JP4093376B2 - 吸引一体型ｓｍｉｆシステム - Google Patents

吸引一体型ｓｍｉｆシステム Download PDF

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Publication number
JP4093376B2
JP4093376B2 JP52689597A JP52689597A JP4093376B2 JP 4093376 B2 JP4093376 B2 JP 4093376B2 JP 52689597 A JP52689597 A JP 52689597A JP 52689597 A JP52689597 A JP 52689597A JP 4093376 B2 JP4093376 B2 JP 4093376B2
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JP
Japan
Prior art keywords
cassette
carrier
port
load lock
door
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP52689597A
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English (en)
Japanese (ja)
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JP2000505240A (ja
Inventor
リチャード エス． ムカ
Original Assignee
ブルックス オートメーション インコーポレイテッド
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Application filed by ブルックス オートメーション インコーポレイテッド filed Critical ブルックス オートメーション インコーポレイテッド
Publication of JP2000505240A publication Critical patent/JP2000505240A/ja
Application granted granted Critical
Publication of JP4093376B2 publication Critical patent/JP4093376B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0297—Wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
JP52689597A 1996-01-24 1997-01-14 吸引一体型ｓｍｉｆシステム Expired - Lifetime JP4093376B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/590,757 US5752796A (en) 1996-01-24 1996-01-24 Vacuum integrated SMIF system
US08/590,757 1996-01-24
PCT/US1997/000523 WO1997027133A1 (en) 1996-01-24 1997-01-14 Vacuum integrated smif system

Publications (2)

Publication Number Publication Date
JP2000505240A JP2000505240A (ja) 2000-04-25
JP4093376B2 true JP4093376B2 (ja) 2008-06-04

Family

ID=24363582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52689597A Expired - Lifetime JP4093376B2 (ja) 1996-01-24 1997-01-14 吸引一体型ｓｍｉｆシステム

Country Status (7)

Country Link
US (1) US5752796A (https=)
EP (1) EP0886618A4 (https=)
JP (1) JP4093376B2 (https=)
KR (1) KR100499324B1 (https=)
AU (1) AU1577997A (https=)
TW (1) TW315488B (https=)
WO (1) WO1997027133A1 (https=)

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USD404373S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Fin for use in a semiconductor wafer heat processing apparatus
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USD404375S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Heat retaining tube base for use in a semiconductor wafer head processing apparatus
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US6755602B2 (en) * 2002-02-07 2004-06-29 Taiwan Semiconductor Manufacturing Co., Ltd Wafer transport pod with linear door opening mechanism
US6899507B2 (en) * 2002-02-08 2005-05-31 Asm Japan K.K. Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections
JP2003332402A (ja) * 2002-05-10 2003-11-21 Kondo Kogyo Kk ミニエンバライメント方式の半導体製造装置
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Also Published As

Publication number Publication date
EP0886618A4 (en) 2005-09-07
KR100499324B1 (ko) 2006-11-30
KR19990082011A (ko) 1999-11-15
EP0886618A1 (en) 1998-12-30
TW315488B (https=) 1997-09-11
JP2000505240A (ja) 2000-04-25
WO1997027133A1 (en) 1997-07-31
US5752796A (en) 1998-05-19
AU1577997A (en) 1997-08-20

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