TWI256059B - Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof - Google Patents

Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof

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Publication number
TWI256059B
TWI256059B TW091101393A TW91101393A TWI256059B TW I256059 B TWI256059 B TW I256059B TW 091101393 A TW091101393 A TW 091101393A TW 91101393 A TW91101393 A TW 91101393A TW I256059 B TWI256059 B TW I256059B
Authority
TW
Taiwan
Prior art keywords
inorganic
composite
dielectrics
electroconductive
particles
Prior art date
Application number
TW091101393A
Other languages
English (en)
Inventor
Nobuyuki Itou
Hideaki Masuko
Nakaatsu Yoshimura
Satomi Hasegawa
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001020290A external-priority patent/JP2002231052A/ja
Priority claimed from JP2001214473A external-priority patent/JP5250923B2/ja
Application filed by Jsr Corp filed Critical Jsr Corp
Application granted granted Critical
Publication of TWI256059B publication Critical patent/TWI256059B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/10—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances metallic oxides
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    • H01L23/145—Organic substrates, e.g. plastic
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    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
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    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
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    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
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TW091101393A 2001-01-29 2002-01-28 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof TWI256059B (en)

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JP2001214473A JP5250923B2 (ja) 2001-07-13 2001-07-13 超微粒子複合樹脂粒子、誘電体形成用組成物および電子部品

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KR100528950B1 (ko) 2005-11-16
DE60217477D1 (de) 2007-02-22
IL151941A0 (en) 2003-04-10
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CN1226752C (zh) 2005-11-09
CN1455933A (zh) 2003-11-12

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