TW315488B - - Google Patents

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Publication number
TW315488B
TW315488B TW085102714A TW85102714A TW315488B TW 315488 B TW315488 B TW 315488B TW 085102714 A TW085102714 A TW 085102714A TW 85102714 A TW85102714 A TW 85102714A TW 315488 B TW315488 B TW 315488B
Authority
TW
Taiwan
Prior art keywords
cassette
carrier
environment
door
item
Prior art date
Application number
TW085102714A
Other languages
English (en)
Chinese (zh)
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Application granted granted Critical
Publication of TW315488B publication Critical patent/TW315488B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0297—Wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW085102714A 1996-01-24 1996-03-04 TW315488B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/590,757 US5752796A (en) 1996-01-24 1996-01-24 Vacuum integrated SMIF system

Publications (1)

Publication Number Publication Date
TW315488B true TW315488B (https=) 1997-09-11

Family

ID=24363582

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085102714A TW315488B (https=) 1996-01-24 1996-03-04

Country Status (7)

Country Link
US (1) US5752796A (https=)
EP (1) EP0886618A4 (https=)
JP (1) JP4093376B2 (https=)
KR (1) KR100499324B1 (https=)
AU (1) AU1577997A (https=)
TW (1) TW315488B (https=)
WO (1) WO1997027133A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7359031B2 (en) 2003-03-11 2008-04-15 Asml Netherlands B.V. Lithographic projection assembly, load lock and method for transferring objects
US10521239B2 (en) 2011-11-22 2019-12-31 Intel Corporation Microprocessor accelerated code optimizer

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US6048154A (en) * 1996-10-02 2000-04-11 Applied Materials, Inc. High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock
US6540466B2 (en) * 1996-12-11 2003-04-01 Applied Materials, Inc. Compact apparatus and method for storing and loading semiconductor wafer carriers
USD405430S (en) 1997-01-31 1999-02-09 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
USD405428S (en) 1997-01-31 1999-02-09 Tokyo Electron Ltd. Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD404016S (en) 1997-01-31 1999-01-12 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD405427S (en) 1997-01-31 1999-02-09 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD405429S (en) 1997-01-31 1999-02-09 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD410438S (en) * 1997-01-31 1999-06-01 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD406113S (en) * 1997-01-31 1999-02-23 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
EP0870850B1 (de) * 1997-04-11 2002-09-18 Leybold Systems GmbH Verfahren und Vorrichtung zum Be- und Entladen einer evakuierbaren Behandlungskammer
JPH10321714A (ja) * 1997-05-20 1998-12-04 Sony Corp 密閉コンテナ並びに密閉コンテナ用雰囲気置換装置及び雰囲気置換方法
USD404369S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
USD404373S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Fin for use in a semiconductor wafer heat processing apparatus
USD407696S (en) 1997-08-20 1999-04-06 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
USD405431S (en) 1997-08-20 1999-02-09 Tokyo Electron Ltd. Tube for use in a semiconductor wafer heat processing apparatus
USD404370S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404375S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Heat retaining tube base for use in a semiconductor wafer head processing apparatus
USD404368S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Outer tube for use in a semiconductor wafer heat processing apparatus
USD405062S (en) * 1997-08-20 1999-02-02 Tokyo Electron Ltd. Processing tube for use in a semiconductor wafer heat processing apparatus
USD404374S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Fin for use in a semiconductor wafer heat processing apparatus
USD404372S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
JPH11111809A (ja) * 1997-10-07 1999-04-23 Innotech Corp 搬送装置
US5931626A (en) * 1998-01-16 1999-08-03 Brooks Automation Inc. Robot mounting de-coupling technique
US6398032B2 (en) * 1998-05-05 2002-06-04 Asyst Technologies, Inc. SMIF pod including independently supported wafer cassette
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US6220808B1 (en) * 1998-07-13 2001-04-24 Asyst Technologies, Inc. Ergonomic, variable size, bottom opening system compatible with a vertical interface
US6120229A (en) * 1999-02-01 2000-09-19 Brooks Automation Inc. Substrate carrier as batchloader
US6364595B1 (en) * 1999-02-10 2002-04-02 Asyst Technologies, Inc. Reticle transfer system
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US6736582B1 (en) * 1999-04-09 2004-05-18 Brooks Automation, Inc. Device for manipulating an object for loading and unloading a clean room
US6612797B1 (en) * 1999-05-18 2003-09-02 Asyst Technologies, Inc. Cassette buffering within a minienvironment
US6234219B1 (en) 1999-05-25 2001-05-22 Micron Technology, Inc. Liner for use in processing chamber
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US8348583B2 (en) 1999-10-19 2013-01-08 Rorze Corporation Container and loader for substrate
US6540424B1 (en) * 2000-03-24 2003-04-01 The Clorox Company Advanced cleaning system
US6579336B1 (en) 2000-06-16 2003-06-17 Tri-Dim Filter Corporation Reversed cube air filter assembly
US7018504B1 (en) 2000-09-11 2006-03-28 Asm America, Inc. Loadlock with integrated pre-clean chamber
US6632068B2 (en) * 2000-09-27 2003-10-14 Asm International N.V. Wafer handling system
JP2002203887A (ja) * 2001-01-05 2002-07-19 Tdk Corp ミニエンバイロンメントシステムおよびその操作方法
DE10164175B4 (de) * 2001-12-27 2004-02-12 Infineon Technologies Ag Prozeßgerät mit zwei Raumeinheiten und einer die zwei Raumeinheiten verbindenden dritten Raumeinheit mit jeweils einer gegenüber der Umgebung verminderten Dichte kontaminierter Teilchen und Verfahren zum Betrieb des Prozeßgerätes
US6755602B2 (en) * 2002-02-07 2004-06-29 Taiwan Semiconductor Manufacturing Co., Ltd Wafer transport pod with linear door opening mechanism
US6899507B2 (en) * 2002-02-08 2005-05-31 Asm Japan K.K. Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections
JP2003332402A (ja) * 2002-05-10 2003-11-21 Kondo Kogyo Kk ミニエンバライメント方式の半導体製造装置
DE10238165B3 (de) * 2002-08-15 2004-03-25 Hans-Heinz Helge Langgestrecktes Rolladenprofil aus Kunststoff oder Metall für Schwimmbadabdeckungen
FR2844258B1 (fr) * 2002-09-06 2005-06-03 Recif Sa Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert
US20040069409A1 (en) * 2002-10-11 2004-04-15 Hippo Wu Front opening unified pod door opener with dust-proof device
US20040101385A1 (en) * 2002-11-25 2004-05-27 Ta-Kuang Chang Semiconductor process apparatus and SMIF pod used therein
JP3759492B2 (ja) 2002-12-03 2006-03-22 近藤工業株式会社 ミニエンバライメント方式の半導体製造装置
SG115629A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Method and apparatus for maintaining a machine part
KR20060095763A (ko) * 2003-10-21 2006-09-01 가부시키가이샤 니콘 환경 제어장치, 디바이스 제조장치, 디바이스 제조방법, 및노광장치
US7479189B2 (en) * 2003-12-22 2009-01-20 Applied Films Gmbh & Co. Kg Coating plant with a charging lock and device therefor
US7409263B2 (en) 2004-07-14 2008-08-05 Applied Materials, Inc. Methods and apparatus for repositioning support for a substrate carrier
US7720558B2 (en) 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
US7467916B2 (en) * 2005-03-08 2008-12-23 Asm Japan K.K. Semiconductor-manufacturing apparatus equipped with cooling stage and semiconductor-manufacturing method using same
JP5030410B2 (ja) * 2005-09-28 2012-09-19 株式会社日立ハイテクノロジーズ 真空処理装置
US8794896B2 (en) * 2005-12-14 2014-08-05 Tokyo Electron Limited Vacuum processing apparatus and zonal airflow generating unit
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US8186927B2 (en) * 2008-05-27 2012-05-29 Tdk Corporation Contained object transfer system
DE102008062080A1 (de) * 2008-12-12 2010-06-17 Karlsruher Institut für Technologie Vorrichtung zum Transport atmosphärenempfindlicher Proben und Verwendung derselben
US8440048B2 (en) 2009-01-28 2013-05-14 Asm America, Inc. Load lock having secondary isolation chamber
KR101668823B1 (ko) * 2009-05-27 2016-10-24 로제 가부시키가이샤 분위기 치환 장치
JP5673806B2 (ja) * 2011-05-02 2015-02-18 村田機械株式会社 自動倉庫
US10332769B2 (en) * 2016-01-15 2019-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor processing station, semiconductor process and method of operating semiconductor processing station
DE102016119888B3 (de) * 2016-10-19 2018-03-08 Asys Automatic Systems Gmbh & Co. Kg Arbeitseinheit zur Umsetzung von Substraten
US10510573B2 (en) * 2017-11-14 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Loading apparatus and operating method thereof
US11195689B2 (en) * 2019-08-03 2021-12-07 ZoNexus LLC Sample holder for electron microscopy
KR102523365B1 (ko) * 2020-09-23 2023-04-21 세메스 주식회사 기판 처리 장치

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7359031B2 (en) 2003-03-11 2008-04-15 Asml Netherlands B.V. Lithographic projection assembly, load lock and method for transferring objects
US7878755B2 (en) 2003-03-11 2011-02-01 Asml Netherlands B.V. Load lock and method for transferring objects
US10521239B2 (en) 2011-11-22 2019-12-31 Intel Corporation Microprocessor accelerated code optimizer

Also Published As

Publication number Publication date
EP0886618A4 (en) 2005-09-07
JP4093376B2 (ja) 2008-06-04
KR100499324B1 (ko) 2006-11-30
KR19990082011A (ko) 1999-11-15
EP0886618A1 (en) 1998-12-30
JP2000505240A (ja) 2000-04-25
WO1997027133A1 (en) 1997-07-31
US5752796A (en) 1998-05-19
AU1577997A (en) 1997-08-20

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