TW200802675A - Sheet cutting device and cutting method - Google Patents

Sheet cutting device and cutting method

Info

Publication number
TW200802675A
TW200802675A TW96107880A TW96107880A TW200802675A TW 200802675 A TW200802675 A TW 200802675A TW 96107880 A TW96107880 A TW 96107880A TW 96107880 A TW96107880 A TW 96107880A TW 200802675 A TW200802675 A TW 200802675A
Authority
TW
Taiwan
Prior art keywords
sheet
semiconductor wafer
cutting
outer circumference
blade
Prior art date
Application number
TW96107880A
Other languages
Chinese (zh)
Inventor
Hideaki Nonaka
Kan Nakada
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200802675A publication Critical patent/TW200802675A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/3806—Cutting-out; Stamping-out wherein relative movements of tool head and work during cutting have a component tangential to the work surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/3846—Cutting-out; Stamping-out cutting out discs or the like

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

A sheet cutting apparatus (10) is provided for cutting a sheet (S), which has a size covering over the outer circumference of a semiconductor wafer (W), along the outer circumference of the semiconductor wafer. The apparatus is provided with a robot (12) for holding a cutter blade (13) at an insertion depth so that the blade is brought into contact with the upper plane of the semiconductor wafer (W). The blade edge of the cutter blade (13) is inserted into the sheet (S) at an inner position very close to the outer circumference of the semiconductor wafer (W), and by rotating the cutter blade (13) within a flat plane in such state, the sheet is cut smaller than the size of the semiconductor wafer (W).
TW96107880A 2006-03-09 2007-03-07 Sheet cutting device and cutting method TW200802675A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006064303A JP2007242948A (en) 2006-03-09 2006-03-09 Sheet cutting device and cutting method

Publications (1)

Publication Number Publication Date
TW200802675A true TW200802675A (en) 2008-01-01

Family

ID=38474746

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96107880A TW200802675A (en) 2006-03-09 2007-03-07 Sheet cutting device and cutting method

Country Status (3)

Country Link
JP (1) JP2007242948A (en)
TW (1) TW200802675A (en)
WO (1) WO2007102304A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102211245A (en) * 2010-04-05 2011-10-12 发那科株式会社 Spot welding system and dressing determination method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011110681A (en) * 2009-11-30 2011-06-09 Lintec Corp Sheet cutting device and cutting method
CN109524332B (en) * 2018-12-26 2020-10-20 江苏纳沛斯半导体有限公司 Accurate cutting device of semiconductor wafer
KR102682977B1 (en) * 2022-06-24 2024-07-08 윈텍주식회사 Chip-on-film bad chip cutting removal apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03297136A (en) * 1990-04-16 1991-12-27 Nitto Denko Corp Pasting and clipping apparatus of protective tape for semiconductor wafer
JPH1055987A (en) * 1996-08-07 1998-02-24 Seiko Seiki Co Ltd Dicing device
JP3303294B2 (en) * 1999-06-11 2002-07-15 株式会社東京精密 Cutting method of semiconductor protective tape
JP4475772B2 (en) * 2000-08-08 2010-06-09 日東電工株式会社 Protective tape application method and protective tape application device
JP4337637B2 (en) * 2004-06-04 2009-09-30 富士電機デバイステクノロジー株式会社 Manufacturing method of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102211245A (en) * 2010-04-05 2011-10-12 发那科株式会社 Spot welding system and dressing determination method
US8901449B2 (en) 2010-04-05 2014-12-02 Fanuc Corporation Spot welding system and dressing determination method

Also Published As

Publication number Publication date
WO2007102304A1 (en) 2007-09-13
JP2007242948A (en) 2007-09-20

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