TWI256076B - Control of thermal donor formation in high resistivity CZ silicon - Google Patents

Control of thermal donor formation in high resistivity CZ silicon

Info

Publication number
TWI256076B
TWI256076B TW091107312A TW91107312A TWI256076B TW I256076 B TWI256076 B TW I256076B TW 091107312 A TW091107312 A TW 091107312A TW 91107312 A TW91107312 A TW 91107312A TW I256076 B TWI256076 B TW I256076B
Authority
TW
Taiwan
Prior art keywords
silicon
high resistivity
control
thermal donor
donor formation
Prior art date
Application number
TW091107312A
Other languages
English (en)
Inventor
Martin J Binns
Robert J Falster
Jeffrey L Libbert
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Application granted granted Critical
Publication of TWI256076B publication Critical patent/TWI256076B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
    • H01L21/3226—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering of silicon on insulator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
    • H01L21/3225—Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
TW091107312A 2001-04-11 2002-04-11 Control of thermal donor formation in high resistivity CZ silicon TWI256076B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US28310301P 2001-04-11 2001-04-11
US30036401P 2001-06-22 2001-06-22
US37132402P 2002-04-10 2002-04-10

Publications (1)

Publication Number Publication Date
TWI256076B true TWI256076B (en) 2006-06-01

Family

ID=27403360

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091107312A TWI256076B (en) 2001-04-11 2002-04-11 Control of thermal donor formation in high resistivity CZ silicon

Country Status (4)

Country Link
US (2) US6897084B2 (zh)
JP (1) JP2004537161A (zh)
TW (1) TWI256076B (zh)
WO (1) WO2002084728A1 (zh)

Cited By (1)

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TWI629725B (zh) * 2016-05-25 2018-07-11 索泰克公司 用於製作高電阻率半導體底材之方法

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TWI629725B (zh) * 2016-05-25 2018-07-11 索泰克公司 用於製作高電阻率半導體底材之方法
US10163682B2 (en) 2016-05-25 2018-12-25 Soitec Methods of forming semiconductor structures

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US7135351B2 (en) 2006-11-14
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US20030054641A1 (en) 2003-03-20

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