
conductive
capacitor
plate
layer
forming
Prior art date
Application number
TW092125649A
Other languages
English (en)
Chinese (zh)
Other versions
TW200405566A (en
Inventor
Sailesh Mansinh Merchant
Yifeng Winston Yan
Original Assignee
Agere Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agere Systems Inc filed Critical Agere Systems Inc
Publication of TW200405566A publication Critical patent/TW200405566A/zh
Application granted granted Critical
Publication of TWI273702B publication Critical patent/TWI273702B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76805—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics the opening being a via or contact hole penetrating the underlying conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW092125649A 2002-09-30 2003-09-17 Capacitor structure and fabrication method therefor in a dual damascene process TWI273702B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/260,693 US6784478B2 (en) 2002-09-30 2002-09-30 Junction capacitor structure and fabrication method therefor in a dual damascene process

Publications (2)

Publication Number Publication Date
TW200405566A TW200405566A (en) 2004-04-01
TWI273702B true TWI273702B (en) 2007-02-11

Family

ID=28454428

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092125649A TWI273702B (en) 2002-09-30 2003-09-17 Capacitor structure and fabrication method therefor in a dual damascene process

Country Status (5)

Country Link
US (1) US6784478B2 (enExample)
JP (1) JP5039267B2 (enExample)
KR (1) KR100988446B1 (enExample)
GB (1) GB2394358B (enExample)
TW (1) TWI273702B (enExample)

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US7229875B2 (en) * 2002-10-17 2007-06-12 Samsung Electronics Co., Ltd. Integrated circuit capacitor structure
US7153776B2 (en) * 2002-11-27 2006-12-26 International Business Machines Corporation Method for reducing amine based contaminants
US7374993B2 (en) * 2003-10-27 2008-05-20 Micron Technology, Inc. Methods of forming capacitors
US7223684B2 (en) * 2004-07-14 2007-05-29 International Business Machines Corporation Dual damascene wiring and method
JP2006108490A (ja) * 2004-10-07 2006-04-20 Sony Corp Ｍｉｍ型キャパシタを有する半導体デバイスおよびその製造方法
US7645675B2 (en) * 2006-01-13 2010-01-12 International Business Machines Corporation Integrated parallel plate capacitors
US20070259519A1 (en) * 2006-05-02 2007-11-08 International Business Machines Corporation Interconnect metallization process with 100% or greater step coverage
WO2008010028A1 (en) * 2006-06-15 2008-01-24 Freescale Semiconductor, Inc. Mim capacitor integration
US7511939B2 (en) * 2006-08-24 2009-03-31 Analog Devices, Inc. Layered capacitor architecture and fabrication method
JP2008085175A (ja) * 2006-09-28 2008-04-10 Tokyo Electron Ltd 半導体装置の製造方法、半導体装置、基板処理システム、プログラム及び記憶媒体。
US7608538B2 (en) 2007-01-05 2009-10-27 International Business Machines Corporation Formation of vertical devices by electroplating
JP2009049078A (ja) * 2007-08-15 2009-03-05 Elpida Memory Inc 半導体装置の製造方法
JP2010118427A (ja) 2008-11-12 2010-05-27 Nec Electronics Corp 半導体装置および半導体装置の製造方法
US20100224960A1 (en) * 2009-03-04 2010-09-09 Kevin John Fischer Embedded capacitor device and methods of fabrication
US9331137B1 (en) * 2012-03-27 2016-05-03 Altera Corporation Metal-insulator-metal capacitors between metal interconnect layers
KR101934426B1 (ko) * 2012-11-26 2019-01-03 삼성전자 주식회사 반도체 장치 및 그 제조 방법
CN104103495A (zh) * 2013-04-02 2014-10-15 中芯国际集成电路制造(上海)有限公司 具有mim电容的半导体器件及其形成方法
US9368392B2 (en) 2014-04-10 2016-06-14 Taiwan Semiconductor Manufacturing Co., Ltd. MIM capacitor structure
US9219110B2 (en) 2014-04-10 2015-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. MIM capacitor structure
US9391016B2 (en) * 2014-04-10 2016-07-12 Taiwan Semiconductor Manufacturing Co., Ltd. MIM capacitor structure
US9425061B2 (en) 2014-05-29 2016-08-23 Taiwan Semiconductor Manufacturing Co., Ltd. Buffer cap layer to improve MIM structure performance
US9831238B2 (en) * 2014-05-30 2017-11-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including insulating film having opening portion and conductive film in the opening portion
US9478602B2 (en) * 2014-10-07 2016-10-25 Globalfoundries Inc. Method of forming an embedded metal-insulator-metal (MIM) capacitor
US20170047276A1 (en) * 2015-08-13 2017-02-16 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
US11121073B2 (en) 2018-04-02 2021-09-14 Intel Corporation Through plate interconnect for a vertical MIM capacitor
TW202236396A (zh) * 2021-02-16 2022-09-16 美商高效電源轉換公司 閘極金屬層-絕緣體層-場板金屬層積體電路電容器及其形成方法
US11901283B2 (en) * 2021-03-18 2024-02-13 Taiwan Semiconductor Manufacturing Company, Ltd. Capacitor and method for forming the same
CN115483197B (zh) * 2021-05-31 2025-12-05 联华电子股份有限公司 电容器结构以及其制作方法
CN119153431A (zh) * 2023-06-14 2024-12-17 中芯国际集成电路制造(上海)有限公司 电容器件及其形成方法

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Also Published As

Publication number Publication date
GB2394358B (en) 2006-07-19
JP2004128498A (ja) 2004-04-22
GB0319129D0 (en) 2003-09-17
TW200405566A (en) 2004-04-01
KR100988446B1 (ko) 2010-10-18
KR20040029269A (ko) 2004-04-06
JP5039267B2 (ja) 2012-10-03
US6784478B2 (en) 2004-08-31
US20040061177A1 (en) 2004-04-01
GB2394358A (en) 2004-04-21

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