TW201407890A - 電連接器 - Google Patents

電連接器 Download PDF

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Publication number
TW201407890A
TW201407890A TW101127875A TW101127875A TW201407890A TW 201407890 A TW201407890 A TW 201407890A TW 101127875 A TW101127875 A TW 101127875A TW 101127875 A TW101127875 A TW 101127875A TW 201407890 A TW201407890 A TW 201407890A
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Taiwan
Prior art keywords
electrical connector
hole
boss
accommodating
end piece
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TW101127875A
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English (en)
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TWI583068B (zh
Inventor
Yen-Chih Chang
Ke-Hao Chen
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Hon Hai Prec Ind Co Ltd
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Priority to TW101127875A priority Critical patent/TWI583068B/zh
Priority to US13/753,545 priority patent/US8851904B2/en
Publication of TW201407890A publication Critical patent/TW201407890A/zh
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Publication of TWI583068B publication Critical patent/TWI583068B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces

Abstract

本發明公開了一種電連接器，用以電性連接晶片模組與電路板，該電連接器包括絕緣本體及固持於絕緣本體內之導電端子，絕緣本體包括底端件及與底端件相配合之頂端件，所述底端件包括一凸台，所述頂端件包括一與凸台配合之配合孔，所述凸台與配合孔相接觸之區域均鍍有金屬層，方便組裝且可達到較佳之屏蔽效果。

Description

電連接器
本發明涉及一種電連接器，尤其涉及一種可電性連接晶片模組至印刷電路板之電連接器。
平面柵格陣列電連接器廣泛應用以電子領域，用以將晶片模組電性連接至電路板，以實現晶片模組與電路板間訊號和資料之傳輸。如“Nonlinear Analysis Helps Design LGA Connectors” (Connector Specifier, Februray 2001)中即揭示了此種技術。該電連接器包括本體及收容於該本體內之端子，當該電連接器將晶片模組與電路板連接時，電連接器之端子之上、下接觸點分別與晶片模組及電路板之導電片相壓接，從而形成晶片模組與電路板間之訊號傳輸。但隨著電子技術之不斷發展，晶片模組與電路板之導電片之排列密度越來越大，而用以該領域中之平面柵格陣列電連接器之尺寸及高度越來越小，而端子排列密度卻要求越來越密集。在此種情況下，電連接器在連接晶片模組與電路板間之訊號傳輸時，必然將導致相鄰間距小之端子在傳輸訊號時發生電磁干擾，而相鄰訊號間一旦發生電磁干擾，則必將影響晶片模組與電路板間訊號傳輸之品質。是故，為了確保晶片模組與電路板之間之訊號傳輸完整性，具有防止電磁干擾之屏蔽裝置之電連接器就變得尤其重要。
台灣專利公告第M419248號揭示了一種可屏蔽電磁干擾之電連接器元件，其包括絕緣本體、收容在絕緣本體內之導電端子，絕緣本體具有承接面及安裝面且設有複數貫穿承接面及安裝面之端子槽，其中所述端子槽包括第一槽及第二槽，導電端子收容在第一槽內，該電連接器還包括容設在第二槽內之金屬屏蔽片。惟，金屬屏蔽片係插入導電端子間，導電端子之間的容納及固持空間較小且絕緣本體成型複雜。
鑒於此，確有必要提供一種改進之電連接器，以克服前述電連接器存在之缺陷。
本發明之目的係提供一種可達到較佳屏蔽效果之電連接器。
為實現前述目的，本發明採用如下技術方案：一種電連接器，用以電性連接晶片模組與電路板，該電連接器包括：絕緣本體，其包括底端件及與底端件相配合之頂端件；導電端子，固持於絕緣本體內；所述底端件包括一凸台，所述頂端件包括一與凸台配合之配合孔，所述凸台與配合孔相接觸之區域均鍍有金屬層。
相較於先前技術，本發明電連接器之絕緣本體分為頂端件與底端件，即分體式設置且凸台與配合孔接觸之區域均鍍有金屬層，以此可降低製造之難度且方便組裝，並可達到較佳之屏蔽效果。
請參閱第一圖至第七圖所示，電連接器100用以電性連接晶片模組(未圖示)與電路板(未圖示)，該電連接器100包括絕緣本體(未標號)、複數固持於絕緣本體內之導電端子3及複數焊接至電路板之錫球4。絕緣本體包括底端件2及與底端件2相配合之頂端件1。
請重點參閱第五圖及第六圖所示，頂端件1包括相對設置之上表面10與下表面11，下表面11向上凹陷設有複數配合孔12，配合孔12自下表面11向上呈漸縮式設計。上表面10向上凸伸設有凸伸部13，凸伸部13上設有連通配合孔12之容納孔14。容納孔14包括收容孔15及與收容孔15連通之固持孔16。頂端件1還包括自凸伸部13之上頂面(未標號)向下凹陷且與容納孔14連通之凹槽17。凸伸部13間隔設置且呈矩陣型排列。頂端件1之容納孔14之側壁140上均鍍有金屬層5，且凹槽17內亦鍍有金屬層5。
底端件2包括呈矩型設置之本體部20，底端件2具有相對設置之頂面21與底面22，自頂面21向上凸伸設有複數凸台23，凸台23大致呈圓柱型設置且自下而上呈漸縮式結構設計。底端件2還包括貫穿凸台23且與底面22連通之容納槽24。容納槽24包括收容槽25及與收容槽25連通之固持槽26。凸台23還包括平行於頂面21之下對接面27，凸台23自頂面21向下對接面27呈漸縮式結構設計。凸台23間隔設置且呈矩陣型排列，凸台23相間隔之區域於本體部20上設有通槽29。頂面21上鍍有金屬層5且通槽29之內側壁(未標號)上亦鍍有金屬層5。
請重點參閱第三圖所示，導電端子3包括主體部30、自主體部30向上彎折延伸之彈性臂31、自主體部30向下彎折延伸之焊接部32及自主體部30向一側彎折延伸之固持部33。主體部30及焊接部32容置於收容槽25內且彈性臂31容置於收容孔15內。固持部33固持於固持槽26及固持孔16內。
組裝完成後，凸台23組裝於配合孔12內，凸台23具有一外壁28且配合孔具有一內壁19，外壁28與內壁19上均鍍有金屬層5，凸台23與配合孔12通過金屬層5緊密配合且電性接觸。凸台23之下對接面27上鍍有金屬層5，頂端件1之配合孔12與下對接面27對接處設有上對接面18，且上對接面18上鍍設有金屬層5，且上對接面18與下對接面27緊密配合，以節省空間、方便組裝且實現更好之電性接觸。
本發明之電連接器100於凸台23及配合孔12相接觸之區域鍍有金屬層5，於收容孔15之側壁140上鍍設金屬層5，並於上對接面18上鍍有金屬層5，於頂面21上鍍設金屬層5且於本體部20之通槽29之內側壁(未標號)上亦鍍設金屬層5，藉金屬層5可將導電端子3完全包覆且電性導通後，導電端子3傳遞訊號且金屬層5可將電磁屏蔽訊號快速自晶片模組傳遞至電路板，以此實現較佳之屏蔽效果。
在本實施方式中，凹槽17可與晶片模組上之如接地裝置(未圖示)等焊接元件相配合，且藉金屬層5形成快速傳遞電磁屏蔽訊號之通道，以達到更佳之屏蔽效果。
綜上所述，本發明符合發明專利要件，依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，本發明之範圍並不以前述實施例為限，舉凡熟習本案技藝之人士依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
100．．．電連接器
1．．．頂端件
10．．．上表面
11．．．下表面
12．．．配合孔
13．．．凸伸部
14．．．容納孔
140．．．側壁
15．．．收容孔
16．．．固持孔
17．．．凹槽
18．．．上對接面
19．．．內壁
2．．．底端件
20．．．本體部
21．．．頂面
22．．．底面
23．．．凸台
24．．．容納槽
25．．．收容槽
26．．．固持槽
27．．．下對接面
28．．．外壁
29．．．通槽
3．．．導電端子
30．．．主體部
31．．．彈性臂
32．．．焊接部
33．．．固持部
4．．．錫球
5．．．金屬層
第一圖係本發明電連接器之立體組合圖；
第二圖係本發明電連接器之另一狀態之立體組合圖；
第三圖係本發明電連接器之立體分解圖；
第四圖係本發明電連接器之另一狀態之立體分解圖；
第五圖係本發明電連接器之底端件之立體圖；
第六圖係本發明電連接器之頂端件之立體圖；及
第七圖係本發明電連接器沿第一圖中VII-VII方向之剖視圖。
100．．．電連接器
1．．．頂端件
10．．．上表面
11．．．下表面
13．．．凸伸部
14．．．容納孔
140．．．側壁
15．．．收容孔
16．．．固持孔
17．．．凹槽
2．．．底端件
20．．．本體部
21．．．頂面
22．．．底面
23．．．凸台
24．．．容納槽
25．．．收容槽
26．．．固持槽
3．．．導電端子
30．．．主體部
31．．．彈性臂
32．．．焊接部
33．．．固持部
4．．．錫球
5．．．金屬層

Claims (10)

  1. 一種電連接器，用以電性連接晶片模組與電路板，該電連接器包括：
    絕緣本體，其包括底端件及與底端件相配合之頂端件；及
    導電端子，固持於絕緣本體內；
    其中，所述底端件包括凸台，所述頂端件包括與凸台配合之配合孔，所述凸台與配合孔相接觸之區域鍍有金屬層。
  2. 如申請專利範圍第1項所述之電連接器，其中所述凸台設有外壁，所述配合孔設有內壁，所述金屬層鍍設於外壁及內壁上，所述凸台與配合孔係通過金屬層電性接觸。
  3. 如申請專利範圍第1項所述之電連接器，其中所述頂端件包括相對設置之上表面與下表面，所述配合孔自下表面向上凹陷形成。
  4. 如申請專利範圍第3項所述之電連接器，其中所述頂端件還包括延伸出上表面之凸伸部，所述凸伸部上設有一連通配合孔之容納孔。
  5. 如申請專利範圍第4項所述之電連接器，其中所述底端件包括相對設置之頂面與底面，所述凸台自頂面向上凸伸形成。
  6. 如申請專利範圍第5項所述之電連接器，其中所述底端件還包括貫穿凸台且與底面連通之容納槽。
  7. 如申請專利範圍第6項所述之電連接器，其中所述導電端子容設於容納孔及容納槽內，所述導電端子包括主體部、自主體部向上彎折延伸之彈性臂、自主體部向下彎折延伸之焊接部及自主體部向一側彎折延伸之固持部。
  8. 如申請專利範圍第7項所述之電連接器，其中所述容納孔包括容設彈性臂之收容孔、容設固持部之固持孔且所述容納槽包括容設主體部之收容槽、容設固持部之固持槽。
  9. 如申請專利範圍第1項所述之電連接器，其中所述凸台大致呈圓柱型設置且自下而上呈漸縮式結構。
  10. 如申請專利範圍第9項所述之電連接器，其中所述配合孔與凸台之形狀相對應且配合孔自底面向上呈漸縮式結構。
TW101127875A 2012-08-02 2012-08-02 電連接器 TWI583068B (zh)

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Application Number Priority Date Filing Date Title
TW101127875A TWI583068B (zh) 2012-08-02 2012-08-02 電連接器
US13/753,545 US8851904B2 (en) 2012-08-02 2013-01-30 Shielding socket with two pieces housing components

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TWI583068B TWI583068B (zh) 2017-05-11

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CN106797098A (zh) * 2014-09-26 2017-05-31 英特尔公司 插口接触部技术和构造

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TWI583068B (zh) * 2012-08-02 2017-05-11 鴻海精密工業股份有限公司 電連接器
TWI558027B (zh) * 2012-11-14 2016-11-11 鴻海精密工業股份有限公司 電連接器
TWI543475B (zh) * 2012-11-30 2016-07-21 鴻海精密工業股份有限公司 電連接器
TWI509913B (zh) * 2012-12-26 2015-11-21 Hon Hai Prec Ind Co Ltd 電連接器及其製造方法
TWM457316U (zh) * 2012-12-26 2013-07-11 Hon Hai Prec Ind Co Ltd 電連接器
US9178328B2 (en) * 2013-06-28 2015-11-03 Intel Corporation Shielded sockets for microprocessors and fabrication thereof by overmolding and plating
TWM472345U (zh) * 2013-07-03 2014-02-11 Hon Hai Prec Ind Co Ltd 電連接器
TWM472966U (zh) * 2013-08-23 2014-02-21 Hon Hai Prec Ind Co Ltd 電連接器
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