TWI263273B - Protective tape applying method and apparatus, and protective tape separating method - Google Patents
Protective tape applying method and apparatus, and protective tape separating methodInfo
- Publication number
- TWI263273B TWI263273B TW091137095A TW91137095A TWI263273B TW I263273 B TWI263273 B TW I263273B TW 091137095 A TW091137095 A TW 091137095A TW 91137095 A TW91137095 A TW 91137095A TW I263273 B TWI263273 B TW I263273B
- Authority
- TW
- Taiwan
- Prior art keywords
- protective tape
- wafer
- separating
- chuck table
- protective
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 title abstract 7
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/68395—Separation by peeling using peeling wheel
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002006013A JP2003209082A (ja) | 2002-01-15 | 2002-01-15 | 保護テープの貼付方法およびその装置並びに保護テープの剥離方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200302520A TW200302520A (en) | 2003-08-01 |
TWI263273B true TWI263273B (en) | 2006-10-01 |
Family
ID=19191174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091137095A TWI263273B (en) | 2002-01-15 | 2002-12-24 | Protective tape applying method and apparatus, and protective tape separating method |
Country Status (6)
Country | Link |
---|---|
US (1) | US6919284B2 (zh) |
EP (1) | EP1328011A2 (zh) |
JP (1) | JP2003209082A (zh) |
KR (1) | KR100868142B1 (zh) |
CN (1) | CN1287428C (zh) |
TW (1) | TWI263273B (zh) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002367931A (ja) * | 2001-06-07 | 2002-12-20 | Lintec Corp | ダイボンディングシート貼着装置およびダイボンディングシートの貼着方法 |
US20040214432A1 (en) * | 2003-04-24 | 2004-10-28 | Mutsumi Masumoto | Thinning of semiconductor wafers |
JP2005086074A (ja) * | 2003-09-10 | 2005-03-31 | Disco Abrasive Syst Ltd | 半導体ウェーハの移し替え方法 |
JP4090416B2 (ja) | 2003-09-30 | 2008-05-28 | 日東電工株式会社 | 粘着テープ付ワークの離脱方法及び離脱装置 |
JP4530638B2 (ja) | 2003-10-07 | 2010-08-25 | 日東電工株式会社 | 半導体ウエハへの保護テープ貼付方法及び貼付装置 |
JP4136890B2 (ja) | 2003-10-17 | 2008-08-20 | 日東電工株式会社 | 保護テープの切断方法及び切断装置 |
JP2005150177A (ja) * | 2003-11-12 | 2005-06-09 | Nitto Denko Corp | 半導体ウエハ裏面への粘着テープ貼付方法及び粘着テープ貼付装置 |
JP4416108B2 (ja) * | 2003-11-17 | 2010-02-17 | 株式会社ディスコ | 半導体ウェーハの製造方法 |
JP4472316B2 (ja) * | 2003-11-28 | 2010-06-02 | 日東電工株式会社 | 粘着テープ切断方法及び粘着テープ切断装置 |
JP4297829B2 (ja) * | 2004-04-23 | 2009-07-15 | リンテック株式会社 | 吸着装置 |
TW200539357A (en) * | 2004-04-28 | 2005-12-01 | Lintec Corp | Adhering apparatus and adhering method |
JP4540403B2 (ja) | 2004-06-16 | 2010-09-08 | 株式会社東京精密 | テープ貼付方法およびテープ貼付装置 |
JP2006272505A (ja) * | 2005-03-29 | 2006-10-12 | Nitto Denko Corp | 保護テープ切断方法およびこれを用いた装置 |
JP4285455B2 (ja) * | 2005-07-11 | 2009-06-24 | パナソニック株式会社 | 半導体チップの製造方法 |
JP4836557B2 (ja) | 2005-11-25 | 2011-12-14 | 株式会社東京精密 | ダイシングテープ貼付装置およびダイシングテープ貼付方法 |
JP4953764B2 (ja) | 2005-11-29 | 2012-06-13 | 株式会社東京精密 | 剥離テープ貼付方法および剥離テープ貼付装置 |
JP2007214357A (ja) * | 2006-02-09 | 2007-08-23 | Nitto Denko Corp | ワーク貼付け支持方法およびこれを用いたワーク貼付け支持装置 |
US20070204520A1 (en) * | 2006-03-01 | 2007-09-06 | Calleja Michael J | Self-elevating staging with rack-and-pinion posts |
JP4953738B2 (ja) * | 2006-09-07 | 2012-06-13 | 日東電工株式会社 | 粘着テープ切断方法およびこれを用いた粘着テープ貼付け装置 |
US7614848B2 (en) | 2006-10-10 | 2009-11-10 | United Technologies Corporation | Fan exit guide vane repair method and apparatus |
KR100775933B1 (ko) * | 2006-12-14 | 2007-11-13 | 우리마이크론(주) | 확산판 보호테이프 자동 부착장치 |
US7659140B2 (en) * | 2007-03-30 | 2010-02-09 | Stats Chippac Ltd. | Integrated circuit system with a debris trapping system |
US20090264053A1 (en) * | 2008-04-21 | 2009-10-22 | Applied Materials, Inc. | Apparatus and methods for using a polishing tape cassette |
JP5160297B2 (ja) * | 2008-05-02 | 2013-03-13 | 日東電工株式会社 | カッタ刃の清掃方法およびカッタ刃の清掃装置、並びに、これを備えた粘着テープ貼付け装置 |
TWI410329B (zh) * | 2009-03-09 | 2013-10-01 | Ind Tech Res Inst | 可撓式裝置的取下設備及其取下方法 |
US8069893B2 (en) * | 2010-02-03 | 2011-12-06 | Lai Chin-Sen | Cutting mechanism for dry film laminator |
JP5381821B2 (ja) | 2010-03-10 | 2014-01-08 | 三菱電機株式会社 | 保護テープ剥離方法および保護テープ剥離装置 |
JP5607965B2 (ja) * | 2010-03-23 | 2014-10-15 | 日東電工株式会社 | 半導体ウエハマウント方法および半導体ウエハマウント装置 |
US8574398B2 (en) | 2010-05-27 | 2013-11-05 | Suss Microtec Lithography, Gmbh | Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers |
JP6054622B2 (ja) * | 2012-04-05 | 2016-12-27 | 信越ポリマー株式会社 | 半導体ウェーハ用保護テープ及びその貼り付け方法 |
JP6388331B2 (ja) * | 2014-07-14 | 2018-09-12 | Necプラットフォームズ株式会社 | テープ貼付装置及びテープ貼付治具 |
JP6510393B2 (ja) * | 2015-12-15 | 2019-05-08 | 三菱電機株式会社 | 半導体装置の製造方法 |
JP6879840B2 (ja) * | 2017-06-28 | 2021-06-02 | 株式会社ディスコ | テープ貼り機及びテープ外し方法 |
JP7022560B2 (ja) * | 2017-10-18 | 2022-02-18 | リンテック株式会社 | 接着シート処理方法および接着シート処理装置 |
JP2020178103A (ja) * | 2019-04-22 | 2020-10-29 | リンテック株式会社 | シート支持装置およびシート支持方法 |
JP7441734B2 (ja) | 2020-06-05 | 2024-03-01 | リンテック株式会社 | 転写装置および転写方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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US5476566A (en) * | 1992-09-02 | 1995-12-19 | Motorola, Inc. | Method for thinning a semiconductor wafer |
US5480842A (en) * | 1994-04-11 | 1996-01-02 | At&T Corp. | Method for fabricating thin, strong, and flexible die for smart cards |
KR970030225A (ko) * | 1995-11-08 | 1997-06-26 | 김광호 | 자외선 테이프를 사용하여 웨이퍼의 후면을 연마하는 반도체 소장 제조방법 |
US6770805B2 (en) * | 2001-01-08 | 2004-08-03 | Randall L. May | Carrier assembly for percussion instruments |
JPH1140520A (ja) * | 1997-07-23 | 1999-02-12 | Toshiba Corp | ウェーハの分割方法及び半導体装置の製造方法 |
JP3171148B2 (ja) * | 1997-09-01 | 2001-05-28 | 日本電気株式会社 | ウエハ−マウント装置 |
KR20000029054A (ko) * | 1998-10-15 | 2000-05-25 | 이데이 노부유끼 | 반도체 장치 및 그 제조 방법 |
JP3560888B2 (ja) * | 1999-02-09 | 2004-09-02 | シャープ株式会社 | 半導体装置の製造方法 |
JP2000331968A (ja) * | 1999-05-21 | 2000-11-30 | Tokyo Seimitsu Co Ltd | ウェーハ保護テープ |
KR100467009B1 (ko) * | 2000-08-04 | 2005-01-24 | 샤프 가부시키가이샤 | 반도체 웨이퍼 표면의 오염을 방지할 수 있는 반도체웨이퍼의 박층화 방법 및 반도체 웨이퍼의 이면 연삭장치 |
JP2002075937A (ja) * | 2000-08-30 | 2002-03-15 | Nitto Denko Corp | 半導体ウエハの加工方法 |
WO2002026441A1 (en) * | 2000-09-27 | 2002-04-04 | Strasbaugh, Inc. | Tool for applying resilient tape to chuck used for grinding or polishing wafers |
US6506681B2 (en) * | 2000-12-06 | 2003-01-14 | Micron Technology, Inc. | Thin flip—chip method |
JP2003051473A (ja) * | 2001-08-03 | 2003-02-21 | Disco Abrasive Syst Ltd | 半導体ウェーハの裏面研削方法 |
JP3770820B2 (ja) * | 2001-10-03 | 2006-04-26 | 日東電工株式会社 | 保護テープの貼付け方法 |
JP2003124147A (ja) * | 2001-10-15 | 2003-04-25 | Fujitsu Ltd | 半導体装置の製造方法 |
JP3761444B2 (ja) * | 2001-10-23 | 2006-03-29 | 富士通株式会社 | 半導体装置の製造方法 |
JP3880397B2 (ja) * | 2001-12-27 | 2007-02-14 | 日東電工株式会社 | 保護テープの貼付・剥離方法 |
-
2002
- 2002-01-15 JP JP2002006013A patent/JP2003209082A/ja active Pending
- 2002-12-24 TW TW091137095A patent/TWI263273B/zh not_active IP Right Cessation
- 2002-12-26 US US10/327,880 patent/US6919284B2/en not_active Expired - Fee Related
- 2002-12-30 KR KR1020020086741A patent/KR100868142B1/ko not_active IP Right Cessation
-
2003
- 2003-01-14 EP EP03000800A patent/EP1328011A2/en not_active Withdrawn
- 2003-01-15 CN CNB031027393A patent/CN1287428C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100868142B1 (ko) | 2008-11-10 |
CN1287428C (zh) | 2006-11-29 |
EP1328011A2 (en) | 2003-07-16 |
CN1433055A (zh) | 2003-07-30 |
JP2003209082A (ja) | 2003-07-25 |
KR20030062224A (ko) | 2003-07-23 |
TW200302520A (en) | 2003-08-01 |
US20030131929A1 (en) | 2003-07-17 |
US6919284B2 (en) | 2005-07-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |