TW316995B - - Google Patents

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Publication number
TW316995B
TW316995B TW085100408A TW85100408A TW316995B TW 316995 B TW316995 B TW 316995B TW 085100408 A TW085100408 A TW 085100408A TW 85100408 A TW85100408 A TW 85100408A TW 316995 B TW316995 B TW 316995B
Authority
TW
Taiwan
Prior art keywords
cleaning
substrate
holding
semiconductor wafer
contact
Prior art date
Application number
TW085100408A
Other languages
English (en)
Chinese (zh)
Original Assignee
Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW316995B publication Critical patent/TW316995B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
TW085100408A 1995-01-19 1996-01-15 TW316995B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2474795 1995-01-19

Publications (1)

Publication Number Publication Date
TW316995B true TW316995B (enExample) 1997-10-01

Family

ID=12146746

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085100408A TW316995B (enExample) 1995-01-19 1996-01-15

Country Status (3)

Country Link
US (2) US5651160A (enExample)
KR (1) KR100224462B1 (enExample)
TW (1) TW316995B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI636518B (zh) * 2013-04-23 2018-09-21 荏原製作所股份有限公司 基板處理裝置及處理基板之製造方法
TWI848342B (zh) * 2021-09-22 2024-07-11 日商斯庫林集團股份有限公司 基板洗淨裝置及基板洗淨方法

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3007566B2 (ja) * 1996-02-16 2000-02-07 株式会社共立 ディスククリーナ
JP3556043B2 (ja) * 1996-03-19 2004-08-18 株式会社荏原製作所 基板乾燥装置
JP3393016B2 (ja) * 1996-04-15 2003-04-07 大日本スクリーン製造株式会社 基板洗浄装置および方法
JPH09320999A (ja) * 1996-05-31 1997-12-12 Komatsu Electron Metals Co Ltd 半導体ウェハ貼付プレートの付着物除去装置
US5875507A (en) 1996-07-15 1999-03-02 Oliver Design, Inc. Wafer cleaning apparatus
US6230753B1 (en) 1996-07-15 2001-05-15 Lam Research Corporation Wafer cleaning apparatus
US5868857A (en) 1996-12-30 1999-02-09 Intel Corporation Rotating belt wafer edge cleaning apparatus
US5901399A (en) * 1996-12-30 1999-05-11 Intel Corporation Flexible-leaf substrate edge cleaning apparatus
JP3290910B2 (ja) * 1997-02-19 2002-06-10 東京エレクトロン株式会社 洗浄装置
JP3180893B2 (ja) * 1997-02-28 2001-06-25 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP3330300B2 (ja) * 1997-02-28 2002-09-30 東京エレクトロン株式会社 基板洗浄装置
JP3630524B2 (ja) * 1997-05-08 2005-03-16 大日本スクリーン製造株式会社 基板洗浄装置
JPH10309666A (ja) * 1997-05-09 1998-11-24 Speedfam Co Ltd エッジポリッシング装置及びその方法
JP3320640B2 (ja) * 1997-07-23 2002-09-03 東京エレクトロン株式会社 洗浄装置
JPH1154471A (ja) 1997-08-05 1999-02-26 Tokyo Electron Ltd 処理装置及び処理方法
US6115867A (en) * 1997-08-18 2000-09-12 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
JPH11123658A (ja) * 1997-10-21 1999-05-11 Speedfam Co Ltd ドレッサ及びドレッシング装置
US6179549B1 (en) * 1997-11-21 2001-01-30 Amada Metrecs Company, Ltd. Loading and unloading device for sheet metals
TW386256B (en) * 1997-12-24 2000-04-01 United Microelectronics Corp Method for removing photoresistor
US5954888A (en) * 1998-02-09 1999-09-21 Speedfam Corporation Post-CMP wet-HF cleaning station
JP3333733B2 (ja) * 1998-02-20 2002-10-15 東京エレクトロン株式会社 洗浄装置
US6261378B1 (en) * 1998-03-23 2001-07-17 Tokyo Electron Limited Substrate cleaning unit and cleaning method
DE19914347C2 (de) * 1998-03-30 2003-11-06 Tokyo Electron Ltd Waschvorrichtung und Waschverfahren
JP4040162B2 (ja) * 1998-04-07 2008-01-30 沖電気工業株式会社 半導体ウエハの洗浄装置
JP3314032B2 (ja) * 1998-04-28 2002-08-12 東京エレクトロン株式会社 処理装置
KR100537022B1 (ko) * 1998-05-19 2006-03-17 삼성전자주식회사 세정 설비 및 세정액 공급 방법
JP3070917B2 (ja) 1998-06-16 2000-07-31 株式会社共立 ディスククリーナ
US6308361B1 (en) * 1998-07-28 2001-10-30 Ebara Corporation Cleaning apparatus
US6277203B1 (en) 1998-09-29 2001-08-21 Lam Research Corporation Method and apparatus for cleaning low K dielectric and metal wafer surfaces
US6202658B1 (en) 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
JP2000180469A (ja) * 1998-12-18 2000-06-30 Fujitsu Ltd 半導体装置用コンタクタ及び半導体装置用コンタクタを用いた試験装置及び半導体装置用コンタクタを用いた試験方法及び半導体装置用コンタクタのクリーニング方法
JP2000260740A (ja) * 1999-03-12 2000-09-22 Disco Abrasive Syst Ltd スピンナー洗浄装置
US6352595B1 (en) 1999-05-28 2002-03-05 Lam Research Corporation Method and system for cleaning a chemical mechanical polishing pad
US6711775B2 (en) 1999-06-10 2004-03-30 Lam Research Corporation System for cleaning a semiconductor wafer
US6405399B1 (en) 1999-06-25 2002-06-18 Lam Research Corporation Method and system of cleaning a wafer after chemical mechanical polishing or plasma processing
KR20010037210A (ko) * 1999-10-14 2001-05-07 구본준, 론 위라하디락사 기판 세정 장치 및 기판 세정 방법
US6295683B1 (en) * 1999-12-09 2001-10-02 United Microelectronics Corp. Equipment for brushing the underside of a semiconductor wafer
US6309276B1 (en) 2000-02-01 2001-10-30 Applied Materials, Inc. Endpoint monitoring with polishing rate change
US6976802B2 (en) 2000-10-11 2005-12-20 The Clorox Company Fluid distribution nozzle and stream pattern
JP3124276B1 (ja) 2000-03-28 2001-01-15 株式会社共立 ディスククリーナ
FR2808120B1 (fr) * 2000-04-20 2002-07-26 Karl Suss France Procede et dispositif pour le traitement du substrat d'un circuit integre ou d'un produit analogue en cours de fabrication
US6536454B2 (en) * 2000-07-07 2003-03-25 Sez Ag Device for treating a disc-shaped object
US6602430B1 (en) * 2000-08-18 2003-08-05 Micron Technology, Inc. Methods for finishing microelectronic device packages
JP4172567B2 (ja) * 2000-09-22 2008-10-29 東京エレクトロン株式会社 基板洗浄具及び基板洗浄装置
US6800020B1 (en) 2000-10-02 2004-10-05 Lam Research Corporation Web-style pad conditioning system and methods for implementing the same
KR100877044B1 (ko) * 2000-10-02 2008-12-31 도쿄엘렉트론가부시키가이샤 세정처리장치
JP2003068695A (ja) * 2001-08-29 2003-03-07 Hitachi Ltd 半導体集積回路装置の製造方法
US6904637B2 (en) 2001-10-03 2005-06-14 Applied Materials, Inc. Scrubber with sonic nozzle
US6676770B2 (en) * 2002-03-19 2004-01-13 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for removing particles from wafer pods
US20040200409A1 (en) * 2002-12-16 2004-10-14 Applied Materials, Inc. Scrubber with integrated vertical marangoni drying
US20050056303A1 (en) * 2003-09-16 2005-03-17 Wei-Ming Lee Oblique burnish/wipe mechanism for hard drive disk like media
CN1301804C (zh) * 2003-09-19 2007-02-28 旺宏电子股份有限公司 清洗保养旋转蚀刻机的方法
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
US6966823B2 (en) * 2003-11-12 2005-11-22 Azuradisc, Inc. Buffing head and method for reconditioning an optical disc
US7353560B2 (en) * 2003-12-18 2008-04-08 Lam Research Corporation Proximity brush unit apparatus and method
US20050279579A1 (en) * 2004-06-22 2005-12-22 Milk Jeremy I Retail display product combination and methods
US20060168743A1 (en) * 2005-02-01 2006-08-03 Homer Ronald E Motorized hand washing device
WO2006113386A2 (en) 2005-04-15 2006-10-26 S. C. Johnson & Son, Inc. Flexible cleaning tool with replaceable non-woven pad and cleaning fluid reservoir
US20070095367A1 (en) * 2005-10-28 2007-05-03 Yaxin Wang Apparatus and method for atomic layer cleaning and polishing
US8327861B2 (en) * 2006-12-19 2012-12-11 Lam Research Corporation Megasonic precision cleaning of semiconductor process equipment components and parts
JP5535687B2 (ja) * 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
KR20140116542A (ko) * 2012-01-24 2014-10-02 어플라이드 머티어리얼스, 인코포레이티드 입자 감소를 위한 세정 모듈 및 프로세스
TWM451568U (zh) * 2012-11-19 2013-04-21 家登精密工業股份有限公司 光罩清洗裝置
WO2014128528A1 (en) * 2013-02-21 2014-08-28 Okulov Pavel D Portable modular deburring machine
KR20150075357A (ko) * 2013-12-25 2015-07-03 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치 및 기판 처리 장치
JP6684191B2 (ja) * 2016-09-05 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置およびそれを備える基板処理装置
JP6905684B2 (ja) * 2017-10-02 2021-07-21 日本電気硝子株式会社 ガラス板の洗浄装置およびガラス板の製造方法
TWI865303B (zh) 2017-12-13 2024-12-01 日商東京威力科創股份有限公司 基板處理裝置
JP7232615B2 (ja) * 2017-12-13 2023-03-03 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7153683B2 (ja) * 2020-03-17 2022-10-14 パナソニックホールディングス株式会社 切断装置
RU2766090C1 (ru) * 2021-04-16 2022-02-07 Федеральное государственное бюджетное образовательное учреждение высшего образования "Саратовский государственный технический университет имени Гагарина Ю.А." (СГТУ имени Гагарина Ю.А.) Способ очистки поверхности изделия от окалины
CN114273294B (zh) * 2021-12-17 2022-12-13 秦皇岛满药本草药业股份有限公司 一种五味子专用清洗装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2296156A (en) * 1941-06-11 1942-09-15 William R Fuller Attachment for record-producing mechanism
US3803660A (en) * 1972-04-27 1974-04-16 Randomex Inc Apparatus for cleaning discs
US4068251A (en) * 1975-02-17 1978-01-10 Hoechst Aktiengesellschaft Developing device for printing plates
JPS6316626A (ja) * 1986-07-09 1988-01-23 Nec Kansai Ltd 半導体装置の製造方法
JP2660248B2 (ja) * 1988-01-06 1997-10-08 株式会社 半導体エネルギー研究所 光を用いた膜形成方法
JPH03274722A (ja) * 1990-03-26 1991-12-05 Hitachi Ltd 半導体装置の製造方法及び製造装置
US5144711A (en) * 1991-03-25 1992-09-08 Westech Systems, Inc. Cleaning brush for semiconductor wafer
JPH04363022A (ja) * 1991-06-06 1992-12-15 Enya Syst:Kk 貼付板洗浄装置
JP3140556B2 (ja) * 1992-04-23 2001-03-05 沖電気工業株式会社 半導体ウエハの洗浄方法
US5375291A (en) * 1992-05-18 1994-12-27 Tokyo Electron Limited Device having brush for scrubbing substrate
US5345639A (en) * 1992-05-28 1994-09-13 Tokyo Electron Limited Device and method for scrubbing and cleaning substrate
JP2877216B2 (ja) * 1992-10-02 1999-03-31 東京エレクトロン株式会社 洗浄装置
US5485644A (en) * 1993-03-18 1996-01-23 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI636518B (zh) * 2013-04-23 2018-09-21 荏原製作所股份有限公司 基板處理裝置及處理基板之製造方法
TWI848342B (zh) * 2021-09-22 2024-07-11 日商斯庫林集團股份有限公司 基板洗淨裝置及基板洗淨方法

Also Published As

Publication number Publication date
KR960030343A (ko) 1996-08-17
US5651160A (en) 1997-07-29
KR100224462B1 (ko) 1999-10-15
US5858112A (en) 1999-01-12

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