TWI272665B - Universal modular wafer transport system - Google Patents

Universal modular wafer transport system Download PDF

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Publication number
TWI272665B
TWI272665B TW091119950A TW91119950A TWI272665B TW I272665 B TWI272665 B TW I272665B TW 091119950 A TW091119950 A TW 091119950A TW 91119950 A TW91119950 A TW 91119950A TW I272665 B TWI272665 B TW I272665B
Authority
TW
Taiwan
Prior art keywords
wafer
wafer transfer
shuttle
magnet
transfer
Prior art date
Application number
TW091119950A
Other languages
English (en)
Chinese (zh)
Inventor
Anthony C Bonora
Richard H Gould
Roger G Hine
Michael Krolak
Jerry A Speasl
Original Assignee
Asyst Technologies
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of TWI272665B publication Critical patent/TWI272665B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3204—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Non-Mechanical Conveyors (AREA)
TW091119950A 2001-08-31 2002-09-02 Universal modular wafer transport system TWI272665B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31672201P 2001-08-31 2001-08-31

Publications (1)

Publication Number Publication Date
TWI272665B true TWI272665B (en) 2007-02-01

Family

ID=23230354

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091119950A TWI272665B (en) 2001-08-31 2002-09-02 Universal modular wafer transport system

Country Status (6)

Country Link
US (3) US7293950B2 (enExample)
JP (1) JP2005508085A (enExample)
KR (1) KR20050026371A (enExample)
CN (3) CN1996553A (enExample)
TW (1) TWI272665B (enExample)
WO (1) WO2003038869A2 (enExample)

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TWI412484B (zh) * 2008-07-23 2013-10-21 大福股份有限公司 物品搬運設備之學習裝置及學習方法
TWI453854B (zh) * 2009-05-28 2014-09-21 薩米列弗有限公司 基板無粒子處理裝置
TWI509722B (zh) * 2012-09-27 2015-11-21 台灣積體電路製造股份有限公司 處理半導體晶圓的裝置及方法
US9257317B2 (en) 2013-10-15 2016-02-09 Inotera Memories, Inc. Overhead hoist transport system
TWI732285B (zh) * 2015-01-23 2021-07-01 美商應用材料股份有限公司 半導體處理設備

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US20030129045A1 (en) 2003-07-10
CN1561535A (zh) 2005-01-05
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CN1996552B (zh) 2012-09-05
KR20050026371A (ko) 2005-03-15
US7293950B2 (en) 2007-11-13
JP2005508085A (ja) 2005-03-24
US20120213614A1 (en) 2012-08-23
US20080101892A1 (en) 2008-05-01
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CN1288714C (zh) 2006-12-06
CN1996553A (zh) 2007-07-11

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