KR100499324B1 - 진공일체형표준메카니컬인터페이스시스템 - Google Patents

진공일체형표준메카니컬인터페이스시스템 Download PDF

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Publication number
KR100499324B1
KR100499324B1 KR1019980705730A KR19980705730A KR100499324B1 KR 100499324 B1 KR100499324 B1 KR 100499324B1 KR 1019980705730 A KR1019980705730 A KR 1019980705730A KR 19980705730 A KR19980705730 A KR 19980705730A KR 100499324 B1 KR100499324 B1 KR 100499324B1
Authority
KR
South Korea
Prior art keywords
cassette
carrier
port
door
mini
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019980705730A
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English (en)
Korean (ko)
Other versions
KR19990082011A (ko
Inventor
리차드 에스. 무카
Original Assignee
브룩스 오토메이션 인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 브룩스 오토메이션 인코퍼레이티드 filed Critical 브룩스 오토메이션 인코퍼레이티드
Publication of KR19990082011A publication Critical patent/KR19990082011A/ko
Application granted granted Critical
Publication of KR100499324B1 publication Critical patent/KR100499324B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0297—Wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1019980705730A 1996-01-24 1997-01-14 진공일체형표준메카니컬인터페이스시스템 Expired - Fee Related KR100499324B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/590,757 US5752796A (en) 1996-01-24 1996-01-24 Vacuum integrated SMIF system
US8/590,757 1996-01-24
US08/590,757 1996-01-24

Publications (2)

Publication Number Publication Date
KR19990082011A KR19990082011A (ko) 1999-11-15
KR100499324B1 true KR100499324B1 (ko) 2006-11-30

Family

ID=24363582

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980705730A Expired - Fee Related KR100499324B1 (ko) 1996-01-24 1997-01-14 진공일체형표준메카니컬인터페이스시스템

Country Status (7)

Country Link
US (1) US5752796A (https=)
EP (1) EP0886618A4 (https=)
JP (1) JP4093376B2 (https=)
KR (1) KR100499324B1 (https=)
AU (1) AU1577997A (https=)
TW (1) TW315488B (https=)
WO (1) WO1997027133A1 (https=)

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USD404016S (en) 1997-01-31 1999-01-12 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD405427S (en) 1997-01-31 1999-02-09 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
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EP0870850B1 (de) * 1997-04-11 2002-09-18 Leybold Systems GmbH Verfahren und Vorrichtung zum Be- und Entladen einer evakuierbaren Behandlungskammer
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USD404373S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Fin for use in a semiconductor wafer heat processing apparatus
USD407696S (en) 1997-08-20 1999-04-06 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
USD405431S (en) 1997-08-20 1999-02-09 Tokyo Electron Ltd. Tube for use in a semiconductor wafer heat processing apparatus
USD404370S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404375S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Heat retaining tube base for use in a semiconductor wafer head processing apparatus
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US6632068B2 (en) * 2000-09-27 2003-10-14 Asm International N.V. Wafer handling system
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DE10164175B4 (de) * 2001-12-27 2004-02-12 Infineon Technologies Ag Prozeßgerät mit zwei Raumeinheiten und einer die zwei Raumeinheiten verbindenden dritten Raumeinheit mit jeweils einer gegenüber der Umgebung verminderten Dichte kontaminierter Teilchen und Verfahren zum Betrieb des Prozeßgerätes
US6755602B2 (en) * 2002-02-07 2004-06-29 Taiwan Semiconductor Manufacturing Co., Ltd Wafer transport pod with linear door opening mechanism
US6899507B2 (en) * 2002-02-08 2005-05-31 Asm Japan K.K. Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections
JP2003332402A (ja) * 2002-05-10 2003-11-21 Kondo Kogyo Kk ミニエンバライメント方式の半導体製造装置
DE10238165B3 (de) * 2002-08-15 2004-03-25 Hans-Heinz Helge Langgestrecktes Rolladenprofil aus Kunststoff oder Metall für Schwimmbadabdeckungen
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US20040101385A1 (en) * 2002-11-25 2004-05-27 Ta-Kuang Chang Semiconductor process apparatus and SMIF pod used therein
JP3759492B2 (ja) 2002-12-03 2006-03-22 近藤工業株式会社 ミニエンバライメント方式の半導体製造装置
SG115629A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Method and apparatus for maintaining a machine part
SG115631A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, load lock and method for transferring objects
KR20060095763A (ko) * 2003-10-21 2006-09-01 가부시키가이샤 니콘 환경 제어장치, 디바이스 제조장치, 디바이스 제조방법, 및노광장치
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JP5030410B2 (ja) * 2005-09-28 2012-09-19 株式会社日立ハイテクノロジーズ 真空処理装置
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Also Published As

Publication number Publication date
EP0886618A4 (en) 2005-09-07
JP4093376B2 (ja) 2008-06-04
KR19990082011A (ko) 1999-11-15
EP0886618A1 (en) 1998-12-30
TW315488B (https=) 1997-09-11
JP2000505240A (ja) 2000-04-25
WO1997027133A1 (en) 1997-07-31
US5752796A (en) 1998-05-19
AU1577997A (en) 1997-08-20

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St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000