TW559965B - Method of forming a bond pad and structure thereof - Google Patents

Method of forming a bond pad and structure thereof Download PDF

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Publication number
TW559965B
TW559965B TW091120027A TW91120027A TW559965B TW 559965 B TW559965 B TW 559965B TW 091120027 A TW091120027 A TW 091120027A TW 91120027 A TW91120027 A TW 91120027A TW 559965 B TW559965 B TW 559965B
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TW
Taiwan
Prior art keywords
copper
layer
features
dielectric layer
height
Prior art date
Application number
TW091120027A
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English (en)
Chinese (zh)
Inventor
Thomas S Kobayashi
Scott K Pozder
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Motorola Inc
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Publication of TW559965B publication Critical patent/TW559965B/zh

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TW091120027A 2001-09-14 2002-09-03 Method of forming a bond pad and structure thereof TW559965B (en)

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US8138079B2 (en) 1998-12-21 2012-03-20 Megica Corporation Method of wire bonding over active area of a semiconductor circuit
US8021976B2 (en) 2002-10-15 2011-09-20 Megica Corporation Method of wire bonding over active area of a semiconductor circuit
US8026588B2 (en) 2002-10-15 2011-09-27 Megica Corporation Method of wire bonding over active area of a semiconductor circuit
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WO2003025998A2 (en) 2003-03-27
CN1554116A (zh) 2004-12-08
KR20040035779A (ko) 2004-04-29
CN1296980C (zh) 2007-01-24
JP4451134B2 (ja) 2010-04-14
EP1430523A2 (en) 2004-06-23
US6531384B1 (en) 2003-03-11
KR100896141B1 (ko) 2009-05-12
US20030054626A1 (en) 2003-03-20
AU2002323303A1 (en) 2003-04-01
JP2005522019A (ja) 2005-07-21
WO2003025998A3 (en) 2003-06-12

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