TW479374B - Optical semiconductor-device with multiple-quantum-pot structure - Google Patents

Optical semiconductor-device with multiple-quantum-pot structure Download PDF

Info

Publication number
TW479374B
TW479374B TW089123809A TW89123809A TW479374B TW 479374 B TW479374 B TW 479374B TW 089123809 A TW089123809 A TW 089123809A TW 89123809 A TW89123809 A TW 89123809A TW 479374 B TW479374 B TW 479374B
Authority
TW
Taiwan
Prior art keywords
layer
layers
gallium
nitride
indium
Prior art date
Application number
TW089123809A
Other languages
English (en)
Inventor
Volker Haerle
Berthold Hahn
Hans-Juergen Lugauer
Helmut Bolay
Stefan Bader
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7929653&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW479374(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Application granted granted Critical
Publication of TW479374B publication Critical patent/TW479374B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/34Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/343Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/34333Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/34Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/3407Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers characterised by special barrier layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/34Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/3408Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers characterised by specially shaped wells, e.g. triangular

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Biophysics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)

Description

479374 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(1 ) 本發明涉及一種具有多重-量子井結構之光學半導體 元件,其中各井層及截止層由不同形成之半導體層交替 地塗佈著。 此種元件例如由EP 0 666 624 B1或Journal of •Crystal Growth 1 89 / 1 90 ( 1 998 )page 786- 789 中已爲人 所知。 以銦-鎵-氮化物(Gal nN-)爲主之LEDs或雷射二極體之 高量子效率是由活性量子井中富含銦之各之自我組構式 之生長所造成。已注入之電荷載體在空間上局部化於這 些島中且由晶格缺陷中之非輻射之重組區 (recombination)所擋住。 這些量子點之核作用(nuc 1 ea t i on )須藉由適當之緩衝 層來導入。特別是含有銦之結構適合在特定之活性.區之 前作爲緩衝層。含銦之氮化物半導體(GaxAlyIni.(x + y) N-半導體(易於分解且形成含銦之相(phase)。這樣會在 生長表面上造成可改變之應力場,於是在活性量子井中 可促進含銦之各島之形成。大約lOOnm厚之Gal nN層可沈 積在活性區之前以便改良Ga I UN量子點之核作用。 目前已可以4重-量子井結構來達成一種最佳化之效率 。如實驗中所示,所發出之光子只在二個最上方(即, P-側之下一個)量子井中產生。適當地選取各生長參數 時可使此種發射現象只在最上方之量子井中發生。下方 之各量子井用來改良最上方之GalnN-島之核作用。若省 略最上方之量子井,則光學輸出功率下降値超過50%。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 479374 A7 B7 五、發明説明( 這些量子井當然會使前向電壓大大地升高。此種前向電 壓可藉由井數目之減少(量子效率亦降低)而改進。壓電 場(其使所觀測到之前向電壓增大)可藉由量子井之區域 中較大之摻雜度而被抑制。當然此活性層之晶體品質會 因此而受到干擾,使內部之量子效率降低。 本發明之目的是改良本文開頭所述形式之光學半導體 元件。 此目的以申請專利範圍第1項之特徵來達成。本發明 之一些形式描述在申請專利範圍各附屬項中。 本發明以下將依據實施例藉助於圖式來詳述。 圖式簡單說明: 第la,b圖本發明之元件之層構造之圖解。 第2圖是第1圖之元件之量子井結構之圖解。 第3圖一般形式之量子井結構之圖解。 經濟部智慧財產局員工消費合作社印製 依據第la圖,在由碳化矽(S:C)所構成之基板1(其上 連接一個電極2)上首先形成一種由鋁-鎵-氮化物 (AlGaN)所形成之緩衝層3。其上又形成另一由鋁-鎵-氮 化物所構成之層4。層4上方配置另一由矽所摻雜之氮化 鎵所構成之緩衝層5,層5上方配置一種仍將詳述之量子 井結構6 a,b,其上是一種特定之活性層6 c。活性層6 c 上方是另一由鋁-鎵-氮化物所構成之層7,其用作電極 位·障。此層7較佳是以鎂來摻雜。在層6和7之間配置另 鎵層8上 一未顯示之GaN層。在層7上方配置一種鎵層 設置此元件之另一電極9。 -4- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 479374 A7 B7 五、發明説明( 經濟部智慧財產局員工消費合作社印製 此種層結構之右側顯示價帶和導電帶之間各層之能帶 間隙。 緩衝層3之功能是用作生長層,這是需要的,以便可在 碳化矽-基板1上生長LED-結構。此層3和5之間之鋁-鎵-氮化物層4具有一種在氮化鎵層5之方向中改變之鋁含量 。氮化鎵層5最好以矽來摻雜且用來生長一些缺陷。在活 性層6上方所配置之由鎂摻雜之鋁-鎵-氮化物所構成之 層7用作電極位障。 第la圖之基本構造基本上可用作鋁-鎵-氮化物(LEDs)。 第1 b圖是本發明活性層6之已放大之圖解。構成一種 具有量子井結構6之層時,其過程是在各別之氮化鎵 (GaN)層6b之間配置由鎵-銦-氮化物(GalnN)所構成之層 6a。由鎵-銦-氮化物(GalnN)所構成之特定之活性.(即, 發光)層6c緊接於最上方之氮化鎵層。 如圖所示,不同厚度之各層6a,6b交替地配置著。由 銦-鎵-氮化物所構成之較薄之層6a以及由氮化鎵所構成 之較厚之層6b因此形成一種超晶格,其中各井6a較薄, 即,較3nm還薄且各層6b是5nm厚或更大。各層之製造是 藉由氣相磊晶法或分子束磊晶法來達成。因此是在700°C 左右之低溫中進行一種1 - 2nm/分鐘之較慢之生長。銦 之分壓較低約30%。 銦之含量小於24%,但最好小於20%,因此是較一般 之銦含量還少。圖中只顯示一次之各層6a,6b可互相重 疊很多次。此種結構X較佳是重複3次。最上方之氮化鎵 請 先 閱 讀 背 之 注 意 事 項 再 填 頁 訂 Μ 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X 297公釐) 479374 A7 _B7___ 五、發明説明() 層6b上是一種特定之活性(即,發光)層6c(由銦-鎵-氮 化物所構成)。 較佳之設計方式是:以濃度1017至1018cm_3之矽來對 鲁 此量子井結構6a,6b進行摻雜。這樣相對於未摻雜之結 .構而言,又可再一次地大大地改良其特性。 第2圖是價帶VB和導電帶CB之能階特性。縱座標是電 子能量,橫座標是量子井之寬度(其對應於層厚度)。實 際之活性層6c緊接於最上方之氮化鎵層6b。 第2b是一種價帶能階圖,其由鎵-銦-氮化物所構成之 量子井之厚度較本發明者還大。由斜線所示者是壓電場 之效應,其是由應力所產生。 相對於第3圖之結構而言,本發明中較薄之由鎵-銦-氮化物所構成之層可達成一種有效之應力分解作用。 由於在第1圖之層結構及第2圖之量子井特性中本發明 使用此種具有較薄之井(量子井之寬度大約lnm)之Gal nN /GaN-超晶格,則前向電壓可大大地下降且此種以銦-鎵-氮化物爲主之光學半導體元件可保持很高之內部量子 效率。所產生之壓電場可完全被防止或實際上已不會有 作用。相較於傳統之單一量子井結構(其中在活性井之 前不沈積此種鎵-銦-氮化物-超晶格)而言,本發明之元 件結構顯示一種雙倍之轉換效率。與習知之超晶格結構 比較,本發明此種元件結構之前向電壓下降之値>0.5V。 一般人所了解之超晶格是一種只由幾個原子層厚之層 所構成之序列。此種超晶格藉由GaN位障而與活性井相 -6- 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) 請 先 閲 讀 背 之 注 意 事 項 再
訂 經濟部智慧財產局員工消費合作社印製 479374 A7 _B7__ 五、發明説明(5 ) 隔開(>5nm)。量子井結構之矽-摻雜作用較未摻雜之結 構中者已大大地改良。相對於SQN結構(在其活性量子井 之前未沈積GalnN超晶格)而言轉換效率可變二倍。 藉由薄的(即,銦含量很少)光學非活性量子井㈧^-wb 1 1 s )與活性量子井6 c之組合,則可獲得目前習知之多 重-量子井結構之發射特性且可使前向電壓下降。薄的 GalnN-量子井可改良活性量子井之品質,由於"Pre-wells"很小之 層厚度 及其很低之銦含量, 則可防止干擾 壓電場之形成。前向電壓不會由於此種核作用層而增大。 經濟部智慧財產局員工消費合作社印製 號之說明 1..... .基板 2..... .電極 3,5... .緩衝層 4,7… .層 6,6c.. ..活性層 6a , 6b. ...量子井結構 8..... .鎵層 9..... .電極 VB.... .價帶 CB.… .導電帶 -7- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)

Claims (1)

  1. 479374 A8 B8 C8 D8 六、申請專利範圍 1.一種具有多重-量子井結構之光學半導體元件,由不 同形式之半導體層所構成之井層和截止層交替地配置著 ,其特徵爲:各井層(6a)是較薄之鎵-銦-氮化物層,各 截止層(6b)是較厚之氮化鎵層,由鎵-銦-氮化物(6c)所構 成之活性層量子井鄰接於最上方之截止層(6b),由各井層 (6a)及各截止層(6b)而形成超晶格。 2 .如申請專利範圍第1項之光學半導體元件,其中各井層 (6a)較3nm還薄且各截止層(6b)是5nm厚或更厚。 請 先 閱 讀 背 \δ 之 注 意 I 頁 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ:297公釐)
TW089123809A 1999-11-19 2000-11-10 Optical semiconductor-device with multiple-quantum-pot structure TW479374B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19955747A DE19955747A1 (de) 1999-11-19 1999-11-19 Optische Halbleitervorrichtung mit Mehrfach-Quantentopf-Struktur

Publications (1)

Publication Number Publication Date
TW479374B true TW479374B (en) 2002-03-11

Family

ID=7929653

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089123809A TW479374B (en) 1999-11-19 2000-11-10 Optical semiconductor-device with multiple-quantum-pot structure

Country Status (8)

Country Link
US (3) US6849881B1 (zh)
EP (1) EP1145331B1 (zh)
JP (2) JP4681186B2 (zh)
KR (3) KR100889144B1 (zh)
CA (1) CA2360502A1 (zh)
DE (1) DE19955747A1 (zh)
TW (1) TW479374B (zh)
WO (1) WO2001039282A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8043977B2 (en) 2005-08-08 2011-10-25 Showa Denko K.K. Method of manufacturing a semiconductor device having a group-III nitride superlattice layer on a silicon substrate

Families Citing this family (149)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19955747A1 (de) * 1999-11-19 2001-05-23 Osram Opto Semiconductors Gmbh Optische Halbleitervorrichtung mit Mehrfach-Quantentopf-Struktur
US6515313B1 (en) * 1999-12-02 2003-02-04 Cree Lighting Company High efficiency light emitters with reduced polarization-induced charges
TW546855B (en) 2001-06-07 2003-08-11 Sumitomo Chemical Co Group 3-5 compound semiconductor and light emitting diode
WO2002103814A1 (en) * 2001-06-15 2002-12-27 Cree, Inc. Gan based led formed on a sic substrate
KR100853935B1 (ko) * 2002-03-06 2008-08-25 주식회사 엘지이아이 반도체 발광 다이오드 및 그의 제조방법
WO2004040661A2 (de) 2002-10-30 2004-05-13 Osram Opto Semiconductors Gmbh Verfahren zum herstellen einer leuchtdioden-lichtquelle mit lumineszenz-konversionselement
DE10258193B4 (de) 2002-12-12 2014-04-10 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen von Leuchtdioden-Lichtquellen mit Lumineszenz-Konversionselement
DE10261675B4 (de) 2002-12-31 2013-08-14 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit strahlungsdurchlässiger elektrischer Kontaktschicht
TWI255052B (en) 2003-02-14 2006-05-11 Osram Opto Semiconductors Gmbh Method to produce a number of semiconductor-bodies and electronic semiconductor-bodies
CA2897376A1 (en) 2003-02-26 2004-09-10 Radoje T. Drmanac Modular system and probes for dna analysis
DE10308866A1 (de) 2003-02-28 2004-09-09 Osram Opto Semiconductors Gmbh Beleuchtungsmodul und Verfahren zu dessen Herstellung
DE10361661A1 (de) * 2003-07-14 2005-03-17 Osram Opto Semiconductors Gmbh Licht emittierendes Bauelement mit einem Lumineszenz-Konversionselement
KR101034055B1 (ko) 2003-07-18 2011-05-12 엘지이노텍 주식회사 발광 다이오드 및 그 제조방법
JP2005056973A (ja) * 2003-08-01 2005-03-03 Hitachi Cable Ltd 半導体発光素子及びそれを作製するための半導体発光素子用エピタキシャルウェハ
US7915085B2 (en) 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
US7223611B2 (en) * 2003-10-07 2007-05-29 Hewlett-Packard Development Company, L.P. Fabrication of nanowires
DE10351349A1 (de) 2003-10-31 2005-06-16 Osram Opto Semiconductors Gmbh Verfahren zum Hestellen eines Lumineszenzdiodenchips
DE102004016697B4 (de) * 2004-02-27 2007-10-11 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen von Halbleiterchips umfassend ein Verbindungsverfahren, das Löten mit einem Lot umfasst, und Halbleiterchip
EP1741144A1 (de) 2004-04-29 2007-01-10 Osram Opto Semiconductors GmbH Verfahren zum herstellen eines strahlungsemittierenden halbleiterchips
DE102004021175B4 (de) 2004-04-30 2023-06-29 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterchips für die Optoelektronik und Verfahren zu deren Herstellung
DE102004026125A1 (de) 2004-05-28 2005-12-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zu dessen Herstellung
DE102004040468B4 (de) 2004-05-31 2022-02-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauelement und Gehäuse-Grundkörper für ein derartiges Bauelement
DE102004045947A1 (de) * 2004-06-30 2006-01-19 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung
DE102005013894B4 (de) * 2004-06-30 2010-06-17 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung erzeugender Halbleiterchip und Verfahren zu dessen Herstellung
JP5305655B2 (ja) * 2004-07-30 2013-10-02 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 薄膜技術による半導体チップの製造方法および薄膜半導体チップ
US8728937B2 (en) * 2004-07-30 2014-05-20 Osram Opto Semiconductors Gmbh Method for producing semiconductor chips using thin film technology
KR100611491B1 (ko) * 2004-08-26 2006-08-10 엘지이노텍 주식회사 질화물 반도체 발광소자 및 그 제조방법
KR100670531B1 (ko) * 2004-08-26 2007-01-16 엘지이노텍 주식회사 질화물 반도체 발광소자 및 그 제조방법
JP2006128653A (ja) * 2004-09-28 2006-05-18 Sumitomo Chemical Co Ltd 3−5族化合物半導体、その製造方法及びその用途
DE102005028748A1 (de) 2004-10-25 2006-05-04 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes Halbleiterbauelement und Bauelementgehäuse
JP2007019277A (ja) * 2005-07-07 2007-01-25 Rohm Co Ltd 半導体発光素子
DE102005035722B9 (de) 2005-07-29 2021-11-18 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung
JP2007080996A (ja) 2005-09-13 2007-03-29 Sony Corp GaN系半導体発光素子及びその製造方法
EP1764840A1 (en) * 2005-09-15 2007-03-21 SuperNova Optoelectronics Corporation Gallium nitride semiconductor light emitting device
KR100691283B1 (ko) * 2005-09-23 2007-03-12 삼성전기주식회사 질화물 반도체 소자
DE102005062514A1 (de) 2005-09-28 2007-03-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
DE102006023685A1 (de) 2005-09-29 2007-04-05 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
DE102006004397A1 (de) 2005-09-30 2007-04-05 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
KR100649749B1 (ko) * 2005-10-25 2006-11-27 삼성전기주식회사 질화물 반도체 발광 소자
KR20080106402A (ko) 2006-01-05 2008-12-05 일루미텍스, 인크. Led로부터 광을 유도하기 위한 개별 광학 디바이스
DE102006033502A1 (de) * 2006-05-03 2007-11-15 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterkörper mit Trägersubstrat und Verfahren zur Herstellung eines solchen
DE102006028692B4 (de) * 2006-05-19 2021-09-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektrisch leitende Verbindung mit isolierendem Verbindungsmedium
DE102006024165A1 (de) 2006-05-23 2007-11-29 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Optoelektronischer Halbleiterchip mit einem Wellenlängenkonversionsstoff sowie optoelektronisches Halbleiterbauelement mit einem solchen Halbleiterchip und Verfahren zur Herstellung des optoelektronischen Halbleiterchips
KR101263934B1 (ko) * 2006-05-23 2013-05-10 엘지디스플레이 주식회사 발광다이오드 및 그의 제조방법
JP2007318044A (ja) * 2006-05-29 2007-12-06 Mitsubishi Electric Corp 半導体装置とその製造方法
US20070284565A1 (en) * 2006-06-12 2007-12-13 3M Innovative Properties Company Led device with re-emitting semiconductor construction and optical element
EP2033236A4 (en) * 2006-06-12 2014-10-22 3M Innovative Properties Co LED DEVICE WITH RE-ESTIMATING SEMICONDUCTOR CONSTRUCTION AND OPTICAL ELEMENT
US7952110B2 (en) 2006-06-12 2011-05-31 3M Innovative Properties Company LED device with re-emitting semiconductor construction and converging optical element
WO2007146868A1 (en) * 2006-06-12 2007-12-21 3M Innovative Properties Company Led device with re-emitting semiconductor construction and converging optical element
US7902542B2 (en) * 2006-06-14 2011-03-08 3M Innovative Properties Company Adapted LED device with re-emitting semiconductor construction
EP1883121B1 (en) * 2006-07-26 2019-03-06 LG Electronics Inc. Nitride-based semiconductor light emitting device
KR100850950B1 (ko) * 2006-07-26 2008-08-08 엘지전자 주식회사 질화물계 발광 소자
EP1883140B1 (de) * 2006-07-27 2013-02-27 OSRAM Opto Semiconductors GmbH LD oder LED mit Übergitter-Mantelschicht und Dotierungsgradienten
EP1883119B1 (de) * 2006-07-27 2015-11-04 OSRAM Opto Semiconductors GmbH Halbleiter-Schichtstruktur mit Übergitter
EP1883141B1 (de) * 2006-07-27 2017-05-24 OSRAM Opto Semiconductors GmbH LD oder LED mit Übergitter-Mantelschicht
DE102007021009A1 (de) 2006-09-27 2008-04-10 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung und Verfahren zur Herstellung einer solchen
DE102006051745B4 (de) 2006-09-28 2024-02-08 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung LED-Halbleiterkörper und Verwendung eines LED-Halbleiterkörpers
DE102006063104B4 (de) 2006-09-28 2024-08-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung LED-Halbleiterkörper und Verwendung eines LED-Halbleiterkörpers
DE102007001743A1 (de) * 2006-09-29 2008-04-03 Osram Opto Semiconductors Gmbh Halbleiterlaser und Verfahren zur Herstellung eines solchen
CN101553928B (zh) 2006-10-02 2011-06-01 伊鲁米特克有限公司 Led系统和方法
KR100920915B1 (ko) 2006-12-28 2009-10-12 서울옵토디바이스주식회사 초격자 구조의 장벽층을 갖는 발광 다이오드
US9024349B2 (en) * 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
EP1953837A3 (de) 2007-01-31 2014-01-15 OSRAM Opto Semiconductors GmbH Halbleiterbauelement mit einer optisch aktiven Schicht, Anordnung mit einer Vielzahl von optisch aktiven Schichten und Verfahren zur Herstellung eines Halbleiterbauelements
DE102007017113A1 (de) 2007-01-31 2008-08-07 Osram Opto Semiconductors Gmbh Halbleiterbauelement mit einer optisch aktiven Schicht, Anordnung mit einer Vielzahl von optisch aktiven Schichten und Verfahren zur Herstellung eines Halbleiterbauelements
EP1976031A3 (en) 2007-03-29 2010-09-08 Seoul Opto Device Co., Ltd. Light emitting diode having well and/or barrier layers with superlattice structure
DE102007015474A1 (de) 2007-03-30 2008-10-02 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102007022947B4 (de) 2007-04-26 2022-05-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen
DE102007035896A1 (de) 2007-07-31 2009-02-05 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper und optoelektronisches Bauelement
DE102007039291A1 (de) 2007-08-20 2009-02-26 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleitermodul und Verfahren zur Herstellung eines solchen
KR100877774B1 (ko) 2007-09-10 2009-01-16 서울옵토디바이스주식회사 개선된 구조의 발광다이오드
DE102007043183A1 (de) 2007-09-11 2009-04-09 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines solchen
DE102007043181A1 (de) 2007-09-11 2009-03-12 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
DE102007044439B4 (de) 2007-09-18 2022-03-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip mit Quantentopfstruktur
DE102007046027A1 (de) * 2007-09-26 2009-04-02 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip mit einer Mehrfachquantentopfstruktur
DE102007046752B4 (de) * 2007-09-28 2022-09-08 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Quasisubstrat für ein optoelektronisches Bauelement und optoelektronisches Bauelement
DE102007049799A1 (de) 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
DE102007059548A1 (de) 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Auskoppellinse für ein optoelektronisches Bauelement
DE102007057756B4 (de) 2007-11-30 2022-03-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Halbleiterkörpers
US7723719B2 (en) * 2007-12-14 2010-05-25 Palo Alto Research Center Incorporated Light emitting devices with inhomogeneous quantum well active regions
DE102007061140A1 (de) 2007-12-19 2009-06-25 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit Kühlelement
DE102008008599A1 (de) 2007-12-20 2009-06-25 Osram Opto Semiconductors Gmbh Halbleiteranordnung, insbesondere Leuchtdiodenanordnung und Leuchtmittelanordnung
DE102007062046B4 (de) 2007-12-21 2023-09-07 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Lichtemittierende Bauelementeanordnung, lichtemittierendes Bauelement sowie Verfahren zum Herstellen einer Mehrzahl von lichtemittierenden Bauelementen
DE102008003182A1 (de) 2008-01-04 2009-07-09 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
DE102008029191A1 (de) 2008-01-31 2009-08-06 Osram Opto Semiconductors Gmbh Beleuchtungseinrichtung zur Hinterleuchtung eines Displays sowie ein Display mit einer solchen Beleuchtungseinrichtung
EP2240968A1 (en) 2008-02-08 2010-10-20 Illumitex, Inc. System and method for emitter layer shaping
DE102008028036A1 (de) 2008-02-29 2009-09-03 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper mit Tunnelübergang und Verfahren zur Herstellung eines solchen
DE102008016525A1 (de) 2008-03-31 2009-11-26 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen
DE102008022941A1 (de) * 2008-02-29 2009-09-03 Osram Opto Semiconductors Gmbh Sensorsystem mit einer Beleuchtungseinrichtung und einer Detektoreinrichtung
JP5992662B2 (ja) 2008-02-29 2016-09-14 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH モノリシックなオプトエレクトロニクス半導体ボディおよびその製造方法
DE102008011848A1 (de) 2008-02-29 2009-09-03 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen
EP2096459B1 (de) 2008-02-29 2017-11-01 OSRAM Opto Semiconductors GmbH Sensorsystem mit einer Beleuchtungseinrichtung und einer Detektoreinrichtung
TWI466314B (zh) * 2008-03-05 2014-12-21 Advanced Optoelectronic Tech 三族氮化合物半導體發光二極體
KR101423720B1 (ko) * 2008-03-25 2014-08-04 서울바이오시스 주식회사 다중양자웰 구조의 활성 영역을 갖는 발광 소자 및 그제조방법
DE102008032318A1 (de) 2008-03-31 2009-10-01 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines solchen
US8664747B2 (en) * 2008-04-28 2014-03-04 Toshiba Techno Center Inc. Trenched substrate for crystal growth and wafer bonding
JP2009289983A (ja) * 2008-05-29 2009-12-10 Sharp Corp 窒化物半導体発光ダイオード
DE102008030751A1 (de) 2008-06-27 2009-12-31 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterchip
KR100957750B1 (ko) 2008-08-12 2010-05-13 우리엘에스티 주식회사 발광 소자
TW201034256A (en) 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
DE102009015569B9 (de) 2009-03-30 2023-06-29 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip
US8207547B2 (en) 2009-06-10 2012-06-26 Brudgelux, Inc. Thin-film LED with P and N contacts electrically isolated from the substrate
DE102009037416B4 (de) 2009-08-13 2021-10-14 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektrisch gepumpter optoelektronischer Halbleiterchip
US8449128B2 (en) 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
TWI405409B (zh) * 2009-08-27 2013-08-11 Novatek Microelectronics Corp 低電壓差動訊號輸出級
US20110089399A1 (en) * 2009-10-09 2011-04-21 The Regents Of The University Of California Light emitting device with a stair quantum well structure
US20110101301A1 (en) * 2009-11-04 2011-05-05 The Regents Of The University Of California Light emitting device with a coupled quantum well structure
US8525221B2 (en) 2009-11-25 2013-09-03 Toshiba Techno Center, Inc. LED with improved injection efficiency
DE102009060750A1 (de) 2009-12-30 2011-07-07 OSRAM Opto Semiconductors GmbH, 93055 Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung
KR100999780B1 (ko) 2010-01-07 2010-12-08 엘지이노텍 주식회사 광학 어셈블리, 이를 구비한 백라이트 유닛 및 디스플레이 장치
RU2434315C1 (ru) * 2010-03-15 2011-11-20 Юрий Георгиевич Шретер Светоизлучающее устройство с гетерофазными границами
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
JP5060637B1 (ja) * 2011-05-13 2012-10-31 株式会社東芝 半導体発光素子及びウェーハ
US8395165B2 (en) 2011-07-08 2013-03-12 Bridelux, Inc. Laterally contacted blue LED with superlattice current spreading layer
US20130026480A1 (en) 2011-07-25 2013-01-31 Bridgelux, Inc. Nucleation of Aluminum Nitride on a Silicon Substrate Using an Ammonia Preflow
US8916906B2 (en) 2011-07-29 2014-12-23 Kabushiki Kaisha Toshiba Boron-containing buffer layer for growing gallium nitride on silicon
US9343641B2 (en) 2011-08-02 2016-05-17 Manutius Ip, Inc. Non-reactive barrier metal for eutectic bonding process
US8865565B2 (en) 2011-08-02 2014-10-21 Kabushiki Kaisha Toshiba LED having a low defect N-type layer that has grown on a silicon substrate
US9012939B2 (en) 2011-08-02 2015-04-21 Kabushiki Kaisha Toshiba N-type gallium-nitride layer having multiple conductive intervening layers
US9142743B2 (en) 2011-08-02 2015-09-22 Kabushiki Kaisha Toshiba High temperature gold-free wafer bonding for light emitting diodes
US20130032810A1 (en) 2011-08-03 2013-02-07 Bridgelux, Inc. Led on silicon substrate using zinc-sulfide as buffer layer
US8564010B2 (en) 2011-08-04 2013-10-22 Toshiba Techno Center Inc. Distributed current blocking structures for light emitting diodes
KR101836122B1 (ko) * 2011-08-24 2018-04-19 엘지이노텍 주식회사 발광소자
US8624482B2 (en) 2011-09-01 2014-01-07 Toshiba Techno Center Inc. Distributed bragg reflector for reflecting light of multiple wavelengths from an LED
US8669585B1 (en) 2011-09-03 2014-03-11 Toshiba Techno Center Inc. LED that has bounding silicon-doped regions on either side of a strain release layer
US8558247B2 (en) 2011-09-06 2013-10-15 Toshiba Techno Center Inc. GaN LEDs with improved area and method for making the same
US8686430B2 (en) 2011-09-07 2014-04-01 Toshiba Techno Center Inc. Buffer layer for GaN-on-Si LED
US9012921B2 (en) 2011-09-29 2015-04-21 Kabushiki Kaisha Toshiba Light emitting devices having light coupling layers
US8698163B2 (en) 2011-09-29 2014-04-15 Toshiba Techno Center Inc. P-type doping layers for use with light emitting devices
US9178114B2 (en) 2011-09-29 2015-11-03 Manutius Ip, Inc. P-type doping layers for use with light emitting devices
US8664679B2 (en) 2011-09-29 2014-03-04 Toshiba Techno Center Inc. Light emitting devices having light coupling layers with recessed electrodes
US8853668B2 (en) 2011-09-29 2014-10-07 Kabushiki Kaisha Toshiba Light emitting regions for use with light emitting devices
US20130082274A1 (en) 2011-09-29 2013-04-04 Bridgelux, Inc. Light emitting devices having dislocation density maintaining buffer layers
US8581267B2 (en) 2011-11-09 2013-11-12 Toshiba Techno Center Inc. Series connected segmented LED
US8552465B2 (en) 2011-11-09 2013-10-08 Toshiba Techno Center Inc. Method for reducing stress in epitaxial growth
US8975616B2 (en) 2012-07-03 2015-03-10 Liang Wang Quantum efficiency of multiple quantum wells
DE102012217681A1 (de) 2012-09-27 2014-03-27 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zum Betreiben eines optoelektronischen Bauteils
FR3004005B1 (fr) * 2013-03-28 2016-11-25 Commissariat Energie Atomique Diode electroluminescente a multiples puits quantiques et jonction p-n asymetrique
DE102013104351B4 (de) 2013-04-29 2022-01-20 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterschichtenfolge und Verfahren zum Betreiben eines optoelektronischen Halbleiterchips
US9887324B2 (en) * 2013-09-16 2018-02-06 Lg Innotek Co., Ltd. Light emitting device package
KR102212561B1 (ko) 2014-08-11 2021-02-08 삼성전자주식회사 반도체 발광 소자 및 반도체 발광 소자 패키지
JP6225945B2 (ja) 2015-05-26 2017-11-08 日亜化学工業株式会社 半導体レーザ素子
KR102328945B1 (ko) * 2015-07-31 2021-11-19 엘지전자 주식회사 디스플레이 장치
DE102016111929A1 (de) * 2016-06-29 2018-01-04 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper und Leuchtdiode
DE102017112127A1 (de) 2017-06-01 2018-12-06 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
JP6891865B2 (ja) 2018-10-25 2021-06-18 日亜化学工業株式会社 発光素子
DE102020125056A1 (de) 2020-09-25 2022-03-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements
CN113451460B (zh) * 2020-11-20 2022-07-22 重庆康佳光电技术研究院有限公司 发光器件及其制备方法
EP4315433A1 (en) * 2021-03-22 2024-02-07 Lumileds LLC Green led with current-invariant emission wavelength

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5679152A (en) * 1994-01-27 1997-10-21 Advanced Technology Materials, Inc. Method of making a single crystals Ga*N article
JP3080831B2 (ja) 1994-02-03 2000-08-28 日本電気株式会社 多重量子井戸半導体レーザ
JP3445653B2 (ja) * 1994-03-23 2003-09-08 士郎 酒井 発光素子
US5777350A (en) 1994-12-02 1998-07-07 Nichia Chemical Industries, Ltd. Nitride semiconductor light-emitting device
GB2298735A (en) * 1995-03-08 1996-09-11 Sharp Kk Semiconductor device having a miniband
TW425722B (en) 1995-11-27 2001-03-11 Sumitomo Chemical Co Group III-V compound semiconductor and light-emitting device
US5684309A (en) * 1996-07-11 1997-11-04 North Carolina State University Stacked quantum well aluminum indium gallium nitride light emitting diodes
US6233264B1 (en) * 1996-08-27 2001-05-15 Ricoh Company, Ltd. Optical semiconductor device having an active layer containing N
JP3854693B2 (ja) * 1996-09-30 2006-12-06 キヤノン株式会社 半導体レーザの製造方法
JP3700283B2 (ja) * 1996-10-02 2005-09-28 昭和電工株式会社 窒化物化合物半導体素子
CA2276335C (en) * 1997-01-09 2006-04-11 Nichia Chemical Industries, Ltd. Nitride semiconductor device
JP3282175B2 (ja) * 1997-02-04 2002-05-13 日亜化学工業株式会社 窒化物半導体素子
JP3433038B2 (ja) * 1997-02-24 2003-08-04 株式会社東芝 半導体発光装置
US6377597B1 (en) * 1997-03-07 2002-04-23 Sharp Kabushiki Kaisha Gallium nitride semiconductor light emitting element with active layer having multiplex quantum well structure and semiconductor laser light source device
US5831277A (en) 1997-03-19 1998-11-03 Northwestern University III-nitride superlattice structures
US5892786A (en) * 1997-03-26 1999-04-06 The United States Of America As Represented By The Secretary Of The Air Force Output control of vertical microcavity light emitting device
JPH1168158A (ja) * 1997-08-20 1999-03-09 Sanyo Electric Co Ltd 窒化ガリウム系化合物半導体装置
US5875052A (en) * 1997-09-05 1999-02-23 North Carolina State University Optical information storage systems and methods using heterostructures comprising ternary group III-V nitride semiconductor materials
JP3283802B2 (ja) * 1997-09-29 2002-05-20 日本電気株式会社 選択成長法を用いた半導体層及びその成長方法、選択成長法を用いた窒化物系半導体層及びその成長方法、窒化物系半導体発光素子とその製造方法
US6563850B1 (en) 1997-10-06 2003-05-13 Sharp Kabushiki Kaisha Light-emitting device and fabricating method thereof
US6541797B1 (en) * 1997-12-04 2003-04-01 Showa Denko K. K. Group-III nitride semiconductor light-emitting device
JP3653169B2 (ja) * 1998-01-26 2005-05-25 シャープ株式会社 窒化ガリウム系半導体レーザ素子
JPH11251685A (ja) * 1998-03-05 1999-09-17 Toshiba Corp 半導体レーザ
AU2746899A (en) * 1998-03-12 1999-09-27 Nichia Chemical Industries, Ltd. Nitride semiconductor device
JP4245691B2 (ja) * 1998-08-04 2009-03-25 シャープ株式会社 窒化ガリウム系半導体レーザ素子及び光ピックアップ装置
US6608330B1 (en) * 1998-09-21 2003-08-19 Nichia Corporation Light emitting device
JP2000150957A (ja) * 1998-11-12 2000-05-30 Showa Denko Kk Iii族窒化物半導体発光素子
US6614059B1 (en) * 1999-01-07 2003-09-02 Matsushita Electric Industrial Co., Ltd. Semiconductor light-emitting device with quantum well
US6625195B1 (en) * 1999-07-20 2003-09-23 Joseph Reid Henrichs Vertical cavity surface emitting laser that uses intracavity degenerate four wave mixing to produce phase-conjugated and distortion free collimated laser light
DE19955747A1 (de) * 1999-11-19 2001-05-23 Osram Opto Semiconductors Gmbh Optische Halbleitervorrichtung mit Mehrfach-Quantentopf-Struktur

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8043977B2 (en) 2005-08-08 2011-10-25 Showa Denko K.K. Method of manufacturing a semiconductor device having a group-III nitride superlattice layer on a silicon substrate
US8222674B2 (en) 2005-08-08 2012-07-17 Showa Denko K.K. Semiconductor device having a group-III nitride superlattice layer on a silicon substrate

Also Published As

Publication number Publication date
JP4681186B2 (ja) 2011-05-11
CA2360502A1 (en) 2001-05-31
KR100799793B1 (ko) 2008-01-31
US20060289854A1 (en) 2006-12-28
JP2011035433A (ja) 2011-02-17
KR20010101598A (ko) 2001-11-14
KR20070116157A (ko) 2007-12-06
KR100889144B1 (ko) 2009-03-16
KR20070009725A (ko) 2007-01-18
WO2001039282A3 (de) 2001-12-06
US6849881B1 (en) 2005-02-01
JP5361845B2 (ja) 2013-12-04
WO2001039282A2 (de) 2001-05-31
US7556974B2 (en) 2009-07-07
JP2003515936A (ja) 2003-05-07
US7106090B2 (en) 2006-09-12
KR100722031B1 (ko) 2007-05-25
DE19955747A1 (de) 2001-05-23
EP1145331A2 (de) 2001-10-17
US20050116216A1 (en) 2005-06-02
EP1145331B1 (de) 2013-07-17

Similar Documents

Publication Publication Date Title
TW479374B (en) Optical semiconductor-device with multiple-quantum-pot structure
JP5852945B2 (ja) 分極誘導電荷を低減させた高効率光エミッタ
US8993996B2 (en) Superlattice structure
US8071986B2 (en) Nitride semiconductor light-emitting element
US9412901B2 (en) Superlattice structure
JP7228176B2 (ja) Iii族窒化物半導体発光素子
US20110220871A1 (en) Nitride semiconductor light-emitting device and semiconductor light-emitting device
US20100207100A1 (en) Radiation-Emitting Semiconductor Body
JP2006295128A (ja) 窒化物半導体素子
JPH10145004A (ja) GaN系発光素子
WO2018163824A1 (ja) 半導体発光素子および半導体発光素子の製造方法
JP6945666B2 (ja) 半導体発光素子および半導体発光素子の製造方法
JPH07176826A (ja) 窒化ガリウム系化合物半導体レーザ素子
WO2007032355A1 (ja) 半導体発光素子
JP2006237045A (ja) 半導体量子ドット構造及びその製造方法
JP5609094B2 (ja) 受光素子
JP2006114611A (ja) 発光素子及びその製造方法
JP5355768B2 (ja) 半導体積層構造の製造方法
JP3307254B2 (ja) GaN系素子及びその製造方法
KR100760151B1 (ko) 레이저 다이오드 및 그 제조방법
JPH06163400A (ja) 偏極電子線発生素子
JP5173673B2 (ja) 半導体発光素子
JP2004297060A (ja) 発光ダイオード素子とその製造方法
JPS6235591A (ja) 半導体発光装置
JPH0537081A (ja) 半導体構造及び半導体装置

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MK4A Expiration of patent term of an invention patent