CN1296980C - 形成具有凹槽的焊盘的方法 - Google Patents

形成具有凹槽的焊盘的方法 Download PDF

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Publication number
CN1296980C
CN1296980C CNB028178254A CN02817825A CN1296980C CN 1296980 C CN1296980 C CN 1296980C CN B028178254 A CNB028178254 A CN B028178254A CN 02817825 A CN02817825 A CN 02817825A CN 1296980 C CN1296980 C CN 1296980C
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China
Prior art keywords
copper
layer
top surface
dielectric layer
pad
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CNB028178254A
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Chinese (zh)
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CN1554116A (zh
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托马斯·S·小林
斯科特·K·波兹德
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Nxp American Corp
Vlsi Technology Co ltd
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Freescale Semiconductor Inc
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
CNB028178254A 2001-09-14 2002-08-20 形成具有凹槽的焊盘的方法 Expired - Lifetime CN1296980C (zh)

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US09/952,527 US6531384B1 (en) 2001-09-14 2001-09-14 Method of forming a bond pad and structure thereof
US09/952,527 2001-09-14

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CN1296980C true CN1296980C (zh) 2007-01-24

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EP1430523A2 (en) 2004-06-23
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CN1554116A (zh) 2004-12-08
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