JP5419384B2 - 真空処理装置 - Google Patents
真空処理装置 Download PDFInfo
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- JP5419384B2 JP5419384B2 JP2008131866A JP2008131866A JP5419384B2 JP 5419384 B2 JP5419384 B2 JP 5419384B2 JP 2008131866 A JP2008131866 A JP 2008131866A JP 2008131866 A JP2008131866 A JP 2008131866A JP 5419384 B2 JP5419384 B2 JP 5419384B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G54/00—Non-mechanical conveyors not otherwise provided for
- B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/02—Controlled or contamination-free environments or clean space conditions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Electromagnetism (AREA)
- Linear Motors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
また更に、前記真空部の外部の領域は大気領域となっており、該大気領域と前記載置部の内部とを連通する連通部を備え、載置部の内部に設けられているコイルから発生する熱を、連通部を通じて真空部の外部の大気領域へ放出したり、或いは、当該コイルを外部から冷却したりすることができるので、載置部の内部やコイルの温度上昇を効果的に抑制することができる。尚、例えば、コイルに前記ワニスやモールド等が設けられている場合には、当該ワニスやモールド等から発生するガスを、連通部を通じて真空部の外部の大気領域へ放出することができる。
また、例えばリニアモータに要する配線等を、載置部の内部から連通部を通して真空部の外部の大気領域へと配設することができる。
更に、前記連通部は、前記載置部の移動経路に対して、左右いずれか一方又は両方に設けられており、真空部の載置部移動方向の長さ全域に亘って、載置部を移動させることが可能となるため、真空部をコンパクト化することができるという利点がある。
また、連通部が前記移動経路の左右両方に設けられている場合には、例えば左側の連通部から載置部を通して右側の連通部へ大気を流すことができるので、載置部の内部で発生する熱やガスなどを効率良く処理することができる。
また、永久磁石によってリニアモータに作用する吸引力の重力の方向の成分が小さくなるため、レール部にかかる荷重を軽減することができ、耐久性を増大させることができる。また、パーティクルの発生を抑えることもできる。尚、載置部に作用する重力の方向とは、鉛直下方向である。
また、前記カバー体は、非磁性体であることが好ましい。
図1に、本実施形態における真空処理装置1が示されている。該真空処理装置1は、内部が真空である真空部2と、該真空部2の内部に設けられ被処理体(図示しない)を載置することができる載置部3と、前記載置部3を前記真空部2の内部で移動させるための後述するリニアモータ4の第1コア41とを備える。この真空処理装置1は、例えばウェハやガラス基板などの被処理体を真空中で移動させながら、該被処理体に対して所定の処理を施すことができるものである。尚、所定の処理とは、搬送処理や成膜処理などの各種の処理が含まれる。
412a…磁極の先端面、413…保持部、414…永久磁石、415…コイル、421…突部、511a…載置面、523…レール係合部、527…ベローズ、611…凹部、5121…貫通孔、5131…第2連通孔、5221…取付孔、5222…流路、W1…左右のレール部の離間距離、W2…幅広部の左右幅、W3…幅狭部の左右幅
Claims (6)
- 内部が真空である真空部と、該真空部の内部に設けられ被処理体を載置することができる載置部と、コイルを具備し前記載置部を前記真空部の内部で移動させるためのリニアモータと、前記載置部を支え、当該載置部をその移動経路に沿って案内するためのレール部とを備え、
前記載置部は、その内部に前記真空部と断絶した状態で大気が収容されており、前記リニアモータのコイルは、前記載置部の内部に収容された大気中に配置され、
前記真空部の外部の領域は大気領域となっており、該大気領域と前記載置部の内部とを連通し、前記載置部の移動経路に対して、左右いずれか一方又は両方に設けられた連通部を備え、
前記連通部は、前記載置部の移動方向に伸縮する多関節式の伸縮アームダクトであり、前記載置部の移動に連動して関節が伸縮することより、前記移動方向に伸縮するように構成されており、
前記リニアモータは永久磁石を備えており、該永久磁石による吸引力が前記載置部に作用する重力の方向とは交差する方向に作用するように配置されていることを特徴とする真空処理装置。 - 前記載置部は、前記被処理体を載置する載置面を備える載置本体と、該載置本体から外方へ突出するように当該載置本体に取り付けられるカバー体とを備え、前記コイルは、カバー体の内部に収容されていることを特徴とする請求項1に記載の真空処理装置。
- 前記カバー体は、非磁性体であることを特徴とする請求項2に記載の真空処理装置。
- 前記載置部は、前記被処理体を載置する載置面を備える載置本体を備えてなり、該載置本体は、上面が前記載置面となる幅広部と、該幅広部の下面から下方へ突設され、前記幅広部の左右幅よりも狭い左右幅を有する幅狭部とを備えてなり、前記リニアモータは、前記幅狭部の左右側面に対応して一対設けられており、該一対のリニアモータは共に、前記幅広部の左右幅の範囲内に収まっていることを特徴とする請求項1乃至3の何れかに記載の真空処理装置。
- 前記リニアモータは、複数備えられており、それぞれのリニアモータは、永久磁石を備えており、しかも、各永久磁石による吸引力が相殺されて打ち消されるように配置されていることを特徴とする請求項1乃至4の何れかに記載の真空処理装置。
- 前記リニアモータは、前記コイルを有する第1コアと、前記載置部の移動経路に沿って設けられる第2コアとを備えてなり、第1コア又は第2コアの何れか一方には、永久磁石が備えられており、前記リニアモータは、前記第1コアと前記第2コアとが左右に対向するように配置され、しかも、前記移動方向に対して左右に対向して一対設けられていることを特徴とする請求項5に記載の真空処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008131866A JP5419384B2 (ja) | 2008-05-20 | 2008-05-20 | 真空処理装置 |
KR1020107023981A KR20110010702A (ko) | 2008-05-20 | 2009-05-19 | 진공 처리 장치 |
PCT/JP2009/059178 WO2009142197A1 (ja) | 2008-05-20 | 2009-05-19 | 真空処理装置 |
US12/993,914 US8522958B2 (en) | 2008-05-20 | 2009-05-19 | Vacuum processing apparatus |
TW098116738A TW201029905A (en) | 2008-05-20 | 2009-05-20 | Vacuum processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008131866A JP5419384B2 (ja) | 2008-05-20 | 2008-05-20 | 真空処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009283548A JP2009283548A (ja) | 2009-12-03 |
JP5419384B2 true JP5419384B2 (ja) | 2014-02-19 |
Family
ID=41340130
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008131866A Expired - Fee Related JP5419384B2 (ja) | 2008-05-20 | 2008-05-20 | 真空処理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8522958B2 (ja) |
JP (1) | JP5419384B2 (ja) |
KR (1) | KR20110010702A (ja) |
TW (1) | TW201029905A (ja) |
WO (1) | WO2009142197A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101829397B1 (ko) | 2011-09-16 | 2018-02-19 | 퍼시몬 테크놀로지스 코포레이션 | 낮은 가변성을 가진 로봇 |
JP2014038990A (ja) * | 2012-08-20 | 2014-02-27 | Tokyo Electron Ltd | 基板搬送装置および基板処理システム |
JP6156716B2 (ja) * | 2012-08-21 | 2017-07-05 | シンフォニアテクノロジー株式会社 | 搬送装置 |
JP6098923B2 (ja) * | 2012-12-27 | 2017-03-22 | シンフォニアテクノロジー株式会社 | 搬送装置 |
KR101645197B1 (ko) * | 2014-10-08 | 2016-08-03 | (주)에이티엘 | 밀폐형 리니어 모터 스테이지 장치 |
KR101892129B1 (ko) * | 2018-05-25 | 2018-10-04 | 주식회사 디엠티 | 진공 챔버 이송 장치 |
JP2022520635A (ja) | 2019-02-14 | 2022-03-31 | パーシモン テクノロジーズ コーポレイション | 磁気によりガイドされた材料取扱いロボット |
JP7236981B2 (ja) * | 2019-10-28 | 2023-03-10 | 株式会社日立ハイテク | 被搬送体、容器キャリア及び搬送装置 |
KR20230004836A (ko) * | 2020-05-04 | 2023-01-06 | 어플라이드 머티어리얼스, 인코포레이티드 | 진공 프로세싱 시스템에서 디바이스를 이송하기 위한 장치들 및 방법들 |
Family Cites Families (15)
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JPH0793809B2 (ja) * | 1987-08-21 | 1995-10-09 | 松下電工株式会社 | リニアステツプモ−タ |
JPH02198920A (ja) | 1989-01-28 | 1990-08-07 | Sukegawa Electric Co Ltd | 磁気浮上形真空内搬送装置 |
JPH0428622A (ja) * | 1990-05-24 | 1992-01-31 | Fujitsu Ltd | 半導体搬送装置 |
JPH06179524A (ja) | 1992-07-18 | 1994-06-28 | Ebara Corp | 磁気浮上真空搬送装置 |
JPH0779507A (ja) | 1993-07-13 | 1995-03-20 | Seiko Seiki Co Ltd | 搬送装置 |
JP4526136B2 (ja) | 1998-06-08 | 2010-08-18 | 株式会社日立国際電気 | 被処理物搬送装置、半導体製造装置及び被処理物の処理方法 |
JP4445075B2 (ja) | 1999-10-06 | 2010-04-07 | 東京エレクトロン株式会社 | 真空モータ及び搬送装置 |
JP4227298B2 (ja) * | 1999-12-02 | 2009-02-18 | ローツェ株式会社 | 搬送用ロボット |
CN101179079B (zh) * | 2000-08-14 | 2010-11-03 | 矩阵半导体公司 | 密集阵列和电荷存储器件及其制造方法 |
CN1996552B (zh) * | 2001-08-31 | 2012-09-05 | 克罗辛自动化公司 | 晶片机 |
US6935828B2 (en) * | 2002-07-17 | 2005-08-30 | Transfer Engineering And Manufacturing, Inc. | Wafer load lock and magnetically coupled linear delivery system |
US7988398B2 (en) * | 2002-07-22 | 2011-08-02 | Brooks Automation, Inc. | Linear substrate transport apparatus |
JP2005317656A (ja) | 2004-04-27 | 2005-11-10 | Tokyo Electron Ltd | 真空処理装置 |
KR101316768B1 (ko) * | 2006-11-29 | 2013-10-10 | 도쿄엘렉트론가부시키가이샤 | 기판의 처리 장치 |
JP5470770B2 (ja) * | 2008-08-07 | 2014-04-16 | シンフォニアテクノロジー株式会社 | 真空処理装置 |
-
2008
- 2008-05-20 JP JP2008131866A patent/JP5419384B2/ja not_active Expired - Fee Related
-
2009
- 2009-05-19 KR KR1020107023981A patent/KR20110010702A/ko active Search and Examination
- 2009-05-19 US US12/993,914 patent/US8522958B2/en not_active Expired - Fee Related
- 2009-05-19 WO PCT/JP2009/059178 patent/WO2009142197A1/ja active Application Filing
- 2009-05-20 TW TW098116738A patent/TW201029905A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20110076119A1 (en) | 2011-03-31 |
JP2009283548A (ja) | 2009-12-03 |
TW201029905A (en) | 2010-08-16 |
KR20110010702A (ko) | 2011-02-07 |
WO2009142197A1 (ja) | 2009-11-26 |
US8522958B2 (en) | 2013-09-03 |
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