USD405428S - Heat retaining tube for use in a semiconductor wafer heat processing apparatus - Google Patents

Heat retaining tube for use in a semiconductor wafer heat processing apparatus Download PDF

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Publication number
USD405428S
USD405428S US29/074,285 US7428597F USD405428S US D405428 S USD405428 S US D405428S US 7428597 F US7428597 F US 7428597F US D405428 S USD405428 S US D405428S
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US
United States
Prior art keywords
processing apparatus
semiconductor wafer
retaining tube
heat
heat processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/074,285
Inventor
Katsutoshi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ISHII, KATSUTOSHI
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Expired - Lifetime legal-status Critical Current

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FIG. 1: a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus;
FIG. 2: a top plan view thereof;
FIG. 3: a front elevational view thereof;
FIG. 4: a cross sectional view thereof taken along line IV--IV in FIG. 3;
FIG. 5: a cross sectional view thereof taken along line V--V in FIG. 3;
FIG. 6: a left side view thereof;
FIG. 7: a right side view thereof;
FIG. 8: a bottom plan view thereof; and,
FIG. 9: a rear elevational view thereof.

Claims (1)

  1. I claim the ornamental design for a heat retaining tube for use in a semiconductor wafer heat processing apparatus, as shown and described.
US29/074,285 1997-01-31 1997-07-24 Heat retaining tube for use in a semiconductor wafer heat processing apparatus Expired - Lifetime USD405428S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP265697 1997-01-31
JP9-2656 1997-01-31

Publications (1)

Publication Number Publication Date
USD405428S true USD405428S (en) 1999-02-09

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US29/074,285 Expired - Lifetime USD405428S (en) 1997-01-31 1997-07-24 Heat retaining tube for use in a semiconductor wafer heat processing apparatus

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD793974S1 (en) * 2015-09-29 2017-08-08 Hitachi Kokusai Electric Inc. Heater for semiconductor thermal process
USD793975S1 (en) * 2015-09-29 2017-08-08 Hitachi Kokusai Electric Inc. Heater for semiconductor thermal process
USD795209S1 (en) * 2015-09-29 2017-08-22 Hitachi Kokusai Electric Inc. Heater for semiconductor thermal process
USD798250S1 (en) * 2015-12-01 2017-09-26 Nuflare Technology, Inc. Heater

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD793974S1 (en) * 2015-09-29 2017-08-08 Hitachi Kokusai Electric Inc. Heater for semiconductor thermal process
USD793975S1 (en) * 2015-09-29 2017-08-08 Hitachi Kokusai Electric Inc. Heater for semiconductor thermal process
USD795209S1 (en) * 2015-09-29 2017-08-22 Hitachi Kokusai Electric Inc. Heater for semiconductor thermal process
USD798250S1 (en) * 2015-12-01 2017-09-26 Nuflare Technology, Inc. Heater

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